Building panel materials

The acrylic resin composition addresses FRP's heat resistance and epoxy resin's curing temperature and viscosity issues, providing a low-temperature curing solution for fiber-reinforced building panels with high elastic modulus retention at elevated temperatures.

JP7875580B2Active Publication Date: 2026-06-18KANAZAWA INSTITUTE OF TECHNOLOGY
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
KANAZAWA INSTITUTE OF TECHNOLOGY
Filing Date
2021-10-20
Publication Date
2026-06-18

AI Technical Summary

⚠Technical Problem

Fiber Reinforced Plastics (FRP) have poor heat resistance and limited temperature range for structural use, while high heat-resistant resins like polyimide lack formability and economy, and general-purpose epoxy resins face high curing temperatures and viscosity issues.

⚗Method used

An acrylic resin composition with a polymerizable compound and curing agent, capable of curing at low temperatures, achieving a cured product with a storage modulus retention rate of 20% or more at 250°C compared to 25°C, and suitable for fiber-reinforced building panels.

🎯Benefits of technology

The acrylic resin composition maintains high elastic modulus at elevated temperatures, enabling the production of fiber-reinforced building panels with improved heat resistance and formability, suitable for continuous molding without specialized heating equipment.

✦ Generated by Eureka AI based on patent content.

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Abstract

To form a cured product that does not suffer a significant decrease in elastic modulus even at high temperatures, from an acrylic resin composition that is low in viscosity compared to epoxy resin and the like and can also be cured at low temperatures.SOLUTION: An acrylic resin composition comprises a polymerizable compound comprising at least one monomer mi (1≤i≤N) and a curing agent and gives a cured product with the ratio of a storage modulus at 250°C to that at 25°C being 20% or more.SELECTED DRAWING: Figure 1
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