Component placement system and its operation method

Abstract

A component placement system is provided that includes a first bondhead array configured to simultaneously transport a first plurality of electronic components, a second bondhead array configured to simultaneously transport a second plurality of electronic components, a first motion system that simultaneously transports the first bondhead array and the second bondhead array along a first axis of motion, and a second motion system that transports the first bondhead array independently of the second bondhead array.

Description

【Technical Field】 , , , 【0005】 , , 【0004】 , , , 【0001】 (Cross - Reference to Related Applications) This application claims the benefit of U.S. Provisional Application No. 63 / 122,200, filed on December 7, 2020, the content of which is incorporated herein by reference. 【0002】 The present invention relates to a component placement system for placing electronic components, and more particularly to an improved component placement system for placing a plurality of electronic components and a method of operating the same. 【Background Art】 【0003】 In the electronic component assembly industry, pick - and - place systems (i.e., component placement systems) are used for placing electronic components. In certain placement systems, a plurality of tools (e.g., pickup tools, pipettes, nozzles, etc.) can be carried by a single bond head array. Thus, a plurality of electronic components (each carried by a separate tool) can be carried simultaneously by the bond head array. The following are prior art documents related to the invention of this application (including documents cited in the international phase after the international filing date and documents cited when the application entered the national phase in other countries): (Prior art document) (Patent Document) (Patent Document 1) U.S. Patent No. 5,862,586 【Summary of the Invention】 【Problems to be Solved by the Invention】 【0004】 Often, multiple bond head arrays are included in a single placement system. Such placement systems have many drawbacks, such as high component costs, complex motion systems for each bond head array, complex movement paths, throughput inefficiencies, etc. 【0005】 Therefore, it is desirable to provide an improved component placement system that overcomes one or more drawbacks of conventional placement systems. 【Means for Solving the Problems】 【0006】 According to exemplary embodiments of the present invention, a component placement system is provided. The component placement system includes a first bond head array configured to transport a first plurality of electronic components simultaneously, a second bond head array configured to transport a second plurality of electronic components simultaneously, and a first motion system that transports the first bond head array and the second bond head array simultaneously along a first motion axis. The second motion system transports the first bond head array independently of the second bond head array. 【0007】 According to another exemplary embodiment of the present invention, a method for operating a component placement system is provided. This method comprises the steps of (a) transporting a first plurality of electronic components using a first bond head array; (b) transporting a second plurality of electronic components using a second bond head array; (c) moving the first bond head array and the second bond head array simultaneously along a first motion axis using a first motion system; and (d) moving the first bond head array independently of the second bond head array using a second motion system. As will be understood by those skilled in the art, such a method may include additional steps (e.g., using a component placement system described in relation to any of the examples shown and described herein, or within the scope of the present invention). 【0008】 According to yet another exemplary embodiment of the present invention, another component placement system is provided. This component placement system comprises: a first support structure for transporting a plurality of linear motion systems, each of which is configured to move one of a plurality of pickup tools; a second support structure for transporting the first support structure; and a rotational motion system for moving the first support structure relative to the second support structure around a rotational motion axis. 【0009】 According to yet another exemplary embodiment of the present invention, another method for operating a component placement system is provided. This method includes (a) transporting a plurality of linear motion systems using a first support structure, each of the plurality of linear motion systems being configured to move one of a plurality of pickup tools configured to transport electronic components; (b) transporting the first support structure by a second support structure; and (c) moving the first support structure relative to the second support structure around a rotational motion axis using a rotational motion system. [Brief explanation of the drawing] 【0010】 This invention is best understood by reading the following detailed description in conjunction with the accompanying drawings. It should be emphasized that, in accordance with common practice, various features in the drawings are not to scale. Conversely, the dimensions of various features have been arbitrarily enlarged or reduced for clarity. The drawings include the following figures: [Figure 1] Figure 1 is a top view of a block diagram of a component placement system according to an exemplary embodiment of the present invention. [Figure 2] Figure 2 is a top view of a block diagram of elements of a component placement system according to an exemplary embodiment of the present invention. [Figure 3] Figure 3 is a top view of a block diagram showing elements of another component placement system according to another exemplary embodiment of the present invention. [Figure 4] Figure 4 is a top view of a block diagram showing elements of yet another component arrangement system according to yet another exemplary embodiment of the present invention. [Figure 5] Figure 5 is a top view of a block diagram showing elements of yet another component arrangement system according to yet another exemplary embodiment of the present invention. [Figure 6] Figure 6 is a top view of a block diagram showing elements of yet another component arrangement system according to yet another exemplary embodiment of the present invention. [Figure 7]Figures 7-8 are flowcharts illustrating how to operate a component placement system according to various exemplary embodiments of the present invention. [Figure 8] Figures 7-8 are flowcharts illustrating how to operate a component placement system according to various exemplary embodiments of the present invention. [Modes for carrying out the invention] 【0011】 Where used herein, “bond head array” refers to a bond head configured to carry multiple pick tools (e.g., pick-and-place tools such as pipettes and grippers) in connection with a placement operation. 【0012】 According to the present invention, various exemplary “motion systems” are described herein. As used herein (including in the claims), the term “motion system” may refer to a single motion system (e.g., a single motion system as illustrated and described in relation to the drawings) or a group of motion systems. For example, referring to Figure 1, a y-axis motion system 104 and two x-axis motion systems 108 are described. These three motion systems (i.e., the y-axis motion system 104 and the two x-axis motion systems 108) collectively move the bond head arrays 106a and 106b along the y and x axes. Thus, these three motion systems (i.e., the y-axis motion system 104 and the two x-axis motion systems 108) collectively can be considered a single motion system within the scope of the present invention. Accordingly, any single motion system or any group of motion systems described herein can be considered a “motion system” within the scope of the present invention. 【0013】 According to various exemplary embodiments of the present invention, a component placement system / apparatus is provided for simultaneously picking and / or placing electronic components. Such a component placement system may include two (or more) bond head arrays residing on a single long-stroke actuator (e.g., a long-stroke y-axis actuator, a long-stroke x-axis actuator, or both). The bond head arrays can be positioned independently of each other, enabling parallel picking and / or parallel placement. 【0014】 Many different modifications are conceivable in accordance with the scope and spirit of the present invention. Exemplary modifications include: (a) a long-stroke y-axis manipulator (see, for example, y-axis motion system 204 in Figure 2) comprising two bond head arrays that can be positioned independently of each other in the XY plane using long-stroke x-axis actuators (see, for example, x-axis motion systems 208a, 208b) and short-stroke y-axis actuators (see, for example, y-axis motion system 220); (b) a long-stroke XY manipulator (for example, such manipulators may include motion systems 304 and 308a in Figure 3) that can be positioned independently of each other in the XY plane using two short-stroke linear actuators. (c) One bond head including two arrays (see, for example, Figure 3) (for example, such a bond head may include bond head arrays 306a, 306b in Figure 3); (c) One long-stroke XY manipulator (for example, such a manipulator may include motion systems 404 and 408a in Figure 4), one bond head (for example, such a bond head may include bond head arrays 406a, 406b in Figure 4), and including two arrays that can be independently positioned in the XY plane via two short-stroke linear actuators, the combination of the two arrays being rotatable, and the arrays being 180° (d) A long-stroke XY manipulator (for example, such a manipulator may include motion systems 504 and 508a in Figure 5), a bond head (for example, such a bond head may include bond head arrays 506a and 506b in Figure 5), which includes two arrays that can be independently positioned in the XY plane using a single short-stroke linear actuator and a rotary actuator, and the arrays can be reordered by further rotating them 180 degrees (for example, a pickup (pipette, etc.) on the right side may move to the left side, and vice versa) (for example, see Figure 5);(e) A bond head (for example, support structure 622 is considered such a bond head) comprising one long-stroke XY manipulator (e.g., such manipulators may include motion systems 604 and 608a in Figure 6), and three pickup tools (such as pipettes) that can be independently positioned in the XY plane via three short-stroke actuators combined with a rotary actuator, wherein the three pickup tools (such as pipettes) can be arranged in any order by selecting the appropriate position of the linear actuator in combination with the rotation angle (see, for example, Figure 6). Of course, other modifications within the scope of the present invention are also conceivable; 【0015】 According to certain exemplary embodiments of the present invention, a reduced number of long-stroke axes are used in the component placement system. In a particular example, for a second bond head, the long-stroke axis is replaced with a short-stroke axis, reducing COGS (i.e., cost of goods sold). The short-stroke axis allows the second bond head to be positioned independently of the first (e.g., main) bond head. In such an example, there is only one (e.g., long-stroke) manipulator, and the short-stroke axis provides additional degrees of freedom. 【0016】 Next, refer to the drawings. FIG. 1 shows a component placement system 100. The component placement system 100 includes a supply area 102 for supplying various electronic components to be picked and placed on a substrate 114 (of course, a plurality of substrates 114 may be provided to receive the electronic components). A lookup camera 112 (or other vision system elements) is provided for alignment, inspection, etc. Exemplary bond head arrays 106a, 106b are shown in FIG. 1, each including a plurality of pick-up tools 110 (e.g., pick-and-place tools such as pipettes, grippers, etc.). A y-axis motion system 104 is provided to simultaneously move each of the bond head arrays 106a, 106b along the y-axis of the component placement system 100. A separate x-axis motion system 108 is provided for each of the bond head arrays 106a, 106b to move them separately from each other along the x-axis of the component placement system 100. An additional y-axis movement system 120 is shown for the bond head array 106b to move the pick-up tool 110 along the y-axis of the component placement system 100 without the bond head array 106a. 【0017】 The details of the bond head arrays 106a, 106b (and their associated support structures, pick-up tools, and motion systems) are essentially exemplary. It is understood that the configurations shown in FIGS. 2-6, or other configurations within the scope of the present invention, can be implemented in a component placement system including elements such as those shown in FIG. 1 (including the supply area 102, the substrate 114, the lookup camera 112, etc.). 【0018】 Referring now to FIG. 2, bond head arrays 206a and 206b are shown. Support structure 216 transports each of bond head arrays 206a and 206b. Further, another support structure 214 transports support structure 216 (and thus each of bond head arrays 206a and 206b). More specifically, support structure 216 (and thus each of bond head arrays 206a and 206b) can be moved along the y-axis of the component placement system using y-axis motion system 204 (e.g., a long stroke actuator). Bond head array 206a is transported by x-axis motion system 208a (via support structure 218), and thereby can be moved along the x-axis of the component placement system. Similarly, bond head array 206b is transported by x-axis motion system 208b, and thereby can be moved along the x-axis of the component placement system. Bond head array 206a can also be moved along the y-axis of the component placement system using y-axis motion system 220 (e.g., a short stroke actuator). Each of bond head arrays 206a and 206b includes a plurality of pickup tools 210 (e.g., pick and place tools such as pipettes). 【0019】 Thus, in summary, FIG. 2 shows a single long stroke y-axis motion system 204 for supporting two bond head arrays 206a and 206b. Each of bond head arrays 206a and 206b can be moved independently along the x-axis using respective x-axis motion systems 208a and 208b (e.g., linear actuators). Finally, bond head array 206a can be moved along the y-axis using y-axis motion system 220. 【0020】 Referring to Figure 3, bond head arrays 306a and 306b are shown. Support structure 316 transports bond head arrays 306a and 306b, respectively. Furthermore, another support structure 314 transports support structure 316 (and thus bond head arrays 306a and 306b, respectively). More specifically, support structure 316 (and thus bond head arrays 306a and 306b, respectively) can be moved along the y-axis of the component placement system using a y-axis motion system 304 (e.g., a long-stroke actuator). Both bond head arrays 306a and 306b are transported by an x-axis motion system 308a (e.g., a long-stroke actuator), thereby enabling movement along the x-axis of the component placement system. The bond head array 306a is also movable along the x and y axes of the component placement system, respectively, independently of the bond head array 306b (however, for simplification, 306a in Figure 3 is shown supported / constrained by roller bearings on both the X and Y axes, thus limiting its movement, but it should be understood that additional support structures can be used to separate the directions). More specifically, the bond head array 306a can move along the x axis independently of the bond head array 306b using the x-axis motion system 308b (e.g., a short-stroke actuator). Furthermore, the bond head array 306a can move along the y axis independently of the bond head array 306b using the y-axis motion system 320 (e.g., a short-stroke actuator). Each of the bond head arrays 306a and 306b includes multiple pickup tools 310 (e.g., pick-and-place tools such as pipettes and grippers). 【0021】 Therefore, in summary, Figure 3 shows (i) a single long-stroke y-axis motion system 304 for transporting two bond head arrays 306a and 306b, and (ii) a single long-stroke x-axis motion system 308a for transporting two bond head arrays 306a and 306b. Furthermore, bond head array 306a can move along the x-axis using the x-axis motion system 308b independently of bond head array 306b, and can also move along the y-axis using the y-axis motion system 320. 【0022】 Referring to Figure 4, bond head arrays 406a and 406b are shown. Support structure 416 carries bond head arrays 406a and 406b, respectively. Furthermore, another support structure 414 transports support structure 416 (and thus bond head arrays 406a and 406b, respectively). More specifically, support structure 416 (and thus bond head arrays 406a and 406b, respectively) can be moved along the y-axis of the component placement system using a y-axis motion system 404 (e.g., a long-stroke actuator). 【0023】 Both bond head arrays 406a and 406b are transported by an x-axis motion system 408a (e.g., a long-stroke actuator) (via a support structure 424), thereby making them movable along the x-axis of the component placement system. Both bond head arrays 406a and 406b are also transported by a rotational motion system 426 (via a support structure 422), and thus bond head arrays 406a and 406b are transported simultaneously around a rotational motion axis (i.e., around the z-axis). For example, a 180-degree rotation can reverse the order of the arrays (e.g., the bond head array on the right moves to the left, and vice versa). 【0024】 Bond head array 406a is also movable along the x and y axes of the component placement system independently of bond head array 406b (however, for simplification, 406a in Figure 4 is shown to be supported / constrained by roller bearings on both the X and Y axes, and thus its movement is restricted, but it should be understood that additional support structures can be used to isolate the directions). More specifically, bond head array 406a can move along the x axis independently of bond head array 406b using x-axis motion system 408b (e.g., short-stroke actuator). Furthermore, bond head array 406a can move along the y axis independently of bond head array 406b using y-axis motion system 420 (e.g., short-stroke actuator). Each of bond head arrays 406a and 406b includes multiple pickup tools 410 (e.g., pick-and-place tools such as pipettes and grippers). 【0025】 Therefore, in summary, Figure 4 shows (i) a single long-stroke y-axis motion system 404 for transporting two bond head arrays 406a and 406b, (ii) a single long-stroke x-axis motion system 408a for transporting two bond head arrays 406a and 406b, and (iii) a single rotational motion system 426 for transporting bond head arrays 406a and 406b around a rotational motion axis. Furthermore, bond head array 406a can move along the x-axis using the x-axis motion system 408b independently of bond head array 406b, and can also move along the y-axis using the y-axis motion system 420. 【0026】 Referring to Figure 5, bond head arrays 506a and 506b are shown. Support structure 516 transports bond head arrays 506a and 506b, respectively. Furthermore, another support structure 514 supports support structure 516 (and thus bond head arrays 506a and 506b, respectively). More specifically, support structure 516 (and thus bond head arrays 506a and 506b, respectively) can be moved along the y-axis of the component placement system using a y-axis motion system 504 (e.g., a long-stroke actuator). Both bond head arrays 506a and 506b are transported (via support structure 524) by an x-axis motion system 508a (e.g., a long-stroke actuator), thereby making them movable along the x-axis of the component placement system. Bond head arrays 506a and 506b are also both transported by the rotational motion system 526 (via the support structure 522), and thus bond head arrays 506a and 506b are transported simultaneously around the rotational motion axis (i.e., around the z-axis). For example, a 180-degree rotation can reverse the order of the arrays (for example, moving the bond head array on the right to the left, and vice versa). 【0027】 The bond head array 506a is also movable along the x-axis of the component placement system independently of the bond head array 506b. More specifically, the bond head array 506a can be moved along the x-axis independently of the bond head array 506b using the x-axis motion system 508b (e.g., a short-stroke actuator). Each of the bond head arrays 506a and 506b includes multiple pickup tools 510 (e.g., pick-and-place tools such as pipettes and grippers). 【0028】 Therefore, in summary, Figure 5 shows (i) a single y-axis motion system 504 (e.g., a long-stroke motion system) for transporting two bond head arrays 506a and 506b, (ii) a single x-axis motion system 508a (e.g., a long-stroke motion system) for transporting two bond head arrays 506a and 506b, and (iii) a single rotational motion system 526 for transporting bond head arrays 506a and 506b around a rotational motion axis. Furthermore, bond head array 506a can be moved along the x-axis independently of bond head array 506b using the x-axis motion system 508b. 【0029】 Referring here to the overhead view in Figure 5, three separate pickup tools 610 are shown, each being transported by one of the support structures 630a, 630b, and 630c, respectively. Each of the linear motion systems 628a, 628b, and 628c is provided to move one of the support structures 630a, 630b, and 630c (and thus each pickup tool 610) relative to the support structure 622 (the support structure 622 is considered a bond head). 【0030】 As detailed below, support structure 616 supports support structure 622 via linear motion system 608a (e.g., x-axis motion system), support structure 624, and rotational motion system 626. Furthermore, another support structure 614 supports support structure 616. More specifically, support structure 616 (and thus each of the pickup tools 610) can be moved along the y-axis of the part placement system using linear motion system 604 (e.g., long-stroke actuator, y-axis motion system). Each of the three pickup tools 610 is transported (via support structure 624) by linear motion system 608a (e.g., long-stroke actuator, x-axis motion system), thereby making it movable along the x-axis of the part placement system. Each of the three pickup tools is also transported (via support structure 622) by rotational motion system 626, and therefore transported simultaneously around the rotational motion axis (i.e., around the z-axis). Therefore, in summary, we have (i) a single linear motion system 604 (e.g., a long-stroke motion system, a y-axis motion system, etc.) for transporting three pickup tools 610, (ii) a single linear motion system 608a (e.g., a long-stroke motion system, an x-axis motion system, etc.) for transporting three pickup tools 610, and (iii) a single rotational motion system 626 for transporting three pickup tools 610 around a rotational motion axis. 【0031】 Furthermore, each of the three pickup tools 610 can move independently along its respective linear axis using its own linear motion system 628a, 628b, and 628c (such as a short-stroke linear actuator). By selecting the correct positions of the linear motion systems 628a, 628b, and 628c at a desired rotation angle of the rotary motion system 626, the three pickup tools 610 (e.g., pipettes, grippers, etc.) can be positioned in any desired configuration. 【0032】 Figures 7 and 8 are flowcharts illustrating the operation of a component placement system. As those skilled in the art will understand, certain steps included in the flowcharts may be omitted. Certain additional steps may also be added. Furthermore, the order of the steps may be changed from the order shown, all of which are within the scope of the present invention. 【0033】 Referring to Figure 7, in step 700, a first set of electronic components are transported using a first bond head array. In step 702, a second set of electronic components are transported using a second bond head array. In step 704, the first bond head array and the second bond head array are moved simultaneously along the first motion axis using the first motion system (for example, bond head arrays 106a and 106b are moved along the y-axis using motion system 104; head arrays 106a and 106b are moved along the x-axis using a motion system including two x-axis motion systems 108) (for example, bond head arrays 206a and 206b are moved along the y-axis using y-axis motion system 204; bond head arrays 206a and 206b are moved along the x-axis using a motion system including two x-axis motion systems 208a and 208b). In step 706, the first bond head array is moved independently of the second bond head array using the second motion system (for example, bond head array 106b is moved independently of bond head array 106a using y-axis motion system 120) (for example, bond head Array 206a is moved independently of bond head array 206b using the y-axis motion system 220. Referring here to Figure 8, in step 800, multiple linear motion systems are transported using the first support structure, each of which is configured to move one of multiple pickup tools configured to transport electronic components. In step 802, the first support structure is supported by the second support structure. In step 804, the first support structure is moved relative to the second support structure around a rotational axis using a rotational motion system (see Figure 6, for example, support structure 622 is moved relative to support structure 624 around a rotational axis using rotational motion system 626). In an optional step 806, the second support structure is supported by the third support structure. In an optional step 808, the second support structure is moved relative to the third support structure along the first linear motion axis using another linear motion system (see Figure 6, for example, support structure 624 is moved relative to support structure 616 using linear motion system 608a). In an optional step 810, the third support structure is supported by the fourth support structure. In an optional step 812, the third support structure is moved along the second linear motion axis relative to the fourth support structure using yet another linear motion system (see Figure 6, for example, where support structure 616 is moved relative to support structure 614 using linear motion system 604). 【0034】 As those skilled in the art will understand, the pick-and-place tools described herein (e.g., pick-up tools, pipettes, grippers, etc.) are configured to pick up and / or place any electronic components as needed for a particular application. Exemplary electronic components include semiconductor elements, discrete components, and other electronic components that can be placed using the component placement systems of the present invention as described herein. 【0035】 As those skilled in the art will understand, the motion systems described herein (y-axis motion systems, x-axis motion systems, linear motion systems, rotational motion systems, etc.) are shown in a simplified form. Such motion systems may include various subcomponents and can be considered as manipulators, actuators, motors, or any other type of motion system applicable to the component placement systems of the present invention as described herein. 【0036】 While the present invention has been illustrated and described herein with reference to specific embodiments, the invention is not intended to be limited to the details shown. Rather, various modifications can be made in detail within the scope of the claims and equivalents without departing from the invention.

Claims

[Claim 1] A component placement system, A bond head comprising a first bond head array configured to simultaneously transport a first plurality of electronic components and a second bond head array configured to simultaneously transport a second plurality of electronic components, A first support structure for transporting the bond head, A second support structure for transporting the first support structure, A first motion system for transporting the first support structure and the bond head along a first motion axis, the first motion system including a long-stroke actuator, A second motion system for transporting the bond head along a second motion axis, wherein the second motion axis is perpendicular to the first motion axis and includes another long-stroke actuator, A third motion system for transporting the first bond head array along the first motion axis independently of the second bond head array, the third motion system includes a short-stroke actuator, A fourth motion system for transporting the first bond head array along the second motion axis independently of the second bond head array, the fourth motion system includes another short-stroke actuator, A component placement system having [Claim 2] A component placement system according to claim 1, wherein the first motion axis includes a linear axis of the component placement system. [Claim 3] A component placement system according to claim 1, wherein the first axis of motion is the y-axis of the component placement system. [Claim 4] A component placement system according to claim 1, wherein the second motion axis is the x-axis of the component placement system. [Claim 5] In the component placement system according to claim 1, A component placement system in which the first axis of motion is the y-axis of the component placement system, and the second axis of motion is the x-axis of the component placement system. [Claim 6] A method for operating a component placement system, (a) A step of providing a bond head, wherein the bond head includes a first bond head array for transporting a first plurality of electronic components and a second bond head array for transporting a second plurality of electronic components. (b) A step of moving a first support structure along a first motion axis using a first motion system including a long-stroke actuator, wherein the first support structure transports the bond heads including the first bond head array and the second bond head array, and the first support structure is supported by the second support structure. (c) A step of moving the bond head along a second motion axis using a second motion system including another long-stroke actuator, wherein the bond head includes the first bond head array and the second bond head array, (d) Moving the first bond head array along the first motion axis independently of the second bond head array using a third motion system including a short-stroke actuator, (e) Moving the first bond head array along the second motion axis independently of the second bond head array using a fourth motion system including another short-stroke actuator, A method having [Claim 7] A component placement system, A first support structure that supports multiple linear motion systems, each of which is configured to move one of multiple pickup tools, and A second support structure for supporting the first support structure, A third support structure for supporting the second support structure, A rotational motion system for moving the first support structure relative to the second support structure around a rotational motion axis, Another linear motion system for supporting the second support structure along the first linear motion axis, A component placement system having the following features. [Claim 8] In the component arrangement system according to claim 7, A fourth support structure for supporting the third support structure, The present invention further comprises another linear motion system for transporting the third support structure along a second linear motion axis, The second linear motion axis is substantially perpendicular to the first linear motion axis. Component placement system. [Claim 9] A method for operating a component placement system, (a) A step of supporting a plurality of linear motion systems using a first support structure, wherein each of the plurality of linear motion systems is configured to move one of a plurality of pickup tools configured to transport electronic components, (b) A step of supporting the first support structure with the second support structure, (c) A step of moving the first support structure relative to the second support structure around the axis of rotation using a rotational motion system, (d) The step of supporting the second support structure with the third support structure, (e) A step of moving the second support structure relative to the third support structure along the first linear motion axis using another linear motion system, A method of having. [Claim 10] In the method described in claim 9, (f) The step of supporting the third support structure with the fourth support structure, (g) A method further comprising the step of moving the third support structure relative to the fourth support structure along a second linear motion axis using another linear motion system. [Claim 11] A component placement system, A first bond head array configured to transport multiple first electronic components simultaneously, A second bond head array configured to transport multiple second electronic components simultaneously, A first motion system for simultaneously transporting the first bond head array and the second bond head array along a first motion axis and a second motion axis, A second motion system for transporting the first bond head array along the first motion axis and the second motion axis, independently of the second bond head array, A rotational motion system for simultaneously rotating the first bond head array and the second bond head array about a rotational motion axis, wherein this rotational motion system is supported by the first motion system, A component placement system having [Claim 12] A component placement system according to claim 11, wherein the first axis of motion is the y-axis of the component placement system, and the second axis of motion is the x-axis of the component placement system.

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