Conductive adhesive film, method for processing adherend, and method for manufacturing semiconductor device

Abstract

Disclosed is a conductive adhesive film which comprises an adhesive layer that is located on the adherend side, and a base material layer. The surface resistivity of the conductive adhesive film at 140°C on a side opposite to the adhesive layer side is 1 × 107 Ω / □ to 1 × 1012 Ω / □.

Description

Conductive adhesive film, method for treating adherend, and method for manufacturing semiconductor device

[0001] The present disclosure relates to a conductive adhesive film, a method for treating an adherend, and a method for manufacturing a semiconductor device.

[0002] In semiconductor manufacturing processes, electrostatic adsorption is used as one method for fixing semiconductor wafers onto the stage of an etching apparatus in various processes such as etching, CVD (chemical vapor deposition), and PVD (physical vapor deposition). This electrostatic adsorption method applies a voltage between the stage and the semiconductor wafer placed on the stage via a dielectric layer, and the electrostatic force generated between the two attracts the semiconductor wafer to the stage (see, for example, Japanese Patent Laid-Open Publication No. 5-63062).

[0003] However, this electrostatic chuck method, by its very nature, requires the stage to serve as one electrode and the workpiece (e.g., a semiconductor wafer) as the other, making it impossible to chuck and fix an insulator workpiece to the stage. For example, devices such as silicon-on-sapphire (SOS) and silicon-on-insulator (SOI) use insulating substrates, which do not provide the same strong chuck force as semiconductor wafers, making it impossible to employ the electrostatic chuck method. Furthermore, flat panel displays (FPDs) and digital video discs (DVDs) also use insulating substrates, such as glass substrates, making it impossible to employ the electrostatic chuck method.

[0004] Therefore, when an insulating support is used, a method of electrostatic chucking has been proposed in which a conductive adhesive film is interposed between the support on which the semiconductor wafer is placed and the stage (see, for example, Japanese Patent No. 4,898,199 and Japanese Patent No. 5,101,449).

[0005] An object of one aspect of the present disclosure is to provide a novel conductive adhesive film, a method for treating an adherend using the conductive adhesive film, and a method for manufacturing a semiconductor device.

[0006] Means for solving the above problems include the following embodiments: <1> A conductive adhesive film comprising: a pressure-sensitive adhesive layer positioned on an adherend side; and a base layer, wherein the surface resistivity of the conductive adhesive film on the side opposite to the pressure-sensitive adhesive layer side at 140°C is 1×10 ７ Ω / □ to 1 x 10 １２ <2> The conductive adhesive film according to <1>, further comprising a conductive layer on the surface of the base layer opposite to the surface on which the adhesive layer faces. <3> The conductive adhesive film according to <2>, wherein the conductive layer contains a conductive polymer material. <4> The conductive adhesive film according to any one of <1> to <3>, wherein no conductive layer is disposed on the surface of the base layer on which the adhesive layer faces. <5> The conductive adhesive film has a surface resistivity of 2×10 ８ Ω / □ to 1 x 10 １２ The conductive adhesive film according to any one of <1> to <4>, wherein the modulus of elasticity at 23°C is 3.5 GPa or less. <6> The conductive adhesive film according to any one of <1> to <5>, wherein the base layer has a modulus of elasticity of 3.5 GPa or less at 23°C. <7> The conductive adhesive film according to any one of <1> to <6>, wherein the light transmittance of the conductive adhesive film is 85% or less at at least one wavelength in the wavelength range of 380 nm to 780 nm. <8> The conductive adhesive film according to any one of <1> to <7>, wherein the base layer contains a polyolefin. <9> A method for treating an adherend, comprising attaching an adherend to the adhesive layer of the conductive adhesive film according to any one of <1> to <8>, and subjecting the adherend to a processing treatment while adsorbing and fixing the adherend to a suction stage by electrostatic adsorption. <10> The method for treating an adherend according to <9>, wherein the processing treatment is etching, CVD, or PVD. <11> The method for treating an adherend according to <9> or <10>, wherein the adherend comprises at least one material selected from the group consisting of glass, ceramics, quartz, and a compound semiconductor. <12> A method for manufacturing a semiconductor device, comprising: attaching an adherend to the adhesive layer of the conductive adhesive film according to any one of <1> to <8>, and processing the adherend while adsorbing and fixing the adherend to an adsorption stage by electrostatic adsorption.

[0007] According to one aspect of the present disclosure, there are provided a novel conductive adhesive film, a method for treating an adherend using the conductive adhesive film, and a method for manufacturing a semiconductor device.

[0008] FIG. 2 is a diagram schematically illustrating a configuration of a conductive adhesive film.

[0009] Hereinafter, embodiments for carrying out the present disclosure will be described in detail. However, the present disclosure is not limited to the following embodiments. In the following embodiments, components (including element steps, etc.) are not essential unless otherwise specified. The same applies to numerical values ​​and their ranges, and do not limit the present disclosure.

[0010] In the present disclosure, the term "process" includes not only processes that are independent of other processes, but also processes that cannot be clearly distinguished from other processes as long as the purpose of the process is achieved. In the present disclosure, numerical ranges indicated using "to" include the numerical values ​​before and after "to" as the minimum and maximum values, respectively. In numerical ranges described in stages in the present disclosure, the upper or lower limit value described in one numerical range may be replaced with the upper or lower limit value of another staged numerical range. Furthermore, in numerical ranges described in the present disclosure, the upper or lower limit value of that numerical range may be replaced with a value shown in the examples. In the present disclosure, each component may contain multiple corresponding substances. When multiple substances corresponding to each component are present in the composition, the content or amount of each component means the total content or amount of the multiple substances present in the composition, unless otherwise specified. In the present disclosure, each component may contain multiple types of particles. When multiple types of particles corresponding to each component are present in the composition, the particle size of each component means the value for a mixture of the multiple types of particles present in the composition, unless otherwise specified. In the present disclosure, the term "layer" includes cases where the layer is formed over the entire area when the area where the layer is present is observed, as well as cases where the layer is formed only over a portion of the area. In the present disclosure, the thickness of the conductive adhesive film or each layer constituting the conductive adhesive film can be measured by known methods. For example, it may be measured using a dial gauge or from a cross-sectional image of the conductive adhesive film. Alternatively, the material constituting the layer may be removed using a solvent or the like, and the thickness may be calculated from the mass before and after removal, the density of the material, the area of ​​the layer, etc. If the layer thickness is not constant, the arithmetic mean of values ​​measured at any five points is taken as the layer thickness. In the present disclosure, "(meth)acrylic" means either or both of acrylic and methacrylic, and "(meth)acrylate" means either or both of acrylate and methacrylate.

[0011] <Conductive adhesive film> The conductive adhesive film of the present disclosure includes a pressure-sensitive adhesive layer located on an adherend side and a base layer, and the conductive adhesive film has a surface resistivity of 1×10 at 140° C. on the side opposite to the pressure-sensitive adhesive layer side. ７ Ω / □ to 1 x 10 １２ Meets Ω / □.

[0012] The use of the conductive adhesive film of the present disclosure is not particularly limited, and it can be used, for example, for electrostatic chuck applications, and can be used when various processing processes are performed in a state where an adherend is attached to the adhesive layer and the adherend is adsorbed and fixed from the base layer side. The use of the conductive adhesive film is not limited to electrostatic chucks, and it may also be used for processing processes performed by fixing an adherend other than an electrostatic chuck, the manufacture of electronic components, optical materials, etc., temporary protection of an adherend, dicing tape, etc.

[0013] The adherend to which the conductive adhesive film of the present disclosure is applied is not particularly limited, and examples thereof include members containing at least one material selected from the group consisting of glass, ceramics, quartz, and compound semiconductors.

[0014] The adherend may include a semiconductor wafer and a support provided on the surface of the semiconductor wafer opposite to the processing surface. The support is a member for protecting the semiconductor wafer. The support may be, for example, a member made of at least one material selected from the group consisting of glass, ceramics, quartz, and compound semiconductors.

[0015] The surface resistivity of the conductive adhesive film at 140°C on the side opposite to the adhesive layer side is 1 x 10 ７ Ω / □ to 1 x 10 １２ It is sufficient to satisfy Ω / □, for example, 1×10 ７ Ω / □ to 1 x 10 １１ It is preferable that the resistance satisfies Ω / □, and 1×10 ７ Ω / □ to 1 x 10 １０ It is more preferable that Ω / □ is satisfied.

[0016] The surface resistivity of the conductive adhesive film at 140°C on the side opposite to the adhesive layer side is 2 × 10 ８ Ω / □ to 1 x 10 １２ Ω / □ may be satisfied, and 1×10９ Ω / □ to 1 x 10 １２ Ω / □. This can prevent electrical conduction between the conductive adhesive film and the adherend, thereby preventing damage to the adherend due to electrostatic breakdown or the like. For example, when processing the adherend while the adherend is fixed to the adsorption stage by an electrostatic chuck, the surface resistivity of the conductive adhesive film on the side opposite to the adhesive layer at 140°C can be 1 × 10 ９ Ω / □ to 1 x 10 １２ By satisfying the Ω / □ requirement, electrical conduction with the adherend can be suppressed, and adverse effects on the adherend, such as damage due to electrostatic breakdown of the adherend when the conductive adhesive film is attached or peeled off, can be suppressed.

[0017] The surface resistivity of the conductive adhesive film at 23°C on the side opposite to the adhesive layer side is 1 x 10 ７ Ω / □ to 1 x 10 １２ It is preferable that the resistance satisfies Ω / □, for example, 1×10 ７ Ω / □ to 1 x 10 １１ It is more preferable that the resistance satisfies 1×10 ７ Ω / □ to 1 x 10 １０ It is more preferable that the surface resistivity of the conductive adhesive film at 23°C on the side opposite to the adhesive layer side satisfies 2×10 ８ Ω / □ to 1 x 10 １２ Ω / □ may be satisfied, and 1×10 ９ Ω / □ to 1 x 10 １２ Ω / □ may be satisfied.

[0018] The surface resistivity at 23° C. and the surface resistivity at 140° C. are values ​​measured by the method described in the examples.

[0019] (Adhesive Layer) The conductive adhesive film of the present disclosure includes an adhesive layer located on the adherend side. The adhesive layer is formed by applying an adhesive to a predetermined thickness onto a substrate layer or a conductive layer formed on the substrate layer, followed by drying or heating. A common coating method can be used to apply the adhesive, and known methods such as gravure coating, die head coating, reverse coating, comma coating, air knife coating, and Mayer bar coating can be used.

[0020] The type of adhesive is not particularly limited, and examples thereof include acrylic adhesives, rubber adhesives, vinyl alkyl ether adhesives, silicone adhesives, polyester adhesives, polyamide adhesives, urethane adhesives, fluorine-based adhesives, and styrene-diene block copolymer adhesives. Of these, acrylic adhesives are more preferred. The adhesive layer may contain one type or two or more types of adhesives.

[0021] Examples of the acrylic pressure-sensitive adhesive include those having an acrylic polymer (homopolymer or copolymer) as a base polymer, which uses one or more types of (meth)acrylic acid alkyl esters as a monomer component.

[0022] Examples of (meth)acrylic acid alkyl esters constituting the acrylic adhesive include methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, isopropyl (meth)acrylate, butyl (meth)acrylate, isobutyl (meth)acrylate, s-butyl (meth)acrylate, t-butyl (meth)acrylate, pentyl (meth)acrylate, hexyl (meth)acrylate, heptyl (meth)acrylate, octyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, and isopropyl (meth)acrylate. Examples of (meth)acrylic acid alkyl esters include octyl, nonyl (meth)acrylate, isononyl (meth)acrylate, decyl (meth)acrylate, isodecyl (meth)acrylate, undecyl (meth)acrylate, dodecyl (meth)acrylate, tridecyl (meth)acrylate, tetradecyl (meth)acrylate, pentadecyl (meth)acrylate, hexadecyl (meth)acrylate, heptadecyl (meth)acrylate, octadecyl (meth)acrylate, nonadecyl (meth)acrylate, and eicosyl (meth)acrylate. The alkyl group of the (meth)acrylic acid alkyl ester may be either linear or branched.

[0023] The acrylic polymer may contain, as necessary, a structural unit derived from another monomer component (copolymerizable monomer component) copolymerizable with the (meth)acrylic acid alkyl ester, for the purpose of modifying cohesive strength, heat resistance, crosslinkability, etc. Examples of such copolymerizable monomer components include carboxyl group-containing monomers such as (meth)acrylic acid (acrylic acid, methacrylic acid), carboxyethyl acrylate, carboxypentyl acrylate, itaconic acid, maleic acid, fumaric acid, and crotonic acid; acid anhydride group-containing monomers such as maleic anhydride and itaconic anhydride; hydroxyl group-containing monomers such as hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate, hydroxybutyl (meth)acrylate, hydroxyhexyl (meth)acrylate, hydroxyoctyl (meth)acrylate, hydroxydecyl (meth)acrylate, hydroxylauryl (meth)acrylate, and (4-hydroxymethylcyclohexyl)methyl methacrylate; and sulfonic acid group-containing monomers such as styrenesulfonic acid, allylsulfonic acid, 2-(meth)acrylamido-2-methylpropanesulfonic acid, (meth)acrylamidopropanesulfonic acid, sulfopropyl (meth)acrylate, and (meth)acryloyloxynaphthalenesulfonic acid. (N-substituted) amide monomers such as (meth)acrylamide, N,N-dimethyl(meth)acrylamide, N-butyl(meth)acrylamide, N-methylol(meth)acrylamide, and N-methylolpropane(meth)acrylamide; aminoalkyl (meth)acrylate monomers such as aminoethyl (meth)acrylate, N,N-dimethylaminoethyl (meth)acrylate, and t-butylaminoethyl (meth)acrylate; alkoxyalkyl (meth)acrylate monomers such as methoxyethyl (meth)acrylate and ethoxyethyl (meth)acrylate; cyanoacrylate monomers such as acrylonitrile and methacrylonitrile; epoxy group-containing acrylic monomers such as glycidyl (meth)acrylate; styrene-based monomers such as styrene and α-methylstyrene; vinyl ester-based monomers such as vinyl acetate and vinyl propionate; olefin-based monomers such as isoprene, butadiene, and isobutylene;Vinyl ether-based monomers such as vinyl ether; nitrogen-containing monomers such as N-vinylpyrrolidone, methylvinylpyrrolidone, vinylpyridine, vinylpiperidone, vinylpyrimidine, vinylpiperazine, vinylpyrazine, vinylpyrrole, vinylimidazole, vinyloxazole, vinylmorpholine, N-vinylcarboxylic acid amides, and N-vinylcaprolactam; maleimide-based monomers such as N-cyclohexylmaleimide, N-isopropylmaleimide, N-laurylmaleimide, and N-phenylmaleimide; N-methyl Itaconimide-based monomers such as itaconimide, N-ethylitaconimide, N-butylitaconimide, N-octylitaconimide, N-2-ethylhexylitaconimide, N-cyclohexylitaconimide, and N-laurylitaconimide; succinimide-based monomers such as N-(meth)acryloyloxymethylene succinimide, N-(meth)acryloyl-6-oxyhexamethylene succinimide, and N-(meth)acryloyl-8-oxyoctamethylene succinimide; polyethylene (meth)acrylate glycol-based acrylic ester monomers such as ethylene glycol, polypropylene glycol (meth)acrylate, methoxyethylene glycol (meth)acrylate, and methoxypolypropylene glycol (meth)acrylate; acrylic ester-based monomers having a heterocycle, a halogen atom, a silicon atom, or the like, such as tetrahydrofurfuryl (meth)acrylate, fluorine (meth)acrylate, and silicone (meth)acrylate; and polyfunctional monomers such as hexanediol di(meth)acrylate, (poly)ethylene glycol di(meth)acrylate, (poly)propylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, pentaerythritol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol hexa(meth)acrylate, epoxy acrylate, polyester acrylate, urethane acrylate, divinylbenzene, butyl di(meth)acrylate, and hexyl di(meth)acrylate. These copolymerizable monomer components may be used alone or in combination of two or more.

[0024] The acrylic copolymer may be a cross-linked acrylic copolymer. The cross-linked acrylic copolymer can be synthesized by cross-linking monomers, which are raw materials for the acrylic copolymer, using a cross-linking agent. Examples of cross-linking agents used in synthesizing the cross-linked acrylic copolymer include known cross-linking agents such as isocyanate compounds, melamine compounds, and epoxy compounds. In addition, in order to form a network structure that spreads gently in the acrylic pressure-sensitive adhesive, the cross-linking agent may be a multifunctional cross-linking agent, such as a trifunctional or tetrafunctional cross-linking agent.

[0025] The pressure-sensitive adhesive layer may contain components other than the pressure-sensitive adhesive and the crosslinking agent, such as a tackifying resin, a colorant, a thickener, an extender, a filler, a plasticizer, an antioxidant, an antioxidant, a surfactant, etc.

[0026] The conductive adhesive film of the present disclosure may have a separator provided on the surface of the adhesive layer on the adherend side. Examples of the separator include resin films such as polyethylene terephthalate (PET), polyethylene, and polypropylene, resin films surface-coated with a release agent such as a silicone-based release agent, a fluorine-based release agent, and a long-chain alkyl acrylate-based release agent, and paper.

[0027] The thickness of the pressure-sensitive adhesive layer is not particularly limited and may be, for example, 3 μm or more, or 5 μm or more, and may be, for example, 50 μm or less, or 30 μm or less.

[0028] (Substrate layer) The conductive adhesive film of the present disclosure includes a substrate layer. The substrate layer is a layer for supporting an adherend via the adhesive layer. In addition, the surface resistivity of the conductive adhesive film of the present disclosure on the side opposite to the adhesive layer side may be adjusted by adjusting the material, composition, etc. of the substrate layer.

[0029] The material of the substrate layer is not particularly limited. Examples include polyolefins such as polyethylene and polypropylene, polyesters such as polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate, polyimides, polyamides, polyester ethers, polyamideimides, fluorine-containing resins, and thermoplastic elastomers. Among these, polyolefins such as polyethylene and polypropylene and polyethylene terephthalate are preferred, and from the viewpoints of conformability to the adherend and detection by an optical sensor, polyolefins such as polyethylene and polypropylene are more preferred. From the viewpoint of reducing the elastic modulus of the substrate layer and improving conformability to the adherend, it is preferable that the substrate layer does not contain polyimide (e.g., polyimide containing a biphenylimide ring). The resin contained in the substrate layer may be one type or two or more types.

[0030] The substrate layer may be a layer made of the resin described above, or may contain other components in addition to the resin. Examples of other components that may be contained in the substrate layer include the other components that may be contained in the pressure-sensitive adhesive layer described above, antistatic agents described below, conductive polymer materials, conductive materials such as metals, etc.

[0031] The base layer may be stretched or may not be stretched. If the base layer is stretched, the strength of the conductive adhesive film tends to be excellent, and if the base layer is not stretched, the elongation of the conductive adhesive film tends to be excellent.

[0032] The thickness of the substrate layer is not particularly limited, and is preferably 10 μm or more, more preferably 20 μm or more, and even more preferably 30 μm or more. When the thickness of the substrate layer is 10 μm or more, the release sheet is less likely to tear and has excellent handleability, and when the thickness of the substrate layer is 30 μm or more, conformability to the adherend (the property of deforming to match the shape of the adherend) is obtained. The thickness of the substrate layer is preferably 300 μm or less, more preferably 200 μm or less, and even more preferably 100 μm or less. When the thickness of the substrate layer is 300 μm or less, the transportability and processability as a film roll are excellent.

[0033] The elastic modulus of the base layer at 23° C. is not particularly limited, and is preferably 3.5 GPa or less, more preferably 2.0 GPa or less, even more preferably 1.5 GPa or less, and particularly preferably 1.0 GPa or less. When the elastic modulus of the base layer at 23° C. is 3.5 GPa or less, there is a tendency for sufficient conformability to the adherend (the property of deforming to match the shape of the adherend) to be obtained.

[0034] The substrate layer may be composed of only one layer or two or more layers. Methods for obtaining a substrate layer composed of two or more layers include a method in which the materials for each layer are extruded by a co-extrusion method, a method in which two or more films are laminated, and the like.

[0035] When the substrate layer includes a conductive layer, the surface of the substrate layer on which the conductive layer is provided may be subjected to a treatment to improve adhesion to the conductive layer. Examples of the treatment method include surface treatment such as corona treatment or plasma treatment, and application of a primer.

[0036] If necessary, a backing treatment agent may be applied to the back surface of the substrate layer (the surface opposite to the side to be attached to the adherend surface) to adjust the unwinding property of the conductive adhesive film from the roll. Examples of backing treatment agents include silicone resins, fluorine-containing resins, polyvinyl alcohol, and resins having alkyl groups. If necessary, these backing treatment agents may be modified. Only one type of backing treatment agent may be used, or two or more types may be used in combination.

[0037] (Conductive Layer) The conductive adhesive film of the present disclosure may further include a conductive layer. The position of the conductive layer is not particularly limited, and the conductive layer may be disposed between the pressure-sensitive adhesive layer and the base layer, or may be disposed on the surface of the base layer opposite to the pressure-sensitive adhesive layer side. In the conductive film of the present disclosure, the conductive layer is not an essential layer. For example, when the surface resistivity of the conductive adhesive film at 140°C on the side opposite to the pressure-sensitive adhesive layer side is 1 × 10 ７ Ω / □ to 1 x 10 １２ A conductive layer may be provided to facilitate the satisfaction of Ω / □. The surface resistivity of the conductive layer is 1×10 ７ Ω / □ to 1 x 10 １２It is sufficient to satisfy Ω / □, for example, 1×10 ７ Ω / □ to 1 x 10 １１ It is preferable that the resistance satisfies Ω / □, and 1×10 ７ Ω / □ to 1 x 10 １０ It is more preferable that the surface resistivity of the conductive layer satisfies 1×10 ９ Ω / □ to 1 x 10 １２ The surface resistivity of the conductive layer means the surface resistivity at 23°C or the surface resistivity at 140°C.

[0038] The conductive layer may be disposed between the pressure-sensitive adhesive layer and the base layer, and on the surface of the base layer opposite the pressure-sensitive adhesive layer. In this case, the pressure-sensitive adhesive layer, the conductive layer, the base layer, and the conductive layer may be disposed in this order. The two conductive layers may have the same or different compositions. Alternatively, the conductive layer may be disposed only between the pressure-sensitive adhesive layer and the base layer, or on the surface of the base layer opposite the pressure-sensitive adhesive layer. In this case, the pressure-sensitive adhesive layer, the conductive layer, the base layer, and the conductive layer may be disposed in this order (provided that the conductive layer is not disposed on the outer side of the base layer), or the pressure-sensitive adhesive layer, the base layer, and the conductive layer may be disposed in this order (provided that the conductive layer is not disposed between the pressure-sensitive adhesive layer and the base layer). When a conductive layer is disposed between the pressure-sensitive adhesive layer and the base layer, depending on its compatibility with the pressure-sensitive adhesive layer, it may precipitate on the surface of the pressure-sensitive adhesive layer and affect the adherend when the adhesive is attached to the adherend (for example, residue of the conductive layer may adhere to the adherend). Therefore, it is preferable that the conductive layer is arranged on only one side of the substrate layer opposite the pressure-sensitive adhesive layer side, and it is preferable that the conductive layer is not arranged on the pressure-sensitive adhesive layer side of the substrate layer.

[0039] The conductive layer may have any configuration, as long as it can increase the conductivity of the conductive adhesive film and suppress static buildup. For example, it may be a layer containing an antistatic agent, a conductive polymer material, a conductive material such as a metal, or the like. From the viewpoint of humidity-independent conductivity, conductive materials such as conductive polymer materials or metals are preferred, and from the viewpoint of ease of application to the resin film, conductive polymers are more preferred. The conductive layer is formed by applying a conductive layer-forming material containing a conductive material to the base layer to a predetermined thickness, followed by drying or heating. When applying the conductive layer-forming material, a general application method can be used, as with the application of the adhesive.

[0040] Examples of antistatic agents contained in the conductive layer include cationic antistatic agents having cationic groups such as quaternary ammonium salts, pyridinium salts, and primary to tertiary amino groups; anionic antistatic agents having anionic groups such as sulfonate groups, sulfate ester groups, and phosphate ester groups; amphoteric antistatic agents such as amino acid-based and amino acid sulfate-based; nonionic antistatic agents having nonionic groups such as amino alcohol-based, glycerin-based, and polyethylene glycol-based; and polymeric antistatic agents obtained by increasing the molecular weight of these antistatic agents. The antistatic agent may be a combination of a main component and an auxiliary (such as a curing agent). Examples of conductive polymer materials contained in the conductive layer include polymer compounds having a polythiophene, polyaniline, polypyrrole, polyacetylene, or the like in their skeletons. Among these, polymer compounds having a polythiophene skeleton are preferred from the viewpoints of stability, high conductivity, hole injection ability, and low visible light absorption. By suppressing visible light absorption, unintended reactions of the conductive polymer material can be suppressed when the pressure-sensitive adhesive layer is irradiated with active energy rays. Examples of metals include aluminum, copper, gold, chromium, and tin, with aluminum being preferred from the viewpoint of availability.

[0041] The method for forming the conductive layer is not particularly limited, and examples thereof include a method of laminating a metal foil or the like on one side of a film that will serve as a base layer, and a method of applying a material for the conductive layer to one side of a film that will serve as a base layer by coating, vapor deposition, or the like.

[0042] The thickness of the conductive layer is not particularly limited as long as it provides a sufficient antistatic effect for the conductive adhesive film, and may be, for example, in the range of 0.01 μm to 1 μm.

[0043] An example of the configuration of a conductive adhesive film including a pressure-sensitive adhesive layer, a substrate layer, and a conductive layer is shown schematically in Fig. 1. The conductive adhesive film 40 shown in Fig. 1 includes a pressure-sensitive adhesive layer 10, a substrate layer 20, and a conductive layer 30, in this order.

[0044] The total thickness of the conductive adhesive film is not particularly limited and can be set according to the desired physical properties (elongation, elastic modulus, resistivity, etc.), and may be, for example, 30 μm to 300 μm, 35 μm to 250 μm, or 40 μm to 200 μm.

[0045] The light transmittance of the conductive adhesive film of the present disclosure in the visible light region may be 98% or less, or may be 85% or less. When it is 70% or less, detection by light irradiation becomes easy. Furthermore, the light transmittance of the conductive adhesive film of the present disclosure in the visible light region may be 0% or more. The visible light region refers to, for example, the range of 380 nm to 780 nm. The light transmittance of the conductive adhesive film at at least one wavelength included in this wavelength range may satisfy the above-mentioned range (for example, 85% or less).

[0046] <Method for treating an adherend and method for manufacturing a semiconductor device> The method for treating an adherend according to the present disclosure is a method for treating an adherend, in which an adherend is attached to the pressure-sensitive adhesive layer of the conductive pressure-sensitive adhesive film according to the present disclosure, and a processing treatment is performed on the adherend while the adherend is adsorbed and fixed to an adsorption stage by electrostatic adsorption. Furthermore, a semiconductor device may be manufactured by processing the adherend.

[0047] In the method for treating an adherend according to the present disclosure, an adherend is attached to the adhesive layer of a conductive adhesive film, and the adherend to which the conductive adhesive film is attached is placed on an adsorption stage installed in a vacuum chamber of a dry etching device, etc. Then, the adherend adsorbed and fixed to the adsorption stage is subjected to a processing treatment.

[0048] The adherend may be a member containing at least one material selected from the group consisting of glass, ceramics, quartz, and compound semiconductors. One example of the adherend is a laminate formed by adhering a support for supporting a semiconductor substrate having an electronic device formed on its surface to the support. The support may be a member containing at least one material selected from the group consisting of glass, ceramics, quartz, and compound semiconductors.

[0049] After the adherend is placed on the suction stage, a voltage is applied to the internal electrode installed inside the suction stage, generating positive and negative charges on the surface of the conductive adhesive film and the suction stage, and the adherend can be adsorbed and fixed to the suction stage by the electrostatic force acting between them.

[0050] Examples of processing that can be performed on the adherend that has been fixed by suction to the suction stage include etching, CVD (chemical vapor deposition), and PVD (physical vapor deposition).

[0051] The conductive adhesive film of the present disclosure will be described below based on examples, although the present disclosure is not limited to the following examples.

[0052] (Preparation of Composition for Pressure-Sensitive Adhesive Layer) The components shown below (parts by mass, converted to solid content) were mixed to prepare a composition for pressure-sensitive adhesive layer. (Meth)acrylic resin: SK Dyne (registered trademark) S-43, Mw 1,000,000, manufactured by Soken Chemical & Engineering Co., Ltd.: 100 parts by mass Polyisocyanate: Duranate (registered trademark) E405-80T, manufactured by Asahi Kasei Corporation: 12 parts by mass

[0053] Examples 1, 2, and 4 and Comparative Example 2 A film having one side subjected to a corona treatment as shown in Table 1 was prepared as a base layer. A pressure-sensitive adhesive layer composition was applied to the corona-treated surface of the base layer to a thickness of 10 μm after drying, and the coating was heated at 100°C for 1 minute to form a pressure-sensitive adhesive layer. A conductive layer composition having the conductive layer composition shown in Table 1 was applied to the surface opposite the corona-treated surface of the base layer to a thickness of 0.2 μm after drying, and the coating was heated at 100°C for 1 minute to form a conductive layer. A separator shown in Table 1 was attached to the pressure-sensitive adhesive layer provided on the base layer. In this manner, a conductive pressure-sensitive adhesive film was obtained in which the separator, pressure-sensitive adhesive layer, base layer, and conductive layer were laminated in this order. The conductive layer composition was diluted with methanol so that the total of the components listed in Table 1 achieved the concentration shown in Table 1.

[0054] Example 3 and Comparative Example 3 A film containing a conductive component (component E or component F in Table 1) as a substrate layer and having been subjected to a corona treatment on one side was prepared. The same operation as in Example 1 was carried out, except that no new conductive layer was formed. This resulted in a conductive pressure-sensitive adhesive film in which a separator, a pressure-sensitive adhesive layer, a substrate layer, and a conductive layer were laminated in this order.

[0055] Comparative Example 1 The same operation as in Example 1 was carried out, except that the conductive layer was not formed. This resulted in a pressure-sensitive adhesive film in which a separator, a pressure-sensitive adhesive layer, and a substrate layer were laminated in this order.

[0056] Details of each component shown in Table 1 are as follows: Component A: Polythiophene-based conductive polymer Component B: Urethane-acrylic composite resin emulsion Component C: Cationic antistatic agent which is an acrylic copolymer having a quaternary ammonium salt, manufactured by Konishi Co., Ltd., Bondip (registered trademark) PA-100 main component Component D: Epoxy-based curing agent, manufactured by Konishi Co., Ltd., Bondip (registered trademark) PA-100 curing agent Component E: Conductive polymer material (compound of polythiophene-based conductive polymer) Component F: Anionic antistatic agent

[0057] The elastic modulus of each base layer at 23°C is as follows: Polypropylene: 0.7 GPa Polyolefin: 0.1 GPa Polyethylene terephthalate: 3.4 GPa

[0058] The conductive adhesive film and adhesive film thus obtained were subjected to the following evaluation tests. The results are shown in Table 1.

[0059] <Surface Resistivity> Using an insulation resistance meter (digital ultra-high resistance / microcurrent meter manufactured by Advantest Corporation), the surface resistivity of the conductive adhesive film and the adhesive film on the side opposite to the adhesive layer side was measured. Specifically, the conductive adhesive film and the adhesive film were left in an atmosphere of 23±2°C and 55% RH for more than 1 hour, and then a voltage of 500V was applied for 1 minute, after which the surface resistance value (Ω) was measured, and the surface resistivity (Ω / □) was calculated using the following formula. Furthermore, the surface resistivity was measured under high temperature and low humidity conditions. Specifically, the conductive adhesive film and the adhesive film were left on a hot plate heated to 140°C for more than 5 minutes, and then a voltage of 500V was applied for 1 minute, after which the surface resistance value (Ω) was measured, and the surface resistivity (Ω / □) was calculated using the following formula. The results are shown in Table 1. In Table 1, α.E + 0β and α.E + β (α and β are integers) are expressed as α × 10 β means.

[0060] Surface resistivity=π(D+d) / (D−d)×R, where π: circumference constant, D: inner diameter of ring-shaped electrode, d: outer diameter of ring-shaped electrode, and R: surface resistance. The value of π(D+d) / (D−d) used to calculate the surface resistivity was 18.84.

[0061] <Light Transmittance (%)> The light transmittance (%) of the three-layer laminate structure of the pressure-sensitive adhesive layer, the base layer, and the conductive layer used in each Example and Comparative Example was measured using a red LED (wavelength: approximately 650 nm). The results are shown in Table 1.

[0062] <Electrostatic Chuck Evaluation> The separators of the conductive adhesive film and adhesive film were peeled off, and a quartz substrate (adherend) was attached to the adhesive layer. Electrostatic chuck evaluation was performed as follows. With the adherend attached to the adhesive layer, a voltage was applied between the stage and the conductive adhesive film or adhesive film placed on the stage, and an attempt was made to attract the adherend to the stage by the electrostatic force generated between the two. If the leakage rate of He used to cool the adherend was less than 10 Pa / min, the electrostatic chuck was evaluated as A (good). If the leakage rate of He was 10 Pa / min or more, the electrostatic chuck was evaluated as B (poor). The results are shown in Table 1.

[0063] <Optical Sensor Detection Evaluation> The separator of the conductive adhesive film and the adhesive film was peeled off, and a quartz substrate as an adherend was attached to the adhesive layer, and an optical sensor detection evaluation was performed as follows. In the optical sensor detection evaluation, light was irradiated from the thickness direction of the conductive adhesive film and the adhesive film to the area where the adherend was attached, and whether the substrate could be detected by the optical sensor during substrate transport was evaluated. If it was detectable, it was rated as A, and if it was detectable but difficult to detect, it was rated as B. The results are shown in Table 1.

[0064]

[0065] As shown in Table 1, Examples 1 to 4 were evaluated as good in terms of electrostatic chuck performance, and particularly Examples 1 to 3 were evaluated as good in terms of optical sensor detection performance. On the other hand, Comparative Examples 1 to 3 were evaluated as poor in terms of electrostatic chuck performance.

[0066] The disclosure of PCT / JP2023 / 020722, filed June 2, 2023, is incorporated herein by reference in its entirety. All publications, patent applications, and technical standards mentioned herein are incorporated by reference into this specification to the same extent as if each individual publication, patent application, and technical standard was specifically and individually indicated to be incorporated by reference.

Claims

1. a pressure-sensitive adhesive layer positioned on the adherend side; A conductive adhesive film comprising a base material layer, The surface resistivity of the conductive adhesive film at 140°C on the side opposite to the adhesive layer side is 1 × 10 ７ Ω / □ to 1 x 10 １２ Conductive adhesive film with Ω / □.

2. The conductive adhesive film according to claim 1 , further comprising a conductive layer on the surface of the base layer opposite to the surface on which the adhesive layer is formed.

3. The conductive adhesive film according to claim 2 , wherein the conductive layer comprises a conductive polymer material.

4. The conductive adhesive film according to claim 1 , wherein no conductive layer is disposed on the surface of the base layer facing the adhesive layer.

5. The surface resistivity of the conductive adhesive film on the side opposite to the adhesive layer side is 2×10 ８ Ω / □ to 1 x 10 １２ The conductive adhesive film according to claim 1, wherein the resistance is Ω / □.

6. The conductive adhesive film according to claim 1 , wherein the base layer has a modulus of elasticity at 23° C. of 3.5 GPa or less.

7. The conductive adhesive film according to claim 1, wherein the light transmittance of the conductive adhesive film is 85% or less at at least one wavelength included in the wavelength range of 380 nm to 780 nm.

8. The conductive adhesive film according to claim 1 , wherein the base layer contains polyolefin.

9. A method for processing an adherend, comprising attaching the adherend to the adhesive layer of the conductive adhesive film according to any one of claims 1 to 8, and performing a processing process on the adherend while adsorbing and fixing the adherend to an adsorption stage by electrostatic adsorption.

10. 10. The method for treating an adherend according to claim 9, wherein the processing is etching, CVD, or PVD.

11. The method for treating an adherend according to claim 9, wherein the adherend comprises at least one material selected from the group consisting of glass, ceramics, quartz, and compound semiconductors.

12. A method for manufacturing a semiconductor device, comprising: attaching an adherend to the adhesive layer of the conductive adhesive film according to any one of claims 1 to 8; and processing the adherend while the adherend is adsorbed and fixed to an adsorption stage by electrostatic adsorption.