Wiring board, functional backplane, and method for manufacturing the same

Abstract

The wiring board includes a base substrate and a plurality of first connection pads. The plurality of first connection pads are provided on the base substrate. The plurality of first connection pads include at least one electrical connection layer, and each electrical connection layer includes a body material layer and at least one protective layer. The at least one protective layer is provided on a side of the body material layer that is farther from the base substrate. The at least one protective layer includes a first reference protective layer, and the first reference protective layer is a protective layer farthest from the base substrate among the at least one protective layer, and a material of the body material layer includes copper. The at least one electrical connection layer includes a first electrical connection layer, and the first electrical connection layer is an electrical connection layer farthest from the base substrate among the at least one electrical connection layer, and in the at least one protective layer included in the first electrical connection layer, a material of at least the first reference protective layer can form a first intermetallic compound with a first solder.

Claims

1. Base board and A plurality of first connection pads provided on the base substrate, Includes, The plurality of first connection pads include a plurality of electrical connection layers, each electrical connection layer includes a main material layer and at least one protective layer, the at least one protective layer is provided on the side of the main material layer away from the base substrate, the at least one protective layer includes a first reference protective layer, the first reference protective layer is the protective layer of the at least one protective layer furthest from the base substrate, and the material of the main material layer includes copper. The plurality of electrical connection layers include a first electrical connection layer and a second electrical connection layer, the first electrical connection layer being the electrical connection layer furthest from the base substrate among the plurality of electrical connection layers, and in the at least one protective layer included in the first electrical connection layer, at least the material of the first reference protective layer is capable of forming a first solder and a first intermetallic compound. The second electrical connection layer is located between the first electrical connection layer and the base substrate, and the material of the first reference protective layer included in the second electrical connection layer can form a first solder and a first intermetallic compound, or the material of the first reference protective layer included in the second electrical connection layer cannot form a first solder and a first intermetallic compound. Wiring board.

2. The material of the first reference protective layer included in the first electrical connection layer is a single metal or a metal alloy, and / or The thickness of each protective layer included in the first electrical connection layer is 300 Å or more and 30,000 Å or less. The wiring board according to claim 1.

3. The thickness or material of the at least one protective layer included in the first electrical connection layer is configured to block the diffusion of the first solder into the main material layer included in the first electrical connection layer. The wiring board according to claim 1.

4. If the material of the first reference protective layer included in the first electrical connection layer includes copper or a copper-nickel alloy, the thickness of the first reference protective layer takes a value between 300 Å and 600 Å. If the material of the first reference protective layer included in the first electrical connection layer does not contain copper, the thickness of the first reference protective layer takes a value between 300 Å and 3000 Å, or If the material of the first reference protective layer included in the first electrical connection layer includes copper or a copper-nickel alloy, the thickness of the first reference protective layer takes a value between 300 Å and 600 Å. If the material of the first reference protective layer included in the first electrical connection layer does not contain copper, the thickness of the first reference protective layer is between 300 Å and 3000 Å, and the diffusion depth of the first solder in the first electrical connection layer is greater than or equal to the thickness of the first reference protective layer included in the first electrical connection layer. The wiring board according to claim 3.

5. The at least one protective layer comprises at least two protective layers, the at least two protective layers further comprising the first reference protective layer and the second reference protective layer, the second reference protective layer being located between the first reference protective layer and the base substrate, and the material of the second reference protective layer being capable of forming a first solder and a first intermetallic compound, or the material of the second reference protective layer being incapable of forming a first solder and a first intermetallic compound. The wiring board according to claim 1.

6. The material of the second reference protective layer can form a first solder and a first intermetallic compound. The materials of the at least two protective layers are different, or the thickness of at least one of the at least two protective layers is greater than 500 Å, or the sum of the thicknesses of the at least two protective layers is greater than 500 Å. The wiring board according to claim 5.

7. Along the direction gradually approaching the base substrate, the diffusion depth of the first solder per unit time in the at least two protective layers gradually decreases, and / or the melting point of the material of the at least two protective layers gradually increases, and / or Along the direction gradually approaching the base substrate, the proportion of elements in the at least two protective layers capable of forming the first solder and the first intermetallic compound gradually decreases, and / or Along the direction gradually approaching the base substrate, the thickness of each of the at least two protective layers gradually increases, and / or The diffusion depth of the first solder in the at least two protective layers is greater than or equal to the thickness of the first reference protective layer, and less than or equal to the sum of the thicknesses of the first reference protective layer and the second reference protective layer. The wiring board according to claim 6.

8. The thickness of the first reference protective layer included in the second electrical connection layer is 300 Å or more and / or 30,000 Å or less, The material of the first reference protective layer included in the second electrical connection layer can form a first solder and a first intermetallic compound, and the thickness of the first reference protective layer included in the second electrical connection layer is greater than the thickness of the first reference protective layer included in the first electrical connection layer, and / or The diffusion depth of the first solder in the multiple electrical connection layers is greater than or equal to the thickness of the first reference protective layer included in the first electrical connection layer, and less than or equal to the sum of the thickness of the first electrical connection layer and the thickness of the first reference protective layer included in the second electrical connection layer. The wiring board according to claim 1.

9. The plurality of second connection pads provided on the base substrate further include a plurality of second connection pads configured to be electrically connected to a circuit board, The wiring board according to claim 1.

10. A wiring board and first solder according to any one of claims 1 to 9, At least one electronic component, each electronic component including a pin, wherein the electronic component is welded to the first connecting pad via the pin and the first solder, Includes, The first solder forms a first intermetallic compound with at least the first reference protective layer contained in the first electrical connection layer. Functional backplane.

11. The at least one electronic component includes at least one first electronic component, and in a first connection pad to be welded to a pin included in the at least one first electronic component, the surface of the first reference protective layer included in the first electrical connection layer that is away from the base substrate has a groove, a second solder is provided in the groove, and the second solder forms a third intermetallic compound with at least the side walls of the groove, or The at least one electronic component includes at least one first electronic component, and in a first connection pad to be welded to a pin included in the at least one first electronic component, the surface of the first reference protective layer included in the first electrical connection layer that is away from the base substrate has a groove, a second solder is provided in the groove, and the second solder forms a third intermetallic compound with at least the side wall of the groove, the plurality of electrical connection layers further includes a third electrical connection layer, the third electrical connection layer is the electrical connection layer of the plurality of electrical connection layers closest to the base substrate, the portion of the first connection pad located on one side of the bottom of the groove includes at least a portion of the first connection pad included in the third electrical connection layer, and the portion included in the third electrical connection layer includes at least a portion of the main material layer included in the third electrical connection layer. A functional backplane according to claim 10.

12. A step of manufacturing a wiring board, wherein the wiring board includes a base substrate and a plurality of first connection pads, the plurality of first connection pads are provided on the base substrate, the plurality of first connection pads include a plurality of electrical connection layers, each electrical connection layer includes a main material layer and at least one protective layer, the at least one protective layer is provided on the side of the main material layer away from the base substrate, the at least one protective layer includes a first reference protective layer, the first reference protective layer is the protective layer of the at least one protective layer furthest from the base substrate, the material of the main material layer includes copper, and the plurality of electrical connection layers include a first electric The first electrical connection layer includes a gas connection layer and a second electrical connection layer, wherein the first electrical connection layer is the electrical connection layer furthest from the base substrate among the plurality of electrical connection layers, and in at least one protective layer included in the first electrical connection layer, the material of at least the first reference protective layer can form a first solder and a first intermetallic compound, and the second electrical connection layer is located between the first electrical connection layer and the base substrate, and the material of the first reference protective layer included in the second electrical connection layer can form a first solder and a first intermetallic compound, or the material of the first reference protective layer included in the second electrical connection layer cannot form a first solder and a first intermetallic compound. A step of providing at least one electronic component, each electronic component including pins, A step of welding the electronic component to the first connection pad via the pin and the first solder, wherein the first solder forms a first intermetallic compound with at least the first reference protective layer contained in the first electrical connection layer, and the first solder forms a second intermetallic compound with the pin, including, Method for fabricating a functional backplane.

13. The step of welding the electronic component to the first connection pad via the pin and the first solder is: A step of providing a first solder between a pin included in each electronic component and the first connecting pad, the step of reacting the first solder with the first connecting pad and the pin, respectively, and welding the at least one electronic component to the first connecting pad via the pin and the first solder, A method for manufacturing a functional backplane according to claim 12.

14. If the at least one electronic component includes a plurality of electronic components, and the plurality of electronic components include at least one first electronic component, the manufacturing method further includes: A step of detecting the connection status between the plurality of electronic components and the first connection pad, If the connection between the second electronic component and the first connection pad does not meet the requirements, the second electronic component is replaced and replaced with the first electronic component. including, or, If the at least one electronic component includes a plurality of electronic components, and the plurality of electronic components includes at least one first electronic component, the manufacturing method further includes the step of detecting the connection state between the plurality of electronic components and the first connection pad, and if the connection state between the second electronic component and the first connection pad does not meet the requirements, the step of replacing the second electronic component and substituting the second electronic component with the first electronic component, the step of replacing the second electronic component and substituting the second electronic component with the first electronic component is The steps include removing the second electronic component and forming a groove on the surface of the first connection pad that is separated from the base substrate, The steps include: providing a second solder in the groove, welding a pin included in the first electronic component to the first connecting pad via the second solder, and the second solder forming a third intermetallic compound with at least the side wall of the groove; including, A method for manufacturing a functional backplane according to claim 12.

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