Photosensitive resin composition, cured product, partition wall, organic electroluminescent element, and image display device

Abstract

This photosensitive resin composition contains (a) alkali-soluble resin, (b) a liquid repellent, (c) a photopolymerization initiator, and (d) a photopolymerizable compound. The (a) alkali-soluble resin contains polyamide-imide (meth) acrylate resin (a-1) containing a specific structure.　According to the present invention, it is possible to provide a photosensitive resin composition that can form a partition wall that can exhibit liquid repellency with a lower exposure amount and exhibits excellent step-forming properties and ink-jet coating properties.

Description

Photosensitive resin composition, cured product, partition wall, organic electroluminescent device, and image display device

[0001] The present invention relates to a photosensitive resin composition, a cured product obtained by curing the photosensitive resin composition, a partition wall, an organic electroluminescent device having the partition wall, and an image display device including the organic electroluminescent device.

[0002] Conventionally, organic electroluminescent elements included in organic electroluminescent displays and the like have been manufactured by forming partition walls (banks) on a substrate and then laminating various functional layers within the region surrounded by the partition walls. A known method for easily forming such partition walls is a photolithography method using a photosensitive resin composition. Another known method for laminating various functional layers within the region surrounded by the partition walls is a method in which ink containing materials constituting the functional layers is first prepared and then the prepared ink is injected into the region surrounded by the partition walls. Among these methods, the inkjet method is often adopted because it is easy to accurately inject a predetermined amount of ink into a predetermined location.

[0003] Furthermore, when forming a functional layer using ink, it is sometimes necessary to impart ink repellency (liquid repellency) to the partition walls in order to prevent the ink from adhering to the partition walls, prevent the inks injected between adjacent regions from mixing, etc. Patent Document 1 describes that by using a photosensitive resin composition containing a specific alkali-soluble resin, it is possible to obtain a partition wall pattern that has high liquid repellency on the upper surface of the partition walls and excellent ink wettability at the openings.

[0004] Japanese Patent Application Laid-Open No. 2022-47006

[0005] When forming an organic light-emitting layer by the inkjet method, it is necessary to form a partition wall having high liquid repellency on the upper surface. In order to achieve high liquid repellency on the upper surface of the partition wall, a high exposure dose is generally required. However, increasing the exposure dose increases the exposure time and manufacturing costs, so a value of 80 mJ / cm is used. ２ It is said that it is preferable to expose to light at a dose of 120 mJ / cm or less. Patent Document 1 describes that high liquid repellency can be imparted to the upper surface of the partition wall by using a photosensitive resin composition containing a specific alkali-soluble resin.２ exposure is required.

[0006] Therefore, an object of the present invention is to provide a photosensitive resin composition capable of forming partition walls that can exhibit liquid repellency at a lower exposure dose and that exhibit excellent step-forming properties and inkjet coatability. Another object of the present invention is to provide partition walls formed by curing the photosensitive resin composition, organic electroluminescent devices including the partition walls, and image display devices including the organic electroluminescent devices.

[0007] As a result of extensive research, the present inventors have found that the above-mentioned problems can be solved by using a specific alkali-soluble resin in a photosensitive resin composition, and have thus completed the present invention. That is, the gist of the present invention is as follows: [1] A photosensitive resin composition containing (a) an alkali-soluble resin, (b) a liquid repellent agent, (c) a photopolymerization initiator, and (d) a photopolymerizable compound, wherein the alkali-soluble resin (a) contains a polyamide-imide (meth)acrylate resin (a-1) having a structure represented by the following general formula (1):

[0008] (In formula (1), R １ ~R ３ represents a divalent aliphatic hydrocarbon group. １ ~X ３ represents any one of the structures of general formulas (2) to (4).

[0009] (In formula (2), R ４ ~R ６ represents a divalent aliphatic hydrocarbon group. ４ and X ５ represents any one of the structures of general formulas (2) to (4). １ represents an aromatic hydrocarbon or an alicyclic hydrocarbon.)

[0010] (In formula (3), R ７ represents a monovalent aliphatic hydrocarbon group. ２ and Y ３ each independently represents an aromatic hydrocarbon or an alicyclic hydrocarbon.

[0011] (In formula (4), R８ represents a monovalent aliphatic hydrocarbon group. ４ and Y ５ each independently represents an aromatic hydrocarbon or an alicyclic hydrocarbon.

[0012] [2] The photosensitive resin composition according to [1], wherein the (b) liquid repellent agent comprises (b1) a liquid repellent agent having an ethylenically unsaturated bond group. [3] The photosensitive resin composition according to [2], wherein the (b1) liquid repellent agent comprises (b2) an acrylic resin containing a repeating unit represented by the following general formula (5) and a fluorine atom:

[0013]

[0014] (In formula (5), R １１ each independently represents a hydrogen atom or a methyl group, R １２ represents an alkyl group having 2 to 6 carbon atoms, and may be interrupted by one or more of -O-, -CO-, -S-, and -NH-. * represents a bonding site.) [4] The photosensitive resin composition according to [3], wherein the acrylic resin (b2) has a fluoroalkyl group and / or a fluoroalkylene group. [5] The photosensitive resin composition according to [1], wherein the content of the alkali-soluble resin (a) is 200 parts by mass or less per 100 parts by mass of the photopolymerizable compound (d). [6] The photosensitive resin composition according to [1], wherein the polyamide-imide (meth)acrylate resin (a-1) has a weight average molecular weight (Mw) of 1,000 or more and 10,000 or less in terms of polystyrene, as measured by gel permeation chromatography (GPC). [7] The photosensitive resin composition according to any one of [1] to [6], which is used for forming partition walls. [8] The photosensitive resin composition according to [7], which is used for collectively forming partition walls having steps by photolithography. [9] A cured product obtained by curing the photosensitive resin composition according to any one of [1] to [6].

[10] A partition wall obtained by curing the photosensitive resin composition according to any one of [1] to [6].

[11] An organic electroluminescent device comprising the partition wall according to

[10] .

[12] An image display device comprising the organic electroluminescent device according to

[11] .

[0015] The present invention can provide a photosensitive resin composition capable of forming partition walls that exhibit liquid repellency at a lower exposure dose and that exhibit excellent step-forming properties and inkjet coating properties.The present invention can also provide partition walls formed by curing the photosensitive resin composition, organic electroluminescent devices including the partition walls, and image display devices including the organic electroluminescent devices.

[0016] Fig. 1 is a plan view showing an example of a substrate provided with partition walls having steps, and Fig. 2 is a cross-sectional view showing an example of a substrate provided with partition walls having steps.

[0017] The present invention will be described in detail below. The following description is an example of an embodiment of the present invention, and the present invention is not limited thereto as long as it does not depart from the gist thereof. In the present invention, "(meth)acrylic" means "acrylic and / or methacrylic". In the present invention, "(di)tricarboxylic acid anhydride" means dicarboxylic acid anhydride and / or tricarboxylic acid anhydride. In the present invention, "total solid content" means all components other than the solvent in the photosensitive resin composition, and even if the components other than the solvent are liquid at room temperature, they are included in the solid content.

[0018] In the present invention, a numerical range expressed using "to" means a range that includes the numerical values ​​written before and after "to" as the lower and upper limits. In the present invention, "A and / or B" means one or both of A and B, and specifically means A, B, or A and B. In the present invention, "(co)polymer" means both a single polymer (homopolymer) and a copolymer, and "polybasic acid (anhydride)" means "polybasic acid and / or polybasic acid anhydride."

[0019] In the present invention, the weight-average molecular weight refers to the weight-average molecular weight (Mw) calculated in terms of polystyrene by gel permeation chromatography (GPC). In the present invention, the acid value refers to the acid value calculated in terms of effective solid content, and is calculated by neutralization titration. In the present invention, the partition material refers to a bank material, a wall material, or a wall material, and similarly, the partition wall refers to a bank, a wall, or a wall. In the present invention, the light-emitting portion (pixel portion) refers to a portion that emits light when electrical energy is applied.

[0020] [1] Photosensitive Resin Composition The photosensitive resin composition of the present invention is a photosensitive resin composition containing (a) an alkali-soluble resin, (b) a liquid repellent, (c) a photopolymerization initiator, and (d) a photopolymerizable compound, wherein the alkali-soluble resin (a) contains a polyamide-imide (meth)acrylate resin (a-1) having a structure represented by the following general formula (1): The photosensitive resin composition of the present invention may further contain other components as necessary, such as an ultraviolet absorber or a polymerization inhibitor.

[0021] (In formula (1), R １ ~R ３ represents a divalent aliphatic hydrocarbon group. １ ~X ３ represents any one of the structures of general formulas (2) to (4).

[0022] (In formula (2), R ４ ~R ６ represents a divalent aliphatic hydrocarbon group. ４ and X ５ represents any one of the structures of general formulas (2) to (4). １ represents an aromatic hydrocarbon or an alicyclic hydrocarbon.)

[0023] (In formula (3), R ７ represents a monovalent aliphatic hydrocarbon group. ２ and Y ３ each independently represents an aromatic hydrocarbon or an alicyclic hydrocarbon.

[0024] (In formula (4), R ８ represents a monovalent aliphatic hydrocarbon group. ４ and Y ５ each independently represents an aromatic hydrocarbon or an alicyclic hydrocarbon.

[0025] In the present invention, the partition wall is used to partition, for example, a functional layer (organic layer, light-emitting portion) in an active-drive organic electroluminescent element, and is used to form pixels including the functional layer and the partition wall, for example, by ejecting ink, which is a material for constituting the functional layer, into the partitioned region (pixel region) and drying the ink.

[0026] [1-1] Components and composition of photosensitive resin composition The components constituting the photosensitive resin composition of the present invention and their composition will be described. The photosensitive resin composition of the present invention contains (a) an alkali-soluble resin, (b) a liquid repellent agent, (c) a photopolymerization initiator, and (d) a photopolymerizable compound.

[0027] [1-1-1] Component (a): Alkali-soluble Resin The alkali-soluble resin (a) in the present invention contains a polyamide-imide (meth)acrylate resin (a-1) having a structure represented by the above-mentioned general formula (1).

[0028] <Polyamide-imide (meth)acrylate resin (a-1)> The polyamide-imide (meth)acrylate resin (a-1) has an isocyanuric skeleton and an amide bond or an imide bond, which gives it strong intermolecular forces and tends to be less susceptible to thermal decomposition during heat treatment. It is believed that the inclusion of the polyamide-imide (meth)acrylate resin (a-1) in a photosensitive resin composition reduces the generation of fumes when a cured film of the composition is baked. Furthermore, the polyamide-imide (meth)acrylate resin (a-1) has a (meth)acryloyl group, which is believed to result in a stronger cured film upon photo- or thermal curing, even when it contains a colorant, thereby increasing the residual film rate after baking.

[0029] In the above formula (1), R １ ~R ３ represents a divalent aliphatic hydrocarbon group. The aliphatic hydrocarbon group is preferably an aliphatic hydrocarbon group having 1 to 20 carbon atoms, and may be saturated or unsaturated, may be linear, branched, or cyclic, and may have a substituent. １ ~R ３ may all be the same aliphatic hydrocarbon group, or may all be different aliphatic hydrocarbon groups.１ ~X ３ represents any one of the structures of general formulas (2) to (4). １ ~X ３ may all have the same structure or may all have different structures.

[0030] In the above formula (2), R ４ ~R ６ represents a divalent aliphatic hydrocarbon group. The aliphatic hydrocarbon group is preferably an aliphatic hydrocarbon group having 1 to 20 carbon atoms, and may be saturated or unsaturated, may be linear, branched, or cyclic, and may have a substituent. ４ ~R ６ may all be the same aliphatic hydrocarbon group, or may all be different aliphatic hydrocarbon groups. ４ and X ５ represents any one of the structures of general formulas (2) to (4). ４ and X ５ may all have the same structure or may all have different structures. １ represents an aromatic hydrocarbon or alicyclic hydrocarbon which may have a substituent. The aromatic hydrocarbon and alicyclic hydrocarbon preferably have 1 to 10 carbon atoms.

[0031] In the above formula (3), R ７ represents a monovalent aliphatic hydrocarbon group. The aliphatic hydrocarbon group is preferably an aliphatic hydrocarbon group having 1 to 20 carbon atoms, and may be saturated or unsaturated, may be linear, branched, or cyclic, and may have a substituent. Y ２ and Y ３ each independently represents an aromatic hydrocarbon or an alicyclic hydrocarbon which may have a substituent. The aromatic hydrocarbon and the alicyclic hydrocarbon preferably have 1 to 10 carbon atoms.

[0032] In the above formula (4), R ８represents a monovalent aliphatic hydrocarbon group. The aliphatic hydrocarbon group is preferably an aliphatic hydrocarbon group having 1 to 20 carbon atoms, and may be saturated or unsaturated, may be linear, branched, or cyclic, and may have a substituent. Y ４ and Y ５ each independently represents an aromatic hydrocarbon or an alicyclic hydrocarbon which may have a substituent.

[0033] Polyamide-imide (meth)acrylate resin (a-1) (hereinafter sometimes abbreviated as "resin (a-1)") can be obtained, for example, by reacting a polyamide-imide resin having a terminal acid group or an acid anhydride group, obtained by reacting an isocyanurate-type polyisocyanate with a tricarboxylic acid anhydride, with a (meth)acrylate having an epoxy group in the molecule and a (di)tricarboxylic acid anhydride. However, the present invention is not limited to this, as long as the raw materials and method can provide similar effects.

[0034] Examples of the isocyanurate polyisocyanate include isocyanurate triisocyanate (HDI3N) synthesized from hexamethylene diisocyanate, isocyanurate triisocyanate (HTMDI3N) synthesized from trimethylhexamethylene diisocyanate, isocyanurate triisocyanate (IPDI3N) synthesized from isophorone diisocyanate, isocyanurate triisocyanate (HTDI3N) synthesized from hydrogenated tolylene diisocyanate, isocyanurate triisocyanate (HXDI3N) synthesized from hydrogenated xylene diisocyanate, isocyanurate triisocyanate (NBDI3N) synthesized from norbornane diisocyanate, and isocyanurate triisocyanate (HMDI3N) synthesized from hydrogenated diphenylmethane diisocyanate. From the viewpoint of suppressing cure shrinkage, for example, alicyclic isocyanurate polyisocyanates such as isocyanurate triisocyanate (IPDI3N) synthesized from isophorone diisocyanate, isocyanurate triisocyanate (HTDI3N) synthesized from hydrogenated tolylene diisocyanate, isocyanurate triisocyanate (HXDI3N) synthesized from hydrogenated xylene diisocyanate, isocyanurate triisocyanate (NBDI3N) synthesized from norbornane diisocyanate, and isocyanurate triisocyanate (HMDI3N) synthesized from hydrogenated diphenylmethane diisocyanate are preferred, and isocyanurate triisocyanate (IPDI3N) synthesized from isophorone diisocyanate is more preferred.

[0035] Examples of tricarboxylic acid anhydrides to be reacted with isocyanurate-type polyisocyanates include trimellitic anhydride, naphthalene-1,2,4-tricarboxylic acid anhydride, propanetricarboxylic acid anhydride, cyclohexanetricarboxylic acid anhydride, methylcyclohexanetricarboxylic acid anhydride, cyclohexenetricarboxylic acid anhydride, and methylcyclohexenetricarboxylic acid anhydride. From the viewpoint of suppressing cure shrinkage, alicyclic tricarboxylic acid anhydrides such as cyclohexanetricarboxylic acid anhydride, methylcyclohexanetricarboxylic acid anhydride, cyclohexenetricarboxylic acid anhydride, and methylcyclohexenetricarboxylic acid anhydride are preferred, with cyclohexanetricarboxylic acid anhydride being more preferred.

[0036] Examples of the cyclohexanetricarboxylic anhydride include cyclohexane-1,3,4-tricarboxylic acid-3,4-anhydride, cyclohexane-1,3,5-tricarboxylic acid-3,5-anhydride, and cyclohexane-1,2,3-tricarboxylic acid-2,3-anhydride.

[0037] The (meth)acrylate having an epoxy group in the molecule used in the present invention is not particularly limited in its specific structure as long as it is a compound having an epoxy group and a (meth)acryloyl group in its molecular structure, and a wide variety of compounds can be used.

[0038] Examples of (meth)acrylates having an epoxy group in the molecule include glycidyl acrylate, glycidyl methacrylate, allyl glycidyl ether, cyclohexyl monoepoxy acrylate, and derivatives thereof (e.g., analogs obtained by reacting an epoxycyclohexane compound with acrylic acid or methacrylic acid, such as 3,4-epoxycyclohexylmethyl methacrylate). These may be used alone or in combination of two or more. Among these, those having a molecular weight of 1,000 or less are preferred, as they result in a cured product that is an ethylenically unsaturated group-, acid group-, and secondary hydroxyl group-containing polyamideimide resin with excellent heat resistance.

[0039] With regard to the (di)carboxylic acid anhydride to be reacted with the polyamide-imide resin having a terminal acid group or an acid anhydride group and the (meth)acrylate having an epoxy group in the molecule, examples of the dicarboxylic acid anhydride include anhydrides of maleic acid, succinic acid, itaconic acid, phthalic acid, tetrahydrophthalic acid, hexahydrophthalic acid, methylhexahydrophthalic acid, endomethylenetetrahydrophthalic acid, chlorendic acid, and methyltetrahydrophthalic acid. From the viewpoint of electrical properties, aliphatic dicarboxylic acid anhydrides such as anhydrides of succinic acid, 1,2-cyclopropanedicarboxylic acid, 2,2-dimethylsuccinic acid, caronic acid, 1,2-cyclohexanedicarboxylic acid, butylsuccinic acid, 4-methylcyclohexane-1,2-dicarboxylic acid, n-octylsuccinic acid, decylsuccinic acid, and dodecylsuccinic acid are preferred. Examples of the tricarboxylic acid anhydride include the same tricarboxylic acid anhydrides as those reacted with the above-mentioned isocyanurate-type polyisocyanate, and from the viewpoint of developability, aliphatic tricarboxylic acid anhydrides are preferred, and alicyclic tricarboxylic acid anhydrides are more preferred.

[0040] The polystyrene-equivalent weight average molecular weight (Mw) of resin (a-1) measured by gel permeation chromatography (GPC) is usually 1,000 or more, preferably 1,500 or more, more preferably 2,000 or more, even more preferably 2,500 or more, and even more preferably 3,000 or more. Furthermore, it is usually 10,000 or less, preferably 9,000 or less, more preferably 8,000 or less, and even more preferably 7,000 or less. The above upper and lower limits can be arbitrarily combined. For example, 1,000 to 10,000 is preferred, 1,500 to 9,000 is more preferred, 2,000 to 8,000 is even more preferred, and 3,000 to 7,000 is even more preferred. By setting the Mw at or above the lower limit, fume generation tends to be reduced. By setting the Mw at or below the upper limit, developer solubility tends to be improved.

[0041] In the reaction between the alicyclic isocyanurate polyisocyanate and the alicyclic tricarboxylic acid anhydride, the total amount of the acid anhydride groups and the carboxylic acid is preferably 1.0 mol to 3.0 mol, more preferably 1.2 mol to 2.8 mol, and even more preferably 1.4 mol to 2.6 mol per mol of isocyanate groups in the alicyclic isocyanurate polyisocyanate. When the total amount of the acid anhydride groups and the carboxylic acid exceeds 1.0 mol, residual isocyanate groups are prevented, polymerization is suppressed, and developability is improved. When the total amount of the acid anhydride groups and the carboxylic acid is less than 3.0 mol, residual alicyclic tricarboxylic acid anhydrides are prevented, and development residues can be suppressed.

[0042] The acid value of resin (a-1) is not particularly limited, but is preferably 20 mgKOH / g or more, more preferably 40 mgKOH / g or more, and even more preferably 60 mgKOH / g or more, and is preferably 200 mgKOH / g or less, and more preferably 150 mgKOH / g or less. The above upper and lower limits can be arbitrarily combined. For example, the acid value is preferably 20 to 200 mgKOH / g, more preferably 40 to 200 mgKOH / g, and even more preferably 60 to 150 mgKOH / g.

[0043] By setting the content at or above the lower limit, the development solubility improves and the resolution tends to be good. By setting the content at or below the upper limit, the residual film rate tends to be good. The specific structure of the alkali-soluble resin having an ethylenic double bond is not particularly limited, but from the viewpoint of development solubility, acrylic copolymer resin (a-2) and / or epoxy (meth)acrylate resin (a-3) are preferred, and from the viewpoint of reducing outgassing, epoxy (meth)acrylate resin (a-3) is more preferred. The acrylic copolymer resin (a-2) is described in detail below.

[0044] [Acrylic Copolymer Resin (a-2)] From the viewpoint of curability, the acrylic copolymer resin (a-2) is preferably one having an ethylenic double bond in a side chain. Among the acrylic copolymer resins (a-2), from the viewpoint of development solubility, an acrylic copolymer resin (a-2-1) containing a partial structure represented by the following general formula (I) is preferred.

[0045]

[0046] In formula (I), R A and R B each independently represents a hydrogen atom or a methyl group. * represents a bond. From the viewpoint of developability, the partial structure represented by formula (I) is preferably a partial structure represented by the following general formula (I-1):

[0047]

[0048] In formula (I-1), R A and R B has the same meaning as that in formula (I). 1 represents a divalent hydrocarbon group having 1 to 4 carbon atoms which may have a substituent. From the viewpoint of sensitivity, the partial structure represented by formula (I) is preferably a partial structure represented by formula (I-2) below.

[0049]

[0050] In formula (I-2), R A and R B is synonymous with that of formula (I). When the acrylic copolymer resin (a-2-1) contains a partial structure represented by general formula (I), the content of the partial structure represented by general formula (I) contained in the acrylic copolymer resin (a-2-1) is not particularly limited, but is preferably 5 mol% or more, more preferably 20 mol% or more, even more preferably 30 mol% or more, even more preferably 50 mol% or more, particularly preferably 70 mol% or more, and most preferably 80 mol% or more. It is also preferably 99 mol% or less, more preferably 97 mol% or less, and even more preferably 95 mol% or less. The upper and lower limits can be arbitrarily combined; for example, 5 to 99 mol% is preferred, 20 to 99 mol% is more preferred, 30 to 97 mol% is more preferred, 50 to 97 mol% is even more preferred, 70 to 95 mol% is particularly preferred, and 80 to 95 mol% is most preferred. By setting the content at or above the lower limit, residue tends to be reduced. Furthermore, by making the amount equal to or less than the upper limit, the development adhesion tends to be improved.

[0051] When the acrylic copolymer resin (a-2-1) contains a partial structure represented by the general formula (I-1), the content of the partial structure represented by the general formula (I-1) contained in the acrylic copolymer resin (a-2-1) is not particularly limited, but is preferably 1 mol% or more, more preferably 5 mol% or more, even more preferably 8 mol% or more, even more preferably 10 mol% or more, and is preferably 99 mol% or less, more preferably 60 mol% or less, even more preferably 40 mol% or less, even more preferably 30 mol% or less, and particularly preferably 20 mol% or less. The upper and lower limits can be arbitrarily combined, and for example, 1 to 99 mol% is preferred, 1 to 60 mol% is more preferred, 5 to 40 mol% is more preferred, even more preferably 8 to 30 mol%, and particularly preferably 10 to 20 mol%. By setting the content at or above the lower limit, sensitivity tends to be increased and residue tends to be reduced. Furthermore, by setting the content at or below the upper limit, development adhesion tends to be improved.

[0052] When the acrylic copolymer resin (a-2-1) contains a partial structure represented by the general formula (I-2), the content of the partial structure represented by the general formula (I-2) contained in the acrylic copolymer resin (a-2-1) is not particularly limited, but is preferably 10 mol% or more, more preferably 20 mol% or more, even more preferably 30 mol% or more, even more preferably 40 mol% or more, particularly preferably 50 mol% or more, and most preferably 70 mol% or more. It is also preferably 99 mol% or less, more preferably 95 mol% or less, even more preferably 90 mol% or less, and particularly preferably 85 mol% or less. The upper and lower limits can be arbitrarily combined; for example, 10 to 99 mol% is preferred, 20 to 99 mol% is more preferred, 30 to 95 mol% is more preferred, 40 to 95 mol% is even more preferred, 50 to 90 mol% is particularly preferred, and 70 to 85 mol% is most preferred. Setting the content at or above the lower limit tends to increase sensitivity. Setting the content at or below the upper limit tends to improve developability.

[0053] When the acrylic copolymer resin (a-2-1) contains a partial structure represented by the general formula (I), other partial structures that may be contained therein are not particularly limited. However, from the viewpoint of adhesion after development, it is preferable that the acrylic copolymer resin (a-2-1) contains, for example, a partial structure represented by the following general formula (I'):

[0054]

[0055] In the above formula (I′), R Ｄ represents a hydrogen atom or a methyl group, R Ｅ represents an alkyl group which may have a substituent, an aryl group (aromatic ring group) which may have a substituent, or an alkenyl group which may have a substituent.

[0056] (R Ｅ In the formula (I′), R Ｅ represents an alkyl group which may have a substituent, an aryl group which may have a substituent, or an alkenyl group which may have a substituent. Ｅ The alkyl group in the formula (I) includes linear, branched, and cyclic alkyl groups. The number of carbon atoms is preferably 1 or more, more preferably 3 or more, and even more preferably 5 or more, and is preferably 20 or less, more preferably 18 or less, more preferably 16 or less, even more preferably 14 or less, and particularly preferably 12 or less. The upper and lower limits can be arbitrarily combined; for example, 1 to 20 is preferred, 1 to 18 is more preferred, 3 to 16 is more preferred, 3 to 14 is even more preferred, and 5 to 12 is particularly preferred. By setting the number of carbon atoms at or above the lower limit, film strength tends to increase and development adhesion tends to improve. Furthermore, by setting the number of carbon atoms at or below the upper limit, residue tends to be reduced.

[0057] Examples of the alkyl group include a methyl group, an ethyl group, a cyclohexyl group, a dicyclopentanyl group, and a dodecanyl group.Among these, from the viewpoint of film strength, a dicyclopentanyl group and a dodecanyl group are preferred, and a dicyclopentanyl group is more preferred.Examples of the substituent that the alkyl group may have include a methoxy group, an ethoxy group, a chloro group, a bromo group, a fluoro group, a hydroxy group, an amino group, an epoxy group, an oligoethylene glycol group, a phenyl group, a carboxy group, an acryloyl group, and a methacryloyl group, and from the viewpoint of developability, a hydroxy group and an oligoethylene glycol group are preferred.

[0058] R Ｅ Examples of the aryl group (aromatic ring group) in the formula (I) include a monovalent aromatic hydrocarbon ring group and a monovalent aromatic heterocyclic group. The number of carbon atoms is preferably 4 or more, more preferably 6 or more, and is preferably 24 or less, more preferably 22 or less, even more preferably 20 or less, and particularly preferably 18 or less. The upper and lower limits can be arbitrarily combined, and for example, 4 to 24 is preferred, 4 to 22 is more preferred, 6 to 20 is even more preferred, and 6 to 18 is particularly preferred. By setting the number at or above the lower limit, development adhesion tends to be improved. Furthermore, by setting the number at or below the upper limit, residue tends to be reduced.

[0059] The aromatic hydrocarbon ring in the aromatic hydrocarbon ring group may be a single ring or a fused ring, and examples thereof include a benzene ring, a naphthalene ring, an anthracene ring, a phenanthrene ring, a perylene ring, a tetracene ring, a pyrene ring, a benzpyrene ring, a chrysene ring, a triphenylene ring, an acenaphthene ring, a fluoranthene ring, and a fluorene ring. The aromatic heterocycle in aromatic heterocyclic group can be a single ring or a condensed ring, for example, furan ring, benzofuran ring, thiophene ring, benzothiophene ring, pyrrole ring, pyrazole ring, imidazole ring, oxadiazole ring, indole ring, carbazole ring, pyrroloimidazole ring, pyrrolopyrazole ring, pyrrolopyrrole ring, thienopyrrole ring, thienothiophene ring, furopyrrole ring, furofuran ring, thienofuran ring, benzisoxazole ring, benzisothiazole ring, benzimidazole ring, pyridine ring, pyrazine ring, pyridazine ring, pyrimidine ring, triazine ring, quinoline ring, isoquinoline ring, cinnoline ring, quinoxaline ring, phenanthridine ring, perimidine ring, quinazoline ring, quinazolinone ring, azulene ring.Among these, from the viewpoint of curability, benzene ring group, naphthalene ring group are preferred, and benzene ring group is more preferred.

[0060] Examples of the substituent that the aryl group may have include a methyl group, an ethyl group, a propyl group, a methoxy group, an ethoxy group, a chloro group, a bromo group, a fluoro group, a hydroxy group, an amino group, an epoxy group, an oligoethylene glycol group, a phenyl group, and a carboxy group, and from the viewpoint of developability, a hydroxy group and an oligoethylene glycol group are preferred. Ｅ The alkenyl group in the formula (I) may be a linear, branched, or cyclic alkenyl group. The number of carbon atoms is preferably 2 or more, and is preferably 22 or less, more preferably 20 or less, even more preferably 18 or less, even more preferably 16 or less, and particularly preferably 14 or less. For example, 2 to 22 is preferred, more preferably 2 to 20, even more preferably 2 to 18, even more preferably 2 to 16, and particularly preferably 2 to 14. By setting the carbon number at or above the lower limit, development adhesion tends to improve. By setting the carbon number at or below the upper limit, residue tends to be reduced.

[0061] Examples of the alkenyl group include an ethenyl group, a propenyl group, a butenyl group, and a cyclohexenyl group.Among these, from the viewpoint of curability, an ethenyl group and a propenyl group are preferred, and an ethenyl group is more preferred.Examples of the substituent that the alkenyl group may have include a methoxy group, an ethoxy group, a chloro group, a bromo group, a fluoro group, a hydroxy group, an amino group, an epoxy group, an oligoethylene glycol group, a phenyl group, and a carboxy group, and from the viewpoint of developability, a hydroxy group and an oligoethylene glycol group are preferred.

[0062] Among these, from the viewpoint of developability, R Ｅ As the group, an alkyl group or an alkenyl group is preferred, an alkyl group is more preferred, and a dicyclopentanyl group is even more preferred. When the acrylic copolymer resin (a-2-1) contains a partial structure represented by the general formula (I'), the content of the partial structure represented by the general formula (I') contained in the acrylic copolymer resin (a-2-1) is not particularly limited, but is preferably 0.5 mol% or more, more preferably 1 mol% or more, even more preferably 1.5 mol% or more, particularly preferably 2 mol% or more, and is preferably 90 mol% or less, more preferably 70 mol% or less, even more preferably 50 mol% or less, even more preferably 30 mol% or less, and particularly preferably 10 mol% or less. The upper and lower limits can be arbitrarily combined; for example, 0.5 to 90 mol% is preferred, 0.5 to 70 mol% is more preferred, 1 to 50 mol% is even more preferred, 1.5 to 30 mol% is even more preferred, and 2 to 10 mol% is particularly preferred. By setting the content at or above the lower limit, development adhesion tends to be improved. Furthermore, by making the content equal to or less than the upper limit, there is a tendency for residue to be reduced.

[0063] When the acrylic copolymer resin (a-2-1) contains a partial structure represented by the general formula (I) above, it preferably further contains a partial structure represented by the following general formula (I″) from the viewpoints of heat resistance and film strength:

[0064]

[0065] In the above formula (I″), R Ｆ represents a hydrogen atom or a methyl group, RＧ represents an alkyl group which may have a substituent, an alkenyl group which may have a substituent, a hydroxyl group, a carboxy group, a halogen atom, an alkoxy group which may have a substituent, a thiol group, or an alkylsulfide group which may have a substituent, and t represents an integer of 0 to 5.

[0066] (R Ｇ In the formula (I″), R Ｇ represents an alkyl group which may have a substituent, an alkenyl group which may have a substituent, a hydroxyl group, a carboxy group, a halogen atom, an alkoxy group which may have a substituent, a thiol group, or an alkyl sulfide group which may have a substituent.

[0067] R Ｇ The alkyl group in the formula (I) may be a linear, branched, or cyclic alkyl group. The number of carbon atoms is preferably 1 or more, more preferably 3 or more, and even more preferably 5 or more, and is preferably 20 or less, more preferably 18 or less, still more preferably 16 or less, even more preferably 14 or less, and particularly preferably 12 or less. The upper and lower limits can be arbitrarily combined; for example, 1 to 20 is preferred, 1 to 18 is more preferred, 3 to 16 is more preferred, 3 to 14 is even more preferred, and 5 to 12 is particularly preferred. By setting the number of carbon atoms at or above the lower limit, development adhesion tends to be improved. Furthermore, by setting the number of carbon atoms at or below the upper limit, residue tends to be reduced.

[0068] Examples of the alkyl group include a methyl group, an ethyl group, a cyclohexyl group, a dicyclopentanyl group, and a dodecanyl group. Among these, from the viewpoint of development adhesion, a dicyclopentanyl group and a dodecanyl group are preferred, and a dicyclopentanyl group is more preferred. Examples of the substituent that the alkyl group may have include a methoxy group, an ethoxy group, a chloro group, a bromo group, a fluoro group, a hydroxy group, an amino group, an epoxy group, an oligoethylene glycol group, a phenyl group, a carboxy group, an acryloyl group, and a methacryloyl group, and from the viewpoint of development, a hydroxy group and an oligoethylene glycol group are preferred.

[0069] R ＧThe alkenyl group in the formula (I) may be a linear, branched, or cyclic alkenyl group. The number of carbon atoms is preferably 2 or more, and is preferably 22 or less, more preferably 20 or less, even more preferably 18 or less, even more preferably 16 or less, and particularly preferably 14 or less. For example, 2 to 22 is preferred, more preferably 2 to 20, even more preferably 2 to 18, even more preferably 2 to 16, and particularly preferably 2 to 14. By setting the carbon number at or above the lower limit, development adhesion tends to improve. By setting the carbon number at or below the upper limit, residue tends to be reduced.

[0070] Examples of the alkenyl group include an ethenyl group, a propenyl group, a butenyl group, and a cyclohexenyl group.Among these, from the viewpoint of curability, an ethenyl group and a propenyl group are preferred, and an ethenyl group is more preferred.Examples of the substituent that the alkenyl group may have include a methoxy group, an ethoxy group, a chloro group, a bromo group, a fluoro group, a hydroxy group, an amino group, an epoxy group, an oligoethylene glycol group, a phenyl group, and a carboxy group, and from the viewpoint of developability, a hydroxy group and an oligoethylene glycol group are preferred.

[0071] R Ｇ Examples of the halogen atom in R include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom, and among these, a fluorine atom is preferred from the viewpoint of ink repellency. Ｇ The alkoxy group in the formula (I) may be a linear, branched, or cyclic alkoxy group. The number of carbon atoms is preferably 1 or more, and is preferably 20 or less, more preferably 18 or less, even more preferably 16 or less, even more preferably 14 or less, and particularly preferably 12 or less. For example, the number of carbon atoms is preferably 1 to 20, more preferably 1 to 18, even more preferably 1 to 16, even more preferably 1 to 14, and particularly preferably 1 to 12. By setting the number of carbon atoms at or above the lower limit, development adhesion tends to be improved. Meanwhile, by setting the number of carbon atoms at or below the upper limit, residue tends to be reduced.

[0072] Examples of the substituent that the alkoxy group may have include a methoxy group, an ethoxy group, a chloro group, a bromo group, a fluoro group, a hydroxy group, an amino group, an epoxy group, an oligoethylene glycol group, a phenyl group, a carboxy group, an acryloyl group, and a methacryloyl group, and from the viewpoint of developability, a hydroxy group and an oligoethylene glycol group are preferred. Ｇ The alkyl sulfide group in the formula (I) includes linear, branched, and cyclic alkyl sulfide groups. The number of carbon atoms is preferably 1 or more, and is preferably 20 or less, more preferably 18 or less, even more preferably 16 or less, even more preferably 14 or less, and particularly preferably 12 or less. For example, 1 to 20 is preferred, more preferably 1 to 18, even more preferably 1 to 16, even more preferably 1 to 14, and particularly preferably 1 to 12. By setting the number of carbon atoms at or above the lower limit, development adhesion tends to be improved. On the other hand, by setting the number of carbon atoms at or below the upper limit, residue tends to be reduced.

[0073] Examples of alkyl sulfide groups include methyl sulfide groups, ethyl sulfide groups, propyl sulfide groups, and butyl sulfide groups. Among these, from the viewpoint of developability, methyl sulfide groups and ethyl sulfide groups are preferred. Examples of substituents that the alkyl group in the alkyl sulfide group may have include methoxy groups, ethoxy groups, chloro groups, bromo groups, fluoro groups, hydroxy groups, amino groups, epoxy groups, oligoethylene glycol groups, phenyl groups, carboxy groups, acryloyl groups, and methacryloyl groups. From the viewpoint of developability, hydroxy groups and oligoethylene glycol groups are preferred.

[0074] Among these, from the viewpoint of developability, R G As the alkyl group, a hydroxy group or a carboxy group is preferred, and a carboxy group is more preferred.

[0075] (t) In formula (I"), t represents an integer of 0 to 5. From the viewpoint of developability, t is preferably 0 to 2, more preferably 0 to 1, and even more preferably 0. When the acrylic copolymer resin (a-2-1) contains a partial structure represented by general formula (I"), the content of the partial structure represented by general formula (I") contained in the acrylic copolymer resin (a-2-1) is not particularly limited, but is preferably 1 mol% or more, more preferably 2 mol% or more, even more preferably 3 mol% or more, particularly preferably 5 mol% or more, and is preferably 90 mol% or less, more preferably 70 mol% or less, even more preferably 50 mol% or less, even more preferably 30 mol% or less, particularly preferably 20 mol% or less, and most preferably 10 mol% or less. The upper and lower limits can be arbitrarily combined, and are, for example, preferably 1 to 90 mol%, more preferably 1 to 70 mol%, even more preferably 2 to 50 mol%, even more preferably 2 to 30 mol%, particularly preferably 3 to 20 mol%, and most preferably 5 to 10 mol%. By setting the content at or above the lower limit, development adhesion tends to improve. On the other hand, by setting the content at or below the upper limit, residue tends to be reduced.

[0076] When the acrylic copolymer resin (a-2-1) contains a partial structure represented by the general formula (I) above, it preferably further contains a partial structure represented by the following general formula (I''') from the viewpoint of developability.

[0077]

[0078] In the above formula (I''', R Ｈrepresents a hydrogen atom or a methyl group. When the acrylic copolymer resin (a-2-1) contains a partial structure represented by general formula (I"'), the content of the partial structure represented by general formula (I'") contained in the acrylic copolymer resin (a-2-1) is not particularly limited, but is preferably 5 mol% or more, more preferably 10 mol% or more, even more preferably 30 mol% or more, and is preferably 90 mol% or less, more preferably 80 mol% or less, even more preferably 70 mol% or less, and particularly preferably 50 mol% or less. The upper and lower limits can be arbitrarily combined, and for example, 5 to 90 mol% is preferred, 5 to 80 mol% is more preferred, 10 to 70 mol% is more preferred, and 30 to 50 mol% is particularly preferred. By setting the content at or above the lower limit, residue tends to be reduced. Furthermore, by setting the content at or below the upper limit, development adhesion tends to be improved.

[0079] The acid value of the acrylic copolymer resin (a-2) is not particularly limited, but is preferably 5 mgKOH / g or more, more preferably 10 mgKOH / g or more, even more preferably 20 mgKOH / g or more, and even more preferably 25 mgKOH / g or more. It is also preferably 100 mgKOH / g or less, more preferably 80 mgKOH / g or less, even more preferably 60 mgKOH / g or less, and even more preferably 40 mgKOH / g or less. The upper and lower limits can be arbitrarily combined. For example, 5 to 100 mgKOH / g is preferred, 10 to 80 mgKOH / g is more preferred, 20 to 60 mgKOH / g is more preferred, and 25 to 40 mgKOH / g is even more preferred. By setting the acid value at or above the lower limit, residue tends to be reduced. Furthermore, by setting the acid value at or below the upper limit, development adhesion tends to be improved.

[0080] The weight-average molecular weight (Mw) of the acrylic copolymer resin (a-2) is not particularly limited, but is preferably 1,000 or more, more preferably 2,000 or more, even more preferably 3,000 or more, even more preferably 4,000 or more, and particularly preferably 5,000 or more. It is also preferably 30,000 or less, more preferably 20,000 or less, even more preferably 15,000 or less, and even more preferably 10,000 or less. It is particularly preferably 8,000 or less. The upper and lower limits can be arbitrarily combined. For example, 1,000 to 30,000 is preferred, 2,000 to 20,000 is more preferred, 3,000 to 15,000 is even more preferred, 4,000 to 10,000 is even more preferred, and 5,000 to 8,000 is particularly preferred. By setting the Mw at or above the lower limit, development adhesion tends to be improved. Furthermore, by setting the Mw at or below the upper limit, residue tends to be reduced.

[0081] When the alkali-soluble resin (a) contains an acrylic copolymer resin (a-2), the content of the acrylic copolymer resin (a-2) contained in the alkali-soluble resin (a) is not particularly limited, but is preferably 5% by mass or more, more preferably 10% by mass or more, even more preferably 15% by mass or more, and particularly preferably 20% by mass or more. It is usually preferably 100% by mass or less, more preferably 80% by mass or less, and even more preferably 50% by mass or less. The upper and lower limits can be arbitrarily combined. For example, 5 to 100% by mass is preferred, 10 to 100% by mass is more preferred, 15 to 80% by mass is more preferred, and 20 to 50% by mass is particularly preferred. By setting the content at or above the lower limit, the development solubility tends to be improved. By setting the content at or below the upper limit, the taper angle tends to be high. The epoxy (meth)acrylate resin (a-3) is described in detail below.

[0082] [Epoxy (meth)acrylate resin (a-3)] The epoxy (meth)acrylate resin (a-3) is a resin obtained by adding an acid or ester compound having an ethylenically unsaturated bond (ethylenic double bond) to an epoxy resin, and then adding a polybasic acid or anhydride thereof. For example, a resin obtained by ring-opening addition of a carboxy group of an acid having an ethylenically unsaturated bond to the epoxy group of the epoxy resin, thereby adding an ethylenically unsaturated bond to the epoxy resin via an ester bond (—COO—), and adding one carboxy group of a polybasic acid anhydride to the hydroxyl group generated during this process. Another example is a resin obtained by simultaneously adding a polyhydric alcohol when adding the polybasic acid anhydride. Furthermore, resins obtained by reacting a compound having a functional group capable of further reacting with the carboxy group of the resin obtained by the above reaction are also included in the epoxy (meth)acrylate resin (a-3).

[0083] As described above, epoxy (meth)acrylate resins are essentially free of epoxy groups in terms of their chemical structure and are not limited to "(meth)acrylates." However, since epoxy compounds (epoxy resins) are used as raw materials and "(meth)acrylates" are a typical example, they are conventionally named as such. Here, the term "epoxy resin" refers to raw material compounds prior to their formation into resins by thermal curing, and the epoxy resin can be appropriately selected from known epoxy resins. Furthermore, the epoxy resin can be a compound obtained by reacting a phenolic compound with an epihalohydrin. The phenolic compound is preferably a compound having a divalent or more than divalent phenolic hydroxyl group, and may be a monomer or a polymer.

[0084] Specific examples include bisphenol A type epoxy resins, bisphenol F type epoxy resins, bisphenol S type epoxy resins, phenol novolac epoxy resins, cresol novolac epoxy resins, biphenyl novolac epoxy resins, trisphenol epoxy resins, epoxidized products of polymers of phenol and dicyclopentane, dihydroxylfluorene type epoxy resins, dihydroxylalkyleneoxylfluorene type epoxy resins, diglycidyl ethers of 9,9-bis(4'-hydroxyphenyl)fluorene, and diglycidyl ethers of 1,1-bis(4'-hydroxyphenyl)adamantane, and those having an aromatic ring in the main chain can be preferably used.

[0085] Among these, from the viewpoint of the strength of the cured film, bisphenol A type epoxy resins, phenol novolac epoxy resins, cresol novolac epoxy resins, epoxidized products of polymers of phenol and dicyclopentadiene, and epoxidized products of 9,9-bis(4'-hydroxyphenyl)fluorene are preferred, with bisphenol A type epoxy resins being more preferred. Examples of acids having an ethylenically unsaturated bond include (meth)acrylic acid, crotonic acid, maleic acid, fumaric acid, citraconic acid, pentaerythritol tri(meth)acrylate succinic anhydride adduct, pentaerythritol tri(meth)acrylate tetrahydrophthalic anhydride adduct, dipentaerythritol penta(meth)acrylate succinic anhydride adduct, dipentaerythritol penta(meth)acrylate phthalic anhydride adduct, dipentaerythritol penta(meth)acrylate tetrahydrophthalic anhydride adduct, and reaction products of (meth)acrylic acid and ε-caprolactone. Among these, (meth)acrylic acid is preferred from the viewpoint of sensitivity.

[0086] Examples of polybasic acids (anhydrides) include succinic acid, maleic acid, itaconic acid, phthalic acid, tetrahydrophthalic acid, 3-methyltetrahydrophthalic acid, 4-methyltetrahydrophthalic acid, 3-ethyltetrahydrophthalic acid, 4-ethyltetrahydrophthalic acid, hexahydrophthalic acid, 3-methylhexahydrophthalic acid, 4-methylhexahydrophthalic acid, 3-ethylhexahydrophthalic acid, 4-ethylhexahydrophthalic acid, trimellitic acid, pyromellitic acid, benzophenonetetracarboxylic acid, biphenyltetracarboxylic acid, and anhydrides thereof. These may be used alone or in combination of two or more. Among these, from the viewpoint of reducing residues in pixel areas after development, succinic anhydride, maleic anhydride, and itaconic anhydride are preferred, and succinic anhydride is more preferred.

[0087] The use of a polyhydric alcohol increases the molecular weight of the epoxy (meth)acrylate resin (a-3), allowing for the introduction of branches into the molecule, and tends to balance the molecular weight and viscosity. Furthermore, the introduction rate of acid groups into the molecule can be increased, making it easier to balance sensitivity, adhesion, and the like. Examples of polyhydric alcohols include trimethylolpropane, ditrimethylolpropane, pentaerythritol, dipentaerythritol, trimethylolethane, and 1,2,3-propanetriol. These may be used alone or in combination of two or more.

[0088] The acid value of the epoxy (meth)acrylate resin (a-3) is not particularly limited, but is preferably 10 mgKOH / g or more, more preferably 20 mgKOH / g or more, even more preferably 40 mgKOH / g or more, even more preferably 60 mgKOH / g or more, and is preferably 200 mgKOH / g or less, more preferably 180 mgKOH / g or less, even more preferably 150 mgKOH / g or less, even more preferably 120 mgKOH / g or less, and particularly preferably 100 mgKOH / g or less. The upper and lower limits can be arbitrarily combined, for example, 10 to 200 mgKOH / g is preferred, 10 to 180 mgKOH / g is more preferred, 20 to 150 mgKOH / g is even more preferred, 40 to 120 mgKOH / g is even more preferred, and 60 to 100 mgKOH / g is particularly preferred. By setting the acid value at or above the lower limit, residue is likely to be reduced. Furthermore, by setting the content to the upper limit or less, outgassing during light emission from the device tends to be reduced.

[0089] The weight average molecular weight (Mw) of the epoxy (meth)acrylate resin (a-3) is not particularly limited, but is preferably 1,000 or more, more preferably 2,000 or more, even more preferably 3,000 or more, even more preferably 4,000 or more, particularly preferably 5,000 or more, particularly preferably 6,000 or more, and most preferably 7,000 or more, and is preferably 30,000 or less, more preferably 20,000 or less, even more preferably 15,000 or less, and particularly preferably 10,000 or less. The upper and lower limits can be arbitrarily combined, and are preferably 1,000 to 30,000, more preferably 2,000 to 30,000, even more preferably 3,000 to 20,000, even more preferably 4,000 to 20,000, particularly preferably 5,000 to 15,000, particularly preferably 6,000 to 15,000, and most preferably 7,000 to 10,000. By setting the Mw to be equal to or greater than the lower limit, outgassing during device light emission tends to be reduced. Furthermore, by making the content equal to or less than the upper limit, there is a tendency for residue to be reduced.

[0090] When the (a) alkali-soluble resin contains an epoxy (meth)acrylate resin (a-3), the content of the epoxy (meth)acrylate resin (a-3) contained in the (a) alkali-soluble resin is not particularly limited, but is preferably 30% by mass or more, more preferably 50% by mass or more, even more preferably 70% by mass or more, even more preferably 80% by mass or more, particularly preferably 90% by mass or more, and is usually 100% by mass or less. The upper and lower limits can be arbitrarily combined. For example, 30 to 100% by mass is preferred, 50 to 100% by mass is more preferred, 70 to 100% by mass is even more preferred, 80 to 100% by mass is even more preferred, and 90 to 100% by mass is particularly preferred. By setting the content at or above the lower limit, outgassing tends to be reduced.

[0091] The epoxy (meth)acrylate resin (a-3) can be synthesized by a conventionally known method. Specifically, a method can be used in which the epoxy resin is dissolved in an organic solvent, and in the presence of a catalyst and a thermal polymerization inhibitor, an acid or ester compound having an ethylenically unsaturated bond is added to cause an addition reaction, and then a polybasic acid or an anhydride thereof is added to continue the reaction. Examples of organic solvents include methyl ethyl ketone, cyclohexanone, diethylene glycol ethyl ether acetate, and propylene glycol monomethyl ether acetate. Examples of catalysts include tertiary amines such as triethylamine, benzyldimethylamine, and tribenzylamine; quaternary ammonium salts such as tetramethylammonium chloride, methyltriethylammonium chloride, tetraethylammonium chloride, tetrabutylammonium chloride, and trimethylbenzylammonium chloride; phosphorus compounds such as triphenylphosphine; and stibines such as triphenylstibine. Examples of thermal polymerization inhibitors include hydroquinone, hydroquinone monomethyl ether, and methylhydroquinone.

[0092] These may be used alone or in combination of two or more. The acid or ester compound having an ethylenically unsaturated bond can be used in an amount that is preferably 0.7 to 1.3 chemical equivalents, more preferably 0.9 to 1.1 chemical equivalents, per chemical equivalent of the epoxy group of the epoxy resin. The temperature during the addition reaction is preferably 60 to 150°C, more preferably 80 to 120°C. The polybasic acid (anhydride) can be used in an amount that is preferably 0.1 to 1.2 chemical equivalents, more preferably 0.2 to 1.1 chemical equivalents, per chemical equivalent of the hydroxyl group generated by the addition reaction.

[0093] From the viewpoint of outgassing during device light emission, the epoxy (meth)acrylate resin (a-3) preferably contains at least one selected from the group consisting of an epoxy (meth)acrylate resin (a-3-1) containing a partial structure represented by the following general formula (i) (hereinafter may be referred to as "epoxy (meth)acrylate resin (a-3-1)"), an epoxy (meth)acrylate resin (a-3-2) containing a partial structure represented by the following general formula (ii) (hereinafter may be referred to as "epoxy (meth)acrylate resin (a-3-2)"), and an epoxy (meth)acrylate resin (a-3-3) containing a partial structure represented by the following general formula (iii) (hereinafter may be referred to as "epoxy (meth)acrylate resin (a-3-3)").

[0094] Among these, from the viewpoint of reducing outgassing during device light emission, the epoxy (meth)acrylate resin (a-3) preferably contains an epoxy (meth)acrylate resin (a-3-1) containing a partial structure represented by the following general formula (i), and more preferably an epoxy (meth)acrylate resin (a-3-1) containing a partial structure represented by the following general formula (i). One of the reasons for this is presumed to be that the resin has a rigid main skeleton, making it less susceptible to thermal decomposition.

[0095]

[0096] In formula (i), R a represents a hydrogen atom or a methyl group, R brepresents a divalent hydrocarbon group which may have a substituent. The benzene ring in formula (i) may be further substituted with any substituent. * represents a bond.

[0097] (R ｂ In the formula (i), R ｂ represents a divalent hydrocarbon group which may have a substituent. Examples of divalent hydrocarbon groups include divalent aliphatic groups, divalent aromatic cyclic groups, and groups in which one or more divalent aliphatic groups are linked to one or more divalent aromatic cyclic groups. Examples of divalent aliphatic groups include linear, branched, and cyclic groups. Among these, linear groups are preferred from the viewpoint of development solubility, while cyclic groups are preferred from the viewpoint of reducing developer penetration into exposed areas. The number of carbon atoms is usually 1 or more, preferably 3 or more, more preferably 6 or more, and preferably 20 or less, more preferably 15 or less, and even more preferably 10 or less. The upper and lower limits can be arbitrarily combined; for example, 1 to 20 is preferred, 3 to 15 is more preferred, and 6 to 10 is even more preferred. By setting the number of carbon atoms at or above the lower limit, development adhesion tends to be improved. Furthermore, by setting the number of carbon atoms at or below the upper limit, residue tends to be reduced.

[0098] Examples of divalent linear aliphatic groups include methylene, ethylene, n-propylene, n-butylene, n-hexylene, and n-heptylene. Among these, methylene is preferred from the viewpoint of reducing residues. Examples of divalent branched aliphatic groups include structures having a methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, sec-butyl, or tert-butyl group as a side chain in the aforementioned divalent linear aliphatic group.

[0099] The number of rings in the divalent cyclic aliphatic group is not particularly limited, but is usually 1 or more, preferably 2 or more, and preferably 10 or less, more preferably 5 or less. The upper and lower limits can be arbitrarily combined, for example, 1 to 10 is preferred, 1 to 5 is more preferred, and 2 to 5 is even more preferred. By setting the number at or above the lower limit, the film residual rate tends to be improved. Furthermore, by setting the number at or below the upper limit, the residue tends to be reduced. Examples of divalent cyclic aliphatic groups include groups in which two hydrogen atoms have been removed from a cyclohexane ring, a cycloheptane ring, a cyclodecane ring, a cyclododecane ring, a norbornane ring, an isobornane ring, and an adamantane ring. Among these, from the viewpoint of development adhesion, groups in which two hydrogen atoms have been removed from an adamantane ring are preferred.

[0100] Examples of substituents that the divalent aliphatic group may have include alkoxy groups having 1 to 5 carbon atoms, such as a methoxy group or an ethoxy group; a hydroxyl group; a nitro group; a cyano group; and a carboxy group. From the viewpoint of ease of synthesis, unsubstituted groups are preferred. Examples of divalent aromatic ring groups include divalent aromatic hydrocarbon ring groups and divalent aromatic heterocyclic groups. The number of carbon atoms is usually 4 or more, preferably 5 or more, more preferably 6 or more, and preferably 20 or less, more preferably 15 or less, and even more preferably 10 or less. The upper and lower limits can be arbitrarily combined; for example, 4 to 20 is preferred, 5 to 15 is more preferred, and 6 to 10 is even more preferred. By setting the number at or above the lower limit, development adhesion tends to be improved. Furthermore, by setting the number at or below the upper limit, residue tends to be reduced.

[0101] The aromatic hydrocarbon ring in the divalent aromatic hydrocarbon ring group may be a single ring or a condensed ring. Examples of the divalent aromatic hydrocarbon ring group include a benzene ring, a naphthalene ring, an anthracene ring, a phenanthrene ring, a perylene ring, a tetracene ring, a pyrene ring, a benzpyrene ring, a chrysene ring, a triphenylene ring, an acenaphthene ring, a fluoranthene ring, and a fluorene ring, each of which has two free valences.

[0102] The aromatic heterocycle in the divalent aromatic heterocyclic group may be a single ring or a condensed ring. Examples of the divalent aromatic heterocyclic group include a furan ring, a benzofuran ring, a thiophene ring, a benzothiophene ring, a pyrrole ring, a pyrazole ring, an imidazole ring, an oxadiazole ring, an indole ring, a carbazole ring, a pyrroloimidazole ring, a pyrrolopyrazole ring, a pyrrolopyrrole ring, a thienopyrrole ring, a thienothiophene ring, a furopyrrole ring, a furofuran ring, a thienofuran ring, a benzisoxazole ring, a benzisothiazole ring, a benzimidazole ring, a pyridine ring, a pyrazine ring, a pyridazine ring, a pyrimidine ring, a triazine ring, a quinoline ring, an isoquinoline ring, a cinnoline ring, a quinoxaline ring, a phenanthridine ring, a perimidine ring, a quinazoline ring, a quinazolinone ring, and an azulene ring, each of which has two free valences. Among these, from the viewpoint of photocurability, a benzene ring or a naphthalene ring having two free valences is preferred, and a benzene ring having two free valences is more preferred.

[0103] As the substituent that the divalent aromatic ring group may have, for example, hydroxyl group, methyl group, methoxy group, ethyl group, ethoxy group, propyl group, propoxy group, glycidyl ether group can be mentioned.Among these, from the viewpoint of curability, unsubstituted is preferred.As the group that one or more divalent aliphatic groups and one or more divalent aromatic ring groups are linked, one or more of the above-mentioned divalent aliphatic groups and one or more of the above-mentioned divalent aromatic ring groups can be mentioned.

[0104] The number of divalent aliphatic groups is not particularly limited, but is usually 1 or more, preferably 2 or more, and is preferably 10 or less, more preferably 5 or less, and even more preferably 3 or less. The upper and lower limits can be arbitrarily combined, and for example, 1 to 10 is preferred, 1 to 5 is more preferred, and 2 to 3 is even more preferred. By making the number equal to or greater than the lower limit, development adhesion tends to be improved. Also, by making the number equal to or less than the upper limit, residue tends to be reduced.

[0105] The number of divalent aromatic ring groups is not particularly limited, but is usually 1 or more, preferably 2 or more, and is preferably 10 or less, more preferably 5 or less, and even more preferably 3 or less. The upper and lower limits can be arbitrarily combined, and for example, 1 to 10 is preferred, 1 to 5 is more preferred, and 2 to 3 is even more preferred. By making the number equal to or greater than the lower limit, development adhesion tends to be improved. Also, by making the number equal to or less than the upper limit, residue tends to be reduced.

[0106] Examples of the group formed by linking one or more divalent aliphatic groups with one or more divalent aromatic ring groups include groups represented by the following formulae (i-A) to (i-F). Among these, the group represented by the following formula (i-A) is preferred from the viewpoints of the rigidity of the skeleton and the hydrophobicity of the film. * in the chemical formula represents a bond.

[0107]

[0108] As described above, the benzene ring in formula (i) may be further substituted with any substituent. Examples of the substituent on the benzene ring in formula (i) include a hydroxyl group, a methyl group, a methoxy group, an ethyl group, an ethoxy group, a propyl group, and a propoxy group. The number of substituents is not particularly limited, and may be one or two or more, as long as it is chemically permissible.

[0109] From the viewpoint of curability, it is preferable that the partial structure represented by the formula (i) is a partial structure represented by the following formula (i-1):

[0110]

[0111] In formula (i-1), R ａ and R ｂ has the same meaning as that in formula (i). 1 represents a divalent hydrocarbon group having 1 to 4 carbon atoms which may have a substituent. * represents a bond. The benzene ring in formula (i-1) may be further substituted with any substituent.

[0112] (R 1 In the general formula (i-1), R 1represents a divalent hydrocarbon group having 1 to 4 carbon atoms, which may have a substituent. Examples of the divalent hydrocarbon group include an alkylene group and an alkenylene group. The alkylene group may be linear or branched, but is preferably linear from the viewpoint of development solubility. The number of carbon atoms is not particularly limited, but is usually 1 or more, preferably 2 or more, and preferably 4 or less, and more preferably 3 or less. The upper and lower limits can be arbitrarily combined; for example, 1 to 4 is preferred, 1 to 3 is more preferred, and 2 to 3 is even more preferred. By setting the number at or above the lower limit, the residual film ratio tends to be high. Furthermore, by setting the number at or below the upper limit, the amount of outgassing generated during device light emission tends to be low.

[0113] Specific examples of the alkylene group include a methylene group, an ethylene group, a propylene group, and a butylene group. From the viewpoint of reducing outgassing, a methylene group or an ethylene group is preferred, and an ethylene group is more preferred. The alkenylene group may be linear or branched, but from the viewpoint of solubility in development, a linear chain is preferred. The number of carbon atoms is not particularly limited, but is usually 2 or more, preferably 4 or less, and more preferably 3 or less. For example, 2 to 4 is preferred, and 2 to 3 is more preferred. By setting the number of carbon atoms at or above the lower limit, the residual film ratio tends to be high. Furthermore, by setting the number of carbon atoms at or below the upper limit, the amount of outgassing generated during device light emission tends to be low.

[0114] Specific examples of the alkenylene group include an ethenylene group, a propenylene group, and a butyrenylene group, and from the viewpoint of outgassing, an ethenylene group is preferred. The substituent that the divalent hydrocarbon group having 1 to 4 carbon atoms may have is not particularly limited, and examples thereof include a halogen atom, an alkoxy group, a benzoyl group, and a hydroxyl group, and from the viewpoint of ease of synthesis, unsubstituted groups are preferred.

[0115] Among these, from the viewpoint of reducing outgassing, R 1 is preferably a divalent alkylene group having 1 to 4 carbon atoms, more preferably a methylene group or an ethylene group, and even more preferably an ethylene group. The partial structure represented by formula (i-1) contained in one molecule of the epoxy (meth)acrylate resin (a-3-1) may be one type or two or more types.

[0116] The number of partial structures represented by formula (i) contained in one molecule of the epoxy (meth)acrylate resin (a-3-1) is not particularly limited, but is preferably 1 or more, more preferably 2 or more, even more preferably 3 or more, and is preferably 10 or less, and even more preferably 8 or less. The upper and lower limits can be arbitrarily combined, and for example, 1 to 10 is preferred, 2 to 10 is more preferred, and 3 to 8 is even more preferred. By making the number equal to or greater than the lower limit, development adhesion tends to be improved. Furthermore, by making the number equal to or less than the upper limit, residue tends to be reduced.

[0117] The number of partial structures represented by the formula (i-1) contained in one molecule of the epoxy (meth)acrylate resin (a-3-1) is not particularly limited, but is preferably 1 or more, more preferably 2 or more, even more preferably 3 or more, and is preferably 10 or less, and even more preferably 8 or less. The upper and lower limits can be arbitrarily combined, and for example, 1 to 10 is preferred, 2 to 10 is more preferred, and 3 to 8 is even more preferred. By setting the number at or above the lower limit, development adhesion tends to be improved. Furthermore, by setting the number at or below the upper limit, residue tends to be reduced. Specific examples of the epoxy (meth)acrylate resin (a-3-1) are listed below.

[0118]

[0119]

[0120]

[0121]

[0122]

[0123]

[0124]

[0125] In another embodiment, the epoxy (meth)acrylate resin (a-3) is preferably an epoxy (meth)acrylate resin (a-3-2) containing a partial structure represented by the following formula (ii) from the viewpoint of development adhesion.

[0126]

[0127] In formula (ii), R c R each independently represents a hydrogen atom or a methyl group. d represents a divalent hydrocarbon group having a cyclic hydrocarbon group as a side chain. * represents a bond.

[0128] (R d In the formula (ii), R d represents a divalent hydrocarbon group having a cyclic hydrocarbon group as a side chain. Examples of the cyclic hydrocarbon group include an aliphatic cyclic group and an aromatic cyclic group. The number of rings in the aliphatic cyclic group is not particularly limited, but is usually 1 or more, preferably 2 or more, and is preferably 10 or less, more preferably 5 or less, and even more preferably 3 or less. The upper and lower limits can be arbitrarily combined, and for example, 1 to 10 is preferred, 1 to 5 is more preferred, and 2 to 3 is even more preferred. By setting the number at or above the lower limit, development adhesion tends to be improved. Furthermore, by setting the number at or below the upper limit, residue tends to be reduced.

[0129] The number of carbon atoms in the aliphatic cyclic group is usually 4 or more, preferably 6 or more, more preferably 8 or more, and preferably 40 or less, more preferably 30 or less, even more preferably 20 or less, and particularly preferably 15 or less. The upper and lower limits can be arbitrarily combined, and for example, 4 to 40 is preferred, 4 to 30 is more preferred, 6 to 20 is even more preferred, and 8 to 15 is particularly preferred. By setting the carbon number at or above the lower limit, development adhesion tends to be improved. Furthermore, by setting the carbon number at or below the upper limit, residue tends to be reduced.

[0130] Examples of the aliphatic ring in the aliphatic cyclic group include a cyclohexane ring, a cycloheptane ring, a cyclodecane ring, a cyclododecane ring, a norbornane ring, an isobornane ring, and an adamantane ring. Among these, an adamantane ring is preferred from the viewpoint of development adhesion. The number of rings in the aromatic cyclic group is not particularly limited, but is usually 1 or more, preferably 2 or more, more preferably 3 or more, and preferably 10 or less, more preferably 5 or less, and even more preferably 4 or less. The upper and lower limits can be arbitrarily combined, and for example, 1 to 10 is preferred, 2 to 5 is more preferred, and 3 to 4 is even more preferred. By setting the number at or above the lower limit, residue tends to be reduced. Furthermore, by setting the number at or below the upper limit, development adhesion tends to be improved.

[0131] Examples of the aromatic ring group include an aromatic hydrocarbon ring group and an aromatic heterocyclic group. The number of carbon atoms in the aromatic ring group is usually 4 or more, preferably 6 or more, more preferably 8 or more, even more preferably 10 or more, and particularly preferably 12 or more. It is also preferably 40 or less, more preferably 30 or less, even more preferably 20 or less, and particularly preferably 15 or less. The upper and lower limits can be arbitrarily combined; for example, 4 to 40 is preferred, 6 to 40 is more preferred, 8 to 30 is more preferred, even more preferably 10 to 20, and particularly preferably 12 to 15. Setting the carbon number at or above the lower limit tends to reduce residue. Setting the carbon number at or below the upper limit tends to improve development adhesion.

[0132] Examples of aromatic rings in the aromatic ring group include a benzene ring, a naphthalene ring, an anthracene ring, a phenanthrene ring, a perylene ring, a tetracene ring, a pyrene ring, a benzpyrene ring, a chrysene ring, a triphenylene ring, an acenaphthene ring, a fluoranthene ring, and a fluorene ring. Among these, a fluorene ring is preferred from the viewpoint of patterning properties. The divalent hydrocarbon group in the divalent hydrocarbon group having a cyclic hydrocarbon group as a side chain is not particularly limited, and examples thereof include a divalent aliphatic group, a divalent aromatic ring group, and a group in which one or more divalent aliphatic groups are linked to one or more divalent aromatic ring groups.

[0133] The divalent aliphatic group may be linear, branched, or cyclic. Among these, linear groups are preferred from the viewpoint of development solubility, while cyclic groups are preferred from the viewpoint of reducing developer penetration into exposed areas. The number of carbon atoms is usually 1 or more, preferably 3 or more, more preferably 6 or more, and preferably 25 or less, more preferably 20 or less, and even more preferably 15 or less. The upper and lower limits can be arbitrarily combined; for example, 1 to 25 is preferred, 3 to 20 is more preferred, and 6 to 15 is even more preferred. By adjusting the number to be equal to or greater than the lower limit, development adhesion tends to be improved. By adjusting the number to be equal to or less than the upper limit, residue tends to be reduced.

[0134] Examples of divalent linear aliphatic groups include methylene, ethylene, n-propylene, n-butylene, n-hexylene, and n-heptylene. Among these, a methylene group is preferred from the viewpoint of residues. Examples of divalent branched aliphatic groups include structures having a methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, sec-butyl, or tert-butyl group as a side chain in the aforementioned divalent linear aliphatic group.

[0135] The number of rings in the divalent cyclic aliphatic group is not particularly limited, but is usually 1 or more, preferably 2 or more, and is preferably 10 or less, more preferably 5 or less, and even more preferably 3 or less. The upper and lower limits can be arbitrarily combined, and for example, 1 to 10 is preferred, 1 to 5 is more preferred, and 2 to 3 is even more preferred. By making the number equal to or greater than the lower limit, development adhesion tends to be improved. Also, by making the number equal to or less than the upper limit, residue tends to be reduced.

[0136] Examples of the divalent cyclic aliphatic group include groups in which two hydrogen atoms have been removed from a cyclohexane ring, a cycloheptane ring, a cyclodecane ring, a cyclododecane ring, a norbornane ring, an isobornane ring, or an adamantane ring. Among these, from the viewpoint of development adhesion, a group in which two hydrogen atoms have been removed from an adamantane ring is preferred. Examples of the substituent that the divalent aliphatic group may have include an alkoxy group having 1 to 5 carbon atoms, such as a methoxy group or an ethoxy group; a hydroxyl group; a nitro group; a cyano group; and a carboxy group. From the viewpoint of ease of synthesis, unsubstituted groups are preferred.

[0137] Examples of divalent aromatic ring groups include divalent aromatic hydrocarbon ring groups and divalent aromatic heterocyclic groups. The number of carbon atoms is usually 4 or more, preferably 5 or more, more preferably 6 or more, and preferably 30 or less, more preferably 20 or less, and even more preferably 15 or less. The upper and lower limits can be arbitrarily combined, and for example, 4 to 30 is preferred, 5 to 20 is more preferred, and 6 to 15 is even more preferred. By setting the number at or above the lower limit, development adhesion tends to be improved. Furthermore, by setting the number at or below the upper limit, residue tends to be reduced.

[0138] The aromatic hydrocarbon ring in the divalent aromatic hydrocarbon ring group may be a single ring or a condensed ring. Examples of the divalent aromatic hydrocarbon ring group include a benzene ring, a naphthalene ring, an anthracene ring, a phenanthrene ring, a perylene ring, a tetracene ring, a pyrene ring, a benzpyrene ring, a chrysene ring, a triphenylene ring, an acenaphthene ring, a fluoranthene ring, and a fluorene ring, each of which has two free valences.

[0139] The aromatic heterocycle in the divalent aromatic heterocyclic group may be a single ring or a condensed ring. Examples of the divalent aromatic heterocyclic group include a furan ring, a benzofuran ring, a thiophene ring, a benzothiophene ring, a pyrrole ring, a pyrazole ring, an imidazole ring, an oxadiazole ring, an indole ring, a carbazole ring, a pyrroloimidazole ring, a pyrrolopyrazole ring, a pyrrolopyrrole ring, a thienopyrrole ring, a thienothiophene ring, a furopyrrole ring, a furofuran ring, a thienofuran ring, a benzisoxazole ring, a benzisothiazole ring, a benzimidazole ring, a pyridine ring, a pyrazine ring, a pyridazine ring, a pyrimidine ring, a triazine ring, a quinoline ring, an isoquinoline ring, a cinnoline ring, a quinoxaline ring, a phenanthridine ring, a perimidine ring, a quinazoline ring, a quinazolinone ring, and an azulene ring, each of which has two free valences. Among these, from the viewpoint of photocurability, a benzene ring or a naphthalene ring having two free valences is preferred, and a benzene ring having two free valences is more preferred.

[0140] Examples of the substituent that the divalent aromatic ring group may have include, for example, a hydroxyl group, a methyl group, a methoxy group, an ethyl group, an ethoxy group, a propyl group, and a propoxy group.Among these, from the viewpoint of curability, unsubstituted is preferred.As the group that one or more divalent aliphatic groups and one or more divalent aromatic ring groups are linked, examples include the group that one or more of the above-mentioned divalent aliphatic groups are linked with one or more of the above-mentioned divalent aromatic ring groups.

[0141] The number of divalent aliphatic groups is not particularly limited, but is usually 1 or more, preferably 2 or more, and is preferably 10 or less, more preferably 5 or less, and even more preferably 3 or less. The upper and lower limits can be arbitrarily combined, and for example, 1 to 10 is preferred, 1 to 5 is more preferred, and 2 to 3 is even more preferred. By making the number equal to or greater than the lower limit, development adhesion tends to be improved. Also, by making the number equal to or less than the upper limit, residue tends to be reduced.

[0142] The number of divalent aromatic ring groups is not particularly limited, but is usually 1 or more, preferably 2 or more, and is preferably 10 or less, more preferably 5 or less, and even more preferably 3 or less. The upper and lower limits can be arbitrarily combined, and for example, 1 to 10 is preferred, 1 to 5 is more preferred, and 2 to 3 is even more preferred. By making the number equal to or greater than the lower limit, development adhesion tends to be improved. Also, by making the number equal to or less than the upper limit, residue tends to be reduced.

[0143] Examples of the group linking one or more divalent aliphatic groups with one or more divalent aromatic ring groups include groups represented by the formulae (i-A) to (i-F) above. Among these, from the viewpoint of reducing residue, the group represented by the formula (i-C) above is preferred. The bonding mode of the cyclic hydrocarbon group serving as a side chain to these divalent hydrocarbon groups is not particularly limited, but examples include a mode in which one hydrogen atom of the aliphatic group or aromatic ring group is substituted with the side chain, and a mode in which one carbon atom of the aliphatic group is included to form the cyclic hydrocarbon group serving as a side chain.

[0144] From the viewpoint of development adhesion, the partial structure represented by the formula (ii) is preferably a partial structure represented by the following formula (ii-1):

[0145]

[0146] In formula (ii-1), R c has the same meaning as in formula (ii). α represents a monovalent cyclic hydrocarbon group which may have a substituent. n is an integer of 1 or more. The benzene ring in formula (ii-1) may be further substituted with an arbitrary substituent. * represents a bond.

[0147] (R α In the formula (ii-1), R αrepresents a monovalent cyclic hydrocarbon group which may have a substituent. Examples of the cyclic hydrocarbon group include an aliphatic cyclic group and an aromatic cyclic group. The number of rings in the aliphatic cyclic group is not particularly limited, but is usually 1 or more, preferably 2 or more, and preferably 6 or less, more preferably 4 or less, and even more preferably 3 or less. The upper and lower limits can be arbitrarily combined, and for example, 1 to 6 are preferred, 1 to 4 are more preferred, and 2 to 3 are even more preferred. By setting the number at or above the lower limit, development adhesion tends to be improved. Furthermore, by setting the number at or below the upper limit, residue tends to be reduced.

[0148] The number of carbon atoms in the aliphatic cyclic group is usually 4 or more, preferably 6 or more, more preferably 8 or more, and preferably 40 or less, more preferably 30 or less, even more preferably 20 or less, and particularly preferably 15 or less. The upper and lower limits can be arbitrarily combined, and for example, 4 to 40 is preferred, 4 to 30 is more preferred, 6 to 20 is even more preferred, and 8 to 15 is particularly preferred. By setting the carbon number at or above the lower limit, development adhesion tends to be improved. By setting the carbon number at or below the upper limit, residue tends to be reduced.

[0149] Examples of the aliphatic ring in the aliphatic cyclic group include a cyclohexane ring, a cycloheptane ring, a cyclodecane ring, a cyclododecane ring, a norbornane ring, an isobornane ring, and an adamantane ring. Among these, an adamantane ring is preferred from the viewpoint of development adhesion. The number of rings possessed by the aromatic cyclic group is not particularly limited, but is usually 1 or more, preferably 2 or more, more preferably 3 or more, and preferably 10 or less, more preferably 5 or less. The upper and lower limits can be arbitrarily combined, and for example, 1 to 10 is preferred, 2 to 10 is more preferred, and 3 to 5 is even more preferred. By setting the number at or above the lower limit, development adhesion tends to be improved. Furthermore, by setting the number at or below the upper limit, residue tends to be reduced.

[0150] Examples of the aromatic ring group include an aromatic hydrocarbon ring group and an aromatic heterocyclic group. The number of carbon atoms in the aromatic ring group is usually 4 or more, preferably 5 or more, more preferably 6 or more, and preferably 30 or less, more preferably 20 or less, and even more preferably 15 or less. The upper and lower limits can be arbitrarily combined, and for example, 4 to 30 is preferred, 5 to 20 is more preferred, and 6 to 15 is even more preferred. By setting the number at or above the lower limit, development adhesion tends to be improved. By setting the number at or below the upper limit, residue tends to be reduced.

[0151] Examples of the aromatic ring in the aromatic ring group include a benzene ring, a naphthalene ring, an anthracene ring, a phenanthrene ring, and a fluorene ring. Among these, a fluorene ring is preferred from the viewpoint of development adhesion. Examples of the substituent that the cyclic hydrocarbon group may have include an alkyl group having 1 to 5 carbon atoms, such as a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, a sec-butyl group, a tert-butyl group, an amyl group, and an isoamyl group; an alkoxy group having 1 to 5 carbon atoms, such as a methoxy group and an ethoxy group; a hydroxyl group; a nitro group; a cyano group; and a carboxy group. From the viewpoint of ease of synthesis, unsubstituted groups are preferred.

[0152] n represents an integer of 1 or more, preferably 2 or more, and more preferably 3 or less. For example, 1 to 3 is preferred, and 1 to 2 is more preferred. By making n equal to or greater than the lower limit, there is a tendency for development adhesion to be improved. Also, by making n equal to or less than the upper limit, there is a tendency for residue to be reduced. Among these, from the viewpoint of strong film hardness and electrical properties, R α is preferably a monovalent aliphatic cyclic group, more preferably an adamantyl group.

[0153] As described above, the benzene ring in formula (ii-1) may be further substituted with any substituent. Examples of the substituent include a hydroxyl group, a methyl group, a methoxy group, an ethyl group, an ethoxy group, a propyl group, and a propoxy group. The number of substituents is not particularly limited, and may be one or two or more. From the viewpoint of curability, unsubstituted groups are preferred. Specific examples of the partial structure represented by formula (ii-1) are listed below.

[0154]

[0155]

[0156]

[0157]

[0158]

[0159] From the viewpoint of development adhesion, the partial structure represented by the formula (ii) is preferably a partial structure represented by the following formula (ii-2):

[0160]

[0161] In formula (ii-2), R c has the same meaning as in formula (ii). β represents a divalent cyclic hydrocarbon group which may have a substituent. The benzene ring in formula (ii-2) may be further substituted with any substituent. * represents a bond.

[0162] (R β In the formula (ii-2), R β represents a divalent cyclic hydrocarbon group which may have a substituent. Examples of the cyclic hydrocarbon group include an aliphatic cyclic group and an aromatic cyclic group. The number of rings in the aliphatic cyclic group is not particularly limited, but is usually 1 or more, preferably 2 or more, and is preferably 10 or less, more preferably 5 or less. The upper and lower limits can be arbitrarily combined, and for example, 1 to 10 is preferred, and 2 to 5 is more preferred. By setting the number to be equal to or greater than the lower limit, development adhesion tends to be improved. Furthermore, by setting the number to be equal to or less than the upper limit, residue tends to be reduced.

[0163] The number of carbon atoms in the aliphatic cyclic group is usually 4 or more, preferably 6 or more, more preferably 8 or more, and preferably 40 or less, more preferably 35 or less, and even more preferably 30 or less. The upper and lower limits can be arbitrarily combined, and for example, 4 to 40 is preferred, 6 to 35 is more preferred, and 8 to 30 is even more preferred. By setting the carbon atom number at or above the lower limit, development adhesion tends to be improved. By setting the carbon atom number at or below the upper limit, residue tends to be reduced.

[0164] Examples of the aliphatic ring in the aliphatic cyclic group include a cyclohexane ring, a cycloheptane ring, a cyclodecane ring, a cyclododecane ring, a norbornane ring, an isobornane ring, and an adamantane ring. Among these, an adamantane ring is preferred from the viewpoint of development adhesion. The number of rings in the aromatic cyclic group is not particularly limited, but is usually 1 or more, preferably 2 or more, more preferably 3 or more, and preferably 10 or less, and more preferably 5 or less. The upper and lower limits can be arbitrarily combined, and for example, 1 to 10 is preferred, 2 to 10 is more preferred, and 3 to 5 is even more preferred. By setting the number at or above the lower limit, development adhesion tends to be improved. Furthermore, by setting the number at or below the upper limit, residue tends to be reduced.

[0165] Examples of the aromatic ring group include an aromatic hydrocarbon ring group and an aromatic heterocyclic group. The number of carbon atoms in the aromatic ring group is usually 4 or more, preferably 6 or more, more preferably 8 or more, and even more preferably 10 or more. It is also preferably 40 or less, more preferably 30 or less, still more preferably 20 or less, and particularly preferably 15 or less. The upper and lower limits can be arbitrarily combined, and for example, 4 to 40 is preferred, 6 to 30 is more preferred, 8 to 20 is even more preferred, and 10 to 15 is particularly preferred. By setting the carbon number at or above the lower limit, development adhesion tends to be improved. By setting the carbon number at or below the upper limit, residue tends to be reduced.

[0166] Examples of the aromatic ring in the aromatic ring group include a benzene ring, a naphthalene ring, an anthracene ring, a phenanthrene ring, and a fluorene ring. Among these, a fluorene ring is preferred from the viewpoint of development adhesion. Examples of the substituent that the cyclic hydrocarbon group may have include an alkyl group having 1 to 5 carbon atoms, such as a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, a sec-butyl group, a tert-butyl group, an amyl group, and an isoamyl group; an alkoxy group having 1 to 5 carbon atoms, such as a methoxy group and an ethoxy group; a hydroxyl group; a nitro group; a cyano group; and a carboxy group. Among these, an unsubstituted group is preferred from the viewpoint of ease of synthesis.

[0167] Among these, from the viewpoint of curability, R β is preferably a divalent aliphatic ring group, and more preferably a divalent adamantane ring group. β is preferably a divalent aromatic ring group, and more preferably a divalent fluorene ring group. As described above, the benzene ring in formula (ii-2) may be further substituted with any substituent. Examples of the substituent on the benzene ring in formula (ii-2) include a hydroxyl group, a methyl group, a methoxy group, an ethyl group, an ethoxy group, a propyl group, and a propoxy group. The number of substituents is not particularly limited, and may be one or two or more. From the viewpoint of curability, unsubstituted groups are preferred. Specific examples of the partial structure represented by formula (ii-2) are listed below.

[0168]

[0169]

[0170]

[0171]

[0172] From the viewpoint of curability, the partial structure represented by the formula (ii) is preferably a partial structure represented by the following formula (ii-3):

[0173]

[0174] In formula (ii-3), Rc and R d has the same meaning as in formula (ii). 1 is synonymous with formula (i-1). * represents a bond. The partial structure represented by formula (ii-3) contained in one molecule of epoxy (meth)acrylate resin (a-3-2) may be one type or two or more types. The number of partial structures represented by formula (ii) contained in one molecule of epoxy (meth)acrylate resin (a-3-2) is not particularly limited, but is preferably 1 or more, more preferably 3 or more, and is preferably 20 or less, more preferably 15 or less, and even more preferably 10 or less. The upper and lower limits can be arbitrarily combined, and for example, 1 to 20 is preferred, 1 to 15 is more preferred, and 3 to 10 is even more preferred. By setting the number to be equal to or greater than the lower limit, development adhesion tends to be improved. Furthermore, by setting the number to be equal to or less than the upper limit, residue tends to be reduced.

[0175] In yet another embodiment, the epoxy (meth)acrylate resin (a-3) is preferably an epoxy (meth)acrylate resin (a-3-3) containing a partial structure represented by the following general formula (iii), from the viewpoint of reducing outgassing during device light emission:

[0176]

[0177] In formula (iii), R e represents a hydrogen atom or a methyl group, and γ represents a single bond, —CO—, an alkylene group which may have a substituent, or a divalent cyclic hydrocarbon group which may have a substituent. The benzene ring in formula (iii) may be further substituted with an arbitrary substituent. * represents a bond.

[0178] (γ) In the formula (iii), γ represents a single bond, —CO—, an alkylene group which may have a substituent, or a divalent cyclic hydrocarbon group which may have a substituent. The alkylene group may be linear or branched, but is preferably linear from the viewpoint of developer solubility, and is preferably branched from the viewpoint of developer adhesion. The number of carbon atoms is not particularly limited, but is usually 1 or more, preferably 2 or more, and is preferably 6 or less, more preferably 4 or less. The upper and lower limits can be arbitrarily combined; for example, 1 to 6 is preferred, and 2 to 4 is more preferred. By setting the number at or above the lower limit, developer adhesion tends to be improved. Furthermore, by setting the number at or below the upper limit, residue tends to be reduced.

[0179] Examples of the alkylene group include a methylene group, an ethylene group, a propylene group, a butylene group, a hexylene group, and a heptylene group. From the viewpoint of achieving both excellent developer adhesion and excellent developer solubility, a methylene group, an ethylene group, and a propylene group are preferred, and a dimethylmethylene group (2,2-propylene group) is more preferred. Examples of the substituent that the alkylene group may have include an alkoxy group having 1 to 5 carbon atoms, such as a methoxy group or an ethoxy group; a hydroxyl group; a nitro group; a cyano group; and a carboxy group. From the viewpoint of achieving both excellent developer adhesion and excellent developer solubility, an unsubstituted group is preferred.

[0180] Examples of the divalent cyclic hydrocarbon group include a divalent aliphatic cyclic group or a divalent aromatic cyclic group. The number of rings in the aliphatic cyclic group is not particularly limited, but is usually 1 or more, preferably 2 or more, and is preferably 10 or less, more preferably 5 or less. The upper and lower limits can be arbitrarily combined, and for example, 1 to 10 is preferred, and 2 to 5 is more preferred. By setting the number at or above the lower limit, development adhesion tends to be improved. Furthermore, by setting the number at or below the upper limit, residue tends to be reduced.

[0181] The number of carbon atoms in the aliphatic cyclic group is usually 4 or more, preferably 6 or more, more preferably 8 or more, and preferably 40 or less, more preferably 35 or less, and even more preferably 30 or less. The upper and lower limits can be arbitrarily combined, and for example, 4 to 40 is preferred, 6 to 35 is more preferred, and 8 to 30 is even more preferred. By setting the carbon atom number at or above the lower limit, development adhesion tends to be improved. By setting the carbon atom number at or below the upper limit, residue tends to be reduced.

[0182] Examples of the aliphatic ring in the aliphatic cyclic group include a cyclohexane ring, a cycloheptane ring, a cyclodecane ring, a cyclododecane ring, a norbornane ring, an isobornane ring, and an adamantane ring. Among these, an adamantane ring is preferred from the viewpoint of development adhesion. The number of rings possessed by the aromatic cyclic group is not particularly limited, but is usually 1 or more, preferably 2 or more, more preferably 3 or more, and preferably 10 or less, more preferably 5 or less. The upper and lower limits can be arbitrarily combined, and for example, 1 to 10 is preferred, 2 to 10 is more preferred, and 3 to 5 is even more preferred. By setting the number at or above the lower limit, development adhesion tends to be improved. Furthermore, by setting the number at or below the upper limit, residue tends to be reduced.

[0183] Examples of the aromatic ring group include an aromatic hydrocarbon ring group and an aromatic heterocyclic group. The number of carbon atoms in the aromatic ring group is usually 4 or more, preferably 6 or more, more preferably 8 or more, and even more preferably 10 or more, and is preferably 40 or less, more preferably 30 or less, still more preferably 20 or less, and particularly preferably 15 or less. The upper and lower limits can be arbitrarily combined, and for example, 4 to 40 is preferred, 6 to 30 is more preferred, 8 to 20 is even more preferred, and 10 to 15 is particularly preferred. By setting the carbon number at or above the lower limit, development adhesion tends to be improved. Furthermore, by setting the carbon number at or below the upper limit, residue tends to be reduced.

[0184] Examples of the aromatic ring in the aromatic ring group include a benzene ring, a naphthalene ring, an anthracene ring, a phenanthrene ring, and a fluorene ring. Among these, a fluorene ring is preferred from the viewpoint of development adhesion. Examples of the substituent that the cyclic hydrocarbon group may have include an alkyl group having 1 to 5 carbon atoms, such as a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, a sec-butyl group, a tert-butyl group, an amyl group, and an isoamyl group; an alkoxy group having 1 to 5 carbon atoms, such as a methoxy group and an ethoxy group; a hydroxyl group; a nitro group; a cyano group; and a carboxy group. From the viewpoint of ease of synthesis, unsubstituted groups are preferred.

[0185] Among these, from the viewpoint of reducing residues, γ is preferably an alkylene group which may have a substituent, and more preferably dimethylmethylene. As described above, the benzene ring in formula (iii) may be further substituted with any substituent. Examples of the substituent on the benzene ring in formula (iii) include a hydroxyl group, a methyl group, a methoxy group, an ethyl group, an ethoxy group, a propyl group, and a propoxy group. The number of substituents is not particularly limited, and may be one or two or more. From the viewpoint of curability, unsubstituted groups are preferred.

[0186] From the viewpoint of development solubility, the partial structure represented by the formula (iii) is preferably a partial structure represented by the following formula (iii-1):

[0187]

[0188] In formula (iii-1), R e and γ have the same meaning as in formula (iii). 1is the same as that in formula (i-1). * represents a bond. The benzene ring in formula (iii-1) may be further substituted with any substituent. The number of partial structures represented by formula (iii) contained in one molecule of epoxy (meth)acrylate resin (a-3-3) is not particularly limited, but is preferably 1 or more, more preferably 5 or more, even more preferably 10 or more, and is preferably 18 or less, even more preferably 15 or less. The upper and lower limits can be arbitrarily combined; for example, 1 to 18 is preferred, 5 to 18 is more preferred, and 10 to 15 is even more preferred. By setting the number to be equal to or greater than the lower limit, development adhesion tends to be improved. Furthermore, by setting the number to be equal to or less than the upper limit, residue tends to be reduced.

[0189] The number of partial structures represented by formula (iii-1) contained in one molecule of epoxy (meth)acrylate resin (a-3-3) is not particularly limited, but is preferably 1 or more, more preferably 3 or more, even more preferably 5 or more, and is preferably 18 or less, and even more preferably 15 or less. The upper and lower limits can be arbitrarily combined, and for example, 1 to 18 is preferred, 3 to 18 is more preferred, and 5 to 15 is even more preferred. By setting the number at or above the lower limit, development adhesion tends to be improved. Furthermore, by setting the number at or below the upper limit, residue tends to be reduced. Specific examples of epoxy (meth)acrylate resin (a-3-3) are listed below.

[0190]

[0191]

[0192]

[0193] The alkali-soluble resin (a) may contain either the epoxy (meth)acrylate resin (a-3) or the acrylic copolymer resin (a-2) alone, or both. Furthermore, the alkali-soluble resin (a) may contain an alkali-soluble resin other than the alkali-soluble resin (b). The content of the alkali-soluble resin (a) in the photosensitive resin composition of the present invention is preferably 5% by mass or more, more preferably 10% by mass or more, even more preferably 20% by mass or more, even more preferably 30% by mass or more, particularly preferably 40% by mass or more, and preferably 90% by mass or less, more preferably 70% by mass or less, even more preferably 60% by mass or less, and particularly preferably 50% by mass or less, based on the total solid content of the photosensitive resin composition. The upper and lower limits can be arbitrarily combined; for example, 5 to 90% by mass is preferred, 10 to 90% by mass is more preferred, 20 to 70% by mass is even more preferred, 30 to 60% by mass is even more preferred, and 40 to 50% by mass is particularly preferred. By setting the content to be equal to or greater than the lower limit, the developability tends to be improved, and by setting the content to be equal to or less than the upper limit, the outgassing during light emission from the device tends to be reduced.

[0194] When the photosensitive resin composition of the present invention contains an epoxy (meth)acrylate resin (a-3), the content of the epoxy (meth)acrylate resin (a-3) is not particularly limited, but is preferably 5% by mass or more, more preferably 10% by mass or more, even more preferably 20% by mass or more, even more preferably 30% by mass or more, particularly preferably 40% by mass or more, and preferably 90% by mass or less, more preferably 70% by mass or less, even more preferably 60% by mass or less, and particularly preferably 50% by mass or less, based on the total solid content of the photosensitive resin composition. The upper and lower limits can be arbitrarily combined; for example, 5 to 90% by mass is preferred, 10 to 90% by mass is more preferred, 20 to 70% by mass is even more preferred, 30 to 60% by mass is even more preferred, and 40 to 50% by mass is particularly preferred. By setting the content at or above the lower limit, developability tends to be improved. Furthermore, by setting the content at or below the upper limit, outgassing during device light emission tends to be reduced.

[0195] Furthermore, when the photosensitive resin composition of the present invention contains an acrylic copolymer resin (a-2), the content of the acrylic copolymer resin (a-2) is not particularly limited, but is preferably 5% by mass or more, more preferably 10% by mass or more, even more preferably 20% by mass or more, even more preferably 30% by mass or more, particularly preferably 40% by mass or more, and preferably 90% by mass or less, more preferably 70% by mass or less, even more preferably 60% by mass or less, and particularly preferably 50% by mass or less, based on the total solid content of the photosensitive resin composition. The upper and lower limits can be arbitrarily combined; for example, 5 to 90% by mass is preferred, 10 to 90% by mass is more preferred, 20 to 70% by mass is even more preferred, 30 to 60% by mass is even more preferred, and 40 to 50% by mass is particularly preferred. By setting the content at or above the lower limit, developability tends to be improved. Furthermore, by setting the content at or below the upper limit, outgassing during device light emission tends to be reduced.

[0196] Furthermore, the total content of (a) alkali-soluble resin and (d) photopolymerizable compound in the total solid content of the photosensitive resin composition is preferably 5% by mass or more, more preferably 10% by mass or more, even more preferably 30% by mass or more, even more preferably 50% by mass or more, particularly preferably 70% by mass or more, even more particularly preferably 80% by mass or more, and most preferably 90% by mass or more, and is preferably 99% by mass or less, more preferably 97% by mass or less, and even more preferably 95% by mass or less. The upper and lower limits can be arbitrarily combined; for example, 5 to 99% by mass is preferred, 10 to 99% by mass is more preferred, 30 to 99% by mass is even more preferred, 50 to 97% by mass is even more preferred, 70 to 97% by mass is particularly preferred, 80 to 95% by mass is particularly preferred, and 90 to 95% by mass is most preferred. Setting the content at or above the lower limit tends to improve curability. Setting the content at or below the upper limit tends to reduce outgassing during device light emission.

[0197] The blending ratio of the (a) alkali-soluble resin to the (d) photopolymerizable compound in the photosensitive resin composition is preferably 50 parts by mass or more, more preferably 60 parts by mass or more, even more preferably 70 parts by mass or more, and particularly preferably 80 parts by mass or more, per 100 parts by mass of the (d) photopolymerizable compound. It is also preferably 400 parts by mass or less, more preferably 300 parts by mass or less, even more preferably 200 parts by mass or less, and particularly preferably 120 parts by mass or less. The total upper and lower limits can be arbitrarily combined. For example, 50 to 400 parts by mass is preferred, more preferably 60 to 300 parts by mass, even more preferably 70 to 200 parts by mass, and particularly preferably 80 to 120 parts by mass. By setting the blending ratio at or above the lower limit, development adhesion tends to be improved. Furthermore, by setting the blending ratio at or below the upper limit, curability tends to be improved.

[0198] [1-1-2] Component (b): Liquid-repellent agent The liquid-repellent agent (b) in the photosensitive resin composition of the present invention preferably contains a liquid-repellent agent (b1) having an ethylenically unsaturated bond group. The liquid-repellent agent (b1) preferably contains an acrylic resin (b2) containing a fluorine atom and a repeating unit represented by the following general formula (5):

[0199]

[0200] (In formula (5), R １１ each independently represents a hydrogen atom or a methyl group, R １２ represents an alkyl group having 2 to 6 carbon atoms which may have a substituent, and may be interrupted by one or more of -O-, -C(=O)-, -S-, and -NH-. * represents a bond.) R １２ The number of carbon atoms in the alkyl group is preferably 2 or more, more preferably 4 or more, and preferably 6 or less, more preferably 5 or less. The upper and lower limits can be arbitrarily combined; for example, 2 to 6 is preferred, and 4 to 5 is more preferred. By setting the number at or above the lower limit, synthesis becomes easier. Furthermore, by setting the number at or below the upper limit, the degree of freedom of the ethylenically unsaturated bond increases, and curability and liquid repellency tend to improve.

[0201] Also, R １２The alkyl group in may be interrupted by one or more of -O-, -C(=O)-, -S-, and -NH-. In another embodiment, it may be interrupted by -O-, -C(=O)-, or -NH-, and in yet another embodiment, it may be interrupted by -O-C(=O)-NH-. １２ When has a substituent, examples of the substituent include a hydroxyl group and an alkoxy group having 1 to 3 carbon atoms. It is preferably unsubstituted or substituted with a hydroxyl group, and more preferably unsubstituted.

[0202] R １２ As for -(C ２ H ４ ) ２ -NHCOO-(C ２ H ４ ) ２ -, -(CH) ２ -CHOH-(CH ２ A group represented by -(C)- is preferred in terms of liquid repellency. ２ H ４ ) ２ -NHCOO-(C ２ H ４ ) ２ The inclusion of the acrylic resin (b2) can impart ink repellency (liquid repellency) to the surface of the resulting partition wall, which is thought to prevent ink from adhering to the partition wall and prevent inks injected between adjacent regions from mixing together when the organic electroluminescent device is produced by an inkjet method.

[0203] It is believed that the use of a liquid repellent agent having an ethylenically unsaturated group such as that represented by general formula (5) can accelerate the crosslinking reaction on the surface of the formed coating film when the film is exposed to light, making it difficult for the liquid repellent agent to flow out during development, and as a result, the resulting partition walls can exhibit high ink repellency. The use of a resin containing fluorine atoms tends to allow the fluorine atom-containing resin to orient on the surface of the partition walls, thereby preventing ink bleeding and color mixing. More specifically, the group having a fluorine atom repels ink, and tends to prevent ink bleeding and color mixing caused by ink passing over the partition walls and penetrating into adjacent regions.

[0204] The acrylic resin (b2) preferably has a fluoroalkyl group and / or a fluoroalkylene group, and more preferably has a perfluoroalkyl group and / or a perfluoroalkylene ether chain. By having either or both of a fluoroalkyl group and a fluoroalkylene group, or either or both of a perfluoroalkyl group and a perfluoroalkylene ether chain, the fluorine atom-containing resin is more likely to be oriented on the surface of the partition wall, exhibiting higher ink repellency and further tending to prevent ink bleeding and color mixing.

[0205] Examples of perfluoroalkyl groups include perfluorobutyl groups, perfluorohexyl groups, and perfluorooctyl groups. Examples of perfluoroalkylene ether chains include -CF2-O-, -(CF2)2-O-, -(CF2)3-O-, -CF2-C(CF3)O-, -C(CF3)-CF2-O-, and divalent groups having these repeating units.

[0206] The acrylic resin (b2) may have a structural unit other than the repeating unit represented by general formula (5) or a structural unit containing a fluorine atom. Examples of such a structural unit include a structural unit containing an epoxy group, a structural unit containing a carboxy group, and a structural unit having an alkylene oxide chain. As a commercially available acrylic resin (b2), fluorine-containing organic compounds available under the trade names "Megafac (registered trademark; the same applies hereinafter) RS-72-K" and "Megafac RS-90" manufactured by DIC Corporation can be used.

[0207] The fluorine atom content in the acrylic resin (b2) is not particularly limited, but is preferably 5% by mass or more, more preferably 10% by mass or more, even more preferably 20% by mass or more, and even more preferably 25% by mass or more in the acrylic resin (b2). Also, it is preferably 50% by mass or less, and more preferably 35% by mass or less. The upper and lower limits can be arbitrarily combined; for example, 1 to 50% by mass is preferred, 10 to 50% by mass is more preferred, 20 to 35% by mass is more preferred, and 25 to 35% by mass is even more preferred. By setting the content at or above the lower limit, a high contact angle is easily ensured, while by setting the content at or below the upper limit, outflow to pixel areas tends to be suppressed.

[0208] The molecular weight of the acrylic resin (b2) is not particularly limited, and may be a low-molecular-weight compound or a high-molecular-weight compound. High-molecular-weight compounds are preferred because they suppress fluidity due to post-baking and can prevent outflow from the partition walls. From this viewpoint, the weight-average molecular weight of the acrylic resin (b2) is preferably 100 or more, more preferably 500 or more, and is preferably 100,000 or less, more preferably 10,000 or less. The upper and lower limits can be arbitrarily combined, and are, for example, preferably 100 to 100,000, more preferably 500 to 10,000.

[0209] The acrylic resin (b2) may be used alone or in combination of two or more. In the present invention, a liquid repellent other than the acrylic resin (b2) may be used in combination as the liquid repellent (b). The content of the liquid repellent (b) in the photosensitive resin composition of the present invention is not particularly limited, but is preferably 0.01% by mass or more, more preferably 0.05% by mass or more, even more preferably 0.1% by mass or more, and particularly preferably 0.2% by mass or more, based on the total solid content of the photosensitive resin composition. It is also preferably 5% by mass or less, more preferably 3% by mass or less, and even more preferably 1% by mass or less. The upper and lower limits can be arbitrarily combined. For example, it is preferably 0.01 to 5% by mass, more preferably 0.05 to 5% by mass, even more preferably 0.1 to 3% by mass, and particularly preferably 0.2 to 1% by mass. Setting the content at or above the lower limit tends to improve ink repellency. Setting the content at or below the upper limit tends to facilitate obtaining a uniform coating film when applying ink to pixel portions after partition wall formation.

[0210] The content of the acrylic resin (b2) in the photosensitive resin composition of the present invention is not particularly limited, but is preferably 0.01% by mass or more, more preferably 0.1% by mass or more, even more preferably 0.2% by mass or more, and is preferably 5% by mass or less, more preferably 3% by mass or less, and even more preferably 1% by mass or less, based on the total solid content of the photosensitive resin composition. The upper and lower limits can be arbitrarily combined, and for example, are preferably 0.01 to 5% by mass, more preferably 0.1 to 3% by mass, and even more preferably 0.2 to 1% by mass. By setting the content at or above the lower limit, ink repellency tends to be improved. Furthermore, by setting the content at or below the upper limit, a uniform coating film tends to be obtained more easily when applying ink to pixel portions after partition wall formation.

[0211] [1-1-3] Component (c): Photopolymerization Initiator The (c) photopolymerization initiator is a component that directly absorbs light, undergoes a decomposition reaction or a hydrogen abstraction reaction, and generates polymerization-active radicals. If necessary, additives such as a polymerization accelerator (chain transfer agent) or a sensitizing dye may be added. Examples of photopolymerization initiators include metallocene compounds including titanocene compounds described in JP-A-59-152396 and JP-A-61-151197; hexaarylbiimidazole derivatives described in JP-A-2000-56118; halomethylated oxadiazole derivatives and halomethyl-s-triazine derivatives described in JP-A-10-39503; α-aminoalkylphenone derivatives; and oxime ester compounds described in JP-A-2000-80068 and JP-A-2006-36750.

[0212] Specific examples of titanocene derivatives include dicyclopentadienyltitanium dichloride, dicyclopentadienyltitanium bisphenyl, dicyclopentadienyltitanium bis(2,3,4,5,6-pentafluorophenyl-1-yl), dicyclopentadienyltitanium bis(2,3,5,6-tetrafluorophenyl-1-yl), dicyclopentadienyltitanium bis(2,4,6-tri ... titanium di(2,6-difluorophenyl-1-yl), dicyclopentadienyltitanium di(2,4-difluorophenyl-1-yl), di(methylcyclopentadienyl)titanium bis(2,3,4,5,6-pentafluorophenyl-1-yl), di(methylcyclopentadienyl)titanium bis(2,6-difluorophenyl-1-yl), dicyclopentadienyltitanium [2,6-difluoro-3-(pyrro-1-yl)-phenyl-1-yl], and the like.

[0213] Examples of hexaarylbiimidazole derivatives include 2-(2'-chlorophenyl)-4,5-diphenylimidazole dimer, 2-(2'-chlorophenyl)-4,5-bis(3'-methoxyphenyl)imidazole dimer, 2-(2'-fluorophenyl)-4,5-diphenylimidazole dimer, 2-(2'-methoxyphenyl)-4,5-diphenylimidazole dimer, and (4'-methoxyphenyl)-4,5-diphenylimidazole dimer.

[0214] Furthermore, examples of halomethylated oxadiazole derivatives include 2-trichloromethyl-5-(2'-benzofuryl)-1,3,4-oxadiazole, 2-trichloromethyl-5-[β-(2'-benzofuryl)vinyl]-1,3,4-oxadiazole, 2-trichloromethyl-5-[β-(2'-(6''-benzofuryl)vinyl)]-1,3,4-oxadiazole, and 2-trichloromethyl-5-furyl-1,3,4-oxadiazole.

[0215] Furthermore, examples of halomethyl-s-triazine derivatives include 2-(4-methoxyphenyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4-methoxynaphthyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4-ethoxynaphthyl)-4,6-bis(trichloromethyl)-s-triazine, and 2-(4-ethoxycarbonylnaphthyl)-4,6-bis(trichloromethyl)-s-triazine.

[0216] Examples of α-aminoalkylphenone derivatives include 2-methyl-1[4-(methylthio)phenyl]-2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone-1,2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)butan-1-one, 4-dimethylaminoethyl benzoate, 4-dimethylaminoisoamyl benzoate, 4-diethylaminoacetophenone, 4-dimethylaminopropiophenone, 2-ethylhexyl-1,4-dimethylaminobenzoate, 2,5-bis(4-diethylaminobenzal)cyclohexanone, 7-diethylamino-3-(4-diethylaminobenzoyl)coumarin, and 4-(diethylamino)chalcone.

[0217] As a photopolymerization initiator, an oxime ester compound is particularly effective in terms of sensitivity and plate-making properties, and when an alkali-soluble resin containing a phenolic hydroxyl group is used, an oxime ester compound with such excellent sensitivity is particularly useful. Because an oxime ester compound has a structure that absorbs ultraviolet light, a structure that transmits light energy, and a structure that generates radicals, it has high sensitivity even in a small amount and is stable against thermal reactions, making it possible to obtain a highly sensitive photosensitive resin composition with a small amount.

[0218] Examples of the oxime ester compound include compounds represented by the following general formula (IV).

[0219]

[0220] In the above formula (IV), R 21a represents a hydrogen atom, an alkyl group which may have a substituent, or an aromatic ring group which may have a substituent. 21b represents an optional substituent containing an aromatic ring. 22a represents an alkanoyl group which may have a substituent, or an aryloyl group which may have a substituent.

[0221] n represents an integer of 0 or 1. 21aIn the formula, the number of carbon atoms in the alkyl group is not particularly limited, but from the viewpoint of solubility in a solvent and sensitivity, it is usually 1 or more, preferably 2 or more, and usually 20 or less, preferably 15 or less, more preferably 10 or less. Specific examples of the alkyl group include a methyl group, an ethyl group, a propyl group, a cyclopentylethyl group, and a propyl group.

[0222] Examples of the substituent that the alkyl group may have include an aromatic ring group, a hydroxyl group, a carboxy group, a halogen atom, an amino group, an amide group, a 4-(2-methoxy-1-methyl)ethoxy-2-methylphenyl group, and an N-acetyl-N-acetoxyamino group, and from the viewpoint of ease of synthesis, it is preferable that the alkyl group is unsubstituted. 21a Examples of the aromatic ring group in include an aromatic hydrocarbon ring group and an aromatic heterocyclic group. The number of carbon atoms in the aromatic ring group is not particularly limited, but is preferably 5 or more from the viewpoint of solubility in the photosensitive resin composition. Furthermore, from the viewpoint of developability, it is preferably 30 or less, more preferably 20 or less, and even more preferably 12 or less.

[0223] Specific examples of the aromatic ring group include a phenyl group, a naphthyl group, a pyridyl group, and a furyl group, and among these, from the viewpoint of developability, a phenyl group or a naphthyl group is preferred, and a phenyl group is more preferred. Examples of the substituent that the aromatic ring group may have include a hydroxyl group, a carboxyl group, a halogen atom, an amino group, an amide group, an alkyl group, an alkoxy group, and a group in which these substituents are linked, and from the viewpoint of developability, an alkyl group, an alkoxy group, and a group in which these are linked are preferred, and a linked alkoxy group is more preferred.

[0224] Among these, R 21a is preferably an alkyl group which may have a substituent, more preferably an unsubstituted alkyl group, and even more preferably a methyl group. 21a is preferably an aromatic ring group which may have a substituent, and more preferably an aromatic ring group which has a linked alkoxy group as a substituent.

[0225] Also, R21b As R, an optionally substituted carbazole group, an optionally substituted thioxanthonyl group, or an optionally substituted diphenyl sulfide group is preferred. Among these, an optionally substituted diphenyl sulfide group is preferred from the viewpoint of NMP resistance. 22a The number of carbon atoms in the alkanoyl group is not particularly limited, but from the viewpoint of solubility in a solvent and sensitivity, it is usually 2 or more, preferably 3 or more, and usually 20 or less, preferably 15 or less, more preferably 10 or less, and even more preferably 5 or less. Specific examples of the alkanoyl group include an acetyl group, an ethyloyl group, a propanoyl group, and a butanoyl group.

[0226] Examples of the substituent that the alkanoyl group may have include an aromatic ring group, a hydroxyl group, a carboxyl group, a halogen atom, an amino group, and an amide group, and from the viewpoint of ease of synthesis, it is preferable that the alkanoyl group is unsubstituted. 22a The number of carbon atoms in the aryloyl group is not particularly limited, but from the viewpoint of solubility in a solvent and sensitivity, it is usually 7 or more, preferably 8 or more, and usually 20 or less, preferably 15 or less, more preferably 10 or less. Specific examples of the aryloyl group include a benzoyl group and a naphthoyl group.

[0227] Examples of the substituent that the aryloyl group may have include a hydroxyl group, a carboxyl group, a halogen atom, an amino group, an amide group, and an alkyl group. From the viewpoint of ease of synthesis, it is preferable that the aryloyl group is unsubstituted. Among these, from the viewpoint of NMP resistance, R 22a is preferably an alkanoyl group which may have a substituent, more preferably an unsubstituted alkanoyl group, and even more preferably an acetyl group.

[0228] The initiators described in JP 2016-133574 A are also preferably used because they reduce contamination of the liquid crystal layer by colorants. The photopolymerization initiators may be used alone or in combination of two or more. If necessary, a sensitizing dye and a polymerization accelerator corresponding to the wavelength of the image exposure light source may be blended into the photopolymerization initiator in order to increase sensitivity. Examples of sensitizing dyes include xanthene dyes described in JP-A Nos. 4-221958 and 4-219756, coumarin dyes having a heterocycle described in JP-A Nos. 3-239703 and 5-289335, 3-ketocoumarin compounds described in JP-A Nos. 3-239703 and 5-289335, pyrromethene dyes described in JP-A No. 6-19240, and others, such as those described in JP-A Nos. 47-2528 and 54-155292. and dyes having a dialkylaminobenzene skeleton described in JP-B No. 45-37377, JP-A No. 48-84183, JP-A No. 52-112681, JP-A No. 58-15503, JP-A No. 60-88005, JP-A No. 59-56403, JP-A No. 2-69, JP-A No. 57-168088, JP-A No. 5-107761, JP-A No. 5-210240, and JP-A No. 4-288818.

[0229] Among these sensitizing dyes, preferred are amino group-containing sensitizing dyes, and more preferred are compounds having an amino group and a phenyl group in the same molecule. Particularly preferred are, for example, benzophenone compounds such as 4,4'-dimethylaminobenzophenone, 4,4'-diethylaminobenzophenone, 2-aminobenzophenone, 4-aminobenzophenone, 4,4'-diaminobenzophenone, 3,3'-diaminobenzophenone, and 3,4-diaminobenzophenone; 2-(p-dimethylaminophenyl)benzoxazole, 2-(p-diethylaminophenyl)benzoxazole, 2-(p-dimethylaminophenyl)benzo[4,5]benzoxazole, 2-(p-dimethylaminophenyl)benzo[6,7]benzoxazole, and 2,5-bis(p-diethylaminophenyl)-1,3,4-o and p-dialkylaminophenyl group-containing compounds such as thiazolinone, 2-(p-dimethylaminophenyl)benzothiazole, 2-(p-diethylaminophenyl)benzothiazole, 2-(p-dimethylaminophenyl)benzimidazole, 2-(p-diethylaminophenyl)benzimidazole, 2,5-bis(p-diethylaminophenyl)-1,3,4-thiadiazole, (p-dimethylaminophenyl)pyridine, (p-diethylaminophenyl)pyridine, (p-dimethylaminophenyl)quinoline, (p-diethylaminophenyl)quinoline, (p-dimethylaminophenyl)pyrimidine, and (p-diethylaminophenyl)pyrimidine. Of these, 4,4'-dialkylaminobenzophenone is the most preferred.

[0230] The sensitizing dyes may be used alone or in combination of two or more. Examples of the polymerization accelerator include aromatic amines such as ethyl p-dimethylaminobenzoate and 2-dimethylaminoethyl benzoate, aliphatic amines such as n-butylamine and N-methyldiethanolamine, and mercapto compounds described below. The polymerization accelerators may be used alone or in combination of two or more.

[0231] [1-1-4] Component (d): Photopolymerizable Compound The photosensitive resin composition of the present invention contains a photopolymerizable compound (d). It is believed that the inclusion of the photopolymerizable compound (d) results in high sensitivity. The photopolymerizable compound used herein refers to a compound having one or more ethylenically unsaturated bonds (ethylenic double bonds) in the molecule. However, from the viewpoints of polymerizability, crosslinkability, and the associated ability to increase the difference in developer solubility between exposed and unexposed areas, a compound having two or more ethylenically unsaturated bonds in the molecule is preferred. Furthermore, it is even more preferred that the unsaturated bond is derived from a (meth)acryloyloxy group, i.e., a (meth)acrylate compound.

[0232] In the photosensitive resin composition of the present invention, it is particularly desirable to use a polyfunctional ethylenic monomer having two or more ethylenically unsaturated bonds per molecule. The number of ethylenically unsaturated groups in the polyfunctional ethylenic monomer is not particularly limited, but is preferably two or more, more preferably three or more, even more preferably four or more, and particularly preferably five or more, and is preferably 15 or less, more preferably 10 or less, even more preferably eight or less, and particularly preferably seven or less. The upper and lower limits can be arbitrarily combined; for example, 2 to 15 is preferred, 3 to 10 is more preferred, 4 to 8 is even more preferred, and 5 to 7 is particularly preferred. Setting the number at or above the lower limit tends to improve polymerizability and result in high sensitivity. Setting the number at or below the upper limit tends to result in better developability.

[0233] Examples of the photopolymerizable compound include esters of aliphatic polyhydroxy compounds and unsaturated carboxylic acids; esters of aromatic polyhydroxy compounds and unsaturated carboxylic acids; and esters obtained by an esterification reaction between polyhydric hydroxy compounds such as aliphatic polyhydroxy compounds and aromatic polyhydroxy compounds and unsaturated carboxylic acids and polybasic carboxylic acids.

[0234] Examples of esters of aliphatic polyhydroxy compounds and unsaturated carboxylic acids include acrylic acid esters of aliphatic polyhydroxy compounds such as ethylene glycol diacrylate, triethylene glycol diacrylate, trimethylolpropane triacrylate, trimethylolethane triacrylate, pentaerythritol diacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol tetraacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, and glycerol acrylate; methacrylic acid esters in which the acrylate of these compounds is replaced with methacrylate; itaconic acid esters in which the acrylate of these compounds is replaced with itaconate; crotonate esters in which the acrylate of these compounds is replaced with crotonate; and maleic acid esters in which the acrylate of these compounds is replaced with maleate.

[0235] Examples of esters of aromatic polyhydroxy compounds and unsaturated carboxylic acids include acrylic acid esters and methacrylic acid esters of aromatic polyhydroxy compounds such as hydroquinone diacrylate, hydroquinone dimethacrylate, resorcinol diacrylate, resorcinol dimethacrylate, pyrogallol triacrylate, etc. Esters obtained by the esterification reaction of polyhydric hydroxy compounds such as aliphatic polyhydroxy compounds and aromatic polyhydroxy compounds with unsaturated carboxylic acids and polybasic carboxylic acids are not necessarily single compounds, but include, for example, condensates of acrylic acid, phthalic acid, and ethylene glycol; condensates of acrylic acid, maleic acid, and diethylene glycol; condensates of methacrylic acid, terephthalic acid, and pentaerythritol; and condensates of acrylic acid, adipic acid, butanediol, and glycerin.

[0236] Other useful examples of the photopolymerizable compound that can be used in the photosensitive resin composition of the present invention include urethane (meth)acrylates such as those obtained by reacting a polyisocyanate compound with a hydroxyl group-containing (meth)acrylic acid ester or a polyisocyanate compound with a polyol and a hydroxyl group-containing (meth)acrylic acid ester; epoxy acrylates such as addition reaction products of a polyfunctional epoxy compound with a hydroxyl group-containing (meth)acrylic acid ester or (meth)acrylic acid; acrylamides such as ethylenebisacrylamide; allyl esters such as diallyl phthalate; and vinyl group-containing compounds such as divinyl phthalate.

[0237] Examples of urethane (meth)acrylates include DPHA-40H, UX-5000, UX-5002D-P20, UX-5003D, and UX-5005 (manufactured by Nippon Kayaku Co., Ltd.), U-2PPA, U-6LPA, U-10PA, U-33H, UA-53H, UA-32P, and UA-1100H (manufactured by Shin-Nakamura Chemical Co., Ltd.), UA-306H, UA-510H, and UF-8001G (manufactured by Kyoeisha Chemical Co., Ltd.), and UV-1700B, UV-7600B, UV-7605B, UV-7630B, and UV7640B (manufactured by Mitsubishi Chemical Corporation).

[0238] Among these, from the viewpoint of an appropriate taper angle and sensitivity, it is preferable to use ester (meth)acrylates or urethane (meth)acrylates as the (d) photopolymerizable compound, and it is more preferable to use dipentaerythritol hexa(meth)acrylate, dipentaerythritol penta(meth)acrylate, 2-tris(meth)acryloyloxymethylethyl phthalate, pentaerythritol tetra(meth)acrylate, pentaerythritol tri(meth)acrylate, a dibasic acid anhydride adduct of dipentaerythritol penta(meth)acrylate, or a dibasic acid anhydride adduct of pentaerythritol tri(meth)acrylate.

[0239] These may be used alone or in combination of two or more. In the photosensitive resin composition of the present invention, the molecular weight of the photopolymerizable compound (d) is not particularly limited, but from the viewpoints of sensitivity, ink repellency, and taper angle, it is preferably 100 or more, more preferably 150 or more, even more preferably 200 or more, still more preferably 300 or more, particularly preferably 400 or more, and most preferably 500 or more, and is preferably 1000 or less, more preferably 700 or less. The upper and lower limits can be arbitrarily combined, and for example, it is preferably 100 to 1000, more preferably 150 to 1000, even more preferably 200 to 1000, even more preferably 300 to 700, particularly preferably 400 to 700, and most preferably 500 to 700.

[0240] The number of carbon atoms in the (d) photopolymerizable compound is not particularly limited, but from the viewpoints of sensitivity, ink repellency, and taper angle, it is preferably 7 or more, more preferably 10 or more, even more preferably 15 or more, still more preferably 20 or more, and particularly preferably 25 or more, and is preferably 50 or less, more preferably 40 or less, even more preferably 35 or less, and particularly preferably 30 or less. The upper and lower limits can be arbitrarily combined; for example, 7 to 50 is preferred, 10 to 50 is more preferred, 15 to 40 is even more preferred, 20 to 35 is even more preferred, and 25 to 30 is particularly preferred.

[0241] From the viewpoints of sensitivity, ink repellency, and taper angle, ester (meth)acrylates, epoxy (meth)acrylates, and urethane (meth)acrylates are preferred, and among these, tri- or higher functional ester (meth)acrylates such as pentaerythritol tetra(meth)acrylate, pentaerythritol tri(meth)acrylate dipentaerythritol hexa(meth)acrylate, and dipentaerythritol penta(meth)acrylate, and adducts of acid anhydrides to tri- or higher functional ester (meth)acrylates such as 2,2,2-tris(meth)acryloyloxymethylethyl phthalate and dibasic acid anhydride adducts of dipentaerythritol penta(meth)acrylate are more preferred.

[0242] The content of the (d) photopolymerizable compound in the photosensitive resin composition of the present invention is preferably 5% by mass or more, more preferably 10% by mass or more, even more preferably 20% by mass or more, even more preferably 30% by mass or more, particularly preferably 40% by mass or more, and preferably 80% by mass or less, more preferably 70% by mass or less, even more preferably 60% by mass or less, even more preferably 55% by mass or less, and particularly preferably 50% by mass or less, based on the total solid content of the photosensitive resin composition. The upper and lower limits can be arbitrarily combined; for example, 5 to 80% by mass is preferred, 10 to 70% by mass is more preferred, 20 to 60% by mass is even more preferred, 30 to 55% by mass or less is even more preferred, and 40 to 50% by mass is particularly preferred. By setting the content at or above the lower limit, appropriate internal curing properties tend to be achieved. By setting the content at or below the upper limit, developability tends to be good.

[0243] [1-1-5] UV absorber The photosensitive resin composition of the present invention may contain a UV absorber. The UV absorber is added for the purpose of controlling the photocuring distribution by absorbing specific wavelengths of the light source used for exposure. The inclusion of a UV absorber tends to provide effects such as improving the taper angle shape after development and reducing residues remaining in unexposed areas after development. As the UV absorber, from the viewpoint of inhibiting light absorption by the photopolymerization initiator, for example, a compound having an absorption maximum in the wavelength range of 250 nm to 400 nm can be used.

[0244] Examples of ultraviolet absorbers include benzotriazole compounds, triazine compounds, benzophenone compounds, benzoate compounds, cinnamic acid derivatives, naphthalene derivatives, anthracene and its derivatives, dinaphthalene compounds, phenanthroline compounds, and dyes. These ultraviolet absorbers may be used alone or in combination of two or more.

[0245] Among these, from the viewpoint of increasing the taper angle, benzotriazole compounds and / or hydroxyphenyltriazine compounds are preferred, and benzotriazole compounds are particularly preferred. Among benzotriazole-based compounds, from the viewpoint of the tapered shape, benzotriazole compounds represented by the following general formula (Z1) are preferred.

[0246]

[0247] In the above formula (Z1), R 1e and R 2e R each independently represents a hydrogen atom, an alkyl group which may have a substituent, a group represented by the following general formula (Z2), or a group represented by the following general formula (Z3). 3e represents a hydrogen atom or a halogen atom.

[0248]

[0249] In the above formula (Z2), R 4e represents an alkylene group which may have a substituent, R 5e represents an alkyl group which may have a substituent.

[0250]

[0251] In the above formula (Z3), R 6e represents an alkylene group which may have a substituent, R 7e represents a hydrogen atom or a methyl group.

[0252] (R 1e and R 2e In the formula (Z1), R 1e and R 2eeach independently represents a hydrogen atom, an alkyl group which may have a substituent, a group represented by general formula (Z2), or a group represented by general formula (Z3). Examples of the alkyl group include linear, branched, and cyclic alkyl groups. The number of carbon atoms is preferably 1 or more, more preferably 2 or more, and even more preferably 4 or more, and is preferably 10 or less, more preferably 6 or less, and even more preferably 4 or less. The upper and lower limits can be arbitrarily combined; for example, 1 to 10 is preferred, 2 to 6 is more preferred, and 4 to 6 is even more preferred.

[0253] Examples of the alkyl group include a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, an isobutyl group, and a tert-butyl group. Of these, a tert-butyl group is preferable. Examples of the substituent that the alkyl group may have include a methoxy group, an ethoxy group, a chloro group, a bromo group, a fluoro group, a hydroxy group, an amino group, an epoxy group, an oligoethylene glycol group, a phenyl group, a carboxy group, an acryloyl group, and a methacryloyl group.

[0254] (R 3e In the formula (Z1), R 3e represents a hydrogen atom or a halogen atom. Examples of halogen atoms include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom. Among these, from the viewpoint of synthesis, R 3e is preferably a hydrogen atom.

[0255] (R 4e In the formula (Z2), R 4erepresents an alkylene group which may have a substituent. Examples of the alkylene group include linear, branched, and cyclic alkylene groups. The number of carbon atoms is usually 1 or more, preferably 2 or more, and preferably 6 or less, more preferably 4 or less, and even more preferably 3 or less. The upper and lower limits can be arbitrarily combined; for example, 1 to 6 is preferred, 1 to 4 is more preferred, and 2 to 3 is even more preferred. Examples of the alkylene group include a methylene group, an ethylene group, a propylene group, and a butylene group. Among these, an ethylene group is preferred.

[0256] Examples of the substituent that the alkylene group may have include a methoxy group, an ethoxy group, a chloro group, a bromo group, a fluoro group, a hydroxy group, an amino group, an epoxy group, an oligoethylene glycol group, a phenyl group, a carboxy group, an acryloyl group, and a methacryloyl group. 4e is preferably an ethylene group.

[0257] (R 5e In the formula (Z2), R 5e represents an alkyl group which may have a substituent. Examples of the alkyl group include linear, branched, and cyclic alkyl groups. The number of carbon atoms is preferably 4 or more, more preferably 5 or more, and even more preferably 7 or more, and is preferably 15 or less, more preferably 10 or less, and even more preferably 9 or less. The upper and lower limits can be arbitrarily combined; for example, 5 to 15 is preferred, 5 to 10 is more preferred, and 7 to 9 is even more preferred.

[0258] Examples of the alkyl group include a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, a hexyl group, a hepsyl group, an octyl group, and a nonyl group. Examples of the substituent that the alkyl group may have include a methoxy group, an ethoxy group, a chloro group, a bromo group, a fluoro group, a hydroxy group, an amino group, an epoxy group, an oligoethylene glycol group, a phenyl group, a carboxy group, an acryloyl group, and a methacryloyl group. Among these, from the viewpoint of the tapered shape, R 5eis preferably a heptyl group, an octyl group, or a nonyl group.

[0259] (R 6e In the formula (Z3), R 6e represents an alkylene group which may have a substituent. Examples of the alkylene group include linear, branched, and cyclic alkylene groups. The number of carbon atoms is usually 1 or more, preferably 2 or more, and is preferably 6 or less, more preferably 4 or less, and even more preferably 3 or less. The above upper and lower limits can be arbitrarily combined; for example, 1 to 6 is preferred, 1 to 4 is more preferred, and 2 to 3 is even more preferred.

[0260] Examples of the alkylene group include a methylene group, an ethylene group, a propylene group, and a butylene group. Among these, an ethylene group is preferred. Examples of the substituent that the alkylene group may have include a methoxy group, an ethoxy group, a chloro group, a bromo group, a fluoro group, a hydroxy group, an amino group, an epoxy group, an oligoethylene glycol group, a phenyl group, a carboxy group, an acryloyl group, and a methacryloyl group.

[0261] Among these, from the viewpoint of tapered shape, R 1e is a tert-butyl group, R 2e is a group represented by the formula (Z2) (where R 4e is an ethylene group, and R 5e is an alkyl group having 7 to 9 carbon atoms), R 3e is a hydrogen atom, or 1e is a hydrogen atom, R 2e is a group represented by the formula (Z3) (where R 6e is an ethylene group, and R 7e is a methyl group), R 3e is a hydrogen atom, and R 1e is a tert-butyl group, R 2e is a group represented by the formula (Z2) (where R 4e is an ethylene group, and R 5e is an alkyl group having 7 to 9 carbon atoms), R 3e is a hydrogen atom is more preferred.

[0262] Examples of benzotriazole compounds include 2-(5-methyl-2-hydroxyphenyl)benzotriazole, 2-(2-hydroxy-5-t-butylphenyl)-2H-benzotriazole, a mixture of octyl-3[3-tert-butyl-4-hydroxy-5-(5-chloro-2H-benzotriazol-2-yl)phenyl]propionate and 2-ethylhexyl-3-[3-tert-butyl-4-hydroxy-5-(5-chloro-2H-benzotriazol-2-yl)phenyl]propionate, 2-[2-hydroxy-3,5-bis(α,α-dimethylbenzyl)phenyl]-2H-benzotriazole, 2-(3-tert-butyl-5-methyl-2-hydroxyphenyl)-5-chlorobenzotriazole, 2-(3,5-di-t-amyl-2-hydroxyphenyl)-2H-benzotriazole, and the like. 2-(2'-hydroxy-5'-t-octylphenyl)benzotriazole, 3-[3-tert-butyl-5-(2H-benzotriazol-2-yl)-4-hydroxyphenyl]heptyl propionate, 3-[3-tert-butyl-5-(2H-benzotriazol-2-yl)-4-hydroxyphenyl]octyl propionate, 3-[3-tert-butyl-5-(2H-benzotriazol-2-yl)-4-hydroxyphenyl]nonyl propionate, 2-(2H-benzotriazol-2-yl)-4,6-bis(1-methyl-1-phenylethyl)phenol, and 2-(2H-benzotriazol-2-yl)-6-(1-methyl-1-phenylethyl)-4-(1,1,3,3-tetramethylbutyl)phenol. Among these, from the viewpoints of taper angle and exposure sensitivity, heptyl 3-[3-tert-butyl-5-(2H-benzotriazol-2-yl)-4-hydroxyphenyl]propionate, octyl 3-[3-tert-butyl-5-(2H-benzotriazol-2-yl)-4-hydroxyphenyl]propionate, nonyl 3-[3-tert-butyl-5-(2H-benzotriazol-2-yl)-4-hydroxyphenyl]propionate, and mixtures thereof are preferred.

[0263] Commercially available benzotriazole compounds include, for example, Sumisorb (registered trademark, the same applies hereinafter) 200, Sumisorb 250, Sumisorb 300, Sumisorb 340, Sumisorb 350 (manufactured by Sumitomo Chemical Co., Ltd.), JF77, JF78, JF79, JF80, JF83 (manufactured by Johoku Chemical Industry Co., Ltd.), TINUVIN (registered trademark, the same applies hereinafter) PS, TINUVIN 99-2, TINUVIN 109, TINUVIN 384-2, TINUVIN 326, TINUVIN 900, TINUVIN 928, TINUVIN 1130 (manufactured by BASF), EVERSORB 70, EVERSORB 71, EVERSORB 72, EVERSORB 1130 ... Examples of such a surfactant include SORB73, EVERSORB74, EVERSORB75, EVERSORB76, EVERSORA-234, EVERSORB77, EVERSORB78, EVERSORB80, EVERSORB81 (manufactured by Taiwan Yong Guang Chemical Industry Co., Ltd.), TOMISORB (registered trademark, the same applies hereinafter) 100, TOMISORB 600 (manufactured by API Corporation), SEESORB (registered trademark, the same applies hereinafter) 701, SEESORB702, SEESORB703, SEESORB704, SEESORB706, SEESORB707, SEESORB709 (manufactured by Shipro Chemical Co., Ltd.), and RUVA-93 (manufactured by Otsuka Chemical Co., Ltd.).

[0264] Examples of triazine compounds include 2-[4,6-di(2,4-xylyl)-1,3,5-triazin-2-yl]-5-octyloxyphenol, 2-[4,6-bis(2,4-dimethylphenyl)-1,3,5-triazin-2-yl]-5-[3-(dodecyloxy)-2-hydroxypropoxy]phenol, a reaction product of 2-(2,4-dihydroxyphenyl)-4,6-bis(2,4-dimethylphenyl)-1,3,5-triazine and (2-ethylhexyl)glycidic acid ester, and 2,4-bis[2-hydroxy-4-butoxyphenyl]-6-(2,4-dibutoxyphenyl)-1,3,5-triazine. Among these, hydroxyphenyltriazine compounds are preferred from the viewpoints of taper angle and exposure sensitivity.

[0265] Examples of commercially available triazine compounds include TINUVIN 400, TINUVIN 405, TINUVIN 460, TINUVIN 477, and TINUVIN 479 (manufactured by BASF). Other ultraviolet absorbers include Sumisorb 130 (manufactured by Sumitomo Chemical Co., Ltd.), EVERSORA-30, EVERSORA-31, and EVERSORA-32 (manufactured by Taiwan Yongkou Chemical Industry Co., Ltd.), Tomisorb 800 (manufactured by API Corporation), SEESORA-300, SEESORA-301, SEESORA-301S, SEESORA-302, SEESORA-303, and SEE Benzophenone compounds such as SORA-305, SEESORA-306, SEESORA-307, and SEESORA-351 (manufactured by Shipro Chemical Co., Ltd.); benzoate compounds such as Sumisorb 400 (manufactured by Sumitomo Chemical Co., Ltd.) and phenyl salicylate; cinnamic acid derivatives such as 2-ethylhexyl cinnamate, 2-ethylhexyl paramethoxycinnamate, isopropyl methoxycinnamate, and isoamyl methoxycinnamate; α naphthalene derivatives such as α-naphthol, β-naphthol, α-naphthol methyl ether, α-naphthol ethyl ether, 1,2-dihydroxynaphthalene, 1,3-dihydroxynaphthalene, 1,4-dihydroxynaphthalene, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 1,7-dihydroxynaphthalene, 1,8-dihydroxynaphthalene, 2,3-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, and 2,7-dihydroxynaphthalene; anthracene and derivatives thereof such as anthracene and 9,10-dihydroxyanthracene; and dyes such as azo dyes, benzophenone dyes, aminoketone dyes, quinoline dyes, anthraquinone dyes, diphenylcyanoacrylate dyes, triazine dyes, and p-aminobenzoic acid dyes. Among these, from the viewpoint of exposure sensitivity, cinnamic acid derivatives and naphthalene derivatives are preferably used, and cinnamic acid derivatives are particularly preferred.

[0266] When the photosensitive resin composition of the present invention contains an ultraviolet absorber, the content of the ultraviolet absorber in the photosensitive resin composition is preferably 0.01% by mass or more, more preferably 0.05% by mass or more, even more preferably 0.1% by mass or more, even more preferably 0.5% by mass or more, particularly preferably 1% by mass or more, based on the total solid content of the photosensitive resin composition, and is preferably 15% by mass or less, more preferably 10% by mass or less, even more preferably 5% by mass or less, and particularly preferably 3% by mass or less. The upper and lower limits can be arbitrarily combined; for example, 0.01 to 15% by mass is preferred, 0.05 to 15% by mass is more preferred, 0.1 to 10% by mass is even more preferred, 0.5 to 5% by mass is even more preferred, and 1 to 3% by mass is particularly preferred. Setting the content at or above the lower limit tends to increase the taper angle. Setting the content at or below the upper limit tends to increase sensitivity.

[0267] When the photosensitive resin composition of the present invention contains an ultraviolet absorber, the blending ratio relative to the (c) photopolymerization initiator is preferably 1 part by mass or more, more preferably 10 parts by mass or more, even more preferably 30 parts by mass or more, even more preferably 50 parts by mass or more, particularly preferably 80 parts by mass or more, per 100 parts by mass of the (c) photopolymerization initiator, and is preferably 500 parts by mass or less, more preferably 300 parts by mass or less, even more preferably 200 parts by mass or less, particularly preferably 150 parts by mass or less. The upper and lower limits can be arbitrarily combined; for example, 10 to 500 parts by mass is preferred, 30 to 300 parts by mass is more preferred, 50 to 200 parts by mass is even more preferred, and 80 to 150 parts by mass is particularly preferred. By setting the blending ratio at or above the lower limit, the taper angle tends to increase. Furthermore, by setting the blending ratio at or below the upper limit, high sensitivity tends to be achieved.

[0268] [1-1-6] Polymerization Inhibitor The photosensitive resin composition of the present invention may contain a polymerization inhibitor. It is believed that the inclusion of a polymerization inhibitor inhibits radical polymerization, thereby making it possible to increase the taper angle of the resulting partition walls. Examples of polymerization inhibitors include hydroquinone, hydroquinone monomethyl ether, methylhydroquinone, methoxyphenol, and 2,6-di-tert-butyl-4-cresol (BHT). Among these, from the viewpoint of polymerization inhibition ability, methylhydroquinone and methoxyphenol are preferred, and methylhydroquinone is more preferred.

[0269] The polymerization inhibitor may be used alone or in combination of two or more. Usually, when the alkali-soluble resin (a) is produced, a polymerization inhibitor may be contained in the resin, and this may be used as the polymerization inhibitor contained in the photosensitive resin composition of the present invention. Alternatively, in addition to the polymerization inhibitor contained in the resin, a polymerization inhibitor identical to or different from the polymerization inhibitor may be added during the production of the photosensitive resin composition.

[0270] When the photosensitive resin composition of the present invention contains a polymerization inhibitor, the content of the polymerization inhibitor in the photosensitive resin composition is preferably 0.0005% by mass or more, more preferably 0.001% by mass or more, even more preferably 0.01% by mass or more, and preferably 0.3% by mass or less, more preferably 0.2% by mass or less, and even more preferably 0.1% by mass or less, based on the total solid content of the photosensitive resin composition. The upper and lower limits can be arbitrarily combined; for example, 0.0005 to 0.3% by mass is preferred, 0.001 to 0.2% by mass is more preferred, and 0.01 to 0.1% by mass is even more preferred. By setting the content at or above the lower limit, the taper angle tends to be higher. Furthermore, by setting the content at or below the upper limit, high sensitivity tends to be maintained.

[0271] [1-1-7] Amino Compound The photosensitive resin composition of the present invention may contain an amino compound to promote thermal curing. When the photosensitive resin composition of the present invention contains an amino compound, the content of the amino compound in the photosensitive resin composition is preferably 40% by mass or less, more preferably 30% by mass or less, based on the total solid content of the photosensitive resin composition. It is also preferably 0.5% by mass or more, more preferably 1% by mass or more. The upper and lower limits can be arbitrarily combined; for example, 0.5 to 40% by mass is preferred, and 1 to 30% by mass is more preferred. By setting the content below the upper limit, storage stability tends to be maintained. By setting the content above the lower limit, sufficient thermal curing tends to be ensured.

[0272] Examples of the amino compound include amino compounds having, as a functional group, a methylol group or at least two alkoxymethyl groups obtained by condensing a methylol group with an alcohol having 1 to 8 carbon atoms. Specific examples include melamine resins obtained by polycondensing melamine with formaldehyde, benzoguanamine resins obtained by polycondensing benzoguanamine with formaldehyde, glycoluril resins obtained by polycondensing glycoluril with formaldehyde, urea resins obtained by polycondensing urea with formaldehyde, resins obtained by copolycondensing two or more of melamine, benzoguanamine, glycoluril, urea, and the like with formaldehyde, and modified resins obtained by condensing the methylol groups of the above-mentioned resins with alcohol.

[0273] These may be used alone or in combination of two or more. Among these, melamine resins and modified resins thereof are preferred as the amino compound, and modified resins having a modification ratio of methylol groups of 70% or more are more preferred, and modified resins having a modification ratio of 80% or more are particularly preferred. Examples of melamine resins and modified resins thereof as amino compounds include Cymel (registered trademark, the same applies hereinafter) 300, 301, 303, 350, 736, 738, 370, 771, 325, 327, 703, 701, 266, 267, 285, 232, 235, 238, 1141, 272, 254, 202, 1156, and 1158 manufactured by Cytec Corporation, and Nikalac (registered trademark, the same applies hereinafter) MW-390, MW-100LM, MX-750LM, MW-30M, MX-45, and MX-302 manufactured by Sanwa Chemical Co., Ltd.

[0274] Examples of benzoguanamine resins and modified resins thereof include Cymel 1123, 1125, and 1128 manufactured by Cytec Co., Ltd. Examples of glycoluril resins and modified resins thereof include Cymel 1170, 1171, 1174, and 1172 manufactured by Cytec Co., Ltd., and Nikalac MX-270 manufactured by Sanwa Chemical Co., Ltd. Examples of urea resins and modified resins thereof include UFR (registered trademark, the same applies hereinafter) 65 and 300 manufactured by Cytec Co., Ltd., and Nikalac MX-290 manufactured by Sanwa Chemical Co., Ltd.

[0275] [1-1-8] Colorant The photosensitive resin composition of the present invention may contain a colorant for the purpose of coloring the partition walls. Known colorants such as pigments and dyes can be used as the colorant. When using a pigment, a known dispersant or dispersion aid may be used in combination so that the pigment does not aggregate and remains stable in the photosensitive resin composition. Coloring the ink-repellent partition walls black is particularly effective in achieving clear pixel display. Examples of black colorants include black dyes, black pigments, carbon black, and titanium black, and also mixing an organic pigment to achieve black coloring is effective in providing low conductivity.

[0276] From the viewpoints of plate-making properties and color properties, the content of the colorant is preferably 60% by mass or less, more preferably 40% by mass or less, of the total solid content of the photosensitive resin composition. In another embodiment, when a colorant is contained in the photosensitive resin composition, the curability of the partition walls decreases, the liquid repellency of the partition walls decreases, and outgassing tends to occur easily. Therefore, it is desirable that the content of the colorant in the photosensitive resin composition is low; for example, it is preferably 20% by mass or less, more preferably 10% by mass or less, particularly preferably 5% by mass or less, and most preferably 0% by mass, of the total solid content of the photosensitive resin composition.

[0277] [1-1-9] Coatability Improver, Development Improver The photosensitive resin composition of the present invention may contain a coatability improver or a development improver in order to improve coatability or development solubility. As the coatability improver or development improver, for example, a known surfactant can be used.

[0278] The surfactant can be used for the purpose of improving the coatability of the photosensitive resin composition as a coating liquid and the developability of the coating film, among which fluorine-based surfactants or silicone-based surfactants are preferred. In particular, silicone-based surfactants are preferred, and polyether-modified silicone-based surfactants are more preferred, because they have the effect of removing residues of the photosensitive resin composition from unexposed areas during development and also have the function of exhibiting wettability.

[0279] As the fluorine-based surfactant, a compound having a fluoroalkyl or fluoroalkylene group at least at any one of the terminal, main chain, and side chain is suitable. Specific examples include 1,1,2,2-tetrafluorooctyl (1,1,2,2-tetrafluoropropyl) ether, 1,1,2,2-tetrafluorooctylhexyl ether, octaethylene glycol di(1,1,2,2-tetrafluorobutyl) ether, hexaethylene glycol di(1,1,2,2,3,3-hexafluoropentyl) ether, octapropylene glycol di(1,1,2,2-tetrafluorobutyl) ether, hexapropylene glycol di(1,1,2,2,3,3-hexafluoropentyl) ether, sodium perfluorododecyl sulfonate, 1,1,2,2,8,8,9,9,10,10-decafluorododecane, and 1,1,2,2,3,3-hexafluorodecane. Examples of commercially available products include "BM-1000" and "BM-1100" manufactured by BM Chemie, "Megafac F470", "Megafac F475", "Megafac F554", and "Megafac F559" manufactured by DIC Corporation, "FC430" manufactured by 3M Japan Ltd., and "DFX-18" manufactured by Neos Corporation.

[0280] Examples of silicone surfactants include "DC3PA," "SH7PA," "DC11PA," "SH21PA," "SH28PA," "SH29PA," "8032 Additive," and "SH8400" manufactured by Dow Corning Toray Co., Ltd., and "BYK (registered trademark, the same applies hereinafter) 323" and "BYK330" manufactured by BYK-Chemie Co., Ltd. The surfactant may contain other surfactants in addition to the fluorine-based surfactant and the silicone-based surfactant, and examples of such other surfactants include nonionic, anionic, cationic, and amphoteric surfactants.

[0281] Examples of nonionic surfactants include polyoxyethylene alkyl ethers, polyoxyethylene polyoxypropylene alkyl ethers, polyoxyethylene alkylphenyl ethers, polyoxyethylene alkyl esters, polyoxyethylene fatty acid esters, glycerin fatty acid esters, polyoxyethylene glycerin fatty acid esters, pentaerythritol fatty acid esters, polyoxyethylene pentaerythritol fatty acid esters, sorbitan fatty acid esters, polyoxyethylene sorbitan fatty acid esters, sorbitol fatty acid esters, and polyoxyethylene sorbitol fatty acid esters. Commercially available products of these include polyoxyethylene surfactants such as "Emulgen (registered trademark, the same applies hereinafter) 104P" and "Emulgen A60" manufactured by Kao Corporation.

[0282] Examples of anionic surfactants include alkyl sulfonates, alkyl benzene sulfonates, alkyl naphthalene sulfonates, polyoxyethylene alkyl ether sulfonates, alkyl sulfates, alkyl sulfate ester salts, higher alcohol sulfate ester salts, aliphatic alcohol sulfate ester salts, polyoxyethylene alkyl ether sulfates, polyoxyethylene alkyl phenyl ether sulfates, alkyl phosphate ester salts, polyoxyethylene alkyl ether phosphates, polyoxyethylene alkyl phenyl ether phosphates, and special polymer surfactants. Among these, special polymer surfactants are preferred, and special polycarboxylic acid type polymer surfactants are more preferred. Examples of anionic surfactants include alkyl sulfate ester salts such as "EMAL (registered trademark) 10" manufactured by Kao Corporation, alkyl naphthalene sulfonates such as "PELEX (registered trademark) NB-L" manufactured by Kao Corporation, and special polymer surfactants such as "HOMOGENOL (registered trademark, the same applies hereinafter) L-18" and "HOMOGENOL L-100" manufactured by Kao Corporation.

[0283] Examples of cationic surfactants include quaternary ammonium salts, imidazoline derivatives, and alkylamine salts. Examples of amphoteric surfactants include betaine-type compounds, imidazolium salts, imidazolines, and amino acids. Among these, quaternary ammonium salts are preferred, and stearyltrimethylammonium salts are more preferred. Examples of cationic surfactants or benign surfactants include alkylamine salts such as "Acetamine (registered trademark) 24" manufactured by Kao Corporation, and quaternary ammonium salts such as "Quatamine (registered trademark, the same applies hereinafter) 24P" and "Quatamine 86W" manufactured by Kao Corporation.

[0284] The surfactant may be used alone or in combination of two or more. For example, a combination of a silicone surfactant / a fluorine surfactant, a combination of a silicone surfactant / a special polymer surfactant, or a combination of a fluorine surfactant / a special polymer surfactant may be used. Among these, a combination of a silicone surfactant / a fluorine surfactant is preferred. Examples of the silicone surfactant / fluorine surfactant combination include BYK-Chemie "BYK-300" or "BYK-330" / NEOS "DFX-18", BYK-Chemie "BYK-300", "BYK-330" / AGC Seimi Chemical Co., Ltd. "S-393", BYK-Chemie "BYK-300" or "BYK-330" / DIC "F-554" or "F-559", Shin-Etsu Silicones Co., Ltd. "KP340" / DIC "F-478" or "F-475", Dow Corning Toray "SH7PA" / Daikin "DS-401", and NUC "L-77" / 3M Japan "FC4430".

[0285] As the development improver, for example, a known development improver containing an organic carboxylic acid or an anhydride thereof can also be used. When the photosensitive resin composition of the present invention contains a coatability improver or a development improver, the contents of the coatability improver and the development improver are each preferably 20% by mass or less, and more preferably 10% by mass or less, of the total solid content of the photosensitive resin composition, from the viewpoint of sensitivity.

[0286] [1-1-10] Silane Coupling Agent The photosensitive resin composition of the present invention may contain a silane coupling agent to improve adhesion to the substrate. Examples of the silane coupling agent that can be used include epoxy-based, methacrylic-based, amino-based, and imidazole-based silane coupling agents. From the viewpoint of improving adhesion, epoxy-based and imidazole-based silane coupling agents are particularly preferred. When the photosensitive resin composition of the present invention contains a silane coupling agent, the content of the silane coupling agent is preferably 20% by mass or less, more preferably 15% by mass or less, of the total solid content of the photosensitive resin composition, from the viewpoint of adhesion.

[0287] [1-1-11] Phosphate-Based Adhesion Improver The photosensitive resin composition of the present invention may contain a phosphoric acid-based adhesion improver to improve adhesion to a substrate. As the phosphoric acid-based adhesion improver, (meth)acryloyloxy group-containing phosphates are preferred, and among them, those represented by the following general formulas (Va), (Vb), and (Vc) are preferred.

[0288]

[0289] In the above general formulae (Va), (Vb), and (Vc), R 8 represents a hydrogen atom or a methyl group, r and r' are integers of 1 to 10, and s is 1, 2, or 3. When the photosensitive resin composition of the present invention contains a phosphoric acid-based adhesion improver, its content is not particularly limited, but is preferably 0.1 mass% or more, more preferably 0.2 mass% or more, and even more preferably 0.3 mass% or more, and is preferably 5 mass% or less, more preferably 3 mass% or less, and even more preferably 1 mass% or less, based on the total solids content of the photosensitive resin composition. The upper and lower limits can be arbitrarily combined; for example, 0.1 to 5 mass% is preferred, 0.2 to 3 mass% is more preferred, and 0.3 to 1 mass% is even more preferred. By setting the content at or above the lower limit, adhesion to the substrate tends to be improved. Furthermore, by setting the content at or below the upper limit, surface curability tends to be improved.

[0290] [1-1-12] Inorganic Filler The photosensitive resin composition of the present invention may contain an inorganic filler for the purpose of improving the strength of the cured product and also improving the flatness and taper angle of the coating film through a suitable interaction with the alkali-soluble resin (forming a matrix structure). Examples of inorganic fillers include talc, silica, alumina, barium sulfate, magnesium oxide, and those surface-treated with various silane coupling agents.

[0291] The average particle size of the inorganic filler is preferably 0.005 to 20 μm, more preferably 0.01 to 10 μm. Here, the average particle size is a value measured using a laser diffraction / scattering particle size distribution analyzer manufactured by Beckman Coulter, Inc. Among inorganic fillers, silica sol and modified silica sol are preferred because they tend to have excellent dispersion stability and an excellent effect of improving the taper angle.

[0292] When the photosensitive resin composition of the present invention contains an inorganic filler, the content thereof is, from the viewpoint of sensitivity, preferably 5% by mass or more, more preferably 10% by mass or more, and preferably 80% by mass or less, more preferably 70% by mass or less, based on the total solid content of the photosensitive resin composition. The upper and lower limits can be arbitrarily combined, and, for example, 5 to 80% by mass is preferred, and 10 to 70% by mass is more preferred.

[0293] [1-1-13] Solvent The photosensitive resin composition of the present invention preferably contains a solvent and is used in a state in which the above-mentioned components are dissolved or dispersed in the solvent. The solvent is not particularly limited, and examples thereof include the organic solvents described below. Glycol monoalkyl ethers such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether, ethylene glycol monobutyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol mono-n-butyl ether, propylene glycol t-butyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol mono-n-butyl ether, methoxymethyl pentanol, dipropylene glycol monoethyl ether, dipropylene glycol monomethyl ether, 3-methyl-3-methoxybutanol, 3-methoxy-1-butanol, triethylene glycol monomethyl ether, triethylene glycol monoethyl ether, and tripropylene glycol methyl ether; glycol dialkyl ethers such as ethylene glycol dimethyl ether, ethylene glycol diethyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol dipropyl ether, diethylene glycol dibutyl ether, and dipropylene glycol dimethyl ether;Glycol alkyl ether acetates such as ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, ethylene glycol mono-n-butyl ether acetate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, propylene glycol monopropyl ether acetate, propylene glycol monobutyl ether acetate, methoxybutyl acetate, 3-methoxybutyl acetate, methoxypentyl acetate, diethylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate, diethylene glycol mono-n-butyl ether acetate, dipropylene glycol monomethyl ether acetate, triethylene glycol monomethyl ether acetate, triethylene glycol monoethyl ether acetate, 3-methyl-3-methoxybutyl acetate, and 3-methoxy-1-butyl acetate; glycol alkyl ether acetates such as ethylene glycol diacetate, 1,3-butylene glycol diacetate, and 1,6-hexanol diacetate; Alkyl diacetates; alkyl acetates such as cyclohexanol acetate; ethers such as amyl ether, diethyl ether, dipropyl ether, diisopropyl ether, dibutyl ether, diamyl ether, ethyl isobutyl ether, and dihexyl ether; acetone, methyl ethyl ketone, methyl amyl ketone, methyl isopropyl ketone, methyl isoamyl ketone, diisopropyl ketone, diisobutyl ketone, methyl isobutyl ketone, cyclohexanone, ethyl amyl ketone, methyl butyl ketone, methyl hexyl ketones such as methyl ketone, methyl nonyl ketone, and methoxymethyl pentanone; monohydric or polyhydric alcohols such as methanol, ethanol, propanol, butanol, hexanol, cyclohexanol, ethylene glycol, propylene glycol, butanediol, diethylene glycol, dipropylene glycol, triethylene glycol, methoxymethyl pentanol, glycerin, and benzyl alcohol; aliphatic hydrocarbons such as n-pentane, n-octane, diisobutylene, n-hexane, hexene, isoprene, dipentene, and dodecane;Alicyclic hydrocarbons such as cyclohexane, methylcyclohexane, methylcyclohexene, and bicyclohexyl; aromatic hydrocarbons such as benzene, toluene, xylene, and cumene; amyl formate, ethyl formate, ethyl acetate, butyl acetate, propyl acetate, amyl acetate, methyl isobutyrate, ethylene glycol acetate, ethyl propionate, propyl propionate, butyl butyrate, isobutyl butyrate, methyl isobutyrate, ethyl caprylate, butyl stearate, ethyl benzoate, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, 3- Chain or cyclic esters such as methyl methoxypropionate, ethyl 3-methoxypropionate, propyl 3-methoxypropionate, butyl 3-methoxypropionate, and γ-butyrolactone; alkoxycarboxylic acids such as 3-methoxypropionic acid and 3-ethoxypropionic acid; halogenated hydrocarbons such as butyl chloride and amyl chloride; ether ketones such as methoxymethylpentanone; nitriles such as acetonitrile and benzonitrile; and tetrahydrofurans such as tetrahydrofuran, dimethyltetrahydrofuran, and dimethoxytetrahydrofuran.

[0294] Examples of commercially available solvents that fall into this category include mineral spirits, Balsol #2, Apco #18 Solvent, Apco Thinner, Socal Solvent No. 1 and No. 2, Solvesso #150, Shell TS28 Solvent, Carbitol, ethyl carbitol, butyl carbitol, methyl cellosolve, ethyl cellosolve, ethyl cellosolve acetate, methyl cellosolve acetate, and diglyme (all of which are trade names).

[0295] The solvent can dissolve or disperse each component in the photosensitive resin composition and is selected depending on the method of use of the photosensitive resin composition of the present invention, but from the viewpoint of coatability, a solvent having a boiling point at atmospheric pressure (1013.25 hPa) of preferably 60 to 280° C., more preferably 70 to 260° C. For example, propylene glycol monomethyl ether, 3-methoxy-1-butanol, propylene glycol monomethyl ether acetate, and 3-methoxy-1-butyl acetate are preferred.

[0296] The solvent may be used alone or in combination of two or more. The solvent is preferably used so that the total solids content in the photosensitive resin composition is preferably 10% by mass or more, more preferably 15% by mass or more, even more preferably 18% by mass or more, and preferably 90% by mass or less, more preferably 50% by mass or less, even more preferably 40% by mass or less, and particularly preferably 30% by mass or less. The upper and lower limits can be arbitrarily combined; for example, 10 to 90% by mass is preferred, 10 to 50% by mass is more preferred, 15 to 40% by mass is even more preferred, and 18 to 30% by mass is particularly preferred. By setting the solvent content at or above the lower limit, a coating film tends to be obtained even with a high film thickness. Furthermore, by setting the solvent content at or below the upper limit, a moderate coating uniformity tends to be obtained.

[0297] [1-2] Method for Preparing Photosensitive Resin Composition The photosensitive resin composition of the present invention is prepared by mixing the above-described components with a stirrer. The prepared photosensitive resin composition may be filtered using a membrane filter or the like to make it uniform. [2] Partition Wall and Method for Forming the Same The photosensitive resin composition of the present invention can be suitably used to form partition walls, particularly partition walls for separating the organic layer (light-emitting portion) of an organic electroluminescent device. The partition walls of the present invention are obtained by curing the photosensitive resin composition of the present invention. That is, the cured product of the present invention is obtained by curing the photosensitive resin composition of the present invention and is used, for example, to form partition walls.

[0298] The method for forming partition walls using the photosensitive resin composition of the present invention is not particularly limited, and any conventionally known method can be used. For example, the method for forming partition walls includes a coating step of applying the photosensitive resin composition onto a substrate to form a photosensitive resin composition layer, and an exposure step of exposing the photosensitive resin composition layer to light. A specific example of the method for forming such partition walls is photolithography.

[0299] In photolithography, a photosensitive resin composition is applied to the entire surface of a region of a substrate where partition walls are to be formed, thereby forming a photosensitive resin composition layer. The formed photosensitive resin composition layer is exposed to light according to a predetermined partition wall pattern, and then the exposed photosensitive resin composition layer is developed to form partition walls on the substrate. In the application step of photolithography, the photosensitive resin composition is applied to a substrate on which partition walls are to be formed using a contact transfer type application device such as a roll coater, reverse coater, or bar coater, or a non-contact type application device such as a spinner (rotary application device) or curtain flow coater, and the solvent is removed by drying as necessary to form a photosensitive resin composition layer.

[0300] Next, in the exposure step, the photosensitive resin composition is irradiated with active energy rays such as ultraviolet rays and excimer laser light using a negative mask, and the photosensitive resin composition layer is partially exposed according to the pattern of the partition walls. For exposure, a light source that emits ultraviolet rays, such as a high-pressure mercury lamp, an ultra-high-pressure mercury lamp, a xenon lamp, or a carbon arc lamp, can be used. The exposure dose varies depending on the composition of the photosensitive resin composition, but is, for example, 10 to 400 mJ / cm. 2 The degree is preferable.

[0301] Next, in the development step, the photosensitive resin composition layer exposed according to the partition wall pattern is developed with a developer to form a partition wall pattern. The development method is not particularly limited, and an immersion method, a spray method, or the like can be used. Specific examples of developers include organic developers such as dimethylbenzylamine, monoethanolamine, diethanolamine, and triethanolamine, as well as aqueous solutions of sodium hydroxide, potassium hydroxide, sodium carbonate, ammonia, and quaternary ammonium salts. An antifoaming agent or a surfactant can also be added to the developer.

[0302] The developed partition wall pattern is then post-baked and heat-cured to obtain the partition walls. Post-baking is preferably performed at 150 to 250°C for 15 to 60 minutes. After the partition wall formation, a cleaning treatment can be performed to clean the unexposed areas. The cleaning method is not particularly limited, and examples include plasma irradiation, excimer light irradiation, and UV irradiation. In the case of excimer light irradiation or UV irradiation, active oxygen caused by light irradiation can decompose and remove organic matter attached to the pixel areas.

[0303] The substrate used for forming the partition wall is not particularly limited and may be appropriately selected depending on the type of organic electroluminescent device to be manufactured using the substrate on which the partition wall is formed. Suitable substrate materials include glass and various resin materials. Specific examples of resin materials include polyesters such as polyethylene terephthalate; polyolefins such as polyethylene and polypropylene; polycarbonates; poly(meth)methacrylic resins; polysulfones; and polyimides.

[0304] Among these substrate materials, glass and polyimide are preferred because of their excellent heat resistance. Furthermore, depending on the type of organic electroluminescent device to be manufactured, a transparent electrode layer such as ITO or ZnO may be previously provided on the surface of the substrate on which the partition wall is to be formed. The photosensitive resin composition of the present invention is excellent in controlling the surface curability and internal curability, and therefore can be suitably used to form partition walls having a step. Here, a partition wall having a step refers to a partition wall having a first partition wall and a second partition wall with different heights, for example, a partition wall in which the first partition wall is taller than the second partition wall.

[0305] The use of a partition wall having a step tends to make the film thickness of the organic layer (light-emitting portion) uniform. Furthermore, providing a second partition wall between pixels ensures insulation between pixels, thereby suppressing light emission from portions other than the pixel portion. The height of the step, i.e., the difference in height between the upper surface of the first partition wall and the upper surface of the second partition wall, is preferably 0.7 μm or more, more preferably 0.8 μm or more, and even more preferably 0.9 μm or more. Furthermore, it is preferably 1.3 μm or less, more preferably 1.2 μm or less, and even more preferably 1.1 μm or less. The upper and lower limits can be arbitrarily combined; for example, 0.7 to 1.3 μm is preferred, 0.8 to 1.2 μm is more preferred, and 0.9 to 1.1 μm is even more preferred.

[0306] By setting the thickness equal to or greater than the lower limit, inkjet coating properties in a line tend to be ensured. Furthermore, by setting the thickness equal to or less than the upper limit, insulation between pixels tends to be ensured. FIGS. 1 and 2 show an example of a substrate provided with partition walls having a step. FIG. 1 is a plan view, and FIG. 2 is a cross-sectional view taken along line X-X in FIG. 1. A partition wall 2 having a step is provided on a substrate 1, and an open area in the partition wall 2, i.e., an area partitioned by the partition wall 2, forms a pixel section 3. The partition wall 2 has an upper surface 11 of a first partition wall and an upper surface 12 of a second partition wall, and a step 13 is formed by the difference in height between the upper surface 11 of the first partition wall and the upper surface 12 of the second partition wall.

[0307] An example of a method for forming a partition wall having a step is a method using a negative halftone mask in the exposure step of the photolithography formation method described above. An example of a negative halftone mask is one in which the portion corresponding to the pixel portion 3 is a light-shielding portion (light transmittance 0%), the portion corresponding to the top surface 11 of the first partition wall is an opening with the highest average light transmittance (fully transparent opening), and the portion corresponding to the top surface 12 of the second partition wall is an opening with a lower average light transmittance than the fully transparent opening (intermediate transparent opening). This method generates a difference in the remaining film rate due to the difference in average light transmittance between the fully transparent opening and the intermediate transparent opening, i.e., the difference in exposure dose, thereby forming a step.

[0308] By using a half-tone mask in this way, it is possible to form the partition walls having steps by photolithography in a single process, which allows the partition walls to be continuous without a clear boundary between the first and second partition walls.

[0309] [3] Organic electroluminescent element The organic electroluminescent element of the present invention comprises the partition wall of the present invention. Various organic electroluminescent elements are manufactured using a substrate having a partition wall pattern manufactured by the method described above. The method for forming the organic electroluminescent element is not particularly limited, but preferably, the organic electroluminescent element is manufactured by forming a partition wall pattern on the substrate by the method described above, and then injecting ink into the areas on the substrate surrounded by the partition walls to form organic layers such as pixels.

[0310] Examples of organic electroluminescent device types include bottom-emission and top-emission types. A bottom-emission device is fabricated, for example, by forming a partition wall on a glass substrate on which a transparent electrode is laminated, and then laminating a hole transport layer, a light-emitting layer, an electron transport layer, and a metal electrode layer in an opening surrounded by the partition wall. A top-emission device is fabricated, for example, by forming a partition wall on a glass substrate on which a metal electrode layer is laminated, and then laminating an electron transport layer, a light-emitting layer, a hole transport layer, and a transparent electrode layer in an opening surrounded by the partition wall.

[0311] Examples of the light-emitting layer include organic electroluminescent layers such as those described in Japanese Patent Publication No. 2009-146691 and Japanese Patent Publication No. 5734681. Quantum dots such as those described in Japanese Patent Publication No. 5653387 and Japanese Patent Publication No. 5653101 may also be used. The solvent used to form the ink for forming the organic layer may be water, an organic solvent, or a mixture thereof. The organic solvent is not particularly limited as long as it can be removed from the film formed after the ink is injected. Examples of organic solvents include toluene, xylene, anisole, mesitylene, tetralin, cyclohexylbenzene, acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, methanol, ethanol, isopropyl alcohol, ethyl acetate, butyl acetate, and 3-phenoxytoluene. The ink may also contain, for example, a surfactant, an antioxidant, a viscosity modifier, or an ultraviolet absorber.

[0312] The inkjet method is preferred as a method for injecting ink into the region surrounded by the partition wall, as it allows for easy injection of a small amount of ink into a predetermined location. The ink used to form the organic layer is selected appropriately depending on the type of organic electroluminescent device to be manufactured. When injecting ink by the inkjet method, the viscosity of the ink is not particularly limited as long as the ink can be ejected satisfactorily from the inkjet head, but is preferably 4 to 20 mPa·s, and more preferably 5 to 10 mPa·s. The viscosity of the ink can be adjusted by adjusting the solid content in the ink, changing the solvent, adding a viscosity modifier, etc.

[0313] [4] Image Display Device The image display device of the present invention includes the organic electroluminescent element of the present invention. There are no particular limitations on the type or structure of the image display device, as long as it includes the organic electroluminescent element of the present invention. For example, the image display device of the present invention can be assembled according to a conventional method using an active-drive organic electroluminescent element. For example, the image display device of the present invention can be formed by a method such as that described in "Organic EL Display" (Ohmsha, published August 20, 2004, by Shizuo Tokito, Chinaya Adachi, and Hideyuki Murata). For example, an organic electroluminescent element that emits white light may be combined with a color filter to display an image, or organic electroluminescent elements that emit different colors of light, such as RGB, may be combined to display an image.

[0314] The present invention will be described below with reference to specific examples, but the present invention is not limited to the following examples as long as the gist of the present invention is not exceeded. The components of the photosensitive resin composition used in the following examples and comparative examples are as follows.

[0315] <Alkali-Soluble Resins> a-1: An alkali-soluble resin prepared by the method described in JP 2023-55623 A. This corresponds to a polyamideimide(meth)acrylate resin. Using the above method, polyamideimide(meth)acrylate resin (a-1) was obtained from 242.8 g of an isocyanurate-type polyisocyanate: an isocyanurate-modified isophorone diisocyanate ("VESTANATT-1890 / 100" manufactured by EVONIK, isocyanate group content 17.3% by mass), 188.1 g of a tricarboxylic acid anhydride: cyclohexane-1,3,4-tricarboxylic acid-3,4-anhydride, 170.4 g of a (meth)acrylate having an epoxy group in the molecule: glycidyl methacrylate, and 118.8 g of a tricarboxylic acid anhydride: cyclohexane-1,3,4-tricarboxylic acid-3,4-anhydride. The polyamideimide (meth)acrylate resin (a-1) used in the experimental examples had a weight average molecular weight of 5,100 and an acid value of 80 mgKOH / g.

[0316] a-2: An alkali-soluble resin having the following structure, which has a weight average molecular weight (Mw) of 7,000 and an acid value of 62 mgKOH / g, and corresponds to an epoxy (meth)acrylate resin.

[0317]

[0318] a-3: Alkali-soluble resin having the following structure (a mixture of those in which m and n are 1 to 20). It has a weight average molecular weight (Mw) of 8,000 and an acid value of 80 mg KOH / g, and corresponds to an epoxy (meth)acrylate resin.

[0319]

[0320] <Liquid repellent agent> b-1: Acrylic copolymer resin having a structural unit having a perfluoroalkyl group, a structural unit having an ethylenic double bond, and a structural unit having a carboxy group, Mw 90,000, fluorine atom content 20% by mass

[0321] <Photopolymerization initiator> c-1: Oxime ester photopolymerization initiator having the following chemical structure

[0322]

[0323] <Photopolymerizable compound> d-1: Multifunctional monomer (Light Acrylate PE-4A) manufactured by Kyoeisha Chemical Co., Ltd.

[0324] <Chain transfer agent> e-1: KAYAMER PM-21 manufactured by Nippon Kayaku Co., Ltd.

[0325] <UV absorber> e-2: Methylhydroquinone manufactured by Seiko Chemical Co., Ltd.

[0326] <Ultraviolet absorber> e-3: TINUVIN 384-2 manufactured by BASF

[0327] <Preparation of Photosensitive Resin Compositions> The components were used in the blending ratios shown in Table 1, and the photosensitive resin compositions of Example 1 and Comparative Examples 1 and 2 were prepared by stirring the components uniformly in a solvent containing propylene glycol monomethyl ether acetate (PGMEA) and propylene glycol monomethyl ether (PGME) in a mixing ratio of 80:20 so that the total solids content of the photosensitive resin composition was 14.5% by mass. The blending ratio (% by mass) of each component in Table 1 refers to the value of the solids content of each component relative to the total solids content of the photosensitive resin composition.

[0328] <Evaluation of Exposure Dose for Contact Angle Development> The photosensitive resin composition was applied to a glass substrate using a spin coater so that the film thickness after heat curing would be 1.0 μm, and after drying under reduced pressure for 1 minute, it was dried on a hot plate at 127° C. for 120 seconds using a proximity method of 0.3 mm. The obtained coating film was then heated to a wavelength of 365 nm and exposed to an intensity of 500 mW / cm ２ The exposure dose was 20 mJ / cm ２ (lower limit of device setting) to 100 mJ / cm ２ up to 10 mJ / cm ２ Each substrate was subjected to an exposure process over the entire surface so as to provide a gap.

[0329] Subsequently, using a developer consisting of a 2.38% by mass aqueous solution of TMAH (tetramethylammonium hydroxide), shower development was performed at 24°C under a water pressure of 0.05 MPa for 60 seconds, and then the development was stopped with pure water and washed with a water spray. Thereafter, the substrate was heat-cured in an oven at 230°C for 30 minutes to obtain a substrate for contact angle evaluation.

[0330] The contact angle when PGMEA was dropped onto the obtained contact angle evaluation substrate was measured, and the exposure dose at which a contact angle of 46° or more was generated was verified. The contact angle measurement was carried out using a contact angle measurement device DMo-601 manufactured by Kyowa Interface Science Co., Ltd. under conditions of a temperature of 23°C and a humidity of 50% RH. 1.0 μL of PGMEA was dropped onto the contact angle evaluation substrate, and the contact angle was measured after 10 seconds. The measurement results are shown in Table 1. The exposure dose at which a contact angle of 46° or more was generated is shown in Table 1.

[0331] <Partition Walls Having Steps and Evaluation> (Partition Wall Formation) A photosensitive resin composition was applied to an electrode substrate having an 8 nm thick ITO film, a 120 nm thick silver film, and a 10 nm thick ITO film deposited in this order over the entire surface of a glass substrate, using a spin coater to give a film thickness of 1.0 μm after heat curing. The composition was then dried under reduced pressure for 1 minute and then dried for 120 seconds at a distance of 0.3 mm on a hot plate at 127°C. The resulting coating was exposed to light using a photomask (a photomask having linear fully transparent openings with an opening width of 14 μm and intermediate transparent openings of 14 μm (a thin film of Cr oxide with a light transmittance of 9% at a wavelength of 365 nm) using a Canon MPA-600FA exposure machine. The intensity at a wavelength of 365 nm during exposure was 500 mW / cm. ２ The exposure dose was the contact angle development exposure dose + 10 mJ / cm ２ , under air. Subsequently, using a developer consisting of a 2.38 mass % aqueous solution of TMAH (tetramethylammonium hydroxide), shower development was carried out at 24°C under a water pressure of 0.05 MPa for 60 seconds, after which development was stopped with pure water and washed with a water spray. By these operations, unnecessary portions were removed and the substrate having a pattern formed thereon was heated and cured in an oven at 230°C for 30 minutes to obtain a partition wall substrate having steps.

[0332] (Measurement of Partition Wall Film Thickness) For the partition wall substrate having the above-described step, the film thickness of the cured film (first partition wall) corresponding to the completely transmitting opening and the cured film (second partition wall) corresponding to the intermediate transmitting opening were measured. For the measurement, an Alpha-Step D-600 manufactured by Tencor Corporation was used.

[0333] (Evaluation of Step) The difference in film thickness (step, ΔH) between the first and second partition walls was calculated and evaluated according to the following criteria. The results are shown in Table 1. A larger difference in film thickness indicates higher step formation performance. If step formation is insufficient, the height of the second partition wall increases, and the filled ink cannot pass over the second partition wall, resulting in poor coating. From the viewpoint of coating properties, it is considered better for the height of the second partition wall to be low, so evaluation was performed using the following evaluation criteria. A: The height of the second partition wall is less than 0.4 μm B: The height of the second partition wall is 0.4 μm C: The height of the second partition wall is greater than 0.4 μm

[0334] <Evaluation of Inkjet Coatability> (Formation of Partition Walls) A photosensitive resin composition was applied to an electrode substrate having an 8 nm thick ITO film, a 120 nm thick silver film, and a 10 nm thick ITO film deposited in this order over the entire surface of a glass substrate, using a spin coater to give a film thickness of 1.0 μm after heat curing. The composition was then dried under reduced pressure for 1 minute and then dried for 120 seconds on a hot plate at 127°C using a 0.3 mm proximity method. The resulting coating film was exposed to light using a photomask (elliptical pixel region with long sides of 200 μm and short sides of 75 μm) and a Canon MPA-600FA exposure machine. The intensity at a wavelength of 365 nm during exposure was +10 mJ / cm of the contact angle development exposure dose. 2 , and air. Subsequently, using a developer consisting of a 2.38 mass % aqueous solution of TMAH (tetramethylammonium hydroxide), shower development was performed at 24°C and a water pressure of 0.05 MPa for 60 seconds, after which development was stopped with pure water and washed with a water spray. By these operations, unnecessary portions were removed and the substrate on which a pattern was formed was heated and cured in an oven at 230°C for 30 minutes to obtain a partition wall substrate.

[0335] (Evaluation of Coatability) Inkjet coating was carried out on the pixel regions of the partition wall substrate using a DMP-2850 manufactured by Fujifilm Corporation. A solvent (isoamyl benzoate) was used alone as the ink, and 40 pL per pixel region was applied to 15 pixels, and the presence or absence of repelling within the pixels was evaluated according to the following criteria. When the ink was inkjet coated within the pixel regions, if a circular depression was formed on the coating surface or a hole large enough to reveal the base material of the glass substrate was formed, it was considered that repelling had occurred.

[0336] (Evaluation Criteria) A: No cissing occurs in any of the pixels. B: The number of pixels where cissing occurs is less than 50%. C: The number of pixels where cissing occurs is 50% or more.

[0337]

[0338] As can be seen from Table 1, Example 1 is the lower limit of the device setting, 20 mJ / cm ２ In contrast, in Comparative Example 1, the liquid repellency was exhibited at a very low exposure dose of 80 mJ / cm ２, 100 mJ / cm in Comparative Example 2 ２ In the photosensitive resin composition of Example 1, in addition to the photopolymerization reaction during exposure, the polyamide-imide (meth)acrylate resin (a-1) contained therein has a high thermosetting property due to its amide-imide structure, and a thermosetting reaction also occurs due to the heat of the hot plate, so that the curing reaction proceeds even with a low exposure dose, and it is thought that this is because elution of the liquid repellent agent during development was suppressed.

[0339] Furthermore, as can be seen from Table 1, Example 1 was able to form a larger step than Comparative Examples 1 and 2. Since the polyamide-imide (meth)acrylate resin (a-1) has an amide-imide structure, it has increased thermal reactivity and a higher shrinkage rate when heated in an oven, and it is thought that this is due to the strong shrinkage occurring particularly in the portion corresponding to the intermediate transmission opening portion where the photopolymerization reaction is weak, contributing to the formation of a large step.

[0340] Furthermore, as can be seen from Table 1, Example 1 showed no cissing in any of the 15 pixels, demonstrating good coatability. On the other hand, in Comparative Examples 1 and 2, cissing was confirmed in all pixels. In the photosensitive resin composition of Example 1, in addition to the photopolymerization reaction during exposure, the polyamide-imide (meth)acrylate resin (a-1) contained therein has a high thermosetting property due to its amide-imide structure, and a thermosetting reaction also occurs due to the heat of the hot plate. This is thought to be because the curing reaction proceeds even with a low exposure dose, suppressing the elution of the liquid repellent agent into the pixels during development and suppressing contamination of the pixels by the liquid repellent agent.

[0341] REFERENCE SIGNS LIST 1 substrate 2 partition wall with step 3 pixel portion 11 upper surface of first partition wall 12 upper surface of second partition wall 13 step

Claims

1. A photosensitive resin composition comprising (a) an alkali-soluble resin, (b) a liquid repellent, (c) a photopolymerization initiator, and (d) a photopolymerizable compound, wherein the alkali-soluble resin (a) comprises a polyamide-imide (meth)acrylate resin (a-1) having a structure represented by the following general formula (1): (In formula (1), R １ ~R ３ represents a divalent aliphatic hydrocarbon group. １ ~X ３ Each represents a structure of any one of general formulas (2) to (4). (In formula (2), R ４ ~R ６ represents a divalent aliphatic hydrocarbon group. ４ and X ５ Each represents a structure represented by any one of general formulas (2) to (4). １ represents an aromatic or alicyclic hydrocarbon.) (In formula (3), R ７ represents a monovalent aliphatic hydrocarbon group. ２ and Y ３ Each independently represents an aromatic hydrocarbon or an alicyclic hydrocarbon. (In formula (4), R ８ represents a monovalent aliphatic hydrocarbon group. ４ and Y ５ Each independently represents an aromatic hydrocarbon or an alicyclic hydrocarbon.

2. The photosensitive resin composition according to claim 1, wherein the (b) liquid repellent agent includes (b1) a liquid repellent agent having an ethylenically unsaturated bond group.

3. The photosensitive resin composition according to claim 2, characterized in that the liquid repellent (b1) contains an acrylic resin (b2) containing a repeating unit represented by the following general formula (5) and a fluorine atom: (In formula (5), R １１ each independently represents a hydrogen atom or a methyl group; R １２ represents an alkyl group having 2 to 6 carbon atoms, which may be interrupted by one or more of -O-, -CO-, -S-, and -NH-. * represents a bond.

4. The photosensitive resin composition according to claim 3, wherein the acrylic resin (b2) has a fluoroalkyl group and / or a fluoroalkylene group.

5. The photosensitive resin composition according to claim 1, wherein the content of the alkali-soluble resin (a) is 200 parts by mass or less per 100 parts by mass of the photopolymerizable compound (d).

6. The photosensitive resin composition according to claim 1, wherein the polyamide-imide (meth)acrylate resin (a-1) has a weight average molecular weight (Mw) in terms of polystyrene measured by gel permeation chromatography (GPC) of 1,000 or more and 10,000 or less.

7. The photosensitive resin composition according to any one of claims 1 to 6, which is used for forming partition walls.

8. The photosensitive resin composition according to claim 7, which is used for forming partition walls having steps in a single step by photolithography.

9. A cured product obtained by curing the photosensitive resin composition according to any one of claims 1 to 6.

10. A partition wall formed by curing the photosensitive resin composition according to any one of claims 1 to 6.

11. An organic electroluminescent device comprising the partition wall according to claim 10.

12. An image display device comprising the organic electroluminescent device according to claim 11.