Semiconductor Laser Module

Abstract

A metal block (2) is formed on the main surface of a disk-shaped metal stem (1). The block (2) has a mounting surface (2a) and a heat dissipation surface (2b) opposite the mounting surface (2a). A semiconductor laser chip (6) is mounted on the mounting surface of the block (2). The cap (9) has a lens (10) that focuses the laser light emitted from the semiconductor laser chip (6) and a lens barrel (11) that holds the lens (10) and is fixed to the metal stem (1) or the block (2). The heat dissipation surface of the block (2) is not covered by the lens barrel (11) and is flush with the side surface of the metal stem (1).

Description

[Technical field]

[0001] The present disclosure relates to a TO-can type semiconductor laser device and a semiconductor laser module. [Background technology]

[0002] In a TO-CAN type semiconductor laser device, a semiconductor laser chip is mounted on a block formed on the main surface of a disk-shaped metal stem (see, for example, Patent Document 1). Heat generated when the semiconductor laser chip is driven is dissipated via the block and the metal stem. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2007-027375 Summary of the Invention [Problem to be solved by the invention]

[0004] Conventionally, in order to reduce size, the semiconductor laser chip, block, etc. were all housed inside the lens barrel. Since the space inside the lens barrel was limited, it was difficult to secure a sufficient volume for the block, which serves as a heat dissipation path. In addition, the only path for dissipating heat propagating radially from the semiconductor laser chip was from the block to the metal stem, so the amount of heat dissipation was limited. Therefore, conventional semiconductor laser devices had poor heat dissipation properties, which led to problems such as reduced optical output, element failure, or deterioration of semiconductor laser characteristics.

[0005] The present disclosure has been made to solve the above-mentioned problems, and has an object to provide a semiconductor laser device and a semiconductor laser module that can improve heat dissipation. [Means for solving the problem]

[0006] Semiconductor laser according to the present disclosure Moduleis a TO-CAN type semiconductor laser device and a holder for holding the semiconductor laser device and optically coupling the semiconductor laser device to an optical fiber, The present invention relates to a laser diode, comprising: a disk-shaped metal stem; a metal block formed on a main surface of the metal stem and having a mounting surface and a heat dissipation surface opposite to the mounting surface; a semiconductor laser chip mounted on the mounting surface of the block; a cap having a lens for focusing a laser beam emitted from the semiconductor laser chip; and a lens barrel for holding the lens and fixed to the metal stem or the block, wherein the heat dissipation surface of the block is not covered by the lens barrel and is flush with a side surface of the metal stem. An opening is formed in a part of the holder, and the heat dissipation surface of the block is exposed through the opening. It is characterized by: Effect of the Invention

[0007] In the present disclosure, the heat dissipation surface of the block is not covered by the lens barrel and is flush with the side surface of the metal stem. This allows the heat of the semiconductor laser chip to be dissipated not only laterally from the block to the metal stem, but also vertically from the heat dissipation surface of the block to the outside. This allows the heat propagating radially from the semiconductor laser chip to be efficiently dissipated, improving heat dissipation. [Brief description of the drawings]

[0008] [Figure 1] 1 is a side view showing a semiconductor laser device according to a first embodiment. [Diagram 2] 1 is a front view showing the inside of a semiconductor laser device according to a first embodiment. [Diagram 3] 2 is a perspective view showing a stem, a block, and a cap of the semiconductor laser device according to the first embodiment. FIG. [Figure 4] FIG. 1 is a side view showing a semiconductor laser device according to a comparative example. [Diagram 5] FIG. 4 is a front view showing the inside of a semiconductor laser device according to a comparative example. [Figure 6] FIG. 11 is a side view showing a semiconductor laser device according to a second embodiment. [Figure 7] FIG. 11 is a side view showing a semiconductor laser device according to a third embodiment. [Figure 8]FIG. 11 is a front view showing the inside of a semiconductor laser device according to a third embodiment. [Figure 9] FIG. 11 is a perspective view showing a stem, a block, and a cap of a semiconductor laser device according to a third embodiment. [Figure 10] FIG. 11 is a side view showing a semiconductor laser device according to a fourth embodiment. [Figure 11] FIG. 11 is a front view showing the inside of a semiconductor laser device according to a fourth embodiment. [Figure 12] FIG. 11 is a perspective view showing a stem, a block, and a cap of a semiconductor laser device according to a fourth embodiment. [Figure 13] FIG. 13 is a side view showing a semiconductor laser device according to a fifth embodiment. [Figure 14] FIG. 13 is a top view showing a semiconductor laser device according to a fifth embodiment. [Figure 15] FIG. 13 is a front view showing the inside of a semiconductor laser device according to a fifth embodiment. [Figure 16] FIG. 13 is a perspective view showing a stem, a block, and a cap of a semiconductor laser device according to a fifth embodiment. [Figure 17] FIG. 13 is a side view showing a semiconductor laser device according to a sixth embodiment. [Figure 18] FIG. 13 is a front view showing the inside of a semiconductor laser device according to a sixth embodiment. [Figure 19] FIG. 13 is a perspective view showing a stem, a block, and a cap of a semiconductor laser device according to a sixth embodiment. [Figure 20] FIG. 13 is a cross-sectional view showing a semiconductor laser module according to a seventh embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] A semiconductor laser device and a semiconductor laser module according to the embodiments will be described with reference to the drawings. The same or corresponding components are denoted by the same reference numerals, and repeated description may be omitted.

[0010] Embodiment 1 Fig. 1 is a side view showing a semiconductor laser device according to embodiment 1. Fig. 2 is a front view showing the inside of the semiconductor laser device according to embodiment 1. Fig. 3 is a perspective view showing a stem, a block, and a cap of the semiconductor laser device according to embodiment 1. The semiconductor laser device according to this embodiment is a TO-CAN type semiconductor laser device.

[0011] A metal block 2 is formed on the main surface 1a of a disk-shaped metal stem 1. The metal stem 1 and block 2 are made of the same material and are integrally formed. The block 2 has a flat mounting surface 2a and a heat dissipation surface 2b opposite the mounting surface 2a. The mounting surface 2a is perpendicular to the main surface 1a of the metal stem 1. The heat dissipation surface 2b is a curved surface at the lower end of the block 2, and is flush with the side surface of the metal stem 1. When viewed from a direction perpendicular to the main surface 1a of the metal stem 1, the block 2 is semicircular.

[0012] A lead 3 for current flow passes through a through hole 1b of the metal stem 1. Sealing glass 4 is filled in the through hole 1b to insulate the lead 3 from the metal stem 1. The lead 3 is placed above the metal stem 1 so as not to interfere with the block 2 located below the metal stem 1.

[0013] A submount 5 is die-bonded near the center of the mounting surface 2a of the block 2. A semiconductor laser chip 6 is die-bonded to a metallized portion of the submount 5. A photodiode 7 is mounted on the main surface 1a of the metal stem 1 via a submount 8, and monitors the light extracted from the rear end face of the semiconductor laser chip 6. The lead 3 is wire-bonded to the surface electrode of the semiconductor laser chip 6. Another lead 3 is wire-bonded to the metallized portion of the submount 5. This forms a path for current injection.

[0014] The cap 9 has a lens 10 that focuses the laser light emitted from the semiconductor laser chip 6, and a lens barrel 11 that holds the lens 10. The lens barrel 11 is fixed to three surfaces, namely the main surface 1a of the metal stem 1, the mounting surface 2a of the block 2, and the tip surface of the block 2, by projection welding so as to cover the semiconductor laser chip 6 and the like (hermetic sealing). At this time, it is necessary to perform positioning with high precision so that the laser light emitted from the semiconductor laser chip 6 is efficiently coupled to the lens 10. These techniques are among the most basic techniques in optical communication.

[0015] Specifically, first, the position of the cap 9 is adjusted in the Y direction so that the center lines of the lens 10 and the semiconductor laser chip 6 overlap. Next, the cap 9 is lowered in the -X direction until it contacts the mounting surface 2a of the block 2. Next, the cap 9 is slid in the -Z direction, and the cap 9 is welded and fixed to the metal stem 1 and the block 2. With this method, the positioning of the block 2 is completed mainly by adjusting the position in the Y direction alone, eliminating the need for axial adjustment in two or more dimensions as in the past.

[0016] A cutout 11a is formed in the side surface of the lens barrel 11 to match the shape of the heat dissipation surface 2b of the block 2. The cutout 11a of the lens barrel 11 is fitted into the block 2. The heat dissipation surface 2b of the block 2 is exposed to the outside of the lens barrel 11 from the cutout 11a and is not covered by the lens barrel 11.

[0017] The lens barrel 11 may be fixed by adhesive or other welding, and the fixing location is not limited to the above example, as long as it does not prevent heat dissipation from the heat dissipation surface of the block 2. The presence or absence of airtight sealing can be selected according to the intended use or environment. The mounted chip is not limited to the semiconductor laser chip 6, and any heat-generating chip can enjoy the advantages unique to the structure. The semiconductor laser chip 6 may be mounted on the block 2 without using the submount 5.

[0018] Next, the effect of this embodiment will be described in comparison with a comparative example. Fig. 4 is a side view showing a semiconductor laser device according to the comparative example. Fig. 5 is a front view showing the inside of the semiconductor laser device according to the comparative example. In the comparative example, the semiconductor laser chip 6, the submount, the block 2, etc. are all housed in the lens barrel 11. Since the space inside the lens barrel 11 is limited, it is not possible to ensure a sufficient volume for the block 2, which serves as a heat dissipation path. In addition, since the only path for dissipating heat from the semiconductor laser chip 6 is from the block 2 toward the metal stem 1, the amount of heat dissipation is limited. Therefore, the semiconductor laser device according to the comparative example has poor heat dissipation properties.

[0019] In contrast, in this embodiment, the heat dissipation surface of the block 2 is not covered by the lens barrel 11, and is flush with the side surface of the metal stem 1. By bringing the flush side surface of the metal stem 1 and the heat dissipation surface of the block 2 into contact with an external heat sink (not shown), heat can be dissipated from both the metal stem 1 and the block 2. As a result, heat from the semiconductor laser chip 6 is not only dissipated laterally from the block 2 toward the metal stem 1, but also vertically from the heat dissipation surface 2b of the block 2 toward the outside. Therefore, heat propagating radially from the semiconductor laser chip 6 can be efficiently dissipated, improving heat dissipation.

[0020] Also, the block 2 is extended in the -X direction until the heat dissipation surface 2b at the bottom end of the block 2 is flush with the side surface of the metal stem 1. Furthermore, the block 2 is extended in the Z direction, which is the laser light emission direction, within a range where the tip of the block 2 does not interfere with the cap 9. This increases the volume of the block 2, expanding the path for diffusing heat from the semiconductor laser chip 6 and improving heat dissipation. The improved heat dissipation improves the semiconductor laser characteristics, especially during high temperature operation.

[0021] Since the laser light emitted from the semiconductor laser chip 6 and the lens 10 are perpendicular to each other, the shape of the lens barrel 11 for holding the lens 10 is simple. Also, since there is no interfering portion above the mounting surface 2a of the block 2, the mounting of the semiconductor laser chip 6 and the submount 5 is easy.

[0022] In the comparative example, the lens barrel 11 is positioned so that the center of the cap 9 is aligned with the center of the metal stem 1, so that it takes time to adjust the optical axis. On the other hand, in this embodiment, the optical axis can be adjusted in a short time by fitting the notch 11a of the lens barrel 11 into the block 2. By ensuring the accuracy of the shapes of the fitted notch 11a of the lens barrel 11 and the block 2, it is possible to suppress variation in positioning. Also, the shape of the lens barrel 11 is simple, since only a part of the cylindrical lens barrel 11 is cut out to expose the block 2.

[0023] When a highly light-collecting ball lens or the like is used as the lens 10, it is necessary to increase the height of the lens barrel 11 in order to ensure a distance between the semiconductor laser chip 6 and the lens 10. In this embodiment, the lens 10 of the cap 9 is disposed in the direction in which the laser light is emitted, so there are no restrictions on the type of lens 10, the height of the lens barrel 11, etc. Therefore, even if the height of the lens barrel 11 is increased, the laser light can pass through the lens 10. There is a high degree of freedom in the optical design, and the coupling efficiency with the lens 10 is high.

[0024] When a cap is formed by combining a rectangular lens barrel with a circular spherical lens, stress is concentrated at the four corners of the lens barrel window, causing concerns about the cap characteristics. On the other hand, the cap 9 of this embodiment uses a cylindrical lens barrel 11, which prevents stress concentration, has isotropy, and provides stable cap characteristics.

[0025] Embodiment 2 6 is a side view showing a semiconductor laser device according to the second embodiment. The block 2 extends in the z direction in which the laser light 12 is emitted from the semiconductor laser chip 6. The length of the block 2 in the Z direction is limited to prevent the tip of the block 2 from interfering with the laser light 12 between the semiconductor laser chip 6 and the lens 10. This makes it possible to improve the optical coupling of the laser light 12 to the lens 10. The other configurations and effects are the same as those of the first embodiment.

[0026] The laser light 12 is emitted from the semiconductor laser chip 6 in an elliptical shape, and the output decreases from the center to the periphery. Therefore, even if part of the laser light 12 interferes with the tip of the block 2 and is not coupled to the lens 10, there is no problem as long as the required optical output is satisfied.

[0027] Embodiment 3 Fig. 7 is a side view showing a semiconductor laser device according to embodiment 3. Fig. 8 is a front view showing the inside of the semiconductor laser device according to embodiment 3. Fig. 9 is a perspective view showing a stem, a block, and a cap of the semiconductor laser device according to embodiment 3.

[0028] A recess 2c is partially formed in the center of the tip of the block 2 in the passage path of the laser light emitted from the semiconductor laser chip 6. Since the laser light passes through the recess 2c, the tip of the block 2 does not interfere with the laser light between the semiconductor laser chip 6 and the lens 10. This makes it possible to improve the optical coupling of the laser light to the lens 10. The other configurations and effects are the same as those of the first embodiment.

[0029] Embodiment 4 Fig. 10 is a side view showing a semiconductor laser device according to embodiment 4. Fig. 11 is a front view showing the inside of the semiconductor laser device according to embodiment 4. Fig. 12 is a perspective view showing a stem, a block, and a cap of the semiconductor laser device according to embodiment 4.

[0030] A semicircular recess 2d is formed at the tip of mounting surface 2a of block 2 to match the curvature of disk-shaped lens barrel 11. The outer periphery of lens barrel 11, which has been machined to be shorter than that of embodiment 1, is fitted into recess 2d. This fixes lens barrel 11 to block 2. The fixing method at this time is, for example, welding, adhesion, etc., but is not limited to these.

[0031] Block 2 also extends in the Z direction to fix barrel 11. Accordingly, the area of ​​mounting surface 2a of block 2 can be increased, improving the mountability and assembly of semiconductor laser chip 6 and submount 5. Also, the efficiency of the fixing work of barrel 11 can be improved. The fitting structure reduces positioning variation, improving optical coupling to lens 10. Furthermore, the adoption of a short barrel 11 is expected to reduce component prices, simplify the manufacturing method, and reduce costs. The other configurations and effects are the same as those of embodiment 1.

[0032] The semiconductor laser chip 6 and the submount 5 are mounted near the center of the mounting surface 2a of the block 2, and are not covered by the lens barrel 11 (non-hermetic sealing). Depending on the usage environment, such as installation in an indoor facility, the lens barrel 11 does not necessarily need to protect the semiconductor laser chip 6. Also, since the semiconductor laser device is covered by hardware such as a holder when assembled into a TOSA or mounted in a module, there are also specifications in which the lens barrel 11 does not protect the semiconductor laser chip.

[0033] Embodiment 5. Fig. 13 is a side view showing a semiconductor laser device according to embodiment 5. Fig. 14 is a top view showing a semiconductor laser device according to embodiment 5. Fig. 15 is a front view showing the inside of the semiconductor laser device according to embodiment 5. Fig. 16 is a perspective view showing a stem, a block, and a cap of the semiconductor laser device according to embodiment 5.

[0034] The block 2 has a two-tier structure including a lower block 21 and an upper block 22 formed on the upper surface of the lower block 21 and narrower than the lower block 21. The lower surface of the lower block 21 is the heat dissipation surface 2b. The semiconductor laser chip 6 and the submount 5 are fixed near the center of the mounting surface 2a of the upper block 22. By making the block 2 have a two-tier structure, the heat radially diffused from the semiconductor laser chip 6 can be efficiently dissipated.

[0035] The lens barrel 11 is fixed and hermetically sealed by projection welding to two surfaces, namely, the main surface 1a of the metal stem 1 and the upper surface of the lower block 21. Since the block 2 has a two-stage structure, it is easy to assemble and easy to expand.

[0036] Lower block 21 extends in the Z direction up to a position immediately below lens 10. The width of upper block 22 in the X direction is expanded to a range that fits within lens barrel 11, taking into consideration ease of mounting submount 5, etc. Upper block 22 extends in the Z direction to a position that does not interfere with lens barrel 11 and lens 10. However, it is preferable to limit the length of upper block 22 in the Z direction as in embodiment 2, or to form recess 2c as in embodiment 3 so that the tip of upper block 22 does not interfere with the laser light.

[0037] Embodiment 6 Fig. 17 is a side view showing a semiconductor laser device according to embodiment 6. Fig. 18 is a front view showing the inside of the semiconductor laser device according to embodiment 6. Fig. 19 is a perspective view showing a stem, a block, and a cap of the semiconductor laser device according to embodiment 6.

[0038] The outer diameter of the block 2 is the same as that of the metal stem 1, and the side of the block 2 including the heat dissipation surface 2b is flush with the side of the metal stem 1. The block 2 has an inclined surface 2e inclined at an angle θ with respect to the main surface 1a of the metal stem 1. A mounting surface 2a perpendicular to the main surface 1a of the metal stem 1 is formed in the center of the inclined surface 2e. The semiconductor laser chip 6 and the submount 5 are mounted on the mounting surface 2a. A recess 2f is formed on the outer periphery of the inclined surface 2e.

[0039] An end of the cylindrical lens barrel 11 is cut off at an angle θ corresponding to the inclined surface 2e of the block 2. That is, the end of the lens barrel 11 is also inclined at an angle θ with respect to the bottom surface of the lens barrel 11 to which the lens 10 is fixed. The end of the lens barrel 11 is fitted into a recess 2f of the inclined surface 2e of the block 2. This makes it easy to position the lens barrel 11 during assembly. In addition, by making the bottom surface of the recess 2f slightly larger than the outer shape of the lens barrel 11, it is possible to finely adjust the position of the lens barrel 11 in the X and Y directions during assembly.

[0040] Embodiment 7 FIG. 20 is a cross-sectional view showing a semiconductor laser module according to the seventh embodiment. In this figure, the semiconductor laser device 100 is the semiconductor laser device according to the first embodiment, but may be the semiconductor laser device according to any one of the second to sixth embodiments. A cylindrical holder 101 holds the semiconductor laser device 100 and optically couples it to an optical fiber of a receptacle 102. An opening 101a is formed in a part of the curved surface at the lower end of the holder 101 according to the shape of the block 2 of the semiconductor laser device 100. The heat dissipation surface 2b of the block 2 is exposed from the opening 101a without being covered by the holder 101. This allows the heat from the semiconductor laser chip 6 to be efficiently dissipated. In addition, the shape of the semiconductor laser module in which the semiconductor laser device 100 and the holder 101 are combined is almost the same as that of the conventional one, so that optical axis alignment is easy when mounting the optical transceiver. [Explanation of symbols]

[0041] REFERENCE SIGNS LIST 1 metal stem, 1a main surface, 2 block, 2a mounting surface, 2b heat dissipation surface, 2c recess, 2d engraving, 2e inclined surface, 2f recess, 6 semiconductor laser chip, 9 cap, 10 lens, 11 lens barrel, 11a notch, 21 lower block, 22 upper block, 100 semiconductor laser device, 101 holder, 101a opening

Claims

1. A TO-CAN type semiconductor laser device; a holder for holding the semiconductor laser device and optically coupling the semiconductor laser device to an optical fiber; The semiconductor laser device comprises: A disk-shaped metal stem; a metal block formed on a main surface of the metal stem, the metal block having a mounting surface and a heat dissipation surface opposite to the mounting surface; a semiconductor laser chip mounted on the mounting surface of the block; a cap having a lens for collecting laser light emitted from the semiconductor laser chip and a lens barrel for holding the lens and fixed to the metal stem or the block; the heat dissipation surface of the block is not covered by the lens barrel and is flush with a side surface of the metal stem; An opening is formed in a portion of the holder, a heat dissipation surface of the block exposed through the opening;

2. a notch is formed in the lens barrel in accordance with a shape of the heat dissipation surface of the block; the cutout of the lens barrel is fitted into the block, 2. The semiconductor laser module according to claim 1, wherein the heat dissipation surface of the block is exposed through the notch.

3. 3. The semiconductor laser module according to claim 1, wherein the tip of said block does not interfere with said laser light between said semiconductor laser chip and said lens.

4. 4. The semiconductor laser module according to claim 3, wherein a recess is formed at the tip of the block in a passage path of the laser light.

5. A semicircular recess is formed in the mounting surface of the block; 2. The semiconductor laser module according to claim 1, wherein an outer periphery of said disk-shaped lens barrel is fitted into said engraved portion.

6. The block includes a lower block and an upper block formed on an upper surface of the lower block and having a narrower width than the lower block, 3. The semiconductor laser module according to claim 1, wherein the lens barrel is fixed to the main surface of the metal stem and the upper surface of the lower block.

7. the block has an inclined surface inclined with respect to the main surface of the metal stem, A recess is formed on the outer periphery of the inclined surface, The end of the cylindrical lens barrel is cut at an angle corresponding to the inclined surface, 2. The semiconductor laser module according to claim 1, wherein said end of said lens barrel is fitted into said recess in said inclined surface.