Adhesive film, separator for adhesive film, method for producing adhesive film, and method for producing electronic device

Abstract

The present invention comprises: a base material layer (A); an adhesive resin layer (B) for temporarily fixing an electronic component to a first-surface side of the base material layer (A); an adhesive resin layer (C) located on the second-surface side of the base material layer (A); and a separator (D) located on the surface of the adhesive resin layer (B) on the opposite side from the base material layer (A). The separator (D) has a marker that allows visual identification of the presence of the separator (D).

Description

Adhesive film, separator for adhesive film, method for manufacturing adhesive film, and method for manufacturing electronic device

[0001] The present invention relates to an adhesive film, a separator for an adhesive film, a method for producing an adhesive film, and a method for producing an electronic device.

[0002] Fan-out packaging has been developed as a technology that can reduce the size and weight of electronic devices (e.g., semiconductor devices). One method for manufacturing fan-out packaging, called embedded wafer level ball grid array (eWLB), involves temporarily fixing multiple electronic components, such as semiconductor chips, spaced apart on an adhesive film attached to a support substrate, and then encapsulating the multiple electronic components together with an encapsulant. The adhesive film must be adhered to the electronic components and the support substrate during the encapsulation process, and must be removed from the encapsulated electronic components together with the support substrate after encapsulation.

[0003] As a technique relating to a method for manufacturing a fan-out type package, there is one described in Japanese Patent Application Laid-Open No. 2003-222299.

[0004] Patent Document 1 describes a heat-resistant adhesive sheet for semiconductor device manufacturing that is used by adhering when resin-encapsulating a substrateless semiconductor chip, as a method for solving the problem of the chip not being held in place due to pressure during resin encapsulation and shifting from its designated position, or the problem of the package being damaged when the heat-resistant adhesive sheet for semiconductor device manufacturing is peeled off due to the hardening of the encapsulant or heat causing the encapsulant to become strongly adhesive to the chip surface. The heat-resistant adhesive sheet has a base layer and an adhesive layer, and the adhesive layer has an adhesive strength to SUS304 after lamination of 0.5 N / 20 mm or more, and hardens due to stimuli received before the resin encapsulation process is completed, so that the peel strength to the package is 2.0 N / 20 mm or less.

[0005] JP 2011-134811 A

[0006] The present invention provides an adhesive film having a separator, which enables visual confirmation that the separator has been peeled off from the adhesive film, a separator for the adhesive film, a method for manufacturing an adhesive film, and a method for manufacturing an electronic device.

[0007] The present inventors have conducted extensive research to achieve the above object, and as a result have found that by marking the separator, it is possible to visually confirm that the separator has been peeled off from the adhesive film, and have completed the present invention.

[0008] [1] An adhesive film comprising: a base layer (A); an adhesive resin layer (B) for temporarily fixing an electronic component on a first surface of the base layer (A); an adhesive resin layer (C) on a second surface of the base layer (A); and a separator (D) on the surface of the adhesive resin layer (B) opposite the base layer (A), wherein the separator (D) has a marker that allows visual identification of the presence of the separator (D). [2] The adhesive film according to [1], wherein the marker is located on the surface of the separator (D), and the thickness of the marker is 0.1 μm or more and 10 μm or less. [3] The adhesive film according to [1] or [2], wherein the marker is linear. [4] The adhesive film according to any one of [1] to [3], wherein the adhesive resin layer (C) contains a thermally expandable adhesive. [5] The adhesive film according to [4], wherein the thermally expandable adhesive is an adhesive whose adhesive strength decreases or is lost when heated at a temperature exceeding 100°C. [6] The pressure-sensitive adhesive film according to any one of [1] to [5], wherein the pressure-sensitive adhesive film is wound up in a roll around a core. [7] A separator for a pressure-sensitive adhesive film, which is used in a pressure-sensitive adhesive film capable of temporarily fixing an electronic component when sealing the electronic component, and which has a marker that allows the presence of the separator to be visually identified. [8] The separator for a pressure-sensitive adhesive film according to [7], which can be used for separator (D) constituting the pressure-sensitive adhesive film according to any one of [1] to [6]. [9] A manufacturing method for manufacturing the pressure-sensitive adhesive film according to any one of [1] to [6], comprising the steps of: preparing a laminated film including the base material layer (A), an adhesive resin layer (B) for temporarily fixing an electronic component on a first surface side of the base material layer (A), an adhesive resin layer (C) on a second surface side of the base material layer (A), and a separator (D) on the surface of the adhesive resin layer (B) opposite to the base material layer (A), and a step of applying a marker to the separator (D) while slitting the laminated film to a predetermined size.

[10] A manufacturing method for an electronic device, comprising the step of confirming that the separator (D) has been peeled off from the pressure-sensitive adhesive film according to the presence or absence of the marker in the pressure-sensitive adhesive film according to any one of [1] to [6].

[11] The method for manufacturing an electronic device according to

[10] , further comprising a step of peeling the separator (D) constituting the pressure-sensitive adhesive film from the pressure-sensitive adhesive film before the step of confirming that the separator (D) has been peeled.

[12] The method for manufacturing an electronic device according to

[10] or

[11] , further comprising the steps of: attaching a support substrate to the pressure-sensitive adhesive resin layer (C) side of the pressure-sensitive adhesive film; providing an electronic component on the pressure-sensitive adhesive resin layer (B) of the pressure-sensitive adhesive film; and encapsulating the electronic component with a encapsulant, in this order.

[13] The method for manufacturing an electronic device according to

[12] , wherein the encapsulant comprises an epoxy resin-based encapsulant.

[14] The method for manufacturing an electronic device according to any of

[10] to

[13] , wherein the electronic device comprises a fan-out package.

[0009] According to the present invention, it is possible to provide an adhesive film, a separator for an adhesive film, a method for manufacturing an adhesive film, and a method for manufacturing an electronic device, which make it possible to visually confirm that a separator has been peeled off from an adhesive film having a separator.

[0010] While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments and is not to be construed as limiting the invention.

[0011] Hereinafter, embodiments of the present invention will be described with reference to the drawings. In all drawings, similar components are designated by common reference numerals, and descriptions thereof will be omitted as appropriate. The drawings are schematic diagrams and do not correspond to actual dimensional ratios. In the present embodiment, "(meth)acrylic" means acrylic, methacrylic, or both acrylic and methacrylic.

[0012] In this specification, unless otherwise specified, the expression "X to Y" in the description of a numerical range means at least X and at most Y. For example, "1 to 5% by mass" means "at least 1% by mass and at most 5% by mass."

[0013] [Adhesive Film] The adhesive film of this embodiment will be described. Fig. 1 is a cross-sectional view schematically showing an example of the structure of an adhesive film 100 of this embodiment. The adhesive film 100 of this embodiment includes a base layer (A), an adhesive resin layer (B) for temporarily fixing an electronic component on a first surface side of the base layer (A), an adhesive resin layer (C) on a second surface side of the base layer (A), and a separator (D) on the surface of the adhesive resin layer (B) opposite to the base layer (A), wherein the separator (D) has a marker 10 that allows the presence of the separator (D) to be visually identified.

[0014] A manufacturing method for an electronic device includes a step of arranging electronic components spaced apart on an adhesive film attached to a support substrate and encapsulating the components together with a sealing resin. One side of the adhesive film may be an adhesive layer for holding the electronic components, and a separator for protecting the adhesive layer may be attached to the surface of the adhesive layer. The separator is peeled off immediately before the electronic components are placed on the adhesive film. In this process of placing electronic components on an adhesive film 100 on the support substrate, it has sometimes been difficult to see whether the separator has been peeled off from the adhesive film 100. If the electronic components are placed on the support substrate without noticing that the separator has not been peeled off from the adhesive film 100, the adhesive layer is not exposed, preventing the electronic components from being held in place, resulting in a large amount of electronic components being wasted. After extensive research, the inventors discovered that by adding a marker to the separator that allows visual identification of the separator's presence, it is possible to visually determine whether the separator has been peeled off from the adhesive film, and thus completed the present invention.

[0015] The marker 10 on the separator (D) of this embodiment is not limited as long as it allows visual identification of the separator (D). Examples include one or more types selected from the group consisting of markers applied with oil-based markers (also called felt-tip pens or oil pens), markers applied by inkjet printing, tape attached to the surface of the separator (D), and color separators. Among these, from the viewpoint of improving availability and ease of application of the marker 10, one or more types selected from the group consisting of markers applied with oil-based markers and markers applied by inkjet printing are preferred, with markers applied with oil-based markers being more preferred. Using an oil-based marker makes it easier to apply the marker 10 to the surface of the separator (D), apply a linear marker, and adjust the thickness of the marker 10, as described below. Furthermore, as described below, the time required for the marker 10 to dry and become fixed on the separator (D) after application can be further reduced.

[0016] In the pressure-sensitive adhesive film 100 of this embodiment, the marker 10 is preferably located on the surface of the separator (D). This makes it easier to visually confirm that the separator (D) has been peeled off from the pressure-sensitive adhesive film 100. For example, when the marker 10 is located between the separator (D) and the pressure-sensitive adhesive resin layer (B), even if the separator (D) is peeled off, ink or the like constituting the separator (D) may remain on the surface of the pressure-sensitive adhesive resin layer (B), making it difficult to tell that the separator (D) has been peeled off.

[0017] In the pressure-sensitive adhesive film 100 of this embodiment, the marker 10 is preferably linear. More specifically, the marker 10 is more preferably linear and parallel to the long side direction of the separator (D). This makes it possible to more easily apply the marker 10 to the separator (D), minimize the area of ​​the marker 10, and make it easier to visually confirm that the separator (D) has been peeled off from the pressure-sensitive adhesive film 100. When the marker 10 is linear, the width of the line of the marker 10 is preferably 0.5 mm or more, more preferably 0.8 mm or more, and preferably 2.0 mm or less, more preferably 1.8 mm or less, and even more preferably 1.5 mm or less. The width of the line of the marker 10 is preferably 0.5 mm or more and 2.0 mm or less, more preferably 0.8 mm or more and 1.8 mm or less, and even more preferably 0.8 mm or more and 1.5 mm or less. By making the line width of the marker 10 within the above range, the area of ​​the marker 10 can be minimized, and it becomes easier to visually confirm that the separator (D) has been peeled off from the adhesive film 100.

[0018] In the pressure-sensitive adhesive film 100 of this embodiment, the thickness of the marker 10 is preferably 0.1 μm or more, more preferably 0.3 μm or more, even more preferably 0.5 μm or more, and even more preferably 1.0 μm or more, and preferably 10 μm or less, more preferably 8.0 μm or less, and preferably 5.0 μm or less. Furthermore, the thickness of the marker 10 is preferably 0.1 μm or more and 10 μm or less, more preferably 0.3 μm or more and 8.0 μm or less, even more preferably 0.5 μm or more and 8.0 μm or less, and even more preferably 1.0 μm or more and 5.0 μm or less. When the thickness of the marker 10 in the pressure-sensitive adhesive film 100 is within the above range, the thickness of the marker 10 is less likely to have an effect when the pressure-sensitive adhesive film 100 is wound into a roll as described below, and this prevents the formation of irregularities on the surface of the rolled wound product and the edge surfaces of the rolled wound product from shifting, allowing the rolled wound product to be formed more neatly. When applying the marker 10 using an oil-based marker, the thickness of the marker 10 can be kept within the above range by adjusting the type of oil-based marker and the pressure when pressing the oil-based marker against the separator (D) surface of the adhesive film 100, as described below.

[0019] Each layer of the adhesive film 100 will be described below.

[0020] <Substrate Layer (A)> The substrate layer (A) is a layer provided for the purpose of further improving the handleability, mechanical properties, heat resistance, and other properties of the pressure-sensitive adhesive film 100. The substrate layer (A) is not particularly limited, but examples thereof include resin films. Examples of resins constituting the resin film include known thermoplastic resins. Examples include one or more resins selected from the group consisting of polyolefins such as polyethylene, polypropylene, poly(4-methyl-1-pentene), and poly(1-butene); polyesters such as polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate; polyamides such as nylon-6, nylon-66, and polymethaxylene adipamide; polyacrylate; polymethacrylate; polyvinyl chloride; polyvinylidene chloride; polyimide; polyetherimide; ethylene-vinyl acetate copolymer; polyacrylonitrile; polycarbonate; polystyrene; ionomer; polysulfone; polyethersulfone; and polyphenylene ether. Among these, from the viewpoint of an excellent balance of transparency, mechanical strength, price, etc., one or more selected from polypropylene, polyethylene terephthalate, polyethylene naphthalate, polyamide, and polyimide are preferred, and at least one selected from the group consisting of polyethylene terephthalate and polyethylene naphthalate is more preferred.

[0021] The base layer (A) may be a single layer or two or more layers. The form of the resin film used to form the base layer (A) may be a non-stretched film or a uniaxially or biaxially stretched film, but is preferably a uniaxially or biaxially stretched film from the viewpoint of improving the mechanical strength of the base layer (A).

[0022] The thickness of the substrate layer (A) is preferably 1 μm or more, more preferably 5 μm or more, and even more preferably 10 μm or more, from the viewpoint of obtaining better film properties, and is preferably 500 μm or less, more preferably 300 μm or less, and even more preferably 250 μm or less. Furthermore, the thickness of the substrate layer (A) is preferably 1 μm or more and 500 μm or less, more preferably 5 μm or more and 300 μm or less, and even more preferably 10 μm or more and 250 μm or less, from the viewpoint of obtaining better film properties. The substrate layer (A) may be subjected to a surface treatment to further improve adhesion to other layers. Specifically, corona treatment, plasma treatment, undercoat treatment, primer coating treatment, etc. may be performed.

[0023] <Adhesive resin layer (B)> The adhesive resin layer (B) is a layer provided on the first surface side A1 of the base layer (A). The adhesive resin layer (B) is a layer that comes into contact with the surface of an electronic component to temporarily fix the electronic component when the electronic component is encapsulated with an encapsulant in the manufacturing process of an electronic device.

[0024] The adhesive constituting the adhesive resin layer (B) preferably includes one or more selected from the group consisting of (meth)acrylic adhesives, silicone adhesives, urethane adhesives, olefin adhesives, and styrene adhesives, and more preferably includes a (meth)acrylic adhesive having a (meth)acrylic polymer as a base polymer, since this makes it easier to adjust the adhesive strength.

[0025] As the adhesive constituting the adhesive resin layer (B), a radiation-crosslinkable adhesive whose adhesive strength is reduced by radiation can be preferably used. The adhesive resin layer (B) composed of the radiation-crosslinkable adhesive is crosslinked by irradiation of radiation and its adhesive strength is significantly reduced, making it easier to pick up electronic components from the adhesive resin layer (B) in the electronic component pick-up step. Examples of radiation include ultraviolet light, electron beams, and infrared light. As the radiation-crosslinkable adhesive, an ultraviolet-crosslinkable adhesive is preferred.

[0026] Examples of the (meth)acrylic polymer contained in the (meth)acrylic pressure-sensitive adhesive include a homopolymer of a (meth)acrylic acid ester compound and a copolymer of a (meth)acrylic acid ester compound and a comonomer. Examples of the (meth)acrylic acid ester compound include one or more compounds selected from the group consisting of methyl (meth)acrylate, ethyl (meth)acrylate, butyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate, dimethylaminoethyl (meth)acrylate, glycidyl (meth)acrylate, etc. These (meth)acrylic acid ester compounds may be used alone or in combination of two or more compounds. Examples of the comonomer constituting the (meth)acrylic copolymer include one or more selected from the group consisting of vinyl acetate, (meth)acrylonitrile, (meth)acrylamide, styrene, (meth)acrylic acid, itaconic acid, (meth)acrylamide, methylol (meth)acrylamide, maleic anhydride, etc. These comonomers may be used alone or in combination of two or more.

[0027] The radiation crosslinkable pressure-sensitive adhesive contains, for example, a pressure-sensitive adhesive such as the above-mentioned (meth)acrylic pressure-sensitive adhesive, a crosslinkable compound (a component having a carbon-carbon double bond), and a photopolymerization initiator or a thermal polymerization initiator.

[0028] Examples of the crosslinkable compound include a monomer, oligomer, or polymer having a carbon-carbon double bond in the molecule and capable of crosslinking by radical polymerization. Examples of such crosslinkable compounds include one or more compounds selected from the group consisting of esters of (meth)acrylic acid and polyhydric alcohols such as trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, tetraethylene glycol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, neopentyl glycol di(meth)acrylate, and dipentaerythritol hexa(meth)acrylate; ester (meth)acrylate oligomers; and isocyanurates or isocyanurate compounds such as 2-propenyldi-3-butenyl cyanurate, 2-hydroxyethylbis(2-(meth)acryloxyethyl)isocyanurate, and tris(2-methacryloxyethyl)isocyanurate. When the pressure-sensitive adhesive is a radiation-crosslinkable polymer having a carbon-carbon double bond in the side chain of the polymer, it is not necessary to add a crosslinking compound.

[0029] The content of the crosslinkable compound is preferably 5 to 100 parts by mass, more preferably 10 to 50 parts by mass, per 100 parts by mass of the adhesive. When the content of the crosslinkable compound is within the above range, the adhesive strength can be more easily adjusted than when the content is less than the above range, and deterioration in storage stability due to excessive sensitivity to heat and light is less likely to occur than when the content is more than the above range.

[0030] The photopolymerization initiator may be any compound that is cleaved to generate radicals upon irradiation with radiation, and examples thereof include one or more selected from the group consisting of benzoin alkyl ethers such as benzoin methyl ether, benzoin isopropyl ether, and benzoin isobutyl ether; aromatic ketones such as benzil, benzoin, benzophenone, and α-hydroxycyclohexyl phenyl ketone; aromatic ketals such as benzil dimethyl ketal; polyvinyl benzophenone; and thioxanthones such as chlorothioxanthone, dodecylthioxanthone, dimethylthioxanthone, and diethylthioxanthone.

[0031] Examples of the thermal polymerization initiator include organic peroxide derivatives and azo-based polymerization initiators. Organic peroxide derivatives are preferred because they do not generate nitrogen during heating. Examples of the thermal polymerization initiator include one or more selected from the group consisting of ketone peroxides, peroxyketals, hydroperoxides, dialkyl peroxides, diacyl peroxides, peroxyesters, and peroxydicarbonates.

[0032] A crosslinking agent may be added to the pressure-sensitive adhesive. Examples of the crosslinking agent include one or more selected from the group consisting of epoxy compounds such as sorbitol polyglycidyl ether, polyglycerol polyglycidyl ether, pentaerythritol polyglycidyl ether, and diglycerol polyglycidyl ether; aziridine compounds such as tetramethylolmethane-tri-β-aziridinyl propionate, trimethylolpropane-tri-β-aziridinyl propionate, N,N'-diphenylmethane-4,4'-bis(1-aziridinecarboxamide), and N,N'-hexamethylene-1,6-bis(1-aziridinecarboxamide); and isocyanate compounds such as tetramethylene diisocyanate, hexamethylene diisocyanate, and polyisocyanate. The content of the crosslinking agent is preferably 0.1 parts by mass or more and 10 parts by mass or less per 100 parts by mass of the adhesive, from the viewpoint of improving the balance between the heat resistance and adhesive strength of the adhesive resin layer (B).

[0033] The thickness of the adhesive resin layer (B) is preferably 1 μm or more, more preferably 3 μm or more, even more preferably 5 μm or more, and preferably 100 μm or less, more preferably 50 μm or less, even more preferably 40 μm or less. The thickness of the adhesive resin layer (B) is preferably 1 μm or more and 100 μm or less, more preferably 3 μm or more and 50 μm or less, even more preferably 5 μm or more and 40 μm or less.

[0034] <Adhesive Resin Layer (C)> The adhesive resin layer (C) is a layer provided on the second surface side A2 of the base layer (A). The adhesive resin layer (C) is preferably a layer whose adhesive strength decreases in response to an external stimulus. This allows the adhesive film 100 to be more easily peeled off from the support substrate by applying an external stimulus. Examples of adhesive resin layers (C) whose adhesive strength decreases in response to an external stimulus include heat-peelable adhesive resin layers whose adhesive strength decreases when heated, and light-irradiation type adhesive resin layers whose adhesive strength decreases when exposed to light such as ultraviolet light or radiation. Methods for applying the external stimulus include light irradiation and heat treatment.

[0035] Examples of heat-peelable adhesive resin layers include adhesive resin layers composed of a heat-expandable adhesive that contains an adhesive resin (C1) and further contains a gas-generating component, a heat-expandable adhesive that contains heat-expandable microspheres that can expand to reduce adhesive strength, a heat-expandable adhesive that reduces adhesive strength by crosslinking the adhesive component due to heat, etc. Among these, from the viewpoint of further suppressing misalignment of electronic components and further simplifying the manufacturing method, it is preferable that the adhesive resin layer (C) of this embodiment contains a heat-expandable adhesive.

[0036] The thermally expandable adhesive used in the adhesive resin layer (C) is preferably an adhesive whose adhesive strength is reduced or lost when heated at temperatures above 100°C, more preferably at 110°C or higher, even more preferably at 120°C or higher, even more preferably at 130°C or higher, even more preferably at 150°C or higher, even more preferably at 180°C or higher, even more preferably at 200°C or higher, even more preferably at 210°C or higher, and even more preferably at 230°C or higher. The thermally expandable adhesive used in the adhesive resin layer (C) can be, for example, a material that does not peel at temperatures below 100°C but peels at temperatures above 100°C. It is preferable that the adhesive film 100 has sufficient adhesive strength to prevent peeling from the support substrate during the manufacturing process of the electronic device. Here, the reduction or loss of adhesive strength due to heating at temperatures above 100°C can be evaluated, for example, by attaching the adhesive resin layer (C) side to a stainless steel plate, heating it at 90°C for 1 hour, and then heating it at a temperature above 100°C for 2 minutes, and then measuring the peel strength from the stainless steel plate. The specific heating temperature when heating at a temperature exceeding 100°C is set to a temperature higher than the temperature at which gas is generated or the temperature at which the heat-expandable microspheres thermally expand, and is appropriately set depending on the type of gas generated and the type of heat-expandable microspheres. In this embodiment, loss of adhesive strength refers to, for example, a 180° peel strength of less than 0.5 N / 25 mm measured at 23°C and a tensile speed of 300 mm / min.

[0037] Examples of gas-generating components that can be used in thermally expandable pressure-sensitive adhesives include azo compounds, azide compounds, and Meldrum's acid derivatives. Other examples include inorganic blowing agents such as ammonium carbonate, ammonium bicarbonate, sodium bicarbonate, ammonium nitrite, sodium boron hydroxide, and various azides; water; fluorinated alkane compounds such as trichloromonofluoromethane and dichloromonofluoromethane; azo compounds such as azobisisobutyronitrile, azodicarbonamide, and barium azodicarboxylate; paratoluenesulfonylhydrazide, diphenylsulfone-3,3'-disulfonylhydrazide, 4,4'-oxybis(benzenesulfonyl)hydrazide; Other examples of organic blowing agents that can be used include hydrazine compounds such as p-toluenesulfonylsemicarbazide and 4,4'-oxybis(benzenesulfonylsemicarbazide); semicarbazide compounds such as p-toluenesulfonylsemicarbazide and 4,4'-oxybis(benzenesulfonylsemicarbazide); triazole compounds such as 5-morpholyl-1,2,3,4-thiatriazole; and N-nitroso compounds such as N,N'-dinitrosopentamethylenetetramine and N,N'-dimethyl-N,N'-dinitrosoterephthalamide. The gas-generating component may be added to the adhesive resin (C1) or may be directly bonded to the adhesive resin (C1).

[0038] The heat-expandable microspheres used in heat-expandable pressure-sensitive adhesives can be, for example, microencapsulated blowing agents. Examples of such heat-expandable microspheres include microspheres in which a substance that easily gasifies and expands upon heating, such as isobutane, propane, or pentane, is encapsulated within an elastic shell. Examples of materials constituting the shell include vinylidene chloride-acrylonitrile copolymer, polyvinyl alcohol, polyvinyl butyral, polymethyl methacrylate, polyacrylonitrile, polyvinylidene chloride, and polysulfone. Heat-expandable microspheres can be produced, for example, by coacervation or interfacial polymerization. Heat-expandable microspheres can be added to adhesive resins.

[0039] The lower limit of the content of at least one selected from the gas-generating component and the heat-expandable microspheres can be appropriately set depending on the expansion ratio and adhesive strength reduction of the heat-peelable adhesive resin layer (C), and is not particularly limited, but is preferably 1 part by mass or more, more preferably 10 parts by mass or more, and even more preferably 12 parts by mass or more, per 100 parts by mass of the adhesive resin (C1) in the heat-peelable adhesive resin layer (C). The upper limit of the content of at least one selected from the gas-generating component and the heat-expandable microspheres is preferably 150 parts by mass or less, more preferably 130 parts by mass or less, and even more preferably 100 parts by mass or less, per 100 parts by mass of the adhesive resin (C1) in the heat-peelable adhesive resin layer (C). The content of at least one selected from the gas-generating component and the heat-expandable microspheres is preferably 1 to 150 parts by mass, more preferably 10 to 130 parts by mass, and even more preferably 12 to 100 parts by mass, per 100 parts by mass of the adhesive resin (C1) in the heat-peelable adhesive resin layer (C). The content of at least one selected from the gas-generating component and the heat-expandable microspheres is preferably designed so that the temperature at which the gas is generated or the temperature at which the heat-expandable microspheres thermally expand exceeds 100°C.

[0040] Examples of the pressure-sensitive adhesive resin (C1) constituting the thermally expandable pressure-sensitive adhesive include one or more selected from the group consisting of (meth)acrylic resins, urethane resins, silicone resins, polyolefin resins, polyester resins, polyamide resins, fluorine-containing resins, styrene-diene block copolymer resins, etc. Among these, (meth)acrylic resins are preferred.

[0041] The adhesive resin layer (C) of this embodiment preferably further contains, in addition to the adhesive resin (C1), a crosslinking agent (C2) having two or more crosslinkable functional groups per molecule. The crosslinking agent (C2) having two or more crosslinkable functional groups per molecule is used to adjust the adhesive strength and cohesive strength by reacting with the functional groups of the adhesive resin (C1). Examples of such crosslinking agents (C2) include epoxy compounds such as sorbitol polyglycidyl ether, polyglycerol polyglycidyl ether, pentaerythritol polyglycidyl ether, diglycerol polyglycidyl ether, glycerol polyglycidyl ether, neopentyl glycol diglycidyl ether, and resorcinol diglycidyl ether; isocyanate compounds such as tetramethylene diisocyanate, hexamethylene diisocyanate, toluene diisocyanate triadduct of trimethylolpropane, polyisocyanate, diphenylmethane diisocyanate, and tolylene diisocyanate; trimethylolpropane-tri-β-aziridinyl propionate, tetramethylolpropane-tri-β-aziridinyl propionate, and tetramethylolpropane-tri-β-aziridinyl propionate. Examples of the epoxy-based compound include aziridine compounds such as N,N,N'-diphenylmethane-tri-β-aziridinylpropionate, N,N'-diphenylmethane-4,4'-bis(1-aziridinecarboxamide), N,N'-hexamethylene-1,6-bis(1-aziridinecarboxamide), N,N'-toluene-2,4-bis(1-aziridinecarboxamide), and trimethylolpropane-tri-β-(2-methylaziridine)propionate; tetrafunctional epoxy compounds such as N,N,N',N'-tetraglycidyl-m-xylylenediamine and 1,3-bis(N,N'-diglycidylaminomethyl)cyclohexane; and melamine compounds such as hexamethoxymethylolmelamine. These compounds may be used alone or in combination. Among these, it is preferable to use one or more compounds selected from the group consisting of epoxy compounds, isocyanate compounds, and aziridine compounds.

[0042] The content of the crosslinking agent (C2) is usually preferably within a range such that the number of functional groups in the crosslinking agent (C2) is not greater than the number of functional groups in the adhesive resin (C1). However, an excess amount may be added as necessary when new functional groups are generated in the crosslinking reaction or when the crosslinking reaction is slow. The lower limit of the content of the crosslinking agent (C2) in the adhesive resin layer (C) is preferably 0.1 parts by mass or more, more preferably 0.5 parts by mass or more, per 100 parts by mass of the adhesive resin (C1), from the viewpoint of further suppressing misalignment of electronic components during the encapsulation process. Furthermore, the upper limit of the content of the crosslinking agent (C2) in the adhesive resin layer (C) is preferably 10 parts by mass or less, more preferably 5 parts by mass or less, per 100 parts by mass of the adhesive resin (C1), from the viewpoint of storage stability.

[0043] In this embodiment, the adhesive resin layer (C) preferably contains a tackifier resin in addition to the adhesive resin (C1) from the viewpoint of improving adhesion to the support substrate. Incorporating a tackifier resin into the adhesive resin layer (C) is preferred because it facilitates adjustment of adhesion to the support substrate at around room temperature. The tackifier resin preferably has a softening point of 100°C or higher. Specific examples of tackifier resins include one or more selected from the group consisting of rosin-based resins such as rosin derivatives treated by esterification or the like; terpene-based resins such as α-pinene, β-pinene, dipentene, and terpene phenol; natural rosins such as gum, wood, and tall oil; petroleum resins obtained by hydrogenating, disproportionating, polymerizing, or maleating these natural rosins; and coumarone-indene resins. Among these, those having a softening point in the range of 100 to 160°C are more preferred, and those in the range of 120 to 150°C are even more preferred.

[0044] The blending ratio of the tackifier resin is preferably 1 part by mass or more, more preferably 2 parts by mass or more, per 100 parts by mass of the adhesive resin (C1), from the viewpoint of further improving adhesion to the support substrate during operation, and is preferably 100 parts by mass or less, more preferably 50 parts by mass or less, from the viewpoint of further improving adhesion to the support substrate and attachment at room temperature. The acid value of the tackifier resin is preferably 30 or less. This tends to make it less likely that adhesive residue will remain on the support substrate when the adhesive film 100 is peeled off.

[0045] The adhesive resin layer (C) may contain additives such as plasticizers as other components. The lower limit of the total content of the adhesive resin (C1), crosslinking agent (C2), and tackifier resin in the adhesive resin layer (C), when the entire adhesive resin layer (C) is taken as 100% by mass, is preferably 50% by mass or more, more preferably 70% by mass or more, even more preferably 90% by mass or more, and even more preferably 95% by mass or more. Furthermore, when the adhesive resin layer (C) is composed of a heat-expandable adhesive, the lower limit of the total content of the adhesive resin (C1), crosslinking agent (C2), tackifier resin, gas-generating component, and heat-expandable microspheres in the adhesive resin layer (C), when the entire adhesive resin layer (C) is taken as 100% by mass, is preferably 50% by mass or more, more preferably 70% by mass or more, even more preferably 90% by mass or more, and even more preferably 95% by mass or more. The upper limit is not particularly limited, but is, for example, 100% by mass or less.

[0046] Examples of the light-irradiation-type adhesive resin layer (C) include adhesive resin layers composed of an ultraviolet-expandable adhesive containing an ultraviolet-reactive adhesive resin (C3) and further containing a gas-generating component, an ultraviolet-expandable adhesive containing ultraviolet-expandable microspheres that can expand to reduce adhesive strength, and an ultraviolet-expandable adhesive whose adhesive strength is reduced by a crosslinking reaction of the adhesive component upon ultraviolet irradiation. The light source used here is not particularly limited, but it is preferable to use a light source that can irradiate ultraviolet or visible light with a wavelength of 200 nm to 500 nm. Examples of such light sources include high-pressure mercury lamps, low-pressure mercury lamps, metal halide lamps, and super UV lamps. In the case of ultraviolet crosslinking, for example, a high-pressure mercury lamp is used to irradiate ultraviolet light with a dominant wavelength of 365 nm at an irradiation intensity of 10 to 350 mW / cm in an environment of 0 to 60°C. ２ UV dose 100-20,000 mJ / cm ２ By irradiating the adhesive resin layer (C) under the above conditions, the adhesive resin layer (C) expands, reducing the adhesive strength, and can be peeled off.

[0047] The adhesive resin layer (C) may be a single layer or a multilayer. For example, by laminating two or more layers with different degrees of expansion upon heating to form the adhesive resin layer (C), the adhesiveness and thermal peelability can be changed between one side and the other side of the adhesive resin layer (C). The thickness of the adhesive resin layer (C) is preferably 3 μm or more, more preferably 20 μm or more, from the viewpoint of further improving the adhesiveness and thermal peelability, and is preferably 300 μm or less, more preferably 150 μm or less, from the viewpoint of improving the handleability of the adhesive film 100. The thickness of the adhesive resin layer (C) is preferably 3 μm or more and 300 μm or less, more preferably 20 μm or more and 150 μm or less.

[0048] <Separator (D)> In this embodiment, the separator (D) is a layer provided on the surface of the adhesive resin layer (B) opposite to the substrate layer (A). The separator (D) has a marker 10 that allows the presence of the separator (D) to be visually identified. This makes it easier to visually recognize that the separator (D) has been peeled off from the adhesive film 100.

[0049] The material of the separator (D) is not limited, but preferably contains one or more selected from the group consisting of polyolefins such as polyethylene, polypropylene, poly(4-methyl-1-pentene), and poly(1-butene); and polyesters such as polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate. This further improves the strength of the separator (D), allowing the separator (D) to better fulfill its function of protecting the adhesive resin layer (B) of the adhesive film 100, further improving the releasability of the separator (D), and making it easier to apply the marker 10 to the separator (D). More specifically, when the marker 10 is applied with an oil-based marker, using the above-mentioned material for the separator (D) further improves the affinity between the oil-based ink and the separator (D), allowing the marker 10 to be more reliably fixed to the surface of the separator (D). The surface of the separator (D) on the side of the adhesive resin layer (B) may be subjected to a surface treatment such as a silicone release treatment in order to further improve releasability from the adhesive film.

[0050] The thickness of the separator (D) is preferably 1 μm or more, more preferably 5 μm or more, even more preferably 10 μm or more, and preferably 200 μm or less, more preferably 100 μm or less, and even more preferably 50 μm or less. The thickness of the separator (D) is preferably 1 μm or more and 200 μm or less, more preferably 5 μm or more and 100 μm or less, and even more preferably 10 μm or more and 50 μm or less. When the thickness of the separator (D) is equal to or greater than the above-mentioned lower limit, the strength is further improved, and the adhesive resin layer (B) of the adhesive film 100 can be more reliably protected. Furthermore, peeling of the separator (D) is made easier, and breakage of the separator (D) when applying the marker 10 can be more effectively prevented. When the thickness of the separator (D) is equal to or less than the above-mentioned upper limit, the handleability of the adhesive film 100 can be further improved. More specifically, the adhesive film 100 can be more easily wound up into a roll.

[0051] Furthermore, the pressure-sensitive adhesive film 100 of this embodiment may further include a separator (E) on the side of the pressure-sensitive adhesive resin layer (C) opposite the substrate layer (A), in addition to the separator (D). This can protect the pressure-sensitive adhesive resin layer (C). The material and thickness of the separator (E) are, for example, the same as the material and thickness of the separator (D).

[0052] The overall thickness of the pressure-sensitive adhesive film 100 according to this embodiment is preferably 25 μm or more, more preferably 30 μm or more, and preferably 800 μm or less, more preferably 500 μm or less, and even more preferably 300 μm or less, from the viewpoint of further improving the balance between mechanical properties and handleability. Furthermore, the overall thickness of the pressure-sensitive adhesive film 100 according to this embodiment is preferably 25 μm or more and 800 μm or less, more preferably 30 μm or more and 500 μm or less, and even more preferably 30 μm or more and 300 μm or less, from the viewpoint of further improving the balance between mechanical properties and handleability. Having a thickness of the entire pressure-sensitive adhesive film 100 equal to or greater than the above lower limit can further improve the mechanical properties. Having a thickness of the entire pressure-sensitive adhesive film 100 equal to or less than the above upper limit can further improve the handleability.

[0053] The pressure-sensitive adhesive film 100 of this embodiment may be wound up in a roll around a core. Forming the film in a roll shape can further improve the handleability, workability, ease of transportation and shipping of the pressure-sensitive adhesive film 100. The pressure-sensitive adhesive film 100 of this embodiment can be more easily formed into a roll shape because the thicknesses of the base material layer (A), the pressure-sensitive adhesive resin layer (B), the pressure-sensitive adhesive resin layer (C), and the separator (D), and the thickness of the marker 10 of the separator (D) are within appropriate ranges, and furthermore, shifting and distortion of the edges when formed into a roll shape can be further suppressed.

[0054] [Method for manufacturing adhesive film] A manufacturing method for manufacturing the adhesive film 100 of the present embodiment preferably includes a step (X) of preparing a laminated film including a base layer (A), an adhesive resin layer (B) for temporarily fixing an electronic component on a first surface side of the base layer (A), an adhesive resin layer (C) on a second surface side of the base layer (A), and a separator (D) on a surface of the adhesive resin layer (B) opposite to the base layer (A), and a step (Y) of applying a marker 10 onto the separator (D) while slitting the laminated film to a predetermined size.

[0055] (Step (X)) The step of preparing a laminated film in step (X) can be performed using a conventionally known method, but can be performed, for example, as follows. A pressure-sensitive adhesive coating liquid for producing a pressure-sensitive adhesive resin layer (B) is applied to a separator (D) to form the pressure-sensitive adhesive resin layer (B), and then the layer is laminated to the first surface side of a film-like base layer (A). Alternatively, a pressure-sensitive adhesive coating liquid for producing a pressure-sensitive adhesive resin layer (C) is applied to a separator (E) to form the pressure-sensitive adhesive resin layer (C). The exposed second surface side of the base layer (A) is then laminated to the surface of the pressure-sensitive adhesive resin layer (C) opposite the separator (E), thereby producing the laminated film. Alternatively, the pressure-sensitive adhesive resin layer (B) and the pressure-sensitive adhesive resin layer (C) can be produced by applying a pressure-sensitive adhesive coating liquid to the base layer (A), respectively, and then laminating the separator (D) and the separator (E) thereon. The substrate layer (A) and the adhesive resin layer (B) may be formed on the separator (D) by co-extrusion molding, or may be formed by laminating a film-like substrate layer (A) and a film-like adhesive resin layer (B). The same applies to the substrate layer (A) and the adhesive resin layer (C). The adhesive resin layer (B), the substrate layer (A), and the adhesive resin layer (C) may be formed in this order by co-extrusion molding.

[0056] The coating liquid can be applied using conventional coating methods such as a roll coater, reverse roll coater, gravure roll, bar coater, comma coater, or die coater. The drying conditions for the coating liquid are not particularly limited, but drying at a temperature of 80 to 200°C for 10 seconds to 10 minutes is generally preferred. Drying at 80 to 170°C for 15 seconds to 5 minutes is even more preferred. In order to sufficiently promote the crosslinking reaction between the crosslinker and the adhesive, the adhesive coating liquid may be heated at 40 to 80°C for approximately 5 to 300 hours after drying.

[0057] (Step (Y)) Step (Y) will be specifically described with respect to a case in which marker 10 is applied to separator (D) using an oil-based marker while slitting the laminate film to a predetermined size. A jig for applying an oil-based marker is further installed on a jig equipped with a cutter for slitting the laminate film, and a spring is further attached to the jig. The spring presses the tip of the oil-based marker on the side opposite to the tip on which marker 10 is applied, thereby pressing the oil-based marker against the surface of separator (D) of the adhesive film 100 and applying marker 10. That is, for example, when slitting a laminate film into three laminate films, it is preferable to apply marker 10 to the surface of each of the three laminate films using three oil-based markers, and apply marker 10 to each of the cut laminate films. This allows marker 10 to be applied to any surface of the cut laminate film.

[0058] Here, the pressure when pressing the oil-based marker against the surface of the separator (D) is preferably 1 gf or more, more preferably 5 gf or more, even more preferably 10 gf or more, and preferably 100 gf or less, more preferably 70 gf or less, and even more preferably 50 gf or less. Furthermore, the pressure when pressing the oil-based marker against the surface of the separator (D) is preferably 1 gf or more and 100 gf or less, more preferably 5 gf or more and 70 gf or less, and even more preferably 10 gf or more and 50 gf or less. When the pressure when pressing the oil-based marker against the surface of the separator (D) is equal to or greater than the above-mentioned lower limit, the linear marker 10 can be more stably applied to the separator (D). Furthermore, when the pressure when pressing the oil-based marker against the surface of the separator (D) is equal to or less than the above-mentioned upper limit, the occurrence of unevenness in the adhesive resin layer (B) can be further suppressed. Consequently, when an electronic component 70 is placed in this recess, scattering of the electronic component 70 can be further suppressed during the process of sealing the electronic component 70.

[0059] In the laminated film, the marker 10 is preferably provided at a position 10 mm to 60 mm from the end of the laminated film in the long side direction after slitting, which makes it easier to visually confirm that the separator (D) has been peeled off from the adhesive film 100.

[0060] (Step (Z)) The method for producing a pressure-sensitive adhesive film of this embodiment may further include, after step (Y), step (Z), of winding up the slit laminate film into a roll. When the method for producing a pressure-sensitive adhesive film includes step (Z), it is preferable that the ink of the oil-based marker used in step (Y) is quick-drying. More specifically, the drying time of the ink of the oil-based marker is preferably 8 seconds or less, more preferably 6 seconds or less, even more preferably 5 seconds or less, even more preferably 4 seconds or less, and even more preferably 3 seconds or less after the marker 10 is applied to the surface of the separator (D). This makes it possible to further shorten the time from applying the marker 10 in step (Y) to winding up the laminate film in step (Z), and further improve the production efficiency of the pressure-sensitive adhesive film 100. Furthermore, if the drying time of the ink in the oil-based marker is equal to or less than the above upper limit, the laminated film can be rolled up before the marker 10 dries, preventing the ink of the marker 10 from being transferred to the adhesive resin layer (C) in the adhesive film 100 or the separator (E) on the adhesive resin layer (C) side, and preventing the adhesive resin layer (B) side (i.e., the side on which the electronic components are placed) from being indistinguishable from the adhesive resin layer (C) side (i.e., the side attached to the support substrate) in the adhesive film 100.

[0061] In the step (Z), the speed at which the slit laminated film is wound up can be, for example, about 25 m / min.

[0062] [Method for Manufacturing an Electronic Device] The method for manufacturing an electronic device of this embodiment will be described with reference to the drawings. FIG. 2 is a cross-sectional view schematically illustrating the method for manufacturing an electronic device of this embodiment according to the present invention. The method for manufacturing an electronic device of this embodiment includes a step of confirming that the separator (D) has been peeled off from the adhesive film 100 based on the presence or absence of the marker 10 on the adhesive film 100 of this embodiment described above. The method for manufacturing an electronic device of this embodiment uses the adhesive film 100 of this embodiment. Therefore, the presence or absence of the marker 10 on the separator (D) of the adhesive film 100 can be recognized when viewed from the surface of the adhesive film 100 after the separator (D) has been peeled off, making it easy to confirm whether the separator (D) has been peeled off from the adhesive film 100. This allows the electronic component 70 to be placed on the adhesive film 100, more specifically, on the separator (D), in a state where the separator (D) is not peeled off from the adhesive film 100, i.e., in a state where the adhesive resin layer (B) is not exposed, thereby preventing a large amount of electronic component 70 from being wasted due to not being temporarily fixed.

[0063] Whether the separator (D) has been peeled from the adhesive film 100 can be confirmed by visual inspection or by using a sensor capable of distinguishing colors. Whether visual inspection or using a sensor, it is preferable to check from the normal direction of the surface of the adhesive film 100. This suppresses reflection from the surface of the adhesive film 100, allowing the presence or absence of the marker 10 on the separator (D) to be more accurately recognized, and more accurately confirming whether the separator (D) has been peeled from the adhesive film 100. When visually confirming whether the separator (D) has been peeled from the adhesive film 100, it is preferable to check from a position 5 cm to 100 cm away from the surface of the adhesive film 100 in an environment with an illuminance of 50 lux to 100,000 lux. This allows more accurately confirming whether the separator (D) has been peeled from the adhesive film 100. When a sensor is used to confirm that the separator (D) has been peeled off from the adhesive film 100, for example, a photoelectric sensor can be used that emits light aimed at the position of the marker 10 on the separator (D) of the adhesive film 100 and detects with a light receiving unit the light reflected by the adhesive film 100. Examples of commercially available products that can be used as sensors include the White Spot Photoelectric Sensor LR-W Series, product name, manufactured by Keyence Corporation.

[0064] From the viewpoint of further suppressing misalignment of the electronic component 70, the support substrate 80 preferably includes at least one type selected from the group consisting of a stainless steel substrate and a glass substrate.

[0065] The method for manufacturing an electronic device of this embodiment may further include a step of peeling the separator (D) constituting the adhesive film 100 from the adhesive film 100 before the step of confirming that the separator (D) has been peeled off.

[0066] Furthermore, the method for manufacturing an electronic device according to the present embodiment may further include, in this order, a step of attaching a support substrate 80 to the adhesive resin layer (C) side of the adhesive film 100, a step of providing an electronic component 70 on the adhesive resin layer (B) of the adhesive film 100, and a step of sealing the electronic component 70 with a sealant 90. Here, it is preferable that, after the step of attaching the support substrate 80 to the adhesive resin layer (C) side of the adhesive film 100, a step of peeling the separator (D) constituting the adhesive film 100 from the adhesive film 100 is included. This allows the process to proceed to the step of providing the electronic component 70 on the adhesive resin layer (B) of the adhesive film 100 without going through any other steps after the step of peeling the separator (D) from the adhesive film 100, and further prevents the adhesive resin layers (B) of the adhesive film 100 from sticking to each other or objects other than the electronic component 70 from adhering to the adhesive resin layer (B), thereby allowing the manufacturing of the electronic device to proceed more smoothly.

[0067] Examples of the electronic component 70 include semiconductor chips such as ICs, LSIs, discrete devices, light-emitting diodes, and light-receiving elements, as well as semiconductor panels and semiconductor packages. The surface of the electronic component 70 has an uneven structure due to the presence of electrodes. Furthermore, when mounting an electronic device on a mounting surface, the electrodes are bonded to the electrodes formed on the mounting surface to form an electrical connection between the electronic device and the mounting surface (such as the mounting surface of a printed circuit board). Examples of the electrodes include bump electrodes such as ball bumps, printed bumps, stud bumps, plated bumps, and pillar bumps. In other words, the electrodes are typically convex electrodes. These bump electrodes may be used alone or in combination. The metal species constituting the bump electrodes are not particularly limited, and examples include silver, gold, copper, tin, lead, bismuth, and alloys thereof. These metal species may be used alone or in combination.

[0068] In the process of sealing the electronic components 70 with the sealing material 90, the plurality of electronic components 70 may be sealed together with the sealing material 90, or may be sealed individually. As a method for individually covering the plurality of electronic components 70 with the sealing material 90, it is preferable to use one or more methods selected from the group consisting of a 3D printer method, a spray method, a screen printing method, and an inkjet method, and it is more preferable to use a 3D printer method. By using the above method to individually cover the plurality of electronic components 70 with the sealing material 90, it is possible to suppress misalignment of the electronic components 70.

[0069] As the sealing material 90, any known sealing material having high insulating properties can be used, but the sealing material 90 preferably includes an epoxy resin-based sealing material, which improves the affinity of the sealing material 90 to the adhesive film 100 and enables more uniform sealing of the electronic component 70. Examples of such epoxy resin-based sealing materials that can be used include the T693 / R4000 series, T693 / R1000 series, and T693 / R5000 series manufactured by Nagase ChemteX Corporation. The sealing material 90 may be in a solid or liquid state, but is preferably in a liquid state, from the viewpoints that the sealing process can be performed at low temperature and low pressure and that displacement of the electronic component 70 during the sealing process can be further suppressed.

[0070] From the viewpoint of further suppressing misalignment of electronic component 70, the thickness of sealing material 90 after covering electronic component 70 is preferably 1.0 μm or more, more preferably 1.5 μm or more, even more preferably 5.0 μm or more, even more preferably 10.0 μm or more, even more preferably 30.0 μm or more, even more preferably 50.0 μm or more, and is preferably 2.0 mm or less, more preferably 1.5 mm or less, even more preferably 1.0 mm or less, even more preferably 0.5 mm or less.

[0071] The sealing temperature in the step of sealing the electronic component 70 with the sealing material 90 is preferably 10° C. or higher, more preferably 15° C. or higher, and even more preferably 20° C. or higher, from the viewpoint of further improving work efficiency, and is preferably 45° C. or lower, more preferably 40° C. or lower, even more preferably 35° C. or lower, and even more preferably 30° C. or lower, from the viewpoint of further suppressing misalignment of the electronic component 70. Note that the sealing temperature in this embodiment refers to the set temperature of the device used to seal the electronic component 70.

[0072] The sealing pressure in the step of sealing the electronic component 70 with the sealing material 90 is preferably 30 kPa or more, more preferably 50 kPa or more, even more preferably 70 kPa or more, and even more preferably 90 kPa or more, from the viewpoint of improving the reliability of the electronic device, and is preferably 150 kPa or less, more preferably 130 kPa or less, and even more preferably 110 kPa or less, from the viewpoint of further suppressing misalignment of the electronic component 70. Furthermore, it is more preferable that the sealing pressure in the step of sealing the electronic component 70 with the sealing material 90 is normal pressure. Note that the sealing pressure in this embodiment refers to the set pressure in the device used to seal the electronic component 70.

[0073] The method for manufacturing an electronic device according to this embodiment preferably further includes a step (not shown) of curing the encapsulant 90 after the step of encapsulating the electronic component 70 with the encapsulant 90. This fixes the electronic component 70 and further suppresses misalignment of the electronic component 70. Examples of a method for curing the encapsulant 90 include treating the encapsulant 90 with one or two methods selected from the group consisting of light irradiation and heat treatment. From the viewpoint of further suppressing misalignment of the electronic component 70, it is preferable to cure the encapsulant 90 by light irradiation.

[0074] In the method for manufacturing an electronic device of this embodiment, it is preferable to further include, after the step of curing the sealing material 90, a step (not shown) of applying an external stimulus to the adhesive resin layer (C) to reduce the adhesive strength of the adhesive resin layer (C) and peeling the support substrate 80 from the adhesive film 100. After sealing the electronic component 70, the support substrate 80 can be easily removed from the adhesive film 100 by, for example, heating the support substrate 80 to a temperature exceeding 100°C to reduce the adhesive strength of the adhesive resin layer (C).

[0075] In the method for manufacturing an electronic device of this embodiment, it is preferable to further include a step (not shown) of peeling the adhesive film 100 from the plurality of electronic components 70 after the step of peeling the support substrate 80 from the adhesive film 100. An electronic device is obtained by this step. Examples of methods for peeling the adhesive film 100 from the electronic components 70 include a mechanical peeling method and a method of reducing the adhesive strength of the surface of the adhesive film 100 before peeling.

[0076] The method for manufacturing an electronic device according to this embodiment can be preferably used to manufacture an electronic device including a fan-out package. That is, the electronic device obtained by the method for manufacturing an electronic device according to this embodiment includes a fan-out package. In a fan-out package, terminals can be extended to the outside of the chip (fan out), so it can be used in applications where the number of terminals is large compared to the chip area. Furthermore, since a package substrate is not required, it can also be made thinner.

[0077] Although the embodiments of the present invention have been described above, these are merely examples of the present invention, and various other configurations can also be adopted.

[0078] The present invention is not limited to the above-described embodiment, and modifications and improvements within the scope of achieving the object of the present invention are included in the present invention.

[0079] This application claims priority based on Japanese Patent Application No. 2023-124160, filed on July 31, 2023, the disclosure of which is incorporated herein by reference in its entirety.

[0080] A: Base material layer (A) B: Adhesive resin layer (B) C: Adhesive resin layer (C) D: Separator (D) A1: First surface side of base material layer (A) A2: Second surface side of base material layer (A) 10: Marker 70: Electronic component 80: Support substrate 90: Sealant 100: Adhesive film

Claims

1. Substrate layer (A), On the first surface side of the base material layer (A), there is an adhesive resin layer (B) for temporarily fixing electronic components, A tacky resin layer (C) is provided on the second surface side of the base material layer (A), The adhesive resin layer (B) includes a separator (D) on the side opposite to the base material layer (A), An adhesive film wherein the separator (D) has a marker that allows the presence of the separator (D) to be visually identified.

2. The marker is located on the surface of the separator (D), The adhesive film according to claim 1, wherein the thickness of the marker is 0.1 μm or more and 10 μm or less.

3. The adhesive film according to claim 1 or 2, wherein the marker is linear.

4. The adhesive film according to claim 1 or 2, wherein the adhesive resin layer (C) contains a heat-expandable adhesive.

5. The adhesive film according to claim 4, wherein the heat-expandable adhesive is an adhesive whose adhesive strength decreases or is lost when heated to a temperature exceeding 100°C.

6. The adhesive film according to claim 1 or 2, wherein the adhesive film is wound in a roll shape on a core.

7. A separator used in an adhesive film that can temporarily fix electronic components when sealing electronic components, A separator for adhesive films having a marker that allows the presence of the separator to be visually identified.

8. A separator for adhesive film according to claim 7, which can be used in a separator (D) constituting the adhesive film according to claim 1 or 2.

9. A method for producing an adhesive film according to claim 1 or 2, A step of preparing a laminated film comprising: a base layer (A); an adhesive resin layer (B) for temporarily fixing electronic components on the first surface side of the base layer (A); an adhesive resin layer (C) on the second surface side of the base layer (A); and a separator (D) on the side of the adhesive resin layer (B) opposite to the base layer (A); The process involves slitting the laminated film to a predetermined size while applying a marker to the separator (D), A method for manufacturing an adhesive film, including [the specified element].

10. A method for manufacturing an electronic device, comprising the step of confirming that the separator (D) has been peeled off from the adhesive film based on the presence or absence of the marker in the adhesive film according to claim 1 or 2.

11. The method for manufacturing an electronic device according to claim 10, further comprising the step of peeling off the separator (D) constituting the adhesive film from the adhesive film, prior to the step of confirming that the separator (D) has been peeled off.

12. A step of attaching a support substrate to the adhesive resin layer (C) side of the adhesive film, A step of attaching an electronic component to the adhesive resin layer (B) of the adhesive film, A step of sealing the electronic component with a sealing material, A method for manufacturing an electronic device according to claim 10, further comprising the in this order.

13. The method for manufacturing an electronic device according to claim 12, wherein the sealing material includes an epoxy resin-based sealing material.

14. A method for manufacturing an electronic device according to claim 10, wherein the electronic device includes a fan-out type package.