Multilayer electronic components

Abstract

This mitigates the problem of reduced airtightness in multilayer electronic components due to areas where the external electrodes are thinly coated. [Solution] A stacked electronic component according to one embodiment of the present invention includes a dielectric layer 111 and internal electrodes 121, 122 arranged alternately with the dielectric layer in a first direction, and comprises a body 110 including a first and second surface facing the first direction, a third and fourth surface facing the second direction perpendicular to the first direction, and a fifth and sixth surface facing the third direction perpendicular to the first and second directions; a metal layer 120 arranged at the corners connecting the first and fifth surfaces, the first and sixth surfaces, the second and fifth surfaces, and the second and sixth surfaces; a first external electrode 130 arranged on the third surface; and a second external electrode 140 arranged on the fourth surface, wherein the metal layer contains nickel (Ni) and further contains one or more of phosphorus (P) and boron (B).

Description

[Technical Field]

[0001] This invention relates to a stacked electronic component. [Background technology]

[0002] A multilayer ceramic capacitor (MLCC), a type of multilayer electronic component, is a chip-type capacitor that is mounted on the printed circuit boards of various electronic products, such as video equipment like liquid crystal displays (LCDs) and plasma display panels (PDPs), computers, smartphones and mobile phones, on-board chargers (OBCs) in electric vehicles, and DC-DC converters, and plays the role of charging or discharging electricity.

[0003] Examples of methods to improve the moisture resistance reliability of multilayer ceramic capacitors include forming the external electrodes densely or increasing the thickness of the external electrodes. However, when miniaturizing multilayer ceramic capacitors, the method of forming the external electrodes densely may have limitations because it is difficult to improve the density of the external electrodes. When increasing the thickness of the external electrodes, the specific gravity occupied by the external electrodes in the overall component increases, which may result in the problem of not being able to secure sufficient capacitance per unit volume.

[0004] In particular, when the under electrode layer of the external electrodes of a multilayer ceramic capacitor is formed by applying and firing a conductive paste, the thickness of the under electrode layer will be thinner at the corners of the main body. This may result in abrasion during the subsequent plating process, which could lead to a decrease in the airtightness of the multilayer ceramic capacitor.

[0005] On the other hand, depending on the application of the multilayer ceramic capacitor, a ground electrode may be formed in addition to the terminal electrodes. In this case, a separate process of applying and firing a conductive paste is required, which may lead to the problem of having to perform an additional process. Similarly, the process of forming the ground electrode at the corner of the main body may lead to a decrease in the airtightness of the multilayer ceramic capacitor, as mentioned above.

[0006] Therefore, there is a need for structural improvements that can easily achieve miniaturization and increased capacitance of multilayer ceramic capacitors while also improving their sealing performance. [Overview of the project] [Problems that the invention aims to solve]

[0007] One of the several objectives of the present invention is to mitigate the problem of reduced airtightness of multilayer electronic components due to areas where the external electrodes are thinly coated.

[0008] One of the several objectives of the present invention is to alleviate the problem of difficulty in forming a uniform base electrode layer when forming the base electrode layer of an external electrode by firing using a conductive paste.

[0009] One of the several objectives of the present invention is to mitigate the problem of reduced airtightness that can occur when forming a ground electrode in a multilayer electronic component.

[0010] One of the several objectives of the present invention is to solve the problem that when forming a ground electrode on a multilayer electronic component, an additional step of applying a conductive paste must be performed.

[0011] However, the objectives of the present invention are not limited to those described above and can be more easily understood in the process of describing specific embodiments of the present invention. [Means for solving the problem]

[0012] A stacked electronic component according to one embodiment of the present invention includes a dielectric layer and internal electrodes alternately arranged with the dielectric layer in a first direction, and comprises a body including a first and second surface facing the first direction, a third and fourth surface facing a second direction perpendicular to the first direction, and a fifth and sixth surface facing a third direction perpendicular to the first and second directions; a metal layer disposed at the corner connecting the first and fifth surfaces, the corner connecting the first and sixth surfaces, the corner connecting the second and fifth surfaces, and the corner connecting the second and sixth surfaces; a first external electrode disposed on the third surface; and a second external electrode disposed on the fourth surface, wherein the metal layer contains nickel (Ni) and may further contain one or more of phosphorus (P) and boron (B). [Effects of the Invention]

[0013] One of the various effects of the present invention is to mitigate the problem of reduced airtightness in multilayer electronic components due to areas where the external electrodes are thinly coated.

[0014] One of the various effects of the present invention is to alleviate the problem of difficulty in forming a uniform base electrode layer when forming the base electrode layer of an external electrode by firing using a conductive paste.

[0015] One of the various effects of the present invention is to mitigate the problem of reduced airtightness that can occur when forming a ground electrode on a multilayer electronic component.

[0016] One of the various effects of the present invention is to solve the problem that when forming a ground electrode on a multilayer electronic component, it is necessary to perform an additional step of applying a conductive paste.

[0017] However, the diverse yet beneficial advantages and effects of the present invention are not limited to those described above and can be more easily understood in the process of describing specific embodiments of the present invention. [Brief explanation of the drawing]

[0018] [Figure 1]Schematically shows a perspective view of a stacked electronic component according to an embodiment of the present invention. [Figure 2] Schematically shows a cross-sectional view taken along line I-I' of FIG. 1. [Figure 3] Schematically shows a cross-sectional view taken along line II-II' of FIG. 1. [Figure 4] Schematically shows an enlarged view of the P region in FIG. 3. [Figure 5] Schematically shows a cross-sectional view taken along line III-III' of FIG. 1. [Figure 6] Schematically shows a cross-sectional view taken along line IV-IV' of FIG. 1. [Figure 7] Schematically shows a perspective view of a main body according to an embodiment. [Figure 8] Schematically shows a perspective view of a state where a metal layer is formed on a main body according to an embodiment. [Figure 9] Schematically shows an exploded perspective view of a main body according to an embodiment. [Figure 10] Schematically shows a perspective view of a stacked electronic component according to an embodiment. [Figure 11] Schematically shows a perspective view of a main body according to an embodiment. [Figure 12] Schematically shows a perspective view of a state where a metal layer is formed on a main body according to an embodiment. [Figure 13] Schematically shows an exploded perspective view of a main body according to an embodiment.

Mode for Carrying Out the Invention

[0019] Embodiments of the present invention will be described below with reference to specific embodiments and accompanying drawings. However, embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Furthermore, embodiments of the present invention are provided to give a more complete explanation of the present invention to a person of the ordinary skill. Accordingly, the shapes and sizes of elements in the drawings may be exaggerated for clearer explanation, and elements indicated by the same reference numerals in the drawings are the same elements.

[0020] Furthermore, in order to clearly illustrate the present invention in the drawings, parts unrelated to the explanation have been omitted, and the size and thickness of each component shown in the drawings are arbitrarily shown for the convenience of explanation; therefore, the present invention is not necessarily limited to what is shown. Components with the same function within the scope of the same concept are described using the same reference numerals. Moreover, throughout the specification, when a part "includes" a certain component, this does not exclude other components unless otherwise stated, but rather means that it may further include other components.

[0021] In the figure, the first direction can be defined as the stacking direction or thickness direction, the second direction as the length direction, and the third direction as the width direction.

[0022] Figure 1 schematically shows a perspective view of a stacked electronic component according to one embodiment of the present invention, Figure 2 schematically shows a cross-sectional view along the line I-I' in Figure 1, Figure 3 schematically shows a cross-sectional view along the line II-II' in Figure 1, Figure 4 schematically shows an enlarged view of region P in Figure 3, Figure 5 schematically shows a cross-sectional view along the line III-III' in Figure 1, Figure 6 schematically shows a cross-sectional view along the line IV-IV' in Figure 1, and Figure 7 schematically shows a perspective view of the main body according to one embodiment. Figure 8 schematically shows a perspective view of the main body with a metal layer formed on it according to one embodiment, Figure 9 schematically shows an exploded perspective view of the main body according to one embodiment, Figure 10 schematically shows a perspective view of a stacked electronic component according to one embodiment, Figure 11 schematically shows a perspective view of the main body according to one embodiment, Figure 12 schematically shows a perspective view of the main body with a metal layer formed on it according to one embodiment, and Figure 13 schematically shows an exploded perspective view of the main body according to one embodiment.

[0023] Hereinafter, with reference to Figures 1 to 13, a stacked electronic component 100 according to one embodiment of the present invention and various embodiments thereof will be described in detail.

[0024] A stacked electronic component 100 according to one embodiment of the present invention includes a dielectric layer 111 and internal electrodes 121, 122 arranged alternately with the dielectric layer in a first direction, and comprises a body 110 including a first surface 1 and a second surface 2 facing the first direction, a third surface 3 and a fourth surface 4 facing the second direction perpendicular to the first direction, and a fifth surface 5 and a sixth surface 6 facing the first direction and the third direction perpendicular to the second direction; a metal layer 120 arranged at the corners connecting the first surface and the fifth surface, the corners connecting the first surface and the sixth surface, the corners connecting the second surface and the fifth surface, and the corners connecting the second surface and the sixth surface; a first external electrode 130 arranged on the third surface; and a second external electrode 140 arranged on the fourth surface, wherein the metal layer contains nickel (Ni) and may further contain one or more of phosphorus (P) and boron (B).

[0025] The main body 110 may include a dielectric layer 111 and internal electrodes 121 and 122, and the dielectric layer 111 and internal electrodes 121 and 122 may be arranged alternately in a first direction. That is, in the present invention, the first direction may mean the stacking direction of the dielectric layer 111 and internal electrodes 121 and 122.

[0026] There are no particular restrictions on the specific shape of the main body 110, but as shown in Figure 7, the main body 110 can be a hexahedron or a similar shape. Due to the shrinkage of the ceramic powder contained in the main body 110 during the firing process, the main body 110 may not be a perfectly straight hexahedron, but it may have a substantially hexahedron shape.

[0027] The main body 110 may have a first surface 1 and a second surface 2 facing each other in a first direction, a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 2 and facing each other in a second direction perpendicular to the first direction, and a fifth surface 5 and a sixth surface 6 connected to the first surface 1 and the second surface 2 and connected to the third surface 3 and the fourth surface 4 and facing each other in a third direction perpendicular to the first and second directions.

[0028] On the other hand, when margin regions where internal electrodes 121 and 122 are not placed on the dielectric layer 111 overlap, steps are generated due to the thickness of the internal electrodes 121 and 122, and the corners connecting the first surface with the third, fourth, fifth, and sixth surfaces and / or the corners connecting the second surface with the third, fourth, fifth, and sixth surfaces may have a form that is contracted toward the center in the first direction of the main body 110 when viewed with reference to the first or second surface. Alternatively, due to the contraction behavior during the sintering process of the main body, the corners connecting the first surface 1 with the third surface 3 with the fourth surface 4 with the fifth surface 5 and sixth surface 6 and / or the corners connecting the second surface 2 with the third surface 3 with the fourth surface 4 with the fifth surface 5 and sixth surface 6 may have a form that is contracted toward the center in the first direction of the main body 110 when viewed with reference to the first or second surface. Alternatively, in order to prevent chipping defects, the corners connecting the faces of the main body 110 can be rounded by performing a separate process to round the corners connecting the first face with the third, fourth, fifth, and sixth faces, and / or the corners connecting the second face with the third, fourth, fifth, and sixth faces.

[0029] The multiple dielectric layers 111 forming the main body 110 are in a fired state, and the boundaries between adjacent dielectric layers 111 can be integrated to such an extent that they are difficult to confirm without using a scanning electron microscope (SEM). There is no particular limit to the number of dielectric layers stacked, and it can be determined considering the size of the multilayer electronic component. For example, the main body can be formed by stacking 400 or more dielectric layers.

[0030] The dielectric layer 111 can be formed by manufacturing a ceramic slurry containing ceramic powder, an organic solvent, and a binder, applying and drying the slurry on a carrier film to provide a ceramic green sheet, and then firing the ceramic green sheet. The ceramic powder is not particularly limited as long as sufficient capacitance can be obtained. For example, as the ceramic powder, a barium titanate (BaTiO3)-based powder can be used. As a more specific example, the barium titanate (BaTiO3)-based powder can be one or more of BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), and Ba(Ti 1-y Zr y )O3 (0 < y < 1). The CaZrO3-based normal dielectric powder can be (Ca 1-x Sr x )(Zr 1-y Ti y )O3 (0 < x < 1, 0 < y < 1).

[0031] The average thickness td of the dielectric layer 111 is not particularly limited.

[0032] When aiming for miniaturization and high capacitance of the multilayer electronic component 100, the average thickness td of the dielectric layer 111 may be 0.35 μm or less. When aiming to improve the reliability of the multilayer electronic component 100 under high temperature and high pressure, the average thickness td of the dielectric layer 111 may be 3 μm or more.

[0033] The average thickness td of the dielectric layer 111 can mean the average thickness of one or more of the plurality of dielectric layers.

[0034] The average thickness td of the dielectric layer 111 can be measured by scanning images of the cross-sections (LT cross-sections) of the main body 110 in the first and second directions using a scanning electron microscope (SEM). For example, the average thickness td of the dielectric layer 111 may be the average of the thicknesses measured at the 1 / 4, 2 / 4, and 3 / 4 points, where the dielectric layer is divided into four equal parts in the length direction, using one dielectric layer adjacent to the point where the center line in the length direction and the center line in the thickness direction of the capacitance forming section meet as a reference. By extending such measurements to the two upper and two lower dielectric layers that are equally spaced with respect to one dielectric layer adjacent to the point where the center line in the length direction and the center line in the thickness direction of the capacitance forming section meet as a reference, the average thickness of the dielectric layer can be further generalized.

[0035] The main body 110 may include a capacitance forming section Ac which is disposed inside the main body 110 and includes first internal electrodes 121 and second internal electrodes 122 which are alternately arranged with the dielectric layer 111 to form a capacitance, and cover sections 112 and 113 which are formed on the upper and lower parts of the capacitance forming section Ac in a first direction.

[0036] The capacitance-forming portion Ac is the part that contributes to the capacitance formation of the capacitor, and can be formed by repeatedly stacking a plurality of first internal electrodes 121 and second internal electrodes 122 with a dielectric layer 111 in between, and can represent a region in which the first internal electrodes 121 and second internal electrodes 122 overlap in a first direction. Furthermore, the first internal electrode 121 can be positioned at the uppermost end of the capacitance-forming portion Ac in the first direction, and the second internal electrode 122 can be positioned at the lowermost end in the same first direction.

[0037] The internal electrodes 121 and 122 may include a first internal electrode 121 and a second internal electrode 122. The first internal electrode 121 and the second internal electrode 122 are arranged alternately so as to face each other across the dielectric layer 111 that constitutes the main body 110, and can be exposed on the third surface 3 and the fourth surface 4 of the main body 110, respectively. That is, in one embodiment, one end of the first internal electrode 121 in the second direction can be in contact with the third surface 3, and one end of the second internal electrode 122 in the second direction can be in contact with the fourth surface 4.

[0038] Referring to Figure 2, the first internal electrode 121 can be connected to the first external electrode 130, and the second internal electrode 122 can be connected to the second external electrode 140.

[0039] The first internal electrode 121 may be connected to the first external electrode 130 but not to the second external electrode 140, and the second internal electrode 122 may be connected to the second external electrode 140 but not to the first external electrode 130. That is, the first internal electrode 121 may be formed at a certain distance from the fourth surface 4, and the second internal electrode 122 may be formed at a certain distance from the third surface 3. In addition, the first internal electrode 121 and the second internal electrode 122 may be arranged at a distance from the fifth and sixth surfaces of the main body 110.

[0040] The conductive metals contained in the internal electrodes 121 and 122 may be one or more of Ni, Cu, Pd, Ag, Au, Pt, In, Sn, Al, Ti, and alloys thereof, but the present invention is not limited thereto.

[0041] The average thickness te of the internal electrodes 121 and 122 is not particularly limited and may vary depending on the purpose. To miniaturize the multilayer electronic component 100, the average thickness te of the internal electrodes 121 and 122 may be 0.35 μm or less, and to improve the reliability of the multilayer electronic component 100 under high temperature and high pressure, the average thickness te of the internal electrodes 121 and 122 may be 3 μm or more.

[0042] The average thickness te of internal electrodes 121 and 122 can mean the average thickness of one or more internal electrodes among a group of internal electrodes.

[0043] The average thickness te of the internal electrodes 121 and 122 can be measured by scanning images of the cross-sections (LT cross-sections) of the main body 110 in the first and second directions using a scanning electron microscope (SEM). For example, the average thickness td of the dielectric layer 111 may be the average of the thicknesses measured at the 1 / 4, 2 / 4, and 3 / 4 points, which divide the internal electrode into four equal parts in the length direction, using one internal electrode layer adjacent to the point where the center line in the length direction and the center line in the thickness direction of the capacitance forming section meet as a reference. By extending such measurements to the two upper and two lower internal electrodes that are equally spaced relative to the one internal electrode layer adjacent to the point where the center line in the length direction and the center line in the thickness direction of the capacitance forming section meet as a reference, the average thickness of the internal electrodes can be further generalized.

[0044] Referring to Figure 9, cover portions 112 and 113 can be arranged on the upper and lower surfaces of the volume forming portion Ac in the first direction.

[0045] The cover portions 112 and 113 can essentially serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0046] The cover portions 112 and 113 can contain the same material as the dielectric layer 111. That is, the cover portions 112 and 113 can contain ceramic materials, for example, barium titanate (BaTiO3) based ceramic materials.

[0047] On the other hand, the thickness of the cover portions 112 and 113 is not particularly limited. For example, the thickness tc1 of the cover portions 112 and 113 may be 20 μm or less.

[0048] The average thickness tc1 of the cover portions 112 and 113 can represent the size in the first direction, and can be the average value of the sizes of the cover portions 112 and 113 in the first direction measured at five equally spaced points on the upper or lower part of the volume forming portion Ac.

[0049] Referring to Figure 5, margin portions 114 and 115 can be arranged on the side surface of the volume-forming portion Ac.

[0050] The margin portions 114 and 115 may include a first margin portion 114 located on the fifth surface 5 of the main body 110 and a second margin portion 115 located on the sixth surface 6. That is, the margin portions 114 and 115 may be located on both end surfaces in the width direction of the ceramic main body 110.

[0051] As shown in Figure 5, the margin portions 114 and 115 can refer to the regions between the interface between both ends of the first internal electrode 121 and the second internal electrode 122 and the body 110 in a cross-section obtained by cutting the body 110 in the width-thickness (WT) direction.

[0052] The margins 114 and 115 can essentially serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0053] The margin portions 114 and 115 may be formed by applying a conductive paste to the ceramic green sheet, except for the areas where the margin portions are formed, to form internal electrodes.

[0054] On the other hand, the widths of the margin portions 114 and 115 do not need to be particularly limited. For example, the average width of the margin portions 114 and 115 may be 20 μm or less.

[0055] The average width of the margin portions 114 and 115 can represent the average size in the third direction of the region where the internal electrode is separated from the fifth surface, and the average size in the third direction of the region where the internal electrode is separated from the sixth surface, and can be the average value of the sizes of the margin portions 114 and 115 in the third direction measured at five equally spaced points on the side surface of the capacitance forming portion Ac.

[0056] The external electrodes 130 and 140 may be placed on the main body 110, specifically on the third surface 3 and the fourth surface 4 of the main body 110.

[0057] The external electrodes 130 and 140 may include a first external electrode 130 positioned on the third surface 3 of the main body 110, and a second external electrode 140 positioned on the fourth surface 4 of the main body 110.

[0058] On the other hand, it is not necessary to limit the external electrodes 130 and 140 to those arranged only on the third surface 3 and fourth surface 4 of the main body. Referring to Figures 1 and 2, the first external electrode 130 may extend from the third surface 3 of the main body 110 to a portion of the first, second, fifth and sixth surfaces 1, 2, 5, and 6, and the second external electrode 140 may extend from the fourth surface 4 to a portion of the first, second, fifth and sixth surfaces 1, 2, 5, and 6.

[0059] The external electrodes 130 and 140 may include electrode layers 131 and 141 that are placed on the main body 110 and connected to the internal electrodes 121 and 122.

[0060] Specifically, the first internal electrode 130 may include a first electrode layer 131 disposed on the main body 110 and connected to the first internal electrode 121, and the second internal electrode 140 may include a second electrode layer 141 disposed on the main body 110 and connected to the second internal electrode 122.

[0061] The first electrode layer 131 and the second electrode layer 141 are connected to the internal electrodes 121 and 122, respectively, and can play a role in ensuring electrical connectivity between the external electrodes 130 and 140 and the internal electrodes 121 and 122.

[0062] The first electrode layer 131 and the second electrode layer 141 may contain conductive metals. The conductive metal can be any material with excellent electrical conductivity, and is not particularly limited. For example, the conductive metal may be one or more of nickel (Ni), copper (Cu), and their alloys.

[0063] As a more specific example for the first electrode layer 131 and the second electrode layer 141, the electrode layers may be fired electrodes containing a conductive metal and glass, or resin-based electrodes containing a conductive metal and resin.

[0064] The first electrode layer 131 and the second electrode layer 141 may be formed in a manner in which a fired electrode and a resin-based electrode are sequentially formed on the main body. Furthermore, the electrode layers may be formed by transferring a sheet containing a conductive metal onto the main body, or by transferring a sheet containing a conductive metal onto a fired electrode.

[0065] The size of the stacked electronic component 100 is not particularly limited. For example, the length of the stacked electronic component 100 may be between 0.1 mm and 10.0 mm, the thickness of the stacked electronic component 100 may be between 0.1 mm and 10.0 mm, and the width of the stacked electronic component 100 may be between 0.1 mm and 10.0 mm.

[0066] Here, the length of the stacked electronic component 100 can mean the maximum size of the stacked electronic component 100 in the second direction, the thickness of the stacked electronic component 100 can mean the maximum size of the stacked electronic component 100 in the first direction, and the width of the stacked electronic component 100 can mean the maximum size of the stacked electronic component 100 in the third direction.

[0067] As mentioned above, the main body 110 may include corners connecting the first surface 1 with the third surface 3, fourth surface 4, fifth surface 5 and sixth surface 6, and / or corners connecting the second surface with the third surface 3, fourth surface 4, fifth surface 5 and sixth surface 6. Such corners of the main body 110 may become the main penetration routes for moisture or plating solution from the outside, and in particular, the corners connecting the first surface and the fifth surface, the corners connecting the first surface and the sixth surface, the corners connecting the second surface and the fifth surface, and the corners connecting the second surface and the sixth surface may become vulnerable to moisture and plating solution from the outside as a result of the electrode layers 131 and 141 of the external electrodes 130 and 140 being formed thinly. This may result in a problem in ensuring the airtightness of the multilayer electronic component 100.

[0068] Conventionally, attempts have been made to improve the airtightness of the laminated electronic component 100 by densely forming external electrodes on the corners of the main body 110 or by increasing the thickness of the external electrodes. However, when densely forming external electrodes, there may be limitations when miniaturizing the laminated electronic component because it is difficult to improve the density of the external electrodes. When the thickness of the external electrodes is increased, the specific gravity occupied by the external electrodes in the entire component increases, which may result in the problem of not being able to secure a sufficient volume per unit volume.

[0069] Therefore, in one embodiment of the present invention, by arranging metal layers at the corners connecting the first surface and the fifth surface, the corners connecting the first surface and the sixth surface, the corners connecting the second surface and the fifth surface, and the corners connecting the second surface and the sixth surface, the corners of the main body 110, which are vulnerable to the penetration of moisture or plating solution from the outside, are protected, and the airtightness of the laminated electronic component 100 can be improved by forming the external electrodes 130 and 140 located on the corners of the main body 110 to a sufficient thickness.

[0070] On the other hand, since the corners of the main body 110 can be made of the ceramic material of the dielectric layer 111, if a metal layer made of a single element is formed, it may be difficult to ensure sufficient bonding force between the metal layer 120 and the main body 110. Also, if the metal layer 120 is formed by applying a conductive paste containing a conductive metal, it may be difficult to form a uniform metal layer 120 at the corners of the main body 110.

[0071] Therefore, in one embodiment of the present invention, by making the metal layer 120 contain nickel (Ni) and further contain one or more of phosphorus (P) and boron (B), a thin and uniform metal layer 120 can be formed at the corners connecting the first surface and the fifth surface, the corners connecting the first surface and the sixth surface, the corners connecting the second surface and the fifth surface, and the corners connecting the second surface and the sixth surface, thereby ensuring sufficient adhesion between the metal layer 120 and the main body 110.

[0072] Since the metal layer 120 is formed at the corners of the main body 110, which can be the main penetration routes for moisture or plating solution from the outside, if the metal layer 120 itself acts as a barrier against the penetration of moisture or plating solution from the outside, the moisture resistance reliability of the multilayer electronic component 100 can be further improved. Specifically, the metal layer 120 does not have to substantially contain glass components, which are vulnerable to plating solutions, and may consist substantially only of metal. For example, the content of metal elements relative to the total elements contained in the metal layer 120 may be 80 at% or more.

[0073] Referring to Figure 8, the metal layer 120 may include a first metal layer with one end in the second direction in contact with the third surface 3, and a second metal layer with one end in the second direction in contact with the fourth surface 4. In this case, the first metal layer and the second metal layer can be arranged spaced apart in the second direction. This prevents electrical connection between the first metal layer and the second metal layer.

[0074] Referring to Figures 3 and 4, the electrode layers 131 and 141 can be arranged to cover the metal layer 120. This further improves the effect of suppressing the penetration of moisture from the outside or erosion from the plating solution.

[0075] Referring to Figures 3 and 4, the length of the main body 110 in the second direction is denoted by L, the thickness of the main body 110 in the first direction is denoted by T, the length of the metal layer 120 in the second direction is denoted by lp, and the thickness of the metal layer 120 in the first direction is denoted by tp.

[0076] If lp / L is less than 0.05, the effect of the metal layer 120 covering the corners of the main body 110 may not be sufficient. If lp / L exceeds 0.33, the external electrodes 130 and 140 formed on the metal layer 120 may be excessively formed in the second direction, making it difficult to ensure sufficient spacing between the external electrodes 130 and 140. Therefore, in one embodiment, by ensuring that lp / L is between 0.05 and 0.33, the effect of the metal layer 120 in protecting the corners of the main body 110 can be sufficiently ensured, and sufficient spacing between the external electrodes 130 and 140 can be ensured.

[0077] Referring to Figures 3, 4, and 7, the metal layer 120 can also be placed at the corners connecting the first surface 1 with the third surface 3 and / or the fourth surface 4, and at the corners connecting the second surface 2 with the third surface 3 and / or the fourth surface 4. That is, the metal layer 120 may extend to a part of the third surface 3 or the fourth surface 4. This further improves the airtightness of the stacked electronic component 100 according to the present invention. In this case, if tp / T exceeds 0.04, the thickness of the external electrodes 130 and 140 formed in areas other than the corners increases, which may reduce the effect of improving the capacity per unit volume of the stacked electronic component 100. Therefore, in one embodiment, by ensuring that tp / T is 0.04 or less, it is possible to prevent a decrease in the effect of improving the capacity per unit volume of the stacked electronic component 100 while ensuring the airtightness of the stacked electronic component 100 according to the present invention.

[0078] On the other hand, the lower limit of tp / T is not particularly limited, and tp may be 1 μm or more in order to form the metal layer 120 to a sufficient thickness.

[0079] The method for measuring L, lp, T, and tp is not particularly limited. For example, L, lp, T, and tp can be measured using equipment such as an optical microscope (OM) or a scanning electron microscope (SEM) in a cross-section as shown in Figure 3, which is a cross-section in the first and second directions after polishing the multilayer electronic component 100 in the third direction to a point where the metal layer 120 and internal electrodes 121 and 122 are simultaneously exposed. In this case, L may represent the maximum size of the multilayer electronic component 100 in the second direction, T may represent the maximum size of the multilayer electronic component 100 in the first direction, lp may represent the length in the second direction between one end of the metal layer 120 in the second direction and the outermost edge of the main body 110 in the second direction, and tp may represent the maximum thickness in the first direction of the metal layer 120 placed on the surface of the main body 110 facing the first direction.

[0080] Referring to Figure 6, the first electrode layer 131 can have a maximum thickness (tmax) and a minimum thickness (tmin) in the region between the extension line Et of the first internal electrode 121 located at the uppermost end in the first direction and the extension line Eb of the first internal electrode 121 located at the lowermost end in the first direction. In one embodiment of the present invention, when a metal layer 120 is placed at the corners connecting the first surface and the fifth surface, the corners connecting the first surface and the sixth surface, the corners connecting the second surface and the fifth surface, and the corners connecting the second surface and the sixth surface, the external electrodes 130 and 140 can be formed with a more uniform thickness compared to when the metal layer 120 is not formed. Specifically, in one embodiment, tmin / tmax may be 0.5 or more and 1 or less. Although Figure 6 shows the first electrode layer 131, the characteristics regarding the thickness variation of the first electrode layer 131 can be similarly applied to the second electrode layer 141 of the second external electrode 140.

[0081] The method for measuring tmin and tmax is not particularly limited. Tmin and tmax can be measured using equipment such as an optical microscope (OM) or scanning electron microscope (SEM) in a cross-section as shown in Figure 6, which is a cross-section in the first and third directions of the multilayer electronic component 100, polished so that the metal layer 120 and the first internal electrode 121 are simultaneously exposed in the second direction. Tmin and tmax may represent the thickness of the first internal electrode 121 in the third direction, measured in the region between the extension line Et of the first internal electrode 121 located at the uppermost end in the first direction and the extension line Eb of the first internal electrode 121 located at the lowermost end in the first direction.

[0082] In one embodiment, the metal layer 120 can be arranged at a distance from the internal electrodes 121 and 122. This prevents the external electrodes 130 and 140 formed in the region excluding the corners of the main body 110 from being excessively thick, and further improves the effect of improving the capacitance per unit volume of the stacked electronic component 100.

[0083] Referring to Figure 10, the stacked electronic component 100' according to one embodiment may further include a third external electrode 150 disposed on the fifth surface 5 of the main body 110', and a fourth external electrode 160 disposed on the sixth surface 6 of the main body 110'.

[0084] The main body 110' according to one embodiment may include, as shown in Figure 13, a first internal electrode 121 with one end in the second direction in contact with the third surface 3, a second internal electrode 122 with one end in the second direction in contact with the fourth surface 4, and a third internal electrode 123 with one end in the third direction in contact with the fifth surface 5 and the other end in the third direction in contact with the sixth surface. The main body 110' according to one embodiment may have the same configuration as the main body 100 according to one embodiment, except that it further includes the third internal electrode 123. For example, as shown in Figure 12, a metal layer 120 may be placed at the corners connecting the first surface and the fifth surface of the main body 110', the corners connecting the first surface and the sixth surface, the corners connecting the second surface and the fifth surface, and the corners connecting the second surface and the sixth surface.

[0085] Referring to Figure 11, in the main body 110' according to one embodiment, one end of the first internal electrode 121 is in contact with the third surface 3, and although not directly shown in Figure 11, the second internal electrode 122 can be in contact with the fourth surface 4, and the third internal electrode 123 can be in contact with the fifth surface and the sixth surface 6. On the other hand, the present invention describes a case in which each of the third internal electrodes 123 is in contact with the fifth surface 5 and the sixth surface 6 simultaneously, but is not limited to this, and a part of the third internal electrode can be in contact with the fifth surface 5, and another part can be in contact with the sixth surface 6.

[0086] In one embodiment, the third external electrode 150 and the fifth external electrode 160 contain nickel (Ni) and may further contain one or more of phosphorus (P) and boron (B). This can mitigate the problem of reduced airtightness that may occur when forming ground electrodes on multilayer electronic components, and also solve the problem of having to perform the step of applying a conductive paste.

[0087] In one embodiment, the metal layer 120 can be formed by electroless plating. This makes it possible to form a uniform and dense metal layer 120 on the corners of the main body 110, which does not contain any metal components.

[0088] There are no particular limitations on the method for adjusting the length, thickness, and coating area of ​​the metal layer 120. For example, when forming the metal layer 120 by nickel (Ni) electroless plating, after firing the main body 110, degreasing and pretreatment can be performed, followed by coating the area where the metal layer 120 will be formed with catalyst particles such as palladium (Pd) or other seed layers, then depositing this in a solution containing Ni ions, and finally reducing the Ni ions.

[0089] In one embodiment, the third external electrode 150 and the fourth external electrode 160 can be formed by electroless plating. This allows the third external electrode 150 and the fourth external electrode 160 to be formed uniformly and densely on the corners of the main body 110' and on the first surface 1 and second surface 2 of the main body 110'.

[0090] On the other hand, the third external electrode 150 and the fourth external electrode 160 can be formed by the same electroless plating method as the metal layer 120, but are not limited to this method.

[0091] As described above, embodiments of the present invention have been explained in detail, but the present invention is not limited by the embodiments described above and the accompanying drawings, but is limited by the claims provided. Therefore, within the scope of the technical idea of ​​the present invention as described in the claims, various forms of substitution, modification, and alteration are possible by persons with ordinary skill in the art, and these also fall within the scope of the present invention.

[0092] Furthermore, the expression “one embodiment” as used in this disclosure does not mean that each embodiment is the same as another, but is provided to highlight and illustrate the unique and distinct features of each embodiment. However, the embodiments presented above do not preclude their realization in combination with features of other embodiments. For example, even if a matter described in one embodiment is not described in another embodiment, it can be understood as a description related to the other embodiment unless there is a contradictory or contrary description of that matter in the other embodiment.

[0093] The terms used in this disclosure are used solely to illustrate one embodiment and are not intended to limit the disclosure. Where otherwise clearly the context indicates otherwise, singular expressions include plural expressions. [Explanation of symbols]

[0094] 100, 100': Multilayer electronic components 110, 110': Main unit 111: Dielectric layer 112, 113: Cover section 114, 115: Margin section 120: Metal layer 121, 122, 123: Internal electrode 131, 141: Electrode layer 132, 142: Plating layer 130, 140, 150, 160: External electrodes

Claims

1. A body including a dielectric layer and internal electrodes arranged alternately with the dielectric layer in a first direction, the body including a first and second surface facing the first direction, a third and fourth surface facing the second direction perpendicular to the first direction, and a fifth and sixth surface facing the third direction perpendicular to the first and second directions, A metal layer is disposed at the corner connecting the first surface and the fifth surface, the corner connecting the first surface and the sixth surface, the corner connecting the second surface and the fifth surface, and the corner connecting the second surface and the sixth surface. The first external electrode is arranged on the third surface, The system includes a second external electrode positioned on the fourth surface, A multilayer electronic component wherein the metal layer contains nickel (Ni) and further contains one or more of phosphorus (P) and boron (B).

2. The stacked electronic component according to claim 1, wherein the internal electrode includes a first internal electrode whose one end in the second direction is in contact with the third surface, and a second internal electrode whose one end in the second direction is in contact with the fourth surface.

3. The stacked electronic component according to claim 1, wherein the metal layer includes a first metal layer whose one end in the second direction is in contact with the third surface, and a second metal layer which is spaced apart from the first metal layer in the second direction and whose one end in the second direction is in contact with the fourth surface.

4. The laminated electronic component according to claim 1, wherein when the length of the main body in the second direction is L and the length of the metal layer in the second direction is lp, lp / L satisfies 0.05 or more and 0.33 or less.

5. The stacked electronic component according to claim 1, wherein when the thickness of the main body in the first direction is T and the thickness of the metal layer in the first direction is tp, tp / T satisfies 0.04 or less.

6. The first external electrode includes a first electrode layer in contact with the third surface and a first plating layer disposed on the first electrode layer, and the second external electrode includes a second electrode layer in contact with the fourth surface and a second plating layer disposed on the second electrode layer. The stacked electronic component according to claim 1, wherein the first electrode layer and the second electrode layer cover the metal layer.

7. The first external electrode includes a first electrode layer in contact with the third surface and a first plating layer disposed on the first electrode layer, and the second external electrode includes a second electrode layer in contact with the fourth surface and a second plating layer disposed on the second electrode layer. The stacked electronic component according to claim 1, wherein when the maximum thickness of the first electrode layer and the second electrode layer is tmax and the minimum thickness is tmin, tmin / tmax is 0.5 or more and 1.0 or less.

8. The stacked electronic component according to claim 1, wherein the metal layer is arranged to extend to a part of the third or fourth surface.

9. The stacked electronic component according to claim 1, wherein the metal layer is arranged at a distance from the internal electrodes.

10. The aforementioned multilayer electronic component is The stacked electronic component according to any one of claims 1 to 9, further comprising a third external electrode disposed on the fifth surface and a fourth external electrode disposed on the sixth surface.

11. The stacked electronic component according to claim 10, wherein the internal electrodes include a first internal electrode whose one end in the second direction is in contact with the third surface, a second internal electrode whose one end in the second direction is in contact with the fourth surface, and a third internal electrode whose one end in the third direction is in contact with the fifth surface and the other end in the third direction is in contact with the sixth surface.

12. The stacked electronic component according to claim 10, wherein the third external electrode and the fourth external electrode contain nickel (Ni) and further contain one or more of phosphorus (P) and boron (B).

13. The stacked electronic component according to claim 10, wherein the third external electrode and the fourth external electrode are formed by an electroless plating method.

14. The stacked electronic component according to any one of claims 1 to 9, wherein the metal layer is formed by an electroless plating method.

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