Adhesive compound, adhesive tape, bonded assembly and method for electrically debonding a bonded assembly

By using a mixture of ionic liquids with different pH values ​​in the adhesive, the problems of adhesive strength and hygrothermal stability during the electro-debonding process were solved, achieving a fast and clean electro-debonding process and reducing corrosion of the metal carrier.

CN122146183APending Publication Date: 2026-06-05TESA SE

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
TESA SE
Filing Date
2025-11-26
Publication Date
2026-06-05

AI Technical Summary

Technical Problem

Existing adhesives are difficult to achieve high and durable bond strength during electro-debonding, and they also have poor stability under humid and hot conditions and may release undesirable substances such as hydrofluoric acid, affecting the corrosivity of the substrate.

Method used

The adhesive formulation is a mixture of a first ionic liquid with a pH less than or equal to 7 and a second ionic liquid with a pH greater than 7. Electrodebinding of the adhesive is achieved by applying voltage, and the stability is maintained under humid and hot conditions to avoid the release of undesirable substances.

Benefits of technology

It achieves rapid and clean adhesive separation under applied voltage, maintains high initial adhesion, is stable under humid and hot conditions, and reduces corrosion of metal carriers.

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Abstract

The invention relates to an adhesive compound, to a tape, to a bonded assembly, to a method for electro-debonding a bonded assembly, and to the use of an adhesive compound or a tape for bonding components in electronic devices, automobiles, medical devices and dental devices. The adhesive compound comprises a) at least one first ionic liquid having a pH of less than or equal to 7, and b) at least one second ionic liquid having a pH of more than 7, wherein the pH of the pure mixture of all following ionic liquids contained in the adhesive compound is from 5.5 to 9: a) having a pH of less than or equal to 7, and b) having a pH of more than 7.
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