Laminate

JP7872402B2Active Publication Date: 2026-06-09YUPO CORP
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Patent Information

Application Number
JP2025053708
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Priority Date
2024-03-29
Filing Date
2025-03-27
Publication Date
2026-06-09
Estimated Expiration
2045-03-27

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Abstract

To provide a laminate that satisfies both satisfactory adhesive strength to an adherend and physically satisfactory releasability.SOLUTION: A laminate comprises a heat seal layer and a ground layer, where the solid content of the heat seal layer per unit area is 0.05 to 1.5 g / m2, the heat seal layer includes thermoplastic resin (A) with the melting point of Tm(A), the ground layer includes thermoplastic resin (B), the thermoplastic resin (B) has a melting point Tm(B) of (Tm(A)+10°C) or higher and lower than (Tm(A)+60°C), the content of thermoplastic resin having a melting point lower than (Tm(A)+10°C) in the ground layer is 20 mass% or less, and the content of the thermoplastic resin (B) in the ground layer is 20 to 50 mass%.SELECTED DRAWING: None
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Claims

1. It comprises a heat-seal layer and a base layer, The solid content per unit area of ​​the heat seal layer is 0.05 to 1.5 g / m². 2 And, The heat seal layer comprises a thermoplastic resin (A) having a melting point Tm(A), The aforementioned underlayer contains thermoplastic resin (B), The thermoplastic resin (B) has a melting point Tm(B) of (Tm(A) + 10°C) or higher and (Tm(A) + 60°C) or lower. The content of thermoplastic resin having a melting point of less than (Tm(A) + 10°C) in the aforementioned underlayer is 20% by mass or less. A laminate in which the content of the thermoplastic resin (B) in the underlying layer is 20 to 50% by mass.

2. The aforementioned underlayer further contains thermoplastic resin (C), The laminate according to claim 1, wherein the thermoplastic resin (C) has a melting point Tm(C) of (Tm(A) + 60°C) or higher.

3. The laminate according to claim 1 or 2, wherein the underlying layer further comprises particles.

4. The laminate according to claim 1 or 2, wherein the thickness of the aforementioned underlayer is 0.5 to 10 μm.

5. The laminate according to claim 1 or 2, wherein the content of the thermoplastic resin (A) in the heat seal layer is 50% by mass or more.

Citation Information

Patent Citations

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