Vehicular control device

Abstract

A zone ECU (100) is a vehicular control device having a gateway function. The zone ECU (100) is provided with a module heat dissipation unit (70) in addition to a motherboard (30), a plurality of input / output modules (40), and a power distribution circuit (60p) for distributing power supply. The plurality of input / output modules (40) are electrically connected to the motherboard (30). The module heat dissipation unit (70) is thermally connected to at least one input / output module (40), and dissipates heat generated by the input / output module (40).

Description

Vehicle control device CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application is based on Patent Application No. 2023-140468 filed in Japan on August 30, 2023, and the contents of the original application are incorporated by reference in their entirety.

[0002] TECHNICAL FIELD This disclosure relates to a vehicle control system.

[0003] Patent Document 1 discloses an electronic control device for use in a vehicle. This electronic control device includes a substrate on which electronic components such as a power MOSFET are mounted, and a metal case. A heat dissipation gel is provided between the power MOSFET mounted on the substrate and the case. The heat dissipation gel dissipates heat generated by the power MOSFET to the case.

[0004] Patent No. 5071447

[0005] In recent years, development of vehicle control devices that integrate multiple functions has progressed. These vehicle control devices can be equipped with the necessary functions by selecting modules connected to a motherboard. However, since different modules are used depending on the vehicle model or specifications, the amount of heat generated by the vehicle control device and, therefore, the cooling performance required for the vehicle control device may also vary.

[0006] The present disclosure aims to provide a vehicle control device that can have appropriate cooling performance even if the configuration of modules connected to a motherboard changes.

[0007] In order to achieve the above object, one disclosed aspect is a vehicle control device having a gateway function, which includes a motherboard, a plurality of connection modules electrically connected to the motherboard, a power distribution circuit that distributes power, and a module heat dissipation unit that is thermally connected to at least one connection module and dissipates heat generated in the connection module.

[0008] In this embodiment, the module heat dissipation unit is thermally connected to the connection modules that require heat dissipation among the connection modules connected to the motherboard. Therefore, even if the configuration of the connection modules connected to the motherboard changes, it is possible to construct a heat dissipation structure that can accommodate changes in the amount of heat generated. As a result, the vehicle control device can have appropriate cooling performance.

[0009] It should be noted that the reference numbers in parentheses in the claims merely indicate an example of the correspondence with the specific configurations in the embodiments described below, and do not limit the technical scope in any way. Furthermore, claims not explicitly stated in the claims may be combined together if no particular problems arise in the combination.

[0010] 1 is a diagram showing an in-vehicle network system including a zone ECU according to a first embodiment of the present disclosure. FIG. 2 is a perspective view of a zone ECU. FIG. 3 is a cross-sectional view showing the configuration of a zone ECU having an internal box. FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. 3. FIG. 5 is a diagram schematically showing a heat dissipation path for heat generated in an input / output module. FIG. 6 is a cross-sectional view showing the configuration of a zone ECU having no internal box. FIG. 7 is a diagram showing the configuration of a zone ECU according to a second embodiment. FIG. 8 is a cross-sectional view showing an example of the configuration of a cooling flow path provided in an internal box. FIG. 9 is a diagram showing the configuration of a zone ECU according to a third embodiment. FIG. 10 is a cross-sectional view showing the configuration of a zone ECU having no internal box. FIG. 11 is a diagram showing the configuration of a zone ECU according to a fourth embodiment.

[0011] Hereinafter, several embodiments will be described with reference to the drawings. Note that corresponding components in each embodiment are given the same reference numerals, and redundant description may be omitted. When only a portion of the configuration is described in each embodiment, the configuration of another embodiment described previously can be applied to the remaining portion of the configuration. Furthermore, in addition to the combinations of configurations explicitly stated in the description of each embodiment, configurations of several embodiments can also be partially combined together even if not explicitly stated, as long as there is no particular problem with the combination.

[0012] 1 shows a zone ECU (Electronic Control Unit) 100 according to a first embodiment of the present disclosure, which is mounted on a vehicle and used in the vehicle. The zone ECU 100, together with a central ECU 11, various on-board devices 13, and a large number of communication lines, constitutes an on-board network system 10. The on-board network system 10 is a communication network based on a zone architecture, and realizes efficient data exchange between the central ECU 11, the multiple zone ECUs 100, and the large number of on-board devices 13.

[0013] The central ECU 11 is a higher-level ECU than the zone ECUs 100. The central ECU 11 comprehensively controls the multiple zone ECUs 100. The central ECU 11 generates commands (control signals) for controlling the in-vehicle devices 13 and transmits them to the corresponding zone ECUs 100. The central ECU 11 controls the in-vehicle devices 13 via the zone ECUs 100.

[0014] The on-board devices 13 include a slave ECU 14, an actuator 15, and a sensor 16. The on-board devices 13 connected to each zone ECU 100 can be changed as appropriate. The slave ECU 14 is a subordinate ECU to the zone ECU 100. For example, the slave ECU 14 may include a body ECU, a powertrain ECU, a chassis ECU, a multimedia ECU, a cockpit ECU, an ADAS (Advanced Driving Assistant System) ECU, etc. The actuator 15 is controlled by the central ECU 11 via the zone ECU 100. The sensor 16 provides detection information to the central ECU 11 via the zone ECU 100.

[0015] The multiple zone ECUs 100 are arranged in multiple pre-defined zones of the vehicle, such as the front, rear, left, and right sides of the vehicle. Specifically, the zone ECUs 100 are arranged in the engine compartment, the instrument panel, the trunk, under the seats, under the floor, etc. The zone ECUs 100 have a power distribution function and supply power for operation to each on-board device 13. In addition, the zone ECUs 100 have a gateway function and convert and relay data between networks with different communication methods, enabling mutual communication.

[0016] More specifically, one zone ECU 100 is communicatively connected to the central ECU 11 and other zone ECUs 100. The zone ECU 100 communicates with the central ECU 11 and other zone ECUs 100 in accordance with, for example, the ETHERNET (registered trademark) protocol. Each zone ECU 100 is communicatively connected to the in-vehicle devices 13 located in the zone in which it is located. The zone ECU 100 communicates with each in-vehicle device 13 in accordance with, for example, the CAN (Controller Area Network (registered trademark)) protocol or the LIN (Local Interconnect Network) protocol. Using the gateway function described above, the zone ECU 100 relays communication between the central ECU 11 and the in-vehicle devices 13 and controls each in-vehicle device 13 to be controlled.

[0017] <Configuration of Zone ECU> Next, the configuration of the zone ECU 100 will be described with reference to Figures 2 to 4. The zone ECU 100 includes a housing 20, a motherboard 30, an input / output module 40, and an internal box 50. In the following description, the thickness direction of the motherboard 30 is referred to as the Z direction, and two directions along the motherboard 30 are referred to as the X direction and the Y direction, respectively. The Z direction corresponds to the up-down direction of the zone ECU 100. The X direction is along the longitudinal direction of the motherboard 30 and is perpendicular to the Z direction. The Y direction is along the lateral direction of the motherboard 30 and is perpendicular to both the Z direction and the X direction.

[0018] The housing 20 is formed into a generally flat, rectangular parallelepiped shape as a whole. An accommodation space is defined inside the housing 20. The accommodation space accommodates other elements constituting the zone ECU 100, such as the motherboard 30, the input / output module 40, and the internal box 50. The housing 20 is configured to be separable in the Z direction (up and down direction). The housing 20 includes an upper case 21 and a lower case 26. The upper case 21 and the lower case 26 are assembled to each other by snap fitting, screw fastening, heat caulking, or the like. A sealant may be disposed at the joint between the upper case 21 and the lower case 26 to provide the housing 20 with a waterproof function.

[0019] The upper case 21 is made of resin and has a box-like shape. The upper case 21 has a top wall 22 and four upper side walls 24. The top wall 22 faces the motherboard 30 in the Z direction. The upper side walls 24 extend from the four outer edges of the top wall 22 toward the lower case 26 along the Z direction. The upper side walls 24 are formed in a rectangular cylindrical shape and surround the entire periphery of the internal box 50. The lower end portions of the upper side walls 24 are formed in a flange shape so that they can be fixed to the lower case 26.

[0020] The upper case 21 is formed with a plurality (four) of case connectors 23. The case connectors 23 are formed in a rectangular cylindrical shape as a whole. The case connectors 23 are erected upward (in the +Z direction) from the ceiling surface (outer surface) of the upper wall 22 so as to surround the periphery of terminal openings 22a formed in the upper wall 22. Inside the case connectors 23, external connection terminals 45 (described later) of the input / output module 40 are exposed through the terminal openings 22a. The case connectors 23 constitute male connectors.

[0021] A harness connector 81 is connected to the case connector 23. The harness connector 81 is a female connector provided at an end of the wire harness 80. The harness connector 81 is fitted onto the case connector 23. The fitting of the harness connector 81 to the case connector 23 electrically connects the zone ECU 100 and the wire harness 80. A sealant may be disposed at the joint between the case connector 23 and the harness connector 81 to provide waterproofing to the housing 20.

[0022] The lower case 26 is made of a metal material such as aluminum and has a flat, shallow, bottomed container shape. The lower case 26 has a bottom wall 27 and four lower side walls 28. The bottom wall 27 faces the motherboard 30 in the Z direction. The lower side walls 28 extend from the four outer edges of the bottom wall 27 toward the upper case 21 along the Z direction. The lower side walls 28 are formed in a rectangular cylindrical shape and surround the entire periphery of the motherboard 30. The upper end portions of the lower side walls 28 are formed in a flange shape so that they can be fixed to the upper case 21.

[0023] Support portions 29 are formed on the lower case 26. The support portions 29 are located inside the lower side walls 28. The support portions 29 support the motherboard 30 from the bottom wall 27 side. The support portions 29 are provided at multiple (four) locations on the bottom wall 27 so as to support the four corners of the motherboard 30.

[0024] The motherboard 30 has a substantially rectangular plate shape. The motherboard 30 is provided with an arithmetic processing circuit including a processor, a random access memory (RAM), a storage, etc. The processor includes a central processing unit (CPU), etc. The processor is coupled to the RAM and executes various processes to realize each function of the zone ECU 100 by accessing the RAM. The storage includes a non-volatile storage medium such as a flash memory. The storage stores a control program to be executed by the processor. When the processor executes the control program, a control method corresponding to the control program is executed.

[0025] The motherboard 30 includes a board body 31, electronic components 35, and a module connector 37. The board body 31 is a rigid wiring board (printed wiring board) such as a glass epoxy board. The board body 31 is formed in a rectangular plate shape with its longitudinal direction in the X direction. Of the two surfaces of the board body 31, one facing the top wall 22 is an upper mounting surface 32, and the other facing the bottom wall 27 is a lower mounting surface 33. Fixing holes 38 are formed in the four corners of the board body 31. The fixing holes 38 are through-holes that penetrate the board body 31 in the board thickness direction. The fixing holes 38 are used to fix the inner box 50 to the housing 20 (the support portion 29 of the lower case 26).

[0026] The substrate body 31 is composed of an insulating substrate and wiring. The insulating substrate is formed using an electrically insulating material such as epoxy resin. The wiring is disposed on the insulating substrate. The wiring includes at least a conductor pattern. The conductor pattern is formed by patterning metal foil. The conductor pattern is disposed on both the upper mounting surface 32 and the lower mounting surface 33. The conductor pattern may be disposed on only one side of the substrate body 31, or may be disposed inside the insulating substrate. In other words, the substrate body 31 may be a double-sided substrate, a single-sided substrate, or a multi-layer substrate having three or more layers.

[0027] The electronic components 35 are mounted on the substrate main body 31. In the first embodiment, a plurality of electronic components 35 are mounted on each of the upper mounting surface 32 and the lower mounting surface 33. The electronic components 35 are electrically connected to lands formed on the upper mounting surface 32 or the lower mounting surface 33 by soldering or the like. The electronic components 35 are combined with wiring to form a processing circuit, a power supply circuit, and the like on the substrate main body 31.

[0028] The electronic components 35 include a microcomputer 35a and power supply ICs 35b and 35c. The microcomputer 35a and the power supply ICs 35b and 35c are disposed in the central portion 31c of the board body 31. The microcomputer 35a is a semiconductor chip including at least the above-described processor. The microcomputer 35a is mounted on the upper mounting surface 32 and constitutes part of the arithmetic processing circuit. The power supply IC 35b is mounted on the upper mounting surface 32 and constitutes part of the power supply circuit. The power supply IC 35c is mounted on the lower mounting surface 33 and constitutes part of the power supply circuit. The power supply ICs 35b and 35c function as DC / DC converters and step down the vehicle's power supply voltage (battery voltage) supplied via a power supply module 40p (described later) to generate a predetermined supply voltage. The power supply ICs 35b and 35c may be capable of generating different supply voltages.

[0029] The module connector 37 is formed in the shape of an elongated rectangular parallelepiped. For example, an SMD (Surface Mount Device) connector is used as the module connector 37. A plurality (six) of module connectors 37 are arranged on the upper mounting surface 32 of the board main body 31. The module connectors 37 are spaced apart from one another and aligned in the X direction. Each module connector 37 is electrically connected to a land formed on the upper mounting surface 32 by soldering or the like, with its longitudinal direction aligned in the Y direction. Three module connectors 37 are provided in the X direction on each side of the central portion 31c on which the microcomputer 35a and power supply ICs 35b and 35c are mounted.

[0030] The module connector 37 has a module insertion port 37a. The module insertion port 37a is an opening that opens upward (in the +Z direction). A board connection terminal 49 (described later) of the input / output module 40 is inserted into the module insertion port 37a. A large number of pins are arranged inside the module insertion port 37a. By inserting the board connection terminal 49 into the module insertion port 37a, the input / output module 40 is electrically connected to the motherboard 30. At least some of the multiple module connectors 37 may be compatible with each other.

[0031] The input / output module 40 provides at least the input / output control function (I / O control function) among the functions of the zone ECU 100. The input / output module 40 is configured to modularize the input / output control function by separating it from the motherboard 30. The input / output module 40 is connected to one device (such as the slave ECU 14) of multiple systems, such as the powertrain system, chassis system, body system, multimedia system, and ADAS system. The zone ECU 100 is equipped with multiple (four) input / output modules 40. These multiple input / output modules 40 are connected to devices of at least two types of systems out of the multiple systems. The number of input / output modules 40 equipped in the zone ECU 100 can be increased or decreased depending on the functions required of the zone ECU 100.

[0032] The input / output module 40 includes a module main body 41, external connection terminals 45, and board connection terminals 49. The module main body 41 is formed as a flat rectangular parallelepiped overall. The external dimensions of the module main body 41 are uniform. That is, the dimensions of the long sides, short sides, and thickness of each input / output module 40 are substantially the same.

[0033] The module main body 41 is composed of a module substrate 42, module components 43, a sealing body 44, and the like. The module substrate 42 is a rigid wiring substrate such as a glass epoxy substrate. The module substrate 42 is formed in a rectangular flat plate shape. A plurality of external connection terminals 45 and a plurality of board connection terminals 49 are electrically connected to the module substrate 42. As an example, the module substrate 42 is a single-sided board. The module components 43 are mounted on one mounting surface of the module substrate 42. The sealing body 44 is made of, for example, hardened epoxy-based resin. The sealing body 44 seals the entire module substrate 42 and module components 43, as well as portions of the external connection terminals 45 and board connection terminals 49.

[0034] The input / output module 40 is provided with a plurality of external connection terminals 45 and board connection terminals 49. The external connection terminals 45 and board connection terminals 49 are aligned in the Y direction at intervals. The external connection terminals 45 and board connection terminals 49 are formed of a metal material with excellent conductivity, such as copper. The external connection terminals 45 protrude upward (+Z direction) from the upper end surface of the module main body 41 along the planar direction of the module main body 41. The tip of the external connection terminal 45 in the protruding direction is located on the inner periphery of the case connector 23 and is electrically connected to the wire harness 80. The board connection terminal 49 protrudes downward (-Z direction) from the lower end surface of the module main body 41 along the planar direction of the module main body 41. The external connection terminal 45 is inserted into the module insertion port 37a and electrically connected to the motherboard 30.

[0035] The multiple input / output modules 40 include a communication module 40c and a power supply module 40p. Additionally, the multiple input / output modules 40 further include an MPU (Micro-Processing Unit) module, a general-purpose IO module, and an AD input module. The MPU module includes an MPU chip capable of high-speed arithmetic processing. The general-purpose IO module includes a microcontroller with general-purpose I / O (GPIO, General Purpose Input / Output) functionality. The role of the input / output terminals of the general-purpose IO module is not fixed to either input or output. The role of the input / output terminals of the general-purpose IO module can be freely selected between input and output using software, etc. The AD input module is an input / output module 40 with an AD conversion function that converts analog signals into digital signals.

[0036] The communication module 40c is an input / output module 40 that performs communication processing. The communication module 40c is, for example, an Ethernet communication module that includes a communication circuit 60c for Ethernet (registered trademark) communication. The communication circuit 60c mainly includes a network processor 43c. The network processor 43c is mounted as a module component 43 on a module substrate 42 of the communication module 40c. The communication circuit 60c performs high-speed communication in accordance with the ETHERNET protocol between the central ECU 11 (see FIG. 1) and other zone ECUs 100. In addition, the communication circuit 60c has a communication protocol conversion function, enabling connection of on-board devices 13 (see FIG. 1) to the ETHERNET. Due to this function of the communication circuit 60c, commands from the central ECU 11 are converted into a protocol such as CAN or LIN by the communication module 40c and then transmitted from the other input / output modules 40 to the on-board devices 13 to be controlled.

[0037] At least a portion of a power distribution circuit 60p is formed in the power supply module 40p. The power distribution circuit 60p distributes power supplied from the vehicle's power source, i.e., an on-board battery or generator, to multiple on-board devices 13 (see FIG. 1) connected to the zone ECU 100. The power distribution circuit 60p may distribute the supply power directly to each on-board device 13, or may distribute the supply power to each on-board device 13 in cooperation with the power supply circuit of the motherboard 30. In addition to the power distribution function, the power distribution circuit 60p also has a switch function that turns on and off the supply of power to each on-board device 13, and a fuse function that monitors the current to predict and calculate a temperature rise in the wiring and cut off the current before it starts to smoke.

[0038] The power supply module 40p further includes a bus bar 46, a reverse connection protection circuit 47, and a power supply monitoring circuit 48. The bus bar 46 is made of a metal material with excellent conductivity, such as copper. The middle portion of the bus bar 46 is sealed with a sealing body 44. The bus bar 46 forms a power connection terminal 46p and a power supply terminal 46s. The bus bar 46 is provided with the power connection terminal 46p and the power supply terminal 46s on the positive side and the power connection terminal 46p and the power supply terminal 46s on the negative side.

[0039] Like the external connection terminals 45, the power connection terminals 46p protrude upward (in the +Z direction) from the upper end surface of the module body 41 along the planar direction of the module body 41. Like the board connection terminals 49, the power supply terminals 46s protrude downward (in the -Z direction) from the lower end surface of the module body 41 along the planar direction of the module body 41. A large current, for example, of 60 A or more, flows through the bus bar 46. Therefore, the cross-sectional areas of the power connection terminals 46p and the power supply terminals 46s are larger than the cross-sectional areas of the other external connection terminals 45 and board connection terminals 49.

[0040] The reverse connection protection circuit 47 and the power supply monitoring circuit 48 are provided in the current path of the bus bar 46. The reverse connection protection circuit 47 and the power supply monitoring circuit 48 are sealed by the sealing body 44 together with the middle portion of the bus bar 46. The reverse connection protection circuit 47 protects the circuit of the zone ECU 100 when the power supply is accidentally connected in the reverse polarity. For example, a reverse connection protection diode and a MOSFET (Metal Oxide Semiconductor Field Effect Transistor) with a built-in PN diode are used as the reverse connection protection circuit 47. The power supply monitoring circuit 48 realizes the fuse function described above. The power supply monitoring circuit 48 monitors the current and, if the current exceeds a threshold, turns off a semiconductor switch such as a MOSFET to cut off the current.

[0041] The internal box 50 is disposed in a storage space partitioned inside the housing 20. The internal box 50 is formed into a rectangular parallelepiped shape as a whole from a metal material with high thermal conductivity, such as aluminum. The internal box 50 is integrally formed by aluminum die-casting or the like. The internal box 50 may be an assembled product formed by combining multiple metal parts. The internal box 50 is provided with a non-slot portion 51, a slot-forming portion 55, and a fixing portion 59.

[0042] The non-slot portion 51 is located in the center of the internal box 50 in the X direction. The non-slot portion 51 does not have a slot 56 (described later). The non-slot portion 51 is a solid block of metal. The bottom wall of the non-slot portion 51 (hereinafter referred to as the central bottom wall 52) is formed in a flat, planar shape. The central bottom wall 52 faces, with a gap in the Z direction, the electronic components 35, such as the microcomputer 35a and the power supply IC 35b, arranged on the upper mounting surface 32.

[0043] The slot forming portions 55 are formed on both sides of the non-slot portion 51 in the X direction. Each slot forming portion 55 has multiple (three) slots 56 formed therein. Each slot forming portion 55 is adjacent to a non-slot portion 51 and is located outside the non-slot portion 51 in the X direction. The multiple slots 56 are formed at predetermined intervals from one another in the X direction. The number of slots 56 provided in the internal box 50 matches the number of module connectors 37 provided on the motherboard 30. Each slot 56 is located above each module connector 37 (in the +Z direction). Some of the multiple slots 56 may be empty slots 56e that do not accommodate an input / output module 40.

[0044] The slots 56 are through-holes that penetrate the internal box 50 in the Z direction. The slots 56 are formed as rectangular holes with the Y direction as the longitudinal axis. The slots 56 individually accommodate the input / output modules 40 connected to the module connectors 37. In the XY cross section, the inner dimensions of the long and short sides of the slots 56 are slightly larger than the outer dimensions of the long sides and thickness of the module main body 41. On the other hand, the depth of the slots 56, in other words, the thickness of the internal box 50, is slightly smaller than the outer dimensions of the short sides of the module main body 41. The four inner wall surface portions 57 of the slots 56 face the four outer peripheral wall portions 41a of the module main body 41 with a small gap therebetween.

[0045] The fixing portions 59 are provided at the four corners of the inner box 50. The fixing portions 59 have insertion holes formed therein for inserting fastening members such as screws. The fastening members are inserted into the insertion holes of the fixing portions 59 and the fixing holes 38 of the motherboard 30, and are fastened to the support portions 29 of the lower case 26. The inner box 50, together with the motherboard 30, is held in the housing 20 by the fastening members.

[0046] [Heat Dissipation Structure of Zone ECU] The zone ECU 100 is provided with a heat dissipation structure that dissipates heat generated by high-heat-generating components on the motherboard 30 and in the input / output module 40. The zone ECU 100 is equipped with a module heat dissipation section 70 and a board heat dissipation section 76 as heat dissipation structures. The heat dissipation structure of the zone ECU 100 will be further described below with reference to FIGS. 2 to 5.

[0047] The module heat dissipation unit 70 is thermally connected to all input / output modules 40, including the communication module 40c and the power supply module 40p. Being thermally connected means being connected in a manner that allows heat transfer, and includes not only a direct connection but also a connection in which an intervening element or layer that does not substantially impede heat transfer is present. In the first embodiment, the module heat dissipation unit 70 is in direct contact with the input / output modules 40. The module heat dissipation unit 70 is thermally connected to both each input / output module 40 and the internal box 50. The module heat dissipation unit 70 transfers heat generated in each input / output module 40 to the internal box 50. The module heat dissipation unit 70 dissipates heat generated in the input / output modules 40. The module heat dissipation unit 70 enables cooling of module components 43, such as an SoC, a microcontroller, and a power supply IC, included in the input / output module 40, as well as the bus bar 46.

[0048] The module heat dissipation section 70 is provided in the gap between the inner wall surface 57 that defines the slot 56 and the outer peripheral wall 41 a of the input / output module 40 accommodated in the slot 56. The module heat dissipation section 70 is in close contact over a wide area with both the outer peripheral wall 41 a and the inner wall surface 57. The module heat dissipation section 70 surrounds the entire periphery of the module main body 41, and transfers heat from the four outer peripheral wall portions 41 a to the inner wall surface portions 57 that face each outer peripheral wall portion 41 a.

[0049] The module heat dissipation section 70 is made of heat dissipation gel. The heat dissipation gel is a paste or grease-like coating agent whose main component is silicone oil. The heat dissipation gel is interposed between the outer peripheral wall section 41a and the inner wall surface section 57 in an uncured state. The heat dissipation gel has a thermal conductivity of, for example, approximately 2.5 to 4.0 W / m·K. The thermal conductivity of the heat dissipation gel is higher than that of the sealing body 44 (for example, approximately 0.7 to 1.0 W / m·K). On the other hand, the internal box 50 is made of aluminum, which has a higher thermal conductivity than the module heat dissipation section 70. The thermal conductivity of aluminum is, for example, approximately 96 to 200 W / m·K.

[0050] As described above, the internal box 50 has the highest thermal conductivity, followed by the heat dissipation gel and then the sealing body 44 of the input / output module 40. Therefore, heat generated by the input / output module 40 moves to the components with the highest thermal conductivity, raising the temperature of the internal box 50. The internal box 50 functions as a heat sink, dissipating the transferred heat into the surrounding air (see the hollow arrows in FIG. 5 ). Because the internal box 50 has the highest thermal conductivity, heat transferred to the internal box 50 is unlikely to return to the input / output module 40. Therefore, heat transfer between the input / output modules 40 via the internal box 50 is unlikely to occur. Note that a portion of the heat generated in the input / output module 40 may be dissipated to the conductors of the wire harness 80 through the external connection terminals 45.

[0051] A holding groove 71 is formed in at least one of the inner wall surface 57 and the outer peripheral wall 41a, which come into contact with the module heat dissipation unit 70. The holding groove 71 may be formed over the entire inner wall surface 57 and the outer peripheral wall 41a, or may be formed in an area that overlaps with the module component 43 in the X direction. The holding groove 71 is an uneven pattern provided to hold the heat dissipation gel. The holding groove 71 prevents the heat dissipation gel from shifting or moving downward due to gravity, vibration, etc. As an example, a lattice-like (mesh-like) uneven pattern is formed as the holding groove 71 on the inner wall surface 57 and the outer peripheral wall 41a.

[0052] Like the module heat dissipation unit 70, the board heat dissipation unit 76 is made of heat dissipation gel. The board heat dissipation unit 76 is provided between the electronic components 35 mounted on the motherboard 30 and the internal box 50. A heat-generating microcontroller 35a is mounted as a high-heat-generating component in the central portion 31c of the motherboard 30 facing the central bottom wall 52 of the non-slot portion 51. The board heat dissipation unit 76 is provided in the gap (e.g., several millimeters) between the microcontroller 35a and the central bottom wall 52. The board heat dissipation unit 76 is in close contact with both the top surface of the microcontroller 35a and the cooling wall portion 53 of the central bottom wall 52 over a wide area. The board heat dissipation unit 76 transfers heat generated by the microcontroller 35a to the cooling wall portion 53. Additionally, the board heat dissipation unit 78 contributes to lowering the temperature of the power supply ICs 35b and 35c mounted in the central portion 31c by cooling the microcontroller 35a.

[0053] [Arrangement of Input / Output Modules] Of the multiple slots 56 provided in each slot forming portion 55, the slot 56 closest to the non-slot portion 51 is referred to as the inner slot 56a. Furthermore, the other slots 56 farther from the non-slot portion 51 than the inner slot 56a are referred to as the outer slots 56b. The inner slots 56a can release heat to the non-slot portion 51, which has a large heat capacity. Therefore, the inner slots 56a exhibit higher cooling performance than the outer slots 56b.

[0054] The inner slot 56a accommodates the high heat generating module 40a, which generates a large amount of heat. Specifically, the high heat generating module 40a includes the communication module 40c, the power supply module 40p, and the MPU module. On the other hand, the outer slot 56b accommodates the low heat generating module 40b, which generates a small amount of heat. The heat generated by the high heat generating module 40a is greater than that of the low heat generating module 40b. Other input / output modules 40 having input / output control functions are included in the low heat generating module 40b. Specifically, the low heat generating module 40b includes the general-purpose IO module, the AD input module, and the like.

[0055] A high-heat-generating module 40a generates more heat from semiconductor chips, such as integrated circuits (ICs), than a low-heat-generating module 40b. Therefore, the temperature of ICs and other components in a high-heat-generating module 40a is more likely to rise than in a low-heat-generating module 40b. Consequently, the surface temperature of the module is more likely to rise. Such high-heat-generating modules 40a and low-heat-generating modules 40b are structurally distinguishable. For example, an input / output module 40 with a larger cross-sectional area of ​​the external connection terminals 45 and board connection terminals 49 than other input / output modules 40, such as a power supply module 40p with a bus bar 46, is considered a high-heat-generating module 40a. Furthermore, an input / output module 40 including a module component 43 (semiconductor chip) that generates more heat than other input / output modules 40, such as a communication module 40c with a network processor 43c, is considered a high-heat-generating module 40a. The heat generated by a module component 43 can be determined from indicators such as thermal design power (TDP) described in specifications.

[0056] [Method of forming heat dissipation structure] The heat dissipation gel that forms the module heat dissipation section 70 is applied to the outer peripheral wall portion 41 a of the input / output module 40 and the slot 56. The input / output module 40 with the heat dissipation gel applied thereto is inserted into the slot 56, and the outer peripheral wall portion 41 a is thermally connected to the inner wall surface portion 57 via the heat dissipation gel. The input / output modules 40 are individually inserted into the slots 56 of the internal box 50 that is fixed to the lower case 26.

[0057] The heat dissipation gel may also be applied to the inner wall surface 57 of the slot 56. The internal box 50 is installed on the motherboard 30 so that the multiple input / output modules 40 fixed to the motherboard 30 are inserted into each slot 56.

[0058] Furthermore, if the internal box 50 is an assembled product and the width of the slots 56 in the X direction is adjustable, the heat dissipation gel is applied to the outer peripheral wall 41 a of the input / output modules 40. After all of the input / output modules 40 are accommodated in the slots 56, the internal box 50 is compressed in the X direction. By squeezing the heat dissipation gel in this process, the heat dissipation gel is reliably brought into close contact with the inner wall surface 57 and the outer peripheral wall 41 a.

[0059] The heat dissipation gel forming the board heat dissipation portion 76 is applied to the top surface of the microcomputer 35a and the cooling wall surface portion 53. When the inner box 50 is assembled to the lower case 26 with the motherboard 30 sandwiched between it and the microcomputer 35a, the heat dissipation gel is squeezed between the microcomputer 35a and the central bottom wall 52. As a result, the heat dissipation gel is securely attached to the top surface of the microcomputer 35a and the cooling wall surface portion 53.

[0060] [Heat Dissipation Structure Without Internal Box] In the zone ECU 100, the internal box 50 can be omitted. More specifically, if the total wattage consumption of the entire zone ECU 100 is high and high cooling performance is required for the zone ECU 100, a heat dissipation structure using the internal box 50 is adopted. On the other hand, if the cooling performance required for the zone ECU 100 is not high, the internal box 50 is omitted and a heat dissipation structure in which the input / output modules 40 are thermally connected to each other is adopted. Below, the heat dissipation structure of the zone ECU 100 without the internal box 50, specifically the details of the module heat dissipation section 70 and the board heat dissipation section 78, are described with reference to FIG. 6 .

[0061] The module heat dissipation section 70 is provided between two adjacent input / output modules 40. The two input / output modules 40 thermally connected by the module heat dissipation section 70 have different heat generation amounts. The module heat dissipation section 70 connects the high heat generation module 40a and the low heat generation module 40b.

[0062] The module heat dissipation unit 70 may be configured with a heat dissipation gel or a heat dissipation sheet (thermally conductive sheet). The heat dissipation sheet is a flexible resin sheet made of acrylic resin or silicone resin, which contains a highly thermally conductive filler. In addition to its heat dissipation function, the module heat dissipation unit 70 may also have the function of damping vibrations of each input / output module 40.

[0063] In two input / output modules 40 facing each other across the module heat dissipation unit 70, at least one of the opposing outer peripheral wall portions 41a has a holding groove 71 formed therein for holding a heat dissipation gel or a heat dissipation sheet. The holding groove 71 has the grid-like uneven pattern described above. The holding groove 71 is formed, for example, on both outer peripheral wall portions 41a. The holding groove 71 may be formed over the entire outer peripheral wall portion 41a, or may be formed only in the area that overlaps with the module component 43.

[0064] In the above configuration, heat generated in the high heat generation module 40a travels from the sealing body 44 through the module heat dissipation section 70 to the low heat generation module 40b (see the outline arrow in FIG. 6 ), raising the temperature of the low heat generation module 40b. That is, some of the heat generated by the high heat generation module 40a is dissipated using the low heat generation module 40b. By using the low heat generation module 40b for heat dissipation, local temperature increases in the high heat generation module 40a are suppressed. The module heat dissipation section 70 is designed so that the temperature of the low heat generation module 40b is maintained at or below the guaranteed temperature of the module components 43 of the low heat generation module 40b.

[0065] The board heat dissipation portion 78 is made of heat dissipation gel, similar to the board heat dissipation portion 76 (see FIG. 3 ). The board heat dissipation portion 78 is provided between the electronic components 35 mounted on the motherboard 30 and the lower case 26. The board heat dissipation portion 78 is provided in the gap between the bottom wall 27 and the power supply IC 35c mounted on the lower mounting surface 33. The board heat dissipation portion 78 is in close contact with both the top surface of the power supply IC 35c and the inner wall surface of the bottom wall 27 over a wide area. The board heat dissipation portion 78 dissipates heat from the power supply IC 35c by transferring heat generated by the power supply IC 35c to the lower case 26. In addition, by cooling the power supply IC 35c, the board heat dissipation portion 78 contributes to lowering the temperatures of the microcomputer 35a and the power supply IC 35b mounted on the upper mounting surface 32 of the central portion 31c.

[0066] (Summary of First Embodiment) In the first embodiment described so far, the module heat dissipation unit 70 is thermally connected to the input / output modules 40 that require heat dissipation among the input / output modules 40 connected to the motherboard 30. Therefore, even if the configuration of the input / output modules 40 connected to the motherboard 30 changes, it is possible to construct a heat dissipation structure that can accommodate increases and decreases in the amount of heat generated. As a result, the zone ECU 100 can have appropriate cooling performance.

[0067] More specifically, because the zone ECU 100 can be equipped with various functions, the amount of heat generated by its internal components changes as the number of input / output modules 40 increases. In other words, the amount of heat generated by the zone ECU 100 varies depending on the vehicle model and its specifications. However, changing the heat dissipation design for each vehicle model and its specifications requires a significant amount of development time. To address this issue, the zone ECU 100 can accommodate the addition of high-heat-generating components and the expansion of input / output control functions without requiring design changes to the motherboard 30. This prevents insufficient cooling performance and also avoids the need for excessive heat dissipation structures, which would hinder weight reduction of the zone ECU 100.

[0068] Additionally, the zone ECU 100 of the first embodiment includes an internal box 50. The internal box 50 is formed from a material with a higher thermal conductivity than the module main body 41 of the input / output module 40, and defines slots 56 that individually accommodate the input / output modules 40. A module heat dissipation section 70 is provided between an inner wall surface 57 that defines the slot 56 and the input / output module 40 accommodated in the slot 56. With the above configuration, heat generated in the input / output module 40 is transferred to the internal box 50 through the module heat dissipation section 70. As a result, heat from the input / output module 40 can be efficiently dissipated.

[0069] The internal box 50 of the first embodiment includes a non-slot section 51 where no slots 56 are formed, and a slot-forming section 55 adjacent to the non-slot section 51. Among the multiple slots 56 formed in the slot-forming section 55, the inner slot 56a closest to the non-slot section 51 accommodates a high-heat-generating module 40a, which generates a large amount of heat. Meanwhile, among the multiple slots 56 in the slot-forming section 55, the outer slot 56b farther from the non-slot section 51 than the inner slot 56a accommodates a low-heat-generating module 40b. In the internal box 50 described above, the slots 56 closer to the non-slot section 51 have higher cooling performance. Therefore, by accommodating the high-heat-generating module 40a, which requires high heat dissipation, in the inner slot 56a and the low-heat-generating module 40b, which requires low heat dissipation, in the outer slot 56b, it becomes possible to efficiently dissipate heat from multiple input / output modules 40 that generate different amounts of heat.

[0070] Furthermore, the motherboard 30 of the first embodiment is mounted with a microcomputer 35a that generates heat. A board heat dissipation section 76 is provided between the microcomputer 35a and the internal box 50. The addition of this board heat dissipation section 76 enables heat dissipation from the microcomputer 35a mounted on the motherboard 30. Therefore, even if electronic components 35 that generate a large amount of heat are mounted on the motherboard 30, the zone ECU 100 can ensure cooling performance for the motherboard 30.

[0071] Additionally, in the first embodiment, a board heat dissipation section 76 is provided between the microcomputer 35a and the non-slot section 51. The board heat dissipation section 76 transfers heat generated by the microcomputer 35a to the internal box 50. As a result, the heat generated by the microcomputer 35a is dissipated to the internal box 50. As a result, the cooling performance for the motherboard 30 can be reliably ensured.

[0072] Furthermore, in the motherboard 30 of the first embodiment, the heat-generating microcomputer 35a is mounted in the central portion 31c facing the non-slot portion 51. This arrangement of the microcomputer 35a allows for more efficient heat transfer from the microcomputer 35a to the non-slot portion 51, ensuring reliable cooling performance for the motherboard 30.

[0073] Furthermore, in the first embodiment, in a configuration in which the internal box 50 is not provided, the module heat dissipation unit 70 is provided between two input / output modules 40 that generate different amounts of heat. Therefore, the module heat dissipation unit 70 can dissipate heat generated by the high heat generation module 40a, which generates a large amount of heat, to the low heat generation module 40b, which generates a small amount of heat. As a result, even in a configuration in which the internal box 50 is not provided, the zone ECU 100 can have appropriate cooling performance.

[0074] Additionally, the input / output modules 40 of the first embodiment include a communication module 40c that performs communication processing. The module heat dissipation unit 70 is thermally connected to the communication module 40c. This configuration makes it possible to appropriately cool the communication module 40c, which generates a large amount of heat during communication processing.

[0075] Furthermore, the multiple input / output modules 40 of the first embodiment include a power supply module 40p that forms at least a part of the power supply distribution circuit 60p. The module heat dissipation unit 70 is thermally connected to the power supply module 40p. This configuration makes it possible to appropriately cool the power supply module 40p, which generates a large amount of heat due to power distribution.

[0076] Furthermore, the module heat dissipation section 70 of the first embodiment is made of heat dissipation gel. With this configuration, it is possible to easily provide an optimal module heat dissipation section 70 in response to an increase or decrease in the number of input / output modules 40.

[0077] Additionally, in the first embodiment, a retaining groove 71 is formed in at least one of the inner wall surface 57 and the outer wall 41a facing the inner wall surface 57. The retaining groove 71 holds the heat-dissipating gel. As a result, the heat-dissipating gel is less likely to fall out of its correct position due to gravity or vibration. As a result, even if the module heat dissipation portion 70 is formed of heat-dissipating gel, the zone ECU 100 can continue to maintain high cooling performance.

[0078] In the first embodiment, the retaining groove 71 is formed in at least one of the outer peripheral wall portions 41 a of the two input / output modules 40 that face each other across the module heat dissipation portion 70. This makes it difficult for the heat dissipation gel to come off from between the two input / output modules 40. As a result, even in a configuration in which the internal box 50 is not provided, the zone ECU 100 can continue to maintain high cooling performance.

[0079] Furthermore, in the first embodiment, the module heat dissipation section 70 is in contact with the input / output module 40. With this structure, the module heat dissipation section 70 can more directly remove the heat generated in the input / output module 40. As a result, improved cooling performance is achieved.

[0080] Additionally, the input / output module 40 of the first embodiment is connected to one of the powertrain, chassis, body, multimedia, and ADAS systems. Furthermore, the multiple input / output modules 40 are connected to at least two of the powertrain, chassis, body, multimedia, and ADAS systems. Thus, in a zone ECU 100 connected to multiple systems, a configuration employing the module heat dissipation unit 70 described above can effectively contribute to improving cooling performance.

[0081] In the first embodiment, the input / output module 40 to which the module heat dissipation unit 70 is connected is at least one of the power supply module 40p, the communication module 40c, and the MPU module. If the module heat dissipation unit 70 is connected to such a high heat-generating module 40a, it is possible to suppress a local temperature rise in the high heat-generating module 40a.

[0082] In the first embodiment, the high heat generating module 40a is at least one of the power supply module 40p, the communication module 40c, and the MPU module, and the low heat generating module 40b is a general-purpose IO module or an AD input module. As a result, heat dissipation from the multiple input / output modules 40 with different heat values ​​can be more efficiently performed.

[0083] In the above embodiment, the microcomputer 35a corresponds to the "heat-generating component," the input / output module 40 corresponds to the "connection module," the high-heat-generating module 40a corresponds to the "first module," and the low-heat-generating module 40b corresponds to the "second module." The communication module 40c corresponds to the "Ethernet communication module," the outer peripheral wall portion 41a corresponds to the "opposing surface portion," the inner box 50 corresponds to the "accommodation box," and the non-slot portion 51 corresponds to the "non-accommodation portion." The slot-forming portion 55 corresponds to the "adjacent accommodation portion," the inner slot 56a corresponds to the "adjacent slot," the outer slot 56b corresponds to the "remote slot," and the zone ECU 100 corresponds to the "vehicle control device."

[0084] 7 and 8 is a modified example of the first embodiment. In the zone ECU 100 of the second embodiment, even in the configuration in which the internal box 50 is provided, a board heat dissipation portion 78 is provided to transfer heat generated in the power supply IC 35c to the lower case 26. In addition, a cooling flow path 58 is formed in the internal box 50 of the second embodiment.

[0085] The cooling flow path 58 circulates a cooling medium. The cooling medium is a cooling water (coolant) used in the vehicle's cooling system. The cooling flow path 58 is supplied with low-temperature cooling water immediately after passing through a heat exchanger such as an evaporator or chiller. For example, cooling water close to ambient temperature or cooling water cooled to approximately 0 to 10°C is supplied to the cooling flow path 58. The cooling medium passes through a supply hose 85 (see FIG. 7) connected to the upper case 21 and is supplied to a flow path inlet 58a (see FIG. 8) of the cooling flow path 58. The heated cooling medium circulates through the cooling flow path 58 and is discharged from a flow path outlet 58b into a return hose 86 connected to the upper case 21, and is returned to the vehicle's cooling system.

[0086] The cooling flow passage 58 is formed in at least one of the four side surfaces of the internal box 50. The cooling flow passage 58 can be formed in all of the two long side surfaces 54a along the ZX plane and the two short side surfaces 54b along the YZ plane. As an example, the cooling flow passage 58 is formed in the long side surface 54a by connecting multiple U-shaped flow passages (see FIG. 8). The cooling medium cools the internal box 50 by moving upward (in the +Z direction) while repeatedly going back and forth along the X direction.

[0087] The cooling flow passages 58 are defined inside the long side surfaces 54a and the short side surfaces 54b by making the long side surfaces 54a and the short side surfaces 54b double-layered. The cooling flow passages 58 may be formed by piping installed outside the long side surfaces 54a or the short side surfaces 54b. The flow passage width or inner diameter of the cooling flow passages 58 is, for example, about 2 to 3 mm. When cooling flow passages 58 are provided on multiple side surfaces, the cooling flow passages 58 on each side surface may be continuous or may be separate systems. The cooling flow passages 58 can also be formed between two slots 56, in the non-slot portion 51, etc.

[0088] The second embodiment described so far also has the same effects as the first embodiment, and it is possible to construct a heat dissipation structure that can accommodate the increase or decrease in the amount of heat generated, even if the configuration of the input / output module 40 is changed. As a result, the zone ECU 100 can have appropriate cooling performance.

[0089] Additionally, the internal box 50 of the second embodiment is formed with cooling channels 58 for circulating a cooling medium. This circulation of the cooling medium allows the internal box 50 to maintain a low temperature. Therefore, heat generated in the input / output module 40 is easily transferred to the internal box 50 through the module heat dissipation section 70. As a result, heat from the input / output module 40 can be dissipated efficiently.

[0090] Third Embodiment The third embodiment shown in FIG. 9 is another modified example of the first embodiment. The zone ECU 100 of the third embodiment differs from the first embodiment in the number of module connectors 37 provided on the motherboard 30 and the number of slots 56 provided on the internal box 50. Two module connectors 37 are mounted on each side of the central portion 31c of the motherboard 30 in the X direction. Two slots 56 are formed in each slot forming portion 55 of the internal box 50. All slots 56 of the internal box 50 house input / output modules 40. In other words, there are no empty slots 56e (see FIG. 3) in the internal box 50.

[0091] A module heat dissipation section 70 made of potting material is formed between the inner wall surface 57 of the slot 56 and the outer peripheral wall 41a of the input / output module 40. The potting material contained in the module heat dissipation section 70 is a protective material primarily composed of polymer materials such as epoxy resin, silicone resin, urethane resin, and urethane resin. The thermal conductivity of the potting material (e.g., approximately 1.0 to 1.5 W / m·K) is lower than that of the heat dissipation gel. Meanwhile, the thermal conductivity of the potting material is higher than that of the seal 44. Therefore, heat generated by the input / output module 40 moves to components with higher thermal conductivity, raising the temperature of the internal box 50. As a result, the input / output module 40 is efficiently cooled.

[0092] The potting material is filled in an uncured, viscous state into the slot 56 housing the input / output module 40. The potting material penetrates into the gap between the inner wall surface 57 and the outer peripheral wall 41a and hardens within this gap. A retaining groove 71 may be formed in at least one of the inner wall surface 57 and the outer peripheral wall 41a. Compared to heat-dissipating gel, the potting material has superior mechanical properties, such as vibration resistance, impact resistance, vibration isolation, waterproofing, and heat resistance. Therefore, the module heat dissipation section 70 made of the potting material physically protects the input / output module 40 while insulating the module main body 41 from the inner wall surface 57.

[0093] Here, the input / output module 40 does not necessarily have to be formed with the sealing body 44. In this configuration, the potting material is filled into the slot 56 that houses the input / output module 40. The potting material thermally connects the module board 42 and module components 43 to the inner wall surface portion 57. Even in this configuration, the module heat dissipation portion 70 can protect the module board 42 and module components 43 while dissipating the heat generated therefrom to the internal box 50.

[0094] In the embodiment shown in FIG. 10 , in which the internal box 50 is omitted, a module heat dissipation unit 70 made of heat dissipation gel is provided between two adjacent input / output modules 40, as in the first embodiment. The module heat dissipation unit 70 thermally connects the power supply module 40p, which is the high heat-generating module 40a, to the low heat-generating module 40b adjacent to the power supply module 40p. The module heat dissipation unit 70 enables heat dissipation from the high heat-generating module 40a to the low heat-generating module 40b (see the hollow arrow in FIG. 6 ). The module heat dissipation unit 70 may also thermally connect the communication module 40c, which is the high heat-generating module 40a, to another input / output module 40 adjacent to the communication module 40c. With this configuration, heat generated by the high heat-generating module 40a is released into the air from both the high heat-generating module 40a and the low heat-generating module 40b, thereby suppressing a temperature rise in the high heat-generating module 40a.

[0095] The third embodiment described so far also has the same effects as the first embodiment, and it is possible to construct a heat dissipation structure that can accommodate the increase or decrease in the amount of heat generated even if the configuration of the input / output module 40 is changed. As a result, the zone ECU 100 can have appropriate cooling performance.

[0096] Additionally, the module heat dissipation section 70 of the third embodiment is made of potting material. With this configuration, the module heat dissipation section 70 can protect the input / output module 40 while dissipating heat from the input / output module 40 to the internal box 50.

[0097] (Fourth Embodiment) The fourth embodiment shown in Fig. 11 is yet another modification of the first embodiment. The module heat dissipation section 70 of the fourth embodiment includes a first heat dissipation section 70a and a second heat dissipation section 70b. The first heat dissipation section 70a is made of a potting material, similar to the module heat dissipation section 70 of the third embodiment. The first heat dissipation section 70a seals the entire module substrate 42 and module components 43, as well as parts of the external connection terminals 45 and the substrate connection terminals 49, in place of the sealing body 44 (see Fig. 5).

[0098] The second heat dissipation section 70b is made of heat dissipation gel, similar to the module heat dissipation section 70 of the first embodiment. The heat dissipation gel is applied to the outer surface of the hardened first heat dissipation section 70a. The input / output module 40 is inserted into the corresponding slot 56 with the heat dissipation gel applied to the first heat dissipation section 70a. The second heat dissipation section 70b is located in the gap between the first heat dissipation section 70a and the inner wall surface section 57, and effectively transfers heat generated by the input / output module 40 from the first heat dissipation section 70a to the inner wall surface section 57 (see the hollow arrow in FIG. 11 ).

[0099] The fourth embodiment described so far also achieves the same effects as the first embodiment, in that heat generated in the input / output module 40 moves sequentially to components with high thermal conductivity, raising the temperature of the internal box 50. In other words, the heat generated in the input / output module 40 can be effectively dissipated. Furthermore, even if the configuration of the input / output module 40 changes, a heat dissipation structure can be constructed that can accommodate changes in the amount of heat generated. As a result, the zone ECU 100 can have appropriate cooling performance.

[0100] Additionally, the module heat dissipation section 70 of the fourth embodiment includes a first heat dissipation section 70 a and a second heat dissipation section 70 b. With this configuration, even if the input / output module 40 is not protected by the sealing body 44, the module heat dissipation section 70 can protect the input / output module 40 while dissipating heat to the internal box 50.

[0101] (Other Embodiments) Although multiple embodiments of the present disclosure have been described above, the present disclosure should not be construed as being limited to the above-described embodiments, and can be applied to various embodiments and combinations within the scope that does not deviate from the gist of the present disclosure.

[0102] In a first modification of the above embodiment, the motherboard 30 and the input / output module 40 are connected by press-fit. In this first modification, a module heat dissipation section 70 is provided at the connection between the motherboard 30 and the input / output module 40. Heat generated in the input / output module 40 is transferred to the motherboard 30 through the module heat dissipation section 70. As a result, the cooling performance of the input / output module 40 is improved.

[0103] In the above embodiment, the upper case 21 is formed of a resin material because it is necessary to provide the case connector 23 on the upper case 21. In contrast, in Modification 2 of the above embodiment, the upper case 21 is not provided with the case connector 23. Therefore, the upper case 21, like the case connector 23, is formed of aluminum die-cast or the like. Modification 2 includes a box heat dissipation section that thermally connects the upper surface of the non-slot section 51 to the upper case 21. The box heat dissipation section is made of heat dissipation gel, similar to the module heat dissipation section 70. Heat transferred from the input / output module 40 to the internal box 50 is transferred to the upper case 21 through the box heat dissipation section and released from the upper case 21 into the surrounding air. As a result, the cooling performance of the input / output module 40 is improved.

[0104] In the third modification of the above embodiment, a heat sink consisting of an array of numerous thin plate-like fins or numerous pins is formed in the internal box 50. An opening that exposes the heat sink to the outside of the housing 20 is formed in the top wall 22 or the upper side wall 24 of the upper case 21 made of a resin material. With this configuration, the internal box 50 can radiate heat to the air outside the housing 20 from the heat sink exposed to the outside of the housing 20. This improves the cooling performance of the input / output module 40.

[0105] In a fourth modification of the above embodiment, a housing heat dissipation section made of a metal material is provided in a portion of the upper case 21 made of a resin material. The housing heat dissipation section is formed on at least one of the top wall 22 or the upper side wall 24 of the upper case 21. A heat sink may be formed on the outer surface of the housing heat dissipation section. The housing heat dissipation section is thermally connected to the internal box 50 via a box heat dissipation section made of heat dissipation gel. The internal box 50 can dissipate heat to the air outside the housing 20 via the housing heat dissipation section. As a result, the cooling performance of the input / output module 40 is improved.

[0106] In Modification 5 of the above embodiment, the slot-forming portion 55 is formed on only one side of the non-slot portion 51. As in Modification 5, the configuration of the slot-forming portion 55 may be changed as appropriate. In addition, the low heat-generating module 40b may be arranged in the inner slot 56a closest to the non-slot portion 51, and the high heat-generating module 40a may be arranged in the outer slot 56b farther from the non-slot portion 51. Furthermore, as long as the heat capacity of the non-slot portion 51 can be ensured, the non-slot portion 51 may have a hollowed-out shape.

[0107] In a sixth modification of the above embodiment, a module heat dissipation section 70 made of a heat dissipation sheet is provided between the outer peripheral wall section 41a and the inner wall surface section 57. In a seventh modification of the above embodiment, board heat dissipation sections 76, 78 made of a heat dissipation sheet are provided between the electronic component 35 and the inner box 50 or the lower case 26. The board heat dissipation sections 76, 78 may be omitted as appropriate. The formation of the holding groove 71 may also be omitted as appropriate.

[0108] In the eighth modification of the above embodiment, in addition to the microcomputer 35a, the power supply IC 35b is a heat-generating component that is thermally connected to the cooling wall surface portion 53 by the board heat dissipation portion 76. In the eighth modification, the central bottom wall 52 is provided with irregularities to absorb the differences in height of the plurality of electronic components 35.

[0109] In the second embodiment, the internal box 50 is cooled using cooling water. However, the cooling medium used to cool the internal box 50 may be changed as appropriate. For example, the zone ECU 100 in the ninth modification of the embodiment has a cooling system independent of the vehicle's cooling system. The cooling water supplied to the cooling flow path 58 of the internal box 50 is cooled by a dedicated heat exchanger provided in the zone ECU 100. Furthermore, in the tenth modification of the embodiment, the cooling medium used in the vehicle air conditioner is supplied to the cooling flow path 58. The internal box 50 can be cooled by the cooling medium of the vehicle air conditioner.

[0110] In the above embodiment, the same zone ECU 100 can be used in both a configuration that includes the internal box 50 and a configuration that does not include the internal box 50. However, the zone ECU 100 may be configured only in a configuration that includes the internal box 50, or may be configured only in a configuration that does not include the internal box 50.

[0111] The specific configurations of the electronic components 35 and module components 43 in the above embodiment may be modified as appropriate. Each component may be configured as a circuit formed by combining multiple semiconductor chips. The specific configurations of the communication circuit 60c and power distribution circuit 60p in the above embodiment may also be modified as appropriate. Each circuit may be configured as a single semiconductor chip.

[0112] Furthermore, the microcomputer 35a in the above embodiment is not limited to a configuration mainly composed of a CPU. For example, a microcomputer 35a mainly composed of an MPU, a graphics processing unit (GPU), a data flow processor (DFP), or the like may be mounted on the motherboard 30. In addition, electronic components 35 such as SoCs, ASICs, and FPGAs may be mounted on the motherboard 30 and each input / output module 40 as appropriate. SoCs are System on Chip, ASICs are Application Specific Integrated Circuits, and FPGAs are Field-Programmable Gate Arrays.

[0113] (Disclosure of Technical Ideas) This specification discloses multiple technical ideas described in the following multiple clauses. Some clauses may be described in a multiple dependent form, with the subsequent clause alternatively referring to the preceding clause. Furthermore, some clauses may be described in a multiple dependent form, with the subsequent clause referring to another multiple dependent clause. These multiple dependent clauses define multiple technical ideas.

[0114] (Technical Idea 1) A vehicle control device having a gateway function, comprising: a motherboard (30), a plurality of connection modules (40) electrically connected to the motherboard, a power distribution circuit (60p) that distributes power, and a module heat dissipation unit (70) thermally connected to at least one of the connection modules and that dissipates heat generated in the connection module. (Technical Idea 2) The vehicle control device according to Technical Idea 1, further comprising: a housing box (50) that forms slots (56) that individually accommodate the connection modules and is formed from a material that has a higher thermal conductivity than the module heat dissipation unit, wherein the module heat dissipation unit is provided between an inner wall surface portion (57) that partitions the slots and the connection modules accommodated in the slots. (Technical Idea 3) The storage box includes a non-accommodation portion (51) where no slot is formed, and an adjacent storage portion (55) where a plurality of the slots are formed and adjacent to the non-accommodation portion, and the connection module accommodated in an adjacent slot (56a) of the plurality of slots in the adjacent storage portion that is closest to the non-accommodation portion is defined as a first module (40a), and the connection module accommodated in a remote slot (56b) of the plurality of slots in the adjacent storage portion that is farther from the non-accommodation portion than the adjacent slot is defined as a second module (40b), the amount of heat generated by the first module is greater than the amount of heat generated by the second module. (Technical Idea 4) The vehicle control device according to Technical Idea 2 or 3, wherein a heat-generating component (35a) is mounted on the motherboard, and further comprising a board heat dissipation unit (76) provided between the heat-generating component and the storage box. (Technical Idea 5) The vehicle control device according to Technical Idea 2, wherein the storage box includes a central non-storage portion (51) where the slots are not formed, and an adjacent storage portion (55) where a plurality of the slots are formed and located outside the non-storage portion, and the motherboard is mounted with a heat-generating component (35a), and further includes a board heat dissipation portion (76) provided between the heat-generating component and the non-storage portion and which transfers heat generated by the heat-generating component to the storage box.(Technical Idea 6) The vehicle control device according to Technical Idea 5, wherein the heat-generating component is mounted on a central portion (31c) of the motherboard facing the non-accommodated portion. (Technical Idea 7) The vehicle control device according to any one of Technical Ideas 2 to 6, wherein the accommodation box forms a cooling flow path (58) for circulating a cooling medium. (Technical Idea 8) The vehicle control device according to Technical Idea 1, wherein the module heat dissipation unit is provided between two of the connection modules having different heat generation amounts. (Technical Idea 9) The vehicle control device according to any one of Technical Ideas 1 to 8, wherein the plurality of connection modules include a communication module (40c) that performs communication processing, and the module heat dissipation unit is thermally connected to the communication module. (Technical Idea 10) The vehicle control device according to any one of Technical Ideas 1 to 9, wherein the plurality of connection modules include a power supply module (40p) that forms at least a part of the power distribution circuit, and the module heat dissipation unit is thermally connected to the power supply module. (Technical Idea 11) The vehicle control device according to any one of Technical Ideas 1 to 10, wherein the module heat dissipation portion includes a heat dissipation gel or a potting material. (Technical Idea 12) The vehicle control device according to any one of Technical Ideas 2 to 7, wherein the module heat dissipation portion is made of a heat dissipation gel, and a holding groove (71) for holding the heat dissipation gel is formed on at least one of the inner wall surface portion and the opposing surface portion (41a) of the connection module that faces the inner wall surface portion. (Technical Idea 13) The vehicle control device according to Technical Idea 8, wherein the module heat dissipation portion is made of a heat dissipation gel, and a holding groove (71) for holding the heat dissipation gel is formed on at least one of the opposing surface portions (41a) of the two connection modules that face each other across the module heat dissipation portion. (Technical Idea 14) The vehicle control device according to any one of Technical Ideas 1 to 13, wherein the module heat dissipation portion is in contact with the connection module.(Technical Idea 15) The vehicle control device according to any one of Technical Ideas 1 to 14, wherein the connection module is connected to one device of a powertrain system, a chassis system, a body system, a multimedia system, and an ADAS system, and the plurality of connection modules are connected to devices of at least two types of systems of the powertrain system, the chassis system, the body system, the multimedia system, and the ADAS system. (Technical Idea 16) The vehicle control device according to any one of Technical Ideas 1 to 15, wherein the connection module to which the module heat dissipation unit is connected is at least one of a power supply module (40p), an Ethernet communication module, and an MPU module.

Claims

1. A vehicle control device having a gateway function, A motherboard (30), a plurality of connection modules (40) electrically connected to the motherboard; a power distribution circuit (60p) that distributes power; a module heat dissipation section (70) that is thermally connected to at least one of the connection modules and dissipates heat generated in the connection module; a housing box (50) that has slots (56) for individually housing the connection modules and is made of a material with a higher thermal conductivity than the module heat dissipation portion; The module heat dissipation portion is provided between an inner wall surface portion (57) that defines the slot and the connection module accommodated in the slot.

2. The storage box includes a non-storage portion (51) in which the slot is not formed, and an adjacent storage portion (55) in which a plurality of the slots are formed and adjacent to the non-storage portion, The connection module accommodated in the adjacent slot (56a) closest to the non-accommodated portion among the plurality of slots of the adjacent accommodation portion is designated as a first module (40a), If the connection module accommodated in a remote slot (56b) among the plurality of slots in the adjacent accommodation portion that is farther from the non-accommodated portion than the adjacent slot is designated as a second module (40b), The vehicle control device according to claim 1 , wherein the amount of heat generated by the first module is greater than the amount of heat generated by the second module.

3. A heat-generating component (35a) is mounted on the motherboard, The vehicle control device according to claim 2, further comprising a board heat dissipation portion (76) provided between the heat generating component and the housing box.

4. The storage box includes a central non-storage portion (51) in which the slots are not formed, and an adjacent storage portion (55) in which a plurality of the slots are formed and which is located outside the non-storage portion, A heat-generating component (35a) is mounted on the motherboard, The vehicle control device according to claim 1, further comprising a board heat dissipation section (76) provided between the heat generating component and the non-container portion, for transferring heat generated by the heat generating component to the containment box.

5. 5. The vehicle control device according to claim 4, wherein the heat-generating component is mounted on a central portion (31c) of the motherboard facing the non-accommodated portion.

6. The vehicle control device according to claim 1, wherein the housing box forms a cooling passage (58) for circulating a cooling medium.

7. A vehicle control device having a gateway function, A motherboard (30), a plurality of connection modules (40) electrically connected to the motherboard; a power distribution circuit (60p) that distributes power; a module heat dissipation section (70) that is thermally connected to at least one of the connection modules and dissipates heat generated in the connection module; The module heat dissipation unit is provided between two of the connection modules that have different heat generation amounts.

8. The plurality of connection modules include a communication module (40c) that performs communication processing, The vehicle control device according to claim 1 or 7, wherein the module heat dissipation section is thermally connected to the communication module.

9. The plurality of connection modules includes a power supply module (40p) that forms at least a part of the power distribution circuit; The vehicle control device according to claim 1 or 7, wherein the module heat dissipation section is thermally connected to the power supply module.

10. The vehicle control device according to claim 1 or 7, wherein the module heat dissipation portion is made of a heat dissipation gel or a potting material.

11. the module heat dissipation part is made of heat dissipation gel, A vehicle control device as described in claim 1, wherein a retaining groove (71) for retaining the heat dissipation gel is formed in at least one of the inner wall surface portion and the opposing surface portion (41a) that faces the inner wall surface portion in the connection module.

12. the module heat dissipation part is made of heat dissipation gel, A vehicle control device as described in claim 7, wherein a holding groove (71) for holding the heat dissipation gel is formed on at least one of the opposing surface portions (41a) of the two connection modules that face each other across the module heat dissipation portion.

13. The vehicle control device according to claim 1 or 7, wherein the module heat dissipation portion is in contact with the connection module.

14. the connection module is connected to one of a powertrain system, a chassis system, a body system, a multimedia system, and an ADAS system; 10. The vehicle control device according to claim 1, wherein the plurality of connection modules are connected to devices of at least two systems selected from a powertrain system, a chassis system, a body system, a multimedia system, and an ADAS system.

15. The vehicle control device according to claim 1 or 7, wherein the connection module to which the module heat dissipation section is connected is at least one of a power supply module (40p), an Ethernet communication module, and an MPU module.

16. the first module is at least one of a power supply module (40p), an Ethernet communication module, and an MPU module; The vehicle control device according to claim 2 , wherein the second module is a general-purpose IO module or an AD input module.