Inserts mounted on trays for transporting semiconductor products, trays containing inserts, and semiconductor product test systems including inserts.

Abstract

To provide an insert that allows semiconductor products with terminals located on lateral sides thereof to be applicable to a test tray.SOLUTION: A test tray for testing a semiconductor product according to an embodiment of the present invention may include a tray, and an insert with an accommodating portion configured to accommodate a semiconductor product, the insert being designed to be inserted to the tray.SELECTED DRAWING: Figure 6

Description

Technical Field

[0001] The present invention relates to an insert mounted on a tray for transporting semiconductor products, a tray including the insert, and a semiconductor product test system including the insert.

Background Art

[0002] Semiconductor products such as memory modules that have undergone the production process are graded through predetermined tests before being finally shipped to the market. Examples of such memory modules include SO-DIMM, R-DIMM, U-DIMM, LPCAMM, etc. Among these, LPCAMM has terminals located on the side, unlike other common memory modules where the terminals are located at the lower end.

[0003] Regarding the test for the memory module, such a test is conducted in a manner of determining whether the memory module can operate normally in an environment similar to actual use before shipment. Specifically, the memory module is inserted into a socket electrically connected to an actual motherboard (main board), and it is determined whether the memory module operates normally while exchanging electrical signals with the motherboard. The test of actually mounting the memory module in the socket to determine whether it is normal is called an implementation test.

[0004] In order to improve the efficiency of the implementation test, it is necessary to test a large number of memory modules at once. Conventionally, in response to such needs, a test device includes a plurality of sockets, and a test tray that supports the memory modules corresponding to the socket arrangement is used. The test tray has a plurality of inserts arranged corresponding to the socket arrangement for transporting and testing a large number of memory modules. The insert houses the memory module such that the lower end of the memory module is exposed below the test tray. Thereby, in a state where the test tray is seated on the test device, the memory modules housed in the respective inserts can be inserted and mounted into the corresponding sockets.

[0005] However, as mentioned above, semiconductor products with terminals formed on the side, such as LPCAMM, have recently appeared. To perform mounting tests of such semiconductor products with high efficiency, the use of test trays is necessary. However, because the terminals of such semiconductor products are located on the side, when inserted into conventional inserts, the terminal portion is not exposed in the direction of the socket. Therefore, in order to use a test tray for mounting tests of semiconductor products with terminals located on the side, a different type of insert is required than conventional ones. [Overview of the project] [Problems that the invention aims to solve]

[0006] The problem that this invention aims to solve is to provide an insert that can be applied to a test tray to a semiconductor product having terminals formed on its side.

[0007] The problems addressed by the present invention are not limited to those mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the following description. [Means for solving the problem]

[0008] A tray for testing semiconductor products according to one embodiment of the present invention for solving the aforementioned problems includes a tray and a storage section for accommodating semiconductor products, and may also include an insert mounted on the tray.

[0009] The storage unit may have a first orientation that forms a first angle with respect to the tray for storing the semiconductor product, and a second orientation that forms a second angle with respect to the tray for testing the semiconductor product.

[0010] The insert may further include a mounting portion that is mounted on the tray and supports the housing portion in an angle-adjustable manner relative to the tray.

[0011] The housing portion may include a mounting slot for housing the semiconductor product and a rotating body supported by the mounting portion in an angle-adjustable manner.

[0012] In the first position, the opening of the mounting slot of the rotating body may be exposed on the upper side of the tray, and in the second position, the opening of the mounting slot may face the inner wall of the tray.

[0013] The housing portion may further include a push body that faces the back surface of the semiconductor product, is movably formed relative to the rotating body, and selectively supports the semiconductor product or moves the semiconductor product in one direction.

[0014] The push body may have an end that protrudes from the rotating body so as to be pressurized in one direction by an external force applied from the outside.

[0015] The housing portion may further include a retractable elastic member that provides a restoring force to maintain the push body in a protruding state relative to the rotating body.

[0016] The push body has a recess formed at the end that contacts the back surface of the semiconductor product, which corresponds to the shape of the back surface of the semiconductor product, allowing it to approach the semiconductor product and accommodate the semiconductor product in the recess.

[0017] The rotating body may include a shaft that serves as the axis of rotation of the rotating body and is inserted into the mounting portion so as to be pivotable in the axial direction.

[0018] The rotating body may further include a pair of mounting blocks, each having mounting slots at adjacent ends having a width corresponding to the thickness of the semiconductor product, and spaced apart from each other by a distance corresponding to the length of the semiconductor product so that the semiconductor product is housed in the space between the different mounting slots.

[0019] The mounting block may have an alignment hole that extends and recesses parallel to the thickness direction of the housed semiconductor product.

[0020] The accommodating portion may further include a posture restoring elastic member that provides a restoring force for maintaining the rotating body in the first posture or the second posture.

[0021] The rotating body may further be formed with a posture fixing groove into which an external member is inserted so that the external member can interact with the rotating body to maintain a posture different from the posture restored by the posture restoring elastic member.

[0022] A tray for testing a semiconductor product according to an embodiment of the present invention for solving the above problems may include a tray having a plurality of grooves and an insert that houses the semiconductor product and is mounted on the tray so as to be positioned in the grooves.

[0023] The semiconductor product may include a first-type semiconductor product having terminals located at the lower end and a second-type semiconductor product having terminals located on the side surface.

[0024] The insert may include a first-type insert that houses the first-type semiconductor product and exposes the lower end of the first-type semiconductor product below the tray, and a second-type insert that houses the second-type semiconductor product and has a first posture in which an entrance through which the second-type semiconductor product enters and exits is exposed above the tray and a second posture in which the side surface of the housed second-type semiconductor product is exposed below the tray.

[0025] The first-type insert or the second-type insert may be selectively mounted on the tray.

[0026] An insert mounted on a tray for transporting a semiconductor product according to an embodiment of the present invention for solving the above problems may include an accommodating portion formed with a mounting slot for accommodating the semiconductor product and a mounting portion that supports the accommodating portion in a posture-convertible manner.

[0027] The accommodating portion may have a first posture in which the entrance of the mounting slot is exposed to the upper external space of the mounting portion, and a second posture in which the mounting slot is exposed to the lower external space of the mounting portion.

[0028] A semiconductor product test system according to an embodiment of the present invention for solving the above problems includes a tray having grooves, a semiconductor product accommodated therein, an insert mounted on the tray so as to be positioned in the grooves, the insert having a first posture forming a first angle with respect to the tray and a second posture forming a second angle with respect to the tray, and a posture converter for converting the posture of the insert by pressing one side of the insert so that the angle of the insert changes.

[0029] Other specific matters of the present invention are included in the detailed description and the drawings.

Effects of the Invention

[0030] According to an embodiment of the present invention, there are at least the following effects.

[0031] It is possible to improve the mounting test efficiency of a semiconductor product having terminals located on its side surface.

[0032] The effects of the present invention are not limited to the contents exemplified above, and more various effects are included in this specification.

Brief Description of the Drawings

[0033] [Figure 1] It is a block diagram of a semiconductor product test system according to an embodiment of the present invention. [Figure 2] It is a view showing a tray for testing a semiconductor product according to an embodiment of the present invention. [Figure 3] It is a view of an insert as seen from above in a state where no external force is applied to the insert according to an embodiment of the present invention. [Figure 4] It is a view of an insert as seen from below in a state where no external force is applied to the insert according to an embodiment of the present invention. [Figure 5] This is a rear view of an insert according to one embodiment of the present invention when it is in the first position. [Figure 6] This is a view from the front of an insert according to one embodiment of the present invention when it is in a first position. [Figure 7] This is an exploded perspective view of an insert according to one embodiment of the present invention. [Figure 8] This is a perspective view of a rotating body according to one embodiment of the present invention. [Figure 9] This is a bottom view of a rotating body according to one embodiment of the present invention. [Figure 10] This figure shows a push body according to one embodiment of the present invention. [Figure 11] This figure shows a tray attached to a posture changing device according to one embodiment of the present invention. [Figure 12] This is a view of the attitude changer shown in Figure 11 from a different angle. [Figure 13] This figure shows an insert opening module according to one embodiment of the present invention. [Figure 14] This is a side view of an insert opening module according to one embodiment of the present invention. [Figure 15] This figure illustrates the situation in which a tray is in contact with a hard stopper according to one embodiment of the present invention. [Figure 16] This figure shows the insert release module according to one embodiment of the present invention in its lowest possible position. [Figure 17] This figure shows the insert fixing module according to one embodiment of the present invention in its maximum raised state. [Modes for carrying out the invention]

[0034] The advantages and features of the present invention, and methods for achieving them, will become clearer with reference to the embodiments described below in detail with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below and can be realized in a variety of different forms, provided that these embodiments are made to complete the disclosure of the present invention and to fully inform those who are ordinary skill in the art to which the invention pertains, and the present invention is defined only by the scope of the claims.

[0035] Furthermore, the embodiments described herein are explained with reference to cross-sectional and / or schematic diagrams that serve as ideal illustrative diagrams of the present invention. Therefore, the form of the illustrative diagrams may be modified due to manufacturing techniques and / or tolerances. Also, in each figure shown herein, each component may be shown slightly enlarged or reduced for ease of explanation. Throughout the specification, the same reference numerals refer to the same component.

[0036] The semiconductor products mentioned below may be memory modules or similar information processing units. Semiconductor products are classified into Type 1 semiconductor products, which have terminals located at the bottom, and Type 2 semiconductor products, which have terminals located on the sides. Examples of Type 1 semiconductor products include SO-DIMM, R-DIMM, and U-DIMM. Examples of Type 2 semiconductor products include LPCAM.

[0037] The trays mentioned below may be stacking means for stacking semiconductor products in a predetermined arrangement. Such trays are classified into user trays and test trays. User trays stack a number of semiconductor products in a predetermined arrangement determined from the perspective of user management convenience. For example, a user tray can stack the number of semiconductor products produced or supplied at one time (hereinafter, 1 LOT). In contrast, test trays can support semiconductor products in accordance with the socket arrangement of a test unit. Test trays have inserts that expose the terminal portions of the contained semiconductor products on the underside in order to insert the semiconductor products into the sockets.

[0038] The directional expressions such as up, down, left, and right used above and below are explained by defining the remaining directions based on one direction in order to clarify the understanding of the present invention. Accordingly, the directions of up, down, left, and right may be changed depending on the actual use or application of the present invention, and the present invention should be interpreted as including such modified embodiments.

[0039] The semiconductor product test system 1 according to an embodiment of the present invention will be described below with reference to Figure 1. Figure 1 is a block diagram of a semiconductor product test system according to one embodiment of the present invention.

[0040] As shown in Figure 1, a semiconductor product test system 1 according to one embodiment of the present invention may include a stacker 11, a user tray loader 12, a loading precisioner 15, a test tray loader 18, a rack master 20, a test unit 21, a test tray unloader 19, an unloading precisioner 17, a user tray unloader 14, a user tray buffer 13, and a test tray buffer 16.

[0041] In the following, the transfer of trays and / or semiconductor products between the components included in the semiconductor product test system 1 according to one embodiment of the present invention can utilize a variety of transfer units, such as conventionally known robotic devices, pick-and-place devices, and transfer units.

[0042] The stacker 11 provides space for stacking user trays. Although not shown in the figures, the stacker 11 is divided into a loading stacker where user trays containing semiconductor products before testing are stored, and an unloading stacker and / or retest stacker where user trays containing semiconductor products after testing are stored. The unloading stacker stores user trays containing semiconductor products that have been tested and graded. The retest stacker stores user trays containing semiconductor products that must be tested again. The stacker 11 may be equipped with a transfer unit for picking up user trays from the loading stacker and transferring them to the user tray loader 12. The stacker 11 may also be equipped with a transfer unit for retrieving user trays from the user tray unloader 14 and placing them in the unloading stacker and / or retest stacker.

[0043] The user tray loader 12 provides a stage where user trays can wait adjacent to the loading presizer 15. A test tray is loaded into the loading presizer 15, and the loading presizer 15 releases the inserts in the loaded test tray. Here, "released" means that the inserts are ready to accommodate semiconductor products. A semiconductor product transfer unit may be installed between the user tray loader 12 and the loading presizer 15 to pick up semiconductor products from the user trays and mount them in the released inserts.

[0044] The test tray loader 18 retrieves the test trays once the semiconductor products have been placed in their respective inserts in the loading preciser 15, and then transmits them to the rack master 20. The rack master 20 may be a transfer unit that transmits the test trays transmitted from the test tray loader 18 to the respective test units 21. The test units 21 are arranged along the length of the rack master 20, and may also be stacked in the height direction. The rack master 20 can store or identify the position of each test unit 21 and transmit the test trays to the test units 21 in the order in which the test trays are transmitted.

[0045] The test unit 21 may include a plurality of sockets arranged in correspondence with the insert arrangement of the test tray. The board on which the plurality of sockets are formed in the test unit 21 is referred to as the test board. Once the test tray is installed in a matched state on the test board, the semiconductor products housed in each insert can be electrically connected to the sockets. The sockets may have connecting means for electrically connecting the terminals of the semiconductor products to the motherboard. For example, the connecting means may be at least one of various conventional means such as pogo pins, electrode pads, or rubber socket pads.

[0046] After testing is complete in the test unit 21, the test trays are collected again by the rack master 20 and transferred to the test tray unloader 19. The test tray unloader 19 transmits the transferred test trays to the unloading preciser 17. The unloading preciser 17 can then release the inserts in the transmitted test trays.

[0047] Meanwhile, the user tray unloader 14 provides a stage where empty user trays can wait adjacent to the unloading preciser 17. Between the unloading preciser 17 and the user tray unloader 14, a semiconductor product transfer unit can be installed to pick up semiconductor products from the open test trays and load them into the empty user trays. Once the loading of semiconductor products into the user trays is complete, the user trays that were in the user tray unloader 14 can be moved to the unloading stacker and / or retest stacker for storage.

[0048] The user tray buffer 13 can provide temporary storage space for user trays and / or semiconductor products to ensure a smooth flow of transport for user trays. For example, the user tray buffer 13 can be used as a temporary storage location for semiconductor products that have been evaluated as retest grade. The user tray buffer 13 can also be used as a temporary storage location for additionally transported user trays when semiconductor products are sorted and unloaded by grade on the user tray unloader 14 side. As another example, if only semiconductor products of the same grade are loaded into a single user tray, the user tray buffer 13 can be used as a waiting space until the user trays that are not yet fully filled are filled with semiconductor products.

[0049] The test tray buffer 16 provides space for the test tray, which has had all semiconductor products unloaded in the unloading presizer 17, to pass through before being transferred to the loading presizer 15. The test tray can be sequentially transferred from the test tray buffer 16 to the loading presizer 15. After the loading presizer 15 transmits the test tray loaded with semiconductor products to be tested to the test tray loader 18, the test tray buffer 16 can receive an empty test tray and release the inserts.

[0050] The following description will refer to the above-mentioned description of the semiconductor product test system 1 according to one embodiment of the present invention, and will describe a tray for testing semiconductor products and an insert mounted thereon according to one embodiment of the present invention. The insert mounted on the tray for transporting semiconductor products according to one embodiment of the present invention can be used in the semiconductor product test system 1 according to one embodiment of the present invention by being mounted on a test tray.

[0051] Figure 2 shows a tray for testing semiconductor products according to one embodiment of the present invention. In this case, the tray 30 for testing semiconductor products according to one embodiment of the present invention is provided to serve as the test tray 2.

[0052] As shown in Figure 2, multiple inserts 40 are mounted on the tray 30. The inserts 40 are detachably connected to the tray 30 so that they are positioned in grooves formed in the tray 30 (spaces in the tray where the inserts are located). The structure of the inserts 40 for connecting to the tray 30 can be any of the various conventional connection structures, so a detailed explanation is omitted. On the other hand, the inserts 40 may be loosely connected to the tray 30 so that they can swing to some extent while mounted on the tray 30. In the example in Figure 2, eight inserts 40 are mounted on the tray 30 in two rows, but the number of inserts 40 can be varied in various ways.

[0053] On the other hand, each groove in the tray 30 can be fitted with two different types of inserts. For this purpose, the inserts may include a first-type insert (not shown) and a second-type insert 40 having the same or similar bonding structure. Therefore, the user can select and install the first-type insert and the second-type insert 40 in the tray 30 as needed.

[0054] The Type 1 insert may be an insert that supports the Type 1 semiconductor product such that the lower end of the Type 1 semiconductor product is exposed below the tray 30 (downward in Figure 2). The Type 1 insert may be provided to have an insert structure of various conventional semiconductor products designed to support the Type 1 semiconductor product. The Type 1 insert may utilize previously disclosed technology, so a detailed explanation is omitted.

[0055] On the other hand, the insert mounted on the tray 30 in Figure 2 may be a second-type insert 40 according to one embodiment of the present invention. The second-type insert 40 may be an insert formed for mounting and testing a second-type semiconductor product. The second-type insert 40 is provided to allow angle adjustment and orientation change between a first orientation in which an entrance for the second-type semiconductor product to enter and exit is exposed on the upper side of the tray 30, and a second orientation in which the side of the housed second-type semiconductor product is exposed on the lower side of the tray 30. Exemplarily, in the first orientation, the second-type semiconductor product may have an angle perpendicular to the tray 30 or the grooves of the tray 30. Also, exemplarily, in the second orientation, the second-type semiconductor product may be parallel to the tray 30 or the grooves of the tray 30. In the following description, it will be assumed that the angle between the first and second orientations is perpendicular, but the present invention is not limited thereto.

[0056] In this case, insert 40b, located in the right column of tray 30 in Figure 2, is in the first position, and insert 40a, located in the left column of tray 30, is in the second position. Insert 40 can assume either the first or second position as its basic position without external force, thanks to its built-in position-restoring elastic member (described later). For the sake of explanation, the second position will be described below as the basic position, but an ordinary technician in the art to which this invention belongs can easily modify the design so that the first position becomes the basic position by referring to the following description, and the scope of this invention should be interpreted as extending to such embodiments.

[0057] The Type 2 semiconductor product descends vertically from above the Type 2 insert 40 in the first orientation and can be accommodated in the Type 2 insert 40. At this time, the Type 2 semiconductor product is mounted in the Type 2 insert 40 such that the side on which the terminals are located is exposed in front of the Type 2 insert 40. As a result, when the Type 2 insert 40 is switched to the second orientation, the terminals of the Type 2 semiconductor product can be exposed below the tray 30.

[0058] Hereinafter, with reference to Figures 3 and 4, an insert 40 according to one embodiment of the present invention, which is provided as a second-type insert, will be described. Figure 3 is a view of the insert according to one embodiment of the present invention from above when no external force is applied to it. In contrast, Figure 4 is a view of the insert according to one embodiment of the present invention from below when no external force is applied to it.

[0059] Referring to Figures 3 and 4, an insert 40 according to one embodiment of the present invention can assume a second position as its basic position when no external force is applied. At this time, the portion of the semiconductor product D (Type 2 semiconductor product) where the terminals are located can be exposed to the external space below the insert 40.

[0060] Such an insert 40 may be configured to include a mounting portion 420 and a housing portion 410. The mounting portion 420 may be a portion that is pivotably coupled to the tray 30 (see Figure 2). The mounting portion 420 may include a mounting frame 421 and a guide frame 423.

[0061] First, the mounting frame 421 has a coupling structure for connecting to the tray 30, and at the same time, a structure for securely attaching to the test board. The mounting frame 421 is similar in shape to the groove formed in the tray 30, but may be slightly smaller in size. For example, the mounting frame 421 may be provided in a square shape with an open center.

[0062] An alignment hole 4211 may be formed through the lower end of the mounting frame 421 in the height direction. An alignment hole may be a hole formed to align the position of the member in which the alignment hole is formed by inserting an alignment pin having a corresponding shape. Hereinafter, the alignment hole 4211 formed at the lower end of the mounting frame 421 will be referred to as the fixed alignment hole 4211, so as to distinguish it from other alignment holes formed in the insert 40.

[0063] The anchoring alignment hole 4211 may be located at the bottom of the insert 40 compared to other alignment holes. The anchoring alignment hole 4211 can accommodate alignment pins protruding from the test board during the process of the tray 30 being anchored to the test board. As the alignment pins are accommodated in the anchoring alignment hole 4211, the insert 40 is swung relative to the tray 30, and once the alignment pins are fully accommodated in the anchoring alignment hole 4211, the insert 40 can be aligned with the socket.

[0064] The guide frame 423 can be accommodated as a groove formed in the test board during the process of being fixed to the test board. For this purpose, the test board has a recessed groove in the shape corresponding to the guide frame 423. The insert 40 can be initially aligned with the socket during the process of the guide frame 423 being fixed to the test board, and the alignment pins can be accommodated in the fixing alignment holes 4211 for further alignment with the socket.

[0065] Furthermore, the guide frame 423 can set the lower limit of the downward movement of the semiconductor product D. To this end, the guide frame 423 can protrude from the lower end of the mounting frame 421 into the empty space in the center of the mounting frame 421. At this time, the guide frame 423 can protrude into the empty space to such an extent that it does not cover the terminals on the side of the semiconductor product D when it has been lowered to its maximum extent.

[0066] The housing section 410 may be a portion that houses semiconductor products D, and is supported by the mounting section 420 so as to be angle-adjustable relative to the tray 30. The housing section 410 can be angle-adjusted and its orientation changed between the first and second orientations described above relative to the tray 30. In the first orientation, the housing section 410 is at a first angle relative to the tray 30, and in the second orientation, it is at a second angle relative to the tray 30. For example, the first angle may be 90 degrees, and the second angle may be 0 degrees or 180 degrees.

[0067] Such a housing section 410 may include a rotating body 413 and a push body 411.

[0068] The rotating body 413 is angle-adjustably supported on the mounting frame 421. For this purpose, shafts 4131 protrude from both ends of the rotating body 413, which are inserted into and housed in the mounting frame 421. The pair of shafts 4131 are arranged coaxially with each other and can act as the axis of rotation of the rotating body 413. Each shaft 4131 is inserted into a shaft housing groove 4213 formed in the mounting frame 421. The shaft housing groove 4213 may be formed by recessing or penetrating from the inner center of the mounting frame 421 outward. However, the present invention is not limited to this embodiment, and in some embodiments, the shaft housing groove 4213 may be formed in the rotating body 413, and the shafts 4131 may protrude from the mounting frame 421.

[0069] The inner diameter of the shaft housing groove 4213 may be slightly larger than the diameter of the shaft 4131. Also, the distance from one end to the other of two opposing shaft housing grooves 4213 may be longer than the distance between the ends of the pair of shafts 4131. This allows the pair of shafts 4131 to be loosely coupled to the mounting frame 421 so that they can swing not only in the axial direction but also in the forward / backward / up / down directions when each shaft 4131 is inserted into the shaft housing groove 4213. The swinging of the pair of shafts 4131 allows the rotating body 413 to move relative to the mounting frame 421 and align with the socket.

[0070] The housing 410 may include a posture-restoring elastic member 415 that provides a restoring force to maintain the rotating body 413 in a second position. Exemplarily, the posture-restoring elastic member 415 may be provided as a coil spring and positioned to enclose the shaft 4131. One end of the posture-restoring elastic member 415 can contact the rotating body 413 to elastically support the rotating body 413 in maintaining a second angle. Further explanation of this will follow later. In this case, as described above, the posture-restoring elastic member 415 can also maintain the rotating body 413 in a first angle, depending on the embodiment.

[0071] On the other hand, the rotating body 413 can have a central portion that penetrates vertically. For example, the rotating body 413 may be provided in a roughly square shape with an open central portion. The end of the push body 411 is housed in the open space inside the rotating body 413. The push body 411 can approach the semiconductor product D through the open space in the central portion of the rotating body 413. The push body 411 can be coupled to the rotating body 413 such that one end is located in the open space in the center of the rotating body 413 and the other end protrudes outside the rotating body 413.

[0072] Although not shown, the housing 410 may include a protruding restoring elastic member that provides a restoring force to maintain the push body 411 in a protruding state from the rotating body 413 when no external force is present. The protruding restoring elastic member is positioned between the push body 411 and the rotating body 413 and can elastically support the push body 411 relative to the rotating body 413. Such a protruding restoring elastic member may be provided as one of the various conventionally known elastic members that can maintain the push body 411 in a protruding state. For example, the protruding restoring elastic member may be a coil spring.

[0073] A pair of mounting blocks 4137 may be positioned at the end of the rotating body 413. The mounting blocks 4137 are exposed below the tray 30 (see Figure 2) when the rotating body 413 is in the second position. The pair of mounting blocks 4137 have mounting slots 4137b that extend in the direction in which the semiconductor product D is accommodated in the first position. A detailed explanation of the mounting slots 4137b will be given later with reference to Figure 8.

[0074] The mounting block 4137 has alignment holes 4137a that extend parallel to the thickness direction of the housed semiconductor product D (the direction in which it is fixed to the test board in the second orientation; the vertical direction; the direction in which the push body is pressed). To distinguish it from other alignment holes, the alignment holes 4137a formed in the mounting block 4137 are referred to as fine adjustment alignment holes 4137a. The fine adjustment alignment holes 4137a are formed to interact with external alignment pins and ultimately align the position of the rotating body 413.

[0075] When the rotating body 413 is in the second position, the push body 411 protruding upward from the rotating body 413 can be pressurized downward by an external pressurizing module. For example, such a pressurizing module may be installed above the test board in the test unit 21 (see Figure 1).

[0076] When the push body 411 is in its lowest position, it can contact the side of the semiconductor product D opposite to the side that is in contact with the socket (the side where the terminals are located). For example, the push body 411 can simply support the back surface of the semiconductor product D to maintain an open position during mounting tests of the semiconductor product D. In this case, the mounting block 4137 can simply hold the semiconductor product D in its original position.

[0077] As another example, the push body 411 can pressurize the back surface of the semiconductor product D, and the pressurizing module can move the semiconductor product D in the direction of the pressurization. In this case, the mounting block 4137 can be coupled to the frame 413a (see Figure 7), which constitutes the skeleton of the rotating body 413, so as to be movable along the pressurization direction. For the sake of explanation, the following description will use the example of the push body 411 simply contacting the back surface of the semiconductor product D so as to maintain the open state of the semiconductor product D.

[0078] On the other hand, the rotating body 413 has an upper alignment hole 4133 exposed on the upper side and a lower alignment hole 4135 exposed on the lower side, both extending vertically through it. At this time, the upper alignment hole 4133 is used to align the rotating body 413 by interacting with alignment pins formed on the external pressure module. In contrast, the lower alignment hole 4135 is used to align the rotating body 413 by interacting with alignment pins formed on the test board.

[0079] The first position of the insert 40 according to one embodiment of the present invention will be described below with reference to Figures 5 to 6. Figure 5 is a view from the rear of the insert according to one embodiment of the present invention when it is in the first position. In contrast, Figure 6 is a view from the front of the insert according to one embodiment of the present invention when it is in the first position.

[0080] The state shown in Figures 5 and 6 may be a state in which the rotating body 413 has overcome the elastic force of the posture-restoring elastic member 415 and rotated vertically due to an external element. When the rotating body 413 is pressed by an external force and rotated 90 degrees clockwise, it may be in the state shown in Figures 5 and 6.

[0081] More specifically, when an external force acts on the rotating body 413 to rotate it counterclockwise, the elastic member support blocks 4139, located at both ends of the rotating body 413 and housing the ends of the posture-restoring elastic member 415, pressurize the ends of the posture-restoring elastic member 415, compressing the posture-restoring elastic member counterclockwise.

[0082] The elastic member support blocks 4139 are provided in pairs and may be located at both ends of the rotating body 413 adjacent to the shaft 4131. The elastic member support blocks 4139 have linearly recessed elastic member housing grooves 4139a formed in them. Here, the posture-restoring elastic member 415, formed in the form of a coil spring, has a linear protruding end that is housed in the elastic member housing groove 4139a. The posture-restoring elastic member 415 can provide a counterclockwise elastic force to the elastic member support blocks 4139 through the protruding end that contacts the elastic member support blocks 4139.

[0083] As shown in Figures 5 and 6, when the rotating body 413 is converted to the first position, the entrance to the mounting slot 4137b is exposed to the upper external space of the insert 40. At this time, the semiconductor product D can descend in the mounting direction (MA) from above the space between the pair of mounting blocks 4137 and be housed between the mounting blocks 4137. Subsequently, when the external force on the rotating body 413 is removed, the rotating body 413 housing the semiconductor product D can be rotated clockwise by the position-restoring elastic member 415 and converted to the second position.

[0084] The following describes the coupling relationships between the components of the insert 40 according to one embodiment of the present invention, with reference to Figure 7. Figure 7 is an exploded perspective view of the insert according to one embodiment of the present invention.

[0085] As shown in Figure 7, in one embodiment of the present invention, the push body 411, the rotating body 413, and / or the mounting frame 421 may be connected such that the push body 411 is housed in a push body housing space 4132 formed inside the rotating body 413, and the rotating body 413 is housed in a rotating body housing space 4232 formed inside the mounting frame 421.

[0086] The push body housing space 4132 may be provided to be slightly larger than the size of the push body 411 so that the push body 411 is coupled to the rotating body 413 with some play. The push body housing space 4132 may be provided as the inner space of the rotating frame 413a that forms the main skeleton of the rotating body 413.

[0087] The rotating frame 413a is provided in a square shape with an open interior, and a support step 413b protrudes from its lower end toward the inner space. The support step 413b may be a frame that protrudes from both inner walls of the rotating frame 413a to limit the travel distance of the push body 411. The push body 411, which is pressurized by an external force, descends within the push body housing space 4132 until it contacts the support step 413b. At this time, a protruding restorative elastic member may be placed between the support step 413b and the push body 411. A recessed support groove 413c may be formed in the support step 413b so as not to hinder the maximum descent of the push body 411 by the protruding restorative elastic member. The support groove 413c can accommodate a part of the protruding restorative elastic member when there is no external force, and can accommodate all of the protruding restorative elastic member when the push body 411 is compressed in its maximum descent state.

[0088] On the other hand, the rotating body housing space 4232 has a width that prevents the rotating body 413 from contacting the mounting frame 421 between the first and second positions. The shafts 4131 can each be coupled to the shaft housing grooves 4211 exposed in the rotating body housing space 4232. At this time, a posture-restoring elastic member 415 may be attached to at least one of the pair of shafts 4131.

[0089] Hereinafter, with reference to Figures 8 to 9, a rotating body 413 according to one embodiment of the present invention will be described in detail. Figure 8 is a perspective view of the rotating body according to one embodiment of the present invention. In contrast, Figure 9 is a bottom view of the rotating body according to one embodiment of the present invention.

[0090] For the sake of explanation, when explaining in relation to Figures 8 to 9, the part of the rotating body 413 where the mounting block 4137 is located will be referred to as the front surface of the rotating body 413, and the direction that the front surface of the rotating body 413 looks in will be referred to as the front.

[0091] Referring to Figure 8, a guide frame housing groove 413d is formed at the upper front end of the rotating frame 413a. The guide frame housing groove 413d may also be a portion that houses the upper end of the guide frame 423 when the rotating frame 413a is in the second position. In this embodiment, in the second position, the guide frame 423 can contact the front surface of the rotating frame 413a. In this case, the guide frame 423 acts as a stopper that limits the rotation angle of the rotating body 413 to 90 degrees.

[0092] Furthermore, the guide frame 423 prevents the semiconductor product D from being completely separated from the insert 40 even if it detaches from the mounting slot 4137b during the rotation of the rotating frame 413a in the second position to the first position. More specifically, the guide frame 423 can protrude from below the semiconductor product D in the first position toward the push body housing space 4132, thereby restricting the downward movement of the semiconductor product D. As a result, the guide frame 423 prevents damage to the semiconductor product D due to its detachment by preventing complete separation of the semiconductor product D.

[0093] Furthermore, the guide frame 423 can guide the position of the semiconductor product D when it is inserted into the mounting slot 4137b in the second orientation. More specifically, the semiconductor product D is in contact with the guide frame 423 that protrudes toward the push body housing space 4132, and its downward height is limited. In some cases, an inclined surface can be formed on the part of the guide frame 423 that contacts the semiconductor product D to guide the semiconductor product D as it moves downward. In this case, the semiconductor product D can descend along the inclined surface and be mounted in the correct position in the insert 40.

[0094] On the other hand, a pair of mounting blocks 4137 may be symmetrically arranged facing each other on the front surface of the rotating frame 413a. The mounting slots 4137b can be formed on the end of a mounting block 4137 adjacent to another mounting block 4137 (the surface facing the other mounting block). The width of the mounting slots 4137b can accommodate the thickness of the semiconductor product so as to accommodate the semiconductor product.

[0095] The entrance to the mounting slot 4137b can be exposed on the upper side of the tray in the first position and can be positioned horizontally toward the inner wall of the tray in the second position. More specifically, the upper end of the mounting slot 4137b may extend to the upper end of the mounting block 4137 to form an entrance, and the lower end, which extends vertically downward, may be positioned higher than the lower end of the mounting block 4137. Thus, the upper end of the mounting slot 4137b may be open and the lower end may be closed.

[0096] Furthermore, the entrance of the mounting slot 4137b is wider than other parts, and the width of the entrance decreases as it goes downwards. Once it reaches the minimum width, it can maintain that minimum width and extend to the bottom end. At this time, the minimum width may be the same as or slightly larger than the thickness of the semiconductor product. Since the entrance of the mounting slot 4137b is widest at the top and gradually narrows, even if the semiconductor product is loaded into the mounting slot 4137b slightly misaligned, the semiconductor product can slide along the inner wall of the mounting block 4137 during the insertion process and be aligned with the mounting slot 4137b.

[0097] The maximum distance between mounting slots 4137b formed in each mounting block 4137 corresponds to the length of the side of the semiconductor product. This spacing is ensured to provide space for accommodating the semiconductor product between the mounting blocks 4137.

[0098] As shown in Figure 9, a posture fixing groove 4138 may be formed on the bottom surface of the rotating frame 413a, extending toward the upper end. The posture fixing groove 4138 is a groove into which an external object is inserted to maintain the rotating frame 413a in a first posture. When an external object is inserted into the posture fixing groove 4138, the rotating body 413 is supported by the external object and can overcome the elastic force of the posture restoring elastic member 415 to maintain the first posture. In this case, in an embodiment where the second posture is the basic posture, unlike this embodiment, the posture fixing groove 4138 can be used to maintain the rotating body 413 in the second posture.

[0099] The push body 411 according to one embodiment of the present invention will be further described below with reference to Figure 10. Figure 10 is a diagram showing the push body according to one embodiment of the present invention.

[0100] As shown in Figure 10, the push body 411 according to one embodiment of the present invention may include a base block 411a and a push block 411b. One end of the base block 411a is housed in the push body housing space 4132 (see Figure 7), and the other end protrudes outside the push body housing space 4132. The base block 411a may be formed so that one end is sized to correspond to the push body housing space 4132, and the other end is sized to correspond to an external pressurizing module.

[0101] On the other hand, at one end of the base block 411a, an elastic member groove 411c may be formed by recessing toward the other end at a position adjacent to the push block 411b. The elastic member groove 411c can face the support groove 413c (see Figure 7) when the push body 411 is housed in the push body housing space 4132. When the elastic member groove 411c is present, in its maximum compressed state, a portion of the protruding restoring elastic member is housed in the support groove 413c, and the other portion is housed in the elastic member groove 411c.

[0102] The push block 411b may extend from the center of one end of the base block 411a, and a recessed recess 411d may be formed at one end to correspond to the side shape of the semiconductor product. If a recess 411d is formed, at least a portion of the semiconductor product can be accommodated in the recess 411d under the maximum pressure of the push body 411. The side of the push block 411b having the recess 411d can contact the back surface of the semiconductor product to support the semiconductor product. The recess 411d has the effect of finally aligning the semiconductor product accommodated in the mounting slot 4137b (see Figure 8).

[0103] Hereinafter, based on the above description, an attitude changer 50 that can be used in a semiconductor product test system according to one embodiment of the present invention will be described with reference to Figures 11 to 17. The attitude changer 50 according to one embodiment of the present invention may be installed in a loading preciser 15 (see Figure 1) and / or an unloading preciser 17 (see Figure 1) to perform an operation to release the insert 40. For example, the attitude changer 50 can adjust the angle of the insert 40 to change the attitude of the insert 40 from a second attitude to a first attitude.

[0104] First, Figure 11 shows a tray attached to a posture changer according to one embodiment of the present invention. In contrast, Figure 12 shows the posture changer of Figure 11 viewed from a different angle.

[0105] As shown in Figures 11 to 12, the posture changer 50 according to one embodiment of the present invention may include a hard stopper 51, an insert release module 52, a tray lifting module 53, and an insert fixing module 54.

[0106] First, the tray 30 can be loaded and / or mounted on the attitude changer 50 between the hard stopper 51 and the tray lifting module 53. The hard stopper 51 may be a straight frame fixed directly above the front and rear ends of the loaded tray 30. The tray lifting module 53 provides a stage on which the tray 30 is secured and has a cylinder for raising the stage. The tray lifting module 53 initially waits in its maximum lowered position and can perform the raising operation after the tray 30 has been loaded onto the stage.

[0107] The insert release modules 52 are provided in pairs, each operating to release one of the rows of inserts 40. However, there are not necessarily two insert release modules 52; there may be as many insert release modules 52 as there are rows of inserts 40 formed in the tray 30. Each insert release module 52 is provided above the hard stopper 51 so that it can move up and down independently. For example, the insert release modules 52 can be connected to a cylinder to perform the up and down movement.

[0108] Referring to Figure 12, the state shown in Figure 12 is when the tray lifting module 53 has raised the tray 30, the left insert release module 52 is at its lowest position, and the right insert release module 52 is at its highest position. Although Figure 12 shows the two insert release modules 52 operating separately to represent the range of motion of the insert release modules 52, the user can configure the pair of insert release modules 52 to be driven together or independently as needed.

[0109] The insert fixing modules 54 are provided in the same number as the insert release modules 52 and can move up and down together with the stage of the tray lifting module 53. Similar to the insert release modules 52, the insert fixing modules 54 may be provided to interact with any one row of inserts 40. The insert fixing modules 54 can initially wait in their maximum lowered position. The insert fixing modules 54 can move upward after the insert release modules 52 located directly above them have lowered to their maximum position and released the inserts 40. When the insert fixing modules 54 are raised to their maximum position, the inserts 40 can be fixed in the released position.

[0110] The insert release module 52 of the present invention will be described in detail below with reference to Figures 13 and 14. Figure 13 is a diagram showing an insert release module according to one embodiment of the present invention. In contrast, Figure 14 is a side view of an insert release module according to one embodiment of the present invention.

[0111] As shown in Figures 13 to 14, the insert release module 52 according to one embodiment of the present invention may include a release module frame 52a, release module legs 52b, and a pressure wheel 52c.

[0112] The open module frame 52a may have a length corresponding to the length of the tray 30 and a width corresponding to the width of any one row of inserts 40. The open module frame 52a can be raised and lowered by an external drive unit. An opening 52d is formed through the open module frame 52a, located directly above the inserts 40 mounted on the tray 30. The opening 52d may be formed to allow semiconductor products to be mounted or retrieved in the inserts that have been opened by being converted to a first position.

[0113] Open module legs 52b extend downward from both sides of the opening 52d. The open module legs 52b are positioned eccentrically forward or backward with respect to the center of the opening 52d. A pressure wheel 52c can be rotatably mounted on the lower end of the open module legs 52b. The pressure wheel 52c may be a roller that descends along the open module legs 52b and pressurizes the insert 40.

[0114] The insert release operation of the attitude changer 50 according to one embodiment of the present invention will be described below with reference to Figures 15 to 17.

[0115] Figure 15 illustrates a situation in which a tray is in contact with a hard stopper according to one embodiment of the present invention. When the test tray 2 is loaded into the attitude changer 50, the tray lifting module 53 (see Figure 12) can perform an upward movement to raise the tray 30. The upward movement by the tray lifting module 53 continues until the upper end of the tray 30 contacts the hard stopper 51. When the tray lifting module 53 is raised to its maximum height, the tray 30 is in close contact with the hard stopper 51 and its attitude is fixed. At this time, the insert 40 maintains a second attitude, and the insert release module 52 waits above the hard stopper 51 and / or the insert 40.

[0116] Continuing the explanation with reference to Figure 16, Figure 16 shows the insert release module in its lowest position according to one embodiment of the present invention. As shown in Figure 16, when the insert release module 52 is lowered to its lowest position, the insert 40 is converted to the first position.

[0117] This is because the open module leg 52b is positioned eccentrically with respect to the opening 52d (see Figure 13), causing the pressure wheel 41c to pressurize a position eccentric from the center of the rotating body 413. As a result, the pressure wheel 52c can provide the rotating body 413 with a torque in the opposite direction to the elastic force of the posture-restoring elastic member 415 (see Figure 3). Referring again to Figure 3, the pressure wheel 52c can pressurize the upper surface of the rotating body 413 that is not facing the guide frame 423. For example, assuming that the guide frame 423 is located in front of the mounting portion 420, the pressure wheel 52c can descend from a position behind the shaft 4131 and pressurize the rotating body 413.

[0118] At this time, the pressure wheel 52c pressurizes the rotating body 413 and can rotate in the opposite direction to the rotating body 413. Therefore, according to one embodiment of the present invention, the rotating body 413 can smoothly change its orientation during the pressurization process by the pressure wheel 52c, and damage to the insert 40 due to pressurization can be minimized.

[0119] On the other hand, when the insert 40 is converted to the first position, the fixing rod 54a of the insert fixing module 54 can be positioned directly below the insert 40. The fixing rod 54a may be an axial member that protrudes upward at a position facing the position fixing groove 4138 (see Figure 17) of the insert 40, which has been converted to the first position by the insert release module 52.

[0120] Referring to Figure 17, the operation of fixing the insert 40 by the insert fixing module 54 will be explained. Figure 17 shows the insert fixing module according to one embodiment of the present invention in its maximum raised state. As shown in Figure 17, when the insert fixing module 54 is raised to its maximum height, the fixing rod 54a can be inserted into the posture fixing groove 4138.

[0121] The fixing rod 54a is inserted into the position fixing groove 4138 to prevent rotation of the insert 40, so that the insert 40 can stably maintain a first position. After the insert 40 is fixed by the insert fixing module 54, the semiconductor product D is either mounted on the insert 40 or retrieved from the insert 40 after the insert release module 52 rises again, according to the embodiment. Alternatively, the semiconductor product D can be mounted on the insert 40 or retrieved from the insert 40 by passing through the opening 52d (see Figure 13) without the insert release module 52 rising.

[0122] On the other hand, while the above description uses the example of the insert release module 52 being located at the top of the tray 30 and the insert fixing module 54 being located at the bottom of the tray 30, these positions can be changed depending on the embodiment. For example, the insert release module 52 could rotate the insert 40 at the bottom of the tray 30, and the insert fixing module 54 could fix the insert 40 at the top of the tray 30. Alternatively, both the insert release module 52 and the insert fixing module 54 could operate either above or below the tray 30.

[0123] Furthermore, although the push body 411 was described as a component of the insert 40 in the above explanation, the push body 411 may be installed in an external pressure module instead of the insert 40 in some cases. In this case, the push body 411 is lowered by the external pressure module and selectively inserted into the rotating body 413 to pressurize the semiconductor product D.

[0124] On the other hand, in the semiconductor product test system 1, tray 30 and / or insert 40 according to one embodiment of the present invention, the parts that come into direct contact with the semiconductor product D may be coated with an antistatic (ESD; electrostatic discharge) material and / or coating. For example, the antistatic material and / or coating may be made of a nonmetallic material having a surface resistance of 5 to 8. As an example, such a nonmetallic material may be a material such as MCNYLON, PEEK, POM or a similar plastic material.

[0125] Furthermore, for example, the antistatic material and / or coating can be applied to the guide frame 423, the push body 411 and / or the mounting block 4137. Accordingly, according to one embodiment of the present invention, by applying an antistatic material to the part that directly contacts the semiconductor product D, the generation of static electricity during loading, unloading and / or contact operations on the semiconductor product D can be prevented, thereby preventing damage to the semiconductor product D due to static electricity.

[0126] A person with ordinary skill in the art to which the present invention pertains will understand that the present invention can be carried out in other specific forms without altering its technical idea or essential features. Accordingly, the embodiments described above should be understood to be illustrative and not limiting in all respects. The scope of the present invention is expressed by the claims, which are set forth below rather than in the detailed description above, and all modified or altered forms derived from the meaning and scope of the claims and the concept of equivalents thereto should be interpreted as being included within the scope of the present invention. [Explanation of symbols]

[0127] 1: Semiconductor product test system 2: Test tray 11: Stacker 12: User Tray Loader 13: User tray buffer 14: User Tray Unloader 15: Loading Precision 16: Test tray buffer 17: Unloading Precisor 18: Test Tray Loader 19: Test Tray Unloader 20: Rack Master 21: Test Unit 30: Tray 40: Insert 410: Detention Unit 411: Push button unit 411a: Base block 411b: Push Block 411c: Elastic member groove 411d: Recess 413: Rotating body 413a: Rotating frame 413b: Support step 413c: Support groove 413d: Guide frame housing groove 4131: Shaft 4132: Push button housing space 4133: Upper Aligned Hole 4135: Lower Aligned Hole 4137: Mounting Block 4137a: Fine-tuning alignment hole 4137b: Installation slot 4138: Posture fixing groove 4139: Elastic member support block 4139a: Elastic member housing groove 415: Posture Restoration Elastic Member 420: Mounting part 421: Mounting frame 4211: Safe Arrival Align Hall 4213: Shaft housing groove 423: Guide frame 4232: Rotating body housing space 50: Posture changer 51: Hard Stopper 52: Insert release module 52a: Open module frame 52b: Open module legs 52c: Pressure wheels 52d:Aperture 53: Tray lifting module 54: Insert fixing module 54a: Fixed rod D: Semiconductor products

Claims

1. A tray having multiple grooves; and Includes an insert, which includes a housing for housing semiconductor products and is mounted on the tray by being positioned in the groove of the tray; The aforementioned housing section is A first orientation that forms a first angle with respect to the tray for housing the semiconductor product, and a second orientation that forms a second angle with respect to the tray for testing the semiconductor product, It has, In the first orientation for housing the semiconductor product, the entrance to the housing section faces upward relative to the tray, and in the first orientation, the terminals of the semiconductor product housed in the housing section face forward, intersecting the vertical direction of the tray. In the second orientation for testing the semiconductor product, the terminals of the semiconductor product housed in the housing are facing downward relative to the tray. The terminals of the semiconductor product are located on the side of the semiconductor product, and the tray is for testing the semiconductor product.

2. The aforementioned insert is A tray for testing semiconductor products according to claim 1, further comprising a mounting portion which is mounted on the tray and supports the housing portion in an angle-adjustable manner relative to the tray.

3. The aforementioned housing section is A tray for testing semiconductor products according to claim 2, comprising: a rotating body having a mounting slot for housing the semiconductor product and being angle-adjustable and supported on the mounting portion;

4. The aforementioned rotating body is, A tray for testing semiconductor products according to claim 3, wherein in the first orientation, the entrance to the mounting slot is exposed on the upper side of the tray, and in the second orientation, the entrance to the mounting slot faces the inner wall of the tray.

5. The aforementioned housing section is A tray for testing a semiconductor product according to claim 3, further comprising a push body that faces the back surface of the semiconductor product and is movably formed relative to the rotating body, for selectively supporting the semiconductor product or moving the semiconductor product in one direction.

6. The push body is, A tray for testing semiconductor products according to claim 5, wherein the end protrudes from the rotating body so as to be pressurized in one direction by an external force applied from the outside.

7. The aforementioned housing section is A tray for testing semiconductor products according to claim 6, further comprising a retractable elastic member that provides a restoring force to maintain the push body in a protruding state relative to the rotating body.

8. The push body is, A tray for testing a semiconductor product according to claim 5, wherein a recess is formed at the end that contacts the back surface of the semiconductor product, and the tray approaches the semiconductor product and accommodates the semiconductor product in the recess.

9. The aforementioned rotating body is, A tray for testing semiconductor products according to claim 3, comprising a shaft which serves as the rotation axis of the rotating body and is inserted into the mounting portion so as to be pivotable in the axial direction.

10. The aforementioned rotating body is, A tray for testing semiconductor products according to claim 9, further comprising a pair of mounting blocks, each having a mounting slot having a width corresponding to the thickness of the semiconductor product at adjacent ends, and spaced apart from each other by a distance corresponding to the length of the semiconductor product so that the semiconductor product is housed in the space between the different mounting slots.

11. The aforementioned mounting block is A tray for testing semiconductor products according to claim 10, having indented, inclined aligned holes that extend parallel to the thickness direction of the contained semiconductor product.

12. The aforementioned housing section is A tray for testing semiconductor products according to claim 3, further comprising a posture-restoring elastic member that provides a restoring force for maintaining the rotating body in the first or second posture.

13. The aforementioned rotating body is, A tray for testing semiconductor products according to claim 12, further comprising a position-fixing groove into which an external member is inserted, so as to interact with the external member and maintain a position different from the position restored by the position-restoring elastic member.

14. A tray having multiple grooves; and Includes an insert that houses a semiconductor product and is mounted in the tray so as to be positioned in the groove; The aforementioned semiconductor product is This includes a Type 1 semiconductor product with terminals located at the bottom and a Type 2 semiconductor product with terminals located on the side. The aforementioned insert is A first-type insert that houses the first-type semiconductor product and exposes the lower end of the first-type semiconductor product below the tray, The second type insert includes a second type insert that houses the second type semiconductor product and has a first orientation in which an opening for the second type semiconductor product to enter and exit is exposed on the upper side of the tray, and a second orientation in which the side of the housed second type semiconductor product is exposed on the lower side of the tray, The tray includes: A tray for testing semiconductor products, in which the first type insert or the second type insert is selectively mounted.

15. An insert that is fitted into a tray for transporting semiconductor products, The insert is mounted on the tray so as to be positioned in a groove formed in the tray. The aforementioned insert is A housing section having mounting slots for housing semiconductor products; and A mounting part that supports the housing part so that its orientation can be changed; The aforementioned housing section is The mounting slot has a first orientation in which the entrance to the mounting portion is exposed to the upper external space of the mounting portion, and a second orientation in which the mounting slot is exposed to the lower external space of the mounting portion. In the first orientation for housing the semiconductor product, the entrance to the housing section faces upward relative to the tray, and in the first orientation, the terminals of the semiconductor product housed in the housing section face forward, intersecting the vertical direction of the tray. In the second orientation for testing the semiconductor product, the terminals of the semiconductor product housed in the housing are facing downward relative to the tray. The terminals of the semiconductor product are inserts located on the side of the semiconductor product and mounted on a tray for transporting the semiconductor product.

16. A tray with grooves; An insert having a housing portion for housing semiconductor products, mounted on the tray so as to be positioned in the groove, and having a first posture that forms a first angle with respect to the tray and a second posture that forms a second angle with respect to the tray; and A posture changer that presses on one side of the insert to change the orientation of the insert so that the angle of the insert changes; In the first orientation for housing the semiconductor product, the entrance to the housing section faces upward relative to the tray, and in the first orientation, the terminals of the semiconductor product housed in the housing section face forward, intersecting the vertical direction of the tray. In the second orientation for testing the semiconductor product, the terminals of the semiconductor product housed in the housing are facing downward relative to the tray. A semiconductor product test system wherein the terminals of the semiconductor product are located on the side of the semiconductor product.

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