Multilayer ceramic capacitor

Abstract

Provided is a multilayer ceramic capacitor that can reduce ESL.　A multilayer ceramic capacitor 1 includes: end surface internal electrodes 20 that are exposed at both end surfaces C of a layered body 2; and side surface internal electrodes 50 that are exposed at both side surfaces B. The multilayer ceramic capacitor 1 is configured such that when a straight line that passes through a center part in the length direction L of the layered body 2 and a center part in the width direction W of the layered body 2 and extends parallel to the layering direction T is a reference line SL, the end surface internal electrode 20 that is closest to a first principal surface AA is a first outermost end surface internal electrode 20A, the distance along the reference line SL between the first outermost end surface internal electrode 20A and the first principal surface AA is a1, and the distance along a first end surface CA between one end part in the width direction W of the first outermost end surface internal electrode 20A and the first principal surface AA is b1, b1<a1.

Description

Multilayer ceramic capacitors

[0001] The present invention relates to a multilayer ceramic capacitor.

[0002] There is a multi-terminal multilayer ceramic capacitor that includes a laminate in which dielectric layers each having an internal electrode exposed at an end face of the laminate and a dielectric layer each having an internal electrode exposed at a side face of the laminate are alternately stacked, and includes end face external electrodes arranged on the end faces and side face external electrodes arranged on the side faces (see, for example, Patent Document 1). With this configuration, it is possible to reduce the equivalent series inductance (ESL) of the multilayer ceramic capacitor.

[0003] JP 2016-127262 A

[0004] However, as the distance between the internal electrodes and the mounting surface increases, the ESL increases, and to further reduce the ESL, it was necessary to shorten the distance between the internal electrodes and the mounting surface in order to shorten the current path.

[0005] An object of the present invention is to provide a multilayer ceramic capacitor capable of reducing ESL.

[0006] In order to achieve the above object, a multilayer ceramic capacitor according to the present invention comprises a laminate including a plurality of laminated dielectric layers and a plurality of internal electrodes respectively disposed on the plurality of dielectric layers, the laminate having first and second main surfaces opposing each other in a lamination direction, a first side surface and a second side surface opposing each other in a width direction perpendicular to the lamination direction, and a first end surface and a second end surface opposing each other in a length direction perpendicular to the lamination direction and the width direction, end surface external electrodes arranged in pairs on each of the end surfaces, and side surface external electrodes arranged in pairs on each of the side surfaces, the plurality of internal electrodes being end surface internal electrodes exposed on both the first end surface and the second end surface. and a side surface internal electrode exposed on both the first side surface and the second side surface, wherein a straight line that passes through a center portion in the length direction of the laminate and a center portion in the width direction of the laminate is taken as a reference line, the end surface internal electrode that is closest to the first main surface is taken as a first outermost end surface internal electrode, a distance on the reference line between the first outermost end surface internal electrode and the first main surface is taken as a1, and a distance on the first end surface between one end of each end portion in the width direction of the first outermost end surface internal electrode and the first main surface is taken as b1, where b1<a1.

[0007] According to the present invention, it is possible to provide a multilayer ceramic capacitor capable of reducing ESL.

[0008] 1. A schematic perspective view of a multilayer ceramic capacitor 1 in accordance with the first embodiment. A cross-sectional view of the multilayer ceramic capacitor 1 in accordance with the first embodiment taken along the II-II direction in FIG. 1. A cross-sectional view of the multilayer ceramic capacitor 1 in accordance with the first embodiment taken along the III-III direction in FIG. 1. A side view of the laminate 2 in accordance with the first embodiment, viewed from the first end face CA side. A side view of the laminate 2 in accordance with the first embodiment, viewed from the second end face CB side. A side view of the laminate 2 in accordance with the first embodiment, viewed from the first side face BA side. A side view of the laminate 2 in accordance with the first embodiment, viewed from the second side face BB side. A view showing a ceramic green sheet on which a conductive paste for an end face internal electrode 20 is disposed. A view showing a ceramic green sheet on which a conductive paste for a side face internal electrode 50 is disposed. A view showing a state in which a dielectric paste is applied onto the ceramic green sheet of FIG. 8 during the manufacture of the multilayer ceramic capacitor 1 in accordance with the first embodiment. A view showing a state in which a dielectric paste is applied onto the ceramic green sheet of FIG. 9 during the manufacture of the multilayer ceramic capacitor 1 in accordance with the first embodiment. A conceptual diagram illustrating the stacking state in a mother block in accordance with the first embodiment. A schematic perspective view of a multilayer ceramic capacitor 100 in accordance with a second embodiment. 13A and 13B are cross-sectional views of the multilayer ceramic capacitor 100 according to the second embodiment taken along the XIV-XIV direction in FIG. 13. FIG. 13A is a cross-sectional view of the multilayer ceramic capacitor 100 according to the second embodiment taken along the XV-XV direction in FIG. 13. FIG. 13B is a side view of the laminate 102 according to the second embodiment taken from the first end face CA. FIG. 13C is a side view of the laminate 102 according to the second embodiment taken from the second end face CB. FIG. 13D is a side view of the laminate 102 according to the second embodiment taken from the first side face BA. FIG. 13D is a side view of the laminate 102 according to the second embodiment taken from the second side face BB. FIG. 13C is a diagram illustrating a state in which a dielectric paste is applied onto the ceramic green sheets of FIG. 8 during the manufacture of the multilayer ceramic capacitor 1 according to the second embodiment. FIG. 13D is a conceptual diagram illustrating the stacking state in the mother block according to the second embodiment.

[0009] First Embodiment A multilayer ceramic capacitor 1 according to a first embodiment of the present invention will be described below. First, the configuration of the multilayer ceramic capacitor 1 will be described with reference to FIGS.

[0010] (Multilayer Ceramic Capacitor 1) As shown in Fig. 1, the multilayer ceramic capacitor 1 includes a laminate 2 and a plurality of external electrodes 3. The multilayer ceramic capacitor 1 is a so-called three-terminal multilayer ceramic capacitor. The multilayer ceramic capacitor 1 is mounted on a mounting substrate (not shown) for use.

[0011] The dimension of the multilayer ceramic capacitor 1 in the stacking direction T is preferably 0.2 mm or more and 2.8 mm or less, the dimension in the length direction L is preferably 0.6 mm or more and 3.5 mm or less, and the dimension in the width direction W is preferably 0.3 mm or more and 2.8 mm or less.

[0012] (Laminate 2) The laminate 2 has a substantially rectangular parallelepiped shape. All outer surfaces of the laminate 2 are flat. It is preferable that the corners (i.e., the portions where three surfaces of the laminate intersect) and ridges (i.e., the portions where two surfaces of the laminate intersect) of the laminate 2 are rounded. The laminate 2 has an inner layer portion 11 in which dielectric layers 14 and internal electrodes 15 are stacked, and outer layer portions 12 arranged on both sides of the inner layer portion 11 in the stacking direction T.

[0013] In this specification, the term indicating the orientation of the multilayer ceramic capacitor 1 refers to the direction in which the dielectric layers 14 and the internal electrodes 15 are stacked in the multilayer ceramic capacitor 1 as the stacking direction T. The direction that intersects with the stacking direction T and in which the pair of end face external electrodes 30 are provided is referred to as the length direction L. The direction that intersects with both the length direction L and the stacking direction T is referred to as the width direction W. In the embodiment, the stacking direction T, the length direction L, and the width direction W are perpendicular to one another.

[0014] Furthermore, of the six outer surfaces of the laminate 2, a pair of outer surfaces provided on both sides in the stacking direction T is referred to as a first main surface AA and a second main surface AB, a pair of outer surfaces extending in the stacking direction T and provided on both sides in the width direction W is referred to as a first side surface BA and a second side surface BB, and a pair of outer surfaces extending in the stacking direction T and provided on both sides in the length direction L is referred to as a first end surface CA and a second end surface CB. When there is no particular need to distinguish between them, the first main surface AA and the second main surface AB may be collectively referred to as "respective main surfaces A," the first side surface BA and the second side surface BB may be collectively referred to as "respective side surfaces B," and the first end surface CA and the second end surface CB may be collectively referred to as "respective end surfaces C."

[0015] The cross section in Fig. 2 is parallel to the length direction L and the stacking direction T and passes through the center of the width direction W of the laminate 2. The cross section in Fig. 3 is parallel to the width direction W and the stacking direction T and passes through the center of the length direction L of the laminate 2.

[0016] A straight line extending parallel to the stacking direction T and passing through the center of the laminate 2 in the length direction L and the center of the laminate 2 in the width direction W is defined as a reference line SL.

[0017] 2 and 3, the inner layer portion 11 has a substantially rectangular parallelepiped shape. The inner layer portion 11 is configured by alternately stacking dielectric layers 14 and internal electrodes 15.

[0018] (Dielectric Layer 14) The dielectric layer 14 is made of a ceramic material. For example, a dielectric ceramic containing BaTiO3 as a main component may be used. Alternatively, the ceramic material may be one containing the main component and at least one of a manganese compound, an iron compound, a chromium compound, a cobalt compound, a nickel compound, or the like.

[0019] (Internal Electrode 15) The internal electrode 15 is preferably made of a metal material such as Ni, Cu, Ag, Pd, an Ag-Pd alloy, or Au.

[0020] The internal electrodes 15 include end surface internal electrodes 20 exposed on both the first end surface CA and the second end surface CB, and side surface internal electrodes 50 exposed on both the first side surface BA and the second side surface BB. The end surface internal electrodes 20 and the side surface internal electrodes 50 are arranged alternately.

[0021] (End Face Internal Electrode 20) The end face internal electrode 20 extends between both end faces C in the length direction L of the laminate 2, and is spaced a certain distance from both side faces B in the width direction W. The end face internal electrode 20 has a first opposing portion 20a facing the side face internal electrode 50 adjacent to it in the stacking direction T, and first lead portions 20b drawn from the first opposing portion 20a and exposed at each of the two end faces C. More specifically, the first opposing portion 20a is located in the center between the both end faces C. The end face internal electrode closest to the first main face AA is referred to as the first outermost end face internal electrode 20A, and the end face internal electrode closest to the second main face AB is referred to as the second outermost end face internal electrode 20B.

[0022] (Side surface internal electrode 50) The side surface internal electrode 50 has a dimension in the width direction W that is slightly smaller than that of the laminate 2, and is spaced apart from both end faces C. The side surface internal electrode 50 has a second opposing portion 50a that faces the end face internal electrode 20 adjacent to it in the stacking direction T, and second lead portions 50b that are drawn out from the second opposing portion 50a and exposed on each of the two side faces B. More specifically, the second opposing portion 50a is located in the center between the two side faces B. The side surface internal electrode 50 closest to the first main surface AA is referred to as the first outermost surface internal electrode 50A, and the side surface internal electrode 50 closest to the second main surface AB is referred to as the second outermost surface internal electrode 50B.

[0023] Furthermore, when there is no particular need to distinguish between them, the first opposing portion 20a and the second opposing portion 50a may be collectively referred to as "each opposing portion 21, 51," and the first drawn-out portion 20b and the second drawn-out portion 50b may be collectively referred to as "each drawn-out portion 22, 52."

[0024] (Outer Layer Portion 12) The outer layer portion 12 is a dielectric layer having a constant thickness. The outer layer portion 12 may be made of the same material as the dielectric layer 14 of the inner layer portion 11, or may be made of a different material.

[0025] The dimension of each outer layer portion 12 in the stacking direction T is preferably 10 μm or more and 100 μm or less. One method for measuring the dimension of each outer layer portion 12 in the stacking direction T is, for example, to observe, using a scanning electron microscope, an LT cross section near the center of the width direction W of the laminate exposed by polishing. Furthermore, due to curvature of the internal electrodes 15, the dimension of each outer layer portion 12 in the stacking direction T may vary depending on the measurement position. Therefore, the dimension of each outer layer portion 12 in the stacking direction T is calculated as the average value of measurements taken at multiple locations in the length direction L. For example, this value can be calculated by setting four points equidistantly spaced in the length direction L and averaging the measurements at each point.

[0026] (External electrodes 3) The multiple external electrodes 3 include end surface external electrodes 30 arranged in pairs on each end surface C, and side surface external electrodes 40 arranged in pairs on each side surface B. The end surface external electrodes 30 include a first end surface external electrode 30A arranged on the first end surface CA, and a second end surface external electrode 30B arranged on the second end surface CB. The side surface external electrode 40 includes a first side surface external electrode 40A arranged on the first side surface BA, and a second side surface external electrode 40B arranged on the second side surface BB.

[0027] (End Surface External Electrode 30) A first lead portion 20b is connected to each end surface external electrode 30. Each end surface external electrode 30 covers not only each end surface C but also a portion of each main surface A and each side surface B on the end surface C side. Each end surface external electrode 30 includes a base electrode layer 31 and a plating layer 32 disposed on the base electrode layer 31. The base electrode layer 31 contains, for example, Cu. The plating layer 32 includes a Ni (nickel) plating layer 321 disposed on the base electrode layer 31 and a Sn (tin) plating layer 322 disposed on the Ni plating layer 321. The base electrode layer 31 may contain Ni. A conductive resin layer may be disposed between the base electrode layer 31 and the plating layer 32.

[0028] (Side surface external electrode 40) A second lead portion 50b is connected to each side surface external electrode 40. Each side surface external electrode 40 covers not only the side surface B but also a portion of the side surface B side of the main surface A. Each side surface external electrode 40 includes a base electrode layer 41 and a plating layer 42 disposed on the base electrode layer 41. The base electrode layer 41 contains, for example, Cu. The plating layer 42 includes a Ni (nickel) plating layer 421 disposed on the base electrode layer 41 and a Sn (tin) plating layer 422 disposed on the Ni plating layer 421. Note that the base electrode layer 41 may contain Ni.

[0029] (Regarding Curvature of End Face Internal Electrode 20) Here, at least some of the end face internal electrodes 20 among the plurality of end face internal electrodes 20 are curved in the lamination direction T.

[0030] First, the region on the first main surface AA side of the first end face CA side will be described. As shown in Fig. 3, the center portion of the first outermost end face internal electrode 20A in the width direction W on the first end face CA is farther from the first main surface AA than the portion of the first outermost end face internal electrode 20A on the reference line SL. Therefore, if the distance on the reference line SL between the first outermost end face internal electrode 20A and the first main surface AA is a1 and the distance on the reference line SL between the center portion of the first outermost end face internal electrode 20A in the width direction on the first end face CA and the first main surface AA is c1, then a1 < c1.

[0031] 4, on the first end face CA, at least one of the ends in the width direction W of the first outermost end face internal electrode 20A is closer to the first main surface AA than the center of the width direction W of the first outermost end face internal electrode 20A. More specifically, on the first end face CA, all of the ends in the width direction W of the first outermost side surface internal electrode 50A are closer to the first main surface AA than the center of the width direction W of the first outermost end face internal electrode 20A. In addition, the first main surface AA is a flat surface. Therefore, when the distance between one of the ends in the width direction W of the first outermost end face internal electrode 20A on the first end face CA and the first main surface AA is b1, b1≦c1 holds, or more specifically, b1<c1 holds.

[0032] At least one end (more specifically, both ends) of the first outermost end surface internal electrode 20A on the first end face CA in the width direction W is closer to the first main surface AA than the portion of the first outermost end surface internal electrode 20A on the reference line SL. Therefore, b1<a1.

[0033] Next, the region on the second main surface AB side of the first end face CA side will be described. The center portion of the second outermost end face internal electrode 20B on the first end face CA in the width direction W is farther from the second main surface AB than the portion of the second outermost end face internal electrode 20B on the reference line SL (see FIG. 3). Therefore, if the distance on the reference line SL between the second outermost end face internal electrode 20B and the second main surface AB is a2 and the distance on the reference line SL between the center portion of the second outermost end face internal electrode 20B on the first end face CA in the width direction and the second main surface AB is c2, then a2<c2.

[0034] On the first end face CA, at least one end (more specifically, both ends) of the second outermost end face internal electrode 20B in the width direction W is closer to the second main surface AB than the center of the second outermost end face internal electrode 20B in the width direction W (see FIG. 3 ). The second main surface AB is a flat surface. Therefore, when the distance between one end of the second outermost end face internal electrode 20B in the width direction W on the first end face CA and the second main surface AB is defined as b2, b2≦c2 holds, or more specifically, b2<c2 holds.

[0035] At least one end (more specifically, both ends) of the second outermost end surface internal electrode 20B on the first end face CA in the width direction W is closer to the second main surface AB than the portion of the second outermost end surface internal electrode 20B on the reference line SL. Therefore, b2<a2.

[0036] Next, the region on the first main surface AA side of the second end surface CB will be described. The center of the first outermost end surface internal electrode 20A in the width direction W on the second end surface CB is farther from the first main surface AA than the portion of the first outermost end surface internal electrode 20A on the reference line SL (see FIG. 3). Therefore, when the distance between the center of the first outermost end surface internal electrode 20A in the width direction on the second end surface CB and the first main surface AA is c3, a1<c3.

[0037] 5 , on the second end face CB, at least one end (more specifically, both ends) of each end in the width direction W of the first outermost end face internal electrode 20A is closer to the first main surface AA than the center of the first outermost end face internal electrode 20A in the width direction W. Therefore, when the distance between one end of each end in the width direction W of the first outermost end face internal electrode 20A on the second end face CB and the first main surface AA is b3, b3≦c3 holds, more specifically, b3<c3 holds.

[0038] At least one end (more specifically, both ends) of the first outermost end surface internal electrode 20A on the second end face CB in the width direction W is closer to the first main surface AA than the portion of the first outermost end surface internal electrode 20A on the reference line SL. Therefore, b3<a1.

[0039] Next, the region on the second main surface AB side of the second end face CB will be described. The center portion of the second outermost end face internal electrode 20B on the second end face CB in the width direction W is farther from the second main surface AB than the portion of the second outermost end face internal electrode 20B on the reference line SL (see FIG. 3). Therefore, when the distance between the center portion of the second outermost end face internal electrode 20B on the second end face CB in the width direction and the first main surface AA is c4, a2<c4 holds.

[0040] On the second end face CB, at least one end (more specifically, both ends) of each end in the width direction W of the second outermost end face internal electrode 20B is closer to the second main surface AB than the center of the second outermost end face internal electrode 20B in the width direction W (see FIG. 5 ). Therefore, when the distance between one end of each end in the width direction W of the second outermost end face internal electrode 20B on the second end face CB and the second main surface AB is b4, b4≦c4 holds, more specifically, b4<c4 holds.

[0041] At least one end (more specifically, both ends) of the second outermost end surface internal electrode 20B on the second end face CB in the width direction W is closer to the second main surface AB than the portion of the second outermost end surface internal electrode 20B on the reference line SL. Therefore, b4<a2.

[0042] In the multilayer ceramic capacitor 1, b1<a1 is satisfied on the first main surface AA side on the first end face CA side.

[0043] In a multilayer ceramic capacitor, the ESL is reduced when the distance through which electricity flows between the internal electrodes and the mounting substrate is shortened. In particular, in the high frequency range, the current flowing through the internal electrodes tends to flow around the edge portions of the internal electrodes, so it is thought that bringing the edge portions of the internal electrodes closer to the mounting substrate can effectively reduce the ESL.

[0044] Since b1<a1, it is easier to shorten the distance between the mounting substrate and the edge of the first outermost end face internal electrode 20A compared to when the internal electrode 15 is not curved, thereby reducing the ESL.

[0045] Furthermore, since b1≦c1, it is possible to easily shorten the distance between the edge of the first outermost end face internal electrode 20A and the mounting substrate, thereby reducing ESL. Furthermore, since b1<c1, it is possible to easily bring the mounting substrate and the edge of the first outermost end face internal electrode 20A closer together, thereby reducing ESL.

[0046] Similarly, on the second main surface AB side of the first end surface CA side, b2<a2, which makes it easier to shorten the distance between the mounting substrate and the edge of the first outermost end surface internal electrode 20A, thereby reducing the ESL.

[0047] In addition, since b2≦c2, the ESL can be reduced. Furthermore, since b2<c2, the ESL can be reduced even more effectively.

[0048] Similarly, on the first main surface AA side of the second end surface CB side, b3<a1, which makes it easier to shorten the distance between the mounting substrate and the edge of the first outermost end surface internal electrode 20A, thereby reducing the ESL.

[0049] In addition, since b3≦a3, the ESL can be reduced. Furthermore, since b3<a3, the ESL can be reduced even more effectively.

[0050] Similarly, on the second main surface AB side of the second end surface CB side, b4<a2, which makes it easier to shorten the distance between the mounting substrate and the edge of the second outermost end surface internal electrode 20B, thereby reducing the ESL.

[0051] In addition, since b4≦c4, the ESL can be reduced. Furthermore, since b4<c4, the ESL can be reduced even more effectively.

[0052] (Regarding Curvature of Side Surface Internal Electrode 50) At least some of the side surface internal electrodes 50 among the plurality of side surface internal electrodes 50 are curved in the stacking direction T.

[0053] First, the region on the first main surface AA side of the first side surface BA side will be described. As shown in Fig. 2, the distance from the first main surface AA to the center of the first outermost surface internal electrode 50A in the length direction L on the first side surface BA and the portion of the first outermost surface internal electrode 50A on the reference line SL are the same. Therefore, if the distance on the reference line SL between the first outermost surface internal electrode 50A and the first main surface AA is a3 and the distance on the reference line SL between the center of the first outermost surface internal electrode 50A in the width direction on the first side surface BA and the first main surface AA is c5, then a3 = c5.

[0054] 6 , on the first side surface BA, at least one end (more specifically, both ends) of each end of the first outermost surface internal electrode 50A in the length direction L is closer to the first main surface AA than the center of the first outermost surface internal electrode 50A in the length direction L. In addition, the first main surface AA is a flat surface. Therefore, when the distance between one end of each end of the first outermost surface internal electrode 50A in the length direction L on the first side surface BA and the first main surface AA is defined as b5, b5≦c5 holds, more specifically, b5<c5 holds.

[0055] At least one end (more specifically, both ends) of the first outermost surface internal electrode 50A on the first side surface BA in the length direction L is closer to the first main surface AA than the portion of the first outermost surface internal electrode 50A on the reference line SL. Therefore, b5<a3.

[0056] Next, the region on the second main surface AB side of the first side surface BA side will be described. The center of the second outermost surface internal electrode 50B on the first side surface BA in the length direction L and the portion of the second outermost surface internal electrode 50B on the reference line SL are the same distance from the second main surface AB (see FIG. 2). Therefore, if the distance on the reference line SL between the second outermost surface internal electrode 50B and the second main surface AB is a4 and the distance on the reference line SL between the center of the second outermost surface internal electrode 50B on the first side surface BA in the width direction and the second main surface AB is c6, then a4 = c6.

[0057] On the first side surface BA, at least one end (more specifically, both ends) of the second outermost surface internal electrode 50B in the length direction L is closer to the second main surface AB than the center of the second outermost surface internal electrode 50B in the length direction L (see FIG. 6 ). The second main surface AB is a flat surface. Therefore, when the distance between one end of the second outermost surface internal electrode 50B in the length direction L on the first side surface BA and the second main surface AB is defined as b6, b6≦c6 holds, more specifically, b6<c6 holds.

[0058] At least one end (more specifically, both ends) of the second outermost surface internal electrode 50B on the first side surface BA in the length direction L is closer to the second main surface AB than the portion of the second outermost surface internal electrode 50B on the reference line SL. Therefore, b6<a4.

[0059] Next, the region on the first main surface AA side of the second side surface BB will be described. The distance from the first main surface AA to the center of the first outermost surface internal electrode 50A on the second side surface BB in the length direction L is the same as that of the portion of the first outermost surface internal electrode 50A on the reference line SL (see FIG. 2). Therefore, when the distance between the center of the first outermost surface internal electrode 50A on the second side surface BB in the width direction and the first main surface AA is c7, a3 = c7.

[0060] 7 , on the second side face BB, at least one end (more specifically, both ends) of each end in the length direction L of the first outermost surface internal electrode 50A is closer to the first main surface AA than the center of the first outermost surface internal electrode 50A in the length direction L. Therefore, when the distance between one end of each end in the length direction L of the first outermost surface internal electrode 50A on the second side face BB and the first main surface AA is defined as b7, b7≦c7, more specifically, b7<c7.

[0061] At least one of the ends of the first outermost surface internal electrode 50A on the second side surface BB in the length direction L is closer to the first main surface AA than the portion of the first outermost surface internal electrode 50A on the reference line SL. Therefore, b7<a3.

[0062] Next, the region on the second main surface AB side of the second side surface BB will be described. The center of the second outermost surface internal electrode 50B on the second side surface BB in the length direction L and the portion of the second outermost surface internal electrode 50B on the reference line SL are the same distance from the second main surface AB (see FIG. 2). Therefore, if the distance between the center of the second outermost surface internal electrode 50B on the second side surface BB in the width direction and the first main surface AA is c8, then a4 = c8.

[0063] On the second side surface BB, at least one end (more specifically, both ends) of the second outermost surface internal electrode 50B in the length direction L is closer to the second main surface AB than the center of the second outermost surface internal electrode 50B in the length direction L (see FIG. 7 ). Therefore, when the distance between one end of the second outermost surface internal electrode 50B in the length direction L on the second side surface BB and the second main surface AB is b8, b8≦c8 holds, more specifically, b8<c8 holds.

[0064] At least one end (more specifically, both ends) of the second outermost surface internal electrode 50B on the second side surface BB in the length direction L is closer to the second main surface AB than the portion of the second outermost surface internal electrode 50B on the reference line SL. Therefore, b8<a4.

[0065] In the multilayer ceramic capacitor 1, on the first main surface AA side closer to the first end face CA, b5<a3. Therefore, the distance between the mounting substrate and the edge of the first outermost surface internal electrode 50A can be easily shortened compared to when the internal electrode is not curved. This can reduce the ESL.

[0066] Furthermore, since b5≦c5, it is possible to easily shorten the distance between the mounting substrate and the edge of the first outermost surface internal electrode 50A, thereby reducing the ESL. Furthermore, since b5<c5, it is possible to more easily shorten the distance between the mounting substrate and the edge of the first outermost surface internal electrode 50A, thereby more effectively reducing the ESL.

[0067] Similarly, on the second principal surface AB side of the first end surface CA side, b6<a4, which makes it easier to shorten the distance between the mounting substrate and the edge of the first outermost surface internal electrode 50A, thereby more effectively reducing the ESL.

[0068] In addition, since b6≦c6, the ESL can be easily reduced. Furthermore, since b6<c6, the ESL can be reduced more effectively.

[0069] Similarly, on the first main surface AA side closer to the second end surface CB, b7<a3, which makes it easier to shorten the distance between the mounting substrate and the edge of the first outermost surface internal electrode 50A, thereby facilitating the reduction of ESL.

[0070] In addition, since b7≦c7, it is easy to reduce the ESL. Furthermore, since b7<c7, it is easy to reduce the ESL even more favorably.

[0071] Similarly, on the second main surface AB side of the second end surface CB side, b8<a4, which makes it easier to shorten the distance between the mounting substrate and the edge of the second outermost surface internal electrode 50B, thereby facilitating the reduction of ESL.

[0072] In addition, since b8≦c8, it is easy to reduce the ESL. Furthermore, since b8<c8, it is easy to reduce the ESL even more favorably.

[0073] Of the multiple internal electrodes 15, those arranged in the center of the stacking direction T of the laminate 2 are not curved or are slightly curved. Of the multiple internal electrodes 15, those arranged closer to the first main surface AA are curved in the same manner as the first outermost end face internal electrode 20A and the first outermost surface internal electrode 50A, and those arranged closer to the second main surface AB are curved in the same manner as the second outermost end face internal electrode 20B and the second outermost surface internal electrode 50B. However, the magnitude of curvature of these internal electrodes 15 may increase with increasing distance from the internal electrode 15 arranged in the center of the stacking direction T of the laminate 2.

[0074] (Method for measuring the distance between the internal electrode 15 and each principal surface A) First, the end face external electrodes 30 and the side face external electrodes 40 are removed from the multilayer ceramic capacitor 1 using acetone or the like to expose each end face C and each side face B of the laminate 2. The exposed end faces C and each side face B are observed using a scanning electron microscope (SEM), a metallurgical microscope, or the like, and the distances (e.g., b1 to b8, c1 to c8) between the internal electrode 15 and each principal surface A are measured.

[0075] More specifically, b1 to b4 can be obtained, for example, by measuring the distance between a position 20 μm from the end of the end face internal electrode 20 in the width direction W toward the center of the end face internal electrode 20 in the width direction W and the first main surface AA or the second main surface AB. b5 to b8 can be obtained by measuring the distance between a position 20 μm from the end of the side face internal electrode 50 in the length direction L toward the center of the side face internal electrode 50 in the length direction L and the first main surface AA or the second main surface AB. c1 to c4 can be obtained, for example, by measuring the distance between the center of the width direction W of the end face internal electrode 20 and the first main surface AA or the second main surface AB. c5 to c8 can be obtained by measuring the distance between the center of the length direction L of the side face internal electrode 50 and the first main surface AA or the second main surface AB.

[0076] Next, the laminate 2 is polished to expose either the LT cross section near the center in the width direction W of the laminate 2 or the WT cross section near the center in the length direction L of the laminate 2. The cross section is observed using a scanning microscope, a metallurgical microscope, or the like, and the distances (e.g., a1 to a4) between the internal electrode 15 and each of the main surfaces A on the reference line SL are measured.

[0077] (Manufacturing Method of Multilayer Ceramic Capacitor 1) Next, a manufacturing method of the multilayer ceramic capacitor 1 will be described with reference to Fig. 8 to Fig. 12. Note that in Fig. 10 and Fig. 11, the positions at which the mother block B1 is divided in the cutting step described below are indicated by imaginary lines. For convenience, Fig. 12 shows only the portion of the mother block B1 that constitutes one laminate.

[0078] (Printing Process) First, a conductive paste P1 that will become the internal electrode 15 is placed on a ceramic green sheet S. The ceramic green sheet is a strip-shaped sheet formed by forming a ceramic slurry containing ceramic powder, a binder, and a solvent onto a carrier film using a die coater, a gravure coater, a microgravure coater, or the like. The conductive paste P1 contains a binder and a solvent. The conductive paste P1 is placed on the ceramic green sheet in a desired shape by printing, for example, screen printing, gravure printing, letterpress printing, or the like. The ceramic green sheet on which the conductive paste that will become the end surface internal electrode 20 is placed is sometimes referred to as a "first ceramic green sheet S1," and the ceramic green sheet on which the conductive paste that will become the side surface internal electrode 50 is placed is sometimes referred to as a "second ceramic green sheet S2."

[0079] As shown in Fig. 8, a conductive paste P1 is placed on a first ceramic green sheet S1. This forms a pattern of end surface internal electrodes 20 on the first ceramic green sheet S1. As shown in Fig. 9, a conductive paste P1 is placed on a second ceramic green sheet S2. This forms a pattern of side surface internal electrodes 50 on the second ceramic green sheet S2.

[0080] Next, a dielectric paste P2 that will become a dielectric layer is placed on the ceramic green sheet S. The dielectric paste P2 is a ceramic slurry containing ceramic powder, a binder, and a solvent, and contains, for example, the same components in the same ratios as the ceramic slurry used as the material for the ceramic green sheet. However, this is not limited to this, and the dielectric paste P2 and the ceramic slurry used as the material for the ceramic green sheet may contain different types and ratios of components. The dielectric paste P2 is placed on the ceramic green sheet S in a desired shape by printing, for example, screen printing, gravure printing, letterpress printing, or the like.

[0081] 10, the dielectric paste P2 is printed in the first ceramic green sheet S1 in a pattern of multiple stripes aligned in a direction perpendicular to the longitudinal direction thereof. In the first ceramic green sheet S1, the dielectric paste P2 is arranged in the entire region where the conductive paste P1 is not arranged and in regions overlapping with each edge portion of the end surface internal electrode 20 in the width direction W, but is not arranged in regions overlapping with linear regions of a constant width that pass through the center of the end surface internal electrode 20 in the width direction W and extend in the length direction L.

[0082] 11 , on the second ceramic green sheet S2, the dielectric paste P2 is printed as a pattern of multiple rectangular shapes arranged vertically and horizontally. The regions of the second ceramic green sheet S2 where the dielectric paste P2 is not arranged form a substantial lattice pattern when viewed in the stacking direction T. The regions of the second ceramic green sheet S2 where the dielectric paste P2 is not arranged include regions overlapping linear regions of a constant width that pass through the center of the side surface internal electrode 50 in the width direction W and extend in the length direction L, and regions overlapping linear regions of a constant width that pass through the center of the side surface internal electrode 50 in the length direction L and extend in the width direction W.

[0083] The order in which the conductive paste P1 and the dielectric paste P2 are placed on the ceramic green sheet S is not limited to the order described above, and the conductive paste P1 may be placed on the ceramic green sheet S on which the dielectric paste P2 has been placed.

[0084] 12, the first ceramic green sheets S1 on which the conductive paste P1 and the dielectric paste P2 are arranged and the second ceramic green sheets S2 on which the conductive paste P1 and the dielectric paste P2 are arranged are alternately stacked. Next, ceramic green sheets S3 for outer layer portions are arranged on both sides of the alternately stacked first ceramic green sheets S1 and second ceramic green sheets S2 in the stacking direction T. This results in a mother block B1.

[0085] Each outer layer portion 12 may be a laminate of multiple ceramic green sheets S3, or may be a single ceramic green sheet S3. The ceramic green sheets for the inner layer portions (i.e., the first ceramic green sheet S1 and the second ceramic green sheet S2) and the ceramic green sheets for the outer layer portions S3 may contain different components. For example, the ceramic green sheets for the inner layer portions may contain components that improve the dielectric constant, and the ceramic green sheets for the outer layer portions may contain components that improve moisture resistance, weather resistance, and strength resistance.

[0086] In the mother block B1, due to the overlapping of the ceramic green sheets S, the conductive paste P1, and the dielectric paste P2, a part of the outer surface of the mother block B1 bulges in the stacking direction T, and the internal electrodes 15 (conductive paste P1) curve in the stacking direction T. The magnitude of the bulge on the outer surface of the mother block B1 and the magnitude of the curvature of the internal electrodes 15 can be adjusted by adjusting the thickness (dimension in the stacking direction T) of the dielectric paste P2, the amount of binder and plasticizer in the dielectric paste P2, etc.

[0087] (Compression bonding process) Next, the ceramic green sheets for the outer layer portions and the stacked first ceramic green sheet S1 and second ceramic green sheet S2 are thermocompression bonded together. At this time, the mother block is sandwiched between two metal plates in the stacking direction T. This thermocompression bonds the third ceramic green sheet and the stacked first ceramic green sheet S1 and second ceramic green sheet S2 together, and also flattens the outer surface of the mother block B1 in the stacking direction T.

[0088] The magnitude of the protrusion on the outer surface of the mother block B1 and the magnitude of the curvature of the internal electrodes 15 can be adjusted by adjusting the temperature and pressure during thermocompression bonding, adjusting the rigidity of the metal plate, etc. If a protrusion exists on the outer surface of the mother block B1 after thermocompression bonding, the protrusion can be ground to flatten the outer surface of the mother block B1.

[0089] (Cutting Step) Next, the mother block B1 is cut in the length direction L and the width direction W. This results in a plurality of rectangular parallelepiped blocks.

[0090] (Laminate Firing Step) The obtained block is heated at a predetermined firing temperature in a nitrogen atmosphere for a predetermined time, thereby obtaining the laminate 2.

[0091] (External electrode forming process) Next, side surface external electrodes 40 are formed on both side surfaces B of the laminate 2. The second lead portions 50b of the side surface internal electrodes 50 are connected to the side surface external electrodes 40. Each side surface external electrode 40 is formed so as to cover not only the side surface B but also a portion of the side surface B side of the main surface A.

[0092] End surface external electrodes 30 are formed on both end surfaces C of the laminate 2. Each end surface external electrode 30 is connected to a first lead portion 20b of the end surface internal electrode 20. Each end surface external electrode 30 is formed so as to cover not only the end surface C but also a portion of the main surface A and the side surface B on the end surface C side.

[0093] (External Electrode Baking Process) Next, the laminate 2 on which the end surface external electrodes 30 and side surface external electrodes 40 have been formed is heated in a nitrogen atmosphere at a predetermined firing temperature for a predetermined time, thereby baking the end surface external electrodes 30 and side surface external electrodes 40 to the laminate 2. In this manner, the multilayer ceramic capacitor 1 shown in FIG.

[0094] (Effects of First Embodiment) According to this embodiment, the following effects can be obtained.

[0095] According to this embodiment, when the distance between the first outermost end face internal electrode 20A and the first main surface AA on the reference line SL is a1, and the distance between one of the ends of the first outermost end face internal electrode 20A in the width direction W on the first end face CA and the first main surface AA is b1, b1 < a1.

[0096] In a multilayer ceramic capacitor, the ESL is reduced when the distance through which electricity flows between the internal electrodes and the mounting substrate is shortened. In particular, in the high frequency range, the current flowing through the internal electrodes tends to flow around the edge portions of the internal electrodes, so it is thought that bringing the edge portions of the internal electrodes closer to the mounting substrate can effectively reduce the ESL.

[0097] Since b1<a1, it is easier to shorten the distance between the mounting substrate and the edge of the first outermost end face internal electrode 20A compared to when the internal electrode 15 is not curved, thereby reducing the ESL.

[0098] Therefore, it is possible to provide a multilayer ceramic capacitor in which the ESL can be easily reduced.

[0099] According to this embodiment, when the distance between the center of the first outermost end face internal electrode 20A in the width direction W on the first end face CA and the first main face AA is c1, b1≦c1 holds.

[0100] This makes it easier to shorten the distance between the mounting substrate and the edge of the first outermost end face internal electrode 20A, thereby reducing ESL.

[0101] Furthermore, according to this embodiment, b1<c1, which makes it easier to shorten the distance between the mounting substrate and the edge of the first outermost end face internal electrode 20A, thereby more suitably reducing the ESL.

[0102] According to this embodiment, when the distance between the second outermost end face internal electrode 20B and the second main surface AB on the reference line SL is a2 and the distance between one end of each end of the second outermost end face internal electrode 20B in the width direction W on the first end face CA and the second main surface AB is b2, b2<a2 is satisfied. This makes it easier to shorten the distance between the edge of the internal electrode 15 and the mounting substrate, thereby reducing the ESL.

[0103] According to this embodiment, when the distance between the center of the second outermost end face internal electrode 20B in the width direction W on the first end face CA and the second main surface AB is defined as c2, b2≦c2 is satisfied. This makes it easier to shorten the distance between the edge of the internal electrode 15 and the mounting substrate, thereby more effectively reducing ESL.

[0104] Furthermore, according to this embodiment, b2<c2, which makes it easier to shorten the distance between the edge of the internal electrode 15 and the mounting substrate, thereby reducing ESL.

[0105] According to this embodiment, when the distance between one end of the first outermost end face internal electrode 20A on the second end face CB in the width direction W and the first main surface AA is defined as b3, b3<a1 is satisfied, which makes it easier to shorten the distance between the edge of the internal electrode 15 and the mounting substrate, thereby reducing the ESL.

[0106] According to this embodiment, when the distance between the center of the first outermost end face internal electrode 20A in the width direction W on the second end face CB and the first main surface AA is c3, b3≦c3 is satisfied. This makes it easier to shorten the distance between the edge of the internal electrode 15 and the mounting substrate, thereby reducing ESL.

[0107] Furthermore, according to this embodiment, b3<c3, which allows the distance between the edge of the internal electrode 15 and the mounting substrate to be shortened, thereby more effectively reducing ESL.

[0108] According to this embodiment, when the distance between the second outermost end face internal electrode 20B and the second main surface AB on the reference line SL is a2 and the distance between one end of each end of the second outermost end face internal electrode 20B in the width direction W on the second end face CB and the second main surface AB is b4, b4<a2 is satisfied. This makes it possible to shorten the distance between the edge of the internal electrode 15 and the mounting substrate, thereby reducing the ESL.

[0109] According to this embodiment, when the distance between the center of the second outermost end face internal electrode 20B in the width direction W on the second end face CB and the second main surface AB is defined as c4, b4≦c4 is satisfied. This makes it easier to shorten the distance between the edge of the internal electrode 15 and the mounting substrate, thereby reducing the ESL.

[0110] Furthermore, according to this embodiment, b4<c4, which allows the distance between the edge of the internal electrode 15 and the mounting substrate to be shortened, thereby reducing the ESL.

[0111] According to this embodiment, when the distance between the first outermost surface internal electrode and the first main surface AA on the reference line SL is a3 and the distance between one end of the first outermost surface internal electrode 50A on the first side surface BA in the length direction L and the first main surface AA is b5, the relationship b5<a3 is satisfied. This makes it easier to shorten the distance between the edge of the internal electrode 15 and the mounting substrate, thereby reducing the ESL.

[0112] According to this embodiment, when the distance between the center of the first outermost surface internal electrode 50A in the length direction L on the first side surface BA and the first main surface AA is defined as c5, b5≦c5 is satisfied. This makes it easier to shorten the distance between the edge of the internal electrode 15 and the mounting substrate, thereby reducing the ESL.

[0113] Furthermore, according to this embodiment, b5<c5, which makes it easier to shorten the distance between the edge of the internal electrode 15 and the mounting substrate, thereby reducing ESL.

[0114] According to this embodiment, when the distance on the reference line SL between the second outermost surface internal electrode 50B and the second main surface AB is a4 and the distance on the first side surface BA between one end of the second outermost surface internal electrode 50B in the length direction L and the second main surface AB is b6, the relationship b6<a4 is satisfied. This makes it easier to shorten the distance between the edge of the internal electrode 15 and the mounting substrate, thereby reducing the ESL.

[0115] According to this embodiment, when the distance between the center of the second outermost surface internal electrode 50B in the length direction L on the first side surface BA and the second main surface AB is defined as c6, b6≦c6 is satisfied. This makes it easier to shorten the distance between the edge of the internal electrode 15 and the mounting substrate, thereby reducing the ESL.

[0116] Furthermore, according to this embodiment, b6<c6, which makes it easier to shorten the distance between the edge of the internal electrode 15 and the mounting substrate, thereby more effectively reducing ESL.

[0117] According to this embodiment, when the distance between one end of the first outermost surface internal electrode 50A on the second side surface BB in the length direction L and the first main surface AA is defined as b7, b7<a3 is satisfied, which makes it easier to shorten the distance between the edge of the internal electrode 15 and the mounting substrate, thereby reducing the ESL.

[0118] According to this embodiment, when the distance between the center of the first outermost surface internal electrode 50A in the length direction L on the second side surface BB and the first main surface AA is defined as c7, d7≦c7 is satisfied. This makes it easier to shorten the distance between the edge of the internal electrode 15 and the mounting substrate, thereby reducing the ESL.

[0119] Furthermore, according to this embodiment, d7<c7, which allows the distance between the edge of the internal electrode 15 and the mounting substrate to be shortened, thereby more effectively reducing the ESL.

[0120] According to this embodiment, when the distance on the reference line SL between the second outermost surface internal electrode 50B and the second main surface AB is a4 and the distance on the second side surface BB between one end of the second outermost surface internal electrode 50B in the length direction L and the second main surface AB is b8, the relationship b8<a4 is satisfied. This makes it possible to shorten the distance between the edge of the internal electrode 15 and the mounting substrate, thereby more suitably reducing the ESL.

[0121] According to this embodiment, when the distance between the center of the second outermost surface internal electrode 50B in the length direction L on the second side surface BB and the second main surface AB is defined as c8, b8≦c8 is satisfied. This makes it possible to suppress the separation between the edge of the internal electrode 15 and the mounting substrate, thereby reducing the ESL.

[0122] Furthermore, according to this embodiment, b8<c8, which makes it easier to shorten the distance between the edge of the internal electrode 15 and the mounting substrate, thereby reducing the ESL.

[0123] Second Embodiment Next, a multilayer ceramic capacitor 100 according to a second embodiment of the present invention will be described. Differences from the first embodiment will be mainly described below, and the same components as those in the multilayer ceramic capacitor 1 according to the first embodiment will be denoted by the same reference numerals and description thereof will be omitted. The cross section in Fig. 14 is a cross section parallel to the length direction L and the stacking direction T and passing through the center of the width direction W of the laminate 102. The cross section in Fig. 15 is a cross section parallel to the width direction W and the stacking direction T and passing through the center of the length direction L of the laminate 102.

[0124] 13, the multilayer ceramic capacitor 100 according to the second embodiment is a so-called three-terminal multilayer ceramic capacitor, similar to the first embodiment. However, as will be described below, the second embodiment differs from the first embodiment in the manner in which the internal electrodes are curved.

[0125] (Regarding the curvature of the end face internal electrode 120) First, the region on the first main surface AA side of the first end face CA side will be described. As shown in Fig. 15, the center portion of the first outermost end face internal electrode 120A on the first end face CA in the width direction W is closer to the first main surface AA than the portion of the first outermost end face internal electrode 120A on the reference line SL. Therefore, c1 < a1. This makes it easier to shorten the distance between the end of the internal electrode and the mounting substrate, thereby reducing ESL.

[0126] As shown in Figure 16, on the first end surface CA, at least one end (more specifically, both ends) of the first outermost end surface internal electrode 120A in the width direction W and the center of the first outermost end surface internal electrode 120A in the width direction W are the same distance from the first main surface AA. Therefore, b1 = c1. Note that b1 and c1 may be slightly different from each other. However, it is preferable that b1 ≤ c1. In this case, it is easier to shorten the distance between the end of the internal electrode and the mounting substrate, thereby reducing ESL.

[0127] At least one end (more specifically, both ends) of the first outermost end face internal electrode 120A on the first end face CA in the width direction W is closer to the first main surface AA than the portion of the first outermost end face internal electrode 120A on the reference line SL. Therefore, b1<a1. This makes it easier to shorten the distance between the end of the internal electrode and the mounting substrate, thereby reducing ESL.

[0128] Next, the region on the second main surface AB side of the first end surface CA will be described. The center portion of the second outermost end surface internal electrode 120B on the first end surface CA in the width direction W is farther from the second main surface AB than the portion of the second outermost end surface internal electrode 120B on the reference line SL (see FIG. 15). Therefore, a2<c2. This makes it easier to shorten the distance between the end of the internal electrode and the mounting substrate, thereby reducing ESL.

[0129] On the first end surface CA, at least one end (more specifically, both ends) of the second outermost end surface internal electrode 120B in the width direction W and the center of the second outermost end surface internal electrode 120B in the width direction W are the same distance from the second main surface AB (see FIG. 16 ). Therefore, b2 = c2. Note that b2 and c3 may be slightly different from each other. However, it is preferable that b2≦c2. In this case, it is easier to shorten the distance between the end of the internal electrode and the mounting substrate, thereby reducing ESL.

[0130] At least one end (more specifically, both ends) of the second outermost end face internal electrode 120B on the first end face CA in the width direction W is closer to the second main surface AB than the portion of the second outermost end face internal electrode 120B on the reference line SL. Therefore, b2<a2. This makes it easier to shorten the distance between the end of the internal electrode and the mounting substrate, thereby reducing ESL.

[0131] Next, the region on the first main surface AA side of the second end surface CB will be described. The center portion of the first outermost end surface internal electrode 120A on the second end surface CB in the width direction W is farther from the first main surface AA than the portion of the first outermost end surface internal electrode 120A on the reference line SL (see FIG. 14). Therefore, a1<c3. This makes it easier to shorten the distance between the end of the internal electrode and the mounting substrate, thereby reducing ESL.

[0132] As shown in Figure 17, on the second end face CB, at least one end (more specifically, both ends) of the first outermost end face internal electrode 120A in the width direction W and the center of the first outermost end face internal electrode 120A in the width direction W are the same distance from the first main surface AA. Therefore, b3 = c3. Note that b3 and c3 may be slightly different from each other. However, it is preferable that b3 ≤ c3. In this case, it is easier to shorten the distance between the end of the internal electrode and the mounting substrate, thereby reducing ESL.

[0133] At least one end (more specifically, both ends) of the first outermost end face internal electrode 120A on the second end face CB in the width direction W is closer to the first main surface AA than the portion of the first outermost end face internal electrode 120A on the reference line. Therefore, b3<a1. This makes it easier to shorten the distance between the end of the internal electrode and the mounting substrate, thereby reducing ESL.

[0134] Next, the region on the second main surface AB side of the second end surface CB will be described. The center portion of the second outermost end surface internal electrode 120B on the second end surface CB in the width direction W is farther from the second main surface AB than the portion of the second outermost end surface internal electrode 120B on the reference line SL (see FIG. 15). Therefore, a2<c4 holds. This makes it easier to shorten the distance between the end of the internal electrode and the mounting substrate, thereby reducing ESL.

[0135] On the second end face CB, at least one of the ends in the width direction W of the second outermost end face internal electrode 120B (more specifically, both ends) and the center in the width direction W of the second outermost end face internal electrode 120B are the same distance from the second main surface AB (see FIG. 17 ). Therefore, b4=c4. Note that b4 and c4 may be slightly different from each other. However, it is preferable that b4≦c4. In this case, it is easier to shorten the distance between the end of the internal electrode and the mounting substrate, thereby reducing ESL.

[0136] At least one end (more specifically, both ends) of the second outermost end face internal electrode 120B on the second end face CB in the width direction W is closer to the second main surface AB than the portion of the second outermost end face internal electrode 120B on the reference line SL. Therefore, b4<a2. This makes it easier to shorten the distance between the end of the internal electrode and the mounting substrate, thereby reducing ESL.

[0137] (Regarding the curvature of the side surface internal electrode 150) First, the region on the first main surface AA side of the first side surface BA will be described. As shown in FIG. 14 , the center portion of the first outermost side surface internal electrode 150A on the first side surface BA in the length direction L is closer to the first main surface AA than the portion of the first outermost side surface internal electrode 150A on the reference line SL. Therefore, a3<c5. This makes it easier to shorten the distance between the end of the internal electrode and the mounting substrate, thereby reducing ESL.

[0138] 18, on the first side surface BA, at least one end (more specifically, both ends) of the first outermost surface internal electrode 150A in the length direction L and the center of the first outermost surface internal electrode 150A in the length direction L are the same distance from the first main surface AA. Therefore, b5 = c5. Note that b5 and c5 may be slightly different from each other.

[0139] At least one end (more specifically, both ends) of the first outermost surface internal electrode 150A on the first side surface BA in the length direction L is closer to the first main surface AA than the portion of the first outermost surface internal electrode 150A on the reference line SL. Therefore, b5<a3. This makes it easier to shorten the distance between the end of the internal electrode and the mounting substrate, thereby reducing ESL.

[0140] Next, the region on the second main surface AB side of the first side surface BA will be described. The center portion of the second outermost surface internal electrode 150B on the first side surface BA in the length direction L is closer to the second main surface AB than the portion of the second outermost surface internal electrode 150B on the reference line SL (see FIG. 14). Therefore, a4<c6. This makes it easier to shorten the distance between the end of the internal electrode and the mounting substrate, thereby reducing ESL.

[0141] On the first side surface BA, at least one end (specifically, both ends) of the second outermost surface internal electrode 150B in the length direction L and the center of the second outermost surface internal electrode 150B in the length direction L are the same distance from the second main surface AB (see FIG. 18 ). Therefore, b6=c6. Note that b6 and c6 may be slightly different from each other.

[0142] At least one end (more specifically, both ends) of the second outermost surface internal electrode 150B on the first side surface BA in the length direction L is closer to the second main surface AB than the portion of the second outermost surface internal electrode 150B on the reference line SL. Therefore, b6<a4. This makes it easier to shorten the distance between the end of the internal electrode and the mounting substrate, thereby reducing ESL.

[0143] Next, the region on the first main surface AA side of the second side surface BB will be described. The center portion of the first outermost surface internal electrode 150A on the second side surface BB in the length direction L is closer to the first main surface AA than the portion of the first outermost surface internal electrode 150A on the reference line SL (see FIG. 14). Therefore, a3<c7. This makes it easier to shorten the distance between the end of the internal electrode and the mounting substrate, thereby reducing ESL.

[0144] 19 , on the second side surface BB, at least one end (more specifically, both ends) of the first outermost surface internal electrode 150A in the length direction L and the center of the first outermost surface internal electrode 150A in the length direction L are the same distance from the first main surface AA. Therefore, b7=c7. Note that b7 and c7 may be slightly different from each other.

[0145] At least one end (more specifically, both ends) of the first outermost surface internal electrode 150A on the second side surface BB in the length direction L is closer to the first main surface AA than the portion of the first outermost surface internal electrode 150A on the reference line SL. Therefore, b7<a3. This makes it easier to shorten the distance between the end of the internal electrode and the mounting substrate, thereby reducing ESL.

[0146] Next, the region on the second main surface AB side of the second side surface BB will be described. The center portion of the second outermost surface internal electrode 150B on the second side surface BB in the length direction L is farther from the second main surface AB than the portion of the second outermost surface internal electrode 150B on the reference line SL (see FIG. 14). Therefore, a4<c8. This makes it easier to shorten the distance between the end of the internal electrode and the mounting substrate, thereby reducing ESL.

[0147] On the second side surface BB, the distance from the second main surface AB to at least one end (specifically, both ends) of the second outermost surface internal electrode 150B in the length direction L is the same as that to the center of the second outermost surface internal electrode 150B in the length direction L (see FIG. 19 ). Therefore, b8=c8. Note that b8 and c8 may be slightly different from each other.

[0148] At least one end (more specifically, both ends) of the second outermost surface internal electrode 150B on the second side surface BB in the length direction L is closer to the second main surface AB than the portion of the second outermost surface internal electrode 150B on the reference line SL. Therefore, b8<a4. This makes it easier to shorten the distance between the end of the internal electrode and the mounting substrate, thereby reducing ESL.

[0149] (Method for manufacturing the multilayer ceramic capacitor 100) Next, a method for manufacturing the multilayer ceramic capacitor 100 according to the second embodiment will be described with reference to Fig. 20 and Fig. 21. Note that in Fig. 20, the positions at which the mother block B2 is divided in the cutting step described below are indicated by imaginary lines. For convenience, Fig. 21 shows only the portion of the mother block B2 that constitutes one laminate.

[0150] In the second embodiment, the arrangement of the dielectric paste P2 in the second ceramic green sheet S2 is different from that in the first embodiment. As shown in Fig. 20 , in the second ceramic green sheet S2, the dielectric paste P2 is arranged in the entire region where the side surface internal electrode 150 is not arranged and in a region overlapping with the peripheral edge of the side surface internal electrode 150, but is not arranged in a region overlapping with a substantially rectangular region as seen in the stacking direction T including the center of the second opposing portion 150b in the length direction L and the width direction W.

[0151] The arrangement of the dielectric paste P2 on the first ceramic green sheet S1 is the same as in the first embodiment.

[0152] As shown in FIG. 21, the first ceramic green sheet S1 on which the conductive paste P1 and the dielectric paste P2 are arranged and the second ceramic green sheet S1 on which the conductive paste P1 and the dielectric paste P2 are arranged are alternately stacked, as in the first embodiment.

[0153] Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various changes and modifications are possible.

[0154] The curvature of the end face internal electrodes is not limited to that of the above-described embodiments. However, it is preferable that b1<a1, and more preferable that b1<a1 and b2<a2. This makes it possible to more effectively reduce ESL.

[0155] Furthermore, it is preferable that b3<a1, and it is more preferable that b3<a1 and b4<a2, which makes it possible to more suitably reduce the ESL.

[0156] Furthermore, b1, b3, c1, and c3 do not necessarily have to be smaller than a1, and ESL can be reduced by making b1<c1 or b3<c3. However, ESL can be more suitably reduced by making b1, b3, c1, and c3 smaller than a1.

[0157] Similarly, b2, b4, c2, and c4 do not necessarily have to be smaller than a2, and ESL can be reduced by making b2<c2 or b4<c4. However, ESL can be more effectively reduced by making b2, b4, c2, and c4 smaller than a2.

[0158] The curvature of the side internal electrode is not limited to that of the above-described embodiments. However, it is preferable that b5<a3, and more preferable that b5<a3 and b7<a4. This makes it possible to more effectively reduce ESL.

[0159] Furthermore, it is preferable that b6<a3, and it is more preferable that b6<a3 and b8<a4, which makes it possible to more suitably reduce the ESL.

[0160] Furthermore, b5, b7, c5, and c7 do not necessarily have to be smaller than a3, and ESL can be reduced by making b5<c5 or b7<c7. However, ESL can be more suitably reduced by making b5, b7, c5, and c7 smaller than a3.

[0161] Similarly, b6, b8, c6, and c8 do not necessarily have to be smaller than a4, and ESL can be reduced by making b6<c6 or b8<c8. However, ESL can be reduced by making b6, b8, c6, and c8 smaller than a4.

[0162] The arrangement patterns and components of the dielectric paste P2 and the conductive paste P1 are not limited to those in the above embodiments. By appropriately changing these, the size relationships between a1 to a4, b1 to b8, and c1 to c8 can be adjusted.

[0163] In the above embodiment, each main surface A of the laminate is a flat surface, but it may have irregularities formed on each main surface A. However, it is preferable that each main surface A is as flat as possible, since this allows the distance between the edge of the internal electrode and each main surface A to be suitably shortened.

[0164] In the above embodiment, the end surface internal electrodes 20 extend between both end surfaces C of the laminate 2 and are spaced a certain distance from both side surfaces B, but the configuration of the end surface internal electrodes is not limited to this.

[0165] The dimension in the width direction W of a portion of the first lead portion 20b may be larger than the dimension in the width direction W of the first opposing portion 20a. Ends in the width direction W of a portion of the first lead portion 20b may be in contact with both side surfaces B. The ends in the width direction W of the first lead portion 20b in contact with both side surfaces B are exposed from both side surfaces B. Ends in the length direction L of the first lead portion 20b may be in contact with the entire one end surface. An end surface internal electrode 20 having first lead portions 20b whose ends in the width direction W are in contact with both side surfaces B and whose ends in the length direction L are in contact with the entire one end surface forms an H-shape when viewed in the stacking direction T. Note that each end in the width direction W of the first lead portion 20b may be spaced apart from each side surface B without being in contact with each side surface B.

[0166] The ESL of the H-shaped end face internal electrode 20 when viewed in the lamination direction T is further suppressed.

[0167] When manufacturing such a multilayer ceramic capacitor, when the conductive paste P1 is printed on the first ceramic green sheet S1, a plurality of stripes of conductive paste P1 extending in the length direction L and a plurality of stripes of conductive paste P1 extending in the width direction W are printed at predetermined intervals on the first ceramic green sheet S1. When viewing the first multilayer ceramic green sheet S1 in the lamination direction, the conductive paste P1 is arranged in a lattice pattern. Note that, for example, the conductive paste P1 extending in the length direction L is printed so as not to overlap with the cutting line in the length direction L in the cutting process. The conductive paste P1 extending in the width direction W is printed at a position where the center portion in the short side direction of the conductive paste P1 overlaps with the cutting line in the width direction W in the cutting process.

[0168] Furthermore, it is preferable that the dielectric paste P2 is printed on the first ceramic green sheet so as to overlap at least the portions of the conductive paste P1 that will become the ends of the first lead portion in the width direction W. In this case, in the multilayer ceramic capacitor, the ends of the first lead portion of the first outermost end surface internal electrode in the width direction W can be closer to the first main surface AA, and the ends of the first lead portion of the second outermost end surface internal electrode in the width direction W can be closer to the second main surface AB. This allows b1 to b4 to be smaller.

[0169] In the above embodiment, when the dielectric paste P2 is printed on the first ceramic green sheet S1, the dielectric paste P2 is arranged in the entire area where the conductive paste P1 is not arranged and in the areas overlapping with each edge portion in the width direction W of the end face internal electrode 20, but is not arranged in the areas overlapping with the linear area of ​​a constant width that passes through the center of the end face internal electrode 20 in the width direction W and extends in the length direction L. However, the arrangement of the dielectric paste P2 is not limited to this. Moreover, the dielectric paste P2 may be arranged so that multiple overlapping portions are arranged.

[0170] For example, the dielectric paste P2 may be disposed on the first ceramic green sheet S1 so as to overlap a region of the conductive paste P1 that will become the first lead portion. In this case, for example, the conductive paste P1 is printed on the first ceramic green sheet S1 in stripes extending in the length direction L at predetermined intervals. The dielectric paste P2 is printed on the first ceramic green sheet S1 in stripes extending in the length direction L at predetermined intervals, and further printed in stripes extending in the width direction W at predetermined intervals. When the first laminated ceramic green sheet S1 is viewed in the stacking direction, the plurality of dielectric pastes P2 are arranged in a lattice pattern. Note that the dielectric paste P2 extending in the length direction L is printed at a position where its central portion in the short direction overlaps the cutting line in the length direction L in the cutting process. The dielectric paste P2 extending in the length direction L is printed so that its end in the width direction W overlaps with the end in the width direction W of the conductive paste P1. The dielectric paste P2 extending in the width direction W is printed, for example, at a position where the center portion in the short side direction thereof overlaps with the cutting line in the width direction W in the cutting step.

[0171] In this way, each end portion in the longitudinal direction L of the portion of the conductive paste P1 that will become one end face internal electrode after the mother block is cut will be overlapped with the dielectric paste P2 over the entire width direction W.

[0172] In this case, in the multilayer ceramic capacitor, the ends of the first outermost end face internal electrode in the length direction L can be closer to the first main surface AA, and the ends of the second outermost end face internal electrode in the length direction L can be closer to the second main surface AB, thereby making it possible to reduce b1 to b4 and c1 to c4.

[0173] Furthermore, each end in the length direction L of the portion of the conductive paste P1 that will become one end face internal electrode after the mother block is cut is in a state where each end in the width direction W overlaps with the dielectric paste P2 extending in the length direction L and the dielectric paste P2 extending in the width direction W.

[0174] In this case, in the multilayer ceramic capacitor, each end in the width direction W of each end in the length direction L of the first outermost end face internal electrode can be made closer to the first main surface AA, and each end in the width direction W of each end in the length direction L of the second outermost end face internal electrode can be made closer to the second main surface AB, thereby making it possible to further reduce c1 to c4.

[0175] The present invention also includes the following combinations:

[0176] <1> A laminate including a plurality of laminated dielectric layers and a plurality of internal electrodes respectively arranged on the plurality of dielectric layers, the laminate having first and second main surfaces opposing each other in a lamination direction, first and second side surfaces opposing each other in a width direction perpendicular to the lamination direction, and first and second end surfaces opposing each other in a length direction perpendicular to the lamination direction and the width direction, end surface external electrodes arranged in pairs on each of the end surfaces, and side surface external electrodes arranged in pairs on each of the side surfaces, the plurality of internal electrodes including end surface internal electrodes exposed on both the first end surface and the second end surface, and a side surface internal electrode exposed to a surface of the laminated body in the width direction, wherein a straight line passing through a center portion of the laminated body in the length direction and a center portion of the laminated body in the width direction is taken as a reference line, the end surface internal electrode closest to the first main surface is taken as a first outermost end surface internal electrode, a distance on the reference line between the first outermost end surface internal electrode and the first main surface is taken as a1, and a distance on the first end surface between one end of each end of the first outermost end surface internal electrode in the width direction and the first main surface is taken as b1, where b1<a1.

[0177] <2> The multilayer ceramic capacitor according to <1>, wherein, when a distance c1 is defined as a distance between a center portion of the first outermost end surface internal electrode in the width direction on the first end surface and the first main surface, b1≦c1.

[0178] <3> The multilayer ceramic capacitor according to <1> or <2>, wherein the end face internal electrode closest to the second main surface is a second outermost end face internal electrode, and when a2 is a distance between the second outermost end face internal electrode and the second main surface on the reference line, and b2 is a distance between one end of each end of the second outermost end face internal electrode in the width direction on the first end surface and the second main surface, b2<a2.

[0179] <4> The multilayer ceramic capacitor according to <3>, wherein, when a distance c2 is defined as a distance between a center portion in the width direction of the second outermost end surface internal electrode on the first end surface and the second main surface, b2≦c2.

[0180] <5> The multilayer ceramic capacitor according to any one of <1> to <4>, wherein, when a distance b3 is defined as a distance between one end of each end of the first outermost end surface internal electrode in the width direction on the second end surface and the first main surface, b3<a1.

[0181] <6> The multilayer ceramic capacitor according to <5>, wherein, when a distance c3 is defined as a distance between a center portion in the width direction of the first outermost end surface internal electrode on the second end surface and the first main surface, b3≦c3.

[0182] <7> The multilayer ceramic capacitor according to any one of <1> to <6>, wherein the end face internal electrode closest to the second main surface is a second outermost end face internal electrode, and when a2 is a distance between the second outermost end face internal electrode and the second main surface on the reference line and b4 is a distance between one end of the second outermost end face internal electrode in the width direction on the second end surface and the second main surface, b4<a2.

[0183] <8> The multilayer ceramic capacitor according to <7>, wherein, when a distance c4 is defined as a distance between a center portion in the width direction of the second outermost end surface internal electrode on the second end surface and the second main surface, b4≦c4.

[0184] <9> The multilayer ceramic capacitor according to any one of <1> to <8>, wherein the side surface internal electrode closest to the first main surface is a first outermost side surface internal electrode, the distance between the first outermost side surface internal electrode and the first main surface on the reference line is a3, and the distance between one end of each end of the first outermost side surface internal electrode in the length direction on the first side surface and the first main surface is b5, where b5<a3.

[0185] <10> The multilayer ceramic capacitor according to <9>, wherein, when c5 is the distance between the center of the first outermost surface internal electrode in the length direction on the first side surface and the first main surface, b5≦c5.

[0186] <11> The multilayer ceramic capacitor according to <9> or <10>, wherein the side surface internal electrode closest to the second main surface is a second outermost side surface internal electrode, the distance between the second outermost side surface internal electrode and the second main surface on the reference line is a4, and the distance between one end of each end of the second outermost side surface internal electrode in the length direction on the first side surface and the second main surface is b6, where b6<a4.

[0187] <12> The multilayer ceramic capacitor according to <11>, wherein, when a distance c6 is defined as a distance between a center portion of the second outermost surface internal electrode in the length direction on the first side surface and the second main surface, b6≦c6.

[0188] <13> The multilayer ceramic capacitor according to any one of <9> to <12>, wherein the side surface internal electrode closest to the first main surface is a first outermost side surface internal electrode, and when a distance b7 is defined as a distance between one end of each end of the first outermost side surface internal electrode in the length direction on the second side surface and the first main surface, b7<a3.

[0189] <14> The multilayer ceramic capacitor according to <13>, wherein, when a distance between a center portion of the first outermost surface internal electrode in the length direction on the second side surface and the first main surface is c7, d7≦c7.

[0190] <15> The multilayer ceramic capacitor according to any one of <9> to <14>, wherein the side surface internal electrode closest to the second main surface is a second outermost side surface internal electrode, the distance between the second outermost side surface internal electrode and the second main surface on the reference line is a4, and the distance between one end of each end of the second outermost side surface internal electrode in the length direction on the second side surface and the second main surface is b8, where b8<a4.

[0191] <16> The multilayer ceramic capacitor according to <15>, wherein, when c8 is the distance between the center of the second outermost surface internal electrode in the length direction on the second side surface and the second main surface, b8≦c8.

[0192] <17> A laminate including a plurality of laminated dielectric layers and a plurality of internal electrodes respectively arranged on the plurality of dielectric layers, the laminate having a first main surface and a second main surface opposing each other in a lamination direction, a first side surface and a second side surface opposing each other in a width direction perpendicular to the lamination direction, and a first end surface and a second end surface opposing each other in a length direction perpendicular to the lamination direction and the width direction, end surface external electrodes arranged in pairs on each of the end surfaces, and side surface external electrodes arranged in pairs on each of the side surfaces, the plurality of internal electrodes including end surface internal electrodes exposed on both the first end surface and the second end surface, and side surface internal electrodes exposed on both the first side surface and the second side surface. and electrodes, wherein a straight line that passes through a center portion in the length direction of the laminate and a center portion in the width direction of the laminate is taken as a reference line, the side surface internal electrode that is closest to the first main surface is taken as a first outermost surface internal electrode, a distance on the reference line between the first outermost surface internal electrode and the first main surface is taken as a3, and a distance on the first side surface between one end of the first outermost surface internal electrode in the length direction and the first main surface is taken as b5, where b5<a3.

[0193] 1,100 Multilayer ceramic capacitor 2,102 Laminate 14 Dielectric layer 15 Internal electrode 3 End face external electrode 4 Side face external electrode 20,120 End face internal electrode 50,150 Side face internal electrode 20A,120A First outermost end face internal electrode 20B,120B Second outermost end face internal electrode 50A,150A First outermost side face internal electrode 50B,150B Second outermost side face internal electrode AA First main surface AB Second main surface BA First side surface BB Second side surface CA First end surface CB Second end surface SL Reference line

Claims

1. A laminate comprising a plurality of stacked dielectric layers and a plurality of internal electrodes arranged on each of the plurality of dielectric layers, having a first main surface and a second main surface facing each other in the stacking direction, a first side surface and a second side surface facing each other in the width direction perpendicular to the stacking direction, and a first end surface and a second end surface facing each other in the length direction perpendicular to the stacking direction and the width direction, End face external electrodes arranged in pairs on each of the aforementioned end faces, Side external electrodes are arranged in pairs on each of the aforementioned side surfaces, Equipped with, The plurality of internal electrodes are a multilayer ceramic capacitor having end-face internal electrodes exposed on both the first end face and the second end face, and side-face internal electrodes exposed on both the first side surface and the second side surface, A straight line extending parallel to the stacking direction, passing through the central portion in the longitudinal direction of the laminate and the central portion in the width direction of the laminate, is used as the reference line. The end face internal electrode closest to the first main surface is designated as the first outermost end face internal electrode. Let a1 be the distance between the first outermost end face internal electrode and the first main surface on the aforementioned reference line. When b1 is the distance between one of the ends in the width direction of the internal electrode of the first outermost end face on the first end face and the first main surface, A multilayer ceramic capacitor where b1 < a1.

2. When c1 is the distance between the central part in the width direction of the internal electrode of the first outermost end face on the first end face and the first main surface, The multilayer ceramic capacitor according to claim 1, wherein b1 ≤ c1.

3. The end face internal electrode closest to the second main surface is designated as the second outermost end face internal electrode. Let a2 be the distance between the second outermost end face internal electrode and the second main surface on the aforementioned reference line. When the distance between the second main surface and one of the ends of the second outermost end surface internal electrode in the width direction on the first end surface is b2, A multilayer ceramic capacitor according to claim 1 or 2, wherein b2 < a2.

4. When the distance c2 is the central part in the width direction of the internal electrode of the second outermost end face on the first end face and the second main surface, The multilayer ceramic capacitor according to claim 3, wherein b2 ≤ c2.

5. When the distance between the first main surface and one of the ends of the first outermost end surface internal electrode in the width direction on the second end surface is b3, A multilayer ceramic capacitor according to claim 1 or 2, wherein b3 < a1.

6. When the distance c3 is the central part in the width direction of the internal electrode of the first outermost end face on the second end face and the first main surface, The multilayer ceramic capacitor according to claim 5, wherein b3 ≤ c3.

7. The end face internal electrode closest to the second main surface is designated as the second outermost end face internal electrode. Let a2 be the distance between the second outermost end face internal electrode and the second main surface on the aforementioned reference line. When the distance between the second main surface and one of the ends of the second outermost end surface internal electrode in the width direction on the second end surface is b4, A multilayer ceramic capacitor according to claim 1 or 2, wherein b4 < a2.

8. When the distance c4 is the central part in the width direction of the internal electrode of the second outermost end face on the second end face and the second main surface, The multilayer ceramic capacitor according to claim 7, wherein b4 ≤ c4.

9. The side internal electrode closest to the first main surface is designated as the first outermost side internal electrode. Let a3 be the distance between the first outermost inner electrode and the first main surface on the aforementioned reference line. When the distance between one of the ends of the inner electrode of the first outermost surface in the longitudinal direction on the first surface and the first main surface is b5, The multilayer ceramic capacitor according to claim 1, wherein b5 < a3.

10. When the distance c5 is the longitudinal center of the inner electrode of the first outermost surface on the first side surface and the first main surface, The multilayer ceramic capacitor according to claim 9, wherein b5 ≤ c5.

11. The side surface internal electrode closest to the second main surface is designated as the second outermost side surface internal electrode. Let a4 be the distance between the second outermost surface internal electrode and the second main surface on the aforementioned reference line. When the distance between one of the ends of the inner electrode of the second outermost surface on the first surface and the second main surface is b6, A multilayer ceramic capacitor according to claim 9 or 10, wherein b6 < a4.

12. When the distance between the central part in the longitudinal direction of the inner electrode of the second outermost surface on the first surface and the second main surface is c6, The multilayer ceramic capacitor according to claim 11, wherein b6 ≤ c6.

13. The side internal electrode closest to the first main surface is designated as the first outermost side internal electrode. When the distance between one of the ends of the inner electrode of the first outermost surface in the longitudinal direction on the second surface and the first main surface is b7, A multilayer ceramic capacitor according to claim 9 or 10, wherein b7 < a3.

14. When the distance c7 is the longitudinal center of the first outermost inner electrode on the second surface and the first main surface, The multilayer ceramic capacitor according to claim 13, wherein d7 ≤ c7.

15. The side surface internal electrode closest to the second main surface is designated as the second outermost side surface internal electrode. Let a4 be the distance between the second outermost surface internal electrode and the second main surface on the aforementioned reference line. When the distance between one of the ends of the inner electrode of the second outermost surface in the longitudinal direction on the second surface and the second main surface is b8, A multilayer ceramic capacitor according to claim 9 or 10, wherein b8 < a4.

16. When the distance c8 is the longitudinal center of the inner electrode of the second outermost surface on the second surface and the second main surface, The multilayer ceramic capacitor according to claim 15, wherein b8 ≤ c8.

17. A laminate comprising a plurality of stacked dielectric layers and a plurality of internal electrodes arranged on each of the plurality of dielectric layers, having a first main surface and a second main surface facing each other in the stacking direction, a first side surface and a second side surface facing each other in the width direction perpendicular to the stacking direction, and a first end surface and a second end surface facing each other in the length direction perpendicular to the stacking direction and the width direction, End face external electrodes arranged in pairs on each of the aforementioned end faces, Side external electrodes are arranged in pairs on each of the aforementioned side surfaces, Equipped with, The plurality of internal electrodes are a multilayer ceramic capacitor having end-face internal electrodes exposed on both the first end face and the second end face, and side-face internal electrodes exposed on both the first side surface and the second side surface, A straight line extending parallel to the stacking direction, passing through the central portion in the longitudinal direction of the laminate and the central portion in the width direction of the laminate, is used as the reference line. The side internal electrode closest to the first main surface is designated as the first outermost side internal electrode. Let a3 be the distance between the first outermost inner electrode and the first main surface on the aforementioned reference line. When the distance between one of the ends of the inner electrode of the first outermost surface in the longitudinal direction on the first surface and the first main surface is b5, A multilayer ceramic capacitor where b5 < a3.