Devices and related methods for cleaning substrates

Abstract

A device for cleaning a substrate. This device includes a polymer pad, a frame body, and a coupling member. The polymer pad has an upper surface and a lower surface. At least a part of the frame body extends between the upper surface and the lower surface of the polymer pad. The coupling member extends upward from at least a part of the frame body.

Description

Technical Field

[0001] The present disclosure relates to the field of attachable devices and related methods for cleaning substrates.

Background Art

[0002] Chemical mechanical planarization is a process in which a substrate is planarized and conditioned through a combination of chemical oxidation and mechanical abrasion. The process of chemical mechanical planarization results in residues, particles, and contaminants.

Summary of the Invention

[0003] Some embodiments relate to a device. In some embodiments, the device comprises a polymer pad having an upper surface and a lower surface. In some embodiments, the device comprises a frame body. In some embodiments, at least a portion of the frame body extends between the upper surface and the lower surface of the polymer pad. In some embodiments, the device comprises a coupling member extending from at least a portion of the frame body.

[0004] In some embodiments, the coupling member is configured to couple the device to an apparatus.

[0005] In some embodiments, the coupling member comprises a clamp configured to clamp the device to an apparatus.

[0006] In some embodiments, the coupling member comprises a fastener configured to fasten the device to an apparatus.

[0007] In some embodiments, the device further comprises a magnet configured to couple the device to an apparatus.

[0008] In some embodiments, the polymer pad is configured to perform at least one of cleaning, polishing, or brushing the surface of a semiconductor substrate.

[0009] In some embodiments, the polymer pad comprises a plurality of surface structures extending from the lower surface of the polymer pad.

[0010] In some embodiments, multiple surface structures are integrated with a polymer pad.

[0011] In some embodiments, the polymer pad comprises at least one of a flat lower surface, a flat upper surface, or any combination thereof.

[0012] In some embodiments, the polymer pad comprises a first polymer material. In some embodiments, the frame body comprises a second polymer material. In some embodiments, the second polymer material is different from the first polymer material.

[0013] In some embodiments, the first polymer material includes at least one of polyvinyl alcohol, polysulfone, polyethersulfone, polyarylsulfone, nylon, polyamide, fluoropolymer, polytetrafluoroethylene (PTFE), polyethylene, polypropylene, cellulose, acetate, or any combination thereof.

[0014] In some embodiments, the second polymer material includes at least one of polypropylene, polyethylene, copolymers thereof, or any combination thereof.

[0015] In some embodiments, the polymer pad has a disc shape.

[0016] In some embodiments, the frame body has a disc shape.

[0017] In some embodiments, the frame body includes a plurality of through holes in the surface of the frame body.

[0018] In some embodiments, the frame body and the connecting member form a single, unitary structure.

[0019] In some embodiments, the polymer pad is formed integrally with the frame body.

[0020] In some embodiments, the diameter of the polymer pad is between 1 mm and 450 mm.

[0021] In some embodiments, the porosity of the polymer pad is 50% to 99%.

[0022] Some embodiments relate to a method. In some embodiments, the method includes obtaining a device according to any combination of embodiments disclosed herein. In some embodiments, the method includes coupling the device to an apparatus.

[0023] In some embodiments, coupling involves clamping the device onto the mandrel of the apparatus.

[0024] In some embodiments, coupling involves securing the device to the mandrel of the apparatus.

[0025] In some embodiments, coupling involves securing the device to the mandrel of the apparatus via (one or more) magnets.

[0026] Some embodiments relate to a method for forming a device. In some embodiments, the method includes obtaining a frame. In some embodiments, the frame includes a frame body having a plurality of through holes and a coupling member extending from an edge portion of the frame body. In some embodiments, the method includes disposing at least the frame body in a mold. In some embodiments, the method includes obtaining a polymer material. In some embodiments, the method includes disposing the polymer material in the mold. In some embodiments, the method includes solidifying the polymer material.

[0027] In some embodiments, the method further includes heating the polymer material to a temperature sufficient to obtain a flowable polymer material.

[0028] In some embodiments, solidifying includes cooling the polymer material to a temperature sufficient to solidify the polymer material.

[0029] Some embodiments of the present disclosure are described herein by way of example only, with reference to the accompanying drawings. Next, referring specifically to the drawings in detail, it is emphasized that the illustrated embodiments are by way of example and for the purpose of an illustrative explanation of embodiments of the present disclosure. In this regard, the description made with the drawings will clarify to those skilled in the art how embodiments of the present disclosure can be practiced.

Brief Description of the Drawings

[0030] [Figure 1] FIG. 1 is a side view of a non-limiting embodiment of a device coupled to a mandrel of an apparatus according to some embodiments. [Figure 2] FIG. 2 is a cross-sectional view of a non-limiting embodiment of the device shown in FIG. 1 according to some embodiments. [Figure 3] FIG. 3 is a cross-sectional view of a non-limiting embodiment of a device according to some embodiments. [Figure 4A]This is a cross-sectional view of one non-limiting embodiment of the device, according to several embodiments. [Figure 4B] This is a perspective view of one non-limiting embodiment of a pyramidal structure, based on several embodiments. [Figure 5A] This is a cross-sectional view of one non-limiting embodiment of the device, according to several embodiments. [Figure 5B] This is a perspective view of one non-limiting embodiment of a cylindrical pillar, according to several embodiments. [Figure 5C] This is a perspective view of one non-limiting embodiment of a square pillar, according to several embodiments. [Figure 6] This is a cross-sectional view of one non-limiting embodiment of the device, according to several embodiments. [Figure 7] This is a cross-sectional view of one non-limiting embodiment of the device, according to several embodiments. [Figure 8] This is a flowchart of the method according to several embodiments. [Figure 9] This is a flowchart of the method according to several embodiments. [Modes for carrying out the invention]

[0031] Among the benefits and improvements disclosed, other objectives and advantages of this disclosure will become apparent from the following description, accompanied by the accompanying figures. While detailed embodiments of this disclosure are disclosed herein, it should be understood that the disclosed embodiments are merely illustrative examples of the various forms in which this disclosure may be embodied. Furthermore, each of the examples given with respect to the various embodiments of this disclosure is illustrative and not limiting.

[0032] Prior patents and publications referenced herein are incorporated in their entirety by reference.

[0033] Throughout this specification and the claims, the following terms have the meanings expressly relating to this specification unless the context explicitly specifies otherwise. The phrases “in one embodiment,” “in an embodiment,” and “in some embodiments” as used herein may refer to, but not necessarily, the same embodiment. Furthermore, the phrases “in another embodiment” and “in some other embodiments” as used herein may refer to, but not necessarily, different embodiments. All embodiments of this disclosure are combinable without departing from the scope or spirit of this disclosure.

[0034] As used herein, the term “based on” is non-exclusive and allows for the basis of additional factors not explicitly stated, unless the context otherwise explicitly specifies. Furthermore, throughout this specification, the meanings of “a,” “an,” and “the” include multiple references. The meaning of “in” includes “in” and “on.”

[0035] Some embodiments of this disclosure relate to a device for cleaning substrates. The device includes a polymer pad incorporated into a frame body and a coupling member extending upward from the frame body for securing the device to equipment. The frame body and coupling member are constructed from a material that is generally rigider than the soft polymer material used to form the polymer pad. The rigidity of the frame body and coupling member improves the structural integrity of the polymer pad and replaces the soft polymer extension with a rigid coupling member, thereby more securely securing and mounting the device to equipment. Additional advantages, among many other benefits, include easier mounting and removal from equipment, a longer lifespan for the polymer pad, and improved reliability, which will become apparent based on the disclosures herein.

[0036] In some embodiments, the devices disclosed herein are employed to clean or brush substrates, such as silicon wafers used in semiconductor manufacturing. Specifically, in some embodiments, the substrate undergoes polishing processes, such as chemical mechanical planarization (CMP) processes, where chemical oxidation and mechanical abrasion are used to achieve high substrate flatness. Processes such as CMP often result in the formation of various residues and contaminants on the substrate surface. These residues and contaminants need to be removed before further semiconductor manufacturing processes. Therefore, the devices disclosed herein may be useful in post-CMP cleaning modules, pre-CMP cleaning modules, and the like.

[0037] As used herein, the term “residue” refers to particles generated during a process (one or more). The term includes “(one or more) post-CMP residues.” For example, but not limited to, post-CMP residues may include, for example, silica-containing particles, particles from the polishing slurry, reaction by-products of the polishing slurry, carbon-rich particles, polishing pad particles, brush deloading particles, metals (e.g., at least one of copper, aluminum, tungsten, or any combination thereof), metal oxides, organic residues, barrier layer residues, any other materials that are by-products of the CMP process, or any combination thereof. It will be understood that the term may include other types of residues without departing from the scope of this disclosure.

[0038] As used herein, the term “contaminant” refers to one or more undesirable substances. The term includes, for example, at least one of the following: chemicals in a CMP slurry, reaction byproducts of abrasive slurries, any other materials that are byproducts of a CMP process, or any combination thereof. An example of a contaminant is benzotriazole. It will be understood that the term may include other types of contaminants without departing from the scope of this disclosure.

[0039] Figure 1 shows a side view of one non-limiting embodiment of device 100 coupled to a mandrel 202 of apparatus 200. Device 100 may include devices described in any combination of embodiments disclosed herein. In the illustrated embodiment, device 100 includes a polymer pad 102 configured to contact a substrate surface (e.g., to clean, brush, polish, etc.). A coupling member 106, shown, extending upward from a frame body (not shown), is configured to couple device 100 to apparatus 200. In some embodiments, the coupling member 106 is configured to be sufficiently detached to couple device 100 to the mandrel 202 and is also sufficiently elastic to snap back and secure device 100 to the mandrel 202. In some embodiments, the mandrel 202 may further include a groove 204, as shown, for further securing device 100 to the apparatus.

[0040] The side view shows multiple bonding members 106, but in some embodiments, the device 100 includes a single bonding member. In some embodiments, the device 100 includes multiple bonding members. In some embodiments, the polymer pad 102 is formed in the shape of a disk, and the bonding members extend upward from the periphery or outer circumference of the disk. In some of these embodiments, the bonding members may extend around all or part of the outer circumference of the disk.

[0041] Figure 2 is a cross-sectional view of one non-limiting embodiment of device 100, according to several embodiments. Device 100 includes a polymer pad 102, a frame body 104, and a connector 106. The polymer pad 102 has an upper surface 108 and a lower surface 110. The connector 106 is integral with the frame body 104. That is, the connector 106 and the frame body are a single, integral structure formed from the same building material. Since the polymer pad 102 is generally formed from a relatively soft polymer material (e.g., polyvinyl alcohol) for cleaning substrates, the frame body 104 is generally disposed within the polymer pad 102 to provide structural rigidity to device 100. That is, the frame body 104 extends into the polymer pad 102 between the upper surface 108 and the lower surface 110. Furthermore, the frame body 104 includes through holes 112 in the surface of the frame body 104. The through-hole 112 allows the fluid polymer material to be disposed within the through-hole and above and below the frame body 104 during the manufacturing of the device 100, so that when the fluid polymer material solidifies, the resulting polymer pad 102 is formed integrally with at least the frame body 104. The connecting member 106 extends upward from the periphery of the frame body 104 and over the polymer pad 102 in order to connect the device 100 to the apparatus 200.

[0042] The polymer pad 102 generally comprises a material that is softer than the frame body 104 and the binder 106. For example, in some embodiments, the polymer pad comprises a soft polymer material such as polyvinyl alcohol. In some embodiments, the polymer pad comprises at least one of polysulfone, polyethersulfone, polyarylsulfone, nylon, polyamide, fluoropolymer, polytetrafluoroethylene (PTFE), polyethylene, polypropylene, cellulose, acetate, or any combination thereof. In some embodiments, the frame body 104, the binder 106, or any combination thereof comprises a harder polymer material such as at least one of polypropylene, polyethylene, any copolymer thereof, or any combination thereof. In some embodiments, the frame body 104, the coupling member 106, or any combination thereof, comprises a fluid polymer material, which, once solidified, produces a coupling member 106 that is sufficiently elastic so that the coupling member 106 can be bent and sufficiently extensible to bias the clamp inward to engage the device 200 (e.g., snap on to and / or snap off from the mandrel).

[0043] The polymer pad 102 may have a thickness in the range of 0.1 mm to 50 mm, or any range or partial range between 0.1 mm and 50 mm. In some embodiments, for example, the polymer pad 102 may have a thickness in the range of 1 mm to 10 mm, 1 mm to 9 mm, 1 mm to 8 mm, 1 mm to 7 mm, 1 mm to 6 mm, 1 mm to 5 mm, 1 mm to 4 mm, 1 mm to 3 mm, 1 mm to 2 mm, 2 mm to 10 mm, 3 mm to 10 mm, 4 mm to 10 mm, 5 mm to 10 mm, 6 mm to 10 mm, 7 mm to 10 mm, 8 mm to 10 mm, 9 mm to 10 mm, 2 mm to 7 mm, 2 mm to 6 mm, 2 mm to 5 mm, 2 mm to 4 mm, 3 mm to 7 mm, 4 mm to 7 mm, 5 mm to 7 mm, 6 mm to 7 mm, any range or partial range between these, or any combination thereof.

[0044] The diameter of the polymer pad 102 can range from 1 mm to 450 mm, or over any range or partial range between 1 mm and 450 mm. In some embodiments, for example, the polymer pad 102 has a thickness in the range of 1 mm to 25 mm, 1 mm to 50 mm, 1 mm to 75 mm, 1 mm to 100 mm, 1 mm to 125 mm, 1 mm to 150 mm, 1 mm to 200 mm, 1 mm to 300 mm, 1 mm to 450 mm, 25 mm to 450 mm, 50 mm to 450 mm, 75 mm to 450 mm, 100 mm to 450 mm, 125 mm to 450 mm, 150 mm to 450 mm, 200 mm to 450 mm, or 300 mm to 450 mm.

[0045] In some embodiments, the diameter of the polymer pad 102 is less than the diameter of the substrate. In some embodiments, the substrate is a silicon wafer. In some embodiments, the diameter of the polymer pad 102 is less than 25 mm (e.g., 1 mm to 24 mm), less than 51 mm (e.g., 1 mm to 50 mm), less than 76 mm (e.g., 1 mm to 75 mm), less than 100 mm (e.g., 1 mm to 99 mm), less than 125 mm (e.g., 1 mm to 124 mm), less than 150 mm (e.g., 1 mm to 149 mm), less than 200 mm (e.g., 1 mm to 199 mm), less than 300 mm (e.g., 1 mm to 299 mm), or less than 450 mm (1 mm to 449 mm).

[0046] The porosity of the polymer pad 102 can refer to the dimensionless ratio of the volume of void space to the volume of bulk material. In some embodiments, the porosity of the polymer pad 102 is 50% to 99%, or any range or partial range between 50% and 99%. In some embodiments, the porosity of the polymer pad 102 is 60% to 99%, 65% to 99%, 70% to 99%, 75% to 99%, 80% to 99%, 85% to 99%, 90% to 99%, 85% to 95%, 85% to 90%, or 90% to 95%.

[0047] The coupling member 106 eliminates the need for the polymer pad 102 to have any extensions configured to be inserted into the mandrel 202 to secure the device 100 to the apparatus 200. For example, conventional polymer pads have a dovetail joint structure on the upper surface of the polymer pad to connect the conventional polymer pad to the apparatus, but the polymer pad 102 disclosed herein does not include a structure for connecting the polymer pad 102 to the apparatus 200. That is, in some embodiments, the polymer pad 102 has a flat upper surface. In some embodiments, the polymer pad 102 has a non-flat upper surface, and the non-flat upper surface does not have a structure for connecting the polymer pad 102 to the apparatus 200.

[0048] The polymer pad 102 has a lower surface configured for cleaning, polishing, or brushing the substrate surface. In some embodiments, the polymer pad 102 has a flat lower surface. In some embodiments, the polymer pad 102 has a non-flat lower surface. For example, in some embodiments, the polymer pad 102 includes a plurality of surface structures extending from the lower surface of the polymer pad 102. Various embodiments of the surface structures are described below.

[0049] Figure 3 is a cross-sectional view of one non-limiting embodiment of device 300, according to several embodiments. Device 300 is similar to device 100; therefore, the same reference numerals are used. Device 300 includes a plurality of surface structures 320. The plurality of surface structures 320 are integral with the polymer pad 302 and extend downward from the lower surface 310 of the polymer pad 302. The plurality of surface structures 320 are configured for cleaning the substrate surface. As shown in Figure 3, the plurality of surface structures 320 have a circular cross-section.

[0050] Figure 4 is a cross-sectional view of one non-limiting embodiment of device 400, according to several embodiments. Device 400 is similar to device 100; therefore, the same reference numerals are used. Device 400 includes a plurality of surface structures 420. The plurality of surface structures 420 are integral with the polymer pad 402 and extend downward from the lower surface 410 of the polymer pad 402. The plurality of surface structures 420 are configured for cleaning the substrate surface. As shown in Figure 4, the plurality of surface structures 420 have a triangular cross-section. In some embodiments, the plurality of surface structures 420 include a plurality of pyramidal structures, such as the pyramidal structure 430 shown in Figure 4B, which extends from the lower surface 410.

[0051] Figure 5A is a cross-sectional view of one non-limiting embodiment of device 500, according to several embodiments. Device 500 is similar to device 100; therefore, the same reference numerals are used. Device 500 includes a plurality of surface structures 520. The plurality of surface structures 520 are integral with the polymer pad 502 and extend downward from the lower surface 510 of the polymer pad 502. The plurality of surface structures 520 are configured for cleaning the substrate surface. As shown in Figure 5A, the plurality of surface structures 520 have a rectangular (or quadrilateral) cross-section. In some embodiments, for example, the plurality of surface structures 520 include a plurality of cylindrical pillars extending from the lower surface 510, such as the cylindrical pillar 530 shown in Figure 5B. In some embodiments, the plurality of surface structures 520 include a plurality of square pillars extending from the lower surface 510, such as the square pillar 540 shown in Figure 5C.

[0052] Figure 6 is a cross-sectional view of one non-limiting embodiment of device 600, according to several embodiments. Device 600 is similar to device 100; therefore, the same reference numerals are used. Device 600 includes coupling members 606. Each coupling member 606 is configured to fasten device 600 to the apparatus. In the illustrated embodiments, each coupling member 606 is shown to include fasteners 630, such as mechanical fasteners (e.g., screws), for fastening device 600 to the apparatus. In some embodiments, each fastener 630 is configured to pass through the coupling member 606 to a receiving member in the apparatus that receives the fastener 630 and connects device 600 to the apparatus.

[0053] Figure 7 is a cross-sectional view of one non-limiting embodiment of device 700, according to several embodiments. Device 700 is similar to device 100; therefore, the same reference numerals are used. Device 700 includes at least one magnet 730 coupled to the upper surface 708 of the polymer pad 702. The location and arrangement of the at least one magnet 730 on the upper surface 708 of the polymer pad 702 is not particularly limited. In some embodiments, the at least one magnet 730 is a single magnet curved around the outer circumference of the disk-shaped polymer pad 702. For each of the various configurations of the at least one magnet 730, the apparatus includes at least one second magnet for magnetically coupling device 700 to the apparatus.

[0054] Figure 8 is a flowchart of Method 800 in several embodiments. The Method includes step 802 of acquiring a device according to any combination of embodiments disclosed herein. The Method includes step 804 of coupling the device to the apparatus. The device may be coupled according to any combination of embodiments disclosed herein. For example, the device may be clamped to the apparatus (e.g., snap-on), attached to the apparatus, coupled to the apparatus via magnets, or any combination thereof. In some embodiments, the Method further includes step 806 of cleaning a substrate using the device. The Method may include any one or more of the above steps, and these may be performed in any order.

[0055] Figure 9 is a flowchart of a method for forming a device according to several embodiments. Method 900 includes a step 902 of obtaining a frame including a frame body and a connector. The frame may include a frame body according to any combination of embodiments disclosed herein and a connector according to any combination of embodiments disclosed herein. In some embodiments, the frame body includes a plurality of through holes in the surface of the frame body, and the connector extends from the edge portion of the frame body. The method then includes a step 904 of placing at least the frame body in a mold. The method further includes a step 906 of obtaining a polymer material (e.g., a fluid polymer material) and a step 908 of placing the polymer material in a mold. The method then includes a step 910 of solidifying the polymer material (for example, enough to form a device according to any combination of embodiments disclosed herein). In some embodiments, the method further includes heating the polymer material to a temperature sufficient to obtain a fluid polymer material. In some embodiments, solidification includes cooling the polymer material to a temperature sufficient to solidify the polymer material. This method may include one or more of the steps described above, and these steps may be performed in any order.

[0056] manner

[0057] Various embodiments are described below. Please understand that one or more of the features exhibited in the following embodiments may be combined with one or more of the other embodiments. Embodiment 1. A device, A polymer pad having an upper surface and a lower surface, The frame itself, At least a portion of the frame body extends between the upper and lower surfaces of the polymer pad, The frame itself, A connecting member extending from at least a portion of the frame body and A device equipped with the following features. Embodiment 2. The device according to Embodiment 1, wherein the coupling member is configured to couple the device to the apparatus. Embodiment 3. The device according to Embodiment 1 or 2, wherein the coupling member comprises a clamp configured for clamping the device to a device. Embodiment 4. The device according to any one of Embodiments 1 to 3, wherein the connecting member comprises a fastener configured for securing the device to the apparatus. Embodiment 5. The device according to any one of Embodiments 1 to 4, further comprising a magnet configured for coupling the device to the apparatus. Embodiment 6. The device according to any one of Embodiments 1 to 5, wherein the polymer pad is configured to perform at least one of cleaning, polishing, or brushing the surface of a semiconductor substrate. Embodiment 7. The device according to any one of Embodiments 1 to 6, wherein the polymer pad comprises a plurality of surface structures extending from the lower surface of the polymer pad. Embodiment 8. The device according to Embodiment 7, wherein multiple surface structures are integrated with a polymer pad. Embodiment 9. The device according to any one of Embodiments 1 to 8, wherein the polymer pad comprises at least one of a flat lower surface, a flat upper surface, or any combination thereof. Embodiment 10. The polymer pad comprises a first polymer material, The frame body comprises a second polymer material, The second polymer material is different from the first polymer material. The device according to any one of embodiments 1 to 9. Embodiment 11. The device according to Embodiment 10, wherein the first polymer material comprises at least one of polyvinyl alcohol, polysulfone, polyethersulfone, polyarylsulfone, nylon, polyamide, fluoropolymer, polytetrafluoroethylene (PTFE), polyethylene, polypropylene, cellulose, acetate, or any combination thereof. Embodiment 12. The device according to Embodiment 10, wherein the second polymer material comprises at least one of polypropylene, polyethylene, copolymers thereof, or any combination thereof. Embodiment 13. The device according to any one of Embodiments 1 to 12, wherein the polymer pad has a disc shape. Embodiment 14. The device according to any one of Embodiments 1 to 13, wherein the frame body has a disk shape. Embodiment 15. The device according to any one of Embodiments 1 to 14, wherein the frame body comprises a plurality of through holes on the surface of the frame body. Embodiment 16. The device according to any one of Embodiments 1 to 15, wherein the frame body and the connecting member are a single, integrated piece. Embodiment 17. The device according to any one of Embodiments 1 to 16, wherein the polymer pad is formed integrally with the frame body. Embodiment 18. The device according to any one of Embodiments 1 to 17, wherein the diameter of the polymer pad is 1 mm to 450 mm. Embodiment 19. The device according to any one of Embodiments 1 to 18, wherein the porosity of the polymer pad is 50% to 99%. Embodiment 20. Obtaining the device described in any one of Embodiments 1 to 19, Connecting a device to a device and Methods that include... Embodiment 21. The method according to Embodiment 20, wherein coupling includes clamping the device onto the mandrel of the apparatus. Embodiment 22. The method according to Embodiment 20 or 21, wherein coupling includes securing the device to the mandrel of the apparatus. Embodiment 23. The method according to any one of Embodiments 20 to 22, wherein coupling includes securing the device to the mandrel of the apparatus via magnets. Embodiment 24. A method for forming a device, It is about obtaining the frame, The frame, A frame body having multiple through holes, A connecting member extending from the edge of the frame body and Equipped with, To obtain a frame, At the very least, the frame itself must be placed within the mold, Obtaining polymer materials, Placing polymer material inside the mold, To solidify a polymer material sufficient to form the device described in any one of embodiments 1 to 17 Methods that include... Embodiment 25. The method according to Embodiment 24, further comprising heating the polymer material to a temperature sufficient to obtain a fluid polymer material. Embodiment 26. The method according to Embodiment 24 or 25, wherein solidification includes cooling the polymer material to a temperature sufficient to solidify the polymer material. It should be understood that modifications may be made to the details, particularly with respect to the shape, size, and arrangement of the building materials and components used, without departing from the scope of this disclosure. The embodiments described herein and described herein are examples, and the true scope and spirit of this disclosure are indicated by the appended claims.

Claims

1. It is a device, A polymer pad having an upper surface and a lower surface and comprising a first polymer material, A frame body comprising a second polymer material, wherein the second polymer material differs from the first polymer material, and at least a portion of the frame body extends between the upper surface and the lower surface of the polymer pad, A coupling member extending from at least a portion of the frame body, wherein the coupling member is configured to connect the device to the apparatus, and Equipped with, In the polymer pad, the first polymer material is solidified integrally with the frame body while accommodating at least a portion of the frame body, in a device.

2. The device according to claim 1, wherein the polymer pad comprises a plurality of surface structures extending from the lower surface of the polymer pad.

3. The device according to claim 2, wherein the plurality of surface structures are integrated with the polymer pad.

4. The device according to claim 1, wherein the first polymer material comprises at least one of polyvinyl alcohol, polysulfone, polyethersulfone, polyarylsulfone, nylon, polyamide, fluoropolymer, polytetrafluoroethylene (PTFE), polyethylene, polypropylene, cellulose, acetate, or any combination thereof.

5. The device according to claim 1, wherein the second polymer material comprises at least one of polypropylene, polyethylene, copolymers thereof, or any combination thereof.

6. The device according to claim 1, wherein the frame body has a disk shape.

7. The device according to claim 1, wherein the frame body has a plurality of through holes on the surface of the frame body.

8. The device according to claim 1, wherein the frame body and the connecting member are a single, integrated piece.

9. The device according to claim 1, wherein the porosity of the polymer pad is 50% to 99%.

10. A method for forming the device according to any one of claims 1 to 9, It is about obtaining the frame, The aforementioned frame, A frame body having multiple through holes, A connecting member extending from the edge portion of the frame body and Equipped with, To obtain a frame, To place at least a portion of the frame body inside the mold, A fluid polymer material is supplied to the mold, and the fluid polymer material is solidified within the mold while containing at least a portion of the frame body, thereby forming a polymer pad. Methods that include...

11. The method according to claim 10, wherein forming the polymer pad comprises heating a polymer material placed in the mold to a temperature sufficient to obtain the fluid polymer material, and cooling the fluid polymer material to a temperature that causes it to solidify.

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