Cleaning apparatus, cleaning method, and wire bonding apparatus

Abstract

To improve the removal rate of dirt adhering to the side surface of a bonding tool. [Solution] The device comprises an outer tube (50), an inner tube (40), a suction tube (64) and a vacuum tube (65) that supply vacuum from a vacuum source (61) to the inner tube, the outer tube (50) having a plurality of notches (52) extending downward from an upper end surface (55), the inner tube (40) having a base portion (41) joined to the inner surface of the outer tube (50) and an upper end portion (42) spaced apart from the inner surface of the outer tube (50), and having flexibility such that when vacuum is supplied to the interior from the vacuum source (61), the upper end portion (42) is crushed radially and comes into contact with the surface of the capillary (16), and has a removal portion at the point where it comes into contact with the surface of the capillary (16).

Description

Technical Field

[0001] The present disclosure relates to a cleaning device for cleaning the surface of a bonding tool, a cleaning method using the cleaning device, and a wire bonding device including the cleaning device.

Background Art

[0002] A wire bonding device that connects a pad of a semiconductor chip and a lead of a lead frame with a metal wire is used. In the wire bonding device, as bonding is repeated, impurities deposited on the surface of the metal wire adhere to the tip surface of the capillary as dirt. If bonding is continued with dirt remaining on the tip surface of the capillary, the wire may not be sufficiently pressed onto the lead, and the bonding quality may deteriorate. For this reason, a method for cleaning the tip surface of the capillary has been proposed.

[0003] For example, Patent Document 1 discloses a method of cleaning the tip surface of a capillary by pressing and rubbing the tip surface of the capillary against a plate member plated with gold or copper.

[0004] Further, Patent Document 2 discloses a method of cleaning the tip surface by moving the tip surface of the bonding tool horizontally while pressing it against a fixed brush, and a method of cleaning the tip surface by pressing the tip surface of the bonding tool against a rotating brush.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0006] Incidentally, in wire bonding equipment, dirt can sometimes adhere to the sides of the bonding tool. When dirt adheres to the sides, it can cause errors in detecting the tip position of the bonding tool, which can lead to a decrease in bonding quality. However, the cleaning methods described in references 1 and 2 were insufficient to adequately remove the dirt adhering to the sides of the bonding tool.

[0007] Therefore, this disclosure aims to improve the removal rate of dirt adhering to the sides of bonding tools. [Means for solving the problem]

[0008] The cleaning apparatus of this disclosure is a cleaning apparatus for cleaning the surface of a bonding tool used to bond a wire to a bonding target, comprising: an outer tube having a predetermined rigidity; an inner tube fitted into the inner surface of the outer tube and into which the tip of the bonding tool is inserted; and a path for supplying vacuum from a vacuum source to the inner tube, wherein the outer tube includes a plurality of notches extending downward from its upper end surface, and the inner tube includes a base portion joined to the inner surface below the lower end of the notches of the outer tube, and an upper end portion spaced apart from the inner surface between the upper end surface of the outer tube and the lower end of the notches, and the upper end portion has flexibility such that it collapses radially and contacts the surface of the bonding tool when vacuum is supplied to the interior from a vacuum source, and has a removal portion at the location that contacts the surface of the bonding tool.

[0009] In this way, the upper end of the inner tube is flattened radially and comes into contact with the side of the tip of the bonding tool. As the bonding tool moves vertically, the upper end rubs against the side of the tip of the bonding tool, cleaning the side. This improves the removal rate of dirt adhering to the side of the tip of the bonding tool. Furthermore, this improves the accuracy of detecting the position of the tip of the bonding tool, suppressing the deterioration of bonding quality when bonding is repeated.

[0010] The cleaning apparatus of this disclosure may have a drive mechanism for moving the removal unit relative to the surface of the bonding tool.

[0011] This allows the bonding tool to be rotated, enabling cleaning of the entire side of the bonding tool.

[0012] In the cleaning apparatus of the present disclosure, the plurality of notches are arranged in pairs opposite each other in the diametrical direction of the outer tube, and when the front interior of the inner tube is vacuumed, the upper end of the inner tube may be crushed in a direction perpendicular to the direction in which the notches are aligned, and a portion of the upper end may protrude into the notches.

[0013] This allows the inner tube to be more easily compressed radially, enabling its upper end to adhere tightly to the side of the tip of the bonding tool. This improves the removal rate of dirt adhering to the side of the tip of the bonding tool.

[0014] In the cleaning apparatus of this disclosure, the upper end of the inner tube may have a plurality of notches located at positions corresponding to the circumferential center of the notch of the outer tube. .

[0015] This allows the inner tube to be more easily compressed radially, ensuring that its upper end adheres securely to the side of the tip of the bonding tool. This improves the removal rate of dirt adhering to the side of the tip of the bonding tool.

[0016] In the cleaning apparatus of this disclosure, the notch has a vertical length of 1.5 to 3 times the diameter of the inner tube, a circumferential width of at least twice the wall thickness of the inner tube and at least 1 / 4 of the outer circumference of the inner tube, and the inner tube may be made of a resin containing abrasive particles, with a rubber Shore of 60 or less and a wall thickness of at least 1 / 10 of the inner diameter.

[0017] This ensures that the inner tube collapses radially when the inside is evacuated, and that it returns to its original annular shape when the inside is returned to atmospheric pressure.

[0018] The cleaning method of this disclosure is a cleaning method for cleaning the surface of a bonding tool used to bond a wire to a bonding object, comprising: an outer tube having a predetermined rigidity; an inner tube fitted into the inner surface of the outer tube and into which the tip of the bonding tool is inserted; and a path for supplying vacuum from a vacuum source to the inner tube, wherein the outer tube includes a plurality of notches extending downward from its upper end surface, and the inner tube includes a base portion joined to the inner surface below the lower end of the notches of the outer tube, and an upper end portion positioned spaced apart from the inner surface between the upper end surface of the outer tube and the lower end of the notches, and vacuum is supplied to the interior from a vacuum source. The cleaning device is characterized by having a flexible upper end that collapses radially and contacts the surface of the bonding tool when it is used, and having a removal section at the part that contacts the surface of the bonding tool, and by including the following steps: first step of inserting the bonding tool into the inner tube; second step of creating a vacuum inside the inner tube; third step of pulling out the bonding tool from the inner tube while the inside of the inner tube is under vacuum; fourth step of returning the inside of the inner tube to atmospheric pressure after the third step; and fifth step of rotating the outer tube by a predetermined angle in the circumferential direction, and repeating steps 1 to 5 a predetermined number of times.

[0019] In this way, by creating a vacuum inside the inner tube and compressing its upper end radially to bring it into contact with the side of the bonding tool, the bonding tool is moved upward, allowing the upper end to rub against the side of the bonding tool and clean the side. Furthermore, by rotating the outer tube together with the inner tube by a predetermined angle in the circumferential direction and repeating the above operation, the sides of the bonding tool can be cleaned along its entire circumference, improving the rate of removal of dirt from the sides.

[0020] In the cleaning method of this disclosure, the third step may involve rotating the outer tube circumferentially when withdrawing the bonding tool from the inner tube.

[0021] This allows the sides of the bonding tool to be rubbed in both the vertical and circumferential directions when withdrawing it, thereby cleaning the sides.

[0022] The cleaning method of this disclosure is a cleaning method for cleaning the surface of a bonding tool used to bond a wire to a bonding object, comprising: an outer tube having a predetermined rigidity; an inner tube fitted into the inner surface of the outer tube and into which the tip of the bonding tool is inserted; and a path for supplying vacuum from a vacuum source to the inner tube, wherein the outer tube includes a plurality of notches extending downward from its upper end surface, and the inner tube has a base portion joined to the inner surface below the lower end of the notches of the outer tube, and the upper end surface of the outer tube and the lower end of the notches The cleaning device includes an inner tube and an upper end spaced apart from the inner surface between them, and is flexible such that when vacuum is supplied to the interior from a vacuum source, the upper end collapses radially and contacts the surface of the bonding tool, and has a removal section at the point where it contacts the surface of the bonding tool. The cleaning device is characterized by including a first step of inserting the bonding tool into the inner tube, a second step of creating a vacuum inside the inner tube, and a third A step of pulling out the bonding tool from the inner tube while rotating the outer tube in the circumferential direction while the inside of the inner tube is under vacuum.

[0023] As a result, the upper end portion of the inner tube can clean the side surface of the bonding tool by rubbing it in the vertical and circumferential directions.

[0024] The wire bonding apparatus of the present disclosure is a wire bonding apparatus that bonds a wire to a bonding target, and includes a bonding tool that bonds the wire to the bonding target, a drive unit that moves the bonding tool in the vertical direction, a cleaning unit that cleans the surface of the bonding tool, and a control unit. The cleaning unit includes an outer tube having a predetermined rigidity, an inner tube that is fitted into the inner surface of the outer tube and into which the tip of the bonding tool is inserted, and a path for supplying vacuum from a vacuum source to the inner tube. The outer tube includes a plurality of notches extending downward from the upper end surface. The inner tube includes a base portion joined to the inner surface below the lower end of the notch of the outer tube, and an upper end portion disposed apart from the inner surface between the upper end surface of the outer tube and the lower end of the notch. When vacuum is supplied to the inside from the vacuum source, the upper end portion has flexibility to collapse in the radial direction and contact the surface of the bonding tool, and has a removal portion at a location where it contacts the surface of the bonding tool. The apparatus further includes a drive mechanism that relatively moves the removal portion with respect to the surface of the bonding tool. The control unit adjusts the operations of the drive unit and the drive mechanism, inserts the bonding tool into the inner tube by the drive unit, evacuates the inside of the inner tube, pulls the bonding tool out of the inner tube by the drive unit while the inside of the inner tube is in a vacuum state, returns the inside of the inner tube to atmospheric pressure, and rotates the outer tube by a predetermined angle in the circumferential direction by a rotational drive unit, and repeats this a predetermined number of times.

[0025] As a result, the bonding tool can be cleaned by rubbing it at the upper end of the inner tube. Further, by rotating the outer tube together with the inner tube by a predetermined angle in the circumferential direction and repeatedly performing the above operation, the surface can be cleaned over the entire circumference of the bonding tool, and the removal rate of dirt on the side surface can be improved. Therefore, the detection accuracy of the tip position of the bonding tool is improved, and a decrease in the bonding quality when bonding is repeated can be suppressed.

[0026] In the wire bonding apparatus of the present disclosure, when the control unit pulls out the bonding tool from the inner tube by the driving unit, the driving mechanism may rotate the outer tube in the circumferential direction.

[0027] As a result, when the bonding tool is pulled out, the side surface of the bonding tool can be rubbed in the vertical and circumferential directions to clean the side surface.

[0028] The wire bonding apparatus of the present disclosure is a wire bonding apparatus for bonding a wire to a bonding target, comprising: a bonding tool for bonding the wire to the bonding target; a drive unit for moving the bonding tool vertically; a cleaning unit for cleaning the surface of the bonding tool; and a control unit, wherein the cleaning unit comprises: an outer tube having a predetermined rigidity; an inner tube fitted into the inner surface of the outer tube and into which the tip of the bonding tool is inserted; and a path for supplying vacuum from a vacuum source to the inner tube, wherein the outer tube includes a plurality of notches extending downward from its upper end surface; and the inner tube has a base portion joined to the inner surface below the lower end of the notches of the outer tube. The device includes an upper end portion spaced apart from the inner surface between the upper end surface of the outer tube and the lower end of the notch, and when vacuum is supplied to the interior from a vacuum source, the upper end portion has flexibility to collapse radially and contact the surface of the bonding tool, and has a removal portion at the portion that contacts the surface of the bonding tool, and further comprises a drive mechanism for moving the removal portion relative to the surface of the bonding tool, and the control unit adjusts the operation of the drive unit and the operation of the drive mechanism, inserting the bonding tool into the interior of the inner tube by the drive unit, creating a vacuum inside the inner tube, and while the interior of the inner tube is under vacuum, the drive mechanism rotates the outer tube circumferentially while the drive unit pulls the bonding tool out of the inner tube.

[0029] This allows the upper end of the inner tube to rub and clean the sides of the bonding tool in both vertical and circumferential directions.

[0030] In the wire bonding apparatus of this disclosure, an ultrasonic transducer is provided to ultrasonically vibrate the bonding tool, and the control unit may ultrasonically vibrate the bonding tool with the ultrasonic transducer when withdrawing the bonding tool from the inner tube.

[0031] This allows for the effective removal of highly adhesive dirt.

[0032] In the wire bonding apparatus of this disclosure, the control unit may vibrate the bonding tool vertically by a drive unit when the bonding tool is withdrawn from the inner tube.

[0033] This allows for the effective removal of highly adhesive dirt.

[0034] The wire bonding apparatus of the present disclosure is a wire bonding apparatus for bonding a wire to a bonding target, comprising: a bonding tool for bonding the wire to the bonding target; a drive unit for moving the bonding tool vertically; a cleaning unit for cleaning the surface of the bonding tool; and a control unit, wherein the cleaning unit comprises: an outer tube having a predetermined rigidity; an inner tube fitted into the inner surface of the outer tube and into which the tip of the bonding tool is inserted; and a path for supplying vacuum from a vacuum source to the inner tube, wherein the outer tube includes a plurality of notches extending downward from its upper end surface, and the inner tube comprises: a base portion joined to the inner surface below the lower end of the notches of the outer tube; and between the upper end surface of the outer tube and the lower end of the notches The outer tube includes an upper end portion spaced apart from the inner surface, and when vacuum is supplied to the interior from a vacuum source, the upper end portion has flexibility to collapse radially and contact the surface of the bonding tool, and has a removal portion at the portion that contacts the surface of the bonding tool, and further comprises a drive mechanism for moving the removal portion relative to the surface of the bonding tool, and the control unit adjusts the operation of the drive portion and the operation of the drive mechanism, and is characterized by repeating the following a predetermined number of times: inserting the bonding tool into the interior of the inner tube with the drive mechanism, creating a vacuum inside the inner tube, pulling out the bonding tool from the inner tube with the drive mechanism while the inside of the inner tube is under vacuum, returning the inside of the inner tube to atmospheric pressure, and rotating the outer tube by a predetermined angle in the circumferential direction with the drive mechanism.

[0035] This allows for capillary cleaning without operating the drive unit of the wire bonding device. [Effects of the Invention]

[0036] This disclosure can improve the removal rate of dirt adhering to the sides of bonding tools. [Brief explanation of the drawing]

[0037] [Figure 1] This is a schematic diagram showing the configuration of a wire bonding apparatus according to an embodiment. [Figure 2] Figure 1 is a magnified perspective view of the cleaning tube. [Figure 3A] Figure 2 is a cross-sectional view of the cleaning tube, specifically section AA shown in Figure 2. [Figure 3B] Figure 2 is a cross-sectional view of the cleaning tube, specifically the BB cross-section shown in Figure 2. [Figure 4] This flowchart shows the cleaning operation of the wire bonding apparatus according to the embodiment. [Figure 5] This is a perspective view showing the wire bonding apparatus of the embodiment with the capillary moved directly above the cleaning tube. [Figure 6] This is a perspective view showing the wire bonding apparatus of the embodiment, with the capillary inserted into the inner tube and the inside of the inner tube evacuated. [Figure 7A] Figure 6 is a cross-sectional view of the cleaning tube, specifically the CC cross-section shown in Figure 6. [Figure 7B] Figure 6 is a cross-sectional view of the cleaning tube, specifically the DD cross-section shown in Figure 6. [Figure 8] Figure 7A is a detailed view of section E, which is a cross-sectional view showing the change at the upper end of the inner tube when the capillary is withdrawn from the inner tube. [Figure 9] This is a perspective view showing the wire bonding apparatus of the embodiment with the capillary withdrawn from the inner tube. [Figure 10A] Figure 9 is a cross-sectional view of the cleaning tube, specifically the FF cross-section shown in Figure 9. [Figure 10B] Figure 9 is a cross-sectional view of the cleaning tube, specifically the G-G section shown in Figure 9. [Figure 11] This is a perspective view showing the cleaning tube rotated 90 degrees. [Figure 12] This is a perspective view showing other cleaning tubes. [Figure 13] This flowchart shows other cleaning operations of the wire bonding apparatus according to the embodiment. [Figure 14] This flowchart shows a cleaning method according to an embodiment. [Figure 15] The flowchart shows a cleaning method of another embodiment. [Figure 16] This is a schematic diagram showing the configuration of a wire bonding apparatus in another embodiment. [Modes for carrying out the invention]

[0038] The wire bonding apparatus 100 of this embodiment will be described below with reference to the drawings. As shown in Figure 1, the wire bonding apparatus 100 includes an XY table 11, a bonding head 12, a bonding arm 15, a capillary 16, a bonding stage 17, an ultrasonic transducer 18, a wire spool 19, a cleaning device 200, and a control unit 80. In the following description, the transport direction of the substrate 21 will be described as the X direction, the direction from the bonding head 12 toward the capillary holding portion 15A at the tip of the bonding arm 15 will be described as the Y direction, and the vertical direction will be described as the Z direction.

[0039] The XY table 11 drives the bonding head 12 mounted on top in the XY direction as shown by arrow 91 in Figure 1. The bonding arm 15 includes a capillary holder 15A at the tip and a base 15B. The capillary 16 is attached to the capillary holder 15A. The base 15B is attached to the bonding head 12 so as to rotate around a rotation axis 15C. The bonding head 12 is equipped with a Z-direction motor 13 inside which rotates the base 15B of the bonding arm 15 around the rotation axis 15C. The Z-direction motor 13 rotates the base 15B around the rotation axis 15C as shown by arrow 92 in Figure 1. As a result, the tip 16B of the capillary 16 attached to the capillary holder 15A moves up and down to move toward and away from the substrate 21 as shown by arrow 93 in Figure 1. The XY table 11 and the Z-direction motor 13 of the bonding head 12 constitute a drive unit 14 that moves the tip portion 16B of the capillary 16 in the XYZ directions.

[0040] The bonding stage 17 vacuum-adsorbs the substrate 21 to its upper surface and heats the substrate 21 with a built-in heater (not shown). A semiconductor die 22 is attached to the surface of the substrate 21.

[0041] The capillary 16 consists of a cylindrical base portion 16A held by a capillary holder 15A, and an elongated frustoconical tip portion 16B extending downward from the lower end of the base portion 16A. The side surface of the tip portion 16B is a cone. The base portion 16A and the tip portion 16B have holes extending vertically through their centers. A wire 70 is inserted through the hole, and the wire 70 extends downward from the tip portion 16B. The capillary 16 bonds the wire 70 extending from the tip portion 16B to the pads of the semiconductor die 22 and the leads of the substrate 21, connecting the pads and leads with the wire 70. The capillary 16 is a bonding tool, and the pads of the semiconductor die 22 and the leads of the substrate 21 constitute the objects to be bonded.

[0042] The wire spool 19 is located on top of the bonding head 12 and supplies the wire 70 to the capillary 16.

[0043] The cleaning device 200 includes a cleaning tube 30, a rotary drive unit 35, a suction tube 64, a vacuum tube 65, a vacuum valve 62, a filter 63, and an atmospheric release valve 67. The cleaning device 200 constitutes the cleaning section of the wire bonding device 100. The vacuum source 61 may consist of, for example, a vacuum tank and a vacuum pump. The cleaning tube 30 includes an inner tube 40 and an outer tube 50 (see Figures 2 and 3), into which the tip 16B of the capillary 16 is inserted. The structure of the cleaning tube 30 will be described later with reference to Figures 2 and 3. The rotary drive unit 35 rotates the outer tube 50 in the circumferential direction. As will be described later, the inner tube 40 is bonded to the outer tube 50, so when the rotary drive unit 35 rotates the outer tube 50, the inner tube 40 rotates circumferentially together with the outer tube 50. Furthermore, at this time, the removal section 42C (which will be explained later with reference to Figure 8) on the inner surface of the upper end 42 of the inner tube 40 rotates circumferentially together with the inner tube 40 and the outer tube 50. The rotation drive unit 35 constitutes a drive mechanism that moves the removal section 42C relative to the surface of the capillary 16. The filter 63 allows air to pass through but prevents foreign matter removed from the side surface of the capillary 16 from passing through. The filter 63 may be, for example, a centrifugal filter.

[0044] The inner tube 40 and the filter 63 are connected by a suction tube 64. The filter 63 and the vacuum source 61 are connected by a vacuum tube 65. A vacuum valve 62 is provided in the vacuum tube 65. The vacuum valve 62 is, for example, an electromagnetic gate valve. An atmospheric release tube 66 is also connected to the suction tube 64. An atmospheric release valve 67 is provided in the atmospheric release tube 66. The atmospheric release valve 67 may also be an electromagnetic gate valve, similar to the vacuum valve 62. The suction tube 64 and the vacuum tube 65 constitute a path for supplying vacuum from the vacuum source 61 to the inner tube 40.

[0045] The control unit 80 is a computer that includes a CPU 81, which is a processor that performs information processing, and a memory 82 that stores programs and control data. The control unit 80 receives signals from a sensor (not shown) that detects the position of the tip 16B of the capillary 16 in the XYZ directions. The control unit 80 operates the drive unit 14 to adjust the position of the tip 16B of the capillary 16 in the XYZ directions. The control unit 80 also operates the rotary drive unit 35 to rotate the outer tube 50 in the circumferential direction. Furthermore, the control unit 80 operates the vacuum valve 62 and the atmospheric release valve 67 to change the pressure inside the inner tube 40 between atmospheric pressure and vacuum.

[0046] As shown in Figures 2 and 3, the cleaning tube 30 is composed of an inner tube 40 and an outer tube 50.

[0047] The outer tube 50 is a cylindrical metal member, such as aluminum. As shown in Figure 2, the outer tube 50 includes a main body 51 and notches 52 provided on the upper part of the main body 51. There are a total of two notches 52, one on the positive X-direction side and one on the negative X-direction side of the upper part of the main body 51. In other words, there are two notches 52 on the upper part of the main body 51, facing each other in the diametrical direction. The notches 52 are U-shaped and extend downward from the upper end surface 55 of the outer tube 50. Between the notches 52 are lip portions 54 on the positive Y-direction side and the negative Y-direction side. There are two lip portions 54, similar to the notches 52.

[0048] As shown in Figures 3A and 3B, the inner tube 40 is a cylindrical member made of silicone resin and is fitted onto the inner surface of the outer tube 50. The inner tube 40 includes a base portion 41 and an upper end portion 42. The base portion 41 is the part of the outer tube 50 that is joined to the inner surface of the main body 51 below the lower end 53 of the notch 52 with adhesive 44. The upper end portion 42 is the part of the outer tube 50 that is spaced apart from the inner surface of the main body 51 between the upper end surface 55 and the lower end 53 of the notch 52. The portion of the upper end portion 42 located on the inner diameter side of the two lip portions 54 is called the Y-direction portion 42Y. The portion of the upper end portion 42 located on the inner diameter side of the two notches 52 is called the X-direction portion 42X. The upper surface 43 of the upper end portion 42 is flush with the upper end surface 55 of the outer tube 50. The inner surface of the Y-direction portion 42Y constitutes the removal portion 42C, which will be explained later.

[0049] Here, the inner diameter of the inner tube 40 is such that there is a gap of 0.2 to 0.5 mm between it and the outer surface of the base portion 16A of the capillary 16. In other words, the inner diameter of the inner tube 40 is 0.4 to 1.0 mm larger than the outer diameter of the base portion 16A of the capillary 16. Also, the inner diameter of the outer tube 50 is the same as the outer diameter of the inner tube 40.

[0050] Furthermore, the inner tube 40 may be made of a silicone resin with a wall thickness of 0.5 mm and a rubber Shore hardness of 30 to 50. Alternatively, the inner tube 40 may be made of a silicone resin containing abrasive particles with a wall thickness of 0.2 mm to 0.25 mm and a rubber Shore hardness of 50 to 60. Also, the vertical length of the notch 52 may be 1.5 to 3 times the diameter of the inner tube 40. Furthermore, the circumferential width of the notch 52 may be more than twice the wall thickness of the inner tube 40 and less than or equal to 1 / 4 of the outer circumference of the inner tube 40.

[0051] Next, the operation of the wire bonding apparatus 100 configured as described above will be explained. First, the bonding operation of the wire bonding apparatus 100 will be briefly explained. The bonding operation is achieved when the CPU 81 of the control unit 80 executes a program stored in the memory 82.

[0052] The CPU 81 of the control unit 80 moves the tip 16B of the capillary 16 near a torch (not shown) using the drive unit 14, and forms the wire 70 extending from the tip 16B into an initial ball. Then, the CPU 81 moves the tip 16B onto the pad of the semiconductor die 22. The control unit 80 then lowers the capillary 16 using the drive unit 14, and presses the initial ball with the tip 16B against the pad of the semiconductor die 22, bonding the wire 70 to the pad. After that, the control unit 80 presses the tip 16B of the capillary 16 onto the lead of the substrate 21, bonding the wire 70 onto the lead with the tip 16B. Then, with the wire 70 gripped by a clamper (not shown), the control unit 80 raises the capillary holding portion 15A of the bonding arm 15 to cut the wire 70. The wire bonding apparatus 100 connects multiple pads on the semiconductor die 22 and multiple leads on the substrate 21 with wires 70 by repeating the same operation.

[0053] Next, the cleaning operation of the wire bonding apparatus 100 will be described with reference to Figures 4 to 11. After the control unit 80 has performed bonding between the pads of the semiconductor die 22 and the leads of the substrate 21 a predetermined number of times, it performs the cleaning operation of the capillary 16 shown in Figure 4. The cleaning operation is performed by the CPU 81 of the control unit 80 executing a program stored in the memory 82, similar to the bonding operation described earlier.

[0054] As shown in step S101 of Figure 4, the CPU 81 of the control unit 80 operates the drive unit 14, moving the tip 16B of the capillary 16 onto the cleaning tube 30 as shown in Figure 5. Then, the control unit 80 uses the drive unit 14 to lower the tip 16B of the capillary 16 and insert it into the inside of the inner tube 40.

[0055] Next, the CPU 81 of the control unit 80 opens the vacuum valve 62, as shown in step S102 of Figure 4. At this time, the atmospheric release valve 67 is closed. As a result, the pressure inside the inner tube 40 decreases. Then, as shown in Figures 6 and 7A, the Y-direction portion 42Y of the upper end 42 of the inner tube 40 moves radially inward. At this time, as shown in Figures 6 and 7B, the X-direction portion 42X of the upper end 42 of the inner tube 40 deforms radially outward and protrudes into the notch 52. In other words, when the pressure inside the inner tube 40 decreases, the Y-direction portion 42Y collapses radially along the Y-direction, which is perpendicular to the X-direction where the notches 52 are aligned. At this time, the X-direction portion 42X protrudes into the notch 52. When the Y-direction portion 42Y and the X-direction portion 42X come into close contact with the outer circumferential surface of the base portion 16A of the capillary 16, the inside of the inner tube 40 becomes a vacuum.

[0056] Next, the CPU 81 of the control unit 80 gradually pulls the capillary 16 upward using the drive unit 14. As the capillary 16 rises, the upper end 42 of the inner tube 40 moves downward relative to the capillary 16. As shown by arrows 94 and 95 in Figure 8, as the capillary 16 rises, the Y-direction portion 42Y moves downward relative to the outer surface of the base portion 16A of the capillary 16. Then, the removal portion 42C on the inner surface of the Y-direction portion 42Y moves diagonally downward while in close contact with the side surface of the tip portion 16B. At this time, the removal portion 42C moves diagonally downward while rubbing against the side surface of the tip portion 16B. Since the Y-direction portion 42Y is made of silicone resin containing abrasive particles, the abrasive particles contained in the removal portion 42C remove foreign matter attached to the side surface of the tip portion 16B, cleaning the side surface.

[0057] When the tip 16B of the capillary 16 is pulled out from inside the inner tube 40, the two X-direction portions 42X protrude significantly into the notch 52, as shown in Figures 9 and 10B. As a result, the two Y-direction portions 42Y come into close contact with each other and close the top surface 43, as shown in Figures 9 and 10A.

[0058] The CPU 81 of the control unit 80 determines in step S104 of Figure 4 whether the tip 16B of the capillary 16 has been withdrawn from inside the inner tube 40. If the CPU 81 of the control unit 80 determines YES in step S104 of Figure 4, it proceeds to step S105 of Figure 4 and closes the vacuum valve 62. Then, the control unit 80 proceeds to step S106 of Figure 4 and opens the atmospheric pressure release valve 67. As a result, the inside of the inner tube 40 becomes atmospheric pressure. The upper end 42 of the inner tube 40 returns to its initial annular shape as shown in Figure 2.

[0059] In step S107 of Figure 4, the CPU 81 of the control unit 80 determines whether steps S101 to S106 have been executed a predetermined number of times, for example, twice. If the CPU 81 of the control unit 80 determines NO in step S107 of Figure 4, it proceeds to step S108. In step S108 of Figure 4, the CPU 81 of the control unit 80 rotates the outer tube 50 in the circumferential direction by a predetermined angle. Here, the predetermined angle can be freely selected, but for example, it may be 90°. When the outer tube 50 is rotated in the circumferential direction by the predetermined angle in this way, the inner tube 40 rotates in the circumferential direction together with the outer tube 50 by the predetermined angle. Also, the removal portion 42C of the upper end portion 42 of the inner tube 40 rotates in the circumferential direction by the predetermined angle together with the inner tube 40 and the outer tube 50.

[0060] Thus, when the outer tube 50 rotates 90°, as shown in Figure 11, the inner surface removal portion 42C of the Y-direction portion 42Y aligns in the X-direction, and conversely, the X-direction portion 42X aligns in the Y-direction.

[0061] Then, the control unit 80 returns to step S101 in Figure 4 and repeatedly executes steps S101 to S106. During this time, the removal section 42C on the inner surface of the Y-direction section 42Y comes into close contact with the side portion of the capillary 16 that was rubbed in the previous operation and the portion that has been rotated 90° in the circumferential direction, and removes foreign matter from this portion.

[0062] Then, if the CPU 81 of the control unit 80 determines YES in step S107 of Figure 4, it terminates the cleaning operation.

[0063] As explained above, the wire bonding apparatus 100 creates a vacuum inside the inner tube 40 and compresses the upper end 42 radially, bringing it into contact with the side surface of the tip 16B of the capillary 16. With the capillary 16 moved upward, the removal portion 42C on the inner surface of the upper end 42 rubs against the side surface of the tip 16B of the capillary 16, thus cleaning the side surface. Furthermore, by rotating the inner tube 40 circumferentially by a predetermined angle together with the outer tube 50 and repeating the above operation, the side surface of the tip 16B of the capillary 16 can be cleaned along its entire circumference, improving the removal rate of dirt from the side surface. As a result, the detection accuracy of the tip position of the bonding tool is improved, and the deterioration of bonding quality when bonding is repeated can be suppressed.

[0064] In the wire bonding apparatus 100, the notches 52 of the outer tube 50 are arranged in pairs, facing each other in the diametrical direction of the outer tube 50. As a result, when the inside of the inner tube 40 is evacuated, the upper end 42 collapses in the Y direction perpendicular to the X direction in which the notches 52 are aligned. At this time, a part of the upper end 42 protrudes into the notches 52. Therefore, the inner tube 40 collapses more easily in the radial direction, and the upper end 42 of the inner tube 40 can be brought into close contact with the side surface of the tip 16B of the capillary 16. This improves the removal rate of dirt adhering to the side surface of the tip 16B of the capillary 16.

[0065] In the previous explanation of the cleaning operation, it was described that after performing steps S101 to S106, the outer tube 50 is rotated 90° together with the inner tube 40, and then steps S101 to S106 are performed again. However, the procedure is not limited to this. As long as the sides of the tip 16B of the capillary 16 can be cleaned evenly around its entire circumference, for example, steps S101 to S106 may be performed every 30° rotation of the outer tube 50 together with the inner tube 40. In this case, the predetermined angle is 30°, and the predetermined number of rotations is 3.

[0066] Furthermore, since the inner tube 40 is made of silicone resin containing abrasive particles, when the removal portion 42C of the upper end 42 is brought into close contact with the side surface of the tip portion 16B of the capillary 16 and the capillary 16 is pulled out, the abrasive particles can remove foreign matter adhering to the side surface of the tip portion 16B.

[0067] Furthermore, the inner tube 40 of the wire bonding apparatus 100 is made of silicone resin with a rubber Shore hardness of 60 or less and a wall thickness of 1 / 10 or less of the inner diameter. Also, the notch 52 of the outer tube 50 has a vertical length of 1.5 to 3 times the diameter of the inner tube 40, and a circumferential width of more than twice the wall thickness of the inner tube 40 and less than 1 / 4 of the outer circumference of the inner tube 40. As a result, when the inside is evacuated, the upper end 42 of the inner tube 40 collapses radially, and when the inside is returned to atmospheric pressure, the inner tube 40 returns to its original annular shape. This makes it possible to repeatedly use the cleaning tube 30 including the inner tube 40.

[0068] Furthermore, in step S103 of the cleaning operation of the wire bonding apparatus 100, the control unit 80 may rotate the outer tube 50 when pulling up the capillary 16. This allows the entire circumference of the tip portion 16B to be cleaned when the capillary 16 is withdrawn.

[0069] Furthermore, in step S103 of the cleaning operation, the control unit 80 may use the ultrasonic transducer 18 to ultrasonically vibrate the capillary 16 when withdrawing it from the inner tube 40. Alternatively, the control unit 80 may use the drive unit 14 to vibrate the capillary 16 in the vertical direction when withdrawing it from the inner tube 40.

[0070] In this way, when the removal portion 42C of the Y-direction portion 42Y of the inner tube 40 rubs against the side of the tip portion 16B of the capillary 16, the side can be vibrated to more effectively remove foreign matter from the side.

[0071] Next, the other cleaning tubes 130 will be described with reference to Figure 12. Parts identical to those of the cleaning tube 30 described earlier with reference to Figures 2 and 3 are given the same reference numerals and their descriptions are omitted.

[0072] As shown in Figure 12, the cleaning tube 130 has a notch 45 in the circumferential center of the X-direction portion 42X of the upper end 42 of the inner tube 40. The rest of the tube is the same as the cleaning tube 30 described earlier. The notch 45 is positioned to correspond to the circumferential center of the cutout 52.

[0073] With this configuration, the upper end 42 of the inner tube 40 of the cleaning tube 130 is more easily compressed radially, so that the removal portion 42C on the inner surface of the upper end 42 adheres more securely to the side surface of the tip 16B of the capillary 16, and dirt adhering to the side surface can be removed.

[0074] Next, other cleaning operations of the wire bonding apparatus 100 will be described with reference to Figure 13. These other cleaning operations are the same as those described earlier with reference to Figure 4, but with step S103 replaced by step S201, and steps S107 and S108 removed.

[0075] In other cleaning operations, in step S201, the capillary 16 is gradually pulled up while the outer tube 50 is rotated circumferentially. As a result, when the capillary 16 is pulled up, the removal portion 42C on the inner surface of the Y-direction portion 42Y of the upper end 42 moves downward while spirally rubbing against the side surface of the tip portion 16B of the capillary 16. This allows the entire circumference of the side surface of the tip portion 16B to be cleaned when the capillary 16 is withdrawn.

[0076] In other cleaning operations, as with the cleaning operation described above, the control unit 80 may use the ultrasonic transducer 18 to ultrasonically vibrate the capillary 16 when withdrawing the capillary 16 from the inner tube 40 in step S201 of the cleaning operation. Alternatively, the control unit 80 may use the drive unit 14 to vibrate the capillary 16 in the vertical direction when withdrawing the capillary 16 from the inner tube 40.

[0077] This allows for the effective removal of foreign matter from the sides, similar to the cleaning operation described earlier.

[0078] Next, the cleaning method of the embodiment will be described with reference to Figure 14. This cleaning method is described as the cleaning operation of the wire bonding apparatus 100 described earlier. This cleaning method may be implemented by the CPU 81 of the control unit 80 of the wire bonding apparatus 100 executing a program of the method stored in the memory 82.

[0079] The cleaning method involves preparing the wire bonding apparatus 100 in step S300 of Figure 14. In step S301 of Figure 14, the tip 16B of the capillary 16 is inserted into the inner tube 40 (first step). Next, in step S302 of Figure 14, the inside of the inner tube 40 is evacuated (second step). This causes the upper end 42 of the inner tube 40 to collapse radially. Next, in step S303 of Figure 14, with the inside of the inner tube 40 under vacuum, the tip 16B of the capillary 16 is withdrawn from the inner tube 40 (third step). This causes the removal portion 42C on the inner surface of the upper end 42 of the inner tube 40 to move downward while rubbing against the side of the tip 16B of the capillary 16, cleaning the side. Next, in step S304 of Figure 14, the inside of the inner tube 40 is returned to atmospheric pressure, and the inner tube 40 is returned to its original annular shape (fourth step). Then, in step S305 in Figure 13, if steps S301 to S304 have not been repeated the predetermined number of times, in step S306 in Figure 14, the outer tube 50 is rotated by a predetermined angle in the circumferential direction (fifth step), and steps S301 to S304 in Figure 14 are repeated. If YES is determined in step S305 in Figure 14, the cleaning is terminated.

[0080] The cleaning method described above allows the removal portion 42C at the upper end 42 of the inner tube 40 to rub against the side of the capillary 16 in an up-and-down direction for cleaning. Furthermore, by rotating the outer tube 50 together with the inner tube 40 by a predetermined angle in the circumferential direction and repeating the above operation, the side of the capillary 16 can be cleaned along its entire circumference, improving the rate of removal of dirt from the side.

[0081] Alternatively, the cleaning device 200 may be prepared in step S300 of Figure 14, and each of the steps described above may be performed manually.

[0082] Next, a cleaning method of another embodiment will be described with reference to Figure 15. This cleaning method is the same as the cleaning method described with reference to Figure 14, but with step S303 replaced by step S401, and steps S305 and S306 removed.

[0083] In other cleaning methods, in step S401, the capillary 16 is gradually pulled up while the outer tube 50 is rotated circumferentially (step 3A). As a result, when the capillary 16 is pulled up, the removal portion 42C of the Y-direction portion 42Y of the upper end portion 42 moves downward while spirally rubbing against the side surface of the tip portion 16B of the capillary 16. This allows the entire circumference of the side surface of the tip portion 16B to be cleaned when the capillary 16 is pulled out.

[0084] Next, another embodiment of the wire bonding apparatus 110 will be described with reference to Figure 16. As shown in Figure 16, the cleaning device 210 of the wire bonding apparatus 110 includes a vertical drive unit 36 ​​that drives the outer tube 50 in the vertical direction together with the inner tube 40. The vertical drive unit 36 ​​is connected to the control unit 80 and operates according to commands from the CPU 81 of the control unit 80. The other configurations are the same as those of the wire bonding apparatus 100 described earlier with reference to Figure 1. The vertical drive unit 36 ​​and the rotary drive unit 35 constitute a drive mechanism that moves the removal unit 42C relative to the surface of the capillary 16.

[0085] In the cleaning operation of the wire bonding apparatus 110 shown in Figure 16, the CPU 81 of the control unit 80 raises the inner tube 40 using the vertical drive unit 36 ​​in step S101 of Figure 4, inserting the tip 16B of the capillary 16 into the inner tube 40. Also, in step S103 of Figure 4, the CPU 81 of the control unit 80 lowers the inner tube 40 using the vertical drive unit 36, pulling the capillary 16 out of the inner tube 40. In other cleaning operations, the CPU 81 of the control unit 80 raises the inner tube 40 using the vertical drive unit 36 ​​in step S101 of Figure 13, inserting the tip 16B of the capillary 16 into the inner tube 40. Furthermore, in step S201 of Figure 13, the CPU 81 of the control unit 80 rotates the inner tube 40 together with the outer tube 50 using the rotary drive unit 35, while simultaneously lowering the inner tube 40 together with the outer tube 50 using the vertical drive unit 36 ​​to pull out the capillary 16 from the inner tube 40. Other cleaning operations are the same as those of the wire bonding apparatus 100 described earlier.

[0086] In the above description, the inner tube 40 and outer tube 50 of the cleaning tube 30 were described as cylindrical members, but they are not limited to this. For example, the inner tube 40 and outer tube 50 may be elliptical annular members.

[0087] Furthermore, although the inner tube 40 has been described as being made of a silicone resin containing silicone particles, it is not limited to this. It may be made of any other material as long as the upper end portion 42 collapses radially when the inside becomes a vacuum. The inner tube 40 may be made of, for example, silicone rubber. Also, the abrasive particles are not limited to silicone particles, but may be made of other metals or ceramic particles. In addition, the removal rate may be improved by making the surface of the removal portion 42C rougher than other surfaces. For example, the surface of the removal portion 42C may be roughened by mechanical processing. Alternatively, the surface of the removal portion 42C may be roughened by adhering sand or metal to it. Note that the surface of the removal portion 42C may not be changed from the other parts of the inner surface of the upper end portion 42, and may be made to be the same as the other parts of the inner surface of the upper end portion 42.

[0088] Furthermore, although the above description states that the outer tube 50 has two diametrically opposed notches 52, the number of notches 52 is not limited to two, and there may be multiple notches 52. For example, the outer tube 50 may have three notches 52 arranged at 120° intervals in the circumferential direction. Alternatively, the outer tube 50 may have four notches 52 arranged at 90° intervals in the circumferential direction. Also, although the above description states that the outer tube 50 is made of metal, it is not limited to metal as long as it is a rigid material. For example, the outer tube 50 may be made of ceramics or composite fibers.

[0089] Furthermore, the bonding tools cleaned by the cleaning devices 200 and 210 are not limited to capillaries 16; any bonding tool used for wire bonding, such as a wedge tool, may be used. [Explanation of symbols]

[0090] 11 XY table, 12 bonding head, 13 Z-direction motor, 14 drive unit, 15 bonding arm, 15A capillary holder, 15B base, 15C rotating shaft, 16 capillary, 16A base, 16B tip, 17 bonding stage, 18 ultrasonic transducer, 19 wire spool, 21 substrate, 22 semiconductor die, 30, 130 cleaning tube, 35 rotation drive unit, 36 vertical drive unit, 40 inner tube, 41 base unit, 42 upper end, 42C removal unit, 42X X-direction part, 42Y Y-direction part, 43 top surface, 44 adhesive, 45 notch, 50 outer tube, 51 main body, 52 cutout, 53 lower end, 54 lip, 55 upper end surface, 61 vacuum source, 62 vacuum valve, 63 Filter, 64 Suction tube, 65 Vacuum tube, 66 Atmospheric release tube, 67 Atmospheric release valve, 80 Control unit, 81 CPU, 82 Memory, 100, 110 Wire bonding device, 200, 210 Cleaning device (cleaning section).

Claims

1. A cleaning device for cleaning the surface of a bonding tool used to bond a wire to a bonding target, An outer tube having a predetermined rigidity, An inner tube fitted onto the inner surface of the outer tube, into which the tip of the bonding tool is inserted, The system includes a path for supplying vacuum from a vacuum source to the inner tube, The outer tube includes a plurality of notches extending downward from the upper end surface, The aforementioned inner tube is A base portion joined to the inner surface of the outer tube below the lower end of the notch, The upper end portion of the outer tube is positioned spaced apart from the inner surface between the upper end surface of the outer tube and the lower end of the notch, When vacuum is supplied to the interior from the vacuum source, the upper end has the flexibility to collapse radially and come into contact with the surface of the bonding tool. The bonding tool has a removal portion at the part that contacts the surface. A cleaning device characterized by the following.

2. A cleaning device according to claim 1, The removal unit has a drive mechanism that moves it relative to the surface of the bonding tool. A cleaning device characterized by the following.

3. A cleaning device according to claim 1, The multiple notches are arranged in pairs opposite each other in the diametrical direction of the outer tube. When the inside of the inner tube is evacuated, the upper end of the inner tube is crushed in a direction perpendicular to the direction in which the notches are aligned, and a part of the upper end protrudes into the notches. A cleaning device characterized by the following.

4. A cleaning device according to claim 3, The upper end of the inner tube is provided with a plurality of notches at positions corresponding to the circumferential center of the notch of the outer tube. A cleaning device characterized by the following.

5. A cleaning device according to any one of claims 1 to 4, The notch has a vertical length of 1.5 to 3 times the diameter of the inner tube, and a circumferential width of at least twice the wall thickness of the inner tube and at least 1 / 4 of the outer circumference of the inner tube. The inner tube has a rubber Shore hardness of 60 or less, a wall thickness of 1 / 10 or less of the inner diameter, and is made of a resin containing abrasive particles. A cleaning device characterized by the following.

6. A cleaning method for cleaning the surface of a bonding tool used to bond a wire to a bonding target, A cleaning device is prepared comprising: an outer tube having a predetermined rigidity; an inner tube fitted into the inner surface of the outer tube and into which the tip of the bonding tool is inserted; and a path for supplying vacuum from a vacuum source to the inner tube, wherein the outer tube includes a plurality of notches extending downward from its upper end surface; the inner tube includes a base portion joined to the inner surface below the lower end of the notches of the outer tube; and an upper end portion spaced apart from the inner surface between the upper end surface of the outer tube and the lower end of the notches; and the upper end portion has flexibility such that it collapses radially and contacts the surface of the bonding tool when vacuum is supplied to the interior from the vacuum source; and the cleaning device has a removal portion at the location that contacts the surface of the bonding tool. The first step is to insert the bonding tool into the interior of the inner tube, A second step is to create a vacuum inside the inner tube, The third step is to withdraw the bonding tool from the inner tube while the inside of the inner tube is under vacuum, After the third step, a fourth step is to bring the inside of the inner tube to atmospheric pressure, The fifth step includes rotating the outer tube in the circumferential direction by a predetermined angle, The first to fifth steps described above are repeated and executed a predetermined number of times. A cleaning method characterized by the following.

7. A cleaning method according to claim 6, The third step involves rotating the outer tube circumferentially when withdrawing the bonding tool from the inner tube. A cleaning method characterized by the following.

8. A cleaning method for cleaning the surface of a bonding tool used to bond a wire to a bonding target, A cleaning device is prepared comprising: an outer tube having a predetermined rigidity; an inner tube fitted into the inner surface of the outer tube and into which the tip of the bonding tool is inserted; and a path for supplying vacuum from a vacuum source to the inner tube, wherein the outer tube includes a plurality of notches extending downward from its upper end surface; the inner tube includes a base portion joined to the inner surface below the lower end of the notches of the outer tube; and an upper end portion spaced apart from the inner surface between the upper end surface of the outer tube and the lower end of the notches; and the upper end portion has flexibility such that it collapses radially and contacts the surface of the bonding tool when vacuum is supplied to the interior from the vacuum source; and the cleaning device has a removal portion at the location that contacts the surface of the bonding tool. The first step is to insert the bonding tool into the interior of the inner tube, A second step is to create a vacuum inside the inner tube, Step 3A includes withdrawing the bonding tool from the inner tube while rotating the outer tube circumferentially, with the inside of the inner tube under vacuum. A cleaning method characterized by the following.

9. A wire bonding apparatus for bonding a wire to a bonding target, A bonding tool for bonding the aforementioned wire to the object to be bonded, A drive unit for moving the bonding tool in the vertical direction, A cleaning unit for cleaning the surface of the bonding tool, It comprises a control unit and, The cleaning unit is An outer tube having a predetermined rigidity, An inner tube fitted onto the inner surface of the outer tube, into which the tip of the bonding tool is inserted, The system includes a path for supplying vacuum from a vacuum source to the inner tube, The outer tube includes a plurality of notches extending downward from the upper end surface, The inner tube includes a base portion joined to the inner surface of the outer tube below the lower end of the notch, and an upper end portion spaced apart from the inner surface between the upper end surface of the outer tube and the lower end of the notch, and has flexibility such that when vacuum is supplied to the interior from the vacuum source, the upper end portion collapses radially and contacts the surface of the bonding tool, and has a removal portion at the location that contacts the surface of the bonding tool. The system further includes a drive mechanism for moving the removal unit relative to the surface of the bonding tool, The control unit adjusts the operation of the drive unit and the operation of the drive mechanism. The drive unit inserts the bonding tool into the interior of the inner tube. The inside of the inner tube is made into a vacuum, With the inside of the inner tube under vacuum, the bonding tool is pulled out of the inner tube by the drive unit. The inside of the inner tube is made to atmospheric pressure, The drive mechanism rotates the outer tube in the circumferential direction by a predetermined angle. To repeat the process a predetermined number of times. A wire bonding apparatus characterized by the following features.

10. A wire bonding apparatus according to claim 9, The control unit rotates the outer tube in the circumferential direction using the drive mechanism when the bonding tool is withdrawn from the inner tube by the drive unit. A wire bonding apparatus characterized by the following features.

11. A wire bonding apparatus for bonding a wire to a bonding target, A bonding tool for bonding the aforementioned wire to the object to be bonded, A drive unit for moving the bonding tool in the vertical direction, A cleaning unit for cleaning the surface of the bonding tool, It comprises a control unit and, The cleaning unit is An outer tube having a predetermined rigidity, An inner tube fitted onto the inner surface of the outer tube, into which the tip of the bonding tool is inserted, The system includes a path for supplying vacuum from a vacuum source to the inner tube, The outer tube includes a plurality of notches extending downward from the upper end surface, The inner tube includes a base portion joined to the inner surface of the outer tube below the lower end of the notch, and an upper end portion spaced apart from the inner surface between the upper end surface of the outer tube and the lower end of the notch, and has flexibility such that when vacuum is supplied to the interior from the vacuum source, the upper end portion collapses radially and contacts the surface of the bonding tool, and has a removal portion at the location that contacts the surface of the bonding tool. The system further includes a drive mechanism for moving the removal unit relative to the surface of the bonding tool, The control unit adjusts the operation of the drive unit and the operation of the drive mechanism. The drive unit inserts the bonding tool into the interior of the inner tube. The inside of the inner tube is made into a vacuum, With the inside of the inner tube under vacuum, the outer tube is rotated circumferentially by the drive mechanism while the bonding tool is pulled out of the inner tube by the drive unit. A wire bonding apparatus characterized by the following features.

12. A wire bonding apparatus according to claim 9, The bonding tool is equipped with an ultrasonic transducer that vibrates the bonding tool ultrasonically, The control unit vibrates the bonding tool ultrasonically using the ultrasonic transducer when withdrawing the bonding tool from the inner tube. A wire bonding apparatus characterized by the following features.

13. A wire bonding apparatus according to claim 10, The bonding tool is equipped with an ultrasonic transducer that vibrates the bonding tool ultrasonically, The control unit vibrates the bonding tool ultrasonically using the ultrasonic transducer when withdrawing the bonding tool from the inner tube. A wire bonding apparatus characterized by the following features.

14. A wire bonding apparatus according to claim 11, The bonding tool is equipped with an ultrasonic transducer that vibrates the bonding tool ultrasonically, The control unit vibrates the bonding tool ultrasonically using the ultrasonic transducer when withdrawing the bonding tool from the inner tube. A wire bonding apparatus characterized by the following features.

15. A wire bonding apparatus according to claim 9, The control unit causes the bonding tool to vibrate vertically when the bonding tool is withdrawn from the inner tube, A wire bonding apparatus characterized by the following features.

16. A wire bonding apparatus according to claim 10, The control unit causes the bonding tool to vibrate vertically when the bonding tool is withdrawn from the inner tube, A wire bonding apparatus characterized by the following features.

17. A wire bonding apparatus according to claim 11, The control unit causes the bonding tool to vibrate vertically when the bonding tool is withdrawn from the inner tube, A wire bonding apparatus characterized by the following features.

18. A wire bonding apparatus for bonding a wire to a bonding target, A bonding tool for bonding the aforementioned wire to the object to be bonded, A drive unit for moving the bonding tool in the vertical direction, A cleaning unit for cleaning the surface of the bonding tool, It comprises a control unit and, The cleaning unit is An outer tube having a predetermined rigidity, An inner tube fitted onto the inner surface of the outer tube, into which the tip of the bonding tool is inserted, The system includes a path for supplying vacuum from a vacuum source to the inner tube, The outer tube includes a plurality of notches extending downward from the upper end surface, The inner tube includes a base portion joined to the inner surface of the outer tube below the lower end of the notch, and an upper end portion spaced apart from the inner surface between the upper end surface of the outer tube and the lower end of the notch, and has flexibility such that when vacuum is supplied to the interior from the vacuum source, the upper end portion collapses radially and contacts the surface of the bonding tool, and has a removal portion at the location that contacts the surface of the bonding tool. The system further includes a drive mechanism for moving the removal unit relative to the surface of the bonding tool, The control unit adjusts the operation of the drive unit and the operation of the drive mechanism. The aforementioned drive mechanism inserts the bonding tool into the interior of the inner tube, The inside of the inner tube is made into a vacuum, With the inside of the inner tube under vacuum, the bonding tool is pulled out of the inner tube by the drive mechanism. The inside of the inner tube is made to atmospheric pressure, The drive mechanism rotates the outer tube in the circumferential direction by a predetermined angle. To repeat the process a predetermined number of times. A wire bonding apparatus characterized by the following features.

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