Brush and substrate processing apparatus equipped therewith
The brush configuration with a central and outer peripheral brushes, biased to maintain equal height or perpendicular movement, addresses the issue of substrate inclination and warping, preventing damage and ensuring effective cleaning.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- SCREEN HOLDINGS CO LTD
- Filing Date
- 2022-10-27
- Publication Date
- 2026-06-24
AI Technical Summary
Conventional substrate cleaning brushes fail to instantaneously conform to the substrate's inclination, leading to irregular brush deformation and potential damage to the cleaning surface, and do not adapt to substrate warping during cleaning.
A brush configuration with a central brush and slidably mounted outer peripheral brushes, biased by a mechanism to maintain equal height or perpendicular movement relative to the central brush, ensuring uniform contact with the substrate surface regardless of warping or inclination.
The solution prevents irregular deformation of the outer peripheral brush, allowing the central brush to primarily engage the substrate, thus avoiding damage to the cleaning surface and ensuring effective cleaning without substrate damage.
Smart Images
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Abstract
Description
Technical Field
[0001] The present invention relates to a brush that acts on a substrate when cleaning substrates such as semiconductor substrates, substrates for flat panel displays (FPD) such as liquid crystal display and organic EL (Electroluminescence) display devices, glass substrates for photomasks, and substrates for optical discs, and a substrate processing apparatus provided with the same.
Background Art
[0002] Conventionally, as a first type of this apparatus, there is a brush that rotates while moving in the radial direction of the substrate and acts on the upper surface of the substrate to perform a cleaning process (see, for example, Patent Document 1). This brush includes members having different hardnesses at the central portion and the outer peripheral portion. Specifically, the outer peripheral portion includes a member having a lower hardness than the central portion. Thereby, even when the surface of the substrate is warped and has an inclination in the radial direction of the substrate, the cleaning surface of the brush is deformed to the shape. Therefore, even for a substrate having an inclination in the radial direction from the central portion toward the peripheral portion, an uncleaned portion can be eliminated and cleaning can be performed with high cleanliness.
[0003] Further, as a second type of this apparatus, there is a brush having an inner cylinder and an outer cylinder (see, for example, Patent Document 2). The inner cylinder and the outer cylinder each have a cleaning brush on the lower surface. After cleaning while moving in the radial direction using one of the cleaning brushes, cleaning is performed using the other when moving in the next radial direction. That is, by properly using the brushes of the inner cylinder and the outer cylinder, it is possible to prevent the substrate from being damaged by the brush to which foreign matter has adhered, and to save the time and labor for brush replacement. However, this second apparatus does not describe any configuration for switching the inner cylinder and the outer cylinder according to the warp of the substrate.
Prior Art Documents
Patent Documents
[0004]
Patent Document 1
Patent Document 2
[0005] However, conventional examples with such a configuration have the following problems. In other words, the conventional first device conforms to the slope of the substrate due to the difference in hardness of the components that make up the brush, so it is not possible to instantaneously conform the brush to the slope of the substrate. As a result, the outer edge of the brush acts on the substrate in an irregular shape. Specifically, let's explain the case where the surface of the substrate is linearly sloped to one side on the surface on which the brush acts, for example, when it slopes downward to the right. In this case, the outer edge of the brush is weakly compressed on the peripheral side of the substrate (left side), and the central side of the substrate (right side) is strongly compressed. As a result, the outer edge of the brush rotates in an irregular shape. This may damage the cleaning surface of the substrate.
[0006] Furthermore, the second device does not switch between the inner and outer cylinders in response to the warping of the substrate. Therefore, even when used with a warped substrate, it is not possible to switch between the central and peripheral parts of the substrate at a suitable timing.
[0007] The present invention has been made in view of these circumstances, and aims to provide a brush that can clean a substrate without damaging the cleaning surface by instantaneously aligning the surface of the brush that acts on the substrate with the inclination of the substrate, and a substrate processing apparatus equipped with the same. [Means for solving the problem]
[0008] To achieve this objective, the present invention has the following configuration. In other words, the invention described in claim 1 is a brush that acts on a substrate to perform a cleaning process, comprising a brush body that acts on the substrate and a brush holder to which the brush body is attached, wherein the brush body is The brush holder is directly fixed to the brush holder,The central brush constitutes the central part in a plan view, and the other components are positioned on the outer circumference of the central brush and are slidably mounted perpendicular to the central brush. Insert the aforementioned central brush at least one cylindrical When the outer periphery brush and the brush body are located in the center of the substrate, the lower surface of the central brush and the lower surface of the outer periphery brush are at approximately the same height, and when the brush body is located at the periphery of the substrate, the outer periphery brush moves perpendicular to the central brush in accordance with the inclination of the periphery. as one The device is characterized by comprising a biasing means that biases the outer peripheral brush toward the substrate side relative to the central brush so as to allow movement.
[0009] [Operation and Effects] According to the invention described in claim 1, when the brush body is located in the center of the substrate, the biasing means biases the brush so that the lower surface of the central brush and the lower surface of the outer periphery brush are at approximately the same height. When the brush body is located at the periphery of the substrate, the biasing means biases the brush so that the outer periphery brush moves perpendicular to the central brush in accordance with the inclination of the periphery. Therefore, in the center of the substrate, the entire lower surface of the brush body acts on the substrate. At the periphery of the substrate, the outer periphery brush instantaneously moves perpendicular to the central brush to conform to the inclination of the substrate. As a result, the outer periphery brush does not undergo irregular deformation, and almost only the central brush acts on the substrate, so that the cleaning surface of the substrate is not damaged.
[0010] Furthermore, in the present invention, it is preferable that the central brush comprises an upper flange and a columnar member protruding vertically from the central part of the upper flange, and the outer periphery brush comprises a lower flange facing the lower surface of the upper flange and a hollow member covering the outer periphery of the columnar member and protruding vertically from the lower flange (Claim 2).
[0011] The hollow member of the outer brush moves along the columnar member of the central brush. Therefore, the vertical movement of the outer brush can be made smooth.
[0012] Furthermore, in the present invention, it is preferable that the biasing means is arranged between the lower surface of the upper flange and the upper surface of the lower flange (Claim 3).
[0013] The biasing force of the biasing means can be efficiently transmitted from the upper flange to the lower flange.
[0014] Furthermore, in the present invention, it is preferable that the biasing means is a compression coil spring with an upper end and a lower end positioned between the upper flange and the lower flange (Claim 4).
[0015] The biasing mechanism can be constructed simply by placing a compression coil spring between the upper and lower flanges. Therefore, the outer circumferential brush can be moved with a simple configuration.
[0016] Furthermore, in the present invention, it is preferable that the biasing force of the biasing means is smaller than the pressing force that biases the brush toward the substrate (Claim 5).
[0017] The outer periphery brush, receiving a reaction force from the pressure applied by the brush, can move vertically against the biasing force of the biasing means. Therefore, the outer periphery brush can be appropriately moved along the edge of the substrate in accordance with the inclination of the substrate.
[0018] Furthermore, in the present invention, it is preferable that the brush holder comprises a mounting portion, an outer peripheral portion extending from the outer peripheral surface of the mounting portion along the outer peripheral surface of the lower flange, and a restricting portion extending from the lower surface of the outer peripheral portion along the lower surface of the lower flange (Claim 6).
[0019] The outer periphery extending from the mounting portion restricts the outer brush from moving in the planar direction of the substrate. The restricting portion also restricts the outer brush from protruding downward from the brush holder. Therefore, the outer brush, which moves relative to the central brush, can be held in a stable position.
[0020] Furthermore, the invention described in claim 7 is a substrate processing apparatus that performs cleaning processing by applying a brush to a substrate, comprising: a rotating holding unit that holds the substrate in a horizontal position and rotates the substrate; a brush that acts on the upper surface of the substrate held by the rotating holding unit and comprises a brush body that acts on the substrate and a brush holder to which the brush body is attached; a cleaning arm with the brush at its tip; and an arm driving unit that drives the cleaning arm so that the brush moves radially across the substrate between the rotation center and the periphery of the substrate held by the rotating holding unit, wherein the brush body is in plan view The device is characterized by comprising: a central brush constituting the central part; at least one outer brush positioned on the outer circumference of the central brush and slidably mounted perpendicular to the central brush; and a biasing means that biases the outer brush toward the substrate relative to the central brush, such that when the brush body is located in the central part of the substrate, the lower surface of the central brush and the lower surface of the outer brush are at approximately the same height, and when the brush body is located at the periphery of the substrate, the outer brush moves perpendicular to the central brush in accordance with the inclination of the periphery.
[0021] [Operation and Effects] According to the invention described in claim 7, the brush is moved between the central and peripheral parts by the cleaning arm while the brush acts on the substrate, which is being rotated by the rotating holding part. When the brush body is located in the central part of the substrate, the biasing means biases the brush so that the lower surface of the central brush and the lower surface of the outer peripheral brush are at approximately the same height. When the brush body is located at the peripheral part of the substrate, the biasing means biases the outer peripheral brush so that it is possible for the outer peripheral brush to move perpendicular to the central brush in accordance with the inclination of the peripheral part. Therefore, in the central part of the substrate, the entire lower surface of the brush body acts on the substrate. At the peripheral part of the substrate, the outer peripheral brush instantaneously moves perpendicular to the central brush to conform to the inclination of the substrate. As a result, the outer peripheral brush does not undergo irregular deformation, and almost only the central brush acts on the substrate, so that the cleaning surface of the substrate is not damaged. [Effects of the Invention]
[0022] According to the brush of the present invention, when the brush body is located at the central portion of the substrate, the biasing means biases so that the lower surface of the central brush and the lower surface of the outer peripheral brush are substantially flush. When the brush body is located at the peripheral edge of the substrate, the biasing means biases so as to allow the outer peripheral brush to move in the vertical direction with respect to the central brush according to the inclination of the peripheral edge. Therefore, at the central portion of the substrate, the entire lower surface of the brush body acts on the substrate. At the peripheral edge of the substrate, the outer peripheral brush instantaneously moves in the vertical direction with respect to the central brush by the biasing means along the inclination of the substrate. As a result, the outer peripheral brush does not undergo a distorted deformation, and substantially only the central brush acts on the substrate, so that the cleaning surface of the substrate is not damaged.
Brief Description of the Drawings
[0023] [Figure 1] It is a plan view showing the overall configuration of a substrate processing apparatus according to an embodiment. [Figure 2] It is a view of the substrate processing apparatus of FIG. 1 as seen from the rear X. [Figure 3] It is a plan view showing the schematic configuration of a back surface cleaning unit according to an embodiment. [Figure 4] It is a side view showing the schematic configuration of the back surface cleaning unit. [Figure 5] It is a longitudinal sectional view of the cleaning arm. [Figure 6] It is a longitudinal sectional view showing details of the cleaning section. [Figure 7] It is a view for explaining the state of the brush at the central portion and the peripheral edge portion. [Figure 8] It is a longitudinal sectional view showing details of the cleaning section according to Modification 1. [Figure 9] It is a longitudinal sectional view showing details of the cleaning section according to Modification 2. [Figure 10] It is a longitudinal sectional view showing details of the cleaning section according to Modification 3. [Figure 11] It is a longitudinal sectional view showing details of the cleaning section according to Modification 4.
Modes for Carrying Out the Invention
[0024] Hereinafter, embodiments of the present invention will be described with reference to the drawings. Figure 1 is a plan view showing the overall configuration of the substrate processing apparatus according to the embodiment. Figure 2 is a view of the substrate processing apparatus of Figure 1 from the rear X.
[0025] <1. Overall Structure>
[0026] The substrate processing apparatus 1 comprises an input / output block 3, an indexer block 5, and a processing block 7.
[0027] The substrate processing apparatus 1 processes the substrate W. The substrate processing apparatus 1 performs a cleaning process on the substrate W, for example. The substrate processing apparatus 1 processes the substrate W in a single-wafer manner in the processing block 7. In the single-wafer manner, one substrate W at a time is processed in a horizontal position.
[0028] In this specification, for convenience, the direction in which the loading / unloading block 3, indexer block 5, and processing block 7 are aligned is called the "front-to-back direction X". The front-to-back direction X is horizontal. Of the front-to-back direction X, the direction from the processing block 7 toward the loading / unloading block 3 is called the "front". The direction opposite to the front is called the "rear". The horizontal direction perpendicular to the front-to-back direction X is called the "width direction Y". One direction of the "width direction Y" is appropriately called the "right". The direction opposite to the right is called the "left". The direction perpendicular to the horizontal is called the "vertical direction Z". In each figure, front, rear, right, left, up, and down are shown as appropriate for reference.
[0029] <2. Loading / Unloading Block>
[0030] The loading / unloading block 3 includes an input section 9 and an output section 11. The input section 9 and the output section 11 are arranged in the width direction Y. Multiple substrates W (for example, 25) are stacked horizontally at regular intervals within a single carrier C. The carrier C containing the unprocessed substrates W is placed on the input section 9. The input section 9 includes, for example, two mounting tables 13 on which the carrier C is placed. The carrier C has multiple grooves (not shown) formed therein, which accommodate each substrate W with the surfaces of the substrates W spaced apart. The carrier C accommodates the substrates W in a orientation with the surface facing upwards. An example of a carrier C is a FOUP (Front Opening Unify Pod). A FOUP is a sealed container. The carrier C may be an open container, and is of any type.
[0031] The dispensing unit 11 is located on the opposite side of the input unit 9, across the center of the width Y in the substrate processing apparatus 1. The dispensing unit 11 is positioned to the left Y of the input unit 9. The dispensing unit 11 stores the processed substrates W in a carrier C and dispenses the carrier C together. The dispensing unit 11, which functions in this way, is equipped with, for example, two mounting tables 13 for placing the carrier C, similar to the input unit 9. The input unit 9 and the dispensing unit 11 are also called load ports.
[0032] <3. Indexer Block>
[0033] The indexer block 5 is located adjacent to the rear X of the loading / unloading block 3 in the substrate processing apparatus 1. The indexer block 5 includes an indexer robot IR and a transfer unit 15.
[0034] The indexer robot IR is configured to rotate around the vertical Z direction. The indexer robot IR is configured to move in the width direction Y. The indexer robot IR comprises a first hand 19 and a second hand 21. In Figure 1, only one hand is shown for illustrative purposes. The first hand 19 and the second hand 21 each hold one substrate W. The first hand 19 and the second hand 21 are configured to move independently in the front-rear direction X. The indexer robot IR moves in the width direction Y and rotates around the vertical Z direction, moving the first hand 19 and the second hand 21 forward and backward to transfer the substrate W between each cassette C. Similarly, the indexer robot IR transfers the substrate W between itself and the transfer unit 15.
[0035] The transfer section 15 is located at the boundary between the indexer block 5 and the processing block 7. The transfer section 15 is located, for example, in the center in the width direction Y. As shown in Figure 2, the transfer section 15 is formed to be elongated in the vertical direction Z.
[0036] The transfer section 15 comprises a first reversal unit 23, a pass section 25, a pass section 27, and a second reversal unit 29, extending from below to above in the vertical direction Z.
[0037] The first inversion unit 23 inverts the top and bottom of the substrate W received from the indexer block 5. The first inversion unit 23 also inverts the horizontal orientation of the substrate W. Specifically, the first inversion unit 23 changes the orientation of the substrate W from having the top surface facing upwards to having the top surface facing downwards. In other words, it changes the orientation of the substrate W so that the back surface faces upwards.
[0038] The second inversion unit 29 performs the reverse operation. That is, the second inversion unit 29 inverts the orientation of the substrate W received from the processing block 7. The second inversion unit 29 converts the substrate W, which is facing downwards, to an orientation where the front surface is facing upwards. In other words, it converts the orientation of the substrate W so that the back surface is facing downwards.
[0039] The inversion directions of the first inversion unit 23 and the second inversion unit 29 described above may be opposite to each other. That is, the first inversion unit 23 changes the orientation of the substrate W so that the front surface is facing upwards. The second inversion unit 29 changes the orientation of the substrate W so that the back surface is facing upwards.
[0040] The path sections 25 and 27 are used to transfer the substrate W between the indexer block 5 and the processing block 7. Path section 25 is used, for example, to transport the substrate W from the processing block 7 to the indexer block 5. Path section 27 is used, for example, to transport the substrate W from the indexer block 5 to the processing block 7. Note that the transport directions of the substrate W in path sections 25 and 27 may be opposite to each other.
[0041] <4. Processing Block>
[0042] Processing block 7 performs a cleaning process on the substrate W, for example. The cleaning process is, for example, a process using a brush in addition to a processing liquid. As shown in Figure 1, processing block 7 is divided into, for example, a first column R1, a second column R2, and a third column R3 in the width direction Y. In detail, the first column R1 is located to the left in Y. The second column R2 is located in the center of the width direction Y. In other words, the second column R2 is located to the right of the first column R1 in Y. The third column R3 is located to the right of the second column R2 in Y.
[0043] <4-1. 1st column>
[0044] The first column R1 of the processing block 7 comprises multiple processing units 31. For example, the first column R1 comprises four processing units 31. The first column R1 consists of four processing units 31 stacked in the vertical direction Z. Each processing unit 31 will be described in detail later. Each processing unit 31 is, for example, a cleaning unit. The cleaning unit cleans the substrate W. Cleaning units include a surface cleaning unit that cleans the surface of the substrate W and a back surface cleaning unit that cleans the back surface of the substrate W. In this embodiment, the back surface cleaning unit SSR will be used as an example of a processing unit 31.
[0045] <4-2. 2nd column>
[0046] The second column R2 of the processing block 7 is equipped with a center robot CR. The center robot CR is configured to be rotatable about the vertical direction Z. The center robot CR is configured to be able to move up and down in the vertical direction Z. The center robot CR includes, for example, a first hand 33 and a second hand 35. The first hand 33 and the second hand 35 each hold one substrate W. The first hand 33 and the second hand 35 are configured to move independently in the front-rear direction X and the width direction Y.
[0047] <4-3. 3rd column>
[0048] The third column R3 of processing block 7 has the same configuration as the first column R1. That is, the third column R3 has multiple processing units 31. For example, the third column R3 has four processing units 31. The four processing units 31 in the third column R3 are stacked in the vertical direction Z. Each processing unit 31 in the first column R1 and each processing unit 31 in the third column R3 are positioned opposite each other in the width direction Y. This allows the center robot CR to access each opposing processing unit 31 in the first column R1 and the third column R3 at the same height in the vertical direction Z.
[0049] Processing block 7 is configured as described above. Here, an example of the operation of the center robot CR will be briefly explained. The center robot CR receives the substrate W from the first inversion unit 23, for example. The center robot CR transports the substrate W to either the first row R1 or the third row R3 back surface cleaning unit SSR to perform cleaning on the back surface of the substrate W. The center robot CR receives the substrate W that has been cleaned by either the first row R1 or the third row R3 back surface cleaning unit SSR. The center robot CR transports the substrate W to the second inversion unit 29.
[0050] <4-4. Processing Unit>
[0051] Here, the back surface cleaning unit SSR (processing unit 31) will be described with reference to Figures 3 to 5. Figure 3 is a plan view showing the schematic configuration of the back surface cleaning unit according to the embodiment. Figure 4 is a side view showing the schematic configuration of the back surface cleaning unit. Figure 5 is a longitudinal cross-sectional view of the cleaning arm.
[0052] Here, we will explain using the back surface cleaning unit SSR provided in the first row R1 as an example. The back surface cleaning unit SSR in the third row R3 has a configuration where the arrangement in the width direction Y is reversed.
[0053] The back surface cleaning unit SSR comprises a rotating holding section 37, a guard 39, a first processing liquid arm 41, a second processing liquid arm 43, a cleaning arm 45, and a standby pot 47.
[0054] <4-4-1. Rotation Holding Section>
[0055] The rotating holding unit 37 is positioned approximately in the center of the back surface cleaning unit SSR in a plan view. The rotating holding unit 37 rotates the substrate W in the horizontal plane while holding the substrate W in a horizontal position. The rotating holding unit 37 comprises an electric motor 49, a rotating shaft 51, a spin chuck 53, and a support pin 55.
[0056] The electric motor 49 is positioned with its rotating shaft 51 oriented in the vertical direction Z. A spin chuck 53 is attached to the upper end of the rotating shaft 51. The spin chuck 53 has a diameter slightly larger than the diameter of the substrate W. The spin chuck 53 is a circular plate-like member. The spin chuck 53 is equipped with a plurality of support pins 55. In this embodiment, for example, there are six support pins 55. The six support pins 55 contact the outer edge of the substrate W and support the substrate W in a horizontal position. The number of support pins 55 is not limited to six, as long as the substrate W can be stably supported in a horizontal position. The six support pins 55 are erected near the outer edge of the substrate W in the spin chuck 53. The six support pins 55 release the holding of the periphery of the substrate W when the substrate W is loaded into the spin chuck 53 and when the substrate W is unloaded from the spin chuck 53. Therefore, each support pin 55 is configured to be rotatable about the vertical direction Z. A detailed explanation of the specific configuration for performing this operation will be omitted. When the electric motor 49 rotates, the rotation holding unit 37 rotates the spin chuck 53 about the rotation center P1. The rotation center P1 is in the vertical direction Z.
[0057] <4-4-2. Guard>
[0058] The guard 39 is positioned to surround the rotating holding part 37 in a plan view. More specifically, the guard 39 comprises a cylindrical body 57 and an inclined part 59. The guard 39 is configured to be able to move up and down in the vertical direction Z. The guard 39 can move between a lowered standby position and a processing position above the standby position. A detailed explanation of the specific configuration for moving the guard 39 up and down is omitted.
[0059] The body 57 of the guard 39 is cylindrical. The inner circumferential surface of the body 57 is positioned outward from the outer circumferential side of the rotating holding part 37. The inclined part 59 is narrowed from the top of the body 57 toward the rotating shaft 51 side. The inclined part 59 has an opening 61 at its top. The opening 61 is formed in the center of the inclined part 59. The opening 61 is larger than the diameter of the substrate W. The opening 61 is larger than the diameter of the spin chuck 53. When loading or unloading the substrate W, the guard 39 is lowered in the vertical direction Z to a position where the spin chuck 53 protrudes upward from the opening 61. When cleaning the substrate W, the inclined part 59 of the guard 39 is positioned at approximately the height of the substrate W held by the spin chuck 53. The inclined part 59 guides the processing liquid and other substances scattered from the substrate W to the lower part of the guard 39 with its inclined inner circumferential surface.
[0060] <4-4-3. First Processing Liquid Arm>
[0061] The first processing liquid arm 41 is positioned rear X of the rotation holding unit 37 in a plan view. The first processing liquid arm 41 is equipped with an electric motor 42 at its base end. The first processing liquid arm 41 is oscillated around a rotation center P2 at its base end by the electric motor 42. The rotation center P2 is in the vertical direction Z. The first processing liquid arm 41 is equipped with one nozzle 63. The nozzle 63 has a discharge port at its bottom. The nozzle 63 discharges processing liquid. The tip of the nozzle 63 of the first processing liquid arm 41 is configured to swing between a standby position shown in Figure 3 and a supply position near the rotation center P1. When the first processing liquid arm 41 supplies processing liquid to the substrate W, the tip of the nozzle 63 is moved to the supply position. When the first processing liquid arm 41 does not supply processing liquid to the substrate W, the tip of the nozzle 63 is moved to the standby position. The first processing liquid arm 41 may be configured to swing its nozzle 63 above the substrate W so as not to interfere with the cleaning arm 45 when supplying the processing liquid to the substrate W.
[0062] Examples of the processing liquid discharged from the nozzle 63 include a rinsing solution. Examples of rinsing solutions include pure water, carbonated water, electrolyzed ionized water, hydrogen water, and ozonated water.
[0063] <4-4-4. Second processing fluid arm>
[0064] The second processing liquid arm 41 is positioned to the left Y of the rotation holding unit 37 in a plan view. The second processing liquid arm 41 is equipped with an electric motor 44 at its base end. The second processing liquid arm is oscillated by the electric motor 44 around a rotation center P3 at its base end. The rotation center P3 is in the vertical direction Z. The second processing liquid arm 43 is equipped with three nozzles 65, 67, and 69. Each nozzle 65, 67, and 69 has a discharge port at its bottom. The nozzles 65, 67, and 69 discharge processing liquid. The second processing liquid arm 43 is configured so that the tips of the nozzles 65, 67, and 69 can oscillate between a standby position shown in Figure 3 and a supply position near the rotation center P1. When the second processing liquid arm 43 supplies processing liquid to the substrate W, the tips of the nozzles 65, 67, and 69 are moved to the supply position. When the second processing liquid arm 43 is not supplying processing liquid to the substrate W, the tips of the nozzles 65, 67, and 69 are moved to a standby position. When supplying processing liquid to the substrate W, the second processing liquid arm 43 may also be configured to swing the nozzles 65, 67, and 69 above the substrate W to avoid interference with the cleaning arm 45.
[0065] Examples of the processing liquid discharged from nozzles 65, 67, and 69 include chemical solutions. Examples of chemical solutions include those containing at least one of sulfuric acid, nitric acid, acetic acid, hydrochloric acid, hydrofluoric acid, ammonia water, and hydrogen peroxide. More specifically, a mixture of ammonia water and hydrogen peroxide, such as SC-1, can be used.
[0066] <4-4-5. Washing Arm>
[0067] The cleaning arm 45 is configured as follows:
[0068] The cleaning arm 45 comprises a rotating and lifting mechanism 71, a support column 73, a housing 75, and a cleaning section 77.
[0069] The rotary lifting mechanism 71 is configured to allow the support column 73, the housing 75, and the cleaning unit 77 to move up and down in the vertical direction Z. The rotary lifting mechanism 71 is configured to allow the support column 73, the housing 75, and the cleaning unit 77 to swing around the rotation center P4. Specifically, the rotary lifting mechanism 71 is configured, for example, by combining an electric motor and an air cylinder. In the standby position, the rotary lifting mechanism 71 raises the cleaning unit 77 from the standby pot 47 in the vertical direction Z. The rotary lifting mechanism 71 swings (moves) the cleaning unit 77 so that it passes near the rotation center P1.
[0070] The aforementioned rotating lifting mechanism 71 corresponds to the "arm drive unit" in this invention.
[0071] The support column 73 is cylindrical in shape. The lower part of the support column 73 is connected to the rotational lifting mechanism 71. The upper part of the support column 73 is connected to one of the lower parts of the housing 75. The housing 75 has a long axis in the horizontal plane. The housing 75 is equipped with a cleaning unit 77 at the other lower part. The cleaning unit 77 rotates around a rotation center P5. The rotation center P5 is in the vertical direction Z.
[0072] The enclosure 75 comprises a lower enclosure 75a and an upper enclosure 75b. The lower enclosure 75a constitutes the lower part of the enclosure 75. The upper enclosure 75b constitutes the upper part of the enclosure 75. The upper enclosure 75b and the lower enclosure 75a are connected to each other.
[0073] The housing 75 is equipped with a pressing mechanism 81 and a rotating mechanism 83. Specifically, the lower housing 75a is equipped with the pressing mechanism 81 and the rotating mechanism 83.
[0074] The pressing mechanism 81 comprises a pivot member 85, a seesaw member 87, a pressing actuator 89, and a support mechanism 91.
[0075] The pivot member 85 is attached to the upper surface of the lower housing 75a. The pivot member 85 is erected approximately in the center of the lower housing 75a in the front-rear direction X. The pivot member 85 has a pivot shaft 85a at its upper part. The pivot shaft 85a is rotatable about the width direction Y. The seesaw member 87 has its central part 87c pivotably attached to the pivot member 85 via the pivot shaft 85a. The seesaw member 87 has both ends, one side 87l (point of application) and the other side 87r (point of force application), which can alternately move up and down in the vertical direction Z. The pivot shaft 85a is the pivot point of the seesaw member 87.
[0076] The pressing actuator 89 has an operating piece 89a positioned vertically in the Z direction. The pressing actuator 89 raises one side 87l of the seesaw member 87 by extending the operating shaft 89a. The pressing actuator 89 is preferably an air bearing actuator, for example.
[0077] In an air bearing actuator, the operating shaft 89a is supported by air, allowing it to move back and forth with a small gap. Therefore, theoretically, the sliding resistance of the operating shaft 89a is zero, and no friction occurs. As a result, an air bearing actuator can move the operating shaft 89a back and forth even with a small amount of air pressure, compared to a conventional air cylinder. Consequently, it is possible to move it back and forth linearly in response to the air pressure. However, a conventional air cylinder can also be used as the pressing actuator 89.
[0078] In the front-rear direction X, a support mechanism 91 is provided on the opposite side of the pressing actuator 89, which is flanked by the pivot member 85. The support mechanism 91 supports the cleaning unit 77. The support mechanism 91 suspends the cleaning unit 77 below the housing 75.
[0079] The support mechanism 91 includes a holding member 93, a biasing part 95, and a guide part 97.
[0080] The support mechanism 91 suspends and supports the cleaning unit 77. The cleaning unit 77 includes a brush 99 and a brush holder 101. The brush 99 acts on the substrate W to perform cleaning. The brush holder 101 holds the brush 99. The brush holder 101 holds the brush 99 in a detachable manner. A rotating shaft 103 is attached to the center of the brush holder 101 in a plan view. The rotating shaft 103 extends vertically in the Z direction from the brush holder 101. The brush 99 is held by the cleaning arm 45 and moves in the horizontal plane so as to pass near the rotation center P1 of the substrate W.
[0081] The retaining member 93 rotatably holds the rotating shaft 103. The rotating shaft 103 is, for example, a spline shaft. The rotating shaft 103 is attached to the retaining member 93 via a spline nut 103a. The rotating shaft 103 is movable vertically in the Z direction relative to the spline nut 103a. The retaining member 93 holds the spline nut 103a in a state that allows it to rotate around the vertical Z direction. The spline nut 103a is attached to the retaining member 93 via a bearing (not shown). The rotating shaft 103 is rotatable around the rotation center P5. A pulley 105 is attached to the spline nut 103a protruding from the upper part of the retaining member 93. The pulley 105 is fixed to the outer circumferential surface of the spline nut 103a. When the pulley 105 rotates, the spline nut 103a rotates, and the rotating shaft 103 rotates in the same direction along with it.
[0082] A biasing part 95 is positioned on the upper part of the pulley 105. The biasing part 95 comprises an upper holding part 107, a lower holding part 109, and a coil spring 111. The upper holding part 107 is attached to the upper side of the rotating shaft 103 via a bearing (not shown). In other words, the upper holding part 107 remains stationary even when the rotating shaft 103 rotates. The lower holding part 109 is positioned spaced apart from the upper holding part 107. The lower holding part 109 is located below the upper holding part 107 and on the upper part of the pulley 105. The inner circumferential surface of the lower holding part 109 is positioned spaced apart from the outer circumferential surface of the rotating shaft 103. Therefore, the lower holding part 109 remains stationary even when the rotating shaft 103 rotates. The lower holding part 109 is also attached to the upper surface of the pulley 105 via a bearing. Therefore, the lower holding portion 109 is not affected by the rotation of the pulley 105.
[0083] The coil spring 111 is attached to the upper holding portion 107 and the lower holding portion 109. The upper end of the coil spring 111 is fixed to the upper holding portion 107. The lower end of the coil spring 111 is fixed to the lower holding portion 109. The coil spring 111 has, for example, a cylindrical shape. The coil spring 111 is a compression coil spring. Therefore, the upper holding portion 107 is biased upward from the upper surface of the pulley 105 and the lower holding portion 109. As a result, the rotating shaft 103 is biased upward in the vertical direction Z. Therefore, in the normal state when the pressing actuator 89 is not operating, the brush 99 is maintained at a constant height from the lower surface of the lower housing 75a. In other words, in the normal state, the load on the brush 99 is zero.
[0084] The support mechanism 91 supports a rotating shaft 103 that moves up and down in the vertical direction Z. The support mechanism 91 comprises a linear guide 113 and a shaft holding part 115. The linear guide 113 is positioned adjacent to the holding member 93. The linear guide 113 is erected in the vertical direction Z. The linear guide 113 comprises a rail 113a and a carriage 113b. The rail 113a has its longitudinal direction oriented in the vertical direction Z. The carriage 113b is attached to the rail 113a so as to be movable in the vertical direction Z. The carriage 113b is positioned below the other side 87r of the seesaw member 87. The carriage 113b is positioned to contact the other side 87r of the seesaw member 87 when it is lowered.
[0085] The shaft holder 115 holds the upper part of the rotating shaft 103. The shaft holder 115 holds the rotating shaft 103 in a state that allows it to rotate. The shaft holder 115 holds the rotating shaft 103 via, for example, a bearing (not shown). The carriage 113b is connected to the shaft holder 115. When the pressing actuator 89 raises the operating shaft 89a with a driving force stronger than the biasing force of the coil spring 111, one side 87l (point of application) rises. When one side 87l rises, the other side 87r (point of force application) descends. At this time, the other side 87r lowers the carriage 113b together with the shaft holder 115. As a result, the rotating shaft 103 descends, and the brush 99 moves downward from its predetermined position. When the pressing actuator 89 is driven in this manner, a pressing force corresponding to the driving force of the pressing actuator 89 is applied to the brush 99.
[0086] A rotating mechanism 83 is positioned adjacent to the support mechanism 91. The rotating mechanism 83 is positioned on the pivot member 85 side. The rotating mechanism 83 comprises a mounting member 117 and an electric motor 119. The mounting member 117 is positioned above the bottom surface of the lower housing 75a, spaced apart from the electric motor 119. The rotating shaft of the electric motor 119 is positioned downward in the vertical direction Z. The electric motor 119 rotates its rotating shaft around a rotation center P6. The rotation center P6 is approximately parallel to the rotation center P5 in the vertical direction Z. A pulley 121 is attached to the rotating shaft of the electric motor 119. A timing belt 123 is stretched between pulley 121 and pulley 105. Therefore, when the electric motor 119 rotates, the rotating shaft 103 rotates around the rotation center P5 via the timing belt 123, pulleys 105 and 121, and spline nut 103a. Even when the rotation axis 103 is rotated in this manner, the rotation axis 103 can still move up and down in the vertical direction Z.
[0087] As described above, the cleaning arm 45 is configured as follows. In other words, the operation of the pressing actuator 89 is applied to the other side 87r (point of application) of the seesaw member 87 via one side 87l (point of force application). Therefore, by providing the seesaw member 87, the degree of freedom in the placement of the pressing actuator 89 is increased. Consequently, the height of the substrate processing apparatus 1 can be suppressed. As a result, a multi-stage stacking arrangement of the substrate processing apparatus 1 can be easily realized.
[0088] The brush 99 described above is raised and lowered as follows. The seesaw member 87 is oscillated by the pressing actuator 89. For example, the pressing actuator 89 is operated according to the target load, as will be described later. This operation moves the brush 99 in the vertical direction Z. Specifically, the brush 99 is raised and lowered to a no-load height, an operating height, and a maximum pressing height. The no-load height is the highest. Under normal circumstances, except during the cleaning process, the brush 99 is located at this no-load height. The operating height is lower than the no-load height. The maximum pressing height is lower than the operating height.
[0089] <4-5. Control System>
[0090] The control unit 161 includes a CPU and memory (not shown). The control unit 161 comprehensively controls each of the above-mentioned parts. Specifically, the control unit 161 controls the transport operations in the input unit 9 and the discharge unit 11, the transport operations of the indexer robot IR, the reversal operations of the first reversal unit 23 and the second reversal unit 29, and the transport operations of the center robot CR. The control unit 161 controls the rotation of the electric motor 49 in the back surface cleaning unit SSR (processing unit 31), the lifting and lowering operation of the guard 39, the opening and closing operation of the support pin 55 in the spin chuck 53, the oscillating operation of the electric motors 42 and 44, and the pressing actuator 89. The control unit 161 operates the pressing actuator 89 according to the target load specified for the cleaning process, controlling the pressing pressure applied from the brush 99 to the substrate W.
[0091] <4-6. Cleaning Section 77>
[0092] Now, with reference to Figure 6, the details of the cleaning unit 77 will be described. Figure 6 is a longitudinal cross-sectional view showing the details of the cleaning unit.
[0093] The cleaning unit 77 corresponds to the "brush" in this invention, and the brush 99 corresponds to the "brush body" in this invention.
[0094] The cleaning unit 77 has a brush 99 attached to a brush holder 101. The brush holder 101 includes a mounting portion 501, an outer circumference portion 503, and a regulating portion 505.
[0095] The mounting portion 501 constitutes the upper part of the brush holder 101. The mounting portion 501 has a circular shape in plan view. A mounting hole 507 is formed on the upper surface of the mounting portion 501. The mounting hole 507 is formed in the center of the mounting portion 501 in plan view. The lower end of the rotating shaft 103 is screwed into the mounting hole 507. The brush holder 101 is connected to the rotating shaft 103 on its upper surface.
[0096] The outer circumferential surface of the mounting portion 501 extends downward in the vertical direction Z. This extended portion constitutes the outer circumferential portion 503. The lower surface of the outer circumferential portion 503 extends toward the center of the mounting portion 501. This portion constitutes the restricting portion 505. The restricting portion 505 has an opening 509 formed in its center in a plan view. The lower surface of the mounting portion 501, the inner circumferential surface of the outer circumferential portion 503, and the upper surface of the restricting portion 505 form a space 511.
[0097] A brush 99 is positioned in space 511. The brush 99 comprises a central brush 513, an outer periphery brush 515, and a plurality of compression coil springs 517. The brush 99 is made of, for example, PVA (polyvinyl alcohol). The material of the brush 99 is not limited.
[0098] The central brush 513 comprises an upper flange 519 and a columnar member 521. The upper flange 519 has a circular shape in plan view. The upper flange 519 has a smaller diameter than the brush holder 101. The central brush 513 is mounted on the ceiling surface of the space 511. The columnar member 521 extends downward in the vertical direction Z from the center of the lower surface of the upper flange 519. The lower surface of the columnar member 521 protrudes downward from the opening 509. The outer diameter of the columnar member 521 is smaller than the inner diameter of the opening 509.
[0099] The outer periphery brush 515 comprises a lower flange 523 and a hollow member 525. The outer periphery brush 515 is positioned such that the upper surface of the lower flange 523 faces the lower surface of the upper flange 519. In other words, the outer periphery brush 515 is positioned spaced apart so that the upper surface of the lower flange 523 faces the lower surface of the upper flange 519. The outer diameter of the lower flange 523 is smaller than the inner diameter of the space 511. The hollow member 525 extends downward in the vertical direction Z from the center of the lower surface of the lower flange 523. The hollow member 525 has a hollow center. The hollow member 525 has a through hole 527 that penetrates from the upper surface of the lower flange 523 to the lower surface of the hollow member 525. The inner diameter of the through hole 527 is slightly larger than the outer diameter of the columnar member 521. The columnar member 521 is inserted through the through hole 527 of the hollow member 525 in the outer periphery brush 515. The outer brush 515 is mounted so as to be able to move up and down vertically in the Z direction relative to the central brush 513.
[0100] Multiple compression coil springs 517 are arranged between the central brush 513 and the outer periphery brush 515. Specifically, multiple compression coil springs 517 are arranged between the upper flange 519 of the central brush 513 and the lower flange 523 of the outer periphery brush 515. Multiple compression coil springs 517 are arranged between the lower surface of the upper flange 519 and the upper surface of the lower flange 523. There are, for example, four multiple compression coil springs 517. Preferably, each of the multiple compression coil springs 517 is arranged at an equal angle from the center in a plan view. Multiple compression coil springs 517 are arranged to surround the columnar member 521 in a plan view. The upper and lower ends of the multiple compression coil springs 517 do not need to be fixed to the upper flange 519 and the lower flange 523. It is sufficient that they are arranged between the upper flange 519 and the lower flange 523.
[0101] The compression coil spring 517 biases the outer periphery brush 515 downward in the vertical direction Z. The biasing force of the compression coil spring 517 is less than the pressing force of the target load. As a result, when the brush 99 is pressed against the substrate W with the target load and receives a reaction force corresponding to the target load due to the inclination of the substrate W, only the outer periphery brush 515 can move upward. The biased outer periphery brush 515 is restricted from moving downward beyond a certain point by the lower surface of the lower flange 523 contacting the upper surface of the restricting portion 505. This restricts the height of the lower surface of the outer periphery brush 515. Furthermore, the compression coil spring 517 biases the outer periphery brush 515 downward in the vertical direction Z. Therefore, when the brush 99 returns from the periphery to the center, the outer periphery brush 515 can return to its original position. Without the compression coil spring 517, the outer periphery brush 515 cannot return to its original position.
[0102] In Figure 6, the height of the lower surface of the outer periphery brush 515, shown by the solid line, indicates the position when the brush 99 is located in the center of the substrate W. The compression coil spring 517 ensures that there is no step between the lower surface of the central brush 513 and the lower surface of the outer periphery brush 515 when the brush 99 is not subjected to any load or reaction force, or when the brush 99 is subjected to a reaction force corresponding to the target load but the substrate W is not inclined. In other words, the lower surface of the central brush 513 and the lower surface of the outer periphery brush 515 coincide in the front-rear direction X and the width direction Y. In Figure 6, the height of the lower surface of the outer periphery brush 515, shown by the dashed line, indicates the position when the brush 99 is located at the periphery of the substrate W. When the brush 99 is subjected to a reaction force corresponding to the target load and the substrate W is inclined, the compression coil spring 517 causes the lower surface of the outer periphery brush 515 to move upward from the lower surface of the central brush 513.
[0103] Next, with reference to Figure 7, the operation of the cleaning unit 77 with the above configuration will be explained. Figure 7 is a diagram illustrating the state of the brush in the central and peripheral areas. Note that during the actual cleaning process, a treatment solution is supplied, but this will be omitted in the following explanation.
[0104] In the SSR back surface cleaning device described above, when cleaning the substrate W, the brush 99 is pressed against the substrate W with a target load by the pressing mechanism 81 while the substrate W is being rotated by the rotating holding unit 37. Furthermore, the brush 99 is moved between the central part CP and the peripheral part PP by the cleaning arm 45. In this example, the central part CP of the substrate W is level and has no incline. In this example, the peripheral part PP of the substrate W has an incline with respect to the central part CP. In this example, the incline is downward sloping to the right.
[0105] When the cleaning unit 77 is located in the central part CP of the substrate W, the lower surfaces of the central brush 513 and the outer brush 515 of the brush 99 coincide and act on the upper surface of the substrate W. Therefore, in the central part CP of the substrate W, the entire lower surface of the brush 99 acts on the substrate W.
[0106] On the other hand, when the cleaning unit 77 is located at the peripheral edge PP of the substrate W, the outer periphery brush 515 moves perpendicular to the central brush 513 in accordance with the inclination of the peripheral edge PP. The outer periphery brush 515 moves instantaneously upward due to the reaction force from the substrate W corresponding to the target load, which is stronger than the biasing force of the compression coil spring 517. Therefore, the brush 99 takes on a shape in which its working surface follows the inclination of the substrate W. As a result, the outer periphery brush 515 does not undergo irregular deformation, and almost only the central brush 513 acts on the substrate W, so no damage is inflicted on the cleaning surface of the substrate W. Furthermore, when the cleaning unit 77 moves to the central part CP, the outer periphery brush 515 is biased downward by the compression coil spring 517, so it reliably and instantaneously moves to a position that coincides with the central brush 513.
[0107] <Example 1>
[0108] Now, with reference to Figure 8, a modified example of the cleaning unit 77 will be described. Figure 8 is a longitudinal cross-sectional view showing details of the cleaning unit according to Modified Example 1.
[0109] The cleaning unit 77A is equipped with a single compression coil spring 517A for the brush 99A. The compression coil spring 517A is positioned with a columnar member 521 inserted through its hollow portion. Even with this configuration, the same effects as in the above-described embodiment are achieved. Furthermore, in Modification 1, since there is only one compression coil spring 517, the configuration can be simplified compared to the embodiment. As a result, the assembly of the cleaning unit 77A can be easily performed.
[0110] <Modification 2>
[0111] Now, with reference to Figure 9, a modified example of the cleaning unit 77 will be described. Figure 9 is a longitudinal cross-sectional view showing details of the cleaning unit according to modified example 2.
[0112] The cleaning unit 77B differs in configuration from the above-described embodiment in that the brush 99B is equipped with a leaf spring 517B instead of a compression coil spring 517. The leaf spring 517B has an L-shaped longitudinal cross-section. The leaf spring 517B has a simpler structure and is lighter than the compression coil spring 517. Therefore, the cleaning unit 77B can be made lighter.
[0113] <Variation 3>
[0114] Now, with reference to Figure 10, a modified example of the cleaning unit 77 will be described. Figure 10 is a longitudinal cross-sectional view showing details of the cleaning unit according to modified example 3.
[0115] The cleaning unit 77C is equipped with a leaf spring 517C to which the brush 99C is integrated with the brush holder 101. The leaf spring 517C is formed on the outer circumference 503 of the brush holder 101. The leaf spring 517C extends from the inner surface of the outer circumference 503 toward the columnar member 521. The leaf spring 517C is curved downward. The leaf spring 517C biases the outer circumferential brush 515 downward with its lower surface. In this modified example 1, the leaf spring 517C is integrally configured with the brush holder 101. Therefore, the number of parts can be reduced and the configuration can be simplified.
[0116] <Modification 4>
[0117] Now, with reference to Figure 11, a modified example of the cleaning unit 77 will be described. Figure 11 is a longitudinal cross-sectional view showing details of the cleaning unit according to modified example 4.
[0118] The cleaning section 77D comprises a brush 99D consisting of a central brush 513 and two outer periphery brushes 515D1 and 515D2. The outer periphery brush 515D1 is positioned on the outer periphery side of the central brush 513. The outer periphery brush 515D2 is positioned on the outer periphery side of the outer periphery brush 515D1. The outer periphery brush 515D1 is cylindrical in shape. The outer periphery brush 515D2 has the same shape as the outer periphery brush 515 in the above-described embodiment.
[0119] The outer periphery brush 515D1 has a locking portion 531 formed on its upper surface. The central brush 513 has a locking portion 533 formed on the lower surface of its upper flange 519. The upper and lower ends of the first compression coil spring 535 are fixed to the locking portions 531 and 533. Thus, the cylindrical outer periphery brush 515D1 is suspended and supported by the first compression coil spring 535. The outer periphery brush 515D2 has a second compression coil spring 537 positioned between it and the central brush 513. The first compression coil spring 535 and the second compression coil spring 537 have a biasing force smaller than the reaction force corresponding to the pressing pressure of the target load, similar to the embodiment described above.
[0120] In this modified example 4, the shape of the brush 99D is deformed in two stages according to the inclination of the substrate W. Therefore, while deforming the shape of the brush 99D according to the inclination of the substrate W, the surface area of the brush 99D acting on the substrate W can be maintained to the maximum extent. As a result, the cleaning process can be performed efficiently.
[0121] The present invention is not limited to the embodiments described above, and can be modified and implemented as follows.
[0122] (1) In the embodiments described above, a back surface cleaning unit SSR was used as an example of a substrate processing apparatus. However, the present invention is not limited to a back surface cleaning unit SSR. For example, a surface cleaning unit that cleans the surface of a substrate with a brush 99 can also be applied.
[0123] (2) In the above-described embodiment, the substrate processing apparatus was described using as an example a configuration in which the back surface cleaning unit SSR (processing unit 31) as a substrate processing apparatus is provided in a substrate processing apparatus 1 equipped with an input / output block 3, an indexer block 5, and the like. However, the present invention is not limited to such a configuration. For example, it may consist only of the back surface cleaning unit SSR (processing unit 31).
[0124] (3) In the embodiments described above, the cleaning arm 45 does not have a mechanism for detecting the load applied to the brush 99. However, the present invention is not limited to such a configuration. For example, the force applied to the carriage 113b may be detected by a load cell, and the degree of agreement with the target load may be detected.
[0125] (4) In the embodiments described above, the central brush 513 is provided with an upper flange 519 and the outer peripheral brush 515 is provided with a lower flange 523. However, the present invention is not limited to such configurations.
[0126] (5) In the embodiments and modifications described above, the biasing means utilizes elastic force, but the present invention is not limited to such configurations. For example, a driving means may be used as the biasing means to actively adjust the height of the outer peripheral brush 515 according to the inclination of the substrate W.
[0127] (6) In the above-described embodiment, the movement of the brush 99 was performed by rotational driving by a rotary lifting mechanism 71 mounted on the cleaning arm 45. However, the configuration is not limited to this, and the cleaning arm 45 may be linearly driven by a linear motion mechanism using a ball screw, a linear guide, and a motor that rotates the ball screw, and the movement of the brush 99 held on the cleaning arm 45 may be linear. [Explanation of Symbols]
[0128] 1 ... Substrate processing equipment 3… Loading / unloading block 5… Indexerblock 7 ... Processing block W… Circuit board C... Career IR… Indexer Robot 15 … Delivery department 23 … 1st Reversal Unit 25, 27 ... Pass section 29 … Second Reversal Unit 31… Processing Unit SSR… Backside cleaning unit CR... Center Robot 37 ... Rotation holding part 39… Guard 41 ... First processing fluid arm 42… Electric motor 43... Second processing fluid arm 45... Washing arm 47... Standby Pod 53… Spin Chuck 71… Rotary lifting mechanism 75… Cabinet 77, 77A~77D ... Cleaning section 81... Pressing mechanism 83… Rotation mechanism 85 ... Pivot member 87... Seesaw component 87c … central part 87l ... one side 87r ... Other side 89… Actuator for pressing 91…Support mechanism 93 ... Retaining member 95 ... biasing section 97… Guide Section 99,99A~99D ... Brush 101… Brush holder 103 ... Rotation axis 111... Coil spring 113… Linear guide 501 ... Mounting part 503 ... Outer perimeter 505 ... Regulatory Department 513… Central brush 515 ... Outer brush 517… Compression coil spring 519 … Upper flange 521 ... Columnar member 523 … Lower flange 525 ... Hollow member CP…Central part PP… Peripheral area
Claims
1. In a brush that acts on a substrate to perform a cleaning process, The brush body that acts on the circuit board, A brush holder to which the brush body can be attached, Equipped with, The brush body is A central brush, which is directly fixed to the brush holder and forms the central part in a plan view, At least one cylindrical outer brush is positioned on the outer circumference of the central brush, is mounted so as to be slidable perpendicular to the central brush, and passes through the central brush; When the brush body is located in the center of the substrate, the lower surface of the central brush and the lower surface of the outer periphery brush are at approximately the same height, and when the brush body is located at the periphery of the substrate, the biasing means biases the outer periphery brush toward the substrate side relative to the central brush so as to allow the outer periphery brush to move together perpendicularly to the central brush in accordance with the inclination of the periphery, A brush characterized by having the following features.
2. A brush that acts on a substrate to perform a cleaning process, The brush body that acts on the circuit board, A brush holder to which the brush body can be attached, Equipped with, The brush body is The central brush that constitutes the central part in a plan view, At least one outer brush is positioned on the outer circumference of the central brush and is mounted so as to be slidable perpendicular to the central brush, and when the brush body is located in the center of the substrate, the lower surface of the central brush and the lower surface of the outer brush are at approximately the same height, and when the brush body is located at the periphery of the substrate, the outer brush is allowed to move perpendicular to the central brush in accordance with the inclination of the periphery. A biasing means for biasing the outer peripheral brush toward the substrate side relative to the central brush, Equipped with, The central brush comprises an upper flange and a columnar member protruding vertically from the central part of the upper flange. The brush is characterized by comprising a lower flange facing the lower surface of the upper flange and a hollow member that covers the outer circumference of the columnar member and protrudes vertically from the lower flange.
3. In the brush according to claim 2, The brush is characterized in that the biasing means is positioned between the lower surface of the upper flange and the upper surface of the lower flange.
4. In the brush according to claim 3, The brush is characterized in that the biasing means is a compression coil spring with its upper and lower ends positioned between the upper flange and the lower flange.
5. In the brush according to any one of claims 1 to 3, A brush characterized in that the biasing force of the biasing means is smaller than the pressing force that biases the brush toward the substrate.
6. In the brush according to claim 2, The brush holder is characterized by comprising a mounting portion, an outer peripheral portion extending from the outer peripheral surface of the mounting portion along the outer peripheral surface of the lower flange, and a restricting portion extending from the lower surface of the outer peripheral portion along the lower surface of the lower flange.
7. In a substrate processing apparatus that performs cleaning on a substrate by applying a brush, A rotating holding unit that holds the substrate in a horizontal position and rotates the substrate, A brush according to any one of claims 1 or 2, A cleaning arm equipped with the aforementioned brush at its tip, A substrate processing apparatus comprising: an arm drive unit that drives the cleaning arm so that the brush moves in the radial direction of the substrate between the rotation center and the peripheral edge of the substrate held by the rotating holding unit.