Electronic component housings and electronic component housing packaging

Abstract

An electronic component accommodation body (101) is provided with: a bulk case (2) capable of accommodating a plurality of electronic components (3); an RFID tag (20) for identifying the bulk case (2); and an electric conductor (13). The RFID tag (20) has an RFIC and an antenna electrically connected to the RFIC. The electric conductor (13) is capable of displacing with respect to the antenna. Thus, an electronic component accommodation body and an electronic component accommodation body package that are capable of changing a communication distance of an RFID according to a reading purpose can be obtained.

Description

Technical Field

[0001] The present invention relates to an electronic component storage body in which a plurality of electronic components are stored in a bulk case and an electronic component storage body package in which a plurality of electronic component storage bodies are packaged.

Background Art

[0002] Conventionally, electronic components such as chip components are individually packaged in a taping reel to form a component reel. Necessary types of component reels are installed in an electronic component mounting device (mounter), and each component is mounted at a predetermined location on an electronic substrate.

[0003] Normally, labels such as barcodes and two-dimensional codes are attached to the component reels, and information regarding the component reels as products is managed thereby.

[0004] The individual packaging of electronic components by the taping reel method is bulky, which is a problem in reducing transportation costs or reducing CO2 related to recent transportation. Therefore, for example, very small electronic components such as multilayer ceramic capacitors (MLCCs) are considered to be shipped and transported in a bulk case.

[0005] Business operations such as boxing up a plurality of the above bulk cases and shipping, transporting, and storing them in that state are also carried out.

[0006] On the other hand, a technique of storing electronic components in a bulk state in a case (bulk case) and managing this bulk case with an RFID tag is disclosed in Patent Document 1.

[0007] Although it is possible to manage items individually by attaching a barcode label or a two-dimensional code label to each bulk case, in a state where a plurality of bulk cases are packaged in a packing box, these cannot be read by a barcode reader or a two-dimensional code reader. Therefore, it is required to attach an RFID tag to each bulk case.

[0008] RFID tags allow for the simultaneous reading of information from multiple bulk cases, even when they are inside boxes, as long as they are within the radio wave range. This makes shipping and inventory management extremely convenient. Furthermore, by directly mounting bulk cases to a mounter and supplying parts from the bulk cases, waste materials such as taping reels can be significantly reduced, leading to cost savings.

[0009] By enabling the RFID tags on bulk cases to be read directly by the mounter when the bulk cases are attached, data management can be performed throughout the entire process, from parts shipment to product manufacturing, leading to increased efficiency and reduced labor in many tasks. [Prior art documents] [Patent Documents]

[0010] [Patent Document 1] International Publication No. 2022 / 123904 [Overview of the project] [Problems that the invention aims to solve]

[0011] However, bulk cases mounted on the mounter require data to be read and managed for each individual bulk case. In other words, unlike managing inventory by reading the data of items that are stored together, it is necessary to accurately read which bulk case contains which electronic component and where it is installed on the mounter.

[0012] Since multiple bulk cases are arranged and mounted on the mount, if you read the RFID tags attached to these bulk cases with a standard RFID reader, all the RFID tags on all the bulk cases will react. In other words, because the RFID tags on bulk cases are configured to react within a certain distance, all nearby bulk cases will react. Therefore, even if a reader at position A tries to read whether bulk case B is mounted at position A on the mount, it cannot determine whether bulk case B is correctly installed at position A.

[0013] Therefore, the object of the present invention is to provide an electronic component housing and an electronic component housing packaging that enable changes in the RFID communication distance according to the reading purpose in a bulk case containing electronic components. [Means for solving the problem]

[0014] As an example of the present disclosure, an electronic component housing comprises a bulk case capable of housing a plurality of electronic components, an RFID tag for identifying the bulk case, and a conductor, wherein the RFID tag has an RFIC and an antenna electrically connected to the RFIC, and the conductor is displaceable relative to the antenna.

[0015] Furthermore, the electronic component housing and packaging of the present disclosure is characterized in that each comprises a plurality of electronic component housings having the above configuration and a packaging box for packaging these plurality of electronic component housings, and the plurality of electronic component housings are packaged in the packaging box. [Effects of the Invention]

[0016] According to the present invention, an electronic component housing can be obtained in which the communication distance of RFID tags can be changed according to the purpose of reading, in a bulk case containing electronic components. For example, even when multiple bulk cases are in close proximity, the RFID tags of a given bulk case can be read individually, and when multiple bulk cases are packaged together, the RFID tags of each bulk case can be read simultaneously.

Brief Description of the Drawings

[0017] [Figure 1] FIG. 1 is a diagram showing the structure of the electronic component storage body 101 according to the first embodiment in a first state. [Figure 2] FIG. 2 is a perspective view of an electronic component storage body package 201 composed of a plurality of electronic component storage bodies 101 and a packing box 200 for packing these electronic component storage bodies 101. [Figure 3] FIG. 3 is a diagram showing the structure of the electronic component storage body 101 in a second state. [Figure 4] FIG. 4 is a plan view showing the configuration of the RFID tag 20. [Figure 5] FIG. 5 is a diagram showing the structure of the electronic component storage body 102 according to the second embodiment in a first state. [Figure 6] FIG. 6 is a diagram showing the structure of the electronic component storage body 102 in a second state. [Figure 7] FIG. 7 is a diagram showing the structure of the electronic component storage body 103 according to the third embodiment in a second state. [Figure 8] FIG. 8 is a longitudinal sectional view of the electronic component storage body 104 according to the fourth embodiment in a first state. [Figure 9] FIG. 9 is a longitudinal sectional view of the electronic component storage body 104 in a second state.

Modes for Carrying Out the Invention

[0018] 《First Embodiment》 FIG. 1 is a diagram showing the structure of the electronic component storage body 101 cited as the first embodiment according to the present invention in a first state. The upper left figure in FIG. 1 is a longitudinal sectional view of the electronic component storage body 101, the upper right figure is a right side view of the electronic component storage body 101, and the lower left figure is a bottom view of the electronic component storage body 101.

[0019] The electronic component housing 101 comprises a resin bulk case 2. In the orientation shown in Figure 1, an electronic component housing section SP1 for housing numerous electronic components 3 is formed at the top of the bulk case 2, and a spare space SP2 is formed below this electronic component housing section.

[0020] The bulk case 2 has an opening 4 for removing electronic components 3. The electronic component storage unit 101 has a slider 5 and a lid 6 connected to each other, which are electrically insulated by polyethylene (PE) or the like. The lid 6 opens and closes the opening 4 as the slider 5 moves. When transporting or storing the electronic component storage unit 101, the slider 5 is positioned on the right side and the opening 4 is closed by the lid 6, in the orientation shown in Figure 1. This lid 6 is an example of the "base material" according to the present invention.

[0021] RFID tags 20 are placed on the inner surface of bulk case 2. A conductor 13 is provided on the lid 6. As shown in Figure 1, when the slider 5 is closed on the opening 4 (first state), the conductor 13 is separated from the RFID tags 20, the RFID tags 20 are not affected by the conductor 13, and the RFID tag reader / writer can read the RFID tags from a distance.

[0022] The communication frequency of RFID tag 20 is, for example, in the 900MHz band (860MHz to 920MHz). In other words, this RFID tag is an RFID tag that uses the UHF band.

[0023] As will be shown later, the RFID tag 20 communicates with the RFID tag reader / writer via electric field coupling (capacitive coupling) or magnetic field coupling.

[0024] Figure 2 is a perspective view of an electronic component storage unit 201, which consists of multiple electronic component storage units 101 and a packaging box 200 that packages these electronic component storage units 101. As shown in Figure 1, the opening 4 is closed by the lid 6, so the electronic components 3 will not spill out of the opening 4. Furthermore, as will be shown later, because each electronic component storage unit 101 is in the first state shown in Figure 1, the antenna gain of the RFID tag is high, and the contents of the RFID tag of each electronic component storage unit 101 in the electronic component storage unit 201 can be read from a predetermined distance.

[0025] Figure 3 shows the structure of the electronic component housing 101 in its second state. The upper left figure in Figure 3 is a vertical cross-sectional view of the electronic component housing 101, the upper right figure is a right side view of the electronic component housing 101, and the lower left figure is a bottom view of the electronic component housing 1.

[0026] Figure 1 shows the state in which the lid 6 is blocking the dispensing opening 4, while Figure 3 shows the state in which the lid 6 is opening the dispensing opening 4 (second state).

[0027] After the electronic component housing 101 is mounted on the mounter, the slider 5 is slid open, causing the removal opening 4 to open. In this state, the conductive material 13 overlaps the RFID tag 20.

[0028] Figure 4 is a plan view showing the configuration of the RFID tag 20. An insulating RFID tag sheet 14 has meander line-shaped radiating electrodes 15 and end electrodes 16 formed on it. The radiating electrodes 15 and end electrodes 16 constitute an antenna. An RFIC 7 is also mounted on the RFID tag sheet 14. The RFIC 7 may be an IC alone, or it may be an IC equipped with matching circuits, an antenna, etc. If the RFIC 7 is an IC alone, the electrodes of the RFIC 7 may be electrically directly connected to the radiating electrodes 15. If the RFIC 7 is an RFIC module equipped with an antenna, the electrodes of the RFIC 7 may be capacitively coupled to the radiating electrodes 15 via capacitance, or magnetically coupled via a magnetic field.

[0029] In the first state shown in Figure 1, the radiating electrode 15 and RFIC 7 function as an RFID tag equipped with a dipole antenna, and the antenna gain is highest in this state. For example, the maximum communication distance between the RFID tag and the RFID tag reader / writer is several meters or more. That is, in the states shown in Figures 1 and 4, the RFID tags of each electronic component housing 101 within the electronic component housing packaging 201 can be read simultaneously from a predetermined distance.

[0030] On the other hand, when the electronic component housing 101 is attached to the mounter, the second state shown in Figure 3 occurs, and the conductive material 13 overlaps the RFID tag 20, resulting in a decrease in antenna gain. For example, the maximum communication distance between the RFID tag reader / writer on the mounter and the RFID tag is within a few centimeters. Therefore, in this state, the tag reader on the mounter can only read (or read / write) the RFID tag on the bulk case closest to the tag reader attached to the mounter.

[0031] The antenna of an RFID tag is not limited to being a dipole antenna when used as an antenna; it may also be configured to be a monopole antenna when used as an antenna. For example, the RFID tag 20 shown in Figures 1 and 3 may have a conductor pattern for a monopole antenna formed on it, and the conductor 13 may be configured to cover the conductor pattern for the monopole antenna as shown in Figure 3.

[0032] Furthermore, the antenna of the RFID tag is not limited to an antenna in which the radiating conductor extends in a linear manner, but may also be a patch antenna. For example, the RFID tag 20 may have a patch antenna formed on it, and the antenna gain may be reduced when the conductor 13 overlaps the patch antenna in the state shown in Figure 3.

[0033] Furthermore, while the examples shown in Figures 1 and 3 show the RFID tag 20 being attached to the inner bottom surface of the bulk case 2, it may also be formed on the side surface of the bulk case 2.

[0034] In addition to FPC made of polyethylene, the RFID tag 20 can also be made of PET (polyethylene terephthalate), PP (polypropylene), or paper with a metal pattern formed on it. Furthermore, a substrate such as glass epoxy may be used. These substrates can be fixed to the bulk case 2 with adhesive or double-sided tape.

[0035] Figures 1 and 3 show an example where the conductor 13 is formed on the lid 6 and the RFID tag 20 is formed on the bulk case 2, and the conductor 13 and RFID tag 20 overlap in the second state when the lid 6 has its opening 4 open. However, this is just one example. The RFID tag 20 may be formed on the lid 6 and the conductor 13 may be formed on the bulk case 2. Even in this case, the conductor 13 and RFID tag 20 overlap in the second state when the lid 6 has its opening 4 open, so that communication is only possible at short distances when mounted on the mounter.

[0036] Furthermore, in the examples shown in Figures 1 and 3, the RFID tag 20 is placed on the inner surface of the bulk case 2, but the RFID tag 20 may also be placed on the outer surface of the bulk case 2. However, placing the RFID tag 20 on the inner surface of the bulk case 2 makes it easier to prevent counterfeiting by third parties.

[0037] 《Second Embodiment》 In the first embodiment, an example was shown in which the proximity between the conductor 13 and the antenna of the RFID tag 20 changes depending on the sliding of the lid 6. In the second embodiment, an example is shown in which the proximity between the conductor 13 and the antenna of the RFID tag 20 changes depending on the up and down orientation of the electronic component housing.

[0038] Figure 5 shows the structure of the electronic component housing 102 in its first state, as described in the second embodiment of the present invention. The lower left figure in Figure 5 is a vertical cross-sectional view of the electronic component housing 102, the lower right figure in Figure 5 is a right side view of the electronic component housing 102, and the upper left figure is a top view of the electronic component housing 102. In the electronic component housing 102 of the second embodiment, when packaged in a packaging body, each electronic component housing 102 is oriented as shown in Figure 5, that is, with the electronic component housing 3 storage section on the bottom (with the outlet 4 on the top).

[0039] The electronic component housing 102 comprises a resin bulk case 2. In the orientation shown in Figure 5, an electronic component housing section SP1 for housing numerous electronic components 3 is formed at the bottom of the bulk case 2, and a spare space SP2 is formed above this electronic component housing section.

[0040] The bulk case 2 has an opening 4 for removing electronic components 3. The electronic component storage unit 102 is equipped with a slider 5 and a lid 6 that are connected to each other. The lid 6 opens and closes the opening 4 as the slider 5 moves. When transporting or storing the electronic component storage unit 102, as shown in Figure 5, the slider 5 is positioned on the right side and the opening 4 is closed by the lid 6.

[0041] A conductor 13 is provided in the remaining space SP2 inside the bulk case 2. This conductor 13 is positioned so that it can be displaced in the vertical direction. An RFID tag 20 is placed on the inner surface of the bulk case 2. In the first state shown in Figure 5, the conductor 13 is located away from the RFID tag 20 due to its own weight. Therefore, the RFID tag 20 is not significantly affected by the conductor 13.

[0042] The communication frequency of RFID tag 20 is, for example, in the 900MHz band (860MHz to 920MHz). In other words, this RFID tag is an RFID tag that uses the UHF band.

[0043] Figure 6 shows the structure of the electronic component housing 102 in the second state. In Figure 6, the upper left is a vertical cross-sectional view of the electronic component housing 102, the upper right is a right side view of the electronic component housing 102, and the lower left is a bottom view of the electronic component housing 102. In the second embodiment, the electronic component housing 102 is mounted on a mounter, and the electronic component housing 102 is oriented as shown in Figure 6.

[0044] Figure 5 shows the first state in which the lid 6 is blocking the opening 4, while Figure 6 shows the second state in which the lid 6 is opening the opening 4. Also, Figure 5 shows the slider 5 and the opening 4 in the orientation shown in Figure 5, but Figure 6 shows the slider 5 and the opening 4 in the orientation shown in Figure 6, but downwards. Figure 6 shows the electronic component housing 102 mounted on the mounter. The direction in which it is mounted can be determined by the structure of the opening 4 and the storage area for the electronic components 3. That is, in order to remove all of the electronic components 3 from the bulk case 2, the opening 4 is positioned on the mounter with the opening 4 closer to the direction of gravity acceleration relative to the storage area.

[0045] In the first state (Figure 5), when the electronic component housing 102 is not mounted on the mounter, the conductor 13 is separated from the RFID tag 20. As a result, the RFID tag 20 functions as a proper RFID tag without being affected by the conductor 13. Therefore, long-distance communication is possible, and the electronic component housing can be read even when it is stored in the packaging box 200.

[0046] In the second state (Figure 6), when the electronic component housing 102 is mounted on the mounter, the conductor 13 is in close proximity to the RFID tag 20. As a result, the RFID tag 20 is affected by the conductor 13, and its antenna gain is reduced compared to the original RFID tag. For example, the maximum communication distance between the RFID tag reader / writer on the mounter and the RFID tag is within a few centimeters. Therefore, in this state, the tag reader on the mounter can only read (or read / write) the RFID tag on the bulk case closest to the tag reader mounted on the mounter.

[0047] In Figures 5 and 6, an example is shown where the bulk case 2 is installed in a direction from which the electronic component 3 can be removed, causing the conductor 13 to move closer to the antenna of the RFID tag 20 due to its own weight. However, if the conductor 13 is a ferromagnetic material, a magnet may be provided on an external structure such as a mounter. In this case, the conductor 13 may be configured to be attracted to the magnet in the direction in which it moves closer to the antenna of the RFID tag 20 due to its own weight. This ensures that the conductor 13 is brought closer to the antenna of the RFID tag 20.

[0048] In the first implementation state, the communication range was changed by moving the lid 6, but in the second implementation state, the communication range can be changed by changing the orientation of the electronic component housing regardless of the lid 6. As a result, it is possible to read information only from the bulk case 2 closest to the tag reader without removing the electronic component 3, and for example, if the electronic component 3 is attached to the mount incorrectly, it can be replaced without losing any components.

[0049] In the second embodiment, as shown in Figure 5, when not mounted on a mount, the conductor 13 is separated from the RFID tag 20 and is located between the RFID tag 20 and the electronic component 3. Therefore, the characteristics of the RFID tag 20 can be stabilized regardless of the amount of electronic component 3. That is, if the electronic component also contains a metal part, the distance between the antenna of the RFID tag 20 and the metal part in the electronic component 3 changes depending on the amount of electronic component contained in the electronic component storage section SP1, which changes the radiation characteristics of the antenna of the RFID tag 20. However, as shown in Figure 5, the presence of the conductor 13 between the antenna of the RFID tag 20 and the electronic component storage section SP1 keeps the radiation characteristics of the antenna constant regardless of the amount of electronic component.

[0050] 《Third Embodiment》 In the third embodiment, similar to the second embodiment, an example is shown in which the proximity between the conductor 13 and the antenna of the RFID tag 20 changes depending on the up-and-down orientation of the electronic component housing.

[0051] Figure 7 shows the structure of the electronic component housing 103 in its second state, as described in the third embodiment of the present invention. The left figure in Figure 7 is a vertical cross-sectional view of the electronic component housing 103, and the right figure is a right side view of the electronic component housing 103. The electronic component housing 103 of the third embodiment is oriented as shown in Figure 7 when mounted on a mounter.

[0052] In this third embodiment, the conductor 13 is formed on the substrate 41. The substrate 41 is provided with a ferromagnetic member 40 that is attracted to a magnet 30 provided on an external structure such as a mounter. The other configurations are the same as those of the electronic component housing 102 shown in the second embodiment. 。 According to the third embodiment, when the conductor 13 is in close proximity to the antenna of the RFID tag 20 due to the weight of the substrate 41, conductor 13, and ferromagnetic member 40, the ferromagnetic member 40 is attracted to the magnet 30. This allows the conductor 13 to be made of a non-magnetic material such as Cu or Al. Furthermore, the movement of the substrate 41, conductor 13, and ferromagnetic member 40 can be made more reliable. Note that the ferromagnetic member 40 may be a magnet arranged in a polarity that attracts it to the magnet 30.

[0053] 《Fourth Embodiment》 In the fourth embodiment, an example is shown in which the proximity between the conductor pattern and the RFID tag changes in response to the magnetic force attracting the conductor.

[0054] Figure 8 is a diagram showing the structure of the electronic component housing 104 in its first state, as a fourth embodiment of the present invention, and is a longitudinal cross-sectional view of the electronic component housing 104.

[0055] The electronic component housing 104 comprises a resin bulk case 2. In the orientation shown in Figure 8, an electronic component housing section SP1 for housing numerous electronic components 3 is formed at the top of the bulk case 2, and a spare space SP2 is formed below this electronic component housing section.

[0056] A conductor 13 is provided in the remaining space inside the bulk case 2. This conductor 13 is positioned so that it can be displaced vertically by attraction and elasticity from the electromagnet 31. An RFID tag 20 is also placed on the inner surface of the bulk case 2. The conductor 13 is a ferromagnetic plate such as an iron plate, but in the state shown in Figure 8, the conductor 13 is not attracted to the electromagnet 31. Therefore, the RFID tag 20 is not affected by the conductor 13.

[0057] Figure 9 is a longitudinal cross-sectional view of the electronic component housing 103 in its second state. While Figure 8 shows the state in which the conductor 13 is not attracted to the electromagnet, Figure 9 shows the state in which the conductor 13 is attracted to the electromagnet. Also in Figure 9, the lid 6 is open to the outlet 4. Figure 9 shows the electronic component housing 103 mounted on the mounter.

[0058] When the electronic component housing 103 is not mounted on the mounter, the conductor 13 is in a first state, away from the RFID tag 20, as shown in Figure 8. As a result, the RFID tag 20 functions as an RFID tag capable of long-distance communication without being affected by the conductor 13. The electromagnet 31 is, for example, an electromagnet with a ferrite core. Therefore, as shown in Figure 8, even when the electromagnet 31 is in close proximity to the RFID tag 20, the RFID tag 20 is not affected by the conductivity of the electromagnet 31.

[0059] When the electronic component housing 103 is mounted on the mounter, the electronic component housing 103 is in a second state, as shown in Figure 9, where the conductor 13 is attracted by the electromagnet 31. As a result, the RFID tag 20 is affected by the conductor 13, and its antenna gain decreases. For example, the maximum communication distance between the RFID tag reader / writer on the mounter and the RFID tag is within a few centimeters. Therefore, in this state, the tag reader on the mounter can only read (or read / write) the RFID tag on the bulk case closest to the tag reader mounted on the mounter.

[0060] The conductor 13 may, for example, have its end support portion inserted from the remaining space SP2 towards the electronic component storage section SP1. In other words, the conductor 13 may be installed closer to the electronic component storage section SP1 in the remaining space SP2 without being fixed. That is, it is sufficient to configure it so that the conductor 13 does not come out when attracted by the electromagnet 31. This allows the conductor 13 to be freely deformed, while at the same time, by giving the conductor 13 rigidity to maintain its shape, it can return to a linear shape as shown in Figure 8 when the electromagnet 31 is not present, thereby stabilizing the antenna characteristics.

[0061] Furthermore, the conductor 13 may be formed on a deformable substrate, and the deformation due to the attractive force of the electromagnet 31 and the restoring force in the absence of the electromagnet 31 may be adjusted by combining the rigidity of the substrate and the conductor 13.

[0062] Alternatively, the distance of the conductor 13 to the RFID tag 20 can be set in multiple stages by making the magnetic force strength of the electromagnet 31 multi-stage, thereby controlling the antenna gain in multiple stages.

[0063] Furthermore, the on / off switch of the electromagnet 31 may be linked to the operation of the slider 5, but in this embodiment, the electromagnet 31 can be turned on and off independently of the operation of the slider 5. This makes it possible to determine the type of electronic component 3 mounted on the mounter without removing the electronic component 3, and eliminates the loss of electronic component 3 due to opening the removal opening 4.

[0064] Furthermore, in the example shown in Figure 9, both ends of the conductor 13 are fixed, but it is also possible to fix only one end.

[0065] Finally, the present invention is not limited to the embodiments described above. It can be appropriately modified and altered by those skilled in the art. The scope of the present invention is defined not by the embodiments described above, but by the claims. Furthermore, the scope of the present invention includes modifications and alterations from the claims and equivalent embodiments.

[0066] For example, electronic components are not limited to a rectangular parallelepiped shape; they may also be cylindrical, for instance.

[0067] Furthermore, although the above embodiments show examples in which the RFID tag 20 is attached to the bottom or top surface of the bulk case 2, it may also be formed on the side surface of the bulk case 2.

[0068] The electronic component of the present invention may be provided in any of the following embodiments.

[0069] <1> It comprises a bulk case capable of housing multiple electronic components, an RFID tag for identifying the bulk case, and a conductor. The RFID tag comprises an RFIC and an antenna electrically connected to the RFIC. The conductor is displaceable relative to the antenna. Electronic component housing.

[0070] <2> In a plan view of the antenna, the conductor is displaceable between a position that overlaps with the antenna and a position that does not overlap with the antenna. <1> The electronic component housing described above.

[0071] <3> The bulk case is provided with a base material that is displaceable relative to the bulk case, The conductor is formed on the substrate, and the position of the conductor relative to the antenna changes due to the displacement of the substrate. <1> or <2> The electronic component housing described above.

[0072] <4> The bulk case is provided with a base material that is displaceable relative to the bulk case, The RFID tag is formed on the substrate, and the position of the conductor relative to the antenna changes due to the displacement of the substrate. <1> or <2> The electronic component housing described above.

[0073] <5> When the bulk case is installed in a direction from which the electronic component can be removed, the conductor will move closer to the antenna due to its own weight, and when the bulk case is installed in a direction from which the electronic component cannot be removed, the conductor will move away from the antenna. <1> The electronic component housing described above.

[0074] <6> The aforementioned conductor is a ferromagnetic material that is attracted to a magnet provided on the external structure. The conductor is attracted to the magnet in a direction approaching the antenna due to its own weight. <5> The electronic component housing described above.

[0075] <7> The aforementioned conductor is formed on the substrate, The substrate has a ferromagnetic member that is attracted to a magnet provided on the external structure. The ferromagnetic member is attracted to the magnet by its own weight in a direction that brings the conductor closer to the antenna. <5> or <6> The electronic component housing described above.

[0076] <8> The distance between the conductor and the antenna changes depending on the strength of the attraction by the magnet. <6> or <7> The electronic component housing described above.

[0077] <9> The magnet is an electromagnet, and the strength of the attraction by the magnet changes depending on whether or not current is applied to the electromagnet. <6> from <8> An electronic component housing as described in any of the following.

[0078] <10> The substrate on which the conductor is formed is provided, and the position of the conductor relative to the antenna is displaced by the displacement of the substrate, The bulk case has an outlet that allows the electronic components to be discharged by the displacement of the substrate. Due to the displacement of the substrate, the conductor and the RFID tag come into close proximity when the outlet is open. <1> from <4> An electronic component housing as described in any of the following.

[0079] <11> <1> from <10> The system comprises a plurality of electronic component housings as described in any of the above, and a packaging box for packaging these plurality of electronic component housings, An electronic component housing package is formed by packing the aforementioned plurality of electronic component housings into the packaging box. [Explanation of symbols]

[0080] SP1... Electronic component storage compartment SP2… extra space 2…Bulk case 3…Electronic components 4… Dispensing opening 5... Slider 6…Lid (base material) 7…RFIC 13... Conductors 14…RFID tag sheet 15...Radiation electrode 16...End electrode 20…RFID tags 30... Magnet 31... Electromagnet 40...Ferromagnetic material material 41... Circuit board 101-104... Electronic component housing 200... Packing boxes 201... Electronic component storage and packaging

Claims

1. The device comprises a bulk case capable of housing multiple electronic components, an RFID tag for identifying the bulk case, a conductor, and a base material that is displaceable relative to the bulk case. The bulk case has an outlet that allows the electronic components to be discharged by the displacement of the substrate, The RFID tag comprises an RFIC and an antenna electrically connected to the RFIC. The conductor is displaceable relative to the antenna, The conductor is formed on the substrate, and the position of the conductor relative to the antenna changes due to the displacement of the substrate. Due to the displacement of the substrate, the conductor and the RFID tag come into close proximity when the outlet is open. Electronic component housing.

2. In a plan view of the antenna, the conductor is displaceable between a position that overlaps with the antenna and a position that does not overlap with the antenna. The electronic component housing according to claim 1.

3. The RFID tag is formed on the substrate, and the position of the conductor relative to the antenna changes due to the displacement of the substrate. The electronic component housing according to claim 1 or claim 2.

4. When the bulk case is installed in a direction from which the electronic component can be removed, the conductor will move closer to the antenna due to its own weight, and when the bulk case is installed in a direction from which the electronic component cannot be removed, the conductor will move away from the antenna. The electronic component housing according to claim 1.

5. A bulk case capable of housing multiple electronic components, an RFID tag for identifying the bulk case, and a conductor, The RFID tag comprises an RFIC and an antenna electrically connected to the RFIC. The conductor is displaceable relative to the antenna, When the bulk case is installed in a direction from which the electronic component can be removed, the conductor will move closer to the antenna due to its own weight, and when the bulk case is installed in a direction from which the electronic component cannot be removed, the conductor will move away from the antenna. Electronic component housing.

6. The aforementioned conductor is a ferromagnetic material that is attracted to a magnet provided on the external structure. The conductor is attracted to the magnet in a direction approaching the antenna due to its own weight. The electronic component housing according to claim 4 or claim 5.

7. The aforementioned conductor is formed on the substrate, The substrate has a ferromagnetic member that is attracted to a magnet provided on the external structure. The ferromagnetic member is attracted to the magnet by its own weight in a direction that brings the conductor closer to the antenna. The electronic component housing according to claim 5.

8. The distance between the conductor and the antenna changes depending on the strength of the attraction by the magnet. The electronic component housing according to claim 6.

9. The aforementioned magnet is an electromagnet, and the strength of the attraction by the magnet changes depending on whether or not current is applied to the electromagnet. The electronic component housing according to claim 6.

10. The invention comprises a plurality of electronic component housings according to claim 1, claim 2, claim 4, claim 5, or claim 7, and a packaging box for packaging these plurality of electronic component housings, An electronic component housing package is formed by packing the aforementioned plurality of electronic component housings into the packaging box.

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