Resin compositions, films, laminates, and flexible printed circuit boards

The resin composition addresses the limitations of existing polyurethane resins by using a photosensitive polyesterimide resin with controlled molecular weight and imide bond concentration, enhancing heat resistance, flexibility, and low water absorption for laminates and flexible printed circuit boards.

JP7883083B1Active Publication Date: 2026-06-30DAINICHISEIKA COLOR & CHEMICALS MFG CO LTD
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Patent Information

Application Number
JP2026518092
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Priority Date
2025-02-17
Filing Date
2026-02-05
Publication Date
2026-06-30
Estimated Expiration
2046-02-05

AI Technical Summary

Technical Problem

Existing polyurethane resins used in adhesives for vehicles and electronic materials lack sufficient heat resistance, low water absorption, and storage stability in low-boiling point solvents, while also containing highly polar urethane and imide bonds that affect their performance.

Method used

A resin composition comprising a photosensitive polyesterimide resin with specific molecular weight, acid value, and imide bond concentration, combined with an epoxy resin and photopolymerization initiator, to form films with low thermal expansion, excellent heat resistance, and low water absorption.

Benefits of technology

The resin composition forms cured products with improved heat resistance, flexibility, and low water absorption, along with excellent weak alkali developability and photosensitivity, suitable for laminates and flexible printed circuit boards.

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Abstract

The present invention provides a resin composition capable of forming cured products such as films with a low coefficient of linear expansion, excellent heat resistance, flexibility, and low water absorption. The resin composition contains a photosensitive resin, an epoxy resin, and a photopolymerization initiator, wherein the photosensitive resin has a structure represented by general formula (1) (where n is a number from 0 to 20, R1 represents an organic group obtained by removing an acid anhydride group from a tetracarboxylic dianhydride, R2 represents an organic group obtained by removing an amino group from a polyamine, R3 represents an organic group obtained by removing a hydroxyl group from a polyol, and Y represents a group containing a hydroxyl group and a polymerizable unsaturated double bond, or a hydrogen atom, and part of Y is a hydrogen atom), the polyamine contains a dimer amine, the acid value is 25 to 95 mgKOH / g, and the weight-average molecular weight is 4,000 or more, and is a photosensitive polyesterimide resin. TIFF0007883083000014.tif36170
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Citation Information

Patent Citations

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    JP2010139993A

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    WO2021187355A1