(Meth)acryloyl group-containing polyimides, photosensitive compositions, cured products and articles

JP7878375B2Active Publication Date: 2026-06-23ARAKAWA CHEM IND LTD

Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
ARAKAWA CHEM IND LTD
Filing Date
2024-08-27
Publication Date
2026-06-23

AI Technical Summary

Benefits of technology

【0007】 本開示の(メタ)アクリロイル基含有ポリイミドを用いることにより、貯蔵弾性率、リソグラフ性及び線膨張係数が良好である硬化物を製造できる。

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure 0007878375000001
    Figure 0007878375000001
  • Figure 0007878375000002
    Figure 0007878375000002
Patent Text Reader

Abstract

To provide a (meth)acryloyl group-containing polyimide, a photosensitive composition, a cured product, and an article.SOLUTION: A (meth)acryloyl group-containing polyimide includes: a fluorine atom-containing acid anhydride unit; and a fluorine atom- and biphenyl structure-containing diamine unit.SELECTED DRAWING: None
Need to check novelty before this filing date? Find Prior Art

Claims

[Claim 1] A photosensitive compound containing a (meth)acryloyl group-containing polyimide and a photosensitive composition containing an organic solvent, The (meth)acryloyl group-containing polyimide comprises a fluorine atom-containing acid anhydride unit and a fluorine atom and a biphenyl structure-containing diamine unit, The content of the (meth)acryloyl group-containing polyimide is 40% to 75% by mass relative to 100% by mass of the photosensitive compound. The photosensitive composition wherein the organic solvent is solely an alicyclic solvent.