Embedded board

Abstract

The embedded circuit board can be mounted on various devices such as machine tools and has the function of performing predetermined processes.

Description

Technical Field

[0001] The present disclosure relates to an embedded substrate.

Background Art

[0002] For example, Japanese Patent No. 6886506 (Patent Document 1) discloses a machine tool including an imaging unit, a chip recognition unit that automatically recognizes chips based on an image captured by the imaging unit and detects the position where the chips are deposited, and a coolant discharge unit that discharges coolant in a predetermined path toward the deposition position of the chips when a detection signal is input from the chip recognition unit.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] It is required to enable various devices such as machine tools to execute a predetermined process including AI (Artificial Intelligence) processing.

[0005] The present disclosure aims to provide an embedded substrate that enables various devices such as machine tools to execute a predetermined process.

Means for Solving the Problems

[0006] In accordance with certain aspects of this disclosure, the embedded substrate comprises a first substrate and a second substrate. The first substrate includes a first integrated circuit, a first signal path connected to the first integrated circuit and for transmitting associated signals associated with at least one of images, imaging devices, numerical control devices, and machine tools, a first connection part connected to the first signal path, a second signal path connected to the first integrated circuit and for transmitting signals, and a second connection part connected to the second signal path. The second substrate includes a second integrated circuit, a third signal path connected to the second integrated circuit and for transmitting signals, a third connection part connected to the third signal path and physically and electrically connected to the second connection part, and a fourth signal path connected to the second integrated circuit and for transmitting a detection signal indicating at least one of the detection results of position, temperature, strain, pressure, flow rate, vibration, rotational speed, acceleration, torque, atmospheric pressure, illuminance, ultraviolet rays, infrared rays, radiation, light, angular velocity, moisture content, concentration, magnetic field, and electric field. The second integrated circuit transmits the detection signal to the first integrated circuit by transmitting it in the following order: third signal path, third connection, second connection, and second signal path. The first integrated circuit receives the transmitted detection signal and the related signal transmitted from the first signal path, and processes the related signal. [Effects of the Invention]

[0007] According to this disclosure, predetermined processes can be performed using various devices such as machine tools. [Brief explanation of the drawing]

[0008] [Figure 1] This is a perspective view of a machine tool. [Figure 2] This is a perspective view of an imaging system installed inside a machine tool. [Figure 3] This diagram illustrates the software embedded in the circuit board and the interface through which the board communicates with the outside world. [Figure 4] This diagram further illustrates the configuration of the imaging system. [Figure 5] This diagram illustrates the flow of image data in an imaging system. [Figure 6]This is a diagram illustrating the power supply in an imaging system. [Figure 7] This is a block diagram showing the hardware configuration of a machine tool. [Figure 8] This is a flowchart illustrating the data transmission flow in an imaging system. [Figure 9] This figure shows another example. [Figure 10] This diagram further illustrates the hardware configuration of the machine tool. [Figure 11] This is a block diagram of an embedded circuit board located in the control panel of a machine tool. [Modes for carrying out the invention]

[0009] Embodiments according to the present invention will be described below with reference to the drawings. In the following description, the same parts and components are denoted by the same reference numerals. Their names and functions are also the same. Therefore, detailed descriptions of them will not be repeated.

[0010] Figure 1 is a perspective view of a machine tool. As shown in Figure 1, the machine tool 1000 includes an operation panel 8. The machine tool 1000 includes a machining chamber 900 (Figure 7) and a control panel 2 (Figure 7) inside. The operation panel 8 is communicatively connected to the control panel 2.

[0011] Figure 2 is a perspective view of an imaging system installed inside a machine tool 1000. As shown in Figure 2, the imaging system 1 comprises a substrate 10, a first coaxial cable 20A, a second coaxial cable 20B, a first camera unit 30A, and a second camera unit 30B.

[0012] The circuit board 10 has an expansion bus 15. The first camera unit 30A includes a first camera 31A and a first extension board 32A. The second camera unit 30B includes a second camera 31B and a second extension board 32B. The first camera 31A is connected to the first extension board 32A. The second camera 31B is connected to the second extension board 32B.

[0013] The first camera 31A and the second camera 31B are built-in cameras. The first camera 31A and the second camera 31B are also referred to as "MIPI cameras". The first camera 31A and the second camera 31B are installed at different positions of the machine tool 1000. The first camera 31A and the second camera 31B image different areas in the processing chamber 900. Note that a part of the areas imaged by the first camera 31A and the second camera 31B may overlap.

[0014] The first camera unit 30A is housed in a case. The front surface of the case is composed of a transparent panel. The first camera 31A images the inside of the processing chamber 900 through the panel. Similarly, the second camera unit 30B is housed in a case different from the case in which the first camera unit 30A is housed. The front surface of the case is also composed of a transparent panel. The second camera 31B images the inside of the processing chamber 900 through the panel. Note that this is not limited thereto, and the first camera unit 30A and the second camera unit 30B may be housed in the same case. Hereinafter, the above panel is also referred to as a "camera front panel".

[0015] The first extension substrate 32A is connected to one end 21A of the first coaxial cable 20A. The second extension substrate 32B is connected to one end 21B of the second coaxial cable 20B. The other end 22A of the first coaxial cable 20A and the other end 22B of the second coaxial cable 20B are connected to the substrate 10.

[0016] In FIG. 2, for convenience of explanation, the first coaxial cable 20A and the second coaxial cable 20B in a wound state are shown, but when the imaging system 1 is installed in the machine tool 1000, each of the first coaxial cable 20A and the second coaxial cable 20B is in an extended state.

[0017] In the following, when referring to any one of the first camera unit 30A and the second camera unit 30B, it is referred to as "camera unit 30". Similarly, when referring to any one of the first coaxial cable 20A and the second coaxial cable 20B, it is referred to as "coaxial cable 20".

[0018] The length of the coaxial cable 20 can be appropriately adjusted according to the size of the machine tool 1000 or the like. The length of the coaxial cable 20 can be about a dozen meters (for example, 15 m).

[0019] FIG. 3 is a diagram for explaining the hardware included in the substrate 10 and the software incorporated in the substrate 10. The hardware includes an interface for the substrate 10 to communicate with the outside.

[0020] As shown in FIG. 3, the substrate 10 includes a SOM (System On Module) 11. The SOM 11 includes a CPU (Central Processing Unit) 110, an eMMC (embedded Multi Media Card) 121, and a RAM (Random Access Memory) 122. An application program 170 and an embedded Linux (registered trademark) 180 as an OS (Operating System) are stored in the eMMC 121. The substrate 10 further includes a standard I / F (Inter Face) 13, an extended I / F 14, and an extended bus 15.

[0021] Since the eMMC 121 is a non-volatile memory, the application program 170 is stored in the eMMC 121 even when the power of the substrate 10 is turned off. When the power of the substrate 10 is turned on, the application program 170 is expanded in the RAM 122, and the substrate 10 (specifically, the CPU 110) starts an operation (processing) based on the application program 170.

[0022] The board 10 has a standard interface 13 which includes a camera interface 13A, a camera interface 13B, a Gigabit Ethernet® 13C, a Gigabit Ethernet 13D, and a USB (Universal Serial Bus) 3.0 (Type-C) 13E.

[0023] Board 10 has the following expansion I / F14: QSPI (Quad Serial Peripheral Interface), SDIO (Secure Digital Input / Output), PCIe (Peripheral Component Interconnect-Express), USB3.0, GPIO (General Purpose Input / Output), UART (Universal Asynchronous Receiver Transmitter), SPI (Serial Peripheral Interface), I2C (Inter-Integrated Circuit), CAN (Controller Area Network), LVDS (Low-Voltage Differential Signaling), I2S (Inter-IC Sound), MIPI-DSI (Display Serial Interface), and HDMI (Registered Trademark) (High-Definition Multimedia Interface).

[0024] The expansion bus 15 is used to connect to the expansion board 40 (Figure 7), which will be described later. Figure 4 is a diagram illustrating the configuration of the imaging system 1. As shown in Figure 4, the first extension substrate 32A of the first camera unit 30A has a first serializer 320A. The second extension substrate 32B of the second camera unit 30B has a second serializer 320B.

[0025] In addition to the first camera interface 13A and the second camera interface 13B described above, the circuit board 10 includes a CPU 110, memory 120, power supply 140, and bus 190. The first camera interface 13A has a first deserializer 130A. The second camera interface 13B has a second deserializer 130B. The first camera interface 13A, the second camera interface 13B, the CPU 110, the memory 120, and the power supply 140 are connected by the bus 190.

[0026] Memory 120 includes eMMC 121 and RAM 122. Memory 120 (more specifically, eMMC 121) stores a trained model 171 as an example of the application program 170 described above. The trained model 171 is an AI (Artificial Intelligence) model that includes trained parameters for detecting (estimating) the accumulation state (accumulation area, accumulation amount in each area) of workpiece chips scattered within the machining chamber 900 of the machine tool 1000.

[0027] The end 22A of the first coaxial cable 20A is connected to the first camera I / F 13A of the circuit board 10. The end 22B of the second coaxial cable 20B is connected to the second camera I / F 13B of the circuit board 10.

[0028] Figure 5 is a diagram illustrating the flow of image data in the imaging system 1. More specifically, Figure 5 is a diagram illustrating the flow of moving image data (video signal). As shown in Figure 5, the image data (more specifically, the parallel signal) obtained by imaging by the first camera 31A is sent to the first serializer 320A in accordance with the MIPI standard. The first serializer 320A converts the image data into a serial signal. The image data converted into a serial signal is input to the first deserializer 130A via the first coaxial cable 20A. The first deserializer 130A converts the image data converted into a serial signal into a parallel signal. The video signal converted into a parallel signal is sent to the CPU 110 in accordance with the MIPI standard.

[0029] Similarly, image data (specifically, a parallel signal) obtained by imaging with the second camera 31B is sent to the second serializer 320B in accordance with the MIPI standard. The second serializer 320B converts the image data into a serial signal. The image data converted into a serial signal is input to the second deserializer 130B via the second coaxial cable 20B. The second deserializer 130B converts the image data converted into a serial signal into a parallel signal. The video signal converted into a parallel signal is sent to the CPU 110 in accordance with the MIPI standard.

[0030] Furthermore, imaging commands from the CPU 110 to the first camera 31A are transmitted via the first coaxial cable 20A. Similarly, imaging commands from the CPU 110 to the second camera 31B are transmitted via the second coaxial cable 20B. In detail, imaging commands from the CPU 110 to the first camera 31A and the second camera 31B are transmitted using a communication standard different from MIPI.

[0031] Figure 6 is a diagram illustrating the power supply in the imaging system 1. As shown in Figure 6, the power supply 140 supplies power to the CPU 110, the memory 120, the first deserializer 130A, and the second deserializer 130B.

[0032] Furthermore, the power supply 140 supplies power to the first camera unit 30A via the first coaxial cable 20A. More specifically, the power supply 140 supplies power to the first camera 31A and the first serializer 320A. Similarly, the power supply 140 supplies power to the second camera unit 30B via the second coaxial cable 20B. More specifically, the power supply 140 supplies power to the second camera 31B and the second serializer 320B. In this way, in the imaging system 1, power is supplied from the circuit board 10 to each camera unit 30 via the coaxial cable 20.

[0033] Figure 7 is a block diagram showing the hardware configuration of the machine tool 1000. As shown in Figure 7, in addition to the operation panel 8, the machine tool 1000 further comprises a control panel 2, a PLC (Programmable Logic Controller) 4, a pump 5, a first nozzle 6, and a second nozzle 7.

[0034] The control panel 2 is installed inside the housing of the machine tool 1000. However, the control panel 2 may also be installed outside the housing of the machine tool 1000. The control panel 2 includes a nozzle control unit 3 and a PLC 4. The nozzle control unit 3 includes a circuit board 10 and an expansion circuit board 40. The expansion bus 15 of the circuit board 10 is inserted into a slot (not shown) of the expansion circuit board 40. The expansion circuit board 40 is installed in the control panel 2. The operation panel 8 includes a display 81 and an IPC (Industrial Personal Computer) 82.

[0035] The control panel 2 is connected to the first nozzle 6, the second nozzle 7, and the operation panel 8. More specifically, the nozzle control unit 3 is communicated with the PLC 4, the first nozzle 6, the second nozzle 7, and the IPC 82 of the operation panel 8.

[0036] The first nozzle 6 and the second nozzle 7 discharge coolant into the machining chamber 900 of the machine tool 1000. The first nozzle 6 and the second nozzle 7 are configured to allow control of the direction of coolant discharge.

[0037] The nozzle control unit 3 controls the direction of the coolant discharged from the first nozzle 6 and the second nozzle 7, the start timing of coolant discharge, the end timing of coolant discharge, and the amount of coolant discharged (more specifically, the amount discharged per unit time) based on the output of the CPU 110 of the substrate 10 (the state of chip accumulation). Specifically, the nozzle control unit 3 comprises a CPU (not shown) and a memory (not shown) that stores the control program executed by the CPU.

[0038] More specifically, the nozzle control unit 3 controls the orientation of the first nozzle 6 and the second nozzle 7 by sending operation commands to the first nozzle 6 and the second nozzle 7. Thus, the nozzle control unit 3 controls the direction of the coolant discharged from the first nozzle 6 and the direction of the coolant discharged from the second nozzle 7.

[0039] Based on the execution of the ladder program, PLC4 sends operation commands to pump 5. PLC4 starts or stops the operation of pump 5. Through the operation of pump 5, coolant is supplied from the tank to the first nozzle 6 and the second nozzle 7. The upstream input for the operation commands of pump 5 may be sent from the CPU 110 of the circuit board 10 to PLC4 via IPC82.

[0040] The nozzle control unit 3 controls the opening and closing operation of a valve (not shown) installed between the pump 5 and the first nozzle 6. Similarly, the nozzle control unit 3 controls the opening and closing operation of a valve (not shown) installed between the pump 5 and the second nozzle 7.

[0041] The CPU 110 of the board 10 transmits the image data captured by the first camera unit 30A and the second camera unit 30B to the IPC 82. Based on user input, the IPC 82 displays the image data on the display 81. The CPU 110 controls the first nozzle 6 and the second nozzle 7 based on the output of the trained model 171.

[0042] Furthermore, the number of nozzles is not limited to two. One or more nozzles whose orientation does not change may be provided.

[0043] Figure 8 is a flowchart illustrating the data transmission flow in the imaging system 1. As shown in Figure 8, in step S1, the CPU 110 causes the first camera 31A and the second camera 31B to start imaging. In step S2, the first camera 31A transmits the image data (parallel signal) obtained by imaging to the first serializer 320A. Similarly, the second camera 31B transmits the image data (parallel signal) obtained by imaging to the second serializer 320B.

[0044] In step S3, the first serializer 320A transmits image data (serial signal) from the first camera 31A to the first deserializer 130A via the first coaxial cable 20A. Similarly, the second serializer 320B transmits image data (serial signal) from the second camera 31B to the second deserializer 130B via the second coaxial cable 20B.

[0045] In step S4, the first deserializer 130A transmits image data (parallel signal) from the first camera 31A to the CPU 110. Similarly, the second deserializer 130B transmits image data (parallel signal) from the second camera 31B to the CPU 110. In step S5, the CPU 110 inputs the image data received from the first and second cameras 31A and 31B to the trained model 171 and controls the first and second nozzles 6 and 7 based on the output from the trained model 171.

[0046] <Summary> (1) As shown in Figure 4, the substrate 10 includes a memory 120 that stores a program for executing AI processing, and a CPU 110 that inputs image data obtained by imaging with the first camera 31A to a trained model 171 and controls the first nozzle 6 and the second nozzle 7 based on the output from the trained model 171.

[0047] With this substrate 10, AI processing can be executed on the machine tool 1000. More specifically, with the substrate 10, AI processing for controlling the first and second nozzles 6 and 7, which are internal components of the machine tool 1000 but external components to the substrate 10, can be executed on the machine tool 1000. In this way, edge AI can be realized with the substrate 10.

[0048] (2) As shown in Figure 4, the substrate 10 is mounted on the machine tool 1000. Image data from the first camera 31A shows the state inside the machining chamber 900 of the machine tool 1000. With this configuration, the CPU 110 of the substrate 10 can obtain image data inside the machining chamber 900.

[0049] (3) As shown in Figure 5, the CPU 110 acquires image data obtained by imaging with the first camera 31A via a first serializer 320A that converts parallel signals to serial signals and a first deserializer 130A that converts serial signals to parallel signals. Communication from the first camera 31A to the first serializer 320A and communication from the first deserializer 130A to the CPU 110 are MIPI compliant. The first deserializer 130A is connected to the first serializer 320A by a first coaxial cable 20A.

[0050] MIPI-compliant communication has a short transmission distance. Typically, this transmission distance is limited to within approximately 30 cm. Therefore, in configurations that do not use a serializer, coaxial cable, and deserializer, it is not possible to ensure sufficient distance between the camera and the CPU.

[0051] On the other hand, according to this disclosure, image data obtained by imaging with the first camera 31A can be sent to the CPU 110 via the first serializer 320A, the first coaxial cable 20A, and the first deserializer 130A. Therefore, the first camera 31A and the substrate 10 (specifically the CPU 110) can be installed at a distance corresponding to the length of the first coaxial cable 20A.

[0052] In particular, in the machine tool 1000, the processing chamber 900 is imaged by the first camera 31A, and the circuit board 10 is mounted on the control panel 2. Therefore, the distance between the first camera 31A and the CPU 110 on the circuit board 10 is at least several meters. However, the transmission distance between the CPU 110 and the first camera 31A can be increased by using a circuit board 10 to which the first coaxial cable 20A can be connected.

[0053] In addition, the first coaxial cable 20A has high noise immunity. Therefore, even if the length of the first coaxial cable 20A is increased, the impact of noise on image data between the first serializer 320A and the first deserializer 130A can be reduced.

[0054] Furthermore, compared to a configuration where a PoE (Power Over Internet) hub for connecting a network camera and an IPC are connected with a LAN (Local Area Network) cable instead of the circuit board 10, the circuit board 10 allows for a reduction in the installation space and power consumption of the equipment.

[0055] Similarly, the CPU 110 acquires image data showing the state inside the machining chamber 900 of the machine tool 1000, obtained by imaging with the second camera 31B, via a second serializer 320B that converts parallel signals to serial signals and a second deserializer 130B that converts serial signals to parallel signals. Communication from the second camera 31B to the second serializer 320B and communication from the second deserializer 130B to the CPU 110 are MIPI compliant. The second deserializer 130B is connected to the second serializer 320B by a second coaxial cable 20B.

[0056] In this case as well, the transmission distance between the substrate 10 and the second camera 31B can be increased. In addition, even if the length of the second coaxial cable 20B is increased, the influence of noise on image data between the second serializer 320B and the second deserializer 130B can be reduced.

[0057] (4) As shown in Figure 6, the board 10 further includes a power supply 140 that supplies power to the CPU 110, the first deserializer 130A, and the second deserializer 130B. The power supply 140 further supplies power to the first camera 31A and the first serializer 320A via the first coaxial cable 20A. The power supply 140 further supplies power to the second camera 31B and the second serializer 320B via the second coaxial cable 20B.

[0058] With this configuration, power can be supplied from the circuit board 10 to the first camera 31A, the first serializer 320A, the second camera 31B, and the second serializer 320B.

[0059] (5) As shown in Figure 4, the machine tool 1000 comprises a circuit board 10, a first camera 31A, a first serializer 320A, a first coaxial cable 20A, a second camera 31B, a second serializer 320B, and a second coaxial cable 20B.

[0060] With this configuration, by connecting the network camera and the PoE (Power Over Internet) hub with a LAN cable, and then connecting the PoE hub and the IPC with another LAN cable, it is possible to reduce the space required for the imaging system and the power consumption of the imaging system compared to an imaging system where the IPC acquires image data from the network camera.

[0061] (6) As shown in Figure 4, the first camera unit 30A includes the first camera 31A and the first serializer 320A. Similarly, the second camera unit 30B includes the second camera 31B and the second serializer 320B. With this configuration, convenience during installation is improved compared to a configuration in which the camera and serializer are not unitized.

[0062] <Details of circuit board 10 and peripheral devices for circuit board 10> Figure 9 shows a different embodiment from the imaging system 1 described so far. Figure 9 shows the hardware configuration of a control unit 500 that detects the state of the machine tool 1000. The control unit 500 is installed inside the machine tool 1000. The control unit 500 includes a circuit board 10, and the hardware of the circuit board 10 in this embodiment is the same as that used in the imaging system 1. More specifically, in this example, the control unit 500 is included in the control panel 2 (Figure 7). The control unit 500 includes a cover (not shown) and a heat sink (not shown). Figure 9 shows the control unit 500 with the cover removed.

[0063] The control unit 500 comprises a sheet metal (thin steel plate) 501, a substrate 520, and the aforementioned expansion substrate 40 (Figure 7). The substrate 520 and the expansion substrate 40 are arranged on the sheet metal 501. The substrate 520 is a sensor substrate. The expansion substrate 40 is an expansion substrate for expanding the interface of the substrate 10.

[0064] (Circuit board 520) The circuit board 520 includes an analog front-end circuit 521, a 32-bit microcontroller 522, a high-speed single-channel USB (Universal Serial Bus) to UART (Universal Asynchronous Receiver Transmitter) / FIFO (First In First Out) IC (Integrated Circuit) 523, a connector 524 for connecting to the circuit board 10, an LED (Light Emitting Diode) 525, a connector 526 for a temperature sensor, a connector 527 for a strain gauge, a calibration interface 528, and a digital output circuit 529.

[0065] Connector 526 includes eight input terminals. Connector 527 includes four input terminals. Digital output circuit 529 includes four output terminals. For example, the FT232H from FTDI (Future Technology Devices International Limited) can be used as the high-speed single-channel USB to UART / FIFO IC 523.

[0066] The sensing results (analog signals) from multiple temperature sensors are input to the analog front-end circuit 521 via connector 526. The sensing results (analog signals) from multiple strain sensors are input to the analog front-end circuit 521 via connector 527.

[0067] The analog front-end circuit 521 includes a filter, an amplifier, and an AD converter. The filter removes unwanted components (noise) from the signals from the temperature sensor and the strain sensor. The amplifier amplifies the signal from which unwanted components have been removed by the filter. The AD converter converts the amplified signal (analog signal) into a digital signal.

[0068] The 32-bit microcontroller 522 transmits the digital signal obtained from the AD converter of the analog front-end circuit 521 to the CPU 110 (Figure 3) on the board 10 of the expansion board 40 via USB or SPI. Furthermore, the 32-bit microcontroller 522 detects the occurrence of an anomaly (such as a collision of the spindle of the machine tool 1000) by analyzing the digital signal obtained from the AD converter. When the 32-bit microcontroller 522 detects such an anomaly, it sends an anomaly detection signal to the outside of the control unit 500 via the digital output circuit 529. Specifically, the digital output circuit 529 is connected to the PLC4 of the machine tool 1000. When the above-mentioned anomaly is detected, the anomaly detection signal is output to the PLC4 of the machine tool via the digital output circuit 529. The PLC4 of the machine tool 1000 or the numerical control device of the machine tool 1000 (hereinafter also referred to as the "NC (Numerical Control) device") can stop the machine tool 1000 or display an alarm or warning on the display device of the machine tool 1000 based on an abnormality detection signal.

[0069] I / F528 is an interface used during the manufacturing (before shipment) of board 520. Specifically, a reference signal for the strain sensor is input via I / F528 from a signal source (not shown). I / F528 adjusts the gain of the amplifier in the analog front-end circuit 521 so that the voltage level of the reference signal can be accurately obtained.

[0070] (Expansion board 40) The expansion board 40 includes the aforementioned board 10, a connector (slot) 511 for board 10, a power circuit 512, a slot 513 for a microSD (Secure Digital) card, a connector 514 for connecting to board 520, a connector 515 for DC (Direct Current) 24V power input, and a digital output circuit 516.

[0071] The power circuit 512 includes a DC / DC converter (not shown). Connector 514 connects the expansion board 40 to board 520 in a communicative manner. Connector 514 connects to connector 524 on board 520. The digital output circuit 516 includes four output terminals. The digital output circuit 516 is connected to the PLC4 of the machine tool.

[0072] (Circuit board 10) The circuit board 10 is equipped with a LAN (Local Area Network) port 517 for connecting to a host device and a LAN port 518 for connecting to an NC device. Note that LAN port 517 corresponds to Gigabit Ethernet 13C (Figure 3) on the circuit board 10. LAN port 518 corresponds to Gigabit Ethernet 13D (Figure 3) on the circuit board 10.

[0073] The circuit board 10 acquires sensing results from the temperature sensor (digital signal indicating temperature) and sensing results from the strain sensor (digital signal indicating strain) from the circuit board 520 via USB or SPI. The circuit board 10 acquires information such as the spindle rotation angle from the NC device via LAN port 518 using communication based on the industrial Ethernet® protocol (PROFINET in this example).

[0074] The circuit board 10 calculates the spindle cutting force based on the sensing results obtained from the circuit board 520 and the information obtained from the NC device. This calculation is performed by the CPU 110 based on an application program stored in the eMMC 121 of the circuit board 10. The circuit board 10 transmits the calculation result (spindle cutting force) to the host device via the LAN port 517 using communication based on the MQTT (Message Queuing Telemetry Transport) protocol. Furthermore, the circuit board 10 logs the calculation result to the microSD card memory housed in the microSD slot 513.

[0075] The circuit board 10 may detect the occurrence of an anomaly (such as a collision of the spindle of the machine tool 1000) by analyzing the digital signals described above, either in place of or together with the circuit board 520. In this case, when the circuit board 10 detects the anomaly, it transmits an anomaly detection signal to the outside of the control unit 500 via the digital output circuit 516.

[0076] The circuit board 10 detects wear, damage, or breakage of the tool used for machining by the machine tool 1000 based on the measured cutting force, the rotational speed of the spindle of the machine tool 1000, and additional data from the NC device of the machine tool 1000. The measured cutting force may be a calculated result (spindle cutting force). In this case, the rotational angle of the spindle may also be used. If the tool has multiple cutting edges, the circuit board 10 can further detect wear or breakage of a specific one or more cutting edges based on the rotational angle of the spindle. The circuit board 10 performs a process to determine the position of the cutting edge from the rotational angle of the spindle. The circuit board 10 performs a process to estimate the expansion and contraction of the workpiece headstock, workpiece spindle, tool spindle, tool, etc. of the machine tool 1000 based on temperature. By using temperature as a basis, the wear state of the cutting edge can be estimated more accurately.

[0077] Figure 10 is a diagram illustrating the hardware configuration of the machine tool 1000 and the imaging system 1. As shown in Figure 10, the machine tool 1000 further comprises air nozzles 91, 92, an air valve 93, coolant nozzles 96, 97, and a coolant valve 98. The first nozzle 6 further comprises a sensor 61 and a coolant valve 62. The second nozzle 7 further comprises a sensor 71 and a coolant valve 72.

[0078] The expansion board 40 further includes a motion controller IC 810, a valve control I / F 820, nozzle I / Fs 861 and 871, motor drivers 862 and 872, valve control I / Fs 863 and 873, signal input I / Fs 864 and 874, a DC24V power input connector 830, and a power circuit 840.

[0079] The motion controller IC810 controls the direction of coolant discharge from the first and second nozzles 6 and 7, and the speed at which the direction of the first and second nozzles 6 and 7 is changed. The valve control I / F820 is an interface for controlling the camera cleaning coolant valve and the air valve. Specifically, the valve control I / F820 is a connector that outputs signals to open and close the coolant valve that cleans the front panel of the camera, and signals to open and close the air valve.

[0080] Motor driver 862 is an element that drives a motor that changes the direction of the coolant in the first nozzle 6. Motor driver 872 is an element that drives a motor that changes the direction of the coolant in the second nozzle 7. Nozzle I / F 861 is a connector that outputs signals from motor driver 862. Nozzle I / F 871 is a connector that outputs signals from motor driver 872.

[0081] Valve control interfaces 863 and 873 control the machine cleaning coolant valves. Specifically, valve control interface 863 is a connector that outputs a signal to open and close the valve for the coolant discharged from the first nozzle 6. Valve control interface 873 is a connector that outputs a signal to open and close the valve for the coolant discharged from the second nozzle 7.

[0082] Signal input interfaces 864 and 874 are interfaces to which nozzle origin position detection signals are input. Specifically, signal input interface 864 is a connector to which a signal indicating that the coolant discharge direction of the first nozzle 6 is in the origin state is input. Signal input interface 874 is a connector to which a signal indicating that the coolant discharge direction of the second nozzle 7 is in the origin state is input. Power circuit 840 is a power supply circuit including a DC / DC converter. Power circuit 840 supplies power to each device located on the expansion board 40.

[0083] The following will explain "nozzle origin position detection," "control of the direction, start / end timing, and discharge volume of coolant by the nozzle (hereinafter also referred to as "coolant discharge control")," and "cleaning of the camera front panel."

[0084] (1) Nozzle origin position detection The CPU 110 on board 10 and the motion controller IC 810 on expansion board 40 are connected via SPI 890 through expansion bus 15. The CPU 110 commands the motion controller IC 810 via SPI 890 to execute the nozzle origin position confirmation program. The motion controller IC 810 operates the first nozzle 6 via motor driver 862 and nozzle I / F 861. Similarly, the motion controller IC 810 operates the second nozzle 7 via motor driver 872 and nozzle I / F 871.

[0085] The first nozzle 6 is equipped with a sensor 61 that outputs a signal indicating that the coolant discharge direction is at the origin. Similarly, the second nozzle 7 is equipped with a sensor 71 that outputs a signal indicating that the coolant discharge direction is at the origin. Each of the first and second nozzles 6 and 7 operates according to the nozzle origin position confirmation program described above. When each of the first and second nozzles 6 and 7 detects its own origin, it outputs a signal from sensors 61 and 71.

[0086] The signals output from sensors 61 and 71 are input to the motion controller IC 810 via the signal input I / F 864 and 874 of the expansion board 40. The nozzle origin position detection signal is notified from the motion controller IC 810 to the CPU 110 via SPI 890.

[0087] (2) Coolant discharge control The CPU 110 on board 10 converts the direction of coolant discharge into motor rotation. The CPU 110 sends motor operation commands to the motion controller IC 810 on expansion board 40 via SPI 890.

[0088] The motion controller IC 810 outputs pulse signals to the motor drivers 862 and 872 to rotate the motors. The pulse signal to motor driver 862 is transmitted from nozzle I / F 861 to the first nozzle 6 via motor driver 862. The pulse signal to motor driver 872 is transmitted from nozzle I / F 871 to the second nozzle 7 via motor driver 872.

[0089] The CPU 110 issues instructions to the motion controller IC 810 at the discharge start timing and discharge end timing to control (open and close) the coolant valves 62 and 72 provided in the first and second nozzles 6 and 7, respectively. Based on these instructions, the motion controller IC 810 outputs a valve open / close signal to the first nozzle 6 via the valve control I / F 863. Similarly, the motion controller IC 810 outputs a valve open / close signal to the second nozzle 7 via the valve control I / F 873.

[0090] PLC4 (Figure 7) controls the flow rate of pump 5. Alternatively, the CPU 110 may instruct PLC4 via IPC82 to control the flow rate.

[0091] (3) Cleaning the front panel of the camera The CPU 110 on board 10 instructs the motion controller IC 810 on expansion board 40 via SPI 890 to open and close the air valve 93 and coolant valve 98 for cleaning the camera's front panel. The air valve 93 supplies air to air nozzles 91 and 92. The coolant valve 98 supplies coolant to coolant nozzles 96 and 97.

[0092] The motion controller IC810, following instructions from the CPU110, outputs valve open / close signals to the air valve 93 and coolant valve 98 for cleaning the camera's front panel via the valve control I / F820.

[0093] When the coolant valve opens, coolant is discharged from the coolant nozzle 96 for the first camera unit 30A towards the camera front panel of the case housing the first camera unit 30A. Furthermore, coolant is discharged from the coolant nozzle 97 for the second camera unit 30B towards the camera front panel of the case housing the second camera unit 30B.

[0094] Similarly, when the air valve opens, air is discharged from the air nozzle 91 for the first camera unit 30A towards the camera front panel of the case housing the first camera unit 30A. Furthermore, air is discharged from the air nozzle 92 for the second camera unit 30B towards the camera front panel of the case housing the second camera unit 30B.

[0095] Furthermore, cleaning of the camera's front panel using air and coolant is performed at predetermined times, such as after the completion of processing.

[0096] <Embedded circuit board> Figure 11 is a block diagram of an embedded circuit board located in the control panel 2 (Figure 7) of the machine tool 1000. As shown in Figure 11, the embedded circuit board 2000 comprises a first circuit board 2100 and a second circuit board 2200.

[0097] The first substrate 2100 includes a first integrated circuit 2101, a first signal path 2102, a first connection part 2103, a second signal path 2104, and a second connection part 2105. The first signal path 2102 is connected to the first integrated circuit 2101. The first signal path 2102 transmits relevant signals associated with at least one of the following: an image, an imaging device, an NC device (numerical control device), and a machine tool 1000. The first connection part 2103 is connected to the first signal path. The second signal path 2104 is connected to the first integrated circuit. The second signal path 2104 transmits signals. The second connection part 2105 is connected to the second signal path 2104. The imaging device corresponds to the first camera 31A and the second camera 31B.

[0098] The second substrate 2200 includes a second integrated circuit 2201, a third signal path 2202, a third connection part 2203, and a fourth signal path 2204. The third signal path 2202 is connected to the second integrated circuit 2201. The third signal path 2202 transmits signals. The third connection part is connected to the third signal path. The third connection part 2203 is physically and electrically connected to the second connection part 2105 of the first substrate 2100. The fourth signal path 2204 is connected to the second integrated circuit 2201. In this example, the fourth signal path 2204 transmits a signal indicating temperature detected by a temperature sensor (a detection signal indicating the detection result) and a signal indicating strain detected by a strain gauge (a detection signal indicating the detection result).

[0099] The second integrated circuit 2201 transmits the above-mentioned detection signal to the first integrated circuit 2101 by transmitting it in the following order: third signal path 2202, third connection unit 2203, second connection unit 2105, and second signal path 2104. The first integrated circuit 2101 receives the transmitted detection signal and the related signal transmitted from the first signal path 2102. The first integrated circuit 2101 performs processing based on the related signal.

[0100] The following explains the correspondence between the components shown in Figure 11 and the components shown in Figures 9 and 10.

[0101] (First correspondence) In this example, we will explain with reference to Figures 9 and 11. The first board 2100 corresponds to the combined configuration of the expansion board 40 and board 10. The first integrated circuit 2101 corresponds to the CPU 110 of board 10 (Figures 3 to 6, Figure 10, etc.). The first connection section 2103 corresponds to the LAN ports 517, 518 and the digital output circuit 516. The second connection section 2105 corresponds to the connector 514. The first signal path 2102 corresponds to the path between the LAN ports 517, 518 and the CPU 110 of board 10. The second signal path 2104 corresponds to the path between the CPU 110 of board 10 and the connector 514.

[0102] The relevant signals transmitted through the first signal path 2102 correspond to information such as the spindle rotation angle acquired by the board 10 from the NC device, calculation results (spindle cutting force) transmitted from the board 10 to the host device, and abnormality detection signals transmitted from the board 10 to the outside via the digital output circuit 516. At this time, the NC device is connected to the first board 2100 via the LAN port 518, which is the first connection unit 2103, and the host device is connected to the first board 2100 via the LAN port 517, which is also the first connection unit 2103.

[0103] The second board 2200 corresponds to board 520. The second integrated circuit 2201 corresponds to the 32-bit microcontroller 522. The third connection part 2203 corresponds to connector 524. The third signal path 2202 corresponds to the path between connector 524 and 32-bit microcontroller 522. The fourth signal path 2204 corresponds to the path between connectors 526, 527 and 32-bit microcontroller 522.

[0104] (Second correspondence) In this example, as with the first correspondence, we will explain by referring to Figures 9 and 11. The first board 2100 corresponds to board 10. The first integrated circuit 2101 corresponds to the CPU 110 of board 10 (Figures 3 to 6, Figure 10, etc.). The first connection part 2103 corresponds to LAN ports 517 and 518. The second connection part 2105 corresponds to the expansion bus 15. The first signal path 2102 corresponds to the path between LAN ports 517 and 518 and the CPU 110 of board 10. The second signal path 2104 corresponds to the path between the CPU 110 of board 10 and the expansion bus 15.

[0105] The relevant signals transmitted through the first signal path 2102 correspond to information such as the spindle rotation angle acquired by the substrate 10 from the NC device, and calculation results (spindle cutting force) transmitted from the substrate 10 to the host device. At this time, the NC device is connected to the first substrate 2100 via the LAN port 518, which is the first connection unit 2103, and the host device is connected via the LAN port 517, which is also the first connection unit 2103.

[0106] The second board 2200 corresponds to the combined configuration of the expansion board 40 and board 520. The second integrated circuit 2201 corresponds to the 32-bit microcontroller 522. The third connection part 2203 corresponds to the connector 511. The third signal path 2202 corresponds to the path between the connector 511 and the 32-bit microcontroller 522. The fourth signal path 2204 corresponds to the path between the connectors 526, 527 and the 32-bit microcontroller 522.

[0107] (Third correspondence) In this example, we will refer to Figures 7, 10, and 11 for explanation. The first board 2100 corresponds to board 10. The first integrated circuit 2101 corresponds to the CPU 110 of board 10. The first connection part 2103 corresponds to LAN ports 517 and 518. The second connection part 2105 corresponds to the expansion bus 15. The first signal path 2102 corresponds to the path between LAN ports 517 and 518 and the CPU 110. The second signal path 2104 corresponds to the path between the CPU 110 and the expansion bus 15.

[0108] The relevant signals transmitted through the first signal path 2102 correspond to the operation commands for the pump 5 transmitted from the CPU 110 to the PLC 4, and the image data captured by the first camera unit 30A and the second camera unit 30B transmitted from the CPU 110 to the IPC 82. At this time, the PLC 4 and IPC 82 are connected to the first board 2100 via the LAN port 517 or 518, which is the first connection section 2103.

[0109] The second board 2200 corresponds to the expansion board 40. The second integrated circuit 2201 corresponds to the motion controller IC 810. The third connection part 2203 corresponds to the connector 511. The third signal path 2202 corresponds to the SPI 890. The fourth signal path 2204 corresponds to the path between sensors 61 and 71 and the motion controller IC 810.

[0110] <Variation> (1) In the above description, the fourth signal path 2204 (Figure 11) was described as a configuration that transmits a signal indicating temperature and a signal indicating strain as detection signals indicating the detection result, but it is not limited to this. The fourth signal path can be configured to transmit a detection signal indicating at least one of the following detection results: position, temperature, strain, pressure, flow rate, vibration, rotational speed, acceleration, torque, atmospheric pressure, illuminance, ultraviolet rays, infrared rays, radiation, light, angular velocity, moisture content, concentration, magnetic field, and electric field. The machine tool 1000 is equipped with sensors (not shown) that detect these values.

[0111] (2) In the above description, an example was given in which the imaging system 1 comprises two camera units 30, but it is not limited to this. The imaging system 1 may comprise one camera unit 30 or three or more camera units 30.

[0112] (3) In this example, the first nozzle 6 and the second nozzle 7 were used as examples of external devices controlled based on the output from the trained model 171, but the external devices to be controlled are not limited to these.

[0113] (4) In the above description, the trained model 171 was used as an example to explain the program for detecting the accumulation state of workpiece chips scattered in the machining chamber 900 of the machine tool 1000. However, the program for detecting the accumulation state of workpiece chips is not limited to the trained model 171, but can be any program that performs AI processing.

[0114] (5) In the above, an example of an application program 170 was described using a program that detects the chip accumulation state of a workpiece. However, the application program 170 is not limited to a program that detects the chip accumulation state of a workpiece. An application program that performs necessary calculations from information from multiple temperature sensors and multiple strain sensors that detect the state of the machine tool can also be applied, as in the control unit 500. Various types of programs other than the program described can be mounted on the circuit board 10. Therefore, the circuit board 10 can be used for other purposes even though it is the same hardware. Thus, the circuit board 10 is highly versatile.

[0115] (6) In the above description, an example was given in which the imaging system 1, including the substrate 10, is built into a machine tool 1000. However, the machine in which the imaging system 1 is installed is not limited to a machine tool. Furthermore, the camera unit 30 and the substrate 10 may be installed in separate machines.

[0116] (7) In the above description, as shown in Figures 4 and 10, a configuration in which the first camera I / F 13A includes the first deserializer 130A and the second camera I / F 13B includes the second deserializer 130B was used as an example, but the description is not limited to this. The first deserializer 130A does not have to be included in the first camera I / F 13A. That is, the first deserializer 130A may be provided independently of the first camera I / F 13A. Similarly, the second deserializer 130B does not have to be included in the second camera I / F 13B.

[0117] The embodiments disclosed herein are illustrative and not limited to those described herein. The scope of the present invention is indicated by the claims, and all modifications within the meaning and scope of the claims are intended to be included.

[0118] Cross-reference of related applications This application is based on Japanese Patent Application No. 2024-201173, filed with the Japan Patent Office on 30 October 2024, the entire contents of which are incorporated herein by reference. [Explanation of symbols]

[0119] 1 Imaging system, 2 Control panel, 3 Nozzle control unit, 5 Pump, 6 First nozzle, 7 Second nozzle, 8 Operation panel, 10 Circuit board, 11 SOM, 170 Application program, 13 Standard I / F, 13A, 13B Camera I / F, 13C, 13D Gigabit Ethernet, 14 Expansion I / F, 15 Expansion bus, 20A First coaxial cable, 20B Second coaxial cable, 30A First camera unit, 30B Second camera unit, 31A First camera, 31B Second camera, 32A First extension board, 32B Second extension board, 40 Expansion board, 61, 71 Sensor, 62, 72, 98 Coolant valve, 81 Display, 91, 92 Air nozzle, 93 Air valve, 96, 97 Coolant nozzle, 110 CPU, 120 Memory, 121 eMMC, 122 RAM, 130A First Deserializer, 130B Second Deserializer, 140 Power Supply, 171 Learned Model, 190 Bus, 320A First Serializer, 320B Second Serializer, 500 Control Unit, 501 Sheet Metal, 511, 514, 515, 524, 526, 527 Connectors, 512 Power Circuit, 513 Micro SD Slot, 516, 529 Digital Output Circuit, 517, 518 LAN Port, 519 USB 3.0 (Type-C), 521 Analog Front-End Circuit, 522 32-bit Microcontroller, 523 High-Speed ​​Single-Channel USB UART / FIFO IC, 810 Motion Controller IC, 820, 863, 873 Valve Control I / F, 861, 871 Nozzle I / F, 862, 872 Motor Driver, 864, 874 Signal input I / F, 830 Power input connector, 840 Power circuit, 890 SPI, 1000 Machine tool, 2000 Embedded board, 2100 First board, 2101 First integrated circuit, 2102 First signal path, 2103 First connection, 2104 Second signal path, 2105 Second connection, 2200 Second board, 2201 Second integrated circuit, 2202 Third signal path, 2203 Third connection, 2204 Fourth signal path.

Claims

[Claim 1] An embedded circuit board, First substrate and A second substrate is provided, The first substrate is, The first integrated circuit and A first signal path for transmitting related signals associated with at least one of an imaging device, a numerical control device, and a PLC (Programmable Logic Controller), each connected to the first integrated circuit and each located outside the embedded board, A first connection part that connects to the first signal path, A second signal path connected to the first integrated circuit and for transmitting signals, It includes a second connection part that connects to the second signal path, The aforementioned second substrate is The second integrated circuit and A third signal path connected to the second integrated circuit and for transmitting signals, A third connection part that connects to the third signal path and is physically and electrically connected to the second connection part, The system includes a fourth signal path connected to the second integrated circuit and transmitting a detection signal indicating at least one of the following detection results: position, temperature, strain, pressure, flow rate, vibration, rotational speed, acceleration, torque, atmospheric pressure, illuminance, ultraviolet rays, infrared rays, radiation, light, angular velocity, moisture content, concentration, magnetic field, and electric field. The second integrated circuit transmits the detection signal to the first integrated circuit by transmitting it in the order of the third signal path, the third connection, the second connection, and the second signal path. The first integrated circuit is an embedded board that receives the transmitted detection signal and the associated signal transmitted from the first signal path, and processes the associated signal.

Images