Method for manufacturing a reinforced semiconductor chip, semiconductor chip with film, method for reinforcing a semiconductor chip, reinforcing film, and semiconductor device.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- RESONAC CORP
- Filing Date
- 2021-11-05
- Publication Date
- 2026-06-23
AI Technical Summary
【0013】 本開示によれば、新規な補強された半導体チップの製造方法が提供される。また、本開示によれば、半導体チップに発生し得る反り、割れ(クラック)等の不具合を抑制することが可能なフィルム付き半導体チップが提供される。また、本開示によれば、簡便に半導体チップを補強することが可能な新規な半導体チップの補強方法が提供される。また、本開示によれば、このような半導体チップの補強方法に用いられる補強用フィルムが提供される。さらに、本開示によれば、半導体チップを備える半導体装置が提供される。
Smart Images
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Abstract
Claims
1. The process includes a step of placing a film having at least a thermosetting resin layer on the surface of a single-layer or multi-layer semiconductor chip, The aforementioned film is a multilayer film, The multilayer film is a film having a first thermosetting resin layer, a rigid material layer, and a second thermosetting resin layer in this order. The rigid material layer has higher rigidity than the first thermosetting resin layer and the second thermosetting resin layer. A method for manufacturing reinforced semiconductor chips.
2. The rigid material layer is a polyimide resin layer. A method for manufacturing a reinforced semiconductor chip according to claim 1.
3. The total thickness of the aforementioned film is 5 to 180 μm. A method for manufacturing a reinforced semiconductor chip according to claim 1 or 2.
4. Single-layer or multi-layer semiconductor chips, A film having at least a thermosetting resin layer disposed on the surface of the semiconductor chip, Equipped with, The aforementioned film is a multilayer film, The multilayer film is a film having a first thermosetting resin layer, a rigid material layer, and a second thermosetting resin layer in this order. The rigid material layer has higher rigidity than the first thermosetting resin layer and the second thermosetting resin layer. Semiconductor chip with film.
5. The process includes a step of placing a film having at least a thermosetting resin layer on the surface of a single-layer or multi-layer semiconductor chip, The aforementioned film is a multilayer film, The multilayer film is a film having a first thermosetting resin layer, a rigid material layer, and a second thermosetting resin layer in this order. The rigid material layer has higher rigidity than the first thermosetting resin layer and the second thermosetting resin layer. Methods for reinforcing semiconductor chips.
6. A reinforcing film for reinforcing a single-layer or multi-layer semiconductor chip by being placed on its surface, The reinforcing film is a multilayer film having a first thermosetting resin layer, a rigid layer, and a second thermosetting resin layer in that order. The rigid material layer has higher rigidity than the first thermosetting resin layer and the second thermosetting resin layer. Reinforcement film.
7. circuit board and A single-layer or multi-layer semiconductor chip disposed on the substrate, A cured film having at least a thermosetting resin layer disposed on the surface of the semiconductor chip, Equipped with, The aforementioned film is a multilayer film, The multilayer film is a film having a first thermosetting resin layer, a rigid material layer, and a second thermosetting resin layer in this order. The rigid material layer has higher rigidity than the first thermosetting resin layer and the second thermosetting resin layer. Semiconductor equipment.
8. The rigid material layer is a polyimide resin layer. The semiconductor device according to claim 7.