(Meth)acryloyl group-containing polyimides, photosensitive compositions, cured products and articles
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- ARAKAWA CHEM IND LTD
- Filing Date
- 2024-08-27
- Publication Date
- 2026-06-23
AI Technical Summary
【0007】 本開示の(メタ)アクリロイル基含有ポリイミドを用いることにより、貯蔵弾性率、リソグラフ性及び線膨張係数が良好である硬化物を製造できる。
Smart Images

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Figure 0007878375000002
Abstract
Claims
[Claim 1] A photosensitive compound containing a (meth)acryloyl group-containing polyimide and a photosensitive composition containing an organic solvent, The (meth)acryloyl group-containing polyimide comprises a fluorine atom-containing acid anhydride unit and a fluorine atom and a biphenyl structure-containing diamine unit, The content of the (meth)acryloyl group-containing polyimide is 40% to 75% by mass relative to 100% by mass of the photosensitive compound. The photosensitive composition wherein the organic solvent is solely an alicyclic solvent.