YAG sintered body and method for producing YAG sintered body

JPWO2025134824A5Pending Publication Date: 2026-06-09
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Filing Date
2025-08-22
Publication Date
2026-06-09

AI Technical Summary

Technical Problem

Existing YAG sintered bodies used as oscillation media for lasers face challenges in minimizing reflectance and ensuring uniform mechanical strength at the joining interface between different sintered portions, which can lead to parasitic oscillation and mechanical instability.

Method used

A YAG sintered body is manufactured with a first sintered portion and a second sintered portion joined together, where the first portion contains a dopant not present in the second portion, and the average diffusion distance of the dopant across the interface is longer than 0.010 mm, achieved through powder sintering bonding rather than diffusion joining.

Benefits of technology

This approach results in a YAG sintered body with reduced reflectance and uniform mechanical strength at the joining interface, effectively suppressing parasitic oscillation and enhancing optical gain, while also simplifying the manufacturing process and reducing costs.

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Abstract

The present invention provides: a YAG sintered body which is capable of achieving a relatively low reflectance and / or uniform mechanical strength at the bonding interface between a first sintered part and a second sintered part; and a method for producing a YAG sintered body. This YAG sintered body includes a portion in which a part of a crystal of Y3Al5O12 is replaced with a dopant. The YAG sintered body has a first sintered part and a second sintered part which are bonded to each other, the first sintered part containing a dopant that is not contained in the second sintered part. On the surface of the YAG sintered body, the average diffusion distance of at least one dopant, which is contained in the first sintered part, to the second sintered part is longer than 0.010 mm in a direction that is orthogonal to the bonding interface between the first sintered part and the second sintered part.
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