Seat expansion device, method for expanding a seat

Abstract

To provide a sheet expanding device capable of reducing adhesion of sheet waste.SOLUTION: A sheet expansion device includes an expansion unit (200) that expands a sheet of a frame unit (1) in which a workpiece (11) is supported via the expandable sheet (23) in a circular opening (2201) formed in the center of a frame (25), and a contraction unit (310) that supplies heated steam to an area between an inner edge of the annular frame and an outer edge of the workpiece, thereby contracting the expanded sheet.SELECTED DRAWING: Figure 5

Description

Technical Field

[0004] ,

[0006] , , , , , ,

[0005] , , ,

[0003] , , , , ,

[0001] The present invention relates to a sheet expanding device and a method for expanding a sheet.

Background Art

[0007] This configuration allows heating in a moist state using steam heating, thus suppressing the adhesion of vaporized sheet debris. Furthermore, since a shrinking unit is provided in the washing area, the washing step can be performed without requiring time for transport after shrinking, making it even less likely for the attached sheet debris to adhere. [Effects of the Invention]

[0008] According to the present invention, the adhesion of sheet debris can be reduced. [Brief explanation of the drawing]

[0009] [Figure 1] This is a schematic perspective view showing a frame unit including a workpiece that is divided by the extension method of this embodiment. [Figure 2] This figure shows an example of an expansion unit for implementing the expansion method of this embodiment. [Figure 3] This figure shows an example of an expansion unit for implementing the expansion method of this embodiment. [Figure 4] This figure shows an example of an expansion unit for implementing the expansion method of this embodiment. [Figure 5] This figure shows an example of an expansion unit for implementing the expansion method of this embodiment. [Figure 6] This diagram shows the relationship between the expansion area and the cleaning area located in the frame retaining section. [Modes for carrying out the invention]

[0010] The expansion method of this embodiment will now be described with reference to the attached drawings. Figure 1 is a schematic perspective view showing a frame unit including a workpiece that is divided by the expansion method of this embodiment.

[0011] The frame unit 1 shown in Figure 1 includes a workpiece 11 having a disc shape. The workpiece 11 is a workpiece (wafer) made of a semiconductor material such as silicon (Si). The surface 111 side of the workpiece 11 is divided into multiple regions by a plurality of intersecting division lines 13, and a device 15 such as an IC is formed in each region.

[0012] In this embodiment, a disc-shaped workpiece made of a semiconductor material such as silicon is used as the workpiece 11, but there are no restrictions on the material, shape, structure, and size of the workpiece 11. For example, substrates made of other semiconductors, ceramics, resins, metals, etc., can also be used as the workpiece 11. Similarly, there are no restrictions on the type, quantity, shape, structure, size, and arrangement of the devices 15. Furthermore, the devices 15 do not need to be formed on the workpiece 11.

[0013] Furthermore, a modified layer 17 is formed inside the workpiece 11 as a dividing point along the dividing line 13. That is, a dividing point, which is a dividing groove or a modified layer 17 formed inside, is formed along the dividing line 13. The dividing line 13 is formed in a grid pattern on the surface of the workpiece, and a device 15 is formed in each region partitioned by the multiple dividing lines 13. The modified layer 17 is formed, for example, by irradiating the workpiece 11 along the dividing line 13 with a laser beam having a wavelength that penetrates the workpiece 11 and whose focal point is located inside the workpiece 11.

[0014] An expanded sheet (sheet) 23 is attached to the back surface 112 of the workpiece 11 via an adhesive film 21. The adhesive film 21 is typically a film-like adhesive called a die attach film (DAF), and generally has a disc shape with a larger diameter than the workpiece 11. The adhesive film 21 is formed using, for example, a resin that hardens with heat or light, and has the function of fixing the chips obtained by dividing the workpiece 11 to any object (for example, another chip or substrate).

[0015] The expandable sheet 23, which is attached to the back surface 112 of the workpiece 11 via the adhesive film 21, is a resin film that stretches when force is applied, and for example, has a disc shape with a larger diameter than the adhesive film 21. Furthermore, the outer periphery of the expandable sheet 23 is attached to an annular frame 25 whose inner diameter is larger than the diameters of the workpiece 11 and the adhesive film 21. The adhesive film 21 is divided along the division line 13 along with the workpiece into devices 15. The workpiece is supported by the annular frame 25 via the expandable sheet 23 and is divided into individual devices 15 by the expansion of the expandable sheet 23.

[0016] In this expansion method, an adhesive film 21 having an outer diameter larger than the outer diameter of the workpiece 11 is attached to the back surface 112 of the workpiece 11, and the adhesive film 21 side is attached to the expandable sheet 23 exposed from the center of the frame 25. Also, a surface protection tape (not shown) is peeled off from the surface 111 of the workpiece 11, and the surface 111 is turned upward. In this way, the workpiece 11 is attached to the expandable sheet 23 via the adhesive film 21 with the peripheral exposed area 14 of the adhesive film 21 protruding (exposed) from the outer circumference of the workpiece 11.

[0017] Figures 2 to 5 are diagrams showing an example of an expansion unit 200 for implementing the expansion method of the present embodiment. FIG. 2 shows a cross-sectional view of the expansion unit 200 before expansion, FIG. 3 shows a cross-sectional view of the expansion unit 200 during expansion, FIG. 4 shows a cross-sectional view of the expansion unit 200 after expansion, and FIG. 5 shows a cross-sectional view of the expansion unit 200 during cleaning. The expansion unit 200 expands (expands) the expandable sheet 23. The expansion unit 200 includes a base 210, a frame pressing portion 220, a frame support portion 221, an expansion drum 230, a holding table 232 installed inside the expansion drum 230 and having a pressing surface 233 substantially at the same height as the upper surface of the expansion drum 230, a lifting unit 240 for lifting and lowering the expansion drum 230 and the holding table 232, a contraction unit 310, and a cleaning unit 410. The base 210 is formed in a cylindrical shape and supports the expansion drum 230 and the lifting unit 240. The holding table 232 is formed in a disc shape and is disposed inside the expansion drum 230. The holding table 232 presses the workpiece by the pressing surface 233 via the expandable sheet 23. Further, the holding table 232 functions to suck and hold the workpiece 11 in order to maintain the interval between the chips after expansion.

[0018] The frame pressing portion 220 contacts and holds the annular frame 25 and restricts the upward movement of the frame 25. The frame pressing portion 220 is formed of a metal material such as SUS, for example. The frame pressing portion 220 holds the frame unit 1. Specifically, the frame pressing portion 220 has a circular opening (opening portion) 2201 corresponding to the circular opening 2212 of the frame support portion 221. The frame support portion 221 is moved by a lifting unit (not shown) between a fixed position where the frame is sandwiched between the upper surface (support surface) 2211 of the frame support portion 221 and the lower surface of the frame pressing portion 220 to press the frame 25 of the frame unit 1, and a retracted position lowered from the fixed position.

[0019] The frame support part 221 has a circular opening 2212 on its upper surface 2211. An expansion drum 230 is disposed within the circular opening 2212 of the frame support part 221 so as to be vertically movable. A plurality of expansion rollers 231 are attached to the outer periphery of the lower end part of the expansion drum 230. The frame support part 221 is formed of a metallic material such as SUS. The expansion roller 231 functions as a pressing unit. The expansion roller 231 expands the expandable sheet 23 in a state where the frame 25 is sandwiched between the frame support part 221 and the frame presser part 220. Thereby, the work 11 can be sucked and held by the holding table 232, and the chip interval can be maintained. Then, by heating after releasing the pressing of the expansion roller 231, the surplus area between the inner edge of the frame 25 and the outer edge of the work 11 can be shrunk.

[0020] The expansion drum 230 is suspended from the base 210 and is formed in a cylindrical shape. The expansion drum 230 is disposed inside the frame presser part 220 and at a position coaxial with the frame presser part 220. The inner diameter and the outer diameter of the expansion drum 230 are smaller than the inner diameter of the frame 25 and the frame presser part 220 and larger than the outer diameter of the work 11.

[0021] The elevating unit 240 relatively moves the frame support part 221 and the expansion drum 230 along the vertical direction. In the present embodiment, an elevating unit (not shown) elevates the expansion drum 230 over a position where the upper surface 2211 of the frame support part 221 is located on the same plane as the lower end of the expansion drum 230 and a position where the upper surface 2211 of the frame support part 221 is below the lower end of the expansion drum 230. In the present embodiment, the elevating unit 240 is an air cylinder that is suspended from the base 210, is stretchable, and has the expansion drum 230 attached to its lower end. In the present embodiment, the elevating unit 240 is provided at a substantially central position of the base 210. The elevating unit 240 may be constituted by a motor (not shown) and a ball screw and may be formed so as to be vertically stretchable.

[0022] (Expansion step) The expansion method according to this embodiment involves expanding the expanded sheet 23 of the frame unit 1, which is formed by attaching a workpiece 11, on which a division starting point is formed along the division line 13, to the expanded sheet 23 via an adhesive film 21 larger than the workpiece 11, and then tearing the adhesive film 21 along the division line 13. The expansion method according to this embodiment is carried out by a control device (not shown) of the expansion unit 200 controlling each component of the expansion unit 200, and comprises an expansion step, a shrinking step, and a cleaning step. Prior to the expansion step, the workpiece 11 is brought into the circular opening 2212 of the frame support portion 221, and the frame 25 is placed on the upper surface 2211 of the frame support portion 221.

[0023] The expansion step expands the expanded sheet 23 and breaks the adhesive film 21. In the expansion step, as shown in Figure 3, the expansion drum 230 is lowered by the drive of the lifting unit 240, which allows for efficient breaking of the adhesive film 21.

[0024] As the lifting unit 240 descends, the expanded sheet 23 is expanded, and the adhesive film 21 is ruptured. During the expansion step, a cold air supply means (not shown) is activated to supply cold air and cool the adhesive film 21. Cooling reduces the ductility of the adhesive film 21, so the adhesive film 21 can be easily ruptured simply by expanding the expanded sheet 23.

[0025] The shrinking unit 310 supplies heated steam to the area between the inner edge of the frame 25 and the outer edge of the workpiece 11, thereby shrinking the expanded sheet 23. Specifically, the shrinking unit 310 comprises a base 320, a lifting unit 330, a shrinking table 340, and a shrinking device 350. The shrinking device 350, mounted on the shrinking table 340, is fixed to the base 320 so as to be vertically movable by the lifting unit 330.

[0026] The shrinking device 350 is installed between the inner edge of the frame 25 and the outer edge of the workpiece 11, and supplies steam heated by a heating device (not shown) to the expanded sheet 23.

[0027] (Contraction step) The shrinking step involves heating the expanded sheet 23, which has been expanded by the expansion step, to cause thermal shrinkage. In particular, the slack portions of the expanded sheet 23 that have formed around the workpiece 11 and the adhesive film 21 are heated to cause thermal shrinkage. When the shrinking step is performed, the expansion unit 200 is further equipped with a heating device 260. The shrinking device 350 is equipped with, for example, a heater (not shown) as a heat source, and the lower surface of the expanded sheet 23 can be heated by steam heated by the heater. When the expanded sheet 23 is heated by the heated steam, the temperature of the expanded sheet 23 rises. The heated steam may be, for example, superheated steam.

[0028] The shrinking device 350 applies heat to the expanded sheet 23 from below, but the heating method is not limited to this, and other heating methods may be used. For example, heat may be applied to the expanded sheet 23 from above using heated steam. Alternatively, the expanded sheet 23 may be heated while providing moisture, for example, by infrared irradiation or hot air. When using infrared irradiation or hot air, the expanded sheet 23 can be supported so that it is exposed upwards, and infrared irradiation or hot air blowing can be applied to the expanded sheet 23 from below. Since the expanded sheet 23 can be heated in a moist state by heated steam and then shrunk, it is possible to suppress the adhesion caused by the vaporized expanded sheet 23 scattering and sticking to the workpiece 11 as it dries. In other words, it can always be shrunk in a moist state, and adhesion to the workpiece 11 caused by drying can be prevented.

[0029] (Washing step) As shown in Figure 5, the cleaning unit 410 includes a cleaning arm 420, a cleaning fluid supply nozzle 430, and a gas supply nozzle 440. The cleaning arm 420 extends from the frame support portion 221 and is configured to allow the cleaning fluid supplied from the cleaning fluid supply nozzle 430 and gas to pass through it. When not cleaning, the cleaning arm 420 is folded and formed integrally with the frame support portion 221, and when cleaning, it is extended and configured to allow the cleaning fluid supply nozzle 430 and the gas supply nozzle 440 to move to the central position of the workpiece 11.

[0030] During cleaning, the workpiece 11 is cleaned with cleaning fluid supplied from the cleaning fluid supply nozzle 430. After cleaning with the cleaning fluid supply nozzle 430, the workpiece 11 is ventilated with gas supplied from the gas supply nozzle 440, and the frame unit 1 can be dried. Any gas can be used as the gas supplied from the gas supply nozzle 440, such as air or nitrogen. As shown in Figure 5, during cleaning, the frame retaining portion 220 is positioned relatively far apart from the frame support portion 221, so that the frame 25 is not pinched between the frame retaining portion 220 and the frame support portion 221. As a result, the frame 25 can rotate freely, making cleaning and drying easy.

[0031] Figure 6 shows the relationship between the expansion area 510 and the cleaning area 520 located on the frame retaining portion 220. A temporary storage area 530 is located between the expansion area 510 and the cleaning area 520. The expansion area 510 and the cleaning area 520 are separated by the temporary storage area 530.

[0032] An expansion unit 200 is installed in the expansion area 510. A frame holding section 220, a cleaning fluid supply nozzle 430, and a gas supply nozzle 440 are installed in the cleaning area 520. The shrinking unit 310 is also positioned in the cleaning area 520. After the shrinking step, a transport step is performed. In the transport step, the transport arm 610 transports, for example, the workpiece 11 placed on the expanded sheet 23 to the expansion area 510. The transport step may be performed before the shrinking step. The shrinking unit 310 is positioned in the so-called spinner area. By positioning the shrinking unit 310 in the cleaning area 520 where cleaning fluid is used, a mechanism capable of handling liquid generated by heated steam and cleaning fluid generated from the cleaning fluid supply nozzle 430 can be consolidated in one place, simplifying the mechanism and reducing manufacturing costs. Furthermore, by cleaning immediately without transport, the risk of sheet debris generated from the expanded sheet 23 sticking to the frame unit 1 and becoming impossible to remove is reduced. Furthermore, because the spinner can be retracted in the cleaning area, cleaning can begin immediately afterward, allowing for the removal of sheet debris from the expanded sheet 23 before it adheres or hardens. Although the cleaning area 520 gets wet, the cleaning area 520 and the expansion area 510 are separated, so wetting the expansion area 510 prevents condensation or frost from forming in the expansion area 510.

[0033] As described above, according to the sheet expansion method of this embodiment, when the expanded sheet 23 is expanded and then the area between the frame 25 and the workpiece 11 is heated and shrunk, the vaporized sheet debris can be prevented from adhering to the frame unit 1 by keeping the expanded sheet 23 moist when heated.

[0034] Furthermore, in this embodiment, various workpieces such as semiconductor substrates, inorganic material substrates, and package substrates may be used as workpieces. As semiconductor substrates, various substrates such as silicon, gallium arsenide, gallium nitride, and silicon carbide may be used. As inorganic material substrates, various substrates such as sapphire, ceramics, and glass may be used. Semiconductor substrates and inorganic material substrates may or may not have devices formed on them. As package substrates, various substrates for CSP (Chip Size Package), WLCSP (Wafer Level Chip Size Package), EMI (Electro Magnetic Interference), SIP (System In Package), and FOWLP (Fan Out Wafer Level Package) may be used. In addition, lithium tantalate, lithium niobate, raw ceramics, and piezoelectric elements may be used as workpieces, either after or before device formation.

[0035] Furthermore, although this embodiment and its variations have been described, other embodiments of the present invention may be combinations of the above embodiments and their variations, either entirely or partially.

[0036] Furthermore, the embodiments and modifications of the present invention are not limited to those described above, and may be modified, substituted, or altered in various ways without departing from the spirit of the technical idea of ​​the present invention. Moreover, if the technical idea of ​​the present invention can be realized in a different way by advances in the art or by other derived arts, it may be implemented by that method. Accordingly, the claims cover all embodiments that may fall within the scope of the technical idea of ​​the present invention.

[0037] Furthermore, although this embodiment describes a configuration in which the present invention is applied to the expansion of an expandable sheet, it can also be applied to the expansion of other sheets. In this embodiment, an expansion unit that holds the workpiece downwards, a contraction unit, and a cleaning unit are described, but the workpiece may be held upwards in at least one of the expansion unit, contraction unit, and cleaning unit. [Industrial applicability]

[0038] As described above, the present invention has the effect of reducing the adhesion of sheet debris, and is particularly effective for sheet expansion devices that expand expanded sheets. [Explanation of Symbols]

[0039] 1: Frame Unit 11: Work 13: Planned division line 14:Exposed area 15: Device 17: Modified layer 21: Adhesive film 23: Expandable Sheet 25: Frame 200: Expansion Unit 210: Base 220: Frame retaining part 221: Frame support section 230: Expansion Drum 231: Expansion Roller 232: Holding Table 233: Pressing surface 240: Lifting Unit 260: Heating device 310: Shrinkage Unit 320: Base 330: Lifting Unit 340: Shrinkable Table 350: Contraction device 410: Washing Unit 420: Washing arm 430: Cleaning fluid supply nozzle 440: Gas supply nozzle 510: Extended area 520: Cleaning area 530: Temporary storage area 610: Transport arm 2211:Top surface 2212: Circular opening

Claims

1. An extension unit that extends the sheet of a frame unit in which a workpiece is supported via a sheet in an opening formed in the center of an annular frame, A shrinking unit that supplies heated steam to the region between the inner edge of the annular frame and the outer edge of the workpiece, thereby shrinking the expanded sheet, A seat expansion device characterized by comprising the following features.

2. The seat expansion device is The expansion area in which the expansion unit is installed, The extended area is separated from the holding table that holds the frame unit, A cleaning area is installed in which a cleaning unit is provided, which includes a cleaning fluid supply nozzle that supplies cleaning fluid to the frame unit held on the holding table, Furthermore, The shrinking unit is positioned in the cleaning area. The sheet expansion device according to feature 1.

3. Multiple division starting points are formed in the workpiece. By extending the sheet with the extension unit, The workpiece is divided into multiple chips along the starting point of the division. The sheet expansion device according to feature 1.

4. The workpiece has multiple dividing grooves formed therein that divide the workpiece into multiple chips. By extending the sheet with the extension unit, Widen the spacing between the chips. The sheet expansion device according to feature 1.

5. An expansion step of extending the sheet of a frame unit, in which a workpiece is supported via the sheet, into an opening formed in the center of the annular frame, The process includes a shrinking step of supplying heated steam to the region between the inner edge of the annular frame and the outer edge of the workpiece to shrink the expanded sheet. A method for expanding a sheet, characterized by the features described above.

6. After the contraction step, The system further comprises a cleaning step of supplying cleaning fluid to the frame unit for cleaning. The method for expanding a sheet according to feature 5.

7. After the expansion step and before the cleaning step, The system further includes a transport step for transporting the frame unit from the expansion area where the expansion step is performed to the cleaning area where the cleaning step is performed. The shrinking step is performed in the cleaning area. The method for expanding a sheet according to feature 6.

Images