electronic equipment

Abstract

Provided is a multifunctional display device or electronic apparatus. Provided is an electronic apparatus that can switch between VR display and AR display. The electronic apparatus has a first display device, a second display device, a lens, a screen, a mounting implement, and a housing. The mounting implement has a function for allowing the housing to be fixed to the head. The housing has a function for transforming between a closed first format in which visibility is obstructed and an open second format in which it is possible to see ahead. The electronic apparatus has a function for providing a first image that is displayed on the first display device via the lens and the screen in the first format and a function for providing a second image that is projected onto the screen from the second display device in the second format.

Description

Electronic equipment and communication systems

[0001] 1. Field of the Invention One aspect of the present invention relates to a display device, an electronic device including a display device, and a communication system for an electronic device.

[0002] Note that one embodiment of the present invention is not limited to the above technical field. Examples of the technical field of one embodiment of the present invention disclosed in this specification and the like include semiconductor devices, display devices, light-emitting devices, power storage devices, memory devices, electronic devices, lighting devices, input devices, input / output devices, driving methods thereof, and manufacturing methods thereof. A semiconductor device refers to any device that can function by utilizing semiconductor characteristics.

[0003] Wearable electronic devices and stationary electronic devices equipped with display devices for augmented reality (AR) or virtual reality (VR) are becoming increasingly popular. Examples of wearable electronic devices include head-mounted displays (HMDs) and eyeglass-type electronic devices. Examples of stationary electronic devices include head-up displays (HUDs).

[0004] In electronic devices such as HMDs, where the display unit is close to the user, the user can easily see the pixels, which can cause a strong sense of graininess, which can reduce the sense of immersion or realism in AR or VR. For this reason, it is preferable to provide the HMD with a display device having fine pixels so that the pixels are not visible to the user. Patent Document 1 discloses a method for realizing an HMD with fine pixels by using fine transistors that can be driven at high speed.

[0005] Japanese Patent Application Laid-Open No. 2000-2856

[0006] An object of one embodiment of the present invention is to provide a multifunctional display device or electronic device. Another object is to provide a display device or electronic device that can switch between VR display and AR display. Another object is to provide a wearable electronic device having a novel structure. Another object is to provide a display device or electronic device with high visibility. Another object is to provide a display device or electronic device with low power consumption. Another object is to provide a display device or electronic device that can be intuitively operated. Another object is to provide an electronic device that can be easily miniaturized. Another object is to provide an electronic device that can be easily lightweight.

[0007] An object of one embodiment of the present invention is to provide a display device having a novel structure or an electronic device having a novel structure. Alternatively, an object of one embodiment of the present invention is to provide a method for driving a display device having a novel structure or a method for driving an electronic device having a novel structure. Alternatively, an object of one embodiment of the present invention is to provide a method for driving a display device having a novel structure or a method for driving an electronic device having a novel structure. An object of one embodiment of the present invention is to at least alleviate at least one of the problems of the prior art.

[0008] Note that the description of these problems does not preclude the existence of other problems. Note that one embodiment of the present invention does not necessarily solve all of these problems. Note that problems other than these can be extracted from the description of the specification, drawings, claims, etc.

[0009] One aspect of the present invention is an electronic device having a first display device, a second display device, a lens, a screen, a wearing device, and a housing. The wearing device has a function of fixing the housing to the head. The housing has a function of transforming into a first state in which it is closed to block the field of view and a second state in which it is open to allow the user to see what is ahead. The electronic device also has a function of providing a first image displayed on the first display device via the lens and the screen in the first state, and a function of providing a second image projected from the second display device onto the screen in the second state.

[0010] Another aspect of the present invention is an electronic device having a first display device, a second display device, a lens, a screen, a wearing device, a housing, and a communication unit. The wearing device has a function of fixing the housing to the head. The housing has a function of transforming into a first state in which it is closed to block the field of view and a second state in which it is open to allow the user to see what is ahead. The electronic device has a function of providing a first image displayed on the first display device via the lens and the screen in the first state, and a function of providing a second image projected from the second display device onto the screen in the second state. The communication unit has a function of communicating with a terminal device via a wired or wireless connection. The first image data to be supplied to the first display device and the second image data to be supplied to the second display device are each supplied from the terminal device.

[0011] In any of the above, it is preferable that the housing has a first part that opens and closes and a second part that is fixed to the first screen. Furthermore, it is preferable that the first display device and the lens are provided in the first part, and the second display device is provided in the second part.

[0012] In any of the above, it is preferable that the first display device has a display area larger than that of the second display device.

[0013] In any of the above, it is preferable that the second display device has a higher definition than the first display device.

[0014] In any of the above, it is preferable that the first display device and the second display device each have a resolution of 3000 ppi or more and 10000 ppi or less.

[0015] In any of the above, it is preferable that the first display device has a display area with a diagonal size of 1.3 inches to 1.7 inches.

[0016] In any of the above, it is preferable that the electronic device further includes a pair of first cameras and a pair of second cameras. In this case, it is preferable that the first cameras have a function of capturing an image in front of the housing, and the second cameras have a function of capturing an image of the user's eyes. It is also preferable that the electronic device further has a function of acquiring gesture information using the first cameras, and a function of acquiring iris information or eye movement information using the second cameras.

[0017] In the above, it is preferable that a pair of third cameras are further provided. The third cameras preferably have a function of capturing an image in front of the housing. In this case, it is preferable that the third cameras have a narrower angle of view than the first cameras.

[0018] Another aspect of the present invention is a communication system including the electronic device, a terminal, and a server. In the communication system, the electronic device and the terminal are capable of communicating with each other, and the terminal and the server are connected via a network.

[0019] According to one embodiment of the present invention, a multifunctional display device or electronic device can be provided. Alternatively, a display device or electronic device capable of switching between VR display and AR display can be provided. Alternatively, a wearable electronic device having a novel configuration can be provided. Alternatively, a display device or electronic device with high visibility can be provided. Alternatively, a display device or electronic device with low power consumption can be provided. Alternatively, a display device or electronic device that can be intuitively operated can be provided. Alternatively, an electronic device that can be easily miniaturized can be provided. Alternatively, an electronic device that can be easily lightweight can be provided.

[0020] Furthermore, according to one embodiment of the present invention, it is possible to provide a display device having a novel configuration or an electronic device having a novel configuration. Alternatively, according to one embodiment of the present invention, it is possible to provide a driving method for a display device having a novel configuration or a driving method for an electronic device having a novel configuration. Alternatively, according to one embodiment of the present invention, it is possible to provide a display device having a novel configuration or a display system having a novel configuration. Furthermore, according to one aspect of the present invention, it is possible to at least alleviate at least one of the problems of the prior art.

[0021] Note that the description of these effects does not preclude the existence of other effects. Note that one embodiment of the present invention does not necessarily have all of these effects. Note that effects other than these can be extracted from the description in the specification, drawings, claims, etc.

[0022] 1A and 1B are diagrams illustrating an example of the configuration of an electronic device. FIG. 2 is a diagram illustrating an example of the configuration of an electronic device. FIGS. 3A and 3B are diagrams illustrating an example of the configuration of an electronic device. FIG. 4 is a block diagram illustrating an example of the configuration of an electronic device. FIGS. 5A and 5B are diagrams illustrating an example of the configuration of an electronic device and a terminal. FIG. 6A is a diagram illustrating an example of the configuration of an electronic device and a terminal. FIG. 6B is a diagram illustrating an example of the configuration of an electronic device. FIGS. 7A and 7B are diagrams illustrating an example of the configuration of an electronic device. FIGS. 8A and 8B are diagrams illustrating an example of the configuration of an electronic device. FIGS. 9A and 9B are diagrams illustrating an example of the configuration of an electronic device. FIG. 10 is a block diagram illustrating an example of the configuration of an electronic device and a terminal. FIGS. 11A to 11C are diagrams illustrating an example of the configuration of an electronic device and a terminal. FIG. 12 is a flowchart illustrating a method of operating an electronic device. FIG. 13 is a flowchart illustrating a method of operating an electronic device. FIGS. 14A to 14C are diagrams illustrating an example of an image displayed on an electronic device. FIGS. 15A to 15D are diagrams illustrating an example of an image displayed on an electronic device. FIGS. 16A and 16B are diagrams illustrating an example of the configuration of a display device. FIG. 17 is a diagram illustrating an example of the configuration of a display device. FIGS. 18A to 18C are perspective views of a display module. FIGS. 19A and 19B are diagrams showing an example of the configuration of a display device. FIGS. 20A to 20D are diagrams showing an example of the configuration of a display device. FIGS. 21A to 21D are diagrams showing an example of the configuration of a display device. FIG. 22 is a timing chart showing a method of driving a display device. FIGS. 23A and 23B are diagrams showing an example of the configuration of a display device. FIGS. 24A and 24B are diagrams showing an example of the operation of a display device. FIGS. 25A and 25B are diagrams showing an example of the configuration of a display device. FIGS. 26A to 26D are diagrams showing an example of the configuration of a display device. FIGS. 27A to 27C are diagrams showing an example of the configuration of a display device. FIG. 28 is a block diagram showing an example of the configuration of a display device. FIG. 29 is a block diagram showing an example of the configuration of a display device. FIGS. 30A and 30B are diagrams showing an example of the configuration of a display device. FIG. 31 is a diagram showing an example of the configuration of a display device. FIG. 32 is a diagram showing an example of the configuration of a display device. FIGS. 33A to 33C are diagrams showing an example of the configuration of a display device. 34A to 34F are diagrams showing examples of pixel configurations.Fig. 35A and Fig. 35B are diagrams showing an example of the configuration of a display device. Fig. 36 is a diagram showing an example of the configuration of a display device. Fig. 37 is a diagram showing an example of the configuration of a display device. Fig. 38 is a diagram showing an example of the configuration of a display device. Fig. 39 is a diagram showing an example of the configuration of a display device. Fig. 40 is a diagram showing an example of the configuration of a display device. Fig. 41 is a diagram showing an example of the configuration of a display device. Fig. 42 is a diagram showing an example of the configuration of a display device. Figs. 43A to 43F are diagrams showing an example of the configuration of a light-emitting device. Figs. 44A to 44C are diagrams showing an example of the configuration of a light-emitting device.

[0023] Hereinafter, embodiments will be described with reference to the drawings. However, it will be readily understood by those skilled in the art that the embodiments can be implemented in many different ways and that various changes in form and details can be made without departing from the spirit and scope of the present invention. Therefore, the present invention should not be interpreted as being limited to the following description of the embodiments.

[0024] In the configuration of the invention described below, the same parts or parts having similar functions are denoted by the same reference numerals in different drawings, and repeated explanations thereof will be omitted. In addition, when referring to similar functions, the same hatch pattern may be used and no particular reference numeral may be assigned.

[0025] In the drawings described in this specification, the size of each component, the thickness of a layer, or an area may be exaggerated for clarity, and therefore, the drawings are not necessarily limited to the scale.

[0026] In this specification, ordinal numbers such as "first" and "second" are used to avoid confusion of components and do not limit the number.

[0027] In this specification, the EL layer refers to a layer provided between a pair of electrodes of a light-emitting element and containing at least a light-emitting substance (also referred to as a light-emitting layer), or a stack including a light-emitting layer.

[0028] In this specification and the like, a display panel, which is one aspect of a display device, has a function of displaying (outputting) an image or the like on a display surface, and therefore the display panel is one aspect of an output device.

[0029] In addition, in this specification, a display panel having a connector such as an FPC (Flexible Printed Circuit) or a TCP (Tape Carrier Package) attached to the substrate, or a display panel having an IC mounted on the substrate using a COG (Chip On Glass) method or the like, may be referred to as a display panel module, a display module, or simply a display panel.

[0030] Embodiment 1 In this embodiment, a display device according to one embodiment of the present invention and an electronic device including the display device will be described.

[0031] One aspect of the present invention is a head-mountable electronic device. The electronic device has a function of displaying in various display modes. For example, the electronic device can switch between an AR display mode and a VR display mode. The AR display mode is a mode in which a real scene viewed through a screen can be displayed superimposed on an image displayed on the screen. The VR mode is a mode in which an image can be displayed in a state in which the field of view is blocked and the real scene cannot be seen.

[0032] An electronic device according to one embodiment of the present invention includes a housing having an openable / closable mechanism and a headwear to be worn on the head. The housing includes two display devices (a first display device and a second display device). In a VR mode, the housing is closed to block the user's view, and an image displayed on a display unit of the first display device disposed inside the housing is presented to the user. In an AR mode, the housing is opened to allow the user to view a real scene through a translucent screen, and an image projected from the second display device onto a screen is presented to the user.

[0033] It is also preferable to provide multiple image sensors (cameras) on the housing. By capturing an image of the hand with a camera facing the outside of the housing, hand movements (gestures) can be acquired as information, enabling gesture operation and thus enabling intuitive operation. Furthermore, by capturing an image of the user's eyes with a camera facing the inside of the housing, eye information and gaze movement information can be acquired for use in authentication processing, health management, or eye tracking. The information may be processed by the electronic device itself, or may be transmitted to and processed on a terminal or server separate from the electronic device.

[0034] The first display device and the second display device preferably have extremely high resolution. For example, a display device having a resolution of 1000 ppi or more, preferably 2000 ppi or more, more preferably 3000 ppi or more, even more preferably 4000 ppi or more, even more preferably 5000 ppi or more, and even more preferably 6000 ppi or more, and 10000 ppi or less, 9000 ppi or less, or 8000 ppi or less can be used.

[0035] The first display device and the second display device preferably have a higher number of pixels (resolution). For example, resolutions such as HD (1280 x 720 pixels), FHD (1920 x 1080 pixels), and WQHD (2560 x 1440 pixels) are possible. Furthermore, the first display device and the second display device preferably have extremely high resolutions such as WQXGA (2560 x 1600 pixels), 4K2K (3840 x 2160 pixels), and 8K4K (7680 x 4320 pixels). Resolutions of 4K2K, 8K4K, or higher are particularly preferred. Note that, when the aspect ratio of the display areas of the first display device and the second display device is 1:1 or close to 1:1, the number of signal lines and the number of scanning lines are not limited to the above, and it is preferable that both be 1000 or more.

[0036] There are no particular limitations on the screen ratio (aspect ratio) of the first display device and the second display device, and for example, the first display device and the second display device can each support various screen ratios such as 1:1 (square), 4:3, 16:9, and 16:10.

[0037] Furthermore, it is preferable that the size (area) of the display area of ​​the first display device used as a direct-view type is larger than that of the second display device. This not only allows the lenses and other components of the direct-view optical system to be thinner, but also reduces image distortion caused by the lenses. For example, the diagonal size of the first display device is preferably 0.5 inches or more, preferably 0.7 inches or more, more preferably 1 inch or more, and even more preferably 1.3 inches or more, and is preferably 2 inches or less, or 1.7 inches or less. Specifically, a size of 1.5 inches or thereabouts is preferable.

[0038] On the other hand, the second display device used as a projection type can enlarge and project an image onto a screen, so using a small display device leads to a reduction in the weight of the electronic device. Furthermore, it is preferable that the resolution of the second display device be higher than that of the first display device. This allows for the display of an image that is enlarged and displayed on a screen without any graininess and without impairing the sense of immersion.

[0039] Here, the electronic device is preferably configured to be capable of wired or wireless communication with an information terminal (hereinafter also referred to as a terminal). The terminal may be an information terminal such as a computer, a game console, a smartphone, a tablet terminal, or a wristwatch-type terminal. The electronic device and the terminal exchange data via communication, and some or all of the image data displayed on the screen of one terminal can be displayed on the first display device or the second display device of the electronic device. That is, the image data (first image data) to be supplied to the first display device and the image data (second image data) to be supplied to the second display device are supplied from the terminal to the electronic device. The image displayed on the electronic device may be an image processed by a processing method such as upconversion or downconversion.

[0040] In addition, it is preferable that the terminal device has a first communication unit for communicating with the electronic device and a second communication unit for connecting to and communicating with a communication network such as the Internet, an intranet, etc. For example, content to be displayed on the electronic device is sent to the electronic device through the terminal device and executed there.

[0041] The terminal device can be provided with a function to control each component of the electronic device. For example, the terminal device can be provided with a function to control the first display device, the second display device, multiple cameras, various sensors, etc., of the electronic device. The terminal device can be made capable of controlling the electronic device by installing various device drivers and application software for driving the electronic device. This eliminates the need for the electronic device itself to perform large-scale calculations, thereby simplifying the configuration and facilitating the miniaturization and weight reduction of the electronic device. It is preferable that the electronic device to be worn on the head be as light as possible.

[0042] Furthermore, it is preferable that the terminal device has a battery for supplying power to the electronic device and a circuit for charging the battery. By configuring the terminal device to supply power to the electronic device, the electronic device can be made lighter, thereby reducing the burden on the user. A battery may also be provided in the electronic device. By providing a battery in the electronic device, the electronic device can be driven by itself. It is preferable that the battery installed in the electronic device has a smaller capacity than the terminal device, since this reduces the increase in weight of the electronic device.

[0043] A more specific example will be described below with reference to the drawings.

[0044] 1A and 1B show schematic cross-sectional views of an electronic device 500. Fig. 1A corresponds to the VR mode, and Fig. 1B corresponds to the AR mode.

[0045] The electronic device 500 has a function as a portable information terminal, and can execute various programs and play various content by connecting to the Internet. For example, the electronic device 500 has a function to display augmented reality content in AR mode and a function to display virtual reality content in VR mode. Note that the electronic device 500 may also have a function to display substitutional reality (SR) or mixed reality (MR) content in addition to AR and VR.

[0046] The electronic device 500 can be intuitively operated by gesture operations using one or both hands. For example, with conventional smartphones, tablet devices, or the like, it is necessary to hold the device with one hand and operate the screen with the holding hand or the fingers of the other hand. Even with devices with small screens, at least one hand is often occupied, which is inconvenient. On the other hand, the electronic device 500 of one embodiment of the present invention is preferable because it allows hands-free operation.

[0047] The electronic device 500 has a housing 501, an optical member 504, a mounting fixture 505, etc. The housing 501 has a first part 502 and a second part 503. The second part 503 is fixed to the optical member 504 and the mounting fixture 505. The first part 502 has an opening and closing mechanism.

[0048] The first section 502 has a display device 511 and a lens 512. A user can view an image displayed on the display device 511 through the optical member 504 and the lens 512.

[0049] The first part 502 preferably has a mechanism for adjusting the distance between the display device 511 and the lens 512 or the angle between them. This allows for focus adjustment and image enlargement and reduction. For example, one or both of the display device 511 and the lens 512 may be configured to be movable in the vertical axis direction.

[0050] The second part 503 has a display device 521 and a reflector 522. Furthermore, a reflecting surface 523 that functions as a screen is formed inside the optical member 504. The reflecting surface 523 functions as a half mirror and transmits light. As shown by the arrows in FIG. 1B , light emitted from the display device 521 is reflected by the reflector 522 and enters the optical member 504. The light is totally reflected within the optical member 504 and reaches the reflecting surface 523, whereby an image is projected onto the reflecting surface 523. The user can view the image projected onto the reflecting surface 523 by superimposing it on the transmitted image that has passed through the reflecting surface 523.

[0051] The wearing device 505 can take various forms as long as it can be fixed to the user's head. In Fig. 1A and other figures, it is shown as having a shape similar to the temples of glasses, but is not limited to this. The wearing device 505 only needs to be wearable by the user, and may be, for example, in the form of a helmet or a band.

[0052] Fig. 2 is a schematic diagram of electronic device 500 as viewed from above. As shown in Fig. 2, electronic device 500 has a pair of optical members 504, a mounting fixture 505, a display device 511, and a lens 512. Note that display device 511 may be a single display device instead of a pair.

[0053] The electronic device 500 has two types of imaging devices (camera 531 and camera 532) for capturing images of the outside. The camera 531 has a function of capturing images in front of the housing 501 and is equipped with a wide-angle lens for capturing images within a range of, for example, approximately 1 m from the electronic device 500. The camera 531 is an imaging device for capturing images mainly for performing gesture operations using the user's hand movements. The camera 532 is an imaging device for mainly capturing landscape images and has a telephoto lens more telephoto than the camera 531. In other words, the camera 532 has a longer focal length and a narrower angle of view than the camera 531. The cameras 531 and 532 may each have a zoom mechanism for changing the focal length. In this case, the camera 532 can be selected so that the maximum focal length of the camera 532 is greater than the maximum focal length of the camera 531.

[0054] 2 shows a configuration in which electronic device 500 has a pair of cameras 531 and 532. This enables stereo imaging, enabling 3D images to be captured, and also enabling calculation of the distance to an object. Note that electronic device 500 may also have a configuration in which it has one camera 531 and one camera 532.

[0055] The electronic device 500 also has a pair of imaging devices (cameras 533) for capturing images of the inside. Each of the pair of cameras 533 is a camera for capturing an image of the right eye or the left eye. The cameras 533 are preferably sensitive to infrared light. The cameras 533 can capture images of the user's right eye and left eye, respectively, and the images can be used for iris authentication, healthcare, eye tracking, and the like. Although not shown here, it is preferable for the electronic device 500 to have a light source that emits infrared light for illumination. The electronic device 500 may also be configured to have one camera 533 that captures images of both eyes.

[0056] In FIG. 2, examples of the imaging ranges of the cameras 531, 532, and 533 are shown by dashed lines.

[0057] Although an example including the camera 531 has been shown here, a distance measuring sensor (hereinafter also referred to as a detection unit) capable of measuring the distance to an object may be provided as the camera 531. That is, the camera 531 is one aspect of the detection unit. As the detection unit, for example, an image sensor or a range image sensor such as a LIDAR (Light Detection and Ranging) can be used. By using an image obtained by the camera and an image obtained by the range image sensor, more information can be obtained, enabling more accurate gesture operations.

[0058] 5A, 5B, and 6A show an example having an electronic device 500 and a terminal device 550. The electronic device 500 is connected to the terminal device 550 via a cable 520. In this example, a smartphone is used as the terminal device 550.

[0059] The electronic device 500 can display video content output from the terminal device 550. The electronic device 500 can also be said to have a function as a video display device. For example, the electronic device 500 may have a function to display SR or MR content in addition to AR and VR content.

[0060] The electronic device 500 may also have a function as a mobile information terminal. For example, the electronic device 500 may be able to execute various programs and play various content by connecting to the Internet by itself.

[0061] 1B and 5B show examples of displaying an image using the display device 521 with a reflector 522 and a reflecting surface 523, but other configurations are also possible. For example, FIG. 6B shows a configuration using an optical element 524 and an optical element 525. The display device 521 is positioned so as to emit an image (light) downward. A portion of the light emitted from the display device 521 is reflected by the optical element 524 toward the optical element 525 and projected onto the optical element 525. A portion of the light reflected by the optical element 525 passes through the optical element 524 and reaches the user's eyes. This allows the image of the display device 521 to be displayed superimposed on an actual background.

[0062] A lens 526 may be provided on the front surface of the display device 521. Furthermore, a microlens array may be provided between the display device 521 and the lens 526.

[0063] The optical members 524 and 525 may be configured to include a polarizing plate, a circular polarizing plate, a lens, a half mirror, etc. For example, the optical member 524 functions as a beam splitter, transmitting light of a predetermined polarization and reflecting light of other polarizations. The optical member 525 has a function of collecting and reflecting light reflected from the optical member 524, and polarizing the light so that it can pass through the optical member 524.

[0064] 3A and 3B show an example of the configuration of an electronic device 500 different from the above.

[0065] In the electronic device shown in Figures 3A and 3B, the wearing device 505 has a band-like shape. This makes it less likely to slip off than the configuration shown in Figure 1A, etc., and is therefore suitable for enjoying content that requires a relatively high level of physical activity, such as attractions. Although not shown here, a battery or the like may be built into the wearing device 505 at a position opposite the portion 506 (toward the back of the head). By balancing the weight of the portion 506 and the weight of the battery, the center of gravity of the electronic device 500 can be adjusted, improving the wearing comfort.

[0066] The wearing device 505 also has a portion 506 that covers the user's forehead. By including the portion 506, it is possible to make it less likely to slip off. Furthermore, electrodes can be provided on the portion of the wearing device 505 that touches the forehead, and electroencephalograms can be measured using these electrodes.

[0067] 7A and 7B show an example of the configuration of an electronic device 500 different from that described above. As shown in FIG. 7A, the first section 502 has a shape that covers not only the front but also the sides of the face when closed. This can shield the user's field of vision from external light, thereby enhancing the sense of realism and immersion. For example, depending on the content displayed, it can also enhance the sense of fear felt by the user.

[0068] 7A and 7B show an example in which a battery 507 is built into the rear side of the head of the wearing device 505. Furthermore, Fig. 7A and 7B show an example in which a cable 520 is connected to the wearing device 505.

[0069] 8A and 8B show examples of the configuration of electronic device 500 that are different from those described above. Fig. 8A shows a state in which first section 502 is closed, and Fig. 8B shows a state in which first section 502 is open.

[0070] 8A and 8B has a configuration in which the wearing device 505 is fastened by hanging it over the ear. The wearing device 505 may function as a speaker using bone conduction, a microphone, or both. That is, the wearing device 505 may have a bone conduction speaker, a microphone, or both, built in it, and may be configured to contact at least a part of the head.

[0071] 9A and 9B show an example of the configuration of an electronic device 500 that is different from the above.

[0072] The second portion 503 of the housing 501 is provided with a slot into which the terminal device 550 is inserted. By inserting the terminal device 550 into the slot, the electronic device 500 and the terminal device 550 are enabled to communicate with each other. In this way, since the electronic device 500 has a mechanism capable of holding the terminal device 550, the user does not need to select clothing with a pocket or the like for storing the terminal device 550 or to wear a bag or the like, which is preferable.

[0073] Here, the case where the terminal device 550 is a smartphone having a display unit is shown. In this case, the screen of the terminal device 550 may be used as the display device 521 provided in the second part 503. That is, the terminal device 550 may be inserted into a slot so that the screen is positioned downward, and an image displayed on the screen may be projected onto the reflective surface 523 of the optical member 504. By adopting such a configuration, the configuration of the electronic device 500 can be simplified, and it becomes easier to reduce the cost, weight, and size.

[0074] 9B, the first part 502 may be configured to be detachable, and shows the state when the first part 502 and the terminal device 550 are removed.

[0075] 4 is a block diagram showing an example of a hardware configuration of a portion of the electronic device 500. The electronic device 500 has a control unit 551, a storage unit 552, a camera 531, a camera 533, an open / close sensor 553, a display device 511, a display device 521, a communication unit 554, etc. Each configuration (component) is electrically connected to one another via a bus line.

[0076] In the following, for ease of explanation, when there is no need to distinguish between components other than the control unit 551 of the electronic device 500, these may be simply referred to as components.

[0077] The control unit 551 can function as, for example, a central processing unit (CPU) and has a function of controlling each component.

[0078] The storage unit 552 can store various data such as program data, system data, user data, etc. The control unit 551 can read data from the storage unit 552 and store data in the storage unit 552.

[0079] The open / close sensor 553 has a function of obtaining the open / close state of the first part 502 of the housing 501 and outputting the information to the control unit 551. The open / close sensor 553 has a mechanical, optical, or electrical switch, and can obtain the open / close state of the housing 501.

[0080] The EEG sensor 555 has a function of acquiring the user's brain waves and outputting the information to the control unit 551. The EEG sensor has, for example, one or more electrodes that come into contact with the user's forehead. The EEG sensor 555 can acquire frequency and amplitude information for brain waves such as alpha waves, beta waves, theta waves, and delta waves. The control unit 551 can estimate the user's state of alertness and the like from the EEG information and execute processing according to the state of alertness.

[0081] Signals are transmitted between the control unit 551 and each component via a bus line. The control unit 551 has a function of processing signals input from each component connected via the bus line and a function of generating signals to be output to each component, and can comprehensively control each component connected to the bus line.

[0082] Note that a transistor having an oxide semiconductor in a channel formation region and an extremely low off-state current can also be used in the control unit 551 or an IC or the like included in other components. Because the off-state current of the transistor is extremely low, the transistor can be used as a switch for retaining charge (data) flowing into a capacitor functioning as a memory element, thereby ensuring a long data retention period. By utilizing this characteristic in a register, cache memory, or the like of the control unit 551, the control unit 551 is operated only when necessary, and information from the previous process is saved in the memory element at other times. This enables so-called normally-off computing, in which the power supply to the control unit 551 is cut off when not in use, thereby enabling low power consumption of the electronic device 500.

[0083] The control unit 551 performs various data processing and program control by interpreting and executing commands from various programs using the processor. The programs that can be executed by the processor may be stored in a memory area of ​​the processor or may be stored in the storage unit 552.

[0084] In addition to a CPU, other microprocessors such as a DSP (Digital Signal Processor) and a GPU (Graphics Processing Unit) can be used alone or in combination as the control unit 551. These microprocessors may also be configured to be realized by a PLD (Programmable Logic Device) such as an FPGA (Field Programmable Gate Array) or an FPAA (Field Programmable Analog Array).

[0085] The control unit 551 may have a main memory, which may include a volatile memory such as a random access memory (RAM) or a non-volatile memory such as a read only memory (ROM).

[0086] The RAM provided in the main memory may be, for example, a dynamic random access memory (DRAM), and a virtual memory space is allocated to and used as a working space for the control unit 551. The operating system, application programs, program modules, program data, etc. stored in the storage unit 552 are loaded into the RAM for execution. The data, programs, program modules, etc. loaded into the RAM are directly accessed and operated by the control unit 551.

[0087] On the other hand, the ROM can store a BIOS (Basic Input / Output System), which does not require rewriting, firmware, etc. As the ROM, a mask ROM, an OTPROM (One Time Programmable Read Only Memory), an EPROM (Erasable Programmable Read Only Memory), etc. can be used. Examples of EPROMs include UV-EPROMs (Ultra-Violet Erasable Programmable Read Only Memories), which allow stored data to be erased by exposure to ultraviolet light, EEPROMs (Electrically Erasable Programmable Read Only Memories), and flash memories.

[0088] Furthermore, it is preferable that the control unit 551 has a processor specialized for parallel calculations rather than a CPU. For example, it is preferable that the control unit 551 has a processor having a large number (tens to hundreds) of processor cores capable of parallel processing, such as a GPU, a TPU (Tensor Processing Unit), or an NPU (Neural Processing Unit). This allows the control unit 551 to perform calculations, particularly those related to neural networks, at high speed.

[0089] The storage unit 552 may be, for example, a storage device using a nonvolatile storage element such as a flash memory, MRAM (Magnetoresistive Random Access Memory), PRAM (Phase Change RAM), ReRAM (Resistive RAM), or FeRAM (Ferroelectric RAM), or a storage device using a volatile storage element such as a DRAM (Dynamic RAM) or SRAM (Static RAM). Alternatively, a recording media drive such as a hard disk drive (HDD) or a solid state drive (SSD) may be used.

[0090] The communication unit 554 can wirelessly exchange data with external communication devices. For example, the communication unit 554 can communicate via an antenna. The communication means (communication method) of the communication unit 554 can be, for example, connecting each device to a computer network such as the Internet, an intranet, an extranet, a personal area network (PAN), a local area network (LAN), a campus area network (CAN), a metropolitan area network (MAN), a wide area network (WAN), or a global area network (GAN), which is the foundation of the World Wide Web (WWW). When performing wireless communication, communication standards such as LTE (Long Term Evolution), GSM (Global System for Mobile Communication: registered trademark), EDGE (Enhanced Data Rates for GSM Evolution), CDMA2000 (Code Division Multiple Access 2000), and W-CDMA (registered trademark), or specifications standardized by IEEE such as Wi-Fi (registered trademark), Bluetooth (registered trademark), and ZigBee (registered trademark), can be used as communication protocols or communication technologies.

[0091] 10 is a block diagram showing an example of a partial hardware configuration of electronic device 500 and terminal device 550. Electronic device 500 has a control unit 551, display device 511, display device 521, camera 531, camera 533, communication unit 558, open / close sensor 553, brain wave sensor 555, audio output unit 556, microphone 557, etc. Each configuration (component) is electrically connected to one another via a bus line (not shown).

[0092] The control unit 551 functions as a central processing unit and has a function of controlling each component. For example, the control unit 551 controls each component in response to a command transmitted from the terminal device 550 via the communication unit 558. The control unit 551 also has a function of outputting data output from each component to the terminal device 550 via the communication unit 558.

[0093] A built-in speaker such as a speaker or a bone conduction speaker may be used as the audio output unit 556. Alternatively, audio data may be output to earphones, headphones, an external speaker, or the like, wirelessly or via a wired connection.

[0094] The terminal 550 includes a control unit 571, a storage unit 572, a communication unit 573, a communication unit 574, a display device 575, a camera 576, and a sensor 577. Note that the configuration of the terminal 550 is not limited to this, and the terminal 550 may include various components depending on the type of the terminal.

[0095] For the communication unit 574, the description of the communication unit 554 can be referred to.

[0096] The communication unit 573 has a function of communicating with the communication unit 558 of the electronic device 500. When performing communication via a wired connection, the communication unit 573 may be configured to include a connection terminal. For example, a general-purpose external connection terminal such as a USB (Universal Serial Bus) may be used.

[0097] When the communication unit 573 communicates with the communication unit 558 via a wireless connection, the communication unit 573 can share the hardware with the communication unit 574 .

[0098] The description of the control unit 551 can be referred to for the control unit 571. It is preferable that the control unit 571 of the terminal device 550 uses a processor having higher computing performance than the control unit 551 of the electronic device 500.

[0099] For the storage unit 572, the description of the storage unit 552 can be referred to.

[0100] The sensor 577 may be any of various sensors depending on the type of the terminal 550. For example, a touch sensor, an illuminance sensor, an acceleration sensor, a fingerprint sensor, a temperature sensor, a humidity sensor, a geomagnetic sensor, a GPS, or the like may be used.

[0101] [Specific Examples of Terminals and Electronic Devices] FIGS. 11A to 11C show specific examples of terminals and electronic devices.

[0102] 11A shows a terminal device 550A and an electronic device 500A. Each of the terminal device 550A and the electronic device 500A has a wireless communication function.

[0103] Terminal device 550A is a portable information terminal device that functions as a smartphone. Terminal device 550A has a housing 570, a communication unit 574, and a display device 575. Here, an example is shown in which communication unit 574 also functions as communication unit 573. That is, communication unit 574 has both a function of communicating with a server or the like via a network and a function of communicating with electronic device 500A. Note that FIG. 11A shows right hand 530R of a user operating terminal device 550A.

[0104] 8A can be referred to for the configuration of the electronic device 500A. Wireless communication between the electronic device 500A and the terminal 550A can be performed between the communication unit 574 and the communication unit 558.

[0105] 11A has a function of outputting audio to earphone 579. Here, an example is shown in which audio information is output from terminal device 550A to earphone 579 via wireless communication. However, the present invention is not limited to this, and audio information may be output from electronic device 500A to earphone 579.

[0106] Terminal device 550B shown in Fig. 11B functions as a wristwatch-type portable information terminal. Terminal device 550B has a housing 570, a display device 575, a communication unit 573, a communication unit 574, and a band 578. Fig. 11B also shows a user's right hand 530R and left hand 530L. Terminal device 550B and electronic device 500B can communicate wirelessly via communication unit 573 and communication unit 578.

[0107] The electronic device 500B has a sound output function that utilizes bone conduction. In this example, the wearing device 505 vibrates to provide sound to the user using bone conduction.

[0108] Terminal device 550C shown in Fig. 11C functions as a game machine. Terminal device 550C has at least a communication unit 574 and a control unit 571 inside housing 570. Communication unit 574 also functions as communication unit 573. Fig. 11C also shows controller 580. Controller 580 has a wireless communication function and is connected to terminal device 550C.

[0109] The terminal 550C includes a processor, a storage device, and the like. A user can play various game contents by launching applications on the terminal 550C. The terminal 550C can also execute applications such as a video playback application, an image playback application, a music playback application, and an internet browser in addition to game contents. The terminal 550C can also be used as a personal computer.

[0110] Although an example in which the controller 580 is used has been shown here, the controller 580 does not need to be used if the game is enjoyed through gesture control using the camera of the electronic device 500C.

[0111] The electronic device 500C includes a wired earphone 579. The earphone 579 is connected to the wearing attachment 505 via a cable.

[0112] The combinations of electronic devices and terminals are not limited to those shown in Figures 11A to 11C. For example, electronic device 500A can be connected to any of terminals 550A, 550B, and 550C.

[0113] In this way, electronic device 500 and terminal device 550 can communicate with each other via wire or wirelessly. Therefore, electronic device 500 can transfer the function of generating video content (image data) to be displayed on display devices 511 and 521 to terminal device 550. In addition, the function of processing data captured by multiple cameras and data acquired by various sensors of electronic device 500 can be transferred to terminal device 550. By entrusting processing requiring high computing power to terminal device 550 in this way, the configuration of electronic device 500 can be simplified, thereby facilitating cost reduction, weight reduction, and size reduction.

[0114] For example, when performing iris authentication, the processing may be completed within electronic device 500, or electronic device 500 may only take an image and the processing related to authentication may be performed by terminal device 550. Specifically, electronic device 500 may output image data of the user's eyes and their surroundings acquired by camera 533 of electronic device 500 to terminal device 550, and control unit 571 of terminal device 550 may perform authentication by collating the image data with authentication data of the true user stored in storage unit 572 or the like of terminal device 550.

[0115] Furthermore, instead of performing processing requiring high computing power in the electronic device 500 and the terminal device 550, the processing may be performed by a server connected via a network. This type of processing is also called a thin client, in which only limited processing is performed on the user (client) terminal (here, the terminal device 550 and the electronic device 500), and advanced processing such as application execution and management is performed on the server side, thereby reducing the scale of processing on the client side terminal. This eliminates the need for a computing device with high computing power not only for the electronic device 500 but also for the terminal device 550, making it easier to reduce costs, weight, and size.

[0116] For example, when performing AR display and VR display, it is necessary to use a head tracking function and an eye tracking function to generate images that match the movement of the head and the movement of the gaze, and this processing can be performed by a server. When performing such processing, it is preferable to use a fifth-generation mobile communication system (commonly known as 5G), which has high speed and low latency, because this can reduce delays as much as possible and reduce so-called VR sickness that occurs when images are delayed relative to head and eye movements.

[0117] [Operation Method of Electronic Device] Next, an example of an operation method of the electronic device 500 illustrated in Fig. 4 will be described using a flowchart. A flowchart is shown in Fig. 12. The flowchart shown in Fig. 12 is a flowchart of an operation method performed when the electronic device 500 is started up. The flowchart shown in Fig. 12 has steps S01 to S09.

[0118] The process starts in step S01. At this time, it is assumed that the electronic device 500 is powered on.

[0119] In step S02, the electronic device 500 is worn. The control unit 551 acquires information that the electronic device 500 is being worn from output data of the acceleration sensor, image data of various cameras, and the like.

[0120] In step S03 , the open / close sensor 553 acquires the open / close state of the housing 501 and outputs the information to the control unit 551 .

[0121] In step S04 , camera 533 captures an image of the user's eyes and outputs the captured image data to control unit 551 .

[0122] In step S05, the control unit 551 executes authentication processing based on the captured image data. For example, the control unit 551 can execute iris authentication processing using the captured image data. Specifically, the control unit 551 compares the feature points of the captured iris image with the feature points of the iris of the real user previously stored in the storage unit 552, and determines whether they belong to the same person. Then, in step S06, if the user is authenticated (authentication successful), the process proceeds to step S07.

[0123] If authentication is not successful in step S06, the process returns to step S04. If authentication fails a predetermined number of times, processing such as issuing a warning may be executed.

[0124] In step S07, if the housing 501 is in the open state, the process proceeds to step S08, and if it is in the closed state, the process proceeds to step S09.

[0125] In step S08, the AR mode is executed. Specifically, an image is displayed on the display device 521.

[0126] In step S09, the VR mode is executed. Specifically, an image is displayed on the display device 511.

[0127] Step S03 may be performed at any time after step S02 and before step S07. Step S03 may also be performed in parallel with other steps.

[0128] Next, an example of an operation method will be shown for the configuration including the electronic device 500 and the terminal device 550 illustrated in Fig. 10 etc. The flowchart shown in Fig. 13 is a flowchart of the operation method when the electronic device 500 is started up. The flowchart shown in Fig. 13 has steps S11 to S19.

[0129] The process starts in step S11. At this time, it is assumed that the power of the electronic device 500 is on and that the electronic device 500 and the terminal device 550 are connected to each other.

[0130] In step S12, the electronic device 500 is worn. The control unit 551 or the control unit 571 acquires, from output data of the acceleration sensor, image data of various cameras, and the like, that the electronic device 500 is being worn.

[0131] In step S13, the open / close sensor 553 acquires the open / close state of the housing 501 and outputs the information to the control unit 551. The control unit 551 outputs the information to the control unit 571 of the terminal device 550 via the communication unit 558.

[0132] In step S14 , the camera 533 captures an image of the user's eyes and outputs the captured image data to the control unit 551 .

[0133] In step S15, the control unit 551 or the control unit 571 executes authentication processing based on the image data. For example, the control unit 551 or the control unit 571 can execute authentication processing for iris authentication using the image data. Specifically, the control unit 551 or the control unit 571 compares the feature points of the captured iris image with the feature points of the iris of the real user stored in advance in the storage unit 572 or the like, and determines whether these belong to the same person. Then, in step S16, if authentication is successful (authentication is successful), the process proceeds to step S17.

[0134] If authentication is not successful in step S16, the process returns to step S14. If authentication fails a predetermined number of times, processing such as issuing a warning may be executed.

[0135] In step S17, if the housing 501 is in the open state, the process proceeds to step S18, and if it is in the closed state, the process proceeds to step S19.

[0136] In step S18, the AR mode is executed. Specifically, an image is displayed on the display device 521.

[0137] In step S19, the VR mode is executed. Specifically, an image is displayed on the display device 511.

[0138] Note that step S13 may be performed at any time after step S12 and before step S17. Furthermore, step S13 may be performed in parallel with other steps.

[0139] The above is a description of an example method of operation.

[0140] [Image Examples] Hereinafter, examples of operations that can be experienced by a user and examples of images that can be presented to a user using a display system according to one embodiment of the present invention will be described.

[0141] 14A shows a state in which user 540 is performing a gesture operation while wearing electronic device 500. User 540 also has terminal 550 in his pocket. Electronic device 500 and terminal 550 are in a communication state. At this time, since the housing of electronic device 500 is in an open state, user 540 can see an image displayed in AR mode. Note that when using electronic device 500 alone, user 540 does not necessarily have terminal 550 or a pocket to store terminal 550.

[0142] 14B shows an example of the field of view 560 of the user 540 shown in FIG. 14A. In the field of view 560, image information 561 is shown superimposed on the actual interior scenery, such as the floor, walls, and doors. Here, the image information 561 shown is an image simulating the screen of a smartphone or tablet device.

[0143] The user can operate the image information 561, which appears to be floating in the air, in the same way as operating a smartphone, and thus can use it without feeling uncomfortable. In addition, by operating the edge of the image information 561 as shown in Fig. 14C, the image information 561 can be rotated from portrait to landscape.

[0144] 15A shows a state in which user 540 is about to eat grapes while wearing electronic device 500. At this time, the housing of electronic device 500 is in an open state, so user 540 can see an image displayed in AR mode.

[0145] 15B shows an example of a field of view 560 of a user 540. The electronic device 500 can determine whether the grapes are sweet based on image information of the grapes, and can display the sweet grapes as a marker by overlaying a color on the actual grapes. Also displayed within the user's field of view is image information 562 showing information about the selected grapes, and on the periphery of the field of view are images 563 and the like that function as menu icons.

[0146] 15C shows a state in which user 540 is performing a gesture operation while wearing electronic device 500. At this time, since the housing of electronic device 500 is closed, user 540 can see an image displayed in VR mode.

[0147] FIG. 15D shows an example of a field of view 560 of a user 540. The user is performing 3D modeling (sculpting) using an object 564 displayed in a virtual space. A right hand 540R and a left hand 540L displayed in the field of view 560 are images that move in the same way as the right and left hands of the user 540. The object 564 can be deformed and shaped by various operations such as grabbing, pinching, pulling, and twisting the object 564. In addition, by pressing a menu icon 565, sculpting tools such as a knife or spatula can be used.

[0148] In this way, the electronic device 500 according to one aspect of the present invention allows users to experience both the AR mode and the VR mode with a single device. Furthermore, the electronic device 500 allows users to switch between the AR mode and the VR mode by simply opening and closing the housing.

[0149] At least a part of the configuration examples exemplified in this embodiment and the corresponding drawings can be combined as appropriate with other configuration examples or drawings.

[0150] This embodiment mode can be implemented by appropriately combining at least a part thereof with other embodiment modes described in this specification.

[0151] Embodiment 2 Hereinafter, a configuration example of a display device applicable to the display device of the electronic device exemplified in Embodiment 1 will be described with reference to the drawings.

[0152] 16A is a perspective view of a display device 10A that can be used as the display device of the electronic device described in Embodiment 1. The display device 10A can be used as the display device 511 and the display device 521.

[0153] The display device 10A has a substrate 11 and a substrate 12. The display device 10A has a display unit 13 composed of elements provided between the substrate 11 and the substrate 12. The display unit 13 is an area in the display device 10A that displays an image. The display unit 13 has a plurality of pixels 230. Each pixel 230 has a pixel circuit 51 and a light-emitting element 61 (not shown).

[0154] Furthermore, by arranging the pixels 230 in a matrix of 1920 x 1080 pixels, a display unit 13 capable of displaying at a resolution of so-called full high-definition (also referred to as "2K resolution," "2K1K," or "2K") can be realized. Furthermore, by arranging the pixels 230 in a matrix of 3840 x 2160 pixels, for example, a display unit 13 capable of displaying at a resolution of so-called ultra high-definition (also referred to as "4K resolution," "4K2K," or "4K") can be realized. Furthermore, by arranging the pixels 230 in a matrix of 7680 x 4320 pixels, for example, a display unit 13 capable of displaying at a resolution of so-called super high-definition (also referred to as "8K resolution," "8K4K," or "8K") can be realized. By increasing the number of pixels 230, a display unit 13 capable of displaying at a resolution of 16K or even 32K can also be realized.

[0155] The pixel density (resolution) of the display unit 13 is preferably 1000 ppi or more and 10000 ppi or less, but may be, for example, 2000 ppi or more and 6000 ppi or less, or 3000 ppi or more and 5000 ppi or less.

[0156] There are no particular limitations on the screen ratio (aspect ratio) of the display unit 13. The display unit 13 can support various screen ratios, such as 1:1 (square), 4:3, 16:9, and 16:10.

[0157] In this specification and the like, the term “element” may be replaced with “device.” For example, a display element, a light-emitting element, and a liquid crystal element may be replaced with a display device, a light-emitting device, and a liquid crystal device.

[0158] The display device 10A receives various signals and power supply potentials from the outside via the terminal unit 14, and can display images using display elements provided in the display unit 13. Various elements can be used as the display elements. Representative examples include light-emitting elements that have a function of emitting light, such as organic EL elements and LED elements, liquid crystal elements, and MEMS (Micro Electro Mechanical Systems) elements.

[0159] A plurality of layers are provided between the substrate 11 and the substrate 12, and each layer is provided with a transistor for performing circuit operation or a display element for emitting light. The plurality of layers are provided with pixel circuits having a function of controlling the operation of the display elements, drive circuits having a function of controlling the pixel circuits, function circuits having a function of controlling the drive circuits, and the like.

[0160] FIG. 16B is a perspective view showing a schematic configuration of each layer provided between the substrate 11 and the substrate 12.

[0161] A layer 20 is provided on the substrate 11. The layer 20 includes a driver circuit 30, a functional circuit 40, and an input / output circuit 80. The layer 20 includes a transistor 21 (also referred to as a Si transistor) having silicon in a channel formation region 22. The substrate 11 is, for example, a silicon substrate. A silicon substrate is preferable because it has higher thermal conductivity than a glass substrate. By providing the driver circuit 30, the functional circuit 40, and the input / output circuit 80 on the same layer, the wiring electrically connecting the driver circuit 30, the functional circuit 40, and the input / output circuit 80 can be shortened. This shortens the charging and discharging time of the control signal used by the functional circuit 40 to control the driver circuit 30, thereby reducing power consumption. Furthermore, the charging and discharging time required for the input / output circuit 80 to supply signals to the functional circuit 40 and the driver circuit 30 is shortened, thereby reducing power consumption.

[0162] The transistor 21 can be, for example, a transistor having single crystal silicon in a channel formation region (also referred to as a "c-Si transistor"). In particular, when a transistor having single crystal silicon in a channel formation region is used as the transistor provided in the layer 20, the on-state current of the transistor can be increased. Therefore, a circuit included in the layer 20 can be driven at high speed, which is preferable. Furthermore, a Si transistor can be formed by microfabrication so that the channel length is 3 nm to 10 nm, and therefore the display device 10A can be provided with an accelerator such as a CPU, an application processor, or a GPU integrated with the display unit.

[0163] Alternatively, a transistor having polycrystalline silicon in a channel formation region (also referred to as a "poly-Si transistor") may be provided in the layer 20. Low temperature polysilicon (LTPS) may be used as the polycrystalline silicon. Note that a transistor having LTPS in a channel formation region is also referred to as an "LTPS transistor." Alternatively, an OS transistor may be provided in the layer 20.

[0164] The driving circuit 30 can be various circuits such as a shift register, a level shifter, an inverter, a latch, an analog switch, and a logic circuit. The driving circuit 30 includes, for example, a gate driver circuit, a source driver circuit, and the like. The driving circuit 30 may also include an arithmetic circuit, a memory circuit, a power supply circuit, and the like. Because the gate driver circuit, the source driver circuit, and other circuits can be arranged overlapping the display unit 13, the width of the non-display area (also called a frame) around the periphery of the display unit 13 of the display device 10A can be made significantly narrower than when these circuits and the display unit 13 are arranged side by side, thereby enabling the display device 10A to be made more compact.

[0165] The functional circuit 40 has, for example, the function of an application processor for controlling each circuit in the display device 10A and generating signals for controlling each circuit. The functional circuit 40 may also have a circuit for correcting image data, such as a GPU, and a CPU. The functional circuit 40 may also have an LVDS (Low Voltage Differential Signaling) circuit, a MIPI (Mobile Industry Processor Interface) circuit, a D / A (Digital to Analog) conversion circuit, and the like, which function as an interface for receiving image data and the like from outside the display device 10A. The functional circuit 40 may also have a circuit for compressing and decompressing image data, a power supply circuit, and the like.

[0166] A layer 50 is provided over the layer 20. The layer 50 includes a pixel circuit group 55 including a plurality of pixel circuits 51. An OS transistor may be provided in the layer 50. The pixel circuit 51 may include an OS transistor. Note that the layer 50 can be stacked over the layer 20.

[0167] A Si transistor may be provided in the layer 50. For example, the pixel circuit 51 may be configured to include a transistor having single crystal silicon or polycrystalline silicon in the channel formation region. LTPS may be used as the polycrystalline silicon. For example, the layer 50 may be formed on a separate substrate and then bonded to the layer 20.

[0168] Furthermore, for example, the pixel circuit 51 may be configured with multiple types of transistors using different semiconductor materials. When the pixel circuit 51 is configured with multiple types of transistors using different semiconductor materials, the transistors may be provided in different layers for each type of transistor. For example, when the pixel circuit 51 is configured with Si transistors and OS transistors, the Si transistors and the OS transistors may be provided overlapping each other. By providing the transistors overlapping each other, the area occupied by the pixel circuit 51 can be reduced. This can improve the resolution of the display device 10A. Note that a configuration in which an LTPS transistor and an OS transistor are combined is sometimes referred to as LTPO.

[0169] The OS transistor 52 preferably includes an oxide containing at least one of indium, an element M (wherein M is aluminum, gallium, yttrium, or tin), and zinc in the channel formation region 54. Such an OS transistor has a characteristic of extremely low off-state current. Therefore, it is preferable to use an OS transistor, particularly as a transistor provided in a pixel circuit, because analog data written to the pixel circuit can be held for a long period of time.

[0170] A layer 60 is provided on the layer 50. A substrate 12 is provided on the layer 60. The substrate 12 is preferably a light-transmitting substrate or a layer made of a light-transmitting material. A plurality of light-emitting elements 61 are provided on the layer 60. The layer 60 can be configured to be stacked on the layer 50. The light-emitting elements 61 can be, for example, organic electroluminescence elements (also referred to as organic EL elements). However, the light-emitting elements 61 are not limited thereto, and for example, inorganic EL elements made of inorganic materials can also be used. Note that "organic EL elements" and "inorganic EL elements" may be collectively referred to as "EL elements." The light-emitting elements 61 may include inorganic compounds such as quantum dots. For example, quantum dots can be used in the light-emitting layer to function as a light-emitting material.

[0171] As shown in FIG. 16B , the display device 10A of one embodiment of the present invention can have a stacked structure including the light-emitting element 61, the pixel circuit 51, the driver circuit 30, and the functional circuit 40. This allows for an extremely high pixel aperture ratio (effective display area ratio). For example, the pixel aperture ratio can be 40% or more and less than 100%, preferably 50% or more and 95% or less, and more preferably 60% or more and 95% or less. Furthermore, the pixel circuits 51 can be arranged at extremely high density, thereby achieving extremely high pixel resolution. For example, in the display portion 13 of the display device 10A (a region where the pixel circuit 51 and the light-emitting element 61 are stacked), pixels can be arranged with a resolution of 2000 ppi or more, preferably 3000 ppi or more, more preferably 5000 ppi or more, and further preferably 6000 ppi or more, and 20,000 ppi or less, or 30,000 ppi or less.

[0172] Because the display device 10A has extremely high resolution, it can be suitably used in VR devices such as head-mounted displays or eyeglass-type AR devices. For example, even in a configuration in which the display unit of the display device 10A is viewed through an optical component such as a lens, the display device 10A has an extremely high-resolution display unit, so that pixels are not visible even when the display unit is enlarged with a lens, thereby providing a highly immersive display.

[0173] When display device 10A is used as a wearable VR or AR display device, the diagonal size of display unit 13 can be 0.1 inches or more and 5.0 inches or less, preferably 0.5 inches or more and 2.0 inches or less, and more preferably 1 inch or more and 1.7 inches or less. For example, the diagonal size of display unit 13 may be 1.5 inches or close to 1.5 inches. Setting the diagonal size of display unit 13 to 2.0 inches or less allows processing with a single exposure process using an exposure device (typically a scanner device), thereby improving the productivity of the manufacturing process.

[0174] Furthermore, the display device 10A according to one embodiment of the present invention can be applied to devices other than wearable electronic devices. In this case, the diagonal size of the display unit 13 may exceed 2.0 inches. The configuration of the transistors used in the pixel circuits 51 may be appropriately selected depending on the diagonal size of the display unit 13. For example, when single-crystal Si transistors are used in the pixel circuits 51, the diagonal size of the display unit 13 is preferably 0.1 inches to 3 inches. When LTPS transistors are used in the pixel circuits 51, the diagonal size of the display unit 13 is preferably 0.1 inches to 30 inches, and more preferably 1 inch to 30 inches. When LTPO is used in the pixel circuits 51, the diagonal size of the display unit 13 is preferably 0.1 inches to 50 inches, and more preferably 1 inch to 50 inches. When OS transistors are used in the pixel circuits 51, the diagonal size of the display unit 13 is preferably 0.1 inches to 200 inches, and more preferably 50 inches to 100 inches.

[0175] Display devices using single-crystal Si transistors are very difficult to increase in size because it is difficult to increase the size of the single-crystal Si substrate. Furthermore, when LTPS transistors are used in display devices, it is difficult to accommodate larger screen sizes (typically, diagonal screen sizes exceeding 30 inches) because a laser crystallization apparatus is used in the manufacturing process. On the other hand, OS transistors are not restricted by the use of a laser crystallization apparatus or can be manufactured at a relatively low process temperature (typically, 450° C. or lower) in the manufacturing process, and therefore can accommodate display devices with relatively large areas (typically, diagonal screen sizes of 50 inches to 100 inches). Furthermore, LTPO transistors can accommodate diagonal screen sizes between those using LTPS transistors and those using OS transistors (typically, 1 inch to 50 inches).

[0176] A specific configuration example of the drive circuit 30 and the functional circuit 40 will be described with reference to Fig. 17. Fig. 17 is a block diagram illustrating pixel circuits 51 in the display device 10A, a plurality of wirings connecting the drive circuit 30 and the functional circuit 40, and bus wiring and the like within the display device 10A.

[0177] In a display device 10A shown in FIG. 17, a layer 50 has a plurality of pixel circuits 51 arranged in a matrix.

[0178] 17 , the layer 20 includes a drive circuit 30, a functional circuit 40, and an input / output circuit 80. The drive circuit 30 includes, for example, a source driver circuit 31, a digital-to-analog converter (DAC) 32, an amplifier circuit 35, a gate driver circuit 33, and a level shifter 34. The functional circuit 40 includes, for example, a memory device 41, a GPU (AI accelerator) 42, an EL correction circuit 43, a timing controller 44, a CPU 45, a sensor controller 46, and a power supply circuit 47. The functional circuit 40 has the function of an application processor.

[0179] The input / output circuit 80 supports transmission methods such as LVDS (Low Voltage Differential Signaling), and has a function of distributing control signals, image data, and the like input via the terminal unit 14 to the drive circuit 30 and the function circuit 40. The input / output circuit 80 also has a function of outputting information from the display device 10A to the outside via the terminal unit 14.

[0180] Furthermore, the display device 10A in FIG. 17 illustrates a configuration in which the circuits included in the drive circuit 30 and the circuits included in the functional circuit 40 are electrically connected to the bus line BSL.

[0181] For example, the source driver circuit 31 has a function of transmitting image data to the pixel circuit 51 of the pixel 230. Therefore, the source driver circuit 31 is electrically connected to the pixel circuit 51 via the wiring SL. Note that a plurality of source driver circuits 31 may be provided.

[0182] The digital-analog conversion circuit 32 has a function of converting image data that has been digitally processed by a GPU, a correction circuit, etc., which will be described later, into analog data. The image data converted into analog data is amplified by an amplifier circuit 35, such as an operational amplifier, and transmitted to the pixel circuits 51 via the source driver circuit 31. Note that the image data may be transmitted in the order of the source driver circuit 31, the digital-analog conversion circuit 32, and the pixel circuits 51. The digital-analog conversion circuit 32 and the amplifier circuit 35 may also be included in the source driver circuit 31.

[0183] For example, the gate driver circuit 33 has a function of selecting a pixel circuit 51 to which image data is to be sent. Therefore, the gate driver circuit 33 is electrically connected to the pixel circuit 51 through a wiring GL. Note that a plurality of gate driver circuits 33 may be provided corresponding to the source driver circuits 31.

[0184] The level shifter 34 has a function of converting signals input to the source driver circuit 31, the digital-to-analog conversion circuit 32, the gate driver circuit 33, etc., to appropriate levels, for example.

[0185] For example, the storage device 41 has a function of storing image data to be displayed on the pixel circuits 51. The storage device 41 can be configured to store the image data as digital data or analog data.

[0186] Furthermore, when image data is stored in the storage device 41, it is preferable to use a nonvolatile memory as the storage device 41. In this case, for example, a NAND type memory or the like can be used as the storage device 41.

[0187] Furthermore, when temporary data generated by the GPU 42, the EL correction circuit 43, the CPU 45, etc. is stored in the storage device 41, it is preferable to use a volatile memory as the storage device 41. In this case, for example, an SRAM (Static Random Access Memory), a DRAM (Dynamic Random Access Memory), etc. can be used as the storage device 41.

[0188] As an example, the GPU 42 has a function of performing processing to output image data read from the storage device 41 to the pixel circuit 51. In particular, the GPU 42 is configured to perform pipeline processing in parallel, and therefore can quickly process image data to be output to the pixel circuit 51. The GPU 42 can also have a function as a decoder for restoring encoded images.

[0189] The functional circuit 40 may also include multiple circuits capable of improving the display quality of the display device 10A. For example, such circuits may include a correction circuit (color adjustment, dimming) that detects color unevenness in the displayed image and corrects the color unevenness to produce an optimal image. For example, if a light-emitting device using an organic EL is used as the display element, the functional circuit 40 may include an EL correction circuit that corrects image data in accordance with the characteristics of the light-emitting device. As an example, the functional circuit 40 includes an EL correction circuit 43.

[0190] Furthermore, artificial intelligence may be used for the image correction described above. For example, the current flowing through the pixel circuit (or the voltage applied to the pixel circuit) may be monitored and acquired, and the displayed image may be acquired by an image sensor or the like, and the current (or voltage) and the image may be treated as input data for an artificial intelligence calculation (e.g., an artificial neural network), and the output result may be used to determine whether or not the image should be corrected.

[0191] Furthermore, the AI ​​calculations can be applied not only to image correction but also to up-conversion processing that increases the resolution of image data. As an example, the GPU 42 in Fig. 17 illustrates blocks (such as a color unevenness correction circuit 42a and an up-conversion circuit 42b) for performing various correction calculations.

[0192] The algorithm for performing the upconversion process of image data can be selected from the nearest neighbor method, the bilinear method, the bicubic method, the rapid and accurate image super-resolution (RAISR) method, the anchored neighborhood regression (ANR) method, the A+ method, the super-resolution convolutional neural network (SRCNN) method, and the like.

[0193] The upconversion process may be configured to use a different algorithm for each region determined according to the point of gaze. For example, the upconversion process for the region at and near the point of gaze may be performed using a slow but highly accurate algorithm, while the upconversion process for regions other than the point of gaze may be performed using a fast but less accurate algorithm. This configuration can shorten the time required for the upconversion process. It can also reduce the power consumption required for the upconversion process.

[0194] Furthermore, in addition to up-conversion processing, down-conversion processing may be performed to reduce the resolution of image data. If the resolution of the image data is greater than the resolution of the display unit 13, a portion of the image data may not be displayed on the display unit 13. In such a case, down-conversion processing can be performed to display the entire image data on the display unit 13.

[0195] For example, the timing controller 44 has a function of controlling the drive frequency (frame frequency, frame rate, refresh rate, etc.) at which an image is displayed. For example, when a still image is displayed on the display device 10A, the drive frequency can be lowered by the timing controller 44, thereby reducing the power consumption of the display device 10A.

[0196] The CPU 45 has a function of performing general-purpose processing such as, for example, running an operating system, controlling data, performing various calculations, and running programs. The CPU 45 has a role of issuing commands such as writing or reading image data to or from the storage device 41, correcting image data, and operating a sensor (described later). The CPU 45 may also have a function of transmitting a control signal to at least one of the circuits included in the functional circuit 40.

[0197] The sensor controller 46 has a function of controlling the sensor, for example. In addition, in Fig. 17, a wiring SNCL is illustrated as a wiring for electrically connecting to the sensor.

[0198] The sensor may be, for example, a touch sensor that can be provided in the display unit 13. Alternatively, the sensor may be, for example, an illuminance sensor.

[0199] For example, the power supply circuit 47 has a function of generating voltages to be supplied to the pixel circuits 51, the drive circuits 30, the functional circuits 40, etc. The power supply circuit 47 may also have a function of selecting the circuits to which the voltage is supplied. For example, the power supply circuit 47 can reduce the power consumption of the entire display device 10A by stopping the voltage supply to the CPU 45, the GPU 42, etc. during the period when a still image is being displayed.

[0200] As described above, the display device of one embodiment of the present invention can have a stacked structure including a display element, a pixel circuit, a driver circuit, and a functional circuit 40. The driver circuit and the functional circuit, which are peripheral circuits, can be arranged to overlap with the pixel circuit, and the width of the frame can be significantly reduced, thereby enabling a miniaturized display device. Furthermore, the display device of one embodiment of the present invention can be lightweight because the wiring connecting the circuits can be shortened by stacking the circuits. Furthermore, the display device of one embodiment of the present invention can have a display portion with improved pixel resolution, thereby enabling a display device with excellent display quality.

[0201] <Configuration Example of Display Module> Next, a configuration example of a display module including the display device 10A will be described.

[0202] 18A to 18C are perspective views of a display module 70. The display module 70 has a structure in which an FPC (Flexible Printed Circuit) 74 is provided on the terminal section 14 of the display device 10A. The FPC 74 has a structure in which wiring is provided on a film made of an insulating material. The FPC 74 is also flexible. The FPC 74 functions as wiring for supplying video signals, control signals, power supply potential, and the like from the outside to the display device 10A. An IC may also be mounted on the FPC 74.

[0203] 18B has a configuration in which a display device 10A is provided on a printed wiring board 71. The printed wiring board 71 has a structure in which wiring is provided inside or on the surface, or inside and on the surface, of a substrate made of an insulating material.

[0204] 18B, terminal portion 14 of display device 10A is electrically connected to terminal portion 72 of printed wiring board 71 via wire 73. Wire 73 can be formed by wire bonding. Furthermore, ball bonding or wedge bonding can be used as the wire bonding.

[0205] After forming the wires 73, the wires 73 may be covered with a resin material or the like. Note that the electrical connection between the display device 10A and the printed wiring board 71 may be achieved by a method other than wire bonding. For example, the electrical connection between the display device 10A and the printed wiring board 71 may be achieved by an anisotropic conductive adhesive, a bump, or the like.

[0206] 18B , terminal portion 72 of printed wiring board 71 is electrically connected to FPC 74. For example, if the pitch of the electrodes in terminal portion 14 of display device 10A differs from the pitch of the electrodes in FPC 74, terminal portion 14 and FPC 74 may be electrically connected via printed wiring board 71. Specifically, the spacing (pitch) between the multiple electrodes in terminal portion 14 can be converted to the spacing between the multiple electrodes in terminal portion 72 using wiring formed on printed wiring board 71. In other words, even if the pitch of the electrodes in terminal portion 14 differs from the pitch of the electrodes in FPC 74, electrical connection between the electrodes can be achieved.

[0207] Furthermore, various elements such as resistor elements, capacitor elements, and semiconductor elements can be provided on the printed wiring board 71 .

[0208] 18C , the terminal portion 72 may be electrically connected to a connection portion 75 provided on the underside (the side on which the display device 10A is not provided) of the printed wiring board 71. For example, by using a socket-type connection portion as the connection portion 75, the display module 70 can be easily attached to and detached from other devices.

[0209] 19A and 19B show a configuration example of a pixel circuit 51 and a light-emitting element 61 connected to the pixel circuit 51. Fig. 19A is a diagram showing the connection of each element, and Fig. 19B is a diagram schematically showing the hierarchical relationship between a layer 20 including a driver circuit, a layer 50 including a plurality of transistors included in the pixel circuit, and a layer 60 including a light-emitting element.

[0210] 19A and 19B includes a transistor 52A, a transistor 52B, a transistor 52C, and a capacitor 53. The transistors 52A, 52B, and 52C can be OS transistors. Each of the OS transistors 52A, 52B, and 52C preferably includes a back gate electrode. In this case, the back gate electrode can be configured to receive the same signal as the gate electrode, or a signal different from the gate electrode can be applied to the back gate electrode.

[0211] The transistor 52B includes a gate electrode electrically connected to the transistor 52A, a first electrode electrically connected to the light-emitting element 61, and a second electrode electrically connected to the wiring ANO. The wiring ANO is a wiring for applying a potential for supplying a current to the light-emitting element 61.

[0212] The transistor 52A has a first terminal electrically connected to the gate electrode of the transistor 52B, a second terminal electrically connected to the wiring SL that functions as a source line, and a gate electrode that has the function of controlling the conductive state or non-conductive state based on the potential of the wiring GL1 that functions as a gate line.

[0213] The transistor 52C includes a first terminal electrically connected to the wiring V0, a ​​second terminal electrically connected to the light-emitting element 61, and a gate electrode having a function of controlling the conductive state or non-conductive state based on the potential of the wiring GL2 functioning as a gate line. The wiring V0 is a wiring for applying a reference potential and a wiring for outputting a current flowing through the pixel circuit 51 to the driver circuit 30 or the functional circuit 40.

[0214] The capacitor 53 includes a conductive film electrically connected to the gate electrode of the transistor 52B and a conductive film electrically connected to the second electrode of the transistor 52C.

[0215] The light-emitting element 61 includes a first electrode electrically connected to the first electrode of the transistor 52B and a second electrode electrically connected to a wiring VCOM. The wiring VCOM is a wiring for applying a potential for supplying a current to the light-emitting element 61.

[0216] This allows the intensity of light emitted by the light-emitting element 61 to be controlled in accordance with an image signal applied to the gate electrode of the transistor 52B. Also, the reference potential of the wiring V0 applied via the transistor 52C can suppress variations in the gate-source voltage of the transistor 52B.

[0217] Furthermore, a current value that can be used to set pixel parameters can be output from the wiring V0. More specifically, the wiring V0 can function as a monitor line for outputting the current flowing through the transistor 52B or the current flowing through the light-emitting element 61 to the outside. The current output to the wiring V0 is converted into a voltage by a source follower circuit or the like and output to the outside. Alternatively, it can be converted into a digital signal by an A-D converter or the like and output to the functional circuit 40 or the like.

[0218] Note that the light-emitting element described in one embodiment of the present invention refers to a self-luminous display element such as an organic light-emitting diode (OLED). Note that the light-emitting element electrically connected to the pixel circuit can be a self-luminous light-emitting element such as an LED (light-emitting diode), a micro LED, a quantum-dot light-emitting diode (QLED), or a semiconductor laser.

[0219] In the configuration shown in FIG. 19B as an example, the wiring electrically connecting the pixel circuits 51 and the drive circuit 30 can be shortened, thereby reducing the wiring resistance of the wiring. This allows data to be written quickly, enabling the display device 10A to be driven at high speed. This allows the display device 10A to have a sufficient frame period even if the number of pixel circuits 51 is increased, thereby increasing the pixel density of the display device 10A. Furthermore, increasing the pixel density of the display device 10A can increase the resolution of the image displayed by the display device 10A. For example, the pixel density of the display device 10A can be 1000 ppi or more, 5000 ppi or more, or 7000 ppi or more. Therefore, the display device 10A can be used as a display device for AR or VR, for example, and is suitable for use in electronic devices such as HMDs, where the display unit is close to the user.

[0220] 19A and 19B show an example of the pixel circuit 51 including three transistors in total, but one embodiment of the present invention is not limited thereto. Below, a configuration example of a pixel circuit applicable to the pixel circuit 51 and an example of a driving method thereof will be described.

[0221] A pixel circuit 51A shown in Fig. 20A includes a transistor 52A, a transistor 52B, and a capacitor 53. Fig. 20A also shows a light-emitting element 61 connected to the pixel circuit 51A. A wiring SL, a wiring GL, a wiring ANO, and a wiring VCOM are electrically connected to the pixel circuit 51A. The pixel circuit 51A has a configuration in which the transistor 52C is removed from the pixel circuit 51 shown in Fig. 19A and the wirings GL1 and GL2 are replaced with a wiring GL.

[0222] The transistor 52A has a gate electrically connected to the wiring GL, one of its source and drain electrically connected to the wiring SL, and the other electrically connected to the gate of the transistor 52B and one electrode of the capacitor C1. The transistor 52B has one of its source and drain electrically connected to the wiring ANO, and the other electrically connected to the anode of the light-emitting element 61. The other electrode of the capacitor C1 is electrically connected to the anode of the light-emitting element 61. The light-emitting element 61 has a cathode electrically connected to the wiring VCOM.

[0223] 20B is configured by adding a transistor 52C to the pixel circuit 51A. A wiring V0 is electrically connected to the pixel circuit 51B.

[0224] A pixel circuit 51C shown in FIG. 20C is an example in which transistors having a pair of gates electrically connected are used as the transistors 52A and 52B of the pixel circuit 51A. A pixel circuit 51D shown in FIG. 20D is an example in which the same transistors are used as the pixel circuit 51B. This can increase the current that the transistors can pass. Note that, although transistors having a pair of gates electrically connected are used for all the transistors here, this is not a limitation. Alternatively, a transistor having a pair of gates electrically connected to different wirings may be used. For example, reliability can be improved by using a transistor in which one of the gates is electrically connected to a source.

[0225] 21A has a configuration in which a transistor 52D is added to the pixel circuit 51B. The pixel circuit 51E is electrically connected to wirings GL1, GL2, and GL3 that function as gate lines. Note that in this embodiment and other embodiments, the wirings GL1, GL2, and GL3 may be collectively referred to as wirings GL. Therefore, the number of wirings GL is not limited to one, and there may be multiple wirings GL.

[0226] The gate of the transistor 52D is electrically connected to a wiring GL3, one of the source and drain of the transistor 52D is electrically connected to the gate of the transistor 52B, and the other is electrically connected to a wiring V0. The gate of the transistor 52A is electrically connected to a wiring GL1, and the gate of the transistor 52C is electrically connected to a wiring GL2.

[0227] By simultaneously turning on the transistors 52C and 52D, the source and gate of the transistor 52B have the same potential, and the transistor 52B can be turned off. This makes it possible to forcibly cut off the current flowing through the light-emitting element 61. Such a pixel circuit is suitable for use in a display method in which display periods and off periods are alternately provided.

[0228] 21B is an example in which a capacitor 53A is added to the pixel circuit 51E. The capacitor 53A functions as a storage capacitor.

[0229] 21C and 21D are examples in which transistors each having a pair of gates are applied to the pixel circuit 51E or 51F, respectively. Transistors 52A, 52C, and 52D are transistors in which a pair of gates are electrically connected, and transistor 52B is a transistor in which one gate is electrically connected to its source.

[0230] Next, a description will be given of an example of a method for driving a display device to which pixel circuit 51 E is applied. Note that the same driving method can also be applied to display devices to which pixel circuits 51 F, 51 G, and 51 H are applied.

[0231] 22 is a timing chart illustrating a driving method of a display device using the pixel circuit 51E. The timing chart illustrates the transition of potentials of the wirings GL1[k], GL2[k], and GL3[k], which are gate lines in the kth row, and the wirings GL1[k+1], GL2[k+1], and GL3[k+1], which are gate lines in the k+1th row. The timing chart also illustrates the timing of signals applied to the wirings SL, which function as source lines.

[0232] Here, an example of a driving method is shown in which one horizontal period is divided into a light-on period and a light-off period. The horizontal period for the kth row and the horizontal period for the k+1th row are shifted by the selection period of the gate line.

[0233] In the lighting period of the kth row, a high-level potential is first applied to the wiring GL1[k] and the wiring GL2[k], and a source signal is applied to the wiring SL. This brings the transistors 52A and 52C into conduction, and a potential corresponding to the source signal is written from the wiring SL to the gate of the transistor 52B. After that, a low-level potential is applied to the wiring GL1[k] and the wiring GL2[k], bringing the transistors 52A and 52C into non-conduction, and the gate potential of the transistor 52B is maintained.

[0234] Subsequently, the lighting period of the k+1th row begins, and data is written in the same manner as above.

[0235] Next, the off-period will be described. During the off-period of the kth row, a high-level potential is applied to the wiring GL2[k] and the wiring GL3[k]. As a result, the transistors 52C and 52D are turned on, and the same potential is applied to the source and gate of the transistor 52B, so that almost no current flows through the transistor 52B. This turns off the light-emitting element 61. All subpixels located in the kth row are turned off. The subpixels in the kth row remain off until the next light-on period.

[0236] Next, the process transitions to the off period of the k+1th row, and all the sub-pixels of the k+1th row are in the off state in the same manner as above.

[0237] This driving method, in which the display is not always on during one horizontal period but has an off period during one horizontal period, can also be called duty driving. Duty driving can reduce the afterimage phenomenon when displaying moving images, thereby realizing a display device with high moving image display performance. In particular, in VR devices, reducing afterimages can alleviate so-called VR sickness.

[0238] In duty driving, the ratio of the on period to one horizontal period can be called the duty ratio. For example, a duty ratio of 50% means that the on period and the off period are the same length. The duty ratio can be freely set and can be adjusted as appropriate within a range of, for example, more than 0% and less than 100%.

[0239] Furthermore, a configuration different from the pixel circuit described above will be described with reference to FIGS. 23A and 23B.

[0240] Fig. 23A shows a block diagram of a pixel 230. The pixel shown in Fig. 23A has a memory circuit MEM (Memory) in addition to a switching transistor (Switching Tr), a driving transistor (Driving Tr), and a light-emitting element (LED).

[0241] Data DataW is supplied to the memory circuit MEM through the wiring SL2 and the transistor 52A. When the data DataW is supplied to the pixel in addition to the image data Data, the current flowing through the light-emitting element increases, and the display device can achieve high luminance.

[0242] FIG. 23B shows a specific circuit diagram of the pixel circuit 51I.

[0243] A pixel circuit 51I shown in Fig. 23B includes a transistor 52w, a transistor 52A, a transistor 52B, a transistor 52C, a capacitor 53s, and a capacitor 53w. Fig. 23B also shows a light-emitting element 61 connected to the pixel circuit 51I.

[0244] The transistor 52w functions as a switching transistor. The transistor 52B functions as a driving transistor. One of the source or drain of the transistor 52w is electrically connected to one electrode of a capacitor 53w. The other electrode of the capacitor 53w is electrically connected to one of the source or drain of the transistor 52A. One of the source or drain of the transistor 52A is electrically connected to the gate of the transistor 52B. The gate of the transistor 52B is electrically connected to one electrode of a capacitor 53s. The other electrode of the capacitor 53s is electrically connected to one of the source or drain of the transistor 52B. One of the source or drain of the transistor 52B is electrically connected to one of the source or drain of the transistor 52C. One of the source or drain of the transistor 52C is electrically connected to one electrode of the light-emitting element 61. Although each transistor shown in FIG. 23B has a backgate electrically connected to the gate, the connection of the backgate is not limited to this. Furthermore, the transistor does not necessarily have to have a backgate.

[0245] Here, a node NM is defined as a node to which the other electrode of the capacitor 53w, one of the source or drain of the transistor 52A, the gate of the transistor 52B, and one electrode of the capacitor 53s are connected, and a node NA is defined as a node to which the other electrode of the capacitor 53s, one of the source or drain of the transistor 52B, one of the source or drain of the transistor 52C, and one electrode of the light-emitting element 61 are connected.

[0246] The gate of the transistor 52w is electrically connected to the wiring GL1. The gate of the transistor 52C is electrically connected to the wiring GL1. The gate of the transistor 52A is electrically connected to the wiring GL2. The other of the source and the drain of the transistor 52w is electrically connected to the wiring SL1. The other of the source and the drain of the transistor 52C is electrically connected to the wiring V0. The other of the source and the drain of the transistor 52A is electrically connected to the wiring SL2. Note that in this embodiment and the like, the wirings SL1 and SL2 may be collectively referred to as wirings SL. Thus, the number of wirings SL is not limited to one, and may be multiple.

[0247] The other of the source and the drain of the transistor 52B is electrically connected to a wiring ANO. The other electrode of the light-emitting element 61 is electrically connected to a wiring VCOM.

[0248] The wirings GL1 and GL2 can function as signal lines for controlling the operation of the transistors. The wiring SL1 can function as a signal line for supplying image data Data to the pixels. The wiring SL2 can function as a signal line for writing data DataW to the memory circuit MEM. For example, the wiring SL2 can function as a signal line for supplying a correction signal to the pixels. The wiring V0 functions as a monitor line for acquiring electrical characteristics of the transistor 52B. Furthermore, by supplying a specific potential from the wiring V0 to the other electrode of the capacitor 53s through the transistor 52C, writing of an image signal can be stabilized.

[0249] The transistor 52A and the capacitor 53w constitute a memory circuit MEM. The node NM is a memory node, and data DataW supplied from the wiring SL2 can be written to the node NM by turning on the transistor 52A. By using an OS transistor with extremely low off-state current as the transistor 52A, the potential of the node NM can be held for a long time.

[0250] In the pixel circuit 51I, image data Data supplied from the wiring SL1 is supplied to a capacitor 53w via a transistor 52w. One of the source or drain of the transistor 52w is capacitively coupled to a node NM. Therefore, the potential of the node NM to which data DataW is written changes in accordance with the image data Data. In addition, the node NA and the node NM are capacitively coupled via a capacitor 53s. Therefore, the potential of the node NA changes in accordance with the data DataW and the image data Data.

[0251] The transistor 52w functions as a selection transistor that determines whether or not image data Data is supplied. The transistor 52C functions as a reset transistor that determines whether or not the potential of the node NA is set equal to that of the wiring V0.

[0252] Furthermore, in the display device of one embodiment of the present invention, defective pixels can be detected by using the functional circuit 40 overlapping with the pixel circuit group 55. By using information about the defective pixels, display defects due to the defective pixels can be corrected, and normal display can be achieved.

[0253] A part or all of the correction methods exemplified below may be executed by a circuit provided outside the display device. Alternatively, a part of the correction method may be executed by the functional circuit 40, and another part may be executed by a circuit provided outside the display device.

[0254] A more specific example of the correction method will be described below: Fig. 24A is a flowchart showing the correction method described below.

[0255] First, the correction operation is started in step E1.

[0256] Subsequently, in step E2, the pixel current is read out, for example, by driving each pixel to output a current to a monitor line electrically connected to the pixel.

[0257] When pixel circuit group 55 is divided into a plurality of sections 59, such as in a display device 10B described below, the current readout operation can be performed simultaneously for each section 59. By dividing pixel circuit group 55 into a plurality of sections 59, the current readout operation for all pixels can be performed in an extremely short time.

[0258] Next, in step E3, the read current is converted into a voltage. At this time, if a digital signal is to be handled in subsequent processing, it can be converted into digital data in step E3. For example, analog data can be converted into digital data using an analog-to-digital converter (ADC).

[0259] Next, in step E4, pixel parameters for each pixel are obtained based on the obtained data, such as the threshold voltage or field effect mobility of the driving transistor, the threshold voltage of the light-emitting element, and the current value at a predetermined voltage.

[0260] Next, in step E5, each pixel is judged to be abnormal based on the pixel parameter, for example, if the value of the pixel parameter exceeds (or falls below) a predetermined threshold value, the pixel is recognized as an abnormal pixel.

[0261] The abnormalities include dark spot defects with significantly low brightness relative to the input data potential, and bright spot defects with significantly high brightness.

[0262] In step E5, the address of the abnormal pixel and the type of defect can be identified and obtained.

[0263] Subsequently, in step E6, correction processing is performed.

[0264] An example of the correction process will be described with reference to Fig. 24B. Fig. 24B schematically shows a pixel, each of which is a set of 3 x 3 pixel circuits 51 and light-emitting elements 61. Here, it is assumed that the central pixel is a pixel 151 that has a dark point defect. Fig. 24B schematically shows a state in which pixel 151 is turned off and the surrounding pixels 150 are turned on at a predetermined brightness.

[0265] A dark point defect is a defect in which the brightness of the pixel is unlikely to reach normal brightness even if a correction is made to increase the data potential input to the pixel. Therefore, as shown in Figure 24B, a correction is made to increase the brightness of pixels 150 surrounding a pixel 151 with a dark point defect. This makes it possible to display a normal image even if a dark point defect occurs.

[0266] In the case of a bright spot defect, the bright spot defect can be made less noticeable by lowering the brightness of the surrounding pixels.

[0267] In particular, in the case of a display device with high resolution (e.g., 1000 ppi or more), it is difficult to visually distinguish adjacent pixels, so it is particularly effective to use a correction method that compensates for abnormal pixels using surrounding pixels.

[0268] On the other hand, it is preferable to correct pixels in which an abnormality such as a dark spot defect or a bright spot defect has occurred so that no data potential is input.

[0269] In this way, correction parameters can be set for each pixel. By applying the correction parameters to input image data, corrected image data can be generated to display an optimal image on the display device 10A.

[0270] Furthermore, since variations exist in pixel parameters not only for abnormal pixels and pixels surrounding the abnormal pixels but also for pixels not determined to be abnormal pixels, unevenness due to the variations may be visible when an image is displayed. Therefore, for pixels not determined to be abnormal pixels, correction parameters can be set to cancel (level out) the variations in pixel parameters. For example, a reference value based on the median or average value of pixel parameters for some or all pixels can be set, and a correction value for canceling the difference between the pixel parameters of a specific pixel and the reference value can be set as the correction parameter for that pixel.

[0271] Furthermore, for pixels surrounding an abnormal pixel, it is preferable to set correction data that takes into consideration both the amount of correction for compensating for the abnormal pixel and the amount of correction for canceling variations in pixel parameters.

[0272] Then, in step E7, the correction operation is completed.

[0273] Thereafter, an image can be displayed based on the correction parameters obtained in the above correction operation and the input image data.

[0274] A neural network may be used in one of the steps of the correction operation. In the neural network, correction parameters can be determined based on inference results obtained by machine learning, for example. For example, when the correction parameters are determined using a neural network, high-precision correction can be performed so that abnormal pixels are not noticeable, without using a detailed correction algorithm.

[0275] The above is the explanation of the correction method.

[0276] 25A and 25B are perspective views of a display device 10B that is a modification of the display device 10A. Fig. 25B is a perspective view for explaining the configuration of each layer of the display device 10B. To reduce repetition of explanation, differences from the display device 10A will be mainly explained.

[0277] The display device 10B has a pixel circuit group 55 including a plurality of pixel circuits 51 and a drive circuit 30 stacked on top of each other. In the display device 10B, the pixel circuit group 55 is divided into a plurality of sections 59, and the drive circuit 30 is divided into a plurality of sections 39. Each of the plurality of sections 39 has a source driver circuit 31 and a gate driver circuit 33.

[0278] FIG. 26A shows an example of the configuration of a pixel circuit group 55 included in the display device 10B. FIG. 26B shows an example of the configuration of a drive circuit 30 included in the display device 10B. The partitions 59 and 39 are each arranged in a matrix of m rows and n columns (m and n are each an integer greater than or equal to 1). In this specification, the partition 59 in the first row and first column is referred to as partition 59[1,1], and the partition 59 in the mth row and nth column is referred to as partition 59[m,n]. Similarly, the partition 39 in the first row and first column is referred to as partition 39[1,1], and the partition 39 in the mth row and nth column is referred to as partition 39[m,n]. FIGS. 26A and 26B show a case where m is 4 and n is 8. That is, the pixel circuit group 55 and the drive circuit 30 are each divided into 32 sections.

[0279] Each of the plurality of sections 59 has a plurality of pixel circuits 51, a plurality of wirings SL, and a plurality of wirings GL. In each of the plurality of sections 59, one of the plurality of pixel circuits 51 is electrically connected to at least one of the plurality of wirings SL and at least one of the plurality of wirings GL.

[0280] One of the sections 59 and one of the sections 39 are arranged to overlap (see FIG. 26C ). For example, section 59[i,j] (i is an integer between 1 and m, and j is an integer between 1 and n) and section 39[i,j] are arranged to overlap. The source driver circuit 31[i,j] of section 39[i,j] is electrically connected to the wiring SL of section 59[i,j]. The gate driver circuit 33[i,j] of section 39[i,j] is electrically connected to the wiring GL of section 59[i,j]. The source driver circuit 31[i,j] and the gate driver circuit 33[i,j] have the function of controlling the multiple pixel circuits 51 of section 59[i,j].

[0281] By overlapping the section 59[i,j] and the section 39[i,j], the connection distance (wiring length) between the pixel circuit 51 in the section 59[i,j] and the source driver circuit 31 and gate driver circuit 33 in the section 39[i,j] can be made extremely short. As a result, the wiring resistance and parasitic capacitance are reduced, which shortens the time required for charging and discharging, enabling high-speed driving. This also reduces power consumption. Furthermore, miniaturization and weight reduction can be achieved.

[0282] Furthermore, display device 10B has a configuration in which each section 39 has a source driver circuit 31 and a gate driver circuit 33. Therefore, display unit 13 can be divided into sections 59 corresponding to sections 39, and image data can be rewritten. For example, it is possible to rewrite image data only in sections of display unit 13 where changes have occurred in the image, and to retain image data in sections where no changes have occurred, thereby realizing a reduction in power consumption.

[0283] In the present embodiment and other embodiments, one of the display units 13 divided into sections 59 is referred to as a sub-display unit 19. Therefore, it can be said that the sub-display units 19 are divided into sections 39. The display device 10B described with reference to FIGS. 25 and 26 shows a case in which the display unit 13 is divided into 32 sub-display units 19 (see FIG. 25A ). The sub-display units 19 include a plurality of pixels 230 shown in FIG. 19 and other embodiments. Specifically, one sub-display unit 19 includes one of the sections 59 including a plurality of pixel circuits 51, and a plurality of light-emitting elements 61. Furthermore, one section 39 has the function of controlling the plurality of pixels 230 included in one sub-display unit 19.

[0284] Furthermore, the display device 10B can arbitrarily set the drive frequency for image display for each sub-display unit 19 by using the timing controller 44 of the functional circuit 40. The functional circuit 40 has a function of controlling the operation of each of the multiple sections 39 and the multiple sections 59. In other words, the functional circuit 40 has a function of controlling the drive frequency and operation timing of each of the multiple sub-display units 19 arranged in a matrix. The functional circuit 40 also has a function of adjusting synchronization between the sub-display units.

[0285] Furthermore, a timing controller 441 and an input / output circuit 442 may be provided for each partition 39 (see FIG. 26D). The input / output circuit 442 may be, for example, an I2C (Inter-Integrated Circuit) interface. In FIG. 26, the timing controller 441 included in partition 39[i,j] is indicated as timing controller 441[i,j]. Furthermore, the input / output circuit 442 included in partition 39[i,j] is indicated as input / output circuit 442[i,j].

[0286] For example, the functional circuit 40 supplies to the input / output circuit 442[i,j] operation parameters such as setting signals for the scanning direction and drive frequency of the gate driver circuit 33[i,j], and the number of pixels to be thinned out of image data when reducing the resolution (the number of pixels not to be rewritten when rewriting image data). The source driver circuit 31[i,j] and the gate driver circuit 33[i,j] operate in accordance with these operation parameters.

[0287] Furthermore, if the sub-display unit 19 has a light-receiving element, which will be described later, the input / output circuit 442 outputs information photoelectrically converted by the light-receiving element to the function circuit 40 .

[0288] The display device 10B in the electronic device of one embodiment of the present invention has pixel circuits 51 and drive circuits 30 stacked together, and can achieve low power consumption by varying the drive frequency for each sub-display unit 19 in response to the movement of the user's line of sight.

[0289] FIG. 27A shows a display unit 13 having four rows and eight columns of sub-display units 19. FIG. 27A also shows a first region S1 to a third region S3 centered around a fixation point G. The CPU 45 assigns each of the multiple sub-display units 19 to either a first region 29A overlapping with the first region S1 or the second region S2, or a second region 29B overlapping with the third region S3. That is, the CPU 45 assigns each of the multiple sections 39 to either the first region 29A or the second region 29B. In this case, the first region 29A overlapping with the first region S1 or the second region S2 includes the region overlapping with the fixation point G. The second region 29B includes the sub-display units 19 located outside the first region 29A (see FIG. 27B).

[0290] The operation of the drive circuits (source driver circuit 31 and gate driver circuit 33) included in each of the multiple sections 39 is controlled by the functional circuit 40. For example, the second section 29B overlaps with the third region S3, which includes the stable fixation field, the induced field, and the auxiliary field, and is an area where the user's ability to distinguish is low. Therefore, even if the number of times image data is rewritten per unit time (hereinafter also referred to as the "number of image rewrites") in the second section 29B is lower than that in the first section 29A, the actual display quality perceived by the user (hereinafter also referred to as the "actual display quality") is not significantly reduced. In other words, even if the drive frequency (also referred to as the "second drive frequency") of the sub-display unit 19 included in the second section 29B is lower than the drive frequency (also referred to as the "first drive frequency") of the sub-display unit 19 included in the first section 29A, the actual display quality is not significantly reduced.

[0291] Lowering the drive frequency can reduce the power consumption of the display device. On the other hand, lowering the drive frequency also reduces the display quality. In particular, the display quality when displaying moving images is reduced. According to one aspect of the present invention, by setting the second drive frequency lower than the first drive frequency, it is possible to reduce power consumption in areas where user visibility is low while suppressing a substantial reduction in display quality. According to one aspect of the present invention, it is possible to maintain display quality while reducing power consumption.

[0292] The first drive frequency may be 30 Hz or more and 500 Hz or less, preferably 60 Hz or more and 500 Hz or less. The second drive frequency is preferably equal to or less than the first drive frequency, more preferably equal to or less than half the first drive frequency, and even more preferably equal to or less than one-fifth the first drive frequency.

[0293] Furthermore, among the sub-display units 19 overlapping the third region S3, the area farther from the first area 29A may be designated as a third area 29C (see FIG. 27C ), and the drive frequency (also referred to as the "third drive frequency") of the sub-display units 19 included in the third area 29C may be set lower than that of the second area 29B. The third drive frequency is preferably equal to or lower than the second drive frequency, more preferably equal to or lower than half the second drive frequency, and even more preferably equal to or lower than one-fifth the second drive frequency. By significantly reducing the number of times the image is rewritten, power consumption can be further reduced. Furthermore, image data rewriting may be stopped as necessary. Stopping image data rewriting can further reduce power consumption.

[0294] When such a driving method is used, it is preferable to use a transistor with extremely low off-state current as the transistor constituting the pixel circuit 51. For example, it is preferable to use an OS transistor as the transistor constituting the pixel circuit 51. Because the off-state current of an OS transistor is extremely low, image data supplied to the pixel circuit 51 can be held for a long period of time. In particular, it is preferable to use an OS transistor as the transistor 52A.

[0295] Furthermore, when the video scene displayed on the display unit 13 changes, an image with significantly different brightness, contrast, or color tone from the immediately preceding image may be displayed. In such a case, a difference occurs in the timing of image switching between the first area 29A and an area with a lower drive frequency than the first area 29A, resulting in a significant difference in brightness, contrast, or color tone between the two areas, which may result in a loss of substantial display quality. In such a case, for example, when the video scene changes, it is sufficient to first rewrite image data in areas other than the first area 29A at the same drive frequency as the first area 29A, and then lower the drive frequency for the areas other than the first area 29A.

[0296] Furthermore, if it is determined that the amount of change in the gaze point G has exceeded a certain amount, the image data of areas other than the first area 29A may also be rewritten at the same drive frequency as the first area 29A, and if it is determined that the amount of change is within the certain amount, the drive frequency of the areas other than the first area 29A may be reduced. Furthermore, if it is determined that the amount of change in the gaze point G is small, the drive frequency of the areas other than the first area 29A may be further reduced.

[0297] Furthermore, if the display device 10B does not have a frame memory, which is a storage device that temporarily stores image data, or if it has one frame memory for the entire display unit 13, the second drive frequency and the third drive frequency must both be an integer multiple of the first drive frequency.

[0298] By providing a frame memory corresponding to each of the multiple sub-display units 19, the second drive frequency and the third drive frequency can be set to any value, not just an integer fraction of the first drive frequency. By setting the second drive frequency and the third drive frequency to any value, the degree of freedom in setting the drive frequency can be increased. Therefore, the actual degradation of display quality can be reduced.

[0299] 28 is a block diagram illustrating an example of the configuration of a display device 10B having a frame memory 443 for each sub-display section 19. In Fig. 28, the input / output circuit 80 has an image information input section 461 and a clock signal input section 462. The functional circuit 40 also has an image data temporary storage section 463, an operation parameter setting section 464, an internal clock signal generation section 465, an image processing section 466, a memory controller 467, and multiple frame memories 443.

[0300] One of the plurality of frame memories 443 has a function of storing image data to be displayed on one of the plurality of sub-display units 19. For example, frame memory 443[1,1] has a function of storing image data to be displayed on sub-display unit 19[1,1]. Similarly, frame memory 443[m,n] has a function of storing image data to be displayed on sub-display unit 19[m,n].

[0301] 28, each of the plurality of sub-display sections 19 is electrically connected to one of the plurality of sections 39. In FIG. 28, each of the plurality of sections 39 includes a source driver circuit 31, a gate driver circuit 33, a timing controller 441, and an input / output circuit 442.

[0302] Image data to be displayed on the display unit 13 and operating parameters of the display device 10B are supplied from the outside to the image information input unit 461. A clock signal is supplied from the outside to the clock signal input unit 462. The clock signal is also supplied to an internal clock signal generation unit 465 via the clock signal input unit 462.

[0303] The internal clock signal generating unit 465 has a function of using an externally supplied clock signal to generate a clock signal (also referred to as an "internal clock signal") to be used within the display device 10B. The internal clock signal is supplied to the image data temporary storage unit 463, the operation parameter setting unit 464, the memory controller 467, the partition 39, etc., and is used to synchronize the operation timing of each circuit constituting the display device 10B.

[0304] The image data input via the image information input unit 461 is supplied to an image data temporary storage unit 463. The operation parameters input via the image information input unit 461 are supplied to an operation parameter setting unit 464.

[0305] The image data temporary storage unit 463 holds the supplied image data and, in synchronization with an internal clock signal, supplies the image data to the image processing unit 466. By providing the image data temporary storage unit 463, it is possible to eliminate the difference between the timing at which image data is supplied from the outside and the timing at which the image data is processed inside the display device 10B.

[0306] The operation parameter setting unit 464 has a function of holding the supplied operation parameters. The operation parameters include information for determining the drive frequency, scanning direction, resolution settings, etc. for each of the multiple sub-display units 19.

[0307] Image processing unit 466 has a function of performing arithmetic processing of the image data stored in image data temporary storage unit 463. For example, image processing unit 466 has a function of performing contrast adjustment, brightness adjustment, gamma correction, etc. of the image data. Image processing unit 466 also has a function of dividing the image data stored in image data temporary storage unit 463 for each sub-display unit 19.

[0308] The memory controller 467 has a function of controlling the operation of the plurality of frame memories 443. The image data divided for each sub-display unit 19 by the image processing unit 466 is stored in each of the plurality of frame memories 443. Furthermore, the plurality of frame memories 443 have a function of supplying image data to the respective partitions 39 in response to a read request signal (read) from the corresponding partition 39.

[0309] 29, the storage device 41 may be used as a frame memory 443. That is, the storage device 41 may store image data divided for each sub-display unit 19.

[0310] The frame memory 443 may be provided in a location other than the functional circuit 40. The frame memory 443 may be provided in a semiconductor device other than the display device 10B.

[0311] The areas set in the display unit 13 are not limited to the three areas, the first area 29A, the second area 29B, and the third area 29C. Four or more areas may be set in the display unit 13. By setting a plurality of areas in the display unit 13 and gradually lowering the drive frequency, it is possible to further reduce the actual degradation of display quality.

[0312] The image displayed in the first area 29A may be subjected to the above-described upconversion process. By displaying an upconverted image in the first area 29A, the display quality can be improved. The image displayed in areas other than the first area 29A may be subjected to the above-described upconversion process. By displaying an upconverted image in areas other than the first area 29A, the actual degradation in display quality when the drive frequency in areas other than the first area 29A is reduced can be further reduced.

[0313] It is also possible to use a high-precision algorithm to upconvert the image displayed in the first area 29A and a low-precision algorithm to upconvert the image displayed in areas other than the first area 29A. Even in this case, it is possible to further reduce the substantial degradation in display quality when the drive frequency for areas other than the first area 29A is reduced.

[0314] Furthermore, high-speed rewriting can be achieved by simultaneously rewriting image data for all sub-display sections 19 instead of for each sub-display section 19. In other words, high-speed rewriting can be achieved by simultaneously rewriting image data for all sections 39 instead of for each section 39.

[0315] Generally, in the case of line-sequential driving, the source driver circuit simultaneously writes image data to all pixels in one row while the gate driver circuit selects the pixels in that row. For example, if the display unit 13 is not divided into sub-display units 19 and has a resolution of 4000 x 2000 pixels, the source driver circuit must write image data to 4000 pixels while the gate driver circuit selects one row of pixels. When the frame frequency is 120 Hz, one frame time is approximately 8.3 msec. Therefore, the gate driver circuit must select 2000 rows of pixels in approximately 8.3 msec, and the time required to select one row of pixels, i.e., the time required to write image data per pixel, is approximately 4.17 μsec. In other words, the higher the resolution of the display unit and the higher the frame frequency, the more difficult it becomes to ensure sufficient time for rewriting image data.

[0316] In the display device 10B exemplified in this embodiment, the display unit 13 is divided into four sections in the row direction. Therefore, in one sub-display unit 19, the time required to write image data per pixel can be four times longer than when the display unit 13 is not divided. According to one aspect of the present invention, even when the frame frequency is set to 240 Hz or even 360 Hz, it is easy to ensure the time required to rewrite image data, thereby realizing a display device with high display quality.

[0317] Furthermore, in the display device 10B exemplified in this embodiment, the display unit 13 is divided into four in the row direction, so the length of the wiring SL electrically connecting the source driver circuit and the pixel circuit is reduced to one-fourth, which reduces the resistance and parasitic capacitance of the wiring SL to one-fourth, thereby shortening the time required to write (rewrite) image data.

[0318] In addition, in the display device 10B exemplified in this embodiment, the display unit 13 is divided into eight sections in the column direction, so the length of the wiring GL electrically connecting the gate driver circuit and the pixel circuit is reduced to one-eighth, which reduces the resistance and parasitic capacitance of the wiring GL to one-eighth, improving signal degradation and delay and making it easier to ensure sufficient time for rewriting image data.

[0319] According to the display device 10B of one embodiment of the present invention, it is easy to ensure sufficient time for writing image data, and therefore high-speed rewriting of the displayed image can be realized. As a result, a display device with high display quality can be realized, and in particular, a display device with excellent moving image display can be realized.

[0320] <Variation 2> Figures 30A and 30B show perspective views of a display device 10C, which is a variation of the display device 10A. Note that the display device 10C is also a variation of the display device 10B. Figure 30B is a perspective view for explaining the configuration of each layer of the display device 10C. To reduce repetition of explanation, differences from the display device 10A and the display device 10B will be mainly explained.

[0321] The pixel circuit group 55 including a plurality of pixel circuits 51, the drive circuits 30 (30a to 30d), the functional circuit 40, and the terminal unit 14 may be provided on the same layer. The display device 10C has the pixel circuit group 55, the drive circuits 30, the functional circuit 40, and the terminal unit 14 provided on the layer 20. By providing the pixel circuit group 55, the drive circuits 30, and the functional circuit 40 on the same layer, the wiring that electrically connects them can be shortened. This reduces wiring resistance and parasitic capacitance, and reduces power consumption.

[0322] For example, when c-Si transistors are used as the transistors used in the display device 10C, a single-crystal silicon substrate can be used as the layer 20 to provide the pixel circuit group 55, the drive circuit 30, the function circuit 40, and the terminal portion 14. Furthermore, by using a single-crystal silicon substrate as the layer 20, the substrate 11 can be omitted. This allows the weight of the display device 10C to be reduced. Furthermore, this allows the production cost of the display device 10C to be reduced. This improves the productivity of the display device 10C.

[0323] Note that the transistors used in the display device 10C are not limited to c-Si transistors, and various transistors such as poly-Si transistors or OS transistors can be used as the transistors used in the display device 10C.

[0324] 30A and 30B, the display unit 13 is configured with sub-display units 19 arranged in a matrix of m rows and n columns. Therefore, the pixel circuit group 55 is divided into sections 59 arranged in a matrix of m rows and n columns. Fig. 31 shows a planar layout of the layer 20. Fig. 31 shows sections 59 when m is 4 and n is 8.

[0325] In the display device 10C, the drive circuit 30 is divided into four regions: drive circuit 30a, drive circuit 30b, drive circuit 30c, and drive circuit 30d. The drive circuits 30a, 30b, 30c, and 30d are provided outside the pixel circuit group 55. Specifically, of the four sides of the periphery of the pixel circuit group 55, the drive circuit 30a is provided on a first side, the drive circuit 30c is provided on a third side facing the first side across the pixel circuit group 55, the drive circuit 30b is provided on a second side, and the drive circuit 30d is provided on a fourth side facing the second side across the pixel circuit group 55.

[0326] The drive circuit 30a and the drive circuit 30c each have 16 gate driver circuits 33. The drive circuit 30b and the drive circuit 30d each have 16 source driver circuits 31. One of the gate driver circuits 33 is electrically connected to a plurality of pixel circuits 51 included in one of the sections 59. One of the source driver circuits 31 is electrically connected to a plurality of pixel circuits 51 included in one of the sections 59.

[0327] 31 , the gate driver circuit 33 electrically connected to the section 59[1,1] is indicated as gate driver circuit 33[1,1], and the source driver circuit 31 electrically connected to the section 59[1,1] is indicated as source driver circuit 31[1,1]. Similarly, the gate driver circuit 33 electrically connected to the section 59[4,8] is indicated as gate driver circuit 33[4,8], and the source driver circuit 31 electrically connected to the section 59[4,8] is indicated as source driver circuit 31[4,8].

[0328] The driver circuit 30a includes gate driver circuits 33[1,1] to 33[1,4], gate driver circuits 33[2,1] to 33[2,4], gate driver circuits 33[3,1] to 33[3,4], and gate driver circuits 33[4,1] to 33[4,4]. The driver circuit 30b includes source driver circuits 31[1,1] to 31[1,8] and source driver circuits 31[2,1] to 31[2,8]. The driver circuit 30c includes gate driver circuits 33[1,5] to 33[1,8], gate driver circuits 33[2,5] to 33[2,8], gate driver circuits 33[3,5] to 33[3,8], and gate driver circuits 33[4,5] to 33[4,8]. The driver circuit 30d includes source driver circuits 31[3,1] to 31[3,8] and source driver circuits 31[4,1] to 31[4,8].

[0329] The arrangement of the pixel circuit group 55, the drive circuit 30, and the function circuit 40 provided in the layer 20 is not limited to the configuration shown in Fig. 31 . For example, the configuration shown in Fig. 32 may be used. In Fig. 32 , the drive circuit 30 is divided into two regions, a drive circuit 30a and a drive circuit 30b. For example, the drive circuit 30a is provided with 32 gate driver circuits 33 (gate driver circuit 33[1,1] to gate driver circuit 33[4,8]), and the drive circuit 30b is provided with 32 source driver circuits 31 (source driver circuit 31[1,1] to source driver circuit 31[4,8]).

[0330] In the display devices 10B and 10C according to an embodiment of the present invention, the display unit 13 is divided into 32 sub-display units 19. However, the display unit 13 of the display devices 10B and 10C according to an embodiment of the present invention is not limited to 32 divisions, and may be divided into 16, 64, or 128 divisions, for example. Increasing the number of divisions of the display unit 13 can further reduce the actual degradation in display quality perceived by the user.

[0331] In this embodiment, a structural example of a display device that can be applied to an electronic device of one embodiment of the present invention will be described. A display device exemplified below can be applied to the display device 511, the display device 521, and the like in Embodiment 1.

[0332] One embodiment of the present invention is a display device having light-emitting elements (also referred to as light-emitting devices). The display device has two or more light-emitting elements that emit different light colors. Each light-emitting element has a pair of electrodes and an EL layer therebetween. The light-emitting elements are preferably organic EL elements (organic electroluminescent elements). The two or more light-emitting elements that emit different light colors each have an EL layer containing a different light-emitting material. For example, a full-color display device can be realized by having three types of light-emitting elements that emit red (R), green (G), or blue (B) light, respectively.

[0333] When fabricating a display device having multiple light-emitting elements that emit different colors of light, it is necessary to form at least one layer containing a light-emitting material (light-emitting layer) in an island shape. When fabricating a partial or entire EL layer, a method of forming island-shaped organic films by vapor deposition using a shadow mask such as a metal mask is known. However, this method can cause deviations in the shape and position of the island-shaped organic films from the design due to various factors such as the accuracy of the metal mask, misalignment between the metal mask and the substrate, deflection of the metal mask, and spreading of the contours of the deposited film due to vapor scattering, making it difficult to achieve high-definition and high-aperture display devices. Furthermore, during vapor deposition, the contours of the layer can become blurred, resulting in thinning of the edges. In other words, the thickness of the island-shaped light-emitting layer can vary depending on the location. Furthermore, when fabricating large, high-resolution, or high-definition display devices, there is a concern that low dimensional accuracy of the metal mask and deformation due to heat, etc., can reduce manufacturing yield. Therefore, measures have been taken to artificially increase the resolution (also known as pixel density) by adopting special pixel arrangements such as a pentile array.

[0334] In this specification, the term "island-like" refers to a state in which two or more layers formed using the same material in the same process are physically separated. For example, an island-like light-emitting layer refers to a state in which the light-emitting layer is physically separated from an adjacent light-emitting layer.

[0335] In one embodiment of the present invention, an EL layer is processed into a fine pattern by photolithography without using a shadow mask such as a fine metal mask (FMM). This makes it possible to realize a display device with high definition and a large aperture ratio, which have been difficult to achieve until now. Furthermore, since the EL layer can be individually fabricated, a display device with extremely vivid images, high contrast, and high display quality can be realized. Note that, for example, the EL layer may be processed into a fine pattern using both a metal mask and photolithography.

[0336] Furthermore, the EL layer can be partially or entirely separated physically. This can suppress leakage current between adjacent light-emitting elements through a layer shared between the light-emitting elements (also referred to as a common layer). This can prevent crosstalk caused by unintended light emission, thereby realizing a display device with extremely high contrast. In particular, a display device with high current efficiency at low luminance can be realized.

[0337] One embodiment of the present invention can also be a display device that combines a white-emitting light-emitting element and a color filter. In this case, light-emitting elements provided in pixels (subpixels) that emit light of different colors can have the same configuration, and all layers can be common layers. Furthermore, part or all of each EL layer is separated by photolithography. This suppresses leakage current through the common layer, thereby realizing a display device with high contrast. In particular, in an element having a tandem structure in which multiple light-emitting layers are stacked via a highly conductive intermediate layer, leakage current through the intermediate layer can be effectively prevented, thereby realizing a display device that combines high brightness, high definition, and high contrast.

[0338] Furthermore, it is preferable to provide an insulating layer that covers at least the side surfaces of the island-shaped light-emitting layers. The insulating layer may be configured to cover a portion of the top surface of the island-shaped EL layer. The insulating layer is preferably made of a material that has barrier properties against water and oxygen. For example, an inorganic insulating film that is difficult for water or oxygen to diffuse can be used. This suppresses deterioration of the EL layer and realizes a highly reliable display device.

[0339] Furthermore, there is a region (recess) between two adjacent light-emitting elements where the EL layer of either light-emitting element is not provided. When a common electrode, or a common electrode and a common layer, is formed to cover the recess, a phenomenon in which the common electrode is separated by a step at the edge of the EL layer (also called a step discontinuity) may occur, resulting in insulation of the common electrode on the EL layer. Therefore, it is preferable to use a configuration in which the local step located between two adjacent light-emitting elements is filled with a resin layer functioning as a planarization film (also called LFP: Local Filling Planarization). The resin layer functions as a planarization film. This suppresses step discontinuity of the common layer or common electrode, thereby achieving a highly reliable display device.

[0340] A more specific example of the structure of the display device of one embodiment of the present invention will be described below with reference to the drawings.

[0341] 33A shows a schematic top view of a display device 100 of one embodiment of the present invention. The display device 100 includes a plurality of light-emitting elements 110R that exhibit red light, a plurality of light-emitting elements 110G that exhibit green light, and a plurality of light-emitting elements 110B that exhibit blue light, over a substrate 101. In FIG. 33A , the symbols R, G, and B are assigned within the light-emitting regions of the light-emitting elements to easily distinguish them from one another.

[0342] The light emitting elements 110R, 110G, and 110B are arranged in a matrix. Fig. 33A shows a so-called stripe arrangement in which light emitting elements of the same color are arranged in one direction. Note that the arrangement method of the light emitting elements is not limited to this, and arrangement methods such as an S-stripe arrangement, a delta arrangement, a Bayer arrangement, or a zigzag arrangement may also be used, or a pentile arrangement, a diamond arrangement, or the like may also be used.

[0343] As the light-emitting element 110R, the light-emitting element 110G, and the light-emitting element 110B, for example, an OLED (organic light-emitting diode) or a QLED (quantum-dot light-emitting diode) is preferably used. Examples of the light-emitting substance contained in the EL element include a substance that emits fluorescence (fluorescent material), a substance that emits phosphorescence (phosphorescent material), and a substance that exhibits thermally activated delayed fluorescence (thermally activated delayed fluorescence: TADF material). As the light-emitting substance contained in the EL element, not only organic compounds but also inorganic compounds (such as quantum dot materials) can be used.

[0344] 33A also shows a connection electrode 111C that is electrically connected to the common electrode 113. The connection electrode 111C is given a potential (e.g., an anode potential or a cathode potential) to be supplied to the common electrode 113. The connection electrode 111C is provided outside the display area where the light-emitting elements 110R and the like are arranged.

[0345] The connection electrode 111C can be provided along the periphery of the display area. For example, it may be provided along one side of the periphery of the display area, or it may be provided over two or more sides of the periphery of the display area. That is, when the shape of the display area is rectangular in a plan view, the shape of the connection electrode 111C can be a strip (rectangle), an L-shape, a U-shape (square bracket shape), a square shape, or the like.

[0346] 33B and 33C are schematic cross-sectional views corresponding to dashed dotted lines A1-A2 and A3-A4 in Fig. 33A, respectively. Fig. 33B shows a schematic cross-sectional view of light-emitting element 110R, light-emitting element 110G, and light-emitting element 110B, and Fig. 33C shows a schematic cross-sectional view of connection portion 140 where connection electrode 111C and common electrode 113 are connected.

[0347] The light-emitting element 110R has a pixel electrode 111R, an organic layer 112R, a common layer 114, and a common electrode 113. The light-emitting element 110G has a pixel electrode 111G, an organic layer 112G, a common layer 114, and a common electrode 113. The light-emitting element 110B has a pixel electrode 111B, an organic layer 112B, a common layer 114, and a common electrode 113. The common layer 114 and the common electrode 113 are provided in common to the light-emitting element 110R, the light-emitting element 110G, and the light-emitting element 110B.

[0348] The organic layer 112R of the light-emitting element 110R contains a light-emitting organic compound that emits at least red light. The organic layer 112G of the light-emitting element 110G contains a light-emitting organic compound that emits at least green light. The organic layer 112B of the light-emitting element 110B contains a light-emitting organic compound that emits at least blue light. The organic layer 112R, the organic layer 112G, and the organic layer 112B can also be called EL layers, and each contains at least a layer (light-emitting layer) that contains a light-emitting organic compound.

[0349] Hereinafter, when describing matters common to light emitting element 110R, light emitting element 110G, and light emitting element 110B, they may be referred to as light emitting element 110. Similarly, when describing matters common to components distinguished by alphabets, such as organic layer 112R, organic layer 112G, and organic layer 112B, they may be described using symbols without the alphabets.

[0350] The organic layer 112 and the common layer 114 may each independently include one or more of an electron injection layer, an electron transport layer, a hole injection layer, and a hole transport layer. For example, the organic layer 112 may have a stacked structure of a hole injection layer, a hole transport layer, a light-emitting layer, and an electron transport layer from the pixel electrode 111 side, and the common layer 114 may have an electron injection layer.

[0351] The pixel electrode 111R, pixel electrode 111G, and pixel electrode 111B are provided for each light-emitting element. The common electrode 113 and common layer 114 are provided as a continuous layer common to each light-emitting element. A conductive film transmissive to visible light is used for either the pixel electrode or the common electrode 113, and a conductive film reflective to visible light is used for the other. By making each pixel electrode transmissive and the common electrode 113 reflective, a bottom-emission display device can be obtained. Conversely, by making each pixel electrode reflective and the common electrode 113 transmissive, a top-emission display device can be obtained. Note that by making both the pixel electrodes and the common electrode 113 transmissive, a dual-emission display device can be obtained.

[0352] A protective layer 121 is provided on the common electrode 113 to cover the light emitting elements 110R, 110G, and 110B. The protective layer 121 has a function of preventing impurities such as water from diffusing from above into each light emitting element.

[0353] The edge of the pixel electrode 111 preferably has a tapered shape. When the edge of the pixel electrode has a tapered shape, the organic layer 112 provided along the side surface of the pixel electrode also has a tapered shape. By tapering the side surface of the pixel electrode, the coverage of the EL layer provided along the side surface of the pixel electrode can be improved. Furthermore, by tapering the side surface of the pixel electrode, foreign matter (for example, dust or particles) during the manufacturing process can be easily removed by a process such as cleaning, which is preferable.

[0354] In this specification and the like, the term "tapered shape" refers to a shape in which at least a part of a side surface of a structure is inclined with respect to a substrate surface. For example, it is preferable that the structure has a region in which the angle between the inclined side surface and the substrate surface (also referred to as the taper angle) is less than 90°.

[0355] The organic layer 112 is processed into an island shape by photolithography. As a result, the angle between the top surface and the side surface of the organic layer 112 at its edge is close to 90 degrees. On the other hand, an organic film formed using a fine metal mask (FMM) or the like tends to become gradually thinner as it approaches the edge. For example, the top surface is formed in a sloped shape over a range of 1 μm to 10 μm up to the edge, making it difficult to distinguish between the top surface and the side surface.

[0356] Between two adjacent light emitting elements, an insulating layer 125, a resin layer 126, and a layer 128 are provided.

[0357] Between two adjacent light-emitting elements, the side surfaces of the organic layers 112 face each other with the resin layer 126 interposed therebetween. The resin layer 126 is located between the two adjacent light-emitting elements and is provided so as to fill the ends of each organic layer 112 and the region between the two organic layers 112. The upper surface of the resin layer 126 has a smooth convex shape, and a common layer 114 and a common electrode 113 are provided to cover the upper surface of the resin layer 126.

[0358] The resin layer 126 functions as a planarization film that fills in a step between two adjacent light-emitting elements. By providing the resin layer 126, it is possible to prevent a phenomenon (also called step disconnection) in which the common electrode 113 is divided by a step at the end of the organic layer 112, resulting in insulation of the common electrode on the organic layer 112. The resin layer 126 can also be called an LFP (Local Filling Planarization) layer.

[0359] An insulating layer containing an organic material can be suitably used as the resin layer 126. For example, acrylic resin, polyimide resin, epoxy resin, imide resin, polyamide resin, polyimideamide resin, silicone resin, siloxane resin, benzocyclobutene resin, phenolic resin, precursors of these resins, etc. can be used as the resin layer 126. Alternatively, organic materials such as polyvinyl alcohol (PVA), polyvinyl butyral, polyvinylpyrrolidone, polyethylene glycol, polyglycerin, pullulan, water-soluble cellulose, or alcohol-soluble polyamide resin can be used as the resin layer 126.

[0360] Furthermore, a photosensitive resin can be used as the resin layer 126. A photoresist can be used as the photosensitive resin. The photosensitive resin can be a positive-type material or a negative-type material.

[0361] The resin layer 126 may contain a material that absorbs visible light. For example, the resin layer 126 itself may be made of a material that absorbs visible light, or the resin layer 126 may contain a pigment that absorbs visible light. For example, the resin layer 126 may be a resin that can be used as a color filter that transmits red, blue, or green light and absorbs other light, or a resin that contains carbon black as a pigment and functions as a black matrix.

[0362] The insulating layer 125 is provided in contact with the side surface of the organic layer 112. The insulating layer 125 is also provided to cover the upper end portion of the organic layer 112. A portion of the insulating layer 125 is provided in contact with the upper surface of the substrate 101.

[0363] The insulating layer 125 is located between the resin layer 126 and the organic layer 112, and functions as a protective film for preventing the resin layer 126 from contacting the organic layer 112. If the organic layer 112 and the resin layer 126 come into contact with each other, the organic layer 112 may be dissolved by an organic solvent or the like used when forming the resin layer 126. Therefore, as shown in this embodiment, by providing the insulating layer 125 between the organic layer 112 and the resin layer 126, it is possible to protect the side surfaces of the organic layer.

[0364] The insulating layer 125 can be an insulating layer containing an inorganic material. For example, an inorganic insulating film such as an oxide insulating film, a nitride insulating film, an oxynitride insulating film, or a nitride oxide insulating film can be used for the insulating layer 125. The insulating layer 125 may have a single-layer structure or a stacked-layer structure. Examples of oxide insulating films include a silicon oxide film, an aluminum oxide film, a magnesium oxide film, an indium gallium zinc oxide film, a gallium oxide film, a germanium oxide film, an yttrium oxide film, a zirconium oxide film, a lanthanum oxide film, a neodymium oxide film, a hafnium oxide film, and a tantalum oxide film. Examples of nitride insulating films include a silicon nitride film and an aluminum nitride film. Examples of oxynitride insulating films include a silicon oxynitride film and an aluminum oxynitride film. Examples of nitride oxide insulating films include a silicon nitride oxide film and an aluminum nitride oxide film. In particular, by using an inorganic insulating film such as a metal oxide film, an aluminum oxide film, or a silicon oxide film formed by an ALD method as the insulating layer 125, an insulating layer 125 with few pinholes and excellent protection of the EL layer can be formed.

[0365] In this specification and elsewhere, an oxynitride refers to a material whose composition contains more oxygen than nitrogen, and a nitride oxide refers to a material whose composition contains more nitrogen than oxygen. For example, silicon oxynitride refers to a material whose composition contains more oxygen than nitrogen, and silicon nitride oxide refers to a material whose composition contains more nitrogen than oxygen.

[0366] The insulating layer 125 can be formed by a sputtering method, a CVD method, a PLD method, an ALD method, or the like. The insulating layer 125 is preferably formed by an ALD method because it has good coverage.

[0367] Furthermore, a reflective film (e.g., a metal film containing one or more selected from silver, palladium, copper, titanium, aluminum, etc.) may be provided between the insulating layer 125 and the resin layer 126, so that the light emitted from the light-emitting layer is reflected by the reflective film, thereby improving the light extraction efficiency.

[0368] The layer 128 is a remaining portion of a protective layer (also referred to as a mask layer or a sacrificial layer) for protecting the organic layer 112 during etching of the organic layer 112. The layer 128 can be made of a material that can be used for the insulating layer 125. In particular, it is preferable to use the same material for the layer 128 and the insulating layer 125 because a common processing device or the like can be used for both.

[0369] In particular, inorganic insulating films such as metal oxide films such as aluminum oxide films and hafnium oxide films, or silicon oxide films formed by the ALD method have few pinholes and therefore have an excellent function of protecting the EL layer, and can be suitably used for the insulating layer 125 and the layer 128.

[0370] A protective layer 121 is provided to cover the common electrode 113 .

[0371] The protective layer 121 may have, for example, a single-layer structure or a stacked structure including at least an inorganic insulating film. Examples of the inorganic insulating film include oxide films or nitride films such as a silicon oxide film, a silicon oxynitride film, a silicon nitride oxide film, a silicon nitride film, an aluminum oxide film, an aluminum oxynitride film, and a hafnium oxide film. Alternatively, the protective layer 121 may be made of a semiconductor material or a conductive material such as indium gallium oxide, indium zinc oxide, indium tin oxide, or indium gallium zinc oxide.

[0372] The protective layer 121 may also be a laminated film of an inorganic insulating film and an organic insulating film. For example, a configuration in which an organic insulating film is sandwiched between a pair of inorganic insulating films is preferable. Furthermore, it is preferable that the organic insulating film functions as a planarizing film. This allows the upper surface of the organic insulating film to be flat, improving the coverage of the inorganic insulating film thereon and enhancing the barrier properties. Furthermore, since the upper surface of the protective layer 121 is flat, when a structure (e.g., a color filter, a touch sensor electrode, a lens array, etc.) is provided above the protective layer 121, the influence of uneven shapes caused by the structure below can be reduced, which is preferable.

[0373] 33C shows a connection portion 140 where the connection electrode 111C and the common electrode 113 are electrically connected. In the connection portion 140, an opening is provided in the insulating layer 125 and the resin layer 126 above the connection electrode 111C. The connection electrode 111C and the common electrode 113 are electrically connected in the opening.

[0374] 33C shows a connection portion 140 where the connection electrode 111C and the common electrode 113 are electrically connected, but the common electrode 113 may be provided on the connection electrode 111C via the common layer 114. In particular, when a carrier injection layer is used for the common layer 114, the electrical resistivity of the material used for the common layer 114 is sufficiently low and the common layer 114 can be formed thin, so there are many cases where no problem occurs even if the common layer 114 is located at the connection portion 140. This allows the common electrode 113 and the common layer 114 to be formed using the same masking mask, thereby reducing manufacturing costs.

[0375] The above is a description of an example of the configuration of the display device.

[0376] [Pixel Layout] The following mainly describes pixel layouts that are different from those in Fig. 33A. There are no particular limitations on the arrangement of light-emitting elements (sub-pixels), and various methods can be applied.

[0377] In addition, in a plan view, the shape of the sub-pixel may be, for example, a triangle, a quadrangle (including a rectangle and a square), a polygon such as a pentagon, a polygon with rounded corners, an ellipse, a circle, etc. Here, the shape of the sub-pixel corresponds to the shape of the light-emitting region of the light-emitting element.

[0378] An S-stripe arrangement is applied to pixel 150 shown in Fig. 34A. Pixel 150 shown in Fig. 34A is composed of three sub-pixels: light-emitting elements 110a, 110b, and 110c. For example, light-emitting element 110a may be a blue light-emitting element, light-emitting element 110b may be a red light-emitting element, and light-emitting element 110c may be a green light-emitting element.

[0379] The pixel 150 shown in FIG. 34B includes, in a plan view, a light-emitting element 110a having a generally trapezoidal shape with rounded corners, a light-emitting element 110b having a generally triangular shape with rounded corners, and a light-emitting element 110c having a generally rectangular or hexagonal shape with rounded corners. Furthermore, the light-emitting element 110a has a larger light-emitting area than the light-emitting element 110b. In this manner, the shape and size of each light-emitting element can be determined independently. For example, the more reliable the light-emitting element, the smaller the size can be. For example, the light-emitting element 110a may be a green light-emitting element, the light-emitting element 110b may be a red light-emitting element, and the light-emitting element 110c may be a blue light-emitting element.

[0380] The pixels 124a and 124b shown in Figure 34C are arranged in a Pentile arrangement. Figure 34C shows an example in which a pixel 124a having light-emitting elements 110a and 110b and a pixel 124b having light-emitting elements 110b and 110c are arranged alternately. For example, the light-emitting element 110a may be a red light-emitting element, the light-emitting element 110b may be a green light-emitting element, and the light-emitting element 110c may be a blue light-emitting element.

[0381] The pixels 124a and 124b shown in Figures 34D and 34E are arranged in a delta configuration. The pixel 124a has two light-emitting elements (light-emitting elements 110a and 110b) in the top row (first row) and one light-emitting element (light-emitting element 110c) in the bottom row (second row). The pixel 124b has one light-emitting element (light-emitting element 110c) in the top row (first row) and two light-emitting elements (light-emitting elements 110a and 110b) in the bottom row (second row). For example, the light-emitting element 110a may be a red light-emitting element, the light-emitting element 110b may be a green light-emitting element, and the light-emitting element 110c may be a blue light-emitting element.

[0382] FIG. 34D shows an example in which each light-emitting element has a substantially rectangular shape with rounded corners in plan view, and FIG. 34E shows an example in which each light-emitting element has a circular shape.

[0383] 34F shows an example in which light-emitting elements of each color are arranged in a zigzag pattern. Specifically, when viewed from above, the positions of the upper edges of two light-emitting elements arranged in a column direction (e.g., light-emitting elements 110a and 110b, or light-emitting elements 110b and 110c) are misaligned. For example, light-emitting element 110a may be a red light-emitting element, light-emitting element 110b may be a green light-emitting element, and light-emitting element 110c may be a blue light-emitting element.

[0384] In photolithography, the finer the pattern to be processed, the more significant the effect of light diffraction becomes. This reduces the fidelity of the photomask pattern when it is transferred by exposure, making it difficult to process the resist mask into the desired shape. Therefore, even if the photomask pattern is rectangular, it is likely to have rounded corners. Therefore, the shape of the light-emitting element in plan view may be a polygon with rounded corners, an ellipse, a circle, or the like.

[0385] Furthermore, in a method for manufacturing a display panel according to one embodiment of the present invention, the EL layer is processed into an island shape using a resist mask. The resist film formed on the EL layer needs to be cured at a temperature lower than the heat resistance temperature of the EL layer. Therefore, depending on the heat resistance temperature of the material for the EL layer and the curing temperature of the resist material, the resist film may not be cured sufficiently. A resist film that is not cured sufficiently may have a shape that deviates from the desired shape during processing. As a result, the shape of the EL layer in a planar view may become a polygon with rounded corners, an ellipse, a circle, or the like. For example, when a resist mask having a square shape in a planar view is formed, a circular resist mask may be formed, resulting in a circular shape of the EL layer in a planar view.

[0386] In order to make the shape of the EL layer in a desired planar view, a technique for correcting the mask pattern in advance (OPC (Optical Proximity Correction) technique) may be used so that the design pattern and the transfer pattern coincide with each other. Specifically, the OPC technique adds a correction pattern to the corners of figures on the mask pattern.

[0387] This concludes the description of the pixel layout.

[0388] This embodiment mode can be implemented by appropriately combining at least a part thereof with other embodiment modes described in this specification.

[0389] In this embodiment, another structural example of a display device (display panel) that can be applied to an electronic device of one embodiment of the present invention will be described. The display device (display panel) exemplified below can be applied to the display device 511, the display device 521, and the like in Embodiment 1.

[0390] The display device of this embodiment can be a high-resolution display device. For example, the display device of one embodiment of the present invention can be used for a display portion of a wristwatch-type or bracelet-type information terminal (wearable device), a VR device such as a head-mounted display, or a head-mountable wearable device such as a glasses-type AR device.

[0391] 35A shows a perspective view of a display module 280. The display module 280 includes a display device 200A and an FPC 290. Note that the display panel included in the display module 280 is not limited to the display device 200A, and may be any of display devices 200B to 200F described later.

[0392] The display module 280 has a substrate 291 and a substrate 292. The display module 280 has a display unit 281. The display unit 281 is an area for displaying an image.

[0393] 35B is a perspective view schematically illustrating the configuration on the substrate 291 side. A circuit portion 282, a pixel circuit portion 283 on the circuit portion 282, and a pixel portion 284 on the pixel circuit portion 283 are stacked on the substrate 291. A terminal portion 285 for connecting to the FPC 290 is provided in a portion of the substrate 291 that does not overlap with the pixel portion 284. The terminal portion 285 and the circuit portion 282 are electrically connected by a wiring portion 286 composed of a plurality of wirings.

[0394] The pixel section 284 has a plurality of periodically arranged pixels 284a. An enlarged view of one pixel 284a is shown on the right side of Fig. 35B. The pixel 284a has a light-emitting element 110R that emits red light, a light-emitting element 110G that emits green light, and a light-emitting element 110B that emits blue light.

[0395] The pixel circuit portion 283 has a plurality of pixel circuits 283a arranged periodically. Each pixel circuit 283a is a circuit that controls the light emission of three light-emitting devices included in one pixel 284a. One pixel circuit 283a may be configured to have three circuits that control the light emission of one light-emitting device. For example, the pixel circuit 283a may be configured to have at least one selection transistor, one current control transistor (drive transistor), and a capacitor for each light-emitting device. In this case, a gate signal is input to the gate of the selection transistor, and a source signal is input to the source. This realizes an active matrix display panel.

[0396] The circuit portion 282 includes a circuit for driving each pixel circuit 283a of the pixel circuit portion 283. For example, it is preferable that the circuit portion 282 includes one or both of a gate line driver circuit and a source line driver circuit. In addition, the circuit portion 282 may include at least one of an arithmetic circuit, a memory circuit, a power supply circuit, and the like. Furthermore, a transistor provided in the circuit portion 282 may constitute a part of the pixel circuit 283a. That is, the pixel circuit 283a may be composed of a transistor included in the pixel circuit portion 283 and a transistor included in the circuit portion 282.

[0397] The FPC 290 functions as wiring for supplying a video signal, a power supply potential, and the like from the outside to the circuit portion 282. An IC may be mounted on the FPC 290.

[0398] The display module 280 can be configured such that one or both of the pixel circuit unit 283 and the circuit unit 282 are provided overlapping below the pixel unit 284, thereby enabling the aperture ratio (effective display area ratio) of the display unit 281 to be extremely high. For example, the aperture ratio of the display unit 281 can be 40% or more and less than 100%, preferably 50% or more and 95% or less, and more preferably 60% or more and 95% or less. Furthermore, the pixels 284a can be arranged at an extremely high density, enabling the resolution of the display unit 281 to be extremely high. For example, it is preferable that the pixels 284a be arranged in the display unit 281 at a resolution of 2000 ppi or more, preferably 3000 ppi or more, more preferably 5000 ppi or more, and even more preferably 6000 ppi or more, and 20,000 ppi or less, or 30,000 ppi or less.

[0399] Because such a display module 280 has extremely high resolution, it can be suitably used in VR devices such as head-mounted displays, or in glasses-type AR devices. For example, even in a configuration in which the display unit of the display module 280 is viewed through lenses, the display module 280 has an extremely high-resolution display unit 281, so even when the display unit is enlarged with lenses, the pixels are not visible, allowing for a highly immersive display. Furthermore, the display module 280 is not limited to this, and can be suitably used in electronic devices with relatively small display units. For example, it can be suitably used in the display unit of a wearable electronic device such as a wristwatch.

[0400] [Display Device 200A] The display device 200A shown in FIG. 36A includes a substrate 301, light-emitting elements 110R, 110G, and 110B, a capacitor 240, and a transistor 310.

[0401] Substrate 301 corresponds to substrate 291 in FIGS. 35A and 35B.

[0402] The transistor 310 has a channel formation region in a substrate 301. The substrate 301 can be, for example, a semiconductor substrate such as a single crystal silicon substrate. The transistor 310 includes a part of the substrate 301, a conductive layer 311, a low-resistance region 312, an insulating layer 313, and an insulating layer 314. The conductive layer 311 functions as a gate electrode. The insulating layer 313 is located between the substrate 301 and the conductive layer 311 and functions as a gate insulating layer. The low-resistance region 312 is a region in which the substrate 301 is doped with impurities and functions as one of a source and a drain. The insulating layer 314 is provided to cover a side surface of the conductive layer 311.

[0403] An element isolation layer 315 is provided between two adjacent transistors 310 so as to be embedded in the substrate 301 .

[0404] In addition, an insulating layer 261 is provided to cover the transistor 310 , and a capacitor 240 is provided over the insulating layer 261 .

[0405] The capacitor 240 has a conductive layer 241, a conductive layer 245, and an insulating layer 243 located therebetween. The conductive layer 241 functions as one electrode of the capacitor 240, the conductive layer 245 functions as the other electrode of the capacitor 240, and the insulating layer 243 functions as a dielectric of the capacitor 240.

[0406] The conductive layer 241 is provided over the insulating layer 261 and is buried in the insulating layer 254. The conductive layer 241 is electrically connected to one of the source and drain of the transistor 310 by a plug 271 buried in the insulating layer 261. The insulating layer 243 is provided to cover the conductive layer 241. The conductive layer 245 is provided in a region overlapping with the conductive layer 241 with the insulating layer 243 interposed therebetween.

[0407] An insulating layer 255a is provided to cover the capacitor 240, an insulating layer 255b is provided over the insulating layer 255a, and an insulating layer 255c is provided over the insulating layer 255b.

[0408] An inorganic insulating film can be preferably used for each of the insulating layers 255a, 255b, and 255c. For example, it is preferable to use a silicon oxide film for the insulating layer 255a and the insulating layer 255c, and a silicon nitride film for the insulating layer 255b. This allows the insulating layer 255b to function as an etching protection film. In this embodiment, an example is shown in which part of the insulating layer 255c is etched to form a recess, but the insulating layer 255c does not necessarily have to have a recess.

[0409] The light-emitting elements 110R, 110G, and 110B are provided over the insulating layer 255c. Embodiment 1 can be referred to for the structures of the light-emitting elements 110R, 110G, and 110B.

[0410] In the display device 200A, a separate light-emitting device is fabricated for each emitted color, resulting in minimal change in chromaticity between low-luminance and high-luminance emission. Furthermore, because the organic layers 112R, 112G, and 112B are spaced apart from one another, crosstalk between adjacent subpixels can be suppressed even in a high-resolution display panel. This allows for the realization of a high-resolution, high-quality display panel.

[0411] In the region between adjacent light emitting elements, an insulating layer 125, a resin layer 126, and a layer 128 are provided.

[0412] The pixel electrode 111R, pixel electrode 111G, and pixel electrode 111B of the light-emitting element are electrically connected to one of the source and drain of the transistor 310 via a plug 256 embedded in the insulating layers 255a, 255b, and 255c, a conductive layer 241 embedded in the insulating layer 254, and a plug 271 embedded in the insulating layer 261. The height of the top surface of the insulating layer 255c and the height of the top surface of the plug 256 are the same or approximately the same. Various conductive materials can be used for the plug.

[0413] A protective layer 121 is provided on the light emitting elements 110R, 110G, and 110B. A substrate 170 is attached to the protective layer 121 with an adhesive layer 171.

[0414] There is no insulating layer covering the upper end of each pixel electrode 111 between two adjacent pixel electrodes 111. This allows the distance between adjacent light-emitting elements to be extremely narrow, resulting in a high-definition or high-resolution display device.

[0415] 37 has a configuration in which a transistor 310A and a transistor 310B, each having a channel formed in a semiconductor substrate, are stacked. Note that in the following description of the display panel, descriptions of parts that are the same as those of the display panel described above may be omitted.

[0416] The display device 200B has a configuration in which a substrate 301B on which a transistor 310B, a capacitor 240, and a light-emitting device are provided and a substrate 301A on which a transistor 310A is provided are bonded together.

[0417] Here, an insulating layer 345 is provided on the lower surface of the substrate 301B, and an insulating layer 346 is provided on the insulating layer 261 provided on the substrate 301A. The insulating layers 345 and 346 function as protective layers and can suppress the diffusion of impurities into the substrates 301B and 301A. The insulating layers 345 and 346 can be made of an inorganic insulating film that can be used for the protective layer 121 or the insulating layer 332.

[0418] The substrate 301B is provided with a plug 343 that penetrates the substrate 301B and an insulating layer 345. Here, it is preferable to provide an insulating layer 344 that covers the side surface of the plug 343 and functions as a protective layer.

[0419] Furthermore, in the substrate 301B, a conductive layer 342 is provided below the insulating layer 345. The conductive layer 342 is embedded in the insulating layer 335, and the lower surfaces of the conductive layer 342 and the insulating layer 335 are flattened. The conductive layer 342 is electrically connected to a plug 343.

[0420] On the other hand, in the substrate 301A, a conductive layer 341 is provided on an insulating layer 346. The conductive layer 341 is embedded in the insulating layer 336, and the upper surfaces of the conductive layer 341 and the insulating layer 336 are flattened.

[0421] It is preferable to use the same conductive material for the conductive layers 341 and 342. For example, a metal film containing an element selected from Al, Cr, Cu, Ta, Ti, Mo, and W, or a metal nitride film containing the above elements (titanium nitride film, molybdenum nitride film, tungsten nitride film), etc., can be used. In particular, it is preferable to use copper for the conductive layers 341 and 342. This allows the use of Cu-Cu (copper-copper) direct bonding technology (technology that achieves electrical conductivity by connecting Cu (copper) pads together).

[0422] [Display Device 200C] A display device 200C shown in FIG. 38 has a configuration in which a conductive layer 341 and a conductive layer 342 are joined via a bump 347.

[0423] 38 , by providing a bump 347 between the conductive layer 341 and the conductive layer 342, the conductive layer 341 and the conductive layer 342 can be electrically connected. The bump 347 can be formed using a conductive material containing, for example, gold (Au), nickel (Ni), indium (In), tin (Sn), or the like. Alternatively, for example, solder may be used as the bump 347. An adhesive layer 348 may be provided between the insulating layer 345 and the insulating layer 346. When the bump 347 is provided, the insulating layer 335 and the insulating layer 336 may not be provided.

[0424] [Display Device 200D] A display device 200D shown in FIG. 39 differs from the display device 200A mainly in the configuration of the transistors.

[0425] The transistor 320 is a transistor (OS transistor) in which a metal oxide (also referred to as an oxide semiconductor) is used for a semiconductor layer in which a channel is formed.

[0426] The transistor 320 includes a semiconductor layer 321 , an insulating layer 323 , a conductive layer 324 , a pair of conductive layers 325 , an insulating layer 326 , and a conductive layer 327 .

[0427] Substrate 331 corresponds to substrate 291 in Figures 35A and 35B.

[0428] An insulating layer 332 is provided over a substrate 331. The insulating layer 332 functions as a barrier layer that prevents impurities such as water or hydrogen from diffusing from the substrate 331 to the transistor 320 and prevents oxygen from being released from the semiconductor layer 321 toward the insulating layer 332. The insulating layer 332 can be, for example, a film through which hydrogen or oxygen is less likely to diffuse than a silicon oxide film, such as an aluminum oxide film, a hafnium oxide film, or a silicon nitride film.

[0429] A conductive layer 327 is provided over the insulating layer 332, and an insulating layer 326 is provided to cover the conductive layer 327. The conductive layer 327 functions as a first gate electrode of the transistor 320, and part of the insulating layer 326 functions as a first gate insulating layer. An oxide insulating film such as a silicon oxide film is preferably used for at least a portion of the insulating layer 326 that is in contact with the semiconductor layer 321. The top surface of the insulating layer 326 is preferably planarized.

[0430] The semiconductor layer 321 is provided over the insulating layer 326. The semiconductor layer 321 preferably includes a metal oxide (also referred to as an oxide semiconductor) film exhibiting semiconductor characteristics. A pair of conductive layers 325 is provided over and in contact with the semiconductor layer 321 and functions as a source electrode and a drain electrode.

[0431] An insulating layer 328 is provided to cover top surfaces and side surfaces of the pair of conductive layers 325 and side surfaces of the semiconductor layer 321, and an insulating layer 264 is provided over the insulating layer 328. The insulating layer 328 functions as a barrier layer that prevents impurities such as water or hydrogen from diffusing from the insulating layer 264 or the like into the semiconductor layer 321 and prevents oxygen from being released from the semiconductor layer 321. The insulating layer 328 can be an insulating film similar to the insulating layer 332.

[0432] An opening reaching the semiconductor layer 321 is provided in the insulating layer 328 and the insulating layer 264. An insulating layer 323 in contact with the top surface of the semiconductor layer 321 and a conductive layer 324 are buried in the opening. The conductive layer 324 functions as a second gate electrode, and the insulating layer 323 functions as a second gate insulating layer.

[0433] The top surfaces of the conductive layer 324, the insulating layer 323, and the insulating layer 264 are planarized so that their heights are the same or approximately the same, and insulating layers 329 and 265 are provided to cover them.

[0434] The insulating layer 264 and the insulating layer 265 function as interlayer insulating layers. The insulating layer 329 functions as a barrier layer that prevents impurities such as water or hydrogen from diffusing from the insulating layer 265 or the like to the transistor 320. The insulating layer 329 can be formed using an insulating film similar to the insulating layer 328 and the insulating layer 332.

[0435] A plug 274 electrically connected to one of the pair of conductive layers 325 is provided to be embedded in the insulating layer 265, the insulating layer 329, and the insulating layer 264. Here, the plug 274 preferably includes a conductive layer 274a covering the side surfaces of the openings of the insulating layer 265, the insulating layer 329, the insulating layer 264, and the insulating layer 328 and part of the top surface of the conductive layer 325, and a conductive layer 274b in contact with the top surface of the conductive layer 274a. In this case, the conductive layer 274a is preferably made of a conductive material through which hydrogen and oxygen do not easily diffuse.

[0436] [Display Device 200E] A display device 200E illustrated in FIG. 40 has a stacked structure of a transistor 320A and a transistor 320B each including an oxide semiconductor as a semiconductor in which a channel is formed.

[0437] The transistor 320A, the transistor 320B, and the surrounding configurations thereof can be referred to the display device 200D.

[0438] Although two transistors including an oxide semiconductor are stacked here, the present invention is not limited to this structure, and for example, three or more transistors may be stacked.

[0439] [Display Device 200F] A display device 200F shown in FIG. 41 has a stacked structure of a transistor 310 in which a channel is formed in a substrate 301 and a transistor 320 in which a channel is formed and a semiconductor layer containing metal oxide.

[0440] An insulating layer 261 is provided to cover the transistor 310, and a conductive layer 251 is provided over the insulating layer 261. An insulating layer 262 is provided to cover the conductive layer 251, and a conductive layer 252 is provided over the insulating layer 262. The conductive layers 251 and 252 each function as wirings. An insulating layer 263 and an insulating layer 332 are provided to cover the conductive layer 252, and the transistor 320 is provided over the insulating layer 332. An insulating layer 265 is provided to cover the transistor 320, and a capacitor 240 is provided over the insulating layer 265. The capacitor 240 and the transistor 320 are electrically connected by a plug 274.

[0441] The transistor 320 can be used as a transistor that forms a pixel circuit. The transistor 310 can be used as a transistor that forms a pixel circuit or a driver circuit (gate line driver circuit, source line driver circuit) that drives the pixel circuit. The transistors 310 and 320 can be used as transistors that form various circuits such as an arithmetic circuit or a memory circuit.

[0442] With this configuration, not only pixel circuits but also driving circuits etc. can be formed directly below the light-emitting device, which makes it possible to make the display panel smaller than when driving circuits are provided around the periphery of the display area.

[0443] [Display Device 200G] A display device 200G shown in Figure 42 has a stacked structure of a transistor 310 whose channel is formed in a substrate 301, a transistor 320A whose channel is formed in a semiconductor layer containing metal oxide, and a transistor 320B.

[0444] The transistor 320A can be used as a transistor that forms a pixel circuit. The transistor 310 can be used as a transistor that forms a pixel circuit or a transistor that forms a driver circuit (gate line driver circuit, source line driver circuit) for driving the pixel circuit. The transistor 320B may be used as a transistor that forms a pixel circuit or a transistor that forms the driver circuit. The transistor 310, the transistor 320A, and the transistor 320B can be used as transistors that form various circuits such as an arithmetic circuit or a memory circuit.

[0445] This embodiment mode can be implemented by appropriately combining at least a part thereof with other embodiment modes described in this specification.

[0446] Embodiment 5 In this embodiment, a light-emitting device (light-emitting element) that can be used for a display device of one embodiment of the present invention will be described.

[0447] In this specification, etc., a device fabricated using a metal mask or an FMM (fine metal mask, high-resolution metal mask) may be referred to as a device with an MM (metal mask) structure. Also, in this specification, etc., a device fabricated without using a metal mask or an FMM may be referred to as a device with an MML (metal maskless) structure.

[0448] In this specification and the like, a structure in which at least light-emitting layers are separately fabricated for light-emitting devices with different emission wavelengths may be referred to as an SBS (Side By Side) structure. The SBS structure allows the materials and configuration to be optimized for each light-emitting device, increasing the degree of freedom in the selection of materials and configurations, and facilitating improvements in brightness and reliability.

[0449] In this specification and the like, holes or electrons may be referred to as "carriers." Specifically, a hole injection layer or an electron injection layer may be referred to as a "carrier injection layer," a hole transport layer or an electron transport layer may be referred to as a "carrier transport layer," and a hole block layer or an electron block layer may be referred to as a "carrier block layer." Note that the above-mentioned carrier injection layer, carrier transport layer, and carrier block layer may not be clearly distinguishable from each other depending on their cross-sectional shapes or characteristics. Furthermore, one layer may have two or three functions among the carrier injection layer, carrier transport layer, and carrier block layer.

[0450] In this specification and the like, a light-emitting device (also referred to as a light-emitting element) has an EL layer between a pair of electrodes. The EL layer has at least a light-emitting layer. Here, examples of layers (also referred to as functional layers) included in the EL layer include a light-emitting layer, a carrier injection layer (a hole injection layer and an electron injection layer), a carrier transport layer (a hole transport layer and an electron transport layer), and a carrier block layer (a hole block layer and an electron block layer).

[0451] As the light-emitting device, for example, an OLED (organic light-emitting diode) or a QLED (quantum-dot light-emitting diode) is preferably used. Examples of the light-emitting material contained in the light-emitting device include a fluorescent material (fluorescent material), a phosphorescent material (phosphorescent material), a material exhibiting thermally activated delayed fluorescence (thermally activated delayed fluorescence: TADF material), and an inorganic compound (such as a quantum dot material). Furthermore, an LED such as a micro LED (light-emitting diode) can also be used as the light-emitting device.

[0452] The light emitting device can emit light of infrared, red, green, blue, cyan, magenta, yellow, white, etc. The color purity can be improved by providing the light emitting device with a microcavity structure.

[0453] 43A, the light-emitting device has an EL layer 763 between a pair of electrodes (a lower electrode 761 and an upper electrode 762). The EL layer 763 can be composed of multiple layers, such as a layer 780, a light-emitting layer 771, and a layer 790.

[0454] The light-emitting layer 771 contains at least a light-emitting substance (also referred to as a light-emitting material).

[0455] When the lower electrode 761 is an anode and the upper electrode 762 is a cathode, the layer 780 includes one or more of a layer containing a substance with high hole-injecting properties (hole-injecting layer), a layer containing a substance with high hole-transporting properties (hole-transporting layer), and a layer containing a substance with high electron-blocking properties (electron-blocking layer). The layer 790 also includes one or more of a layer containing a substance with high electron-injecting properties (electron-injecting layer), a layer containing a substance with high electron-transporting properties (electron-transporting layer), and a layer containing a substance with high hole-blocking properties (hole-blocking layer). When the lower electrode 761 is a cathode and the upper electrode 762 is an anode, the layers 780 and 790 have the opposite structures to those described above.

[0456] A structure including the layer 780, the light-emitting layer 771, and the layer 790 provided between a pair of electrodes can function as a single light-emitting unit, and the structure of FIG. 43A is referred to as a single structure in this specification.

[0457] 43B shows a modified example of the EL layer 763 included in the light-emitting device shown in Fig. 43A. Specifically, the light-emitting device shown in Fig. 43B has a layer 781 on a lower electrode 761, a layer 782 on the layer 781, a light-emitting layer 771 on the layer 782, a layer 791 on the light-emitting layer 771, a layer 792 on the layer 791, and an upper electrode 762 on the layer 792.

[0458] When the lower electrode 761 is an anode and the upper electrode 762 is a cathode, for example, the layer 781 can be a hole injection layer, the layer 782 can be a hole transport layer, the layer 791 can be an electron transport layer, and the layer 792 can be an electron injection layer. When the lower electrode 761 is a cathode and the upper electrode 762 is an anode, the layer 781 can be an electron injection layer, the layer 782 can be an electron transport layer, the layer 791 can be a hole transport layer, and the layer 792 can be a hole injection layer. Such a layer structure allows carriers to be efficiently injected into the light-emitting layer 771, and the efficiency of carrier recombination in the light-emitting layer 771 can be increased.

[0459] 43C and 43D, a variation of the single structure is a configuration in which multiple light-emitting layers (light-emitting layers 771, 772, and 773) are provided between layer 780 and layer 790. While an example having three light-emitting layers is shown in FIGS. 43C and 43D, the number of light-emitting layers in a single-structure light-emitting device may be two, or may be four or more. Furthermore, a light-emitting device with a single structure may have a buffer layer between the two light-emitting layers.

[0460] 43E and 43F, a configuration in which a plurality of light-emitting units (light-emitting unit 763a and light-emitting unit 763b) are connected in series via a charge generation layer 785 (also referred to as an intermediate layer) is referred to as a tandem structure in this specification. Note that the tandem structure may also be referred to as a stack structure. By using a tandem structure, a light-emitting device capable of emitting light with high brightness can be obtained. Furthermore, compared to a single structure, the tandem structure can reduce the current required to obtain the same brightness, thereby improving reliability.

[0461] 43D and 43F are examples of display devices having a layer 764 overlapping with the light-emitting device. Fig. 43D is an example in which the layer 764 overlaps with the light-emitting device shown in Fig. 43C, and Fig. 43F is an example in which the layer 764 overlaps with the light-emitting device shown in Fig. 43E.

[0462] The layer 764 can be a color conversion layer, a color filter (coloring layer), or both.

[0463] 43C and 43D , the light-emitting layers 771, 772, and 773 may be made of light-emitting materials that emit light of the same color, or even the same light-emitting material. For example, the light-emitting layers 771, 772, and 773 may be made of a light-emitting material that emits blue light. In the subpixel that emits blue light, blue light emitted by the light-emitting device can be extracted. In the subpixel that emits red light and the subpixel that emits green light, a color conversion layer is provided as the layer 764 shown in FIG. 43D to convert blue light emitted by the light-emitting device into light with a longer wavelength, thereby allowing red or green light to be extracted.

[0464] Furthermore, light-emitting materials with different emission colors may be used for the light-emitting layers 771, 772, and 773. When the lights emitted by the light-emitting layers 771, 772, and 773 are complementary in color, white light can be obtained. For example, a light-emitting device with a single structure preferably has a light-emitting layer containing a light-emitting material that emits blue light and a light-emitting layer containing a light-emitting material that emits visible light with a wavelength longer than blue.

[0465] For example, when a light-emitting device with a single structure has three light-emitting layers, it preferably has a light-emitting layer containing a light-emitting material that emits red (R) light, a light-emitting layer containing a light-emitting material that emits green (G) light, and a light-emitting layer containing a light-emitting material that emits blue (B) light. The stacking order of the light-emitting layers may be R, G, B from the anode side, or R, B, G from the anode side, etc. In this case, a buffer layer may be provided between R and G or B.

[0466] For example, when a light-emitting device with a single structure has two light-emitting layers, it is preferable that the light-emitting layer has a light-emitting substance that emits blue (B) light and the light-emitting layer has a light-emitting substance that emits yellow light. This configuration is sometimes called BY single.

[0467] A color filter may be provided as layer 764 shown in Figure 43D. When white light passes through the color filter, light of a desired color can be obtained.

[0468] A light-emitting device that emits white light preferably contains two or more types of light-emitting materials. To obtain white light emission, light-emitting materials can be selected so that the light emitted from each of the two or more light-emitting materials has a complementary color relationship. For example, by making the emission color of the first light-emitting layer and the emission color of the second light-emitting layer complementary to each other, a light-emitting device that emits white light as a whole can be obtained. The same applies to a light-emitting device having three or more light-emitting layers.

[0469] 43E and 43F, the light-emitting layer 771 and the light-emitting layer 772 may be made of a light-emitting material that emits light of the same color, or even the same light-emitting material.

[0470] For example, in the light-emitting devices included in the subpixels emitting light of each color, light-emitting materials emitting blue light may be used for the light-emitting layers 771 and 772. In the subpixel emitting blue light, the blue light emitted by the light-emitting device can be extracted. In the subpixel emitting red light and the subpixel emitting green light, a color conversion layer is provided as the layer 764 shown in FIG. 43F to convert the blue light emitted by the light-emitting device into light of a longer wavelength, thereby allowing red or green light to be extracted.

[0471] Furthermore, when the light-emitting devices having the configurations shown in FIG. 43E or 43F are used for the subpixels emitting light of each color, different light-emitting materials may be used for each subpixel. Specifically, in a light-emitting device included in a subpixel emitting red light, light-emitting layers 771 and 772 may each contain a light-emitting material that emits red light. Similarly, in a light-emitting device included in a subpixel emitting green light, light-emitting layers 771 and 772 may each contain a light-emitting material that emits green light. In a light-emitting device included in a subpixel emitting blue light, light-emitting layers 771 and 772 may each contain a light-emitting material that emits blue light. A display device having such a configuration can be said to employ a tandem-structure light-emitting device and also have an SBS structure. Therefore, it can have the advantages of both the tandem structure and the SBS structure. This allows for a highly reliable light-emitting device to be realized.

[0472] 43E and 43F, light-emitting layers 771 and 772 may be made of light-emitting materials that emit light of different colors. When the light emitted by light-emitting layer 771 and the light emitted by light-emitting layer 772 are complementary colors, white light can be obtained. A color filter may be provided as layer 764 shown in FIG. 43F. When white light passes through the color filter, light of a desired color can be obtained.

[0473] 43E and 43F show an example in which the light-emitting unit 763a has one light-emitting layer 771 and the light-emitting unit 763b has one light-emitting layer 772, but this is not limiting. Each of the light-emitting unit 763a and the light-emitting unit 763b may have two or more light-emitting layers.

[0474] 43E and 43F show examples of light emitting devices having two light emitting units, but the present invention is not limited to this. The light emitting device may have three or more light emitting units.

[0475] Specifically, the light-emitting device configurations shown in FIGS. 44A to 44C can be given.

[0476] 44A shows a configuration having three light-emitting units. Note that a configuration having two light-emitting units may be called a two-stage tandem structure, and a configuration having three light-emitting units may be called a three-stage tandem structure.

[0477] 44A , a plurality of light-emitting units (light-emitting unit 763a, light-emitting unit 763b, and light-emitting unit 763c) are connected in series via charge generation layer 785. Light-emitting unit 763a includes layer 780a, light-emitting layer 771, and layer 790a, light-emitting unit 763b includes layer 780b, light-emitting layer 772, and layer 790b, and light-emitting unit 763c includes layer 780c, light-emitting layer 773, and layer 790c.

[0478] 44A , it is preferable that the light-emitting layers 771, 772, and 773 each contain a light-emitting material that emits light of the same color. Specifically, the light-emitting layers 771, 772, and 773 may each contain a red (R) light-emitting material (a so-called R\R\R three-stage tandem structure), the light-emitting layers 771, 772, and 773 may each contain a green (G) light-emitting material (a so-called G\G\G three-stage tandem structure), or the light-emitting layers 771, 772, and 773 may each contain a blue (B) light-emitting material (a so-called B\B\B three-stage tandem structure).

[0479] Note that the light-emitting materials that emit light of the same color are not limited to the above configuration. For example, as shown in FIG. 44B , a tandem light-emitting device may be used in which light-emitting units having a plurality of light-emitting materials are stacked. FIG. 44B shows a configuration in which a plurality of light-emitting units (light-emitting unit 763a and light-emitting unit 763b) are connected in series via a charge generation layer 785. Furthermore, light-emitting unit 763a includes layer 780a, light-emitting layer 771a, light-emitting layer 771b, light-emitting layer 771c, and layer 790a. Light-emitting unit 763b includes layer 780b, light-emitting layer 772a, light-emitting layer 772b, light-emitting layer 772c, and layer 790b.

[0480] In the structure shown in FIG. 44B , light-emitting layers 771a, 771b, and 771c are configured to emit white light (W) by selecting light-emitting materials with complementary colors. Light-emitting layers 772a, 772b, and 772c are configured to emit white light (W) by selecting light-emitting materials with complementary colors. That is, the structure shown in FIG. 44C has a W\W two-tier tandem structure. Note that the stacking order of the light-emitting materials with complementary colors for light-emitting layers 771a, 771b, and 771c is not particularly limited. The implementer can select the optimal stacking order as appropriate. Although not shown, a W\W\W three-tier tandem structure or a four-tier or more tandem structure may also be used.

[0481] In addition, when a light-emitting device having a tandem structure is used, there are a B\Y two-stage tandem structure having a light-emitting unit that emits yellow (Y) light and a light-emitting unit that emits blue (B) light, a R·G\B two-stage tandem structure having a light-emitting unit that emits red (R) and green (G) light and a light-emitting unit that emits blue (B) light, a light-emitting unit that emits yellow (Y) light and a light-emitting unit that emits blue (B) light, and a light-emitting unit that emits blue (B) light. Examples of such a tandem structure include a B\Y\B three-stage tandem structure having, in this order, a light-emitting unit that emits blue (B) light, a light-emitting unit that emits yellow-green (YG) light, and a light-emitting unit that emits blue (B) light, and a B\G\B three-stage tandem structure having, in this order, a light-emitting unit that emits blue (B) light, a light-emitting unit that emits green (G) light, and a light-emitting unit that emits blue (B) light.

[0482] Furthermore, as shown in FIG. 44C, a light-emitting unit having one light-emitting substance and a light-emitting unit having a plurality of light-emitting substances may be combined.

[0483] 44C , a plurality of light-emitting units (light-emitting unit 763a, light-emitting unit 763b, and light-emitting unit 763c) are connected in series via charge generation layer 785. Light-emitting unit 763a includes layer 780a, light-emitting layer 771, and layer 790a, light-emitting unit 763b includes layer 780b, light-emitting layer 772a, light-emitting layer 772b, light-emitting layer 772c, and layer 790b, and light-emitting unit 763c includes layer 780c, light-emitting layer 773, and layer 790c.

[0484] For example, in the configuration shown in Figure 44C, a three-stage tandem structure of B\R·G·YG\B can be applied, in which light-emitting unit 763a is a light-emitting unit that emits blue (B) light, light-emitting unit 763b is a light-emitting unit that emits red (R), green (G), and yellow-green (YG) light, and light-emitting unit 763c is a light-emitting unit that emits blue (B) light.

[0485] For example, the number of layers of the light-emitting units and the order of the colors can be, from the anode side, a two-layer structure of B and Y, a two-layer structure of B and light-emitting unit X, a three-layer structure of B, Y, and B, and the number of layers of the light-emitting layers in light-emitting unit X and the order of the colors can be, from the anode side, a two-layer structure of R and Y, a two-layer structure of R and G, a two-layer structure of G and R, a three-layer structure of G, R, and G, or a three-layer structure of R, G, and R. Furthermore, another layer can be provided between the two light-emitting layers.

[0486] 43C and 43D, the layer 780 and the layer 790 may each independently have a laminated structure made up of two or more layers, as shown in FIG. 43B.

[0487] 43E and 43F, the light-emitting unit 763a includes a layer 780a, a light-emitting layer 771, and a layer 790a, and the light-emitting unit 763b includes a layer 780b, a light-emitting layer 772, and a layer 790b.

[0488] When the lower electrode 761 is an anode and the upper electrode 762 is a cathode, the layers 780a and 780b each have one or more of a hole injection layer, a hole transport layer, and an electron blocking layer. The layers 790a and 790b each have one or more of an electron injection layer, an electron transport layer, and a hole blocking layer. When the lower electrode 761 is a cathode and the upper electrode 762 is an anode, the layers 780a and 790a have the opposite structures to those described above, and the layers 780b and 790b also have the opposite structures to those described above.

[0489] When the lower electrode 761 is an anode and the upper electrode 762 is a cathode, for example, the layer 780a may have a hole injection layer, a hole transport layer on the hole injection layer, and an electron blocking layer on the hole transport layer. The layer 790a may have an electron transport layer and a hole blocking layer between the light-emitting layer 771 and the electron transport layer. The layer 780b may have a hole transport layer and an electron blocking layer on the hole transport layer. The layer 790b may have an electron transport layer, an electron injection layer on the electron transport layer, and a hole blocking layer between the light-emitting layer 771 and the electron transport layer. When the lower electrode 761 is a cathode and the upper electrode 762 is an anode, for example, the layer 780a may have an electron injection layer, an electron transport layer on the electron injection layer, and an electron blocking layer on the electron transport layer. Layer 790a has a hole transport layer and may further have an electron blocking layer between light-emitting layer 771 and the hole transport layer. Layer 780b has an electron transport layer and may further have a hole blocking layer on the electron transport layer. Layer 790b has a hole transport layer and a hole injection layer on the hole transport layer and may further have an electron blocking layer between light-emitting layer 771 and the hole transport layer.

[0490] When a light-emitting device having a tandem structure is fabricated, two light-emitting units are stacked via a charge generation layer 785. The charge generation layer 785 has at least a charge generation region. The charge generation layer 785 has a function of injecting electrons into one of the two light-emitting units and injecting holes into the other when a voltage is applied between a pair of electrodes.

[0491] Next, materials that can be used in light-emitting devices will be described.

[0492] Of the lower electrode 761 and the upper electrode 762, a conductive film that transmits visible light is used for the electrode from which light is extracted. A conductive film that reflects visible light is preferably used for the electrode from which light is not extracted. When the display device has a light-emitting device that emits infrared light, a conductive film that transmits visible light and infrared light is preferably used for the electrode from which light is extracted, and a conductive film that reflects visible light and infrared light is preferably used for the electrode from which light is not extracted.

[0493] A conductive film that transmits visible light may also be used for the electrode on the side from which light is not extracted. In this case, the electrode is preferably disposed between the reflective layer and the EL layer 763. That is, light emitted from the EL layer 763 may be reflected by the reflective layer and extracted from the display device.

[0494] Materials for forming the pair of electrodes of a light-emitting device can include metals, alloys, electrically conductive compounds, and mixtures thereof. Specific examples of such materials include metals such as aluminum, titanium, chromium, manganese, iron, cobalt, nickel, copper, gallium, zinc, indium, tin, molybdenum, tantalum, tungsten, palladium, gold, platinum, silver, yttrium, and neodymium, as well as alloys containing these metals in combination. Examples of such materials include indium tin oxide (In-Sn oxide, also referred to as ITO), In-Si-Sn oxide (also referred to as ITSO), indium zinc oxide (In-Zn oxide), and In-W-Zn oxide. Examples of such materials include aluminum alloys, such as an aluminum-nickel-lanthanum alloy (Al-Ni-La), and an alloy of silver, palladium, and copper (Ag-Pd-Cu, also referred to as APC). Other examples of the material include elements belonging to Group 1 or 2 of the periodic table (e.g., lithium, cesium, calcium, and strontium) that are not listed above as examples, rare earth metals such as europium and ytterbium, alloys containing appropriate combinations of these, and graphene.

[0495] The light-emitting device preferably has a micro-optical resonator (microcavity) structure. Therefore, one of a pair of electrodes of the light-emitting device preferably has a transmissive and reflective electrode for visible light, and the other preferably has a reflective electrode for visible light. By having the light-emitting device have a microcavity structure, the light emitted from the light-emitting layer can be resonated between the two electrodes, thereby intensifying the light emitted from the light-emitting device.

[0496] The semi-transmitting / semi-reflective electrode can have a stacked structure of a conductive layer that can be used as a reflective electrode and a conductive layer that can be used as an electrode that is transparent to visible light (also referred to as a transparent electrode).

[0497] The light transmittance of the transparent electrode is 40% or more. For example, it is preferable to use an electrode having a visible light (light with a wavelength of 400 nm or more and less than 750 nm) transmittance of 40% or more for the transparent electrode of a light-emitting device. The visible light reflectance of the semi-transmissive / semi-reflective electrode is 10% or more and 95% or less, preferably 30% or more and 80% or less. The visible light reflectance of the reflective electrode is 40% or more and 100% or less, preferably 70% or more and 100% or less. The resistivity of these electrodes is 1×10 −２ Preferably, it is Ωcm or less.

[0498] The light-emitting device has at least a light-emitting layer. The light-emitting device may further include a layer other than the light-emitting layer, which layer contains a substance with high hole-injection properties, a substance with high hole-transport properties, a hole-blocking material, a substance with high electron-transport properties, a substance with high electron-injection properties, an electron-blocking material, or a bipolar substance (a substance with high electron-transport properties and high hole-transport properties). For example, the light-emitting device may have, in addition to the light-emitting layer, one or more layers selected from a hole-injection layer, a hole-transport layer, a hole-blocking layer, a charge-generating layer, an electron-blocking layer, an electron-transport layer, and an electron-injection layer.

[0499] The light-emitting device can be made of either a low-molecular-weight compound or a high-molecular-weight compound, and may contain an inorganic compound. The layers constituting the light-emitting device can be formed by a method such as vapor deposition (including vacuum vapor deposition), transfer, printing, inkjet printing, or coating.

[0500] The light-emitting layer contains one or more light-emitting materials. As the light-emitting material, a material that emits light of blue, purple, blue-purple, green, yellow-green, yellow, orange, red, or the like is appropriately used. Furthermore, a material that emits near-infrared light can also be used as the light-emitting material.

[0501] The light-emitting material may include a fluorescent material, a phosphorescent material, a TADF material, and a quantum dot material.

[0502] Examples of fluorescent materials include pyrene derivatives, anthracene derivatives, triphenylene derivatives, fluorene derivatives, carbazole derivatives, dibenzothiophene derivatives, dibenzofuran derivatives, dibenzoquinoxaline derivatives, quinoxaline derivatives, pyridine derivatives, pyrimidine derivatives, phenanthrene derivatives, and naphthalene derivatives.

[0503] Examples of phosphorescent materials include organometallic complexes (particularly iridium complexes) having a 4H-triazole skeleton, a 1H-triazole skeleton, an imidazole skeleton, a pyrimidine skeleton, a pyrazine skeleton, or a pyridine skeleton; organometallic complexes (particularly iridium complexes) having a phenylpyridine derivative having an electron-withdrawing group as a ligand; platinum complexes; and rare earth metal complexes.

[0504] The light-emitting layer may contain one or more organic compounds (host material, assist material, etc.) in addition to the light-emitting substance (guest material). As the one or more organic compounds, one or both of a substance with high hole transport properties (hole transport material) and a substance with high electron transport properties (electron transport material) can be used. As the hole-transporting material, a material with high hole transport properties that can be used for the hole-transporting layer, which will be described later, can be used. As the electron-transporting material, a material with high electron transport properties that can be used for the electron-transporting layer, which will be described later, can be used. Furthermore, as the one or more organic compounds, a bipolar material or a TADF material may be used.

[0505] The light-emitting layer preferably includes, for example, a phosphorescent material and a hole-transporting material and an electron-transporting material that are a combination that easily forms an exciplex. This configuration allows for efficient emission using Exciplex-Triple Energy Transfer (ExTET), which is energy transfer from the exciplex to the light-emitting material (phosphorescent material). By selecting a combination that forms an exciplex that emits light that overlaps with the wavelength of the lowest-energy absorption band of the light-emitting material, energy transfer becomes smooth, allowing for efficient emission. This configuration simultaneously enables high efficiency, low-voltage operation, and long life of the light-emitting device.

[0506] The hole injection layer is a layer that injects holes from the anode into the hole transport layer and contains a material with high hole injection properties, such as an aromatic amine compound and a composite material containing a hole transport material and an acceptor material (electron acceptor material).

[0507] As the hole transporting material, a material having high hole transporting properties that can be used for the hole transport layer, which will be described later, can be used.

[0508] Examples of the acceptor material include oxides of metals belonging to Groups 4 to 8 of the periodic table. Specific examples include molybdenum oxide, vanadium oxide, niobium oxide, tantalum oxide, chromium oxide, tungsten oxide, manganese oxide, and rhenium oxide. Among these, molybdenum oxide is particularly preferred because it is stable in the atmosphere, has low hygroscopicity, and is easy to handle. Alternatively, organic acceptor materials containing fluorine can be used. Other organic acceptor materials that can be used include quinodimethane derivatives, chloranil derivatives, and hexaazatriphenylene derivatives.

[0509] For example, as a material with high hole injection properties, a material containing a hole transporting material and an oxide of a metal belonging to Groups 4 to 8 of the periodic table (typically, molybdenum oxide) may be used.

[0510] The hole transport layer is a layer that transports holes injected from the anode by the hole injection layer to the light emitting layer. The hole transport layer is a layer that contains a hole transport material. The hole transport material is a material having a concentration of 1×10 −６ cm ２ A substance having a hole mobility of 1 / Vs or more is preferred. Note that other substances can also be used as long as they have a higher hole transporting property than electron transporting property. As the hole transporting material, a material having a high hole transporting property, such as a π-electron-rich heteroaromatic compound (e.g., a carbazole derivative, a thiophene derivative, a furan derivative, etc.) or an aromatic amine (a compound having an aromatic amine skeleton), is preferred.

[0511] The electron blocking layer is provided in contact with the light-emitting layer. The electron blocking layer is a layer containing a material that has hole transport properties and can block electrons. The electron blocking layer can be made of a material that has electron blocking properties among the hole transport materials described above.

[0512] The electron blocking layer has hole transport properties and can therefore also be called a hole transport layer. Furthermore, a layer of the hole transport layer that has electron blocking properties can also be called an electron blocking layer.

[0513] The electron transport layer is a layer that transports electrons injected from the cathode by the electron injection layer to the light emitting layer. The electron transport layer is a layer that contains an electron transporting material. The electron transporting material is a material having a molecular weight of 1×10 −６ cm ２ A substance having an electron mobility of 1 / Vs or more is preferred. Note that other substances can also be used as long as they have a higher electron transporting property than holes. Examples of electron-transporting materials that can be used include metal complexes having a quinoline skeleton, metal complexes having a benzoquinoline skeleton, metal complexes having an oxazole skeleton, and metal complexes having a thiazole skeleton, as well as oxadiazole derivatives, triazole derivatives, imidazole derivatives, oxazole derivatives, thiazole derivatives, phenanthroline derivatives, quinoline derivatives having a quinoline ligand, benzoquinoline derivatives, quinoxaline derivatives, dibenzoquinoxaline derivatives, pyridine derivatives, bipyridine derivatives, pyrimidine derivatives, and other π-electron-deficient heteroaromatic compounds including nitrogen-containing heteroaromatic compounds.

[0514] The hole-blocking layer is provided in contact with the light-emitting layer. The hole-blocking layer is a layer containing a material that has electron transport properties and can block holes. The hole-blocking layer can be made of a material that has hole-blocking properties and is selected from the above electron-transporting materials.

[0515] The hole blocking layer has electron transport properties and can therefore also be called an electron transport layer. Furthermore, a layer of the electron transport layer that has hole blocking properties can also be called a hole blocking layer.

[0516] The electron injection layer is a layer that injects electrons from the cathode to the electron transport layer and contains a material with high electron injection properties. Examples of the material with high electron injection properties include alkali metals, alkaline earth metals, and compounds thereof. Examples of the material with high electron injection properties include a composite material containing an electron transport material and a donor material (electron donor material).

[0517] Furthermore, it is preferable that the LUMO level of the material having high electron injection properties has a small difference (specifically, 0.5 eV or less) from the work function value of the material used for the cathode.

[0518] The electron injection layer may contain, for example, lithium, cesium, ytterbium, lithium fluoride (LiF), cesium fluoride (CsF), calcium fluoride (CaF ｘ , x is an arbitrary number), 8-(quinolinolato)lithium (abbreviation: Liq), 2-(2-pyridyl)phenolatolithium (abbreviation: LiPP), 2-(2-pyridyl)-3-pyridinolatolithium (abbreviation: LiPPy), 4-phenyl-2-(2-pyridyl)phenolatolithium (abbreviation: LiPPP), lithium oxide (LiO ｘ ), alkali metals such as cesium carbonate, alkaline earth metals, or compounds thereof can be used. The electron injection layer may have a stacked structure of two or more layers. For example, the stacked structure may have a structure in which lithium fluoride is used as the first layer and ytterbium is provided as the second layer.

[0519] The electron injection layer may contain an electron transporting material. For example, a compound having an unshared electron pair and an electron-deficient heteroaromatic ring can be used as the electron transporting material. Specifically, a compound having at least one of a pyridine ring, a diazine ring (pyrimidine ring, pyrazine ring, pyridazine ring), and a triazine ring can be used.

[0520] The lowest unoccupied molecular orbital (LUMO) level of an organic compound having an unshared electron pair is preferably −3.6 eV or more and −2.3 eV or less. Generally, the highest occupied molecular orbital (HOMO) level and the LUMO level of an organic compound can be estimated by CV (cyclic voltammetry), photoelectron spectroscopy, optical absorption spectroscopy, inverse photoelectron spectroscopy, or the like.

[0521] For example, 4,7-diphenyl-1,10-phenanthroline (abbreviation: BPhen), 2,9-di(naphthalen-2-yl)-4,7-diphenyl-1,10-phenanthroline (abbreviation: NBPhen), diquinoxalino[2,3-a:2',3'-c]phenazine (abbreviation: HATNA), 2,4,6-tris[3'-(pyridin-3-yl)biphenyl-3-yl]-1,3,5-triazine (abbreviation: TmPPPyTz), etc. can be used as the organic compound having an unshared electron pair. Note that NBPhen has a higher glass transition point (Tg) and is superior in heat resistance compared to BPhen.

[0522] As described above, the charge generation layer has at least a charge generation region. The charge generation region preferably contains an acceptor material, for example, a hole transport material and an acceptor material applicable to the hole injection layer.

[0523] The charge generation layer preferably includes a layer containing a material with high electron injection properties. This layer may also be called an electron injection buffer layer. The electron injection buffer layer is preferably provided between the charge generation region and the electron transport layer. By providing the electron injection buffer layer, the injection barrier between the charge generation region and the electron transport layer can be alleviated, so that electrons generated in the charge generation region can be easily injected into the electron transport layer.

[0524] The electron injection buffer layer preferably contains an alkali metal or an alkaline earth metal, and may contain, for example, an alkali metal compound or an alkaline earth metal compound. Specifically, the electron injection buffer layer preferably contains an inorganic compound containing an alkali metal and oxygen, or an inorganic compound containing an alkaline earth metal and oxygen, and may contain an inorganic compound containing lithium and oxygen (lithium oxide (Li ２ In addition, the electron injection buffer layer can be suitably made of the materials applicable to the electron injection layer described above.

[0525] The charge generation layer preferably has a layer containing a material with high electron transport properties. This layer can also be called an electron relay layer. The electron relay layer is preferably provided between the charge generation region and the electron injection buffer layer. When the charge generation layer does not have an electron injection buffer layer, the electron relay layer is preferably provided between the charge generation region and the electron transport layer. The electron relay layer has the function of preventing interaction between the charge generation region and the electron injection buffer layer (or the electron transport layer) and smoothly transferring electrons.

[0526] For the electron relay layer, it is preferable to use a phthalocyanine-based material such as copper (II) phthalocyanine (abbreviated as CuPc) or a metal complex having a metal-oxygen bond and an aromatic ligand.

[0527] It should be noted that the charge generation region, electron injection buffer layer, and electron relay layer may not be clearly distinguishable from one another depending on their cross-sectional shapes or characteristics.

[0528] The charge generation layer may contain a donor material instead of an acceptor material. For example, the charge generation layer may contain a layer containing an electron transport material and a donor material that can be used for the electron injection layer.

[0529] When light-emitting units are stacked, an increase in driving voltage can be suppressed by providing a charge generating layer between two light-emitting units.

[0530] At least a part of the configuration examples exemplified in this embodiment and the corresponding drawings can be combined as appropriate with other configuration examples or drawings.

[0531] This embodiment mode can be implemented by appropriately combining at least a part thereof with other embodiment modes described in this specification.

[0532] 500A: Electronic device, 500B: Electronic device, 500C: Electronic device, 500: Electronic device, 501: Housing, 502: First part, 503: Second part, 504: Optical member, 505: Wearing device, 506: Part, 507: Battery, 511: Display device, 512: Lens, 520: Cable, 521: Display device, 522: Reflector, 523: Reflecting surface, 524: Optical member, 525: Optical member, 526: Lens, 530L: Left hand, 530R: Right hand, 531: Camera, 532: Camera, 533: Camera, 540L: Left hand, 540R: Right hand, 540: User, 550A: Terminal device, 550B: terminal device, 550C: terminal device, 550: terminal device, 551: control unit, 552: memory unit, 553: opening / closing sensor, 554: communication unit, 555: brain wave sensor, 556: audio output unit, 557: microphone, 558: communication unit, 560: field of view, 561: image information, 562: image information, 563: image, 564: object, 565: menu icon, 570: housing, 571: control unit, 572: memory unit, 573: communication unit, 574: communication unit, 575: display device, 576: camera, 577: sensor, 578: band, 579: earphone, 580: controller

Claims

1. An electronic device having a first display device, a second display device, a lens, a screen, a mounting fixture, a housing, a pair of first cameras, and a storage unit, the wearing device has a function of fixing the housing to a head, the housing has a function of transforming into a first state in which it is closed so as to block the view and a second state in which it is open so that the view ahead can be seen, the first camera of the pair has a function of capturing an image of the user's eye and generating image information of the eye; the electronic device has a function of comparing first iris information acquired from the image information with second iris information stored in the storage unit, The electronic device has, when the matching function determines that the first iris information and the second iris information belong to the same person, a function of providing a first image displayed on the first display device via the lens and the screen in the first mode, and a function of providing a second image projected from the second display device onto the screen in the second mode.

2. An electronic device having a first display device, a second display device, a lens, a screen, a mounting fixture, a housing, a pair of first cameras, a storage unit, and a communication unit, the wearing device has a function of fixing the housing to a head, the housing has a function of transforming into a first state in which it is closed so as to block the view and a second state in which it is open so that the view ahead can be seen, the first camera of the pair has a function of capturing an image of the user's eye and generating image information of the eye; the electronic device has a function of comparing first iris information acquired from the image information with second iris information stored in the storage unit, the electronic device has a function of providing a first image displayed on the first display device via the lens and the screen when it is determined by the matching function that the first iris information and the second iris information are of the same person in the first mode, and a function of providing a second image projected from the second display device onto the screen in the second mode, The communication unit has a function of communicating with a terminal device via wire or wirelessly, the first image data to be supplied to the first display device and the second image data to be supplied to the second display device are supplied from the terminal device, respectively; electronic equipment.

3. In claim 1 or claim 2, the housing has a first portion that opens and closes and a second portion that is fixed to the screen; the first display device and the lens are provided in the first portion; the second display device is provided in the second portion; electronic equipment.

4. In claim 1 or claim 2, The first display device has a display area larger than that of the second display device. electronic equipment.

5. In claim 1 or claim 2, The second display device has a higher definition than the first display device. electronic equipment.

6. In claim 1 or claim 2, The first display device and the second display device each have a resolution of 3000 ppi or more and 10000 ppi or less. electronic equipment.

7. In claim 1 or claim 2, The first display device has a display area with a diagonal size of 1.3 inches to 1.7 inches. electronic equipment.

8. In claim 1 or claim 2, a pair of second cameras; the second camera has a function of capturing an image in front of the housing, The device has a function of acquiring gesture information using the second camera. electronic equipment.

9. In claim 8, a pair of third cameras; the third camera has a function of capturing an image in front of the housing, The third camera has a narrower angle of view than the second camera. electronic equipment.