Pressure sensor
JPWO2024075462A5Pending Publication Date: 2025-06-18
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Patent Information
- Application Number
- JP2024555674
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Filing Date
- 2025-02-25
- Publication Date
- 2025-06-18
Abstract
This pressure sensor comprises: a package exterior body having an upper wall; and a MEMS chip. The MEMS chip has a membrane and is disposed in an internal space of the package exterior body. A plurality of holes passing through the upper wall in the thickness direction of the upper wall are formed in the upper wall.
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