Adhesive compound, adhesive tape, bonded assembly and method for electrically debonding a bonded assembly
By using a mixture of ionic liquids with different pH values in the adhesive, the problems of adhesive strength and hygrothermal stability during the electro-debonding process were solved, achieving a fast and clean electro-debonding process and reducing corrosion of the metal carrier.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- TESA SE
- Filing Date
- 2025-11-26
- Publication Date
- 2026-06-05
AI Technical Summary
Existing adhesives are difficult to achieve high and durable bond strength during electro-debonding, and they also have poor stability under humid and hot conditions and may release undesirable substances such as hydrofluoric acid, affecting the corrosivity of the substrate.
The adhesive formulation is a mixture of a first ionic liquid with a pH less than or equal to 7 and a second ionic liquid with a pH greater than 7. Electrodebinding of the adhesive is achieved by applying voltage, and the stability is maintained under humid and hot conditions to avoid the release of undesirable substances.
It achieves rapid and clean adhesive separation under applied voltage, maintains high initial adhesion, is stable under humid and hot conditions, and reduces corrosion of metal carriers.
Smart Images

Figure CN122146183A_ABST