Antenna module and communication device equipped therewith

Abstract

This antenna module (100) comprises: a dielectric substrate (130); a ground electrode (GND) that is disposed in the dielectric substrate; a flat plate-shaped first radiation element (121) that is disposed in the dielectric substrate such as to be opposed to the ground electrode; a flat plate-shaped a second radiation element (122) that is disposed between the first radiation element and the ground electrode and that is greater in size than the first radiation element and has openings (OPG2s) formed in a central portion; a first feeding wire (141A) that penetrates the second radiation element and is electrically coupled to the first radiation element at a position offset from the center of the first radiation element in a first direction; a second feeding wire (142B) that is electrically coupled to the second radiation element at a position offset from the center of the second radiation element in a second direction different from the first direction; and a via electrode (VG) that is connected to the ground electrode, penetrates the second radiation element through an opening thereof, and is electrically coupled to a central portion of the first radiation element.

Description

Antenna module and communication device equipped with same

[0001] The present disclosure relates to an antenna module and a communication device equipped with the same, and more particularly to a technique for improving isolation in an antenna module.

[0002] U.S. Patent Application Publication No. 2021 / 0367358 (Patent Document 1) discloses a dual-band, dual-polarized patch antenna capable of radiating two different radio waves and in two different polarization directions, in which a ground pin is connected to the center of two stacked radiating elements to improve isolation between the feed pins for each radiating element.

[0003] U.S. Patent Application Publication No. 2021 / 0367358

[0004] Antenna modules such as those described above are sometimes used in mobile communication devices, such as mobile phones or smartphones. These mobile communication devices communicate using radio waves in multiple frequency bands to improve communication quality and speed. However, there remains a strong need for improved antenna characteristics, and further improvements in isolation between different frequency bands are required.

[0005] The present disclosure has been made to solve such problems, and its purpose is to improve isolation between power feed ports in a dual-band type antenna module.

[0006] An antenna module according to a first aspect of the present disclosure includes a dielectric substrate, a ground electrode disposed on the dielectric substrate, first and second radiating elements each having a flat plate shape, a first feed wiring, a second feed wiring, and a via electrode connected to the ground electrode. The first radiating element is disposed on the dielectric substrate facing the ground electrode. The second radiating element is disposed between the first radiating element and the ground electrode. The first feed wiring penetrates the second radiating element and transmits a high-frequency signal to the first radiating element. The second feed wiring transmits a high-frequency signal to the second radiating element. The first feed wiring is electrically coupled to the first radiating element at a position offset in a first direction from the center of the first radiating element. The second feed wiring is electrically coupled to the second radiating element at a position offset in a second direction different from the first direction from the center of the second radiating element. The size of the second radiating element is larger than the size of the first radiating element. An opening is formed in the center of the second radiating element. The via electrode passes through the opening of the second radiating element and is electrically coupled to the central portion of the first radiating element.

[0007] An antenna module according to a second aspect of the present disclosure includes a dielectric substrate, a ground electrode disposed on the dielectric substrate, flat first and second radiating elements, first and second feeder wirings, and a via electrode connected to the ground electrode. The first radiating element is disposed on the dielectric substrate facing the ground electrode. The second radiating element is disposed between the first radiating element and the ground electrode. The first feeder wiring penetrates the second radiating element and transmits a high-frequency signal to the first radiating element. The second feeder wiring transmits a high-frequency signal to the second radiating element. The first feeder wiring is electrically coupled to the first radiating element at a position offset in a first direction from the center of the first radiating element. The second feeder wiring is electrically coupled to the second radiating element at a position offset in a second direction different from the first direction from the center of the second radiating element. The size of the second radiating element is larger than the size of the first radiating element. An opening is formed in the center of the second radiating element. The via electrode penetrates the opening of the second radiating element.

[0008] An antenna module according to a third aspect of the present disclosure includes a dielectric substrate, a ground electrode disposed on the dielectric substrate, flat first and second radiating elements, first and second feeder wirings, and a via electrode having a first end and a second end. The first radiating element is disposed on the dielectric substrate facing the ground electrode. The second radiating element is disposed between the first radiating element and the ground electrode. The first feeder wiring penetrates the second radiating element and transmits a high-frequency signal to the first radiating element. The second feeder wiring transmits a high-frequency signal to the second radiating element. The first feeder wiring is electrically coupled to the first radiating element at a position offset in a first direction from the center of the first radiating element. The second feeder wiring is electrically coupled to the second radiating element at a position offset in a second direction different from the first direction from the center of the second radiating element. The size of the second radiating element is larger than the size of the first radiating element. An opening is formed in the center of the second radiating element. The first end of the via electrode is connected to the ground electrode. The second end of the via electrode is located at the position of the second radiating element or between the second radiating element and the first radiating element in the normal direction of the dielectric substrate, and overlaps with the opening when viewed in a plan view in the normal direction of the dielectric substrate.

[0009] The antenna module according to the present disclosure includes two stacked radiating elements. A high-frequency signal to the radiating element (first radiating element) on the higher frequency side is transmitted to the first radiating element through the radiating element (second radiating element) on the lower frequency side. A via electrode connected to a ground electrode is electrically coupled to the center of the first radiating element through an opening formed in the center of the second radiating element. This configuration changes the current distribution in the second radiating element. Specifically, when a high-frequency signal is supplied to the first radiating element, current concentrates around the opening in the center of the second radiating element. This reduces the current flowing from the power supply wiring to the first radiating element to the power supply point of the second radiating element compared to when the via electrode is not present. This improves isolation between power supply ports.

[0010] 1 is a block diagram of a communication device to which an antenna module according to a first embodiment is applied. FIG. 3 is a perspective view of the antenna module of FIG. 1. FIG. 4 is a plan view of the antenna module of FIG. 1. FIG. 5 is a side perspective view of the antenna module of FIG. 3 as seen from the direction of arrow AR1. FIG. 6 is a diagram for explaining the current distribution in the radiating element on the low frequency side when power is fed to the radiating element on the high frequency side in the antenna modules of the first embodiment and comparative example 1. FIG. 7 is a diagram for explaining the isolation characteristics between the power feed ports in the antenna modules of the first embodiment and comparative example 1. FIG. 8 is a side perspective view of the antenna module of modified example 1. FIG. 9 is a side perspective view of the antenna modules of modified examples 2 and 3. FIG. 10 is a diagram for explaining the isolation characteristics in the antenna module of modified example 2. FIG. 11 is a side perspective view of the antenna module of modified example 4. FIG. 12 is a diagram for explaining the isolation characteristics in the antenna module of modified example 4. FIG. 13 is a side perspective view of the antenna module of embodiment 2. FIG. 14 is a side perspective view of the antenna module of modified example 5.

[0011] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. In the drawings, the same or corresponding parts are designated by the same reference numerals, and description thereof will not be repeated.

[0012] [First Embodiment] (Basic Configuration of Communication Device) Fig. 1 is a block diagram of a communication device 10 to which an antenna module 100 according to this embodiment is applied. The communication device 10 is, for example, a mobile terminal such as a mobile phone, smartphone, or tablet, or a personal computer with a communication function. An example of the frequency band of radio waves used in the antenna module 100 according to this embodiment is millimeter-wave radio waves with center frequencies of 28 GHz, 39 GHz, and 60 GHz, for example, but radio waves in other frequency bands are also applicable.

[0013] 1 , a communication device 10 includes an antenna module 100 and a BBIC 200 that constitutes a baseband signal processing circuit. The antenna module 100 includes an RFIC 110, which is an example of a power supply device, and an antenna device 120. The communication device 10 upconverts an intermediate frequency signal transmitted from the BBIC 200 to the antenna module 100 into a high frequency signal and radiates the high frequency signal from the antenna device 120, and also downconverts a high frequency signal received by the antenna device 120 into an intermediate frequency signal and processes the signal in the BBIC 200.

[0014] The antenna device 120 includes a dielectric substrate 130 and a plurality of antenna elements 125 arranged on the dielectric substrate 130. While Fig. 1 illustrates an example of an array configuration in which four antenna elements 125 are arranged in a line on the dielectric substrate 130, the number of antenna elements 125 is not limited to this. A single antenna element 125 may be arranged on the dielectric substrate 130, or a configuration in which a plurality of antenna elements 125 other than four are arranged may also be used. Furthermore, an array configuration in which the antenna elements 125 are arranged two-dimensionally may also be used.

[0015] Antenna element 125 includes flat-plate radiating elements 121 and 122 of different sizes. Radiating elements 121 and 122 are flat-plate patch antennas having a circular, elliptical, or polygonal shape. In the first embodiment, each radiating element is described as a microstrip antenna having a substantially square shape. As will be described later with reference to Figures 2 to 4, radiating elements 121 and 122 are stacked on dielectric substrate 130 and spaced apart from each other in the normal direction of dielectric substrate 130.

[0016] The size of radiating element 121 is smaller than the size of radiating element 122. Therefore, the frequency band of the radio waves radiated from radiating element 121 is higher than the frequency band of the radio waves radiated from radiating element 122. In other words, antenna module 100 is a so-called dual-band type antenna module that is capable of radiating radio waves in two different frequency bands. In the example of embodiment 1, the frequency band of the radio waves radiated from radiating element 121 is the 39 GHz band (37.0 GHz to 43.5 GHz), and the frequency band of the radio waves radiated from radiating element 122 is the 28 GHz band (24.25 GHz to 29.5 GHz).

[0017] Each of the radiating elements 121 and 122 has two feed points offset in different directions from the center of the element, and a high-frequency signal is supplied to each feed point from the RFIC 110. In other words, the antenna module 100 is a so-called dual-polarized antenna module capable of radiating radio waves in two different polarization directions. In the example of the first embodiment, each of the radiating elements 121 and 122 is configured to be able to radiate radio waves in two polarization directions (first polarization direction and second polarization direction) that are orthogonal to each other.

[0018] The RFIC 110 includes four feed circuits 110A to 110D. The feed circuit 110A is a circuit for supplying a high-frequency signal for the first polarization direction of the radiating element 121. The feed circuit 110B is a circuit for supplying a high-frequency signal for the second polarization direction of the radiating element 121. The feed circuit 110C is a circuit for supplying a high-frequency signal for the first polarization direction of the radiating element 122. The feed circuit 110D is a circuit for supplying a high-frequency signal for the second polarization direction of the radiating element 122. Note that the internal configurations of the feed circuits 110A to 110D are the same, and therefore, for ease of explanation, FIG. 1 shows the detailed configuration of only the feed circuit 110A, and omits the configurations of the feed circuits 110B to 110D. The function of the feed circuit 110A will be described below as a representative.

[0019] The power supply circuit 110A includes switches 111A to 111D, 113A to 113D, and 117, power amplifiers 112AT to 112DT, low-noise amplifiers 112AR to 112DR, attenuators 114A to 114D, phase shifters 115A to 115D, a signal combiner / divider 116, a mixer 118, and an amplifier circuit 119.

[0020] When transmitting a high frequency signal, the switches 111A to 111D and 113A to 113D are switched to the side of the power amplifiers 112AT to 112DT, and the switch 117 is connected to the transmitting amplifier of the amplifier circuit 119. When receiving a high frequency signal, the switches 111A to 111D and 113A to 113D are switched to the side of the low noise amplifiers 112AR to 112DR, and the switch 117 is connected to the receiving amplifier of the amplifier circuit 119.

[0021] The intermediate frequency signal transmitted from the BBIC 200 is amplified by the amplifier circuit 119 and up-converted by the mixer 118. The up-converted high frequency signal, that is the transmission signal, is split into four by the signal combiner / divider 116, passes through the corresponding signal paths, and is fed to each different radiating element 121. By individually adjusting the phase shift of the phase shifters 115A to 115D arranged on each signal path, it is possible to adjust the directivity of the radio waves output from the radiating element 121. Furthermore, the attenuators 114A to 114D adjust the strength of the transmission signal.

[0022] The received signals, which are high-frequency signals received by each radiating element 121, are transmitted to the feed circuit 110A of the RFIC 110, and are combined in the signal combiner / divider 116 via four different signal paths. The combined received signals are down-converted to intermediate frequency signals in the mixer 118, and further amplified in the amplifier circuit 119 before being transmitted to the BBIC 200.

[0023] The RFIC 110 is formed, for example, as a single-chip integrated circuit component including the above circuit configuration. Alternatively, it may be formed as an individual integrated circuit component for each power feed circuit. Furthermore, for the devices corresponding to each radiating element (switch, power amplifier, low-noise amplifier, attenuator, phase shifter), each corresponding radiating element may be formed as a single-chip integrated circuit component.

[0024] (Structure of Antenna Module) Next, the configuration of the antenna module 100 according to the first embodiment will be described in detail with reference to Figures 2 to 4. Figure 2 is a perspective view of the antenna module 100 according to the first embodiment. Figure 3 is a plan view of the antenna module 100 as viewed from the normal direction of the dielectric substrate 130. Figure 4 is a side perspective view of the antenna module 100 as viewed from the direction of arrow AR1 in Figure 3.

[0025] 2 and 3, the dielectric of the dielectric substrate 130 is shown removed to make the internal configuration easier to understand. As shown in Fig. 3, the normal direction of the dielectric substrate 130 and the radiating elements 121 and 122 is defined as the Z-axis direction, the direction along one of the two adjacent sides of the radiating elements 121 and 122 is defined as the X-axis, and the direction along the other side is defined as the Y-axis. In each figure, the positive direction of the Z-axis may be referred to as the upper side, and the negative direction as the lower side.

[0026] 2 to 4, the antenna module 100 includes, in addition to the RFIC 110, the antenna element 125, and the dielectric substrate 130, power supply lines 141A, 141B, 142A, and 142B, a ground electrode GND, and a via electrode VG.

[0027] The dielectric substrate 130 may be, for example, a low temperature co-fired ceramics (LTCC) multilayer substrate, a multilayer resin substrate formed by laminating multiple resin layers made of resins such as epoxy or polyimide, a multilayer resin substrate formed by laminating multiple resin layers made of liquid crystal polymer (LCP) having a lower dielectric constant, a multilayer resin substrate formed by laminating multiple resin layers made of fluorine-based resin, a multilayer resin substrate formed by laminating multiple resin layers made of PET (Polyethylene Terephthalate), or a ceramic multilayer substrate other than LTCC. Note that the dielectric substrate 130 does not necessarily have a multilayer structure and may be a single-layer substrate.

[0028] The radiating element 121 is disposed near the upper surface 131 of the dielectric substrate 130. The radiating element 121 may be disposed so as to be exposed on the surface of the dielectric substrate 130, or may be disposed in an internal layer of the dielectric substrate 130 as in the example of FIG. 4. A ground electrode GND is disposed over the entire surface of the dielectric substrate 130 near the lower surface 132 of the dielectric substrate 130. The radiating element 121 is disposed facing the ground electrode. The RFIC 110 is mounted on the lower surface 132 of the dielectric substrate 130 by solder bumps 160. The RFIC 110 may be mounted on the dielectric substrate 130 using a connector disposed on the RFIC 110 instead of solder bumps. Alternatively, the RFIC 110 may be disposed on a wiring board of a device in which the antenna module 100 is mounted, and a high-frequency signal may be supplied from there to the radiating element via a connector.

[0029] Radiating element 122 is disposed between radiating element 121 and ground electrode GND on dielectric substrate 130. Radiating element 122 is disposed opposite dielectric substrate 130 and radiating element 121. As shown in Fig. 3, when dielectric substrate 130 is viewed in a plan view from the normal direction, radiating elements 121 and 122 are disposed so that their centers coincide and overlap each other.

[0030] A high-frequency signal is supplied to the radiating element 121 from the RFIC 110 via feed lines 141A and 141B. The feed line 141A extends from the RFIC 110 to below the radiating element 121 in the dielectric layer closer to the lower surface 132 than the ground electrode GND, and then passes through the ground electrode GND and an opening OP2A of the radiating element 122 to be connected to a feed point SP1A of the radiating element 121. Similarly, the feed line 141B extends from the RFIC 110 to below the radiating element 121 in the dielectric layer closer to the lower surface 132 than the ground electrode GND, and then passes through the ground electrode GND and an opening OP2B of the radiating element 122 to be connected to a feed point SP1B of the radiating element 121.

[0031] As shown in Fig. 3, feed point SP1A is offset in the positive direction of the Y axis from the center of radiating element 121. When a high-frequency signal is supplied to feed point SP1A, radio waves polarized in the Y axis direction are radiated from radiating element 121 in the Z axis direction. Furthermore, feed point SP1B is offset in the negative direction of the X axis from the center of radiating element 121. When a high-frequency signal is supplied to feed point SP1B, radio waves polarized in the X axis direction are radiated from radiating element 121 in the Z axis direction.

[0032] A high-frequency signal is supplied to the radiating element 122 from the RFIC 110 via feed lines 142A and 142B. The feed line 142A extends from the RFIC 110 to below the radiating element 122 in the dielectric layer closer to the lower surface 132 than the ground electrode GND, then penetrates the ground electrode GND and is connected to a feed point SP2A of the radiating element 122. Similarly, the feed line 142B extends from the RFIC 110 to below the radiating element 122 in the dielectric layer closer to the lower surface 132 than the ground electrode GND, then penetrates the ground electrode GND and is connected to a feed point SP2B of the radiating element 122.

[0033] 3, feed point SP2A is offset in the negative direction of the Y axis from the center of radiating element 122. When a high-frequency signal is supplied to feed point SP2A, radio waves polarized in the Y axis direction are radiated from radiating element 122 in the Z axis direction. Furthermore, feed point SP2B is offset in the positive direction of the X axis from the center of radiating element 122. When a high-frequency signal is supplied to feed point SP2B, radio waves polarized in the X axis direction are radiated from radiating element 122 in the Z axis direction.

[0034] The via electrode VG connects the ground electrode GND and the radiating element 121. In other words, a lower end (first end) of the via electrode VG is connected to the ground electrode GND, and an upper end (second end) of the via electrode VG is connected to the radiating element 121. The via electrode VG passes through an opening OPG2 formed in the center of the radiating element 122 from the ground electrode GND and is connected to the center of the radiating element 121. Note that the via electrode VG does not contact the radiating element 122 at the opening OPG2.

[0035] (Antenna Characteristics) In the stacked antenna module described above, when a high-frequency signal is supplied to radiating element 121 on the high-frequency side by power supply wirings 141A, 141B, a current also flows in response to this in radiating element 122, which functions as a ground electrode for radiating element 121. At this time, if a current flows in radiating element 122 through a path connecting openings OP2A, OP2B, where power supply wirings 141A, 141B pass through radiating element 122, and feed points SP2A, SP2B of radiating element 122, coupling occurs between the power supply path on the high-frequency side and the power supply path on the low-frequency side, which may result in a decrease in isolation characteristics.

[0036] Here, in the antenna module 100 of the first embodiment, as described above, the via electrode VG connected to the center of the radiating element 121 passes through the opening OPG2 formed in the center of the radiating element 122 and is connected to the ground electrode GND. When the via electrode VG at ground potential is close to the opening OPG2 in a non-contact state like this, a capacitor is formed between the end of the opening OPG2 and the via electrode VG, and current concentrates at the end of the opening OPG2. In particular, in the case of high-frequency signals, current tends to concentrate at the end of a conductor due to the edge effect, so the arrangement of the via electrode VG as described above makes it easier for current to concentrate at the end of the opening OPG2.

[0037] This changes the current distribution on the radiating element 122, increasing the current density at the openings OP2A and OP2B through which the feed wirings 141A and 141B pass and at the ends of the opening OPG2 through which the via electrode VG pass, as well as between these openings, and relatively decreasing the current density in other portions. As a result, compared to the case where the via electrode VG is not present, the current flowing in the path connecting the openings OP2A and OP2B through which the feed wirings 141A and 141B pass through the radiating element 122 and the feed points SP2A and SP2B of the radiating element 122 decreases, thereby improving the isolation between feed ports of different frequency bands.

[0038] 5 is a diagram showing an example of a simulation of current distribution in the radiating element 122 on the low frequency side when power is supplied to the radiating element 121 on the high frequency side in the antenna module 100 of the first embodiment and the antenna module 100X of the first comparative example that does not have the via electrode VG. In Fig. 5, an arrow on the surface of the radiating element 122 indicates the direction of the current, and the size of the arrow indicates the strength of the current.

[0039] As shown in FIG. 5, in Comparative Example 1, the current intensity around the openings OP2A and OP2B through which the power supply wirings 141A and 141B pass is high, and the current between the openings OP2A and OP2B is also somewhat strong.

[0040] On the other hand, in the configuration of embodiment 1, in addition to the openings OP2A and OP2B, the current intensity is increased at the end of the opening OPG2 through which the via electrode VG passes. That is, the current is concentrated in the vicinity of and around the openings OP2A and OP2B and opening OPG2 of the radiating element 122. Furthermore, accompanying this, the direction of the current flowing near the feed points SP2A and SP2B of the radiating element 122 changes, and the current intensity is slightly reduced. That is, the isolation between the feed lines 141A and 141B and the feed lines 142A and 142B is improved.

[0041] FIG. 6 is a diagram illustrating the simulation results of the isolation characteristics between the power feed ports of the antenna module 100 of the first embodiment and the antenna module 100X of the first comparative example. In each graph in FIG. 6 , the solid lines (LN10, LN12, LN14, and LN16) represent the results for the antenna module 100 of the first embodiment, and the dashed lines (LN11, LN13, LN15, and LN17) represent the results for the antenna module 100X of the first comparative example. In FIG. 6 , the power feed ports corresponding to the power feed lines 141A and 141B are represented by 39V and 39H, respectively, and the power feed ports corresponding to the power feed lines 142A and 142B are represented by 28V and 28H, respectively. The high-frequency band is represented by BW1, and the low-frequency band is represented by BW2.

[0042] 6, graph (A) shows the isolation characteristics between the low-frequency power supply wiring 142A and the power supply wiring 142B. Graph (A) shows that the antenna module 100 of the first embodiment has improved isolation characteristics compared to the antenna module 100X of the first comparative example in the low-frequency band BW2.

[0043] Graph (B) shows the isolation characteristics between the low-frequency power supply wiring 142A and the high-frequency power supply wiring 141B. Graph (C) shows the isolation characteristics between the low-frequency power supply wiring 142B and the high-frequency power supply wiring 141A. In both graphs (B) and (C), although the improvement effect in frequency band BW1 is somewhat small, the antenna module 100 has improved isolation characteristics compared to the antenna module 100X in both frequency bands BW1 and BW2.

[0044] Graph (D) shows the isolation characteristics between the power supply wiring 141A and the power supply wiring 141B on the high frequency side. In graph (D), too, the isolation characteristics of the antenna module 100 are improved compared to the antenna module 100X in the frequency band BW1 on the high frequency side.

[0045] As described above, in a stacked dual-band and dual-polarized antenna module, by providing a via electrode that penetrates the opening formed in the center of the radiating element on the low-frequency side and electrically connects the radiating element on the high-frequency side to the ground electrode, it is possible to improve the isolation characteristics between different polarizations in the same frequency band and different frequency bands.

[0046] In the antenna module 100, both radiating elements 121 and 122 are dual-polarized types, but they do not necessarily have to be dual-polarized types. As long as the polarization direction of the radio waves radiated from radiating element 121 and the polarization direction of the radio waves radiated from radiating element 122 are different, the isolation characteristics can be improved even if the antenna modules are each single-polarized types.

[0047] The "radiating elements 121, 122" in the first embodiment correspond to the "first radiating element" and the "second radiating element" in the present disclosure, respectively. The "power supply wirings 141A, 141B" in the first embodiment correspond to the "first power supply wiring" and the "third power supply wiring" in the present disclosure, respectively. The "power supply wirings 142A, 142B" in the first embodiment correspond to the "second power supply wiring" and the "fourth power supply wiring" in the present disclosure, respectively. In the first embodiment, the "positive direction of the Y-axis" and the "negative direction of the Y-axis" correspond to the "first direction" and the "fourth direction" in the present disclosure, respectively, and the "negative direction of the X-axis" and the "positive direction of the X-axis" correspond to the "second direction" and the "third direction" in the present disclosure, respectively.

[0048] (Modifications 1 to 3) In the antenna module 100 of embodiment 1, the via electrode VG is directly connected to the radiating element 121, but the via electrode VG and the radiating element 121 do not necessarily have to be directly connected as long as they are electrically coupled. Figure 7 is a side perspective view of an antenna module 100A of modification 1. The antenna module 100A differs from the antenna module 100 of embodiment 1 shown in Figure 4 in that the via electrode VG is replaced with a via electrode VG1, and the configuration other than the via electrode VG1 is the same as in Figure 4. In Figure 7, descriptions of elements that overlap with Figure 4 will not be repeated.

[0049] The via electrode VG1 is not directly connected to the radiating element 121, but is capacitively coupled to the radiating element 121 through a plate electrode 170 disposed opposite the radiating element 121.

[0050] The position of the plate electrode 170, i.e., the position of the upper end (second end) of the via electrode VG1, may be the same position as the radiating element 122 in the normal direction of the dielectric substrate 130, or any position between the radiating element 122 and the radiating element 121. In this case, when viewed from above in the normal direction of the dielectric substrate 130, the second end of the via electrode VG1 overlaps with the opening OPG2 of the radiating element 122.

[0051] Furthermore, the position of capacitive coupling in the via electrode is not limited to the boundary with the radiating element 121. For example, as in the antenna module 100B of Modification 2 and the antenna module 100C of Modification 3 in Fig. 8, the via electrode may be divided midway and capacitive coupling may occur at the divided portion.

[0052] The via electrode VG2 in the antenna module 100B of the second modification includes a first portion VG2A connected to the ground electrode GND and a second portion VG2B connected to the radiating element 121. The first portion VG2A and the second portion VG2B are capacitively coupled in the layer between the radiating element 121 and the radiating element 122.

[0053] The via electrode VG3 in the antenna module 100C of the third modification includes a first portion VG3A connected to the ground electrode GND and a second portion VG3B connected to the radiating element 121. The first portion VG3A and the second portion VG3B are capacitively coupled in the layer between the radiating element 122 and the ground electrode GND.

[0054] Fig. 9 is a diagram showing an example of the isolation characteristics of the antenna module 100B according to the above-described modified example 2. Fig. 9 shows a comparison of the isolation characteristics between the low-frequency power feed wiring 142A and the power feed wiring 142B, and the isolation characteristics between the low-frequency power feed wiring 142B and the high-frequency power feed wiring 141A in the antenna module 100B with those in the antenna module 100 according to embodiment 1. In Fig. 9, the solid lines (LN20, LN22) represent the case of the antenna module 100B according to modified example 2, and the dashed lines (LN21, LN23) represent the case of the antenna module 100 according to embodiment 1.

[0055] As shown in Figure 9, the antenna module 100B of variant 2 has improved isolation characteristics compared to the antenna module 100 of embodiment 1, both between the power supply wirings 142A and 142B in frequency band BW2 and between the power supply wirings 141A and 142B in frequency bands BW1 and BW2.

[0056] As described above, even in a configuration in which the via electrode is partially capacitively coupled, by configuring the via electrode to penetrate the opening OPG2 formed in the center of the radiating element 122 as described in FIG. 5, current is concentrated at the end of the opening OPG2 of the radiating element 122, thereby improving the isolation characteristics between the power feed ports. Note that the phase of the current flowing through the via electrode may change depending on the position of the capacitive coupling in the via electrode. Therefore, the position of the capacitive coupling suitable for improving the isolation characteristics may differ depending on the frequency band of the radio waves to be radiated. In other words, the isolation characteristics can be adjusted by setting the position of the capacitive coupling according to the frequency band of the radio waves to be radiated.

[0057] (Modification 4) In each of the above embodiments, the via electrode extends linearly from the ground electrode GND toward the radiating element 121. In Modification 4, a configuration will be described in which vias in different layers that constitute the via electrode are offset between the ground electrode GND and the radiating element 121.

[0058] 10 is a side perspective view of an antenna module 100D of Modification 4. In the antenna module 100D, the via electrode VG in the antenna module 100 of Embodiment 1 is replaced with a via electrode VG4, and the other configuration is the same as that of the antenna module 100D. Description of elements in FIG. 10 that overlap with those in FIG. 4 will not be repeated.

[0059] Referring to FIG. 10 , the via electrode VG4 has a configuration in which multiple vias and multiple strip-shaped flat plate electrodes are alternately arranged. Therefore, when the antenna module 100D is viewed from the side, the vias of different layers constituting the via electrode VG4 are offset between the ground electrode GND and the radiating element 121. In other words, the via electrode VG4 is arranged in a zigzag pattern from the ground electrode GND toward the radiating element 121. In this case, the path length of the via electrode VG4 can be changed by adjusting the length of the flat plate electrode. Changing the path length of the via electrode VG4 changes the inductance value of the via electrode VG4, thereby changing the impedance. Therefore, the isolation characteristics can be adjusted by changing the shape of the via electrode VG4 according to the frequency band of the radiated radio waves, etc.

[0060] 10, in order to facilitate explanation of the structure of the via electrode VG4, the plate electrode of the via electrode VG4 is depicted as extending in the horizontal direction in FIG. 10 (i.e., the direction from the feed point SP1A to SP1B). However, when the antenna module 100D is a dual-polarized type, in order to equalize the influence on the two polarized waves, it is preferable that the extension direction of the plate electrode of the via electrode VG4 be a direction that is equidistant from the feed points SP1A and SP1B. In other words, it is preferable that the plate electrode of the via electrode VG4 extend in the direction of the arrow AR1 in FIG. 3.

[0061] In addition to configuring the via electrode to have vias offset in two layers, as in variants 1 to 3, a portion that is partially capacitively coupled to the via electrode may be provided, and the capacitance value may be changed along with the inductance value to adjust the isolation characteristics.

[0062] Fig. 11 is a diagram for explaining the isolation characteristics of the antenna module 100D of Modification 4. Fig. 11 shows, as an example, the isolation characteristics between the high-frequency power supply wiring 141A and the low-frequency power supply wiring 142B. In Fig. 11, the solid line LN30 indicates the case of the antenna module 100D of Modification 4, and the dashed line LN31 indicates the case of the antenna module 100 of Embodiment 1.

[0063] As shown in Figure 11, in the high-frequency band BW1, the isolation characteristics are similar for both, but in the low-frequency band BW2, the isolation characteristics of the antenna module 100D of variant 4 are improved compared to the isolation characteristics of the antenna module 100.

[0064] As described above, by configuring the vias of different layers that make up the via electrode to be offset between the ground electrode GND and the radiating element 121, it is possible to improve the isolation characteristics compared to when the via electrode is linear.

[0065] [Embodiment 2] In Embodiment 1 and Modifications 1 to 4, a configuration in which two feed elements are arranged in a stack has been described. In Embodiment 2 and Modification 5 described below, a configuration in which a parasitic element is also arranged in a stack in addition to two feed elements will be described.

[0066] 12 is a side perspective view of an antenna module 100E according to embodiment 2. In addition to the components of antenna module 100 according to embodiment 1, antenna module 100E further includes a radiating element 123 disposed closer to top surface 131 of dielectric substrate 130 than radiating element 121. Furthermore, antenna module 100E includes power supply lines 143A and 143B and a via electrode VG5 instead of power supply lines 141A and 141B and via electrode VG of antenna module 100.

[0067] In the antenna module 100E, the radiating element 121 is a parasitic element, and the radiating element 123 is a fed element. The radiating element 121 has openings OPG1, OP1A, and OP1B formed therein.

[0068] The feed wiring 143A passes from the RFIC 110 through an opening OP2A of the radiating element 122 and an opening OP1A of the radiating element 121, and is connected to a feed point SP3A of the radiating element 123. The feed wiring 143B passes from the RFIC 110 through an opening OP2B of the radiating element 122 and an opening OP1B of the radiating element 121, and is connected to a feed point SP3B of the radiating element 123. Furthermore, the via electrode VG5 passes through an opening OPG2 formed in the center of the radiating element 122 and an opening OPG1 formed in the center of the radiating element 121, and is electrically coupled to the center of the radiating element 123. The via electrode VG5 may be capacitively coupled to the radiating element 123.

[0069] The size of radiating element 123 is smaller than the size of radiating element 121. Therefore, by supplying a high-frequency signal corresponding to the resonant frequency of radiating element 123 to radiating element 123 via power supply lines 143A and 143B, radio waves in a higher frequency band than radiating element 121 are radiated from radiating element 123. Furthermore, by supplying a high-frequency signal corresponding to the resonant frequency of radiating element 121 to power supply lines 143A and 143B, radio waves are radiated from radiating element 121. In other words, antenna module 100E can function as a triple-band type antenna module capable of radiating radio waves in three different frequency bands (for example, 28 GHz, 39 GHz, and 60 GHz).

[0070] Furthermore, by setting the resonant frequency of radiating element 123 to a frequency slightly higher than the frequency band of radiating element 121 and at which radiating element 121 can also resonate (for example, 46 GHz), the frequency band of radiating element 121 can be substantially expanded.

[0071] Note that the "radiating elements 121, 122, and 123" in the second embodiment correspond to the "third radiating element," the "second radiating element," and the "first radiating element," respectively, in the present disclosure. The "power feed wiring 143A" and the "power feed wiring 143B" in the second embodiment correspond to the "first power feed wiring" and the "third power feed wiring," respectively, in the present disclosure.

[0072] (Modification 5) In Modification 5, a configuration will be described in which a parasitic element is disposed on the upper surface of the dielectric substrate closer to the two feed elements.

[0073] 13 is a side perspective view of an antenna module 100F of Modification 5. In the antenna module 100F, similar to the antenna module 100E of Embodiment 2, a radiating element 123, which is smaller than the radiating element 122, is further arranged closer to the top surface 131 of the dielectric substrate 130 than the radiating element 121. However, in the antenna module 100F, the radiating elements 121 and 122 are fed elements, and the radiating element 123 is a parasitic element.

[0074] More specifically, similar to the antenna module 100 of embodiment 1, high-frequency signals are supplied to feed points SP1A and SP1B of the radiating element 121 by feed lines 141A and 141B, respectively. Furthermore, high-frequency signals are supplied to feed points SP2A and SP2B of the radiating element 122 by feed lines 142A and 142B, respectively. A via electrode VG5 is electrically coupled to the center of the radiating element 123, passing through an opening OPG2 formed in the center of the radiating element 122 and an opening OPG1 formed in the center of the radiating element 121.

[0075] In the case of antenna module 100F, unlike antenna module 100E of embodiment 2, it is not possible to supply a high-frequency signal individually to radiating element 123. In antenna module 100F, the size of radiating element 123 is set to be slightly smaller than the size of radiating element 121, and is configured so that when a high-frequency signal is supplied to radiating element 121, radiating element 123 also resonates. This makes it possible to expand the frequency band of radiating element 121 toward the high-frequency side.

[0076] It should be noted that the "radiating elements 121, 122, and 123" in Modification 5 correspond to the "first radiating element," the "second radiating element," and the "fourth radiating element," respectively, in the present disclosure.

[0077] [Aspects] (Item 1) An antenna module according to one aspect includes a dielectric substrate, a ground electrode disposed on the dielectric substrate, flat first and second radiating elements, first and second feeder wirings, and a via electrode connected to the ground electrode. The first radiating element is disposed on the dielectric substrate facing the ground electrode. The second radiating element is disposed between the first radiating element and the ground electrode. The first feeder wiring penetrates the second radiating element and transmits a high-frequency signal to the first radiating element. The second feeder wiring transmits a high-frequency signal to the second radiating element. The first feeder wiring is electrically coupled to the first radiating element at a position offset in a first direction from the center of the first radiating element. The second feeder wiring is electrically coupled to the second radiating element at a position offset in a second direction different from the first direction from the center of the second radiating element. The size of the second radiating element is larger than the size of the first radiating element. An opening is formed in the center of the second radiating element. The via electrode passes through the opening of the second radiating element and is electrically coupled to the central portion of the first radiating element.

[0078] (Item 2) In the antenna module described in item 1, the via electrode is connected to the first radiating element.

[0079] (Item 3) In the antenna module described in item 1, the via electrode is capacitively coupled to the first radiating element.

[0080] (4) In the antenna module described in any one of paragraphs 1 to 3, the via electrode includes a first portion connected to the ground electrode and a second portion that is capacitively coupled to the first portion and is disposed between the first portion and the first radiating element.

[0081] (Item 5) In the antenna module described in any one of items 1 to 4, the via electrode has a configuration in which vias in different layers that make up the via electrode are offset between the ground electrode and the first radiating element.

[0082] (Item 6) The antenna module according to any one of Items 1 to 5 further includes a third feed wiring that passes through the second radiating element and transmits a high-frequency signal to the first radiating element. The third feed wiring is electrically coupled to the first radiating element at a position offset in a third direction from the center of the first radiating element.

[0083] (Item 7) The antenna module according to item 6 further includes a fourth feed wiring that transmits a high-frequency signal to the second radiating element. The fourth feed wiring is electrically coupled to the second radiating element at a position offset from the center of the second radiating element in a fourth direction different from the second direction.

[0084] (Item 8) In the antenna module described in item 7, the center of the first radiating element and the center of the second radiating element overlap when viewed in a plan view from the normal direction of the dielectric substrate. The third direction is opposite to the second direction with respect to the center of the first radiating element. The fourth direction is opposite to the first direction with respect to the center of the first radiating element.

[0085] (Item 9) In the antenna module described in item 8, the first direction is orthogonal to the third direction when viewed in a plan view from the normal direction of the dielectric substrate.

[0086] (Item 10) The antenna module described in item 1 further includes a flat-plate-shaped third radiating element disposed between the first radiating element and the second radiating element. The first feed wiring and the via electrode extend through the third radiating element to reach the first radiating element. The size of the third radiating element is larger than the size of the first radiating element and smaller than the size of the second radiating element.

[0087] (Item 11) In the antenna module described in item 1, the dielectric substrate has a first surface and a second surface facing each other. The ground electrode is disposed closer to the second surface than the first radiating element. The antenna module further includes a flat-plate-shaped fourth radiating element disposed closer to the first surface than the first radiating element. The size of the fourth radiating element is smaller than the size of the first radiating element.

[0088] (Item 12) In the antenna module described in item 11, the via electrode passes through the first radiating element and is electrically coupled to the center of the fourth radiating element.

[0089] (Item 13) An antenna module according to one aspect includes a dielectric substrate, a ground electrode disposed on the dielectric substrate, flat first and second radiating elements, first and second feeder wirings, and a via electrode connected to the ground electrode. The first radiating element is disposed on the dielectric substrate facing the ground electrode. The second radiating element is disposed between the first radiating element and the ground electrode. The first feeder wiring penetrates the second radiating element and transmits a high-frequency signal to the first radiating element. The second feeder wiring transmits a high-frequency signal to the second radiating element. The first feeder wiring is electrically coupled to the first radiating element at a position offset in a first direction from the center of the first radiating element. The second feeder wiring is electrically coupled to the second radiating element at a position offset in a second direction different from the first direction from the center of the second radiating element. The size of the second radiating element is larger than the size of the first radiating element. An opening is formed in the center of the second radiating element. The via electrode penetrates the opening of the second radiating element.

[0090] (Item 14) An antenna module according to one aspect includes a dielectric substrate, a ground electrode disposed on the dielectric substrate, flat first and second radiating elements, first and second feed wirings, and a via electrode having a first end and a second end. The first radiating element is disposed on the dielectric substrate facing the ground electrode. The second radiating element is disposed between the first radiating element and the ground electrode. The first feed wiring penetrates the second radiating element and transmits a high-frequency signal to the first radiating element. The second feed wiring transmits a high-frequency signal to the second radiating element. The first feed wiring is electrically coupled to the first radiating element at a position offset in a first direction from the center of the first radiating element. The second feed wiring is electrically coupled to the second radiating element at a position offset in a second direction different from the first direction from the center of the second radiating element. The size of the second radiating element is larger than the size of the first radiating element. An opening is formed in the center of the second radiating element. The first end of the via electrode is connected to the ground electrode. The second end of the via electrode is located at the position of the second radiating element or between the second radiating element and the first radiating element in the normal direction of the dielectric substrate, and overlaps with the opening when viewed in a plan view in the normal direction of the dielectric substrate.

[0091] (15) The antenna module according to any one of the first to fourteenth paragraphs further includes a power supply device for supplying high frequency signals to the first radiating element and the second radiating element.

[0092] (16th Item) A communication device according to one aspect includes the antenna module according to any one of the first to fifteenth items.

[0093] The embodiments disclosed herein should be considered to be illustrative in all respects and not restrictive. The scope of the present invention is defined by the claims, not by the description of the above embodiments, and is intended to include all modifications within the meaning and scope of the claims.

[0094] 10 Communication device, 100, 100A to 100F, 100X Antenna module, 110 RFIC, 110A to 110D Power supply circuit, 111A to 111D, 113A to 113D, 117 Switch, 112AR to 112DR Low noise amplifier, 112AT to 112DT Power amplifier, 114A to 114D Attenuator, 115A to 115D Phase shifter, 116 Signal combiner / divider, 118 Mixer, 119 Amplifier circuit, 120 Antenna device, 121 to 123 Radiating element, 125 Antenna element, 130 Dielectric substrate, 131 Upper surface, 132 Lower surface, 141A to 1413A, 141B to 143B Power supply wiring, 160 Solder bump, 170 Plate electrode, 200 BBIC, BW1, BW2 frequency band, GND ground electrode, OP1A, OP1B, OP2A, OP2B, OPG1, OPG2 opening, SP1A to SP3A, SP1B to SP3B power supply point, VG, VG1 to VG5 via electrode, VG2A, VG3A first part, VG2B, VG3B second part.

Claims

1. A dielectric substrate; a ground electrode disposed on the dielectric substrate; a first radiating element having a flat plate shape and disposed on the dielectric substrate so as to face the ground electrode; a second radiating element having a flat plate shape and disposed between the first radiating element and the ground electrode; a first feed wiring that passes through the second radiating element and transmits a high-frequency signal to the first radiating element; a second feed wiring for transmitting a high frequency signal to the second radiating element; a via electrode connected to the ground electrode; the first power supply wiring is electrically coupled to the first radiating element at a position offset from a center of the first radiating element in a first direction; the second power supply wiring is electrically coupled to the second radiating element at a position offset from a center of the second radiating element in a second direction different from the first direction, The size of the second radiating element is larger than the size of the first radiating element, An opening is formed in the center of the second radiating element, The via electrode passes through the opening of the second radiating element and is electrically coupled to a central portion of the first radiating element.

2. The antenna module according to claim 1 , wherein the via electrode is connected to the first radiating element.

3. The antenna module according to claim 1 , wherein the via electrode is capacitively coupled to the first radiating element.

4. The via electrode is A first portion connected to the ground electrode; The antenna module according to claim 1 , further comprising: a second portion capacitively coupled to the first portion and disposed between the first portion and the first radiating element.

5. The antenna module according to any one of claims 1 to 3, wherein the via electrode has a configuration in which vias of different layers constituting the via electrode are offset between the ground electrode and the first radiating element.

6. a third power supply wiring that passes through the second radiating element and transmits a high-frequency signal to the first radiating element; The antenna module according to any one of claims 1 to 3, wherein the third power supply wiring is electrically coupled to the first radiating element at a position offset from the center of the first radiating element in a third direction different from the first direction.

7. a fourth power supply wiring for transmitting a high-frequency signal to the second radiating element; The antenna module according to claim 6 , wherein the fourth power supply wiring is electrically coupled to the second radiating element at a position offset from a center of the second radiating element in a fourth direction different from the second direction.

8. When viewed in a plan view from a normal direction of the dielectric substrate, a center of the first radiating element and a center of the second radiating element overlap with each other, the third direction is opposite to the second direction with respect to a center of the first radiating element; The antenna module according to claim 7 , wherein the fourth direction is opposite to the first direction with respect to a center of the first radiating element.

9. The antenna module according to claim 8 , wherein, when viewed in a planar view from a normal direction of the dielectric substrate, the first direction is perpendicular to the third direction, and the second direction is perpendicular to the fourth direction.

10. Further comprising a third radiating element having a flat plate shape and disposed between the first radiating element and the second radiating element, the first power supply wiring and the via electrode pass through the third radiating element to reach the first radiating element, The antenna module according to claim 1 , wherein a size of the third radiating element is larger than a size of the first radiating element and smaller than a size of the second radiating element.

11. the dielectric substrate has a first surface and a second surface opposed to each other; the ground electrode is disposed closer to the second surface than the first radiating element, the antenna module further includes a fourth radiating element having a flat plate shape and disposed closer to the first surface than the first radiating element, The antenna module according to claim 1 , wherein a size of the fourth radiating element is smaller than a size of the first radiating element.

12. The antenna module according to claim 11 , wherein the via electrode passes through the first radiating element and is electrically coupled to a central portion of the fourth radiating element.

13. A dielectric substrate; a ground electrode disposed on the dielectric substrate; a first radiating element having a flat plate shape and disposed on the dielectric substrate so as to face the ground electrode; a second radiating element having a flat plate shape and disposed between the first radiating element and the ground electrode; a first feed wiring that passes through the second radiating element and transmits a high-frequency signal to the first radiating element; a second feed wiring for transmitting a high frequency signal to the second radiating element; a via electrode connected to the ground electrode, the first power supply wiring is electrically coupled to the first radiating element at a position offset from a center of the first radiating element in a first direction; the second power supply wiring is electrically coupled to the second radiating element at a position offset from a center of the second radiating element in a second direction different from the first direction, The size of the second radiating element is larger than the size of the first radiating element, An opening is formed in the center of the second radiating element, The via electrode passes through the opening of the second radiating element.

14. A dielectric substrate; a ground electrode disposed on the dielectric substrate; a first radiating element having a flat plate shape and disposed on the dielectric substrate so as to face the ground electrode; a second radiating element having a flat plate shape and disposed between the first radiating element and the ground electrode; a first feed wiring that passes through the second radiating element and transmits a high-frequency signal to the first radiating element; a second feed wiring for transmitting a high frequency signal to the second radiating element; a via electrode having a first end and a second end; the first power supply wiring is electrically coupled to the first radiating element at a position offset from a center of the first radiating element in a first direction; the second power supply wiring is electrically coupled to the second radiating element at a position offset from a center of the second radiating element in a second direction different from the first direction, The size of the second radiating element is larger than the size of the first radiating element, An opening is formed in the center of the second radiating element, the first end of the via electrode is connected to the ground electrode; the second end of the via electrode is located at a position of the second radiating element or between the second radiating element and the first radiating element in a normal direction of the dielectric substrate, The antenna module, when viewed in a plane in a normal direction of the dielectric substrate, the second end overlaps with the opening.

15. The antenna module according to claim 1 , further comprising a power supply device for supplying a high frequency signal to the first radiating element and the second radiating element.

16. A communication device comprising the antenna module according to claim 1.