Method for manufacturing semiconductor device, method for manufacturing temporary fixing film material, and temporary fixing film material

Abstract

The present invention discloses a method for producing a semiconductor device, the method comprising: a step for forming a multilayer body for provisional fixation, the multilayer body comprising a supporting substrate, a light absorption layer, and a resin layer for provisional fixation having a first main surface and a second main surface; a step for provisionally fixing a semiconductor member on the resin layer for provisional fixation; and a step for separating the semiconductor member from the resin layer for provisional fixation. The resin layer for provisional fixation contains a curable resin composition that contains a curable resin and an elastomer. If A1 is the ratio of the abundance of the curable resin to the abundance of the elastomer in the first main surface, and A2 is the ratio in the second main surface, A2 is lower than A1.

Claims

1. A temporary fixing laminate is formed comprising a support substrate having a support surface and a back surface on the opposite side, a light-absorbing layer, and a temporary fixing resin layer having a first main surface and a second main surface on the opposite side, wherein the light-absorbing layer and the temporary fixing resin layer are laminated in this order from the support surface side. The semiconductor member is temporarily fixed onto the aforementioned temporary fixing resin layer, Separating the semiconductor member from the temporary fixing resin layer, This includes them in this order, In the aforementioned temporary fixing laminate, the temporary fixing resin layer is arranged such that the first main surface is in contact with the light absorbing layer. The semiconductor member is temporarily fixed on the temporary fixing resin layer by a method that includes, in this order, placing the semiconductor member on the second main surface of the temporary fixing resin layer and curing the temporary fixing resin layer. The semiconductor member is separated from the temporary fixing resin layer by a method that includes, in this order, irradiating the temporary fixing laminate with light from the back side to separate the temporary fixing resin layer from the light absorbing layer, and peeling the temporary fixing resin layer from the semiconductor member. The aforementioned temporary fixing resin layer is a layer comprising a curable resin composition containing a curable resin and an elastomer, When the ratio of the amount of curable resin to the amount of elastomer is A1 on the first main surface and A2 on the second main surface, A2 is smaller than A1. A method for manufacturing semiconductor devices.

2. The aforementioned temporary fixing laminate is To prepare a temporary fixing film material having the temporary fixing resin layer, a first release film, and a second release film, wherein the first release film is in contact with the first main surface of the temporary fixing resin layer, and the second release film is in contact with the second main surface of the temporary fixing resin layer, and the first release film, the temporary fixing resin layer, and the second release film are laminated in this order. The first release film is peeled off from the temporary fixing film material, and the temporary fixing film material is laminated onto the light-absorbing layer provided on the support surface so that the first main surface of the temporary fixing resin layer is in contact with the light-absorbing layer. The second release film is peeled off from the temporary fixing film material, exposing the second main surface of the temporary fixing resin layer. Formed by a method including in this order, The method according to claim 1.

3. The aforementioned temporary fixing laminate is A temporary fixing film material is prepared, comprising a first curable resin layer, the light-absorbing layer, and a second curable resin layer in this order, wherein the second curable resin layer is the temporary fixing resin layer arranged so that its first main surface is in contact with the light-absorbing layer. The temporary fixing film material is laminated on the support surface in a manner that the first curable resin layer is in contact with the support surface. Formed by a method including, The method according to claim 1.

4. The method according to any one of claims 1 to 3, wherein the light-absorbing layer is a metal layer.

5. The method according to any one of claims 1 to 4, further comprising processing the semiconductor member temporarily fixed on the temporary fixing resin layer.

6. The method further includes forming a sealing layer for sealing the semiconductor member on the temporary fixing resin layer, thereby forming a sealing structure having the semiconductor member and the sealing layer. The method according to any one of claims 1 to 5, wherein the sealing structure is separated from the temporary fixing resin layer by a method comprising, in this order, irradiating the temporary fixing laminate with light from the back side to separate the temporary fixing resin layer from the light absorbing layer, and peeling the temporary fixing resin layer from the sealing structure.

7. A resin varnish containing a solvent is applied to the first release film to form a film of the resin varnish, and then the solvent is removed from the film to form a temporary fixing resin layer on the first release film having a first main surface in contact with the first release film and a second main surface on the opposite side. The second release film is attached to the second main surface of the temporary fixing resin layer, Equipped with, The peeling force of the surface of the first release film in contact with the temporary fixing resin layer is smaller than the peeling force of the surface of the second release film in contact with the temporary fixing resin layer. The aforementioned temporary fixing resin layer is a layer comprising a curable resin composition containing a curable resin and an elastomer, When the ratio of the amount of curable resin to the amount of elastomer is A1 on the first main surface and A2 on the second main surface, A2 is smaller than A1. A method for manufacturing temporary fixing film material.

8. The method according to claim 7, wherein the solvent is a mixed solvent containing two or more solvents.

9. A temporary fixing resin layer having a first main surface and a second main surface on the opposite side, a first release film, and a second release film, The first release film is in contact with the first main surface of the temporary fixing resin layer, and the second release film is in contact with the second main surface of the temporary fixing resin layer, and the first release film, the temporary fixing resin layer, and the second release film are laminated in this order. The peeling force of the surface of the first release film in contact with the temporary fixing resin layer is smaller than the peeling force of the surface of the second release film in contact with the temporary fixing resin layer. The temporary fixing resin layer is a single layer comprising a curable resin composition containing a curable resin and an elastomer. When the ratio of the amount of curable resin to the amount of elastomer is A1 on the first main surface and A2 on the second main surface, A2 is smaller than A1. Temporary fixing film material.

10. The material comprises a first curable resin layer, a light-absorbing layer, and a second curable resin layer in this order. The second curable resin layer has a first main surface in contact with the light-absorbing layer and a second main surface on the opposite side thereof. The second curable resin layer is a layer comprising a curable resin composition containing a curable resin and an elastomer, When the ratio of the amount of curable resin to the amount of elastomer is A1 on the first main surface and A2 on the second main surface, A2 is smaller than A1. Temporary fixing film material.

11. The temporary fixing film material according to claim 10, further comprising a release film provided on the first curable resin layer and a release film provided on the second curable resin layer.

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