Sensors and molds

Abstract

To achieve a sensor that is applicable to estimation of a heat transfer coefficient.SOLUTION: A sensor (80) comprises: a film (82a) that is in contact with liquid and is bent by a pressing force from the liquid; and a laser displacement gauge (82b) that projects light on the film (82a) and receives light reflected from the film (82a) to detect the amount of bend of the film (82a).SELECTED DRAWING: Figure 14

Description

[Technical Field] 【0001】 This invention relates to sensors and molds. [Background technology] 【0002】 Methods for simulating the flow state and solidification behavior of molten materials during mold molding have been extensively researched. Since the flow state and solidification behavior of the molten material are influenced by the temperatures of the metal parts of the mold and the molten material, it is important to accurately estimate the temperature distributions of the metal parts and the molten material (hereinafter abbreviated as "temperature distribution") in these simulation methods. 【0003】 To estimate the temperature distribution, it is necessary to estimate the heat transfer coefficient (HTC) at the interface between the metal and the molten material. The heat transfer coefficient is a value that represents how easily heat is transferred at the interface and changes depending on the contact state between the metal and the molten material. However, since the contact state between the metal and the molten material changes over time and also differs depending on the contact point, estimating the heat transfer coefficient has been difficult. 【0004】 Various studies are underway to solve this problem. For example, Non-Patent Document 1 discloses the results of an investigation into the effects of the decrease in the heat transfer coefficient due to the formation of an air gap on temperature history, shrinkage cavity prediction parameters, etc., in the solidification analysis of castings. [Prior art documents] [Non-patent literature] 【0005】 [Non-Patent Document 1] Oura et al., "Influence of Heat Transfer Models and Material Constitutive Laws on Solidification Analysis Considering Thermal Shrinkage," Foundry Engineering, Japan Foundry Engineering Society, July 25, 2009, Vol. 81, No. 7, pp. 323-330. [Overview of the project] [Problems that the invention aims to solve] 【0006】 The investigation method disclosed in Non-Patent Document 1 estimates the heat transfer coefficient by analyzing a model of the heat transfer coefficient that depends on the amount of air gap when an air gap occurs. Therefore, this investigation method requires measuring the amount of air gap as a prerequisite for estimating the heat transfer coefficient. However, measuring the amount of air gap is time-consuming to prepare, and the measurement of the air gap itself is difficult. For this reason, estimating the heat transfer coefficient using the investigation method disclosed in Non-Patent Document 1 was not always easy. 【0007】 One aspect of the present invention has been made in view of the aforementioned problems and aims to realize a sensor or the like that can be applied to the estimation of the heat transfer coefficient. [Means for solving the problem] 【0008】 A sensor according to one aspect of the present invention comprises a membrane that comes into contact with a fluid and bends due to the pressure exerted by the fluid, and a laser displacement meter that projects light onto the membrane and detects the amount of deflection of the membrane by receiving the light reflected from the membrane. [Effects of the Invention] 【0009】 According to one aspect of the present invention, a sensor or the like applicable to the estimation of the heat transfer coefficient can be realized. [Brief explanation of the drawing] 【0010】 [Figure 1] This is a block diagram showing the functional configuration of the main part of the simulation device according to Embodiments 1 to 3 of the present invention. [Figure 2] Reference numeral 201 denotes a schematic diagram showing the external appearance and internal structure of a mold used in pressure casting. Reference numeral 202 denotes a cross-sectional view of the aforementioned mold when it is cut along a plane containing the central axis of the mold. [Figure 3] Reference numeral 301 denotes a front view and a side view of the first sensor according to Embodiment 1 of the present invention. Reference numeral 302 denotes a schematic diagram showing the measurement location of the first temperature measuring unit in the first sensor described above. [Figure 4]Reference numeral 401 is a front view and a side view of the second sensor according to Embodiment 1 of the present invention. Reference numeral 402 is a schematic diagram showing the measurement location of the second temperature measurement unit in the aforementioned second sensor. [Figure 5] Reference numeral 501 is a plan view showing the measurement locations of the temperatures of the mold and the molten metal shown in FIG. 2. Reference numeral 502 is a cross-sectional view taken along line V-V showing the measurement locations of the temperatures of the mold and the molten metal shown in FIG. 2. Reference numeral 503 is a diagram showing the positions of the respective measurement locations where the temperature is measured by the first and second sensors from the first mold surface. [Figure 6] It is a graph showing the relationship between strain and compressive stress regarding the aforementioned first and second sensors. [Figure 7] Reference numeral 701 is a perspective view showing a three-dimensional model of the mold used for determining the first heat transfer coefficient data. Reference numeral 702 is a view of the aforementioned three-dimensional model in a side view. [Figure 8] It is a flowchart showing an example of a method for determining the heat transfer coefficient according to Embodiment 1 of the present invention. [Figure 9] It is a diagram showing an example of a method for changing the first heat transfer coefficient data in the aforementioned determination method. [Figure 10] It is a diagram showing another example of a method for changing the first heat transfer coefficient data in the aforementioned determination method. [Figure 11] It is a graph showing the correlation between the first heat transfer coefficient data and the contact pressure data. [Figure 12] Reference numeral 1201 is a plan view showing the internal structure of the mold used for gravity casting and the measurement locations of the temperatures of the mold and the molten metal. Reference numeral 1202 is a cross-sectional view taken along line A-A showing the internal structure of the mold used for gravity casting and the measurement locations of the temperatures of the mold and the molten metal. Reference numeral 1203 is a diagram showing the positions of the respective measurement locations where the temperature is measured by the third sensor from the second mold surface. [Figure 13] It is a diagram showing the respective arrangements of the third sensor and the reference sensor in the mold shown in FIG. 12. [Figure 14]Reference numeral 1401 denotes a schematic diagram showing the external appearance of the third sensor according to Embodiment 2 of the present invention. Reference numeral 1402 denotes a cross-sectional view obtained when the mold and the third sensor body housed in the first to fourth holes shown in Figure 12 are cut along a plane including the central axis of the third sensor body. [Figure 15] This graph shows the relationship between the temperature of the film and the amount of film deflection when molten tin is poured into the mold shown in Figure 12 and gravity casting is performed, for various contact pressures. [Figure 16] This figure shows the relationship between the pressing force acting on the film and the height of the molten metal when molten tin is poured into a calibration mold. [Figure 17] This graph shows the relationship between the preferred elapsed time and contact pressure when molten metal according to one embodiment of the present invention is poured into the mold shown in Figure 12 and gravity casting is performed. [Figure 18] This graph shows the relationship between the preferred elapsed time and the heat transfer coefficient when molten metal according to one aspect of the present invention is poured into the mold shown in Figure 12 and gravity casting is performed. [Figure 19] This graph shows the correlation between the heat transfer coefficient and the contact pressure when molten metal according to one aspect of the present invention is poured into the mold shown in Figure 12 and gravity casting is performed. [Figure 20] This graph shows the relationship between the first heat transfer coefficient data determined by the method shown in Figure 8, the first heat transfer coefficient data determined using a one-dimensional transient heat transfer model, and the elapsed time. [Figure 21] This is the equivalent circuit when heat transfer near the interface is represented by a one-dimensional transient heat transfer model. [Figure 22] This graph shows the relationship between the first heat transfer coefficient data determined by the method shown in Figure 8, the first heat transfer coefficient data calculated by applying a one-dimensional transient heat transfer model, and the elapsed time. [Figure 23] This graph shows the evaluation results of the accuracy of determining the first heat transfer coefficient data. [Figure 24] This graph shows the correlation between the first heat transfer coefficient data and contact pressure data, depending on the presence and type of release agent used. [Figure 25]This graph shows the relationship between the first heat transfer coefficient data and the molten metal surface temperature for each contact pressure data. [Modes for carrying out the invention] 【0011】 [Embodiment 1] <Overview of the simulation system> The simulation device 100 according to Embodiment 1 of the present invention is a device that simulates the flow state and solidification behavior of molten metal 50 (molten material) during mold molding. In this embodiment, a tablet terminal is used as an example to describe the simulation device 100. In addition to a tablet terminal, the simulation device 100 may also be a smartphone or a stationary personal computer. Details of the molten metal 50 will be described later. 【0012】 As shown in Figure 1, the simulation device 100 includes an input unit 1, an output unit 2, a storage unit 3, a control device 4, a first sensor 10, and a second sensor 20. The input unit 1 receives user input. The output unit 2 outputs the results of various processes performed by the simulation device 100. In this embodiment, the simulation device 100 includes a touch panel in which the input unit 1 and the display unit (output unit 2) are integrated. 【0013】 The input unit 1 and the display unit (output unit 2) may be physically separated. The input unit 1 may be, for example, a keyboard or a pointing device. The output unit 2 may be, for example, a communication unit that wirelessly (or via wired) transmits the results of various processes performed by the simulation device 100 to an external communication device (not shown), or it may be a printer. 【0014】 The first sensor 10 is a component of the simulation device 100 that measures temperatures Tmp1 to Tmp6 (first temperature), temperature Tcp (second temperature), and contact pressure Fp. Specifically, temperatures Tmp1 to Tmp6 are six temperatures: Tmp1, Tmp2, Tmp3, Tmp4, Tmp5, and Tmp6. 【0015】 The first sensor 10 includes a first temperature measuring unit 11, a first pressure measuring unit 12, and a first sensor body 13, which will be described later. The first temperature measuring unit 11 measures temperatures Tmp1 to Tmp6 and Tcp, and the first pressure measuring unit 12 measures contact pressure Fp. Details of temperatures Tmp1 to Tmp6 and Tcp, and contact pressure Fp will be described later. 【0016】 The second sensor 20 is a component of the simulation device 100 that measures temperature Tmd1 to Tmd6 (first temperature), temperature Tcd (second temperature), and contact pressure Fd. Specifically, temperatures Tmd1 to Tmd6 are six temperatures: Tmd1, Tmd2, Tmd3, Tmd4, Tmd5, and Tmd6. 【0017】 The second sensor 20 includes a second temperature measuring unit 21, a second pressure measuring unit 22, and a second sensor body 23, which will be described later. The second temperature measuring unit 21 measures temperatures Tmd1 to Tmd6 and Tcd, and the second pressure measuring unit 22 measures contact pressure Fd. Details of temperatures Tmd1 to Tmd6 and Tcd, and contact pressure Fd will be described later. 【0018】 In this embodiment, the first and second temperature measuring units 11 and 21 are thermocouples. The first and second temperature measuring units 11 and 21 may be, for example, radiation thermometers or thermometers using optical fibers, but considering the measurement accuracy, it is preferable to use thermocouples. In this embodiment, the first and second pressure measuring units 12 and 22 are strain gauges. The first and second pressure measuring units 12 and 22 may be, for example, piezoelectric elements. 【0019】 The memory unit 3 is a memory device that stores various data used by the simulation device 100. The control device 4 is, for example, a CPU (Central Processing Unit) and comprehensively controls each part that makes up the simulation device 100. The control device 4 has a first estimation device 30 (estimation device) and a second estimation device 60 (behavior estimation device). 【0020】 The first estimation device 30 estimates the second heat transfer coefficient data hd-2, hpl-2, and hpu-2, which will be described later. Details of the estimation process of the first estimation device 30 will be described later. The second estimation device 60 uses the second heat transfer coefficient data hd-2, hpl-2, and hpu-2 estimated by the first estimation device 30 to estimate the temperature distributions of the mold 40 and the molten metal 50 during mold molding. The second estimation device 60 also estimates the solidification behavior of the molten metal 50 during mold molding from the temperature distributions estimated by the first estimation device 30. 【0021】 Specifically, the second estimation device 60 defines the solidification temperature and the solid fraction corresponding to the solidification temperature according to the type of molten metal 50. Next, the second estimation device 60 estimates the solidification behavior of the molten metal 50 for each time step based on the temperature distribution for each time step described later. The method for estimating the solidification behavior is not particularly limited. For example, the energy conservation law may be used as the basic equation for heat transfer estimation, or the forward Euler method, the Crank-Nicholson method, etc., may be used as numerical methods for solving differential equations. Furthermore, methods such as the temperature recovery method, the equivalent specific heat method, and the enthalpy method may be used to handle solidification. 【0022】 Furthermore, the first and second estimation devices 30 and 60 do not necessarily have to be built into the control device 4; the simulation device 100 may be equipped with these devices in some form. Also, the simulation device 100 does not necessarily have to be equipped with the first and second estimation devices 30 and 60; for example, it may function as a server that stores the data from the first and second estimation devices 30 and 60. In this case, a simulation system may be constructed using the first and second sensors 10 and 20, the first and second estimation devices 30 and 60, and the simulation device 100. 【0023】 The first estimation device 30 includes a temperature acquisition unit 31, a pressure acquisition unit 32, a generation unit 33, a first estimation unit 34, and a second estimation unit 35. The temperature acquisition unit 31 acquires the temperature values ​​Tmp1 to Tmp6 and Tcp measured by the first sensor 10 from the first sensor 10, and acquires the temperature values ​​Tmd1 to Tmd6 and Tcd measured by the second sensor 20 from the second sensor 20. Hereinafter, the temperature values ​​acquired by the temperature acquisition unit 31 from the first sensor 10 will be referred to as "temperature data Tmp1-1 to Tmp6-1 and Tcp-1 (first temperature data, second temperature data)". Similarly, the temperature values ​​acquired by the temperature acquisition unit 31 from the second sensor 20 will be referred to as "temperature data Tmd1-1 to Tmd6-1 and Tcd-1 (first temperature data, second temperature data)". 【0024】 The pressure acquisition unit 32 acquires the pressure value of the contact pressure Fp measured by the first sensor 10 from the first sensor 10, and the pressure value of the contact pressure Fd measured by the second sensor 20 from the second sensor 20. Hereinafter, the pressure value acquired by the pressure acquisition unit 32 from the first sensor 10 will be referred to as "contact pressure data Fp-1 (pressure data)". Similarly, the pressure value acquired by the pressure acquisition unit 32 from the second sensor 20 will be referred to as "contact pressure data Fd-1 (pressure data)". The data acquired by the temperature acquisition unit 31 and the pressure acquisition unit 32 may be temporarily stored in the storage unit 3. 【0025】 In this embodiment, the temperature acquisition unit 31 and the pressure acquisition unit 32 each acquire data from the first and second sensors 10 and 20 at multiple time steps at regular intervals. In addition, the temperature acquisition unit 31 and the pressure acquisition unit 32 each acquire data from the first and second sensors 10 and 20 by receiving data via wireless communication. This data reception may also be performed via wired communication. 【0026】 The first estimation device 30 may calculate the contact pressure data Fd-1 and Fp-1, respectively, using the temperature data acquired by the temperature acquisition unit 31. In this case, the first estimation device 30 does not need to have a pressure acquisition unit 32. 【0027】 The generation unit 33 generates an upper punch side basic dataset (basic dataset) by determining a first heat transfer coefficient data hpu-1 using multiple temperature data acquired by the temperature acquisition unit 31. The first heat transfer coefficient data hpu-1 is a value that indicates the first heat transfer coefficient on the upper punch side between the upper punch 42 and the molten metal 50 at the first interface Si1. The first heat transfer coefficient on the upper punch side is a value that represents how easily heat is transferred at the first interface Si1. In this embodiment, the generation unit 33 acquires data from the temperature acquisition unit 31 at multiple time steps at regular intervals and determines the first heat transfer coefficient data hpu-1 for each time step. 【0028】 The upper punch side basic dataset is a dataset in which contact pressure data Fp-1 and first heat transfer coefficient data hpu-1 are associated. In this embodiment, the generation unit 33 generates the upper punch side basic dataset by determining the first heat transfer coefficient data hpu-1 and acquiring contact pressure data Fp-1 from the pressure acquisition unit 32. In this embodiment, the generation unit 33 also acquires data from the pressure acquisition unit 32 at multiple time steps at regular intervals. Therefore, the upper punch side basic dataset in this embodiment has a configuration that includes multiple combinations of contact pressure data Fp-1 and first heat transfer coefficient data hpu-1 in one time step. 【0029】 The generation unit 33 generates the die-side basic dataset (basic dataset) using the same generation method as the upper punch-side basic dataset. The die-side basic dataset is a dataset in which contact pressure data Fd-1 and first heat transfer coefficient data hdu-1 are associated. 【0030】 The generation unit 33 generates the lower punch side basic dataset (basic dataset) using the same generation method as the upper punch side basic dataset. The lower punch side basic dataset is a dataset in which contact pressure data Fp-1 and first heat transfer coefficient data hpl-1 are associated. In this embodiment, the generation unit 33 determines the first heat transfer coefficient data hpl-1 and considers the contact pressure data Fp-1 obtained from the pressure acquisition unit 32 as the pressure value of the contact pressure acting on the third interface Si3 to generate the lower punch side basic dataset. 【0031】 Note that the aforementioned basic datasets do not necessarily have to be generated by the generation unit 33. For example, the aforementioned basic datasets may be stored in advance in the storage unit 3 or an external server, and the first estimation unit 34 may read them from the storage unit 3, etc., when performing the estimation process. Alternatively, for example, an external information processing device may generate the aforementioned basic datasets, and the first estimation unit 34 may acquire them from the information processing device when performing the estimation process. Details of the determination process of the first to third interfaces Si1 to Si3 and the first heat transfer coefficient data hd-1, hpl-1, and hpu-1 by the generation unit 33 will be described later. 【0032】 The first estimation unit 34 estimates the correlation between the contact pressure data Fp-1 and the first heat transfer coefficient data hpu-1 using the upper punch-side basic dataset generated by the generation unit 33. The first estimation unit 34 estimates the correlation between the contact pressure data Fd-1 and the first heat transfer coefficient data hd-1 using the die-side basic dataset generated by the generation unit 33. The first estimation unit 34 estimates the correlation between the contact pressure data Fp-1 and the first heat transfer coefficient data hpl-1 using the lower punch-side basic dataset generated by the generation unit 33. Details of the estimation process by the first estimation unit 34 will be described later. 【0033】 The second estimation unit 35 estimates the second heat transfer coefficient data hd-2 from the estimation contact pressure data Fd-2 (specific pressure data) using the die-side estimation correlation (estimated correlation). The die-side estimation correlation is the correlation between the contact pressure data Fd-1 and the first heat transfer coefficient data hd-1 estimated by the first estimation unit 34. The second heat transfer coefficient data hd-2 is the estimated value of the first heat transfer coefficient data hd-1 corresponding to the estimation contact pressure data Fd-2. 【0034】 The second estimation unit 35 may select the contact pressure data Fd-2 for estimation from among multiple contact pressure data Fd-1 included in the die-side basic dataset. The second estimation unit 35 may also use the value received by the input unit 1 as the contact pressure data Fd-2 when the input unit 1 accepts the input operation for the contact pressure data Fd-2. The second estimation unit 35 may also use the contact pressure data Fd-1 acquired from the pressure acquisition unit 32 as the contact pressure data Fd-2 for estimation. The same applies to the contact pressure data Fp-2 for estimation, which will be described below. 【0035】 Furthermore, the second estimation unit 35 estimates the second heat transfer coefficient data hpu-2 from the estimation contact pressure data Fp-2 (specific pressure data) using the upper punch side estimation correlation (estimated correlation). The upper punch side estimation correlation is the correlation between the contact pressure data Fp-1 and the first heat transfer coefficient data hpu-1 estimated by the first estimation unit 34. The second heat transfer coefficient data hpu-2 is the estimated value of the first heat transfer coefficient data hpu-1 corresponding to the estimation contact pressure data Fp-2. 【0036】 Furthermore, the second estimation unit 35 estimates the second heat transfer coefficient data hpl-2 from the estimation contact pressure data Fp-2 using the lower punch side estimation correlation (estimated correlation). The lower punch side estimation correlation is the correlation between the contact pressure data Fp-1 and the first heat transfer coefficient data hpl-1 estimated by the first estimation unit 34. The second heat transfer coefficient data hpl-2 is the estimated value of the first heat transfer coefficient data hpl-1 corresponding to the estimation contact pressure data Fp-2. Details of the estimation process by the second estimation unit 35 will be described later. 【0037】 <Mold and Contact Pressure> (Mold) The mold 40 is a metal mold used in the manufacture of products by press working. In this embodiment, the forming material of the mold 40 is carbon steel. As shown in Figure 2, the mold 40 comprises a die 41, an upper punch 42 (metal part), and a lower punch 43 (metal part). 【0038】 The die 41 is a hollow cylindrical mold, and the hollow portion of the die 41 is cylindrical. Various release agents, such as water-soluble release agents, oil-based release agents, BN (boron nitride) spray, or blackbody spray, are applied to the inner surface of the die 41 that forms the hollow portion, as needed. A hole 41Y is formed in the metal portion 41X of the die 41, perpendicular to the central axis of the die 41. The hole 41Y is a cylindrical hole large enough to insert and remove the second sensor 20, and penetrates from the outer surface of the metal portion 41X to the hollow portion. When the second sensor 20 is housed in the hole 41Y, as shown by reference numeral 202 in Figure 2, the surface of the second sensor 20 (specifically, the second sensor body 23 described later) facing the molten metal 50 becomes flush with the inner surface of the upper punch 42. 【0039】 The upper punch 42 is a cylindrical mold sized to fit into and out of the hollow section of the die 41. When setting the upper punch 42 into the die 41, it is inserted through the upper opening in the hollow section. The upper punch 42 has a hole 42X formed in a direction parallel to its central axis. The hole 42X is a cylindrical hole sized to fit into and out of the first sensor 10, and it penetrates from the upper end face to the lower end face of the upper punch 42. The central axis of the hole 42X coincides with the central axis of the upper punch 42. When the first sensor 10 is housed in the hole 42X and set, as shown by reference numeral 202 in Figure 2, the surface of the first sensor 10 (specifically, the first sensor body 13 described later) facing the molten metal 50 becomes flush with the lower end face of the upper punch 42. 【0040】 Note that the hole 41Y in the die 41 and the hole 42X in the upper punch 42 do not necessarily have to be through. In this case, the thickness from the bottom surface of the non-through hole 41Y to the inner side surface of the die 41 should be such that a measurement accuracy of the same degree as that of the second sensor 20 when the second sensor 20 is set in the hole 41Y in the configuration of this embodiment can be obtained. Similarly, the thickness from the bottom surface of the non-through hole 42X to the lower end surface of the upper punch 42 should be such that a measurement accuracy of the same degree as that of the first sensor 10 when the first sensor 10 is set in the hole 42X in the configuration of this embodiment can be obtained. 【0041】 The lower punch 43, like the upper punch 42, is a cylindrical shape sized to fit into and out of the hollow section of the die 41. When setting the lower punch 43 into the die 41, it is inserted through the lower opening in the hollow section. Then, as shown by reference numeral 201 in Figure 2, the lower punch 43 is housed in the hollow section so that its lower end face is flush with the lower end face of the die 41. 【0042】 Casting by press working using mold 40 (pressure casting) is performed as follows. First, the die 41, with the lower punch 43 housed in the hollow section, is set in a hydraulic press machine (not shown). Next, molten metal 50 is poured into the hollow section from the upper opening in the hollow section. In this embodiment, the molten metal 50 is molten aluminum alloy die-cast metal such as ADC12. The molten metal 50 may also be molten metal of other die-casting alloys such as zinc alloy die-cast metal. 【0043】 Next, the upper punch 42 is inserted through the upper opening in the hollow section, bringing the upper punch 42 into contact with the molten metal 50, and then the upper punch 42 is pressed vertically downward with a hydraulic press. In other words, during the pressing process with the upper punch 42, the molten metal 50 fills the space 40X surrounded by the metal portion 41X of the die 41, the upper punch 42, and the lower punch 43. Also, during this process, the central axes of the die 41, the upper punch 42, and the lower punch 43 all coincide. These coincided central axes become the central axis AX of the mold 40. Finally, the molten metal 50 is solidified while being pressed by the upper punch 42, completing the molded body (not shown) before finishing. 【0044】 It should be noted that the terms "orthogonal," "parallel to the central axis," "coincident with the central axis," and "flush with the inner side / lower end face" mentioned above do not require "orthogonal," "parallel," "coincident," and "flush" in a strict sense. It is sufficient if they appear "orthogonal," "parallel," "coincident," and "flush" at a visual level, and these concepts include dimensional tolerances, etc. This also applies to the following explanation. 【0045】 The mold 40 does not need to be for press working. For example, when manufacturing a product with molten resin (molten body) instead of molten metal 50, an injection molding mold may be used as the mold 40. Furthermore, the mold 40 does not have to consist of a die 41, an upper punch 42, and a lower punch 43. The mold 40 can be any shape and structure that allows the first and second estimation devices 30 and 60 to perform estimation processing, respectively. 【0046】 (Contact pressure) As described above, the first pressure measuring unit 12 of the first sensor 10 measures the contact pressure Fp, and the second pressure measuring unit 22 of the second sensor 20 measures the contact pressure Fd. The contact pressure Fp is the pressure acting on the first interface Si1 shown by reference numeral 202 in Figure 2. The contact pressure Fd is the pressure acting on the second interface Si2 shown by reference numeral 202 in Figure 2. Note that in Figure 2, reference numeral 202 shows a gap between the die 41, upper punch 42 and lower punch 43 and the molten metal 50. This is done for the sake of explanation, and in reality the die 41, upper punch 42 and lower punch 43 are in contact with the molten metal 50. The same is true in Figure 13. 【0047】 The first interface Si1 is a concept consisting of a surface Sp1 that contacts the molten metal 50 on the first sensor 10 and the upper punch 42, respectively, and a surface Sc1 on the molten metal 50 that contacts the first sensor 10 and the upper punch 42, respectively. Specifically, the "surface Sp1 that contacts the molten metal 50 on the first sensor 10 and the upper punch 42" consists of the surface of the first sensor 10 (the first sensor body 13 described later) that faces the molten metal 50 and the lower end surface of the upper punch 42. In the following description, this surface will be referred to as the "first contact surface Sp1". Specifically, the "surface Sc1 that contacts the first sensor 10 and the upper punch 42 on the molten metal 50" is the upper end surface of the molten metal 50, and in the following description, it will be referred to as the "second contact surface Sc1". 【0048】 From the definition of the first interface Si1 mentioned above, "contact pressure Fp" refers to two pressures: the contact pressure Fp acting from the first contact surface Sp1 toward the second contact surface Sc1, and the contact pressure Fp acting from the second contact surface Sc1 toward the first contact surface Sp1. Here, the pressure Fpx acting from the second contact surface Sc1 toward the surface of the first sensor 10 facing the molten metal 50 is also considered contact pressure Fp. In this embodiment, since the contact pressure Fp is measured based on the strain of the first sensor 10 (specifically, the first sensor body 13 described later) caused by the pressure acting on the first sensor 10, in the following explanation, pressure Fpx will be referred to as "contact pressure Fp". 【0049】 The second interface Si2 is a concept composed of a surface Sd that contacts the molten metal 50 on both the second sensor 20 and the die 41, and a surface Sc2 on the molten metal 50 that contacts both the second sensor 20 and the die 41, respectively. Specifically, the "surface Sd that contacts the molten metal 50 on both the second sensor 20 and the die 41" consists of the surface of the second sensor 20 (the second sensor body 23 described later) that faces the molten metal 50 and the inner side surface of the die 41. In the following description, this surface will be referred to as the "third contact surface Sd". Specifically, the "surface Sc2 on the molten metal 50 that contacts both the second sensor 20 and the die 41" is the side surface of the molten metal 50, and in the following description, it will be referred to as the "fourth contact surface Sc2". 【0050】 From the definition of the second interface Si2 mentioned above, "contact pressure Fd" simply refers to two pressures: the contact pressure Fd acting from the third contact surface Sd toward the fourth contact surface Sc2, and the contact pressure Fd acting from the fourth contact surface Sc2 toward the third contact surface Sd. Here, the pressure Fdx acting from the fourth contact surface Sc2 toward the surface of the second sensor 20 facing the molten metal 50 is also considered contact pressure Fd. In this embodiment, since the contact pressure Fd is measured based on the strain of the second sensor 20 (specifically, the second sensor body 23 described later) caused by the pressure acting on the second sensor 20, in the following explanation, pressure Fdx will be referred to as "contact pressure Fd". 【0051】 The third interface Si3 is formed by the surface Sp2 of the lower punch 43 that contacts the molten metal 50 and the surface Sc3 of the molten metal 50 that contacts the lower punch 43. Specifically, the "surface Sp2 of the lower punch 43 that contacts the molten metal 50" is the upper end face of the lower punch 43 and will be referred to as the "fifth contact surface Sp2" in the following description. Specifically, the "surface Sc3 of the molten metal 50 that contacts the lower punch 43" is the lower end face of the molten metal 50 and will be referred to as the "sixth contact surface Sc3" in the following description. 【0052】 The first interface Si1, the second interface Si2, and the third interface Si3 form the interface between the entire metal portion of the mold 40 and the molten metal 50. In this embodiment, the simulation device 100 performs various processes by assuming that a contact pressure Fp (specifically, pressure Fpx) is acting on the third interface Si3, without measuring the contact pressure acting on the third interface Si3. 【0053】 <Specific structure of the first and second sensors> (Specific structure of the first sensor) The first sensor 10 has a first sensor body 13 as shown in Figure 3. The first sensor body 13 is a solid rod-shaped member and consists of multiple cylindrical portions with different outer diameters. The central axes of the multiple cylindrical portions coincide, and this coincident central axis becomes the central axis AX1 of the first sensor body 13. In this embodiment, the first sensor body 13 is made of the same carbon steel as the mold 40. 【0054】 In this embodiment, as shown by reference numeral 301 in Figure 3, a pair of first pressure measuring units 12 are provided on the first sensor body 13. Specifically, the two first pressure measuring units 12 constituting this pair are arranged symmetrically on the first sensor body 13 with respect to the central axis AX1 when the first sensor body 13 is viewed from the direction of extension of the central axis AX1. 【0055】 The aforementioned "symmetrical position of the first sensor body 13 with respect to the central axis AX1" refers to a position that satisfies the following two conditions (i) and (ii) when the first sensor body 13 is viewed from the direction of extension of the central axis AX1. Condition (i) is that a straight line (hereinafter referred to as the "virtual line") that virtually connects the centroids of the two first pressure measuring units 12 constituting a pair intersects the central axis AX1. Condition (ii) is that the intersection point of the virtual line in condition (i) and the central axis AX1 is the midpoint of the virtual line. 【0056】 Furthermore, these two first pressure measuring units 12 are positioned symmetrically on the first sensor body 13 with respect to the central axis AX1, even when the first sensor body 13 is viewed from a direction perpendicular to the extension direction of the central axis AX1. The aforementioned "symmetrical position on the first sensor body 13 with respect to the central axis AX1" refers to a position that satisfies the aforementioned condition (ii) and the following condition (iii) when the first sensor body 13 is viewed from a direction perpendicular to the extension direction of the central axis AX1. Condition (iii) is that the imaginary line of condition (i) is perpendicular to the central axis AX1. 【0057】 Furthermore, these two first pressure measuring units 12 are positioned at a predetermined distance from the end face of the first sensor body 13 that faces the molten metal 50. The "predetermined distance" varies depending on the size of the first sensor body 13 and the mold 40, the measurement accuracy of the first pressure measuring units 12, etc., but it is sufficient to ensure a distance that is not significantly affected by temperature changes of the molten metal 50. The second pressure measuring unit 22 is positioned similarly. 【0058】 The number and arrangement of the first pressure measuring units 12 are not limited to the example of this embodiment. For example, the first sensor body 13 may have only one first pressure measuring unit 12, or it may have multiple pairs of first pressure measuring units 12. Furthermore, the two first pressure measuring units 12 constituting a pair do not have to be arranged symmetrically with respect to the central axis AX1 on the first sensor body 13. The same applies to the second pressure measuring unit 22. 【0059】 Furthermore, in this embodiment, seven first temperature measuring units 11 are provided on the first sensor 10, and the first sensor 10 measures temperature at seven locations shown by reference numeral 302 in Figure 3. Specifically, the first sensor 10 measures temperature at three locations on the central axis AX1. These three locations are provided in the order of measurement locations Pcp, Pmp1, and Pmp2, starting from the molten metal 50 side. Measurement location Pcp is provided within the molten metal 50 and near the end face of the first sensor body 13 that is in contact with the molten metal 50. Hereinafter, the temperature of the molten metal 50 measured at measurement location Pcp will be referred to as temperature Tcp. Measurement location Pmp1 is provided near the boundary between the cylindrical portion including the end face that is in contact with the molten metal 50 (hereinafter referred to as the "first cylindrical portion") and the cylindrical portion adjacent to the first cylindrical portion (hereinafter referred to as the "second cylindrical portion"). Hereinafter, the temperature of the first sensor body 13 measured at measurement location Pmp1 will be referred to as temperature Tmp1. 【0060】 Here, since the first sensor body 13 is made of the same carbon steel as the mold 40, in this embodiment, the temperature of the first sensor body 13 is considered to be that of the upper punch 42 (i.e., the mold 40). Therefore, temperature Tmp1 is the temperature of the upper punch 42. Measurement point Pmp2 is located on the central side of the first sensor body 13 in the direction of the central axis AX1 than measurement point Pmp1. Hereinafter, the temperature of the upper punch 42 measured at measurement point Pmp2 will be referred to as temperature Tmp2. 【0061】 Furthermore, the first sensor 10 measures temperature at four locations near the boundary between the first cylindrical portion and the second cylindrical portion. All four of these locations are located on the side surface of the second cylindrical portion. In addition, when the first sensor body 13 is viewed from the direction of extension of the central axis AX1, the angle formed by the line virtually connecting one of two adjacent locations to the central axis AX1 and the line virtually connecting the other location to the central axis AX1 is 90°. 【0062】 The four locations mentioned above are arranged in a clockwise direction as measurement points Pmp3, Pmp6, Pmp4, and Pmp5 when the first cylindrical portion of the first sensor body 13 is viewed from the direction of extension of the central axis AX1. Hereinafter, the temperatures of the upper punch 42 measured at measurement points Pmp3, Pmp4, Pmp5, and Pmp6 will be referred to as temperatures Tmp3, Tmp4, Tmp5, and Tmp6, respectively. 【0063】 (Specific structure of the second sensor) The second sensor 20 has a second sensor body 23 as shown in Figure 4. The second sensor body 23 is a solid rod-shaped member with cylindrical ends. On the other hand, the body portion sandwiched between the ends is an elongated flat plate shape, and the shape of the end face in the thickness direction of the body portion is a curved shape corresponding to the outer shape of the ends. The central axes of the ends and the body portion coincide, and this coincided central axis is the central axis AX2 of the second sensor body 23. Of the end faces of the ends of the second sensor body 23, the end face that contacts the molten metal 50 is a curved shape corresponding to the shape of the inner side surface of the die 41. In this embodiment, the second sensor body 23 is also made of the same carbon steel as the mold 40, similar to the first sensor body 13. 【0064】 Furthermore, in this embodiment, as shown by reference numeral 401 in Figure 4, a pair of second pressure measuring units 22 are provided on the second sensor body 23. Specifically, the two second pressure measuring units 22 constituting this pair are positioned symmetrically on the second sensor body 23 with respect to the central axis AX2, regardless of whether the second sensor body 23 is viewed from the direction of extension of the central axis AX2 or from a direction perpendicular to the said extension direction. The meaning of "symmetrical position on the second sensor body 23 with respect to the central axis AX2" is the same as that of "symmetrical position on the first sensor body 13 with respect to the central axis AX1" described above. 【0065】 Furthermore, in this embodiment, seven second temperature measuring units 21 are provided on the second sensor 20, and the second sensor 20 measures temperature at seven locations shown by reference numeral 402 in Figure 4. Specifically, the second sensor 20 measures temperature at three locations on the central axis AX2. These three locations are provided in the order of measurement locations Pcd, Pmd1, and Pmd2, starting from the molten metal 50 side. Measurement location Pcd is provided within the molten metal 50 and near the end face of the second sensor body 23 that contacts the molten metal 50. Hereinafter, the temperature of the molten metal 50 measured at measurement location Pcd will be referred to as temperature Tcd. Measurement location Pmd1 is provided near the boundary between the end portion including the end face that contacts the molten metal 50 (hereinafter referred to as the "molten metal side end portion") and the main body portion. Hereinafter, the temperature of the second sensor body 23 measured at measurement location Pmd1 will be referred to as temperature Tmd1. 【0066】 Here, since the second sensor body 23 is also made of the same carbon steel as the mold 40, in this embodiment, the temperature of the second sensor body 23 is considered to be that of the die 41 (i.e., the mold 40). Therefore, temperature Tmd1 is the temperature of the die 41. Measurement point Pmd2 is located on the central side of the second sensor body 23 in the direction of the central axis AX2, compared to measurement point Pmd1. Hereinafter, the temperature of the die 41 measured at measurement point Pmd2 will be referred to as temperature Tmp2. 【0067】 Furthermore, the second sensor 20 measures temperature at four locations near the boundary between the molten metal end and the main body. Two of these four locations are located on one plane of the main body, and the remaining two are located on the other plane. Moreover, when the second sensor body 23 is viewed from the direction of extension of the central axis AX2, the angle formed by the line virtually connecting one of two adjacent locations to the central axis AX2 and the line virtually connecting the other location to the central axis AX2 is 90°. 【0068】 The four locations mentioned above are arranged in the order of measurement points Pmd3, Pmd5, Pmd4, and Pmd6 in a clockwise direction when the molten metal side end of the second sensor body 23 is viewed from the direction of extension of the central axis AX2. Hereinafter, the temperatures of the die 41 measured at measurement points Pmd3, Pmd4, Pmd5, and Pmd6 will be referred to as temperatures Tmd3, Tmd4, Tmd5, and Tmd6, respectively. 【0069】 <Temperature measurement and pressure measurement> (temperature measurement) In this embodiment, the simulation device 100 measures temperature at a total of 21 locations: 14 locations on the mold 40 side and 7 locations on the molten metal 50 side, as shown by reference numerals 501 and 502 in Figure 5. The arrangement of the 21 measurement locations is such that three measurement locations Pcn, Pmn-1, and Pmn-2 (n: a natural number from 1 to 7), as shown by reference numeral 503 in Figure 5, are arranged in a straight line in both the plan view and the front view. There are a total of 7 groups of measurement locations consisting of these three measurement locations. 【0070】 Hereafter, the three measurement locations Pcn, Pmn-1, and Pmn-2 will be abbreviated as "measurement location Pcn, ~Pmn-2". Furthermore, the temperature measured at measurement location Pcn will be denoted as temperature Tcn, the temperature measured at measurement location Pmn-1 as temperature Tmn-1, and the temperature measured at measurement location Pmn-2 as temperature Tmn-2. 【0071】 In this embodiment, as shown by reference numeral 503 in Figure 5, measurement point Pcn is located 2 mm from the first mold surface toward the molten metal 50. Measurement point Pmn-1 is located 2 mm from the first mold surface toward the mold 40. Measurement point Pmn-2 is located 6 mm from the first mold surface toward the mold 40. Here, "first mold surface" refers to any of the first contact surface Sp1, the third contact surface Sd, or the fifth contact surface Sp2. 【0072】 Measurement points Pc1 and Pm1-2 are located on the central axis AX in both plan view and front view. As shown by reference numeral 502 in Figure 5, measurement point Pc1 is located near the first interface Si1 inside the molten metal 50, and measurement points Pm1-1 and Pm1-2 are located inside the upper punch 42. 【0073】 Measurement point Pc1 is measurement point Pcp where the first sensor 10 measures temperature, and the temperature Tc1 measured at measurement point Pc1 becomes temperature Tcp. Measurement point Pm1-1 is measurement point Pmp1 where the first sensor 10 measures temperature, and the temperature Tm1-1 measured at measurement point Pm1-1 becomes temperature Tmp1. Measurement point Pm1-2 is measurement point Pmp2 where the first sensor 10 measures temperature, and the temperature Tm1-2 measured at measurement point Pm1-2 becomes temperature Tmp2. 【0074】 As shown by reference numerals 501 and 502 in Figure 5, measurement points Pc2 and Pm2-2 are located on a straight line (not shown) parallel to the central axis AX in both plan view and front view. Furthermore, as shown by reference numeral 502 in Figure 5, the vertical positions of measurement points Pc2 and Pm2-2 in the front view are the same as those of measurement points Pc1 and Pm1-2, but they are located closer to the die 41 than measurement points Pc1 and Pm1-2. 【0075】 Measurement points Pc3 and Pm3-2 are located on a straight line (not shown) that is parallel to the central axis AX in a plan view and perpendicular to the central axis AX in a front view, as shown by reference numerals 501 and 502 in Figure 5. Measurement point Pc3 is located near the second interface Si2 inside the molten metal 50, and measurement points Pm1-1 and Pm1-2 are located inside the upper punch 42. Measurement point Pc3 is also located near measurement point Pc2. Measurement points Pm1-2, Pm2-2, Pc3, and Pm3-2 are located on the same straight line, as shown by reference numeral 502 in Figure 5. 【0076】 Measurement points Pc4, ~Pm4-2 and Pc5, ~Pm5-2 are located on a straight line that is parallel to the central axis AX in a plan view and perpendicular to the central axis AX in a front view, similar to measurement points Pc3, ~Pm3-2. As shown by reference numeral 502 in Figure 5, the horizontal positions of measurement points Pc4, ~Pm4-2 and Pc5, ~Pm5-2 in a front view are the same as those of measurement points Pc3, ~Pm3-2. Measurement points Pc4, ~Pm4-2 are located lower than measurement points Pc3, ~Pm3-2 in a front view, and measurement points Pc5, ~Pm5-2 are located lower than measurement points Pc4, ~Pm4-2 in a front view. 【0077】 Measurement points Pc3, ~Pm3-2 and measurement points Pc5, ~Pm5-2 are located at the same position in a plan view, as shown by reference numeral 501 in Figure 5. On the other hand, measurement points Pc4, ~Pm4-2 are located at a position where, in a plan view, the angle between the line containing measurement points Pc4, ~Pm4-2 and the line containing measurement points Pc3, ~Pm3-2 is 45°. 【0078】 Measurement point Pc4 is measurement point Pcd where the second sensor 20 measures temperature, and the temperature Tc4 measured at measurement point Pc4 becomes temperature Tcd. Measurement point Pm4-1 is measurement point Pmd1 where the second sensor 20 measures temperature, and the temperature Tm4-1 measured at measurement point Pm4-1 becomes temperature Tmd1. Measurement point Pm4-2 is measurement point Pmd2 where the second sensor 20 measures temperature, and the temperature Tm4-2 measured at measurement point Pm4-2 becomes temperature Tmd2. 【0079】 Measurement points Pc6 and Pm6-2, like measurement points Pc2 and Pm2-2, are located on a straight line parallel to the central axis AX in both plan view and front view, as shown by reference numerals 501 and 502 in Figure 5. Measurement points Pc2 and Pm2-2 and measurement points Pc6 and Pm6-2 are located in the same position in plan view, as shown by reference numeral 501 in Figure 5. As shown by reference numeral 502 in Figure 5, measurement point Pc6 is located near the third interface Si3 inside the molten metal 50, and measurement points Pm6-1 and Pm6-2 are located inside the lower punch 43. 【0080】 Measurement points Pc7 and Pm7-2, like measurement points Pc1 and Pm1-2, are located on the central axis AX in both plan view and front view, as shown by reference numerals 501 and 502 in Figure 5. Measurement points Pc1 and Pm1-2 and measurement points Pc7 and Pm7-2 are located at the same position in plan view, as shown by reference numeral 501 in Figure 5. Furthermore, as shown by reference numeral 502 in Figure 5, the vertical positions of measurement points Pc7 and Pm7-2 in the front view are the same as those of measurement points Pc6 and Pm6-2. 【0081】 Each of the die 41, upper punch 42, and lower punch 43 has through-holes and non-through-holes (both not shown) formed therein for measuring temperatures other than Tc1, ~Tm1-2, Tc4, and ~Tm4-2 among the temperatures measured at a total of 21 measurement points. Thermocouples (not shown) inserted into these holes measure temperatures other than Tc1, ~Tm1-2, Tc4, and ~Tm4-2. The measurement results of these thermocouples, that is, the temperature data of temperatures other than Tc1, ~Tm1-2, Tc4, and ~Tm4-4 among the temperatures measured at a total of 21 measurement points, are transmitted to the temperature acquisition unit 31 by wireless or wired communication. 【0082】 Hereinafter, the temperature values ​​Tc1 to Tc7, Tm1-1 to Tm7-1, and Tm1-2 to Tm7-2 acquired by the temperature acquisition unit 31 will be referred to as "temperature data Tc1' to Tc7' (second temperature data), Tm1-1' to Tm7-1', and Tm1-2' to Tm7-2' (first temperature data)". 【0083】 Here, temperature data Tc1' is identical to temperature data Tcp-1, temperature data Tm1-1' is identical to temperature data Tmp1-1, and temperature data Tm1-2' is identical to temperature data Tmp2-1. In the following explanation, the names will be consistently referred to as "temperature data Tc1', Tm1-1', and Tm1-2'". Also, temperature data Tc4' is identical to temperature data Tcd-1, temperature data Tm4-1' is identical to temperature data Tmd1-1, and temperature data Tm4-2' is identical to temperature data Tmd2-1. In the following explanation, the names will be consistently referred to as "temperature data Tc4', Tm4-1', and Tm4-2'". 【0084】 (Pressure measurement) The first and second sensors 10 and 20 convert the contact pressures Fd and Fp from the strain value ε (unit: μST) measured by the strain gauges, which serve as the first and second pressure measuring units 12 and 22. As shown in Figure 6, the gauge factor (a coefficient representing the sensitivity of the strain gauge) of the strain gauge also changes with temperature. Therefore, in this embodiment, in order to convert the contact pressures Fd and Fp with high accuracy from the strain value ε measured by the strain gauge, the first and second sensors 10 and 20 are compressed in advance under multiple temperatures. 【0085】 Specifically, the first and second sensors 10 and 20 are compressed at room temperature (293K in this embodiment) and at multiple temperatures higher than room temperature (the temperature increase is constant) to determine their compression characteristics at each temperature. Based on the compression characteristics at multiple temperatures determined in this preliminary process, the correlation between the strain generated in the first and second sensors 10 and 20 and the compressive stress σ (unit: MPa) acting on these sensors is calibrated. For the first and second sensors 10 and 20, the compressive stress σ calculated from the strain value ε after the aforementioned calibration is used as the contact pressure Fd and Fp. 【0086】 <Determination of the first heat transfer coefficient data using a 3D transient heat transfer model> The generation unit 33 determines the first heat transfer coefficient data hd-1, which constitutes the die-side basic dataset, by representing the heat transfer in the vicinity of each of the first to third interfaces Si1 to Si3 using a three-dimensional transient heat transfer model. The generation unit 33 determines the first heat transfer coefficient data hpu-1, which constitutes the upper punch-side basic dataset. The generation unit 33 determines the first heat transfer coefficient data hpl-1, which constitutes the lower punch-side basic dataset. 【0087】 Specifically, the generation unit 33 determines the first heat transfer coefficient data h3-1, h4-1, and h5-1 as the first heat transfer coefficient data hd-1. The generation unit 33 determines the first heat transfer coefficient data h1-1 and h2-1 as the first heat transfer coefficient data hpu-1. The generation unit 33 determines the first heat transfer coefficient data h6-1 and h7-1 as the first heat transfer coefficient data hpl-1. 【0088】 The first heat transfer coefficient data h1-1 is the first heat transfer coefficient data for the interface region between measurement point Pc1 and Pm1-1. The first heat transfer coefficient data h2-1 is the first heat transfer coefficient data for the interface region between measurement point Pc2 and Pm2-1. The first heat transfer coefficient data h3-1 is the first heat transfer coefficient data for the interface region between measurement point Pc3 and Pm3-1. The first heat transfer coefficient data h4-1 is the first heat transfer coefficient data for the interface region between measurement point Pc4 and Pm4-1. The first heat transfer coefficient data h5-1 is the first heat transfer coefficient data for the interface region between measurement point Pc5 and Pm5-1. The first heat transfer coefficient data h6-1 is the first heat transfer coefficient data for the interface region between measurement point Pc6 and Pm6-1. The first heat transfer coefficient data h7-1 is the first heat transfer coefficient data for the interface region between measurement point Pc7 and Pm7-1. 【0089】 (Mold model) The generation unit 33 generates a three-dimensional model of the mold 40 as shown in Figure 7 (hereinafter referred to as the "mold model"), and uses this mold model to determine the first heat transfer coefficient data h1-1 to h7-1. The mold model is a 1 / 8 model of the entire mold 40, assuming that the mold 40 is divided into eight equal parts in the direction of the central axis AX (see Figure 2). The mold model includes a 1 / 8 model of the entire molten metal 50 (hereinafter referred to as the "molten metal model") and is assumed to be placed under air. 【0090】 The mold model may be generated by the generation unit 33, or it may be stored in the storage unit 3 beforehand. If the mold model is stored in the storage unit 3, the generation unit 33 reads the mold model from the storage unit 3 when determining each first heat transfer coefficient data. Alternatively, the generation unit 33 may obtain the mold model data from an external server or the like. 【0091】 The mold model is composed of multiple hexahedral elements as shown by reference numeral 701 in Figure 7. Furthermore, the mold model is assigned element numbers i in the radial direction from the central axis AX, element numbers j in the circumferential direction of the mold 40, and element numbers k in the direction of the central axis AX. For the entire mold model, element numbers i=1 to 15, element numbers j=1 to 6, and element numbers k=1 to 35, resulting in a total of 3240 elements constituting the mold model (including the molten metal model). 【0092】 The measurement points Pcn and Pmn-2 (n: a natural number from 1 to 7) are displayed at the positions indicated by the symbols 702 in Figure 7, using a mold model with a total of 3240 elements. The symbol 702 in Figure 7 is a side view of the mold model, that is, a diagram showing the outer side of each element with j=1 in the mold model. 【0093】 In Figure 7, the measurement points Pc4 and Pm4-2 are shown at position j=1 for ease of explanation. In reality, the measurement points Pc4 and Pm4-2 are located at j=6. In the mold model, as shown in Figure 7, the measurement points Pc1, Pm1-2 and Pc7 and Pm7-2 are treated as being at position i=1 for ease of calculation. In reality, the measurement points Pc1, Pm1-2 and Pc7 and Pm7-2 are located on the central axis AX. 【0094】 (Details of the process for determining the first heat transfer coefficient data) The process for determining the first heat transfer coefficient data h1-1 to h7-1 using the mold model will be explained below with reference to the flowchart shown in Figure 8. The generation unit 33 determines the first heat transfer coefficient data h1-1 from among the first heat transfer coefficient data h1-1 to h7-1 (S101). First, in determining the first heat transfer coefficient data h1-1, the generation unit 33 identifies only the temperature data of multiple elements (hereinafter referred to as "target elements") that include the molten metal side unit contact surface among the elements that constitute the molten metal model in the mold model. The molten metal side unit contact surface is the surface of the element that constitutes a part of the second, fourth, and sixth contact surfaces Sc1, Sc2, and Sc3, respectively. 【0095】 Specifically, the generation unit 33 acquires temperature data Tc1'~Tc7' at a certain time step (point in time) from the temperature acquisition unit 31. The temperature data Tc1'~Tc7' are the temperature values ​​of the target elements for which measurement points Pc1~Pc7 are provided among the multiple target elements. The generation unit 33 also calculates the temperature data for target elements other than those for which measurement points Pc1~Pc7 are provided (hereinafter referred to as "unmeasured elements") at a certain time step using the following formula (1) (S111). 【0096】 【number】 【0097】 Tcp: Temperature data [K] at time steps with unmeasured elements Tci: Among multiple target elements, the target element for which measurement points Pc1 to Pc7 are provided (i = natural numbers from 1 to 7). di: Distance [mm] between each of the measurement points Pc1 to Pc7 and the center of gravity of the unmeasured element. m: A parameter representing the weight (can be set arbitrarily; preferably 0 ≤ m ≤ 1). Next, the generation unit 33 sets the first heat transfer coefficient data h1-1 to h7-1 for a certain time step. The generation unit 33 may, for example, accept the setting operation for the first heat transfer coefficient data h1-1 to h7-1 from the input unit 1 and use the value received by the input unit 1 as the setting value for the first heat transfer coefficient data h1-1 to h7-1. Alternatively, the generation unit 33 may set the first heat transfer coefficient data h1-1 to h7-1 by reading a setting value that has been previously stored in the storage unit. 【0098】 Furthermore, the generation unit calculates all unit first heat transfer coefficient data other than the first heat transfer coefficient data h1-1 to h7-1 using the following formula (2) (S112). 【0099】 【number】 【0100】 hip: Unit: First heat transfer coefficient data [W / (m 2 (K) hi: First heat transfer coefficient data h1-1~h7-1[W / (m 2 (K) The unit first heat transfer coefficient data is the first heat transfer coefficient data in the unit interface region, and in S112, it includes the first heat transfer coefficient data h2-1 to h7-1. The unit interface region is an interface region composed of a surface that constitutes a part of the first, third, and fifth contact surfaces Sp1, Sd, and Sp2, respectively, which are included in one element on the mold 40 side (hereinafter referred to as the "mold-side unit contact surface"), and the molten metal-side unit contact surface that faces the mold-side unit contact surface. The first heat transfer coefficient data between the mold model and air is uniformly set at 50 W / (m²) regardless of the passage of time and the location of the mold model. 2 ·K) 【0101】 Next, the generation unit 33 estimates the temperature data T for all elements (hereinafter, "die-side elements") that constitute the model portion other than the molten metal model in the die model using the following equations (3) to (5). i、j、k ´ is calculated (S113). The estimated temperature data T i、j、k ´ is an estimated value of the temperature data (first temperature data) of the die-side elements at the time when a certain period of time has elapsed from a certain time step (hereinafter, "next time step"). 【0102】 【Equation】 【0103】 T i、j、k ´: Estimated temperature data of die-side elements [K] T i、j、k : Temperature data of die-side elements and target elements at a certain time step [K] i: Element number in the radial direction from the central axis AX j: Element number in the circumferential direction of the die 40 k: Element number in the direction of the central axis AX C: Δt / Cm [(sec·m 3 ) / J] Δt: Certain time (required time between time steps) [sec] Cm: Heat capacity of the die 40 [J / m 3 R: Thermal resistance in the unit interface area [(m 2 ·K) / W] Δrj: Length in the radial direction from the central axis AX [m] Δθ: Angle in the circumferential direction of the die 40 [rad] Δz: Length in the direction of the central axis AX [m] 【0104】 【Equation】 【0105】 h: First heat transfer coefficient data h1-1 to h7-1 [W / (m 2 ·K)] ​λc: Thermal conductivity of molten metal (50%) [W / (m·K)] λm: Thermal conductivity of mold 40 [W / (m·K)] 【0106】 【number】 【0107】 The generation unit 33 generates estimated temperature data T i、j、k When calculating ', if the unit interface region is formed between the mold-side element and the target element, the aforementioned equations (3) and (4) are used. Also, if the unit interface region is formed between the mold-side elements, the generation unit 33 uses the aforementioned equations (3) and (5). 【0108】 Next, the generation unit 33 generates multiple estimated temperature data T i、j、k Of these, the generation unit 33 calculates the difference between the estimated temperature data Te1-1' at measurement point Pm1-1 and the temperature data Tm1-1' at measurement point Pm1-1 in the next time step. Similarly, the generation unit 33 calculates all 14 types of differences, up to the difference between the estimated temperature data Te7-2' at measurement point Pm7-2 and the temperature data Tm7-2' at measurement point Pm7-2 in the next time step. The generation unit 33 then calculates the evaluation function e by summing the absolute values ​​of these 14 types of differences. 【0109】 Next, the generation unit 33 changes the value of the first heat transfer coefficient data h1-1 and calculates the evaluation function e again. By repeating this calculation of the evaluation function e multiple times, the generation unit 33 identifies the value of the first heat transfer coefficient data h1-1 that minimizes the value of the evaluation function e (S114). 【0110】 Specifically, as shown in Figure 9, (A) the generation unit 33 calculates the evaluation function e1 using the first heat transfer coefficient data h1-1 (hereinafter referred to as "first heat transfer coefficient data h1-11") set at a certain time step. Next, (B) the generation unit 33 calculates the evaluation function e2 using the first heat transfer coefficient data h1-1 (hereinafter referred to as "first heat transfer coefficient data h1-12") which is changed by a change amount Δh from the first heat transfer coefficient data h1-11. 【0111】 Regarding the change amount Δh from the first heat transfer coefficient data h1-11 in the first heat transfer coefficient data h1-12, when the input unit 1 receives a setting operation for the change amount Δh, the generation unit 33 may use the value received by the input unit 1 as the set value of the change amount Δh. Also, for example, the generation unit 33 may set the value of the change amount Δh by reading out a set value previously stored in the storage unit. 【0112】 Next, (C) the generation unit 33 compares the magnitudes of the values of the evaluation function e1 and the evaluation function e2. When the value of the evaluation function e1 is smaller, a value M×Δh obtained by multiplying the aforementioned change amount Δh by a coefficient M (-1 < M < 0) is added to the first heat transfer coefficient data h1-11 to obtain new first heat transfer coefficient data h1-12'. Then, an evaluation function e2' is calculated using this first heat transfer coefficient data h1-12', and the magnitudes of the values of the evaluation function e1 and the evaluation function e2' are compared. On the other hand, if the value of the evaluation function e2 is smaller, the aforementioned change amount Δh is added to the first heat transfer coefficient data h1-12 to obtain first heat transfer coefficient data h1-13. Then, an evaluation function e3 is calculated using this first heat transfer coefficient data h1-13, and the magnitudes of the values of the evaluation function e2 and the evaluation function e3 are compared. 【0113】 Hereinafter, the generation unit 33 repeats each of the above-mentioned processes (B) and (C), and ends this repetition process when the value of M×Δh becomes less than or equal to a predetermined threshold value (which can be arbitrarily set). 【0114】 Also, for example, the generation unit 33 may calculate a plurality of evaluation functions e in advance and extract the one with the smallest value from the plurality of calculated evaluation functions e. Specifically, as shown by reference numeral 1001 in FIG. 10, (D) the generation unit 33 determines the number of evaluation functions e11 to be the subject of one extraction process, and repeats each of the processes S112 to S114 until the determined number of evaluation functions e11 is obtained. Each time the generation unit 33 repeats each of the processes S112 to S114, the first heat transfer coefficient data h1-1 is increased by the change amount Δh1. 【0115】 Regarding the determination of the number of evaluation functions e11 to be extracted in one extraction process, the generation unit 33 may accept the input unit 1's setting operation and use the value received by the input unit 1 as the number of evaluation functions e11. Alternatively, for example, the generation unit 33 may set the number of evaluation functions e11 by reading a numerical value of the number previously stored in the memory unit. 【0116】 Next, as shown by reference numeral 1002 in Figure 10, the (E) generation unit 33 extracts the evaluation function emin1 with the smallest value from among the multiple evaluation functions e11 obtained in the (D) process, and then calculates the same number of evaluation functions e22 that are the target of the second extraction process as the evaluation function e11. The generation unit 33 uses the value of the evaluation function emin1 as the median value and sequentially increases or decreases the first heat transfer coefficient data h1-1 corresponding to the evaluation function emin1 by a change amount Δh2 to obtain a predetermined number of evaluation functions e22. Here, the absolute value of the change amount Δh2 is smaller than the absolute value of the change amount Δh1. 【0117】 Next, the (F) generation unit 33 extracts the evaluation function emin2 with the smallest value from among the multiple evaluation functions e22 obtained in the (E) process, and then calculates the same number of evaluation functions e33 as evaluation functions e11 and e22 to be the target of the third extraction process. The generation unit 33 uses the value of evaluation function emin2 as the median value and sequentially increases or decreases the first heat transfer coefficient data h1-1 corresponding to the evaluation function emin2 by a change amount Δh3 to obtain a predetermined number of evaluation functions e33. Here, the absolute value of the change amount Δh3 is smaller than the absolute value of the change amount Δh2. 【0118】 The generation unit 33 then repeats each of the processes described in (F) above, and terminates this iterative process when the value of Δh3 falls below a predetermined threshold (which can be set arbitrarily). 【0119】 The generation unit 33 identifies the first heat transfer coefficient data h1-1 by repeating the processes S112 to S114, and temporarily stores the identified first heat transfer coefficient data h1-1 (hereinafter referred to as "first heat transfer coefficient data h1-1'") in the storage unit 3. The generation unit 33 may also store this data in a memory not shown within the generation unit 33. 【0120】 Similarly, the generation unit 33 identifies the first heat transfer coefficient data h2-1 in the processing steps S111 to S115. At this time, the estimated temperature data T of the "mold-side element" in the processing of S112 i、j、k The calculation of ' uses the previously identified first heat transfer coefficient data h1-1' and first heat transfer coefficient data h3-1 to h7-1. The generation unit 33 temporarily stores the identified first heat transfer coefficient data h2-1 (hereinafter referred to as "first heat transfer coefficient data h2-1'") in the storage unit 3. 【0121】 Similarly, the generation unit 33 identifies the first heat transfer coefficient data h3-1 in the processing steps S111 to S115. At this time, the estimated temperature data T of the "mold-side element" in the processing of S112 i、j、k The calculation of ' uses the previously identified first heat transfer coefficient data h1-1' and h2-1', and the first heat transfer coefficient data h4-1 to h7-1. The generation unit 33 temporarily stores the identified first heat transfer coefficient data h3-1 (hereinafter referred to as "first heat transfer coefficient data h3-1'") in the storage unit 3. 【0122】 In this way, the generation unit 33 sequentially identifies the first heat transfer coefficient data up to h7-1 by using the first heat transfer coefficient data identified in the previous process to identify the next first heat transfer coefficient data. In the following explanation, the first heat transfer coefficient data h7-1 identified by the generation unit 33 will be referred to as "first heat transfer coefficient data h7-1'". The generation unit 33 temporarily stores the seven identified first heat transfer coefficient data in the storage unit 3. 【0123】 Next, the generation unit 33 again identifies the first heat transfer coefficient data h1-1 in the processing steps S111 to S115. At this time, the estimated temperature data T of the "mold-side element" in the processing of S112 i、j、kThe calculation of ' uses the previously identified first heat transfer coefficient data h2-1' to h7-1'. The generation unit 33 temporarily stores the identified first heat transfer coefficient data h1-1 (hereinafter referred to as "first heat transfer coefficient data h1-1") in the storage unit 3. Similarly, the generation unit 33 re-identifies up to the first heat transfer coefficient data h7-1 in the processing steps S111 to S115. 【0124】 Next, the generation unit 33 determines whether the first heat transfer coefficient data h1-1 to h7-1 have converged (S108). Specifically, the generation unit 33 compares the first heat transfer coefficient data h1-1' and h1-1'' to identify the amount of change in the first heat transfer coefficient data h1-1. Then, if the identified amount of change in the first heat transfer coefficient data h1-1 is less than or equal to a threshold (which can be set arbitrarily), the generation unit 33 determines that the first heat transfer coefficient data h1-1 has converged. The generation unit 33 determines whether each of the first heat transfer coefficient data h2-1 to h7-1 has converged using the same method. 【0125】 Next, the generation unit 33 acquires contact pressure data Fp-1 at a certain time step from the pressure acquisition unit 32 and uses it as constituent data for the upper punch side basic dataset. Hereinafter, the upper punch side basic dataset that includes the first heat transfer coefficient data h1-1 as constituent data will be referred to as the "first upper punch side basic dataset". 【0126】 Similarly, the generation unit 33 selects the contact pressure data Fp-1 and the first heat transfer coefficient data h2-1 as constituent data for the "second upper punch side basic dataset". The generation unit 33 selects the contact pressure data Fd-1 and the first heat transfer coefficient data h3-1 as constituent data for the "first die side basic dataset". The generation unit 33 selects the contact pressure data Fd-1 and the first heat transfer coefficient data h4-1 as constituent data for the "second die side basic dataset". The generation unit 33 selects the contact pressure data Fd-1 and the first heat transfer coefficient data h5-1 as constituent data for the "third die side basic dataset". The generation unit 33 selects the contact pressure data Fp-1 and the first heat transfer coefficient data h6-1 as constituent data for the "first lower punch side basic dataset". The generation unit 33 selects the contact pressure data Fp-1 and the first heat transfer coefficient data h7-1 as constituent data for the "second lower punch side basic dataset". 【0127】 If the answer to S108 is No, the generation unit 33 repeats each of the processes from S101 to S107. On the other hand, if the answer to S108 is Yes, the generation unit 33 updates the time step once (S109). If the updated time step is not the final time step (No in S110), the generation unit 33 repeats each of the processes from S101 onwards to determine the first heat transfer coefficient data h1-1 to h7-1 for the updated time step. If the updated time step is the final time step (Yes in S110), the generation unit 33 terminates the process of determining the first heat transfer coefficient data h1-1 to h7-1. 【0128】 <Estimation of the correlation between contact pressure data and first heat transfer coefficient data> The first estimation unit 34 uses the first and second upper punch-side basic datasets generated by the generation unit 33 to estimate the correlation between the contact pressure data Fp-1 and the first heat transfer coefficient data h1-1 and h2-1 (hereinafter referred to as the "first and second upper punch-side correlation"). The first estimation unit 34 uses the first to third die-side basic datasets to estimate the correlation between the contact pressure data Fd-1 and the first heat transfer coefficient data h3-1 to h5-1 (hereinafter referred to as the "first to third die-side correlation"). The first estimation unit 34 uses the first and second lower punch-side basic datasets to estimate the correlation between the contact pressure data Fp-1 and the first heat transfer coefficient data h7-1 and h6-1 (hereinafter referred to as the "first and second lower punch-side correlation"). 【0129】 The estimation of the seven correlations described above by the first estimation unit 34 yields substantially the same results. Therefore, in the following explanation, the first upper punch-side correlation will be used as an example, and the explanation of the other correlations will be omitted. The first estimation unit 34 estimates the first upper punch-side correlation by dividing it into three periods as shown in Figure 11. The estimation process of the first estimation unit 34 described below corresponds to the process performed after the "Yes" case in S110 using the flowchart in Figure 8, and is an example of the first estimation step according to one aspect of the present invention. 【0130】 First, the first estimation unit 34 estimates the correlation relationship on the first upper punch side during the period from when the molten metal 50 is filled into the hollow part of the die 41 in which the lower punch 43 is set, until before the upper punch 42 begins to pressurize the molten metal 50 ("Period I" in Figure 11). During Period I, the contact pressure data Fp-1 is approximately 0 because the upper punch 42 does not pressurize the molten metal 50. On the other hand, since the inner surface of the die 41 is in contact with the molten metal 50, heat transfer occurs between the die 41 and the molten metal 50, causing the temperature data Tc1' to decrease and the temperature data Tm1-1' to increase. Therefore, even during Period I, the first heat transfer coefficient data h1-1 is not 0. 【0131】 The first estimation unit 34 estimates from these analysis results that the first upper punch-side correlation for period I corresponds to the intercept relationship in the graph of Figure 11. The intercept relationship in the graph of Figure 11 estimated by the first estimation unit 34 is referred to as the "first estimated correlation (estimated correlation)". 【0132】 Next, the first estimation unit 34 estimates the correlation relationship on the first upper punch side during the period from when the upper punch 42 begins pressurizing the molten metal 50 until the surface temperature of the molten metal 50 reaches the solidification temperature of the molding material (hereinafter referred to as "Period II"). Specifically, "surface temperature of the molten metal 50" refers to the temperature of the second contact surface Sc1 on the molten metal 50. During Period II, the upper punch 42 continues to pressurize the molten metal 50 with a constant pressure. 【0133】 In period II, the first heat transfer coefficient data h1-1 depends on the contact pressure data Fp-1 and is largely independent of the solidification temperature mentioned above. Furthermore, the first heat transfer coefficient data h1-1 and the contact pressure data Fp-1 are approximately directly proportional. Also, when the relationship between the first heat transfer coefficient data h1-1 and the contact pressure data Fp-1 is considered as a linear function, the slope is positive and its absolute value varies depending on the type of release agent and the surface roughness of the mold 40. 【0134】 The first estimation unit 34 estimates from these analysis results that the correlation relationship between the first upper punch during period II is a linear function (with a positive slope) as shown in the graph of Figure 11. The first estimation unit 34 also estimates that the slope of the linear function varies depending on the type of release agent. The linear function (with a positive slope) relationship in the graph of Figure 11 estimated by the first estimation unit 34 is referred to as the "second estimated correlation relationship (estimated correlation relationship)". 【0135】 Next, the first estimation unit 34 estimates the correlation relationship on the first upper punch side during the period from when the surface temperature of the molten metal 50 becomes lower than the solidification temperature of the molding material of the molten metal 50 until the solidified molded body is removed from the mold 40 (hereinafter referred to as "period III"). During period III, as in period II, the upper punch 42 continues to pressurize the molten metal 50 with a constant pressure. 【0136】 In period III, the first heat transfer coefficient data h1-1 depends on both the contact pressure data Fp-1 and the solidification temperature mentioned above. The relationship between the first heat transfer coefficient data h1-1 and the contact pressure data Fp-1 is expressed as a linear function h1-1 = a × Fp-1 + b × Ts + c (a, b, c: coefficients, Ts: surface temperature of molten metal 50). 【0137】 The first estimation unit 34 estimates from these analysis results that the first upper punch-side correlation for period III is a linear function (with a negative slope) in the graph of Figure 11. The linear function (with a negative slope) relationship in the graph of Figure 11 estimated by the first estimation unit 34 is called the "third estimated correlation (estimated correlation)". 【0138】 The first estimation unit 34 derives the first to third estimated correlations as estimation results, and these are collectively referred to as the "first upper punch side estimated correlation." Similarly, the first estimation unit 34 derives the "second upper punch side estimated correlation," the "first to third dice side estimated correlations," and the "first and second lower punch side estimated correlations" as estimation results. 【0139】 The estimated correlation for the upper punch side is constructed using the first estimated correlation for the upper punch side and the second estimated correlation for the upper punch side. The estimated correlation for the dice side is constructed using the first estimated correlation for the dice side, the second estimated correlation for the dice side, and the third estimated correlation for the dice side. The estimated correlation for the lower punch side is constructed using the first estimated correlation for the lower punch side and the second estimated correlation for the lower punch side. 【0140】 <Estimation of the second heat transfer coefficient data using the first to third estimated correlations> The second estimation unit 35 estimates the second heat transfer coefficient data h1-2 to h7-2 using, as appropriate, one of the first and second upper punch side estimation correlations, the first to third die side estimation correlations, or the first and second lower punch side estimation correlations. The second heat transfer coefficient data h1-2 and h2-2 are estimated values ​​of the first heat transfer coefficient data h1-1 and h2-1 corresponding to the estimation contact pressure data Fp-2. The second heat transfer coefficient data hpu-2 is constructed from the second heat transfer coefficient data h1-2 and the second heat transfer coefficient data h2-2. 【0141】 The second heat transfer coefficient data h3-2 to h5-2 are estimated values ​​of the first heat transfer coefficient data h3-1 to h5-1, which correspond to the estimated contact pressure data Fd-2. The second heat transfer coefficient data h3-2, h4-2, and h5-2 constitute the second heat transfer coefficient data hd-2. The second heat transfer coefficient data h6-2 and h7-2 are estimated values ​​of the first heat transfer coefficient data h6-1 and h7-2, which correspond to the estimated contact pressure data Fd-2. The second heat transfer coefficient data hpl-2 constitutes the second heat transfer coefficient data h6-2 and h7-2. 【0142】 For example, when estimating the heat transfer coefficient data in the interface region between measurement point Pc1 and Pm1-1 from the estimated contact pressure data Fp-2 for period II as described above, the second estimation unit 35 uses the second estimated correlation of the first upper punch side estimated correlation. Then, the second estimation unit 35 applies the estimated contact pressure data Fp-2 to this second estimated correlation to estimate the second heat transfer coefficient data h1-2 corresponding to the estimated contact pressure data Fp-2 for period II. 【0143】 For example, when estimating the heat transfer coefficient data in the interface region between measurement point Pc4 and Pm4-1 from the estimated contact pressure data Fd-2 for period III as described above, the second estimation unit 35 uses the third estimated correlation of the second die-side estimated correlation. Then, the second estimation unit 35 applies the estimated contact pressure data Fd-2 to this third estimated correlation to estimate the second heat transfer coefficient data h4-2 corresponding to the estimated contact pressure data Fd-2 for period III. 【0144】 The estimation process of the second estimation unit 35 exemplified above corresponds to the process performed after the estimation process of the first estimation unit 34, which is performed when the answer is Yes in S110, as shown in the flowchart of Figure 8, and is an example of the second estimation step according to one aspect of the present invention. 【0145】 Furthermore, the second estimation unit 35 does not have to use only the seven estimated correlations estimated by the first estimation unit 34 during the estimation process. Taking the first heat transfer coefficient data h1-1 as an example, the second estimation unit 35 may perform the estimation process using a dataset that includes the first heat transfer coefficient data h1-1, the contact pressure data Fp-1, and the first upper punch side estimated correlation estimated by the first estimation unit 34. 【0146】 [Embodiment 2] Embodiment 2 of the present invention will be described below. For the sake of clarity, components having the same function as those described in Embodiment 1 will be denoted by the same reference numerals, and their descriptions will not be repeated. The same applies to Embodiment 3, which will be described later. 【0147】 The simulation device 200 according to Embodiment 2 of the present invention differs from the simulation device 100 according to Embodiment 1 of the present invention in that it estimates the temperature distribution of the mold 40a instead of the mold 40. Furthermore, the simulation device 200 also differs from the simulation device 100 in that it is equipped with a third sensor 80 instead of the first and second sensors 10 and 20. 【0148】 <Mold and temperature measurement> (Mold) The mold 40a is a metal mold used in the manufacture of products by gravity casting. The forming material of the mold 40a is carbon steel, the same as that of the mold 40. The mold 40a consists only of a die 41a, as shown by reference numerals 1201 and 1202 in Figure 12. The die 41a is a hollow cylindrical mold, and the hollow portion of the die 41a is cylindrical, similar to the die 41 of the mold 40. Also, similar to the die 41a, various release agents are applied to the inner surface of the die 41a as needed. 【0149】 As shown by reference numeral 1202 in Figure 12, the side wall 41Xa-1 of the metal portion 41Xa of the die 41a has a first hole 41Ya, a second hole 41Yb, a third hole 41Yc, and a fifth hole 41Ye formed in a direction perpendicular to the central axis AX-1 of the die 41a (i.e., mold 40a) when viewed from the front. The first to third holes 41Ya to 41Yc are cylindrical holes of a size that allows the third sensor body 83, described later, to be inserted and removed, and they penetrate from the outer side surface of the side wall 41Xa-1 to the hollow portion of the die 41a. In this embodiment, the diameters of the first to third holes 41Ya to 41Yc are all 20 mm. 【0150】 Of the first to third holes 41Ya to 41Yc, the first hole 41Ya is formed at the uppermost position, and the third hole 41Yc is formed at the lowermost position. The second hole 41Yb is formed vertically between the first hole 41Ya and the third hole 41Yc. In the vertical direction, the shortest distance between the first hole 41Ya and the second hole 41Yb is approximately the same as the shortest distance between the second hole 41Yb and the third hole 41Yc. 【0151】 The fifth hole 41Ye is a cylindrical hole with a diameter of 8 mm, smaller than the diameters of the first to third holes 41Ya to 41Yc, and has an opening formed on the outer surface of the side wall 41Xa-1. The fifth hole 41Ye does not penetrate to the hollow part of the die 41a, and the bottom portion 41Ye-1 of the fifth hole 41Ye is formed as part of the side wall 41Xa-1. In this embodiment, the thickness of the bottom portion 41Ye-1 is 2 mm. Furthermore, in a front view, the fifth hole 41Ye is formed in the portion of the side wall 41Xa-1 between the second hole 41Yb and the third hole 41Yc, and in the vicinity of the second hole 41Yb. 【0152】 The central axes of the first to third holes 41Ya to 41Yc intersect on the central axis AX-1 in a plan view, as shown by reference numeral 1201 in Figure 12. In a plan view, the angle between the central axis of the first hole 41Ya and the central axis of the second hole 41Yb is 30°, the angle between the central axis of the second hole 41Yb and the central axis of the third hole 41Yc is 30°, and the angle between the central axis of the first hole 41Ya and the central axis of the third hole 41Yc is 60°. In addition, the central axis of the fifth hole 41Ye coincides with the central axis of the second hole 41Yb in a plan view. 【0153】 As shown by reference numeral 1202 in Figure 12, the bottom wall 41Xa-2 of the metal part 41Xa has a fourth hole 41Yd, a sixth hole 41Yf, and a through hole 41Yg formed in a direction parallel to the central axis AX-1 when viewed from the front. The central axis of the fourth hole 41Yd coincides with the central axis AX-1. The fourth hole 41Yd is a cylindrical hole of a size that allows the third sensor body 83 to be inserted and removed, similar to the first to third holes 41Ya to 41Yc, and penetrates from the outer bottom surface of the bottom wall 41Xa-2 to the hollow part of the die 41a. The diameter of the fourth hole 41Yd is 20 mm, similar to the first to third holes 41Ya to 41Yc. 【0154】 The sixth hole 41Yf is a cylindrical hole with a diameter of 8 mm, smaller than the diameters of the first to fourth holes 41Ya to 41Yd, and has an opening formed on the outer bottom surface of the bottom wall 41Xa-2. Furthermore, the sixth hole 41Yf does not penetrate to the hollow part of the die 41a, and the bottom portion 41Yf-1 of the sixth hole 41Yf is formed as part of the bottom wall 41Xa-2. In this embodiment, the thickness of the bottom portion 41Yf-1 is 2 mm, the same as the bottom portion 41Ye-1. Also, in a front view, the sixth hole 41Yf is formed near the side of the bottom wall 41Xa-2 where each of the holes (first to third holes 41Ya to 41yc and fifth hole 41Ye) is formed. The central axis of the sixth hole 41Yf intersects with the central axis of the first hole 41Ya in a plan view, as shown by reference numeral 1201 in Figure 12. 【0155】 The through-hole 41Yg is a cylindrical hole with a diameter of 1.05 mm, as shown by reference numeral 1202 in Figure 12, and penetrates from the outer bottom surface of the bottom wall 41Xa-2 to the hollow portion of the die 41a. The through-hole 41Yg is formed near the side wall 41Xa-1 in a front view, and near the first hole 41Ya in a plan view, as shown by reference numeral 1201 in Figure 12. Of course, the formation positions, shapes, and sizes of the first to sixth holes 41Ya to 41Yf and the through-hole 41Yg are not limited to the example of this embodiment. 【0156】 In this embodiment, gravity casting using mold 40a is performed as follows. First, mold 40a is preheated to 573.15K (300℃). Next, as shown in Figure 13, molten metal 50 melted at 1023.15K (750℃) is poured into the hollow section from the upper opening in the hollow section, and the molten metal 50 is allowed to solidify in that state. Through these steps, a molded body (not shown) before finishing is completed. In addition, a release agent is applied to the inner surface of the die 41a of mold 40a before gravity casting. Examples of release agents applied to mold 40a include BN spray and blackbody spray. 【0157】 (temperature measurement) The simulation device 200 is equipped with a third sensor 80 (details will be described later) as shown in Figure 1. In this embodiment, the simulation device 200 measures the temperature using the third sensor 80 at a total of 12 locations: 8 locations on the mold 40a side and 4 locations on the molten metal 50 side, as shown by reference numeral 1202 in Figure 12. The arrangement of the 12 measurement locations is such that three measurement locations Pdn, Pen-1, and Pen-2 (n: a natural number from 1 to 4), as shown by reference numerals 1201 and 1202 in Figure 12, are arranged in a straight line in both a plan view and a front view. There are a total of four groups of measurement locations consisting of these three measurement locations. 【0158】 Hereafter, the three measurement locations Pdn, Pen-1, and Pen-2 will be abbreviated as "measurement location Pdn, ~Pen-2". The temperature value Tdn measured at measurement location Pdn will be referred to as temperature data Tdn' (second temperature data). The temperature value Ten-1 measured at measurement location Pen-1 will be referred to as temperature data Ten-1' (first temperature data). The temperature value Ten-2 measured at measurement location Pen-2 will be referred to as temperature data Ten-2' (first temperature data). Furthermore, the three temperatures Tdn, Ten-1, and Ten-2 will be abbreviated as "temperature Tdn, ~Ten-2", and the three temperature data Tdn', Ten-1', and Ten-2' will be abbreviated as "temperature data Tdn', ~Ten-2'". 【0159】 In this embodiment, as shown by reference numeral 1203 in Figure 12, measurement point Pdn is located 2 mm toward the molten metal 50 side from the inner side surface of the side wall 41Xa-1 or the inner bottom surface of the bottom wall 41Xa-2 (hereinafter collectively referred to as the "second mold surface"). Measurement point Pen-1 is located 2 mm toward the mold 40a side from the second mold surface. Measurement point Pen-2 is located 6 mm toward the mold 40a side from the second mold surface. 【0160】 As shown by reference numerals 1201 and 1202 in Figure 12, measurement point Pd1 is located inside the molten metal 50 and near measurement point Pe1-1. Pe1-1 and Pe1-2 are located on the wall surface of the metal portion 41Xa that forms the first hole 41Ya. Measurement point Pd2 is located inside the molten metal 50 and near measurement point Pe2-1. Pe2-1 and Pe2-2 are located on the wall surface of the metal portion 41Xa that forms the second hole 41Yb. Measurement point Pd3 is located inside the molten metal 50 and near measurement point Pe3-1. Pe3-1 and Pe3-2 are located on the wall surface of the metal portion 41Xa that forms the third hole 41Yc. 【0161】 Measurement points Pd4 and Pe4-2 are located on a straight line parallel to the central axis AX-1 in both plan view and front view. This straight line parallel to the central axis AX-1 is located on the side wall 41Xa-1 side of the central axis AX-1. Furthermore, measurement points Pd3, Pe3-2, and Pd4 are located on the same straight line (i.e., the central axis of the third hole 41Yc) in plan view, as shown by reference numeral 1201 in Figure 12. In addition, measurement point Pd4 is located inside the molten metal 50 and near measurement point Pe4-1, as shown by reference numeral 1202 in Figure 12. Measurement points Pe4-1 and Pe4-2 are located on the wall surface of the metal portion 41Xa that forms the fourth hole 41Yd. 【0162】 In this embodiment, as shown in Figure 13, the third sensor body 83 is housed in each of the first to fourth holes 41Ya to 41Yd, thereby setting the third sensor 80 in the mold 40a. With the third sensor 80 set in the mold 40a, the third temperature measuring unit 81 (temperature measuring unit; details will be described later) of the third sensor 80 measures temperatures Td1 to Td4, Te1-1 to Te4-1, and Te1-2 to Te4-2. 【0163】 The temperature acquisition unit 31 of the simulation device 200 shown in Figure 1 acquires temperature data Td1'~Td4', Te1-1'~Te4-1', and Te1-2'~Te4-2' from the third temperature measurement unit 81, which are the measurement results of the third temperature measurement unit 81. 【0164】 The simulation device 200 is equipped with a thermocouple (not shown) (hereinafter referred to as the "fourth temperature measuring unit"), and as shown by reference numeral 1202 in Figure 12, the fourth temperature measuring unit measures temperature at a total of three locations inside and near the through hole 41Yg. Regarding the arrangement of the three measurement locations, the three measurement locations Pd5, Pe5-1, and Pe5-2 shown by reference numerals 1201 and 1202 in Figure 12 are arranged in a straight line in both a plan view and a front view. 【0165】 Measurement points Pd5, Pe5-1, and Pe5-2 are all located on the central axis of the through hole 41Yg. Furthermore, the formation positions of measurement points Pd5, Pe5-1, and Pe5-2 coincide with the formation position of measurement point Pd1 in a plan view, as shown by reference numeral 1201 in Figure 12. Measurement point Pd5 is located 2 mm from the inner bottom surface of the bottom wall 41Xa-2 toward the molten metal 50. Measurement point Pe5-1 is located 2 mm from the inner bottom surface of the bottom wall 41Xa-2 toward the mold 40a. Measurement point Pe5-2 is located 6 mm from the inner bottom surface of the bottom wall 41Xa-2 toward the mold 40a. 【0166】 A fourth temperature measuring unit located at measurement point Pd5 measures temperature Te5, a fourth temperature measuring unit located at measurement point Pe5-1 measures temperature Te5-1, and a fourth temperature measuring unit located at measurement point Pe5-2 measures temperature Te5-2. The temperature acquisition unit 31 of the simulation device 200 acquires temperature data Te5', Te5-1', and Te5-2' from the fourth temperature measuring unit based on the measurement results of that unit. Temperature data Te5' is the temperature value of Te5, temperature data Te5-1' is the temperature value of Te5-1, and temperature data Te5-2' is the temperature value of Te5-2. 【0167】 For the sake of illustration simplicity, the mold 40a in Figure 13 is depicted as having the central axes of the first to sixth holes 41Ya to 41Yf and the through hole 41Yg all located on the cross-section of the metal portion 41Xa of the die 41a. In reality, the second hole 41Yb, the third hole 41Yc, and the fifth hole 41Ye are formed at the locations indicated by reference numerals 1201 and 1202 in Figure 12. 【0168】 <Specific structure and pressure measurement of the third sensor> (Specific structure of the third sensor) The third sensor 80 is a component of the simulation device 200 that measures temperature Tdn, Ten-1 and Ten-2 (n: a natural number from 1 to 4), and contact pressure Fd1 to Fd4. Contact pressure Fd1 to Fd4 are four pressures: Fd1, Fd2, Fd3, and Fd4. 【0169】 Specifically, the third sensor 80 set in the first hole 41Ya measures temperature Td1, ~Te1-2 and contact pressure Fd1. The third sensor 80 set in the second hole 41Yb measures temperature Td2, ~Te2-2 and contact pressure Fd2. The third sensor 80 set in the third hole 41Ya measures temperature Td3, ~Te3-2 and contact pressure Fd3. The third sensor 80 set in the fourth hole 41Ya measures temperature Td4, ~Te4-2 and contact pressure Fd4. 【0170】 As shown by reference numeral 1401 in Figure 14, the third sensor 80 has a third temperature measuring unit 81, a third pressure measuring unit 82 (pressure measuring unit), and a third sensor body 83 (single component). The third temperature measuring unit 81 measures temperatures Td1 to Td4, Te1-1 to Te4-1, and Te1-2 to Te4-2. In this embodiment, the third temperature measuring unit 81 is the same thermocouple as the first and second temperature measuring units 11 and 21. Furthermore, the temperatures Te1-1 to Te4-1 and Te1-2 to Te4-2 measured by the third temperature measuring unit 81 are considered to be the temperatures of the die 41a (i.e., the mold 40a). 【0171】 The third sensor body 83 is a hollow cylindrical component. In this embodiment, the third sensor body 83 is made of the same carbon steel as the mold 40a, with an outer diameter of 20 mm and an inner diameter of 10 mm. Furthermore, as shown by reference numeral 1402 in Figure 14, the length of the third sensor body 83 in the direction of its central axis AX3 is approximately the same as the thickness of the side wall 41Xa-1. Of course, the material, shape, and size of the third sensor body 83 are not limited to the example of this embodiment. 【0172】 The third sensor body 83 is provided with three third temperature measuring sections 81, and the third sensor 80 measures temperature at three locations. These three locations are arranged in the order of measurement points Pdn, Pen-1, and Pen-2 (n: a natural number from 1 to 4) from the molten metal 50 side. Specifically, measurement points Pdn-1 and Pen-2 are provided on the wall surface of the metal parts 41Xa that form the first to fourth holes 41Ya to 41Yd, respectively, as shown by reference numerals 1201 and 1202 in Figure 12. Measurement point Pdn is located inside the molten metal 50 and near measurement point Pen-1. 【0173】 Furthermore, the measurement points Pdn and ~Pen-2 (n: natural numbers from 1 to 4) are located on the same axis. The axis on which the measurement points Pdn and ~Pen-2 (n: natural numbers from 1 to 3) are located is perpendicular to the central axis AX-1 and, in a front view, is at the same height and parallel to the central axis of the first to third holes 41Ya to 41Yc. The axis (not shown) on which the measurement points Pd4 and ~Pe4-2 are located is parallel to the central axis AX-1 in both a plan view and a front view. When the third sensor body 83 is housed in the first to fourth holes 41Ya to 41Yd, the central axis AX3 of the third sensor body 83 coincides with the central axis of the first to fourth holes 41Ya to 41Yd. 【0174】 The third pressure measuring unit 82 measures contact pressures Fd1 to Fd4. Contact pressures Fd1 to Fd3 are pressures acting on the fourth interface Si4. Specifically, contact pressure Fd1 is the pressure acting on the region of the fourth interface Si4 opposite the first hole 41Ya, as shown in Figure 13. Contact pressure Fd2 is the pressure acting on the region of the fourth interface Si4 opposite the second hole 41Yb. Contact pressure Fd3 is the pressure acting on the region of the fourth interface Si4 opposite the third hole 41Yc. 【0175】 The fourth interface Si4 is a concept composed of a surface Sd1 on the side wall 41Xa-1 that contacts the molten metal 50, and a surface Sc4 on the molten metal 50 that contacts the side wall 41Xa-1. Here, "the surface Sd1 on the side wall 41Xa-1 that contacts the molten metal 50" corresponds to the inner side surface of the side wall 41Xa-1. In the following explanation, this surface will be referred to as the "fifth contact surface Sd1". The fifth contact surface Sd1 includes the surfaces 82a-1 of the three films 82a (details will be described later) that seal the first to third holes 41Ya to 41Yc, respectively, and the surface of the third sensor body 83 that contacts the molten metal 50. Also, "the surface Sc4 on the molten metal 50 that contacts the side wall 41Xa-1" corresponds to the side surface of the molten metal 50. In the following explanation, this surface will be referred to as the "sixth contact surface Sc4". 【0176】 Based on the definition of the fourth interface Si4 mentioned above, "contact pressure Fd1~Fd3" refers to two pressures: the contact pressure Fd1~Fd3 acting from the fifth contact surface Sd1 toward the sixth contact surface Sc4, and the contact pressure Fd1~Fd3 acting from the sixth contact surface Sc4 toward the fifth contact surface Sd1. 【0177】 The contact pressure Fd4 is the pressure acting on the fifth interface Si5 shown in Figure 13. Specifically, the contact pressure Fd4 is the pressure acting on the region of the fifth interface Si5 opposite the fourth hole 41Yd. The fifth interface Si5 is a concept composed of a surface Sd2 in contact with the molten metal 50 at the bottom wall 41Xa-2, and a surface Sc5 in contact with the bottom wall 41Xa-2 at the molten metal 50. 【0178】 Here, "the surface Sd2 in contact with the molten metal 50 on the bottom wall 41Xa-2" corresponds to the inner bottom surface of the bottom wall 41Xa-2. In the following explanation, this surface will be referred to as the "seventh contact surface Sd2". The seventh contact surface Sd2 includes the surface 82a-1 and the surface of the third sensor body 83 that is in contact with the molten metal 50. Also, "the surface Sc5 in contact with the bottom wall 41Xa-2 on the molten metal 50" corresponds to the lower end surface of the molten metal 50. In the following explanation, this surface will be referred to as the "eighth contact surface Sc5". 【0179】 Based on the definition of the fifth interface Si5 mentioned above, "contact pressure Fd4" refers to two pressures: the contact pressure Fd4 acting from the seventh contact surface Sd2 toward the eighth contact surface Sc5, and the contact pressure Fd4 acting from the eighth contact surface Sc5 toward the seventh contact surface Sd2. 【0180】 The third pressure measuring unit 82, as shown by reference numeral 1401 in Figure 14, has a membrane 82a and a laser displacement meter 82b. The membrane 82a is attached to the third sensor body 83 and closes the opening on the molten metal 50 side of the third sensor body 83. The membrane 82a comes into contact with the molten metal 50 poured into the mold 40a when the third sensor body 83 is housed in the first to fourth holes 41Ya to 41Yd. 【0181】 Before the third sensor 80 is set in the mold 40a, the film 82a has a flat plate shape as shown by the dashed line of reference numeral 1402 in Figure 14, and the surface 82a-1 on the side that contacts the molten metal 50 is flush with the surface of the third sensor body 83 on the side that contacts the molten metal 50. When the film 82a comes into contact with the molten metal 50, as shown by reference numeral 1402 in Figures 13 and 14, the surface 82a-1 is pressed by the molten metal 50, causing it to bend so that it becomes convex toward the outside of the mold 40a. 【0182】 Hereinafter, the force exerted by the molten metal 50 in contact with the membrane 82a to press against the membrane 82a will be referred to as "pressure force". As shown in Figure 13, the pressure force acting on the membrane 82a of the third pressure measuring unit 82 located in the first hole 41Ya will be referred to as "pressure force Fdy-1". The pressure force acting on the membrane 82a of the third pressure measuring unit 82 located in the second hole 41Yb will be referred to as "pressure force Fdy-2". The pressure force acting on the membrane 82a of the third pressure measuring unit 82 located in the third hole 41Yc will be referred to as "pressure force Fdy-3". The pressure force acting on the membrane 82a of the third pressure measuring unit 82 located in the fourth hole 41Yd will be referred to as "pressure force Fdy-4". 【0183】 To avoid damage to the film 82a during gravity casting, it is necessary that the film 82a does not react with the molten metal 50. In this embodiment, since the molten metal 50 is an aluminum alloy die-cast, it is necessary to select a material for forming the film 82a that does not react with aluminum and has a melting point higher than the temperature of the molten metal 50 during casting. 【0184】 Examples of metallic materials used to form the film 82a include Ti (titanium), Zr (zirconium), Ta (tantalum), Ag (silver), Au (gold), Cr (chromium), Co (cobalt), Ni (nickel), and Pt (platinum). Nonmetallic materials include carbon fiber fabrics and ceramic paper. In particular, Mo (molybdenum), Nb (niobium), and W (tungsten) are preferred as materials for forming the film 82a. On the other hand, when using Fe (iron) and its alloys, or Cu (copper), which readily react with aluminum, it is preferable to coat the surface of the film 82a with a release agent or a ceramic-based coating to prevent erosion. 【0185】 Regarding the thickness of the film 82a, a thinner film allows for greater deflection under the same pressing force, thus achieving higher resolution. On the other hand, a thinner film is more susceptible to damage. Therefore, it is preferable that the film 82a has a thickness that allows for both high resolution and resistance to damage to be within acceptable limits. In this embodiment, taking into consideration all of the above considerations, a metal film made of Mo with a thickness of 10 μm or more is used as the film 82a. 【0186】 The laser displacement meter 82b is a measuring instrument that non-contactively measures the amount of deflection of a film 82a caused by the action of pressing force. Specifically, light from a light-emitting element is focused by a light-emitting lens and projected onto the film 82a. A portion of the light reflected from the film 82a reaches a linear image sensor via a light-receiving lens, and the linear image sensor detects the deflection of the film 82a. As the amount of deflection of the film 82a increases or decreases, the light spot on the linear image sensor moves, and the laser displacement meter 82b detects this amount of movement as the amount of deflection of the film 82a. The light-emitting element, light-emitting lens, light-receiving lens, and linear image sensor are all components of the laser displacement meter 82b (not shown). There are no limitations on the type of laser displacement meter 82b, and any known laser displacement meter can be used. 【0187】 (Pressure measurement) First, the third sensor body 83 is inserted into the first to fourth holes 41Ya to 41Yd. Then, as shown by reference numeral 1402 in Figure 14, the third sensor body 83 is housed in the first to fourth holes 41Ya to 41Yd so that the surface 82a-1 of the film 82a is flush with the fifth contact surface Sd1 (the inner side surface of the side wall 41Xa-1). 【0188】 Next, when the molten metal 50 is poured into the mold 40a, a pressing force acts on the film 82a, causing it to bend so that it becomes convex toward the outside of the mold 40a, as shown in Figure 13. The amount of this bending is measured by the third sensor 80. Specifically, the amount of displacement of the film 82a caused by the pressing force is measured by the laser displacement meter 82b of the third pressure measuring unit 82. At the same time, the amounts of displacement of the bottom portions 41Ye-1 and 41Yf-1 caused by the thermal expansion of the metal portion 41Xa are measured by the laser displacement meter 82b. The laser displacement meter 82b that measures the amounts of each of the aforementioned displacements is not provided in the third pressure measuring unit 82, but is used independently. 【0189】 The third sensor 80 measures the amount of deflection of the film 82a by considering the difference obtained by subtracting the displacement amounts of the bottom portions 41Ye-1 and 41Yf-1 from the displacement amount of the film 82a as the amount of deflection of the film 82a. It should be noted that it is not essential to consider the thermal expansion of the metal portion 41Xa when measuring the amount of deflection of the film 82a, and the amount of displacement of the film 82a caused by the action of the pressing force may be used directly as the amount of deflection of the film 82a. 【0190】 Next, the third sensor 80 calculates the pressing force Fdy-1 to Fdy-4 acting on the membrane 82a of each third sensor body 83 housed in the first to fourth holes 41Ya to 41Yd from the amount of deflection of the obtained membrane 82a. At least two methods for calculation are described below. 【0191】 One first conversion method is to use the following formulas (6) and (7). 【0192】 【number】 【0193】 W: Amount of deflection of film 82a [μm] Po: Pressing force [Pa] E: Elastic modulus of film 82a [Pa] h: Thickness of film 82a [μm] ν: Poisson's ratio a: Radius of film 82a [mm] r: The radial straight-line distance [mm] between the center of the film 82a and the measurement position (the position where the amount of deflection of the film 82a is measured). ρ :r / a A, B, C, D: Coefficients 【0194】 【number】 【0195】 When calculating the pressing force Fdy-1 to Fdy-4 acting on the membrane 82a of each third pressure measuring unit 82 located in the first to third holes 41Ya to 41Yc, the conversion unit of the third sensor 80 uses the aforementioned formula (6). When calculating the pressing force Fdy-4 acting on the membrane 82a of the third pressure measuring unit 82 located in the fourth hole 41Yd, the conversion unit uses the aforementioned formula (7). The conversion unit is, for example, a CPU and is provided in the laser displacement meter 82b. 【0196】 A second conversion method involves using the calibration graph shown in Figure 15. Specifically, before pouring the molten metal 50, molten metal 50a of a low-melting-point metal is poured into the calibration mold 40b shown in Figure 16 and gravity casting is performed. 【0197】 The reason for using molten metal 50a of a low melting point is as follows: The fluid that comes into contact with the film 82a is the molten metal, and once a fluid solidifies, its surface shape becomes unchanged. Therefore, in the case of molten metal, there is a possibility that the amount of deflection of the film 82a cannot be measured with high accuracy due to solidification. In this respect, if the molten metal 50a is a high melting point metal such as an aluminum alloy (913.15K (640℃) for an aluminum alloy), the portion of the molten metal 50a that comes into contact with the film 82a immediately becomes a solid phase after pouring, and the measurement accuracy deteriorates from an early stage. Therefore, it is preferable to use molten metal of a low melting point as the molten metal 50a. In this embodiment, molten tin (melting point: 503.15K (230℃)) is used as the molten metal 50a. 【0198】 The temperature of the molten metal 50a is 1023.15K, the same as the temperature of the molten metal 50. The mold 40b is identical to the mold 40a except that the first to third holes 41Ya to 41Yc, the fifth hole 41Ye, and the sixth hole 41Yf are not formed. A third sensor 80 is set in the fourth hole 41Yd of the mold 40b to measure the amount of deflection of the film 82a caused by the pressure of the molten metal 50a, and also to measure the temperature of the film 82a. For the temperature of the film 82a, the temperature Te4-1 measured at measurement point Pe4-1 by the third temperature measuring unit 81 is considered to be the temperature of the film 82a. Then, gravity casting is performed multiple times while changing the amount of molten metal 50a poured. 【0199】 Here, the pressing force Pi acting on the film 82a set in the mold 40b is given by Pi = l × g × hi (l: specific gravity of molten metal 50a [kg / m³]). 3 ], g: Gravitational acceleration [m / s 2 The pressure can be calculated using the formula `[ ] , hi: height of molten metal 50a [m]`. When the amount of molten metal 50a poured is changed, the height hi changes from h1 to h3 (h1>h2>h3), as shown in the example in Figure 16, and the pressing force Pi acting on the film 82a also changes from pressing force P1 to P3 (P1>P2>P3). In addition, the higher the temperature of the film 82a, the lower the elastic modulus of the film 82a. Therefore, as shown in the example in Figure 15, even with the same pressing force Pi, the amount of deflection of the film 82a increases as the temperature of the film 82a increases. 【0200】 From the above, by performing gravity casting of molten metal 50a using mold 40b multiple times, a calibration graph showing the relationship between the amount of deflection of the film 82a and the temperature of the film 82a, as shown in Figure 15, can be generated for multiple pressing forces Pi with different values. The data of the generated calibration graph may be stored, for example, in a memory unit not shown in the third sensor 80, or in a memory unit not shown built into the simulation device 200. 【0201】 The conversion unit reads a calibration graph from one of the aforementioned storage units and compares the amount of deflection of the molten metal 50 measured by the third pressure measuring unit 82 and the temperature of the film 82a (i.e., temperature Te4-1) measured by the third temperature measuring unit 81 with the aforementioned graph. The conversion unit then converts the pressing forces Fdy-1 to Fdy-4 from the comparison result. 【0202】 Finally, the third sensor 80 measures the contact pressures Fd1 to Fd4 by treating the converted pressing forces Fdy-1 to Fdy-4 as contact pressures Fd1 to Fd4. Specifically, the third sensor 80 treats pressing force Fdy-1 as contact pressure Fd1, pressing force Fdy-2 as contact pressure Fd2, pressing force Fdy-3 as contact pressure Fd3, and pressing force Fdy-4 as contact pressure Fd4. The pressure acquisition unit 32 of the simulation device 200 shown in Figure 1 acquires the contact pressure data Fd1' to Fd4' of the contact pressures Fd1 to Fd4 measured by the third sensor 80. 【0203】 <Example of processing results from a simulation device> The following describes examples of processing results obtained by the simulation device 200 using Figures 12 and 17-19. Note that all graph examples shown in Figures 17-19 represent cases where molten metal 50a is gravity-cast using a mold 40a coated with BN spray as a release agent. 【0204】 First, the measurement results from the third pressure measuring unit 82 are shown in the graph in Figure 17. The horizontal axis of the graph in Figure 17 represents the optimal elapsed time. The optimal elapsed time is the time elapsed from when the molten metal 50a is poured into the mold 40a until the molten metal 50a solidifies, and within this elapsed time range, the amount of deflection of the film 82a can be measured with high accuracy. 【0205】 The optimal elapsed time varies depending on the type of mold 40a, the constituent metals of the molten metal 50a, and the casting conditions. In this embodiment, the end of the optimal elapsed time is set to 20 seconds from the start of pouring the molten metal 50a into the mold 40a, as shown in the graph in Figure 17. 【0206】 When the pouring of molten metal 50a begins, the film 82a set in the fourth hole 41Yd comes into contact with the film 82a in the following order: film 82a set in the third hole 41Yc, film 82a set in the second hole 41Yb, and film 82a set in the first hole 41Ya. As contact between the molten metal 50a and the film 82a begins, the contact pressures Fd1 to Fd4 start to rise, and as shown in the graph in Figure 17, the values ​​start to rise in approximately the order of "contact pressure Fd4 → contact pressure Fd3 → contact pressure Fd2 → contact pressure Fd1". 【0207】 Throughout the elapsed time, the contact pressure Fd4 is highest at the point where the distance from the top surface of the molten metal 50a is greatest (= height hi of the molten metal 50a). However, the maximum value of the contact pressure Fd4 is approximately 0.003 MPa in the example shown in Figure 17, which is on the order of 1 / 1000th of the contact pressure in pressure casting. This result occurs because pressure casting uses a hydraulic press to apply pressure, whereas gravity casting only applies pressure equal to the weight of the molten metal. 【0208】 Next, the first heat transfer coefficient data hd1 to hd5, which the generation unit 33 of the simulation device 200 continuously determined at each time step, are shown in the graph in Figure 18. Note that the graph in Figure 18 shows the determination results up to 50 seconds after the start of pouring molten metal 50a into the mold 40a. 【0209】 As shown by reference numeral 1202 in Figure 12, the first heat transfer coefficient data hd1 is a value indicating the heat transfer coefficient of the region facing the first hole 41Ya at the fourth interface Si4. The first heat transfer coefficient data hd2 is a value indicating the heat transfer coefficient of the region facing the second hole 41Yb at the fourth interface Si4. The first heat transfer coefficient data hd3 is a value indicating the heat transfer coefficient of the region facing the third hole 41Yc at the fourth interface Si4. The first heat transfer coefficient data hd4 is a value indicating the heat transfer coefficient of the region facing the fourth hole 41Yd at the fifth interface Si5. The first heat transfer coefficient data hd5 is a value indicating the heat transfer coefficient of the region facing the through hole 41Yg at the fifth interface Si5. The method for determining the first heat transfer coefficient data hd1 to hd5 is the same as in Embodiment 1. As shown in the graph in Figure 18, each first heat transfer coefficient data shows different behavior depending on the calculation location. 【0210】 Next, the correlation between the contact pressure data Fd1'~Fd4' estimated by the first estimation unit 34 of the simulation device 200 and the first heat transfer coefficient data hd1~hd4 is as shown in the graph in Figure 19. As shown in the graph in Figure 19, even when minute contact pressures Fd1~Fd4 act on the fourth and fifth interfaces Si4 and Si5 under gravity casting, the simulation device 200 can analyze the correlation between the contact pressure data Fd1'~Fd4' and the first heat transfer coefficient data hd1~hd4. 【0211】 [Embodiment 3] Embodiment 3 of the present invention will be described below. The simulation apparatus 300 according to Embodiment 3 of the present invention differs from the simulation apparatuses 100 and 200 in that the first estimation unit 34 constructs estimation models 34a, 34b, and 34c. Furthermore, the simulation apparatus 300 also differs from the simulation apparatuses 100 and 200 in that the second estimation unit 35 estimates the second heat transfer coefficient data hd-2, hpu-2, and hpl-2 using the aforementioned estimation models. 【0212】 The following describes in detail the series of processes up to the point in which the simulation device 300 estimates the correlation between the contact pressure data and the first heat transfer coefficient data, using Figure 1. The series of processes up to the point in which the generation unit 33 of the simulation device 300 shown in Figure 1 generates each basic data set is the same as in Embodiments 1 and 2. 【0213】 The first estimation unit 34, which receives each basic dataset from the generation unit 33 of the simulation device 300, constructs estimation models 34a, 34b, and 34c by machine learning. Estimation model 34a is a trained model obtained by machine learning using the die-side basic dataset as training data, and outputs second heat transfer coefficient data hd-2 using the estimation contact pressure data Fd-2 as input data. Estimation model 34b is a trained model obtained by machine learning using the upper punch-side basic dataset as training data, and outputs second heat transfer coefficient data hpu-2 using the estimation contact pressure data Fp-2 as input data. Estimation model 34c is a trained model obtained by machine learning using the lower punch-side basic dataset as training data, and outputs second heat transfer coefficient data hpl-2 using the estimation contact pressure data Fp-2 as input data. The first estimation unit 34 of the simulation device 300 temporarily stores the constructed estimation models 34a to 34c in the storage unit 3. 【0214】 The second estimation unit 35 of the simulation device 300 reads the estimation model 34a from the storage unit 3, inputs the estimation contact pressure data Fd-2 into the estimation model 34a to obtain the second heat transfer coefficient data hd-2, thereby estimating the second heat transfer coefficient data hd-2. The aforementioned second estimation unit 35 reads the estimation model 34b from the storage unit 3, inputs the estimation contact pressure data Fp-2 into the estimation model 34b to obtain the second heat transfer coefficient data hpu-2, thereby estimating the second heat transfer coefficient data hpl-2. The aforementioned second estimation unit 35 reads the estimation model 34c from the storage unit 3, inputs the estimation contact pressure data Fp-2 into the estimation model 34c to obtain the second heat transfer coefficient data hpl-2, thereby estimating the second heat transfer coefficient data hpl-2. 【0215】 There are no particular limitations on the machine learning method performed by the first estimation unit 34 of the simulation device 300, and known methods such as convolutional neural networks can be employed. Furthermore, the basic datasets used by the first estimation unit 34 of the simulation device 300 when performing machine learning are not limited to those generated immediately before machine learning. For example, the first estimation unit 34 of the simulation device 300 may read previously generated basic datasets from the storage unit 3 and use them for machine learning. Alternatively, the first estimation unit 34 of the simulation device 300 may use a combination of previously generated basic datasets and the basic dataset generated immediately before machine learning for the machine learning process. 【0216】 Estimation models 34a to 34c are trained models that output second heat transfer coefficient data based on the estimated correlation (i.e., estimated correlation) between contact pressure data and first heat transfer coefficient data. Therefore, estimation models 34a to 34c represent the estimation results by the first estimation unit 34 of the simulation device 300. In this way, the simulation device 300 can estimate the correlation between contact pressure data and first heat transfer coefficient data by machine learning using each basic dataset. Furthermore, the simulation device 300 can estimate each second heat transfer coefficient data using estimation models 34a to 34c. 【0217】 [Examples of implementation using software] The functions of the simulation device 100 (hereinafter referred to as "device 100") can be realized by a program that causes the computer to function as the device 100. This program is a program that causes the computer to function as each control block of the device 100 (particularly each part included in the first estimation device 30). 【0218】 In this case, the device 100 includes a computer having at least one control device (e.g., a processor) and at least one storage device (e.g., memory) as hardware for executing the aforementioned program. By executing the aforementioned program using this control device and storage device, each of the functions described in the above embodiment is realized. 【0219】 The aforementioned program may be recorded on one or more computer-readable recording media, not temporary ones. These recording media may or may not be present in the device 100. In the latter case, the aforementioned program may be supplied to the device 100 via any wired or wireless transmission medium. 【0220】 Furthermore, some or all of the functions of each control block in the device 100 can also be realized by logic circuits. For example, an integrated circuit in which logic circuits functioning as each of the aforementioned control blocks are formed is also included in the scope of the present invention. In addition, it is also possible to realize the functions of each of the aforementioned control blocks by, for example, a quantum computer. 【0221】 [Examples] <Equipment> The apparatus used in this embodiment is as follows: The mold 40 used consisted of a die 41 with a height of 100 mm and an outer diameter of 100 mm, an upper punch 42 with an outer diameter of 40 mm, and a lower punch 43 with a height of 50 mm and an outer diameter of 40 mm. 【0222】 As the first sensor 10, a first sensor body 13 was used, having an outer diameter of 12 mm at the first cylindrical section, an outer diameter of 18 mm at the cylindrical section with the largest outer diameter, and a total length of 150 mm. As the second sensor 20, a second sensor body 23 was used, having an outer diameter of 12 mm at the molten metal side end, an outer diameter of 20 mm at the end opposite the molten metal side end, and a total length of 128 mm. In addition, strain gauges, which serve as the first and second pressure measuring sections 12 and 22, were welded and attached at a distance of 60 mm or more from the end face of the first cylindrical section and the end face of the molten metal side end, respectively. 【0223】 In this embodiment, the compression characteristics of the first and second sensors 10 and 20 were determined at 50K intervals from room temperature to approximately 673K. Then, the correlation between the strain generated in the first and second sensors 10 and 20 and the compressive stress acting on these sensors was calibrated. 【0224】 For each measurement point where temperature was not measured by the first and second sensors 10 and 20, through-holes or non-through-holes were formed in the die 41, upper punch 42, and lower punch 43 corresponding to each measurement point. Then, thermocouples similar to those in the first and second temperature measurement units 11 and 21 were inserted into these holes, and the temperature was measured by placing thermocouples at each measurement point. 【0225】 <Casting Method> In this embodiment, a die 41 with a lower punch 43 set in the hollow section was placed in a hydraulic press, and molten metal 50 (ADC12) at approximately 1023K was poured into the hollow section. Next, the upper punch 42 was inserted into the hollow section while being pressurized by the hydraulic press, and the molten metal 50 was pressurized. Then, the molten metal was allowed to solidify while maintaining the pressurized state of the molten metal 50 by the upper punch 42. Except for the verification of the estimation results of the first estimation section 34 described later, a blackbody spray was applied to the inner side surface of the die 41 as a release agent. The press load of the hydraulic press was set to 7.6t. 【0226】 <Survey Results and Evaluation Results> (Relationship between the first heat transfer coefficient data and elapsed time) In this embodiment, the relationship between each of the first heat transfer coefficient data h1-1 to h7-1 determined by the generation unit 33 and the elapsed time was investigated. "Elapsed time" refers to the time elapsed since the start of pouring molten metal 50 into the die 41. As a result of the investigation, a graph like the one shown in Figure 20 was obtained. As shown in the graph in Figure 20, the values ​​of each of the first heat transfer coefficient data h1-1 to h7-1 were different at each elapsed time. From this, it was found that the behavior of the first heat transfer coefficient data with respect to time changes differs depending on the temperature data measurement location. This is presumed to be due to the difference in the contact state between the mold 40 and the molten metal 50 depending on the temperature data measurement location. 【0227】 (Comparison with the first heat transfer coefficient data determined using a one-dimensional transient heat transfer model) In this embodiment, for each of the first heat transfer coefficient data h1-1 to h3-1, the generation unit 33 investigated the relationship between the value determined by the determination method of this embodiment and the value determined using a one-dimensional transient heat transfer model and the elapsed time. The generation unit 33 calculated the first heat transfer coefficient data hm1-1 to hm3-1 using a one-dimensional transient heat transfer model by the method shown below. The first heat transfer coefficient data hm1-1 is the first heat transfer coefficient data h1-1 calculated using a one-dimensional transient heat transfer model. The first heat transfer coefficient data hm2-1 is the first heat transfer coefficient data h2-1 calculated using a one-dimensional transient heat transfer model. The first heat transfer coefficient data hm3-1 is the first heat transfer coefficient data h3-1 calculated using a one-dimensional transient heat transfer model. 【0228】 For the sake of simplicity, the following explanation will only describe the method for determining the first heat transfer coefficient data h1-1. The method for determining the first heat transfer coefficient data h2-1 and h3-1 is substantially the same as the method for determining the first heat transfer coefficient data h1-1. 【0229】 First, the generation unit 33 replaced the state near the interface region corresponding to the first heat transfer coefficient data h1-1 with an equivalent circuit 70 as shown in Figure 21. Measurement location Pc is a general term for measurement locations Pc1 to Pc3, and temperature data Tc' is a general term for temperature data Tc1' to Tc3'. Measurement location Pm1 is a general term for measurement locations Pm1-1 to Pm3-1, and temperature data Tm1' is a general term for temperature data Tm1-1' to Tm3-1'. Measurement location Pm2 is a general term for measurement locations Pm1-2 to Pm3-2, and temperature data Tm2' is a general term for temperature data Tm1-2' to Tm3-2'. 【0230】 Thermal resistance RHTC is a collective term for thermal resistances RHTC1 to RHTC3. Thermal resistances RHTC1 to RHTC3 are the thermal resistances of the interface regions corresponding to the first heat transfer coefficient data h1-1 to h3-1, respectively. Thermal resistance R1 is a collective term for thermal resistances R11 to R13. Thermal resistance R11 is the thermal resistance between measurement points Pm1-1 and Pm1-2. Thermal resistance R12 is the thermal resistance between measurement points Pm2-1 and Pm2-2. Thermal resistance R13 is the thermal resistance between measurement points Pm3-1 and Pm3-2. 【0231】 Next, the generation unit 33 acquired temperature data Tc1', Tm1-1', and Tm1-2' from the temperature acquisition unit 31 at a certain time step. Then, the generation unit 33 set the value of the thermal resistance RHTC1. In this embodiment, the generation unit 33 set the value of the thermal resistance RHTC1 by receiving the setting operation of the input unit 1 from the input unit 1. 【0232】 Next, the generation unit 33 calculated the estimated temperature data Tmpe1' using the following equation (8), which applies the temperature data obtained from the temperature acquisition unit 31, the thermal resistance RHTC1, and the one-dimensional transient heat conduction equation to the equivalent circuit 70. The estimated temperature data Tmpe1' is the estimated temperature data for measurement point Pm1-1. The estimated temperature data Tmpe1', the estimated temperature data Tmpe2' for measurement point Pm2-1, and the estimated temperature data Tmde1' for measurement point Pm3-1 are collectively referred to as "estimated temperature data Tme'". 【0233】 [Number] 【0234】 Tme´:推定 temperature data Tme´ [K] Tm1´: Temperature data Tm1´ at a certain time step Tm2´: Temperature data Tm2´ [K] at a certain time step Tc´: Temperature data Tc´ [K] at a certain time step RHTC: Thermal resistances RHTC1, RHTC2, and RHTC3 [(m 2 ·K) / W] β0, β1: Constants R1: Δx / λm [(m 2 ·K) / W] Δx: Distance between measurement points Pc and Pm1, distance between measurement points Pm1 and Pm2 [m] In this embodiment, the generation unit 33 used the equation obtained by applying the unsteady heat conduction equation in the one-dimensional orthogonal coordinate system to the equivalent circuit 70 as the aforementioned equation (8) to calculate the estimated temperature data Tmpe1´. When calculating the estimated temperature data Tmpe2´, the generation unit 33 also used the equation obtained by applying the unsteady heat conduction equation in the one-dimensional orthogonal coordinate system to the equivalent circuit 70 as the aforementioned equation (8). On the other hand, when calculating the estimated temperature data Tmde1´, the generation unit 33 used the equation obtained by applying the unsteady heat conduction equation in the one-dimensional cylindrical coordinate system to the equivalent circuit 70 as the aforementioned equation (8). Also, the generation unit 33 varied the values of β0 and β1 when calculating the estimated temperature data Tmde1´ and when calculating the estimated temperature data Tmpe1´ and Tmpe2´. 【0235】 Next, the generation unit 33 calculated the difference between the calculated estimated temperature data Tmpe1' and the temperature data Tm1-1' (measured value) at the next time step. Then, the generation unit 33 determined whether the calculated difference was the smallest among the differences between the plurality of estimated temperature data Tmpe1' obtained by repeatedly performing the setting process of the thermal resistance RHTC1 and the calculation process using the above-mentioned formula (8) a plurality of times at this time step, and the above-mentioned temperature data Tm1-1'. If it was determined that it was not the smallest, the generation unit 33 recalculated the estimated temperature data Tmpe1', calculated the above-mentioned difference, and determined whether the difference was the smallest again. 【0236】 In this embodiment, the generation unit 33 recalculated the calculation of the estimated temperature data Tmpe1' and the like by comparing the magnitudes of the values of the plurality of evaluation functions e = |Tmpe1' - Tm1-1'| calculated at a certain time step among the plurality of evaluation functions e. The comparison method of the evaluation function e is the same as the comparison method of the evaluation function e described in this embodiment except that Δh is replaced with ΔRHTC1 (change amount of thermal resistance). 【0237】 If it was determined that it was the smallest, the generation unit 33 calculated the first heat transfer coefficient data hm1-1 by substituting the value of the thermal resistance RHTC1 corresponding to the estimated temperature data Tmpe1' with the smallest difference into the following formula (9). The generation unit 33 calculated the first heat transfer coefficient data hm2-1 and hm3-1 in the same manner. 【0238】 【Equation】 【0239】 h: First heat transfer coefficient data hm1-1, hm2-1 and hm3-1 [W / (m 2 ·K)] Rc: Thermal resistance of molten metal 50 [(m 2 ·K) / W] Rm: Thermal resistance of mold 40 [(m 2 ·K) / W] When the calculation process for the first heat transfer coefficient data hm1-1 to hm3-1 at a given time step is completed, the generation unit 33 updates the time step once and determines whether the updated time step is the final time step or not. If the updated time step is not the final time step, the generation unit 33 calculates the first heat transfer coefficient data hm1-1 to hm3-1 at the updated time step. In this manner, the calculation of the first heat transfer coefficient data hm1-1 to hm3-1 is repeated for each time step, and the generation unit 33 continues calculating the first heat transfer coefficient data hm1-1 to hm3-1 until the final time step is reached. 【0240】 The results of the investigation yielded the graphs shown in Figure 22. In the figure, "1D" indicates the value determined using a one-dimensional transient heat transfer model, and "3D" indicates the value determined by the determination method of this embodiment. In the graphs for measurement points Pc2, ~Pm2-2 and Pc3, ~Pm3-2 in Figure 22, the values ​​of the first heat transfer coefficient data were generally larger for "1D" than for "3D". On the other hand, in the graphs for measurement points Pc1, ~Pm1-2 in Figure 22, there was no significant difference in the values ​​of the first heat transfer coefficient data between "1D" and "3D" regardless of the elapsed time. 【0241】 This is presumed to be due to the fact that the heat transfer from the corner portion of the molten metal 50, including measurement points Pc2 and Pc3, to the mold 40 was greater than the heat transfer from other parts of the molten metal 50. In other words, since the die 41 and upper punch 42 are located nearby to the vertically above and to the side of the aforementioned corner portion, it is presumed that heat transfer from the aforementioned corner portion to the die 41 and upper punch 42 occurred more easily than from other parts of the molten metal 50. 【0242】 (Determination accuracy of the first heat transfer coefficient data) In this embodiment, the determination accuracy of the generation unit 33 was evaluated by calculating the error between the measured temperature data at a specific location and the specific temperature data Tms' using the first heat transfer coefficient data h1-1 to h7-1 determined by the generation unit 33. The specific temperature data Tms' is the estimated temperature data Tme' that minimizes the difference between the estimated temperature data Tme' and the temperature data at the next time step, among a plurality of estimated temperature data Tme' at a certain time step. In this case, "temperature data" refers to the measured temperature at the measurement location where the estimated temperature data Tme' is estimated. 【0243】 Hereinafter, the specific temperature data Tms' from measurement points Pm1-1 to Pm7-1 will be referred to as "specific temperature data Tms1-1' to Tms7-1'", and the specific temperature data Tms' from measurement points Pm1-2 to Pm7-2 will be referred to as "specific temperature data Tms1-2' to Tms7-2'". 【0244】 Specifically, the error between the measured values ​​and the specific temperature data Tms' was calculated for a total of 14 measurement locations, Pm1-1 to Pm7-1 and Pm1-2 to Pm7-2, as shown in Figure 5. In this embodiment, a series of processes related to the evaluation of the determination accuracy were performed using the simulation device 100. 【0245】 In this embodiment, the value of the first heat transfer coefficient data h1-1 was determined using (i) the method of this embodiment (three-dimensional transient heat transfer model). The value was also determined using (ii) the aforementioned one-dimensional transient heat transfer model. Hereinafter, the first heat transfer coefficient data h1-1 in case (i) will be referred to as "first heat transfer coefficient data h11," and the first heat transfer coefficient data h1-1 in case (ii) will be referred to as "first heat transfer coefficient data h12." Furthermore, as a comparative example, a constant value of the first heat transfer coefficient data was used to calculate each specific temperature data. The constant values ​​were 2000, 5000, 10000, 20000, and 30000 W / (m²). 2 The values ​​for each of the following (K) were set. 【0246】 In this embodiment, the measured values ​​of temperature data Tm1-1'~Tm7-1' and Tm1-2'~Tm7-2' were the values ​​obtained by the first and second sensors 10 and 20, respectively. Furthermore, in the cases of (i) and (ii) described above, and in each comparative example, the specific temperature data Tms1-1'~Tms7-1' and Tms1-2'~Tms7-2' were calculated using the equations (3)~(5) described above. In the case of (ii) described above, each specific temperature data was calculated using the equations (8) and (9) described above. 【0247】 Next, the determination accuracy of the generation unit 33 in each of the above cases (i) and (iv), as well as in each comparative example, was evaluated by calculating seven types of average errors E1 to E7. Average error E1 is calculated by determining the error between the measured value and the specific temperature data Tms' in case (i) above for each temperature data, and then taking the average of the calculated errors. Average error E2 is calculated by determining the error between the measured value and the specific temperature data Tms' in case (ii) above for each temperature data, and then taking the average of the calculated errors. 【0248】 The average errors E3 to E7 are calculated by determining the error between the measured value and the specific temperature data Tms' for each temperature data point, assuming the first heat transfer coefficient data is the aforementioned constant value, and then taking the average of the calculated errors. Specifically, the average errors E1 to E7 were calculated using the following equation (10). 【0249】 【number】 【0250】 E: Average error E1~E7[K] Tmes: Measured values ​​[K] for temperature data Tm1-1'~Tm7-1' and Tm1-2'~Tm7-2'. Tcal: Specific temperature data Tms1-1'~Tms7-1', and Tms1-2'~Tms7-2' [K] In this embodiment, for the evaluation of the calculation accuracy, the average errors E1 to E7 for each time step were calculated, and the calculation results were plotted to create a graph. As a result, a graph as shown in FIG. 23 was obtained. The horizontal axis of the graph shown in FIG. 23 is the elapsed time since the molten metal 50 started to be poured into the die 41. 【0251】 As shown in FIG. 23, the average error E1 had the smallest error among all the average errors regardless of the elapsed time. Also, for the average error E1, the error became maximum at the time when the elapsed time was about 11 sec. However, the maximum value of the average error E1 was extremely small, about 3K, and it was found that the first heat transfer coefficient data could be determined with extremely high accuracy according to the method of this embodiment. 【0252】 <Verification of Estimation Results> In this embodiment, the estimated correlation relationship, which is the estimation result of the first estimation unit 34, was verified. Specifically, first, for each of the first upper punch side estimated correlation relationship and the second die side estimated correlation relationship, the second estimated correlation relationship in period II was verified. As a premise, the first estimation unit 34 performed molding for three cases: (iii) when no mold release agent was applied to the inner side surface of the die 41, (iv) when a BN spray was sprayed, and (v) when a black body spray was sprayed. Specifically, for each of the above three cases, the load of the hydraulic press was set to five values of about 3t, about 4t, about 5t, about 6t, and about 7.5t for molding. Then, the above two second estimated correlation relationships were derived. 【0253】 The estimation results of the first estimation unit 34 were obtained in the form of the graphs in Figure 24. As shown in Figure 24, it was found that in all of the cases (iii) to (v) described above, the second estimated correlation could be approximated by a linear function with a positive slope. Furthermore, the slope of this linear function was approximately 3251 in the case of (iii), approximately 1216 in the case of (iv), and approximately 696 in the case of (v). From this, it was found that the slope of the linear function that approximately represents the second estimated correlation changes depending on the presence or absence of a release agent and the type of release agent. It was also found that the slope of this linear function was largest when no release agent was applied to the inner surface of the die 41 (case (iii) described above). 【0254】 Next, the third estimated correlation for period III in the first upper punch side estimated correlation was examined. As a prerequisite, BN spray was applied to the inner side surface of die 41. The first estimation unit 34 also derived the third estimated correlation for each of the four cases where the numerical range of the contact pressure data Fp-1 was different. The estimation results of the first estimation unit 34 were obtained in the form of the graph in Figure 25. Note that the "molten metal surface temperature" on the horizontal axis of this graph represents the temperature at the measurement point Pc1. 【0255】 As shown in Figure 25, the first heat transfer coefficient data h1-1 decreased as the molten metal surface temperature decreased, regardless of the numerical range of the contact pressure data Fp-1. Furthermore, the slope (degree of decrease) of the first heat transfer coefficient data h1-1 increased as the value of the contact pressure data Fp-1 decreased. These findings indicate that the first heat transfer coefficient data is influenced by both the contact pressure data and the molten metal surface temperature. 【0256】 Here, we will give an example of forming using a mold 40 with BN spray applied to the inner side surface of die 41, and setting the load of the hydraulic press to five values: 3.3t, 4.3t, 5.3t, 6.4t, and 7.6t. In this case, in the aforementioned linear function h1-1=a×Fp-1+b×Ts+c, a=approximately 1362.02, b=approximately 3.86, c=approximately -1475.31, and the average error is approximately 3500W / (m 2The third estimated correlation could be approximated by (K). 【0257】 [Summary of the first section] A sensor according to embodiment 1 of the present invention comprises a membrane that comes into contact with a fluid and bends due to the pressing force from the fluid, and a laser displacement meter that projects light onto the membrane and detects the amount of deflection of the membrane by receiving the light reflected from the membrane. 【0258】 The sensor according to embodiment 2 of the present invention may, in embodiment 1, be a molten body filled into a mold, and may detect the pressure value acting at the interface between the metal part of the mold and the molten body filled in the space surrounded by the metal part. 【0259】 In the sensor according to embodiment 3 of the present invention, in embodiment 2, the film may be formed of at least one selected from the group consisting of Mo (molybdenum), Nb (niobium), W (tungsten), Ti (titanium), Zr (zirconium), Ta (tantalum), Ag (silver), Au (gold), Cr (chromium), Co (cobalt), Ni (nickel), Pt (platinum), and carbon fiber. 【0260】 The sensor according to embodiment 4 of the present invention may further include a plurality of temperature measuring units located at different positions from each other, as in embodiment 2 or 3. 【0261】 In the sensor according to embodiment 5 of the present invention, in embodiment 4, the plurality of temperature measuring units may be composed of a first temperature measuring unit located on the molten body side of the film and a second temperature measuring unit located on the mold side of the film. 【0262】 In the sensor according to embodiment 6 of the present invention, in embodiment 4, the plurality of temperature measuring units are composed of a first temperature measuring unit located on the molten body side of the film and a plurality of second temperature measuring units located on the mold side of the film, and the first temperature measuring unit and the plurality of second temperature measuring units may be located on the same axis. 【0263】 A mold according to aspect 7 of the present invention is a mold having a hollow portion into which the fluid is poured, and which is equipped with a plurality of sensors according to aspects 1 to 6. 【0264】 [Second summary] An estimation device according to aspect 11 of the present invention comprises: a first estimation unit that estimates the correlation between the pressure data and the first heat transfer coefficient data using a basic dataset which is associated with pressure data indicating the pressure value acting at the interface between a metal part of a mold and a molten body filled in the space surrounded by the metal part, and first heat transfer coefficient data indicating the first heat transfer coefficient between the metal part and the molten body at the interface; and a second estimation unit that estimates second heat transfer coefficient data indicating the second heat transfer coefficient corresponding to a specific pressure data from a specific pressure data using the estimated correlation which is the correlation estimated by the first estimation unit. 【0265】 According to the above configuration, if the pressure data acting on the interface can be identified, the second heat transfer coefficient data corresponding to the identified pressure can be estimated using the estimated correlation. This makes it easy to estimate the heat transfer coefficient at the interface, and consequently, to easily estimate the temperature distribution of the metal part of the mold and the molten material. 【0266】 In the estimation apparatus according to embodiment 12 of the present invention, in embodiment 11, the first estimation unit may estimate the following as the estimated correlations: a first estimated correlation during the period from when the molten body is filled into the space until a molding pressure for shaping the molten body is applied to the molten body; a second estimated correlation during the period from when the molding pressure is applied to the molten body until the surface temperature of the molten body reaches the solidification temperature of the molten body; and a third estimated correlation after the effect of the molding pressure on the molten body continues and the surface temperature has fallen below the solidification temperature. 【0267】 According to the above configuration, compared to estimating the estimated correlation without considering, for example, at least one of the molding pressure and solidification temperature, it is possible to estimate an estimated correlation that more closely reflects the actual molding of the molten material. This improves the estimation accuracy of the second heat transfer coefficient data using the estimated correlation. 【0268】 In the estimation device according to aspect 13 of the present invention, in aspect 11 or 12, the first estimation unit constructs an estimation model by machine learning using the basic dataset as training data, and the second estimation unit inputs specific pressure data into the estimation model and obtains the second heat transfer coefficient data output from the estimation model to estimate the second heat transfer coefficient data. 【0269】 According to the above configuration, the correlation between contact pressure data and first heat transfer coefficient data can be estimated by machine learning using the basic dataset as training data. Furthermore, second heat transfer coefficient data can be estimated using an estimation model. 【0270】 An estimation device according to embodiment 14 of the present invention may further include, in any of embodiments 11 to 13, a temperature acquisition unit that acquires first temperature data indicating a first temperature value of the metal part and second temperature data indicating a second temperature value of the molten body, and a generation unit that generates the basic data set by determining the first heat transfer coefficient using the first temperature data and the second temperature data acquired by the temperature acquisition unit. 【0271】 According to the above configuration, compared to the case where, for example, the generation unit uses actual values ​​of the first heat transfer coefficient data determined in the past as the first heat transfer coefficient data constituting the basic dataset, the first heat transfer coefficient data constituting the basic dataset will reflect the timely state of the interface. This makes it possible to improve the estimation accuracy of the estimated correlation, and consequently, to improve the estimation accuracy of the second heat transfer coefficient data. 【0272】 The estimation device according to embodiment 15 of the present invention, in embodiment 14, wherein the temperature acquisition unit acquires first temperature data of multiple locations in the metal part and second temperature data of multiple locations in the molten body at regular intervals, and the generation unit calculates multiple estimated temperature data, which are estimated values ​​of the first temperature data at a time when a certain period of time has elapsed from a certain point in time, for each of the multiple locations in the metal part, using the multiple first temperature data and the multiple second temperature data acquired by the temperature acquisition unit at a certain point in time, while changing the value of the first heat transfer coefficient data, and calculates the difference between the estimated temperature data and the first temperature data at a time when a certain period of time has elapsed from a certain point in time for each of the multiple estimated temperature data, and may select the first heat transfer coefficient data constituting the basic dataset from among the multiple first heat transfer coefficient data with varying values ​​using the multiple differences calculated for each of the multiple locations in the metal part. 【0273】 According to the above configuration, the first heat transfer coefficient data constituting the basic dataset can be determined by considering multiple differences calculated for each of multiple locations in the metal part. As a result, the first heat transfer coefficient data constituting the basic dataset not only reflects the timely state of the interface but also accurately reflects the temperature distribution of the metal part. Therefore, the estimation accuracy of the second heat transfer coefficient data can be further improved. 【0274】 A simulation apparatus according to aspect 16 of the present invention comprises an estimation apparatus according to aspect 11, and a behavior estimation apparatus that estimates the solidification behavior of the molten body using the second heat transfer coefficient data estimated by the estimation apparatus. 【0275】 As aspect 17 of the present invention, the estimation device according to each aspect of the present invention may be implemented by a computer. In this case, a control program for the estimation device that enables the computer to implement the estimation device by operating the computer as each part (software element) of the estimation device, and a computer-readable recording medium on which the program is recorded, also fall within the scope of the present invention. 【0276】 A dataset according to aspect 18 of the present invention includes pressure data indicating the pressure value acting at the interface between a metal part of a mold and a molten body filled in the space surrounded by the metal part, first heat transfer coefficient data indicating a first heat transfer coefficient between the metal part and the molten body at the interface, and an estimated correlation relationship obtained by estimating the correlation relationship between the pressure data and the first heat transfer coefficient data, and is used when an estimation device performs estimation processing to estimate a second heat transfer coefficient data indicating a second heat transfer coefficient corresponding to a specific pressure data from a specific pressure data using the estimated correlation relationship. 【0277】 According to the above configuration, the heat transfer coefficient at the interface can be easily estimated using the pressure data, first heat transfer coefficient data, and estimated correlation included in the dataset, and consequently, the temperature distribution of the metal part of the mold and the molten body can be easily estimated. 【0278】 An estimation method according to aspect 19 of the present invention includes: a first estimation step of estimating the correlation between pressure data and first heat transfer coefficient data using a basic dataset to which pressure data indicating the pressure value acting at the interface between a metal part of a mold and a molten body filled in the space surrounded by the metal part and first heat transfer coefficient data indicating the first heat transfer coefficient between the metal part and the molten body at the interface are associated; and a second estimation step of estimating second heat transfer coefficient data indicating the second heat transfer coefficient corresponding to a specific pressure data from a specific pressure data using the estimated correlation between the pressure data and the first heat transfer coefficient data estimated in the first estimation step. [Explanation of Symbols] 【0279】 30 First estimation device (estimation device) 31 Temperature acquisition section 32 Pressure acquisition unit 33 Generation part 34 1st estimation part 35 Second estimation part 40, 40a mold 40X space 41X, 41Xa Metal parts 41Y, 42X holes 41Ya First hole (hole) 41Yb Second hole (hole) 41Yc Third hole (hole) 41 yards, 4th hole (hole) 42 Upper punch (metal part) 43. Lower punch (metal part) 50 Molten metal (molten body) 60. Second Estimation Device (Behavior Estimation Device) 81 Third temperature measurement section (temperature measurement section) 82 Third pressure measuring section (pressure measuring section) 82a membrane 83 Third sensor body (single component) 100, 200, 300 simulation devices hd-1, hpl-1, hpu-1, hd1, hd2, hd3, hd4, hd5 First heat transfer coefficient data HD-2, HPL-2, HPU-2 Second Heat Transfer Coefficient Data Fd-1, Fd1', Fd4', Fp-1 Contact pressure data (pressure data) Fd-2, Fp-2 Estimation Contact Pressure Data (Specific Pressure Data) Si1 1st interface (interface) Si2 second interface (interface) Te1-1', Te4-1', Te1-2', Te4-2', Tm1-1', Tm2-1', Tm3-1', Tm4-1', Tm5-1', Tm6-1', Tm7-1', Tm1-2', Tm2-2', Tm3-2', Tm4-2', Tm5-2', Tm6-2', Tm7-2' Temperature data (first temperature data) Tc1', Tc2', Tc3', Tc4', Tc5', Tc6', Tc7', Td1', Td4' Temperature data (second temperature data) T i、j、k Estimated temperature data

Claims

[Claim 1] A membrane that comes into contact with a fluid and bends due to the pressure exerted by the fluid, A laser displacement meter that projects light onto the aforementioned film and detects the amount of deflection of the film by receiving the light reflected from the film, It comprises multiple temperature measuring units located at different positions from each other. The fluid is a molten body that is filled into the mold. A sensor for detecting the pressure value acting at the interface between the metal part of the mold and the molten body filling the space surrounded by the metal part. [Claim 2] The sensor according to claim 1, wherein the film is formed of at least one selected from the group consisting of Mo (molybdenum), Nb (niobium), W (tungsten), Ti (titanium), Zr (zirconium), Ta (tantalum), Ag (silver), Au (gold), Cr (chromium), Co (cobalt), Ni (nickel), Pt (platinum), and carbon fiber. [Claim 3] Multiple temperature measuring units, A first temperature measuring unit located on the molten body side of the aforementioned film, The sensor according to claim 1, comprising a second temperature measuring unit located on the mold side of the aforementioned membrane. [Claim 4] Multiple temperature measuring units, A first temperature measuring unit located on the molten body side of the aforementioned film, It is composed of a plurality of second temperature measuring units located on the mold side of the aforementioned film, The sensor according to claim 1, wherein the first temperature measuring unit and the plurality of second temperature measuring units are located on the same axis. [Claim 5] A mold comprising a plurality of sensors according to any one of claims 1 to 4, wherein a hollow portion is formed into which the fluid is poured.

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