Ultrasound imaging device and program therefor

Abstract

To provide an ultrasonic video device that can easily display a C-mode image of a desired depth position based on a B-mode image.SOLUTION: An ultrasonic video device 11 can generate an A-mode image G1, a B-mode image G2, and a C-mode image G3 based on transmission and reception of ultrasonic waves to / from an inspection object 1, and simultaneously display them side by side on a display screen 52a. Boundary surface position calculation means 54a calculates depth positions of boundary surfaces K1 and K2 between material layers 2, 3 and 4. Boundary surface visualization means 54b generates marker images L1 and L2 showing the depth positions of the boundary surfaces K1 and K2. The boundary surface visualization method 54b superimposes the marker images L1 on positions corresponding to the depth positions of the boundary surfaces K1 and K2 on the B-mode image G2 to visualize the boundary surfaces K1 and K2.SELECTED DRAWING: Figure 1

Description

【Technical Field】 【0001】 The present invention relates to an ultrasonic imaging device and a program therefor. 【Background Art】 【0002】 Conventionally, an ultrasonic imaging device that visualizes the internal state of an inspection object using ultrasonic waves is well known. In this type of ultrasonic imaging device, various modes of ultrasonic images are generated based on the transmission and reception of ultrasonic waves to the inspection object. These ultrasonic images are usually arranged and simultaneously displayed on a single display screen. For example, in the ultrasonic imaging device described in Patent Document 1, a B-mode image (tomographic image) and a C-mode image (planar image at a predetermined depth) are generated and arranged and simultaneously displayed on the display screen. Also, in the ultrasonic imaging device described in Patent Document 2, an A-mode image (image of a reflection waveform) and a B-mode image are generated and arranged and simultaneously displayed on the display screen. For example, when an inspection object having a structure in which a plurality of material layers are laminated is targeted, the state of the interface between the material layers (such as the presence or absence of peeling) can be detected by using an ultrasonic imaging device. 【Prior Art Documents】 【Patent Documents】 【0003】 【Patent Document 1】 Japanese Patent Application Laid-Open No. 4-328460 【0004】 【Patent Document 2】 Japanese Patent Application Laid-Open No. 2006-322900 【Summary of the Invention】 【Problems to be Solved by the Invention】 【0005】 Incidentally, when obtaining a C-mode image of the interface between material layers, the user of the device needs to locate the target interface while viewing the B-mode image and set a frame-shaped gate on the B-mode image. However, the reflected signals from the inspected object, which tends to be multilayered or thinned, contain many signals, and the necessary signals are easily buried. Therefore, accurately identifying the interface of materials based on the B-mode image has traditionally required practice and experience. Consequently, inexperienced users have difficulty setting the gate appropriately when obtaining the C-mode image, and have been unable to display the C-mode image at the desired depth. 【0006】 The present invention has been made in view of the above problems, and its object is to provide an ultrasonic imaging device and a program therefor that can easily display a C-mode image at a desired depth position based on a B-mode image. [Means for solving the problem] 【0007】 To solve the above problems, the invention described in claim 1 is an ultrasonic imaging device that targets an object to be inspected having a structure in which multiple material layers are stacked, and can simultaneously display A-mode images, B-mode images, and C-mode images generated based on the transmission and reception of ultrasonic waves to the object to be inspected, arranged side by side on a display screen, comprising: an interface position calculation means for calculating the depth position of the interface between the material layers, and a means for indicating the depth position of the interface Color marker line image It generates and Marker line image By superimposing the B-mode image at a position corresponding to the depth position of the interface, an interface visualization means is provided to visualize the interface. The system includes a gate setting display means that sets a gate for obtaining the C-mode image within a predetermined range including the depth position of the interface, generates a gate image representing the setting range of the gate, and superimposes the gate image onto the B-mode image so as to straddle the marker line image. The gist of this invention is an ultrasonic imaging device characterized by being equipped with the following features. 【0008】 Accordingly, according to the invention described in claim 1, the interface position calculation means calculates the depth position of the interface between material layers, and based on the calculation result, the interface visualization means generates a marker image indicating the depth position of the interface and superimposes it on the B-mode image. As a result, the interfaces of multiple material layers are visualized and become easier to distinguish. Therefore, even without experience or familiarity, a C-mode image at a desired depth position can be displayed, and ultrasonic image analysis can be performed easily and accurately. 【0009】 The invention described in claim 2 is characterized in that, in claim 1, the interface position calculation means calculates the depth position of the interface based on position information of the object surface obtained by transmitting and receiving ultrasonic waves to and from the object to be inspected, and information on the thickness and physical properties of each material layer. 【0010】 The invention described in claim 3 is characterized in that, in claim 2, the time required for the ultrasonic waves to pass through the material layer starting from the surface of the object is determined, and the depth position of the interface is calculated from the determined time required for passage, the thickness of the material layer, and the speed of sound. 【0013】 Claim 4 The invention described herein is a program for operating an ultrasonic imaging device that targets an object to be inspected having a structure in which multiple material layers are stacked, and which can simultaneously display A-mode images, B-mode images, and C-mode images generated based on the transmission and reception of ultrasonic waves to the object to be inspected, side by side on a display screen, the program comprising a processor, a boundary surface position calculation step for calculating the depth position of the boundary surface between the material layers, and indicating the depth position of the boundary surface Color marker line image Markers that generate line Image generation step and the generated marker line A marker superimposed on the B-mode image at a position corresponding to the depth position of the interface. line Image superposition step and The gate image generation step involves setting a gate for obtaining the C-mode image in a predetermined range including the depth position of the interface surface and generating a gate image representing the setting range of the gate; and the gate image superposition step involves superimposing the generated gate image onto the B-mode image so as to straddle the marker line image. The program to execute it is the essence of this. 【0014】 Therefore, claim 4According to the invention described above, after the depth position of the interface between material layers is calculated in the interface position calculation step, a marker image indicating the depth position of the interface is generated and superimposed on the B-mode image in the marker image generation and superimposition step. As a result, the interfaces of multiple material layers are visualized and made easier to distinguish. Therefore, even without experience or familiarity, a C-mode image at the desired depth position can be displayed, and image analysis can be performed easily and accurately. 【0015】 Claim 5 The invention described in the claim 4 In this context, the interface position calculation step includes a surface information acquisition step of acquiring positional information of the object surface by transmitting and receiving ultrasonic waves to and from the object to be inspected, a material layer information acquisition step of acquiring information on the thickness and physical properties of each material layer, and a depth position calculation step of calculating the depth position of the interface based on the information acquired by the surface information acquisition step and the material layer information acquisition step. 【0016】 Claim 6 The invention described in the claim 5 In the depth position calculation step, the gist of the procedure is to determine the time required for the ultrasonic waves to pass through the material layer starting from the surface of the object, and then calculate the depth position of the interface from the determined time required for passage, the thickness of the material layer, and the speed of sound. [Effects of the Invention] 【0017】 As detailed above, claims 1 to 6 According to the invention described above, a C-mode image at a desired depth position can be easily displayed based on a B-mode image. [Brief explanation of the drawing] 【0018】 [Figure 1] A schematic diagram showing an ultrasonic imaging device according to an embodiment of the present invention. [Figure 2] A block diagram showing the electrical configuration of the ultrasonic imaging device of the embodiment. [Figure 3] A photograph showing the display screen of the ultrasonic imaging device according to the embodiment. [Figure 4] A flowchart for explaining the operation of the ultrasonic imaging device according to the embodiment. [Figure 5] A flowchart for explaining the operation of the ultrasonic imaging device according to the embodiment. [Figure 6] A flowchart for explaining the operation of the ultrasonic imaging device according to the embodiment. [Figure 7] A photograph showing the B-mode image displayed on the display device. [Figure 8] A photograph showing the B-mode image displayed on the display device. [Figure 9] A photograph showing the B-mode image displayed on the display device. [Figure 10] A photograph showing the B-mode image displayed on the display device. 【Best Mode for Carrying Out the Invention】 【0019】 Hereinafter, the ultrasonic flaw detection imaging device (SAT) 11 according to an embodiment of the present invention will be described in detail based on FIGS. 1 to 10. 【0020】 FIG. 1 is a schematic configuration diagram showing the ultrasonic flaw detection imaging device 11 according to the embodiment. As shown in FIG. 1, the ultrasonic flaw detection imaging device 11 according to the present embodiment is a device for visualizing and non-destructively observing the internal state of the inspection object 1 using ultrasonic waves, and is composed of a scanner unit 21 and a PC (personal computer) 51. In FIG. 1, a PC 51 with an integrated main body and display is shown, but of course, the device may be configured using a PC 51 with a separate main body and display. 【0021】 The scanner unit 21 includes a base 22, a water tank 5, a moving mechanism 30, an ultrasonic probe 27, etc. The water tank 5 is supported in the center of the upper surface of the flat base 22. The water tank 5 contains an ultrasonic transmission medium W1 such as water, and the object to be inspected 1 is immersed in it. In this embodiment, the object to be inspected 1 is a laminate having a structure in which multiple material layers 2, 3, and 4 are stacked. Examples of the object to be inspected 1 include semiconductors (resin packages, ceramic packages, IC chips, lead frames, etc.). This ultrasonic flaw detection imaging device 11 detects delamination (interlayer delamination), cracks, voids, etc. at the interface surfaces K1 and K2 in the multiple material layers 2, 3, and 4. Of course, it is also possible to detect delamination of interface surfaces K1 and K2 in products other than semiconductors, such as ceramic products, metal welded products, and brazed products. 【0022】 A moving mechanism 30 is installed on the base 22. A pair of rails 26 extending along the Y-axis are laid on both the left and right sides of the water tank 5. A Y-axis moving mechanism 24 is guided and supported on the pair of rails 26 so as to be movable in the Y-axis direction. The Y-axis moving mechanism 24 supports a Z-axis moving mechanism 25, which is formed in a roughly U-shape, so as to be movable in the Z-axis direction. The Z-axis moving mechanism 25 supports an X-axis moving mechanism 23 so as to be movable in the X-axis direction. The X-axis moving mechanism 23 is configured to be located above the water tank 5, and an ultrasonic probe 27 is attached downwards to the lower surface of the X-axis moving mechanism 23. 【0023】 The ultrasonic probe 27 is equipped with an ultrasonic transducer 28, which is made of a piezoelectric element, at its lower end. A rod 29 is connected to the lower surface of the ultrasonic transducer 28. The tip of the rod 29 is immersed in the ultrasonic transmission medium W1 while positioned directly above the object to be inspected 1. The ultrasonic waves emitted by the ultrasonic transducer 28 are transmitted to the object to be inspected 1 via the rod 29 and the ultrasonic transmission medium W1. 【0024】 The ultrasonic transducer 28 consists of a piezoelectric element and generates ultrasonic waves in the range of approximately 10 MHz to 140 MHz (50 MHz in this embodiment). The ultrasonic transducer 28 irradiates (transmits) the generated ultrasonic waves toward the object to be inspected 1, and then receives the reflected waves that return from the object to be inspected 1. 【0025】 Figure 2 is a block diagram showing the electrical configuration of the ultrasonic flaw detection imaging device 11 according to this embodiment. 【0026】 As shown in Figure 2, the scanner unit 21 includes an ultrasonic probe 27, a moving mechanism 30, a pulse generation circuit 31, a transmit / receive separation circuit 33, a receiving circuit 34, a detection circuit 35, an A / D conversion circuit 36, an I / F circuit 37, a controller 39, an encoder 40, and the like. 【0027】 As described above, the moving mechanism 30 includes an X-axis moving mechanism 23, a Y-axis moving mechanism 24, and a Z-axis moving mechanism 25, and in particular, the X-axis moving mechanism 23 and the Y-axis moving mechanism 24 perform two-dimensional scanning in the XY plane. These mechanisms have motors 41, 42, and 43 that provide driving force for movement in their respective axes. For example, stepping motors or linear motors can be used as these motors 41, 42, and 43. A controller 39 is electrically connected to each of the motors 41, 42, and 43, and the motors 41, 42, and 43 are driven in response to the drive signals of the controller 39. 【0028】 In this embodiment, an encoder 40 is provided corresponding to the X-axis movement mechanism 23, and the scanning position of the X-axis movement mechanism 23 is detected by the encoder 40. Specifically, if the scanning range is divided into 300 x 300 measurement points, one scan in the X-axis direction is divided into 300 sections. The position of each measurement point is then detected by the encoder 40 and input to the PC 51. The PC 51 generates a drive control signal in synchronization with the output of the encoder 40 and supplies this drive control signal to the CPU 54. The CPU 54 drives the motor 41 based on this drive control signal. The CPU 54 also drives the motor 42 when scanning one line in the X-axis direction is completed based on the output signal of the encoder 40, moving the Y-axis movement mechanism 24 one unit in the Y-axis direction. 【0029】 The CPU 54 generates a trigger signal in synchronization with the drive control signal and supplies it to the pulse generation circuit 38. As a result, the pulse generation circuit 38 generates an excitation pulse at a timing synchronized with the trigger signal. This excitation pulse is supplied to the ultrasonic transducer 28 via the transmit / receive separation circuit 33, resulting in the transmission of ultrasound from the ultrasonic transducer 28. 【0030】 Since the ultrasonic transducer 28 is a transmitter and receiver, it receives the reflected ultrasonic waves from the object under inspection 1 and converts them into electrical signals. These reflected wave signals are then supplied to the receiving circuit 34 via the transmitter / receiver separation circuit 33. The receiving circuit 34 includes a signal amplification circuit, which amplifies the reflected wave signals and outputs them to the detection circuit 35. 【0031】 The detection circuit 35 is a circuit for detecting the reflected wave signal from the object under inspection 1, and is configured to include a gate circuit (not shown). In this embodiment, the detection circuit 35 extracts only the necessary signal from the reflected wave signal received by the ultrasonic transducer 28. The reflected wave signal extracted by the detection circuit 35 is then supplied to the A / D conversion circuit 36, where it is A / D converted and then input to the I / F circuit 37. The I / F circuit 37 is an interface for exchanging signals with the PC 51. The digitized reflected wave signal is transferred to the PC 51 via the I / F circuit 37. The controller 39 and encoder 40 are also electrically connected to the I / F circuit 37, and their output signals are transferred to the PC 51 via the I / F circuit 37. 【0032】 The PC51 includes a display device 52, an I / F circuit 53, a CPU 54 (central processing unit), a memory 55, a storage device 56, and an input device 57, which are connected to each other via a bus 58 so that they can communicate with one another. 【0033】 The CPU 54 executes control programs using the memory 55 and comprehensively controls the entire system. The control programs include programs for controlling two-dimensional scanning by the moving mechanism 30, and programs for generating and displaying images in modes A, B, and C. In addition to the CPU 54, a separate DSP (Digital Signal Processor) may be provided to perform some of the signal processing that the CPU 54 performs. 【0034】 The I / F circuit 53 is an interface for exchanging signals with the scanner unit 21. The I / F circuit 53 plays the role of outputting control signals (drive control signals to the controller 39) to the ultrasonic transducer 28 and inputting transfer data from the ultrasonic transducer 28. When exchanging signals with the ultrasonic transducer 28, the interface is not limited to the physical interface described above, and a wireless interface may also be used. 【0035】 The display device 52 is, for example, a monitor display such as a liquid crystal, plasma, or organic EL (electroluminescence) display. The display device 52 can be used regardless of whether it is a color display or a monochrome display, but a color display is preferable. This display device 52 is a device that can simultaneously display A-mode image G1, B-mode image G2, and C-mode image G3, which are generated based on the transmission and reception of ultrasound to the object to be inspected 1, on the display screen 52a. As shown in Figures 1 and 3, in this embodiment, the A-mode image G1 is placed on the left side of the screen, the B-mode image G2 is placed in the center of the screen, and the C-mode image G3 is placed on the right side of the screen. 【0036】 Here, the A-mode image G1 (A-scope image) is a waveform image representing the received sound pressure and ultrasonic propagation time at the ultrasonic transducer 28 in rectangular coordinates. The A-mode has the advantage of making it easy to understand the reflected sound pressure of the abnormality site within the object being inspected 1 and the depth of the object being inspected 1 from the object surface 60. 【0037】 The B-mode image G2 (B-scope image) is a tomographic image in which the A-mode waveform is represented as a line by brightness modulation, and the position of the ultrasonic transducer 28 on the object 1 under inspection in the X-axis direction (one dimension) and the sound wave propagation time are represented in rectangular coordinates. B-mode displays the distribution, presence, and depth of abnormality locations under the scan line, making it easy to intuitively grasp the internal structure in the depth direction. 【0038】 The C-mode image G3 (C-scope image) is a planar image representing the predetermined depth positions (two-dimensional) in the X-axis and Y-axis directions of the object 1 inspected by the ultrasonic transducer 28, using rectangular coordinates. A key feature of the C-mode image is that it makes it easier to understand the planar distribution of the abnormality. The C-mode image G3 is displayed based on a pre-set gate range. By changing the gate depth position, it is possible to understand the depth-direction changes in the abnormality area. 【0039】 The input device 57 is an input user interface such as a touch panel, mouse, keyboard, or pointing device, and is used for inputting requests, instructions, and parameters from the user. 【0040】 The storage device 56 is an HDD (hard disk drive) or SSD (solid state drive), such as a magnetic disk drive or optical disk drive, and stores various control programs and various data. The memory 55 includes RAM (random access memory) and ROM (read-only memory) and temporarily stores reflected waveforms acquired in advance for ultrasound image generation, as well as various calculation results based on them. The CPU 54 transfers programs and data from the storage device 56 to the memory 55 according to instructions from the input device 57 and executes them sequentially. The programs executed by the CPU 54 may be programs stored on storage media such as memory cards, flexible disks, or optical disks, or programs downloaded via communication media, and are installed and used in the storage device 56 when they are executed. 【0041】 In this embodiment, the CPU 54 functions as an interface position calculation means 54a, an interface visualization means 54b, and an automatic gate setting display means 54c. The interface position calculation means 54a calculates the depth positions of the interface surfaces K1 and K2 between the material layers 2, 3, and 4. The interface visualization means 54b generates marker images indicating the depth positions of the interface surfaces K1 and K2. The interface visualization means 54b further visualizes the interface surfaces K1 and K2 by superimposing these marker images onto the B-mode image G2 at positions corresponding to the depth positions of the interface surfaces K1 and K2. In this embodiment, the interface visualization means 54b generates color marker line images L1 and L2 as the marker images. The automatic gate setting display means 54c sets a gate to obtain a C-mode image G3 within a predetermined range including the depth positions of the interface surfaces K1 and K2, and generates gate images 61 and 62 representing the gate setting range. Furthermore, the gate automatic setting display means 54c superimposes the gate images 61 and 62 on the B-mode image G2 so as to span across the marker line images L1 and L2. 【0042】 Next, the calculation process performed by the CPU 54, which is the processor, in the ultrasonic flaw detection imaging device 11 of this embodiment will be explained using the flowcharts in Figures 4 to 6. 【0043】 As a prerequisite, information regarding the thickness and physical properties of each material layer 2 and 3 of the object to be inspected 1 is stored in memory 55 beforehand. For example, if the first material layer 2 consists of a known metal A and the second material layer 3 consists of a known metal B, the thickness of metal A (mm), the speed of sound of ultrasonic waves traveling through metal A (mm / sec), the thickness of metal B (mm), and the speed of sound of ultrasonic waves traveling through metal B (mm / sec) are stored. These are all known parameters. The input of known parameters may be done by the user themselves or automatically by a predetermined program. 【0044】 First, the CPU 54 drives the scanner unit 21 to perform an initial operation of scanning the object to be inspected 1 in two directions, the X and Y axes, while transmitting and receiving ultrasonic waves (step S100). Next, the CPU 54 moves to step S110 to determine whether the two-dimensional scan is complete or not. If it is determined that the scan is not complete (step S110:N), the CPU 54 returns to step S100 and continues to have the scanner unit 21 perform the scan. If it is determined that the scan is complete (step S110:Y), the CPU 54 moves to step S116 to generate the A-mode image G1 and the B-mode image G2, and then moves to step S118 to display the A-mode image G1 and the B-mode image G2 on the display screen 52a. Figure 7 shows an example of the B-mode image G2 at this time. After that, the CPU 54 moves to step S120 to perform a predetermined interface position calculation process. 【0045】 In the interface position calculation process, first, position information of the object surface 60 is acquired based on the results of the transmission and reception of ultrasound to the object 1 that was performed earlier (step S122). Specifically, the first relatively large pulse that appears after a predetermined time has elapsed since the transmission pulse is the reflected wave from the object surface 60, so that point is defined as the position of the object surface 60. At this time, some kind of identification image indicating that it is the object surface 60 may be generated and superimposed on the part of the object surface 60 in the B-mode image G2. After executing the surface information acquisition step, the CPU 54 moves on to step S124 and executes the material layer information acquisition step. In the material layer information acquisition step, the CPU 54 reads and acquires information on the thickness and physical properties (i.e., sound velocity) of each material layer 2 and 3 from the memory 55. Next, the CPU 54 moves on to step S126 and executes the depth position calculation step. In the depth position calculation step, the CPU 54 calculates the depth position of the interface K1 between material layers 2 and 3 based on the information obtained in the surface information acquisition step and the material layer information acquisition step. Specifically, it determines the time required for the ultrasonic waves to pass through the first material layer 2 starting from the surface 60 of the object, and calculates the depth position of the interface K1 between the first material layer 2 and the second material layer 3 (referred to as "first interface K1" for convenience) from the determined passage time, the thickness of the first material layer 2, and the speed of sound. The same procedure is applied even if a third material layer 4 exists below the second material layer 3. That is, it determines the time required for the ultrasonic waves to pass through the first material layer 2 and the time required for them to pass through the second material layer 3, starting from the surface 60 of the object. Then, using the two calculated transit times, the thickness and sound velocity of the first material layer 2, and the thickness and sound velocity of the second material layer 3, the depth position of the interface K2 between the second material layer 3 and the third material layer 4 (referred to as "second interface K2" for convenience) is calculated. 【0046】 Next, the CPU 54 proceeds to step S130 to execute the marker image generation step and generates marker images indicating the depth positions of the interface surfaces K1 and K2. In this embodiment, color marker line images L1 and L2 are generated as marker images. Next, the CPU 54 proceeds to step S140 to execute the marker image superposition step. That is, the previously generated marker line images L1 and L2 are superimposed on the B-mode image G2 at positions corresponding to the depth positions of the interface surfaces K1 and K2, respectively. Figure 8 shows an example of the B-mode image G2 at this time. In the figure, the state in which the marker line image L1 is superimposed on the first interface surface K1 is shown. 【0047】 Next, the CPU 54 proceeds to step S150 to calculate and set the gate for obtaining the C-mode image G3. At this time, the gate range is automatically set based on predetermined conditions. Specifically, the gate range is automatically set to be a predetermined range that includes the depth position of the boundary surface K1 (for example, a range of ±0.01 mm in the depth direction with respect to the said depth position). 【0048】 Next, the CPU 54 proceeds to step S160 to generate rectangular gate images 61 and 62, and then proceeds to step S170 to superimpose and display the gate images 61 and 62 on the B-mode image G2 of the display screen 52a. Figure 9 shows an example of the B-mode image G2 at this time. In this figure, the gate image 61 is superimposed and displayed so as to straddle the marker line image L1 corresponding to the first boundary surface K1. Figure 10 shows another example of the B-mode image G2 at this time. In this figure, the gate image 61 is superimposed and displayed so as to straddle the marker line image L1 corresponding to the first boundary surface K1, and the gate image 62 is superimposed and displayed so as to straddle the marker line image L2 corresponding to the second boundary surface K2. It is preferable that the gate images 61 and 62 are color images. The colors of the gate images 61 and 62 may be the same as the above-mentioned marker line images L1 and L2, or they may be different colors. Furthermore, if there are multiple gate images 61 and 62, they may be displayed in the same color or in different colors. 【0049】 Next, the CPU 54 proceeds to step S180 to determine whether there are multiple gates currently displayed after automatic setup. If it determines that there are not multiple gates, the CPU 54 skips steps S190 and S200 and proceeds to step S210 (step S180:N). If it determines that there are multiple gates, the CPU 54 proceeds to step S190 to display text or other prompts on the display screen 52a to select one of the multiple gates (step S180:Y). The user operates the input device 57 in response to the display of such text or other prompts and selects one gate. Next, the CPU 54 proceeds to step S200 to determine whether one gate has already been selected. If one gate has not been selected, the CPU 54 returns to step S190 (step S200:N), and if one gate has been selected, it proceeds to step S210 (step S200:Y). 【0050】 Next, the CPU 54 moves to step S210, where it displays text or other prompts to the user asking whether the position of the selected gate is acceptable, and makes a determination based on the user's response. If it determines that the gate position is acceptable (i.e., no position change is necessary), the CPU 54 skips steps S220-S240 and moves to step S250 (step S210:Y). If it determines that the gate position is not acceptable (i.e., a position change is necessary), the CPU 54 moves to step S220, where it displays text or other prompts on the display screen 52a to change the gate position (step S210:N). The user operates the input device 57 in response to such text or other prompts to change the gate position as appropriate in the vertical direction of the screen. Next, the CPU 54 moves to step S230, where it determines whether the gate position has already been changed. If it determines that the gate position has already been changed, the CPU 54 moves to step S240 (step S230:Y). If it is determined that the gate position has not been changed, the CPU 54 returns to step S220 and prompts the system to change the gate position again (step S230:N). 【0051】 In step S240, the CPU 54 displays text or other prompts to the user asking whether the gate position is correct, and makes a decision based on the user's response. If it determines that the gate position is incorrect, the CPU 54 returns to step S220 and prompts the user to change the gate position again (step S240:N). If it determines that the gate position is correct, the CPU 54 proceeds to step S250 (step S240:Y). The CPU 54 then generates a C-mode image of the gate setting range (step S250), and displays the generated C-mode image on the display screen (step S260). 【0052】 Therefore, according to this embodiment, the following effects can be obtained. 【0053】 (1) In the ultrasonic flaw detection imaging device 11 of this embodiment, A-mode image G1, B-mode image G2, and C-mode image G3 are generated based on the transmission and reception of ultrasonic waves to the object to be inspected 1, and these images G1 to G3 can be displayed side by side on the display screen 52a simultaneously. This ultrasonic flaw detection imaging device 11 is characterized by comprising an interface position calculation means 54a and an interface visualization means 54b. With this configuration, the interface position calculation means 54a calculates the depth positions of the interface surfaces K1 and K2 between the material layers 2, 3, and 4, and based on the calculation result, the interface visualization means 54b generates marker images L1 and L2 indicating the depth positions of the interface surfaces K1 and K2 and superimposes them on the B-mode image G2. As a result, the interface surfaces K1 and K2 of multiple material layers 2, 3, and 4 are visualized and made easier to distinguish. For this reason, even without experience or familiarity, the C-mode image G3 at the desired depth position can be displayed, and ultrasonic image analysis can be performed easily and accurately. For example, in this embodiment, abnormalities (such as delamination, cracks, and voids) that are likely to occur at the interface surfaces K1 and K2 of the semiconductor object 1 can be detected with high accuracy. Therefore, it is possible to provide an apparatus suitable for inspecting defective products during semiconductor manufacturing. 【0054】 (2) In this embodiment, the CPU 54, which functions as an interface position calculation means 54a, calculates the depth positions of the interface surfaces K1 and K2 based on the position information of the object surface 60 obtained by transmitting and receiving ultrasonic waves to and from the object to be inspected 1, and information on the thickness and physical properties of each material layer 2, 3, and 4. In particular, it determines the time required for the ultrasonic waves to pass through the material layers 2 and 3 starting from the object surface 60, and calculates the depth positions of the interface surfaces K1 and K2 from the determined time required for passage, the thickness of the material layers 2 and 3, and the speed of sound. With this configuration, the depth positions of the interface surfaces K1 and K2 can be calculated easily and accurately. 【0055】 (3) In this embodiment, the CPU 54, which functions as an interface visualization means 54b, generates color marker line images L1 and L2 that indicate the depth positions of the interface surfaces K1 and K2. Therefore, when superimposed on the B-mode image G2, which is basically displayed in monochrome, the marker line images L1 and L2 can be made easy to see. Also, because they are line-shaped images, the interface surfaces K1 and K2 are colored along their respective depth positions. Thus, there is an advantage in that the presence of the interface surfaces K1 and K2 can be easily grasped intuitively. 【0056】 (4) The ultrasonic flaw detection imaging device 11 of this embodiment is further characterized by being equipped with an automatic gate setting display means 54c. With this configuration, the CPU 54, which functions as the automatic gate setting display means 54c, sets a gate for obtaining a C-mode image G3 in a predetermined range including the depth position of the interface surfaces K1 and K2. It then generates gate images 61 and 62 that represent the setting range of the gate, and superimposes the gate images 61 and 62 on the B-mode image G2 so as to span the marker line images L1 and L2. With this configuration, the gate setting work that previously had to be performed by the user is automated to a considerable extent. Therefore, it is possible to appropriately set the gate when obtaining the C-mode image G3 regardless of familiarity or experience. Thus, it is possible to easily and reliably display the C-mode image G3 at the desired depth position. 【0057】 The above embodiment may be modified as follows. 【0058】 In the above embodiment, the A-mode image G1 was placed on the left side of the screen, the B-mode image G2 in the center of the screen, and the C-mode image G3 on the right side of the screen. However, the three images may be arranged in a different configuration. Also, in the above embodiment, the three images were displayed side by side on the same display screen 52a of one display device 52. However, two display devices 52 may be used. In this case, the A-mode image G1 and the B-mode image G2 may be displayed on one display device 52, while the C-mode image G3 is displayed on the other display device 52 at the same time. 【0059】 In the above embodiment, the CPU 54, which is a processor, was made to function as a boundary surface position calculation means 54a, a boundary surface visualization means 54b, and a gate automatic setting display means 54c by a predetermined program, but the embodiment is not limited to this. For example, the circuit that functions as the boundary surface position calculation means 54a, the circuit that functions as the boundary surface visualization means 54b, and the circuit that functions as the gate automatic setting display means 54c may be provided separately. 【0060】 In the above embodiment, color marker line images L1 and L2 were used as marker images indicating the depth positions of the interface surfaces K1 and K2, but the embodiment is not limited to this. For example, a marker image that is not in the shape of a continuous line may be used, such as a marker image in which multiple dots are arranged in a row along the interface surfaces K1 and K2. Alternatively, an arrow image indicating the depth positions of the interface surfaces K1 and K2 may be used as the marker image. Text information may also be added near these marker images. 【0061】 In the above embodiment, rectangular frame-shaped gate images 61 and 62 representing the gate setting range for obtaining the C-mode image G3 are generated and superimposed, but the embodiment is not limited to this. For example, if the gate setting range is easy to understand, the gate images 61 and 62 do not have to be rectangular frame-shaped and may have other shapes. 【0062】 In the above embodiment, marker images indicating the depth positions of the interface surfaces K1 and K2 were superimposed only on the B-mode image G2, but for example, similar marker images may also be superimposed on the A-mode image G1. 【0063】 In the above embodiment, the boundary surface position calculation process was performed after the completion of the two-dimensional scan with the A-mode image G1 and B-mode image G2 generated and displayed (see steps S110 to S120 in Figure 4), but this is not limited to this. For example, the boundary surface position calculation process may be performed after the completion of the two-dimensional scan with only the B-mode image G2 generated and displayed. [Explanation of symbols] 【0064】 1…Object to be inspected 2, 3, 4…material layer 11. Ultrasonic flaw detection imaging device as an ultrasonic imaging device 52a...Display screen 54a...Boundary surface position calculation means 54b…Boundary surface visualization means 54c...Gate automatic setting display means 60… Surface of the object 61, 62... Gate images G1...A-mode image G2...B-mode image G3...C-mode image K1, K2…boundary surface L1, L2... Marker line images as marker images

Claims

[Claim 1] An ultrasonic imaging device capable of simultaneously displaying A-mode, B-mode, and C-mode images on a display screen, generated based on the transmission and reception of ultrasonic waves to an object having a structure in which multiple material layers are stacked, A boundary surface position calculation means for calculating the depth position of the boundary surface between the material layers, A boundary surface visualization means that generates a color marker line image indicating the depth position of the boundary surface, and superimposes the marker line image onto the B-mode image at a position corresponding to the depth position of the boundary surface, thereby visualizing the boundary surface. A gate automatic setting display means sets a gate for obtaining the C-mode image in a predetermined range including the depth position of the interface, generates a gate image representing the setting range of the gate, and superimposes the gate image on the B-mode image so as to straddle the marker line image. An ultrasonic imaging device characterized by having the following features. [Claim 2] The ultrasonic imaging apparatus according to claim 1, wherein the interface position calculation means calculates the depth position of the interface based on position information of the object surface obtained by transmitting and receiving ultrasonic waves to the object to be inspected, and information on the thickness and physical properties of each material layer. [Claim 3] The ultrasonic imaging device according to claim 2, characterized in that the time required for the ultrasonic waves to pass through the material layer starting from the surface of the object is determined, and the depth position of the interface is calculated from the determined time required for passage, the thickness of the material layer, and the speed of sound. [Claim 4] A program for operating an ultrasonic imaging device that targets an object having a structure of multiple material layers and can simultaneously display A-mode, B-mode, and C-mode images generated based on the transmission and reception of ultrasonic waves to the object on a display screen, wherein the processor... A boundary surface position calculation step for calculating the depth position of the boundary surface between the material layers, A marker line image generation step generates a color marker line image that indicates the depth position of the interface surface, A marker line image superposition step in which the generated marker line image is superimposed on the B-mode image at a position corresponding to the depth position of the interface surface, A gate image generation step includes setting a gate for obtaining the C-mode image in a predetermined range including the depth position of the interface surface, and generating a gate image representing the set range of the gate, A gate image superposition step in which the generated gate image is superimposed on the B-mode image so as to span the marker line image, A program to execute. [Claim 5] The boundary surface position calculation step is: A surface information acquisition step in which positional information of the object surface is acquired by transmitting and receiving ultrasonic waves to and from the object to be inspected, A material layer information acquisition step, which acquires information regarding the thickness and physical properties of each material layer, A depth position calculation step, which calculates the depth position of the interface surface based on the information obtained in the surface information acquisition step and the material layer information acquisition step, including The program according to feature 4. [Claim 6] The program according to claim 5, characterized in that the depth position calculation step determines the time required for the ultrasonic waves to pass through the material layer starting from the surface of the object, and calculates the depth position of the interface from the determined time required for passage, the thickness of the material layer, and the speed of sound.

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