Substrate processing equipment

Abstract

To provide a substrate processing apparatus having a small length in the vertical direction.SOLUTION: A substrate processing apparatus 1 includes a substrate holding unit 41, a cup 51, a brush 61, a motor 81, and an arm 71. The substrate holding unit 41 holds a substrate W in a horizontal position. The cup 51 is arranged on the lateral side of the substrate holding unit 41. The motor 81 rotates the brush 61. The arm 71 supports the brush 61 and the motor 81. The arm 71 moves the brush 61 and the motor 81. When the arm 71 places the brush 61 at a processing position Qa, the brush 61 comes into contact with the substrate W held by the substrate holding unit 41. When the arm 71 places the brush 61 at the processing position Qa, at least a portion of the motor 81 is placed at a position lower than an upper edge 52 of the cup 51.SELECTED DRAWING: Figure 3

Description

【Technical Field】 【0001】 The present invention relates to a substrate processing apparatus. The substrate is, for example, a semiconductor wafer, a substrate for a liquid crystal display, a substrate for an organic EL (Electroluminescence), a substrate for a FPD (Flat Panel Display), a substrate for an optical display, a substrate for a magnetic disk, a substrate for an optical disk, a substrate for a magneto-optical disk, a substrate for a photomask, or a substrate for a solar cell. 【Background Art】 【0002】 Patent Document 1 discloses a substrate processing apparatus for processing a substrate. The substrate processing apparatus of Patent Document 1 includes a substrate holding unit, a cup, a brush, a motor, and an arm. The substrate holding unit holds the substrate in a horizontal posture. The cup is disposed on the side of the substrate holding unit. The motor rotates the brush. The arm supports the brush and the motor. The arm moves the brush and the motor. The arm positions the brush at the processing position. When the arm positions the brush at the processing position, the brush contacts the substrate held by the substrate holding unit. 【Prior Art Documents】 【Patent Documents】 【0003】 【Patent Document 1】 Japanese Patent Application Laid-Open No. 8-243518 【Summary of the Invention】 【Problems to be Solved by the Invention】 【0004】 In a conventional substrate processing apparatus, the arm supports the motor upward. Therefore, the arm is large. Specifically, the length of the arm in the vertical direction is large. Thus, the substrate processing apparatus is large. Specifically, the substrate processing apparatus is tall. The length of the substrate processing apparatus in the vertical direction is large. 【0005】 Made in view of these circumstances, the present invention aims to provide a substrate processing apparatus having a short length in the vertical direction. [Means for solving the problem] 【0006】 To achieve this objective, the present invention has the following configuration. That is, the present invention is a substrate processing apparatus comprising a substrate holding part for holding a substrate in a horizontal position, a cup disposed to the side of the substrate holding part, a brush, a motor for rotating the brush, an arm that supports the brush and the motor and moves the brush and the motor, and when the arm positions the brush in a processing position, the brush is in contact with the substrate held by the substrate holding part, and at least a part of the motor is positioned lower than the upper edge of the cup. 【0007】 The substrate processing apparatus comprises a substrate holder, a cup, brushes, a motor, and an arm. The substrate holder holds the substrate in a horizontal position. The cup is positioned to the side of the substrate holder. The motor rotates the brushes. The arm supports the brushes and the motor. The arm moves the brushes and the motor. The arm positions the brushes in the processing position. When the arm positions the brushes in the processing position, the brushes come into contact with the substrate held in the substrate holder. When the arm positions the brushes in the processing position, at least a portion of the motor is positioned lower than the upper edge of the cup. Therefore, the arm is positioned relatively low relative to the cup. Thus, the length of the substrate processing apparatus in the vertical direction is reduced. 【0008】 As described above, the length of the substrate processing apparatus in the vertical direction is short. 【0009】 In the substrate processing apparatus described above, when the arm positions the brush at the processing position, it is preferable that the motor is positioned such that its lower end is lower than the upper edge of the cup and its upper end is higher than the upper edge of the cup. When the arm positions the brush at the processing position, the motor is positioned such that its upper end is higher than the upper edge of the cup. Therefore, even when the arm positions the brush at the processing position, it is easy for the arm to support the motor. 【0010】 In the substrate processing apparatus described above, when the arm positions the brush at the processing position, it is preferable that at least a portion of the motor overlaps with the cup in a plan view. In other words, when the brush contacts the substrate held by the substrate holding portion, at least a portion of the motor overlaps with the cup positioned to the side of the substrate holding portion in a plan view. For this reason, the motor is positioned close to the brush. Thus, the motor rotates the brush effectively. 【0011】 In the substrate processing apparatus described above, the cup comprises a vertical portion having a cylindrical shape erected vertically, and an inclined portion that slopes upward and inward from the vertical portion, and it is preferable that at least a part of the motor overlaps with the inclined portion in a plan view when the arm positions the brush at the processing position. Therefore, when the arm positions the brush at the processing position, at least a part of the motor is positioned above the inclined portion. Thus, when the arm positions the brush at the processing position, at least a part of the motor is preferably positioned lower than the upper edge of the cup. 【0012】 In the substrate processing apparatus described above, when the arm positions the brush at the processing position, it is preferable that the entire motor is positioned higher than the vertical portion, and at least a portion of the motor is positioned at the same height as the inclined portion. When the arm positions the brush at the processing position, the entire motor is positioned higher than the vertical portion. Therefore, even when the arm positions the brush at the processing position, interference between the motor and the vertical portion is prevented. When the arm positions the brush at the processing position, at least a portion of the motor is positioned at the same height as the inclined portion. Therefore, when the arm positions the brush at the processing position, at least a portion of the motor is preferably positioned lower than the upper edge of the cup. 【0013】 In the substrate processing apparatus described above, it is preferable that when the arm positions the brush at the processing position, the brush is positioned inside the cup, and when the arm positions the brush at the processing position, the motor is positioned outside the cup. When the arm positions the brush at the processing position, the brush is positioned inside the cup. Therefore, when the arm positions the brush at the processing position, the brush makes suitable contact with the substrate held by the substrate holding portion. When the arm positions the brush at the processing position, the motor is positioned outside the cup. Therefore, interference between the motor and the cup is prevented when the arm positions the brush at the processing position. Interference between the motor and the substrate held by the substrate holding portion is also prevented when the arm positions the brush at the processing position. Thus, when the arm positions the brush at the processing position, it is easy to position at least a part of the motor lower than the upper edge of the cup. 【0014】 In the substrate processing apparatus described above, the substrate processing apparatus comprises a belt arranged horizontally and connecting a motor and a brush, wherein when the arm positions the brush at the processing position, the entire belt is preferably positioned higher than the upper edge of the cup. The substrate processing apparatus comprises a belt. The belt extends horizontally. The belt connects the motor and the brush. When the arm positions the brush at the processing position, the entire belt is positioned higher than the upper edge of the cup. This prevents interference between the belt and the cup. 【0015】 In the substrate processing apparatus described above, the motor comprises a motor body that generates rotational power and an output shaft that extends upward from the motor body and is connected to the belt. When the arm positions the brush at the processing position, it is preferable that at least a portion of the motor body is positioned lower than the upper edge of the cup, and at least a portion of the output shaft is positioned higher than the upper edge of the cup. The motor has a motor body and an output shaft. The motor body generates rotational power. The output shaft extends upward from the motor body. The output shaft is connected to the belt. When the arm positions the brush at the processing position, at least a portion of the motor body is positioned lower than the upper edge of the cup. Therefore, when the arm positions the brush at the processing position, at least a portion of the motor is preferably positioned lower than the upper edge of the cup. When the arm positions the brush at the processing position, at least a portion of the output shaft is positioned higher than the upper edge of the cup. Therefore, when the arm positions the brush at the processing position, the output shaft is preferably connected to the belt. 【0016】 In the substrate processing apparatus described above, the substrate processing apparatus comprises a support column erected vertically and supporting the arm, and preferably the horizontal distance between the motor and the brush is shorter than the horizontal distance between the support column and the brush. The motor is positioned close to the brush. Therefore, the motor rotates the brush effectively. 【0017】 In the substrate processing apparatus described above, the arm comprises a main housing formed in a horizontally elongated shape and a first sub-housing that bulges downward from the main housing, and it is preferable that at least a portion of the motor is installed in the first sub-housing. The arm comprises the first sub-housing. At least a portion of the motor is installed in the first sub-housing. Therefore, the arm suitably supports the motor. The arm comprises a main housing. The main housing is formed to follow the horizontal direction. The first sub-housing bulges downward from the main housing. Therefore, at least a portion of the motor is positioned lower than the main housing. Thus, it is easy to position the motor at a low position. 【0018】 In the substrate processing apparatus described above, when the arm positions the brush at the processing position, it is preferable that the entire main housing is positioned higher than the upper edge of the cup, and at least a portion of the first sub-housing is positioned lower than the upper edge of the cup. When the arm positions the brush at the processing position, the entire main housing is positioned higher than the upper edge of the cup. Therefore, interference between the main housing and the cup is prevented even when the arm positions the brush at the processing position. When the arm positions the brush at the processing position, at least a portion of the first sub-housing is positioned lower than the upper edge of the cup. Therefore, when the arm positions the brush at the processing position, at least a portion of the motor is preferably positioned lower than the upper edge of the cup. 【0019】 In the substrate processing apparatus described above, it is preferable that the first sub-housing is positioned such that when the arm positions the brush at the processing position, the lower end of the first sub-housing is lower than the upper edge of the cup, and the upper end of the first sub-housing is higher than the upper edge of the cup. The first sub-housing is positioned such that when the arm positions the brush at the processing position, the upper end of the first sub-housing is higher than the upper edge of the cup. Therefore, even when the arm positions the brush at the processing position, it is easy for the main housing to support the first sub-housing. Thus, even when the arm positions the brush at the processing position, it is easy for the arm to support the motor. 【0020】 In the substrate processing apparatus described above, when the arm positions the brush at the processing position, it is preferable that at least a portion of the first sub-housing overlaps with the cup in a plan view. In other words, when the brush contacts the substrate held by the substrate holding portion, at least a portion of the first sub-housing overlaps with the cup positioned to the side of the substrate holding portion in a plan view. For this reason, the first sub-housing is positioned close to the brush. Therefore, the motor is positioned close to the brush. Consequently, the motor rotates the brush effectively. 【0021】 In the substrate processing apparatus described above, the substrate processing apparatus comprises an actuator that presses the brush downward, and the arm further supports the actuator and moves the actuator, and when the arm positions the brush in the processing position, it is preferable that the entire actuator is positioned higher than the upper edge of the cup. The substrate processing apparatus comprises an actuator. The actuator presses the brush downward. The arm supports the actuator. The arm moves the actuator. When the arm positions the brush in the processing position, the entire actuator is positioned higher than the upper edge of the cup. Therefore, even when the arm positions the brush in the processing position, interference between the actuator and the cup is prevented. 【0022】 In the above-described substrate processing apparatus, when the arm arranges the brush at the processing position, it is preferable that the actuator overlaps the cup in a plan view. In other words, when the brush contacts the substrate held by the substrate holding part, at least a part of the actuator overlaps the cup arranged on the side of the substrate holding part in a plan view. For this reason, the actuator is arranged at a position close to the brush. Therefore, the actuator presses the brush appropriately. 【0023】 In the above-described substrate processing apparatus, when the arm arranges the brush at the processing position, it is preferable that the actuator overlaps the upper edge of the cup in a plan view. In other words, when the brush contacts the substrate held by the substrate holding part, the actuator overlaps the upper edge of the cup in a plan view. For this reason, the actuator is arranged at a position close to the brush. Therefore, the actuator presses the brush appropriately. 【0024】 In the above-described substrate processing apparatus, when the arm arranges the brush at the processing position, it is preferable that the actuator overlaps the substrate held by the substrate holding part in a plan view. In other words, when the brush contacts the substrate held by the substrate holding part, the actuator overlaps the substrate held by the substrate holding part in a plan view. For this reason, the actuator is arranged at a position close to the brush. Therefore, the actuator presses the brush appropriately. 【0025】 In the above-described substrate processing apparatus, it is preferable that a horizontal distance between the actuator and the brush is shorter than a horizontal distance between the motor and the brush. For this reason, the actuator is arranged at a position close to the brush. Therefore, the actuator presses the brush appropriately. 【0026】 In the substrate processing apparatus described above, the arm comprises a main housing formed in a horizontally elongated shape, a first sub-housing bulging downward from the main housing, and a second sub-housing bulging downward from the main housing, wherein at least a portion of the motor is installed in the first sub-housing, and at least a portion of the actuator is installed in the second sub-housing. The arm comprises a first sub-housing. At least a portion of the motor is installed in the first sub-housing. Therefore, the arm suitably supports the motor. The arm comprises a main housing. The main housing is formed in a horizontally elongated shape. The first sub-housing bulges downward from the main housing. Therefore, at least a portion of the motor is positioned lower than the main housing. Thus, it is easy to position the motor at a lower position. The arm further comprises a second sub-housing. At least a portion of the actuator is installed in the second sub-housing. Therefore, the arm suitably supports the actuator. The second sub-housing bulges downward from the main housing. Therefore, at least a portion of the actuator is positioned lower than the main housing. Thus, positioning the actuator at a lower position is easy. 【0027】 In the above-described substrate processing apparatus, when the arm positions the brush at the processing position, the entire main housing is disposed at a position higher than the upper edge of the cup, at least a part of the first sub-housing is disposed at a position lower than the upper edge of the cup, and it is preferable that the entire second sub-housing is disposed at a position higher than the upper edge of the cup. When the arm positions the brush at the processing position, the entire main housing is disposed at a position higher than the upper edge of the cup. Therefore, even when the arm positions the brush at the processing position, interference between the main housing and the cup is prevented. When the arm positions the brush at the processing position, at least a part of the first sub-housing is disposed at a position lower than the upper edge of the cup. Therefore, when the arm positions the brush at the processing position, at least a part of the motor is preferably disposed at a position lower than the upper edge of the cup. When the arm positions the brush at the processing position, the entire second sub-housing is disposed at a position higher than the upper edge of the cup. Therefore, even when the arm positions the brush at the processing position, interference between the second sub-housing and the cup is prevented. 【Advantages of the Invention】 【0028】 According to the present invention, the length of the substrate processing apparatus in the vertical direction is short. 【Brief Description of the Drawings】 【0029】 [Figure 1] It is a plan view of the substrate processing apparatus. [Figure 2] It is a rear view of the substrate processing apparatus. [Figure 3] It is a side view of the processing unit. [Figure 4] It is a plan view of the processing unit. [Figure 5] It is a perspective view of the brush and the arm. [Figure 6] It is a cross-sectional view showing the internal structure of the arm. [Figure 7] It is a bottom view of the arm. 【Embodiments for Carrying Out the Invention】 【0030】 The following describes an embodiment of the substrate processing apparatus with reference to the drawings. 【0031】 <1. Overall Structure> Figure 1 is a plan view of the substrate processing apparatus. Figure 2 is a rear view of the substrate processing apparatus. The substrate processing apparatus 1 processes the substrate W. The processing in the substrate processing apparatus 1 is, for example, a cleaning process. The substrate W is, for example, a semiconductor wafer, a substrate for liquid crystal displays, a substrate for organic EL (Electroluminescence), a substrate for FPD (Flat Panel Display), a substrate for optical displays, a substrate for magnetic disks, a substrate for optical disks, a substrate for magneto-optical disks, a substrate for photomasks, or a substrate for solar cells. 【0032】 The substrate processing apparatus 1 comprises an input / output block 3, an indexer block 5, and a processing block 7. The input / output block 3, the indexer block 5, and the processing block 7 are arranged in a single row. 【0033】 In this specification, for convenience, the direction in which the loading / unloading block 3, indexer block 5, and processing block 7 are aligned is called the "front-to-back direction X". The front-to-back direction X is horizontal. Of the front-to-back direction X, the direction from the processing block 7 toward the loading / unloading block 3 is called the "front". The direction opposite to the front is called the "rear". The horizontal direction perpendicular to the front-to-back direction X is called the "width direction Y". One direction of the "width direction Y" is appropriately called the "right". The direction opposite to the right is called the "left". When the front-to-back direction X and the width direction Y are not distinguished, they are simply called the "horizontal direction". The direction perpendicular to the horizontal is called the "vertical direction Z". In each figure, front, rear, right, left, up, and down are shown as appropriate for reference. 【0034】 The loading / unloading block 3 is also called a load port. The loading / unloading block 3 comprises an input section 9 and an output section 11. The input section 9 and the output section 11 are aligned in the width direction Y. The input section 9 comprises, for example, two mounting tables 13. The output section 11 also comprises, for example, two mounting tables 13. One carrier C is placed on each mounting table 13. The carrier C accommodates multiple (for example, 25) substrates W. The carrier C is, for example, a FOUP (Front Opening Unify Pod). A FOUP is classified as a sealed container. The carrier C is not limited to a FOUP. The carrier C may be classified as an open container. 【0035】 Depending on the substrate W to be stored in the carrier C, the position of the carrier C changes between the input section 9 and the discharge section 11. For example, when the carrier C stores an unprocessed substrate W, the carrier C is placed in the input section 9. For example, when the carrier C stores a processed substrate W, the carrier C is placed in the discharge section 11. 【0036】 Within carrier C, the substrate W is in a horizontal position. The substrate W has a front surface and a back surface. A device is formed on the front surface of the substrate W. The front surface of the substrate W is also called the "device formation surface". The back surface of the substrate W is located on the opposite side of the front surface. For example, within carrier C, the front surface of the substrate W faces upwards, and the back surface of the substrate W faces downwards. In other words, when the substrate W is housed in carrier C, the top surface of the substrate W corresponds to the front surface of the substrate W, and the bottom surface of the substrate W corresponds to the back surface of the substrate W. 【0037】 The indexer block 5 supplies the substrate W to the processing block 7. The indexer block 5 retrieves the substrate W from the processing block 7. The indexer block 5 is equipped with an indexer robot IR and a transfer unit 15. 【0038】 The indexer robot IR is configured to be rotatable about the vertical Z. The indexer robot IR is configured to be movable in the width Y direction. The indexer robot IR comprises a first hand 19 and a second hand 21. The first hand 19 and the second hand 21 each hold one substrate W. The first hand 19 and the second hand 21 are configured to move back and forth in the front-back direction X independently of each other. 【0039】 The indexer robot IR unloads the substrate W from the carrier C of the loading / unloading block 3 and loads the substrate W into the carrier C of the loading / unloading block 3. For example, the indexer robot IR unloads the substrate W from the carrier C of the input section 9. For example, the indexer robot IR loads the substrate W into the carrier C of the discharge section 11. 【0040】 The transfer unit 15 is located at the boundary between the indexer block 5 and the processing block 7. The transfer unit 15 is located, for example, in the center of the width direction Y. The indexer robot IR further places the substrate W on the transfer unit 15 and takes the substrate W from the transfer unit 15. The indexer robot IR transports the substrate W between the carrier C of the loading / unloading block 3 and the transfer unit 15. 【0041】 Refer to Figure 2. The transfer unit 15 comprises a first reversal unit 23, a path section 25, a path section 27, and a second reversal unit 29. The first reversal unit 23, the path section 25, the path section 27, and the second reversal unit 29 are aligned in the vertical direction Z. 【0042】 The first inversion unit 23 and the second inversion unit 29 each invert the substrate W. The first inversion unit 23 and the second inversion unit 29 each rotate the substrate W around a horizontal axis. By inverting the substrate W, the position of the surface of the substrate W switches between the top surface of the substrate W and the bottom surface of the substrate W. By inverting the substrate W, the position of the back surface of the substrate W also switches between the bottom surface of the substrate W and the top surface of the substrate W. The path sections 25 and 27 each place the substrate W on them. 【0043】 Depending on the transport direction of the substrate W, the first inversion unit 23, path section 25, path section 27, and second inversion unit 29 may be selectively used. For example, when the substrate W is transported from the indexaro block 5 to the processing block 7, the substrate W passes through either the first inversion unit 23 or the path section 25. For example, when the substrate W is transported from the processing block 7 to the indexaro block 5, the substrate W passes through either the second inversion unit 29 or the path 27. In this case, the indexer robot IR places the substrate W on the first inversion unit 23 and the path section 25, and retrieves the substrate W from the second inversion unit 29 or the path 27. 【0044】 The processing block 7 performs a cleaning process on the substrate W, for example. The cleaning process is, for example, a process using a brush in addition to a processing liquid. The processing block 7 comprises a central robot CR and a plurality of processing units 31. 【0045】 The center robot CR is positioned, for example, in the center of the width direction Y. The center robot CR is configured to be rotatable about the vertical direction Z. The center robot CR is configured to be vertically movable in the vertical direction Z. The center robot CR comprises, for example, a first hand 33 and a second hand 35. The first hand 33 and the second hand 35 each hold one substrate W. The first hand 33 and the second hand 35 are configured to move back and forth independently of each other in the front-rear direction X and the width direction Y. 【0046】 The central robot CR takes the substrate W from the transfer unit 15 and places the substrate W on the transfer unit 15. For example, the central robot CR takes the substrate W from the first inversion unit 23 and the path unit 25 and places the substrate W on the second inversion unit 29 and the path 27. The central robot CR further carries the substrate W into each processing unit 31 and transports the substrate from each processing unit 31. The central robot CR transports the substrate W between the transfer unit 15 and the processing units 31. 【0047】 Each processing unit 31 is positioned to the side of the central robot CR. For example, the processing units 31 are positioned on both the left and right sides of the central robot CR. 【0048】 Multiple processing units 31 are arranged in the vertical direction Z. For example, four processing units 31 are stacked in the vertical direction Z to the right of the center robot CR. For example, four processing units 31 are stacked in the vertical direction Z to the left of the center robot CR. 【0049】 Each processing unit 31 cleans the substrate W. Each processing unit 31 is also called a "cleaning unit". When a processing unit 31 exclusively cleans the surface of the substrate W, it is classified as a surface cleaning unit. When a processing unit 31 exclusively cleans the back surface of the substrate W, it is classified as a back surface cleaning unit. In this embodiment, the processing unit 31 corresponds to the back surface cleaning unit SSR. However, the processing unit 31 is not limited to the back surface cleaning unit SSR. The processing unit 31 may be either a surface cleaning unit or a back surface cleaning unit. 【0050】 The substrate processing apparatus 1 includes a control unit 39. The control unit 39 controls the indexer robot IR and the center robot CR. The control unit 39 controls the first inversion unit 23 and the second inversion unit 29. The control unit 39 controls the processing unit 31. The control unit 39 is communicated with the indexer robot IR and the center robot CR. The control unit 39 is communicated with the first inversion unit 23 and the second inversion unit 29. The control unit 39 is communicated with the processing unit 31. 【0051】 The control unit 39 is implemented by a central processing unit (CPU) that executes various processes, RAM (Random-Access Memory) which serves as a work area for calculations, and a storage medium such as a fixed disk. The control unit 39 has various types of information that are pre-stored in the storage medium. The information held by the control unit 39 includes, for example, transport condition information and processing condition information. The transport condition information defines the conditions for the operation of the indexer robot IR and the center robot CR. The transport condition information may further define the conditions for the operation of the first inversion unit 23 and the second inversion unit 29. The processing condition information defines the conditions for the operation of the processing unit 31. The processing condition information is also called a processing recipe. 【0052】 <2. Processing Unit> Figure 3 is a side view of the processing unit. Figure 4 is a top view of the processing unit. The processing unit 31 is classified as a single-wafer type. That is, each processing unit 31 processes only one substrate W at a time. 【0053】 The processing unit 31 includes a substrate holding section 41. The substrate holding section 41 holds the substrate W in a substantially horizontal position. Therefore, when the substrate W is held by the substrate holding section 41, the substrate W has an upward-facing surface (i.e., an upper surface) W1. The upper surface W1 of the substrate W held by the substrate holding section 41 is substantially horizontal. 【0054】 When the processing unit 31 is a back surface cleaning unit SSR, the upper surface W1 of the substrate W held by the substrate holding unit 41 corresponds to the back surface of the substrate W. When the processing unit 31 is a front surface cleaning unit, the upper surface W1 of the substrate W held by the substrate holding unit 41 corresponds to the front surface of the substrate W. 【0055】 The configuration of the substrate holding portion 41 is illustrated below. The substrate holding portion 41 comprises a support member 42 and a plurality of retaining pins 43. The support member 42 has a plate shape that extends horizontally. Each retaining pin 43 extends upward from the support member 42. Each retaining pin 43 is in contact with the substrate W. Specifically, each retaining pin 43 is in contact with at least one of the lower surface of the substrate W and the peripheral edge of the substrate W. The retaining pins 43 then hold the substrate W. When the substrate W is held by the retaining pins 43, the substrate W is positioned above the support member 43. 【0056】 Figure 4 omits the illustration of the substrate holding portion 41, but the support member 42 has a circular shape in plan view. The support member 42 has a diameter slightly larger than the diameter of the substrate W. The retaining pins 43 are arranged along the periphery of the support member 42. 【0057】 Refer to Figure 3. The processing unit 31 includes a rotary drive unit 45. The rotary drive unit 45 is located below the substrate holder 41. The rotary drive unit 45 is connected to the substrate holder 41. The rotary drive unit 45 rotates the substrate holder 41. When the substrate W is held by the substrate holder 41, the substrate W rotates together with the substrate holder 41. The substrate W held by the substrate holder 41 rotates in the horizontal plane. The substrate W held by the substrate holder 41 rotates, for example, around an axis P1. The axis P1 is, for example, parallel to the vertical direction Z. The axis P1 passes through, for example, the center of the substrate W. 【0058】 An example configuration of the rotary drive unit 45 will be described. The rotary drive unit 45 comprises a shaft portion 46 and a drive source 47. The shaft portion 46 is connected to a support member 42. The shaft portion 46 extends downward from the support member 42. The shaft portion 46 extends along the axis P1. The drive source 47 is connected to the shaft portion 46. The drive source 47 rotates the shaft portion 46 around the axis P1. The drive source 47 is, for example, a motor. The support member 42 and the retaining pin 43 rotate together with the shaft portion 46. 【0059】 The processing unit 31 includes a cup 51. The cup 51 is positioned to the side of the substrate holding portion 41. The cup 51 is positioned around the substrate holding portion 41. The cup 51 surrounds the substrate holding portion 41. The cup 51 receives liquid that splashes from the substrate W held by the substrate holding portion 41. 【0060】 The cup 51 extends from a position higher than the substrate holding portion 41 to a position lower than the substrate holding portion 41. The cup 51 has an upper edge 52. The upper edge 52 is positioned above the substrate holding portion 41. 【0061】 An example of the configuration of the cup 51 will be described. The cup 51 has a vertical portion 53. The vertical portion 53 has a cylindrical shape that is erected in the vertical direction Z. For example, the vertical portion 53 has a cylindrical shape centered on axis P2. Axis P2 is parallel to the vertical direction Z. Axis P2 coincides with axis P1, for example. The vertical portion 53 corresponds to a vertical wall surrounding the substrate holding portion 41. 【0062】 The cup 51 is provided with an inclined portion 54. The inclined portion 54 is connected to the vertical portion 53. The inclined portion 54 is inclined upward and inward from the vertical portion 53. The inclined portion 54 approaches the axis P2 while moving upward from the vertical portion 53. As the inclined portion 54 moves upward, it tilts toward the axis P2. As the inclined portion 54 moves upward, the inner diameter of the inclined portion 54 decreases. 【0063】 The upper edge 52 corresponds to the upper end of the inclined portion 54. 【0064】 Refer to Figure 4. The upper edge 52 has an annular shape. The upper edge 52 is located on the circumference of a circle centered on axis P2. The upper edge 52 extends in a substantially horizontal direction. 【0065】 The cup 51 has an opening 56. The opening 56 is formed inward from the upper edge 52. The opening 56 has a circular shape centered on axis P2. The opening 56 is wider than the substrate W. The opening 56 overlaps with the entire substrate W held by the substrate holding portion 41. 【0066】 Refer to Figure 3. The opening 56 is located at the same height as the upper edge 52. The opening 56 is located at the same height as the upper end of the inclined portion 54. The opening 56 is located above the substrate W held by the substrate holding portion 41. The opening 56 extends horizontally. 【0067】 The processing unit 31 includes a brush 61. The brush 61 is, for example, a sponge. The brush 61 has, for example, a cylindrical shape. The material of the brush 61 is, for example, polyvinyl alcohol (PVA). 【0068】 The processing unit 31 comprises a brush holder 63 and a shaft portion 65. The brush holder 63 holds the brush 61. The shaft portion 65 is connected to the brush holder 63. The shaft portion 65 extends upward from the brush holder 63. The shaft portion 65 extends in the vertical direction Z. The central axis of the shaft portion 65 is called axis P3. Axis P3 is parallel to the vertical direction Z. Axis P3 passes through, for example, the center of the brush 61. 【0069】 The processing unit 31 includes an arm 71. The arm 71 supports the brush 61. Specifically, the arm 71 supports the shaft portion 65. 【0070】 The arm 71 is positioned above the brush 61. The shaft portion 65 extends downward from the arm 71. The brush 61 is suspended from the arm 71. The brush 61 is positioned outside the arm 71. The brush 61 is positioned below the arm 71. 【0071】 The processing unit 31 is equipped with a motor 81. The motor 81 rotates the brush 61. Specifically, the motor 81 rotates the brush 61 around axis P3 relative to the arm 71. The motor 81 is also called an "electric motor". 【0072】 The processing unit 31 includes an actuator 91. The actuator 91 presses the brush 61 downward. Specifically, the actuator 91 presses the brush 61 downward against the arm 71. The actuator 91 is, for example, an air bearing actuator. The actuator 91 is, for example, an air cylinder. 【0073】 The arm 71 supports the motor 81 and the actuator 91. The motor 81 and the actuator 91 are each mounted on the arm 71. The motor 81 and the actuator 91 are each installed inside the arm 71. The arm 71 houses the motor 81 and the actuator 91. 【0074】 The arm 71 is formed to follow the horizontal direction. The arm 71 has a tip portion 71d and a base portion 71p. The tip portion 71d is the part of the arm 71 that supports the brush 61. The tip portion 71d intersects with the axis P3. The arm 71 is formed along the horizontal direction from the tip portion 71d to the base portion 71p. The motor 81 and actuator 91 are positioned in the portion of the arm 71 between the tip portion 71d and the base portion 71p. 【0075】 The arm 71 is configured to be movable. An example of a configuration for moving the arm 71 is given. The processing unit 31 includes a support column 77 and a moving mechanism 79. The support column 77 supports the arm 71. The support column 77 is erected along the vertical direction Z. The support column 77 is connected to the base end 71p. The central axis of the support column 77 is called axis P4. Axis P4 is parallel to the vertical direction Z. Axis P4 intersects with the base end 71p. The moving mechanism 79 is connected to the support column 77. The moving mechanism 79 moves the support column 77. The moving mechanism 79 rotates the support column 77 around axis P4. The moving mechanism 79 moves the support column 77 in the vertical direction Z. The arm 71 moves together with the support column 77. Therefore, the arm 71 rotates around axis P4. The arm 71 moves in the vertical direction Z. 【0076】 Refer to Figure 4. In a plan view, the support column 77 does not overlap with the brush 61. In a plan view, the support column 77 does not overlap with the motor 81. In a plan view, the support column 77 does not overlap with the actuator 91. 【0077】 As described above, the arm 71 is movable. Therefore, the arm 71 moves the brush 61, motor 81 and actuator 91. For example, the arm 71 moves the brush 61, motor 81 and actuator 91 horizontally. For example, the arm 71 rotates the brush 61, motor 81 and actuator 91 in the horizontal plane. For example, the arm 71 rotates the brush 61, motor 81 and actuator 91 around axis P4. For example, the arm 71 moves the brush 61, motor 81 and actuator 91 vertically in the Z direction. 【0078】 The arm 71 moves the brush 61 to the processing position Qa. Figure 4 shows the arm 71 that places the brush 61 to the processing position Qa with a solid line. For convenience, Figure 4 shows the brush 61 located at the processing position Qa with a dashed line. When the arm 71 places the brush 61 to the processing position Qa, the brush 61 overlaps with the opening 56 of the cup 51 in a plan view. When the arm 71 places the brush 61 to the processing position Qa, the brush 61 does not overlap with the upper edge 52 of the cup 51 in a plan view. When the arm 71 places the brush 61 to the processing position Qa, the brush 61 overlaps with the substrate W held by the substrate holding part 41 in a plan view. 【0079】 The arm 71 moves the brush 61 to the standby position Qb. Figure 4 shows the arm 71 that places the brush 61 to the standby position Qb as a dashed line. For convenience, Figure 4 shows the brush 61 located at the standby position Qb as a dashed line. When the arm 71 places the brush 61 to the standby position Qb, the brush 61 does not overlap with the substrate W held by the substrate holder 41 in a plan view. When the arm 71 places the brush 61 to the standby position Qb, the brush 61 is positioned away from above the substrate W held by the substrate holder 41. 【0080】 When the arm 71 positions the brush 61 at the standby position Qb, the arm 71 does not overlap with the substrate W held by the substrate holding part 41 in a plan view. When the arm 71 positions the brush 61 at the standby position Qb, the arm 71 is positioned away from above the substrate W held by the substrate holding part 41. 【0081】 Figure 3 shows the brush 61 located at processing position Qa. Figure 3 shows the arm 71 that positions the brush 61 at processing position Qa. When the arm 71 positions the brush 61 at processing position Qa, the tip 71d of the arm 71 is located above the opening 56 of the cup 51. When the arm 71 positions the brush 61 at processing position Qa, the tip 71d of the arm 71 is located above the substrate W held by the substrate holding part 41. When the arm 71 positions the brush 61 at processing position Qa, the brush 61 enters the inside of the cup 51 through the opening 56. When the arm 71 positions the brush 61 at processing position Qa, the brush 61 is located inside the cup 51. When the arm 71 positions the brush 61 at processing position Qa, the brush 61 is located above the substrate W held by the substrate holding part 41. When the arm 71 positions the brush 61 at processing position Qa, the brush 61 contacts the substrate W held by the substrate holding part 41. When the arm 71 positions the brush 61 at the processing position Qa, the brush 61 comes into contact with the upper surface W1 of the substrate W held by the substrate holding part 41. 【0082】 Here, an example of the structure of the arm 71 is described. Figure 5 is a perspective view of the brush 61 and the arm 71. The base end 71p has a joint portion 78 for connecting to the support column 77. 【0083】 The arm 71 includes a main housing 72. The main housing 72 is formed in a horizontally elongated shape. The main housing 72 is formed in a horizontally elongated shape from the base end 71p to the tip end 71d. The main housing 72 does not include the base end 71p. The main housing 72 includes the tip end 71d. 【0084】 The arm 71 includes a first sub-housing 73. The first sub-housing 73 bulges downward from the main housing 72. 【0085】 The arm 71 includes a second sub-housing 74. The second sub-housing 74 bulges downward from the main housing 72. 【0086】 Figure 6 is a cross-sectional view showing the internal structure of the arm 71. The first sub-housing 73 has a lower end 73b. The lower end 73b is lower than the main housing 72. 【0087】 The brush 61 has a lower end 61b. The lower end 73b is higher than the lower end 61b of the brush 61. 【0088】 The second sub-housing 74 has a lower end 74b. The lower end 74b is lower than the main housing 72. The lower end 74b is higher than the lower end 61b of the brush 61. The lower end 74b is higher than the lower end 73b of the first sub-housing 73. 【0089】 The main housing 72 has an internal space Aa. The internal space Aa is formed inside the main housing 72. The internal space Aa extends horizontally. 【0090】 The first sub-housing 73 has an internal space Ab. The internal space Ab is formed inside the first sub-housing 73. The internal space Ab communicates with the internal space Aa. The internal space Ab bulges downward from the internal space Aa. The internal space Ab falls downward from the internal space Aa. 【0091】 The second sub-housing 74 has an internal space Ac. The internal space Ac is formed inside the second sub-housing 74. The internal space Ac communicates with the internal space Aa. The internal space Ac bulges downward from the internal space Aa. The internal space Ac drops downward from the internal space Aa. 【0092】 The arrangement of the motor 81 and actuator 91 will now be described. At least a portion of the motor 81 is installed in the first sub-housing 73. The first sub-housing 73 accommodates at least a portion of the motor 81. For example, the first sub-housing 73 accommodates the lower part of the motor 81, and the main housing 72 accommodates the upper part of the motor 81. The first sub-housing 73 corresponds to a pocket for housing the motor 81. 【0093】 At least a portion of the actuator 91 is installed in the second sub-housing 74. The second sub-housing 74 accommodates at least a portion of the actuator 91. For example, the second sub-housing 74 accommodates the lower part of the actuator 91, and the main housing 72 accommodates the upper part of the actuator 91. The second sub-housing 74 corresponds to a pocket for housing the actuator 91. 【0094】 Refer to Figure 3. As described above, when the arm 71 positions the brush 61 at the processing position Qa, the brush 61 contacts the substrate W held by the substrate holding portion 41. Specifically, when the arm 71 positions the brush 61 at the processing position Qa, the lower end 61b of the brush 61 contacts the substrate W held by the substrate holding portion 41. When the arm 71 positions the brush 61 at the processing position Qa, at least a portion of the motor 81 is positioned lower than the upper edge 52 of the cup 51. When the arm 71 positions the brush 61 at the processing position Qa, the motor 81 extends from a position lower than the upper edge 52 to a position higher than the upper edge 52. Specifically, the motor 81 has a lower end and an upper end. When the arm 71 positions the brush 61 at the processing position Qa, the lower end of the motor 81 is lower than the upper edge 52, and the upper end of the motor 81 is higher than the upper edge 52. In other words, when the arm 71 positions the brush 61 at the processing position Qa, the motor 81 is positioned such that its lower end is lower than the upper edge 52 and its upper end is higher than the upper edge 52. When the arm 71 positions the brush 61 at the processing position Qa, the entire motor 81 is positioned higher than the vertical section 53. When the arm 71 positions the brush 61 at the processing position Qa, at least a portion of the motor 81 is positioned at the same height as the inclined section 54. When the arm 71 positions the brush 61 at the processing position Qa, the motor 81 is positioned outside the cup 51. 【0095】 When the arm 71 positions the brush 61 at processing position Qa, the entire actuator 91 is positioned higher than the upper edge 52 of the cup 51. When the arm 71 positions the brush 61 at processing position Qa, the entire actuator 91 is positioned higher than the vertical portion 53. When the arm 71 positions the brush 61 at processing position Qa, the entire actuator 91 is positioned higher than the inclined portion 54. When the arm 71 positions the brush 61 at processing position Qa, the actuator 91 is positioned outside the cup 51. 【0096】 When the arm 71 positions the brush 61 at processing position Qa, the entire main housing 72 is positioned higher than the upper edge 52 of the cup 51. When the arm 71 positions the brush 61 at processing position Qa, the main housing 72 is positioned outside the cup 51. 【0097】 When the arm 71 positions the brush 61 at processing position Qa, at least a portion of the first sub-housing 73 is positioned lower than the upper edge 52. When the arm 71 positions the brush 61 at processing position Qa, the first sub-housing 73 extends from a position lower than the upper edge 52 to a position higher than the upper edge 52. Specifically, the first sub-housing 73 has a lower end and an upper end. When the arm 71 positions the brush 61 at processing position Qa, the lower end of the first sub-housing 73 is lower than the upper edge 52, and the upper end of the first sub-housing 73 is higher than the upper edge 52. That is, when the arm 71 positions the brush 61 at processing position Qa, the first sub-housing 73 is positioned such that its lower end is lower than the upper edge 52 and its upper end is higher than the upper edge 52. When the arm 71 positions the brush 61 at processing position Qa, the entirety of the first sub-housing 73 is positioned higher than the vertical portion 53. When the arm 71 positions the brush 61 at the processing position Qa, at least a portion of the first sub-housing 73 is positioned at the same height as the inclined portion 54. When the arm 71 positions the brush 61 at the processing position Qa, the first sub-housing 73 is positioned outside the cup 51. 【0098】 When the arm 71 positions the brush 61 at processing position Qa, the entire second sub-housing 74 is positioned higher than the upper edge 52 of the cup 51. When the arm 71 positions the brush 61 at processing position Qa, the entire second sub-housing 74 is positioned higher than the vertical portion 53. When the arm 71 positions the brush 61 at processing position Qa, the entire second sub-housing 74 is positioned higher than the inclined portion 54. When the arm 71 positions the brush 61 at processing position Qa, the second sub-housing 74 is positioned outside the cup 51. 【0099】 Refer to Figure 4. When the arm 71 positions the brush 61 at the processing position Qa, at least a portion of the motor 81 overlaps with the cup 51 in a plan view. When the arm 71 positions the brush 61 at the processing position Qa, at least a portion of the motor 81 overlaps with the inclined portion 54 in a plan view. When the arm 71 positions the brush 61 at the processing position Qa, the motor 81 does not overlap with the upper edge 52 of the cup 51 in a plan view. When the arm 71 positions the brush 61 at the processing position Qa, the motor 81 does not overlap with the opening 56 of the cup 51 in a plan view. When the arm 71 positions the brush 61 at the processing position Qa, the motor 81 does not overlap with the substrate W held by the substrate holding portion 41 in a plan view. 【0100】 When the arm 71 positions the brush 61 at the processing position Qa, at least a portion of the first sub-housing 73 overlaps with the cup 51 in a plan view. When the arm 71 positions the brush 61 at the processing position Qa, at least a portion of the first sub-housing 73 overlaps with the inclined portion 54 in a plan view. When the arm 71 positions the brush 61 at the processing position Qa, the first sub-housing 73 does not overlap with the upper edge 52 of the cup 51 in a plan view. When the arm 71 positions the brush 61 at the processing position Qa, the first sub-housing 73 does not overlap with the opening 56 of the cup 51 in a plan view. When the arm 71 positions the brush 61 at the processing position Qa, the first sub-housing 73 does not overlap with the substrate W held by the substrate holding portion 41 in a plan view. 【0101】 When the arm 71 positions the brush 61 at the processing position Qa, the actuator 91 overlaps with the cup 51 in a plan view. When the arm 71 positions the brush 61 at the processing position Qa, at least a portion of the actuator 91 overlaps with the inclined portion 54 in a plan view. When the arm 71 positions the brush 61 at the processing position Qa, the actuator 91 overlaps with the upper edge 52 of the cup 51 in a plan view. When the arm 71 positions the brush 61 at the processing position Qa, the actuator 91 overlaps with the opening 56 of the cup 51 in a plan view. When the arm 71 positions the brush 61 at the processing position Qa, the actuator 91 overlaps with the substrate W held by the substrate holding portion 41 in a plan view. 【0102】 When the arm 71 positions the brush 61 at the processing position Qa, at least a portion of the second sub-housing 74 overlaps with the cup 51 in a plan view. When the arm 71 positions the brush 61 at the processing position Qa, at least a portion of the second sub-housing 74 overlaps with the inclined portion 54 in a plan view. When the arm 71 positions the brush 61 at the processing position Qa, the second sub-housing 74 overlaps with the upper edge 52 of the cup 51 in a plan view. When the arm 71 positions the brush 61 at the processing position Qa, the second sub-housing 74 overlaps with the opening 56 of the cup 51 in a plan view. When the arm 71 positions the brush 61 at the processing position Qa, the second sub-housing 74 overlaps with the substrate W held by the substrate holding portion 41 in a plan view. 【0103】 Refer to Figure 6. An example configuration in which the arm 71 supports the brush 61 is shown. The arm 71 includes a support mechanism 75. The support mechanism 75 is installed on the arm 71. The support mechanism 75 is located at the tip 71d of the arm 71. The support mechanism 75 is located inside the arm 71. The support mechanism 75 is located inside the main housing 72. The support mechanism 75 supports the brush 61. Specifically, the support mechanism 75 supports the shaft 65. 【0104】 The support mechanism 75 comprises a base portion 75a and a spline nut 75b. The base portion 75a is fixed to the main housing 72. The spline nut 75b is supported by the base portion 75a. The shaft portion 65 is supported by the spline nut 75b. The spline nut 75b is rotatable about axis P3 relative to the base portion 75a. The shaft portion 65 is not rotatable about axis P3 relative to the spline nut 75b. Therefore, the shaft portion 65 and the spline nut 75b rotate together about axis P3. The shaft portion 65 and the spline nut 75b are rotatable relative to the base portion 75a. The spline nut 75b is not movable in the vertical Z direction relative to the base portion 75a. The shaft portion 65 is movable in the vertical Z direction relative to the spline nut 75b. Therefore, the shaft portion 65 is movable in the vertical Z direction relative to both the spline nut 75b and the base portion 75a. 【0105】 An example configuration is shown in which the motor 81 rotates the brush 61. The processing unit 31 includes a belt 85. The belt 85 is installed on the arm 71. The belt 85 is mounted on the arm 71. The belt 85 is installed inside the arm 71. The arm 71 houses the belt 85. The belt 85 is located inside the main housing 72. The main housing 72 houses the belt 85. The belt 85 extends horizontally. The belt 85 connects the motor 81 and the brush 61. For example, the belt 85 connects the motor 81 and the shaft 65. For example, the belt 85 connects the motor 81 and the spline nut 75b. The belt 85 transmits the output of the motor 81 to the brush 61. 【0106】 The motor 81 comprises a motor body 82 and an output shaft 83. At least a portion of the motor body 82 is installed inside the first sub-housing 73. The motor body 82 is fixed to the arm 71. The motor body 82 generates rotational power. The output shaft 83 is connected to the motor body 82. The output shaft 83 extends upward from the motor body 82. At least a portion of the output shaft 83 is installed inside the main housing 72. The central axis of the output shaft 83 is called axis P5. Axis P5 is parallel to the vertical direction Z. Axis P5 passes through the center of the motor body 82. The output shaft 83 rotates about axis P5. The output shaft 83 is connected to a belt 85. 【0107】 More specifically, the processing unit 31 includes a first pulley 86 and a second pulley 87. The first pulley 86 is mounted on the output shaft 83. The first pulley 86 rotates integrally with the output shaft 83. The second pulley 87 is mounted, for example, on a spline nut 75b. The second pulley 87 rotates integrally with the shaft portion 65. The belt 85 is wrapped around the first pulley 86 and the second pulley 87. 【0108】 An example configuration is shown in which the actuator 91 presses the brush 61 downward. The processing unit 31 includes a seesaw member 95. The seesaw member 95 is installed on the arm 71. The seesaw member 95 is installed inside the arm 71. The seesaw member 95 is located inside the main housing 72. The seesaw member 95 connects the actuator 91 and the brush 61. For example, the seesaw member 95 connects the actuator 91 and the shaft 65. The seesaw member 95 transmits the output of the actuator 91 to the brush 61. 【0109】 The seesaw member 95 is arranged to extend horizontally. The seesaw member 95 has, for example, a rod shape. The seesaw member 95 is supported by a shaft portion 96. The shaft portion 96 is fixed to the arm 71. The shaft portion 96 extends horizontally. For example, the shaft portion 96 is perpendicular to the plane of the paper in Figure 6. The shaft portion 96 supports the central part of the seesaw member 95. The seesaw member 95 is pivotable around the shaft portion 96 relative to the arm 71. The seesaw member 95 has a first end 95a and a second end 95b. The first end 95a is connected to the actuator 91. The second end 95b is connected to the brush 61. The second end 95b is in contact with, for example, the shaft portion 65. The second end 95b is in contact with, for example, the upper end of the shaft portion 65. When actuator 91 pushes the first end 95a upward, the second end 95b pushes the brush 61 downward. The brush 61 moves downward relative to arm 71. 【0110】 The actuator 91 comprises an actuator body 92 and an operating shaft 93. At least a portion of the actuator body 92 is installed inside the second sub-housing 74. The actuator body 92 is fixed to the arm 71. The actuator body 92 generates a force that extends the operating shaft 93 upward. The operating shaft 93 is connected to the actuator body 92. The operating shaft 93 extends upward from the actuator body 92. At least a portion of the operating shaft 93 is installed inside the main housing 72. The central axis of the operating shaft 93 is called axis P6. Axis P6 is parallel to the vertical direction Z. Axis P6 passes through the center of the actuator body 92. The operating shaft 93 moves along axis P6. The operating shaft 93 is in contact with the seesaw member 95. The operating shaft 93 is in contact with the first end 95a of the seesaw member 95. 【0111】 Although not shown in the figures, the processing unit 31 may further include a biasing means for biasing the brush 61 upward. The biasing means applies an upward force to the brush 61. When the actuator 91 presses the brush 61 downward, the biasing means allows the brush 61 to move downward relative to the arm 71. When the actuator 91 does not press the brush 61 downward, the biasing means moves the brush 61 upward relative to the arm 71, keeping the brush 61 at a predetermined height position. The biasing means includes, for example, a spring. The spring connects the arm 71 and the brush 61. For example, the spring has a first end and a second end. The first end of the spring is connected to the base portion 75a. The second end of the spring is connected to the shaft portion 65. The spring applies an upward elastic force to the brush 61. 【0112】 The positions of each element when the arm 71 places the brush 61 at processing position Qa are described below. 【0113】 When the arm 71 positions the brush 61 at processing position Qa, at least a portion of the motor body 82 is positioned lower than the upper edge 52 of the cup 51. When the arm 71 positions the brush 61 at processing position Qa, at least a portion of the output shaft 83 is positioned higher than the upper edge 52 of the cup 51. When the arm 71 positions the brush 61 at processing position Qa, the entire belt 85 is positioned higher than the upper edge 52 of the cup 51. 【0114】 When the arm 71 positions the brush 61 at processing position Qa, the entire actuator body 92 is positioned higher than the upper edge 52 of the cup 51. When the arm 71 positions the brush 61 at processing position Qa, the entire operating shaft 93 is positioned higher than the upper edge 52 of the cup 51. When the arm 71 positions the brush 61 at processing position Qa, the entire seesaw member 95 is positioned higher than the upper edge 52 of the cup 51. 【0115】 Figure 7 is a bottom view of the arm 71. Figure 7 shows distances L1 and L2. Distance L1 is the horizontal distance between the support column 77 and the brush 61. Distance L1 is the horizontal distance between axis P4 and axis P3. Distance L2 is the horizontal distance between the motor 81 and the brush 61. Distance L2 is the horizontal distance between axis P5 and axis P3. Distance L2 is shorter than distance L1. 【0116】 Figure 7 shows distance L3. Distance L3 is the horizontal distance between actuator 91 and brush 61. Distance L3 is, for example, the horizontal distance between axis P6 and axis P3. Distance L3 is shorter than distance L1. Distance L3 is shorter than distance L2. 【0117】 Refer to Figure 4. The processing unit 31 further comprises nozzles 101, 102a, 102b, and 102c. Nozzle 101 discharges a rinse solution. The rinse solution is, for example, at least one of pure water, carbonated water, electrolyzed ionized water, hydrogen water, and ozonated water. Nozzles 102a, 102b, and 102c each discharge a chemical solution. The chemical solution contains at least one of sulfuric acid, nitric acid, acetic acid, hydrochloric acid, hydrofluoric acid, ammonia water, and hydrogen peroxide water. The chemical solution is, for example, SC-1 containing ammonia water and hydrogen peroxide water. Hereinafter, when nozzles 102a-102c are not distinguished, they will be referred to as "nozzle 102". 【0118】 The processing unit 31 includes moving mechanisms 105 and 106. Moving mechanism 105 moves the nozzle 101. For example, moving mechanism 105 rotates the nozzle 101 around axis P7. Moving mechanism 106 moves the nozzle 102. For example, moving mechanism 106 rotates the nozzle 102 around axis P8. 【0119】 Nozzles 101 and 102 are movable between a standby position and a processing position. Figure 4 shows nozzles 101 and 102 in the standby position with solid lines. When nozzles 101 and 102 are in the standby position, they do not overlap with the substrate W held by the substrate holding section 41 in a plan view. Although not shown in the figure, when nozzles 101 and 102 are in the processing position, they overlap with the substrate W held by the substrate holding section 41 in a plan view. When nozzle 101 is in the processing position, nozzle 101 supplies rinsing liquid to the upper surface W1 of the substrate W. When nozzle 102 is in the processing position, nozzle 102 supplies chemical solution to the upper surface W1 of the substrate W. 【0120】 <3. Example of operation> Refer to Figure 1. The indexer robot IR transports the substrate W from the carrier C of the input unit 9 to the first inversion unit 23. The first inversion unit 23 inverts the substrate W. As a result of the inversion of the substrate W, the top surface of the substrate W corresponds to the back surface of the substrate W. The center robot CR transports the substrate W from the first inversion unit 23 to the processing unit 31. The center robot CR transports the substrate W to the processing unit 31. 【0121】 Refer to Figures 3 and 4. The central robot CR places the substrate W on the substrate holding section 41. The substrate holding section 41 holds the substrate W. The upper surface W1 of the substrate W held by the substrate holding section 41 corresponds to, for example, the back surface of the substrate W. 【0122】 The processing unit 31 processes the substrate W held in the substrate holding section 41. The processing unit 31 processes the upper surface W1 of the substrate W held in the substrate holding section 41. The processing in the processing unit 31 includes, for example, four steps. 【0123】 1st step The processing unit 31 processes the substrate W with rinsing liquid and a brush 61. Specifically, the rotary drive unit 45 rotates the substrate W, which is held by the substrate holder 41, around axis P1. The moving mechanism 105 moves the nozzle 101 to the processing position. The nozzle 101 supplies rinsing liquid to the substrate W held by the substrate holder 41. The arm 71 moves the brush 61 to the processing position Qa. The brush 61 acts on the substrate W held by the substrate holder 41. The brush 61 makes contact with the substrate W held by the substrate holder 41. While the brush 61 is in contact with the substrate W held by the substrate holder 41, the arm 71 may rotate the brush 61 around axis P4. When the arm 71 has positioned the brush 61 at the processing position Qa, the motor 81 may rotate the brush 61 around axis P3. When the arm 71 positions the brush 61 at the processing position Qa, the actuator 91 may press the brush 61 downwards. The cup 51 catches the liquid splashed from the substrate W held by the substrate holding part 41. After that, the nozzle 101 stops discharging the rinse liquid. 【0124】 2nd process Next, the processing unit 31 processes the substrate W with a chemical solution and a brush. Specifically, the rotary drive unit 45 continues to rotate the substrate W. The moving mechanism 106 moves the nozzle 102 to the processing position. The nozzle 102 supplies the chemical solution to the substrate W held by the substrate holding unit 41. The arm 71 maintains the brush 61 at the processing position Qa. After that, the nozzle 102 stops discharging the chemical solution. 【0125】 3rd process Next, the processing unit 31 processes the substrate W with rinsing liquid and a brush. Specifically, the rotary drive unit 45 continues to rotate the substrate W. The nozzle 101 supplies rinsing liquid to the substrate W held by the substrate holding unit 41. With the brush 61 in contact with the substrate W held by the substrate holding unit 41, the arm 71 may rotate the brush 61 around the axis P4. The arm 71 maintains the brush 61 in the processing position Qa. After that, the nozzle 101 stops discharging the rinsing liquid. The arm 71 stops rotating the brush 61. 【0126】 4th step Finally, the processing unit 31 dries the substrate W. Specifically, the arm 71 moves the brush 61 to the standby position Qb. The moving mechanism 105 moves the nozzle 101 to the standby position. The moving mechanism 106 moves the nozzle 102 to the standby position. The rotary drive unit 45 continues to rotate the substrate W. The rotary drive unit 45 may increase the rotation speed of the substrate W. This shakes off the liquid on the substrate W. The substrate W is dried. After that, the rotary drive unit 45 stops rotating the substrate W. 【0127】 After the processing unit 31 has processed the substrate W, the center robot CR takes the substrate W from the substrate holding unit 41. The center robot CR then unloads the substrate W from the processing unit 31. 【0128】 Refer to Figure 1. The center robot CR transports the substrate W from the processing unit 31 to the second inversion unit 29. The second inversion unit 29 inverts the substrate W. As a result of the substrate W being inverted again, the top surface W1 of the substrate W corresponds to the surface of the substrate W. The indexer robot IR transports the substrate W from the second inversion unit 29 to the carrier C of the dispensing unit 11. 【0129】 <4. Effects of the Embodiment> The substrate processing apparatus 1 comprises a substrate holder 41, a cup 51, a brush 61, a motor 81, and an arm 71. The substrate holder 41 holds the substrate W in a horizontal position. The cup 51 is positioned to the side of the substrate holder 41. The motor 81 rotates the brush 61. The arm 71 supports the brush 61 and the motor 81. The arm 71 moves the brush 61 and the motor 81. The arm 71 positions the brush 61 at the processing position Qa. When the arm 71 positions the brush 61 at the processing position Qa, the brush 61 contacts the substrate W held by the substrate holder 41. When the arm 71 positions the brush 61 at the processing position Qa, at least a portion of the motor 81 is positioned lower than the upper edge 52 of the cup 51. Therefore, the arm 71 is positioned relatively low relative to the cup 51. Thus, the processing unit 31 is miniaturized. For example, referring to Figure 2, the length h of the processing unit 31 in the vertical direction Z is reduced. Therefore, the length H of the substrate processing apparatus 1 in the vertical direction Z is reduced. For example, even when four processing units 31 are arranged in the vertical direction Z, the length H of the substrate processing apparatus 1 in the vertical direction Z is not excessively large. 【0130】 As described above, the length H of the substrate processing apparatus 1 in the vertical direction Z is short. 【0131】 When the arm 71 positions the brush 61 at the processing position Qa, the motor 81 is positioned such that its lower end is lower than the upper edge 52 of the cup 51, and its upper end is higher than the upper edge 52 of the cup 51. Therefore, even when the arm 71 positions the brush 61 at the processing position Qa, the motor 81 does not come into contact with the processing cup 51, and the arm 71 can easily support the motor 81. 【0132】 When the arm 71 positions the brush 61 at the processing position Qa, at least a portion of the motor 81 overlaps with the cup 51 in a plan view. In other words, when the brush 61 contacts the substrate W held by the substrate holding portion 41, at least a portion of the motor 81 overlaps with the cup 51, which is positioned around the substrate holding portion 41, in a plan view. For this reason, the motor 81 is positioned close to the brush 61. In other words, the distance L2 is relatively short. As described above, the distance L2 is the horizontal distance between the motor 81 and the brush 61. Therefore, the motor 81 rotates the brush 61 effectively. 【0133】 The cup 51 comprises a vertical portion 53 and an inclined portion 54. The vertical portion 53 has a cylindrical shape and is erected in the vertical direction Z. The inclined portion 54 is inclined upward and inward from the vertical portion 53. When the arm 71 positions the brush 61 at the processing position Qa, at least a portion of the motor 81 overlaps with the inclined portion 54 in a plan view. Therefore, when the arm 71 positions the brush 61 at the processing position Qa, at least a portion of the motor 81 is positioned above the inclined portion 54. Thus, when the arm 71 positions the brush 61 at the processing position Qa, at least a portion of the motor 81 is preferably positioned lower than the upper edge 52 of the cup 51. 【0134】 When the arm 71 positions the brush 61 at the processing position Qa, the entire motor 81 is positioned higher than the vertical section 53. Therefore, even when the arm 71 positions the brush 61 at the processing position Qa, interference between the motor 81 and the vertical section 53 is prevented. 【0135】 When the arm 71 positions the brush 61 at the processing position Qa, at least a portion of the motor 81 is positioned at the same height as the inclined portion 54. Therefore, when the arm 71 positions the brush 61 at the processing position Qa, at least a portion of the motor 81 is preferably positioned lower than the upper edge 52 of the cup 51. 【0136】 When the arm 71 positions the brush 61 at the processing position Qa, the brush 61 is positioned inside the cup 51. Therefore, when the arm 71 positions the brush 61 at the processing position Qa, the brush 61 makes suitable contact with the substrate W held by the substrate holding portion 41. 【0137】 When the arm 71 positions the brush 61 at the processing position Qa, the motor 81 is positioned outside the cup 51. Therefore, interference between the motor 81 and the cup 51 is prevented when the arm 71 positions the brush 61 at the processing position Qa. Interference between the motor 81 and the substrate W held by the substrate holding part 41 is also prevented when the arm 71 positions the brush 61 at the processing position Qa. Thus, when the arm 71 positions the brush 61 at the processing position Qa, it is easy to position at least a portion of the motor 81 lower than the upper edge 52 of the cup 51. 【0138】 The substrate processing apparatus 1 includes a belt 85. The belt 85 is arranged horizontally. The belt 85 connects the motor 81 and the brush 61. When the arm 71 positions the brush 61 at processing position Qa, the entire belt 85 is positioned higher than the upper edge 52 of the cup 51. This prevents interference between the belt 85 and the cup 51. 【0139】 The motor 81 has a motor body 82 and an output shaft 83. The motor body 82 generates rotational power. The output shaft 83 extends upward from the motor body 82. The output shaft 83 is connected to a belt 85. When the arm 71 positions the brush 61 at the processing position Qa, at least a portion of the motor body 82 is positioned lower than the upper edge 52 of the cup 51. Therefore, when the arm 71 positions the brush 61 at the processing position Qa, at least a portion of the motor 81 is preferably positioned lower than the upper edge 52 of the cup 51. When the arm 71 positions the brush 61 at the processing position Qa, at least a portion of the output shaft 83 is positioned higher than the upper edge 52 of the cup 51. Therefore, when the arm 71 positions the brush 61 at the processing position Qa, the output shaft 83 is preferably connected to the belt 85. 【0140】 The substrate processing apparatus 1 includes a support column 77. The support column 77 is erected along the vertical direction Z. The support column 77 supports the arm 71. Distance L1 is the horizontal distance between the support column 77 and the brush 61. Distance L2 is the horizontal distance between the motor 81 and the brush 61. Distance L2 is shorter than distance L1. That is, the motor 81 is positioned close to the brush 61. Therefore, the motor 81 rotates the brush 61 effectively. 【0141】 The arm 71 includes a first sub-housing 73. At least a portion of the motor 81 is installed within the first sub-housing 73. Therefore, the arm 71 suitably supports the motor 81. 【0142】 The arm 71 includes a main housing 72. The main housing 72 is formed in a horizontally elongated shape. The first sub-housing 73 bulges downward from the main housing 72. Therefore, at least a portion of the motor 81 is positioned lower than the main housing 72. Thus, it is easy to position the motor 81 at a low position. 【0143】 When the arm 71 positions the brush 61 at the processing position Qa, the entire main housing 72 is positioned higher than the upper edge 52 of the cup 51. Therefore, even when the arm 71 positions the brush 61 at the processing position Qa, interference between the main housing 72 and the cup 51 is prevented. 【0144】 When the arm 71 positions the brush 61 at the processing position Qa, at least a portion of the first sub-housing 73 is positioned lower than the upper edge 52 of the cup 51. Therefore, when the arm 71 positions the brush 61 at the processing position Qa, at least a portion of the motor 81 is preferably positioned lower than the upper edge 52 of the cup 51. 【0145】 When the arm 71 positions the brush 61 at the processing position Qa, the lower end of the first sub-housing 73 is positioned lower than the upper edge 52 of the cup 51, and the upper end of the first sub-housing 73 is positioned higher than the upper edge 52 of the cup 51. Therefore, even when the arm 71 positions the brush 61 at the processing position Qa, the main housing 72 can easily support the first sub-housing 73. Thus, even when the arm 71 positions the brush 61 at the processing position Qa, the arm 71 can easily support the motor 81. 【0146】 When the arm 71 positions the brush 61 at the processing position Qa, at least a portion of the first sub-housing 73 overlaps with the cup 51 in a plan view. In other words, when the brush 61 contacts the substrate W held by the substrate holding portion 41, at least a portion of the first sub-housing 73 overlaps with the cup 51, which is positioned around the substrate holding portion 41, in a plan view. For this reason, the first sub-housing 73 is positioned close to the brush 61. Therefore, the motor 81 is positioned close to the brush 61. Consequently, the motor 81 rotates the brush 61 effectively. 【0147】 The substrate processing apparatus 1 includes an actuator 91. The actuator 91 presses the brush 61 downward. An arm 71 supports the actuator 91. The arm 71 moves the actuator 91. When the arm 71 positions the brush 61 at the processing position Qa, the entire actuator 91 is positioned higher than the upper edge 52 of the cup 51. Therefore, even when the arm 71 positions the brush 61 at the processing position Qa, interference between the actuator 91 and the cup 51 is prevented. 【0148】 When the arm 71 positions the brush 61 at the processing position Qa, the actuator 91 overlaps with the cup 51 in a plan view. In other words, when the brush 61 contacts the substrate W held by the substrate holding portion 41, at least a portion of the actuator 91 overlaps with the cup 51, which is positioned to the side of the substrate holding portion 41, in a plan view. For this reason, the actuator 91 is positioned close to the brush 61. Thus, the actuator 91 presses the brush 61 effectively. 【0149】 When the arm 71 positions the brush 61 at the processing position Qa, the actuator 91 coincides with the upper edge 52 of the cup 51 in a plan view. In other words, when the brush 61 contacts the substrate W held by the substrate holding portion 41, the actuator 91 coincides with the upper edge 52 of the cup 51 in a plan view. Therefore, the actuator 91 is positioned close to the brush 61. Thus, the actuator 91 presses the brush 61 effectively. 【0150】 When the arm 71 positions the brush 61 at the processing position Qa, the actuator 91 overlaps with the substrate W held by the substrate holding portion 41 in a plan view. In other words, when the brush 61 contacts the substrate W held by the substrate holding portion 41, the actuator 91 overlaps with the substrate W held by the substrate holding portion 41 in a plan view. Therefore, the actuator 91 is positioned close to the brush 61. Thus, the actuator 91 presses the brush 61 effectively. 【0151】 Distance L3 is the horizontal distance between the actuator 91 and the brush 61. Distance L2 is the horizontal distance between the motor 81 and the brush 61. Distance L3 is shorter than distance L2. Therefore, the actuator 91 is positioned close to the brush 61. Thus, the actuator 91 presses the brush 61 effectively. 【0152】 The arm 71 includes a second sub-housing. At least a portion of the actuator 91 is installed within the second sub-housing. Therefore, the arm 71 suitably supports the actuator 91. 【0153】 The second sub-housing bulges downward from the main housing 72. Therefore, at least a portion of the actuator 91 is positioned lower than the main housing 72. Thus, it is easy to position the actuator 91 at a lower position. 【0154】 When the arm 71 positions the brush 61 at the processing position Qa, the entire second sub-housing is positioned higher than the upper edge 52 of the cup 51. Therefore, even when the arm 71 positions the brush 61 at the processing position Qa, interference between the second sub-housing and the cup 51 is prevented. 【0155】 <5. Modified Embodiments> The present invention is not limited to the embodiments described below and can be modified and implemented as follows. 【0156】 (1) In the above embodiment, the arm 71 rotated the brush 61, motor 81, and actuator 91 in the horizontal plane. However, it is not limited to this. For example, the arm 71 may move the brush 61, motor 81, and actuator 91 in parallel in the horizontal direction. In this modified embodiment as well, the arm 71 moves the brush 61, motor 81, and actuator 91 in the horizontal direction. Thus, the arm 71 moves the brush 61 to the processing position Qa. 【0157】 (2) In the embodiments described above, the relative positional relationship between the substrate holder 41 and the cup 51 when the arm 71 places the brush 61 in standby position Qb was not described in detail. However, in the embodiments, when the arm 71 places the brush 61 in standby position Qb, the relative positional relationship between the substrate holder 41 and the cup 51 may be changed as appropriate. For example, when the arm 71 places the brush 61 in standby position Qb, the cup 51 may move downward relative to the substrate holder 41. Alternatively, when the arm 71 places the brush 61 in standby position Qb, the substrate holder 41 may move upward relative to the cup 51. According to these modified embodiments, the center robot CR can access the substrate holder 41 without interfering with the cup 51. 【0158】 (3) In the above-described embodiment, the processing unit 31 is equipped with an actuator 91. However, it is not limited to this. The processing unit 91 does not need to be equipped with an actuator 91. According to this modified embodiment, the processing unit 31 is made even smaller. For example, the length h of the processing unit 31 in the vertical direction Z is reduced. Therefore, the length H of the substrate processing apparatus 1 in the vertical direction Z is made even shorter. 【0159】 (4) The embodiments and each modified embodiment described in (1) to (3) above may be further modified as appropriate by substituting or combining each component with the components of other modified embodiments. [Explanation of symbols] 【0160】 1 ... Substrate processing equipment 31… Processing Unit 41 … Board holding part 51... cup 52… Upper edge 53… Vertical section 54 … Inclined part 56…Aperture 61… Brush 71… Arm 72… Main Housing 73 … 1st Sub-housing 74 … Second Sub-housing 77 … Pillar 81… Motor 82… Motor body 83 … Output shaft 85... belt 91… Actuator L1 … The horizontal distance between the support post and the brush. L2 … Horizontal distance between the motor and the brushes L3 … Horizontal distance between the actuator and the brush Qa... Brush processing position W… Circuit board

Claims

[Claim 1] A substrate processing apparatus, A substrate holding section that holds the substrate in a horizontal position, A cup positioned to the side of the substrate holding portion, A brush and A motor that rotates the aforementioned brush, An arm that supports the brush and the motor, and moves the brush and the motor, Equipped with, When the arm positions the brush in the processing position, the brush contacts the substrate held by the substrate holding portion, and at least a portion of the motor is positioned lower than the upper edge of the cup. When the arm positions the brush at the processing position, at least a portion of the motor overlaps with the cup in a plan view. Circuit board processing equipment. [Claim 2] A substrate processing apparatus, A substrate holding section that holds the substrate in a horizontal position, A cup positioned to the side of the substrate holding portion, A brush and A motor that rotates the aforementioned brush, An arm that supports the brush and the motor, and moves the brush and the motor, Equipped with, When the arm positions the brush in the processing position, the brush contacts the substrate held by the substrate holding portion, and at least a portion of the motor is positioned lower than the upper edge of the cup. The cup is A vertical section having a cylindrical shape and erected vertically, An inclined portion that slopes upward and inward from the aforementioned vertical portion, Equipped with, When the arm positions the brush at the processing position, at least a portion of the motor overlaps with the inclined portion in a plan view. Circuit board processing equipment. [Claim 3] In the substrate processing apparatus according to claim 2, When the arm positions the brush at the processing position, the entire motor is positioned higher than the vertical section, and at least a portion of the motor is positioned at the same height as the inclined section. Circuit board processing equipment. [Claim 4] A substrate processing apparatus, A substrate holding section that holds the substrate in a horizontal position, A cup positioned to the side of the substrate holding portion, A brush and A motor that rotates the aforementioned brush, An arm that supports the brush and the motor, and moves the brush and the motor, Equipped with, When the arm positions the brush in the processing position, the brush contacts the substrate held by the substrate holding portion, and at least a portion of the motor is positioned lower than the upper edge of the cup. The aforementioned arm is The main housing is formed in a horizontally elongated shape, A first sub-housing that bulges downward from the main housing, Equipped with, At least a portion of the motor is installed in the first sub-housing, When the arm positions the brush at the processing position, at least a portion of the first sub-housing overlaps with the cup in a plan view. Circuit board processing equipment. [Claim 5] In the substrate processing apparatus according to claim 4, When the arm positions the brush at the processing position, the entire main housing is positioned higher than the upper edge of the cup, and at least a portion of the first sub-housing is positioned lower than the upper edge of the cup. Circuit board processing equipment. [Claim 6] In the substrate processing apparatus according to claim 4, When the arm positions the brush at the processing position, the first sub-housing is positioned such that the lower end of the first sub-housing is lower than the upper edge of the cup, and the upper end of the first sub-housing is higher than the upper edge of the cup. Circuit board processing equipment. [Claim 7] A substrate processing apparatus, A substrate holding section that holds the substrate in a horizontal position, A cup positioned to the side of the substrate holding portion, A brush and A motor that rotates the aforementioned brush, An arm that supports the brush and the motor, and moves the brush and the motor, Equipped with, When the arm positions the brush in the processing position, the brush contacts the substrate held by the substrate holding portion, and at least a portion of the motor is positioned lower than the upper edge of the cup. The substrate processing apparatus is An actuator that presses the brush downwards, Equipped with, The arm further supports the actuator and moves the actuator. When the arm positions the brush at the processing position, the entire actuator is positioned higher than the upper edge of the cup. When the arm positions the brush in the processing position, the actuator overlaps with the cup in a plan view. Circuit board processing equipment. [Claim 8] A substrate processing apparatus, A substrate holding section that holds the substrate in a horizontal position, A cup positioned to the side of the substrate holding portion, A brush and A motor that rotates the aforementioned brush, An arm that supports the brush and the motor, and moves the brush and the motor, Equipped with, When the arm positions the brush in the processing position, the brush contacts the substrate held by the substrate holding portion, and at least a portion of the motor is positioned lower than the upper edge of the cup. The substrate processing apparatus is An actuator that presses the brush downwards, Equipped with, The arm further supports the actuator and moves the actuator. When the arm positions the brush at the processing position, the entire actuator is positioned higher than the upper edge of the cup. When the arm positions the brush at the processing position, the actuator overlaps with the upper edge of the cup in a plan view. Circuit board processing equipment. [Claim 9] A substrate processing apparatus, A substrate holding section that holds the substrate in a horizontal position, A cup positioned to the side of the substrate holding portion, A brush and A motor that rotates the aforementioned brush, An arm that supports the brush and the motor, and moves the brush and the motor, Equipped with, When the arm positions the brush in the processing position, the brush contacts the substrate held by the substrate holding portion, and at least a portion of the motor is positioned lower than the upper edge of the cup. The substrate processing apparatus is An actuator that presses the brush downwards, Equipped with, The arm further supports the actuator and moves the actuator. When the arm positions the brush at the processing position, the entire actuator is positioned higher than the upper edge of the cup. When the arm positions the brush at the processing position, the actuator overlaps with the substrate held by the substrate holding portion in a plan view. Circuit board processing equipment. [Claim 10] In the substrate processing apparatus according to any one of claims 7 to 9, The horizontal distance between the actuator and the brush is shorter than the horizontal distance between the motor and the brush. Circuit board processing equipment. [Claim 11] In the substrate processing apparatus according to any one of claims 7 to 9, The aforementioned arm is The main housing is formed in a horizontally elongated shape, A first sub-housing that bulges downward from the main housing, A second sub-housing that bulges downward from the main housing, Equipped with, At least a portion of the motor is installed in the first sub-housing, At least a portion of the actuator is installed in the second sub-housing. Circuit board processing equipment. [Claim 12] In the substrate processing apparatus according to claim 11, When the arm positions the brush at the processing position, the entire main housing is positioned higher than the upper edge of the cup, at least a portion of the first sub-housing is positioned lower than the upper edge of the cup, and the entire second sub-housing is positioned higher than the upper edge of the cup. Circuit board processing equipment. [Claim 13] In the substrate processing apparatus according to any one of claims 1, 2, 4, 7, 8, or 9, When the arm positions the brush at the processing position, the motor is positioned such that its lower end is lower than the upper edge of the cup and its upper end is higher than the upper edge of the cup. Circuit board processing equipment. [Claim 14] In the substrate processing apparatus according to any one of claims 1, 2, 4, 7, 8, or 9, When the arm positions the brush at the processing position, the brush is positioned inside the cup. When the arm positions the brush at the processing position, the motor is positioned outside the cup. Circuit board processing equipment. [Claim 15] In the substrate processing apparatus according to any one of claims 1, 2, 4, 7, 8, or 9, The substrate processing apparatus is A belt is arranged horizontally and connects the motor and brushes, Equipped with, When the arm positions the brush at the processing position, the entire belt is positioned higher than the upper edge of the cup. Circuit board processing equipment. [Claim 16] In the substrate processing apparatus according to claim 15, The aforementioned motor is The motor body that generates rotational power, An output shaft extending upward from the motor body and connected to the belt, Equipped with, When the arm positions the brush at the processing position, at least a portion of the motor body is positioned lower than the upper edge of the cup, and at least a portion of the output shaft is positioned higher than the upper edge of the cup. Circuit board processing equipment. [Claim 17] In the substrate processing apparatus according to any one of claims 1, 2, 4, 7, 8, or 9, The substrate processing apparatus is A support column erected vertically and supporting the arm, Equipped with, The horizontal distance between the motor and the brush is shorter than the horizontal distance between the support column and the brush. Circuit board processing equipment.

Images