How to control test handlers

Abstract

To provide a method for controlling a test hander which can solve the issue that it is difficult to run a test on an electronic component with fine pitches in a case of an existing test handler.SOLUTION: The present invention relates to a method for controlling a handler which can perform distribution in the inside of a handler while an electronic component with a contact terminal of fine pitches is being in electric contact with the test handler. The present invention can secure the rapidness and efficiency of a test on an electronic component with a fine contact terminal and also can secure safety by preventing breakage of an electronic component die before packaging.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] This research was supported by a technology development program (RS-2024-00487757) funded by the Ministry of Small and Medium Enterprises (MSS, South Korea). The present invention relates to a method for controlling a test handler, and more particularly to a method for controlling a handler that tests and classifies electronic components having fine contact terminals.

Background Art

[0002] The background of the birth of HBM (High Bandwidth Memory) mainly started from the demand for an increase in memory bandwidth generated in high-performance application programs such as computers and graphic processing units.

[0003] Existing GDDR (Graphics Doule Data Rate) memory technology has been widely used in high-performance graphics cards and systems, but has reached its limit due to the increasing bandwidth requirements. Therefore, memory manufacturers are required to provide new technologies that can offer higher bandwidth and process data more efficiently.

[0004] To meet such requirements, HBM adopted an innovative design that forms a memory chip stack. HBM uses vertically stacked memory chips to achieve high bandwidth, and offers the advantages of occupying less space and reducing power consumption. Such characteristics have become the background for HBM to attract attention as the importance of memory bandwidth and power efficiency increases in high-performance computing and graphic processing systems.

[0005] Such HBM needs to be tested in the die state before packaging. HBM dies are equipped with far more contacts than existing memories, and many contact terminals are provided with a fine pitch in a limited area. However, it has been difficult for conventional test handlers to precisely electrically contact a plurality of HBMs with a tester at the same time.

Prior Art Documents

Patent Documents

[0006] [Patent Document 1] Korean Patent Application Publication No. 10-2021-0148743 Specification [Overview of the project] [Problems that the invention aims to solve]

[0007] The purpose of this invention is to provide a control method that solves the problem that conventional test handlers have difficulty testing electronic components with fine pitches. [Means for solving the problem]

[0008] As a means of solving the aforementioned problems, the present disclosure provides a control method for a test handler that includes a first loading step of transferring electronic components from a user tray to a first shuttle, a second loading step of loading at least one electronic component loaded on the first shuttle onto a test tray equipped with a pitch adjustment unit, a test step of testing the electronic component while it is in electrical contact with the pitch adjustment unit, a first unloading step of transferring the tested electronic component from the test tray to a second shuttle, a second unloading step of loading at least one electronic component loaded on the second shuttle onto a user tray, and a step of cleaning at least a portion of an empty test tray.

[0009] On the other hand, the testing phase may be carried out by achieving electrical contact that extends beyond the minimum distance between the contact terminals of the electronic components.

[0010] On the other hand, the second loading stage may be performed by bringing the contact terminals of the electronic components into contact with the electrical contact means of the pitch adjustment unit.

[0011] On the other hand, after the second loading stage, the process may further include a first test tray transfer stage in which the test tray loaded with electronic components is transferred from the loading site to the test site.

[0012] Furthermore, the second loading stage may be performed while maintaining the state in which the contact terminals of the electronic components are in contact with the electrical contact means of the pitch adjustment unit.

[0013] On the other hand, the testing phase may be performed in a state where the contact terminals of the electronic component and the electrical contact means of the tester are not in direct contact with each other.

[0014] On the other hand, the testing phase may be performed with electrical contact achieved between the tester and the interposer block of the test tray.

[0015] On the other hand, the first loading stage may include the steps of picking up the electronic component from the first shuttle, transferring the electronic component to the upper side of the socket on the test tray, aligning the horizontal position of the electronic component, bringing the contact terminals of the electronic component into contact with the contact means of the pitch adjustment unit, and fixing the electronic component to the test tray so that the contact terminals remain in contact with the contact means.

[0016] Here, the electronic component may be a high-bandwidth memory.

[0017] On the other hand, the second loading stage is performed using a PNP device, and the PNP device may be configured to include a step of aligning the horizontal position so that the contact terminals of the high-bandwidth memory and the contact pins of the pitch adjustment unit can make contact with each other.

[0018] Alternatively, the process may further include a second transport stage in which the test tray is transported to an unloading site after testing.

[0019] On the other hand, after the first unloading stage, a third transfer stage may be further included, in which the empty test tray is transferred to a cleaning site.

[0020] The system may also further include a fourth transfer step, after the cleaning step, in which the test tray is moved from the cleaning site to the loading site.

[0021] On the other hand, the cleaning step may be performed by cleaning the contact means of the pitch adjustment unit provided on the test tray.

[0022] On the other hand, the cleaning step may be performed by cleaning the electrical contact means between the test tray and the tester.

Advantages of the Invention

[0023] The method for controlling a test handler according to the present invention can ensure the speed and efficiency of testing for electronic components having contact terminals with a fine pitch. Also, since damage to the electronic component die before packaging can be prevented, stability can be ensured.

Brief Description of the Drawings

[0024] [Figure 1] It is a flowchart of a method for controlling a test handler according to an embodiment of the present disclosure. [Figure 2] It is a detailed flowchart of the loading step in the present disclosure. [Figure 3] It is a detailed flowchart of the test step in the present disclosure. [Figure 4] It is a detailed flowchart of the unloading step in the present disclosure. [Figure 5] It is a detailed flowchart of the cleaning step in the present disclosure. [Figure 6] It is a conceptual diagram showing an electronic component and a test tray that are controlled and transferred in an embodiment of the present disclosure. [Figure 7] It is a plan view showing an electronic component and a test tray that are controlled and transferred in an embodiment of the present disclosure. [Figure 8] It is a perspective view of a test tray applicable in an embodiment according to the present disclosure. [Figure 9] It is a perspective view of an insert module applicable in an embodiment according to the present disclosure. [Figure 10]This is an exploded perspective view of an insert module applicable in one embodiment of the present disclosure. [Figure 11a] This is a cross-sectional view showing the concept of loading electronic components in the second loading stage of one embodiment of the present disclosure. [Figure 11b] This is an enlarged cross-sectional view of portion I, showing the portion where the fine-pitch contact terminal and the first pin of the insert module make contact during the second loading stage of one embodiment according to this disclosure. [Figure 11c] This is an enlarged cross-sectional view of portion II showing a second pin having an extended pitch exposed to the outside of the test tray during the second loading stage of one embodiment of the present disclosure. [Figure 12a] This is a cross-sectional view showing the PNP module and insert module in operation by the execution of the second loading stage of one embodiment of the present disclosure. [Figure 12b] This is a cross-sectional view showing the PNP module and insert module in operation by the execution of the second loading stage of one embodiment of the present disclosure. [Figure 12c] This is a cross-sectional view showing the PNP module and insert module in operation by the execution of the second loading stage of one embodiment of the present disclosure. [Figure 13a] This is a cross-sectional view illustrating the concept of performing a cleaning step in one embodiment of the present disclosure. [Figure 13b] This is a cross-sectional view illustrating the concept of performing a cleaning step in one embodiment of the present disclosure. [Modes for carrying out the invention]

[0025] The control method for a test handler according to an embodiment of the present invention will be described in detail below with reference to the attached drawings. In the following description of the embodiments, the names of each component may be referred to by different names in the industry. However, if there is functional similarity and identity, a modified embodiment can be considered equivalent. The reference numerals attached to each component are included for the convenience of explanation. However, the illustrations on the drawings in which these reference numerals are indicated do not limit each component to the scope shown in the drawings. Similarly, even if an embodiment with a partially modified configuration is adopted, if there is functional similarity and identity, it can be considered equivalent. Furthermore, if a component is considered to be naturally included in light of the general level of expertise of the art, its explanation will be omitted.

[0026] Figure 1 is a flowchart of a method for controlling a test handler according to one embodiment of the present disclosure.

[0027] As shown in Figure 1, the method for controlling a test handler according to one embodiment of the present disclosure can be performed using a test tray that allows adjustment of the electrical contacts for testing.

[0028] A control method for a test handler according to one embodiment of the present disclosure may include the steps of loading electronic components onto a test tray (S100), testing the electronic components loaded onto the test tray (S200), unloading the tested electronic components from the test tray (S300), and cleaning the contact pins of the unloaded test tray (S400).

[0029] The step of loading electronic components into the test tray (S100) corresponds to the step of loading the electronic components to be tested from the user tray to the test tray. In this disclosure, the electronic components to be tested may be electronic components having contact terminals with a fine pitch. For example, they may be high-bandwidth memory (HBM). The electronic components are supplied to the test handler in a state where they are loaded onto the user tray as so-called dies, before packaging.

[0030] In this stage (S100), the electronic components are inserted into the insert module of the test handler, and the loading is completed when the contact terminals of the electronic components are fixed in contact with the contact pins of the insert module. At this time, the position of each of the multiple electronic components can be precisely adjusted and controlled to enable loading.

[0031] The stage of testing the electronic components loaded onto the test tray (S200) corresponds to the stage in which the test is performed after electrical contact has been established between the test tray and the tester, once the electronic components have been fully loaded onto the test tray. In this stage, the connection terminals of the electronic components and the electrical contact means of the tester no longer directly touch each other. The contact terminals of the electronic components remain in contact with the first pins provided at the first pitch of the test tray. On the other hand, the second pins, which are arranged at a second pitch larger than the first pitch of the test tray, can make contact with the tester and be tested.

[0032] In this stage (S200), the electronic components are configured to perform performance tests according to desired conditions, such as temperature conditions. For this purpose, the electronic components experience a variety of temperature changes during the test. However, since such a test process can be applied in various ways depending on the electronic components, further detailed explanation is omitted.

[0033] The stage of unloading the tested electronic components from the test tray (S300) corresponds to the stage of assigning performance grades to the tested electronic components, and then sorting and discharging them according to their grades. In this stage, the tested electronic components may be unloaded from the test tray and transferred to the user tray. This stage is performed after opening the insert module of the test tray, using a device called a PNP (Pick up and placing) device or a hand.

[0034] The step of cleaning the contact pins of the unloaded test tray (S400) corresponds to the step of cleaning the empty test tray after unloading is complete. In this disclosure, the insert module provided in the test tray may be provided with first pins having a fine pitch. Because the first pins are of a fine size and are provided at fine intervals, they are highly susceptible to foreign matter. Therefore, in this disclosure, the test tray after loading and unloading of electronic components is cleaned before loading electronic components again. In this step, cleaning can be performed on the first pins provided on the inside of the test tray and / or the second pins provided on the outside.

[0035] Meanwhile, the cleaned test trays are transported for use again during the loading stage.

[0036] Through the above steps, the test handler control method according to this disclosure can perform testing by making contact with an electronic component having a fine pitch once with the test tray, then transporting the test tray while maintaining contact. Therefore, damage to the contact terminals of the fine electronic component can be prevented, and damage to the electronic component before packaging can be prevented.

[0037] Furthermore, the control method described herein allows for a dramatic reduction in preparation time for testing. This is achieved by first precisely aligning and fixing the electronic components on a test tray for electrical contact during testing, and then using larger, wider-pitch contact pins to make electrical contact with the tester during testing.

[0038] The method for controlling the test handler according to this disclosure will be described in detail below with reference to Figures 2 to 5.

[0039] Figure 2 is a detailed flowchart of the loading phase in this disclosure.

[0040] As shown in Figure 2, in this disclosure, the loading stage comprises a first loading stage (S110) of transferring electronic components from a user tray to a first shuttle, a stage (S120) of picking up electronic components from the first shuttle and aligning the horizontal position of the electronic components so that the contact terminals of the electronic components and the contact pins of the pitch adjustment unit can make contact, a second loading stage (S130) of loading the electronic components into an insert using a PNP device and maintaining contact between the contact terminals of the electronic components and the contact pins of the pitch adjustment unit, and a first transfer stage (S140) of transferring the test tray from the loading site to the test site.

[0041] The first loading stage (S110), in which electronic components are transferred from the user tray to the first shuttle, corresponds to the stage in which electronic components are transferred from the user tray, which has been transported and loaded in lot units from an external source, are transferred. In this stage, a predetermined number of multiple electronic components can be picked up from the user tray and loaded onto the first shuttle. The first shuttle is provided with multiple grooves, and electronic components are secured in each groove. When electronic components are transferred from the user tray, the shuttle can move to a position adjacent to the user tray in order to shorten the round-trip distance.

[0042] In the first loading phase, the PNP device is controlled to pick up multiple electronic components, adjust their spacing, and then load them onto the first shuttle.

[0043] The step (S120) of picking up an electronic component from the first shuttle and aligning its horizontal position so that the contact terminals of the electronic component make contact with the contact pins of the pitch adjustment unit can be performed using a PNP device equipped with a vision device. This step is performed after moving the first shuttle to the position where the test tray awaits for loading (loading position). The PNP device can be controlled to move above the test tray after picking up the electronic component from the first shuttle. After that, the insert module of the test tray is opened (an operation that allows the electronic component to be inserted), and the position of the PNP device is precisely adjusted. In this step, the horizontal position of the electronic component can be precisely adjusted so that the contact terminals of the electronic component make contact with the first pin of the insert module, based on images acquired using means that aid in precise alignment, such as a vision module and non-contact distance sensors provided in the PNP device.

[0044] The second loading stage (S130) in the PNP device involves loading electronic components into the insert and maintaining contact between the contact terminals of the electronic components and the contact pins of the pitch adjustment unit. This stage maintains the insert module in a closed state. As soon as the insert module closes, the electronic components can be fixed to the test tray. This stage corresponds to the stage in which external forces acting on the insert module are removed, thereby fixing the electronic components themselves.

[0045] The first transfer stage (S140), which involves moving the test tray from the loading site to the test site, is the stage in which the transfer unit is activated to move the test tray to the test site. At this time, the test tray can be adjusted to a position that is easy to load into the soak chamber before the test. The change in the position of the test tray may be performed using means such as a flipper or a robotic arm.

[0046] Figure 3 is a detailed flowchart of the testing phase in this disclosure.

[0047] As shown in Figure 3, the test phase (S200) consists of the steps of aligning the test tray with the tester (S210), bringing the pitch adjustment unit and the tester into electrical contact while the electronic components are in electrical contact with the pitch adjustment unit (S220), and performing a test according to the temperature conditions (S230).

[0048] The step of aligning the test tray with the tester (S210) corresponds to the step of determining the path for transporting the test tray to an available tester if there are multiple testers, and aligning the position for electrical contact with the tester. At this time, approximate position adjustment can be performed by moving the test tray along the guide means.

[0049] The step (S220) in which the pitch adjustment unit and the tester are brought into electrical contact while the electronic components are in electrical contact with the pitch adjustment unit is the step of pressurizing the test tray toward the tester to achieve electrical contact. At this stage, the pitch of the electrical contacts on the rear side of the test tray is expanded and brought into contact with the pins of the tester. The electronic components loaded on the test tray can be electrically connected indirectly through the test tray without directly making electrical contact with the tester. At this time, they can be electrically connected to the tester via an electrical contact means having an average spacing that is expanded from the average spacing between the contact terminals of the electronic components.

[0050] The stage of performing temperature-dependent tests (S230) corresponds to the stage of performing performance tests on multiple electronic components loaded onto a test tray under pre-set conditions.

[0051] Figure 4 is a detailed flowchart of the unloading process in this disclosure.

[0052] As shown in Figure 4, the unloading stage (S300) may include a second transfer stage (S310) in which the test tray is transferred to the unloading site after testing, a first unloading stage (S320) in which the electronic components are transferred from the test tray to the second shuttle, and a second unloading stage (S330) in which the electronic components are transferred from the second shuttle to the user tray.

[0053] In the unloading stage (S300), the second transfer stage (S310), in which the test tray is moved to the unloading site after testing, involves moving the test tray from the tester to the desoak chamber and changing its orientation in the opposite direction to the first transfer stage to move it to the unloading position. In this stage as well, the test tray can be transferred using elements such as linear movement tray transfer means, vertical position adjustment means, and orientation change means.

[0054] The first unloading stage (S320), in which electronic components are transferred from the test tray to the second shuttle, is performed as a preliminary step to efficiently classify and load each electronic component by assigning it one of several performance grades based on the test results. At the unloading position, the insert module is released first. Subsequently, the electronic components can be picked up using a PNP device and loaded onto the first shuttle according to their grade. At this time, the grades can be classified into states such as normal, defective, and requiring retest, based on the test results of the electronic components.

[0055] The second unloading stage (S330), in which electronic components are transferred from the second shuttle to the user tray, corresponds to the stage for transporting electronic components to the outside according to their classified type. In this stage, electronic components of the same grade that were loaded on the first shuttle can be transferred to the user tray. This stage is performed using a PNP device, and the spacing between multiple picked-up electronic components can be adjusted during the transfer process to match the socket spacing of the user tray.

[0056] Figure 5 is a detailed flowchart of the cleaning steps in this disclosure.

[0057] As shown in Figure 5, the cleaning step is performed to clean the electrical contacts of the test tray after unloading.

[0058] The cleaning stage (S400) may include a third transfer stage (S410) in which an empty test tray is transferred to a cleaning site, a stage in which the inserts of the test tray are cleaned (S420), and a fourth transfer stage (S430) in which the cleaned test tray is transferred to a loading site.

[0059] The third transfer step (S410), which involves transferring an empty test tray to the cleaning site, is the step of transferring the empty tray for cleaning. The step of cleaning the inserts in the test tray (S420) is configured to allow cleaning of the contact means, which are arranged at a small pitch inside the insert module and / or the means that contact the tester on the other side of the test tray. In this step, the main target of cleaning is the pins, which are arranged at small intervals inside the insert module. Components with very small contact terminals and small spacing between contact terminals, such as high-bandwidth memory, are greatly affected by small foreign objects. Therefore, cleaning the insert module before the loading step can ensure reliable contact with the electronic components.

[0060] This step (S420) may be performed by blowing air into the inside of the insert module through a nozzle or by using a vacuum to draw air in. Alternatively, it may be performed using a cleaning material that comes into direct contact with the insert module.

[0061] The fourth transport stage (S430), in which the cleaned test tray is moved to the loading site, corresponds to the stage of transporting the test tray for the next test.

[0062] On the other hand, the operation of each of the aforementioned elements can be controlled by a control unit provided in the electronic component test handler. Furthermore, sub-control units and a master control unit may be provided to control each drive element. Such control units may be located in the electronic component test handler, or they may be located in a separate space from the test handler for remote control.

[0063] The following describes the electronic components and test tray that move on the test handler as a result of the control method for the test handler according to one embodiment of the present disclosure.

[0064] Figure 6 is a conceptual diagram showing electronic components and a test tray 1 being transported under control in one embodiment of the present disclosure, and Figure 7 is a plan view showing electronic components and a test tray 1 being transported under control in one embodiment of the present disclosure.

[0065] As shown in Figures 6 and 7, the space on the base where the main operations of the electronic component test handler are performed is divided into the loading site LS, the unloading site US, the test site TS, and the cleaning site CS.

[0066] As mentioned above, the electronic components are loaded onto the first shuttle 21 in the first loading stage (S110) at the loading position UP of the loading site LS. Subsequently, in the second loading stage (S130), the electronic components 1000 are loaded onto the test tray 1. At this time, precise positioning (S120) is performed, and the test tray 1 and the electronic components are maintained in a state where electrical contact is ensured.

[0067] Subsequently, in the first transfer stage (S140), the test tray 1 is transferred to the test site TS, where a test (S200) is performed. After the test is completed, in the second transfer stage (S310), the test tray 1 is transferred to the unloading position UP. At the unloading site US, the first unloading stage (S320) is performed, in which the electronic components are sorted and loaded onto the second shuttle 22 according to their grade according to the test results. Thereafter, in the second unloading stage (S330), the electronic components loaded onto the second shuttle 22 can be loaded onto the user tray C.

[0068] Subsequently, in the third loading stage (S410), test tray 1 is transferred to the cleaning site CS. After the insertion cleaning stage (S420) is completed, in the fourth loading stage (S430), test tray 1 is transferred to the loading site LS.

[0069] On the other hand, the first loading stage (S110), the second loading stage (S130), the first unloading stage (S320), and the second unloading stage (S330) allow for the transfer of the PNP device while minimizing the downtime of the device. Meanwhile, the test tray 1 moves in a circular motion between the loading position LP, the test site TS, the unloading position UP, and the cleaning site CS. At this time, the transfer speed of the test tray 1 can be adjusted in the third transfer stage (S410) and the fourth transfer stage (S430) depending on the presence or absence of the test tray 1 at the loading position and / or unloading position. On the other hand, a buffer space may be provided where the test tray waits to synchronize the transfer of empty test trays with the timing of loading and unloading.

[0070] Figure 8 is a perspective view of a test tray applicable in one embodiment of the present disclosure.

[0071] An electronic component test handler according to one embodiment of the present disclosure is configured to transport multiple electronic components loaded onto an insert module 100. It is also configured to perform tests with the electronic components loaded onto the insert module 100. The tests can be performed in a so-called "handler" that performs performance tests under specific temperature conditions and classifies them by grade.

[0072] An electronic component test tray 1 according to one embodiment of the present disclosure may include a subtray 2, an interposer block, and a board.

[0073] The interposer block may be configured to electrically connect the board to an external tester. Multiple electrical connectors may be provided on one side of the interposer block. The interposer block may also consist of circuits in which each electronic component is electrically connected to a pin.

[0074] The board is configured to allow for an electrical connection between the subtray 2 and the interposer block, and may also be provided with predetermined circuits that can electrically contact and function with the electronic components being tested.

[0075] The upper side of the board may be provided with at least one sub-tray 2. The sub-tray 2 may be configured to be detachable from the board. That is, testing can be performed with one or more sub-trays 2 attached to the board as needed. Alternatively, if necessary, the test tray 1 may wait in another location, and only the sub-trays may be moved to a position where electronic components are loaded or unloaded. After the electronic components for testing are loaded, the sub-tray 2 may be attached to the board, or it may be separated from the board and moved separately from the board for unloading of the electronic components after testing is complete. In this case, known selective fastening elements can be used to attach and detach the sub-trays from the board.

[0076] The subtray 2 may include a first base frame and a second base frame, the latter having spaces formed in a predetermined pattern. The first and second base frames 12 are connected vertically and configured to connect a predetermined number of insert modules. Electronic components are loaded onto each of the insert modules 100. The loaded electronic components can make electrical contact with the insert modules 100. Each of the insert modules 100 can be electrically connected to the board. In total, the electronic components can be electrically connected to the tester via the insert modules 100, the board, and the interposer.

[0077] The insert module 100 is configured to securely fix the position of the electronic components during transport or testing of the test tray 1. When the electronic components are fixed to the insert module 100, the contact terminals of the electronic components can be connected to the electrical contact means of the insert module 100.

[0078] The following describes insert modules applicable to the control method according to this disclosure, with reference to Figures 9 to 10b.

[0079] Figure 9 is a perspective view of an insert module applicable to one embodiment of the present disclosure, and Figure 10 is an exploded perspective view of an insert module applicable to one embodiment of the present disclosure.

[0080] Referring to Figures 9 and 10, in this disclosure, each insert module 100 for electronic components is configured to load and selectively fix electronic components.

[0081] When the contact terminals of electronic components are arranged very finely, aligning them when making contact with a tester can become an excessive burden. Furthermore, handlers test multiple electronic components simultaneously for efficient operation. Precisely aligning and connecting multiple electronic components to the tester at the same time is time-consuming and increases the complexity of the equipment.

[0082] In this disclosure, the insert module 100 may be provided with connecting means that are extended to a pitch greater than the pitch of the contact terminals of the mounted electronic components. In this disclosure, the insert module 100 can be arranged with greater spacing between the fixed electronic components and can be connected to a tester by providing stronger connecting means.

[0083] In this disclosure, the insert module 100 may include a fixing portion 300 and a pitch adjustment portion 200.

[0084] The fixing part 300 and the pitch adjustment part 200 are configured to be connected in the vertical direction. The fixing part 300 and the pitch adjustment part 200 may be connected to each other to form a socket. One electronic component can be loaded into the socket. The fixing part 300 may include a hole that runs vertically through its central portion, through which the electronic component can be loaded or unloaded. The pitch adjustment part 200 may also be provided on the lower side of the hole.

[0085] The fixed portion 300 may include an upper block 310, a lower block 320, a latch link 330, and an elastic portion 340. The upper block 310 and the lower block 320 may be connected so as to be able to reciprocate for a predetermined length in the vertical direction.

[0086] The latch link 330 may be configured so that its pivot angle can be adjusted by the distance between the upper block 310 and the lower block 320. The latch link 330 may be configured symmetrically, with each end configured to pressurize the top of the device loaded in the socket.

[0087] The latch link 330 may include a latch portion 331 and a link 335. The latch portion 331 may include a connecting portion 332 and a pressurizing portion 333. The connecting portion 332 is configured to connect with the upper block 310 and a first connecting pin 336 on one side of the latch link 330. The pressurizing portion 333 is configured to pressurize the upper part of an electronic component on the other side of the latch link 330. The pressurizing portion 333 may be equipped with a thermal pad 334 to minimize the effects of heat when pressurizing the upper end of an electronic component.

[0088] One side of link 335 is connected to the lower block 320 by a connecting pin. The other side of link 335 is connected to the middle section of latch link 330 by a second connecting pin 337 so that it can rotate.

[0089] On the other hand, the operation of the latch link 330 may be geometrically predetermined. In this disclosure, when the upper block 310 descends to the position closest to the lower block 320, the fixing portion 300 of the latch portion 331 is configured to rotate upward by 90 degrees or more.

[0090] Conversely, when the external force is removed and the upper block 310 returns to a position far from the lower block 320, the latch link 330 is adjusted to the opposite direction by 90 degrees to pressurize the upper end of the electronic component.

[0091] On the other hand, the pair of pressurizing portions 333 provided on the latch link 330 may have a concave shape in the portions facing each other in the closed position. The concave structure of the pressurizing portions 333 is to prevent interference with the PNP device when the PNP device closes the socket with the electronic components precisely aligned inside the socket. The concave structure may be configured to be such that the latch portion 331 does not come into contact with the PNP device even when it pivots.

[0092] The elastic portion 340 is configured to provide a restoring force to the latch. The elastic portion 340 is provided at multiple points between the upper block 310 and the lower block 320 and provides an upward restoring force to the upper block 310.

[0093] The pitch adjustment unit 200 is configured to expand the electrical contact area while the electronic components are fixed in place.

[0094] The pitch adjustment unit 200 may include a first pin 210, a pitch adjustment block, and a second pin fixing block 230. The pitch adjustment block may include a conductor 221, and the second pin fixing block 230 may include a second pin 231. The first pin 210, the conductor 221, and the second pin 231 can be electrically connected. When the second pin 231 is electrically connected to an external tester, the electronic components loaded into the socket can also be electrically connected.

[0095] The first pins 210 are arranged to have a contact cross-sectional area suitable for the fine pitch of the electronic components. For example, the first pins 210 may be configured in a plate shape. However, this is just one example, and can be modified and implemented in various configurations that allow for a fine pitch.

[0096] Figure 11a is a cross-sectional view illustrating the concept of loading electronic components in the second loading stage of one embodiment of the present disclosure; Figure 11b is an enlarged cross-sectional view of part I showing the portion where the fine-pitch contact terminals and the first pins of the insert module are in contact in the second loading stage of one embodiment of the present disclosure; and Figure 11c is an enlarged cross-sectional view of part II showing the second pins with an extended pitch exposed to the outside of the test tray in the second loading stage of one embodiment of the present disclosure.

[0097] As shown in Figures 11a, 11b, and 11c, the first pins 210 can be arranged on a plane so that they can contact the contact terminals of the electronic component. In this case, the number of first pins 210 corresponds to the number of contact terminals of the electronic component. Alternatively, the first pins 210 may be arranged in the same way as the contact terminals arranged on the electronic component. That is, the pitch of the first pins 210 may be the same as the pitch of the electronic component. In other words, the contact terminals of the electronic component and the upper end of the first pins may be formed with the same pattern. However, although a configuration in which the first pins 210 are arranged at a first pitch (P1) has been described, this is only one example, and if the contact terminals of the electronic component are connected at various pitches, the first pins 210 can be arranged at various pitches accordingly.

[0098] On the other hand, in this disclosure, the first spacing (P1) between the first pins 210 may be 0.5 mm or less. In some cases, the first spacing may be 0.2 mm or less. Also, the width of the first pins 210 may be 0.2 mm or less. Also, the width of the electrical contact portion of the first pin may be 0.05 mm or less.

[0099] The second block may be provided with a plurality of second pins 231. The plurality of second pins 231 may be arranged at a second spacing (P2) wider than the first spacing (P1). The second pins 231 are configured to be electrically connected to the electrical contact means of the board. The second pins 231 may be provided penetrating the second pin fixing block 230 in the vertical direction. The second pins 231 are configured to minimize damage even when repeatedly contacting the external board and to achieve reliable electrical contact. On the other hand, the second spacing (P2) may be set to 0.3 to 3 mm. In this case, the thickness of the second pins 231 may be set to 0.1 to 3 mm.

[0100] On the other hand, the second interval (P2) may be configured as an extension of the first interval (P1). For example, the second interval can be expanded by 1.1 to 20 times the size of the first interval.

[0101] The second pin 231 may be composed of, for example, a pogo pin. A pogo pin is constructed by connecting a pair of pins, each with a space formed inside and one end open, in the longitudinal direction. An elastic body is provided inside the pogo pin, and when a compressive force is generated in the vertical direction, the overall length shortens accordingly. In other words, the length can be adjusted by external force, and the electrical connection is maintained even if the length changes. Therefore, even if the insert module 100 comes into violent contact with the board, the pogo pin can minimize impact and maintain stability. Furthermore, wear and tear can be prevented even with repeated use, allowing it to maintain optimal performance for a long period of time.

[0102] The pitch adjustment block 220 is configured to allow pitch adjustment between the first pin 210 and the second pin fixing block 230. The pitch adjustment block 220 may be provided with a plurality of conductors 221. At least some of the conductors 221 may be arranged in an inclined path within the pitch adjustment block 220. The upper end of the conductor 221 may be exposed at the upper end of the pitch adjustment block 220, and the lower end may be exposed at the lower end of the pitch adjustment block 220. The upper end of the conductor 221 can make electrical contact with the first pin 210. The lower end of the conductor 221 can make electrical contact with the second pin 231 of the second pin fixing block 230.

[0103] The conductors 221 may be arranged three-dimensionally within the pitch adjustment block 220. The conductors 221 are generally arranged with wider pitches towards the bottom within the pitch adjustment block 220.

[0104] On the other hand, while the above-described embodiment shows an example in which the first pins are arranged at a first interval, the minimum distance between adjacent first pins may also be set as the first interval. Furthermore, the first pins can be arranged at various intervals wider than the first interval as needed. In this case, the minimum distance between adjacent second pins is set as the second interval, and in this case as well, the second interval can be set to be larger than the first interval.

[0105] Figures 12a, 12b, and 12c are cross-sectional views showing the PNP module and insert module in operation by the execution of the second loading stage of one embodiment according to the present disclosure.

[0106] As shown in Figure 12a, the test tray 1 is moved to the loading position and temporarily fixed. At this time, the picker (or hand) 400 picks up electronic components 1000 from the user tray (not shown) and moves them to the top of the test tray 1. The picker 400 is equipped with an electronic component suction unit 420 and a picker pusher 410. The suction unit 420 may be configured to move up and down independently of the picker pusher 410.

[0107] As shown in Figure 12b, when the picker pusher 410 pressurizes the upper block 310, the latch link 330 is fully released. On the other hand, the picker 400 may be equipped with a vision system. The picker 400 can use the vision system to detect the relative position of the socket and the electronic component 1000 and precisely align the horizontal position of the electronic component 1000.

[0108] As shown in Figure 12c, when the position of the electronic component 1000 and the horizontal position of the first pin 210 are aligned, the suction part 420 descends and securely attaches the electronic component 1000 to the upper surface of the first pin 210.

[0109] Figures 13a and 13b are cross-sectional views illustrating the concept of a cleaning step in one embodiment of the present disclosure.

[0110] As shown in Figure 13a, the insert module can be opened at the cleaning site. The cleaning device 500 may include a cleaning pusher 510 and a nozzle 520. The cleaning pusher 510 is configured to open the insert module. The nozzle 520 is configured to enter the inside of the opened insert module and blow fluid toward the first pin to perform cleaning.

[0111] As shown in Figure 13b, the cleaning device 500 may include a cleaning pusher 510 and a suction unit 520'. The suction unit 520' can enter the inside of the insert module and clean the inside of the insert module by sucking in foreign matter and other debris.

[0112] However, unlike the operation described in Figures 13a and 13b, the cleaning device 500 may omit the cleaning pusher 510. In this case, cleaning can be performed by using the cleaning means 520 and 520' to enter the inside of the insert module without contacting the latch link 330.

[0113] As described above, the test handler control method according to this disclosure has the effect of preventing damage to electronic components by making precise contact with electronic components having fine-pitch contact terminals, and dramatically shortening the Takt time of electronic component testing. [Explanation of Symbols]

[0114] US: Unloading Site LS: Loading Site TS: Test Site CS: Cleaning Site C: User Tray UP: Unloading position LP: Loading position 1: Test tray 1000: Electronic components

Claims

1. The first loading phase involves transferring electronic components from the user tray to the first shuttle; A second loading step involves loading at least one of the electronic components loaded onto the first shuttle onto a test tray equipped with a pitch adjustment unit; A test phase in which the electronic component is tested while it is in electrical contact with the pitch adjustment unit; A first unloading step involves transferring the electronic components, after the aforementioned tests have been completed, from the test tray to a second shuttle; A second unloading step of loading at least one of the electronic components loaded on the second shuttle onto a user tray; and The process includes the step of cleaning at least a portion of the empty test tray, The test tray is equipped with a plurality of pitch adjustment units that electrically connect each of the loaded electronic components, Each of the pitch adjustment sections has a first pin on one side, and the first pin is electrically connected to the electronic component. Each of the pitch adjustment sections has a second pin on the opposite side, and the second pin is electrically connected to the tester. The second spacing between the second pins is wider than the first spacing between the first pins. The test tray is equipped with a plurality of latch links for fixing each of the electronic components in alignment with the pitch adjustment section. A method for controlling a test handler, wherein, in the step of cleaning at least a portion of the test tray, the cleaning is performed on the first pin.

2. The aforementioned second loading stage is The control method for a test handler according to claim 1, which is performed by bringing the contact terminals of the electronic component into contact with the electrical contact means of the pitch adjustment unit.

3. The method for controlling a test handler according to claim 2, further comprising, after the second loading step, a first transport step of a test tray, which transports the test tray on which the electronic components are loaded from a loading site to a test site.

4. The control method for a test handler according to claim 3, wherein the second loading stage is performed while maintaining a state in which the contact terminals of the electronic component are in contact with the electrical contact means of the pitch adjustment unit.

5. The aforementioned first loading stage is The step of picking up the electronic component from the first shuttle; A step in which the electronic component is transferred to one side of the pitch adjustment portion of the test tray, wherein the pitch adjustment portion is coupled with a fixing portion to form a socket on the test tray; A step of aligning the horizontal position of the aforementioned electronic components; The step of bringing the contact terminal of the electronic component into contact with the first pin of the pitch adjustment unit; A method for controlling a test handler according to claim 1, comprising the step of fixing the electronic component to the socket of the test tray so that the contact terminal maintains contact with the first pin.

6. The method for controlling a test handler according to claim 1, wherein the electronic component is a high-bandwidth memory.

7. The second loading stage is performed using a PNP device. The control method for a test handler according to claim 6, wherein the PNP device is configured to include the step of aligning the horizontal positions so that the contact terminals of the high-bandwidth memory and the contact pins of the pitch adjustment unit can contact each other.

8. A method for controlling a test handler according to claim 3, further comprising a second transport step of transporting the test tray to an unloading site after the test.

9. A method for controlling a test handler according to claim 8, further comprising a third transfer step of transferring the empty test tray to a cleaning site after the first unloading step.

10. A method for controlling a test handler according to claim 9, further comprising a fourth transfer step of transferring the test tray from the cleaning site to the loading site, after the step of cleaning at least a portion of the test tray.

11. The step of cleaning at least a portion of the test tray is: A method for controlling a test handler according to claim 1, which is performed by cleaning the second pin between the test tray and the tester.

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