Display device adjustment method and display device adjustment system

Abstract

The present invention provides a method of adjusting a display device. The present invention also provides a method of evaluating the display quality of the display device. The display device includes a display panel, an adjustment circuit, and a memory. First, while an image with a first gradation level is displayed on the display device, first imaging data including all pixels of the display device is obtained. Next, while an image with a second gradation level is displayed on the display device, second imaging data including all pixels of the display device is obtained. Next, adjustment data is generated on the basis of the first imaging data and the second imaging data. Then, the adjustment data is output to the memory of the display device. The adjustment circuit includes a function to generate adjusted image data by adjusting the image data on the basis of the adjustment data stored in the memory and to output the adjusted image data to the display panel.

Description

Display device correction method and display device correction system

[0001] TECHNICAL FIELD One aspect of the present invention relates to a method for correcting a display device and a system for correcting a display device.

[0002] Note that one embodiment of the present invention is not limited to the above technical field. Examples of the technical field of one embodiment of the present invention disclosed in this specification and the like include semiconductor devices, display devices, light-emitting devices, power storage devices, memory devices, electronic devices, lighting devices, input devices, input / output devices, driving methods thereof, and manufacturing methods thereof. A semiconductor device refers to any device that can function by utilizing semiconductor characteristics.

[0003] In recent years, there has been a demand for higher resolution and higher definition for display panels. Devices requiring high-definition display panels include, for example, smartphones, tablet terminals, and notebook computers. Furthermore, in stationary display devices such as televisions and monitors, higher definition is also required in line with the increase in resolution. Furthermore, devices requiring the highest definition include, for example, devices for virtual reality (VR) or augmented reality (AR).

[0004] Representative examples of display devices applicable to the display panel include liquid crystal display devices, organic EL (Electro Luminescence) elements, light-emitting devices equipped with light-emitting elements such as light-emitting diodes (LEDs: Light Emitting Diodes), and electronic paper that displays using an electrophoresis method.

[0005] For example, the basic structure of an organic EL element is a layer containing a light-emitting organic compound sandwiched between a pair of electrodes. By applying a voltage to this element, light can be emitted from the light-emitting organic compound. A display device using such an organic EL element does not require a backlight, which is necessary in liquid crystal display devices and the like, and therefore can realize a thin, lightweight, high-contrast, and low-power display device. For example, an example of a display device using an organic EL element is described in Patent Document 1.

[0006] Furthermore, there is a demand for improving the display quality of display panels. Causes of degradation of display quality include, for example, unevenness, point defects, line defects, and other defects caused by variations in the characteristics of pixel transistors or variations in the characteristics of display elements.

[0007] Furthermore, as one method for evaluating the display quality of a display panel, it has been proposed to apply the MTF (Modulation Transfer Function), which is used to evaluate the performance of a camera, to the evaluation of the display panel (Non-Patent Document 1).

[0008] JP 2002-324673 A

[0009] K. Masaoka, “Simulation of Line-Based MTF Measurements for Pixelated Displays”, SID 2020 DIGEST, pp. 854-857

[0010] The higher the resolution of a display device, the greater the number of pixels. This means that the display is susceptible to variations in the characteristics of the transistors that make up the pixels and variations in the characteristics of the display elements, resulting in noticeable display unevenness.

[0011] An object of one embodiment of the present invention is to improve the display quality of a display device. Another object is to provide a method for correcting a display device. Another object is to provide a method for evaluating the display quality of a display device. Another object is to provide a method or system capable of correcting and evaluating a display device through a series of processes. Another object is to provide a novel method or system for image correction. An object of one embodiment of the present invention is to at least alleviate at least one of the problems of the prior art.

[0012] Note that the description of these problems does not preclude the existence of other problems. Note that one embodiment of the present invention does not necessarily solve all of these problems. Note that problems other than these can be extracted from the description of the specification, drawings, claims, etc.

[0013] One embodiment of the present invention is a method for correcting a display device. The display device includes a display panel, a correction circuit, and a memory. First, first imaging data including all pixels of the display device is acquired while an image of a first gray level is displayed on the display device. Next, second imaging data including all pixels of the display device is acquired while an image of a second gray level is displayed on the display device. Next, correction data is generated based on the first imaging data and the second imaging data. Next, the correction data is output to the memory of the display device. The correction circuit has a function of correcting image data based on the correction data stored in the memory to generate corrected image data and outputting the corrected image data to the display panel.

[0014] Another embodiment of the present invention is a method for correcting a display device. The display device includes a display panel, a correction circuit, and a memory. First, first imaging data including all pixels of the display device is acquired while an image of a first gray level is displayed on the display device. Next, second imaging data including all pixels of the display device is acquired while an image of a second gray level is displayed on the display device. Next, correction data is generated based on the first imaging data and the second imaging data. Next, the correction data is output to the memory of the display device. Next, third imaging data is acquired while a test image is displayed on the display device. Next, an MTF value is calculated based on the third imaging data. Next, a determination is made based on the MTF value. The correction circuit has a function of correcting image data based on the correction data stored in the memory to generate corrected image data and outputting the corrected image data to the display panel.

[0015] In any of the above, it is preferable that the display device has N×M pixels (N and M are natural numbers), and the correction data has N×M correction values ​​corresponding to the N×M pixels, respectively.

[0016] In any of the above, it is preferable that the correction data includes address information of pixels that are point defective among the pixels that the display panel has.

[0017] In any of the above, the first imaging data and the second imaging data are preferably acquired by scanning the display panel to capture an image, or the first imaging data and the second imaging data are preferably acquired by capturing an image of the entire display panel.

[0018] Another embodiment of the present invention is a correction system for a display device. The display device includes a display panel, a correction circuit, and a memory. The correction system includes a correction data generation unit, a drive signal generation unit, a timing controller, and an imaging device. The drive signal generation unit generates image data and outputs it to the timing controller. The timing controller generates a control signal based on the image data, outputs the image data to the display device, and outputs a control signal to the imaging device. The display device displays an image on the display panel based on the image data. The imaging device acquires imaging data including all pixels of the display panel based on the control signal while an image is being displayed on the display panel, and outputs the imaging data to the correction data generation unit. The correction data generation unit generates correction data based on the imaging data and outputs the correction data to the display device. The memory of the display device stores the correction data. The correction circuit corrects the image data based on the correction data stored in the memory to generate corrected image data and output the corrected image data to the display panel.

[0019] In the above, the display device has N×M pixels (N and M are natural numbers), and the correction data generation unit preferably has a function of generating correction data such that the correction data has N×M correction values ​​corresponding to the N×M pixels, respectively.

[0020] In any of the above, it is preferable that the correction data generating section has a function of generating the correction data so that the correction data includes address information of pixels that are point defects among the pixels that the display panel has.

[0021] In any of the above, the imaging device preferably has a function of acquiring imaging data by scanning the display panel to capture the image. Alternatively, the imaging device preferably has a function of acquiring imaging data by capturing the entire display panel. In this case, the imaging device preferably has a higher resolution than the display panel.

[0022] According to one aspect of the present invention, it is possible to improve the display quality of a display device. Alternatively, it is possible to provide a method for correcting a display device. Alternatively, it is possible to provide a method for evaluating the display quality of a display device. Alternatively, it is possible to provide a method or system that can perform correction and evaluation of a display device through a series of processes. Alternatively, it is possible to provide a novel method or system for image correction. Furthermore, according to one aspect of the present invention, it is possible to at least alleviate at least one of the problems of the prior art.

[0023] Note that the description of these effects does not preclude the existence of other effects. Note that one embodiment of the present invention does not necessarily have all of these effects. Note that effects other than these can be extracted from the description in the specification, drawings, claims, etc.

[0024] FIG. 1 is a diagram illustrating an example of the configuration of a display device. FIG. 2 is a diagram illustrating an example of the configuration of a correction system. FIGS. 3A to 3C are diagrams illustrating an imaging method. FIGS. 4A to 4D are diagrams illustrating correction data. FIGS. 5A to 5C are diagrams illustrating correction data. FIG. 6 is a flowchart illustrating correction processing. FIG. 7 is a flowchart illustrating a correction method. FIG. 8 is a diagram illustrating an example of MTF. FIG. 9 is a flowchart illustrating determination processing. FIGS. 10A to 10C are diagrams illustrating an example of the configuration of a display device. FIGS. 11A to 11F are diagrams illustrating an example of the configuration of a pixel. FIG. 12 is a diagram illustrating an example of the configuration of a display device. FIGS. 13A and 13B are diagrams illustrating an example of the configuration of a display device. FIGS. 14A and 14B are diagrams illustrating an example of the configuration of a display device. FIG. 15 is a diagram illustrating an example of the configuration of a display device. FIG. 16 is a diagram illustrating an example of the configuration of a display device. FIG. 17 is a diagram illustrating an example of the configuration of a display device. FIG. 18 is a diagram illustrating an example of the configuration of a display device. FIG. 19 is a diagram illustrating an example of the configuration of a display device. FIG. 20 is a diagram illustrating an example of the configuration of a display device. Fig. 21A to Fig. 21F are diagrams showing an example of the configuration of a light-emitting device. Fig. 22A and Fig. 22B are diagrams showing an example of the configuration of a light-receiving device. Fig. 22C to Fig. 22E are diagrams showing an example of the configuration of a display device. Fig. 23A to Fig. 23D are diagrams showing an example of the configuration of an electronic device. Fig. 24A to Fig. 24F are diagrams showing an example of the configuration of an electronic device. Fig. 25A to Fig. 25G are diagrams showing an example of the configuration of an electronic device. Fig. 26A and Fig. 26B show the measurement results of MTF.

[0025] Hereinafter, embodiments will be described with reference to the drawings. However, it will be readily understood by those skilled in the art that the embodiments can be implemented in many different ways and that various changes in form and details can be made without departing from the spirit and scope of the present invention. Therefore, the present invention should not be interpreted as being limited to the following description of the embodiments.

[0026] In the configuration of the invention described below, the same parts or parts having similar functions are denoted by the same reference numerals in different drawings, and repeated explanations thereof will be omitted. In addition, when referring to similar functions, the same hatch pattern may be used and no particular reference numeral may be assigned.

[0027] In the drawings described in this specification, the size of each component, the thickness of a layer, or an area may be exaggerated for clarity, and therefore, the drawings are not necessarily limited to the scale.

[0028] In this specification, ordinal numbers such as "first" and "second" are used to avoid confusion of components and do not limit the number.

[0029] Embodiment 1 In this embodiment, a configuration example of a display device, a configuration example of a system, a correction method, and the like according to one embodiment of the present invention will be described.

[0030] 1 shows an example of the configuration of a display device 10. The display device 10 has a display panel 20 and a signal generation unit 30. The signal generation unit 30 has a function of generating a signal for displaying a predetermined video based on data received from the outside and outputting the signal to the display panel 20. The display panel 20 has a function of displaying an image on the display unit in accordance with the signal input from the signal generation unit 30.

[0031] [Configuration Example of Display Panel] The display panel 20 has a pixel section 21 made up of a plurality of pixels 22, a driving circuit 23, and another driving circuit 24.

[0032] The pixels 22 each have a display element and have the function of displaying a predetermined gradation. The gradation of the pixels 22 is controlled by signals output from the drive circuits 23 and 24, and a predetermined image is displayed on the pixel section 21.

[0033] Examples of the display element provided in the pixel 22 include a liquid crystal element and a light-emitting element. Examples of the liquid crystal element include a transmissive liquid crystal element, a reflective liquid crystal element, and a semi-transmissive liquid crystal element. Examples of the display element include a shutter-type MEMS (Micro Electro Mechanical Systems) element, an optical interference MEMS element, a microcapsule-type display element, an electrophoresis-type display element, an electrowetting-type display element, an electronic liquid powder (registered trademark) display element, and the like. Examples of the light-emitting element include a self-luminous light-emitting element such as an OLED (Organic Light-Emitting Diode), an LED (Light-Emitting Diode), a QLED (Quantum-dot Light-Emitting Diode), and a semiconductor laser.

[0034] 1 , the pixel section 21 is provided with M×N pixels 22. The number of pixels 22 provided in the pixel section 21 can be freely set. For example, when displaying 4K2K video on the display panel 20, it is preferable to provide 3840×2160 or more, or 4096×2160 or more pixels 22 in the pixel section 21. Furthermore, when displaying 8K4K video, it is preferable to provide 7680×4320 or more pixels 22 in the pixel section 21. Furthermore, it is also possible to provide even more pixels 22 in the pixel section 21.

[0035] Each pixel 22 is connected to a wiring SL and a wiring GL. The wirings GL are connected to a driver circuit 23, and the wirings SL are connected to a driver circuit 24.

[0036] The driver circuit 23 has a function of supplying a signal for selecting the pixel 22 (hereinafter also referred to as a selection signal) to the pixel 22. Specifically, the driver circuit 23 has a function of supplying a selection signal to a wiring GL, and the wiring GL has a function of transmitting the selection signal output from the driver circuit 23 to the pixel 22. The driver circuit 23 can be called a scanning line driver circuit, a gate driver, a gate driver, or the like. The wiring GL can also be called a selection signal line, a gate line, or the like.

[0037] The driver circuit 24 has a function of supplying a video signal to the pixels 22. Specifically, the driver circuit 24 has a function of supplying a video signal to a wiring SL, and the wiring SL has a function of transmitting the video signal output from the driver circuit 24 to the pixels 22. The driver circuit 24 can be called a signal line driver circuit, a source driver circuit, a source driver, or the like. The wiring SL can also be called a video signal line, a source line, or the like. When a video signal is supplied to the pixel 22 to which a selection signal has been supplied, the video signal is written in the pixel 22, and a predetermined gradation is displayed.

[0038] [Configuration Example of Signal Generator] The signal generator 30 has a function of generating a video signal based on data input from an external device. The signal generator 30 includes a front-end unit FE, a decoder DEC, a processing circuit PC, a correction circuit CC, a receiving unit RCV, an interface IF, a memory unit MEM, and a control circuit CTRL.

[0039] The front end unit FE has a function of receiving signals input from an external source and performing appropriate signal processing. For example, a broadcast signal encoded and modulated using a predetermined method is input to the front end unit FE. The front end unit FE may have functions such as demodulation and analog-to-digital conversion of the received video signal. The front end unit FE may also have a function of performing error correction. The data received by the front end unit FE and subjected to signal processing is output to a decoder DEC.

[0040] The decoder DEC has a function of decoding an encoded signal. If the image data included in the broadcast signal input to the front end unit FE is compressed, the decoder DEC decompresses the image data. For example, the decoder DEC may have functions of performing inverse quantization, inverse orthogonal transform such as an inverse discrete cosine transform (IDCT) or an inverse discrete sine transform (IDST), entropy decoding, intra-frame prediction, inter-frame prediction, etc.

[0041] The encoding standard used in 8K / 4K television broadcasting is H.265 / MPEG-H High Efficiency Video Coding (hereinafter referred to as HEVC). When image data included in a broadcast signal input to the front end unit FE is encoded in accordance with HEVC, the decoder DEC performs decoding in accordance with HEVC.

[0042] Image data SD is generated by the decoding process by the decoder DEC and is output to the processing circuit PC.

[0043] 1 illustrates an example in which a signal is input to the front-end unit FE via an antenna, but this is not limiting. For example, the front-end unit FE may function as an interface for receiving not only broadcast signals but also various image signals. The front-end unit FE may also receive a digital image signal generated by a processing device such as a central processing unit (CPU) or a graphics processing unit (GPU). In this case, the image signal may be output to the processing circuit PC without passing through a decoder DEC.

[0044] As shown in FIG. 1, the front end FE can also receive data TD from a correction system 40, which is video data used in performing the correction process.

[0045] The processing circuit PC has a function of performing image processing on the image data SD input from the decoder DEC to generate data SD1 and outputting it to the correction circuit CC.

[0046] Examples of image processing include noise reduction, tone conversion, color correction, and brightness correction. Color correction and brightness correction can be performed using gamma correction, etc. The processing circuit PC may also have the function of performing pixel interpolation associated with resolution upconversion and frame interpolation associated with frame frequency upconversion.

[0047] Noise removal processing can remove various types of noise, such as mosquito noise that occurs around the contours of characters, block noise that occurs in high-speed video, random noise that causes flickering, and dot noise that occurs when up-converting resolution.

[0048] The gradation conversion process is a process for converting the gradation indicated by the data SD1 into a gradation that corresponds to the output characteristics of the display panel 20. For example, when increasing the number of gradations, a process for smoothing the histogram can be performed by interpolating and assigning a gradation value corresponding to each pixel to image data input with a small number of gradations. Also included in the gradation conversion process is high dynamic range (HDR) processing, which widens the dynamic range.

[0049] The color correction process corrects the color tone of the image. The brightness correction process corrects the brightness (brightness contrast) of the image. For example, the brightness and color tone of the image displayed on the display panel 20 are corrected to be optimal depending on the type, brightness, color purity, etc. of the lighting installed in the space where the display panel 20 is installed.

[0050] Inter-pixel interpolation is a process of interpolating data that does not actually exist when the resolution is up-converted. For example, color data of a pixel to be newly interpolated (e.g., gradation values ​​corresponding to the colors red (R), green (G), and blue (B)) is obtained by referencing color data of pixels surrounding the pixel, and interpolating the data to obtain color data that is an intermediate color between those colors.

[0051] Inter-frame interpolation is a process for generating an image of a frame (an interpolated frame) that does not actually exist when increasing the frame frequency of a displayed image. For example, an interpolated frame image is generated to be inserted between two images based on the difference between the two images. Alternatively, multiple interpolated frame images can be generated between two images. For example, if the frame frequency of image data is 60 Hz, generating multiple interpolated frames can increase the frame frequency of the video signal output to the display panel 20 by two times, for example, to 120 Hz, four times, for example, to 240 Hz, or eight times, for example, to 480 Hz.

[0052] The above image processing can also be performed by an image processing circuit provided separately from the processing circuit PC.

[0053] The correction circuit CC has a function of correcting the data SD1 input from the processing circuit PC based on the correction data W and generating corrected data SD2. The data SD2 corrected by the correction circuit CC is output to the drive circuit 24 of the display panel 20. The display panel 20 can display an image in the pixel unit 21 based on the data SD2.

[0054] The receiving unit RCV has a function of receiving data or control signals input from the outside, etc. Examples of the receiving unit RCV include an external connection terminal such as a data input terminal or a video input terminal, or a wireless communication module.

[0055] The correction data W and the like used in the correction circuit CC are transmitted from a correction system 40 or the like provided outside the signal generating unit 30, and can be received by the receiving unit RCV.

[0056] The interface IF has a function of performing appropriate signal processing on the data or control signal received by the receiving unit RCV and outputting the processed data to the memory unit MEM or the control circuit CTRL.

[0057] The control circuit CTRL has a function of controlling the operation of each circuit included in the signal generating unit 30. For example, the control circuit CTRL has a function of supplying control signals to the decoder DEC, the processing circuit PC, the correction circuit CC, the memory unit MEM, etc. The control by the control circuit CTRL may be performed based on a control signal received by the receiving unit RCV, etc.

[0058] The memory unit MEM has a function of storing data. The memory unit MEM stores correction data W. The memory unit MEM preferably has a non-volatile memory device so that the correction data W is retained even when the power supply to the display device 10 is stopped.

[0059] The correction circuit CC reads the correction data W from the memory unit MEM under the control of the control circuit CTRL, and corrects the data SD1 using the correction data W to generate the data SD2. The correction data W may be read only when the display device 10 is started up. In this case, the correction circuit CC is configured to have a memory in addition to a processor.

[0060] The display device 10 can constitute a part of an electronic device having a display unit. For example, the display device 10 can be applied to electronic devices having display units of various sizes, such as extra-large devices for digital signage, large devices such as television devices or monitor devices, medium-sized devices such as tablet terminals or notebook terminals, small devices such as smartphones or wristwatch terminals, and ultra-small devices for VR or AR.

[0061] [Correction System] The correction system exemplified below has a function of generating correction data W to be supplied to the display device 10 exemplified above. The display device 10 can display an image based on data SD2 corrected using the correction data W supplied from the correction system.

[0062] Furthermore, the correction system has a function of determining whether the display quality of the corrected display of the display device 10 is pass or fail. If the display quality does not exceed a specified level despite the correction, the display device 10 can be determined to be defective.

[0063] Fig. 2 shows an example of the configuration of the correction system 40. Fig. 2 shows the correction system 40 and the display device 10. For simplicity, Fig. 2 shows only a part of the display panel 20 and a part of the signal generating unit 30 as the display device 10, but Fig. 1 can be referred to for the configuration of the display device 10.

[0064] The correction system 40 includes a processing device 45 and an imaging device 44 .

[0065] The correction system 40 outputs data TD to the display device 10 and displays an image based on the data TD on the display panel 20, then captures images of all pixels with the imaging device 44 and generates correction data W based on the captured image data.

[0066] The imaging device 44 can capture images of all pixels 22 included in the pixel section 21 of the display panel 20. The captured image data is output as imaging data VD to the processing device 45. The imaging device 44 may be, for example, a camera or a two-dimensional luminance meter.

[0067] The processing device 45 includes a correction data generating unit 41 , a signal generating unit 42 , a timing controller 43 , and a determining unit 46 .

[0068] The signal generation unit 42 has a function of generating data TD. The signal generation unit 42 can generate data TD, which is image data to be output to the display device 10, based on a test pattern stored in advance. This allows the test pattern to be displayed on the pixel unit 21 of the display device 10.

[0069] The timing controller 43 has a function of adjusting the timing of displaying the test pattern on the display device 10 and the timing of capturing images by the imaging device 44. The timing controller 43 has a function of generating data CD, which is a control signal that controls the timing of capturing images by the imaging device 44. The timing controller 43 also outputs data TD to the display device 10 and data CD to the imaging device 44 so that they are synchronized with each other.

[0070] The correction data generating section 41 has a function of generating correction data W based on the imaging data VD and outputting it to the display device 10 .

[0071] The determination unit 46 has a function of determining whether the display quality is acceptable or unacceptable based on the imaging data VD. Unlike the imaging data VD for correction, the imaging data VD used for the determination does not need to include information on all pixels, and can be optimal imaging data VD depending on the determination method.

[0072] [Image Capturing Method] Here, an image capturing method for correction will be described. The image capturing device 44 captures images of all pixels of the display panel 20. Therefore, the image capturing method can be changed depending on the size of the display panel 20 or the resolution, focal length, and angle of view of the image capturing device 44.

[0073] 3A shows an example of an imaging method in which the size of the pixel unit 21 of the display device 10 is larger than the imaging range 48 of the imaging device 44. As shown in FIG. 3A, by scanning the imaging device 44 or the display device 10 to capture an image, it is possible to obtain information on the luminance of all pixels.

[0074] 3B shows an example of an imaging method when the size of the pixel unit 21 of the display device 10 is within the imaging range 48 of the imaging device 44. In this case, it is possible to obtain luminance information for all pixels in a single imaging operation. By making the resolution (number of pixels) of the imaging device 44 greater than the resolution (number of pixels) of the pixel unit 21 of the display panel 20, it is possible to obtain the luminance of all pixels of the display panel 20 with high accuracy.

[0075] 3C shows an example of an imaging method for simultaneously imaging a plurality of display devices 10. The display devices 10 are moved by a conveying device 51. A plurality of fixed imaging devices 44 are disposed above the conveying device 51. The display devices 10 are conveyed by the conveying device 51 so that the display devices 10 pass through the imaging range 48 of one of the imaging devices 44. This makes it possible to perform correction processing on a plurality of display devices 10 simultaneously, which is suitable for mass production of the display devices 10.

[0076] [Generation of Correction Data W] An example of a method for generating correction data using information on the luminance of each pixel in the correction data generating unit 41 will be described below.

[0077] The luminance of each pixel is acquired while all pixels are displayed at a predetermined gradation value. At this time, it is preferable to display the pixels without performing any correction, since this allows for the generation of more effective correction data.

[0078] An example of the acquired luminance information is shown in FIG. 4A. Here, as an example, a case where data is acquired when the gradation value T is 40 (T=40) will be described. FIG. 4A is a diagram that schematically shows luminance data L(40) when the gradation value is 40. The luminance data L(40) includes information on the luminance values ​​corresponding to all pixels 22 provided in the pixel section 21 of the display panel 20. FIG. 4A shows an array of luminance values ​​corresponding to 4×4 pixels including the pixel in the i-th row and j-th column (i is an integer between 1 and M, and j is an integer between 1 and N). The luminance value of each pixel is shown when the predetermined luminance when displayed at a gradation value of 40 is 40. For example, the luminance value of the pixel in the i-th row and j-th column is L ｉ，ｊ A pixel with a brightness value of more than 40 is lit brighter than a predetermined value, and a pixel with a brightness value of less than 40 is lit darker than a predetermined value.

[0079] FIG. 4B shows difference data D(40) that indicates the difference between each luminance value of the luminance data L(40) and a predetermined luminance value of 40. For example, the difference value of the pixel in the ith row and jth column is D(40). ｉ，ｊ The difference value is expressed as (40). A pixel with a positive difference value is brighter than a predetermined value, and a pixel with a negative difference value is darker than a predetermined value. Note that the difference data D shown here is shown for the purpose of explanation, and it is not necessarily necessary to calculate the difference data D when generating the correction data W.

[0080] Since the differential data D(40) shown in Fig. 4B indicates the difference from a predetermined luminance, if the image data input to the display panel 20 is corrected in advance so that the difference is cancelled, all pixels can be displayed at the predetermined luminance. That is, the correction data W(40) when the gradation value T=40 can be data obtained by inverting the sign of the differential data D(40), as shown in Fig. 4C. In Fig. 4C, the correction value of the pixel in the i-th row and j-th column of the correction data W(40) is W ｉ，ｊ It is written as (40).

[0081] Here, correction data W(40) when the gradation value T is 40 is taken as an example, but correction data W(T) can be generated for a plurality of gradation values ​​T in a similar manner.

[0082] 4D shows a schematic diagram of the correction data W. For example, in the case of 8-bit gradation, the correction data W can be a data table ranging from correction data W(0) when the gradation value T is 0 to correction data W(255) when the gradation value T is 255. Each correction data W(T) contains the correction value W for the pixel in the first row and first column. １，１ (T) to the correction value W of the pixel in the Mth row and Nth column Ｍ，Ｎ The correction values ​​include M×N correction values ​​up to (T).

[0083] The correction data W may be generated by generating correction data W(T) for all gradation values ​​(for example, from T=0 to T=255), or by generating correction data W(T) for several gradation values ​​T and interpolating the correction data W(T) between them to generate the correction data W. The interpolation may be performed using an appropriate interpolation method such as linear interpolation or nonlinear interpolation.

[0084] In actuality, a full-color display panel has sub-pixels of three colors: red (R), green (G), and blue (B). Therefore, it is preferable to generate correction data W for each color. Furthermore, if there are sub-pixels of yellow (Y) or white (W) in addition to R, G, and B, correction data W can be generated for these colors in the same way.

[0085] Next, a method for generating the correction data W when the display panel 20 has a defective pixel that does not light up (also called a dark spot defect) will be described.

[0086] FIG. 5A shows an example of luminance data L(40) when the pixel in the i+1th row and j+2th column is a dark spot defect. Since this pixel is not lit, the luminance value L ｉ＋１，ｊ＋２ (40) is 0.

[0087] The correction data generating unit 41 can determine that a pixel having a luminance value of 0 or close to 0 is a point defect pixel. ｉ＋１，ｊ＋２ (40) is denoted by X to indicate that it is the data of a pixel of a dark point defect.

[0088] When a dark spot defect pixel is present, the brightness that the dark spot defect pixel should have is compensated for by lighting the surrounding pixels brighter than a predetermined value, which may result in a display closer to normal. This method can be particularly effective when the resolution is high enough to make the pixel invisible. However, care must be taken when the resolution is low, as this may make the area of ​​the brightly lit portion centered on the dark spot defect pixel larger, which may make the defect more noticeable.

[0089] The following example shows how to set the correction values ​​of eight pixels surrounding a dark point defect pixel higher than their original correction values. As shown in FIG. 5C , for example, when the gradation value T is 40, the sum of the luminance values ​​of the 3×3 pixels including the dark point defect pixel should be 40×9=360. Therefore, a correction value is added to the correction value corresponding to each pixel so that the sum of the luminance values ​​of the eight pixels excluding the dark point defect pixel is 360, thereby correcting the correction values ​​to be higher than the original correction values. It is preferable to correct the correction values ​​so that the closer the pixel is to the dark point defect pixel, the higher the correction value. In FIG. 5C , the correction values ​​of the four pixels located above, below, left, and right of the dark point defect pixel are corrected to 47, and the correction values ​​of the four closest pixels located diagonally to the dark point defect pixel are corrected to 43.

[0090] In reality, the distance between pixels varies depending on the pixel arrangement of the display panel 20, and therefore the correction value for the pixels surrounding the pixel with the dark point defect can be set appropriately depending on the configuration of the display panel 20. Here, the method of compensating for luminance using eight pixels surrounding the pixel with the dark point defect has been described, but this is not limiting, and luminance may be compensated using seven or fewer pixels, or nine or more pixels. In this case, too, it is preferable to set a higher correction value the closer the pixel is to the pixel with the dark point defect.

[0091] Furthermore, as shown in FIG. 5C , a mark (here, an X) indicating a pixel with a dark point defect can be left in the correction data W (40). In other words, the correction data W (40) can be said to contain address information for the pixel with the dark point defect. This allows not only information about the luminance variation of the display device 10 but also information about the dark point defect to be recorded in the correction data W and stored in the display device 10 itself. Therefore, for example, if this correction method is used in a pre-shipment inspection of a product using the display device 10, the results of the pre-shipment inspection will be recorded in the product as correction data W, which is effective from the perspective of product assurance for users.

[0092] While we have explained the correction method for dark spot defects here, defects that do not turn off (bright spot defects) can also be made less noticeable by using the opposite method. That is, by setting correction values ​​so that the brightness values ​​of the pixels surrounding the bright spot defect are lowered.

[0093] The above is the description of how the correction data W is generated.

[0094] [Display Device Correction Method] Hereinafter, a display device correction method using the correction system 40 shown in FIG. 2 will be described.

[0095] [Correction Process] Fig. 6 is a flowchart of the correction process described below. The flowchart shown in Fig. 6 has steps S01 to S08. The correction process shown in Fig. 6 is an example of a case where imaging is repeatedly performed A times (A is an integer greater than or equal to 1 and less than or equal to the maximum number of gradations of the display device 10) at different gradations, and correction data W is generated based on each imaging data.

[0096] In step S01, the correction process starts.

[0097] In step S02, initialization is performed. Specifically, the number of repetitions is recorded as 1 (n=1).

[0098] In step 03, all pixels of the display panel 20 are displayed at the nth gradation, and an image is captured using the above-described imaging method to obtain the nth image data.

[0099] Specifically, the signal generating unit 42 generates data TD, which is image data of a predetermined gradation, and the timing controller 43 outputs the data TD to the display device 10 and the data CD to the imaging device 44. The imaging device 44 performs imaging multiple times as necessary to capture images of all pixels, and outputs imaging data VD to the correction data generating unit 41.

[0100] In step S04, it is determined whether the predetermined number of times A has been reached (whether n=A). If the predetermined number of times has been reached (yes), the process proceeds to step S06.

[0101] If n is less than A (no) in step S04, the process proceeds to step S05. In step S05, 1 is added to the number of repetitions (i.e., n = n + 1), and the process proceeds to step S03. By repeating this process until n reaches A, it is possible to obtain the first to nth imaging data for the first to nth gradations.

[0102] In step S06, correction data W is generated based on the acquired first to n-th imaging data (i.e., the first to A-th data). The method for generating the correction data W can be found in the description above.

[0103] In step S07, the generated correction data W is output to the display device 10. The display device 10 stores the correction data W in the memory unit MEM via the receiving unit RCV and the interface IF.

[0104] This concludes the explanation of the correction method (correction process).

[0105] [Determination Process] It is preferable to perform a determination process following the correction process. A flowchart of the correction method in this case is shown in Fig. 7. The determination process exemplified below is performed by, for example, the determination unit 46 and the imaging device 44 exemplified in Fig. 2.

[0106] The determination process involves displaying an image on the display device 10 after image correction based on the correction data W, and determining whether the display quality satisfies a predetermined standard. As a result, when this correction method is used for pre-shipment inspection of products, for example, it is possible to prevent products whose display quality does not meet the standard even after correction with the correction data W from being released onto the market.

[0107] The evaluation process can use various conventional methods. For example, different evaluation criteria can be used depending on the product. However, evaluating different products using the same evaluation criteria is extremely effective from the perspective of quality control.

[0108] As the judgment process, it is preferable to use a method in which the modulation transfer function (MTF), which is widely used in camera performance evaluation, is applied to display evaluation. The MTF of a display panel can be measured and evaluated using the edge method. For example, a state in which a thin line is displayed on the display panel is captured using a camera or a two-dimensional luminance system, and a line spread function (LSF) is calculated from the captured image. The obtained LSF is then Fourier transformed to obtain an MTF curve.

[0109] FIG. 8 shows an example of MTF measurement results. The MTF curves are shown for three panels, display panel A, display panel B, and display panel C, in descending order of display quality. In FIG. 8, the vertical axis represents the MTF value (%). The horizontal axis represents spatial frequency in cpp (cycles per pixel). Spatial frequency ranges from greater than 0 to less than 0.5. A spatial frequency of 0.5 represents, for example, a state in which black and white lines are displayed at a one-pixel pitch, equivalent to the state in which the finest pattern is displayed.

[0110] A larger MTF value indicates that an image can be faithfully displayed, that is, the display quality is higher.

[0111] As a method of judgment, for example, it is possible to judge whether or not the MTF value when the spatial frequency is 0.5 exceeds a predetermined threshold value (Vth). By using the MTF value when the finest pattern is displayed as an index of display quality, it can be used as a simple and effective criterion for judgment.

[0112] 8, display panels A and B have MTF values ​​exceeding the threshold value when the spatial frequency is 0.5, and therefore can be determined as non-defective. On the other hand, display panel C has an MTF value that does not reach the threshold value, and therefore can be determined as defective.

[0113] Next, an example of determination processing using the MTF will be described with reference to the flowchart shown in Fig. 9. The flowchart shown in Fig. 9 includes steps S11 to S18.

[0114] In step S11, the process starts.

[0115] In step S12, an MTF image serving as a test image is displayed on the display panel 20, and MTF imaging data is acquired by the imaging device 44.

[0116] The MTF image (test image) may be an image of a white line with a width of one pixel or any of various chart images. As the MTF image, images of various patterns may be used as long as the MTF can be calculated.

[0117] Furthermore, measurements may be performed using not only still images but also moving images as MTF images. By measuring the MTF value using moving images, it is possible to evaluate, for example, the degree of afterimage.

[0118] It is preferable to acquire MTF imaging data at a plurality of locations within the pixel section 21 of the display panel 20. This makes it possible to accurately determine whether a display device is good or bad, even if the display quality is locally low.

[0119] In step S13, an MTF value is calculated based on the MTF imaging data. When MTF values ​​are obtained at multiple locations, the MTF value is calculated for each location, and the lowest value among them can be used as the MTF value.

[0120] In step S14, it is determined whether the MTF value is equal to or greater than a threshold value.

[0121] If the MTF value is equal to or greater than the threshold value in step S14 (yes), the process proceeds to step S16, where the display device 10 is determined to be acceptable (non-defective). Thereafter, the process ends in step S18.

[0122] If the MTF value is less than the threshold value (no in step S14), the process proceeds to step S15, where the display device 10 is determined to be unacceptable (defective). Thereafter, the process ends in step S17.

[0123] This concludes the description of the determination process.

[0124] According to the display device correction system and correction method of one embodiment of the present invention, correction values ​​for all gradations can be set for all pixels of the display device, so that the display quality can be significantly improved even if luminance unevenness due to characteristics of transistors or display elements occurs in the display device. Furthermore, by performing a determination process using the MTF after the correction process, it is possible to effectively prevent products that are determined to be defective even after the correction from being released on the market by a simple method.

[0125] This embodiment mode can be implemented by appropriately combining at least a part thereof with other embodiment modes described in this specification.

[0126] In this embodiment, a configuration example of a display device to which the correction method or the correction system according to one embodiment of the present invention can be applied will be described. The display device exemplified below can be applied to the display panel 20 in Embodiment 1 or the like.

[0127] One embodiment of the present invention is a display device having light-emitting elements (also referred to as light-emitting devices). The display device has two or more light-emitting elements that emit different light colors. Each light-emitting element has a pair of electrodes and an EL layer therebetween. The light-emitting elements are preferably organic EL elements (organic electroluminescent elements). The two or more light-emitting elements that emit different light colors each have an EL layer containing a different light-emitting material. For example, a full-color display device can be realized by having three types of light-emitting elements that emit red (R), green (G), or blue (B) light, respectively.

[0128] When fabricating a display device having multiple light-emitting elements that emit different colors of light, it is necessary to form at least one layer containing a light-emitting material (light-emitting layer) in an island shape. When fabricating a partial or entire EL layer, a method of forming island-shaped organic films by vapor deposition using a shadow mask such as a metal mask is known. However, this method can cause deviations in the shape and position of the island-shaped organic films from the design due to various factors such as the accuracy of the metal mask, misalignment between the metal mask and the substrate, deflection of the metal mask, and spreading of the contours of the deposited film due to vapor scattering, making it difficult to achieve high-definition and high-aperture display devices. Furthermore, during vapor deposition, the contours of the layer can become blurred, resulting in thinning of the edges. In other words, the thickness of the island-shaped light-emitting layer can vary depending on the location. Furthermore, when fabricating large, high-resolution, or high-definition display devices, there is a concern that low dimensional accuracy of the metal mask and deformation due to heat, etc., can reduce manufacturing yield. Therefore, measures have been taken to artificially increase the resolution (also known as pixel density) by adopting special pixel arrangements such as a pentile array.

[0129] In this specification, the term "island-like" refers to a state in which two or more layers formed using the same material in the same process are physically separated. For example, an island-like light-emitting layer refers to a state in which the light-emitting layer is physically separated from an adjacent light-emitting layer.

[0130] In one embodiment of the present invention, an EL layer is processed into a fine pattern by photolithography without using a shadow mask such as a fine metal mask (FMM). This makes it possible to realize a display device with high definition and a large aperture ratio, which have been difficult to achieve until now. Furthermore, since the EL layer can be individually fabricated, a display device with extremely vivid images, high contrast, and high display quality can be realized. Note that, for example, the EL layer may be processed into a fine pattern using both a metal mask and photolithography.

[0131] Furthermore, the EL layer can be partially or entirely separated physically. This can suppress leakage current between adjacent light-emitting elements through a layer shared between the light-emitting elements (also referred to as a common layer). This can prevent crosstalk caused by unintended light emission, thereby realizing a display device with extremely high contrast. In particular, a display device with high current efficiency at low luminance can be realized.

[0132] One embodiment of the present invention can also be a display device that combines a white-emitting light-emitting element and a color filter. In this case, light-emitting elements provided in pixels (subpixels) that emit light of different colors can have the same configuration, and all layers can be common layers. Furthermore, part or all of each EL layer is separated by photolithography. This suppresses leakage current through the common layer, thereby realizing a display device with high contrast. In particular, in an element having a tandem structure in which multiple light-emitting layers are stacked via a highly conductive intermediate layer, leakage current through the intermediate layer can be effectively prevented, thereby realizing a display device that combines high brightness, high definition, and high contrast.

[0133] Furthermore, it is preferable to provide an insulating layer that covers at least the side surfaces of the island-shaped light-emitting layers. The insulating layer may be configured to cover a portion of the top surface of the island-shaped EL layer. The insulating layer is preferably made of a material that has barrier properties against water and oxygen. For example, an inorganic insulating film that is difficult for water or oxygen to diffuse can be used. This suppresses deterioration of the EL layer and realizes a highly reliable display device.

[0134] Furthermore, there is a region (recess) between two adjacent light-emitting elements where the EL layer of either light-emitting element is not provided. When a common electrode, or a common electrode and a common layer, is formed to cover the recess, a phenomenon in which the common electrode is separated by a step at the edge of the EL layer (also called a step discontinuity) may occur, resulting in insulation of the common electrode on the EL layer. Therefore, it is preferable to use a configuration in which the local step located between two adjacent light-emitting elements is filled with a resin layer functioning as a planarization film (also called LFP: Local Filling Planarization). The resin layer functions as a planarization film. This suppresses step discontinuity of the common layer or common electrode, thereby achieving a highly reliable display device.

[0135] A more specific example of the structure of the display device of one embodiment of the present invention will be described below with reference to the drawings.

[0136] 10A is a schematic top view of a display device 100 of one embodiment of the present invention. The display device 100 includes a plurality of light-emitting elements 110R that exhibit red light, a plurality of light-emitting elements 110G that exhibit green light, and a plurality of light-emitting elements 110B that exhibit blue light, over a substrate 101. In FIG. 10A , the symbols R, G, and B are assigned within the light-emitting regions of the light-emitting elements to easily distinguish the light-emitting elements from one another.

[0137] The light emitting elements 110R, 110G, and 110B are arranged in a matrix. Fig. 10A shows a so-called stripe arrangement in which light emitting elements of the same color are arranged in one direction. Note that the arrangement method of the light emitting elements is not limited to this, and arrangement methods such as an S-stripe arrangement, a delta arrangement, a Bayer arrangement, or a zigzag arrangement may also be used, or a pentile arrangement, a diamond arrangement, or the like may also be used.

[0138] As the light-emitting element 110R, the light-emitting element 110G, and the light-emitting element 110B, for example, an OLED (organic light-emitting diode) or a QLED (quantum-dot light-emitting diode) is preferably used. Examples of the light-emitting substance contained in the EL element include a substance that emits fluorescence (fluorescent material), a substance that emits phosphorescence (phosphorescent material), and a substance that exhibits thermally activated delayed fluorescence (thermally activated delayed fluorescence: TADF material). As the light-emitting substance contained in the EL element, not only organic compounds but also inorganic compounds (such as quantum dot materials) can be used.

[0139] 10A also shows a connection electrode 111C that is electrically connected to the common electrode 113. The connection electrode 111C is given a potential (e.g., an anode potential or a cathode potential) to be supplied to the common electrode 113. The connection electrode 111C is provided outside the display area where the light-emitting elements 110R and the like are arranged.

[0140] The connection electrode 111C can be provided along the periphery of the display area. For example, it may be provided along one side of the periphery of the display area, or it may be provided over two or more sides of the periphery of the display area. That is, when the top surface shape of the display area is rectangular, the top surface shape of the connection electrode 111C can be a strip shape (rectangle), an L-shape, a U-shape (square bracket shape), a square shape, or the like.

[0141] 10B and 10C are schematic cross-sectional views corresponding to dashed dotted lines A1-A2 and A3-A4 in Fig. 10A, respectively. Fig. 10B shows a schematic cross-sectional view of light-emitting element 110R, light-emitting element 110G, and light-emitting element 110B, and Fig. 10C shows a schematic cross-sectional view of connection portion 140 where connection electrode 111C and common electrode 113 are connected.

[0142] The light-emitting element 110R has a pixel electrode 111R, an organic layer 112R, a common layer 114, and a common electrode 113. The light-emitting element 110G has a pixel electrode 111G, an organic layer 112G, a common layer 114, and a common electrode 113. The light-emitting element 110B has a pixel electrode 111B, an organic layer 112B, a common layer 114, and a common electrode 113. The common layer 114 and the common electrode 113 are provided in common to the light-emitting element 110R, the light-emitting element 110G, and the light-emitting element 110B.

[0143] The organic layer 112R of the light-emitting element 110R contains a light-emitting organic compound that emits at least red light. The organic layer 112G of the light-emitting element 110G contains a light-emitting organic compound that emits at least green light. The organic layer 112B of the light-emitting element 110B contains a light-emitting organic compound that emits at least blue light. The organic layer 112R, the organic layer 112G, and the organic layer 112B can also be called EL layers, and each contains at least a layer (light-emitting layer) that contains a light-emitting organic compound.

[0144] Hereinafter, when describing matters common to light emitting element 110R, light emitting element 110G, and light emitting element 110B, they may be referred to as light emitting element 110. Similarly, when describing matters common to components distinguished by alphabets, such as organic layer 112R, organic layer 112G, and organic layer 112B, they may be described using symbols without the alphabets.

[0145] The organic layer 112 and the common layer 114 may each independently include one or more of an electron injection layer, an electron transport layer, a hole injection layer, and a hole transport layer. For example, the organic layer 112 may have a stacked structure of a hole injection layer, a hole transport layer, a light-emitting layer, and an electron transport layer from the pixel electrode 111 side, and the common layer 114 may have an electron injection layer.

[0146] The pixel electrode 111R, pixel electrode 111G, and pixel electrode 111B are provided for each light-emitting element. The common electrode 113 and common layer 114 are provided as a continuous layer common to each light-emitting element. A conductive film transmissive to visible light is used for either the pixel electrode or the common electrode 113, and a conductive film reflective to visible light is used for the other. By making each pixel electrode transmissive and the common electrode 113 reflective, a bottom-emission display device can be obtained. Conversely, by making each pixel electrode reflective and the common electrode 113 transmissive, a top-emission display device can be obtained. Note that by making both the pixel electrodes and the common electrode 113 transmissive, a dual-emission display device can be obtained.

[0147] A protective layer 121 is provided on the common electrode 113 to cover the light emitting elements 110R, 110G, and 110B. The protective layer 121 has a function of preventing impurities such as water from diffusing from above into each light emitting element.

[0148] The edge of the pixel electrode 111 preferably has a tapered shape. When the edge of the pixel electrode has a tapered shape, the portion of the organic layer 112 provided along the side surface of the pixel electrode also has a tapered shape. By tapering the side surface of the pixel electrode, the coverage of the EL layer provided along the side surface of the pixel electrode can be improved. Furthermore, by tapering the side surface of the pixel electrode, foreign matter (for example, dust or particles) during the manufacturing process can be easily removed by a process such as cleaning, which is preferable.

[0149] In this specification and the like, the term "tapered shape" refers to a shape in which at least a part of a side surface of a structure is inclined with respect to a substrate surface. For example, it is preferable that the structure has a region in which the angle between the inclined side surface and the substrate surface (also referred to as the taper angle) is less than 90°.

[0150] The organic layer 112 is processed into an island shape by photolithography. As a result, the angle between the top surface and the side surface of the organic layer 112 at its edge is close to 90 degrees. On the other hand, an organic film formed using a fine metal mask (FMM) or the like tends to become gradually thinner as it approaches the edge. For example, the top surface is formed in a sloped shape over a range of 1 μm to 10 μm from the edge, making it difficult to distinguish between the top surface and the side surface.

[0151] Between two adjacent light emitting elements, an insulating layer 125, a resin layer 126, and a layer 128 are provided.

[0152] Between two adjacent light-emitting elements, the side surfaces of the organic layers 112 face each other with the resin layer 126 interposed therebetween. The resin layer 126 is located between the two adjacent light-emitting elements and is provided so as to fill the ends of each organic layer 112 and the region between the two organic layers 112. The resin layer 126 has a smooth, convex upper surface, and a common layer 114 and a common electrode 113 are provided covering the upper surface of the resin layer 126.

[0153] The resin layer 126 functions as a planarization film that fills in a step located between two adjacent light-emitting elements. By providing the resin layer 126, it is possible to prevent a phenomenon (also called step disconnection) in which the common electrode 113 is divided by a step at the end of the organic layer 112, and the common electrode on the organic layer 112 is isolated. The resin layer 126 can also be called LFP (Local Filling Planarization).

[0154] An insulating layer containing an organic material can be suitably used as the resin layer 126. For example, acrylic resin, polyimide resin, epoxy resin, imide resin, polyamide resin, polyimideamide resin, silicone resin, siloxane resin, benzocyclobutene resin, phenolic resin, precursors of these resins, etc. can be used as the resin layer 126. Alternatively, organic materials such as polyvinyl alcohol (PVA), polyvinyl butyral, polyvinylpyrrolidone, polyethylene glycol, polyglycerin, pullulan, water-soluble cellulose, or alcohol-soluble polyamide resin can be used as the resin layer 126.

[0155] Furthermore, a photosensitive resin can be used as the resin layer 126. A photoresist can be used as the photosensitive resin. The photosensitive resin can be a positive-type material or a negative-type material.

[0156] The resin layer 126 may contain a material that absorbs visible light. For example, the resin layer 126 itself may be made of a material that absorbs visible light, or the resin layer 126 may contain a pigment that absorbs visible light. For example, the resin layer 126 may be a resin that can be used as a color filter that transmits red, blue, or green light and absorbs other light, or a resin that contains carbon black as a pigment and functions as a black matrix.

[0157] The insulating layer 125 is provided in contact with the side surface of the organic layer 112. The insulating layer 125 is also provided to cover the upper end portion of the organic layer 112. A portion of the insulating layer 125 is provided in contact with the upper surface of the substrate 101.

[0158] The insulating layer 125 is located between the resin layer 126 and the organic layer 112, and functions as a protective film for preventing the resin layer 126 from contacting the organic layer 112. If the organic layer 112 and the resin layer 126 come into contact with each other, the organic layer 112 may be dissolved by an organic solvent or the like used when forming the resin layer 126. Therefore, as shown in this embodiment, by providing the insulating layer 125 between the organic layer 112 and the resin layer 126, it is possible to protect the side surfaces of the organic layer 112.

[0159] The insulating layer 125 can be an insulating layer containing an inorganic material. For example, an inorganic insulating film such as an oxide insulating film, a nitride insulating film, an oxynitride insulating film, or a nitride oxide insulating film can be used for the insulating layer 125. The insulating layer 125 may have a single-layer structure or a stacked-layer structure. Examples of oxide insulating films include a silicon oxide film, an aluminum oxide film, a magnesium oxide film, an indium gallium zinc oxide film, a gallium oxide film, a germanium oxide film, an yttrium oxide film, a zirconium oxide film, a lanthanum oxide film, a neodymium oxide film, a hafnium oxide film, and a tantalum oxide film. Examples of nitride insulating films include a silicon nitride film and an aluminum nitride film. Examples of oxynitride insulating films include a silicon oxynitride film and an aluminum oxynitride film. Examples of nitride oxide insulating films include a silicon nitride oxide film and an aluminum nitride oxide film. In particular, by using an inorganic insulating film such as a metal oxide film, an aluminum oxide film, or a silicon oxide film formed by an ALD method as the insulating layer 125, an insulating layer 125 with few pinholes and excellent protection of the EL layer can be formed.

[0160] In this specification and elsewhere, an oxynitride refers to a material whose composition contains more oxygen than nitrogen, and a nitride oxide refers to a material whose composition contains more nitrogen than oxygen. For example, silicon oxynitride refers to a material whose composition contains more oxygen than nitrogen, and silicon nitride oxide refers to a material whose composition contains more nitrogen than oxygen.

[0161] The insulating layer 125 can be formed by a sputtering method, a CVD method, a PLD method, an ALD method, or the like. The insulating layer 125 is preferably formed by an ALD method because it has good coverage.

[0162] Furthermore, a reflective film (e.g., a metal film containing one or more selected from silver, palladium, copper, titanium, aluminum, etc.) may be provided between the insulating layer 125 and the resin layer 126, so that the light emitted from the light-emitting layer is reflected by the reflective film, thereby improving the light extraction efficiency.

[0163] The layer 128 is a remaining portion of a protective layer (also referred to as a mask layer or a sacrificial layer) for protecting the organic layer 112 during etching of the organic layer 112. The layer 128 can be made of a material that can be used for the insulating layer 125. In particular, it is preferable to use the same material for the layer 128 and the insulating layer 125 because a common processing device or the like can be used for both.

[0164] In particular, inorganic insulating films such as metal oxide films such as aluminum oxide films and hafnium oxide films, or silicon oxide films formed by the ALD method have few pinholes and therefore have an excellent function of protecting the EL layer, and can be suitably used for the insulating layer 125 and the layer 128.

[0165] A protective layer 121 is provided to cover the common electrode 113 .

[0166] The protective layer 121 may have, for example, a single-layer structure or a stacked structure including at least an inorganic insulating film. Examples of the inorganic insulating film include oxide films such as a silicon oxide film, a silicon oxynitride film, a silicon nitride oxide film, a silicon nitride film, an aluminum oxide film, an aluminum oxynitride film, and a hafnium oxide film, as well as oxynitride films, nitride oxide films, and nitride films. Alternatively, the protective layer 121 may be made of a semiconductor material or a conductive material such as indium gallium oxide, indium zinc oxide, indium tin oxide, or indium gallium zinc oxide.

[0167] The protective layer 121 may also be a laminated film of an inorganic insulating film and an organic insulating film. For example, a configuration in which an organic insulating film is sandwiched between a pair of inorganic insulating films is preferable. Furthermore, it is preferable that the organic insulating film functions as a planarizing film. This allows the upper surface of the organic insulating film to be flat, improving the coverage of the inorganic insulating film thereon and enhancing the barrier properties. Furthermore, since the upper surface of the protective layer 121 is flat, when a structure (e.g., a color filter, a touch sensor electrode, a lens array, etc.) is provided above the protective layer 121, the influence of uneven shapes caused by the structure below can be reduced, which is preferable.

[0168] 10C shows a connection portion 140 where the connection electrode 111C and the common electrode 113 are electrically connected. In the connection portion 140, an opening is provided in the insulating layer 125 and the resin layer 126 above the connection electrode 111C. The connection electrode 111C and the common electrode 113 are electrically connected through the opening.

[0169] 10C shows a connection portion 140 where the connection electrode 111C and the common electrode 113 are electrically connected, but the common electrode 113 may be provided on the connection electrode 111C via the common layer 114. In particular, when a carrier injection layer is used for the common layer 114, the electrical resistivity of the material used for the common layer 114 is sufficiently low and the common layer 114 can be formed thin, so that there is often no problem even if the common layer 114 is located at the connection portion 140. This allows the common electrode 113 and the common layer 114 to be formed using the same masking mask, thereby reducing manufacturing costs.

[0170] The above is a description of an example of the configuration of the display device.

[0171] [Pixel Layout] The following mainly describes pixel layouts that are different from that shown in Fig. 10A. There are no particular limitations on the arrangement of light-emitting elements (sub-pixels), and various methods can be applied.

[0172] Examples of the top surface shape of the sub-pixel include a triangle, a quadrangle (including a rectangle and a square), a polygon such as a pentagon, a polygon with rounded corners, an ellipse, a circle, etc. Here, the top surface shape of the sub-pixel corresponds to the top surface shape of the light-emitting region of the light-emitting element.

[0173] An S-stripe arrangement is applied to the pixel 150 shown in Fig. 11A. The pixel 150 shown in Fig. 11A is composed of three sub-pixels, namely, light-emitting elements 110a, 110b, and 110c. For example, the light-emitting element 110a may be a blue light-emitting element, the light-emitting element 110b may be a red light-emitting element, and the light-emitting element 110c may be a green light-emitting element.

[0174] The pixel 150 shown in FIG. 11B includes a light-emitting element 110a having a generally trapezoidal top surface shape with rounded corners, a light-emitting element 110b having a generally triangular top surface shape with rounded corners, and a light-emitting element 110c having a generally rectangular or hexagonal top surface shape with rounded corners. Furthermore, the light-emitting element 110a has a larger light-emitting area than the light-emitting element 110b. In this manner, the shape and size of each light-emitting element can be determined independently. For example, the more reliable the light-emitting element, the smaller the size can be. For example, the light-emitting element 110a may be a green light-emitting element, the light-emitting element 110b may be a red light-emitting element, and the light-emitting element 110c may be a blue light-emitting element.

[0175] The pixels 124a and 124b shown in Fig. 11C are arranged in a Pentile arrangement. Fig. 11C shows an example in which a pixel 124a having light-emitting elements 110a and 110b and a pixel 124b having light-emitting elements 110b and 110c are arranged alternately. For example, the light-emitting element 110a may be a red light-emitting element, the light-emitting element 110b may be a green light-emitting element, and the light-emitting element 110c may be a blue light-emitting element.

[0176] 11D and 11E are arranged in a delta configuration. The pixel 124a has two light-emitting elements (light-emitting elements 110a and 110b) in the top row (first row) and one light-emitting element (light-emitting element 110c) in the bottom row (second row). The pixel 124b has one light-emitting element (light-emitting element 110c) in the top row (first row) and two light-emitting elements (light-emitting elements 110a and 110b) in the bottom row (second row). For example, the light-emitting element 110a may be a red light-emitting element, the light-emitting element 110b may be a green light-emitting element, and the light-emitting element 110c may be a blue light-emitting element.

[0177] FIG. 11D shows an example in which each light-emitting element has a substantially rectangular top surface shape with rounded corners, and FIG. 11E shows an example in which each light-emitting element has a circular top surface shape.

[0178] 11F shows an example in which light-emitting elements of each color are arranged in a zigzag pattern. Specifically, when viewed from above, the positions of the upper edges of two light-emitting elements arranged in a column (e.g., light-emitting elements 110a and 110b, or light-emitting elements 110b and 110c) are offset. For example, light-emitting element 110a may be a red light-emitting element, light-emitting element 110b may be a green light-emitting element, and light-emitting element 110c may be a blue light-emitting element.

[0179] In photolithography, the finer the pattern to be processed, the more significant the effect of light diffraction becomes. This reduces the fidelity of the photomask pattern when it is transferred by exposure, making it difficult to process the resist mask into the desired shape. Therefore, even if the photomask pattern is rectangular, it is likely to have rounded corners. As a result, the top surface shape of the light-emitting element may be polygonal with rounded corners, elliptical, circular, or the like.

[0180] Furthermore, in a manufacturing method of a display panel according to one embodiment of the present invention, the EL layer is processed into an island shape using a resist mask. The resist film formed on the EL layer needs to be cured at a temperature lower than the heat resistance temperature of the EL layer. Therefore, depending on the heat resistance temperature of the material for the EL layer and the curing temperature of the resist material, the resist film may not be cured sufficiently. A resist film that is not cured sufficiently may have a shape that is different from the desired shape during processing. As a result, the top surface shape of the EL layer may become a polygon with rounded corners, an ellipse, a circle, or the like. For example, when a resist mask with a square top surface shape is formed, a resist mask with a circular top surface shape may be formed, resulting in a circular top surface shape of the EL layer.

[0181] In order to form the top surface of the EL layer into a desired shape, a technique for correcting a mask pattern in advance (OPC (Optical Proximity Correction) technique) may be used so that the design pattern and the transfer pattern coincide with each other. Specifically, the OPC technique adds a correction pattern to the corners of figures on the mask pattern.

[0182] This concludes the description of the pixel layout.

[0183] This embodiment mode can be implemented by appropriately combining at least a part thereof with other embodiment modes described in this specification.

[0184] Embodiment 3 In this embodiment, a configuration example of a display device that can be applied to a correction method or correction system according to one embodiment of the present invention will be described.

[0185] The display device of this embodiment can be used in electronic devices with relatively large screens, such as television sets, desktop or notebook personal computers, computer monitors, digital signage, large game machines such as pachinko machines, as well as display units of digital cameras, digital video cameras, digital photo frames, mobile phones, portable game machines, smartphones, wristwatch-type terminals, tablet terminals, personal digital assistants, and sound reproduction devices.

[0186] [Display Device 400] FIG. 12 shows a perspective view of display device 400, and FIG. 13A shows a cross-sectional view of display device 400. As shown in FIG.

[0187] The display device 400 has a configuration in which a substrate 452 and a substrate 451 are bonded together. In Fig. 12, the substrate 452 is clearly indicated by a dashed line.

[0188] The display device 400 includes a display portion 462, a circuit 464, wiring 465, and the like. Fig. 12 shows an example in which an IC 473 and an FPC 472 are mounted on the display device 400. Therefore, the configuration shown in Fig. 12 can also be considered as a display module including the display device 400, an IC (integrated circuit), and an FPC.

[0189] The circuit 464 can be, for example, a scanning line driver circuit.

[0190] The wiring 465 has a function of supplying signals and power to the display portion 462 and the circuit 464. The signals and power are input to the wiring 465 from the outside via the FPC 472 or input to the wiring 465 from the IC 473.

[0191] 12 shows an example in which an IC 473 is provided on a substrate 451 by a chip-on-glass (COG) method, a chip-on-film (COF) method, or the like. The IC 473 can be, for example, an IC having a scanning line driver circuit or a signal line driver circuit. The display device 400 and the display module may not include an IC. Alternatively, the IC may be mounted on an FPC by a COF method or the like.

[0192] 13A shows an example of a cross section of the display device 400, where a part of a region including the FPC 472, a part of the circuit 464, a part of the display portion 462, and a part of a region including a connection portion are cut away. In FIG. 13A, an example of a cross section of the display portion 462, particularly a region including the light-emitting element 430b that emits green light and the light-emitting element 430c that emits blue light, is cut away.

[0193] The display device 400 shown in FIG. 13A includes the transistor 202, the transistor 210, the light-emitting element 430b, the light-emitting element 430c, and the like between a substrate 453 and a substrate 454.

[0194] The light-emitting element described in Embodiment 2 can be applied to the light-emitting element 430b and the light-emitting element 430c.

[0195] Here, when a pixel of a display device has three types of subpixels having light-emitting elements that emit different colors, the three subpixels include subpixels of three colors of red (R), green (G), and blue (B), or subpixels of three colors of yellow (Y), cyan (C), and magenta (M), etc. When a pixel of a display device has four subpixels, the four subpixels include subpixels of four colors of R, G, B, and white (W), or subpixels of four colors of R, G, B, and Y, etc.

[0196] The substrate 454 and the protective layer 416 are bonded to each other via an adhesive layer 442. The adhesive layer 442 is provided to overlap the light-emitting element 430b and the light-emitting element 430c, and a solid sealing structure is applied to the display device 400.

[0197] The light-emitting elements 430b and 430c each include a conductive layer 411a, a conductive layer 411b, and a conductive layer 411c as pixel electrodes. The conductive layer 411b is reflective to visible light and functions as a reflective electrode. The conductive layer 411c is transparent to visible light and functions as an optical adjustment layer.

[0198] The conductive layer 411a is connected to a conductive layer 222b of the transistor 210 through an opening provided in the insulating layer 214. The transistor 210 has a function of controlling the driving of a light-emitting element.

[0199] An EL layer 412G or an EL layer 412B is provided to cover the pixel electrode. An insulating layer 421 is provided in contact with the side surfaces of the EL layer 412G and the EL layer 412B, and a resin layer 422 is provided to fill the recesses in the insulating layer 421. A layer 424 is provided between the EL layer 412G and the insulating layer 421, and between the EL layer 412B and the insulating layer 421. A common layer 414, a common electrode 413, and a protective layer 416 are provided to cover the EL layer 412G and the EL layer 412B.

[0200] Light emitted from the light-emitting element is emitted toward the substrate 454. The substrate 454 is preferably made of a material that is highly transparent to visible light.

[0201] The transistor 202 and the transistor 210 are both formed over a substrate 453. These transistors can be manufactured using the same material and through the same process.

[0202] The substrate 453 and the insulating layer 212 are bonded together by an adhesive layer 455 .

[0203] The display device 400 is manufactured by first bonding a substrate 454 provided with the insulating layer 212, the transistors, the light-emitting elements, and the like to the substrate 454 with an adhesive layer 442. The substrate 453 is then attached to the exposed surface of the substrate 454, and the components formed on the substrate 454 are transferred to the substrate 453. The substrate 453 and the substrate 454 are preferably flexible. This can increase the flexibility of the display device 400.

[0204] The insulating layer 212 can be formed using the inorganic insulating film that can be used for the insulating layer 211 and the insulating layer 215 .

[0205] A connection portion 204 is provided in a region of the substrate 453 where the substrate 454 does not overlap. In the connection portion 204, a wiring 465 is electrically connected to an FPC 472 via a conductive layer 466 and a connection layer 242. The conductive layer 466 can be obtained by processing the same conductive film as the pixel electrode. This allows the connection portion 204 and the FPC 472 to be electrically connected via the connection layer 242.

[0206] The transistor 202 and the transistor 210 each include a conductive layer 221 functioning as a gate, an insulating layer 211 functioning as a gate insulating layer, a semiconductor layer 231 including a channel formation region 231i and a pair of low-resistance regions 231n, a conductive layer 222a connected to one of the pair of low-resistance regions 231n, a conductive layer 222b connected to the other of the pair of low-resistance regions 231n, an insulating layer 225 functioning as a gate insulating layer, a conductive layer 223 functioning as a gate, and an insulating layer 215 covering the conductive layer 223. The insulating layer 211 is located between the conductive layer 221 and the channel formation region 231i. The insulating layer 225 is located between the conductive layer 223 and the channel formation region 231i.

[0207] The conductive layer 222a and the conductive layer 222b are each connected to the low-resistance region 231n through an opening provided in the insulating layer 215. One of the conductive layer 222a and the conductive layer 222b functions as a source, and the other functions as a drain.

[0208] 13A shows an example in which the top surface and side surfaces of the semiconductor layer are covered with an insulating layer 225. The conductive layer 222a and the conductive layer 222b are connected to the low-resistance region 231n through openings provided in the insulating layer 225 and the insulating layer 215, respectively.

[0209] 13B , the insulating layer 225 overlaps with the channel formation region 231i of the semiconductor layer 231 but does not overlap with the low-resistance region 231n. For example, the insulating layer 225 is processed using the conductive layer 223 as a mask, thereby manufacturing the structure shown in FIG. 13B . In FIG. 13B , the insulating layer 215 is provided to cover the insulating layer 225 and the conductive layer 223, and the conductive layer 222a and the conductive layer 222b are connected to the low-resistance region 231n through openings in the insulating layer 215. Furthermore, an insulating layer 218 may be provided to cover the transistor.

[0210] The structure of the transistor included in the display device of this embodiment is not particularly limited. For example, a planar transistor, a staggered transistor, an inverted staggered transistor, or the like can be used. Furthermore, either a top-gate transistor or a bottom-gate transistor structure may be used. Alternatively, gates may be provided above and below a semiconductor layer in which a channel is formed.

[0211] The transistor 202 and the transistor 210 have a structure in which a semiconductor layer in which a channel is formed is sandwiched between two gates. The two gates may be connected and the same signal may be supplied to drive the transistor. Alternatively, the threshold voltage of the transistor may be controlled by applying a potential for controlling the threshold voltage to one of the two gates and a potential for driving to the other.

[0212] The crystallinity of a semiconductor material used for a semiconductor layer of a transistor is not particularly limited, and any of an amorphous semiconductor, a single-crystal semiconductor, and a semiconductor having crystallinity other than single crystal (a microcrystalline semiconductor, a polycrystalline semiconductor, or a semiconductor having a crystalline region in part) may be used. The use of a single-crystal semiconductor or a crystalline semiconductor is preferable because it can suppress deterioration of transistor characteristics.

[0213] The semiconductor layer of the transistor preferably includes a metal oxide (also referred to as an oxide semiconductor). That is, the display device of this embodiment preferably includes a transistor using a metal oxide for a channel formation region (hereinafter referred to as an OS transistor).

[0214] The band gap of the metal oxide used for the semiconductor layer of the transistor is preferably 2 eV or more, more preferably 2.5 eV or more. Use of a metal oxide with a wide band gap can reduce the off-state current of the OS transistor.

[0215] The metal oxide preferably contains at least indium or zinc, and more preferably contains indium and zinc. For example, the metal oxide preferably contains indium, M (wherein M is one or more selected from gallium, aluminum, yttrium, tin, silicon, boron, copper, vanadium, beryllium, titanium, iron, nickel, germanium, zirconium, molybdenum, lanthanum, cerium, neodymium, hafnium, tantalum, tungsten, magnesium, and cobalt), and zinc.

[0216] Alternatively, the semiconductor layer of the transistor may contain silicon, such as amorphous silicon or crystalline silicon (such as low-temperature polysilicon or single-crystal silicon).

[0217] The transistors included in the circuit 464 may have the same structure as or different from the transistors included in the display portion 462. The transistors included in the circuit 464 may all have the same structure or may have two or more types of structures. Similarly, the transistors included in the display portion 462 may all have the same structure or may have two or more types of structures.

[0218] At least one insulating layer covering the transistor is preferably made of a material that is resistant to the diffusion of impurities such as water and hydrogen. This allows the insulating layer to function as a barrier layer. With this structure, it is possible to effectively prevent impurities from diffusing into the transistor from the outside, thereby improving the reliability of the display device.

[0219] It is preferable to use an inorganic insulating film for each of the insulating layers 211, 212, 215, 218, and 225. Examples of the inorganic insulating film that can be used include a silicon nitride film, a silicon oxynitride film, a silicon oxide film, a silicon nitride oxide film, an aluminum oxide film, and an aluminum nitride film. Alternatively, a hafnium oxide film, an yttrium oxide film, a zirconium oxide film, a gallium oxide film, a tantalum oxide film, a magnesium oxide film, a lanthanum oxide film, a cerium oxide film, and a neodymium oxide film may also be used. Two or more of the above-described inorganic insulating films may be stacked.

[0220] An organic insulating film is suitable for the insulating layer 214 that functions as a planarizing layer. Materials that can be used for the organic insulating film include acrylic resin, polyimide resin, epoxy resin, polyamide resin, polyimideamide resin, siloxane resin, benzocyclobutene resin, phenol resin, and precursors of these resins.

[0221] Various optical members can be arranged along the inner or outer surface of substrate 454. Examples of optical members include a light-shielding layer, a polarizing plate, a retardation plate, a light diffusion layer (such as a diffusion film), an anti-reflection layer, a microlens array, and a light-collecting film. In addition, an antistatic film that suppresses the adhesion of dust, a water-repellent film that makes it difficult for dirt to adhere, a hard coat film that suppresses scratches caused by use, an impact absorbing layer, etc. may be arranged on the outer surface of substrate 454.

[0222] By providing the protective layer 416 that covers the light-emitting element, impurities such as water can be prevented from entering the light-emitting element, and the reliability of the light-emitting element can be improved.

[0223] 13A shows a connection portion 228. The common electrode 413 and a wiring are electrically connected at the connection portion 228. FIG. 13A shows an example in which the same layered structure as that of the pixel electrode is applied to the wiring.

[0224] The substrate 453 and the substrate 454 can each be made of glass, quartz, ceramics, sapphire, resin, metal, alloy, semiconductor, or the like. A material that transmits light is used for the substrate on the side from which light from the light-emitting element is extracted. When a flexible material is used for the substrate 453 and the substrate 454, the flexibility of the display device can be increased. Alternatively, a polarizing plate may be used for the substrate 453 or the substrate 454.

[0225] The substrates 453 and 454 can each be made of a polyester resin such as polyethylene terephthalate (PET) or polyethylene naphthalate (PEN), a polyacrylonitrile resin, an acrylic resin, a polyimide resin, a polymethyl methacrylate resin, a polycarbonate (PC) resin, a polyethersulfone (PES) resin, a polyamide resin (nylon, aramid, etc.), a polysiloxane resin, a cycloolefin resin, a polystyrene resin, a polyamideimide resin, a polyurethane resin, a polyvinyl chloride resin, a polyvinylidene chloride resin, a polypropylene resin, a polytetrafluoroethylene (PTFE) resin, an ABS resin, or a cellulose nanofiber. One or both of the substrates 453 and 454 may be made of glass having a thickness sufficient to provide flexibility.

[0226] The adhesive layer 442 can be made of various curable adhesives, such as a photo-curable adhesive (e.g., an ultraviolet curable adhesive), a reactive curable adhesive, a thermosetting adhesive, or an anaerobic adhesive. Examples of such adhesives include epoxy resin, acrylic resin, silicone resin, phenolic resin, polyimide resin, imide resin, PVC (polyvinyl chloride) resin, PVB (polyvinyl butyral) resin, and EVA (ethylene vinyl acetate) resin. In particular, a material with low moisture permeability, such as epoxy resin, is preferable. Alternatively, a two-component resin may be used. Alternatively, an adhesive sheet or the like may be used.

[0227] The connection layer 242 may be an anisotropic conductive film (ACF), an anisotropic conductive paste (ACP), or the like.

[0228] Materials that can be used for conductive layers such as the gate, source, and drain of a transistor, as well as various wirings and electrodes that constitute a display device include metals such as aluminum, titanium, chromium, nickel, copper, yttrium, zirconium, molybdenum, silver, tantalum, and tungsten, and alloys containing these metals as main components, etc. Films containing these materials can be used as a single layer or a stacked layer structure.

[0229] Examples of light-transmitting conductive materials include conductive oxides such as indium oxide, indium tin oxide, indium zinc oxide, zinc oxide, and zinc oxide containing gallium, or graphene. Alternatively, metal materials such as gold, silver, platinum, magnesium, nickel, tungsten, chromium, molybdenum, iron, cobalt, copper, palladium, and titanium, or alloy materials containing such metal materials, can be used. Alternatively, nitrides of such metal materials (e.g., titanium nitride) can be used. When using metal materials or alloy materials (or their nitrides), it is preferable to thin them sufficiently to ensure light-transmitting properties. A stacked film of the above materials can also be used as the conductive layer. For example, a stacked film of an alloy of silver and magnesium and indium tin oxide is preferable because it can enhance conductivity. These materials can also be used for conductive layers such as various wirings and electrodes constituting a display device, and for conductive layers (conductive layers functioning as pixel electrodes or common electrodes) of light-emitting elements.

[0230] Examples of insulating materials that can be used for each insulating layer include resins such as acrylic resin and epoxy resin, and inorganic insulating materials such as silicon oxide, silicon oxynitride, silicon nitride oxide, silicon nitride, and aluminum oxide.

[0231] This embodiment mode can be implemented by appropriately combining at least a part thereof with other embodiment modes described in this specification.

[0232] Embodiment 4 In this embodiment, another structural example of a display device that can be applied to the correction method or correction system of one embodiment of the present invention will be described.

[0233] The display panel of this embodiment can be a high-resolution display panel. For example, the display device of one embodiment of the present invention can be used for a display portion of a wristwatch-type or bracelet-type information terminal (wearable device), a VR device such as a head-mounted display, or a head-mountable wearable device such as a glasses-type AR device.

[0234] 14A shows a perspective view of a display module 280. The display module 280 includes a display device 200A and an FPC 290. Note that the display panel included in the display module 280 is not limited to the display device 200A, and may be any of display devices 200B to 200F described below.

[0235] The display module 280 has a substrate 291 and a substrate 292. The display module 280 has a display unit 281. The display unit 281 is an area for displaying an image.

[0236] 14B is a perspective view schematically illustrating the configuration on the substrate 291 side. A circuit portion 282, a pixel circuit portion 283 on the circuit portion 282, and a pixel portion 284 on the pixel circuit portion 283 are stacked on the substrate 291. A terminal portion 285 for connecting to the FPC 290 is provided in a portion of the substrate 291 that does not overlap with the pixel portion 284. The terminal portion 285 and the circuit portion 282 are electrically connected by a wiring portion 286 composed of a plurality of wirings.

[0237] The pixel section 284 has a plurality of periodically arranged pixels 284a. An enlarged view of one pixel 284a is shown on the right side of Fig. 14B. The pixel 284a has a light-emitting element 110R that emits red light, a light-emitting element 110G that emits green light, and a light-emitting element 110B that emits blue light.

[0238] The pixel circuit portion 283 has a plurality of pixel circuits 283a arranged periodically. Each pixel circuit 283a is a circuit that controls the light emission of three light-emitting devices included in one pixel 284a. One pixel circuit 283a may be configured to have three circuits that control the light emission of one light-emitting device. For example, the pixel circuit 283a may be configured to have at least one selection transistor, one current control transistor (drive transistor), and a capacitor for each light-emitting device. In this case, a gate signal is input to the gate of the selection transistor, and a source signal is input to the source. This realizes an active matrix display panel.

[0239] The circuit portion 282 includes a circuit for driving each pixel circuit 283a of the pixel circuit portion 283. For example, it is preferable that the circuit portion 282 includes one or both of a gate line driver circuit and a source line driver circuit. In addition, the circuit portion 282 may include at least one of an arithmetic circuit, a memory circuit, a power supply circuit, and the like. Furthermore, a transistor provided in the circuit portion 282 may constitute a part of the pixel circuit 283a. That is, the pixel circuit 283a may be composed of a transistor included in the pixel circuit portion 283 and a transistor included in the circuit portion 282.

[0240] The FPC 290 functions as wiring for supplying a video signal, a power supply potential, and the like from the outside to the circuit portion 282. An IC may be mounted on the FPC 290.

[0241] The display module 280 can be configured such that one or both of the pixel circuit unit 283 and the circuit unit 282 are provided overlapping below the pixel unit 284, thereby enabling the aperture ratio (effective display area ratio) of the display unit 281 to be extremely high. For example, the aperture ratio of the display unit 281 can be 40% or more and less than 100%, preferably 50% or more and 95% or less, and more preferably 60% or more and 95% or less. Furthermore, the pixels 284a can be arranged at an extremely high density, enabling the resolution of the display unit 281 to be extremely high. For example, it is preferable that the pixels 284a be arranged in the display unit 281 at a resolution of 2000 ppi or more, preferably 3000 ppi or more, more preferably 5000 ppi or more, and even more preferably 6000 ppi or more, and 20,000 ppi or less, or 30,000 ppi or less.

[0242] Because such a display module 280 has extremely high resolution, it can be suitably used in VR devices such as head-mounted displays, or in glasses-type AR devices. For example, even in a configuration in which the display unit of the display module 280 is viewed through lenses, the display module 280 has an extremely high-resolution display unit 281, so even when the display unit is enlarged with lenses, the pixels are not visible, allowing for a highly immersive display. Furthermore, the display module 280 is not limited to this, and can be suitably used in electronic devices with relatively small display units. For example, it can be suitably used in the display unit of a wearable electronic device such as a wristwatch.

[0243] [Display Device 200A] The display device 200A shown in FIG. 15 includes a substrate 301, light-emitting elements 110R, 110G, and 110B, a capacitor 240, and a transistor 310.

[0244] Substrate 301 corresponds to substrate 291 in FIGS. 14A and 14B.

[0245] The transistor 310 has a channel formation region in a substrate 301. The substrate 301 can be, for example, a semiconductor substrate such as a single crystal silicon substrate. The transistor 310 includes a part of the substrate 301, a conductive layer 311, a low-resistance region 312, an insulating layer 313, and an insulating layer 314. The conductive layer 311 functions as a gate electrode. The insulating layer 313 is located between the substrate 301 and the conductive layer 311 and functions as a gate insulating layer. The low-resistance region 312 is a region in which the substrate 301 is doped with impurities and functions as one of a source and a drain. The insulating layer 314 is provided to cover a side surface of the conductive layer 311.

[0246] An element isolation layer 315 is provided between two adjacent transistors 310 so as to be embedded in the substrate 301 .

[0247] In addition, an insulating layer 261 is provided to cover the transistor 310 , and a capacitor 240 is provided over the insulating layer 261 .

[0248] The capacitor 240 has a conductive layer 241, a conductive layer 245, and an insulating layer 243 located therebetween. The conductive layer 241 functions as one electrode of the capacitor 240, the conductive layer 245 functions as the other electrode of the capacitor 240, and the insulating layer 243 functions as a dielectric of the capacitor 240.

[0249] The conductive layer 241 is provided over the insulating layer 261 and is buried in the insulating layer 254. The conductive layer 241 is electrically connected to one of the source and drain of the transistor 310 by a plug 271 buried in the insulating layer 261. The insulating layer 243 is provided to cover the conductive layer 241. The conductive layer 245 is provided in a region overlapping with the conductive layer 241 with the insulating layer 243 interposed therebetween.

[0250] An insulating layer 255a is provided to cover the capacitor 240, an insulating layer 255b is provided over the insulating layer 255a, and an insulating layer 255c is provided over the insulating layer 255b.

[0251] An inorganic insulating film can be preferably used for each of the insulating layers 255a, 255b, and 255c. For example, it is preferable to use a silicon oxide film for the insulating layer 255a and the insulating layer 255c, and a silicon nitride film for the insulating layer 255b. This allows the insulating layer 255b to function as an etching protection film. In this embodiment, an example is shown in which part of the insulating layer 255c is etched to form a recess, but the insulating layer 255c does not necessarily have to have a recess.

[0252] The light-emitting elements 110R, 110G, and 110B are provided over the insulating layer 255c. The description in Embodiment 2 can be referred to for the structures of the light-emitting elements 110R, 110G, and 110B.

[0253] In the display device 200A, a separate light-emitting device is fabricated for each emitted color, resulting in minimal change in chromaticity between low-luminance and high-luminance emission. Furthermore, because the organic layers 112R, 112G, and 112B are spaced apart from one another, crosstalk between adjacent subpixels can be suppressed even in a high-resolution display panel. This allows for the realization of a high-resolution, high-quality display panel.

[0254] In the region between adjacent light emitting elements, an insulating layer 125, a resin layer 126, and a layer 128 are provided.

[0255] The pixel electrode 111R, pixel electrode 111G, and pixel electrode 111B of the light-emitting element are electrically connected to one of the source and drain of the transistor 310 via a plug 256 embedded in the insulating layers 255a, 255b, and 255c, a conductive layer 241 embedded in the insulating layer 254, and a plug 271 embedded in the insulating layer 261. The height of the top surface of the insulating layer 255c and the height of the top surface of the plug 256 are the same or approximately the same. Various conductive materials can be used for the plug.

[0256] A protective layer 121 is provided on the light emitting elements 110R, 110G, and 110B. A substrate 170 is attached to the protective layer 121 with an adhesive layer 171.

[0257] There is no insulating layer covering the upper end of each pixel electrode 111 between two adjacent pixel electrodes 111. This allows the distance between adjacent light-emitting elements to be extremely narrow, resulting in a high-definition or high-resolution display device.

[0258] 16 has a configuration in which a transistor 310A and a transistor 310B, each having a channel formed in a semiconductor substrate, are stacked. Note that in the following description of the display panel, descriptions of parts that are the same as those of the display panel described above may be omitted.

[0259] The display device 200B has a configuration in which a substrate 301B on which a transistor 310B, a capacitor 240, and a light-emitting device are provided and a substrate 301A on which a transistor 310A is provided are bonded together.

[0260] Here, an insulating layer 345 is provided on the lower surface of the substrate 301B, and an insulating layer 346 is provided on the insulating layer 261 provided on the substrate 301A. The insulating layers 345 and 346 function as protective layers and can suppress the diffusion of impurities into the substrates 301B and 301A. The insulating layers 345 and 346 can be made of an inorganic insulating film that can be used for the protective layer 121 or the insulating layer 332.

[0261] The substrate 301B is provided with a plug 343 that penetrates the substrate 301B and an insulating layer 345. Here, it is preferable to provide an insulating layer 344 that covers the side surface of the plug 343 and functions as a protective layer.

[0262] Furthermore, in the substrate 301B, a conductive layer 342 is provided below the insulating layer 345. The conductive layer 342 is embedded in the insulating layer 335, and the lower surfaces of the conductive layer 342 and the insulating layer 335 are flattened. The conductive layer 342 is electrically connected to a plug 343.

[0263] On the other hand, in the substrate 301A, a conductive layer 341 is provided on an insulating layer 346. The conductive layer 341 is embedded in the insulating layer 336, and the upper surfaces of the conductive layer 341 and the insulating layer 336 are flattened.

[0264] It is preferable to use the same conductive material for the conductive layers 341 and 342. For example, a metal film containing an element selected from Al, Cr, Cu, Ta, Ti, Mo, and W, or a metal nitride film containing the above elements (titanium nitride film, molybdenum nitride film, tungsten nitride film), etc., can be used. In particular, it is preferable to use copper for the conductive layers 341 and 342. This allows the use of Cu-Cu (copper-copper) direct bonding technology (technology that achieves electrical conductivity by connecting Cu (copper) pads together).

[0265] [Display Device 200C] A display device 200C shown in FIG. 17 has a configuration in which a conductive layer 341 and a conductive layer 342 are joined via a bump 347.

[0266] 17 , by providing a bump 347 between the conductive layer 341 and the conductive layer 342, the conductive layer 341 and the conductive layer 342 can be electrically connected. The bump 347 can be formed using a conductive material containing, for example, gold (Au), nickel (Ni), indium (In), tin (Sn), or the like. Alternatively, for example, solder may be used as the bump 347. An adhesive layer 348 may be provided between the insulating layer 345 and the insulating layer 346. When the bump 347 is provided, the insulating layer 335 and the insulating layer 336 may not be provided.

[0267] [Display Device 200D] A display device 200D shown in FIG. 18 differs from the display device 200A mainly in the configuration of the transistors.

[0268] The transistor 320 is a transistor (OS transistor) in which a metal oxide (also referred to as an oxide semiconductor) is used for a semiconductor layer in which a channel is formed.

[0269] The transistor 320 includes a semiconductor layer 321 , an insulating layer 323 , a conductive layer 324 , a pair of conductive layers 325 , an insulating layer 326 , and a conductive layer 327 .

[0270] The substrate 331 corresponds to the substrate 291 in FIGS. 14A and 14B.

[0271] An insulating layer 332 is provided over a substrate 331. The insulating layer 332 functions as a barrier layer that prevents impurities such as water or hydrogen from diffusing from the substrate 331 to the transistor 320 and prevents oxygen from being released from the semiconductor layer 321 toward the insulating layer 332. The insulating layer 332 can be, for example, a film through which hydrogen or oxygen is less likely to diffuse than a silicon oxide film, such as an aluminum oxide film, a hafnium oxide film, or a silicon nitride film.

[0272] A conductive layer 327 is provided over the insulating layer 332, and an insulating layer 326 is provided to cover the conductive layer 327. The conductive layer 327 functions as a first gate electrode of the transistor 320, and part of the insulating layer 326 functions as a first gate insulating layer. An oxide insulating film such as a silicon oxide film is preferably used for at least a portion of the insulating layer 326 that is in contact with the semiconductor layer 321. The top surface of the insulating layer 326 is preferably planarized.

[0273] The semiconductor layer 321 is provided over the insulating layer 326. The semiconductor layer 321 preferably includes a metal oxide (also referred to as an oxide semiconductor) film exhibiting semiconductor characteristics. A pair of conductive layers 325 is provided over and in contact with the semiconductor layer 321 and functions as a source electrode and a drain electrode.

[0274] An insulating layer 328 is provided to cover top surfaces and side surfaces of the pair of conductive layers 325 and side surfaces of the semiconductor layer 321, and an insulating layer 264 is provided over the insulating layer 328. The insulating layer 328 functions as a barrier layer that prevents impurities such as water or hydrogen from diffusing from the insulating layer 264 or the like into the semiconductor layer 321 and prevents oxygen from being released from the semiconductor layer 321. The insulating layer 328 can be an insulating film similar to the insulating layer 332.

[0275] An opening reaching the semiconductor layer 321 is provided in the insulating layer 328 and the insulating layer 264. An insulating layer 323 in contact with the top surface of the semiconductor layer 321 and a conductive layer 324 are buried in the opening. The conductive layer 324 functions as a second gate electrode, and the insulating layer 323 functions as a second gate insulating layer.

[0276] The top surfaces of the conductive layer 324, the insulating layer 323, and the insulating layer 264 are planarized so that their heights are the same or approximately the same, and insulating layers 329 and 265 are provided to cover them.

[0277] The insulating layer 264 and the insulating layer 265 function as interlayer insulating layers. The insulating layer 329 functions as a barrier layer that prevents impurities such as water or hydrogen from diffusing from the insulating layer 265 or the like to the transistor 320. The insulating layer 329 can be formed using an insulating film similar to the insulating layer 328 and the insulating layer 332.

[0278] A plug 274 electrically connected to one of the pair of conductive layers 325 is provided to be embedded in the insulating layer 265, the insulating layer 329, and the insulating layer 264. Here, the plug 274 preferably includes a conductive layer 274a covering the side surfaces of the openings of the insulating layer 265, the insulating layer 329, the insulating layer 264, and the insulating layer 328 and part of the top surface of the conductive layer 325, and a conductive layer 274b in contact with the top surface of the conductive layer 274a. In this case, the conductive layer 274a is preferably made of a conductive material through which hydrogen and oxygen do not easily diffuse.

[0279] [Display Device 200E] A display device 200E illustrated in FIG. 19 has a stacked structure of a transistor 320A and a transistor 320B each including an oxide semiconductor as a semiconductor in which a channel is formed.

[0280] The description of the display device 200D can be referred to for the transistor 320A, the transistor 320B, and the surrounding configurations thereof.

[0281] Although two transistors including an oxide semiconductor are stacked here, the present invention is not limited to this structure, and for example, three or more transistors may be stacked.

[0282] [Display Device 200F] A display device 200F shown in FIG. 20 has a stacked structure of a transistor 310 in which a channel is formed in a substrate 301 and a transistor 320 in which a channel is formed and a semiconductor layer containing metal oxide.

[0283] An insulating layer 261 is provided to cover the transistor 310, and a conductive layer 251 is provided over the insulating layer 261. An insulating layer 262 is provided to cover the conductive layer 251, and a conductive layer 252 is provided over the insulating layer 262. The conductive layers 251 and 252 each function as wirings. An insulating layer 263 and an insulating layer 332 are provided to cover the conductive layer 252, and the transistor 320 is provided over the insulating layer 332. An insulating layer 265 is provided to cover the transistor 320, and a capacitor 240 is provided over the insulating layer 265. The capacitor 240 and the transistor 320 are electrically connected by a plug 274.

[0284] The transistor 320 can be used as a transistor that forms a pixel circuit. The transistor 310 can be used as a transistor that forms a pixel circuit or a driver circuit (gate line driver circuit, source line driver circuit) that drives the pixel circuit. The transistors 310 and 320 can be used as transistors that form various circuits such as an arithmetic circuit or a memory circuit.

[0285] With this configuration, not only pixel circuits but also driving circuits etc. can be formed directly below the light-emitting device, which makes it possible to make the display panel smaller than when driving circuits are provided around the periphery of the display area.

[0286] This embodiment mode can be implemented by appropriately combining at least a part thereof with other embodiment modes described in this specification.

[0287] Embodiment 5 In this embodiment, a light-emitting element (also referred to as a light-emitting device) that can be used for a display device that is one embodiment of the present invention will be described.

[0288] In this specification, etc., a device fabricated using a metal mask or an FMM (fine metal mask, high-resolution metal mask) may be referred to as a device with an MM (metal mask) structure. Also, in this specification, etc., a device fabricated without using a metal mask or an FMM may be referred to as a device with an MML (metal maskless) structure.

[0289] In this specification and the like, a structure in which different light-emitting layers are formed or different light-emitting layers are painted for each color light-emitting device (here, blue (B), green (G), and red (R)) may be referred to as an SBS (Side By Side) structure. In this specification and the like, a light-emitting device that can emit white light may be referred to as a white light-emitting device. In addition, a white light-emitting device can be combined with a colored layer (for example, a color filter) to form a full-color display device.

[0290] [Light-Emitting Device] Light-emitting devices can be broadly divided into single-structure and tandem-structure devices. A single-structure device has one light-emitting unit between a pair of electrodes. The light-emitting unit includes one or more light-emitting layers. To obtain white light emission with a single structure, light-emitting layers can be selected that can produce white light through the emission of each of the two or more light-emitting layers. For example, in the case of a two-color device, the light-emitting color of the first light-emitting layer and the light-emitting color of the second light-emitting layer can be made to have a complementary color relationship, thereby achieving a configuration in which the light-emitting device as a whole emits white light. Furthermore, when white light emission is obtained using three or more light-emitting layers, the light-emitting colors of the three or more light-emitting layers can be combined to produce white light emission as a whole.

[0291] A tandem-structure device has multiple light-emitting units between a pair of electrodes. Each light-emitting unit includes one or more light-emitting layers. By using light-emitting layers that emit light of the same color in each light-emitting unit, the brightness per given current can be increased, and the device can be made more reliable than a single-structure device. To obtain white light emission in a tandem structure, the light from the light-emitting layers of the multiple light-emitting units can be combined to obtain white light emission. The combination of light colors that can produce white light emission is the same as in the single-structure device. In a tandem-structure device, it is preferable to provide an intermediate layer, such as a charge-generating layer, between the multiple light-emitting units.

[0292] When comparing a white light-emitting device with a light-emitting device having an SBS structure, the light-emitting device with an SBS structure can consume less power than the white light-emitting device, and the manufacturing process of the white light-emitting device is simpler than that of the light-emitting device having an SBS structure, so the manufacturing cost can be lower and the manufacturing yield can be higher.

[0293] 21A , the light-emitting device has an EL layer 790 between a pair of electrodes (a lower electrode 791 and an upper electrode 792). The EL layer 790 can be composed of multiple layers, such as a layer 720, a light-emitting layer 711, and a layer 730. The layer 720 can have, for example, a layer containing a substance with high electron injection properties (electron injection layer) and a layer containing a substance with high electron transport properties (electron transport layer). The light-emitting layer 711 contains, for example, a light-emitting compound. The layer 730 can have, for example, a layer containing a substance with high hole injection properties (hole injection layer) and a layer containing a substance with high hole transport properties (hole transport layer).

[0294] A structure having the layer 720, the light-emitting layer 711, and the layer 730 provided between a pair of electrodes can function as a single light-emitting unit, and the structure of FIG. 21A is referred to as a single structure in this specification.

[0295] Specifically, the light-emitting device shown in FIG. 21B has layers 730-1 and 730-2, a light-emitting layer 711, layers 720-1 and 720-2, and an upper electrode 792 on a lower electrode 791. For example, the lower electrode 791 is an anode, and the upper electrode 792 is a cathode. In this case, the layer 730-1 functions as a hole injection layer, the layer 730-2 functions as a hole transport layer, the layer 720-1 functions as an electron transport layer, and the layer 720-2 functions as an electron injection layer. On the other hand, when the lower electrode 791 is a cathode and the upper electrode 792 is an anode, the layer 730-1 functions as an electron injection layer, the layer 730-2 functions as an electron transport layer, the layer 720-1 functions as a hole transport layer, and the layer 720-2 functions as a hole injection layer. This layer structure allows carriers to be efficiently injected into the light-emitting layer 711, thereby increasing the efficiency of carrier recombination within the light-emitting layer 711.

[0296] As shown in FIGS. 21C and 21D, a configuration in which a plurality of light-emitting layers (light-emitting layers 711, 712, and 713) are provided between the layer 720 and the layer 730 is also a variation of the single structure.

[0297] As shown in Figures 21E and 21F, a configuration in which a plurality of light-emitting units (EL layer 790a, EL layer 790b) are connected in series via an intermediate layer (charge generating layer) 740 is referred to as a tandem structure in this specification. The tandem structure may also be referred to as a stack structure. Note that the tandem structure makes it possible to obtain a light-emitting device capable of emitting light with high brightness.

[0298] 21C, light-emitting materials that emit light of the same color, or even the same light-emitting material, may be used for the light-emitting layers 711, 712, and 713. Stacking the light-emitting layers can increase the luminance of emitted light.

[0299] Furthermore, different light-emitting materials may be used for the light-emitting layer 711, the light-emitting layer 712, and the light-emitting layer 713. When the light emitted from the light-emitting layer 711, the light-emitting layer 712, and the light-emitting layer 713 has a complementary color relationship, white light can be obtained. Figure 21D shows an example in which a colored layer 795 that functions as a color filter is provided. When white light passes through the color filter, light of a desired color can be obtained.

[0300] 21E, light-emitting layers 711 and 712 may be made of light-emitting materials that emit light of the same color. Alternatively, light-emitting layers 711 and 712 may be made of light-emitting materials that emit different colors. When the light emitted by light-emitting layer 711 and the light emitted by light-emitting layer 712 are complementary colors, white light is obtained. FIG. 21F shows an example in which a colored layer 795 is further provided.

[0301] 21C, 21D, 21E, and 21F, the layer 720 and the layer 730 may have a laminated structure consisting of two or more layers, as shown in FIG. 21B.

[0302] 21D, light-emitting layers 711, 712, and 713 may be made of light-emitting materials that emit light of the same color. Similarly, in FIG. 21F, light-emitting layers 711 and 712 may be made of light-emitting materials that emit light of the same color. In this case, by applying a color conversion layer instead of colored layer 795, light of a desired color different from the light-emitting material can be obtained. For example, by using a blue light-emitting material in each light-emitting layer and transmitting blue light through the color conversion layer, light with a longer wavelength than blue (e.g., red, green, etc.) can be obtained. As the color conversion layer, a fluorescent material, a phosphorescent material, or quantum dots can be used.

[0303] The light-emitting device can emit light of red, green, blue, cyan, magenta, yellow, or white, depending on the material of the EL layer 790. Furthermore, the color purity can be further improved by providing the light-emitting device with a microcavity structure.

[0304] A light-emitting device that emits white light may have a structure in which two or more types of light-emitting materials are contained in the light-emitting layer, or may have two or more stacked light-emitting layers containing different light-emitting materials, in which case the light-emitting materials should be selected so that the light emitted from each of the light-emitting materials has a complementary color relationship.

[0305] [Light-Emitting Device] Here, a specific example of the configuration of the light-emitting device will be described.

[0306] The light-emitting device has at least a light-emitting layer. The light-emitting device may further have, as a layer other than the light-emitting layer, a layer containing a substance with high hole-injection properties, a substance with high hole-transport properties, a hole-blocking material, a substance with high electron-transport properties, an electron-blocking material, a substance with high electron-injection properties, an electron-blocking material, or a bipolar substance (a substance with high electron-transport properties and high hole-transport properties).

[0307] The light-emitting device can be made of either a low-molecular-weight compound or a high-molecular-weight compound, and may contain an inorganic compound. The layers constituting the light-emitting device can be formed by a method such as vapor deposition (including vacuum vapor deposition), transfer, printing, inkjet printing, or coating.

[0308] For example, the light-emitting device may have, in addition to the light-emitting layer, one or more of a hole-injection layer, a hole-transport layer, a hole-blocking layer, an electron-blocking layer, an electron-transport layer, and an electron-injection layer.

[0309] The hole injection layer is a layer that injects holes from the anode into the hole transport layer and contains a material with high hole injection properties, such as an aromatic amine compound and a composite material containing a hole transport material and an acceptor material (electron acceptor material).

[0310] The hole transport layer is a layer that transports holes injected from the anode by the hole injection layer to the light emitting layer. The hole transport layer is a layer that contains a hole transport material. The hole transport material is a material having a concentration of 1×10 −６ cm ２ A substance having a hole mobility of 1 / Vs or more is preferred. Note that other substances can also be used as long as they have a higher hole transporting property than electron transporting property. As the hole transporting material, a material having a high hole transporting property, such as a π-electron-rich heteroaromatic compound (e.g., a carbazole derivative, a thiophene derivative, a furan derivative, etc.) or an aromatic amine (a compound having an aromatic amine skeleton), is preferred.

[0311] The electron transport layer is a layer that transports electrons injected from the cathode by the electron injection layer to the light emitting layer. The electron transport layer is a layer that contains an electron transporting material. The electron transporting material is a material having a molecular weight of 1×10 −６ cm ２A substance having an electron mobility of 1 / Vs or more is preferred. Note that other substances can also be used as long as they have a higher electron transporting property than holes. Examples of electron-transporting materials that can be used include metal complexes having a quinoline skeleton, metal complexes having a benzoquinoline skeleton, metal complexes having an oxazole skeleton, and metal complexes having a thiazole skeleton, as well as oxadiazole derivatives, triazole derivatives, imidazole derivatives, oxazole derivatives, thiazole derivatives, phenanthroline derivatives, quinoline derivatives having a quinoline ligand, benzoquinoline derivatives, quinoxaline derivatives, dibenzoquinoxaline derivatives, pyridine derivatives, bipyridine derivatives, pyrimidine derivatives, and other π-electron-deficient heteroaromatic compounds including nitrogen-containing heteroaromatic compounds.

[0312] The electron injection layer is a layer that injects electrons from the cathode to the electron transport layer and contains a material with high electron injection properties. Examples of the material with high electron injection properties include alkali metals, alkaline earth metals, and compounds thereof. Examples of the material with high electron injection properties include a composite material containing an electron transport material and a donor material (electron donor material).

[0313] The electron injection layer may be formed of, for example, lithium, cesium, ytterbium, lithium fluoride (LiF), cesium fluoride (CsF), calcium fluoride (CaF ２ ), 8-(quinolinolato)lithium (abbreviation: Liq), 2-(2-pyridyl)phenolatolithium (abbreviation: LiPP), 2-(2-pyridyl)-3-pyridinolatolithium (abbreviation: LiPPy), 4-phenyl-2-(2-pyridyl)phenolatolithium (abbreviation: LiPPP), lithium oxide (LiO ｘ ), alkali metals such as cesium carbonate, alkaline earth metals, or compounds thereof can be used. The electron injection layer may have a stacked structure of two or more layers. For example, the stacked structure may have a structure in which lithium fluoride is used in the first layer and ytterbium is provided in the second layer.

[0314] Alternatively, the electron injection layer may be formed using a material having electron transport properties. For example, a compound having an unshared electron pair and an electron-deficient heteroaromatic ring may be used as the material having electron transport properties. Specifically, a compound having at least one of a pyridine ring, a diazine ring (pyrimidine ring, pyrazine ring, pyridazine ring), and a triazine ring may be used.

[0315] The organic compound having an unshared electron pair preferably has a lowest unoccupied molecular orbital (LUMO) level of −3.6 eV to −2.3 eV. Generally, the highest occupied molecular orbital (HOMO) level and the LUMO level of an organic compound can be estimated by cyclic voltammetry (CV), photoelectron spectroscopy, optical absorption spectroscopy, inverse photoelectron spectroscopy, or the like.

[0316] For example, 4,7-diphenyl-1,10-phenanthroline (abbreviation: BPhen), 2,9-di(naphthalen-2-yl)-4,7-diphenyl-1,10-phenanthroline (abbreviation: NBPhen), diquinoxalino[2,3-a:2',3'-c]phenazine (abbreviation: HATNA), 2,4,6-tris[3'-(pyridin-3-yl)biphenyl-3-yl]-1,3,5-triazine (abbreviation: TmPPPyTz), etc. can be used as the organic compound having an unshared electron pair. Note that NBPhen has a higher glass transition temperature (Tg) and is superior in heat resistance compared to BPhen.

[0317] The light-emitting layer is a layer containing a light-emitting substance. The light-emitting layer can contain one or more light-emitting substances. As the light-emitting substance, a substance that emits light of a color such as blue, purple, blue-purple, green, yellow-green, yellow, orange, or red is appropriately used. Furthermore, a substance that emits near-infrared light can also be used as the light-emitting substance.

[0318] Examples of the light-emitting material include fluorescent materials, phosphorescent materials, TADF materials, and quantum dot materials.

[0319] Examples of fluorescent materials include pyrene derivatives, anthracene derivatives, triphenylene derivatives, fluorene derivatives, carbazole derivatives, dibenzothiophene derivatives, dibenzofuran derivatives, dibenzoquinoxaline derivatives, quinoxaline derivatives, pyridine derivatives, pyrimidine derivatives, phenanthrene derivatives, and naphthalene derivatives.

[0320] Examples of phosphorescent materials include organometallic complexes (particularly iridium complexes) having a 4H-triazole skeleton, a 1H-triazole skeleton, an imidazole skeleton, a pyrimidine skeleton, a pyrazine skeleton, or a pyridine skeleton; organometallic complexes (particularly iridium complexes) having a phenylpyridine derivative having an electron-withdrawing group as a ligand; platinum complexes; and rare earth metal complexes.

[0321] The light-emitting layer may contain one or more organic compounds (host materials, assist materials, etc.) in addition to a light-emitting substance (guest material). As the one or more organic compounds, one or both of a hole-transporting material and an electron-transporting material can be used. Furthermore, as the one or more organic compounds, a bipolar material or a TADF material can be used.

[0322] The light-emitting layer preferably includes, for example, a phosphorescent material and a hole-transporting material and an electron-transporting material that are a combination that easily forms an exciplex. This configuration allows for efficient emission using Exciplex-Triple Energy Transfer (ExTET), which is energy transfer from the exciplex to the light-emitting material (phosphorescent material). By selecting a combination that forms an exciplex that emits light that overlaps with the wavelength of the lowest-energy absorption band of the light-emitting material, energy transfer becomes smooth, allowing for efficient emission. This configuration simultaneously enables high efficiency, low-voltage operation, and long life of the light-emitting device.

[0323] At least a part of the configuration examples exemplified in this embodiment and the corresponding drawings can be combined as appropriate with other configuration examples or drawings.

[0324] This embodiment mode can be implemented by appropriately combining at least a part thereof with other embodiment modes described in this specification.

[0325] Embodiment 6 In this embodiment, a light-receiving device that can be used for a display device of one embodiment of the present invention and a display device having a light-receiving and light-emitting function will be described.

[0326] The light receiving device may be, for example, a pn-type or pin-type photodiode. The light receiving device functions as a photoelectric conversion device (also called a photoelectric conversion element) that detects light incident on the light receiving device and generates electric charges. The amount of electric charges generated by the light receiving device is determined based on the amount of light incident on the light receiving device.

[0327] In particular, it is preferable to use an organic photodiode having a layer containing an organic compound as the light-receiving device. Organic photodiodes can be easily made thin, lightweight, and large in area, and have a high degree of freedom in shape and design, making them applicable to a variety of display devices.

[0328] 22A, the light-receiving device has a layer 765 between a pair of electrodes (a lower electrode 761 and an upper electrode 762). The layer 765 has at least one active layer and may further have other layers.

[0329] 22B shows a modification of the layer 765 included in the light-receiving device shown in Fig. 22A. Specifically, the light-receiving device shown in Fig. 22B includes a layer 766 on a lower electrode 761, an active layer 767 on the layer 766, a layer 768 on the active layer 767, and an upper electrode 762 on the layer 768.

[0330] The active layer 767 functions as a photoelectric conversion layer.

[0331] When the lower electrode 761 is an anode and the upper electrode 762 is a cathode, the layer 766 includes a hole transport layer and / or an electron blocking layer. The layer 768 includes an electron transport layer and / or a hole blocking layer. When the lower electrode 761 is a cathode and the upper electrode 762 is an anode, the layers 766 and 768 have the reversed structures.

[0332] Here, in a display device according to one embodiment of the present invention, a layer shared by the light-receiving device and the light-emitting device (which may also be referred to as a continuous layer shared by the light-receiving device and the light-emitting device) may be present. Such a layer may have different functions in the light-emitting device and the light-receiving device. In this specification, components may be referred to based on their functions in the light-emitting device. For example, a hole injection layer functions as a hole injection layer in the light-emitting device and as a hole transport layer in the light-receiving device. Similarly, an electron injection layer functions as an electron injection layer in the light-emitting device and as an electron transport layer in the light-receiving device. Furthermore, a layer shared by the light-receiving device and the light-emitting device may have the same function in the light-emitting device and in the light-receiving device. For example, a hole transport layer functions as a hole transport layer in both the light-emitting device and the light-receiving device, and an electron transport layer functions as an electron transport layer in both the light-emitting device and the light-receiving device.

[0333] Next, materials that can be used for the light-receiving device will be described.

[0334] The light-receiving device may be made of either a low-molecular-weight compound or a high-molecular-weight compound, and may contain an inorganic compound. The layers constituting the light-receiving device may be formed by a method such as vapor deposition (including vacuum deposition), transfer, printing, inkjet printing, or coating.

[0335] The active layer of the light-receiving device includes a semiconductor. Examples of the semiconductor include inorganic semiconductors such as silicon and organic semiconductors containing organic compounds. In this embodiment, an example in which an organic semiconductor is used as the semiconductor of the active layer is shown. Using an organic semiconductor is preferable because the light-emitting layer and the active layer can be formed by the same method (e.g., vacuum deposition), allowing the use of a common manufacturing device.

[0336] The n-type semiconductor material of the active layer is fullerene (e.g., C ６０ , C ７０Examples of the fullerene derivatives include [6,6]-phenyl-C ７１ -butyric acid methyl ester (abbreviation: PC70BM), [6,6]-Phenyl-C ６１ -butyric acid methyl ester (abbreviation: PC60BM), 1', 1'', 4', 4''-Tetrahydro-di [1, 4] methanonaphthaleno [1, 2: 2', 3', 56, 60: 2'', 3''] [5, 6] fullerene-C ６０ (abbreviation: ICBA) and others.

[0337] Examples of materials for n-type semiconductors include perylene tetracarboxylic acid derivatives such as N,N′-dimethyl-3,4,9,10-perylene tetracarboxylic acid diimide (abbreviation: Me-PTCDI), and 2,2′-(5,5′-(thieno[3,2-b]thiophene-2,5-diyl)bis(thiophene-5,2-diyl))bis(methane-1-yl-1-ylidene)dimalononitrile (abbreviation: FT2TDMN).

[0338] Examples of n-type semiconductor materials include metal complexes having a quinoline skeleton, metal complexes having a benzoquinoline skeleton, metal complexes having an oxazole skeleton, metal complexes having a thiazole skeleton, oxadiazole derivatives, triazole derivatives, imidazole derivatives, oxazole derivatives, thiazole derivatives, phenanthroline derivatives, quinoline derivatives, benzoquinoline derivatives, quinoxaline derivatives, dibenzoquinoxaline derivatives, pyridine derivatives, bipyridine derivatives, pyrimidine derivatives, naphthalene derivatives, anthracene derivatives, coumarin derivatives, rhodamine derivatives, triazine derivatives, and quinone derivatives.

[0339] Examples of p-type semiconductor materials contained in the active layer include electron-donating organic semiconductor materials such as copper(II) phthalocyanine (CuPc), tetraphenyldibenzoperiflanthene (DBP), zinc phthalocyanine (ZnPc), tin phthalocyanine (SnPc), quinacridone, and rubrene.

[0340] Examples of p-type semiconductor materials include carbazole derivatives, thiophene derivatives, furan derivatives, compounds having an aromatic amine skeleton, etc. Examples of p-type semiconductor materials include naphthalene derivatives, anthracene derivatives, pyrene derivatives, triphenylene derivatives, fluorene derivatives, pyrrole derivatives, benzofuran derivatives, benzothiophene derivatives, indole derivatives, dibenzofuran derivatives, dibenzothiophene derivatives, indolocarbazole derivatives, porphyrin derivatives, phthalocyanine derivatives, naphthalocyanine derivatives, quinacridone derivatives, rubrene derivatives, tetracene derivatives, polyphenylenevinylene derivatives, polyparaphenylene derivatives, polyfluorene derivatives, polyvinylcarbazole derivatives, and polythiophene derivatives.

[0341] The HOMO level of the electron-donating organic semiconductor material is preferably shallower (higher) than the HOMO level of the electron-accepting organic semiconductor material, and the LUMO level of the electron-donating organic semiconductor material is preferably shallower (higher) than the LUMO level of the electron-accepting organic semiconductor material.

[0342] It is preferable to use a spherical fullerene as the electron-accepting organic semiconductor material and a planar organic semiconductor material as the electron-donating organic semiconductor material. Molecules with similar shapes tend to aggregate together, and when molecules of the same type aggregate, the energy levels of their molecular orbitals become close, which can improve carrier transport properties.

[0343] Furthermore, a polymer compound such as Poly[[4,8-bis[5-(2-ethylhexyl)-2-thienyl]benzo[1,2-b:4,5-b']dithiophene-2,6-diyl]-2,5-thiophenediyl[5,7-bis(2-ethylhexyl)-4,8-dioxo-4H,8H-benzo[1,2-c:4,5-c']dithiophene-1,3-diyl]] polymer (abbreviated as PBDB-T) or a PBDB-T derivative, which functions as a donor, can be used in the active layer. For example, a method of dispersing an acceptor material in PBDB-T or a PBDB-T derivative can be used.

[0344] For example, the active layer is preferably formed by co-evaporating an n-type semiconductor and a p-type semiconductor, or may be formed by laminating an n-type semiconductor and a p-type semiconductor.

[0345] The active layer may also contain a mixture of three or more materials. For example, in order to expand the wavelength range, a third material may be mixed in addition to an n-type semiconductor material and a p-type semiconductor material. In this case, the third material may be a low-molecular-weight compound or a high-molecular-weight compound.

[0346] The light-receiving device may further include a layer containing a substance with high hole-transporting properties, a substance with high electron-transporting properties, or a bipolar substance (a substance with high electron-transporting properties and high hole-transporting properties) as a layer other than the active layer. Furthermore, without being limited to the above, the light-receiving device may further include a layer containing a substance with high hole-injecting properties, a hole-blocking material, a material with high electron-injecting properties, or an electron-blocking material. For the layer other than the active layer of the light-receiving device, for example, the materials that can be used in the above-mentioned light-emitting device can be used.

[0347] For example, the hole transport material or electron blocking material may be a polymer compound such as poly(3,4-ethylenedioxythiophene) / poly(styrenesulfonic acid) (PEDOT / PSS), or an inorganic compound such as molybdenum oxide or copper iodide (CuI). The electron transport material or hole blocking material may be an inorganic compound such as zinc oxide (ZnO), or an organic compound such as polyethyleneimine ethoxylate (PEIE). The light-receiving device may have, for example, a mixed film of PEIE and ZnO.

[0348] [Display Device Having Light Detection Function] In a display device according to one embodiment of the present invention, light-emitting devices are arranged in a matrix in a display portion, and an image can be displayed on the display portion. Furthermore, light-receiving devices are arranged in a matrix in the display portion, and the display portion has one or both of an imaging function and a sensing function in addition to an image display function. The display portion can be used as an image sensor or a touch sensor. That is, by detecting light in the display portion, an image can be captured or the proximity or contact of an object (such as a finger, a hand, or a pen) can be detected.

[0349] Furthermore, in the display device of one embodiment of the present invention, the light-emitting device can be used as a light source for a sensor. In the display device of one embodiment of the present invention, when light emitted from the light-emitting device included in the display portion is reflected (or scattered) by an object, the light-receiving device can detect the reflected light (or scattered light), thereby enabling imaging or touch detection even in a dark place.

[0350] Therefore, a light receiving unit and a light source are not required to be provided separately from the display device, and the number of components in the electronic device can be reduced. For example, a biometric authentication device or a capacitive touch panel for scrolling or the like is not required to be provided separately in the electronic device. Therefore, by using the display device of one embodiment of the present invention, an electronic device with reduced manufacturing costs can be provided.

[0351] Specifically, a display device according to one embodiment of the present invention has a light-emitting device and a light-receiving device in each pixel. In the display device according to one embodiment of the present invention, an organic EL device is used as the light-emitting device, and an organic photodiode is used as the light-receiving device. The organic EL device and the organic photodiode can be formed on the same substrate. Therefore, the organic photodiode can be built into a display device using an organic EL device.

[0352] In a display device having a light-emitting device and a light-receiving device in each pixel, the pixel has a light-receiving function, so that it is possible to detect contact or proximity of an object while displaying an image. For example, in addition to displaying an image using all of the sub-pixels of the display device, some of the sub-pixels can emit light as a light source and the remaining sub-pixels can display an image.

[0353] When the light receiving device is used as an image sensor, the display device can capture an image using the light receiving device. For example, the display device of the present embodiment can be used as a scanner.

[0354] For example, an image sensor can be used to capture images for personal authentication using fingerprints, palm prints, irises, pulse patterns (including vein patterns and arterial patterns), faces, or the like.

[0355] For example, an image sensor can be used to capture images of the area around the eye, the surface of the eye, or the inside of the eye (such as the fundus) of a user of a wearable device. Therefore, the wearable device can have a function to detect one or more of the user's blinking, movement of the pupil, and movement of the eyelid.

[0356] The light receiving device can also be used as a touch sensor (also called a direct touch sensor) or a near-touch sensor (also called a hover sensor, hover touch sensor, non-contact sensor, or touchless sensor).

[0357] Here, the touch sensor or near-touch sensor can detect the proximity or contact of an object (such as a finger, hand, or pen).

[0358] A touch sensor can detect an object when the display device and the object are in direct contact with each other. A near-touch sensor can detect an object even if the object does not touch the display device. For example, a configuration in which the display device can detect an object when the distance between the display device and the object is between 0.1 mm and 300 mm, preferably between 3 mm and 50 mm, is preferred. This configuration allows the display device to be operated without the object directly touching it, in other words, it allows the display device to be operated in a non-contact (touchless) manner. This configuration reduces the risk of the display device becoming dirty or scratched, or allows the object to operate the display device without directly touching dirt (e.g., dust, viruses, etc.) attached to the display device.

[0359] Furthermore, the display device of one embodiment of the present invention can have a variable refresh rate. For example, the refresh rate can be adjusted (for example, adjusted within a range of 1 Hz to 240 Hz) depending on the content displayed on the display device to reduce power consumption. Furthermore, the drive frequency of the touch sensor or the near-touch sensor may be changed depending on the refresh rate. For example, when the refresh rate of the display device is 120 Hz, the drive frequency of the touch sensor or the near-touch sensor can be configured to be higher than 120 Hz (typically 240 Hz). This configuration enables low power consumption and an increased response speed of the touch sensor or the near-touch sensor.

[0360] The display device 300 shown in FIGS. 22C to 22E includes, between a substrate 351 and a substrate 359, a layer 353 having a light-receiving device, a functional layer 355, and a layer 357 having a light-emitting device.

[0361] The functional layer 355 has a circuit for driving the light-receiving device and a circuit for driving the light-emitting device. The functional layer 355 may be provided with one or more of a switch, a transistor, a capacitor, a resistor, a wiring, a terminal, etc. Note that when the light-emitting device and the light-receiving device are driven by a passive matrix method, a configuration without a switch or a transistor may be used.

[0362] 22C , when a finger 352 touches the display device 300, the light emitted by the light-emitting device in the layer 357 having the light-emitting device is reflected by the finger 352, and the reflected light is detected by the light-receiving device in the layer 353 having the light-receiving device. This makes it possible to detect that the finger 352 has touched the display device 300.

[0363] As shown in FIGS. 22D and 22E, the display device may also have a function of detecting or capturing an image of an object that is close to (not in contact with) the display device.

[0364] This embodiment mode can be implemented by appropriately combining at least a part thereof with other embodiment modes described in this specification.

[0365] Embodiment 7 In this embodiment, electronic devices of one embodiment of the present invention will be described with reference to FIGS.

[0366] The electronic devices of this embodiment include a display panel (display device) according to one embodiment of the present invention in a display portion. The display panel according to one embodiment of the present invention can easily achieve high definition and high resolution and can also achieve high display quality. Therefore, the display panel can be used in the display portion of various electronic devices.

[0367] Examples of electronic devices include electronic devices with relatively large screens such as television sets, desktop or notebook personal computers, computer monitors, digital signage, large game machines such as pachinko machines, as well as digital cameras, digital video cameras, digital photo frames, mobile phones, portable game machines, personal digital assistants, and sound playback devices.

[0368] In particular, the display panel of one embodiment of the present invention can have high resolution and thus can be suitably used in electronic devices having a relatively small display area. Examples of such electronic devices include wristwatch-type and bracelet-type information terminals (wearable devices), and head-mounted wearable devices such as VR devices such as head-mounted displays, AR glasses-type devices, and MR devices.

[0369] The display panel of one embodiment of the present invention preferably has extremely high resolution, such as HD (1280 × 720 pixels), FHD (1920 × 1080 pixels), WQHD (2560 × 1440 pixels), WQXGA (2560 × 1600 pixels), 4K (3840 × 2160 pixels), or 8K (7680 × 4320 pixels). A resolution of 4K, 8K, or higher is particularly preferable. Furthermore, the pixel density (resolution) of the display panel of one embodiment of the present invention is preferably 100 ppi or higher, more preferably 300 ppi or higher, more preferably 500 ppi or higher, more preferably 1000 ppi or higher, more preferably 2000 ppi or higher, more preferably 3000 ppi or higher, more preferably 5000 ppi or higher, and even more preferably 7000 ppi or higher. By using a display panel having either or both of high resolution and high definition, it is possible to further enhance the sense of realism and depth in electronic devices for personal use, such as portable or home use. Furthermore, the screen ratio (aspect ratio) of the display panel of one embodiment of the present invention is not particularly limited. For example, the display panel can support various screen ratios, such as 1:1 (square), 4:3, 16:9, and 16:10.

[0370] The electronic device of this embodiment may have a sensor (including the function of detecting, detecting, or measuring force, displacement, position, velocity, acceleration, angular velocity, rotation speed, distance, light, liquid, magnetism, temperature, chemical substance, sound, time, hardness, electric field, current, voltage, power, radiation, flow rate, humidity, gradient, vibration, odor, or infrared rays).

[0371] The electronic device of the present embodiment can have various functions, such as a function to display various information (still images, videos, text images, etc.) on a display unit, a touch panel function, a function to display a calendar, date, time, etc., a function to execute various software (programs), a wireless communication function, a function to read out programs or data recorded on a recording medium, etc.

[0372] 23A to 23D , examples of wearable devices that can be worn on the head are described. These wearable devices have one or both of a function for displaying AR content and a function for displaying VR content. Note that these wearable devices may also have a function for displaying SR or MR content in addition to AR and VR. By having an electronic device have a function for displaying at least one of AR, VR, SR, and MR content, it is possible to enhance the user's sense of immersion.

[0373] The electronic device 700A shown in FIG. 23A and the electronic device 700B shown in FIG. 23B each have a pair of display panels 751, a pair of housings 721, a communication unit (not shown), a pair of mounting units 723, a control unit (not shown), an imaging unit (not shown), a pair of optical members 753, a frame 757, and a pair of nose pads 758.

[0374] A display panel of one embodiment of the present invention can be applied to the display panel 751. Therefore, an electronic device capable of displaying images with extremely high resolution can be provided.

[0375] The electronic device 700A and the electronic device 700B can each project an image displayed on the display panel 751 onto a display area 756 of the optical member 753. Because the optical member 753 is translucent, the user can see the image displayed in the display area superimposed on a transmitted image visually recognized through the optical member 753. Therefore, the electronic device 700A and the electronic device 700B are each electronic devices capable of AR display.

[0376] Electronic device 700A and electronic device 700B may be provided with a camera capable of capturing an image in front of them as an imaging unit. Furthermore, electronic device 700A and electronic device 700B may each be provided with an acceleration sensor such as a gyro sensor, thereby detecting the orientation of the user's head and displaying an image corresponding to that orientation in display area 756.

[0377] The communication unit has a wireless communication device, and can supply a video signal, etc. Instead of or in addition to the wireless communication device, a connector to which a cable through which a video signal and a power supply potential are supplied may be provided.

[0378] Furthermore, the electronic device 700A and the electronic device 700B are provided with batteries, which can be charged wirelessly and / or by wire.

[0379] The housing 721 may be provided with a touch sensor module. The touch sensor module has a function of detecting a touch on the outer surface of the housing 721. The touch sensor module can detect a tap operation or a slide operation by the user and perform various processes. For example, a tap operation can perform a process such as pausing or resuming a video, and a slide operation can perform a process such as fast-forwarding or fast-rewinding. Furthermore, providing a touch sensor module on each of the two housings 721 can expand the range of operations.

[0380] Various touch sensors can be used as the touch sensor module. For example, various types of touch sensors can be used, such as a capacitance type, a resistive film type, an infrared type, an electromagnetic induction type, a surface acoustic wave type, and an optical type. In particular, it is preferable to use a capacitance type or an optical type sensor in the touch sensor module.

[0381] When an optical touch sensor is used, a photoelectric conversion device (also called a photoelectric conversion element) can be used as the light receiving device (also called a light receiving element). The active layer of the photoelectric conversion device can be made of either or both of an inorganic semiconductor and an organic semiconductor.

[0382] The electronic device 800A shown in Figure 23C and the electronic device 800B shown in Figure 23D each have a pair of display units 820, a housing 821, a communication unit 822, a pair of mounting units 823, a control unit 824, a pair of imaging units 825, and a pair of lenses 832.

[0383] A display panel of one embodiment of the present invention can be applied to the display portion 820. Therefore, an electronic device capable of displaying images with extremely high definition can be provided, which allows a user to feel a high sense of immersion.

[0384] The display unit 820 is provided inside the housing 821 at a position that can be viewed through the lens 832. In addition, by displaying different images on the pair of display units 820, it is possible to perform three-dimensional display using parallax.

[0385] The electronic device 800A and the electronic device 800B can be said to be electronic devices for VR. A user wearing the electronic device 800A or the electronic device 800B can view an image displayed on the display unit 820 through the lens 832.

[0386] It is preferable that electronic device 800A and electronic device 800B each have a mechanism that can adjust the left and right positions of lens 832 and display unit 820 so that they are optimally positioned according to the position of the user's eyes. It is also preferable that electronic device 800A and electronic device 800B each have a mechanism that can adjust the focus by changing the distance between lens 832 and display unit 820.

[0387] The mounting unit 823 allows the user to wear the electronic device 800A or the electronic device 800B on the head. Note that, in Fig. 23C and other figures, the mounting unit 823 is shaped like the temples of glasses (also called joints or temples), but is not limited to this. The mounting unit 823 may be shaped like a helmet or a band, for example, as long as it can be worn by the user.

[0388] The imaging unit 825 has a function of acquiring external information. Data acquired by the imaging unit 825 can be output to the display unit 820. An image sensor can be used for the imaging unit 825. Furthermore, multiple cameras may be provided to support multiple angles of view, such as telephoto and wide-angle.

[0389] Although an example including the imaging unit 825 is shown here, a distance measuring sensor (hereinafter also referred to as a detection unit) capable of measuring the distance to an object may be provided. That is, the imaging unit 825 is one aspect of the detection unit. As the detection unit, for example, an image sensor or a range image sensor such as a LIDAR (Light Detection and Ranging) can be used. By using an image obtained by the camera and an image obtained by the range image sensor, more information can be obtained, enabling more accurate gesture operations.

[0390] The electronic device 800A may have a vibration mechanism that functions as a bone conduction earphone. For example, a configuration having such a vibration mechanism can be applied to one or more of the display unit 820, the housing 821, and the wearing unit 823. This allows a user to enjoy video and audio simply by wearing the electronic device 800A, without the need for separate audio equipment such as headphones, earphones, or speakers.

[0391] The electronic device 800A and the electronic device 800B may each have an input terminal to which a cable can be connected for supplying a video signal from a video output device or the like and power for charging a battery provided in the electronic device.

[0392] The electronic device of one embodiment of the present invention may have a function of wireless communication with an earphone 750. The earphone 750 includes a communication unit (not shown) and has a wireless communication function. The earphone 750 can receive information (e.g., audio data) from the electronic device through the wireless communication function. For example, the electronic device 700A shown in FIG. 23A has a function of transmitting information to the earphone 750 through the wireless communication function. Furthermore, for example, the electronic device 800A shown in FIG. 23C has a function of transmitting information to the earphone 750 through the wireless communication function.

[0393] The electronic device may also have an earphone unit. Electronic device 700B shown in Fig. 23B has earphone unit 727. For example, earphone unit 727 and the control unit may be configured to be connected to each other by wire. Part of the wiring connecting earphone unit 727 and the control unit may be disposed inside housing 721 or attachment unit 723.

[0394] 23D includes an earphone unit 827. For example, the earphone unit 827 and the control unit 824 can be configured to be connected to each other by wire. Part of the wiring connecting the earphone unit 827 and the control unit 824 may be disposed inside the housing 821 or the attachment unit 823. The earphone unit 827 and the attachment unit 823 may also have magnets. This allows the earphone unit 827 to be fixed to the attachment unit 823 by magnetic force, which is preferable as it makes storage easier.

[0395] The electronic device may have an audio output terminal to which earphones or headphones can be connected. The electronic device may also have one or both of an audio input terminal and an audio input mechanism. For example, a sound collection device such as a microphone can be used as the audio input mechanism. By having the audio input mechanism, the electronic device may be endowed with the functionality of a so-called headset.

[0396] As described above, as electronic devices of one embodiment of the present invention, both glasses-type devices (such as the electronic devices 700A and 700B) and goggle-type devices (such as the electronic devices 800A and 800B) are suitable.

[0397] The electronic device 6500 shown in FIG. 24A is a portable information terminal that can be used as a smartphone.

[0398] The electronic device 6500 includes a housing 6501, a display portion 6502, a power button 6503, a button 6504, a speaker 6505, a microphone 6506, a camera 6507, a light source 6508, and the like. The display portion 6502 has a touch panel function.

[0399] The display panel of one embodiment of the present invention can be applied to the display portion 6502 .

[0400] FIG. 24B is a schematic cross-sectional view including the end of the housing 6501 on the microphone 6506 side.

[0401] A light-transmitting protective member 6510 is provided on the display surface side of the housing 6501, and a display panel 6511, optical members 6512, a touch sensor panel 6513, a printed circuit board 6517, a battery 6518, etc. are arranged in the space surrounded by the housing 6501 and the protective member 6510.

[0402] A display panel 6511, an optical member 6512, and a touch sensor panel 6513 are fixed to the protective member 6510 by adhesive layers (not shown).

[0403] In a region outside the display portion 6502, a part of the display panel 6511 is folded back, and an FPC 6515 is connected to the folded back part. An IC 6516 is mounted on the FPC 6515. The FPC 6515 is connected to a terminal provided on a printed circuit board 6517.

[0404] The flexible display of one embodiment of the present invention can be applied to the display panel 6511. Therefore, an extremely lightweight electronic device can be realized. In addition, since the display panel 6511 is extremely thin, a large-capacity battery 6518 can be mounted thereon while keeping the thickness of the electronic device small. Furthermore, by folding back a part of the display panel 6511 and arranging a connection portion with the FPC 6515 on the back side of the pixel portion, an electronic device with a narrow frame can be realized.

[0405] 24C shows an example of a television set. A television set 7100 has a display portion 7000 built into a housing 7101. Here, the housing 7101 is supported by a stand 7103.

[0406] 24C can be operated using operation switches provided on the housing 7101 and a separate remote control 7111. Alternatively, the display portion 7000 may be provided with a touch sensor, and the television set 7100 may be operated by touching the display portion 7000 with a finger or the like. The remote control 7111 may have a display portion that displays information output from the remote control 7111. Using operation keys or a touch panel provided on the remote control 7111, the channel and volume can be controlled, and an image displayed on the display portion 7000 can be controlled.

[0407] The television device 7100 is configured to include a receiver, a modem, and the like. Ordinary television broadcasts can be received using the receiver. Furthermore, by connecting to a wired or wireless communication network via the modem, it is possible to perform one-way (from a sender to a receiver) or two-way (between a sender and a receiver, or between receivers, etc.) information communication.

[0408] 24D shows an example of a laptop personal computer 7200. The laptop personal computer 7200 includes a housing 7211, a keyboard 7212, a pointing device 7213, an external connection port 7214, and the like. The housing 7211 includes a display portion 7000.

[0409] 24E and 24F show an example of digital signage.

[0410] 24E includes a housing 7301, a display portion 7000, and a speaker 7303. The digital signage 7300 may further include an LED lamp, operation keys (including a power switch or an operation switch), a connection terminal, various sensors, a microphone, and the like.

[0411] 24F shows a digital signage 7400 attached to a cylindrical pillar 7401. The digital signage 7400 has a display unit 7000 provided along the curved surface of the pillar 7401.

[0412] The larger the display unit 7000, the more information can be provided at one time. Also, the larger the display unit 7000, the more easily it will attract people's attention, which can increase the advertising effectiveness of, for example, advertisements.

[0413] Applying a touch panel to the display unit 7000 is preferable because it not only displays images or videos on the display unit 7000 but also allows the user to intuitively operate it. Furthermore, when used to provide information such as route information or traffic information, the intuitive operation can improve usability.

[0414] 24E and 24F , the digital signage 7300 or the digital signage 7400 is preferably capable of wirelessly linking with an information terminal 7311 or an information terminal 7411 such as a smartphone carried by a user. For example, advertising information displayed on the display unit 7000 can be displayed on the screen of the information terminal 7311 or the information terminal 7411. By operating the information terminal 7311 or the information terminal 7411, the display on the display unit 7000 can be switched.

[0415] Furthermore, the digital signage 7300 or the digital signage 7400 can be made to run a game using the screen of the information terminal 7311 or the information terminal 7411 as an operation means (controller), thereby allowing an unspecified number of users to simultaneously participate in and enjoy the game.

[0416] 24C to 24F, a display panel of one embodiment of the present invention can be applied to the display portion 7000.

[0417] The electronic device shown in Figures 25A to 25G has a housing 9000, a display unit 9001, a speaker 9003, operation keys 9005 (including a power switch or an operation switch), a connection terminal 9006, a sensor 9007 (including the function of detecting, detecting, or measuring force, displacement, position, velocity, acceleration, angular velocity, rotation speed, distance, light, liquid, magnetism, temperature, chemical substance, sound, time, hardness, electric field, current, voltage, power, radiation, flow rate, humidity, gradient, vibration, odor, or infrared rays), a microphone 9008, etc.

[0418] The electronic devices shown in Figures 25A to 25G have various functions. For example, they may have a function to display various information (still images, videos, text images, etc.) on a display unit, a touch panel function, a function to display a calendar, date, or time, a function to control processing using various software (programs), a wireless communication function, a function to read and process programs or data recorded on a recording medium, etc. Note that the functions of the electronic devices are not limited to these, and they may have various other functions. The electronic devices may have multiple display units. Furthermore, the electronic devices may have a function to include a camera or the like to capture still images or videos and store them on a recording medium (external or built-in to the camera), a function to display the captured images on a display unit, etc.

[0419] The electronic devices shown in FIGS. 25A to 25G will be described in detail below.

[0420] FIG. 25A is a perspective view showing a mobile information terminal 9101. The mobile information terminal 9101 can be used as, for example, a smartphone. Note that the mobile information terminal 9101 may be provided with a speaker 9003, a connection terminal 9006, a sensor 9007, and the like. The mobile information terminal 9101 can display text and image information on multiple surfaces. FIG. 25A shows an example in which three icons 9050 are displayed. Information 9051, indicated by a dashed rectangle, can also be displayed on another surface of the display unit 9001. Examples of the information 9051 include notifications of incoming emails, SNS messages, phone calls, etc., the title of the email or SNS message, the sender's name, the date and time, the remaining battery level, and radio wave intensity. Alternatively, an icon 9050 or the like may be displayed in the position where the information 9051 is displayed.

[0421] 25B is a perspective view showing the mobile information terminal 9102. The mobile information terminal 9102 has a function of displaying information on three or more surfaces of the display unit 9001. Here, an example is shown in which information 9052, information 9053, and information 9054 are displayed on different surfaces. For example, a user can check information 9053 displayed in a position that can be observed from above the mobile information terminal 9102 while the mobile information terminal 9102 is placed in a breast pocket of clothes. The user can check the display without taking the mobile information terminal 9102 out of the pocket and decide, for example, whether to answer a call.

[0422] 25C is a perspective view showing a tablet terminal 9103. The tablet terminal 9103 is capable of executing various applications such as mobile phone calls, e-mail, text browsing and creation, music playback, internet communication, and computer games, for example. The tablet terminal 9103 has a display unit 9001, a camera 9002, a microphone 9008, and a speaker 9003 on the front side of a housing 9000, operation keys 9005 as operation buttons on the left side of the housing 9000, and a connection terminal 9006 on the bottom.

[0423] FIG. 25D is a perspective view showing a wristwatch-type mobile information terminal 9200. The mobile information terminal 9200 can be used as, for example, a smart watch (registered trademark). The display surface of the display unit 9001 is curved, and display can be performed along the curved display surface. The mobile information terminal 9200 can also perform hands-free calling by communicating with, for example, a wirelessly capable headset. The mobile information terminal 9200 can also perform data transmission and charging with another information terminal through a connection terminal 9006. Note that charging may be performed by wireless power supply.

[0424] 25E to 25G are perspective views showing a foldable mobile information terminal 9201. Also, FIG. 25E is a perspective view of the mobile information terminal 9201 in an unfolded state, FIG. 25G is a perspective view of the mobile information terminal 9201 in a folded state, and FIG. 25F is a perspective view of a state in the process of changing from one of FIGS. 25E and 25G to the other. The mobile information terminal 9201 has excellent portability in a folded state, and excellent display visibility due to a seamless, wide display area in an unfolded state. The display portion 9001 of the mobile information terminal 9201 is supported by three housings 9000 connected by hinges 9055. For example, the display portion 9001 can be bent with a curvature radius of 0.1 mm or more and 150 mm or less.

[0425] This embodiment mode can be implemented by appropriately combining at least a part thereof with other embodiment modes described in this specification.

[0426] In this example, the results of measuring MTF of a display device according to one embodiment of the present invention will be described.

[0427] The MTF was measured for three types of display panels. One was a display device (sample) with an SBS structure using photolithography, as exemplified in the second embodiment.

[0428] The display panel includes a pixel circuit including a transistor and wiring including an oxide semiconductor, a pixel electrode on the pixel circuit, and light-emitting elements each having a red EL layer, a green EL layer, and a blue EL layer formed into an island shape by photolithography. Between the light-emitting elements, an insulating layer containing aluminum oxide is provided in contact with a side surface of the EL layer, and a resin layer containing acrylic is provided on the insulating layer. An electron injection layer and a common electrode are provided to cover the resin layer.

[0429] The display panel used in this example is a top-emission OLED display, with a diagonal size of the display area of ​​1.50 inches and a resolution of 3207 ppi.

[0430] For comparison, similar evaluations were also performed on two types of display panels (Comparative Example 1 (Ref. 1) and Comparative Example 2 (Ref. 2)) that used white OLEDs and color filters. The resolution of Comparative Example 1 and Comparative Example 2 was comparable to that of the display panel fabricated in this example (referred to as Example).

[0431] The MTF was measured using a display MTF measuring device (DT-8031-MV) manufactured by Astro Design Inc.

[0432] Fig. 26A shows the results of measuring MTF for the example (Sample), comparative example 1 (Ref. 1), and comparative example 2 (Ref. 2). In Fig. 26A, the horizontal axis represents spatial frequency [cpp], and the vertical axis represents MTF [%]. Fig. 26B shows the MTF values ​​for each display panel when the spatial frequency is 0.5 cpp.

[0433] 26A and 26B , it was confirmed that the display panel of this example exhibited a high MTF for any spatial frequency compared to the two comparative examples. In other words, it was confirmed that the display panel of this example was able to display a clear image with very little blur for the input image, demonstrating high display quality.

[0434] 10: display device, 20: display panel, 21: pixel section, 22: pixel, 23: drive circuit, 24: drive circuit, 30: signal generation section, 40: correction system, 41: correction data generation section, 42: signal generation section, 43: timing controller, 44: imaging device, 45: processing device, 46: determination section, 48: imaging range, 51: conveyance device, 100: display device, 101: substrate, 110: light emitting element, 110a: light emitting element, 110b: light emitting element, 110B: light emitting element, 110c: Light-emitting element, 110G: light-emitting element, 110R: light-emitting element, 111: pixel electrode, 111B: pixel electrode, 111C: connection electrode, 111G: pixel electrode, 111R: pixel electrode, 112: organic layer, 112B: organic layer, 112G: organic layer, 112R: organic layer, 113: common electrode, 114: common layer, 121: protective layer, 124a: pixel, 124b: pixel, 125: insulating layer, 126: resin layer, 128: layer, 140: connection portion, 150: pixel, 170: substrate, 171: adhesive layer

Claims

1. A correction method for a display device, comprising: The display device includes a display panel, a correction circuit, and a memory; While displaying an image with a first gradation on the display device, acquiring first imaging data including all pixels of the display device; While displaying an image with a second gradation on the display device, acquiring second imaging data including all the pixels of the display device; Generating correction data based on the first imaging data and the second imaging data; Outputting the correction data to the memory of the display device; While displaying a test image on the display device, acquiring third imaging data; Calculating an MTF value based on the third imaging data; Making a determination based on the MTF value; The correction circuit has a function of correcting image data based on the correction data stored in the memory to generate corrected image data and outputting the corrected image data to the display panel. A correction method for a display device.

2. In Claim 1, The display device has N×M pixels (N and M are natural numbers respectively); The correction data has N×M correction values corresponding to each of the N×M pixels. A correction method for a display device.

3. In Claim 1 or Claim 2, The correction data includes address information of pixels that are dot defects among the pixels of the display panel. A correction method for a display device.

4. In any one of Claims 1 to 3, The first imaging data and the second imaging data are respectively acquired by scanning and imaging the display panel. A correction method for a display device.

5. In any one of Claims 1 to 4, The first imaging data and the second imaging data are respectively acquired by imaging the entire display panel. A correction method for a display device.

6. A correction system for a display device, comprising: The display device includes a display panel, a correction circuit, and a memory; The correction system includes a correction data generation unit, a drive signal generation unit, a timing controller, and an imaging device; The drive signal generation unit has a function of generating image data based on a pre-stored test pattern and outputting the image data to the timing controller. The timing controller has a function of generating a control signal based on the image data, a function of outputting the image data to the display device, and a function of outputting the control signal to the imaging device. The display device has a function of displaying an image on the display panel based on the image data. The imaging device has a function of acquiring imaging data including all pixels of the display panel in a state where an image is displayed on the display panel based on the control signal and outputting the imaging data to the correction data generation unit. The correction data generation unit has a function of generating correction data based on the imaging data and outputting the correction data to the display device. The memory of the display device has a function of storing the correction data. The correction circuit has a function of correcting image data based on the correction data stored in the memory to generate corrected image data and outputting the corrected image data to the display panel. A correction system for a display device.

7. In claim 6, The display device has N×M (N and M are natural numbers respectively) pixels. The correction data generation unit has a function of generating the correction data such that the correction data has N×M correction values corresponding to each of the N×M pixels. A correction system for a display device.

8. In claim 6 or claim 7, The correction data generation unit has a function of generating the correction data such that the correction data includes address information of the pixels that are dot defects among the pixels of the display panel. A correction system for a display device.

9. In any one of claims 6 to 8, The imaging device has a function of acquiring the imaging data by scanning and imaging the display panel. A correction system for a display device.

10. In any one of claims 6 to 8, The imaging device has a function of acquiring the imaging data by imaging the entire display panel. The imaging device has a higher resolution than the display panel. A correction system for a display device.