A structure for integrating optical and infrared transmitting and receiving tubes based on a circuit board

Abstract

The utility model provides a structure of optical and infrared emission receiving tube based on circuit board integrated package, including substrate, base and lens, the base is attached on the substrate, and the lens is connected with the base, the bottom surface of substrate is equipped with pin, and the pin is welded and fixed with the substrate through the tin paste, the upper surface of substrate is equipped with a plurality of chip seat, and the chip is installed on the chip seat, the upper surface of substrate is equipped with tin paste stopper, the tin paste stopper is formed through conductor and is enclosed, the conductor is connected with the pin, the chip is connected with the conductor through conductive gold wire, and the conductor is fixed through filling tin paste in the tin paste stopper. The utility model can reach good efficiency on different packaging structures such as planar / surface adhesion type, effectively improves the light efficiency and performance.

Description

Technical Field

[0001] This utility model belongs to the field of closed semiconductor products, specifically a structure based on circuit board integrated packaging of optical and infrared emitting and receiving tubes. Background Technology

[0002] In the field of semiconductor device packaging, the design and manufacturing of the packaging structure play a crucial role in the device's performance, reliability, and optical efficiency. The basic function of packaging is to support the chip via a substrate, utilize silver paste or metal interconnects to achieve internal and external electrical connections, and provide protection and optical lens applications through external colloids. This packaging method not only protects the internal chip from external environmental influences but also effectively improves optoelectronic performance, making it an indispensable key step in semiconductor device manufacturing. However, existing packaging technologies are mainly based on single-core chip structures, and their design and processes have certain limitations, making it difficult to meet the ever-increasing demands for high performance and miniaturization.

[0003] Current packaging structures typically employ a single-chip layout, resulting in limited optical performance and an inability to meet the requirements of multi-angle and multi-peak optical applications. Furthermore, traditional packaging structures face challenges in terms of size reduction and improved optical efficiency. Due to a lack of optimized optical design and compact layout solutions, existing products often require significant installation space in practical applications, limiting their use on high-density circuit boards. Simultaneously, the die-bonding area design in traditional packaging structures is relatively simple, resulting in insufficient bonding strength and potentially weak adhesion between the chip and the substrate, impacting product reliability and lifespan.

[0004] On the other hand, the pad design of existing package structures also has certain shortcomings in the surface mount technology (SMT) process. Due to the lack of an effective fixing mechanism, the adhesion of the product to the circuit board is weak, making it prone to loosening or detachment during subsequent processing or use. These problems not only increase the defect rate in the production process but also negatively impact the overall performance of the product. Therefore, how to further optimize the package structure design, reduce the finished product size, and improve the adhesion while ensuring optical performance has become a pressing technical challenge. Summary of the Invention

[0005] The purpose of this application is to provide a structure and manufacturing method of an optical and infrared emitting and receiving tube based on a circuit board integrated package, which has the advantages of compact structure, reliable connection, stable optical performance and suitability for multi-chip integration.

[0006] This application provides a structure for an integrated packaged optical and infrared emitting and receiving tube based on a circuit board, including a substrate, a base, and a lens. The base is mounted on the substrate, and the lens is connected to the base. The bottom surface of the substrate has pins, which are soldered to the substrate by solder paste. The upper surface of the substrate has a plurality of chip holders, on which chips are mounted. The upper surface of the substrate has solder paste slots, which are formed by conductors. The conductors are connected to the pins, and the chips are connected to the conductors by conductive gold wires. Solder paste is filled into the solder paste slots to fix the conductors.

[0007] Furthermore, this application also proposes that the chip is bonded to the chip mount using die-bonding silver paste.

[0008] Furthermore, this application also proposes that the bottom surface of the substrate is provided with ink markings.

[0009] Furthermore, this application also proposes that when two or more chip sockets are provided, one chip socket is connected to a conductor, and the remaining chip sockets are individually mounted on the upper surface of the substrate, with the chips connected in series.

[0010] Furthermore, this application also proposes that both the lens and the base are made of plastic, and the inner surface of the base is used to reflect light.

[0011] Furthermore, this application also proposes that the base and the lens are integrally formed.

[0012] Furthermore, this application also proposes that the conductor and the pin are integrally formed from conductive materials.

[0013] As can be seen from the above, the structure of the optical and infrared emitting and receiving tube based on the circuit board integrated packaging provided by this application achieves a compact design of the device structure through the welding and fixing of the base and the substrate, the connection of the chip holder and the conductive gold wire, and the fixing of the conductor by the solder paste clamp. It effectively solves the problems of loose components, pad misalignment and difficulty in multi-chip layout in traditional packaging. It has the advantages of compact structure, reliable connection, stable optical performance and suitability for multi-chip integration. Attached Figure Description

[0014] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0015] Figure 2 This is a schematic diagram of the structure of this utility model after the lens is removed;

[0016] Figure 3 for Figure 2 Another perspective structural diagram;

[0017] Figure 4 The X-axis is a bimodal distribution diagram of highly efficient light energy utilization;

[0018] Figure 5The Y-axis is a triangle representing the efficient distribution of light energy.

[0019] Figure label:

[0020] 1. Substrate; 2. Base; 3. Lens; 4. Pin; 5. Chip; 6. Chip holder; 7. Conductive gold wire; 8. Conductor; 9. Solder paste holder; 10. Ink marking. Detailed Implementation

[0021] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0022] In the description of this invention, it should be understood that if terms such as "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise" are used to indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, they are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of the stated features. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0023] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection. They can refer to a mechanical connection or an electrical connection. They can refer to a direct connection or an indirect connection through an intermediate medium, and they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in this invention can be understood according to the specific circumstances.

[0024] like Figure 1-3As shown, a structure based on a circuit board integrated package of optical and infrared emitting and receiving tubes includes a substrate 1, a base 2, and a lens 3. The base 2 is mounted on the substrate 1, and the lens 3 is connected to the base 2. The bottom surface of the substrate 1 is provided with pins 4 and fixed by soldering with solder paste. The upper surface of the substrate 1 is provided with several chip holders 5 for mounting chips 6. The upper surface of the substrate 1 is provided with solder paste holders 9 formed by conductors 8. The conductors 8 are connected to the pins 7. The chips 6 are connected to the conductors 8 through conductive gold wires 7. The solder paste holders 9 are filled with solder paste to fix the conductors.

[0025] The substrate refers to the supporting structure that carries electronic components. Specifically, it can be made of FR4 fiberglass board, providing a mounting base for chip sockets and conductors.

[0026] The base is a supporting component that connects the substrate and the lens. It can be manufactured using injection molding and is used to fix the pins and form an optical reflection cavity.

[0027] A lens is an optical signal transmission component, which can be injection molded from polycarbonate material and used in conjunction with a base to form an optical path channel.

[0028] Pins refer to electrical connection components, which can be made of copper alloy material by stamping and are mechanically fixed to the substrate and electrically connected by soldering with solder paste.

[0029] A chip mount is the mounting area that supports a semiconductor chip. Specifically, it can be formed on the surface of a substrate through an etching process to provide a positioning reference for the chip.

[0030] Conductive gold wires are wires that connect chips to pins. They can be achieved using gold wire bonding technology, and their diameter can be controlled between 25 and 50 micrometers.

[0031] Solder paste holders refer to enclosed areas that restrict the flow of solder paste. Specifically, they can be formed by etching copper foil to create a ring-shaped fence structure to prevent solder paste from overflowing during the soldering process.

[0032] A conductor is a current transmission path, which can be implemented using gold-plated copper foil circuitry to form a continuous conductive path with the pins.

[0033] Solder paste filler refers to the soldering material used to fix conductors. Specifically, Sn96.5Ag3.0Cu0.5 alloy solder can be used to form reliable solder joints through reflow soldering.

[0034] Specifically, the base is mechanically connected to the substrate via injection molding, and its bottom pin array corresponds to and matches the substrate pads. During surface mount technology (SMT), the base pins are inserted into corresponding holes on the substrate. The annular conductor structure of the solder paste holder restricts the solder flow range, ensuring that the pins and substrate form uniform and reliable solder joints. The chip is fixed to the protrusions on the substrate surface via die bonding, and bonding wires connect the chip electrodes to the surrounding pins. When multiple chip bases are arranged side by side, a composite optical path is formed through series wiring, and the reflective surface of the inner wall of the base converges optical signals from different angles to the lens area.

[0035] This application effectively enhances the reliability of surface mount soldering, preventing device displacement or detachment during processing. The multi-chip layout structure expands the optical coverage angle while maintaining a compact size, the conductor-enclosed solder paste positioning design improves the mechanical strength of the solder joints, and the reflective structure on the inner wall of the base optimizes the optical signal transmission efficiency.

[0036] In this embodiment, we will take setting two chips as an example to illustrate the concept, and the two chips form a dual-core mode.

[0037] Two chip sockets 6 are provided, and a chip 5 is installed on each chip socket 6. Conductors 8 and pins 4 are respectively provided on both sides of the substrate 1. The chip socket on the left is connected to the conductor on the left to achieve the connection with the pin. The chip on the left is connected to the other chip socket through a conductive gold wire. The chip on the other chip socket is connected to the conductor on the right through a conductive gold wire to achieve the connection with the pin on the right, thus realizing a series conduction structure.

[0038] Specifically, when multiple chip sockets are placed on the substrate surface, one chip socket is directly connected to a conductor to form the main circuit node, while the remaining chip sockets are independently distributed in the non-conductive area of ​​the substrate surface. The chips are connected sequentially via conductive gold wires to form a series structure, allowing current to flow from the conductor-connected chip sockets, passing through each chip in turn to form a complete circuit. In this layout, the conductor-connected chip sockets serve as the starting point for electrical connections, and the independent mounting of the remaining chip sockets avoids occupying conductor areas, thus achieving multi-chip integration within a limited substrate area. The series connection method allows each chip to share the same current path, enabling multi-chip collaborative operation while maintaining circuit simplification.

[0039] The chip is bonded to the chip socket using die-attach silver paste. Die-attach silver paste is a conductive adhesive, specifically made of epoxy resin material filled with silver particles. Its function is to provide both mechanical fixation and electrical connection between the chip and the chip socket.

[0040] Specifically, during the encapsulation process, die-attach silver paste is uniformly coated onto a predetermined area of ​​the chip carrier, and then the chip is precisely placed on the surface of the paste. The paste is then cured by heating or ultraviolet irradiation, forming a bonded layer with high adhesion strength. This process not only achieves physical fixation between the chip and the chip carrier but also establishes a low-impedance path between the chip electrodes and the substrate pins through the conductive properties of the silver paste. Thus, the problem of chip detachment caused by insufficient mechanical strength of the adhesive in traditional technologies is solved, while also avoiding electrical performance degradation due to poor interface contact.

[0041] Compared to existing technologies, traditional packaging processes typically use non-conductive adhesives or ordinary bonding agents to fix the chip. These materials are prone to aging or cracking under high temperatures or mechanical stress, leading to chip separation from the substrate. This solution, however, improves bonding reliability through the application of die-bonding silver paste, achieving electrical conductivity directly through the paste itself without the need for additional metal leads or solder joints, thus simplifying the packaging process.

[0042] Through the above technical solution, this application effectively enhances the bonding force between the chip and the substrate, preventing interface peeling caused by vibration or thermal expansion, while optimizing the stability of electrical connections and avoiding photoelectric signal attenuation due to increased contact resistance. Furthermore, the curing process of the die-bonding silver paste is compatible with existing packaging processes, enabling mass production without the need for complex equipment.

[0043] Ink markings 10 are provided on the bottom surface of substrate 1, and can be designed in different styles according to requirements.

[0044] Ink marking refers to a marking layer formed on the surface of a substrate through printing or spraying processes. Specifically, it can be achieved using high-temperature resistant inks or UV-curable inks, such as text, symbols, or QR codes formed through screen printing. This marking remains clearly identifiable during the packaging process and is used to carry product model, batch information, or installation positioning markings.

[0045] The ink markings can be quickly identified by optical inspection equipment in subsequent surface mount processes, ensuring the accurate mounting orientation and position of the substrate on the circuit board.

[0046] Compared to existing technologies, traditional packaging structures typically lack a dedicated marking area on the bottom surface of the substrate, relying solely on outer packaging labels or manual marking for product traceability. This is prone to information loss due to handling or high-temperature environments. This solution integrates ink markings directly onto the bottom surface of the substrate, physically binding product information to the packaging structure and preventing identification errors caused by label detachment or damage.

[0047] Through the above technical solution, this application realizes the function of the packaging structure carrying its own identifiable mark, which solves the problem of product traceability difficulties caused by the easy damage of external labels in traditional processes. At the same time, it provides a positioning reference for automated mounting equipment and reduces manual calibration operations.

[0048] Both the lens and the base are made of plastic. The inner surface of the base is used to reflect light, and the lens and the base are integrally molded.

[0049] Specifically, the base and lens are integrally injection molded from plastic, with an aluminum plating process forming a reflective layer on the inner surface of the base. When the chip is operating, the light generated is guided by the reflective layer to the lens. By adjusting the curvature of the reflective surface and the thickness of the plating, the light is directionally reflected within the base. The choice of plastic material for the base and lens can be tailored to the transmission requirements of different wavelengths; for example, using polycarbonate can optimize the transmittance in the infrared band.

[0050] Compared to existing technologies, traditional packaging structures typically use a metal base with a separately mounted glass lens, resulting in light scattering and loss on the metal surface. This solution integrates a plastic base with the reflective surface, enabling efficient light transmission through the reflective layer within the enclosed cavity and reducing the number of interface reflections. Furthermore, replacing the metal base with plastic reduces structural weight, and injection molding is more suitable for achieving complex curved surface structures compared to metal cutting.

[0051] Through the above technical solution, this application solves the problems of low optical efficiency and bulky size of traditional packaging structures. The combination of the plastic base and the reflective surface improves the directional light transmission efficiency, the integrated injection molding process achieves a compact structure, and the reflective layer coating process enhances light utilization, providing an effective solution for the integration of optical devices on high-density circuit boards.

[0052] In addition, the conductor and the pin are integrally formed from conductive material.

[0053] Integrated molding refers to the formation of a continuous integral structure of conductors and leads through the same processing steps. Specifically, it can be achieved through stamping, casting, or in-mold injection molding processes. This is used to eliminate the connection interface between conductors and leads, and to enhance mechanical bonding and electrical stability.

[0054] Specifically, when conductors are placed on the substrate surface, the conductors and leads are molded into a single integral structure using conductive material, eliminating the need for soldering or mechanical connections between them. During solder paste positioning, the conductors directly extend the leads onto the substrate surface, enclosing the solder paste filling area. During substrate and base assembly, the integrated structure of the leads and conductors avoids increased contact resistance or reduced mechanical strength caused by separate connections. In surface mount technology (SMT), the solder paste fills through the positioning process and forms a stable bond with the conductor and lead structure, thereby improving the reliability of the connection between the substrate and external circuitry.

[0055] Compared to existing technologies, traditional packaging structures typically employ a separate design for conductors and pins, connected via soldering or riveting. This can easily lead to poor soldering or contact at the connection interface, resulting in unstable conductivity. Furthermore, separate structures are prone to deformation or breakage under high temperatures or mechanical stress, affecting pad fixation. This solution eliminates potential defects at the connection interface through integrated molding of conductors and pins, while enhancing overall structural integrity and resulting in a shorter and more robust electrical connection path between the solder paste holder and the pins.

[0056] It should be noted that the above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. However, any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A structure for integrating optical and infrared transmitting and receiving tubes based on a circuit board, comprising a substrate, a base and a lens, characterized in that, The base is attached to a substrate, the lens is connected to the base, the bottom surface of the substrate is provided with a pin, the pin is welded and fixed to the substrate through tin paste, the upper surface of the substrate is provided with a plurality of chip seats, a chip is installed on the chip seat, the upper surface of the substrate is provided with a tin paste clamping position, the tin paste clamping position is formed by a conductor, the conductor is connected to the pin, the chip is connected to the conductor through a conductive gold wire, and the conductor is fixed by filling the tin paste clamping position with tin paste.

2. The structure of claim 1, wherein the structure is a circuit board-based integrated package optical and infrared transmitting-receiving tube structure. The chip is adhered to the chip seat through silver die bonding glue.

3. The structure for integrating optical and infrared transmitting and receiving tubes based on a circuit board according to claim 1, wherein The bottom surface of the substrate is provided with an ink mark.

4. The structure for integrating optical and infrared transmitting and receiving tubes based on a circuit board according to claim 1, wherein When the number of chip seats is two or more, one of the chip seats is connected to the conductor, and the remaining chip seats are separately installed on the upper surface of the substrate, and the chips are connected in series.

5. The structure for integrating optical and infrared transmitting and receiving tubes based on a circuit board according to claim 1, wherein The lens and the base are both made of plastic material, and the inner surface of the base is used for reflecting light.

6. The structure for integrating optical and infrared transmitting and receiving tubes based on a circuit board according to claim 1, wherein The base and the lens are integrally formed.

7. The structure for integrating optical and infrared transmitting and receiving tubes based on a circuit board according to claim 1, wherein The conductor and the pin are integrally formed of conductive material.

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