Electronic circuit board unit and battery monitoring system

Abstract

An electronic substrate unit that comprises an electronic substrate in which a circuit is formed and a wireless module which is mounted to the electronic substrate, and that is accommodated inside a housing of a battery pack, wherein the electronic substrate has a plurality of attachment parts for the wireless module, and the wireless module is provided in one-to-one correspondence with the electronic substrate and is attached to one of the plurality of attachment parts.

Description

Technical Field

[0001] The present invention relates to an electronic substrate unit and a battery monitoring system.

Background Art

[0002] For example, Patent Document 1 discloses a storage battery device. In the storage battery device disclosed in Patent Document 1, communication between a battery module and a battery management unit is made wireless. When a battery module and a battery management unit are housed in a metal casing, radio waves used for communication are reflected inside the casing. Interference between such reflected radio waves may cause a deterioration in communication quality. The storage battery device disclosed in Patent Document 1 includes a battery management unit provided with a plurality of wireless transmission / reception modules. By including a battery management unit having such a plurality of wireless transmission / reception modules, the storage battery device disclosed in Patent Document 1 suppresses a deterioration in communication quality.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] For example, the deterioration of communication quality due to radio wave interference in a battery pack, such as the battery storage device described in Patent Document 1, can be suppressed by providing multiple antennas on the electronic circuit board provided for each battery module or on the electronic circuit board provided for the battery management unit. For example, multiple antennas can be provided on an electronic circuit board by providing multiple wireless modules, each having one antenna, to the electronic circuit board. Alternatively, multiple antennas can be provided on an electronic circuit board by providing wireless modules, each having multiple antennas, to the electronic circuit board. However, providing multiple wireless modules to an electronic circuit board or providing multiple antennas to wireless modules complicates the assembly process and increases equipment costs.

[0005] This invention has been made in view of the above-mentioned problems, and aims to suppress the deterioration of communication quality due to radio wave interference without providing multiple antennas on the electronic circuit board unit housed inside the battery pack casing. [Means for solving the problem]

[0006] The present invention employs the following configuration as a means to solve the above problems.

[0007] One aspect of the present invention is an electronic circuit board unit housed inside a battery pack housing, comprising an electronic circuit board on which a circuit is formed and a wireless module mounted on the electronic circuit board, wherein the electronic circuit board has a plurality of mounting portions for the wireless module, and one wireless module is provided for each electronic circuit board, and is attached to one of the plurality of mounting portions. [Effects of the Invention]

[0008] The present invention has an electronic circuit board with multiple mounting points for wireless modules. Therefore, the wireless module can be installed by selecting a mounting point with high radio wave intensity for communication. In other words, the present invention allows for the selection of the installation position of the wireless module so that null points where radio wave intensity decreases in a specific operating band do not occur. Accordingly, the present invention can suppress the deterioration of communication quality due to radio wave interference without providing multiple antennas on the electronic circuit board unit housed inside the battery pack housing. [Brief explanation of the drawing]

[0009] [Figure 1] This is an exploded perspective view showing the schematic configuration of the battery pack in the first embodiment of the present invention. [Figure 2] This is a block diagram showing the schematic configuration of the battery monitoring system S in the first embodiment of the present invention. [Figure 3] This is a block diagram including a voltage detection device A and a monitoring device B that are part of the battery monitoring system according to the first embodiment of the present invention. [Figure 4] This is a schematic diagram of a voltage detection device according to the first embodiment of the present invention. [Figure 5] This is a schematic diagram of an electronic circuit board included in the voltage detection device according to the first embodiment of the present invention. [Figure 6] This is a schematic cross-sectional view of a printed circuit board included in the voltage detection device according to the first embodiment of the present invention. [Figure 7] This is a schematic diagram of a wireless module in the first embodiment of the present invention, where (a) shows the front side of the wireless module and (b) shows the back side of the wireless module. [Figure 8] This is a schematic diagram showing the arrangement relationship between the forward-facing mounting portion and the left-facing mounting portion in the first embodiment of the present invention, where (a) shows the forward-facing mounting portion and the left-facing mounting portion arranged in overlapping positions, (b) shows the forward-facing mounting portion, and (c) shows the left-facing mounting portion. [Figure 9]This is an enlarged view of a wireless module attached to an electronic circuit board of a voltage detection device in a first embodiment of the present invention, where (a) is an enlarged view of a wireless module attached to the electronic circuit board facing forward, and (b) is an enlarged view of a wireless module attached to the electronic circuit board facing left. [Figure 10] This is a schematic enlarged view of the portion of the electronic circuit board of the voltage detection device in the first embodiment of the present invention where the forward mounting portion and the left-facing mounting portion are provided. [Figure 11] This is a schematic diagram showing the second conductive layer of a printed circuit board in the first embodiment of the present invention. [Figure 12] This is a schematic diagram showing the third conductive layer of a printed circuit board in the first embodiment of the present invention. [Figure 13] This is a schematic diagram of an electronic circuit board included in the monitoring device according to the first embodiment of the present invention. [Figure 14] This is a schematic diagram of an electronic circuit board included in a voltage detection device according to a second embodiment of the present invention. [Figure 15] This is a schematic diagram of an electronic circuit board included in a monitoring device according to a second embodiment of the present invention. [Figure 16] This figure schematically shows the surface side of a wireless module in a third embodiment of the present invention. [Figure 17] This is a schematic diagram showing an enlarged portion of the electronic circuit board of the voltage detection device according to the third embodiment of the present invention. [Modes for carrying out the invention]

[0010] Hereinafter, an embodiment of the electronic circuit board unit and battery monitoring system according to the present invention will be described with reference to the drawings.

[0011] (First Embodiment) FIG. 1 is an exploded perspective view showing a schematic configuration of a battery pack P according to the present embodiment. The battery pack P is mounted on a vehicle such as an electric vehicle or a hybrid vehicle, for example. As shown in FIG. 1, the battery pack P includes a housing C, a plurality of battery modules M, and a battery monitoring system S of the present embodiment. Further, the battery pack P includes connectors and contacts (not shown).

[0012] The housing C is a metal container that houses a plurality of battery modules M and the battery monitoring system S. For example, as shown in FIG. 1, the housing C includes a box-shaped container main body C1 that is partially open, and a lid portion C2 that closes the opening of the container main body C1. However, the shape of the housing C is not limited to the shape shown in FIG. 1, and any shape that can house a plurality of battery modules M and the battery monitoring system S may be used.

[0013] Each battery module M includes a plurality of battery cells connected in series or in parallel. Each battery module M outputs the total voltage of each battery cell as an output voltage. These plurality of battery modules M are connected in series and housed inside the housing C. Note that the battery pack P shown in FIG. 1 includes eight battery modules M. However, the number of battery modules M included in the battery pack P can be changed.

[0014] Each of these battery modules M is a battery that stores electric power for driving a vehicle such as an electric vehicle or a hybrid vehicle, and is a secondary battery such as a lithium-ion battery or a nickel-metal hydride battery. Further, the battery module M can use a fuel cell in addition to the above-described lithium-ion battery and nickel-metal hydride battery. A battery pack P including a plurality of such battery modules M outputs an output voltage of, for example, several hundred volts.

[0015] The battery monitoring system S of the present embodiment monitors the voltage and the like of each battery module M of the battery pack P. Further, the battery monitoring system S of the present embodiment adjusts the voltage of the battery cells included in the battery module M as necessary. FIG. 2 is a block diagram showing a schematic configuration of the battery monitoring system S of the present embodiment.

[0016] As shown in Figure 2, the battery monitoring system S of this embodiment comprises a plurality of voltage detection devices A (electronic circuit board units) and a single monitoring device B (electronic circuit board unit). These voltage detection devices A and monitoring device B are wirelessly connected to each other via a predetermined wireless line.

[0017] Multiple voltage detection devices A are provided, corresponding to each battery module M. In other words, there are as many voltage detection devices as there are battery modules M. Each voltage detection device A detects the voltage of its corresponding battery module M (the voltage of each battery cell) and wirelessly transmits the detected voltage value to the monitoring device B.

[0018] Monitoring device B monitors the status of each battery module M based on the voltage detection values ​​of each battery module M received wirelessly from each voltage detection device A. This monitoring device B sequentially reports the monitoring results of the battery modules M to a higher-level control device (not shown).

[0019] These voltage detection devices A and monitoring devices B will be explained in more detail with reference to Figure 3. Each voltage detection device A is assigned individual identification information to determine its own location, but its basic configuration is identical.

[0020] Figure 3 is a block diagram of the battery monitoring system S in this embodiment, including the voltage detection device A and the monitoring device B. As shown in this figure, the voltage detection device A includes a voltage measurement unit 1, a plurality of discharge circuits 2, a voltage detection device storage unit 3, a voltage detection device wireless communication unit 4, and a voltage detection device processing unit 5.

[0021] The voltage measurement unit 1 detects the output voltage (cell voltage) of each battery cell constituting the battery module M and outputs the detected value of each cell voltage (cell voltage detection value) to the voltage detection device processing unit 5. As shown in the figure, the electrodes (positive electrode and negative electrode) of each battery cell in the battery module M are connected to multiple input terminals. The voltage measurement unit 1 acquires the cell voltage detection value for each battery cell based on the difference between the potential of the positive electrode and the potential of the negative electrode.

[0022] The voltage measurement unit 1 detects the cell voltage, which is an analog value, by sampling the potential of the positive electrode and the negative electrode of each battery cell at a predetermined time interval. The voltage measurement unit 1 also sequentially outputs the detected cell voltage to the voltage detection device processing unit 5.

[0023] As described above, each battery module M is a secondary battery capable of both discharging and charging. Each discharge circuit 2 is provided for each battery cell of the battery module M and is a series circuit for equalizing the charge state. Each discharge circuit 2 is a circuit in which an electronic switch and a resistor, provided for each battery cell, are connected in series.

[0024] These discharge circuits 2 are equipped with electronic switches, such as switching transistors, which are operated by a voltage detection device processing unit 5 to switch between an on state and an off state. The voltage detection device processing unit 5 is also equipped with a resistor connected in series with the electronic switch and having a predetermined resistance value. The electronic switch of the discharge circuit 2 corresponding to each battery cell is switched between an on state and an off state by the voltage detection device processing unit 5. When the electronic switch of the discharge circuit 2 is turned on, the power of the battery cell is discharged.

[0025] The voltage detection device storage unit 3 is, for example, a rewritable non-volatile memory. The voltage detection device storage unit 3 stores the cell voltage measured by the voltage measurement unit 1, as well as programs and parameters necessary for processing by the voltage detection device processing unit 5.

[0026] The voltage detection device wireless communication unit 4 transmits and receives information by wirelessly communicating with the monitoring device B. The voltage detection device wireless communication unit 4 receives information obtained from the monitoring device B via wireless communication and outputs it to the voltage detection device processing unit 5. The voltage detection device wireless communication unit 4 also transmits information from the voltage detection device processing unit 5 to the monitoring device B via wireless communication. The communication method for wireless communication is not particularly limited as long as it is wireless.

[0027] The voltage detection unit 5 performs cell balance control by controlling the discharge circuit 2 based on the multiple cell voltages acquired from the voltage measurement unit 1. The voltage detection unit 5 also transmits information necessary for the stable operation of the battery module M (hereinafter referred to as "management information") to the monitoring device B via wireless communication. Management information includes, for example, information indicating multiple cell voltages, the highest cell voltage, and the lowest cell voltage.

[0028] Figure 4 is a schematic diagram of voltage detection device A. As shown in Figure 4, in this embodiment, voltage detection device A is an electronic circuit board unit comprising an electronic circuit board 20 and a wireless module 21. As shown in Figure 4, in voltage detection device A, the wireless module 21 is mounted on the electronic circuit board 20.

[0029] Figure 5 is a schematic diagram of the electronic circuit board 20. The electronic circuit board 20 is a substrate on which a circuit is formed, and comprises a printed circuit board 20a and electronic components 20b. The printed circuit board 20a is a multilayer substrate provided with multiple conductive layers. Figure 6 is a schematic cross-sectional view of the printed circuit board 20a. As shown in this figure, in this embodiment, the printed circuit board 20a has four conductive layers (first conductive layer L1, second conductive layer L2, third conductive layer L3, and fourth conductive layer L4). Note that the number of conductive layers of the printed circuit board 20a can be changed.

[0030] For the sake of explanation, of these four conductive layers, the conductive layer located closest to the front of the substrate will be referred to as the first conductive layer L1, and the conductive layer located closest to the back of the substrate will be referred to as the fourth conductive layer L4. Furthermore, of the two intermediate layers located between the first conductive layer L1 and the fourth conductive layer L4, the conductive layer on the side of the first conductive layer L1 will be referred to as the second conductive layer L2, and the conductive layer on the side of the fourth conductive layer L4 will be referred to as the third conductive layer L3.

[0031] Furthermore, the printed circuit board 20a has multiple through-holes H that electrically connect multiple conductor layers. Through these through-holes H, the conductor layers are connected to other conductor layers. Note that the printed circuit board 20a may have vias that do not penetrate the printed circuit board 20a, either in place of or in addition to the through-holes H.

[0032] Electronic component 20b is, for example, a processor such as a CPU (Central Processing Unit) or MPU (Micro Processing Unit). Alternatively, electronic component 20b may be non-volatile or volatile semiconductor memory (e.g., RAM (Random Access Memory), ROM (Read Only Memory), flash memory, EPROM (Erasable Programmable Read Only Memory), EEPROM (Electrically Erasable Programmable Read Only Memory)).

[0033] One wireless module 21 is provided for each electronic circuit board 20. In this embodiment, this wireless module 21 functions as the wireless communication unit 4 of the voltage detection device described above. Figure 7 is a schematic diagram of the wireless module 21, where (a) shows the front side of the wireless module 21 and (b) shows the back side of the wireless module 21.

[0034] As shown in Figure 7, the wireless module 21 has a wireless IC chip 21a and one antenna section 21b. The wireless IC chip 21a is an IC (Integrated Circuit) chip that processes signals transmitted and received by the antenna section 21b. The wireless IC chip 21a is formed in a square shape as shown in Figure 7. The antenna section 21b is provided projecting from one side of the square-shaped wireless IC chip 21a to the side of the wireless IC chip 21a. This antenna section 21b consists of a single antenna element.

[0035] The orientation of the wireless module 21 is defined as the direction in which the antenna portion 21b protrudes from the wireless IC chip 21a. For example, if the wireless module 21 is mounted on the electronic circuit board 20 such that the antenna portion 21b faces the front of the electronic circuit board 20 from the perspective of the wireless IC chip 21a, then the orientation of the wireless module 21 is considered to be forward.

[0036] As shown in Figure 7(b), the wireless IC chip 21a has multiple terminals (terminals a1 to j1) on its back side. In this embodiment, the wireless IC chip 21a has 10 terminals. However, the number of terminals provided on the wireless IC chip 21a can be changed. For the sake of explanation, these 10 terminals will be referred to as terminals a1 to j1. As shown in Figure 7(b), terminals a1 to j1 are arranged to form a square (rectangle). In other words, terminals a1 to j1 are arranged in a square pattern.

[0037] Returning to Figure 5, the electronic circuit board 20 is equipped with mounting parts for the wireless module 21 (a forward-facing mounting part 30 and a left-facing mounting part 40). Although the installation orientation of the electronic circuit board 20 is not particularly limited, for the sake of explanation, as shown in Figure 5, one direction will be referred to as the front-rear direction, and the direction perpendicular to the front-rear direction will be referred to as the left-right direction.

[0038] The electronic circuit board 20 has a forward-facing mounting portion 30 (first mounting portion) in which the wireless module 21 faces forward when the wireless module 21 is attached, and a left-facing mounting portion 40 (second mounting portion) in which the wireless module 21 faces left when the wireless module 21 is attached.

[0039] The forward-facing mounting section 30 and the left-facing mounting section 40 each have multiple pads. Figure 8 is a schematic diagram showing the arrangement of the forward-facing mounting section 30 and the left-facing mounting section 40, where (a) shows the forward-facing mounting section 30 and the left-facing mounting section 40 arranged in overlapping positions, (b) shows the forward-facing mounting section 30, and (c) shows the left-facing mounting section 40.

[0040] As shown in Figure 8(b), the forward-facing mounting section 30 has the same number of pads (pads a2 to j2) as the terminals of the wireless module 21. These pads are terminal connection sections for connecting the wireless module 21 and are formed from a part of the first conductor layer L1. In this embodiment, since the wireless module 21 has 10 terminals, the forward-facing mounting section 30 also has 10 pads. For the sake of explanation, these 10 pads will be referred to as pads a2 to j2 (terminal connection sections). As shown in Figure 8(b), these pads a2 to j2 are arranged to form a square (rectangle), similar to the terminals a1 to j1 of the wireless module 21. In other words, the terminals a1 to j1 are arranged in a square pattern.

[0041] When the wireless module 21 is mounted facing forward on the electronic circuit board 20, terminals a1 to j1 are connected to pads a2 to j2 of the forward mounting section 30. In this case, terminals a1 to j1 are joined to pads a2 to j2 using a soldering material such as solder. Pad a2 is the terminal connection section to which terminal a1 is connected. Pad b2 is the terminal connection section to which terminal b1 is connected. Pad c2 is the terminal connection section to which terminal c1 is connected. Pad d2 is the terminal connection section to which terminal d1 is connected. Pad e2 is the terminal connection section to which terminal e1 is connected. Pad f2 is the terminal connection section to which terminal f1 is connected. Pad g2 is the terminal connection section to which terminal g1 is connected. Pad h2 is the terminal connection section to which terminal h1 is connected. Pad i2 is the terminal connection section to which terminal i1 is connected. Pad j2 is the terminal connection section to which terminal j1 is connected.

[0042] Figure 9 is an enlarged view of a wireless module 21 mounted on an electronic circuit board 20, where (a) is an enlarged view of a wireless module 21 mounted facing forward on the electronic circuit board 20, and (b) is an enlarged view of a wireless module 21 mounted facing left on the electronic circuit board 20. When the wireless module 21 is mounted on the forward mounting section 30, the wireless module 21 is mounted such that the antenna section 21b of the wireless module 21 is located in front of the wireless IC chip 21a, as shown in Figure 9(a). In other words, the orientation of the wireless module 21 mounted on the forward mounting section 30 is forward, as indicated by the arrow in Figure 8(b).

[0043] As shown in Figure 8(c), the left-facing mounting section 40 has the same number of pads (pads a3 to j3) as the terminals of the wireless module 21. These pads are terminal connection sections for connecting the wireless module 21 and are formed from a part of the first conductor layer L1. In this embodiment, since the wireless module 21 has 10 terminals, the left-facing mounting section 40 also has 10 pads. For the sake of explanation, these 10 pads will be referred to as pads a3 to j3 (terminal connection sections). As shown in Figure 8(c), these pads a3 to j3 are arranged to form a square (rectangle), similar to the terminals a1 to j1 of the wireless module 21. In other words, the terminals a1 to j1 are arranged in a square pattern.

[0044] When the wireless module 21 is mounted to the electronic circuit board 20 facing left, terminals a1 to j1 are connected to pads a3 to j3 of the left-facing mounting section 40. In this case, terminals a1 to j1 are joined to pads a3 to j3 using solder or other brazing material. Pad a3 is the terminal connection section to which terminal a1 is connected. Pad b3 is the terminal connection section to which terminal b1 is connected. Pad c3 is the terminal connection section to which terminal c1 is connected. Pad d3 is the terminal connection section to which terminal d1 is connected. Pad e3 is the terminal connection section to which terminal e1 is connected. Pad f3 is the terminal connection section to which terminal f1 is connected. Pad g3 is the terminal connection section to which terminal g1 is connected. Pad h3 is the terminal connection section to which terminal h1 is connected. Pad i3 is the terminal connection section to which terminal i1 is connected. Pad j3 is the terminal connection section to which terminal j1 is connected.

[0045] When the wireless module 21 is mounted on the left-facing mounting section 40, the wireless module 21 is mounted such that the antenna section 21b of the wireless module 21 is located to the left of the wireless IC chip 21a, as shown in Figure 9(b). In other words, the orientation of the wireless module 21 mounted on the left-facing mounting section 40 is left-facing, as indicated by the arrow in Figure 8(c).

[0046] The pads a2-j2 of the forward-facing mounting section 30 and the pads a3-j3 of the left-facing mounting section 40 are all connected to the terminals a1-j1 of the wireless module 21. For this reason, the pads a2-j2 of the forward-facing mounting section 30 and the pads a3-j3 of the left-facing mounting section 40 are arranged to form a square pattern of the same size. Note that the pads a3-j3 of the left-facing mounting section 40 are positioned so as not to overlap with the pads a2-j2 of the forward-facing mounting section 30 when the pads a2-j2 of the forward-facing mounting section 30 are rotated 90° to the left around the center O of the square pattern.

[0047] As shown in Figure 8(a), the voltage detection device A of this embodiment includes a forward-facing mounting portion 30 and a left-facing mounting portion 40, both located at the same position on the electronic circuit board 20, such that the center O of the square drawn by pads a2 to j2 of the forward-facing mounting portion 30 coincides with the center O of the square drawn by a3 to j3 of the left-facing mounting portion 40. In this embodiment, as shown in Figure 5, the forward-facing mounting portion 30 and the left-facing mounting portion 40 are arranged to overlap on the left front side of the electronic circuit board 20. In other words, in this embodiment, the forward-facing mounting portion 30 and the left-facing mounting portion 40 are arranged to overlap when viewed from the normal direction of the electronic circuit board 20 (a direction perpendicular to the front-rear and left-right directions).

[0048] The wireless module 21 is attached to either the forward-facing mounting portion 30 or the left-facing mounting portion 40 described above. In other words, in the voltage detection device A of this embodiment, one wireless module 21 is provided on the electronic circuit board 20 and is attached to one of the multiple mounting portions provided on the electronic circuit board 20.

[0049] Furthermore, the electronic circuit board 20 has a notch 20c provided in a position that may face the antenna portion 21b of the wireless module 21 when the wireless module 21 is mounted. In this embodiment, the wireless module 21 can be mounted on the electronic circuit board 20 facing forward or to the left. For this reason, the notch 20c is provided so that a part of the electronic circuit board 20 does not face the antenna portion 21b when the wireless module 21 is facing forward, and a part of the electronic circuit board 20 does not face the antenna portion 21b when the wireless module 21 is facing to the left. Such a notch 20c prevents a part of the electronic circuit board 20 from facing the back surface of the antenna portion 21b of the wireless module 21. As a result, the voltage detection device A can prevent a part of the electronic circuit board 20 from shielding radio waves incident on the antenna portion 21b or radio waves emitted from the antenna portion 21b, thereby improving communication quality.

[0050] Figure 10 is a schematic enlarged view of the area of ​​the electronic circuit board 20 where the forward mounting portion 30 and the left-facing mounting portion 40 are provided. As shown in this figure, the electronic circuit board 20 has a plurality of through-holes (H1 to H13) connected to pads. Through-hole H1 is connected to pad a2. Through-hole H2 is connected to pad i3. Through-hole H3 is connected to pad j3. Through-hole H4 is connected to pad c2. Through-hole H5 is connected to pad a3. Through-hole H6 is connected to pad e2. Through-hole H7 is connected to pad c3. Through-hole H8 is connected to pad f2. Through-hole H9 is connected to pad g2. Through-hole H10 is connected to pad e3. Through-hole H11 is connected to pad f3. Through-hole H12 is connected to pad i2. Through-hole H13 is connected to pad j2.

[0051] Furthermore, as shown in Figure 10, pads b2 and b3 are connected via connecting wire Lb. Pads d2 and d3 are connected via connecting wire Ld. Pads h2 and h3 are connected via connecting wire Lh. These connecting wires Lb, Ld, and Lh are formed from a portion of the first conductor layer L1.

[0052] Figure 11 is a schematic diagram showing the second conductor layer L2 of the printed circuit board 20a. As shown in this figure, through-holes H4 and H7 are connected by a connecting line Lc. In other words, pads c2 and c3 shown in Figure 10 are connected via the connecting line Lc.

[0053] Furthermore, as shown in Figure 11, through-hole H6 and through-hole H10 are connected by a connecting wire Le. In other words, pads e2 and e3 shown in Figure 10 are connected via the connecting wire Le.

[0054] Furthermore, as shown in Figure 11, through-hole H8 and through-hole H11 are connected by a connecting wire Lf. In other words, pads f2 and f3 shown in Figure 11 are connected via the connecting wire Lf.

[0055] Furthermore, as shown in Figure 11, through-hole H2 and through-hole H12 are connected by connecting wire Li. In other words, pads i2 and i3 shown in Figure 10 are connected via connecting wire Li.

[0056] Figure 12 is a schematic diagram showing the third conductor layer L3 of the printed circuit board 20a. As shown in this figure, through-holes H9 and H13 are connected by a connecting line Lg. In other words, pads g2 and g3 shown in Figure 10 are connected via the connecting line Lg.

[0057] Furthermore, as shown in Figure 12, through-hole H3 and through-hole H14 are connected by connecting wire Lj. In other words, pads j2 and j3 shown in Figure 10 are connected via connecting wire Lj.

[0058] The connecting wires Lc, Le, Lf, and Li shown in Figure 11 are formed from a portion of the second conductor layer L2. Furthermore, the connecting wires Lg and Lj shown in Figure 12 are formed from a portion of the third conductor layer L3.

[0059] As described above, in this embodiment, the pads of the forward-facing mounting section 30 and the left-facing mounting section 40 that are connected to the same terminals of the wireless module 21 are electrically connected to each other. That is, pad a2 of the forward-facing mounting section 30 is electrically connected to pad a3 of the left-facing mounting section 40. Also, pad b2 of the forward-facing mounting section 30 is electrically connected to pad b3 of the left-facing mounting section 40. Also, pad c2 of the forward-facing mounting section 30 is electrically connected to pad c3 of the left-facing mounting section 40. Also, pad d2 of the forward-facing mounting section 30 is electrically connected to pad d3 of the left-facing mounting section 40. Also, pad e2 of the forward-facing mounting section 30 is electrically connected to pad e3 of the left-facing mounting section 40. Also, pad f2 of the forward-facing mounting section 30 is electrically connected to pad f3 of the left-facing mounting section 40. Also, pad g2 of the forward-facing mounting section 30 is electrically connected to pad g3 of the left-facing mounting section 40. Furthermore, pad h2 of the forward-facing mounting section 30 is electrically connected to pad h3 of the left-facing mounting section 40. Also, pad i2 of the forward-facing mounting section 30 is electrically connected to pad i3 of the left-facing mounting section 40. Furthermore, pad j2 of the forward-facing mounting section 30 is electrically connected to pad j3 of the left-facing mounting section 40.

[0060] In this embodiment of the voltage detection device A, the left-facing mounting portion 40 is positioned by rotating the forward-facing mounting portion 30 90° counterclockwise around the center O, and the pads a3 to j3 of the left-facing mounting portion 40 are electrically connected to the pads a2 to j2 of the forward-facing mounting portion 30, which are positioned by rotating them 90° around the center O. Therefore, the wireless module 21 is electrically connected to the electronic circuit board 20 in the same way regardless of whether it is mounted on the forward-facing mounting portion 30 or the left-facing mounting portion 40.

[0061] Returning to Figure 2, monitoring device B manages multiple battery modules M by transmitting and receiving information through wireless communication with each of the multiple voltage detection devices A. Monitoring device B communicates with each of the multiple voltage detection devices A and receives management information for each battery module M. Based on this management information, monitoring device B understands the status of each battery module M. For example, monitoring device B is a BMU (Battery Management Unit). As shown in Figure 3, such monitoring device B includes a monitoring device wireless communication unit 11, a monitoring device processing unit 12, and a monitoring device storage unit 13.

[0062] The monitoring device wireless communication unit 11 communicates wirelessly with the voltage detection device wireless communication unit 4 of the voltage detection device A to send and receive information. The monitoring device wireless communication unit 11 receives information obtained wirelessly from the voltage detection device wireless communication unit 4 of the voltage detection device A and outputs it to the monitoring device processing unit 12. The monitoring device wireless communication unit 11 also transmits information from the monitoring device processing unit 12 to the voltage detection device wireless communication unit 4 via wireless communication.

[0063] The monitoring device processing unit 12 acquires management information from the voltage detection device A via wireless communication. For example, based on the management information obtained from the voltage detection device A, the monitoring device processing unit 12 makes a determination as to whether each battery module M is functioning normally or not. To prevent communication between the monitoring device B and each voltage detection device A from becoming mixed, wireless communication between the monitoring device B and each voltage detection device A is scheduled using a timer or the like.

[0064] The monitoring device storage unit 13 is a rewritable non-volatile memory, etc. The monitoring device storage unit 13 stores, for example, programs and parameters for causing the monitoring device processing unit 12 to execute processing.

[0065] Monitoring device B, like each voltage detection device A, is an electronic circuit board unit comprising an electronic circuit board and a wireless module. Figure 13 is a schematic diagram of the electronic circuit board 50 of monitoring device B. Note that the wireless module of monitoring device B has the same configuration as the wireless module of voltage detection device A, so its explanation is omitted here.

[0066] The electronic circuit board 50 is a circuit board on which a circuit is formed, and comprises a printed circuit board 50a and an electronic component 50b. The printed circuit board 50a is a multilayer board with multiple conductive layers, similar to the printed circuit board 20a of the voltage detection device A. The printed circuit board 50a also has multiple through-holes that electrically connect the multiple conductive layers. The printed circuit board 50a may have vias that do not penetrate the printed circuit board 50a, either in place of or in addition to the through-holes.

[0067] Electronic component 50b is, for example, a processor such as a CPU or MPU. Alternatively, electronic component 50b may be non-volatile or volatile semiconductor memory (e.g., RAM, ROM, flash memory, EPROM, EEPROM).

[0068] Such an electronic circuit board 50 is equipped with mounting sections for a wireless module (a forward-facing mounting section 30 and a left-facing mounting section 40). The installation orientation of the electronic circuit board 50 is not particularly limited, but for the sake of explanation, as shown in Figure 13, one direction will be referred to as the front-rear direction, and the direction perpendicular to the front-rear direction will be referred to as the left-right direction. The electronic circuit board 50 has a forward-facing mounting section 30 (first mounting section) in which the wireless module faces forward when the wireless module is attached, and a left-facing mounting section 40 (second mounting section) in which the wireless module faces left when the wireless module is attached. In this embodiment, as shown in Figure 5, the forward-facing mounting section 30 and the left-facing mounting section 40 are provided on the left front side of the electronic circuit board 50 so as to overlap.

[0069] Furthermore, the electronic circuit board 50 has a notch 50c provided in a position that may face the antenna portion 21b of the wireless module when the wireless module is mounted. In this embodiment, the wireless module can be mounted on the electronic circuit board 20 facing forward or to the left. For this reason, the notch 50c is provided so that a part of the electronic circuit board 50 does not face the antenna portion 21b when the wireless module is facing forward or when the wireless module is facing to the left.

[0070] In this embodiment of voltage detection device A, the mounting position of the wireless module 21 is selected based on experiments and simulations to prevent a null point from occurring at the antenna portion 21b of the wireless module 21 in a specific operating band where the radio wave strength decreases. Specifically, either the forward-facing mounting portion 30 or the left-facing mounting portion 40 is selected as the mounting position of the wireless module 21. For example, by performing experiments and simulations with the wireless module 21 mounted on the forward-facing mounting portion 30, it is detected whether a null point occurs in a specific operating band used by the wireless module 21. If this null point occurs at the antenna portion 21b of the wireless module 21, the left-facing mounting portion 40 is selected as the mounting position for the wireless module 21. If a null point occurs in both cases, using the forward-facing mounting portion 30 and the left-facing mounting portion 40, the option with higher radio wave strength is selected.

[0071] Furthermore, in the monitoring device B of this embodiment, the mounting position of the wireless module is selected based on experiments and simulations to ensure that no null points occur in a specific operating band at the position of the wireless module's antenna. Specifically, either the forward-facing mounting section 30 or the left-facing mounting section 40 is selected as the mounting position of the wireless module. For example, by performing experiments and simulations with the wireless module mounted on the forward-facing mounting section 30, it is detected whether a null point occurs in a specific operating band used by the wireless module. If this null point occurs at the position of the wireless module's antenna, the left-facing mounting section 40 is selected as the mounting position for the wireless module. If a null point occurs in both the forward-facing mounting section 30 and the left-facing mounting section 40, the one with the higher radio wave strength is selected.

[0072] The voltage detection device A of this embodiment, as described above, comprises an electronic circuit board 20 on which a circuit is formed and a wireless module 21. The wireless module 21 is mounted on the electronic circuit board 20. The voltage detection device A is housed inside the casing C of the battery pack P. The electronic circuit board 20 has multiple mounting parts for the wireless module 21 (forward mounting part 30 and leftward mounting part 40). One wireless module 21 is provided for each electronic circuit board 20 and is attached to one of the multiple mounting parts.

[0073] In this embodiment of the voltage detection device A, the wireless module 21 can be installed at a mounting location with high radio wave intensity for communication. In other words, the voltage detection device A can select the installation position of the wireless module 21 so that no null points occur in the specific operating band used by the wireless module 21 at the position of the antenna portion 21b of the wireless module 21. Therefore, the voltage detection device A can suppress the deterioration of communication quality due to radio wave interference without providing multiple antennas.

[0074] Furthermore, the monitoring device B of this embodiment comprises an electronic circuit board 50 on which a circuit is formed and a wireless module. The wireless module is mounted on the electronic circuit board 50. The monitoring device B is housed inside the casing C of the battery pack P. The electronic circuit board 50 also has multiple mounting parts for the wireless module (forward mounting part 30 and leftward mounting part 40). One wireless module is provided for each electronic circuit board 50 and is attached to one of the multiple mounting parts.

[0075] In this embodiment of the monitoring device B, the wireless module can be installed at a mounting location with high signal strength for communication. In other words, the monitoring device B can select the installation position of the wireless module so that no null points occur in the specific frequency band used by the wireless module, based on the position of the wireless module's antenna. Therefore, the monitoring device B can suppress the degradation of communication quality due to radio wave interference without the need for multiple antennas.

[0076] Furthermore, in the voltage detection device A, the electronic circuit board 20 includes a forward-facing mounting portion 30 and a left-facing mounting portion 40, which are both mounting portions. When the wireless module 21 is mounted on the left-facing mounting portion 40, the orientation of the wireless module 21 as viewed from the normal direction of the electronic circuit board 20 is different from that of the forward-facing mounting portion 30. Moreover, the forward-facing mounting portion 30 and the left-facing mounting portion 40 are arranged on the electronic circuit board 20 in an overlapping manner when viewed from the normal direction.

[0077] In this embodiment, the voltage detection device A has a forward-facing mounting portion 30 and a left-facing mounting portion 40 that are arranged to overlap. As a result, the electronic circuit board 20 is smaller than when the forward-facing mounting portion 30 and the left-facing mounting portion 40 are located separately. Therefore, the voltage detection device A in this embodiment is compact. Similarly, in the monitoring device B of this embodiment, the electronic circuit board 50 is also miniaturized. Therefore, the monitoring device B is also compact.

[0078] Furthermore, in the voltage detection device A of this embodiment, the forward-facing mounting section 30 and the left-facing mounting section 40 each have multiple pads arranged in the same rectangular pattern to which terminals a1 to j1 of the wireless module 21 are connected. In addition, pads a2 to j2 of the left-facing mounting section 40 are located at positions rotated 90° around the rectangular center position relative to pads a3 to j3 of the forward-facing mounting section 30. Furthermore, each of pads a3 to j3 of the left-facing mounting section 40 is electrically connected to pads a2 to j2 of the forward-facing mounting section 30, which are located at positions rotated 90° around the center O.

[0079] According to the voltage detection device A of this embodiment, the wireless module 21 is electrically connected to the electronic circuit board 20 in the same way whether it is mounted on the forward-facing mounting section 30 or the left-facing mounting section 40. Therefore, the wireless module 21 can be easily connected to the electronic circuit board 20 regardless of which mounting section 40 is selected. Similarly, the monitoring device B can also easily connect the wireless module to the electronic circuit board 50.

[0080] Furthermore, the wireless module 21 includes a wireless IC chip 21a having terminals a1 to j1 connected to the electronic circuit board 20, and an antenna portion 21b provided protruding laterally from the wireless IC chip 21a. With the voltage detection device A of this embodiment, the orientation of the antenna portion 21b can be easily determined by visually inspecting the antenna portion 21b. Similarly, the orientation of the wireless module connected to the electronic circuit board 50 of the monitoring device B can also be easily determined.

[0081] Furthermore, in the voltage detection device A of this embodiment, the electronic circuit board 20 has a notch 20c provided at a position that may face the antenna unit 21b. With this voltage detection device A of this embodiment, it is possible to prevent the communication of the antenna unit 21b from being obstructed by a part of the electronic circuit board 20. Therefore, the voltage detection device A of this embodiment can further improve communication quality. Similarly, since the monitoring device B also has a notch 20c, it can also further improve communication quality.

[0082] Furthermore, the battery monitoring system S of this embodiment comprises a plurality of battery modules M, a voltage detection device A provided on each of the battery modules M, and a monitoring device B that communicates wirelessly with the voltage detection device A. In addition, each of the voltage detection device A and the monitoring device B has a plurality of mounting parts for the wireless module 21. Therefore, the battery monitoring system S of this embodiment can suppress the deterioration of communication quality due to radio wave interference.

[0083] Furthermore, the battery monitoring system S of this embodiment includes one wireless module each for the voltage detection device A and the monitoring device B. Therefore, the number of wireless modules to be installed can be minimized.

[0084] (Second Embodiment) Next, a second embodiment of the present invention will be described with reference to Figures 14 and 15. In this description, parts that are the same as those of the first embodiment will be omitted or simplified.

[0085] Figure 14 is a schematic diagram of the electronic circuit board 20 of the voltage detection device of this embodiment. As shown in this figure, the electronic circuit board 20 is provided with a second forward-facing mounting portion 60 (third mounting portion), which is one of the mounting portions for the wireless module 21. This second forward-facing mounting portion 60 is provided in a different location from the forward-facing mounting portion 30. In this embodiment of the voltage detection device, since there are multiple mounting portions, the wireless module 21 can be placed in a location with high radio wave intensity. As shown in Figure 14, a notch 20c is also provided near the second forward-facing mounting portion 60.

[0086] In this embodiment of the voltage detection device, the installation position of the wireless module 21 can be selected so that null points do not occur in a specific operating band at the position of the antenna portion 21b of the wireless module 21. Therefore, the voltage detection device can suppress the deterioration of communication quality due to radio wave interference without providing multiple antennas.

[0087] Figure 15 is a schematic diagram of the electronic circuit board 50 included in the monitoring device of this embodiment. As shown in this figure, the electronic circuit board 50 is also provided with a second forward-facing mounting portion 60 (third mounting portion), which is one of the mounting portions for the wireless module. This second forward-facing mounting portion 60 is provided in a different location from the forward-facing mounting portion 30. In this monitoring device of this embodiment, since there are multiple mounting portions, the wireless module 21 can be placed in a location with high radio wave intensity. As shown in Figure 15, a notch 50c is also provided near the second forward-facing mounting portion 60.

[0088] In this embodiment of the monitoring device, the installation position of the wireless module can be selected so that null points do not occur in the specific frequency band used by the wireless module at the position of the wireless module's antenna. Therefore, the monitoring device can suppress the deterioration of communication quality due to radio wave interference without providing multiple antennas.

[0089] Furthermore, the distance between the forward-facing mounting portion 30 and the second forward-facing mounting portion 60 is preferably one-quarter to one-half of the wavelength of the radio waves used by the wireless module. In other words, it is preferable that the forward-facing mounting portion 30 and the second forward-facing mounting portion 60 are positioned at a distance of one-quarter to one-half of the wavelength of the radio waves used by the wireless module. By positioning the forward-facing mounting portion 30 and the second forward-facing mounting portion 60 at a distance from each other in this way, it is possible to suppress the inversion of the phases of the radio waves emitted from the wireless module and to suppress the occurrence of null points.

[0090] (Third embodiment) Next, a third embodiment of the present invention will be described with reference to Figures 16 and 17. In this description, parts that are the same as those in the first embodiment will be omitted or simplified.

[0091] Figure 16 is a schematic diagram showing the front surface of the wireless module 22 of this embodiment. The wireless module 22 has a wireless IC chip 22a and an antenna portion 22b that protrudes laterally from the wireless IC chip 22a. The wireless module 22 also has a plurality of terminals a4 to d4 arranged along a circle.

[0092] Figure 17 is a schematic diagram showing an enlarged portion of the electronic circuit board 20 of this embodiment. The electronic circuit board 20 includes a forward-facing mounting portion 70 (first mounting portion), a first inclined angle mounting portion 80 (second mounting portion), and a second inclined angle mounting portion 90 (third mounting portion). The forward-facing mounting portion 70 includes a plurality of pads a5 to d5 arranged along a circle. The first inclined angle mounting portion 80 includes a plurality of pads a6 to d6 arranged concentrically with pads a5 to d5. The second inclined angle mounting portion 90 includes a plurality of pads a7 to d7 arranged concentrically with pads a5 to d5.

[0093] Thus, each of the forward-facing mounting section 70, the first inclined angle mounting section 80, and the second inclined angle mounting section 90 has multiple pads arranged in the same circular pattern to which terminals a4 to d4 of the wireless module 22 are connected. Pads a6 to d6 of the first inclined angle mounting section 80 are positioned rotated to the left by a set angle (30° in this embodiment) relative to pads a5 to d5 of the forward-facing mounting section 70. Also, pads a7 to d7 of the second inclined angle mounting section 90 are positioned rotated to the left by a set angle (60° in this embodiment) relative to pads a5 to d5 of the forward-facing mounting section 70.

[0094] Pads a5, a6, and a7 are electrically connected via conductive parts (not shown). Also, pads b5, b6, and b7 are electrically connected via conductive parts (not shown). Furthermore, pads c5, c6, and c7 are electrically connected via conductive parts (not shown). In other words, pads a6 to d6 of the first inclined angle mounting section 80 and pads a7 to d7 of the second inclined angle mounting section 90 are electrically connected to pads a5 to d5 of the forward-facing mounting section 60 at a position rotated by a set angle around the center position.

[0095] According to the voltage detection device of this embodiment, the wireless module 22 can be positioned in a direction between forward and leftward. Furthermore, the electronic circuit board 20 is provided with a plurality of tilt angle mounting sections (first tilt angle mounting section 80 and second tilt angle mounting section 90) with different set angles. Therefore, the wireless module 22 can be positioned in multiple directions between forward and leftward.

[0096] Furthermore, the notch 20c is formed in an arc shape so that no matter whether the wireless module 22 is mounted on the forward-facing mounting portion 70, the first inclined angle mounting portion 80, or the second inclined angle mounting portion 90, a part of the electronic circuit board 20 does not face the antenna portion 22b.

[0097] In this embodiment, a configuration has been described in which the forward-facing mounting portion 70, the first inclined angle mounting portion 80, and the second inclined angle mounting portion 90 are provided on the electronic circuit board 20. However, the forward-facing mounting portion 70, the first inclined angle mounting portion 80, and the second inclined angle mounting portion 90 may be provided on the monitoring device.

[0098] Preferred embodiments of the present invention have been described above with reference to the attached drawings, but it goes without saying that the present invention is not limited to the above embodiments. The shapes and combinations of the constituent members shown in the above embodiments are examples, and can be modified in various ways based on design requirements, etc., without departing from the spirit of the present invention.

[0099] For example, in this invention, the number of mounting parts is not limited to two. For instance, three or more mounting parts may be provided.

[0100] Furthermore, in the above embodiment, a configuration was described in which both the voltage detection device and the monitoring device are electronic circuit board units of the present invention. However, it is also possible to adopt a configuration in which either the voltage detection device or the monitoring device is an electronic circuit board unit of the present invention.

[0101] Furthermore, the above embodiments can also be described, for example, as shown in the following appendix.

[0102] (Note 1) An electronic circuit board unit comprising an electronic circuit board on which a circuit is formed and a wireless module mounted on the electronic circuit board, and housed inside the casing of a battery pack, The aforementioned electronic circuit board has multiple mounting portions for the wireless module, The wireless module is provided one per electronic circuit board and is attached to one of the plurality of mounting parts. An electronic circuit board unit characterized by the following features.

[0103] (Note 2) The aforementioned electronic circuit board is A first mounting portion, which is one of the aforementioned mounting portions, A second mounting portion which is a mounting portion in which the orientation of the wireless module as viewed from the normal direction of the electronic circuit board is different from that of the first mounting portion when the wireless module is attached, It has, The first mounting portion and the second mounting portion are arranged on the electronic circuit board so that they overlap when viewed from the normal direction. The electronic circuit board unit as described in Appendix 1, characterized by the features described herein.

[0104] (Note 3) Each of the first mounting portion and the second mounting portion has a plurality of terminal connection portions arranged in the same rectangular pattern to which the terminals of the wireless module are connected. The terminal connection portion of the second mounting portion is provided at a position rotated 90° with respect to the rectangular center position of the terminal connection portion of the first mounting portion, Each of the terminal connection portions of the second mounting portion is electrically connected to the terminal connection portion of the first mounting portion at a position rotated 90° around the central position. The electronic circuit board unit as described in Appendix 2, characterized by the features described herein.

[0105] (Note 4) Each of the first mounting portion and the second mounting portion has a plurality of terminal connection portions arranged in the same circular pattern to which the terminals of the wireless module are connected. The terminal connection portion of the second mounting portion is provided at a position rotated by a set angle with respect to the terminal connection portion of the first mounting portion, with respect to the center position of the circular shape. Each of the terminal connection portions of the second mounting portion is electrically connected to the terminal connection portion of the first mounting portion at a position rotated by the set angle around the center position. The electronic circuit board unit as described in Appendix 2, characterized by the features described herein.

[0106] (Note 5) The electronic circuit board unit according to Appendix 4, characterized in that the electronic circuit board comprises a plurality of second mounting portions with different set angles.

[0107] (Note 6) The aforementioned electronic circuit board is A first mounting portion, which is one of the aforementioned mounting portions, A third mounting portion which is a mounting portion different from the first mounting portion, It has, The first mounting portion and the third mounting portion are provided on different parts of the electronic circuit board. The electronic circuit board unit as described in Appendix 1, characterized by the features described herein.

[0108] (Note 7) The electronic circuit board unit according to Appendix 6, characterized in that the first mounting portion and the third mounting portion are arranged at a distance of one-quarter to one-half of the wavelength of the radio waves used by the wireless module.

[0109] (Note 8) The electronic circuit board unit according to any one of the appendices 1 to 7, characterized in that the wireless module comprises a wireless IC chip having terminals connected to the electronic circuit board and an antenna portion provided protruding laterally from the wireless IC chip.

[0110] (Note 9) The electronic circuit board unit according to Appendix 8, characterized in that the electronic circuit board has a notch provided at a position that may face the antenna portion.

[0111] (Note 10) The electronic circuit board unit according to any one of the appendices 1 to 9, characterized in that the electronic circuit board has a voltage detection circuit for detecting the voltage of a battery module formed as the circuit.

[0112] (Note 11) Multiple battery modules, A voltage detection device is provided in each of the aforementioned battery modules, The voltage detection device and the monitoring device that performs wireless communication Equipped with, At least one of the voltage detection device and the monitoring device includes an electronic circuit board unit as described in any one of the appendices 1 to 10. A battery monitoring system characterized by the following features.

[0113] (Note 12) Both the voltage detection device and the monitoring device include an electronic circuit board unit described in any one of the appendices 1 to 10. Each of the voltage detection device and the monitoring device comprises one of the wireless modules. The battery monitoring system described in Appendix 11, characterized by the features described herein. [Explanation of Symbols]

[0114] 20...Electronic circuit board, 20a...Printed circuit board, 20b...Electronic component, 20c...Notch, 21...Wireless module, 21a...Wireless IC chip, 21b...Antenna section, 22...Wireless module, 22a...Wireless IC chip, 22b...Antenna section, 30...Forward-facing mounting section (first mounting section), 40...Left-facing mounting section (second mounting section), 50...Electronic circuit board, 50a...Printed circuit board, 50b...Electronic component, 50c...Notch, 60...Second forward-facing mounting section (third mounting section), 70...Forward-facing mounting section (first mounting section), 80...First tilt angle mounting section (second mounting section), 90...Second tilt angle mounting section (second mounting section), A...Voltage detection device (electronic circuit board unit) a1~j1...Terminals, a2~j2...Pads (terminal connection parts), a3~j3...Pads (terminal connection parts), a4~d4...Terminals, a5~d5...Pads (terminal connection parts), a6~d6...Pads (terminal connection parts), a7~d7...Pads (terminal connection parts), B...Monitoring device (electronic circuit board unit), C...Housing, H...Through-hole, L1...First conductor layer, L2...Second conductor layer, L3...Third conductor layer, L4...Fourth conductor layer, Lb...Connecting wire, Lc...Connecting wire, Ld...Connecting wire, Le...Connecting wire, Lf...Connecting wire, Lg...Connecting wire, Lh...Connecting wire, Li...Connecting wire, Lj...Connecting wire, M...Battery module, P...Battery pack, S...Battery monitoring system

Claims

1. An electronic circuit board unit comprising an electronic circuit board on which a circuit is formed and a wireless module mounted on the electronic circuit board, and housed inside the casing of a battery pack, The aforementioned electronic circuit board has multiple mounting portions for the wireless module, The wireless module is provided one per electronic circuit board and is attached to one of the multiple mounting parts. The aforementioned electronic circuit board is A first mounting portion, which is one of the aforementioned mounting portions, A second mounting portion which is a mounting portion in which the orientation of the wireless module as viewed from the normal direction of the electronic circuit board is different from that of the first mounting portion when the wireless module is attached, It has, The first mounting portion and the second mounting portion are arranged on the electronic substrate so that they overlap when viewed from the normal direction. The first mounting portion has a pad to which the terminals of the wireless module are connected when the wireless module is mounted on the first mounting portion. The second mounting portion has a pad to which the terminals of the wireless module are connected when the wireless module is mounted on the second mounting portion. The pad of the first mounting portion and the pad of the second mounting portion are arranged separately. An electronic circuit board unit characterized by the following features.

2. Each of the first mounting portion and the second mounting portion has a plurality of terminal connection portions arranged in the same rectangular pattern to which the terminals of the wireless module are connected. The terminal connection portion of the second mounting portion is provided at a position rotated 90° with respect to the rectangular center position of the terminal connection portion of the first mounting portion, Each of the terminal connection portions of the second mounting portion is electrically connected to the terminal connection portion of the first mounting portion at a position rotated 90° around the central position. The electronic circuit board unit according to claim 1, characterized in that it is a feature of the present invention.

3. Each of the first mounting portion and the second mounting portion has a plurality of terminal connection portions arranged in the same circular pattern to which the terminals of the wireless module are connected, The terminal connection portion of the second mounting portion is provided at a position rotated by a set angle with respect to the terminal connection portion of the first mounting portion, with respect to the center position of the circular shape. Each of the terminal connection portions of the second mounting portion is electrically connected to the terminal connection portion of the first mounting portion at a position rotated by the set angle around the center position. The electronic circuit board unit according to claim 1, characterized in that it is a feature of the present invention.

4. The electronic circuit board unit according to claim 3, characterized in that the electronic circuit board comprises a plurality of second mounting portions with different set angles.

5. The electronic circuit board unit according to any one of claims 1 to 4, characterized in that the wireless module comprises a wireless IC chip having terminals connected to the electronic circuit board and an antenna portion provided protruding laterally from the wireless IC chip.

6. The electronic circuit board unit according to claim 5, characterized in that the electronic circuit board has a notch provided at a position that may face the antenna portion.

7. The electronic circuit board unit according to any one of claims 1 to 4, characterized in that the electronic circuit board has a voltage detection circuit for detecting the voltage of a battery module formed as the circuit.

8. Multiple battery modules, A voltage detection device is provided in each of the aforementioned battery modules, The voltage detection device and the monitoring device that performs wireless communication Equipped with, At least one of the voltage detection device and the monitoring device includes the electronic circuit board unit described in any one of claims 1 to 4. A battery monitoring system characterized by the following features.

9. Both the voltage detection device and the monitoring device include the electronic circuit board unit described in any one of claims 1 to 4. Each of the voltage detection device and the monitoring device comprises one of the wireless modules. The battery monitoring system according to feature 8.

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