Component mounting system and component mounting method

Abstract

This component mounting method comprises: on the basis of substrate inspection information including at least position error information of a component mounted on a substrate, calculating a correction value for when a component is mounted on the substrate; mounting the component on the substrate on the basis of the correction value; on the basis of the substrate inspection information, calculating a post-correction evaluation value when the component is mounted on the substrate using the correction value; on the basis of the substrate inspection information and the correction value, calculating a pre-correction evaluation value assuming that the component was mounted on the substrate without using the correction value; and determines whether it is appropriate to use the correction value at the time of mounting, on the basis of the post-correction evaluation value and the pre-correction evaluation value.

Description

Technical Field

[0001] The present disclosure relates to a component mounting system and a component mounting method for mounting components on a substrate.

Background Art

[0002] As a component mounting system for mounting components on a substrate, a component mounting apparatus includes an inspection apparatus that inspects a mounting state such as displacement of a component mounted on the substrate, calculates a correction value when mounting the component on the substrate based on the inspection result of the inspection apparatus, and the component mounting apparatus mounts the component on the substrate based on the correction value is known (for example, Patent Document 1). The system described in Patent Document 1 is disclosed to grasp the correction effect by feedback of the inspection result by displaying so as to be able to compare the evaluation value after correction and the evaluation value assuming that no correction was made based on the inspection result and the correction value.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

[0004] The component mounting system of the present disclosure includes a correction value calculation unit that calculates a correction value when mounting the component on the substrate based on substrate inspection information including at least displacement information of a component mounted on the substrate, a component mounting unit that mounts the component on the substrate based on the correction value, a calculation unit that calculates an evaluation value representing the mounting accuracy at the time of mounting by the component mounting unit based on the substrate inspection information and the correction value, and a determination unit. The calculation unit calculates, as the evaluation value, a post-correction evaluation value when mounting the component on the substrate using the correction value and a pre-correction evaluation value when assuming that the component is mounted on the substrate without using the correction value. The determination unit determines the appropriateness of using the correction value at the time of mounting based on the post-correction evaluation value and the pre-correction evaluation value. [[ID=

[0005] The component mounting method of this disclosure calculates a correction value for mounting a component on a substrate based on substrate inspection information which includes at least positional misalignment information of the component mounted on the substrate, mounts the component on the substrate based on the correction value, calculates a corrected evaluation value based on the substrate inspection information which would be obtained if the component were mounted on the substrate using the correction value, calculates a pre-correction evaluation value based on the substrate inspection information and the correction value which would be obtained if the component were mounted on the substrate without using the correction value, and determines whether or not the use of the correction value during mounting is appropriate based on the corrected evaluation value and the pre-correction evaluation value.

[0006] According to this disclosure, good mounting accuracy can be obtained for various components mounted on a substrate. [Brief explanation of the drawing]

[0007] [Figure 1] Figure 1 is an explanatory diagram illustrating the configuration of a component mounting system according to one embodiment of the present disclosure. [Figure 2] Figure 2 is a plan view showing the configuration of the main parts of a component mounting device included in a component mounting system according to one embodiment of the present disclosure. [Figure 3] Figure 3 is a side view showing the configuration of the main part of a component mounting device according to one embodiment of the present disclosure. [Figure 4] Figure 4 is an explanatory diagram illustrating the configuration of the mounting head and the main parts of the component supply unit of a component mounting apparatus according to one embodiment of the present disclosure. [Figure 5] Figure 5 is a block diagram showing the configuration of the control system of a component mounting system according to one embodiment of the present disclosure. [Figure 6] Figure 6 is an explanatory diagram illustrating the amount of misalignment of a component calculated in an inspection apparatus according to one embodiment of the present disclosure. [Figure 7A] Figure 7A is a plan view showing an example of the shape of a component mounted on a substrate in a component mounting apparatus according to one embodiment of the present disclosure. [Figure 7B] Figure 7B is a side view showing an example of the shape of a component mounted on a substrate in a component mounting apparatus according to one embodiment of the present disclosure. [Figure 8] Figure 8 illustrates the evaluation values ​​calculated in a component mounting system according to one embodiment of the present disclosure. [Figure 9] Figure 9 illustrates the relationship between the corrected evaluation value and the uncorrected evaluation value calculated in a component mounting system according to one embodiment of the present disclosure. [Figure 10] Figure 10 illustrates an example of corrected and uncorrected evaluation values ​​calculated in a component mounting system according to one embodiment of the present disclosure. [Figure 11A] Figure 11A is a plan view showing an example of a component that may experience significant misalignment when using the correction values ​​calculated in a component mounting system according to one embodiment of the present disclosure. [Figure 11B] Figure 11B is a side view showing an example of a component that may experience significant misalignment when using the correction values ​​calculated in a component mounting system according to one embodiment of the present disclosure. [Figure 12] Figure 12 is a flowchart of a component mounting method in a component mounting system according to one embodiment of the present disclosure. [Modes for carrying out the invention]

[0008] Incidentally, it is known that some components, due to variations in their shape and external dimensions, can actually become unstable when correction values ​​are fed back from inspection results during component mounting. Therefore, there was room for further improvement in order to achieve good mounting accuracy for the diverse components mounted on the circuit board.

[0009] Therefore, the purpose of this disclosure is to provide a component mounting system and a component mounting method that can obtain good mounting accuracy for various components mounted on a substrate.

[0010] An embodiment of this disclosure will be described in detail below with reference to the drawings. The configurations, shapes, etc. described below are illustrative examples for illustrative purposes and can be modified as appropriate according to the specifications of the component mounting system, management computer, component mounting device, and inspection device. In the following, all corresponding elements are denoted by the same reference numerals in all drawings, and redundant explanations are omitted. In Figure 2 and some parts described later, the X-axis (left-right direction in Figure 2) in the substrate transport direction and the Y-axis (up-down direction in Figure 2) perpendicular to the substrate transport direction are shown as two mutually orthogonal axes in the horizontal plane. In Figure 3 and some parts described later, the Z-axis (up-down direction in Figure 3) is shown as the height direction perpendicular to the horizontal plane. In Figure 4 and some parts described later, the θ direction, which is the direction of rotation with the Z-axis as the axis of rotation, is shown.

[0011] First, the configuration of the component mounting system 1 will be explained with reference to Figure 1. Figure 1 is an explanatory diagram of the configuration of the component mounting system 1. The component mounting system 1 has the function of mounting components onto a circuit board to produce mounted circuit boards. The component mounting system 1 is equipped with a solder printing machine M1, component mounting machines M2 and M3, and an inspection machine M4. These machines are connected to the management computer 3 via a communication network 2. Note that the component mounting machines M2 and M3 equipped in the component mounting system 1 are not limited to two units, but may be one unit or three or more units.

[0012] The solder printing device M1 screen prints solder paste for component bonding onto the substrate to be mounted. Figure 2 is a plan view showing the configuration of the main parts of the component mounting device (M2 or M3) included in the component mounting system 1. Each of the component mounting devices M2 and M3 performs a component mounting operation in which the component mounting unit 12 retrieves components from the component supply unit 7 and transfers and mounts them onto the substrate 6 on which the solder paste for component bonding has been printed. The inspection device M4 inspects the mounting status of components on the substrate 6 on which components have been mounted by the component mounting devices M2 and M3 using an inspection camera 32 (see Figure 5), detects the positional deviation of components from their normal positions, and determines whether the mounted substrate is good or bad. The management computer 3 has a line management function and a function to determine whether the correction values ​​used in the component mounting devices M2 and M3 are appropriate, based on the positional deviation information of the components acquired by the inspection device M4 and the correction values ​​used in the component mounting devices M2 and M3.

[0013] Next, the configurations of the component mounting devices M2 and M3 will be explained with reference to Figures 2 and 3. Figure 3 is a side view showing the configuration of the main parts of the component mounting device (M2 or M3). Figure 3 schematically shows parts of the component mounting devices M2 and M3 in Figure 2. The component mounting device (M2 or M3) has the function of performing mounting work to mount components supplied from the component supply unit onto the substrate 6. In Figure 2, the substrate transport mechanism 5 is positioned along the X-axis in the center of the base 4. The substrate transport mechanism 5 transports the substrate 6 transported from upstream to the mounting work position, positions it, and holds it. The substrate transport mechanism 5 also transports the substrate 6 downstream after the component mounting work is completed.

[0014] Component supply units 7 are located on both sides (front and rear) of the substrate transport mechanism 5. Each component supply unit 7 has multiple tape feeders 8 arranged along the X-axis. The tape feeders 8 feed carrier tapes, which have pockets for storing components, in a pitch direction from the outside of the component supply unit 7 toward the substrate transport mechanism 5 (tape feeding direction), thereby supplying components to the component suction positions where the mounting head 11 of the component mounting unit 12 will pick up the components.

[0015] In FIGS. 2 and 3, on both ends of the base 4 in the X-axis direction on the upper surface, Y-axis tables 9 equipped with linear drive mechanisms are arranged along the Y-axis. On the Y-axis table 9, two (front side and rear side) beams 10 equipped with linear drive mechanisms are movably coupled along the Y-axis. The beams 10 are arranged along the X-axis. On each of the two beams 10, a mounting head 11 is movably mounted along the X-axis. The mounting head 11 adsorbs and holds the component D and includes a plurality (here, eight) of adsorption units 11a that can move up and down. At the lower end of each adsorption unit 11a, a nozzle 11b for adsorbing and holding the component D is mounted.

[0016] In FIG. 2, by driving the Y-axis table 9 and the beam 10, the mounting head 11 moves in the horizontal direction (X-axis direction and Y-axis direction). Thereby, each of the two mounting heads 11 adsorbs and takes out the component D from the component adsorption position of the tape feeder 8 arranged in the corresponding component supply unit 7 by the nozzle 11b and mounts it on the mounting point of the substrate 6 positioned by the substrate transfer mechanism 5. That is, the Y-axis table 9, the beam 10, and the mounting head 11 constitute a component mounting unit 12 for mounting the component D on the substrate 6.

[0017] In FIGS. 2 and 3, a component recognition camera 13 is arranged between the component supply unit 7 and the substrate transfer mechanism 5. When the mounting head 11 that has taken out the component D from the component supply unit 7 moves above the component recognition camera 13, the component recognition camera 13 images the component D held by the nozzle 11b. From the imaging result, the holding state of the component D is recognized. A head camera 14 is attached to the plate 10a to which the mounting head 11 is attached. The head camera 14 moves integrally with the mounting head 11.

[0018] As the mounting head 11 moves, the head camera 14 moves above the substrate 6 positioned on the substrate transport mechanism 5 and captures images of the substrate marks (not shown) provided on the substrate 6. The position of the substrate 6 is recognized from the image capture results. The head camera 14 also moves above the component suction position of the tape feeder 8 and captures images of the components D contained in the carrier tape near the component suction position. The state of the supplied components D is recognized from the image capture results. During the component mounting operation on the substrate 6 by the mounting head 11, the mounting position is corrected by taking into account the image capture results of the components D by the component recognition camera 13 and the image capture results of the substrate position by the head camera 14.

[0019] In Figure 2, touch panels 15 are installed at the front and rear of each component mounting device M2 and M3, respectively, where the worker is positioned to operate the device. The touch panels 15 display various information on their display, and the worker uses the operation buttons displayed on the display to input data and operate the component mounting device (M2 or M3).

[0020] In Figure 3, the component supply unit 7 is set with a trolley 16 that has multiple tape feeders 8 pre-mounted on a feeder base 16a. Multiple slots for mounting the tape feeders 8 are formed on the feeder base 16a. The tape feeders 8 mounted on the trolley 16 are managed based on the position of the slot in which they are mounted and the position (front side, rear side) of the trolley 16 mounted on the component mounting device (M2 or M3). The trolley 16 holds a tape reel 18 that stores a carrier tape 17 holding components D in a wound state. The carrier tape 17 pulled out from the tape reel 18 is pitch-fed to the component suction position by a tape feeding mechanism (not shown) built into the tape feeder 8.

[0021] Next, the configuration of the mounting head 11 will be explained with reference to Figure 4. Figure 4 shows the mounting head 11 and component supply unit of the component mounting machine (M2 or M3). 7This is a diagram illustrating the configuration of the main parts. The mounting head 11 is equipped with a plurality of suction units 11a, and each suction unit 11a is equipped with a drive mechanism (not shown). By driving the drive mechanism, the shaft 11c, to which the nozzle 11b is attached at its lower end, moves up and down (arrow a), and the shaft 11c rotates, causing the nozzle 11b to rotate in the θ direction with the nozzle axis AN as the axis of rotation (arrow b).

[0022] Next, with reference to Figure 5, the configuration of the control system of the component mounting system 1 will be explained. Figure 5 is a block diagram showing the configuration of the control system of the component mounting system 1. Here, we will mainly explain the function of the component mounting system 1 that determines the appropriateness of using correction values ​​in the component mounting devices M2 and M3 based on the positional misalignment information of the components D mounted on the substrate 6 and the correction values ​​used during mounting. The management computer 3, component mounting devices M2 and M3, and inspection device M4 are interconnected via a communication network 2. Each of the component mounting devices M2 and M3 is equipped with a mounting control device 20, a substrate transport mechanism 5, a tape feeder 8, a component mounting unit 12, a component recognition camera 13, a head camera 14, and a touch panel 15. The mounting control device 20 is equipped with a mounting storage unit 21, a mounting control unit 22, and a mounting communication unit 23.

[0023] The mounting communication unit 23 transmits and receives data between the inspection device M4 and the management computer 3 via the communication network 2. The mounting storage unit 21 is a storage device that stores mounting data 21a, correction value information 21b, correction suitability information 21c, etc. The mounting data 21a includes information such as the production model name (board name) of the mounting board, the type of component D mounted on the board 6 (component name), mounting position (XY coordinates), mounting direction (θ direction), mounting position of the tape feeder 8 that supplies the component D, and mounting position of the nozzle 11b.

[0024] Correction value information 21b stores the correction value calculated by the inspection device M4 when imaging the component D mounted on the substrate 6, which is transmitted from the inspection device M4 and stored. Correction suitability information 21c stores suitability information for each type of component D, indicating whether or not the correction value should be used when mounting the component D on the substrate 6.

[0025] In Figure 5, the mounting control unit 22 controls the tape feeder 8, component mounting unit 12, component recognition camera 13, and head camera 14 based on the mounting position and mounting direction included in the mounting data 21a, the correction value included in the correction value information 21b, and the suitability information of the correction value included in the correction suitability information 21c, to mount component D onto the substrate 6. Specifically, the component mounting unit 12 corrects the position of the mounting head 11 based on the position of the substrate 6 captured by the head camera 14, the position of component D held by the nozzle 11b captured by the component recognition camera 13, and the correction value included in the correction value information 21b, and mounts component D onto the substrate 6. At that time, the component mounting unit 12 uses the correction value for component D that is designated as "suitable" in the suitability information included in the correction suitability information 21c, and does not use the correction value for component D that is designated as "unsuitable," and mounts component D onto the substrate 6.

[0026] In Figure 5, the inspection device M4 includes an inspection control device 30, a substrate transport mechanism 31, an inspection camera 32, and an inspection camera movement mechanism 33. The inspection control device 30 includes an inspection storage unit 34, an inspection control unit 35, a recognition processing unit 36, a correction value calculation unit 37, and an inspection communication unit 38. The inspection communication unit 38 transmits and receives data between the component mounting devices M2, M3 and the management computer 3 via the communication network 2. The inspection storage unit 34 is a storage device that stores inspection data 34a, etc. The inspection data 34a includes the production model name (substrate name) of the mounted substrate, the type of component mounted on the substrate 6 (component name), the mounting position (XY coordinates), the mounting direction (θ direction), and the defect judgment value.

[0027] The inspection control unit 35 controls the substrate transport mechanism 31 to move the assembled substrate 6 transported from the upstream component mounting device M3 to the inspection work position, position it, and hold it there, and then transports the substrate 6 downstream once the inspection work is complete. The inspection control unit 35 also controls the inspection camera movement mechanism 33 based on the inspection data 34a to move the inspection camera 32 sequentially above the mounting position of the substrate 6 held at the inspection work position, and uses the inspection camera 32 to image the components D mounted on the substrate 6.

[0028] In Figure 5, the recognition processing unit 36 ​​processes the image captured by the inspection camera 32 and calculates the positional deviation amounts ΔX, ΔY, and Δθ (see Figure 6) of the component D mounted on the substrate 6 from its normal mounting position N. The recognition processing unit 36 ​​also determines that the component D is not mounted correctly if the calculated positional deviation amounts ΔX, ΔY, and Δθ exceed the defect judgment values ​​included in the inspection data 34a. The recognition processing unit 36 ​​also creates substrate inspection information 41b for each substrate 6, which includes the positional deviation information (positional deviation amounts ΔX, ΔY, and Δθ) of the component D mounted on the substrate 6 and the quality judgment result of the mounted substrate, and transmits it to the management computer 3. The management processing unit 40 of the management computer 3 stores the received substrate inspection information 41b in the management storage unit 41.

[0029] Referring to Figure 6, an example of how the recognition processing unit 36 ​​calculates the positional deviation amounts ΔX, ΔY, and Δθ of component D mounted on the substrate 6 from its normal mounting position N will be explained. Figure 6 is an explanatory diagram of the positional deviation amounts of component D calculated by the inspection device M4. The inspection control unit 35 causes the inspection camera 32 to capture images of component D mounted on the substrate 6 at a position where the imaging center of component D coincides with the normal mounting position N of component D. The recognition processing unit 36 ​​detects the center position C of the mounted component D by recognizing the captured image. The recognition processing unit 36 ​​then calculates the positional deviation amount ΔX in the X-axis direction and the positional deviation amount ΔY in the Y-axis direction from the difference between the center position C (ΔX, ΔY) and the mounting position N (0,0). Furthermore, the recognition processing unit 36 ​​calculates the tilt of component D in the θ direction as the positional deviation amount Δθ.

[0030] In Figure 5, the correction value calculation unit 37 calculates correction values ​​to be used by the component mounting devices M2 and M3 when mounting component D onto the substrate 6, based on the positional displacement amounts ΔX, ΔY, and Δθ of component D calculated by the recognition processing unit 36. The correction value calculation unit 37 also creates correction value information including the calculated correction values ​​and transmits it to the component mounting devices M2 and M3 and the management computer 3. The mounting control devices 20 of each component mounting device M2 and M3 store the received correction value information as correction value information 21b in the mounting storage unit 21. The management processing unit 40 of the management computer 3 also stores the received correction value information as correction value information 41c in the management storage unit 41.

[0031] Here, with reference to Figure 9, the method for calculating the correction values ​​(Xc, Yc) by the correction value calculation unit 37 will be explained. Figure 9 is a diagram illustrating the relationship between the corrected evaluation value and the pre-correction evaluation value calculated in the component mounting system 1. First, the correction value calculation unit 37 calculates the average center position Cn(Xn, Yn) of component D from a predetermined number of positional deviation amounts ΔX, ΔY, Δθ included in the board inspection information 41b of the board 6 on which component D has been mounted without using the correction values. The average center position Cn(Xn, Yn) corresponds to the amount of positional deviation caused by elements that cannot be resolved even if the mounting position is corrected by taking into account the positional deviation of component D held by the nozzle 11b during component mounting and the holding position deviation of the board position. Therefore, the correction value calculation unit 37 calculates the correction values ​​(Xc(Xc=-Xn), Yc(Yc=-Yn)) from the average center position Cn(Xn, Yn) so that the center of component D coincides with the mounting position N(0,0) (arrow c).

[0032] Furthermore, when the correction value calculation unit 37 calculates the latest correction value (Xc, Yc) from the board inspection information 41b of the board 6 using the correction value (Xc1, Yc1), it calculates the latest correction value (Xc(Xc=Xc1-Xn), Yc(Yc=Yc1-Yn)) from the correction value (Xc1, Yc1) used and the average center position Cn(Xn, Yn) calculated from the board inspection information 41b. In this way, the correction value calculation unit 37 calculates the correction value (Xc, Yc) when mounting component D on the board 6 based on the board inspection information 41b which includes at least positional displacement information (positional displacement amount ΔX, ΔY, Δθ) of component D mounted on the board 6.

[0033] In Figure 5, the management processing unit 40 of the management computer 3 includes a management storage unit 41, a calculation unit 42, a judgment unit 43, a setting unit 44, an input unit 45, a display unit 46, and a management communication unit 47. The input unit 45 is an input device such as a keyboard, touch panel, or mouse, and is used when inputting operation commands or data. The display unit 46 is a display device such as a liquid crystal panel, and displays various information including various screens such as operation screens for operations performed by the input unit 45. The management communication unit 47 is a communication interface that exchanges signals and data with component mounting devices M2, M3 and inspection device M4 via the communication network 2.

[0034] The management memory unit 41 is a memory device that stores production data 41a, board inspection information 41b, correction value information 41c, corrected information 41d, pre-correction information 41e, etc. The production data 41a includes information such as the production model name (board name) of the mounted board, the type of component D mounted on the board 6 (component name), the size of the component D, the mounting position (XY coordinates), the mounting direction (θ direction), information identifying the component mounting devices M2 and M3 (component mounting unit 12) that mount the component D, the mounting position of the tape feeder 8 that supplies the component D, and the mounting position of the nozzle 11b.

[0035] In Figure 5, the calculation unit 42 calculates a corrected evaluation value when component D is mounted on the substrate 6 using correction values ​​(Xc, Yc) based on the positional misalignment amount ΔX in the X-axis direction and the positional misalignment amount ΔY in the Y-axis direction (hereinafter referred to as "positional misalignment amount ΔX, ΔY") from the positional misalignment amounts ΔX, ΔY, Δθ included in the substrate inspection information 41b, and stores this corrected evaluation value in the management storage unit 41 as corrected information 41d. In addition, the calculation unit 42 calculates a pre-correction evaluation value when it is assumed that component D is mounted on the substrate 6 without using correction values ​​(Xc, Yc), based on the positional misalignment amounts ΔX, ΔY included in the substrate inspection information 41b and the correction values ​​used by the component mounting unit 12 when mounting component D on the substrate 6 included in the correction value information 41c, and stores this pre-correction information 41e in the management storage unit 41.

[0036] Here, with reference to Figures 7A, 7B, and 8, the method for calculating the corrected evaluation value by the calculation unit 42 will be explained. Figures 7A and 7B are plan and side views, respectively, showing examples of the shapes of components mounted on a substrate in component mounting devices M2 and M3. Figure 8 is a diagram illustrating the evaluation value calculated in the component mounting system 1. The calculation unit 42 calculates the average value μ and standard deviation σ for each type of component D from the X-axis positional displacement ΔX of a predetermined number of substrates (for example, 30) included in the substrate inspection information 41b of the substrate 6 using the correction values ​​(Xc, Yc). Next, the calculation unit 42 calculates the process capability index Cpk (Cpk=((T / 2)-|μ|) / 3σ) as a corrected evaluation value from the reference width T calculated by the widths W1, W2 of the electrode Db of component D (see Figures 7A and 7B), and the calculated average value μ and standard deviation σ. Similarly, the calculation unit 42 calculates the process capability index Cpk as a corrected evaluation value in the Y-axis direction from the Y-axis positional displacement ΔY and the reference width T. The process capability index Cpk is an indicator that the larger the value, the smaller the variation (higher the process capability).

[0037] Here, we will explain the widths W1 and W2 of the electrodes Db of component D by referring to Figures 7A and 7B. In Figures 7A and 7B, component D is explained using chip components such as resistors and capacitors as examples. Figure 7A is a top view of component D mounted on the substrate 6, and Figure 7B is a side view of component D mounted on the substrate 6. Component D has electrodes Db at both ends (left and right) of the main body Da. Here, we define the width of the electrodes Db in the direction in which the two electrodes Db are aligned as width W2, and the width of the electrodes Db in the direction perpendicular to the direction in which the two electrodes Db are aligned as width W1.

[0038] When component D is mounted on substrate 6 with the two electrodes Db aligned in the direction of the X-axis of substrate 6, the reference width T (T=(2 / 3)×W2) for evaluating the X-axis displacement ΔX is calculated using the width W2 of electrode Db. Similarly, the reference width T (T=(2 / 3)×W1) for evaluating the Y-axis displacement ΔY is calculated using the width W1 of electrode Db.

[0039] Next, with reference to Figure 9, the calculation method of the pre-correction evaluation value by the calculation unit 42 will be explained. First, the calculation unit 42 uses the same board inspection information 41b as used to calculate the post-correction evaluation value to calculate the pre-correction predicted center position Cb(ΔXb,ΔYb) that is expected when all components D are mounted on the board 6 without using correction values ​​(Xc,Yc) for all components D. Specifically, the calculation unit 42 calculates the pre-correction predicted center position Cb(ΔXb,ΔYb) from the positional deviation amounts ΔX,ΔY included in the board inspection information 41b and the correction values ​​(Xc,Yc) used by the component mounting unit 12 when mounting components D on the board 6, which are included in the correction value information 41c.

[0040] Specifically, the calculation unit 42 calculates the position obtained by subtracting the correction value (Xc, Yc) from the center position C(ΔX, ΔY) of the component D mounted on the substrate 6 (arrow e), and uses this as the pre-correction predicted center position Cb(ΔXb=ΔX-Xc, ΔYb=ΔY-Yc). Subsequently, the calculation unit 42 calculates the average value μb and standard deviation σb for each type of component D from the calculated pre-correction predicted center positions Cb(ΔXb, ΔYb) for a predetermined number of substrates.

[0041] In Figure 9, the calculation unit 42 then calculates the process capability index Cpkb (Cpkb = ((T / 2) - |μb|) / 3σb) as a pre-correction evaluation value from the reference width T and the calculated mean value μ and standard deviation σ. That is, the calculation unit 42 calculates a hypothetical positional displacement amount (ΔXb, ΔYb) assuming that the correction value (Xc, Yc) was not used, from the horizontal positional displacement amounts ΔX, ΔY obtained from the substrate inspection information 41b using the correction value (Xc, Yc) of the first component (component D) and the horizontal correction amount (Xc, Yc) obtained from the correction value (Xc, Yc) of the first component, and calculates the pre-correction evaluation value (process capability index Cpkb) of the first component.

[0042] In this way, the calculation unit 42 calculates the pre-correction evaluation value (process capability index Cpkb) by subtracting the correction values ​​(Xc, Yc) used by the component mounting unit 12 when mounting component D onto the substrate 6 from the substrate inspection information 41b (position deviation amount ΔX, ΔY). In other words, the post-correction evaluation value and the pre-correction evaluation value are evaluation values ​​(process capability index Cpk, process capability index Cpkb) that represent the mounting accuracy during mounting by the component mounting unit 12, calculated based on the substrate inspection information 41b and the correction values ​​(Xc, Yc).

[0043] In Figure 5, the judgment unit 43 determines whether it is appropriate to use the correction values ​​(Xc, Yc) during implementation based on the corrected evaluation values ​​and the uncorrected evaluation values. Specifically, the judgment unit 43 determines that the correction values ​​(Xc, Yc) should be used (appropriate) if both the corrected evaluation values ​​(process capability index Cpk) in the X-axis direction and the Y-axis direction are greater than or equal to the uncorrected evaluation value (process capability index Cpkb). The judgment unit 43 also determines that the correction values ​​(Xc, Yc) should not be used (inappropriate) if either the corrected evaluation value (process capability index Cpk) in the X-axis direction or the Y-axis direction is less than the uncorrected evaluation value (process capability index Cpkb).

[0044] Here, we will explain the significance of comparing the corrected evaluation value (process capability index Cpk) with the uncorrected evaluation value (process capability index Cpkb). The process capability index Cpk is an indicator where a larger value indicates less variation. Therefore, if the corrected evaluation value (process capability index Cpk) is greater than or equal to the uncorrected evaluation value (process capability index Cpkb), it is expected that using the corrected values ​​(Xc, Yc) during assembly will reduce the positional deviation of part D. On the other hand, if the corrected evaluation value (process capability index Cpk) is smaller than the uncorrected evaluation value (process capability index Cpkb), it is expected that using the corrected values ​​(Xc, Yc) during assembly will actually increase the positional deviation.

[0045] In this way, the calculation unit 42 calculates a corrected evaluation value (process capability index Cpk) and an uncorrected evaluation value (process capability index Cpkb) for each type of component D, and the judgment unit 43 determines whether or not to use the correction values ​​(Xc, Yc) for each type of component D. Alternatively, the calculation unit 42 may calculate the corrected evaluation value (process capability index Cpk) and the uncorrected evaluation value (process capability index Cpkb) for each type of component D and for each component mounting unit 12. In this case, the judgment unit 43 determines whether or not to use the correction values ​​(Xc, Yc) for each type of component D and for each component mounting unit 12. This allows the judgment unit 43 to determine whether or not to use the correction values ​​(Xc, Yc) for each component mounting unit 12, even when the same type of component D is mounted alternately on the substrate 6 at the component mounting units 12 before and after the component mounting device M2.

[0046] Here, with reference to Figure 10, the determination of the appropriateness of the correction values ​​(Xc, Yc) by the judgment unit 43 will be explained. Figure 10 is a diagram illustrating examples of the corrected evaluation value and the pre-correction evaluation value calculated in the component mounting system 1. In Figure 10, information contained in the correction value information 41c, corrected information 41d, and pre-correction information 41e is extracted and displayed for some of the multiple types of components D mounted on the substrate 6 in the component mounting devices M2 and M3. Specifically, in Figure 10, for each component name 50 (type of component D), the correction value 51 contained in the correction value information 41c, the corrected evaluation value 52 contained in the corrected information 41d, the pre-correction evaluation value 53 contained in the pre-correction information 41e, and the determination of the appropriateness of the correction 54 by the judgment unit 43 are displayed.

[0047] For example, if the part name 50 is "D01", the judgment unit 43 determines that the correction suitability 54 is "suitable" because the corrected evaluation value 52 (Cpk(X01)) in the X-axis direction is greater than or equal to the pre-correction evaluation value 53 (Cpkb(X01)), and the corrected evaluation value 52 (Cpk(Y01)) in the Y-axis direction is greater than or equal to the pre-correction evaluation value 53 (Cpkb(Y01)). Also, if the part name 50 is "D02", the judgment unit 43 determines that the correction suitability 54 is "unsuitable" because the corrected evaluation value 52 (Cpk(X02)) in the X-axis direction is less than the pre-correction evaluation value 53 (Cpkb(X02)), or the corrected evaluation value 52 (Cpk(Y02)) in the Y-axis direction is less than the pre-correction evaluation value 53 (Cpkb(Y02)).

[0048] In Figure 5, the setting unit 44 configures the component mounting unit 12 to use the correction values ​​(Xc, Yc) if the judgment unit 43 determines that the use of the correction values ​​(Xc, Yc) is appropriate. The setting unit 44 also configures the component mounting unit 12 not to use the correction values ​​(Xc, Yc) if the judgment unit 43 determines that the use of the correction values ​​(Xc, Yc) is inappropriate. Specifically, the setting unit 44 changes (sets) the "appropriate" or "inappropriate" information in the correction suitability information 21c stored in each of the component mounting devices M2 and M3 that mount component D, which changes the suitability of the correction values ​​(Xc, Yc).

[0049] As a result, each component mounting unit 12 of the component mounting devices M2 and M3 mounts component D using or without the correction values ​​(Xc, Yc) according to the settings of the modified correction suitability information 21c. In other words, the setting unit 44 sets whether or not to use the correction values ​​(Xc, Yc) when mounting by the component mounting unit 12.

[0050] Here, referring to Figures 11A and 11B, we will describe an example of a component D1 in which the positional displacement amounts ΔX and ΔY of component D may increase when correction values ​​(Xc, Yc) are used during mounting. Figures 11A and 11B are a plan view and a side view, respectively, showing an example of a component D1 in which the positional displacement may increase when correction values ​​calculated in the component mounting system 1 are used. Component D1 is a chip component in which the center position of the top surface Dc and the center position of the bottom surface De are offset. Component D1 has a parallelogram cross-sectional shape. When components D1 of this shape are irregularly placed in the pockets of the carrier tape 17, as shown in Figures 11A and 11B, when viewed from above, the direction in which the side surface Dd protrudes from the top surface Dc (the relationship between the center position of the top surface Dc and the center position of the bottom surface De) will be irregularly mounted on the substrate 6 on the left and right.

[0051] When component D1 is imaged by the inspection camera 32 of the inspection device M4 and recognized by the recognition processing unit 36, the center position of the upper surface Dc of the recognized component D1 will be offset from the center position of the lower surface De of component D1 that is in contact with the substrate 6. In other words, since the direction of the offset differs for each component D1, the correction values ​​(Xc, Yc) calculated by the correction value calculation unit 37 do not necessarily correct the offset during mounting in the correct direction. Therefore, using the correction values ​​(Xc, Yc) during mounting may actually increase the positional offset amounts ΔX, ΔY of component D1.

[0052] Figure 12 is a flowchart of the component mounting method in component mounting system 1. Next, following the flow in Figure 12, we will explain a component mounting method in which component mounting system 1 determines the appropriateness of using correction values ​​(Xc, Yc) in component mounting devices M2 and M3 based on the misalignment amounts ΔX, ΔY of component D mounted on substrate 6 and the correction values ​​(Xc, Yc) used during mounting. First, when production of mounted substrates starts in component mounting system 1 (ST1), each of component mounting devices M2 and M3 performs component mounting work to mount component D on substrate 6 without using correction values ​​(Xc, Yc) until a predetermined number of misalignment information (misalignment amounts ΔX, ΔY) is acquired (No in ST3) (ST2).

[0053] When a predetermined number of misalignment information (misalignment amounts ΔX, ΔY) is acquired (Yes in ST3), the correction value calculation unit 37 calculates correction values ​​(Xc, Yc) based on the acquired misalignment amounts ΔX, ΔY (ST4: Correction value calculation step). That is, the correction value calculation unit 37 calculates the correction values ​​(Xc, Yc) for mounting component D on the substrate 6 based on substrate inspection information 41b which includes at least the misalignment information (misalignment amounts ΔX, ΔY) of component D mounted on the substrate 6. The calculated correction values ​​(Xc, Yc) are transmitted to component mounting devices M2, M3 (correction value information 21b) and management computer 3 (correction value information 41c).

[0054] In FIG. 12, next, each of the component mounting devices M2 and M3 performs a component mounting operation of mounting the component D on the substrate 6 using the correction values (Xc, Yc) included in the correction value information 21b until the substrate inspection information 41b (amounts of displacement ΔX, ΔY) for a predetermined number of substrates (for example, 30 substrates) is acquired (No in ST6) (ST5). That is, the suitability information included in the correction suitability information 21c is "suitable", and the component mounting unit 12 mounts the component D on the substrate 6 based on the correction values (Xc, Yc).

[0055] When the substrate inspection information 41b (amounts of displacement ΔX, ΔY) for a predetermined number of substrates is acquired (Yes in ST6), the calculation unit 42 calculates a post-correction evaluation value (process capability index Cpk) when the component D is mounted on the substrate 6 using the correction values (Xc, Yc) based on the substrate inspection information 41b of the substrate 6 using the correction values (Xc, Yc) (ST7: post-correction evaluation value calculation step). Further, the calculation unit 42 calculates a pre-correction evaluation value (process capability index Cpkb) when it is assumed that the component D is mounted on the substrate 6 without using the correction values (Xc, Yc) based on the same substrate inspection information 41b and correction values (Xc, Yc) as in the post-correction evaluation value calculation step (ST7) (ST8: pre-correction evaluation value calculation step).

[0056] In FIG. 12, next, the determination unit 43 determines the suitability of using the correction values (Xc, Yc) at the time of mounting based on the post-correction evaluation value (process capability index Cpk) and the pre-correction evaluation value (process capability index Cpkb) (ST9: determination step). When the post-correction evaluation value (process capability index Cpk) is smaller than the pre-correction evaluation value (process capability index Cpkb) (Cpk < Cpkb), the determination unit 43 determines not to use the correction values (Xc, Yc) (not suitable) (Yes in ST9). In that case, the setting unit 44 sets the suitability information of the component D for which it is determined "not suitable" in the correction suitability information 21c of any of the component mounting devices M2 and M3 that mount the component D to "not suitable".

[0057] Furthermore, the determination unit 43 determines that the correction values ​​(Xc, Yc) should be used (appropriate) if the corrected evaluation value (process capability index Cpk) is equal to or greater than the pre-correction evaluation value (process capability index Cpkb) (Cpk ≥ Cpkb) (No in ST9). In this case, the setting unit 44 does not change the appropriateness information for the component D in the correction appropriateness information 21c of either the component mounting device M2 or M3 that mounts the component D which has been determined to be "appropriate" (it is set to "appropriate").

[0058] In Figure 12, the component mounting devices M2 and M3 then perform component mounting operations on the substrate 6 based on the modified correction suitability information 21c (ST11). Specifically, for component D judged as "unsuitable" in the judgment step (ST9), component mounting operations are performed without using the correction values ​​(Xc, Yc), while for component D judged as "suitable," component mounting operations using the correction values ​​(Xc, Yc) are continued. This makes it possible to obtain good mounting accuracy for various components D mounted on the substrate 6.

[0059] In the above component mounting method, the pre-correction evaluation value (process capability index Cpkb) was calculated in the pre-correction evaluation value calculation step (ST8) based on the same board inspection information 41b and correction values ​​(Xc, Yc) as in the post-correction evaluation value calculation step (ST7), but this method is not limited to this method. For example, in the pre-correction evaluation value calculation step (ST8), the pre-correction evaluation value (process capability index Cpkb) may be calculated based on the board inspection information 41b of the board 6 on which component D was mounted without using the correction values ​​(Xc, Yc) in (ST2). In other words, the calculation unit 42 may calculate the pre-correction evaluation value (process capability index Cpkb) based on the board inspection information 41b of the board 6 on which component D was mounted without using the correction values ​​(Xc, Yc).

[0060] Furthermore, if the reason for the "unsuitable" determination in the judgment process (ST9) is due to the shape of component D (see Figures 11A and 11B), the suitability information for component D in the corrected suitability information 21c may be set to "unsuitable" from the start of production (ST1), and component D may be mounted on the substrate 6 without using the correction values ​​(Xc, Yc) during the component mounting work in (ST5). In other words, the "suitable" or "unsuitable" status of the suitability information for each type of component may be stored in a database, and when manufacturing a new mounting substrate, the database may be referenced to create the corrected suitability information 21c for that mounting substrate.

[0061] As described above, the component mounting system 1 of this embodiment includes a correction value calculation unit 37 that calculates correction values ​​(Xc, Yc) for mounting component D on the substrate 6 based on substrate inspection information 41b which includes at least positional misalignment information (positional misalignment amount ΔX, ΔY) of component D mounted on the substrate 6, a component mounting unit 12 that mounts component D on the substrate 6 based on the correction values ​​(Xc, Yc), a calculation unit 42 that calculates an evaluation value representing the mounting accuracy during mounting by the component mounting unit 12 based on the substrate inspection information 41b and the correction values ​​(Xc, Yc), and a determination unit 43.

[0062] The calculation unit 42 then calculates, as evaluation values, the corrected evaluation value (process capability index Cpk) when the component D is mounted on the substrate 6 using the correction values ​​(Xc, Yc), and the uncorrected evaluation value (process capability index Cpkb) when it is assumed that the component D is mounted on the substrate 6 without using the correction values ​​(Xc, Yc). The judgment unit 43 then determines, based on the corrected evaluation value (process capability index Cpk) and the uncorrected evaluation value (process capability index Cpkb), whether or not to use the correction values ​​(Xc, Yc) during mounting. This makes it possible to obtain good mounting accuracy for various components D mounted on the substrate 6.

[0063] In the above embodiment, the inspection device M4 was configured to calculate the correction value, but the component mounting system 1 of this embodiment is not limited to this configuration. For example, the management computer 3 may be equipped with a correction value calculation unit 37, which calculates the correction value based on the board inspection information 41b and transmits it to the component mounting devices M2 and M3. Alternatively, each of the component mounting devices M2 and M3 may be equipped with a correction value calculation unit 37, which obtains the board inspection information 41b from the inspection device M4 and calculates the correction value.

[0064] Furthermore, although the above embodiment was described using an example where one-sided process capability index Cpk is used as the corrected evaluation value and the uncorrected evaluation value, both-sided process capability index Cp may also be used as the corrected evaluation value and the uncorrected evaluation value. [Industrial applicability]

[0065] The component mounting system and component mounting method disclosed herein have the effect of being able to obtain good mounting accuracy for various components mounted on a substrate, and are useful in the field of mounting components on a substrate. [Explanation of Symbols]

[0066] 1. Component mounting system 6 circuit boards 12. Component mounting section D parts M2, M3 component mounting equipment ΔX, ΔY positional displacement (positional displacement information)

Claims

1. A correction value calculation unit calculates a correction value for mounting components onto a circuit board based on circuit board inspection information which includes at least positional misalignment information of components mounted on the circuit board, A component mounting unit that mounts the component onto the substrate based on the correction value, A calculation unit calculates an evaluation value representing the mounting accuracy during mounting by the component mounting unit based on the board inspection information and the correction value, It comprises a determination unit, The calculation unit calculates, as the evaluation value, the corrected evaluation value when the component is mounted on the substrate using the correction value, and the uncorrected evaluation value when it is assumed that the component is mounted on the substrate without using the correction value. The component mounting system includes a determination unit that determines, based on the corrected evaluation value and the uncorrected evaluation value, whether or not to use the correction value during mounting.

2. The calculation unit described above, The corrected evaluation value is calculated based on the substrate inspection information. The component mounting system according to claim 1, wherein the pre-correction evaluation value is calculated by subtracting the correction value used by the component mounting unit when mounting the component on the substrate from the substrate inspection information.

3. The calculation unit calculates the corrected evaluation value and the pre-correction evaluation value for each type of part. The component mounting system according to claim 1 or 2, wherein the determination unit determines whether or not the correction value is appropriate for each type of component.

4. The calculation unit calculates the corrected evaluation value and the pre-correction evaluation value for each type of component and each component mounting section. The component mounting system according to claim 1 or 2, wherein the determination unit determines whether or not the correction value is appropriate to use for each type of component and each component mounting unit.

5. The component mounting system according to claim 1 or 2, wherein the determination unit determines to use the correction value when the corrected evaluation value is equal to or greater than the pre-correction evaluation value.

6. The system further includes a setting unit for setting whether or not to use the correction value when the component mounting unit is used for mounting, The component mounting system according to claim 1 or 2, wherein the setting unit is set to use the correction value when the determination unit determines that it is appropriate to use the correction value.

7. The component mounting system according to claim 6, wherein the setting unit is set not to use the correction value when the determination unit determines that the use of the correction value is unsuitable.

8. The component mounting system according to claim 1 or 2, wherein the calculation unit calculates a provisional positional displacement amount assuming that the correction value was not used, from the amount of horizontal positional displacement obtained from the substrate inspection information using the correction value of the first component and the amount of horizontal correction obtained from the correction value of the first component, and calculates the pre-correction evaluation value of the first component.

9. Based on board inspection information that includes at least positional misalignment information of components mounted on the board, a correction value is calculated for mounting the components on the board. Based on the correction value, the component is mounted on the substrate. Based on the board inspection information, the corrected evaluation value is calculated when the component is mounted on the board using the correction value. Based on the board inspection information and the correction value, calculate the pre-correction evaluation value assuming that the component is mounted on the board without using the correction value. A component mounting method that determines whether or not to use the correction value during mounting based on the correction value and the pre-correction evaluation value.

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