Resin laminated substrate and method for manufacturing a resin laminated substrate

Abstract

This resin laminated substrate comprises: a plurality of resin layers laminated on each other; and conductors disposed outside and inside the laminated plurality of resin layers. The plurality of resin layers include a first resin layer (11), a second resin layer (12), and third resin layers (13a, 13b, 13c) that are laminated on each other in the stated order. The conductors include first conductor layers (21a, 21b), second conductor layers (22a-22h), and interlayer connection conductors (23a1, 23a2, 23e, 23f, 23g, 23h). The first conductor layers (21a, 21b) are disposed on a lower main surface (11ds) of the first resin layer (11). The interlayer connection conductors or the second conductor layers overlapping a portion of the first resin layer (11) when viewed in the thickness direction of the third resin layers (13a, 13b, 13c), are disposed on the third resin layers. The second resin layer (12) is a thermoplastic resin. The melting point of the second resin layer (12) is lower than the melting point of the first resin layer (11). At least the second resin layer (12) has air bubbles.

Claims

1. It comprises a plurality of resin layers laminated together, and conductors arranged on the outside and inside of the plurality of laminated resin layers, The plurality of resin layers include a first resin layer, a second resin layer, and a third resin layer that are laminated in order to each other. The conductor includes a first conductor layer, a second conductor layer, and an interlayer connecting conductor. The first resin layer has an upper main surface and a lower main surface that face each other. The second resin layer has an upper main surface and a lower main surface that face each other. The upper main surface of the first resin layer is in contact with the lower main surface of the second resin layer, The first conductor layer is arranged on the lower main surface of the first resin layer. The third resin layer is provided with the second conductor layer or the interlayer connecting conductor which overlaps with a portion of the first conductor layer when viewed in the thickness direction of the third resin layer. The second resin layer is a thermoplastic resin, and the melting point of the second resin layer is lower than the melting point of the first resin layer. At least the second resin layer has air bubbles, Resin laminated substrate.

2. The bubble ratio of the second resin layer is higher than that of the first resin layer. The resin laminated substrate according to claim 1.

3. The first resin layer and the second resin layer are in direct contact with each other. A conductive layer is not disposed between the first resin layer and the second resin layer. A resin laminated substrate according to claim 1 or claim 2.

4. The third resin layer is provided with a second conductor layer that overlaps with at least a portion of the first conductor layer when viewed in the thickness direction of the third resin layer. At least a portion of the first conductor layer is a radiating element, and the second conductor layer overlapping at least a portion of the first conductor layer is a ground conductor. Alternatively, at least a portion of the second conductor layer is a radiating element, and the first conductor layer overlapping at least a portion of the second conductor layer is a ground conductor. A resin laminated substrate according to claim 1 or claim 2.

5. The radiating element is arranged in the first resin layer, and the dielectric constant of the first resin layer is higher than that of the second resin layer, or the radiating element is arranged in the third resin layer, and the dielectric constant of the third resin layer is higher than that of the first resin layer. The resin laminated substrate according to claim 4.

6. A protective film is formed on the outer surface of the laminate composed of the plurality of resin layers and the conductor. A resin laminated substrate according to claim 1 or claim 2.

7. An electronic component is placed in a position that overlaps with the first conductor layer and within the third resin layer. A resin laminated substrate according to claim 1 or claim 2.

8. The lower main surface of the first resin layer is located in the outermost layer of the laminate composed of the plurality of resin layers and the conductor, and a portion of the first conductor layer is arranged on the lower main surface of the first resin layer. A resin laminated substrate according to claim 1 or claim 2.

9. It comprises a plurality of resin layers laminated together, and conductors arranged on the outside and inside of the plurality of laminated resin layers, The plurality of resin layers include a first resin layer, a second resin layer, and a third resin layer that are laminated in order to each other. The conductor includes a first conductor layer, a second conductor layer, and an interlayer connecting conductor. The first resin layer has an upper main surface and a lower main surface that face each other. The second resin layer has an upper main surface and a lower main surface that face each other. The upper main surface of the first resin layer is in contact with the lower main surface of the second resin layer, The first conductor layer is arranged on the lower main surface of the first resin layer. The third resin layer is provided with the second conductor layer or the interlayer connecting conductor which overlaps with a portion of the first conductor layer when viewed in the thickness direction of the third resin layer. A method for manufacturing a resin laminated substrate, The second resin layer is a thermoplastic resin and has air bubbles inside before hot pressing. The melting point of the second resin layer is lower than the melting point of the first resin layer. With the first resin layer, the second resin layer, and the third resin layer laminated, they are hot-pressed at a temperature lower than the melting point of the first resin layer and higher than the melting point of the second resin layer. A method for manufacturing a resin laminated substrate.

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