thermal interface materials

JP7872262B2Active Publication Date: 2026-06-09DDP SPECIALTY ELECTRONICS MATERIALS US LLC +1

Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
DDP SPECIALTY ELECTRONICS MATERIALS US LLC
Filing Date
2021-09-09
Publication Date
2026-06-09

Smart Images

  • Figure 0007872262000001
    Figure 0007872262000001
  • Figure 0007872262000002
    Figure 0007872262000002
  • Figure 0007872262000003
    Figure 0007872262000003
Patent Text Reader

Abstract

Provided herein are two-part thermal interface materials.
Need to check novelty before this filing date? Find Prior Art

Claims

1. (A) (a1) React the aromatic diisocyanate with the polyether polyol and then C 10 ~C 30 Blocked polyurethane prepolymers produced by capping with phenol having linear hydrocarbon groups. (a2) Aromatic epoxy resin which is a reaction product of diphenol and epichlorohydrin, (a3) Epoxysilane of the following formula, 【Chemistry 1】 (In the formula, R 1 , R 2 , and R 3 C is independent 1 ~C 3 Selected from alkyl groups, R 4 (It is a divalent organic radical.) The first component, which includes; (B) (b1) A nucleophilic crosslinking agent which is a triamine having a main chain based on poly(alkylene oxide)diol. (b2) A catalyst selected from diazabicyclo[2.2.2]octane, 2,4,6-tris((dimethylamino)methyl)phenol, triethanolamine, DMDEE (2,2'-dimorpholinodiethyl ether), polyethyleneimine, imidazole, and 4-methylimidazole. A second component including; A kit for two-component thermal conductive adhesive formulations, including, Based on the total weight of component (A), component (a1) is 0.1 to 5% by weight, component (a2) is 0.1 to 5% by weight, and component (a3) ​​is 0.1 to 1% by weight. Based on the total weight of component (B), component (b1) is 0.2 to 5% by weight, and component (b2) is 0.01 to 0.5% by weight. The material further comprises a thermally conductive filler in which component (A) and component (B) are selected from alumina, aluminum oxide, alumina trihydrate or aluminum trihydrate, silicon carbide, boron nitride, diamond, and graphite, or mixtures thereof, and have a bimodal particle size distribution characterized by a D50 of 5 to 20 microns and a D90 of 70 to 90 microns, and a D90 / D50 ratio of 3 or more. The thermally conductive filler is contained in component (A) at a concentration of 85 to 89% by weight based on the total weight of component (A), and is contained in component (B) at a concentration of 85 to 89% by weight based on the total weight of component (B). A kit in which ingredients (A) and (B) are blended together before use.

2. The kit according to claim 1, wherein the blocked polyurethane prepolymer (a1) is produced by reacting TDI with poly(propylene oxide)diol and then capping with cardanol.

3. The kit according to claim 1, wherein the blocked polyurethane prepolymer (a1) is present in an amount of 1 to 3% by weight based on the total weight of component (A).

4. The kit according to claim 1, wherein the aromatic epoxy resin (a2) is a reaction product of bisphenol A and epichlorohydrin.

5. The kit according to claim 1, wherein the aromatic epoxy resin (a2) is present in an amount of 0.6 to 1.5% by weight based on the total weight of component (A).

6. The kit according to claim 1, wherein the epoxysilane (a3) ​​is gamma-glycidoxypropyltrimethoxysilane.

7. The kit according to claim 1, wherein the epoxysilane (a3) ​​is present in an amount of 0.25 to 0.6% by weight based on the total weight of component (A).

8. The kit according to claim 1, wherein the nucleophilic crosslinking agent (b1) is a triamine having a main chain based on poly(propylene oxide)diol.

9. The kit according to claim 1, wherein the nucleophilic crosslinking agent (b1) is present in an amount of 1.5 to 3.3% by weight based on the total weight of component (B).