Brush, substrate processing apparatus equipped therewith, and method for controlling the pressure of the brush

Abstract

To improve the uniformity of cleanliness within the plane of the substrate by considering the pressure distribution in the plane of a brush.SOLUTION: A control unit controls a pressing mechanism to adjust pressing force, According to a position of a brush 99 in a radial direction of a substrate, on the basis of a pressure distribution detected by an in-plane pressure distribution detection unit SPD. Thereby, force applied by the brush 99 when viewed from a top surface of the substrate can be made almost equal regardless of the position of the brush 99 even when the brush 99 acts unevenly depending on the position of the brush 99 in the radial direction of the substrate, Therefore, uniformity of cleanliness within a plane of the substrate can be improved.SELECTED DRAWING: Figure 6

Description

Technical Field

[0001] The present invention relates to a brush that acts on a substrate when cleaning substrates such as semiconductor substrates, substrates for flat panel displays (FPD) such as liquid crystal display and organic EL (Electroluminescence) display devices, glass substrates for photomasks, and substrates for optical discs, a substrate processing apparatus provided with the same, and a method for controlling the pressing pressure of the brush.

Background Art

[0002] Conventionally, as this type of device, there is one including a rotation holding unit, a nozzle, a brush, a weight sensor, and a cleaning arm (see, for example, Patent Document 1). The rotation holding unit holds the substrate and rotates the substrate in a horizontal plane. The nozzle supplies a cleaning liquid to the upper surface of the substrate. The cleaning arm has a brush at its tip and rotates the brush around a vertical axis. The cleaning arm swings the brush on the upper surface of the substrate with the base end as an axis. At this time, a target load is applied to the brush by a pressing pressure mechanism built in the cleaning arm, and cleaning is performed. The weight sensor is built in the brush. The weight sensor detects the pressing pressure of the brush. Thereby, the pressing pressure mechanism is operated so that the pressing pressure by the brush becomes the target load.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, in the case of the conventional example having such a configuration, there are the following problems.

[0005] Incidentally, devices are formed on substrates through processes that include various heat treatments. During this process, the substrate may warp at the periphery relative to the center, mainly due to differences in the coefficient of thermal expansion in the planar direction. When such a warped substrate is cleaned with a brush, a difference in cleanliness occurs between the center and the periphery of the substrate. In other words, a difference in cleanliness occurs in the radial direction of the substrate.

[0006] In the center of the substrate, the entire underside of the brush acts on the substrate surface. On the other hand, at the periphery of the substrate, because the substrate surface is sloped, only a portion of the underside of the brush acts on the substrate surface. In other words, the contact area of ​​the brush at the periphery is smaller than the contact area of ​​the brush at the center. Therefore, when the pressure mechanism is operated using a weight sensor so that the pressure applied by the brush reaches the target load, the load per unit area becomes greater at the periphery than at the center. In other words, when viewed from the substrate surface, the force applied by the brush body becomes greater at the periphery. When viewed from the substrate surface, the force applied by the brush body differs in the radial direction of the substrate.

[0007] As a result, conventional devices have the problem of uneven particle removal rates in the radial direction of the substrate. In other words, the cleanliness becomes non-uniform across the surface of the substrate. Furthermore, when the brush contact area is small, the load per unit area becomes excessive. This leads to another problem: the brush wears out quickly, shortening the usable time (brush life) of the brush.

[0008] The present invention has been made in view of these circumstances, and aims to provide a brush that can improve the uniformity of cleanliness within the plane of a substrate by considering the pressure distribution within the plane of the brush, a substrate processing apparatus equipped therewith, and a method for controlling the pressing pressure of the brush. [Means for solving the problem]

[0009] To achieve this objective, the present invention has the following configuration. In other words, the invention described in claim 1 is a brush for performing a cleaning process on a substrate, characterized by comprising: a brush body that acts on the substrate; a brush holder to which the brush body is attached; and an in-plane pressure distribution detection unit disposed between the brush body and the brush holder, which detects the pressure on the brush body and detects the in-plane pressure distribution of the brush body that acts on the substrate.

[0010] [Function / Effect] According to the invention described in claim 1, the in-plane pressure distribution detection unit detects the pressure distribution within the plane of the brush body. This makes it possible to determine whether or not the brush body is acting unevenly on the substrate surface. The result of this determination can then be used to adjust the pressure applied by the brush body to the substrate surface.

[0011] Furthermore, the invention described in claim 2 is a substrate processing apparatus that performs cleaning processing by applying a brush to a substrate, comprising: a rotating holding unit that holds the substrate in a horizontal position and rotates the substrate; a brush that acts on the upper surface of the substrate held by the rotating holding unit and comprises a brush body that acts on the substrate and a brush holder to which the brush body is attached; a cleaning arm having the brush at its tip and moving the brush radially in the direction of the substrate between the rotation center and the periphery of the substrate held by the rotating holding unit; a pressing mechanism that biases the brush toward the substrate with pressing pressure; an in-plane pressure distribution detection unit disposed between the brush body and the brush holder and detecting the pressure on the brush body, which detects the in-plane pressure distribution of the brush body acting on the substrate; and a control unit that controls the pressing mechanism to adjust the pressing pressure according to the position of the brush in the radial direction of the substrate based on the pressure distribution.

[0012] [Function and Effect] According to the invention described in claim 2, the control unit controls the pressing force of the pressing mechanism to adjust the pressing force according to the position of the brush in the radial direction of the substrate, based on the pressure distribution detected by the in-plane pressure distribution detection unit. As a result, even if the brush body acts unevenly according to the position of the brush in the radial direction, the force acting on the brush body as seen from the substrate surface can be made almost uniform regardless of the position of the brush. Therefore, the uniformity of cleanliness within the surface of the substrate can be improved.

[0013] Furthermore, in the present invention, it is preferable that the control unit adjusts the pressing pressure so that the load per unit area applied to the substrate by the brush is constant in the radial direction of the substrate (Claim 3).

[0014] The pressing pressure is adjusted so that the load applied per unit area to the substrate is constant in the radial direction of the substrate. Therefore, regardless of the position of the brush, the force acting on the brush body as seen from the substrate surface can be made nearly uniform.

[0015] Furthermore, in the present invention, it is preferable that the control unit defines the area of ​​the pressure distribution where the pressure is approximately the same as the equal pressure area, the equal pressure area when the brush is located in the center of the substrate as the reference equal pressure area, and when the equal pressure area is less than the reference equal pressure area, it operates the pressing mechanism to reduce the pressing pressure on the brush according to the degree of decrease in the equal pressure area (Claim 4).

[0016] If the pressure-equalized area is less than the standard pressure-equalized area, it indicates that the area of ​​the brush body acting on the substrate surface (contact area) has decreased. This indicates that the load per unit area has increased. Therefore, the pressing mechanism is operated to reduce the pressing pressure on the brush according to the degree of decrease in the pressure-equalized area. This makes it possible to make the force acting on the brush body as seen from the substrate surface nearly uniform, regardless of the position of the brush.

[0017] Furthermore, in the present invention, it is preferable that the control unit determines that the brush body is not properly attached to the brush holder if the reference pressure area falls below a predetermined value (Claim 5).

[0018] If the brush body is incorrectly installed in the brush holder in an inclined position, the reference pressure area at the center of the substrate will fall below a predetermined value. Therefore, the control unit can determine that the brush body is not properly installed. This allows the control unit to determine that proper cleaning cannot be performed and to take countermeasures such as stopping the process.

[0019] Furthermore, in the present invention, it is preferable that the control unit further adjusts at least one of the following: the rotational speed of the substrate by the rotational holding unit, the rotational speed of the brush, and the movement speed of the cleaning arm (Claim 6).

[0020] In addition to adjusting the pressing pressure using the pressing mechanism, at least one of the following is further adjusted: the rotation speed of the substrate by the rotating holding unit, the rotation speed of the brush, and the movement speed of the cleaning arm. Therefore, it is possible to suppress the unevenness of cleanliness that cannot be fully adjusted by adjusting the pressing pressure alone.

[0021] Furthermore, the invention described in claim 7 is a method for controlling the pressing pressure of a brush when cleaning a substrate by applying pressing pressure to the brush and moving it between the center and the periphery of the substrate, using a brush comprising a brush body that acts on a substrate, a brush holder to which the brush body is attached, and a cleaning arm having the brush at its tip and movable at its base, characterized in that it includes a pressure distribution detection process for detecting the pressure distribution in the plane of the brush body acting on the substrate, and a pressing pressure adjustment process for adjusting the pressing pressure according to the position of the brush in the radial direction of the substrate based on the pressure distribution.

[0022] [Function and Effect] According to the invention described in claim 7, in the pressure distribution detection process, the pressure distribution within the plane of the brush body is detected. In the pressing force adjustment process, based on the detected pressure distribution, the pressing force is adjusted according to the position of the brush in the radial direction of the substrate. Therefore, regardless of the deviation of the pressure distribution within the plane of the brush, when viewed from the substrate surface, the pressing force is adjusted so that the brush body acts evenly on the substrate surface. As a result, the force exerted by the brush body as viewed from the substrate surface can be made substantially uniform. Thus, the uniformity of the cleanliness within the plane of the substrate can be improved.

Effect of the Invention

[0023] According to the substrate processing apparatus according to the present invention, the control unit controls the pressing force mechanism to adjust the pressing force according to the position of the brush in the radial direction of the substrate based on the pressure distribution by the in-plane pressure distribution detection unit. Thereby, even if the brush body acts unevenly according to the position of the brush in the radial direction, regardless of the position of the brush, the force exerted by the brush body as viewed from the substrate surface can be made substantially uniform. Thus, the uniformity of the cleanliness within the plane of the substrate can be improved.

Brief Description of the Drawings

[0024] [Figure 1] It is a plan view showing the overall configuration of the substrate processing apparatus according to the embodiment. [Figure 2] It is a view of the substrate processing apparatus of FIG. 1 seen from the rear X. [Figure 3] It is a plan view showing the schematic configuration of the back surface cleaning unit according to the embodiment. [Figure 4] It is a side view showing the schematic configuration of the back surface cleaning unit. [Figure 5] It is a longitudinal sectional view of the cleaning arm. [Figure 6] It is a view showing the configuration of the in-plane pressure distribution detection unit. [Figure 7] It is a block diagram showing the control system of the back surface cleaning unit. [Figure 8] It is a schematic diagram for explaining the operating state of the brush at the central portion and the peripheral portion of the warped substrate. [Figure 9] This is a flowchart showing the pre-processing steps to be performed. [Figure 10] (a) shows the relationship between the opening degree of the electro-pneumatic regulator and the load of the electronic balance, (b) shows the relationship between the secondary pressure of the electro-pneumatic regulator and the opening degree, and (c) is a graph showing the relationship between the load of the pressing actuator and the secondary pressure of the electro-pneumatic regulator. [Figure 11] This is a flowchart of the cleaning process. [Modes for carrying out the invention]

[0025] Hereinafter, embodiments of the present invention will be described with reference to the drawings. Figure 1 is a plan view showing the overall configuration of the substrate processing apparatus according to the embodiment. Figure 2 is a view of the substrate processing apparatus of Figure 1 from the rear X.

[0026] <1. Overall Structure>

[0027] The substrate processing apparatus 1 comprises an input / output block 3, an indexer block 5, and a processing block 7.

[0028] The substrate processing apparatus 1 processes the substrate W. The substrate processing apparatus 1 performs a cleaning process on the substrate W, for example. The substrate processing apparatus 1 processes the substrate W in a single-wafer manner in the processing block 7. In the single-wafer manner, one substrate W at a time is processed in a horizontal position.

[0029] In this specification, for convenience, the direction in which the loading / unloading block 3, indexer block 5, and processing block 7 are aligned is called the "front-to-back direction X". The front-to-back direction X is horizontal. Of the front-to-back direction X, the direction from the processing block 7 toward the loading / unloading block 3 is called the "front". The direction opposite to the front is called the "rear". The horizontal direction perpendicular to the front-to-back direction X is called the "width direction Y". One direction of the "width direction Y" is appropriately called the "right". The direction opposite to the right is called the "left". The direction perpendicular to the horizontal is called the "vertical direction Z". In each figure, front, rear, right, left, up, and down are shown as appropriate for reference.

[0030] <2. Loading / Unloading Block>

[0031] The loading / unloading block 3 includes an input section 9 and an output section 11. The input section 9 and the output section 11 are arranged in the width direction Y. Multiple substrates W (for example, 25) are stacked horizontally at regular intervals within a single carrier C. The carrier C containing the unprocessed substrates W is placed on the input section 9. The input section 9 includes, for example, two mounting tables 13 on which the carrier C is placed. The carrier C has multiple grooves (not shown) formed therein, which accommodate each substrate W with the surfaces of the substrates W spaced apart. The carrier C accommodates the substrates W in a orientation with the surface facing upwards. An example of a carrier C is a FOUP (Front Opening Unify Pod). A FOUP is a sealed container. The carrier C may be an open container, and is of any type.

[0032] The dispensing unit 11 is located on the opposite side of the input unit 9, across the center of the width Y in the substrate processing apparatus 1. The dispensing unit 11 is positioned to the left Y of the input unit 9. The dispensing unit 11 stores the processed substrates W in a carrier C and dispenses the carrier C together. The dispensing unit 11, which functions in this way, is equipped with, for example, two mounting tables 13 for placing the carrier C, similar to the input unit 9. The input unit 9 and the dispensing unit 11 are also called load ports.

[0033] <3. Indexer Block>

[0034] The indexer block 5 is located adjacent to the rear X of the loading / unloading block 3 in the substrate processing apparatus 1. The indexer block 5 includes an indexer robot IR and a transfer unit 15.

[0035] The indexer robot IR is configured to rotate around the vertical Z direction. The indexer robot IR is configured to move in the width direction Y. The indexer robot IR comprises a first hand 19 and a second hand 21. In Figure 1, only one hand is shown for illustrative purposes. The first hand 19 and the second hand 21 each hold one substrate W. The first hand 19 and the second hand 21 are configured to move independently in the front-rear direction X. The indexer robot IR moves in the width direction Y and rotates around the vertical Z direction, moving the first hand 19 and the second hand 21 forward and backward to transfer the substrate W between each cassette C. Similarly, the indexer robot IR transfers the substrate W between itself and the transfer unit 15.

[0036] The transfer section 15 is located at the boundary between the indexer block 5 and the processing block 7. The transfer section 15 is located, for example, in the center in the width direction Y. As shown in Figure 2, the transfer section 15 is formed to be elongated in the vertical direction Z.

[0037] The transfer section 15 comprises a first reversal unit 23, a pass section 25, a pass section 27, and a second reversal unit 29, extending from below to above in the vertical direction Z.

[0038] The first inversion unit 23 inverts the top and bottom of the substrate W received from the indexer block 5. The first inversion unit 23 also inverts the horizontal orientation of the substrate W. Specifically, the first inversion unit 23 changes the orientation of the substrate W from having the top surface facing upwards to having the top surface facing downwards. In other words, it changes the orientation of the substrate W so that the back surface faces upwards.

[0039] The second inversion unit 29 performs the reverse operation. That is, the second inversion unit 29 inverts the orientation of the substrate W received from the processing block 7. The second inversion unit 29 converts the substrate W, which is facing downwards, to an orientation where the front surface is facing upwards. In other words, it converts the orientation of the substrate W so that the back surface is facing downwards.

[0040] The inversion directions of the first inversion unit 23 and the second inversion unit 29 described above may be opposite to each other. That is, the first inversion unit 23 changes the orientation of the substrate W so that the front surface is facing upwards. The second inversion unit 29 changes the orientation of the substrate W so that the back surface is facing upwards.

[0041] The path sections 25 and 27 are used to transfer the substrate W between the indexer block 5 and the processing block 7. Path section 25 is used, for example, to transport the substrate W from the processing block 7 to the indexer block 5. Path section 27 is used, for example, to transport the substrate W from the indexer block 5 to the processing block 7. Note that the transport directions of the substrate W in path sections 25 and 27 may be opposite to each other.

[0042] <4. Processing Block>

[0043] Processing block 7 performs a cleaning process on the substrate W, for example. The cleaning process is, for example, a process using a brush in addition to a processing liquid. As shown in Figure 1, processing block 7 is divided into, for example, a first column R1, a second column R2, and a third column R3 in the width direction Y. In detail, the first column R1 is located to the left in Y. The second column R2 is located in the center of the width direction Y. In other words, the second column R2 is located to the right of the first column R1 in Y. The third column R3 is located to the right of the second column R2 in Y.

[0044] <4-1. 1st column>

[0045] The first column R1 of the processing block 7 comprises multiple processing units 31. For example, the first column R1 comprises four processing units 31. The first column R1 consists of four processing units 31 stacked in the vertical direction Z. Each processing unit 31 will be described in detail later. Each processing unit 31 is, for example, a cleaning unit. The cleaning unit cleans the substrate W. Cleaning units include a surface cleaning unit that cleans the surface of the substrate W and a back surface cleaning unit that cleans the back surface of the substrate W. In this embodiment, the back surface cleaning unit SSR will be used as an example of a processing unit 31.

[0046] <4-2. 2nd column>

[0047] The second column R2 of the processing block 7 is equipped with a center robot CR. The center robot CR is configured to be rotatable about the vertical direction Z. The center robot CR is configured to be able to move up and down in the vertical direction Z. The center robot CR includes, for example, a first hand 33 and a second hand 35. The first hand 33 and the second hand 35 each hold one substrate W. The first hand 33 and the second hand 35 are configured to move independently in the front-rear direction X and the width direction Y.

[0048] <4-3. 3rd column>

[0049] The third column R3 of processing block 7 has the same configuration as the first column R1. That is, the third column R3 has multiple processing units 31. For example, the third column R3 has four processing units 31. The four processing units 31 in the third column R3 are stacked in the vertical direction Z. Each processing unit 31 in the first column R1 and each processing unit 31 in the third column R3 are positioned opposite each other in the width direction Y. This allows the center robot CR to access each opposing processing unit 31 in the first column R1 and the third column R3 at the same height in the vertical direction Z.

[0050] Processing block 7 is configured as described above. Here, an example of the operation of the center robot CR will be briefly explained. The center robot CR receives the substrate W from the first inversion unit 23, for example. The center robot CR transports the substrate W to either the first row R1 or the third row R3 back surface cleaning unit SSR to perform cleaning on the back surface of the substrate W. The center robot CR receives the substrate W that has been cleaned by either the first row R1 or the third row R3 back surface cleaning unit SSR. The center robot CR transports the substrate W to the second inversion unit 29.

[0051] <4-4. Processing Unit>

[0052] Here, the back surface cleaning unit SSR (processing unit 31) will be described with reference to Figures 3 to 5. Figure 3 is a plan view showing the schematic configuration of the back surface cleaning unit according to the embodiment. Figure 4 is a side view showing the schematic configuration of the back surface cleaning unit. Figure 5 is a longitudinal cross-sectional view of the cleaning arm.

[0053] Here, we will explain using the back surface cleaning unit SSR provided in the first row R1 as an example. The back surface cleaning unit SSR in the third row R3 has a configuration where the arrangement in the width direction Y is reversed.

[0054] The back surface cleaning unit SSR comprises a rotating holding section 37, a guard 39, a first processing liquid arm 41, a second processing liquid arm 43, a cleaning arm 45, and a standby pot 47.

[0055] The rotating holding unit 37 is positioned approximately in the center of the back surface cleaning unit SSR in a plan view. The rotating holding unit 37 rotates the substrate W in the horizontal plane while holding the substrate W in a horizontal position. The rotating holding unit 37 comprises an electric motor 49, a rotating shaft 51, a spin chuck 53, and a support pin 55.

[0056] The electric motor 49 is positioned with its rotating shaft 51 oriented in the vertical direction Z. A spin chuck 53 is attached to the upper end of the rotating shaft 51. The spin chuck 53 has a diameter slightly larger than the diameter of the substrate W. The spin chuck 53 is a circular plate-like member. The spin chuck 53 is equipped with a plurality of support pins 55. In this embodiment, for example, there are six support pins 55. The six support pins 55 contact the outer edge of the substrate W and support the substrate W in a horizontal position. The number of support pins 55 is not limited to six, as long as the substrate W can be stably supported in a horizontal position. The six support pins 55 are erected near the outer edge of the substrate W in the spin chuck 53. The six support pins 55 release the holding of the periphery of the substrate W when the substrate W is loaded into the spin chuck 53 and when the substrate W is unloaded from the spin chuck 53. Therefore, each support pin 55 is configured to be rotatable about the vertical direction Z. A detailed explanation of the specific configuration for performing this operation will be omitted. When the electric motor 49 rotates, the rotation holding unit 37 rotates the spin chuck 53 about the rotation center P1. The rotation center P1 is in the vertical direction Z.

[0057] <4-4-2. Guard>

[0058] The guard 39 is positioned to surround the rotating holding part 37 in a plan view. More specifically, the guard 39 comprises a cylindrical body 57 and an inclined part 59. The guard 39 is configured to be able to move up and down in the vertical direction Z. The guard 39 can move between a lowered standby position and a processing position above the standby position. A detailed explanation of the specific configuration for moving the guard 39 up and down is omitted.

[0059] The body 57 of the guard 39 is cylindrical. The inner circumferential surface of the body 57 is positioned outward from the outer circumferential side of the rotating holding part 37. The inclined part 59 is narrowed from the top of the body 57 toward the rotating shaft 51 side. The inclined part 59 has an opening 61 at its top. The opening 61 is formed in the center of the inclined part 59. The opening 61 is larger than the diameter of the substrate W. The opening 61 is larger than the diameter of the spin chuck 53. When loading or unloading the substrate W, the guard 39 is lowered in the vertical direction Z to a position where the spin chuck 53 protrudes upward from the opening 61. When cleaning the substrate W, the inclined part 59 of the guard 39 is positioned at approximately the height of the substrate W held by the spin chuck 53. The inclined part 59 guides the processing liquid and other substances scattered from the substrate W to the lower part of the guard 39 with its inclined inner circumferential surface.

[0060] <4-4-3. First Processing Liquid Arm>

[0061] The first processing liquid arm 41 is positioned rear X of the rotation holding unit 37 in a plan view. The first processing liquid arm 41 is equipped with an electric motor 42 at its base end. The first processing liquid arm 41 is oscillated around a rotation center P2 at its base end by the electric motor 42. The rotation center P2 is in the vertical direction Z. The first processing liquid arm 41 is equipped with one nozzle 63. The nozzle 63 has a discharge port at its bottom. The nozzle 63 discharges processing liquid. The tip of the nozzle 63 of the first processing liquid arm 41 is configured to swing between a standby position shown in Figure 3 and a supply position near the rotation center P1. When the first processing liquid arm 41 supplies processing liquid to the substrate W, the tip of the nozzle 63 is moved to the supply position. When the first processing liquid arm 41 does not supply processing liquid to the substrate W, the tip of the nozzle 63 is moved to the standby position. The first processing liquid arm 41 may be configured to swing its nozzle 63 above the substrate W so as not to interfere with the cleaning arm 45 when supplying the processing liquid to the substrate W.

[0062] Examples of the processing liquid discharged from the nozzle 63 include a rinsing solution. Examples of rinsing solutions include pure water, carbonated water, electrolyzed ionized water, hydrogen water, and ozonated water.

[0063] <4-4-4. Second processing fluid arm>

[0064] The second processing liquid arm 41 is positioned to the left Y of the rotation holding unit 37 in a plan view. The second processing liquid arm 41 is equipped with an electric motor 44 at its base end. The second processing liquid arm is oscillated by the electric motor 44 around a rotation center P3 at its base end. The rotation center P3 is in the vertical direction Z. The second processing liquid arm 43 is equipped with three nozzles 65, 67, and 69. Each nozzle 65, 67, and 69 has a discharge port at its bottom. The nozzles 65, 67, and 69 discharge processing liquid. The second processing liquid arm 43 is configured so that the tips of the nozzles 65, 67, and 69 can oscillate between a standby position shown in Figure 3 and a supply position near the rotation center P1. When the second processing liquid arm 43 supplies processing liquid to the substrate W, the tips of the nozzles 65, 67, and 69 are moved to the supply position. When the second processing liquid arm 43 is not supplying processing liquid to the substrate W, the tips of the nozzles 65, 67, and 69 are moved to a standby position. When supplying processing liquid to the substrate W, the second processing liquid arm 43 may also be configured to swing the nozzles 65, 67, and 69 above the substrate W to avoid interference with the cleaning arm 45.

[0065] Examples of the processing liquid discharged from nozzles 65, 67, and 69 include chemical solutions. Examples of chemical solutions include those containing at least one of sulfuric acid, nitric acid, acetic acid, hydrochloric acid, hydrofluoric acid, ammonia water, and hydrogen peroxide. More specifically, a mixture of ammonia water and hydrogen peroxide, such as SC-1, can be used.

[0066] <4-4-5. Washing Arm>

[0067] The cleaning arm 45 is configured as follows:

[0068] The cleaning arm 45 comprises a rotating and lifting mechanism 71, a support column 73, a housing 75, and a cleaning section 77.

[0069] The rotary lifting mechanism 71 is configured to allow the support column 73, the housing 75, and the cleaning unit 77 to move up and down in the vertical direction Z. The rotary lifting mechanism 71 is configured to allow the support column 73, the housing 75, and the cleaning unit 77 to swing around the rotation center P4. Specifically, the rotary lifting mechanism 71 is configured, for example, by combining an electric motor and an air cylinder. In the standby position, the rotary lifting mechanism 71 raises the cleaning unit 77 from the standby pot 47 in the vertical direction Z. The rotary lifting mechanism 71 swings (moves) the cleaning unit 77 in a horizontal plane so that the cleaning unit 77 passes near the rotation center P1.

[0070] The support column 73 is cylindrical in shape. The lower part of the support column 73 is connected to the rotational lifting mechanism 71. The upper part of the support column 73 is connected to one of the lower parts of the housing 75. The housing 75 has a long axis in the horizontal plane. The housing 75 is equipped with a cleaning unit 77 at the other lower part. The cleaning unit 77 rotates around a rotation center P5. The rotation center P5 is in the vertical direction Z.

[0071] The enclosure 75 comprises a lower enclosure 75a and an upper enclosure 75b. The lower enclosure 75a constitutes the lower part of the enclosure 75. The upper enclosure 75b constitutes the upper part of the enclosure 75. The upper enclosure 75b and the lower enclosure 75a are connected to each other.

[0072] The housing 75 is equipped with a pressing mechanism 81 and a rotating mechanism 83. Specifically, the lower housing 75a is equipped with the pressing mechanism 81 and the rotating mechanism 83.

[0073] The pressing mechanism 81 comprises a pivot member 85, a seesaw member 87, a pressing actuator 89, and a support mechanism 91.

[0074] The pivot member 85 is attached to the upper surface of the lower housing 75a. The pivot member 85 is erected approximately in the center of the lower housing 75a in the front-rear direction X. The pivot member 85 has a pivot shaft 85a at its upper part. The pivot shaft 85a is rotatable about the width direction Y. The seesaw member 87 has its central part 87c pivotably attached to the pivot member 85 via the pivot shaft 85a. The seesaw member 87 has both ends, one side 87l (point of application) and the other side 87r (point of force application), which can alternately move up and down in the vertical direction Z. The pivot shaft 85a is the pivot point of the seesaw member 87.

[0075] The pressing actuator 89 has an operating piece 89a positioned vertically in the Z direction. The pressing actuator 89 raises one side 87l of the seesaw member 87 by extending the operating shaft 89a. The pressing actuator 89 is preferably an air bearing actuator, for example.

[0076] In an air bearing actuator, the operating shaft 89a is supported by air, allowing it to move back and forth with a small gap. Therefore, theoretically, the sliding resistance of the operating shaft 89a is zero, and no friction occurs. As a result, an air bearing actuator can move the operating shaft 89a back and forth even with a small amount of air pressure, compared to a conventional air cylinder. Consequently, it is possible to move it back and forth linearly in response to the air pressure. However, a conventional air cylinder can also be used as the pressing actuator 89.

[0077] In the front-rear direction X, a support mechanism 91 is provided on the opposite side of the pressing actuator 89, which is flanked by the pivot member 85. The support mechanism 91 supports the cleaning unit 77. The support mechanism 91 suspends the cleaning unit 77 below the housing 75.

[0078] The support mechanism 91 includes a holding member 93, a biasing part 95, and a guide part 97.

[0079] The support mechanism 91 suspends and supports the cleaning unit 77. The cleaning unit 77 includes a brush 99 and a brush holder 101. The brush 99 acts on the substrate W to perform cleaning. The brush holder 101 holds the brush 99. The brush holder 101 holds the brush 99 in a detachable manner. A rotating shaft 103 is attached to the center of the brush holder 101 in a plan view. The rotating shaft 103 extends vertically in the Z direction from the brush holder 101. The brush 99 is held by the cleaning arm 45 and moves in the horizontal plane so as to pass near the rotation center P1 of the substrate W.

[0080] The retaining member 93 rotatably holds the rotating shaft 103. The rotating shaft 103 is, for example, a spline shaft. The rotating shaft 103 is attached to the retaining member 93 via a spline nut 103a. The rotating shaft 103 is movable vertically in the Z direction relative to the spline nut 103a. The retaining member 93 holds the spline nut 103a in a state that allows it to rotate around the vertical Z direction. The spline nut 103a is attached to the retaining member 93 via a bearing (not shown). The rotating shaft 103 is rotatable around the rotation center P5. A pulley 105 is attached to the spline nut 103a protruding from the upper part of the retaining member 93. The pulley 105 is fixed to the outer circumferential surface of the spline nut 103a. When the pulley 105 rotates, the spline nut 103a rotates, and the rotating shaft 103 rotates in the same direction along with it.

[0081] A biasing part 95 is positioned on the upper part of the pulley 105. The biasing part 95 comprises an upper holding part 107, a lower holding part 109, and a coil spring 111. The upper holding part 107 is attached to the upper side of the rotating shaft 103 via a bearing (not shown). In other words, the upper holding part 107 remains stationary even when the rotating shaft 103 rotates. The lower holding part 109 is positioned spaced apart from the upper holding part 107. The lower holding part 109 is located below the upper holding part 107 and on the upper part of the pulley 105. The inner circumferential surface of the lower holding part 109 is positioned spaced apart from the outer circumferential surface of the rotating shaft 103. Therefore, the lower holding part 109 remains stationary even when the rotating shaft 103 rotates. The lower holding part 109 is also attached to the upper surface of the pulley 105 via a bearing. Therefore, the lower holding portion 109 is not affected by the rotation of the pulley 105.

[0082] The coil spring 111 is attached to the upper holding portion 107 and the lower holding portion 109. The upper end of the coil spring 111 is fixed to the upper holding portion 107. The lower end of the coil spring 111 is fixed to the lower holding portion 109. The coil spring 111 has, for example, a cylindrical shape. The coil spring 111 is a compression coil spring. Therefore, the upper holding portion 107 is biased upward from the upper surface of the pulley 105 and the lower holding portion 109. As a result, the rotating shaft 103 is biased upward in the vertical direction Z. Therefore, in the normal state when the pressing actuator 89 is not operating, the brush 99 is maintained at a constant height from the lower surface of the lower housing 75a. In other words, in the normal state, the load on the brush 99 is zero.

[0083] The support mechanism 91 supports a rotating shaft 103 that moves up and down in the vertical direction Z. The support mechanism 91 comprises a linear guide 113 and a shaft holding part 115. The linear guide 113 is positioned adjacent to the holding member 93. The linear guide 113 is erected in the vertical direction Z. The linear guide 113 comprises a rail 113a and a carriage 113b. The rail 113a has its longitudinal direction oriented in the vertical direction Z. The carriage 113b is attached to the rail 113a so as to be movable in the vertical direction Z. The carriage 113b is positioned below the other side 87r of the seesaw member 87. The carriage 113b is positioned to contact the other side 87r of the seesaw member 87 when it is lowered.

[0084] The shaft holder 115 holds the upper part of the rotating shaft 103. The shaft holder 115 holds the rotating shaft 103 in a state that allows it to rotate. The shaft holder 115 holds the rotating shaft 103 via, for example, a bearing (not shown). The carriage 113b is connected to the shaft holder 115. When the pressing actuator 89 raises the operating shaft 89a with a driving force stronger than the biasing force of the coil spring 111, one side 87l (point of application) rises. When one side 87l rises, the other side 87r (point of force application) descends. At this time, the other side 87r lowers the carriage 113b together with the shaft holder 115. As a result, the rotating shaft 103 descends, and the brush 99 moves downward from its predetermined position. When the pressing actuator 89 is driven in this manner, a pressing force corresponding to the driving force of the pressing actuator 89 is applied to the brush 99.

[0085] A rotating mechanism 83 is positioned adjacent to the support mechanism 91. The rotating mechanism 83 is positioned on the pivot member 85 side. The rotating mechanism 83 comprises a mounting member 117 and an electric motor 119. The mounting member 117 is positioned above the bottom surface of the lower housing 75a, spaced apart from the electric motor 119. The rotating shaft of the electric motor 119 is positioned downward in the vertical direction Z. The electric motor 119 rotates its rotating shaft around a rotation center P6. The rotation center P6 is approximately parallel to the rotation center P5 in the vertical direction Z. A pulley 121 is attached to the rotating shaft of the electric motor 119. A timing belt 123 is stretched between pulley 121 and pulley 105. Therefore, when the electric motor 119 rotates, the rotating shaft 103 rotates around the rotation center P5 via the timing belt 123, pulleys 105 and 121, and spline nut 103a. Even when the rotation axis 103 is rotated in this manner, the rotation axis 103 can still move up and down in the vertical direction Z.

[0086] As described above, the cleaning arm 45 is configured as follows. In other words, the operation of the pressing actuator 89 is applied to the other side 87r (point of application) of the seesaw member 87 via one side 87l (point of force application). Therefore, by providing the seesaw member 87, the degree of freedom in the placement of the pressing actuator 89 is increased. Consequently, the height of the substrate processing apparatus 1 can be suppressed. As a result, a multi-stage stacking arrangement of the substrate processing apparatus 1 can be easily realized.

[0087] Now, let's explain the height to which brush 99 moves up and down.

[0088] The seesaw member 87 described above is oscillated by the pressing actuator 89. For example, the pressing actuator 89 is operated according to the target load, as will be described later. This operation moves the brush 99 vertically in the Z direction. Specifically, the brush 99 is raised and lowered to the following heights.

[0089] (1) No-load height H1: This is the height in the vertical direction Z at which the brush 99 does not act on the substrate W. This no-load height H1 is higher than the other heights listed below. Under normal conditions, except during cleaning, the brush 99 is positioned at this no-load height H1.

[0090] (2) Working height H2: This is the vertical Z height required to apply a predetermined load to the substrate W with the brush 99. This height is lower than the unloaded height H1. When performing a cleaning treatment on the substrate W, the brush 99 is lowered to this working height H2. However, this position is the height at which a predetermined load is applied to the brush 99 and the reaction force from the substrate W balances the load.

[0091] (3) Maximum indentation height H3: This is a height lower than the working height H2. This is the lowest position the brush 99 moves to in the vertical direction Z. This maximum indentation height H3 is determined by the structure of the pressing mechanism 81. The brush 99 cannot move below this maximum indentation height H3.

[0092] <4-4-6. In-plane pressure distribution detection unit>

[0093] Now, refer to Figures 4 to 6. Figure 6 shows the configuration of the in-plane pressure distribution detection unit.

[0094] As described above, the cleaning unit 77 includes a brush 99 and a brush holder 101. The brush 99 has a tip portion 99a that protrudes downward from the center. The brush 99 has a downward convex shape. The tip portion 99a is formed to be concentric with the brush 99.

[0095] The brush 99 mentioned above corresponds to the "brush body" in this invention.

[0096] As shown in Figures 4 and 5, the cleaning unit 77 is equipped with an in-plane pressure distribution detector SPD. The brush holder 101 is equipped with an in-plane pressure distribution detector SPD on its lower surface. The brush 99 is equipped with an in-plane pressure distribution detector SPD on its upper surface. The in-plane pressure detector SPD is provided between the brush holder 101 and the brush 99. In detail, the in-plane pressure distribution detection unit SPD is mounted on the ceiling surface of the brush holder 101, facing the upper surface of the brush 99.

[0097] The in-plane pressure detector SPD detects the pressure applied to the tip portion 99a (protruding portion) of the brush 99. More specifically, the in-plane pressure detector SPD detects the pressure distribution applied to the lower surface of the brush 99. The in-plane pressure detection unit SPD does not measure load, but rather detects pressure distribution. When the target load is applied to the brush 99 by the pressing mechanism 81 described above, the in-plane pressure detector SPD detects the pressure distribution in accordance with the reaction force received by the tip portion 99a from the upper surface of the substrate W.

[0098] The in-plane pressure detector (SPD) is configured as shown in Figure 6, for example.

[0099] The in-plane pressure detector SPD comprises a detection unit 301, a reading unit 303, an A / D converter 305, and a signal line 307.

[0100] The detection unit 301 has, for example, a rectangular shape. The detection unit 301 is larger than the circular shape that constitutes the cross-section of the tip portion 99a of the brush 99, and smaller than the circular shape that constitutes the cross-section of the brush 99. The detection unit 301 has an area larger than the area of ​​the cross-section of the tip portion 99a. The detection unit 301 is configured, for example, as follows:

[0101] The detection unit 301 is printed with ink on a flexible film. The ink is printed linearly in the row and column directions of the film. In other words, the ink is printed in a matrix. The ink is made of a material containing a pressure-resistant substance. The intersections of the row and column directions of the film become pressure-sensitive areas. When pressure is applied to the intersections in the matrix direction, the resistance value of the ink changes according to the magnitude of the pressure. The pressure referred to here is not the absolute value of the pressure. The pressure referred to here is a numerical value that represents the strength of the pressure. The pressure read from the detection unit 301 is the trend of the pressure distribution.

[0102] The reading units 303 are arranged in the row and column directions. The reading units 303 are connected to the A / D converter 305. The A / D converter 305 sequentially reads the pressure at each intersection of the film via the matrix-direction reading units 303. A signal corresponding to each read pressure is output via the signal line 307.

[0103] The signal read out on the signal line 307 is transmitted via the vertical hole 103b and slip ring 309 of the rotating shaft 103. The vertical hole 103b is formed in the rotating shaft 103. The vertical hole 103b is drilled along the long axis of the rotating shaft 103. The signal line 307 is inserted into the vertical hole 103b. The signal line 307 is electrically connected to the cleaning arm 45 via the slip ring 309 provided on the outer circumference of the rotating shaft 103. In this way, the signal indicating the pressure distribution is transmitted from the rotating brush 99 to the stationary cleaning arm 45.

[0104] <4-5. Control System>

[0105] Now refer to Figure 7. Figure 7 is a block diagram showing the control system of the back surface cleaning unit.

[0106] One end of the piping 125 is connected to the nozzle 63 mentioned above. The other end of the piping 125 is connected to a rinse liquid supply source 127. The rinse liquid supply source 127 supplies the rinse liquid mentioned above. The piping 125 is equipped with a flow control valve 129. The flow control valve 129 controls the flow rate of the rinse liquid in the piping 125.

[0107] One end of the piping 131 is connected to the nozzle 65 described above. The other end of the piping 131 is connected to a processing liquid supply source 133. The processing liquid supply source 133 supplies one of the various chemical solutions described above. The piping 131 is equipped with a flow control valve 135. The flow control valve 135 controls the flow rate of the chemical solution in the piping 131.

[0108] One end of the piping 137 is connected to the nozzle 67 mentioned above. The other end of the piping 137 is connected to a processing liquid supply source 139. The processing liquid supply source 139 supplies one of the various chemical solutions mentioned above. The piping 137 is equipped with a flow control valve 141. The flow control valve 141 controls the flow rate of the chemical solution in the piping 139.

[0109] One end of the piping 143 is connected to the nozzle 69 mentioned above. The other end of the piping 143 is connected to a processing liquid supply source 145. The processing liquid supply source 145 supplies one of the various chemical solutions mentioned above. The piping 143 is equipped with a flow control valve 147. The flow control valve 147 controls the flow rate of the chemical solution in the piping 143.

[0110] One end of the air supply pipe 149 is connected to the aforementioned pressing actuator 89. Although the pressing actuator 89 is supplied with air to support the operating shaft 89a with a small gap, this piping and other related details are omitted. An air supply source 151 is connected to the other end of the air supply pipe 149. The air supply source 151 supplies, for example, air. The air is preferably dry air. The air supply source 151 is also connected to other devices. The supply pressure of the air supply source 151 is affected by the operating status of the other devices. In other words, the supply pressure may decrease when the operating rate of the other devices increases. The air supply pipe 149 is equipped with, in order from the air supply source 151 side, an on-off valve 153, a primary side pressure gauge 155, an electro-pneumatic regulator 157, and a secondary side pressure gauge 159.

[0111] The on / off valve 153 allows or blocks the flow of air in the air supply pipe 149. The primary pressure gauge 155 measures the air pressure upstream of the electro-pneumatic regulator 157. The electro-pneumatic regulator 157 adjusts the opening of its built-in valve in response to an input signal. This allows the electro-pneumatic regulator 157 to adjust the air pressure in the air supply pipe 149. Specifically, the electro-pneumatic regulator 157 reduces the primary pressure by adjusting the valve opening in response to a given input signal, which becomes the secondary pressure in the air supply pipe 149. The electro-pneumatic regulator 157 cannot adjust the secondary pressure to a level higher than the primary pressure in the air supply pipe 149. The electro-pneumatic regulator 157 adjusts the secondary pressure to be less than or equal to the primary pressure in the air supply pipe 149. If the primary pressure exceeds a predetermined value, the electro-pneumatic regulator 157 can adjust the secondary pressure to a range below that predetermined value. In other words, if the primary pressure of the electro-pneumatic regulator 157 is below a predetermined value, it may not be able to accurately adjust the secondary pressure to a certain value or higher.

[0112] The control unit 161 comprehensively controls each of the above-mentioned parts. Specifically, the control unit 161 controls the transport operations in the input unit 9 and the discharge unit 11, the transport operations of the indexer robot IR, the reversal operations of the first reversal unit 23 and the second reversal unit 29, and the transport operations of the center robot CR. The control unit 161 controls the rotation of the electric motor 49 in the back surface cleaning unit SSR (processing unit 31), the lifting and lowering operations of the guard 39, the opening and closing operations of the support pin 55 in the spin chuck 53, the oscillating operations of the electric motors 42 and 44, the opening and closing operations of the flow control valves 129, 135, 141, and 147, the oscillating and lifting operations of the rotary lifting mechanism 71, the rotation operation of the electric motor 119, the opening and closing operations of the on / off valve 153, and the opening degree operation of the electro-pneumatic regulator 157.

[0113] The control unit 161 includes a CPU and memory (not shown). An instruction unit 163 is connected to the control unit 161. The instruction unit 163 is operated by the operator of the substrate processing device 1. The instruction unit 163 is used by the operator to provide instructions such as recipes that define the processing content of the substrate W, and to start and stop processing. An alert unit 165 is connected to the control unit 161. The alert unit 165 generates an alarm when a problem occurs in the substrate processing device 1 to notify the operator of the problem. The alert unit 165 may be, for example, a display device, lamp, buzzer, or speaker. Preferably, the alert unit 165 can confirm the type of problem that has occurred. The control unit 161 includes an input port IP. Data from various electronic devices is input to the input port IP. The data input from the input port IP is processed or stored in the control unit 161.

[0114] The control unit 161 receives a signal from the in-plane pressure detection unit SPD regarding the pressure of the brush 99 in the plane. Based on the signal from the in-plane pressure detection unit SPD, the control unit 161 calculates the area (pressure distribution) with the same pressure based on the intersections of the same pressure and the positions of the intersections. As will be described in detail later, it is preferable that the control unit 161 checks the mounting state of the brush 99 based on the pressure distribution only once when the cleaning process is started on a certain substrate W.

[0115] The control unit 161 receives the in-plane pressure distribution at a predetermined period when a target load is applied to the brush 99 and the cleaning process is performed. The predetermined period is much shorter than the period during which the brush 99 moves from the center to the periphery of the substrate W. The predetermined period is, for example, several tens of milliseconds to several hundred milliseconds. Upon receiving the pressure distribution, the control unit 161 operates the pressing mechanism 81 according to the pressure distribution to adjust the pressing pressure on the brush 99 according to the radial position of the substrate W.

[0116] Now, refer to Figure 8. Figure 8 is a schematic diagram illustrating the action of the brush on the central and peripheral parts of a warped substrate.

[0117] If the substrate W is warped, a difference in the action of the brush 99 will occur between the central part CP and the peripheral part PP. Here, for example, as shown in Figure 8, the peripheral part PP of the substrate W is sagging downwards relative to the central part CP of the substrate W, which is radially separated from the substrate W. In other words, the peripheral part PP of the substrate W is warped downwards relative to the central part CP.

[0118] When cleaning a substrate W with such warping, the tip 99a of the brush 99 acts on the upper surface of the substrate W with almost the entire lower surface at the central part CP. In other words, when a target load is applied to the brush 99, the tip 99a receives a reaction force corresponding to the target load across almost its entire surface. To put it another way, almost the entire surface of the tip 99a receives roughly the same amount of pressure.

[0119] In Figure 8, the area of ​​the lower surface of the tip 99a of the brush 99 acting on the substrate W is represented by the symbol CA as the pressure-equal area (hatched region). The pressure-equal area CA1 is the case for the central part CP. On the other hand, at the peripheral part PP, only a portion of the tip 99a of the brush 99 closer to the central part CP acts on the upper surface of the substrate W. In other words, when a target load is applied to the brush 99, only a portion of the tip 99a receives a reaction force corresponding to the target load. In other words, only a portion of the tip 99a receives the same pressure. In this case, the area acting on the upper surface of the substrate W is called the pressure-equal area CA2. In this example, pressure-equal area CA1 > pressure-equal area CA2.

[0120] The aforementioned pressure-equal area CA is a region where approximately the same pressure is applied. Here, "same pressure" means, for example, that the control unit 161 calculates the average pressure at all intersections of the detection unit 301, and that the pressure falls within a predetermined range (e.g., ±10%) of that average value.

[0121] When the same target load is applied to the brush 99 at the central part CP and the peripheral part PP, the area of ​​equal pressure acting on the upper surface of the substrate W is different, so the load per unit area acting on the upper surface of the substrate W is different at the central part CP and the peripheral part PP. In other words, the force that the brush 99 exerts on the upper surface of the substrate W is different in the radial direction of the substrate W. Therefore, the control unit 161 adjusts the pressing pressure by operating the pressing mechanism 81 according to the pressure distribution of the brush 99, i.e., the area of ​​equal pressure CA, so that the force that the brush 99 exerts on the upper surface of the substrate W is the same in the radial direction of the substrate W.

[0122] At the beginning of the cleaning process, the control unit 161 positions the cleaning arm 45 at the rotation center P1 of the substrate W while maintaining the brush 99 at the unloaded height H1. Next, the control unit 161 applies a target load to the brush 99 using the pressing mechanism 81. Furthermore, the control unit 161 lowers the brush 99 to the loaded height H2. At this time, the control unit 161 determines the equal pressure area based on the output of the in-plane pressure distribution detection unit SPD. This equal pressure area is defined as the reference equal pressure area. Preferably, if the reference equal pressure area falls below a predetermined value, the control unit 161 determines that the brush 99 is not properly attached to the brush holder 101 and issues an alarm. Preferably, the predetermined value to be compared with the reference equal pressure area is set for each brush 99. This allows for accurate determination of the brush mounting status according to the type of brush 99.

[0123] The aforementioned back surface cleaning unit SSR (processing unit 31) corresponds to the "substrate processing apparatus" in this invention.

[0124] <5. Pre-processing in the processing unit>

[0125] Referring to Figures 9 and 10, the pretreatment in the SSR back surface cleaning device described above will be explained. Figure 9 is a flowchart of the pretreatment performed in advance. Figure 10(a) shows the relationship between the opening degree of the electro-pneumatic regulator and the load of the electronic balance, Figure 10(b) shows the relationship between the secondary pressure of the electro-pneumatic regulator and the opening degree, and Figure 10(c) is a graph showing the relationship between the load of the pressing actuator and the secondary pressure of the electro-pneumatic regulator.

[0126] The operator of the substrate processing apparatus 1 operates the instruction unit 163 to instruct a pre-treatment for one back surface cleaning unit SSR.

[0127] Step S1 An electronic balance is placed. Specifically, an electronic balance (not shown) is placed in the rotating holding unit 37. The electronic balance is a device for measuring load. Preferably, the electronic balance is equipped with a data output terminal. The data output terminal of the electronic balance is connected to the input port IP. The electronic balance outputs a measured value from the data output terminal. The measured value is, for example, load (g).

[0128] Step S2 The load is measured. Specifically, for example, the control unit 161 varies the input signal to the electro-pneumatic regulator 157 with the on-off valve 153 open, and measures the load X(g) on ​​the electronic balance for each input signal. Alternatively, the operator may specify several loads (target loads X(g)) that they want to apply with the brush 99 during processing from the instruction unit 163, and vary the input signal to the electro-pneumatic regulator 157 so that the measured value of the electronic balance becomes each target load X(g), thereby obtaining the input signal corresponding to each target load X(g). At this time, the control unit 161 receives the secondary pressure, which is the measured value of the secondary pressure gauge 159 for each load.

[0129] Step S3 The control unit 161 stores the correspondence between the measured loads. Based on the measurement in step S2, the control unit 161 obtains the relationship between the opening degree (input signal) of the electro-pneumatic regulator 157 and the load of the electronic balance (target load X(g)) as shown in Figure 10(a), and the relationship between the secondary pressure of the electro-pneumatic regulator 157 and the opening degree as shown in Figure 10(b). Along with the above relationships, the control unit 161 stores in memory the relationship between the load of the pressing actuator 89 and the secondary pressure of the electro-pneumatic regulator 157 as shown in Figure 10(c).

[0130] Step S4 The operator of the substrate processing apparatus 1 operates the instruction unit 163 to signal the completion of pre-treatment for one back surface cleaning unit SSR. The operator of the substrate processing apparatus 1 removes the electronic balance from the rotating holding unit 37. If necessary, the same pre-treatment is performed on the other back surface cleaning units SSR.

[0131] <6. Cleaning process in the processing unit>

[0132] Next, the cleaning process will be explained with reference to Figure 11. Figure 11 is a flowchart of the cleaning process.

[0133] Step S11 The operator gives the command to start processing. Specifically, they also give the command, which includes the target load X(g). Then the substrate W is transported from the indexer block 5 to the transfer unit 15, and its orientation is changed in the first inversion unit 23 so that the back side faces upwards.

[0134] Step S12 The substrate W, with its reverse side facing upwards, is transported by the central robot CR to a single reverse side cleaning unit SSR. The reverse side cleaning unit SSR then begins the cleaning process.

[0135] Step S13 The control unit 161 moves the brush 99. Specifically, the control unit 161 first moves the cleaning arm 45 above the rotation center P1 of the substrate W. The control unit 161 applies pressure to the brush 99. Specifically, the control unit 161 refers to the relationship obtained in advance (Figure 10(c)) and adjusts the input signal to the electro-pneumatic regulator 157 so that the secondary pressure of the secondary pressure gauge 159 becomes the secondary pressure Z (Pa) corresponding to the target load X (g). As a result, air is supplied from the electro-pneumatic regulator 157 to the pressing actuator 89, and a load of the target load X (g) is applied from the brush 99 to the substrate W. In other words, the control unit 161 moves the brush 99 from the unloaded height H1 to the working height H2.

[0136] Step S14 The reference equal pressure area is determined. Specifically, the control unit 161 calculates the reference equal pressure area based on the signal from the in-plane pressure distribution detection unit SPD as described above.

[0137] Step S15 The control unit 161 determines whether the reference pressure area is smaller than a predetermined value. Specifically, it compares the reference pressure area obtained in step S14 with the predetermined value. The process branches according to the result. If the reference pressure area is greater than or equal to the predetermined value, the process branches to step S16. If the reference pressure area is smaller than the predetermined value, the process branches to step S21.

[0138] Here, we will first assume that the standard pressure area is equal to or greater than a predetermined value, and then explain further.

[0139] Step S16 The control unit 161 operates the rotary lifting mechanism 71 to move the cleaning arm 45. Specifically, the control unit 161 operates the rotary drive mechanism 71 to move the cleaning arm 45 of the substrate W so that the brush 99 reverses direction between the rotation center P1 and the end face of the substrate W. At this time, the first processing liquid arm 41 is moved and pure water is supplied to the entire surface of the substrate W at a position where it does not interfere with the cleaning arm 45. As a result, the brush 99 acts on the back surface of the substrate W and the cleaning process is performed.

[0140] Step S17 The control unit 161 determines the pressure-equalized area. Specifically, the control unit 161 determines the pressure-equalized area of ​​the brush 99 based on the signal from the in-plane pressure distribution detection unit SPD, as described above. This pressure-equalized area is calculated each time the cleaning arm 45 moves by a predetermined angle. In other words, this pressure-equalized area is calculated each time the brush 99 moves a predetermined distance in the radial direction of the substrate W. This pressure-equalized area is calculated at predetermined intervals while the brush 99 is at the working height H2 and the cleaning arm 45 is moving.

[0141] Step S18 The control unit 161 adjusts the pressing pressure. Specifically, the control unit 161 adjusts the pressing pressure according to the ratio of the reference pressure area to the pressure area. More specifically, it adjusts the pressing pressure so that it decreases in proportion to the decrease in the pressure area. As a result, the load per unit area acting on the substrate W becomes the same in the radial direction of the substrate W.

[0142] Step S19 The process branches depending on whether the number of scans by the cleaning arm 45 has reached a predetermined number. If the number of scans has reached the predetermined number, the control unit 161 branches the process to step S20. On the other hand, if the number of scans has not reached the predetermined number, the process branches to step S16. In other words, the cleaning arm 45 continues scanning.

[0143] Step S20 The process moves on to the next substrate W. The control unit 161 performs a cleaning process on the next substrate W that has been brought in by the center robot CR. In other words, the process returns to step S12.

[0144] Here, we will explain the case in step S15 described above where the reference pressure area is smaller than a predetermined value. In this case, the process branches to step S21.

[0145] Step S21 The control unit 161 issues an alarm. If the reference pressure area is smaller than a predetermined value, there is a risk that the brush 99 is not properly attached to the brush holder 101. Therefore, the control unit 161 operates the notification unit 165 to issue an alarm. The operator of the substrate processing apparatus 1 can determine from the alarm that there is a problem with the attachment of the brush 99. The operator can, for example, temporarily stop the apparatus and check the attachment status of the brush 99. This prevents continuous processing of the substrate W with an improperly attached brush 99.

[0146] Step S14 described above corresponds to the "pressure distribution detection process" in the present invention. Step S18 described above corresponds to the "pressure adjustment process" in the present invention.

[0147] According to this embodiment, the control unit 161 controls the pressing force of the pressing mechanism 81 to adjust the pressing force according to the position of the brush 99 in the radial direction of the substrate W, based on the pressure distribution detected by the in-plane pressure distribution detection unit SPD. As a result, even if the brush 99 acts unevenly depending on its position in the radial direction of the substrate W, the force acting on the brush 99 as seen from the top surface of the substrate W can be made almost uniform, regardless of the position of the brush 99. Therefore, the uniformity of cleanliness within the plane of the substrate W can be improved.

[0148] The present invention is not limited to the embodiments described above, and can be modified and implemented as follows.

[0149] (1) In the embodiments described above, a back surface cleaning unit SSR was used as an example of a substrate processing apparatus. However, the present invention is not limited to a back surface cleaning unit SSR. For example, a surface cleaning unit that cleans the surface of a substrate with a brush 99 can also be applied.

[0150] (2) In the above-described embodiment, the substrate processing apparatus was described using as an example a configuration in which the back surface cleaning unit SSR (processing unit 31) as a substrate processing apparatus is provided in a substrate processing apparatus 1 equipped with an input / output block 3, an indexer block 5, and the like. However, the present invention is not limited to such a configuration. For example, it may consist only of the back surface cleaning unit SSR (processing unit 31).

[0151] (3) In the embodiments described above, the cleaning arm 45 does not have a mechanism for detecting the load applied to the brush 99. However, the present invention is not limited to such a configuration. For example, the force applied to the carriage 113b may be detected by a load cell, and the degree of agreement with the target load may be detected.

[0152] (4) In the embodiments described above, the configuration shown in Figure 6 was used as an example for the in-plane pressure distribution detection unit SPD. However, the present invention is not limited to such a configuration for the in-plane pressure distribution detection unit SPD. In other words, any configuration is acceptable as long as it can detect the pressure distribution in the plane of the brush 99 used on the substrate W.

[0153] For example, a film that changes color or develops a pattern depending on the pressure is interposed between the brush 99 and the brush holder 101, and the brush holder 101 is constructed from a transparent material. The degree of discoloration may be photographed from the underside of the cleaning arm 45 above the brush holder 101 using a camera, and the pressure distribution may be detected according to this degree.

[0154] (5) In the above-described embodiment, the brush 99 was described as having a downwardly convex shape with a tip portion 99a that is thinner than the diameter of the brush 99. However, the present invention is not limited to such a shape. For example, the brush 99 may have a shape that protrudes downward with the same diameter.

[0155] (6) In the embodiments described above, the area of ​​equal pressure is determined based on the output of the in-plane pressure detection unit SPD. The pressing pressure is then adjusted according to the ratio of the area of ​​equal pressure. However, in the present invention, the pressing pressure may be adjusted without determining the area of ​​equal pressure. For example, the pressing pressure may be adjusted by the ratio of the number of intersections where the in-plane pressure detector SPD has the same pressure.

[0156] (7) In the above-described embodiment, the pressure applied to the brush 99 is reduced according to the degree of decrease in the pressure area, based on a reference pressure area when the brush 99 is located in the center of the substrate W. However, the present invention is not limited to this method. For example, a preset reference pressure area may be used as a reference. This eliminates the need to calculate the reference pressure area and reduces the load on the control unit 161.

[0157] (8) In the above-described embodiment, if the reference pressure area falls below a predetermined value, the process is included in which it is determined that the brush 99 is not properly attached to the brush holder 101. However, this process is not essential in the present invention. By omitting this process, the load on the control unit 161 can be reduced.

[0158] (9) In the above-described embodiment, a slip ring 309 is used to extract a signal from the in-plane pressure distribution detection unit SPD via the signal line 307. However, the present invention does not require such a configuration.

[0159] (10) In the above-described embodiment, only the pressing pressure is adjusted according to the proportion of the same-pressure area, but the present invention is not limited to such adjustments. For example, one of the following may be further adjusted: the electric motor 49 that controls the rotation speed of the substrate W, the electric motor 119 that controls the rotation speed of the brush 99, and the rotating lifting mechanism 71 that controls the movement speed of the cleaning arm 45. This is expected to further suppress the unevenness of cleanliness that cannot be adjusted by adjusting the pressing pressure alone.

[0160] For example, with respect to the substrate W, the rotation speed of the brush 99 is adjusted as it moves from the center to the periphery. For example, with respect to the cleaning arm 45, the movement speed is made different for the center and periphery of the substrate W. For example, with respect to the brush 99, the rotation speed is made different for the center and periphery.

[0161] (11) In the embodiments described above, a substrate W in which the peripheral portion is curved downward relative to the central portion was used as an example. However, the present invention is not limited to such a substrate W. In other words, it can also be applied to a substrate W in which the peripheral portion is curved upward relative to the central portion.

[0162] (12) In the above-described embodiment, the brush 99 was moved by swinging the cleaning arm using a rotary lifting mechanism 71 mounted on the cleaning arm 45. However, the configuration is not limited to this, and the cleaning arm 45 may be linearly driven by a linear motion mechanism using a ball screw and a linear guide, and the brush 99 held by the cleaning arm 45 may be moved linearly. [Explanation of Symbols]

[0163] 1 ... Substrate processing equipment 3… Loading / unloading block 5… Indexerblock 7 ... Processing block W… Circuit board C... Career IR… Indexer Robot 15 … Delivery department 23 … 1st Reversal Unit 25, 27 ... Pass section 29 … Second Reversal Unit 31… Processing Unit SSR… Backside cleaning unit CR... Center Robot 37 ... Rotation holding part 39… Guard 41 ... First processing fluid arm 42… Electric motor 43... Second processing fluid arm 45... Washing arm 47... Standby Pod 53… Spin Chuck 71… Rotary lifting mechanism 75… Cabinet 77 ... Cleaning Department 81... Pressing mechanism 83… Rotation mechanism 85 ... Pivot member 87... Seesaw component 87c … central part 87l ... one side 87r ... Other side 89… Actuator for pressing 91…Support mechanism 93 ... Retaining member 95 ... biasing section 97… Guide Section 99… Brush 99a … Tip 101… Brush holder 103 ... Rotation axis 111... Coil spring 113… Linear guide H1 ... Unloaded height H2 ... Actual height H3… Maximum indentation height 149 ... Air supply pipe 151 ... Air supply source 155… Primary pressure gauge 157... Electro-pneumatic regulator 159… Secondary pressure gauge 161 ... Control Unit 163 … Instruction section 165... Hochi Department SPD… In-plane pressure distribution detection unit 301 ... Detection unit 303 ... Readout section 305 … A / D converter 307 ... Signal line CP…Central part PP… Peripheral area CA, CA1, CA2… Area of ​​the same pressure

Claims

1. In a brush used for cleaning a substrate, The brush body that acts on the circuit board, A brush holder to which the brush body can be attached, Displaced between the brush body and the brush holder, and detecting the pressure on the brush body, the in-plane pressure distribution detection unit detects the pressure distribution of the brush body acting on the substrate within the plane, A brush characterized by having the following features.

2. In a substrate processing apparatus that performs cleaning on a substrate by applying a brush, A rotating holding unit that holds the substrate in a horizontal position and rotates the substrate, A brush that acts on the upper surface of a substrate held by the rotating holding part, comprising a brush body that acts on the substrate and a brush holder to which the brush body is attached, A cleaning arm is provided with the brush at its tip and moves the brush radially in the direction of the substrate between the rotation center and the periphery of the substrate held by the rotating holding part, A pressing mechanism that biases the brush toward the substrate with pressing force, Displaced between the brush body and the brush holder, and detecting the pressure on the brush body, the in-plane pressure distribution detection unit detects the pressure distribution of the brush body acting on the substrate within the plane, A control unit controls the pressing mechanism to adjust the pressing pressure according to the position of the brush in the radial direction of the substrate based on the pressure distribution, A substrate processing apparatus characterized by comprising the following features.

3. In the substrate processing apparatus according to claim 2, The substrate processing apparatus is characterized in that the control unit adjusts the pressing pressure so that the load per unit area applied to the substrate by the brush is constant in the radial direction of the substrate.

4. In the substrate processing apparatus according to claim 2, The control unit is characterized in that it defines the area of ​​the pressure distribution where the pressure is approximately the same as the equal pressure area, defines the equal pressure area when the brush is located in the center of the substrate as the reference equal pressure area, and when the equal pressure area is less than the reference equal pressure area, it operates the pressing mechanism to reduce the pressing pressure on the brush according to the degree of decrease in the equal pressure area.

5. In the substrate processing apparatus according to claim 4, The substrate processing apparatus is characterized in that the control unit determines that the brush body is not properly attached to the brush holder when the reference pressure area falls below a predetermined value.

6. In the substrate processing apparatus according to any one of claims 2 to 5, The substrate processing apparatus is characterized in that the control unit further adjusts at least one of the following: the rotational speed of the substrate by the rotating holding unit, the rotational speed of the brush, and the moving speed of the cleaning arm.

7. A method for controlling the pressure applied to a brush when cleaning a substrate by applying pressure to the brush and moving it between the center and the periphery of the substrate, comprising a brush body that acts on the substrate, a brush holder to which the brush body is attached, and a cleaning arm having the brush at its tip and movable at its base, A pressure distribution detection process for detecting the pressure distribution within the plane of the brush body acting on the substrate, A pressure adjustment process is performed to adjust the pressing pressure according to the position of the brush in the radial direction of the substrate based on the pressure distribution, A method for controlling the pressure of a brush, characterized by performing the following:

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