Airtightly coupled structure, housing, and method for manufacturing the same

Abstract

A hermetically bonded structure is disclosed, comprising a first metal substrate and a second substrate that is at least regionally and / or at least partially made transparent to at least one wavelength range, wherein the first substrate is arranged adjacent to the contact surface of the second substrate at a contact surface, and further has at least one laser bond line or a plurality of connection points for directly and without an intermediary joining the first metal substrate to the second substrate on or within the contact surface, wherein the laser bond line or the plurality of connection points extend into the first substrate on the one hand and into the second substrate on the other hand, and directly join the at least two substrates to each other by melting.

Description

[Technical Field]

[0001] The present invention relates to a hermetically coupled structure, a housing, a method for manufacturing a hermetically sealed assembly, and a hermetically coupled structure manufactured by the said method. [Background technology]

[0002] Background and General Description of the Invention In principle, it is well known that multiple components can be joined together using various laser methods. For example, hermetically bonded glass-glass transitions are known from the applicant's European Patent No. 3012059 (EP3012059 B1), which describes a method for manufacturing a transparent component for protecting an optical structural component. A new laser method is introduced therein.

[0003] Bonding different materials together is attracting increasing attention. Among these, the transition zone between metals and glass is of particular interest because the combination of metals and glass offers numerous potential applications. For example, it could lead to improvements and new applications in biophysics or technomedical fields, particularly in bioprocessors, as well as in aerospace applications.

[0004] When a hermetically sealed housing is constructed, one or more structural members inside the housing can be protected from unfavorable environmental conditions. Therefore, sensitive electronic components, switching circuits, or sensors can be placed within a hermetically sealed housing, for example, in the cardiac region, the retina, or for medical implants in general. Applications can also be found in MEMS (micro-electromechanical systems), in sensor technology, for example, for barometers, blood gas sensors, or glucose sensors, and in electronic applications, particularly in the field of watchmaking, or in the field of wearable devices and equipment where water or pressure protection is generally required. Diverse applications are also found in aviation, high-temperature applications, in the field of electromobility, for example, for the manufacture of flow batteries, and in the field of micro-optical instruments.

[0005] Unlike joining materials of the same type, when different materials are used, there is a problem in that the bonding between the two joining partners is poor, or generally must be achieved in a single joined structure. [Prior art documents] [Patent Documents]

[0006] [Patent Document 1] European Patent No. 3012059 [Overview of the project] [Problems that the invention aims to solve]

[0007] Accordingly, the present invention has the objective of providing a hermetically coupled structure between two components made of different materials, which has not been successfully achieved with metals to date. Furthermore, it also has the objective of providing a housing in which two members of different materials are joined together. In particular, some aspects of the problems of the present invention result in a hermetically coupled structure or housing that can be manufactured with sufficient durability, particularly because both members do not delaminate from each other, or already do not delaminate from each other under the action of small forces. Further aspects of the present invention are that by using a joining method, it is possible to examine and make available inspections, and that the avoidance or reduction of such damage that may occur should be achieved. Accordingly, a possible objective of the present invention is to provide a more reliable and long-lasting hermetically coupled structure or housing. [Means for solving the problem]

[0008] The hermetically coupled structure according to the present invention includes a first metal substrate and a second substrate which is formed to be transparent at least regionally and / or at least partially to at least one wavelength range. The first substrate is positioned adjacent to the contact surface of the second substrate at the contact surface.

[0009] In the sense of this application, a contact surface is a region or part of a surface, or the entire surface of each substrate, where each substrate lies adjacent to or positioned next to the other substrate. Typically, these substrates are arranged side by side or overlapping. When both substrates are in direct and unintermediated contact, a contact surface is formed. Thus, the contact surface is, for example, a portion of the contact surface where the distance between the two substrates is so small that it is no longer optically measurable.

[0010] At least two substrates are typically first placed in contact with each other for their bonding, that is, for example, stacked on top of each other. Gravity can then press the typically second substrate on top against the typically first metal substrate below. In this case, the upward or downward direction is merely descriptive, because the placement of the substrates can naturally take any direction in space, and even adjacent placements do not go beyond the scope of protection. Both substrates are typically placed adjacent to each other, touching each other on their larger sides.

[0011] For example, both substrates are configured to be disc-shaped or flat, and therefore each has at least one larger flat surface, which is preferably aligned in the direction of the other substrate.

[0012] The hermetically coupled structure further includes at least one laser bonding line or a plurality of bonding points for directly and without mediation joining the first metal substrate to the second substrate on or within the contact surface. The laser bonding line or a plurality of bonding points extends into the first substrate on one side and into the second substrate on the other side, and joins at least two substrates to each other by direct melting. In other words, both substrates are joined to each other at the laser bonding line.

[0013] On the contact surface, each substrate is constructed to be flat. However, an absolutely flat surface is only achievable in theory, because depending on the scale of observation, even polished surfaces can have dents, bumps, or curves, or all of these together. Therefore, achieving complete contact is difficult. Rather, the substrates will have dents or bumps, even to a very small degree, if they are warped, tilted, or curved.

[0014] For example, the contact surface can be defined as having an average distance of 1 μm or less, preferably 0.5 μm or less, and more preferably 0.2 μm or less, between the first substrate and the second substrate.

[0015] In this case, it has been found that it is advantageous when the distance between the first substrate and the second substrate is smaller within the scope of the present invention. Therefore, it is advantageous to polish the surface on the contact surface of the first substrate and / or the surface on the contact surface of the second substrate before arranging the substrates in contact with each other, and further reduce the average distance between the substrates. In the case of the first metal substrate, it can be advantageous that the absolute protrusion on the average surface of the metal substrate does not exceed 0.5 μm.

[0016] This is unexpected because the polished surface of the metal substrate is basically disadvantageous for the laser bonding method, because an increase in the amount of reflection occurs on the polished surface, and thus accurate positioning and output deposition for the bonding process become difficult, or the bonding process may not be able to be carried out. Nevertheless, a good bonded structure strongly adhering to each other could be realized, especially on the polished contact surface of the first metal substrate.

[0017] There is a mixed area where the material of the second substrate and the material of the first substrate are mixed at the laser bonding line or a plurality of connection points.

[0018] In the mixed area, the metal material of the first substrate can enter the second substrate. In the mixed area, the material of the second substrate can also enter the first metal substrate. Particularly preferably, in the mixed area, the metal material of the first substrate enters the second substrate and the material of the second substrate also enters the metal substrate.

[0019] The mixed area can have a thickness measured in a direction perpendicular to the contact surface, and the thickness of the mixed area can preferably have a thickness of at least 1 μm, more preferably 2 μm or more, and even more preferably 5 μm or more.

[0020] The mixing area preferably extends 1 μm or more into the second substrate. Preferably, the mixing area extends 5 μm into the second substrate. More preferably, the mixing area extends into the second substrate to the same extent as the re-solidification area, and the mixing area overlaps with the re-solidification area. For example, the mixing area extends into the second substrate with approximately the same extent as the first substrate. This may seem surprising, because, for example, in a metal-glass composite, the CTE of the first substrate is 3 to 10 times higher than the CTE of the glass. The heat capacity and thermal conductivity of the metal are also typically significantly higher than those of the second substrate. However, it has been shown that the mixing area can be advantageously positioned at the laser bonding line or connection point so that it extends into the first substrate with approximately the same extent as the second substrate, thereby improving the bonded structure.

[0021] The mixing area has a width, and the width of the mixing area is preferably greater than the thickness of the mixing area of ​​the second substrate. The width of the mixing area may be 50% or more greater than the thickness of the mixing area, and more preferably 100% or more greater than the thickness of the mixing area.

[0022] In this case, the width can be measured, for example, at the contact surface between the first substrate and the second substrate, in a direction parallel to the contact surface and perpendicular to the laser bonding line.

[0023] At least one laser junction line or multiple junction points may further include a re-solidification area, the re-solidification area having a thickness measured perpendicular to the contact surface. The thickness of the re-solidification area may preferably be 20 μm or less, preferably 10 μm or less, and more preferably 5 μm or less.

[0024] The re-solidified region may extend to a depth of 20 μm or less, preferably 10 μm or less, and even more preferably 5 μm or less, in the second substrate.

[0025] Resolidation zones for at least one laser junction line or multiple junction points may extend along the laser junction line or be located at each junction point. The resolidation zone may have a width of 10 μm, for example, ±5 μm, in the contact surface between the first substrate and the second substrate, and in a direction parallel to the contact surface. Preferably, this can be 20 μm ± 10 μm, and more preferably 30 μm ± 10 μm.

[0026] The resolidification zone may also have a width greater than the thickness of the resolidification zone in a direction parallel to the contact surface and perpendicular to the laser bonding line.

[0027] The resolidification zone is particularly advantageous to be as small as possible; that is, the irradiation parameters of the bonding laser can be selected so that the resolidification zone is as small as possible. The resolidification zone is of no use to the bonding process because the materials are not mixed there in order to create interlocking or adhesion between the first and second substrates. Therefore, the resolidification zone absorbs the laser energy without improving the purpose of adhesion. At the same time, cracks and / or holes or cavities may occur in the resolidification zone during cooling, which can sometimes be explained by the expansion of the material of each substrate during heating, thereby creating tension, and then contracting again during cooling.

[0028] Therefore, the mixing area is set to be as large as possible, while the re-solidification area is set to be as small as possible. Preferably, the mixing area has a height of at least 1 / 5 of the re-solidified height, more preferably 1 / 2 the height of the re-solidification area, and even more preferably the mixing area is the same height as the re-solidification area. In this case, for example, if the height of the mixing area is 5 μm and the height of the mixing area is 1 / 5 of the height of the re-solidification area, the height of the re-solidification area on the mixing area is 25 μm. If the height of the mixing area is 10 μm and the height of the re-solidification area of ​​the second substrate is also 10 μm, the height of the re-solidification area corresponds to the height of the mixing area. The mixing area can also have a greater thickness than the re-solidification area, for example, 1.5 times or more thicker than the re-solidification area, for example, 5 times thicker.

[0029] Furthermore, the first metal substrate typically has a resolidified area below the mixing area. To date, it has not been observed that the size of the resolidified area of ​​the first substrate is disadvantageous to the bonding process, as is the case with the second substrate. Conversely, it can be shown that the material of the second substrate can penetrate into the resolidified area of ​​the first substrate, where dendrite formation can occur; that is, an anchor-like bond of the second substrate on the first substrate can be provided via one or more dendrites, and these dendrites can reach the resolidified area of ​​the first substrate.

[0030] In the mixing area, the materials of the first and second substrates may be arranged such that a shape-bonding interlocking occurs between the materials of the first and second substrates. The hermetically bonded structure may include an interlocking structure that fuses with the first metal substrate and the second substrate. In the fused interlocking structure, overlapping, indentation, or rear gripping of the other substrate material may be present, thereby significantly enhancing the adhesion of the hermetically bonded structure. Such a fused interlocking structure results in a shape bond between both substrates, which is particularly advantageous when material bonding between different materials may provide only small adhesion or low material bonding capacity. The interlocking structure between the first and second substrates functions like a microscopic zipper.

[0031] In the mixing area, the metallic material of the metal substrate can exist in the form of droplets and / or dendrites, and the arrangement as droplets and / or dendrites results in strengthening the bond between the first substrate and the second substrate.

[0032] It should also be noted that the metallic material of the metal substrate and / or the material of the second substrate can penetrate at least one of the resolidification zones, particularly in the form of droplets, ablations (Abschmelzung) and / or dendrites, resulting in a strengthening of the bond between the first and second substrates. In other words, the bonding partners, i.e., the materials of the first and / or second substrates, are selected and / or the beam generator is adjusted and / or prepared so that the bonding process is adjusted so that the metallic material of the metal substrate and / or the material of the second substrate penetrate the resolidification zones belonging to the other substrate.

[0033] For example, the material of the first substrate and / or the second substrate may have amorphous regions or areas through or after the introduction of laser bonding lines. Such amorphous regions, i.e., amorphous metallic material, can further improve the interlocking.

[0034] The contact surface of the first substrate may have at least one contact area where the first substrate is in planar contact with the second substrate. The contact surface may have an average distance of 1 μm or less, preferably 0.5 μm or less, and more preferably 0.2 μm or less between the first and second substrates. In this case, for technical or other reasons, for example, slight gas inclusions or impurities, such as dust particles between substrate layers or irregularities from the polishing process, may be unavoidable. This can also result from irregularities that occur between substrate layers or in minute areas on the surface of the substrate layers. The contact surface may correspond to the contact surface if full contact can be made between both substrates.

[0035] A laser bonding line can bond a first substrate to a second substrate such that both substrates can only be separated from each other by applying a holding force. If the holding force is greater than the force required to destroy the second substrate, the bonding between the two substrates can also be achieved with such strength that separation of the two substrates can only be achieved by destroying the second substrate. The adhesion force of the second substrate to the first substrate is, for example, 10 N / mm².2 It is greater than, preferably 25 N / mm 2 It is greater than, and more preferably 50 N / mm 2 A value exceeding this, and even more preferably 75 N / mm², is preferable. 2 It exceeds and ultimately most preferably 100 N / mm 2 It can surpass that.

[0036] The first substrate may be characterized by having a flat contact surface, that is, particularly a planar surface. The contact surface of the first substrate may be polished.

[0037] In this case, the contact side of the first substrate may have an average roughness value Ra of 0.5 μm or less, preferably 0.2 μm or less, more preferably 0.1 μm or less, even more preferably 50 nm or less, and ultimately preferably 20 nm or less.

[0038] The second substrate is characterized by being flat on the contact side, particularly in a planar form, and more particularly having an average roughness value Ra of 0.5 μm or less.

[0039] The laser junction line is introduced using a junction laser. For example, if the junction laser is an infrared laser, it preferably has a wavelength of 1030 nm. For example, an ultrashort pulse laser having a pulse length in the range of 50 ps or less, preferably 20 ps or less, more preferably 10 ps or less, or even more preferably 1 ps or less can be used.

[0040] A bonding laser has a beam focus. The beam focus may have a beam waist width of 2w0. Furthermore, the bonding laser has a beam width of 2W for the bonding process. レーザー It has a beam waist width of 2w0 or more. The focal plane for integrating the laser junction line can be shifted distally to the junction line. When the focal plane for integrating the laser junction line is shifted distally, the beam width is 2W レーザーIn particular, it is larger than the beam waist width 2w0. In particular, when introducing the laser bonding line, the focal plane is present within the first substrate. The focal plane is shifted distally within the first substrate, preferably by 10 μm ± 10 μm, more preferably by 20 μm ± 10 μm.

[0041] Beam width 2W レーザー is preferably 4 μm ± 1 μm, more preferably 4 μm ± 2 μm, even more preferably 4 μm ± 3 μm on the bonding surface. This can be achieved, for example, when the focal plane is present in the first substrate during laser bonding line introduction, i.e., when it is shifted distally into the first substrate by, for example, 10 μm ± 10 μm or 20 μm ± 10 μm. Alternatively or additionally, the laser beam can be expanded or narrowed, for example, through an aperture or a telescope in front of the writing objective lens to adjust the beam width 2W レーザー to the desired width.

[0042] The first substrate preferably consists entirely of a metallic material. In this case, the first substrate contains metals in the sense of the definition of the periodic table.

[0043] The first substrate can contain at least one of or consist of molybdenum, tungsten, silicon, platinum, silver, or gold. The first substrate can also include alloys.

[0044] In particular, the first substrate can contain at least one of or consist of carbon, copper, manganese, chromium, magnesium, cobalt, nickel, tin, zinc, niobium, palladium, rhenium, indium, tantalum, titanium, or iridium.

[0045] The second substrate is preferably a transparent substrate. The second substrate can contain or consist of glass, glass ceramic, silicon, sapphire, or a combination of the above materials. The second substrate can also contain or consist of a ceramic material, in particular an oxide ceramic material.

[0046] The second substrate may include or consist of at least one of the following: quartz glass, borosilicate glass, aluminosilicate glass, glass ceramics such as Zerodur, Ceran or Robax, optoceramics such as aluminum oxide, spinel, pyrochlore or aluminum oxynitrite, calcium fluoride crystals or chalcogenide glass.

[0047] In further configurations or alternative embodiments, the hermetically coupled structure may include a first metal substrate and a second substrate formed to be transparent at least regionally and / or at least partially to at least one wavelength range, wherein the first substrate is positioned adjacent to the contact surface of the second substrate at the contact surface. The hermetically coupled structure further includes at least one spacer to ensure a gap between the first and second substrates.

[0048] The spacer may be placed between a first metal substrate and a second substrate. For example, the first substrate can then contact the second substrate via the spacer. In other words, the spacer may be positioned, for example, on one of the contact surfaces, so that the other substrates can contact or be in contact with the spacer, but a gap remains between the contact surface of the first substrate and the contact surface of the second substrate outside the spacer, for example, the size of the spacer's thickness.

[0049] Therefore, the first substrate can be in contact with or in tandem with the second substrate via a spacer. Accordingly, the spacer can be placed between the first metal substrate and the second substrate.

[0050] The spacer may be made of a metallic material. For example, the spacer may be formed as a coating on a first substrate or a second substrate. The spacer may also be formed integrally with the first substrate.

[0051] The spacer can be formed integrally with the surface of the first and / or second substrate, that is, a recess or rise can be formed therein. For example, the spacer can be created during polishing if the area of ​​the contact surface of the first or second substrate is not polished and therefore a rise remains therein. In particular, in the case of the second substrate, for example, watch glass, which is typically sapphire that has already undergone the arduous polishing of sapphire glass, additional or re-polishing of the sapphire glass can be performed during the polishing stage, so no additional work steps are required in its manufacture.

[0052] The spacer can be manufactured, for example, as a thin foil made of aluminum, which can be attached to a first or second substrate. The spacer can be sputtered. The spacer may include a directly deposited lithographic glass layer. The spacer can also be printed on the first or second substrate, for example, by an inkjet printing method. The spacer can also be produced using 3D printing.

[0053] The spacer may extend at least along the laser junction line or into the region of the junction point. The spacer may extend outside the laser junction line or outside the region of the junction point. The spacer may also be formed entirely.

[0054] In one example, the spacer is formed when the first metal substrate is polished on its contact surface, but not entirely flat, leaving, for example, a web-like spacer on the contact surface of the first substrate. Thus, the spacer is formed integrally with the first substrate as a bulge from the contact surface of the first substrate. The spacer may preferably be placed where (one or more) laser bonding lines are introduced. This can further reduce the gap remaining between the substrates in the region of the (one or more) laser bonding lines and / or improve the bonding or adhesion of both substrates to each other.

[0055] The spacer may have a thickness of at least 5 μm, more preferably at least 10 μm, and even more preferably at least 20 μm. This is of particular interest when the spacer is used in the region of the laser junction line.

[0056] When the spacer is used adjacent to, for example, the laser junction line to be installed, rather than within that area, it is advantageous that the spacer does not exceed a thickness of 5 μm. For example, the spacer may preferably have a thickness greater than 1 μm, preferably 2 to 3 μm or more.

[0057] Within the scope of the present invention, also shown are hermetically coupled structures comprising a first metal substrate, a second substrate formed to be transparent at least regionally and / or at least partially to at least one wavelength range, wherein the first substrate has a contact surface adjacent to the contact surface of the second substrate, and includes at least one avoidance area for receiving molten material from laser junction lines or connection points, the laser junction lines or a plurality of connection points being used to melt-bond the first metal substrate to the second substrate directly and without mediation.

[0058] In this configuration, at least one avoidance area is preferably positioned adjacent to a laser junction line or a plurality of connection points. In other words, the avoidance area is positioned so that molten material can escape into the avoidance area, especially at the moment of laser junction line generation. For example, the avoidance area is positioned around and in communication with the laser junction line so that a small portion of the material that is melted and heated at the laser junction line can escape into the avoidance area. In this configuration, the molten material can follow a pressure gradient during the avoidance process.

[0059] For example, when introducing a laser bonding line between a first substrate and / or a second substrate, expansion, such as thermal expansion, may occur. Since the laser only heats the material locally, meaning the material around the laser bonding line remains solid, enormous stresses may be generated between the material at the laser bonding line and the surrounding material, which may cause cracks, such as stress cracks or cavities. If a relief zone is available, the molten material can be released into the relief zone to avoid the formation of cracks or cavities.

[0060] The at least one avoidance area, buffer area, or mitigation area is more preferably located between the first substrate and the second substrate, for example, on the contact surface therein.

[0061] For example, the at least one avoidance area can be formed when the second substrate is placed on the first substrate at the contact surface, for example, when one or both of the substrates do not have a flat surface within the range of the contact surface, or on the side facing the other substrate.

[0062] Particularly preferably, the avoidance area is formed by including a spacer such that, when the second substrate is placed on the first substrate, both contact surfaces are located at a defined distance from each other. In this case, the cavity formed between the first and second substrates in the area where the spacer is absent may be pre-fabricated or positioned so that it can be used as an avoidance area for materials to be avoided during laser bonding. This results in a laser bonding line with less stress, which may in some cases provide stronger or higher adhesion, while simultaneously preventing stress from being applied to the second substrate, thus reducing the formation of stress cracks or cavities in the second substrate.

[0063] If we refer to the region where the molten materials of both substrates mix with each other as the mixing region, and the region adjacent to it by the laser bonding line as the resolidification region, the resolidification region is particularly problematic because the introduction of the laser bonding line can cause cracks or voids to form there. This is especially disadvantageous if the second substrate is, for example, a single crystal, such as sapphire, and damage caused by the introduction of the laser bonding line cannot be repaired by introducing a subsequent laser bonding line that is covered and moved over. Therefore, the idea of ​​the present invention, in particular by avoidance regions and / or spacers, makes it possible to keep the resolidification region as small as possible while making the mixing region as large as possible, or projecting as far as possible into both substrates. In the ideal case, the mixing region is the same size as the resolidification region, and therefore the mixing region completely overlaps with the resolidification region, and the resolidification region cannot be recognized as itself. In this case, the adhesion between the two substrates is particularly good, and the occurrence of cracks or voids is minimized.

[0064] A hermetically sealed structure • First metal substrate, • A second substrate formed to be transparent at least regionally and / or at least partially to at least one wavelength range, Here, the first substrate is positioned adjacent to the contact surface of the second substrate at the contact surface. A set of first laser bonding lines or first connection points for directly and without mediation joining the first metal substrate to the second substrate on or within the contact surface, Here, the first laser bonding line or the set of first bonding points extends into the first substrate on one side and into the second substrate on the other side, and at least two substrates are directly joined to each other by melting, A set of second laser bonding lines or second bonding points for directly and without mediation joining the first metal substrate to the second substrate on or within the contact surface, Here, the second laser bonding line or the set of second connection points extends into the first laser bonding line or the set of first connection points, and the mixing of materials achieved by the first laser bonding line or the set of first connection points is altered or improved. Includes.

[0065] Such a second laser junction can be achieved by setting the same laser again on the previous or similar junction location, that is, by having a new laser focus that overlaps with an already set or already applied focus. Introducing the second laser junction, especially to the first laser junction which is still warm or hot, can also be done by using a dual focus in the laser generator. For example, a beam splitter or diffraction grating may be used for this purpose, or two laser generators may be used. In this case, the second laser junction is introduced to the still warm, especially still molten, material of the first and second substrates.

[0066] Such an effect, that is, the introduction of laser energy into a material that is still warm or even still molten, can also be achieved, for example, if the laser generator has a burst function and can thus introduce a number of laser points into the structure in overlapping and short time series. In other words, at one focal point of the first laser junction line, further focal points are introduced at defined time intervals and / or defined spatial intervals, or a second laser junction line is introduced.

[0067] Within the scope of the present invention, as already detailed above, hermetically sealed housings having a particularly hermetically coupled structure are also shown. The hermetically sealed housing includes a first metal substrate and a second substrate formed to be transparent at least regionally and / or at least partially to at least one wavelength range, wherein the first substrate is positioned adjacent to the contact surface of the second substrate at the contact surface.

[0068] Furthermore, the housing includes at least one functional region, particularly a hollow portion, positioned between the first substrate and the second substrate. The housing further includes at least one laser bonding line or a plurality of connection points, particularly around the functional region, for directly and unintermediated joining the first substrate to the second substrate on or within the contact surface, thereby sealing the functional region airtight. In this configuration, the laser bonding line or the plurality of connection points extends into the first substrate on one side and into the second substrate on the other side, and at least two substrates are joined to each other by direct melting via the laser bonding line or the plurality of connection points.

[0069] In a hermetically sealed housing, the laser bonding lines of the housing may be configured to be completely closed around the functional area. Furthermore, or alternatively, the distance of the first substrate from the second substrate along the laser bonding lines may consistently be less than 0.75 μm, preferably less than 0.5 μm, and more preferably less than 0.2 μm.

[0070] The functional area of ​​the housing may have a hermetically sealed housing cavity for receiving an object, such as an electronic circuit, sensor, or MEMS.

[0071] The hermetically coupled structure or hermetically sealed housing may further have a first coating or covering on the first metal substrate, at least on the side facing the second substrate, in the area of ​​laser bonding lines or a plurality of bonding points. The laser bonding lines or a plurality of bonding points are provided, in particular, for directly and without mediation bonding the first metal substrate to the second substrate. In this case, the first coating or covering on the first metal substrate may be applied before hermetically bonding the at least two substrates to each other by directly bonding the at least two substrates.

[0072] In the case of hermetically coupled structures or hermetically sealed housings, the material of the first substrate and the material of the first coating or covering may be mixed in a mixing area and / or in at least a region near the surface of the first substrate.

[0073] In the case of hermetically coupled structures or hermetically sealed housings, the morphology of the structure, particularly in mixed areas, can be altered by the first coating or plating material. In the mixed areas, an alloy can be formed, at least regionally, comprising at least the first metal substrate and the first coating or plating material.

[0074] The alloy described above may preferably form a eutectic.

[0075] The first metal substrate of the hermetically coupled structure or hermetically sealed housing may further include or be made of iron, steel, or an iron-containing alloy. The first coating or covering may further include or be made of carbon.

[0076] In the case of hermetically coupled structures or hermetically sealed housings, a mixture of materials for the first coating or sheathing can further enhance the bond between the first substrate and the second substrate.

[0077] In the case of hermetically coupled structures or hermetically sealed housings, a second coating or shearing may be placed on the second substrate, at least on the side facing the first substrate, in particular, in the area of ​​laser bonding lines or a plurality of bonding points for directly and unintermediated bonding of the first metal substrate to the second substrate, before hermetically bonding the at least two substrates to each other by directly joining the at least two substrates.

[0078] The first coating or coating described above, or the second coating or coating on the second substrate, includes or may consist of a composition that can form internal compressive stresses in the second substrate, extending perpendicularly to the surface of the second substrate to a depth of at least DoL in the region near the surface of the second substrate.

[0079] In the mixing area and / or at least the area near the surface of the second substrate, the material of the second substrate and the material of the second coating or coating may be mixed or introduced.

[0080] The second substrate of the hermetically coupled structure or hermetically sealed housing further comprises, or may comprise, a material to which compressive stress can be introduced at least near the surface in a compressive stress region Ds, and the first coating or covering comprises, or may comprise, a material to which compressive stress can be introduced into the material of the second substrate, particularly by ion exchange.

[0081] In this case, the second substrate may include or be derived from glass, particularly soda-lime glass or borosilicate glass. Furthermore, the material of the second coating may include compounds suitable for releasing exchangeable ions, particularly potassium and / or lithium compounds, particularly potassium nitrate and / or lithium nitrate.

[0082] The mixture or introduced material of the second coating or covering can result in enhanced bonding between the first and second substrates.

[0083] The scope of the present invention also includes a method for manufacturing an hermetically sealed composite of at least two members, comprising the step of arranging at least one first metal substrate planarly on a second substrate, wherein the at least two substrates are arranged in contact with or overlapping each other, a contact surface is formed between the at least two substrates, the first substrate is in contact with the second substrate at the contact surface, and the second substrate includes a transparent material. The method further comprises hermetically bonding the at least two substrates to each other by directly joining them in the region of at least one contact surface to form a mixed area, the mixed area extending on one side into the first substrate and on the other side into the second substrate, and the at least two substrates are directly joined to each other by melting.

[0084] In this method, the placement of the first coating or covering on the first substrate can be performed before placing at least one first metal substrate planarly on the second substrate. The second coating or covering can also be placed on the second substrate, which is advantageously possible before at least one first metal substrate is planarly placed on the second substrate. In this regard, the names of the first coating and the second coating are not limited to the two coatings. Within the scope of this disclosure, each embodiment may include only the first coating or the second coating.

[0085] The contact surface can be understood as the surface from the planes of both substrates to be in contact that are brought close together. The symmetric contact surface refers to a portion of the contact surface where the distance between the two substrates is so small that it is no longer optically measurable. Finally, in the sense of the present invention, a good surface is defined as detailed below, where the distance between the substrates is sufficiently small or actual contact occurs between the two substrates. In this case, the contact surface is generally larger than the good surface, and the good surface is larger than the symmetric contact surface. Both the first and second substrates may each have at least one contact surface. The contact surface can also be understood as the surface on which contact occurs between the first and second substrates.

[0086] In other words, at least two substrates are placed in contact with each other, that is, for example, stacked on top of each other, where gravity presses the upper substrate, typically the first substrate, against the second substrate. In this case, the upward or downward direction is merely descriptive, because the substrates can of course be in any direction in space, and the adjacent arrangement should not go beyond the protected area. Both substrates are typically placed adjacent to each other on their larger sides.

[0087] If both substrates are formed to be absolutely flat, that is, generally without concave, raised, or curved surfaces, this is only achievable in theory, in this absolute respect, and the first and second substrates will be in complete contact with each other. Thus, both substrates will be in contact at all points of their joined surfaces. This is not generally achievable in structural reality. Rather, since substrates will have concave or raised surfaces, even if they are warped, tilted, or curved to a very small degree, perfect contact is generally achieved only in absolute exceptional cases. In such cases, the contact surfaces are formed where the substrates are in contact or where the gap between the substrates is smaller than a predetermined degree (for example, defined as a "good surface" as described below).

[0088] When substrates are arranged in direct contact with each other or overlapping, it means that at least two substrates are arranged or attached in planar contact with each other, particularly without any other material or layer present or inserted between them. For technical reasons, small amounts of gas inclusions or impurities, such as dust particles between substrate layers, may be unavoidable. This can also result from undulations that may occur in minute areas between or on the surface of the substrate layers. If the laser-generated bonding region or laser bonding line is preferably, for example, 4 to 25 μm high, the laser bonding line can ensure an airtight seal because it can bridge any gaps that may occur between the two substrates.

[0089] One or more laser bonding lines can encircle and surround a functional area with a spacing DF. Since the spacing DF encircling the functional area can be constant, the laser bonding lines are positioned around the functional area at approximately the same spacing on all sides. The spacing DF may vary depending on the application, which can be technically advantageous in some cases, for example, when multiple housings are joined in a common working stage, or when the functional area has a circular or arbitrary shape and the laser bonding lines are drawn in straight lines. Even when the hollow portion has optical properties, for example, in the form of a lens, such as a focusing lens, the laser bonding lines are formed around the hollow portion and may have different spacings relative to the hollow portion. A housing may also contain multiple hollow portions.

[0090] The method may further include a step of inspecting an airtight bond of at least two substrates by identifying a profile of the spacing between the at least two substrates. It may also include a step of identifying a first bond quality index Q1 to inspect the mechanical strength or airtightness of the bond.

[0091] The first bonding quality index Q1 can be specified as Q1 = 1 - (AG) / A, where A represents the area of ​​the contact surface and G represents the good surface. The good surface G particularly corresponds to the interfacing contact surface, and the good surface G can describe the portion of the contact surface where the gap between the substrates is less than 5 μm, preferably less than 1 μm, more preferably less than 0.5 μm, and most preferably ultimately less than 0.2 μm. The bonding quality index Q1 can be 0.8 or higher, preferably 0.9 or higher, and more preferably 0.95 or higher.

[0092] The contact surface may have a useful region N, and this useful region may be used to calculate a first bonding quality index Q1. In this case, Q1 is specified as Q1 = 1 - (NG) / N.

[0093] For this purpose, within the scope of the method, a reflected beam can be detected by irradiating the substrate laminate with an incident beam at at least one contact surface of the substrate laminate. In other words, when the substrate laminate is irradiated or illuminated, reflection from the incident beam occurs on the substrate surface. In this case, the reflected beam can be the reflected incident beam, which can be reflected at the surface to a certain extent. In the case of two substrates, where the first substrate is metal, for this purpose, three surfaces can be considered where such reflection may already occur: the upper side of the first metal substrate, the inside of the second, especially transparent, substrate, and the outside of the second substrate.

[0094] In other words, the first substrate has an outer or outer plane that faces outward and is essentially planar or flat. A narrower perimeter is formed adjacent to the outer plane and typically perpendicular to the outer plane, for example, surrounding the edge of the outer plane. In one example, the first substrate can be described as a plate or a rectangular prism, having two large-area sides (i.e., outer and inner), and four smaller sides positioned between these large-area sides, particularly perpendicular to and adjacent to both large-area sides. In this case, the four smaller sides together form a narrower perimeter, and the upper side forms the outer plane of the first substrate. In this case, the upper side typically has a larger surface area than the combined smaller sides of the narrower perimeter. This aspect with respect to size and size ratio may similarly apply to a second substrate.

[0095] In the region where both substrates are in close contact, this rate is relatively small because no reflection occurs, or no significant reflection, on the inside of both substrates. However, when the two substrates are separated, that is, when there is a gap between them, and the two substrates are not in close contact in this subregion, the incident beam is reflected at a specific rate from each of the three surfaces of the second substrate. With more substrates, for example three substrates, a correspondingly larger number of surfaces may need to be considered.

[0096] A first bonding quality index Q1 of the contact surface of the substrate laminate is calculated from the reflected beam that strikes the measuring or observation device from the substrate laminate.

[0097] For example, the first bonding quality index Q1 is determined before the first substrate and the second substrate are joined to each other.

[0098] Furthermore, the method may include a step of identifying a second bonding quality index Q2 of the contact surface of the airtightly bonded joint, where Q2 is particularly greater than Q1. More specifically, Q2 / Q1 is greater than 1.001.

[0099] The reflected beam preferably generates a pattern, particularly an interference pattern, which is generated from the superposition of the incident beam and the backscatter at at least one contact surface of the housing. The measuring or observing device can be configured such that the interference pattern can be identified or detected and from which the distance between the two substrates can be calculated or derived.

[0100] The pattern from the reflected beam may have an arrangement in which the pattern extends around one or more defect locations. In other words, the pattern may be particularly arranged around locations where at least two substrates are not in contact with each other. In this case, it is particularly easy to determine the locations where at least two substrates are not in contact with each other using a measuring or observation device. In this case, the defect location may be characterized in that the distance between the substrates at the defect location is greater than 5 μm, preferably greater than 2 μm, more preferably greater than 1 μm, greater than 0.5 μm, or even more preferably greater than 0.2 μm. In other words, the defect location is particularly preferably located where the criterion for a good surface G is not met. In this case, the contact surface between at least two substrates can be completely separated into a good surface G and a defect location F.

[0101] The allocation of a suitable region can be identified, for example, using interference patterns in the form of Newton's rings. For example, when an incident beam in the visible light range with λ=500nm is used, each Newton's ring will show a height difference of λ / 2=250nm. For example, if the occurrence of three Newton's rings is set as a boundary criterion to confirm whether a good region exists, then in the optical image analysis of the reflected beam from the housing, a region where the distance between substrates is 3×λ / 2=750nm or less can be defined as a good region.

[0102] The method may further include a step of inducing a plasma discharge in a mixing area using a laser in preparation for the laser bonding process.

[0103] The scope of the present invention also includes housings manufactured by the method described above.

[0104] The bonded structures or sealed housings according to the present invention may be used in contact with or in close contact with biomaterials, particularly plant, human, or animal cells. For example, the housing may bond with the biomaterial. The airtight bonded structures may also be constructed to be free from toxic and / or allergenic substances and therefore do not release them. Accordingly, the airtight bonded structures or housings are preferably prepared and constructed so as not to adversely affect biomaterials. Advantageously, the structures according to the present invention have a reduced allergenic potential when in contact with human or animal bodies or plant materials, for example, when introduced into and / or applied to them.

[0105] The structures according to the present invention have exemplary applications as medical implants, particularly as medical internal sensors, and / or as wearable devices that are applied to or placed on or within the body of a human or animal or even plant material in an operational state. Typical wearable devices include fitness trackers and smartwatches, and electronic devices that can measure or monitor physical conditions or physiological parameters in particular. Of course, further applications, such as wearable devices that can influence physiological parameters, or other applications are possible and are also included in the present invention.

[0106] The present invention will be described in more detail below with reference to examples and drawings, where the same and similar elements are sometimes indicated by the same symbols, and features of different embodiments can be combined with each other. [Brief explanation of the drawing]

[0107] [Figure 1] Figure 1 shows a first embodiment of the hermetically sealed coupling. [Figure 2] Figure 2 shows a top view of an airtight coupling, which is configured here as a housing with a functional area. [Figure 3] Figure 3 shows a cross-sectional view of the side of an airtight coupling having a functional area as a hollow section. [Figure 4] Figure 4 shows a side cross-sectional view of the details of the joint region in one embodiment. [Figure 4a] Figure 4a shows a side cross-sectional view of the details of the bonding region in a further embodiment. [Figure 5] Figure 5 shows a side cross-sectional view of further details of the joint area. [Figure 6] Figure 6 shows a cross-sectional view of the side of an airtight joint having a joint region. [Figure 7] Figure 7 shows a cross-sectional view of the side of a substrate laminate with spacers. [Figure 8] Figure 8 shows a cross-sectional view of the side of an airtight coupling with a spacer. [Figure 9] Figure 9 shows a digital photograph of the joined hermetically sealed junction. [Figure 10] Figure 10 shows a cross-sectional view of the side of a hermetically sealed coupling with multiple laser spots. [Figure 11] Figure 11 shows a side cross-sectional view of a hermetically sealed coupling with multiple laser spots and spacers. [Figure 12] Figure 12 shows the laser configuration for generating a laser junction. [Figure 13] Figure 13 shows a micrograph of the bonded substrate laminate. [Figure 14] Figure 14 shows a micrograph of the bonded substrate laminate. [Figure 15] Figure 15 shows a micrograph of the bonded substrate laminate. [Figure 16] Figure 16 shows a micrograph of the bonded substrate laminate. [Figure 17] Figure 17 shows a micrograph of the bonded substrate laminate. [Figure 18] Figure 18 shows a photograph of a sample used to evaluate the achievable airtightness. [Figure 19] Figure 19 shows a schematic explanation of how to measure the quality index. [Figure 20] Figure 20 shows a flowchart for measuring the quality coefficient. [Figure 21] Figure 21 shows a flowchart illustrating the individual steps involved in identifying the quality coefficient. [Examples]

[0108] Detailed description of the invention Referring to Figure 1, a first embodiment of the hermetic coupling 1 according to the present invention is shown, in which a first metal substrate 3 is placed beneath a dielectric 4. The dielectric 4 or the second substrate 4 is placed on the metal substrate 3 such that its inner surface 11 is on the inner surface 12 of the first substrate 3. Thus, both substrates 3 and 4 are in contact with each other. Depending on the specific surface condition (see, for example, Figure 6), the contact surface can constitute the entire inner surfaces 11 and 12 of each, and / or the substrates 3 and 4 can be in planar contact with each other. The substrates 3 and 4 can also be in contact only partially or regionally. When the substrates 3 and 4 are stacked on top of each other, unless a gap is maintained using, for example, a spacer 35, gravity will already cause a minimal degree of contact between both substrates 3 and 4 (see, for example, Figure 7).

[0109] In the example in Figure 1, three laser bonding lines 6a, 6b, 6c or bonding points 6a, 6b, 6c are introduced to bond both substrates 3 and 4 to each other. The bonding points / bonding lines 6a, 6b, 6c are set along the sides of substrates 3 and 4, and the bonding points are driven in from above (relative to the drawing) using a laser (see Figure 12). At this time, the focal plane is set in the region of the inner surfaces 11 and 12. Advantageously, the focal plane is already within the metal substrate 3, and is shifted, for example, 10-20 μm within the metal substrate 3, i.e., 10-20 μm below the inner surface 12 of the metal substrate 3. This can result in the laser beams 6a, 6b, 6c achieving a desired width of preferably 4 μm ± 1 μm, more preferably 4 μm ± 2 μm, and even more preferably 4 μm ± 3 μm on the contact surface 15. This width can also be achieved by corresponding beam shaping in front of the objective lens.

[0110] As shown in Figure 1, when both substrates 3 and 4 are adjacent to each other without mediation on their inner surfaces 11 and 12, that is, when they are in planar contact, the contact surface 15 is the same as both inner surfaces 11 and 12, as shown in Figure 1.

[0111] In Figure 1, three laser junction lines 6a, 6b, and 6c are already shown, and they are intertwined with each other, so that the laser junction lines 6a, 6b, and 6c also interact vertically. In this process, various effects can be induced or achieved depending on the target setting. For example, if the preceding laser junction line 6a has already cooled, the setting of the laser junction line is not performed while it is warm (warm-in-warm), but rather the continuous laser junction line 6b can be applied first. In this case, the cooling process of the laser junction line is carried out very rapidly because a very small total amount of theoretical energy is applied and the metallic material of the metal substrate 3 has excellent thermal conductivity for the majority. At the first laser junction line 6a, the materials of both substrates 3 and 4 are already mixed with each other, and any resulting undulations and gaps (voids 26) are bridged by melting. Depending on the quality of the surface, for example, in the case of large voids 26 of up to 5 μm in the region of the contact surface 15 to be joined, the joining may not be sufficiently formed at the first laser junction line 6a. However, since the area of ​​the contact surface 15 to be joined is closed by the introduction of the first laser joining line 6a, and the void 26, if present beforehand, is closed, and the materials have already at least "begun to mix", the introduction of the second laser joining line 6b, and optionally the third laser joining line 6c, can achieve optimal further mixing of the materials of both substrates 3 and 4.

[0112] Figure 2 shows a top view of the hermetically sealed coupling 1, where the laser bonding lines 6a, 6b, and 6c encircle the functional region 2. While typically three laser bonding lines 6a, 6b, and 6c are shown in the drawing for simplicity, fewer or more laser bonding lines 6, 6a, 6b, and 6c may be used. The laser bonding lines 6a, 6b, and 6c completely encircle the functional region 2, hermetically sealing it. The molten region around the laser bonding lines has a width w. Within the functional region 2, for example, a housing object 5, such as an electronic circuit, may be placed (see Figure 3).

[0113] Figure 3 shows an airtight housing 9 having an airtight coupling 1, where the hollow portion 2 is airtightly sealed. Laser bonding lines 6a, 6b, and 6c are introduced around the hollow portion 2, and the second base material 4 is completely closed and airtightly bonded to the first base material 3, thereby producing an inseparable coupling. The same parts are denoted by the same reference numerals as in Figure 1.

[0114] Figure 4 is a detailed view of the laser bonding point of the laser bonding line 6 or bonding point 6, and has meaningful details that can illustrate various further configurations of the present invention. The present invention addresses the consistent further development and optimization of various bonding processes between substrates 3 and 4, against the background of known and existing conventional bonding methods within the applicant's company. In this, the focus of the present invention is on bonding or joining two different substrates 3 and 4, in particular a metal substrate 3 and a dielectric 4, i.e., glass, glass ceramic, sapphire, etc. In this regard, the very different CTE values ​​of the different materials, and above all different brittleness, should be taken into consideration. For example, during the bonding of materials, undesirable cracks, holes, or pores may occur in the dielectric 4. These are partly based on thermal expansion at the laser bonding line 6, which occurs when heat is introduced into the dielectric 4 at an ultrafast rate by the laser. This can significantly harm the second substrate 4, causing it to easily detach from the first substrate 3 and break, that is, causing the material of the second substrate 4 to break "near the bonding line". In addition to mechanical properties, such cracks can also impair optical properties and may even jeopardize the airtightness of the manufactured product. Therefore, these cracks 67 and pores 68 are particularly advantageous to avoid.

[0115] In Figure 4, the laser junction point 6, shown in the side cross-sectional view, has a mixing region 62 that extends within the metal substrate 3 and the dielectric 4, bridging the roughly drawn void 26. For example, to ensure sufficient generation of the laser junction point 6, the void 26 in the region of the laser junction point 6 should be 5 μm or less in size. For this purpose, it is important that the plasma is ignited at the laser junction point 6 by laser irradiation, for example, as this may not be able to bridge larger spatial distances. Plasma ignition is further predicated on the application of a significant point-like amount of heat to the laser junction point 6 using the laser. In the example in Figure 4, a resolidified region 64 is shown within the dielectric 4 (second substrate), extending far into the second substrate 4. This indicates an unfavorable case in which numerous cracks 67 and pores 68 are produced. In this case, the edge 66 of the resolidified region is visible in the final product as the edge of the material change area within the second substrate 4, for example, under a microscope.

[0116] In the example in Figure 4, the resolidification area is not shown below the mixing area 62, i.e., within the first substrate 3, because the effect of the dielectric 4 should be explained first (however, see Figure 5 for this). In the mixing area 62, the material of the first substrate 3 is mixed with the material of the second substrate 4 when both simultaneously transition to a molten state. In the simple case, since the materials of both substrates 3 and 4 are sufficiently compatible with each other, the mixing in the mixing area 64 already creates sufficient adhesion of the second substrate 4 on the first substrate 3 (and vice versa), and consequently, sufficient holding force.

[0117] The first base material 3 may include, as an inclusive list, copper, silver, gold, iron, aluminum, titanium, or even alloys such as steel.

[0118] Any possible gaps 26 are less than 0.5 μm within the (later) laser bonding region 6. If the gap at the contact surface 15 is 0.5 μm or less, for example, the contact surface 15 is recorded as a good surface G.

[0119] In the case of a single laser junction line 6, 6a, 6b, 6c or connection point, the width W of the laser junction line is equal to the beam width 2W at the contact surface (15) generated by the laser generator (see Figure 12). レーザー This corresponds to approximately the same thing. In the case of N parallel laser junction lines 6, 6a, 6b, 6c, the width W of the laser junction line achieved is usually the beam width 2W at the contact surface (15). レーザー It is less than or equal to N times, because, for example, an overlap of the laser action area is required. m The height of the mixed area 62 is H r This describes the height of the recoagulation zone 64. Ideally, H m is H r That concludes the explanation. However, in the example in Figure 4, this is clearly not applicable in order to clearly illustrate the relationship.

[0120] Figure 4a shows a side cross-sectional view of the details of a joining region in a further embodiment, where, in particular, the first coating or coating 70 may be placed on the first metal substrate 3, on the side facing the second substrate 4, within the region of laser joining lines 6, 6a, 6b, 6c, 6d or a plurality of joining points for directly and unintermediated joining of the first metal substrate to the second substrate.

[0121] This coating or covering 70 can be applied by various methods, including, for example, physical and / or chemical deposition methods, such as physical vapor deposition (PVD), chemical vapor deposition, or even ALD (atomic layer deposition), and can also be applied advantageously in a locally structured manner by alternative printing techniques, such as screen printing or 3D printing. Further forms of application may be carried out by suspending the substrate on a liquid metal.

[0122] The joining method described herein allows the material of the first substrate 3 and the material of the first coating to be mixed in the mixing area 62 and / or in a region near at least one surface of the first substrate 3.

[0123] In this regard, advantageously, the morphology of the tissue, particularly in the mixed area, can be altered by the first coating or covering material.

[0124] In certain embodiments, an alloy can be formed in the mixing area, at least geographically, comprising at least a first metal substrate 3 and a first coating or plating material.

[0125] Particularly advantageous is that this alloy can form a eutectic if a coating or covering is provided in a reasonable amount for the bonding process. This amount can be determined by the selection of the thickness D1 of the first covering or coating, which can be, for example, 0.1 to 5 μm.

[0126] Preferably, the first metal substrate 3 may contain or be derived from iron, steel, or an iron-containing alloy, and the first coating may contain or be made of carbon. When this material is selected, locally high carbon-content regions may be provided in or on the mixed area 62.

[0127] Without limiting generality and without being limited by the examples disclosed above, a mixed material of the first coating or coating can result in enhanced bonding between the first substrate and the second substrate.

[0128] In this regard, and within the scope of this disclosure, the increase in force required to separate the joined substrates 3 and 4 from one another after joining is referred to as reinforcement. These forces can be introduced perpendicular to the respective surfaces of the substrates 3 and 4 that are in contact with each other, thereby specifying and describing a separation strength, or they can be introduced laterally to these surfaces, in which case the strength can be further specified and described in relation to a proportional shear force.

[0129] The enhancements relating to the first and second coatings disclosed herein are understood to be an increase in the aforementioned force in a joint made using the first and / or second coatings compared to a joint made without the first and / or second coatings.

[0130] Alternatively or additionally, prior to hermetically bonding at least two substrates 3, 4 to each other by directly joining the two substrates 3, 4, a second coating or coating 71 may be placed on the second substrate 4, at least on the side facing the first substrate 3, in the area of ​​laser bonding lines 6, 6a, 6b, 6c, 6d or a plurality of bonding points for directly and unintermediated bonding of the first metal substrate 3 to the second substrate 4.

[0131] The coating or covering 71 on the second substrate 4 includes, or may consist of, a composition capable of forming compressive stress in a compressive stress region Ds inside the second substrate 4, which extends perpendicularly to the surface of the second substrate 4 to a depth of at least DoL in the vicinity of the surface of the second substrate 4.

[0132] In a preferred embodiment, in the mixing region 62 and / or in at least the near-surface region of the second substrate 4, the material of the second substrate 4 and the material of the second coating or coating 71 can be mixed or introduced, thereby forming a corresponding local compressive stress region. In this case, the second substrate 4 includes or comprises a material capable of introducing near-surface compressive stress in the compressive stress region Ds, and the first coating or coating includes or comprises a material capable of introducing compressive stress to the material of the second substrate 4, particularly by ion exchange. Such glass and / or glass articles, as well as materials for introducing compressive stress within compressive stress areas Ds, are, for example, U.S. Patent Publication No. 2018 / 0057401 (US2018 / 0057401 A1), U.S. Patent Publication No. 2018 / 0029932 (US2018 / 0029932 A1), U.S. Patent Publication No. 2017 / 0166478 (US2017 / 0166478 A1), U.S. Patent No. 9908811 (US9,908,811 B2), U.S. Patent Publication No. 2016 / 0122240 (US2016 / 0122240 A1), U.S. Patent Publication No. 2016 / 0122239 (US2016 / 0122239 A1), U.S. Patent Application Publication No. 2017 / 0295657 (US2017 / 0295657 A1), U.S. Patent No. 8312739 (US8312739 B2), U.S. Patent No. 9359251 (US9,359,251 B2), U.S. Patent No. 9718727 (US9,718,727 B2), U.S. Patent Application Publication No. 2012 / 0052271 (US2012 / 0052271 A1), U.S. Patent Application Publication No. 2015 / 0030840 (US2015 / 0030840 A1), or further German Patent No. 102010009584 (DE10 2010 009 584 This is described in patent no. B4) and in the specification of Chinese Patent Application Publication No. 102690059 (CN102690059 A).

[0133] For example, the material of the second substrate generally includes or can be made from glass, particularly soda-lime glass or borosilicate glass, and the material of the second coating or coating 71 may include compounds suitable for releasing exchangeable ions, particularly potassium and / or lithium compounds, particularly potassium nitrate and / or lithium nitrate.

[0134] In this regard, the thickness of the second coating or covering 71 is preferably 0.1 to 5 μm, and in this regard, the material mixed or introduced into the second coating or covering 71 can result in strengthening of the bond between the first substrate and the second substrate.

[0135] Figure 5 shows a further embodiment of a detailed view of the laser bonding line 6, where again, the same reference numerals used in the other drawings are assigned to the same attributes. In this embodiment, the laser bonding line 6 also has a resolidation area 69 in the first substrate 3, which extends below the mixing area 62. The mixing area 62 is thought to transition directly into the resolidation areas 64 and 69, respectively. The mixing area 62 is characterized by the presence of a material mixture therein, that is, the mixing area 62 contains the material of the first substrate 3 and the material of the second substrate 4. However, it is also possible, and has already been observed and used, that the materials of substrates 3 and 4 may be introduced into the other substrate, for example, in the form of fragments 4a or dendrites 4b. The metallic material of the first substrate 3 can also be inserted into the second substrate 4, for example, in the form of droplets 3a. Such droplets 3a may be "inserted" into the second substrate 4 by several micrometers.

[0136] The dendrite 4b shown in Figure 5 is particularly interesting because, in such an embodiment, significantly improved adhesion between the two overlapping substrates 3 and 4 can be achieved. In this case, the dendrite 4b may function as an anchor or nail if it interlocks with the material of the other substrate or is driven in at an angle to the perpendicular. In this case, the materials of the two different types of substrates 3 and 4 have little affinity for each other, and even in a molten state, no bonding action is induced between them. In this case, such dendrite 4b or interlocking within the mixing area 62 can be the best option for adjusting the adhesion or holding force between the two substrates 3 and 4.

[0137] Referring to Figure 6, a bonded body 1 having a laser junction line 6 on one side is shown. In this example, the void 26 is just small enough to introduce the laser junction line 6 in the contact region 15 of the laser junction line 6, but is larger in other regions of the inner 11, 12 due to surface irregularities 31, 32. In this case, both the depressions 31 and the ridges 32 can be unfavorable for introducing the laser junction line 6. In principle, it was found to be advantageous when the surfaces 11, 12 are flat, for example, with an average roughness value of 0.1 μm or better. This is surprising at first because flat surfaces, in particular, reflect well, and therefore it is generally difficult to induce energy deposition within a bonded body using a laser.

[0138] Figure 7 shows an embodiment of a substrate laminate 1 that has not yet been bonded, where a spacer 35 is used between substrates 3 and 4 to adjust the defined spacing between them. Within the scope of the present invention, it has been shown that gaps 26 are permissible as long as the spacing between substrates 3 and 4 within the area of ​​the contact region 15 to be bonded is sufficiently small, for example, less than 5 μm, better less than 2 μm, and preferably less than 0.5 μm. In the example of Figure 7, it is also shown that by using the spacer 35, even larger undulations of substrates 3 and 4 can be easily compensated for, because the spacing between the substrates no longer has to be made by full contact of the inner surfaces 11 and 12. Furthermore, the gaps 26 can play an additional role by creating a avoidance area 40 therein, into which the material of substrates 3 and 4 (in which the material of substrate 4 is particularly important) can penetrate when it melts. In this way, cracks and holes in the second substrate 4 can be reduced or even completely avoided.

[0139] Figure 8 shows an embodiment of Figure 7, where the laser spot 6 is introduced on the left side of the contact area 15. Now, the material of the second substrate 4 is in the avoidance area 40. In the mixing area 62, the material of the first substrate 3 is mixed with the material of the spacer 35 and the material of the second substrate 4. The mixing area 62 extends both within the first substrate 3 and the second substrate 4. In this regard, when appropriately selecting the material of the spacer 35, if a material that has some affinity for both the material of the first substrate 3 and the material of the second substrate 4 is selected, the adhesion characteristics can even be further enhanced.

[0140] The avoidance area 40 can also be provided as a recess in the substrates 3 and 4 (not shown). The avoidance area 40 advantageously extends along the planned laser bonding area, allowing certain material to escape into the avoidance area 40, thereby absorbing or preventing the generation of pressure peaks, and consequently reducing the occurrence of cracks and holes 67 and 68.

[0141] Figure 9 is a photographic view of the airtight coupling 1 corresponding to Figure 6. Unevennesses, such as scratches 31 or burrs 32, that could potentially impair the airtightness of the coupling 1 have been eliminated.

[0142] Further aspects of the present invention will be described in more detail with reference to Figure 10. A series of consecutive laser spots for continuously generating a laser junction line 6 are shown, where spots 1, 2, 3, 4, and 5 are struck in succession. The spots are struck while warm, and partially overlap because the beam focal width w is greater than the distance d between the target points or laser spots. This can achieve further improvement in mixing in the mixing area 62, and consequently, improved adhesion.

[0143] A similar effect is achieved when the laser spots shown in Figure 10 are not assumed to belong to one specific laser junction line 6, but rather to five different laser junction lines 6, 6a, 6b, 6c, and 6d, and these are aligned and driven into the material. In both cases, the airtightness and / or holding power of the substrates 3 and 4 can be increased.

[0144] Figure 11 shows a further embodiment, in which multiple laser spots 6 are similarly struck on the contact surface 15, with both substrates 3 and 4 spaced apart from each other by spacers 35. If one or more spacers 35 are configured to be sufficiently small, i.e., less than 5 μm thick (e.g., as a film, metal foil, or deposited, sputtered, or lithographic glass layer), the remaining gaps 26 can be directly bridged by the laser. In the case of subsequent laser spots that partially overlap with preceding laser spots, the gaps are no longer an obstacle because they have already been partially bridged or closed. If the spacing needs to be adjusted to be larger, the spacers 35 can serve as a "starting point" for the laser bonding process, which is then fused (as shown in Figure 6). Further laser spots can partially overlap with the first "starting point" and thus strike even larger substrate spacings. This allows for bridging of substrate spacings larger than 5 μm, for example, larger than 10 μm, or even larger than 20 μm. In this case, the laser spot height can be adjusted to around 50 μm, for example, up to 100 μm. For example, the spacing d from one laser spot to the next can be adjusted to d < 10 μm, preferably d < 6 μm, and more preferably d < 4 μm.

[0145] In the example shown in Figure 11, the interaction region 62 is held further away from the second substrate 4 thanks to the spacer 35, and therefore the mixing region 62 extends only slightly into the second substrate 4. The penetration of the mixing region 62 can be adjusted, for example, to just 1 μm ± 0.8 μm. In this case, the re-solidification region 64 within the second substrate 4 may disappear completely or largely, and nevertheless, the mixing region 62 extends deep enough into the second substrate 4 to ensure bonding.

[0146] Figure 12 shows a schematic of a laser generator 80 for generating a laser spot 6 in the hermetically sealed coupling 1 on the left. In this optional embodiment, the processing head 801 includes a 45° tilted mirror 802 and a writing objective lens 803. Here, the processing head is moved in the x-direction 804 parallel to the laser beam of the laser source 806. Relative to this, the structure 1 or substrate laminate is moved perpendicularly to it in the y-direction 805 on a separate processing table. In addition, on the right side of Figure 12, a schematic of the thermal output intensity profile 82 is shown for the case where three laser junction lines 6a, 6b, and 6c are introduced into the hermetically sealed coupling 1 while it is warm. Thus, the lateral laser junction lines 6a and 6c can result in further enhanced mixing at the intermediate junction line 6b.

[0147] Figure 13 shows a micrograph of the manufactured hermetically sealed bond 1, in which aluminum is used as the first substrate 3 and sapphire is used as the second substrate 4. It has already been successfully demonstrated that only a mixing zone 62 is formed within the second substrate 4, and that cracks or pores in the second substrate 4 can be significantly prevented. Dendrites 4b are clearly visible, where the sapphire 4 penetrates or mixes into the metal of the first substrate 3 and into the resolidification zone 69. This significantly increases the retention force of the sapphire 4 on the aluminum 3. Sapphire particles 4a could also be identified in the resolidification zone 69 of the first substrate 3.

[0148] Figure 14 shows further micrographs, where the conjugate shown in Figure 13 is magnified and again depicted in pseudocolor. The occurrence of dendrites 4b may be described as entirely unexpected and groundbreaking. For this reason, this welcome new development within the applicant's company should be presented as completely and in as many different ways as possible. However, overall, the quality of the manufactured conjugate and the significant reduction in the re-solidified area 64 in the second substrate 4 are strong indicators that the present invention can pave the way for a wide range of products.

[0149] Figure 15 shows further micrographs, where steel is selected as the first substrate 3 and sapphire is selected as the second substrate. In this example, a distinct resolidified area 64 is visible above the mixed area 62 in the sapphire 4, and there are also distinct cracks 67. In this example, the sapphire has not penetrated into the steel. By adjusting the beam, it was possible to create an interlocking structure 37 on the first substrate 3 using a laser spot 6, generating a rough, tooth-like surface that also enhances the adhesion of the airtight bond 1.

[0150] Figure 16 shows further micrographs, where titanium is selected as the first substrate 3 and sapphire is selected as the second substrate 4. In this example as well, no significant resolidification zones 64 are found in the second substrate 4, and therefore, it has already been achieved that no stress or cracks 67 are introduced into the second substrate 4. The material of the first substrate 3 is introduced remarkably far into the second substrate in the mixing zone 62, where it forms a comb-like structure, which also results in the exceptional interlocking of the hermetic bond 1.

[0151] Figure 17 shows further micrographs, where copper is selected as the first substrate 3 and sapphire as the second substrate. In this example as well, the re-solidified area 64 in the second substrate 4 was successfully eliminated. In this example, droplets 3a penetrating several micrometers into the second substrate 4 are identifiable, as are dendrites 4b penetrating the first substrate and ablations 4a of the second substrate 4. Therefore, in this example as well, adhesion has clearly been improved.

[0152] Within the scope of the present invention, a series of measurements were also performed to determine airtightness. In this process, the leak rate (mbar × liters / second) was determined for each of the 61 samples 1a. Figure 18 shows an exemplary copper sample 1a for determining the leak rate, in which the sapphire disk 4 is laser-bonded to the metal structural member 3.

[0153] The leak rate was determined using spraying techniques. For example, under standard or low-pressure (vacuum) conditions, helium gas is suitable for spraying the sample with the gas to measure the possible diffusion into the interior of sample 1. A pressure difference of 1 Bar between the outside and inside of sample 1a was found to be advantageous. Various metal samples 1a were measured, in particular the hermetic coupling 1, which was realized by placing a sapphire disk 4 on a metal structural member 3 and laser bonding it. Aluminum, titanium, steel, and copper samples were measured as the metal structural member 3, and they were each laser bonded to the sapphire substrate 4. The lower limit of measurement for the apparatus used to investigate airtightness was a leak rate of 1 × 10⁻⁶ -9 The reading was mbar × l / sec. When using the spray test, complete airtightness was achieved, and the leak rate was 1 × 10⁻⁶. -7 mbar × l / sec or less, preferably 1 × 10⁻¹⁰ -8 mbar × l / sec or less, more preferably 1 × 10⁻¹⁰ -9 It is expected that a flow rate of less than × l / second will be achieved. In the following table, twelve sample 1a are shown exemplarily, where the metal structural member 3 used to manufacture the airtight bond 1 is (essentially) made of aluminum in the case of the three samples indicated by "Al", (essentially) made of titanium in the case of the sample indicated by "Ti", (essentially) made of iron in the case of the sample indicated by "St", and (essentially) made of copper in the case of the sample indicated by "Cu".

[0154] [Table 1]

[0155] Therefore, all samples 1a reproduced here are characterized as being airtight in the sense of the definition described above. In particular, the samples made of aluminum and steel were measured using the instrument at the lower limit of the measurement range of 1 × 10⁻⁶. -9 It was noteworthy that the leak rate was so small that it could no longer be analyzed using ×l / sec. Therefore, the airtightness actually achieved was better than the lower limit of the measurement range, and thus 1 × 10-9 It is less than × l / second.

[0156] In some cases, the quality of the manufactured hermetically sealed bond 1 should be inspectable. For this purpose, it may be proposed to create spacing profiles in each region of the laser bonding before its introduction. Figure 19 shows a detailed view of the substrate laminate 9 for understanding, where the defective region 17, the contact region 18, and the good region 19 are visible. The double arrow 21 indicates the location of the maximum height of the defective location 17.

[0157] The incident beam 22 is directed towards the substrate laminate 9, where, in the region of the defect location 17, the incident beam is reflected both inside the first substrate 3 11 and inside the second substrate 4 12. The reflected beams 24 and 24a can be detected by the detector 30. In this case, the difference in the paths between the reflected beam 24 and the reflected beam 24a leads to the interference patterns generated by both reflected beams. In the case of a transparent substrate (4), the Fresnel effect, i.e., reflection, is important. In the case of glass without an anti-reflective coating, this reflection may be, for example, about 4% per interface. In the case of a metal substrate (3), the reflection is caused by the polished surface. In this case, the incident beam 22 contains monochromatic light. Therefore, the interference pattern, especially Newton's rings, can be read, and from this a measure of the distance between the substrates can be obtained.

[0158] Figure 20 shows the steps of a method for manufacturing or inspecting an airtight bond of a substrate laminate. In the first step 100, the first substrate is placed planarly on the second substrate. In the second step 110, the reflected beam generated by irradiating the substrate laminate with an incident beam 22 at at least one contact surface of the substrate laminate 9 is detected to determine the height profile of the gap inside the substrate laminate 9. In step 120, a bond quality index Q1 is determined from the height profile. In determination step 130, if the bond quality index Q1 determined in step 120 is within a predetermined tolerance threshold Q 1閾値If it is greater than Q1, it is determined that the substrate laminate may be emitted for further processing, specifically laser bonding by the laser bonding line 6. However, if Q1 is greater than the target or desired Q 1閾値 If the size is smaller than that, in step 135 the substrate laminates 9 are, for example, reprocessed, that is, separated from each other, and, if applicable, washed again or recycled by other means.

[0159] Furthermore, in step 140, the substrate laminate 1 is laser-bonded to form one or more housings. Subsequently, in step 150, a second height profile of the gaps inside the bonded substrate laminate 1 is identified, and from there, Q2 is calculated in step 160. In step 170, Q2 is set to a predetermined threshold Q 2閾値 Determine whether it is greater than or equal to Q. For example, Q 2閾値 is Q 1閾値 The following applies. Advantageously, in step 170, it is also determined or investigated whether Q2 is greater than or equal to Q1 in any case. If both conditions are met, in step 180, further processing of the joined single or multiple housings 1 can be performed, for example, by separating the multiple housings 1 from the wafer stack 9 with separation lines 8. Conversely, if one or both of the predetermined conditions are not met in step 170, a selective further processing of the substrate stack 9 may be introduced in step 175, in which case, for example, defect areas F, 17 may be recorded, or the wafer stack 9 may be put up for recycling.

[0160] Figure 21 illustrates several steps that may be performed to calculate the coupling quality indices Q1 and / or Q2. In step 121, image data from the detector 30 is first acquired, for example, using a workstation prepared for this purpose. The image data acquired in step 121 is converted into a grayscale pattern in step 122, or the red channel is extracted from the image. This can be done, for example, using image processing functions performed on the same computer on which the image data is acquired in step 121. In step 123, the physical edges of the substrate layers 3, 4, and 9 are identified in the recorded image from the detector 30, for example, in the form of edge detection. In step 124, perspective correction or deskew can be performed if necessary. In step 125, contrast improvement can be performed, for example, in the areas of the substrate layers. In this case, for example, the darkest gray background value can be simply subtracted to generate a grayscale image from a black and white image. Finally, in step 126, the height profile is calculated from the image data acquired by the detector 30, for example, using confirmed Newton's rings. Subsequently, in step 127, the region where the critical height or profile has been confirmed can be recorded and integrated. This is particularly relevant to the region confirmed as defect region F, 17. Finally, in step 128, the respective Q coefficients Q1 or Q2 are calculated from the improved or corrected image data as described above.

[0161] Accordingly, the description of this application has been able to fully and clearly demonstrate a method for joining two different substrates, particularly metal substrates, to a dielectric, such as a glass substrate or crystal, in contact with each other using a laser bonding method. Corresponding hermetically bonded structures have also been shown in detail and explained in an understandable manner. The description of this application includes numerous explanations that, in some cases, contradict or unexpectedly reveal "prior" knowledge. For this reason, the results have been further supported by microscopic images, demonstrating that the presented invention has already translated into actual results.

[0162] It will be apparent to those skilled in the art that the above embodiments are to be understood as illustrative and that the present invention is not limited thereto and can be modified in various ways without departing from the scope of protection of the claims. Furthermore, it will be apparent that the above features individually define essential elements of the present invention, regardless of whether they are disclosed in the specification, claims, drawings or elsewhere, even if they are described together with other features. Since the same reference numerals in all drawings indicate the same features, descriptions of features not mentioned in one drawing or, in any case, in all drawings can be transferred to these drawings with respect to features not described in the specification. [Explanation of Symbols]

[0163] 1. Bonded body or substrate laminate 1a Sample 2. Functional area or hollow part 2a, 2b Hollow portion in the region of defect location 17 3. First base material (metal-containing) 3a Droplet 4. Second substrate (dielectric, e.g., glass) 4a Ablation or droplet of the second substrate 4b Second substrate dendrites 5. Items to be stored 6, 6a, 6b, 6c: Joint area or laser coupling line 8 Separation line 9 Housing 11 Contact surface or inside of the first substrate 12 Contact surface or inside of the second substrate 15 Contact surface 17. Defect region or defect location F 18 Mutual contact surface B 19 Good side G 20 Beam sources 21 Maximum distance between two substrates 22 Incident beam 24, 24a Reflected beam 26 Possible gaps 30 detectors 31 Dent 32 Prominence 35 Spacers 37. Interlocking structure 40 Avoidance Zone 62. Melting area or mixing area 64 Resolidification zone 66 Edge of the recoagulation area 67 Crack 68 pores 69 Resolidification zone 70 First coating or coating 71 Second coating or coating 80 Laser Generators 82 Strength Profile 100 Deployment Stages 110. Identifying the height profile 120 Calculation stage of the first combined quality index Q1 121 Data Preparation 122 Conversion Stages 123 Identification Stage 124 Correction Stages 125 Contrast Improvement 126 Calculation stage for height profile 127 Recording stage 128 Calculation stage for the Q coefficient Q1 or Q2 Evaluation stage for 130 Q1 135 Return Stage 140 Further processing steps, especially laser bonding 150 Identification of the second height profile Calculation stage for 160 Q2 Evaluation stage for Q2 170 175 Recording stage in case of defects 180 Final processing, especially individualization of structure 1 or housing 9 801 Laser generator processing head 802 Polarizing Mirror 803 Laser Objective Lens 804 Direction of movement of the processing head 805 Direction of movement of the substrate 806 Laser beam of laser beam source d Distance between two laser junction lines or two connection points N Protected area W Laser bonding line width 6 D1 First coating or coating thickness 70 D2 Second coating or coating thickness 71 Ds compressive stress region Depth of the compressive stress region (DoL)

Claims

1. A hermetically sealed structure (1), - First metal substrate (3), - A second substrate (4) which is formed to be transparent at least regionally and / or at least partially to at least one wavelength range, Here, the first substrate is positioned adjacent to the contact surface (12) of the second substrate at its contact surface (11). - At least one laser bonding line (6, 6a, 6b, 6c, 6d) or a plurality of bonding points for directly and without mediation bonding the first metal substrate to the second substrate on or within the contact surfaces (11, 12, 15), Here, the laser bonding line or the plurality of bonding points extend into the first substrate on one side and into the second substrate on the other side, and at least two substrates are directly joined to each other by melting. Includes, A mixing area (62) exists at the laser bonding line (6, 6a, 6b, 6c, 6d) or at the plurality of bonding points, where the material of the second substrate (4) and the material of the first substrate (3) are mixed. In the mixing area (62), the metal material of the first metal substrate (3) is contained within the second substrate (4), and / or in the mixing area (62), the material of the second substrate (4) is contained within the first substrate (3), and The at least one laser bonding line (6, 6a, 6b, 6c, 6d) or multiple bonding points further have re-solidification regions (64, 69), the re-solidification regions have a thickness measured in a direction perpendicular to the contact surfaces (11, 12, 15), and The thickness of the re-solidified area is 20 μm or less. The aforementioned airtightly connected structure (1).

2. The mixing area (62) has a thickness measured in a direction perpendicular to the contact surfaces (11, 12, 15), and The mixing area has a thickness of at least 1 μm, and / or The mixing area (62) extends to the second substrate by 1 μm or more. The hermetically sealed structure (1) according to claim 1.

3. The aforementioned mixing area (62) has width, and The width of the mixing area is greater than the thickness of the mixing area in the second substrate (4), and / or The width of the mixing area (62) is 50% or more greater than the thickness of the mixing area. The width of the mixing area (62) is measured on the contact surface (15) between the first substrate and the second substrate (3, 4), in a direction parallel to the contact surface and perpendicular to the laser bonding lines (6, 6a, 6b, 6c, 6d). The airtightly coupled structure (1) according to claim 1 or 2.

4. The re-solidified areas (64, 69) extend to a depth of 20 μm or less in the second substrate. An airtightly coupled structure (1) according to any one of claims 1 to 3.

5. The re-solidification zones (64, 69) extend along the laser bonding lines (6, 6a, 6b, 6c, 6d) and / or The re-solidified areas (64, 69) are located on the contact surfaces (11, 12, 15) between the first substrate and the second substrate (3, 4), and have a width of 10 μm ± 5 μm in a direction parallel to the contact surfaces, and / or The re-solidified areas (64, 69) are located on the contact surfaces (11, 12, 15) between the first substrate and the second substrate (3, 4), and have a width greater than the thickness of the re-solidified area in a direction parallel to the contact surfaces and perpendicular to the laser bonding line. The hermetically sealed structure (1) according to claim 4.

6. In the mixing area (62), the material of the first substrate (3) and the material of the second substrate (4) are arranged such that a shape-bonding interlock occurs between the material of the first substrate and the material of the second substrate, and / or The first metal substrate (3) and the second substrate (4) have an interlocking structure (37) that fuses with each other. An airtightly coupled structure (1) according to any one of claims 1 to 5.

7. In the mixing area (62) and / or the resolidification area (64, 69), the metallic material of the metal substrate (3) is present in the form of droplets (3a) and / or dendrites, and / or the material of the second substrate (4) is present in the form of ablations (4a) and / or dendrites (4b), and the arrangement as droplets and / or dendrites results in strengthening the bond between the first substrate and the second substrate. An airtightly coupled structure (1) according to any one of claims 1 to 6.

8. The hermetically bonded structure (1) according to any one of claims 1 to 7, wherein the metallic material of the metal substrate (3) and / or the material of the second substrate (4) penetrate into at least one of the resolidified areas (64, 69) in the form of droplets (3a), ablations (4a) and / or dendrites (4b), resulting in strengthening of the bond between the first substrate and the second substrate.

9. The contact surface (11) of the first substrate (3) has at least one contact region where the first substrate is in planar contact with the second substrate (4). The aforementioned contact surfaces have an average distance of 1 μm or less between the first substrate and the second substrate, and / or The aforementioned contact surface corresponds to the contact surface (15). An airtightly coupled structure (1) according to any one of claims 1 to 8.

10. The laser bonding lines (6, 6a, 6b, 6c, 6d) bond the first substrate (3) to the second substrate (4) such that both substrates can be separated from each other only by applying a holding force, or, if the holding force is greater than the force required to destroy the second substrate, by destroying the second substrate, and The holding force of the second substrate on the first substrate is 10 N / mm². 2 Exceeding, An airtightly coupled structure (1) according to any one of claims 1 to 9.

11. The first substrate (3) is The contact surface (11) is configured to be flat, and / or The contact surface (11) of the first substrate (3) is polished, and / or The contact surface (11) of the first substrate (3) has an average roughness value Ra of 0.5 μm or less. Characterized by and / or The second substrate (4) It is formed flat on the contact surface (12) and has an average roughness value Ra of 0.5 μm or less. Characterized by, An airtightly coupled structure (1) according to any one of claims 1 to 10.

12. The first substrate (3) is made of a metal material and / or The first substrate (3) contains a metal in the sense of the definition of the periodic table. An airtightly coupled structure (1) according to any one of claims 1 to 11.

13. The first substrate (3) contains or consists of at least one of molybdenum, tungsten, silicon, platinum, silver, or gold, and / or The first substrate (3) includes an alloy, An airtightly coupled structure (1) according to any one of claims 1 to 12.

14. The second substrate (4) is a transparent substrate and / or The second substrate (4) includes or consists of glass, glass ceramic, silicon, sapphire, or a combination of the above materials, and / or The second substrate (4) contains or is made of a ceramic material, An airtightly coupled structure (1) according to any one of claims 1 to 13.

15. The hermetically bonded structure (1) according to claim 14, wherein the second substrate (4) comprises or consists of at least one of quartz glass, borosilicate glass, aluminosilicate glass, glass ceramics such as Zerodur, Ceran or Robax, optoceramics such as aluminum oxide, spinel, pyrochlore or aluminum oxynitrite, calcium fluoride crystals or chalcogenide glass.

16. - At least one spacer (35) to ensure a gap between the first substrate and the second substrate. A hermetically coupled structure (1) according to any one of claims 1 to 15, further comprising:

17. The first substrate (3) is in contact with the second substrate (4) via the spacer (35), and / or The spacer (35) is positioned between the first substrate (3) and the second substrate (4). The hermetically sealed structure (1) according to claim 16.

18. The spacer (35) extends at least along the laser bonding lines (6, 6a, 6b, 6c, 6d) or within the region of the bonding point, or The spacer (35) extends outside the laser bonding lines (6, 6a, 6b, 6c, 6d), or outside the region of the connection point, or The spacer (35) is formed over its entire surface, and / or The spacer (35) has a thickness of at least 5 μm. The hermetically coupled structure (1) according to claim 16 or 17.

19. The spacer (35) is made of a metal material and / or The spacer (35) is formed as a coating on the first substrate (3) or the second substrate (4), and / or The spacer (35) is formed integrally with the first base material (3) and / or the second base material (4). The airtightly coupled structure (1) according to claim 17 or 18.

20. - At least one avoidance area (40) for receiving molten material from the laser bonding lines (6, 6a, 6b, 6c, 6d) or bonding points. It further includes, Here, the laser bonding line or the plurality of bonding points are used to directly and without mediation fuse-bond the first metal substrate to the second substrate. An airtightly coupled structure (1) according to any one of claims 1 to 19.

21. The at least one avoidance area (40) is located adjacent to the laser junction lines (6, 6a, 6b, 6c, 6d) or the plurality of connection points, and / or The at least one avoidance area (40) is located between the first substrate (3) and the second substrate (4), and / or The at least one avoidance area (40) is formed on the contact surface (11, 12, 15) when the second substrate (4) is placed on the first substrate (3), The hermetically sealed structure (1) according to claim 20.

22. The at least one laser junction line (6, 6a, 6b, 6c, 6d) or multiple connection points are - A set of first laser bonding lines (6, 6a, 6b, 6c, 6d) or first bonding points for directly and without mediation bonding the first metal substrate to the second substrate on or within the contact surfaces (11, 12, 15), Here, the first laser bonding line or the set of first connection points extends into the first substrate on one side and into the second substrate on the other side, and at least two substrates are directly joined to each other by melting. - A set of second laser bonding lines (6a, 6b, 6c, 6d) or second bonding points for directly and without mediation bonding the first metal substrate to the second substrate on or within the contact surface, Here, the second laser bonding line or the set of second connection points extends within the first laser bonding line or the set of first connection points, and the mixing of materials achieved by the first laser bonding line or the set of first connection points is altered. A hermetically coupled structure (1) according to any one of claims 1 to 21, including the following:

23. A hermetically sealed housing (9) having a hermetically coupled structure (1) according to any one of claims 1 to 22, - At least one functional region (2) disposed between the first substrate and the second substrate of the structure (1), The hermetically sealed housing (9), including the above.

24. The laser bonding lines (6, 6a, 6b, 6c, 6d) of the housing are configured to be completely closed around the functional region (2), and / or The distance between the first substrate (3) and the second substrate (4) along the laser bonding lines (6, 6a, 6b, 6c, 6d) is consistently less than 0.75 μm. The hermetically sealed housing (9) according to claim 23.

25. The hermetically sealed housing (9) according to claim 23 or 24, wherein the functional area (2) includes a hermetically sealed housing cavity for receiving a housing object (5), such as an electronic circuit, sensor, or MEMS.

26. An hermetically coupled structure (1) or hermetically sealed housing (9) according to any one of claims 1 to 25, wherein, before hermetically bonding at least two substrates together by directly joining the at least two substrates, the first coating or covering is placed on the first metal substrate (3), at least on the side facing the second substrate, in the region of laser bonding lines (6, 6a, 6b, 6c, 6d) or a plurality of bonding points for directly and unintermediatedly joining the first metal substrate to the second substrate.

27. A method for manufacturing an hermetically sealed structure (1) according to any one of claims 1 to 22, comprising at least two members, the following steps: The step of arranging at least one first metal substrate (3) planarly on a second substrate (4), wherein at least two substrates are arranged in contact with or overlapping each other, a contact surface (11, 12, 15) is formed between the at least two substrates, the first substrate is in contact with the second substrate at the contact surface, and the second substrate includes a transparent material, The step of forming a mixed area (62) by directly joining the at least two substrates to each other in the region of at least one contact surface, thereby airtightly bonding the at least two substrates to each other, wherein the mixed area (62) extends into the first substrate on one side and into the second substrate on the other side, and the at least two substrates are directly joined to each other by melting. The method comprising the above.

28. The method according to claim 27, wherein the first coating or covering is placed on the first substrate before the at least one first metal substrate (3) is placed planarly on the second substrate (4).

29. A step of inspecting the airtight joint of the at least two substrates (3, 4) by identifying the profile of the spacing between the at least two substrates, and / or To inspect the mechanical strength and / or airtightness of the bond, a first bond quality index Q 1 Identifying the stage It further possesses, The first bonding quality index Q 1 Q 1 = 1 - (A - G) / A, where A represents the area of ​​the contact surface (11, 12, 15) and G represents the good surface. The good surface G corresponds to the contact surface, and The good surface G describes the portion of the contact surface (11, 12, 15) where the gap between the substrates (3, 4) is less than 0.5 μm. The method according to claim 27 or 28.

30. The aforementioned bonding quality index Q 1 It is 0.8 or higher. The method according to claim 29.

31. The first bonding quality index Q 1 This is determined before the first substrate (3) and the second substrate (4) are joined together. The method according to claim 29 or 30.

32. The method according to any one of claims 27 to 31, further comprising the step of igniting a plasma discharge in the mixing area (62) using a laser in preparation for a laser bonding process.

33. Use of the hermetically coupled structure (1) according to any one of claims 1 to 22 or the hermetically sealed housing (9) according to any one of claims 23 to 26 as a medical implant or wearable device that comes into contact with human, animal or plant cells.

Images