Contactor assembly and contactor structure

Abstract

【Problem】 The present invention provides a contactor assembly, a contactor structure, and a probe, as well as a method for manufacturing a contactor assembly, which can achieve extremely high positional accuracy between the contactor and the guide, and can also considerably improve the positional accuracy between the contactor and the receiving device that includes the guide receiving element. 【Solution】A first plurality of contacts children and at least one guide Do including an assembly With your body wherein at least one guide Do and the first plurality of contacts child each contact Child includes a certain portion belonging to a common metal Layer and the first plurality of contacts child each contact Child and at least one guide Do is rigidly fixed, an assembly body.

Description

[Technical Field]

[0001] This application claims priority to U.S. Patent Application No. 18 / 138,168, filed on 24 April 2023. The entire contents of said application are incorporated herein by reference and constitute part of this disclosure.

[0002] This disclosure relates to assemblies and structures, and more particularly to contact assemblies or contact structures for use in electrical connectors or probes. This disclosure further relates to similar methods, and more particularly to methods for manufacturing a plurality of contacts and at least one guide for use in electrical connectors or probes. [Background technology]

[0003] It is known to provide electrical connectors equipped with contacts. This disclosure provides further details in light of this background. [Overview of the project] [Means for solving the problem]

[0004] The purpose of this summary is to facilitate understanding of the disclosure. Therefore, this summary presents the concepts and features of the disclosure in a simplified and general manner compared to the detailed description below, and should not be construed as limiting other parts of the disclosure.

[0005] Broadly speaking, this disclosure teaches an assembly comprising a plurality of contacts and at least one guide. By manufacturing the contacts and guides simultaneously from a single metal layer or from multiple layers comprising a metal layer, a very high degree of positional accuracy can be achieved between the contacts and the guide. This makes it possible to considerably improve the positional accuracy between the contacts and the receiving device comprising the guide receiving element.

[0006] This disclosure relates to a device with a pitch of less than 0.35 mm (preferably less than 0.3 mm, most preferably less than 0.25 mm or less than 0.2 mm) and / or a bandwidth of 2.1 Tbps / cm². 3 Ultra (preferably 2.7 Tbps / 1cm) 3 Most preferably 3.2 Tbps / 1cm 3 Ultra-high or 6.4 Tbps / 1cm 3 We also teach structures that include multiple contactors (super).

[0007] The pitch should preferably be understood as the pitch between at least two of the plurality of contacts, preferably as the pitch between two adjacent signal contacts (i.e., the signal-to-signal pitch), and most preferably as the pitch between the signal contacts of a differential signal pair. However, the pitch between a signal contact and a ground contact (signal-to-ground pitch) or the pitch between any other contacts may also be understood as the pitch.

[0008] The bandwidth per unit volume mentioned above may be further increased, for example, depending on the number of contacts per column or set and the number of contacts per row (as defined below for "column," "set," and "row").

[0009] The term "contact" as used herein preferably refers to an electrical contact.

[0010] The features and advantages mentioned in reference to "assemblies" may also be understood as applicable features and advantages to "structures," and vice versa. "Assemblies" and "structures" may even describe the exact same subject. Therefore, the terms "assemblies" and "structures" can be arbitrarily interchangeable. On the other hand, assemblies may include structures, and vice versa.

[0011] A preferred application of the present invention is differential signal transmission. Therefore, at least two of the contacts preferably define at least one differential signal pair. Preferably, the signal transmission according to the present invention can be performed at at least 100 Gbps, most preferably at least 200 Gbps, per differential signal pair. According to the present invention, a high-speed cable assembly (preferably a high-speed copper cable assembly) may be provided.

[0012] Preferably, pulse amplitude modulation (PAM) can be used for signal transmission according to the present invention, and can be used, for example, according to standards PAM2 (also known as "non-return-to-zero," NRZ), PAM4, PAM5, PAM6, PAM7, PAM8, or also according to PAM16. On the other hand, any other modulation or signal transmission technique may also be applicable.

[0013] Preferably, the assembly or structure can be used to be directly mated on a packaging substrate, such as a printed circuit board, the surface of an integrated circuit die, or the surface of a package substrate. On the other hand, the present invention can also be used in any other contact application where no external force (e.g., a compression plate or similar) is required for mating between the preferably planar contacts and their respective mating contacts, particularly for surface arrangement. Most preferably, the present invention can be used in applications of co-packaged copper (CPC).

[0014] For example, the present invention can be used directly in a data center for high-speed data transmission between two integrated circuits, or between an integrated circuit and an I / O connector on the front panel of a rack (this type of connection is sometimes referred to as a "cable host"). Overall, the present invention is particularly advantageous for directly transmitting data at high data rates back and forth between packages / integrated circuits. However, the use of the present invention is not limited to the aforementioned applications.

[0015] Preferably, according to the present invention, as will be described later, signals may be differentially transmitted via a twinaxial cable (twinaxial cable).

[0016] In particular, when considered together with the accompanying drawings, other objects, advantages, and embodiments of the present disclosure will become apparent from the following detailed description.

Brief Description of the Drawings

[0017] [Figure 1] Shows details of the first embodiment of the assembly according to the present disclosure. [Figure 2] Shows details of the second embodiment of the assembly according to the present disclosure. [Figure 3] Shows details of the third embodiment of the assembly according to the present disclosure. [Figure 4A] Shows the fourth embodiment of the assembly according to the present disclosure. [Figure 4B] Shows the fourth embodiment of the assembly according to the present disclosure. [Figure 4C] Shows the fourth embodiment of the assembly according to the present disclosure. [Figure 4D] Shows the fourth embodiment of the assembly according to the present disclosure. [Figure 5] Shows the fifth embodiment of the assembly according to the present disclosure. [Figure 6] Shows the sixth embodiment of the assembly according to the present disclosure. [Figure 7A] Shows the seventh embodiment of the assembly according to the present disclosure. [Figure 7B] Shows the seventh embodiment of the assembly according to the present disclosure. [Figure 7C] Shows the seventh embodiment of the assembly according to the present disclosure. [Figure 8] Shows the eighth embodiment of the assembly according to the present disclosure. [Figure 9A] Shows the ninth embodiment of the assembly according to the present disclosure. [Figure 9B] Shows the ninth embodiment of the assembly according to the present disclosure.

Modes for Carrying Out the Invention

[0018] Various embodiments of this disclosure and various embodiments of the claimed invention will be best understood from the following detailed description, particularly in conjunction with the accompanying drawings, with respect to both structure and operation.

[0019] Before clarifying these embodiments shown in the figures, we will first describe the various embodiments of this disclosure from a general perspective.

[0020] This disclosure teaches assemblies and structures. An assembly may be a contact assembly, for example, a contact assembly for use in an electrical connector or probe. Similarly, an assembly may constitute (part of) an electrical connector or probe. A structure may be a contact structure, for example, a contact structure for use in an electrical connector or probe. Similarly, a structure may constitute (part of) an electrical connector or probe. Hereafter, the term “assembly” will be used primarily. However, the “assembly” may also be understood as the “structure” (as already mentioned above, these terms are interchangeable). The use of “assembly” as the subject matter below is intended solely to facilitate understanding and improve the flow of the text.

[0021] The assembly may include a (first) contact. The assembly may include a second contact. Similarly, the assembly may include a plurality of (first) contacts. For example, the assembly may include at least 10, at least 20, or at least 40 contacts. Similarly, the assembly may include 100 or fewer, 50 or fewer, or one or fewer contacts. Hereafter, the term "that contact" will be used to specify any of the first contact and / or second contact and / or plurality of (first) contacts. (The term "any" will be clarified in the concluding paragraph of this specification.)

[0022] The contact may be conductive. The contact may be called an electrical contact. The contact may consist of at least one metallic material. The metallic material may be a metal or a metallic alloy. The contact is 105 It may exhibit a volume resistivity of less than Ω·cm. For example, the contact may exhibit greater conductivity than lead. More specifically, the conductivity at 20°C between any two points belonging to the contact may be greater than the conductivity at 20°C between the corresponding two points of a lead component having the same shape as the contact.

[0023] An assembly may include at least one guide, for example, multiple guides (note that a “structure” may also include guides, but a structure does not necessarily have to include guides). Hereafter, the term “that guide” will be used to specify any of the at least one guide. Any individual guide may include one individual contact of each of the (first) multiple contacts. Any individual guide and any individual contact of the (first) multiple contacts may form a single element. Such a single element may, in general, exhibit, but is not required to exhibit, the characteristics of a guide / contact as described in this disclosure. Such a single element may be (virtually) divisible into two sub-elements, one of which may exhibit the characteristics of a guide as described in this disclosure, and the other of which may exhibit the characteristics of a contact as described in this disclosure. Such a single element may, in general, be excluded from the set “each contact” and / or the set “each guide”.

[0024] The guide may be conductive. The guide may consist of at least one metallic material. The metallic material may be a metal or a metallic alloy. In particular, the guide may consist of the same at least one metallic material as the contact. The guide is 10 5 The guide may exhibit a volume resistivity of less than Ω·cm. For example, the guide may exhibit greater conductivity than lead. More specifically, the conductivity at 20°C between any two points belonging to the guide may be greater than the conductivity at 20°C between the corresponding two points of a lead component having the same shape as the guide.

[0025] In the case of a probe, that is, an assembly forming (part of) a probe, the assembly may include one or fewer contacts and two or fewer guides. For example, the assembly may include a first contact, a first guide, and a second guide. Similarly, the assembly may include two or fewer contacts and two or fewer guides. For example, the assembly may include a first contact, a second contact, a first guide, and a second guide. Furthermore, even in the case of a probe, the assembly may include at least one contact and at least one guide. For example, the assembly may include three, four, or five contacts and a first guide. Similarly, the assembly may include three, four, or five contacts, a first guide, and a second guide. Three contacts may form two reference contacts and one signal contact in a GSG (ground, signal, ground, ground, earth, signal, earth) configuration. Four contacts may form two reference contacts and two signal contacts in a GSSG (ground, signal, signal, ground, earth, signal, signal, earth) configuration. The five contacts may consist of two reference contacts and three signal contacts in a GSSSG (ground, signal, signal, signal, ground) configuration. For example, as described below, the reference contacts may electrically contact a reference conductor. For example, as described below, the individual signal contacts may electrically contact signal conductors. The (first / second) guides may be electrically insulated from the contacts and / or from any other conductive parts of the assembly. Note that the contacts may generally be arranged similarly in any other topology (e.g., a GSSGSSG topology).

[0026] The contact may be a long contact. The length of the contact may be at least 5 times, at least 10 times, or at least 15 times the width of the contact. The width of the contact may be at least 2 times, at least 5 times, or at least 10 times the thickness of the contact. Similarly, the width of the contact may be at least 0.25 times, at least 0.5 times, or at least 1.0 times the thickness of the contact (and less than 0.5 times, less than 1.0 times, less than 2 times, or less than 5 times the thickness of the contact). The length of the contact may be the length of the longest side of a smallest-dimension virtual rectangular parallelepiped surrounding the contact. Similarly, the length of the contact may be the length of a side of a virtual rectangular parallelepiped that is (nearest) parallel to the (main) signal propagation direction through the contact. Similarly, the length of the contact may be the length of a side of a virtual rectangular parallelepiped that is (nearest) parallel to a virtual line from a first part of the contact that contacts a conductor, for example by welding or soldering, to a second part of the contact that is furthest from the first part. The thickness of the contact may be the length of the shortest side of the virtual rectangular prism. The thickness of the contact may be the length of the side of the virtual rectangular prism perpendicular to the main surface of the guide (closest to the main surface of the guide). Similarly, the thickness of the contact may be the length of the side of the virtual rectangular prism perpendicular to the plane intersecting each of the (first) multiple contacts, for example, the plane of the common layer (as described below) (closest to the plane of the common layer). The width of the contact may be the length of the side of the virtual rectangular prism perpendicular to the side defining the length of the contact and perpendicular to the side defining the thickness. The contact may have the shape of a rectangular prism. The contact may have a shape that satisfies at least 80%, at least 90%, or at least 95% of the virtual rectangular prism. The length of the contact may be less than 20 mm, less than 15 mm, less than 10 mm, less than 5 mm, or less than 2 mm. The width of the contact may be less than 1 mm, less than 0.5 mm, less than 0.2 mm, or less than 0.1 mm. The thickness of the contact may be less than 1 mm, less than 0.5 mm, less than 0.2 mm, or less than 0.1 mm. The teachings in this paragraph apply to, but are not limited to, a contact in an unbent state.

[0027] In the case of a probe, the contact may exhibit any of the characteristics described in the preceding paragraph. Similarly, the contact may have a certain tip width. This tip width may be the size of the contact at its (distal) tip in a direction perpendicular to the length (or side defining the length) and thickness (or side defining the thickness) of the contact. The tip width may be less than 1 mm, less than 0.5 mm, less than 0.2 mm, or less than 0.1 mm. The tip width may be less than 1 / 10, less than 1 / 20, or less than 1 / 40 of the width of the contact. The contact may have the shape of a three-sided right-angled prism. The contact may have a shape that satisfies at least 80%, at least 90%, or at least 95% of a hypothetical three-sided right-angled prism of the minimum dimensions surrounding the contact.

[0028] The guide may be a plate-shaped guide. The length of the guide may be at least twice, at least five times, or at least ten times the thickness of the guide. The width of the guide may be at least twice, at least five times, or at least ten times the thickness of the guide. The thickness of the guide may be the length of the shortest side of a smallest-dimension virtual rectangular parallelepiped surrounding the guide. The thickness of the guide may be the length of the side of a virtual rectangular parallelepiped perpendicular to the main surface of the guide (closest to the main surface of the guide). Similarly, the thickness of the guide may be the length of the side of a virtual rectangular parallelepiped perpendicular to a plane intersecting each of the (first) multiple contacts, for example, the plane of a common layer (as described below) (closest to the plane of the common layer). The length of the guide may be the length of the longest side of a virtual rectangular parallelepiped surrounding the guide. Similarly, the length of the guide may be the length of the side of a virtual rectangular parallelepiped Similarly, the length of the guide may be the length of a side of a virtual rectangular prism parallel to (the closest) the imaginary line from the first part of the guide that contacts the conductor, for example by welding or soldering, to the second part of the guide that is furthest from the first part. The width of the guide may be the length of the third side of the virtual rectangular prism surrounding the guide, perpendicular to the side of the virtual rectangular prism surrounding the guide that defines the length of the guide, and perpendicular to the shortest side of the virtual rectangular prism surrounding the guide. The minimum thickness of the guide, measured in a direction parallel to the thickness of the guide, may be at least 80%, at least 90%, or at least 95% of the thickness of the guide. The thickness of the guide may be less than 1 mm, less than 0.5 mm, less than 0.2 mm, or less than 0.1 mm. The teachings in this paragraph apply to, but are not limited to, guides in an uncurved state.

[0029] In the case of a probe, the guide may exhibit any of the characteristics described in the preceding paragraph. Similarly, the guide may have a certain tip width. This tip width may be the size of the guide at its (distal) tip in a direction perpendicular to the length (or side defining the length) and thickness (or side defining the thickness) of the guide. The tip width may be less than 1 mm, less than 0.5 mm, less than 0.2 mm, or less than 0.1 mm. The tip width may be less than 1 / 10, less than 1 / 20, or less than 1 / 40 of the width of the guide. The guide may have the shape of an approximately three-sided right-angled prism. The guide may have a shape that satisfies at least 70%, at least 80%, at least 90%, or at least 95% of a hypothetical three-sided right-angled prism of the minimum dimensions surrounding the guide.

[0030] The thickness of the guide may match the thickness of the contact. The thickness of the guide may be greater than 80%, greater than 90%, or greater than 95% of the thickness of the contact. The thickness of the guide may be less than 120%, less than 110%, or less than 105% of the thickness of the contact. The length of the guide may match the length of the contact. The length of the guide may be greater than 80%, greater than 90%, or greater than 95% of the length of the contact. The length of the guide may be less than 120%, less than 110%, or less than 105% of the length of the contact. The width of the guide may be at least four times, at least six times, at least eight times, or at least ten times the width of the contact. The teachings in this paragraph apply to, but are not limited to, the unbent state of the guide and contact.

[0031] The thickness or height of the assembly or structure (particularly with respect to the mated connector) is preferably at most 5.5 mm, and most preferably at most 4.0 mm. The thickness / height may vary depending on the number of rows of contacts, and therefore the number of differential signal pairs, as described later (for example, a height of less than 4.0 mm may be achieved for 16 differential signal pairs, while a height of less than 5.2 mm may be achieved for 32 differential signal pairs).

[0032] The contacts and guides may include a portion belonging to a common material layer. For example, a portion of each contact / guide may belong to a common material layer, for example, the material layer forming a portion of each contact and each guide, individually for each contact and each guide. The entire contact and guide may belong to a common material layer. The common material layer may form the entire contact and guide. The common material layer may be a conductive material layer, for example, a metal layer. The contacts and guides may be made of a first material, for example, a metal. The contacts and guides may be made of a homogeneous material. The contacts and guides may be machined from a single continuous unit of (homogeneous) material, for example, by a subtractive machining process. For example, the contacts and guides may be cut and / or punched and / or etched from a single continuous unit of (homogeneous) material. The single continuous unit of (homogeneous) material may be a sheet of (homogeneous) material. A single continuous unit of (homogeneous) material may be a (single) layer of (homogeneous) material, for example, a (single) layer of the first (homogeneous) material provided on a substrate different from the first material. Contacts and guides may be manufactured, for example, by additive and / or subtractive manufacturing processes, or by a combination of additive and subtractive manufacturing processes, so that the contacts and guides are part of a single (single) layer of (homogeneous) material. For example, using an additive manufacturing process, contacts and guides may be formed by depositing material, such as metal, (exclusively) on an area of ​​the (substrate) surface corresponding to the (overall) shape of the contacts and guides. More specifically, using an additive manufacturing process, the first material may be deposited (exclusively) within each of several separate regions on a substrate (different from the first material). Each separate region may constitute each individual contact / guide (after separation from the substrate). Alternatively, multiple separate regions may be processed by at least one other (addition and / or subtraction) process to form contacts and / or guides. Similarly, an additive manufacturing process may be used to deposit a (homogeneous) layer of the first material onto a substrate (different from the first material).The contacts and guides may be machined from a (homogeneous) layer of the first material, for example, by cutting and / or punching and / or etching. This paragraph refers to "contacts and guides" in a broad sense, meaning "(the first contact and / or at least one of the (first) plurality of contacts) and / or at least one of the at least one guide," but this paragraph also applies in a narrow sense, meaning "a particular one of the first contact and at least one guide" or "a particular one of the (first) plurality of contacts and a particular one of the at least one guide."

[0033] As mentioned above, the assembly may include at least one (each) material layer. For simplicity, at least one material layer may be called a “stack”. At least one material layer may form a stack. Similarly, any of at least one layer may be stacked. A stack may include at least two layered materials. For example, the assembly may include stacks of at least two different conductive materials, or a stack of a non-conductive material and at least one conductive material. Thus, in this disclosure, the term “stack” may be understood to include at least two layered materials, but is not necessarily so. Any individual layer of a stack, for example, a separate layer, may be placed (in contact with) any other individual layer of the stack, for example, such that the main surface (of all) of the individual layer is in contact with the main surface (of all) of the other layer. The material of any layer of a stack may be a conductive material, for example, a metal or a metal alloy. The conductive material is 10 5 It may exhibit a volume resistivity of less than Ω·cm. The stack may include at least one layer of a nonconductive material having a higher modulus of elasticity, particularly Young's modulus, than that of a nonconductive material such as copper. The nonconductive material is 10 9The volume resistivity may exceed Ω·cm. The material of any individual layer may differ (macroscopically) from the material of each adjacent layer. For example, the material of any individual layer may exhibit a volume resistivity that differs from the volume resistivity of at least one adjacent layer by at least 1.2 times, at least 1.5 times, at least 2 times, or at least 5 times. Similarly, the material of any individual layer may exhibit a yield strength and / or modulus, e.g., Young's modulus, that differs from the yield strength / modulus of at least one adjacent layer by at least 1.2 times, at least 1.5 times, at least 2 times, or at least 5 times. For example, one layer may be a highly conductive material, e.g., copper, and another (adjacent) layer may be a conductive material exhibiting a high modulus, e.g., tungsten carbide. The material of any individual layer may be (macroscopically) homogeneous. Any individual layer of the stack, e.g., separate layers, may be (macroscopically) flat material layers. Similarly, any layer of the stack may be arranged in a (macroscopically) flat configuration. Any (individual) layer of the stack may be (macroscopically) flat in the sense that a hypothetical minimum-dimension rectangular parallelepiped surrounding the entire (each) layer has two principal faces and four secondary faces, and the surface area of ​​one principal face is at least 10 times, at least 20 times, at least 50 times, or at least 100 times larger than the surface area of ​​the largest secondary face. Similarly, any (individual) layer of the stack may be (macroscopically) flat in the sense that the total volume of the material in each layer (at least 90% or at least 95%) may be represented by a hypothetical set of identical parallel planar cross-sections (where "identical" may refer only to the shape of the cross-section without impairing other features of the cross-section). The material of any (individual) layer of the stack may be structured as a result of processing (e.g., as a result of additive and / or subtractive manufacturing processes, or by a combination of additive and subtractive manufacturing processes) during the manufacture of the assembly. For clarity, the term "stack" may refer to the material as it is ultimately formed and constituted by post-processing in the finished assembly. Similarly, the term “stack” may refer to materials of a different shape and / or composition from the finished assembly.For example, a material processed to obtain a stack may have the structure and / or configuration of the stack as described above, for example, at the start of processing or in an intermediate state during processing. For simplicity, this disclosure uses the term “unfinished stack” to specify a material having the structure and / or configuration of the stack as described above, but this material requires additional processing to achieve the structure and / or configuration of the stack in a finished assembly. The material of any (individual) layer of the stack may be structured to become a plurality of separate units, for example, by additive and / or subtractive manufacturing processes, or by a combination of additive and subtractive manufacturing processes, where each individual unit contains a volume portion of each layer of the stack. For example, an unfinished stack may be processed, for example, by a combination of additive and subtractive manufacturing processes, so that each individual unit contains a volume portion of each layer of the (unfinished) stack. The plurality of separate units may define the same cross-section as described above. For example, the respective contours of each unit may individually or collectively define the same cross-section as described above. The teachings in this paragraph apply to at least one layer in an uncurved state, but are not limited to an uncurved state.

[0034] As described above, contacts and guides may include a portion belonging to a common material layer. The common material layer may be a material layer belonging to a stack of layered materials. Similarly, the common material layer may be a (single) material layer that makes up the stack. The entire set of contacts and guides may belong to a stack, i.e., to at least one material layer (including a common material layer, e.g., a metal layer). The stack may make up contacts and guides. For example, contacts and guides may collectively consist of a stack (in its entirety). Each contact individually and each guide individually may include, or consist of, their respective volume portions of the stack. Multiple separate units may make up contacts and guides. For example, each unit of multiple separate units may individually make up an individual contact or an individual guide. The contacts and guides may be structured such that, at any point belonging to a partial volume portion of the contacts and guides that constitutes at least 90% or at least 95% of the total volume portion of the material forming the contacts and guides, there exists a virtual plane that intersects each contact and each guide of the contacts and guides. Each such virtual plane may belong to a set of parallel virtual planes. The total volume portion of the material belonging to the intersection of the virtual planes with the contacts and guides may be (macroscopically) homogeneous material. The contacts and guides may be machined from an unfinished stack, for example, by a subtractive machining process, from an assembly (like a sheet) containing at least one material. For example, the contacts and guides may be cut and / or punched and / or etched from an unfinished stack. The unfinished stack may be a (single) sheet of (at least two) layered materials, for example, a multi-sheet material (having two, three, or more). Each of the at least one material in the unfinished stack may correspond individually to the material of the stack. Machining of an unfinished stack may involve shaping the (unfinished) stack into the form of contactors and guides. Machining may also involve deforming the unfinished stack into a stack.The contacts and guides may be manufactured, for example, by additive and / or subtractive manufacturing processes, or by a combination of additive and subtractive manufacturing processes, such that each contact of the contacts and each guide individually contains the same material layer (where “same” may refer only to the order and type of materials without impairing other characteristics of the layer). For example, the contacts and guides may be formed by using an additive manufacturing process to deposit a first material, such as a metal, (exclusively) onto an area of ​​the (substrate) surface corresponding to the (overall) shape of the contacts and guides, and then depositing a second material (exclusively) onto the surface of the first material, but on the same area. More specifically, an additive manufacturing process may be used to deposit a first material (exclusively) in each of several separate regions on a substrate (different from the first material), and then deposit a second material (different from the first material) (exclusively) on top of the first material in each of several separate regions. Each separate region (where the first / second material is exclusively deposited) may form its own individual contact / guide (after separation from the substrate). Alternatively, the several separate regions may be processed by at least one other (additive and / or subtractive) process to form contacts and / or guides. Similarly, an additive manufacturing process may be used to deposit a (homogeneous) layer of the first material on a substrate (different from the first material), and then deposit a (homogeneous) layer of the second material (different from the first material) on top of the first material. The contacts and guides may be machined from the (homogeneous) layers of the first and second materials, for example, by cutting and / or punching and / or etching. The method for manufacturing the contacts and guides may include manufacturing steps that are not inherently related to the manufacture of the contacts and guides. For example, the method for manufacturing the contacts and guides may include a step of separating certain parts of any individual contact and / or guide from all other parts of the contact and guide. The separated parts of each contact and / or guide may then be fixed together (rigidly) by, for example, embedding each contact and / or guide in a non-conductive material. The method for manufacturing the contacts and guides may then include a step of separating the remaining parts of each individual contact and / or guide from all other parts of the contact and guide.This paragraph speaks of "contacts and guides" in a broad sense, meaning "(at least one of the first contacts and / or the (first) plurality of contacts) and / or at least one of the at least one guide," but it also applies more specifically to "a specific one of the first contacts and the at least one guide" or "a specific one of the (first) plurality of contacts and a specific one of the at least one guide." The teachings in this paragraph apply to, but are not limited to, the unbent state of the guides and contacts.

[0035] The assembly may include contact plating. For example, the assembly may include contact plating, such as gold plating, provided on the (distal) contact area of ​​the contact and / or guide. For each of the first contact, the (first) plurality of contacts and at least one guide, the contact plating (if present on each individual contact / guide) may cover less than 10% or less than 5% of the total area of ​​the (outermost) surface of each individual contact / guide.

[0036] The first contact and / or at least one of the (first) plurality of contacts may be rigidly fixed to at least one of the at least one guide. For example, the first contact may be rigidly fixed to one of the at least one guide. Similarly, one of the (first) plurality of contacts may be rigidly fixed to one of the at least one guide. The contacts may be rigidly fixed to the guide and electrically insulated from the guide, for example by a gap and / or non-conductive material (interposed between each contact and each guide). One of the (first) plurality of contacts may be rigidly fixed to (and electrically insulated from) another of the (first) plurality of contacts, for example by a gap and / or non-conductive material (interposed between each contact).

[0037] (The first) The plurality of contacts and / or at least one guide may be divided into sets, particularly into sets each having at least one differential signal pair per set. Preferably, a “set” of contacts is a set of parallel contacts within a common row of contacts (note, however, that two or more rows of contacts each having two or more sets of contacts may be used). The individual contacts and / or guides of any given set may be (rigidly) fixed to any other individual contacts and / or guides of that respective set, for example to all other contacts and / or guides of that respective set, and may not be fixed to contacts and / or guides of any other set. The contacts of any given set may be (at least partially) positioned between two guides to which the contacts are (rigidly) fixed. The guides of any given set may form the outermost elements of an assembly consisting of the guides and / or contacts of that respective set and an integral material (block) that (rigidly) fixes the guides and / or contacts of that respective set. The contacts may be partially embedded within a non-conductive material (block), for example such that a portion of the contact protrudes from the non-conductive material (block). Similarly, the guides may be partially embedded within a non-conductive material (block), for example such that a portion of the guide protrudes from the non-conductive material (block). The non-conductive material may exhibit a volume resistivity greater than 10 9 Ω·cm. For example, the non-conductive material may exhibit an electrical resistivity greater than that of cellulose acetate. More specifically, the electrical resistivity at 20° C. between any two points belonging to the non-conductive material (block) may be greater than the electrical resistivity at 20° C. between the corresponding two points of a cellulose acetate component having the same shape as the non-conductive material (block). The contacts may protrude from the non-conductive material (block) such that the protrusion length of the contacts, for example the maximum size of the protruding portion of the contacts in a direction parallel to the length of the contacts, is less than 5 mm, less than 2 mm, less than 1 mm, less than 0.5 mm or less than 0.2 mm.

[0038] The (first) plurality of contacts may include a first contact, a second contact, and a third contact. The second contact may be located midway between the first and third contacts. For example, the second contact may be located such that at least one virtual line exists from the first to the third contact and intersects the second contact. Similarly, the second contact may be located such that any virtual line from the first to the third contact intersects the second contact. The (first) plurality of contacts may include a fourth contact. The fourth contact may be located midway between the first and third contacts. For example, the fourth contact may be located such that at least one virtual line exists from the first to the third contact and intersects the fourth contact. Similarly, the fourth contact may be located such that any virtual line from the first to the third contact intersects the fourth contact. As mentioned above, each of the first, second, third, and fourth contacts may be electrically insulated from each other by, for example, a gap (interposed between each contact) and / or a non-conductive material. Similarly, the second and fourth contacts may be electrically insulated from each other by, for example, a gap (interposed between each contact) and / or a non-conductive material, while the first and third contacts are electrically connected, for example, by a connection that is included in or not included in an assembly. The gap may be at least 0.01 mm, at least 0.02 mm, at least 0.05 mm, or at least 0.1 mm.

[0039] In the case of a probe, in addition to the features disclosed in the preceding paragraph, the first contact may be located midway between the first guide and the second guide. The second contact, if present, may also be located midway between the first guide and the second guide. For example, the first contact may be positioned such that at least one virtual line exists from the first guide to the second guide and intersects the first (and second) contact. Similarly, the first contact may be positioned such that any virtual line exists from the first guide to the second guide and intersects the first (and second) contact.

[0040] The (first) multiple contacts of the assembly or structure may be provided at pitches of less than 5 mm, less than 2 mm, less than 1 mm, less than 0.5 mm, less than 0.2 mm, less than 0.1 mm, less than 0.05 mm, or less than 0.02 mm. The distance from the first contact to the second contact may be less than 5 mm, less than 2 mm, less than 1 mm, less than 0.5 mm, less than 0.2 mm, less than 0.1 mm, less than 0.05 mm, or less than 0.02 mm. This distance may be the (minimum) distance from the central longitudinal axis of the smallest-dimension virtual cuboid surrounding the first contact to the central longitudinal axis of the smallest-dimension virtual cuboid surrounding the second contact.

[0041] In the case of a probe, in addition to the features disclosed in the preceding paragraph, the first guide, first contact, second contact (if any), and second guide may be provided at pitches of less than 5 mm, less than 2 mm, less than 1 mm, less than 0.5 mm, less than 0.2 mm, less than 0.1 mm, less than 0.05 mm, or less than 0.02 mm. The distance between any two of the first guide, first contact, second contact, and second guide may be less than 5 mm, less than 2 mm, less than 1 mm, less than 0.5 mm, less than 0.2 mm, less than 0.1 mm, less than 0.05 mm, or less than 0.02 mm (note that, as already mentioned above, guides are not necessarily required for the structure). This distance may be measured from the center of the tip of one contact / guide to the center of the tip of another contact / guide.

[0042] The assembly may include at least one conductor. At least one conductor may include a reference conductor. Similarly, at least one conductor may include a signal conductor. For example, at least one conductor may include a first signal conductor and a second signal conductor. The reference conductor and / or (first and / or second) signal conductors are 10 5 The volume resistivity may be less than Ω·cm. The (first and / or second) signal conductors may be electrically insulated from the reference conductor. The assembly may include an insulator that electrically insulates the (first and / or second) signal conductors from the reference conductor. The insulator is 10 9It may exhibit a volume resistivity greater than Ω·cm. The reference conductor may electromagnetically shield at least 80% or at least 90% of the length of the (first and / or second) signal conductors. At least 80% or at least 90% of the length of the (first and / or second) signal conductors may be located inside the reference conductor (through a tubular cavity). For example, at least 80% or at least 90% of the length of the (first and / or second) signal conductors may be located inside the insulator (through a tubular cavity), and at least 80% or at least 90% of the length of the insulator may be located inside the reference conductor (through a tubular cavity). At least 80% or at least 90% of the length of the (first and / or second) signal conductors may be located radially inward of the reference conductor and coaxial with the reference conductor. The (first and / or second) signal conductors may be located radially inward of the reference conductor, in the sense that for each point along at least 80% or at least 90% of the length of the (first and / or second) signal conductors, a virtual plane passing through each point perpendicular to the longitudinal axis of the (first and / or second) signal conductor at each point intersects with the cross section of the reference conductor, and this cross section of the reference conductor defines a closed loop (360°) around the (first and / or second) signal conductors. The reference conductor may be electrically in contact with the first and / or third contacts, for example, inside the non-conductive material (block) or outside the non-conductive material (block), in close proximity to and / or adjacent to it, for example, by welding or soldering (directly). The (first) signal conductor may be electrically in contact with the second contact, for example, inside the non-conductive material (block), for example, by welding or soldering (directly). (2) The signal conductor may be electrically in contact with the fourth contact, for example, at a location inside a non-conductive material (block), or it may be welded or soldered (directly), for example. The reference conductor, signal conductor and insulator may collectively form a coaxial cable capable of transmitting signals via the signal conductor at frequencies above 1 GHz, above 5 GHz, above 10 GHz, or above 50 GHz. The reference conductor may form the outer conductor of the coaxial cable, and the signal conductor may form the inner conductor of the coaxial cable.The reference conductor, first signal conductor, second signal conductor, and insulator may collectively form a twin-axis cable capable of transmitting signals via the first and second signal conductors at frequencies above 1 GHz, above 5 GHz, above 10 GHz, or above 50 GHz. The reference conductor, first signal conductor, second signal conductor, third signal conductor, and insulator may collectively form a tri-axis cable capable of transmitting signals via the first, second, and third signal conductors at frequencies above 1 GHz, above 5 GHz, above 10 GHz, or above 50 GHz. The reference conductor may constitute the outer conductor of the twin-axis cable, and the first / second / third signal conductors may constitute the first / second / third inner conductors of the twin-axis / tri-axis cable.

[0043] Generally, the assembly or structure may include multiple twin-axis cables, the conductors of which are connected to the multiple contacts. The diameter of the twin-axis cables may be less than 102 μm. For example, the twin-axis cables may have conductor dimensions smaller than those specified in the American Wire Gauge (AWG) 38 standard, preferably smaller than AWG39, AWG40, AWG41, AWG42, or even smaller. On the other hand, other types and dimensions of cables may also be used within the scope of the present invention.

[0044] In the case of a probe, in addition to the features disclosed in the preceding paragraph, the first signal conductor may be electrically in contact with the first contact, for example, at a location inside the non-conductive material (block), and may be welded or soldered (directly). The reference conductor may be electrically in contact with the first and second guides, for example, at a location inside the non-conductive material (block), and may be welded or soldered (directly). The second signal conductor may be electrically in contact with the second contact, for example, at a location inside the non-conductive material (block), and may be welded or soldered (directly). As mentioned above, the assembly may include three, four, or five contacts in a GSG, GSSG, or GSSSG configuration. The reference conductor may be electrically in contact with the G-contacts of the GSG / GSSG / GSSSG configuration, for example, at a location inside the non-conductive material (block), and may be welded or soldered (directly). The individual S-contacts in a GSG / GSSG / GSSSG configuration may be electrically connected to their respective signal conductors, for example, at a location inside a non-conductive material (block), and may be welded or soldered (directly), for example.

[0045] At least one conductor may include a first conductor and a second conductor. The first and / or second conductors are 10 5 The volume resistivity may be less than Ω·cm. The first conductor may be electrically insulated from the second conductor. The assembly may include an insulator that electrically insulates the first conductor from the second conductor and / or from the surrounding environment of the first conductor. Similarly, the assembly may include an insulator that electrically insulates the second conductor from the surrounding environment of the second conductor. The insulator is 10 9The volume resistivity may exceed Ω·cm. The first conductor may be electrically in contact with the first contact, for example, at a location inside the non-conductive material (block), or it may be welded or soldered (directly). The second conductor may be electrically in contact with the second contact, for example, at a location inside the non-conductive material (block), or it may be welded or soldered (directly). The first and second conductors may form a twisted pair cable capable of transmitting signals through the first and second conductors at frequencies above 1 GHz, above 5 GHz, above 10 GHz, or above 50 GHz. Any individual conductor of at least one conductor may be a conductive trace on a flexible (non-conductive) substrate.

[0046] At least one of the guides may be molded (individually or collectively) to engage (individually or collectively) with a (guide) component, e.g., a socket. In particular, at least one of the guides may be molded (individually or collectively) to engage (individually or collectively) with a (guide) component such that the position of the guide relative to the (guide) component is defined (as a first demarcation) in a direction parallel to a common layer and perpendicular to one of the individual longitudinal axes of the contacts, e.g., a first contact and / or one of the individual longitudinal axes of the (first) plurality of contacts. Similarly, at least one of the guides may be molded (individually or collectively) to engage (individually or collectively) with a (guide) component such that the position of the guide relative to the (guide) component is defined (as a first demarcation) in a direction parallel to one of the individual widths of the contacts (the edges of each virtual rectangular parallelepiped defining that width). The first defining section may define the position of the guide relative to the (guide) component such that the position of the guide relative to the (guide) component is within 0.2 mm, 0.1 mm, 0.05 mm, 0.02 mm, 0.01 mm, or 0.005 mm. Similarly, the first defining section may define the position of the guide relative to the (guide) component such that the range of motion of the guide relative to the (guide) component is 0.2 mm or less, 0.1 mm or less, 0.05 mm or less, 0.02 mm or less, 0.01 mm or less, or 0.005 mm or less. For this purpose, at least one guide(s) may individually / collectively define at least one pair of opposing sides that intersect with (each) virtual straight line parallel to a common layer and perpendicular to one of the individual longitudinal axes of the contactor and / or with (each) virtual straight line parallel to one of the individual widths of the contactor (each side of the virtual rectangular parallelepiped defining the width). The longitudinal axis of a contactor may be the longitudinal axis of the center of a smallest-dimension virtual rectangular prism surrounding each individual contactor. Any of the opposing sides may intersect a virtual line at an angle of less than 60°, less than 45°, less than 30°, less than 20°, less than 10°, or less than 5° from the perpendicular.In embodiments in which the contact is rigidly fixed to the guide, the teachings in this paragraph regarding the position of the guide relative to the (guide) component apply to the position of the contact relative to the (guide) component, with necessary modifications.

[0047] At least one of the guides may be molded (individually or collectively) to engage with the (guide) component such that the position of the contacts with respect to the (guide) component is defined (as a second definition) in a direction parallel to the longitudinal axis of each of the individual contacts, e.g., a first contact and / or a plurality of individual contacts. The second definition may define the position of the guide with respect to the (guide) component with an accuracy of 1 mm or less, 0.5 mm or less, 0.2 mm or less, or 0.1 mm or less. Similarly, the second definition may define the position of the guide with respect to the (guide) component with respect to the (guide) component with respect to a range of motion of 1 mm or less, 0.5 mm or less, 0.2 mm or less, or 0.1 mm or less. In embodiments in which the contacts are rigidly fixed to the guides, the teachings of this paragraph regarding the position of the guides with respect to the (guide) component apply to the position of the contacts with respect to the (guide) component with necessary modifications.

[0048] As stated above, any of at least one guide may be molded to engage with a (guide) component individually. For example, any of at least one guide may include at least one engaging structure, and the (guide) component may include at least one mating engaging structure. Any (individual) engaging structure may engage (in a mating manner) with at least one mating engaging structure. The engaging structure may include pin-shaped areas, peg-shaped areas and / or projections, or may consist of pin-shaped areas, peg-shaped areas and / or projections. Similarly, the engaging structure may include openings, holes, receivers or cavities (for receiving (in a mating manner) the mating engaging structure of the (guide) component). The mating engaging structure may include pin-shaped areas, peg-shaped areas and / or projections, or may consist of pin-shaped areas, peg-shaped areas and / or projections. Similarly, the mating engaging structure may include openings, holes, receivers or cavities (for receiving (in a mating manner) the engaging structure of the guide). The engaging structure and / or the mating engaging structure may have a dovetail, trapezoidal, elliptical, or circular (partial) shape. For example, in the engaged state of the guide and (guide) component, the engaging structure may engage (fit) with the mating engaging structure in such a way that the position of each guide relative to the (guide) component is defined in at least one dimension, for example, within the tolerance range described above. Any individual engaging structure may define each pair of at least one pair of opposing sides. The engaging structure may protrude beyond the thickness of any one individual of the first contact and / or the (first) plurality of contacts. For example, the engaging structure may protrude outside the space between two virtual planes that are coplane with each side of a virtual rectangular parallelepiped and perpendicular to the shortest side of the virtual rectangular parallelepiped. This virtual rectangular parallelepiped is a virtual rectangular parallelepiped of the minimum dimensions surrounding any one individual of the first contact and / or the (first) plurality of contacts. Similarly, the engaging structure may protrude beyond the length of any one individual of the first contact and / or any of the (first) multiple contacts. For example, the engaging structure may protrude out of the space between two virtual planes that are coplane with each side of the virtual cuboid and perpendicular to the longest side of the virtual cuboid.This virtual rectangular parallelepiped is a virtual rectangular parallelepiped of the minimum dimensions surrounding the first contact and / or any one of the (first) multiple contacts. For example, in the engaged state of the guide and (guide) component, the mating engaging structure may protrude into (the interior of) the virtual rectangular parallelepiped.

[0049] As stated above, any of at least one guide may be molded to engage with the (guide) component collectively. For example, at least one guide may protrude beyond the collective width portion of the first contact and / or the (first) plurality of contacts. Any pair of opposing sides may be located within the region of the guide that protrudes beyond the collective width portion of the first contact and / or the (first) plurality of contacts. For example, each opposing side of each pair may be located outside the space between two virtual planes that are coplane with each side of a virtual rectangular parallelepiped and are perpendicular to the direction defining the individual width of the first contact and / or the (first) plurality of contacts. This virtual rectangular parallelepiped is the smallest-dimension virtual rectangular parallelepiped surrounding the first contact and / or the (first) plurality of contacts.

[0050] The assembly or structure may include a second plurality of (conductive) contacts, for example, a plurality of contacts in a planar arrangement on a surface. The surface may be the surface of a printed circuit board (PCB), the surface of an integrated circuit die, or the surface of a package substrate of a package. For example, the second plurality of contacts may consist of a plurality of contact pads and / or (signal, clock, and / or ground) traces located on the surface of a printed circuit board (PCB), the surface of an integrated circuit die, or the surface of a package substrate. The second plurality of contacts may be arranged such that, for at least one individual contact of the first plurality of contacts, each individual contact of the second plurality of contacts contacts only one individual contact of the second plurality of contacts (in a fully engaged state of at least one guide and component). For example, the second plurality of contacts may be arranged such that, for each contact of the first plurality of contacts, each contact contacts only one individual contact of the second plurality of contacts in a fully engaged state of at least one guide and component.

[0051] As mentioned above, at least one of the at least one guide may be molded to engage with a (guide) component, for example, a socket. The (guide) component may be mounted on the surface (of the PCB / die / package substrate). Similarly, the (guide) component may be formed on or integrally with the surface (of the PCB / die / package substrate) by, for example, additive and / or subtractive manufacturing processes. Similarly, the PCB / die / package substrate may constitute a (guide) component. For example, the PCB / die / package substrate may include at least one hole, for example, at least one hole molded to receive at least one portion of a guide, for example, a pin-shaped area, a peg-shaped area and / or projection of the guide. More generally, as mentioned above, the PCB / die / package substrate may define / include a mating engagement structure (suitable to engage (matingly) with at least one engagement structure (at least a portion thereof) of the at least one guide).

[0052] The (guide) component may specify at least one pair of opposite faces. In the engaged state of the guide and (guide) component, any pair of opposite faces may intersect a virtual line parallel to a common layer and perpendicular to any one individual longitudinal axis of any of the (first or second) contacts. The longitudinal axis of each individual contact may be the central longitudinal axis of a minimum-dimension virtual rectangular parallelepiped surrounding each individual contact. In particular, the virtual line (intersecting each individual pair of opposite faces) may be the virtual line (mentioned above) intersecting each individual pair of opposite faces. Any of the opposite faces may intersect the virtual line at an angle of less than 60° from the perpendicular, less than 45° from the perpendicular, less than 30° from the perpendicular, less than 20° from the perpendicular, less than 10° from the perpendicular, or less than 5° from the perpendicular. The engaged state may be a mating engaged state.

[0053] For example, any pair of opposing sides individually / collectively defined by the guide may be molded to engage with each pair of opposite sides defined by the guide, such that the position of the guide relative to the (guide) component (and therefore the position of any contact fixed to this guide) is defined in a direction parallel to a common layer and perpendicular to the longitudinal axis of each individual contact and / or in a direction parallel to the width of each individual contact (the respective sides of the virtual rectangular parallelepiped defining the width of each contact). For example, the first distance between opposing sides of a pair of opposing sides (along the respective virtual straight lines mentioned above) is shorter than the second distance between opposite sides of a pair of opposite sides (along the respective virtual straight lines mentioned above), and the difference between the first and second distances may be 0.2 mm or less, 0.1 mm or less, 0.05 mm or less, 0.02 mm or less, 0.01 mm or less, or 0.005 mm or less. At least one guide and / or (guide) component may include at least one (second) tapered portion that defines the engagement action of the guide to the (guide) component, for example, restricting the engagement action to an increasingly narrow range as the degree of engagement (engaged state relative to unengaged state) increases. The guide and / or (guide) component may include at least one other structure that defines the engagement action of the guide to the (guide) component, for example together with the (second) tapered portion. The (second) tapered portion (and at least one other structure) may define the engagement action such that the guide is guided by the (second) tapered portion during the engagement action to the (mating) engaged state. Similarly, the (second) tapered portion (and at least one other structure) may define the engagement action such that each (individual) pair of opposing sides is guided to be located (to) midway between each (individual) pair of opposite sides (in the engaged state of the guide and (guide) component).

[0054] (In the engagement state of the parts and guides, the assembly may be structured such that each individual contact of the first plurality of contacts contacts one individual contact of the second plurality of contacts.

[0055] The assembly may include a housing. The housing may be a single-member housing or a multi-member housing, i.e., a housing comprising at least two housing components (collectively forming the housing). Any two (or more) of the at least two housing components may be structured to snap-fit ​​and / or snug-fit (e.g., with respect to shape and / or material). The housing and / or any housing components may be a conductive material, e.g., tinplate; an electrical insulating material, e.g., plastic; or an aggregate of at least one conductive material and at least one electrical insulating material. The conductive material is 10 5 The material may exhibit a volume resistivity of less than Ω·cm. The electrical insulating material is 10 9 The material may exhibit a volume resistivity greater than Ω·cm. The contacts and guides may be supported elastically with respect to the housing, for example, via any of at least one conductor and / or by a cable including any of at least one conductor and / or by a flexible substrate including any of at least one conductor. For example, the contacts and guides may be supported elastically with respect to the housing, for example, via any of a first conductor, a second conductor, a reference conductor, a (first) signal conductor and / or a (second) signal conductor.

[0056] The housing may include at least one first guide structure. The housing may be structured to engage (fit) with a (guide) component. The (guide) component may include at least one first mating guide structure. For example, in the (full) engaged state of the housing and the (guide) component, the first guide structure may function (together with the first mating guide structure) to provide a first degree of alignment (in one, two, or three dimensions) between the housing and the (guide) component. The first guide structure and / or the first mating guide structure may include at least one (first) tapered portion that defines the engagement motion of the housing with respect to the (guide) component, for example, restricting the engagement motion to an increasingly narrow range as the degree of engagement (engaged state relative to unengaged state) increases. For example, the maximum range of motion allowed by a first degree of alignment (in one, two, or three dimensions) between the housing and the (guide) component in the (fully) engaged state of the housing and the (guide) component may be less than 1 mm, less than 0.5 mm, less than 0.2 mm, or less than 0.1 mm.

[0057] For example, in the fully engaged state of the guide and the guide component, any of at least one of the guides may function (together with the guide component) to provide a second degree of alignment (in one, two, or three dimensions) between the first plurality of contacts and the second plurality of contacts. The second degree of alignment may be a higher degree of alignment than the first degree of alignment. For example, the second degree of alignment may limit the range of motion of the first plurality of contacts relative to the second plurality of contacts (at least in one dimension, for example, in a direction parallel to any one width of any individual contact (a side of a virtual rectangular parallelepiped defining that width) and / or in a direction parallel to a common layer and perpendicular to the individual longitudinal axis of each contact) to 70%, 50%, 20%, or 10% of the range of motion that the first degree of alignment restricts the housing to the guide component (in each dimension / direction). The second degree of alignment may define the range of motion of the first plurality of contacts relative to the second plurality of contacts (in the direction parallel to any one individual width of the contacts (the edge of the virtual rectangular parallelepiped defining that width) in each one-dimensional, two-dimensional, or three-dimensional, for example, in the direction parallel to the common layer and perpendicular to one individual longitudinal axis of the contacts (less than 20°, less than 10°, or less than 5° from the perpendicular)) as 0.2 mm or less, 0.1 mm or less, 0.05 mm or less, 0.02 mm or less, 0.01 mm or less, or 0.005 mm or less. The second degree of alignment may define the range of motion of the first plurality of contacts relative to the second plurality of contacts in the direction parallel to one individual longitudinal axis of the contacts as 1 mm or less, 0.5 mm or less, 0.2 mm or less, or 0.1 mm or less.

[0058] At least one conductor may be grouped to form one, two, three, four, or more sets of conductors. Similarly, as already mentioned above, contacts may be grouped to form sets. Each row of contacts or conductors preferably includes at least one of the sets. Each set preferably defines at least one differential signal pair. At least one conductor may be grouped so that the contacts (welded or soldered to each conductor, or otherwise electrically in contact with each conductor) are grouped so that they form parallel sets of one, two, three, four, or more sets of contacts, i.e., parallel rows of one, two, three, four, or more rows of contacts. Similarly, a second set of contacts may be grouped so that they form parallel sets of one, two, three, four, or more sets of contacts, i.e., parallel rows of one, two, three, four, or more rows of contacts. The distance from the distal tip of a contact belonging to one set / row to the distal tip of a contact belonging to another set / row may be at least twice, at least five times, at least ten times, or at least twenty times the pitch of the contacts belonging to one or another set / row. Similarly, the distance from the distal tip of a contact belonging to one set / row to the distal tip of a contact belonging to another set / row may be at least twice, at least five times, at least ten times, or at least twenty times the (minimum) distance from the central longitudinal axis of the smallest-dimension virtual cuboid surrounding the contacts of one set / row to the central longitudinal axis of the smallest-dimension virtual cuboid surrounding the neighboring contacts of one set / row. Any individual block of the integral material that (rigidly) fixes the set of guides and / or contacts may support one, two, three, four or more rows of contacts in parallel. For example, in an assembly containing four parallel rows of contacts, the first material block may support two parallel rows of contacts, and the second material block may support another two parallel rows of contacts.Similarly, in an assembly containing, for example, two parallel rows of contacts, the first material block may support one row of parallel contacts, and the second material block may support another row of parallel contacts. Likewise, in an assembly containing, for example, four parallel rows of contacts, a single material block may support all four parallel rows of contacts.

[0059] As already mentioned, the multiple contacts may include multiple differential signal pairs. The center-to-center distance between at least two adjacent differential signal pairs (preferably adjacent differential signal pairs in the same row) may be less than 1.1 mm, preferably at most 1.0 mm, most preferably at most 0.9 mm, at most 0.8 mm, or at most 0.7 mm.

[0060] As already mentioned, at least one differential signal pair of two of the plurality of contacts may be generated. Preferably, the assembly or structure includes at least four differential signal pairs, most preferably at least eight differential signal pairs, at least twelve differential signal pairs, at least sixteen differential signal pairs, at least twenty differential signal pairs, at least twenty-four differential signal pairs, at least twenty-eight differential signal pairs, or at least thirty-two differential signal pairs.

[0061] Multiple contacts may be distributed across multiple columns. The “columns” may be equal to the “sets” (and therefore the features and advantages describing a “set” may also apply to a “column” and vice versa), but may also describe other types of partial quantities of multiple contacts.

[0062] Preferably, each row or set includes exactly one differential signal pair, for example in a GSSG (ground, signal, signal, ground) configuration. Alternatively, each row or set may also include two or more differential signal pairs (even in any configuration), for example, two, three, four, five, six or more differential signal pairs.

[0063] The distance between two adjacent rows or sets may be greater than the maximum pitch of contacts within each row by, for example, at least 1.5 times, at least 2 times, at least 2.5 times, at least 3 times, or at least 3.5 times.

[0064] Multiple contacts may be distributed across multiple rows. Each row preferably contains at least one, preferably two or more, columns, for example, two, three, four, five, six, or more. The distance between two adjacent rows may be greater than the maximum pitch of contacts within each row. The distance between two adjacent rows may be at most 2.5 mm, preferably at most 2.0 mm, most preferably at most 1.5 mm, for example, at most 1.4 mm, 1.3 mm, 1.2 mm, 1.1 mm, 1.0 mm, 0.9 mm, 0.8 mm, 0.7 mm, 0.6 mm, 0.5 mm, or less.

[0065] Therefore, most preferably, the contacts may be distributed across multiple columns and rows, for example, such that each row contains multiple differential signal pairs.

[0066] The contacts of any individual row may be arranged to form groups, for example, groups of three or four contacts. For example, the first, second, and third contacts may form a contact group. Similarly, the first, second, third, and fourth contacts may form a contact group. The minimum distance between one contact group and another neighboring contact group may be at least four times, at least eight times, or at least ten times the minimum distance between any two contacts in one contact group (and at least four times, at least eight times, or at least ten times the minimum distance between any two contacts in the other contact group).

[0067] This disclosure teaches a method, which may be a manufacturing method, for example, a method for manufacturing an assembly or structure as described above. Similarly, this method may be a method for manufacturing a probe as described above.

[0068] The method may include the step of manufacturing a first plurality of contacts, for example, as described above. Similarly, the method may include the step of manufacturing at least one guide, for example, as described above. A method for manufacturing a first plurality of contacts and / or at least one guide may include the step of cutting the first plurality of contacts and / or at least one guide from a single metal sheet or from a stack of (at least two) layered materials. Similarly, a method for manufacturing a first plurality of contacts and / or at least one guide may include the step of etching the first plurality of contacts and / or at least one guide from a single metal layer or from a stack of (at least two) layered materials. Similarly, a method for manufacturing a first plurality of contacts and / or at least one guide may include the step of forming the first plurality of contacts and / or at least one guide by depositing at least one material onto a surface area corresponding to the shape of the first plurality of contacts / at least one guide, for example, by an additive manufacturing process.

[0069] The method may include, for example, the step of forming an electrical contact, as described above, between a reference conductor and at least one of the first contact and the third contact. Similarly, the method may include, for example, the step of forming an electrical contact, as described above, between a (first) signal conductor and a second contact. Similarly, the method may include, for example, the step of forming an electrical contact, as described above, between a (second) signal conductor and a fourth contact. The method may include, for example, the step of forming an electrical contact, as described above, between a first conductor and a first contact. Similarly, the method may include, for example, the step of forming an electrical contact, as described above, between a second conductor and a second contact.

[0070] This method may include, for example, the step of providing a second plurality of contacts, as described above, in a planar arrangement on a surface.

[0071] This method may include, for example, the step of providing a housing as described above.

[0072] Various embodiments of this disclosure have been described above from a general perspective; next, we will clarify the embodiments shown in the figures.

[0073] Figure 1 shows a schematic diagram illustrating the details of a first embodiment of the assembly 100 according to this disclosure, such as the one described above.

[0074] More specifically, Figure 1 shows four contactors 110 and one guide 120 of the assembly 100 in an unbent state. In the illustrated embodiment, the assembly 100 includes a stack 130 comprising a first layer 132 of a first material and a second layer 134 of a second material. Each of the contactors 110 includes each portion 112 of the first layer 132 and each portion 114 of the second layer 134. Similarly, the guide 120 includes each portion 122 of the first layer 132 and each portion 124 of the second layer 134. A first virtual line 102 represents a line in a first virtual plane that intersects each of the contactors 110 and the guide 120, and the total volume portion of material belonging to the intersection of the first virtual plane with the contactors 110 and the guide 120 is the first material. The second virtual line 102' represents a line (parallel to the first plane) in the second virtual plane that intersects each of the contactors 110 and the guide 120, and the total volume portion of the material belonging to the intersection of the second virtual plane with the contactors 110 and the guide 120 is the second material.

[0075] Figure 2 shows a schematic diagram of the details of a second embodiment of the assembly 200 according to this disclosure, such as the one described above.

[0076] More specifically, Figure 2 shows the four contacts 210 and one guide 220 of the assembly 200 in an unbent state. In the illustrated embodiment, the assembly 200 includes a stack 230 comprising a single material layer 232. Each of the contacts 210 includes a respective portion 212 of the layer 232. The guide 220 similarly includes a respective portion 222 of the layer 232.

[0077] Figure 3 shows a schematic diagram of the details of a third embodiment of the assembly 300 according to this disclosure, such as the one described above.

[0078] More specifically, Figure 3 shows the assembly 300 with four contacts 310 and one guide 320 in an unbent state. In the illustrated embodiment, the assembly 300 includes a non-conductive material block 304 that rigidly fixes each contact 310 to each other and to the guide 320. Each of the contacts 310 is partially embedded within the non-conductive material block 304 such that a portion 315 of each contact 310 protrudes from the non-conductive material block 304. Similarly, the guide 320 is partially embedded within the non-conductive material block 304 such that a portion 325 of the guide 320 protrudes from the non-conductive material block 304. To illustrate the width and thickness directions, reference numeral w1 indicates the width of one contact 310, reference numeral w2 indicates the width of the guide 320, and reference numeral d indicates the thickness of the guide 320. The thickness of the guide corresponds to the thickness of the contact 310.

[0079] Figures 4A to 4D show a schematic diagram of a fourth embodiment of the assembly 400 according to this disclosure, such as the one described above.

[0080] In the embodiment illustrated in Figures 4A to 4D, the assembly 400 includes a guide component in the form of a first set of multiple contacts 410, 410', a set of multiple guides 420, 420', a housing 440, a set of multiple twin-axis cables 450, 450', and a socket 460 mounted on a printed circuit board 480. The contacts 410, 410' and the guides 420, 420' are elastically supported by the cables 450, 450' within the housing 440. The housing 440 includes a guide structure 446 structured to engage with a mating guide structure 466 of the socket 460. The 32 contacts 410, 410' are grouped to form two sets of contacts. The 16 contacts 410 of the first set are arranged to form the first row 411 of the parallel contacts, and the 16 contacts 410' of the second set are arranged to form the second row 411' of the parallel contacts. Row 411 is parallel to row 411'. The first set of contacts 410 are rigidly fixed to the guide 420 by the first nonconductive material block 404. The second set of contacts 410' (four of which are individually indicated as 410A' to 410D' in Figure 4C) are rigidly fixed to the guide 420' by the second nonconductive material block 404'. The eight twin-axis cables 450, 450' are similarly grouped into two sets of cables. The conductors of the first set of four twin-axis cables 450 are connected to the contacts 410, and the conductors of the second set of four twin-axis cables 450' (individually indicated as 450A' to 450D' in Figure 4C) are connected to the contacts 410'. The printed circuit board 480 includes a second set of contacts 482, 482', which are similarly grouped to form two sets of contacts. The first set of 16 contacts 482 are arranged to form the first row 483 of parallel contacts, and the second set of 16 contacts 482' are arranged to form the second row 483' of parallel contacts. Row 483 is parallel to row 483'. In the (fully) engaged state of the housing 440 and socket 460, the second set of contacts 482, 482' are arranged to individually contact each of the first set of contacts 410, 410'.

[0081] Figures 4B to 4D schematically illustrate the details of the assembly 400 in the fully engaged state of the housing 440 and socket 460. However, many elements of the assembly 400 are not depicted in order to better visualize the detailed features.

[0082] As shown in Figures 4B and 4C, the guides 420' collectively provide a second degree of alignment, engaging the contactor 410' with the socket 460 in such a way that the range of motion of the contactor 410' relative to the contactor 482' (not shown in Figure 4B) is defined in a direction D parallel to a common layer of the guides and contactors and perpendicular to one of the individual longitudinal axes of the contactors.

[0083] Figure 4C is an enlarged and annotated detail of Figure 4B. The second nonconductive material block 404' is drawn in a cutaway section to show further details of the contactor 410', guide 420', and cable 450'. As schematically shown in Figure 4C, the contactor 410' contacts a second set of contactors 482' inside the second nonconductive material block 404'. In particular, the reference conductor 452' of the twin-axis cable 450B' electrically contacts the first contactor 410A' and the third contactor 410C', the first signal conductor 454' of the twin-axis cable 450B' electrically contacts the second contactor 410B', and the second signal conductor 456' of the twin-axis cable 450B' electrically contacts the fourth contactor 410D'. The third contact 410C' and the fourth contact 410D' are located midway between the first contact 410A' and the third contact 410C'. As shown in Figure 4C, the guide 420' forms the outermost element of the assembly consisting of the guide 420', the contact 410' and the second nonconductive material block 404', and at least a portion of each of the contacts 410' in row 483' is located midway between the guides 420' to which the contacts 410' are fixed by the second nonconductive material block 404'.

[0084] As shown in Figure 4D, a second degree of alignment is provided, and the range of motion of the contact 410 relative to the contact 482 (not shown in Figure 4D) is defined in a direction D parallel to a common layer of the guide and contacts and perpendicular to one of the individual longitudinal axes of the contacts, so that the guide 420 engages with the socket 460 collectively.

[0085] Figure 5 shows a schematic diagram of a fifth embodiment of the assembly 500 according to this disclosure, as described above.

[0086] In the embodiment illustrated in Figure 5, the assembly 500 includes a first plurality of contacts 510', a plurality of guides 520', a plurality of cables 550', and guide components in the form of a socket 560 mounted on a printed circuit board 580. The socket 560 includes a mating guide structure 566, which in other embodiments including a housing is structured to engage with a guide structure of the housing. The contacts 510' are arranged to form a row of parallel contacts 511' and are rigidly fixed to the guides 520' by a non-conductive material block 504'. The printed circuit board 580 includes a second plurality of contacts 582, 582', which are grouped to form two sets of contacts. The first set of 16 contacts 582 is arranged to form a first row of parallel contacts 583, and the second set of 16 contacts 582' is arranged to form a second row of parallel contacts 583'. Row 583 is parallel to row 583'. The socket 560 includes tapered sections 564, 564' and other structures having the form of corner sections 565, 565'. The engagement action of the guide 520' with the socket 560 is defined by the tapered section 564' together with the corner section 565'. In the fully engaged state of the socket 560 and the guide 520' rigidly fixed to the contacts 510' as shown in the figure, the contacts 582' are positioned to contact each contact 510' individually.

[0087] Figure 6 shows a schematic diagram of a sixth embodiment of the assembly 600 according to this disclosure, as described above.

[0088] In the embodiment illustrated in Figure 6, the assembly 600 includes a first plurality of contacts and a plurality of guides (not visible), a housing 640, a plurality of cables 650, and a guide component in the form of a printed circuit board (PCB) 680 and a socket 660 mounted on the PCB 680. The housing 640 includes a guide structure 646, which is structured to engage with a mating guide structure 686 in the form of a hole in the PCB 680. The guide structure 646 engages with the mating guide structure 686 and provides a first degree of alignment between the housing 640 and the PCB 680. The guide engages with the socket 660 and provides a second degree of alignment between the first plurality of contacts and a second plurality of contacts 682, 682' provided on the surface of the PCB 680. The contacts 682, 682' are grouped to form two sets of contacts, as in the embodiment of Figure 4. Contact 682 is positioned to form the first row 683 of parallel contacts, and contact 682' is positioned to form the second row 683' of parallel contacts. Rows 683 and 683 are parallel. Cables 650 and 650' are similarly grouped to form two sets of cables, each paired with two rows of contacts.

[0089] Figures 7A to 7C show a schematic diagram of a seventh embodiment of the assembly 700 according to this disclosure, such as the one described above.

[0090] In the embodiments illustrated in Figures 7A to 7C, the assembly 700 includes a first plurality of contacts 710', a plurality of guides 720A', 720B', a plurality of twin-axis cables 750', and a guide component in the form of a printed circuit board (PCB) 780, as well as a socket 760 mounted on the PCB 780. The socket 760 includes a mating guide structure 766, which, in other embodiments including a housing, is structured to engage with the guide structure of the housing to provide a first degree of alignment between the housing and the socket. The contacts 710' (four of which are individually shown as 710A' to 710D' in Figure 7B) are arranged to form a parallel row of contacts 711' and are rigidly fixed to the guides 720A', 720B' by non-conductive material blocks 704'. As shown in the embodiment of Figure 4, the printed circuit board 780 includes a second set of contacts 782, 782', which are grouped into two sets of contacts. The first set of 16 contacts 782 are arranged to form the first row 783 of parallel contacts, and the second set of 16 contacts 782' are arranged to form the second row 783' of parallel contacts. Row 783 is parallel to row 783'. Guides 720A', 720B' include pin-type engagement structures 727', and the PCB 780 includes hole-type mating engagement structures 784, 784'. In the fully engaged state of the engagement structure 727' and mating engagement structure 784' as shown in Figure 7B, the second set of contacts 782' are arranged to individually contact each of the first set of contacts 710'. The engagement between the engaging structure 727' and the mating engaging structure 784' provides a second degree of alignment, defining the range of motion of the contact 710' relative to the contact 782' in a direction parallel to a common layer of the guide and the contact, and perpendicular to one of the individual longitudinal axes of the contacts. The shown embodiment includes two guides 720A', 720B', but one such guide would suffice to provide the second degree of alignment and define the range of motion of the contact 710' relative to the contact 782' in a direction parallel to a common layer of the guide and the contact, and perpendicular to one of the individual longitudinal axes of the contacts.

[0091] In Figure 7B, the non-conductive material block 704' is depicted in a cutaway cross-sectional view, showing further details of the contact 710', guides 720A', 720B', and cable 750'. As schematically shown in Figure 7B, the guide 720A' and contact 710E' form a single element, and the conductors of the twin-axis cable 750' (individually indicated as 750A' to 750D' in Figure 7B) are connected to the contact 710' inside the second non-conductive material block 704'. In particular, the reference conductor 752' of the twin-axis cable 750B' is electrically in contact with the first contact 710A' and the third contact 710C', the first signal conductor 754' of the twin-axis cable 750B' is electrically in contact with the second contact 710B', and the second signal conductor 756' of the twin-axis cable 750B' is electrically in contact with the fourth contact 710D'. The third contact 710C' and the fourth contact 710D' are located midway between the first contact 710A' and the third contact 710C'.

[0092] Figure 7C schematically shows a simplified cross-section along the line 7C-7C in Figure 7B. As shown in Figure 7C, the guide 720B' is soldered by solder 758 to the reference conductor 752A' which shields the two signal conductors 754A' and 756A'. The reference conductor 752A' and the signal conductors 754A' and 756A' form part of the twin-axis cable 750A'. Each of the contacts 710A' and 710C' is soldered by solder 758 to the reference conductor 752' which shields the signal conductors 754' and 756'. The two contacts 710' are soldered by solder 758 to the reference conductor 752C' which shields the two signal conductors 754C' and 756C'. The reference conductor 752C' and the signal conductors 754C' and 756C' form part of the twin-axis cable 750C'. Guide 720A' is soldered by solder 758 to reference conductor 752D', which shields the two signal conductors 754D' and 756D'. Reference conductor 752D' and signal conductors 754D' and 756D' form part of the twin-axis cable 750D'.

[0093] Figure 8 shows a schematic diagram of an eighth embodiment of the assembly according to this disclosure, such as the one described above.

[0094] In the embodiment illustrated in Figure 8, the assembly 800 includes a plurality of contacts 810, a plurality of guides 820, a plurality of cables 850, cable clips 890 for tension relief, and reinforcing members 895. The contacts 810 are arranged to form parallel rows of contacts and are rigidly fixed to the guides 820 by non-conductive material blocks 804. The contacts 810 are further arranged to form four groups of contacts 816, 816', where the minimum distance between a group of contacts 816 and a neighboring group of contacts 816' is at least four times the minimum distance between any two contacts in group of contacts 816 and at least four times the minimum distance between any two contacts in group of contacts 816'.

[0095] Figures 9A and 9B show a schematic diagram of a ninth embodiment of the assembly according to this disclosure, such as the one described above.

[0096] In the embodiment illustrated in Figures 9A and 9B, the assembly 900 includes a first contact 910, a first guide 920A, a second guide 920B, and a cable 950. The first contact 910 is rigidly fixed to the first guide 920A, the second guide 920B, and the cable 950 by a non-conductive material block 904. The first contact 910, the first guide 920A, the second guide 920B, the cable 950, and the non-conductive material block 904 form a probe 970, which has a tip 972 at the respective ends of the first contact 910, the first guide 920A, and the second guide 920B. In the illustrated usage concept, the first guide 920A and the second guide 920B are received in a socket 960 mounted on the surface of a die 988 of an integrated circuit.

[0097] In this disclosure, the verb “may” is used to indicate voluntary / non-compulsory nature. In other words, something like “may” means that it is possible, but not required. In this disclosure, the verb “include” may be understood to mean encompassing. Accordingly, the verb “include” does not exclude the existence of other elements / actions. In this disclosure, related terms such as “first,” “second,” “above,” “below,” and similar terms may be used solely to distinguish one entity or action from another, and do not necessarily require or imply any actual relationship or order between such entities or actions.

[0098] In this disclosure, the term “any” may be understood to express any number of each element, for example, one, at least one, at least two, each or all of each element. Similarly, the term “any” may be understood to express any set of each element, for example, one or more sets of each element. Each set may contain one, at least one, at least two, each or all of each element. Each set does not have to contain the same number of elements.

[0099] In this disclosure, the expression “at least one” is used to specify any (integer) number or range of (integer) numbers (which are technically reasonable in a given context). Thus, the expression “at least one” may be understood as, in particular, 1, 2, 3, 4, 5, 10, 15, 20, or 100. Similarly, the expression “at least one” may be understood as, in particular, “one or more,” “two or more,” or “five or more.”

[0100] In this disclosure, expressions in parentheses may be understood as optional. As used in this disclosure, quotation marks may be used to emphasize that expressions within quotation marks may also be understood figuratively. As used in this disclosure, quotation marks may be used to identify specific expressions being discussed.

[0101] In this disclosure, many features are described as optional, for example, through the use of the verb "may" or the use of parentheses. For the sake of brevity and readability, this disclosure does not explicitly enumerate every possible combination and / or permutation, as well as all possible combinations and / or permutations, that can be obtained by selecting from the set of optional features. However, this disclosure should be interpreted as explicitly disclosing all such combinations / permutations. For example, a system described as having three optional features may be embodied in seven different ways: using only one of the three possible features, using any two of the three possible features, or using all three of the three possible features.

[0102] While various embodiments of the present invention have been disclosed and described in detail herein, it will be apparent to those skilled in the art that various modifications to the structure, operation, and form of the present invention can be made without departing from its spirit and scope. In particular, note that each feature of the present invention, even if disclosed only in combination with other features of the present invention, can be combined in any configuration, except where such combination is meaningless or readily apparent to those skilled in the art. Similarly, the use of singular and plural forms is for illustrative purposes only and should not be considered limiting. Unless explicitly stated otherwise, plural forms may be replaced with singular forms, and vice versa.

Claims

1. The assembled units are (100, 200, 300, 400, 500, 600, 700, 800, 900), The first set of multiple contactors (110, 210, 310, 410, 510, 710, 810, 910), At least one guide (120, 220, 320, 420, 520, 720, 820, 920) and Includes, Each of the at least one guide (120, 220, 320, 420, 520, 720, 820, 920) and the first plurality of contacts (110, 210, 310, 410, 510, 710, 810, 910) includes a portion (112, 212, 114, 122, 222, 124) belonging to a common metal layer (132, 232, 134). An assembly (100, 200, 300, 400, 500, 600, 700, 800, 900) in which each of the first plurality of contacts (110, 210, 310, 410, 510, 710, 810, 910) is rigidly fixed to at least one guide (120, 220, 320, 420, 520, 720, 820, 920).

2. The assembly according to claim 1 (100, 200, 300, 400, 500, 600, 700, 800, 900), The first plurality of contacts (110, 210, 310, 410, 510, 710, 810, 910) and the at least one guide (120, 220, 320, 420, 520, 720, 820, 920) are, Elements cut from a single sheet of metal, Elements cut from a layered material stack (130, 230) in which at least one of the materials is a conductive material, Elements etched from a single metal layer, Elements etched from a layered material stack (130, 230) in which at least one of the materials is a conductive material, and An element formed by depositing at least one material layer (132, 232, 134) containing a conductive material layer onto a surface area corresponding to the shapes of the first plurality of contacts (110, 210, 310, 410, 510, 710, 810, 910) and the at least one guide (120, 220, 320, 420, 520, 720, 820, 920). An assembly (100, 200, 300, 400, 500, 600, 700, 800, 900) consisting of elements selected from a group.

3. The assembly according to claim 1 or 2 (100, 200, 300, 400, 500, 600, 700, 800, 900), The first plurality of contacts (110, 210, 310, 410, 510, 710, 810, 910) include a first contact (410A', 710A'), a second contact (410B', 710B'), and a third contact (410C', 710C'), The second contacts (410B', 710B') are located between the first contacts (410A', 710A') and the third contacts 410C', 710C'. The second contacts (410B', 710B') are electrically insulated from the first contacts (410A', 710A') and the third contacts (410C', 710C') in the assemblies (100, 200, 300, 400, 500, 600, 700, 800, 900).

4. The assembly described in claim 3 (100, 200, 300, 400, 500, 600, 700, 800, 900), The assemblies (100, 200, 300, 400, 500, 600, 700, 800, 900) have a distance from the first contact (410A', 710A') to the second contact (410B', 710B') that is shorter than a distance selected from the group consisting of 5 mm, 2 mm, 1 mm, 0.5 mm, 0.2 mm, and 0.1 mm.

5. An assembly (100, 200, 300, 400, 500, 600, 700, 800, 900) according to any one of claims 2 to 4, Reference conductors (452, 752) and Signal conductors (454, 754, 456, 756) and Includes, The reference conductors (452, 752) electromagnetically shield at least 90% of the length of the signal conductors (454, 754, 456, 756), The signal conductors (454, 754, 456, 756) are electrically insulated from the reference conductors (452, 752). The reference conductor (452, 752) is electrically in contact with at least one of the first contacts (410A', 710A') and the third contacts (410C', 710C'), The signal conductors (454, 754, 456, 756) are in electrical contact with the second contacts (410B', 710B') in the assemblies (100, 200, 300, 400, 500, 600, 700, 800, 900).

6. An assembly according to any one of claims 1 to 5 (100, 200, 300, 400, 500, 600, 700, 800, 900), An assembly (100, 200, 300, 400, 500, 600, 700, 800, 900) is formed such that the positions of the first plurality of contacts (110, 210, 310, 410, 510, 710, 810, 910) relative to a certain component are defined in a direction parallel to the common layer (132, 232, 134) and perpendicular to the longitudinal axis of at least one contact (110, 210, 310, 410, 510, 710, 810, 910) belonging to the first plurality of contacts (110, 210, 310, 410, 510, 710, 810, 910) so as to engage with the component, wherein the positions of the first plurality of contacts (110, 210, 310, 410, 510, 710, 810, 910) relative to a certain component are defined in a direction parallel to the common layer (132, 232, 134) and perpendicular to the longitudinal axis of at least one contact (110, 210, 310, 410, 510, 710, 810, 910) belonging to the first plurality of contacts (110, 210, 310, 410, 510, 710, 810, 910) relative to a certain component are defined in a direction parallel to the common layer (132, 232, 134) and perpendicular to the longitudinal axis of at least one contact (110, 210, 310, 410, 510, 710, 810, 910) relative to the first plurality of contacts (110,

7. The assembly according to claim 6 (100, 200, 300, 400, 500, 600, 700, 800, 900), A second set of contacts (482, 582, 682, 782) in a planar arrangement on the surface. Includes, In the engaged state of the components and the at least one guide (120, 220, 320, 420, 520, 720, 820, 920), each individual contact (110, 210, 310, 410, 510, 710, 810, 910) of the first plurality of contacts (110, 210, 310, 410, 510, 710, 810, 910) contacts one individual contact (482, 582, 682, 782) of the second plurality of contacts (482, 582, 682, 782) of the assembly (100, 200, 300, 400, 500, 600, 700, 800, 900).

8. The assembly according to claim 7 (100, 200, 300, 400, 500, 600, 700, 800, 900), The aforementioned components are, Sockets (460, 560, 760, 960) mounted on the aforementioned surface, Printed circuit boards (480, 580, 680, 780) including the aforementioned surface and, Package substrate of the package, including the aforementioned surface. An assembly (100, 200, 300, 400, 500, 600, 700, 800, 900) selected from the group consisting of the above.

9. The steps include manufacturing a first set of multiple contactors (110, 210, 310, 410, 510, 710, 810, 910) and at least one guide (120, 220, 320, 420, 520, 720, 820, 920), The steps include rigidly fixing each of the first plurality of contacts (110, 210, 310, 410, 510, 710, 810, 910) to at least one guide (120, 220, 320, 420, 520, 720, 820, 920) and A method including, A method wherein each contact (110, 210, 310, 410, 510, 720, 820, 920) of the at least one guide (120, 220, 320, 420, 520, 720, 820, 920) and the first plurality of contacts (110, 210, 310, 410, 510, 710, 810, 910) includes a portion (112, 212, 114, 122, 222, 124) belonging to a common metal layer (132, 232, 134).

10. The method according to claim 9, The aforementioned manufacturing method is, Steps of cutting the first plurality of contacts (110, 210, 310, 410, 510, 710, 810, 910) and the at least one guide (120, 220, 320, 420, 520, 720, 820, 920) from a single metal sheet, The steps of cutting the first plurality of contacts (110, 210, 310, 410, 510, 710, 810, 910) and the at least one guide (120, 220, 320, 420, 520, 720, 820, 920) from a layered material stack (130, 230) in which at least one of the materials is a conductive material, The steps include etching the first plurality of contacts (110, 210, 310, 410, 510, 710, 810, 910) and the at least one guide (120, 220, 320, 420, 520, 720, 820, 920) from a single metal layer, The step of etching the first plurality of contacts (110, 210, 310, 410, 510, 710, 810, 910) and the at least one guide (120, 220, 320, 420, 520, 720, 820, 920) from a layered material stack (130, 230) in which at least one of the materials is a conductive material. Step 1: Form the first plurality of contacts (110, 210, 310, 410, 510, 710, 810, 910) and the at least one guide (120, 220, 320, 420, 520, 720, 820, 920) by depositing at least one material layer including a conductive material layer on a surface area corresponding to the shape of the first plurality of contacts (110, 210, 310, 410, 510, 710, 810, 910) and the at least one guide (120, 220, 320, 420, 520, 720, 820, 920) A method which is a process selected from a group consisting of [a certain set of elements].

11. The method according to claim 9 or 10, The first plurality of contacts (110, 210, 310, 410, 510, 710, 810, 910) include a first contact (410A', 710A'), a second contact (410B', 710B'), and a third contact 410C', 710C', The second contacts (410B', 710B') are located between the first contacts (410A', 710A') and the third contacts (410C', 710C'), A method wherein the second contacts (410B', 710B') are electrically insulated from the first contacts (410A', 710A') and the third contacts (410C', 710C').

12. The method according to claim 11, A method wherein the distance from the first contact (410A', 710A') to the second contact (410B', 710B') is shorter than a distance selected from the group consisting of 5 mm, 2 mm, 1 mm, 0.5 mm, 0.2 mm, and 0.1 mm.

13. A method according to any one of claims 9 to 12, The steps include forming electrical contacts (110, 210, 310, 410, 510, 710, 810, 910) between a reference conductor (452, 752) and at least one of the first contacts (410A', 710A') and the third contacts (410A', 710A'), The steps include forming electrical contacts (110, 210, 310, 410, 510, 710, 810, 910) between the signal conductors (454, 754, 456, 756) and the second contacts (410B', 710B'), and Includes, The reference conductors (452, 752) electromagnetically shield at least 90% of the length of the signal conductors (454, 754, 456, 756), A method wherein the signal conductors (454, 754, 456, 756) are electrically insulated from the reference conductors (452, 752).

14. A method according to any one of claims 9 to 13, A method in which the position of the first plurality of contacts (110, 210, 310, 410, 510, 710, 810, 910) relative to a certain component is defined in a direction parallel to the common layer (132, 232, 134) and perpendicular to the longitudinal axis of at least one contact (110, 210, 310, 410, 510, 710, 810, 910) belonging to the first plurality of contacts (110, 210, 310, 410, 510, 710, 810, 910) such that the at least one guide (120, 220, 320, 420, 520, 720, 820, 920) engages with the component.

15. The method according to claim 14, Steps to provide a second set of contacts (482, 582, 682, 782) in a planar arrangement on a surface. Includes, A method wherein, in the engaged state of the components and the at least one guide (120, 220, 320, 420, 520, 720, 820, 920), each individual contact (110, 210, 310, 410, 510, 710, 810, 910) of the first plurality of contacts (110, 210, 310, 410, 510, 710, 810, 910) contacts one individual contact (482, 582, 682, 782) of the second plurality of contacts (482, 582, 682, 782).

16. The method according to claim 15, The aforementioned components are, Sockets (460, 560, 760, 960) mounted on the aforementioned surface, Printed circuit boards (480, 580, 680, 780) including the aforementioned surface and Package substrate of the package, including the aforementioned surface. A method selected from the group consisting of the following.

17. A probe (970), The first guide (920A), Guide 2 (920B), The first contact (910) is located between the first guide (920A) and the second guide (920B) and Includes, Each of the first guide (920A), the second guide (920B), and the first contact (910) includes a portion belonging to a common metal layer. The first contact (910) is a probe (970) rigidly fixed to the first guide (920A) and the second guide (920B).

18. A probe (970) according to claim 17, The first guide (920A), the second guide (920B), and the first contact (910) are, Elements cut from a single sheet of metal, Elements cut from a layered material stack (130, 230) in which at least one of the materials is a conductive material, Elements etched from a single metal layer, Elements etched from a layered material stack (130, 230) in which at least one of the materials is a conductive material, and An element formed by depositing at least one material layer (132, 232, 134) containing a conductive material layer onto a surface area corresponding to the shapes of the first plurality of contacts (110, 210, 310, 410, 510, 710, 810, 910) and the at least one guide (120, 220, 320, 420, 520, 720, 820, 920). A probe (970) is an element selected from the group consisting of the following.

19. A probe (970) according to claim 17 or 18, The second contact is located between the first guide (920A) and the second guide (920B). Includes, The second contact includes a portion belonging to the common metal layer (132, 232, 134), The second contact is a probe (970) rigidly fixed to the first contact (910), the first guide (920A), and the second guide (920B).

20. A probe (970) according to any one of claims 17 to 19, The probe (970) is such that the distance from the first contact (910) to the second contact is shorter than a distance selected from the group consisting of 5 mm, 2 mm, 1 mm, 0.5 mm, 0.2 mm, and 0.1 mm.

21. A structure (100, 200, 300, 400, 500, 600, 700, 800, 900) for signal transmission applications of at least 100 Gbps per differential signal pair, preferably for direct mating on a packaging substrate, Multiple contacts (110, 210, 310, 410, 510, 710, 810, 910, 482, 582, 682, 782) Includes, The aforementioned plurality of contacts (110, 210, 310, 410, 510, 710, 810, 910) - At a pitch of less than 0.25 mm, preferably less than 0.2 mm, and / or - Bandwidth per unit volume: 2.1 Tbps / cm² ３ Super The provided structures are (100, 200, 300, 400, 500, 600, 700, 800, 900).

22. The structure according to claim 21 (100, 200, 300, 400, 500, 600, 700, 800, 900), The plurality of contacts (110, 210, 310, 410, 510, 710, 810, 910, 482, 582, 682, 782) are at least one of the first plurality of contacts (110, 210, 310, 410, 510, 710, 810, 910) of an electrical connector or probe (970), comprising a structure (100, 200, 300, 400, 500, 600, 700, 800, 900).

23. The structure according to claim 21 or 22 (100, 200, 300, 400, 500, 600, 700, 800, 900), The plurality of contacts (110, 210, 310, 410, 510, 710, 810, 910, 482, 582, 682, 782) include a plurality of differential signal pairs, and the center-to-center distance between at least two adjacent differential signal pairs is at most 1.0 mm, preferably at most 0.7 mm, in the structure (100, 200, 300, 400, 500, 600, 700, 800, 900).

24. The structure according to claim 23 (100, 200, 300, 400, 500, 600, 700, 800, 900), The plurality of contacts (110, 210, 310, 410, 510, 710, 810, 910, 482, 582, 682, 782) constitute a structure (100, 200, 300, 400, 500, 600, 700, 800, 900) which includes at least 16, most preferably at least 32, of the differential signal pairs.

25. The structures described in claims 21 to 24 (100, 200, 300, 400, 500, 600, 700, 800, 900), The plurality of contacts (110, 210, 310, 410, 510, 710, 810, 910, 482, 582, 682, 782) are distributed across multiple rows (411, 511, 711), and the distance between two adjacent rows (411, 511, 711) is at most 2.5 mm, preferably at most 1.5 mm, in the structure (100, 200, 300, 400, 500, 600, 700, 800, 900).

26. A structure according to any one of claims 21 to 25 (100, 200, 300, 400, 500, 600, 700, 800, 900), Multiple twin-axis cables (450, 550, 650, 750, 850, 950) The conductors (452, 752, 454, 754, 456, 756) of the cable (450, 550, 650, 750, 850, 950) are connected to the plurality of contacts (110, 210, 310, 410, 510, 710, 810, 910), The twin-axis cable has a conductor diameter less than 102 μm, and is structured as follows (100, 200, 300, 400, 500, 600, 700, 800, 900).

27. A structure according to any one of claims 21 to 26 (100, 200, 300, 400, 500, 600, 700, 800, 900), The height of the aforementioned structures (100, 200, 300, 400, 500, 600, 700, 800, 900) is at most 5.5 mm, preferably at most 4.0 mm.

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