Method for packaging and unpacking planar substrates, and packaging body for planar substrates

Abstract

The present invention relates to a method for packaging planar substrates, in particular glass substrates, in a packaging box, the method comprising the steps of: providing a bottom of the packaging box, the bottom having a lower wall and advantageously four side walls; placing the planar substrate directly or indirectly on the lower wall of the bottom of the packaging box; placing an intermediate layer directly or indirectly on the placed planar substrate; repeating the two steps to form a stack of planar substrates and intermediate layers located therebetween; and covering the bottom of the packaging box with a packaging box lid, as well as packaged planar substrates produced according to the method and a method for unpacking packaged planar substrates.

Description

Technical Field

[0001] The present invention relates to a method for packing a planar substrate, particularly a glass substrate, in a packing box, a package having the planar substrate packed therein, and a method for unpacking the packed planar substrate from the packing box.

[0002] Various methods are known for packing glass substrates. When packing a plurality of substrates of the same or similar type, they can be particularly stacked and spaced apart from each other with an intermediate layer to avoid direct contact of the glass surfaces.

[0003] However, the known methods still have room for further improvement, particularly with respect to the packing of sheet glass, thin glass, ultra-thin glass, and ultra-thin glass (UTG) with a thickness of, for example, 100 μm or less. Here, problems during packing, transportation, and / or unpacking are particularly caused by the lack of inherent rigidity of the substrate. Often, there is a high risk of breakage, particularly during transportation, and the susceptibility to breakage is particularly high in thin glass such as UTG. In the case of UTG in particular, edge protection and protection against shear stress are particularly important to avoid breakage during transportation and during the stacking and unloading of transport packages. Solutions provided for protecting glass, such as TFT cover glass (for example, with a thickness of 0.3 mm or more), using laminates are complex and often not applicable to thin glass. For example, when laminating a film on UTG, the untreated UTG raw glass may break when the film is peeled off. Also, methods provided for spraying and laminating a coating agent or the like are similarly not preferable because an additional cleaning process is required. Problems may also occur when using an intermediate layer. For example, the glass surface is easily affected by surface reactions, and undesirable surface defects such as, for example, haze, salt deposition, and glass corrosion may occur due to the reaction between the glass and the intermediate layer material. Furthermore, packages produced by known methods are often not suitable for automated unpacking.

[0004] Therefore, the present invention relates to a method for packaging planar substrates, particularly thin glass substrates (e.g., UTG), and aims to provide a method for reducing fragility by ensuring a high level of protection, especially for the glass edges. Accordingly, one aspect of the problem addressed by the present invention is to ensure that the packaging of substrates produced by this method is transported safely and without damage or loss. Furthermore, one aspect of the problem addressed by the present invention is to ensure the highest possible cleanliness of the substrate after unpacking, and to avoid surface reactions and / or particle formation, especially during packaging or transport. A further aspect of the problem addressed by the present invention is to provide a method and packaging that allows for the automatic and / or easy removal of the substrate upon unpacking.

[0005] In addressing the problem, the present invention provides the following method for packaging a planar substrate, particularly a glass substrate, into a packaging box.

[0006] The method includes the step of providing a bottom for a packing box, wherein the bottom has a bottom wall and, advantageously, one or more, in particular, four side walls.

[0007] The method further includes the step of placing a planar substrate directly or indirectly on the bottom wall of the packing box. Thus, the planar substrate rests on the bottom wall, and in this manner, the planar substrate rests either directly on the bottom wall or indirectly on the bottom wall, so that one or more additional elements are present between the bottom wall and the planar substrate. The planar substrate is advantageously placed directly or indirectly such that a lateral gap remains between the planar substrate and the side wall, respectively.

[0008] The method further includes the step of placing an intermediate layer directly or indirectly on a placed planar substrate, and performing this placement, advantageously, such that the intermediate layer protrudes laterally from the planar substrate and projects into a lateral gap. Here, the intermediate layer may protrude from the planar substrate and project into a lateral gap on, for example, at least one surface, two, particularly opposing surfaces, or even three or four surfaces. The protruding portion of the intermediate layer can serve to protect the edges of the substrate and / or to hold the substrate in place when it is removed, thereby preventing the intermediate layer from adhering to the substrate being removed. Furthermore, the portion of the intermediate layer that protrudes into the lateral gap can be folded downward so as to reduce or prevent slippage of the substrate. The amount of overhang of the intermediate layer relative to the planar substrate is advantageously a specified value. Advantageously, a perimeter overhang is provided.

[0009] The method further includes the step of forming a stack of planar substrates and intermediate layers located between them by particularly alternating the placement of planar substrates and intermediate layers. The stack advantageously comprises more than 10, particularly preferably more than 50, and even more preferably more than 75 planar substrates.

[0010] Furthermore, the method includes the step of placing the lid of a packing box over the bottom of the packing box so that the stack of formed planar substrates is packed from below and above, and preferably from the side, by the bottom and lid. For this purpose, the lid preferably includes a top wall and preferably has one or more, particularly four, side walls. The lid and / or bottom may be folded from a plate-like body. Thus, the method may also include the step of folding a plate-like body to form the lid and / or the step of folding a plate-like body to form the bottom.

[0011] In one advanced form of the present invention, the method includes the step of inserting one or more centering aids (guiding blocks), preferably four, adjacent to one of the side walls, the centering aids being inserted in particular before the planar substrate is placed and before the stack is formed.

[0012] Each centering aid is positioned within the lateral gap remaining between the planar substrate and the side wall. In particular, the centering aids are positioned such that they at least partially cover the lateral gaps. The centering aids can serve to hold the lateral gaps in place when forming a stack. For example, at least one centering aid may be provided on at least one surface, two surfaces, especially two opposing surfaces, or even three or, most preferably, four surfaces.

[0013] The centering aid is advantageously shorter than each side wall such that the lateral gap is partially covered along the length of the side wall and is partially free, particularly at the corners with adjacent side walls. The length of the centering aid may be, for example, less than 80 percent, less than 70 percent, or even less than 60 percent of the length of the side wall.

[0014] Advantageously, the centering aid comprises a hollow chamber plate and / or rubber, such as ethylene-propylene-diene rubber. The centering aid may also comprise a plurality of hollow chamber plates, for example, one hollow chamber plate facing the stack comprising rubber, such as ethylene-propylene-diene rubber, and / or one hollow chamber plate facing the side wall comprising plastic, such as polypropylene.

[0015] In one preferred variation of this method, the centering aid is removed before the lid of the packaging box is placed over it. However, in principle, the centering aid may remain inside the packaging.

[0016] A method for packaging a planar substrate preferably further includes the step of placing a base plate directly or indirectly on the bottom wall of the bottom of a packaging box, and then placing the planar substrate directly or indirectly on the base plate and indirectly on the bottom wall. The base plate is preferably formed as a rigid base plate and / or advantageously can have higher rigidity than the bottom wall of the packaging box.

[0017] The underlayment is advantageously positioned to extend laterally beyond the planar substrate placed on it and protrude into the lateral gap. Particularly preferably, the underlayment is adjacent to one, some, or all of the side walls of the bottom of the packaging box.

[0018] The underlayment may further have one or more recesses, which may be located, for example, at the lateral edges and be formed to accommodate a centering aid. The recesses may be produced, for example, by punching.

[0019] The underlayment preferably includes or is formed as a hollow chamber plate and / or preferably includes rubber, such as ethylene-propylene-diene rubber.

[0020] Preferably, the underlay has a different color from the packaging box and / or intermediate layer. In particular, the underlay can have a darker color, such as black. Furthermore, the underlay can have a pattern. This may enable or facilitate camera-assisted automated unpacking, as will be further detailed below. In particular, different colors or patterns can be clearly detected by the camera system.

[0021] If no underlay is provided, or if the underlay is formed by the bottom wall, or regardless thereof, the bottom wall may, for example, have a different color from the intermediate layer, especially a darker color, such as black, or have a pattern.

[0022] Furthermore, it may be provided that an intermediate layer is placed directly or indirectly on the underlay before placing the (first) planar substrate.

[0023] Furthermore, the method of packing the planar substrate advantageously includes the step of placing a cover directly or indirectly on a stack formed by the planar substrate and an intermediate layer located therebetween, before covering the lid of the packing box. The cover may be formed identically to the underlay, so that fewer different components are used.

[0024] In particular, the cover may protrude laterally beyond the planar substrate and project into the lateral gap. Particularly preferably, the cover is adjacent to one, several or all of the side walls of the bottom and / or the lid.

[0025] The cover may also have one or more recesses for centering aids, which are arranged, for example, at the lateral ends or punched out.

[0026] Furthermore, the cover may comprise a hollow chamber plate or be formed as a hollow chamber plate and / or may comprise rubber, for example ethylene-propylene-diene rubber.

[0027] The method of packing the planar substrate may further include the step of placing a foam element, placing the foam element directly or indirectly on the stack, particularly directly or indirectly on the cover, and then covering the lid of the packing box. The foam element serves to compress the stack so that the stack or the substrates and / or intermediate layers laminated in the stack do not slip. Generally, if the foam element causes the evaporation of impurities and / or plasticizers in the packing box and such an influence is to be avoided, another type of elastic element may be provided instead of the foam element.

[0028] The foam element can have recesses, particularly two opposing recesses, which can serve to position / fix the desiccant bag. For example, the foam element can be H-shaped. The H-shape can also include, for example, lugs so that the desiccant bag does not slip.

[0029] The foam element placed on the stack protrudes, particularly from the side wall at the bottom, advantageously at least 2 millimeters, particularly preferably at least 4 millimeters, even more preferably at least 6 millimeters or at least 8 millimeters, for example 10 millimeters. The overhang of the foam element is advantageously formed such that the packing box does not bulge and the stack does not slip. The method can include a step of measuring the overhang of the foam element and, if the measured overhang is below a predetermined value, inserting an additional (further) cushion as required to increase the overhang.

[0030] Before placing the cushion and / or the foam element, an additional intermediate layer can be placed directly or indirectly on the stack.

[0031] The bottom layer and / or the top layer can contribute to ensuring sufficient rigidity of the package, particularly when the glass size is large. If the bottom layer and / or the top layer is not used, or independently of that, the bottom and / or the lid can ensure the required rigidity.

[0032] The intermediate layer, which can be located between planar substrates and / or can also be located, for example, at the beginning or the end of the stack, can advantageously have one or more recesses for centering aids, and these recesses can be, for example, punched out.

[0033] In one preferred modification of this method, for example, an intermediate layer is used that has two opposing surfaces adjacent to a planar substrate, each having a different surface roughness. In this case, a lower surface with a higher surface roughness and an upper surface with a lower surface roughness are particularly preferred. This makes it possible to advantageously reduce the adhesion of the planar substrate below the intermediate layer when removing the intermediate layer, which can be particularly advantageous in the case of thin glass.

[0034] The surface roughness of the intermediate layer may have the following values ​​in accordance with ISO 8791 / 4: The roughness of the bottom surface is 4 to 14 micrometers, preferably 6 to 12 micrometers, and particularly preferably 8 to 10 micrometers. The roughness of the top surface is 1 to 7 micrometers, preferably 2 to 6 micrometers, and particularly preferably 3 to 5 micrometers.

[0035] Furthermore, the intermediate layer may have a pH value of 5-9, preferably 6-8, and particularly preferably 7-8, and the pH value may be measurable in particular in accordance with ISO 8791-2. The intermediate layer preferably contains or consists of paper, and has a density of 20-80 g / m². 2 , advantageously 30-70g / m 2 Particularly preferred is 40-60 g / m² 2 For example, 50g / m 2 The basis weight may be provided.

[0036] The intermediate layer can have a greater thickness than the planar substrate, and advantageously can have a thickness of at least 1.25 times the thickness of the planar substrate, and particularly preferably at least 1.5 times the thickness of the planar substrate. The thickness of the intermediate layer may be, for example, 40 to 100 micrometers, advantageously 50 to 90 micrometers, and particularly preferably 60 to 70 micrometers.

[0037] The interlayer may further have one or more of the following properties in accordance with DIN EN 1924-2: the longitudinal (MD) breaking force is 20-80 N / 15 mm, preferably 30-50 N / 15 mm; the transverse (CD) breaking force is 10-40 N / 15 mm, preferably 15-25 N / 15 mm; the longitudinal (MD) elongation is 1.5%-1.9%, preferably 1.6%-1.8%; and the transverse (CD) elongation is 1.6%-2.0%, preferably 1.7%-1.9%.

[0038] The intermediate layer further has a burst pressure of 90-130 kPa, preferably 100-120 kPa, in accordance with DIN EN ISO 2758, and / or a Cobb value (water) of 10-40 g / m³ in accordance with DIN EN 20 535. 2 , advantageously 15-32g / m 2 The intermediate layer may have a moisture content of 1-5%, preferably 2-4%, in accordance with DIN EN 20 287. The intermediate layer may have a moisture content of 20% or less (T=35°) and may be stored in a drying cabinet before placement.

[0039] In particular, to avoid corrosion, scratching, and / or haze of the glass, it is preferable that the chemical properties of the intermediate layer (e.g., paper) are compatible with the planar substrate (e.g., pH value). In particular, using paper as the intermediate layer can avoid the formation of haze (corrosion of the glass, reaction with acid, H2O + CO2 reacting with Na on the glass surface to produce Na2CO3, which can lead to a salt layer on the surface). Preferably, the intermediate layer is industrially formed to be chlorine and acid-free. In particular, using an intermediate layer can avoid the reaction of acid and / or chlorine with the surface of the substrate (e.g., glass) to form salts that are difficult to wash away. The intermediate layer is further preferably made to release few particles and / or particles that can be washed away on the substrate.

[0040] The planar substrate, particularly the glass substrate, can have a thickness of less than 300 micrometers, preferably less than 100 micrometers, and especially preferably less than 50 micrometers.

[0041] A method for packaging a planar substrate advantageously further includes the steps of pressing a lid against the bottom to compress the foamed material elements, and / or securing the lid to the bottom with one or more strips surrounding the packaging box, and / or enclosing the packaging box in a housing and creating a vacuum inside the housing or introducing a protective gas, such as dry nitrogen. The packaging strips may play a role in or contribute to pressing or compressing the foamed material elements. The housing with a vacuum or protective gas may play a role in or contribute to avoiding the effects of air and moisture or the deposition of salt on the substrate.

[0042] The present invention further relates to packaged planar substrates, particularly glass substrates, that can be manufactured or have been manufactured by the method described above.

[0043] The present invention relates in particular to a packaged planar substrate, such as a glass substrate, wherein the packaged planar substrate comprises a packaging box having a bottom and a lid, the bottom comprising a bottom wall and preferably four side walls, and the lid comprising a top wall and preferably four side walls, and a stack of planar substrates and an intermediate layer located therebetween, the stack being placed directly or indirectly on the bottom wall, wherein the planar substrates are preferably spaced apart from the side walls of the bottom, and the intermediate layer preferably protrudes laterally from the planar substrates into the lateral gaps.

[0044] The packaged planar substrate may include a backing placed between the bottom wall of the base and the stack of planar substrates, the backing advantageously protruding laterally from the stack into the lateral gap, and particularly preferably protruding to be adjacent to one, some or all of the side walls.

[0045] The base plate preferably comprises a hollow chamber plate and / or rubber, such as ethylene-propylene-diene rubber. The base plate preferably has a different color, particularly black, or pattern from the packing box and / or intermediate layer, thereby enabling or facilitating camera-assisted automated unpacking. Furthermore, an additional intermediate layer may be placed between the base plate and the stack.

[0046] The packaged planar substrate may further include a top layer positioned between the top wall of the lid and the stack of planar substrates, the top layer advantageously protruding laterally from the planar substrates into the lateral gap, and particularly preferably protruding to be adjacent to one, some or all of the side walls.

[0047] The top layer may, advantageously, include a hollow chamber plate and / or rubber, such as ethylene-propylene-diene rubber. Alternatively or additionally, a foamed material element may be placed between the stack and the upper wall of the lid, particularly between the top layer and the upper wall of the lid.

[0048] The foamed material element advantageously has at least one recess, particularly two opposing recesses, and especially preferably, a desiccant bag is placed in this recess. Instead of, or in addition to, the packaging can be filled with a protective gas (e.g., dry nitrogen). A further intermediate layer may be placed between the stack and the top layer.

[0049] Furthermore, the packaged planar substrate may have one, some, or all of the features described in relation to the above-described method. In particular, the intermediate layer may have the above-described features, and / or the planar substrate may have the above-described features.

[0050] Finally, the present invention further relates to a method for unpacking a packaged planar substrate, particularly a glass substrate, from a packaging box.

[0051] The unpacking method includes the step of removing the lid of the packaging box to access the stack of planar substrates and intermediate layers located at the bottom of the packaging box, wherein the planar substrates are preferably spaced apart from the bottom sidewalls, and the intermediate layers are preferably laterally extended from the planar substrates and projected into the lateral gaps.

[0052] Furthermore, the unpacking method includes the step of removing the planar substrate from the stack, and doing so while pressing down on the intermediate layer located below it in the region that protrudes into the lateral gap.

[0053] Furthermore, the unpacking method advantageously includes the step of removing the intermediate layer located beneath the removed planar substrate from the stack.

[0054] The method advantageously includes the step of repeatedly removing the planar substrates and intermediate layers until all planar substrates and / or intermediate layers are removed from the stack.

[0055] A method for unpacking a packaged planar substrate can provide the automatic removal of the planar substrate and, advantageously, the intermediate layer.

[0056] In particular, the unpacking process can be monitored with a camera to automatically detect when the last planar substrate or the last intermediate layer is removed from the stack.

[0057] Advantageously, a backing is placed between the bottom wall and the stack of planar substrates, and the backing has a different color or pattern from the packaging box and / or intermediate layer, particularly black, to enable or facilitate automatic detection.

[0058] Furthermore, the unpacking method may have one, some, or all of the features described above in relation to the packaged planar substrate and / or the packaged method for the planar substrate.

[0059] In particular, the intermediate layer may have the characteristics described above, and / or the planar substrate may have the characteristics described above.

[0060] The present invention will be described in more detail below with reference to several drawings. [Brief explanation of the drawing]

[0061] [Figure 1] This is a top view showing the bottom of the packaging box with the underlay and centering aid inserted. [Figure 2] This is a top view showing the bottom of a packaging box with a base sheet and centering aid inserted, and an intermediate layer placed on top. [Figure 3] This is a top view showing the bottom of a packaging box with a base sheet and centering aid inserted, and an intermediate layer and planar substrate placed on top. [Figure 4] This is a top view showing the bottom of a packaging box having a stack of planar substrates and an intermediate layer located between them. [Figure 5] This is a side cross-sectional view of a packaging box having a bottom and a top, in which a stack of planar substrates and an intermediate layer located between them is packaged inside the packaging box.

[0062] Figures 1 to 5 show various sequential steps of an exemplary packaging method for a planar substrate 200. Figure 5 serves as an illustration of the planar substrate packaged according to the exemplary method.

[0063] Referring to Figure 5, the packaging box 10 includes a bottom 20 and a lid 30 that can be placed over the bottom. The bottom 20 has a lower wall 22 and side walls 24, the side walls 24 of which may be foldable. Similarly, the lid 30 has a top wall 32 and side walls 34, the side walls 34 of which may also be foldable. Instead of the foldable lateral retaining parts of the packaging box, the box may also have fixed sides that, for example, cannot be unfolded once folded. In particular to ensure secure covering of the substrate being packaged, the packaging box 10, the bottom 20 and / or the lid 30 may include or be made of a hollow chamber element and / or may include or be made of polypropylene (PP).

[0064] Referring to Figure 1, regarding the packaging method, first, a base 20 is provided, and a base sheet 500 is placed on the lower wall 22 of this base 20. Furthermore, a centering aid 400 is inserted into the base 20 on the lower wall 200, adjacent to the side wall 24. For this purpose, the base sheet 500 has an end-side recess 510 for the centering aid 400. The base sheet 500 is a rigid plate and may or may be made of, for example, polypropylene (PP).

[0065] Referring to Figure 2, in the next step, the first intermediate layer 300, which is formed in particular as an intermediate layer paper, is placed indirectly on the underlay 500 and therefore on the bottom wall 22 of the base. The intermediate layer 300 also has a recess 310 for a centering aid.

[0066] Referring to Figure 3, in the next step, a planar substrate 200, particularly a glass plate, is placed indirectly on the intermediate layer 300 and, therefore, on the bottom wall 22. The planar substrate 200 is placed such that a lateral gap A remains between the planar substrate 200 and the side wall 24. This is assisted in particular by the centering aid 400 (guiding block). The lateral guiding blocks can also contribute to stabilization.

[0067] Referring to Figure 4, in a subsequent step, further intermediate layers 300 and planar substrates 200 are alternately placed to form a stack 100 of planar substrates 200 and intermediate layers 300 located between them. Each intermediate layer 300 is larger in size than the planar substrate and therefore protrudes from the planar substrate 200 into the lateral gap A.

[0068] In other words, the interlayer paper is larger than the glass plate, and there is at least one recess in the interlayer material, and the glass plate does not extend into the region of this recess, so the interlayer paper can be reached from the side in this recessed region where the glass plate is not present.

[0069] Before closing the packing box 10 by placing the lid 30 over it, an upper sheet 600 identical or similar to the lower sheet 500 can be placed on the stack 100, and this upper sheet 600 may be formed as a rigid plate. The lower sheet 500 and / or upper sheet 600 contribute to stabilizing the stack of glass and paper. Since the lower sheet 500, the intermediate layer 300 and / or upper sheet 600 each have lateral cutouts for a centering aid in the same location, the centering aid can remain in the bottom during the packing process. In particular, the recesses each open outward in the center of the side so that the lower sheet, intermediate layer and / or upper sheet protrude further at the corners ("puzzle shape"). Advantageously, the centering aid (guiding block) is removed before placing the lid 30 over it.

[0070] Referring to Figure 5, before placing the lid 30, the foam material elements 700 are also placed on the top sheet 600, and the foam material elements 700 protrude from the upper end of the side wall 24 of the bottom 20 so that pressure is applied to the stack 100 when compressed. In this way, the foam material elements 700 play a role in compressing and / or securing the stack 100. Finally, packing strips and / or a vacuum enclosure can be further fitted to the packing box 10.

[0071] Packaged planar substrates, particularly glass substrates, that can be manufactured or have been manufactured in this manner can be automatically unpacked, especially at another location. For example, the stack 100 can be subjected to automated unpacking by first removing the vacuum housing and / or packing strips, and then removing the lid 30, foam element 700 and / or top sheet 600.

[0072] Automated unpacking of stack 100 can provide a step of alternately lifting the intermediate layer 300 and the planar substrate 200 from the stack, in which case the lifting from stack 100 can be done by suction, for example, the substrate 200 can be sucked by a surface suction device.

[0073] To enable or facilitate automated lifting, the base material 200 is preferably positioned in the center of the stack. Furthermore, the base material 200 may be centered at a predetermined distance from the intermediate layer 300, for example, such that the spacing between the paper / glass edges around the perimeter is 2 to 2.5 millimeters. The intermediate layer 300 may substantially correspond to the dimensions of the bottom (excluding the recess).

[0074] The surface of the intermediate layer 300 is preferably formed differently on the top and bottom surfaces, providing a smoother top surface and a rougher bottom surface. Such an asymmetrical intermediate layer material allows for advantageous utilization of the coefficient of friction or tribological effect. In particular, the rougher bottom surface makes it easier to remove the intermediate layer 300 because the underlying substrate (especially UTG) remains when the intermediate layer 300 is removed. The planar substrate 200 typically adheres more strongly to a smooth surface. Good adhesion of the substrate to the smoother top surface of the intermediate layer 300 has the advantage that the substrate does not slip on the intermediate layer or on the stack 100. Note that adhesion between the glass and paper when removing the glass is not a problem because the pressure for the protruding paper can be used to prevent slipping.

[0075] While lifting the substrate 200, the intermediate layer 300 below it is preferably pressed down. This pressing is preferably done at the corners of the intermediate layer 300 or at the corners between adjacent side walls 24 at the bottom of the packing box. This pressing counteracts the surface attraction between the substrate and the intermediate layer below it. The paper thickness is preferably adjusted with automated unpacking in mind, and in particular should not be too low to avoid handling problems, nor too high to avoid glass surface problems.

[0076] While the substrates 200 and intermediate layers 300 are being continuously removed from the stack 100, the process may be monitored by a camera, which can detect when all the substrates 200 and / or intermediate layers 300 have been removed from the stack 100. For this purpose, the packaging box may consist of two colors, and in particular, a base sheet of a different color, such as black, or a patterned base sheet.

Claims

1. A method for packaging a planar substrate (200) into a packaging box (10), The steps include providing the bottom (20) of the packaging box (10), wherein the bottom (20) has a lower wall (22) and a side wall (24), The steps include: placing a planar base material (200) directly or indirectly on the lower wall (22) of the bottom (20) of the packaging box (10), and performing the above placement such that a lateral gap (A) remains between the planar base material (200) and the side wall (24); The steps include: placing the intermediate layer (300) directly or indirectly on the planar substrate (200), and performing the above placement such that the intermediate layer (300) extends laterally from the planar substrate (200) and protrudes into the lateral gap (A); The steps include: forming a stack (100) of a planar substrate (200) and an intermediate layer (300) located between them by repeatedly placing the planar substrate and the intermediate layer; The steps include placing the lid (30) of the packaging box (10) over the bottom (20) of the packaging box (10), so that the stack (100) of the planar base material (200) is packaged from below and above by the bottom (20) and the lid (30), and Includes, The intermediate layer (300) has two opposing surfaces having different surface roughnesses. method.

2. The step of inserting one or more centering aids (400) adjacent to one of the side walls (24), wherein the insertion is performed before placing the planar substrate (200) and before forming the stack, wherein, Each centering aid (400) is positioned within the lateral gap (A) remaining between the planar substrate and the side wall, and the centering aid (400) plays a role in at least partially covering the lateral gap and / or holding the lateral gap when forming the stack. The centering aid (400) is such that the lateral gap is partially covered along the length of the side wall, is partially free, and is shorter than each of the side walls. The centering aid (400) includes a hollow chamber plate and / or rubber. The steps to make it so, The steps include: taking out the centering aid (400) before placing the lid (30) of the packaging box on top; A method for packaging a planar substrate according to claim 1, further comprising:

3. The step of placing the underlay (500) directly or indirectly on the lower wall (22) of the bottom (20) of the packaging box, and then placing the planar substrate directly or indirectly on the underlay and indirectly on the lower wall of the bottom, wherein, The underlay (500) extends laterally beyond the planar substrate placed on it and protrudes into the lateral gap. The underlay (500) has one or more recesses (510) for the centering aid (400), The aforementioned underlay (500) includes a hollow chamber plate and / or rubber, The underlay (500) has a different color from the packaging box and / or the intermediate layer, thereby enabling or facilitating camera-assisted automated unpacking. The steps to make it so, Before placing the planar substrate, the intermediate layer (300) is placed directly or indirectly on the underlay (500), The method for packaging a planar substrate according to claim 2, further comprising:

4. The step of placing the top sheet (600) directly or indirectly on the stack (100) of the planar base material and the intermediate layer located therebetween, before covering the lid of the packaging box, The aforementioned top covering (600) extends laterally from the planar base material and protrudes into the lateral gap, The top mat (600) has one or more recesses (610) for the centering aid (400), The aforementioned top sheet (600) includes a hollow chamber plate and / or rubber. The steps of making it so, and / or The steps include placing the foam material elements (700) directly or indirectly on the stack (100), and then covering it with the lid of the packaging box, The foam material element (700) has at least one recess (710), the recess serves to accommodate one or more desiccant bags, and The step of placing the intermediate layer (300) directly or indirectly on the stack (100) before placing the top layer (600) and / or the foam material elements (700). The method for packaging a planar substrate according to claim 2, further comprising:

5. The intermediate layer (300) has one or more recesses (310) for the centering aid (400), and / or The intermediate layer has a lower surface having a higher surface roughness and an upper surface having a lower surface roughness, and / or The intermediate layer has a pH value of 5 to 9, and / or the intermediate layer contains or consists of paper, and / or The intermediate layer has a greater thickness than the planar substrate, and / or The method for packaging a planar substrate according to claim 2, wherein the planar substrate has a thickness of less than 300 micrometers.

6. The steps of pressing the lid portion (30) against the bottom portion (20) to compress the foam material element, and / or The steps of fixing the lid to the bottom and / or The steps include sealing the aforementioned packaging box into the housing and creating a vacuum inside the housing or introducing a protective gas. A method for packaging a planar substrate according to claim 4, further comprising:

7. A packaged planar substrate, wherein the packaged planar substrate is A packing box (10) having a bottom (20) and a lid (30), wherein the bottom includes a bottom wall (22) and a side wall (24), and the lid includes a top wall (32) and a side wall (34), A stack (100) of a planar substrate and an intermediate layer (300) located between them, wherein the stack (100) is placed directly or indirectly on the lower wall of the bottom. The planar substrate includes, and each of the planar substrates has a gap (A) with respect to the side wall of the bottom, The intermediate layer (300) extends laterally from the planar substrate and protrudes into the lateral gap, and has two opposing surfaces having different surface roughnesses. Packaged planar substrate.

8. A base sheet (500) is placed between the bottom wall of the bottom and the stack of planar substrates, where, The aforementioned underlay (500) protrudes laterally from the stack and into the lateral gap, The aforementioned underlay (500) includes a hollow chamber plate and / or rubber, The underlay (500) has a different color from the packaging box and / or the intermediate layer, thereby enabling or facilitating camera-assisted automated unpacking. A further intermediate layer is placed between the aforementioned underlay (500) and the aforementioned stack. The packaged planar substrate according to claim 7, further comprising:

9. A top sheet (600) is placed between the upper wall of the lid and the stack of planar substrates, where, The aforementioned top covering (600) extends laterally from the planar base material and protrudes into the lateral gap, The aforementioned top sheet (600) shall include a hollow chamber plate and / or rubber, top sheet (600), and / or A foam material element (700) is disposed between the stack and the upper wall of the lid, where, The foam material element (700) has at least one recess, and A further intermediate layer is placed between the aforementioned stack and the aforementioned top layer. The packaged planar substrate according to claim 7 or 8, further comprising:

10. The intermediate layer (300) has a lower surface having a higher surface roughness and an upper surface having a lower surface roughness, and / or The intermediate layer has a pH value of 5 to 9, and / or the intermediate layer contains or consists of paper, and / or Each of the intermediate layers has a greater thickness than the planar substrate, and / or The packaged planar substrate according to any one of claims 7 to 9, wherein each planar substrate has a thickness of less than 300 micrometers.

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