Method of fabricating thin film encapsulation and materials for perovskite solar cell module
The described encapsulation method for perovskite solar cells using PDMS and UV resin, or Parylene/Al2O3 layers, addresses the stability issues by forming a robust barrier against environmental factors, ensuring long-term performance.
Patent Information
- Authority / Receiving Office
- KR · KR
- Patent Type
- Applications
- Current Assignee / Owner
- FRONTIER ENERGY SOLUTION CO LTD
- Filing Date
- 2025-10-31
- Publication Date
- 2026-07-21
AI Technical Summary
Existing thin-film encapsulation technologies have not been effectively applied to perovskite solar cell modules to ensure long-term stability without degrading solar cell performance, particularly due to exposure during the laser etching process and environmental factors like moisture and oxygen.
A method involving the formation of a polydimethylsiloxane (PDMS) encapsulation layer followed by UV resin bonding with glass, or a combination of organic (Parylene) and inorganic (Al2O3) encapsulation layers with UV resin bonding, to create a stable encapsulation for perovskite solar cells.
The method significantly enhances the stability of perovskite solar cells against environmental factors, maintaining performance efficiency by preventing A-site defects and chemical bond disruption, with minimal impact on the module's functionality.
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Abstract
Description
Technology Field
[0001] The present invention is applicable to the field of electronic device encapsulation technology including perovskite solar cells and relates to a technology for improving the stability of perovskite solar cell modules against exposure to the external environment. Background Technology
[0003] When a laser etching process is performed for perovskite module fabrication, the perovskite is exposed to the atmosphere during the P3 stage (the cell separation stage). This can also cause perovskite degradation due to the external environment. Consequently, A-site defects occur, and structural stability is reduced. Additionally, light-induced electron-hole pairs react with the surrounding environment (oxygen and moisture) to generate reactive oxygen species, which further disrupt the chemical bonds of A-site cations, thereby accelerating degradation. To prevent this, PDMS material is spin-coated thinly to prevent A-site defects through passivation of the perovskite surface. As a final step, glass-to-glass bonding is performed using a UV-resin curing method. Therefore, particles such as moisture and oxygen are completely blocked from entering the perovskite solar cell module, thereby increasing stability against the external environment.
[0004] Encapsulation technology is used in the fields of electronic devices and displays as a method to prevent problems that occur when a device comes into contact with the external environment (moisture, oxygen, etc.). It is used in OLED displays, flexible electronic devices, solar cells, LED lighting, semiconductor devices, sensors and bio-devices, batteries and energy storage devices, and in particular, Thin Film Encapsulation (TFE) technology, which uses a thin film form, is replacing conventional encapsulation technology due to its thin and transparent structure, flexibility, and high durability, and is becoming increasingly widely used in electronic devices and new material applications.
[0005] There are existing thin-film encapsulation technologies that improve the stability of OLED panels. However, there are no cases where this has been actually applied to perovskite solar cell modules to ensure long-term stability without degrading solar cell performance. To apply thin-film encapsulation technology to perovskite solar cell modules, a formation method is required that maintains the performance of the perovskite module while possessing homogeneous quality and thickness of organic and inorganic materials, as well as moisture and heat barrier properties. Prior art literature
[0007] Republic of Korea Published Patent No. 10-2023-0102447 The problem to be solved
[0008] The present invention aims to provide a method for manufacturing a perovskite solar cell module using thin-film encapsulation technology.
[0009] The technical problems that the present invention aims to solve are not limited to those mentioned above, and other unmentioned technical problems will be clearly understood by those skilled in the art from the description below. means of solving the problem
[0011] To achieve the above objective, the present invention provides a method for manufacturing a thin film encapsulation for a perovskite solar cell module, comprising the steps of: preparing a perovskite solar cell module; forming a polydimethylsiloxane (PDMS) encapsulation layer on the perovskite solar cell module; applying a UV resin to the edge of the perovskite solar cell module on which the polydimethylsiloxane encapsulation layer is formed; and curing the UV resin to bond it with glass for encapsulation.
[0012] The step of forming a polydimethylsiloxane (PDMS) encapsulation layer on the perovskite solar cell module comprises: a step of performing a masking treatment on the edge of the perovskite solar cell module; and a step of forming a polymer thin film on the masked perovskite solar cell module through a spin coating process, and the step of applying a UV resin to the edge of the perovskite solar cell module on which the polydimethylsiloxane encapsulation layer is formed may comprise: a step of removing the masking on the edge of the perovskite solar cell module; and a step of applying the resin using a dispenser device to the portion where the masking has been removed.
[0013] The step of curing the above UV resin to bond it with glass and encapsulate it can be performed under vacuum.
[0014] In addition, the present invention provides a method for manufacturing a thin film encapsulation for a perovskite solar cell module, comprising the steps of: preparing a perovskite solar cell module; forming an organic encapsulation layer on the perovskite solar cell module through a chemical vapor deposition (CVD) process; forming an inorganic encapsulation layer on the organic encapsulation layer through an atomic layer deposition (ALD) process; applying a UV resin to the edge of the perovskite solar cell module on which the organic and inorganic encapsulation layers are formed; and curing the UV resin to bond with glass for encapsulation.
[0015] The above organic encapsulation layer may contain Parylene, and the above inorganic encapsulation layer may contain aluminum oxide (Al2O3).
[0016] The step of forming an organic encapsulation layer on the perovskite solar cell module through a Chemical Vapor Deposition (CVD) process may include: heating Parylene powder on the perovskite solar cell module to 130 to 170 ℃ to vaporize it and form a Parylene dimer gas; passing the Parylene dimer gas through a furnace heated to 650 to 750 ℃ to convert it into a Parylene monomer gas; and depositing the converted Parylene monomer gas onto the surface of the perovskite solar cell module in a deposition chamber to form a Parylene film.
[0017] The step of forming an inorganic encapsulation layer on the organic encapsulation layer through an atomic layer deposition (ALD) process may include: (a) injecting TMA (Al(CH3)3) into a chamber to react with -OH groups on the surface to form aluminum methyl (-O-Al(CH3)2) groups and releasing methane (CH4) as a byproduct; (b) removing residual TMA and byproducts using an inert gas N2; (c) injecting water (H2O) to react with aluminum methyl groups to form aluminum oxide (Al-O), regenerate -OH groups on the surface, and release methane (CH4) as a byproduct; (d) performing a purge to remove residual H2O and byproducts; and (e) repeating steps (a) through (d) to form an aluminum oxide thin film of a desired thickness. Effects of the invention
[0019] By means of the solution to the above problem, the present invention can provide a method for manufacturing a thin film encapsulation for a perovskite solar cell module and a method for manufacturing a highly stable perovskite solar cell module using the same.
[0020] In addition, the method for manufacturing a thin film encapsulation for a perovskite solar cell module according to the present invention can significantly increase the stability of the module against the external environment by applying thin film encapsulation technology using a material that does not affect the perovskite solar cell module.
[0021] The effects of the present invention are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art from the description in the claims. Brief explanation of the drawing
[0023] FIG. 1 illustrates a method for manufacturing a perovskite solar cell module encapsulation thin film using PDMS and UV resin glass curing encapsulation technology according to one embodiment of the present invention, showing a process of forming a uniform PDMS film of a certain thickness through a spin process after masking treatment on the side of a perovskite solar cell module. FIG. 2 illustrates a method for manufacturing a perovskite solar cell module encapsulation thin film using PDMS and UV resin glass curing encapsulation technology according to an embodiment of the present invention, showing a process in which resin is applied to the outer marking portion of the module, compressed under vacuum inside a vacuum chamber, and finally the final encapsulation is completed through UV curing. FIG. 3 is a schematic diagram showing the module structure of a PDMS material and a UV resin-cured encapsulated perovskite solar cell manufactured according to an embodiment of the present invention. Figure 4 is a diagram showing the results of comparing perovskite decomposition depending on whether a vacuum process is performed. FIG. 5 illustrates a method for manufacturing a perovskite solar cell module encapsulation thin film using perylene, Al2O3, and UV resin glass curing encapsulation technology according to an embodiment of the present invention, and is a diagram showing a method for forming a perylene thin film through a Chemical Vapor Deposition (CVD) process. FIG. 6 illustrates a method for manufacturing a perovskite solar cell module encapsulation thin film using perylene, Al2O3, and UV resin glass curing encapsulation technology according to an embodiment of the present invention, wherein (a) shows the perovskite layer being exposed to the atmosphere during the P3 step (step of separating the cell) when laser scribing is performed for perovskite module formation, and (b) shows preventing A-site defects through passivation of the perovskite surface by forming a perylene thin film. FIG. 7 illustrates a method for manufacturing a perovskite solar cell module encapsulation thin film using perylene, Al2O3, and UV resin glass curing encapsulation technology according to an embodiment of the present invention, and is a diagram showing the process of forming an Al2O3 thin film on a formed perylene thin film through an atomic layer deposition (ALD) process. FIG. 8 illustrates a method for manufacturing a perovskite solar cell module encapsulation thin film using perylene, Al2O3, and UV resin glass curing encapsulation technology according to an embodiment of the present invention, wherein after applying UV resin, N2 gas is filled to seal the material, and then the applied resin is cured through UV curing to complete the final encapsulation. Figure 9 shows the results of a test conducted for 1,000 hours in an 85°C and RH 85% chamber environment. Figure 10 shows the results of a photostability test in which Maximum Power Point Tracking (MPPT) was measured after exposure for 1,000 hours. Specific details for implementing the invention
[0024] The terms used in this invention have been selected based on currently widely used general terms, taking into account their functions within the invention; however, these terms may vary depending on the intent of those skilled in the art, case law, the emergence of new technologies, etc. Additionally, in specific cases, terms have been arbitrarily selected by the applicant, and in such cases, their meanings will be described in detail in the relevant description of the invention. Therefore, the terms used in this invention should be defined not merely by their names, but based on their meanings and the overall content of the invention.
[0025] Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as generally understood by those skilled in the art to which the present invention pertains. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology, and should not be interpreted in an ideal or overly formal sense unless explicitly defined in this application.
[0026] When a part of a specification is described as “comprising” a certain component, this means that, unless specifically stated otherwise, it does not exclude other components but may include additional components.
[0027] Embodiments of the present invention are described below with reference to the attached drawings so that those skilled in the art can easily implement them. However, the present invention may be embodied in various different forms and is not limited to the embodiments described herein.
[0028] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
[0029] FIGS. 1 and 2 are drawings illustrating a method for manufacturing a thin film encapsulation for a perovskite module according to one embodiment of the present invention.
[0030] Referring to FIGS. 1 and 2, a method for manufacturing a thin film encapsulation for a perovskite module according to an embodiment of the present invention comprises the steps of: preparing a perovskite solar cell module; forming a polydimethylsiloxane (PDMS) encapsulation layer on the perovskite solar cell module; applying a UV resin to the edge of the perovskite solar cell module on which the polydimethylsiloxane encapsulation layer is formed; and curing the UV resin to bond with glass and encapsulate.
[0031] Referring to FIG. 1, the step of forming a polydimethylsiloxane encapsulation layer on the perovskite solar cell module comprises: a step of performing a masking treatment on the edge of the perovskite solar cell module; and a step of forming a polydimethylsiloxane thin film on the masked perovskite solar cell module through a spin coating process, and the step of applying a UV resin to the edge of the perovskite solar cell module on which the polydimethylsiloxane encapsulation layer is formed may include: a step of removing the masking on the edge of the perovskite solar cell module; and a step of applying the resin using a dispenser device to the portion where the masking has been removed.
[0032] In the step of applying UV resin to the edge of the perovskite solar cell module having the above-mentioned polydimethylsiloxane encapsulation layer, the width of the applied UV resin may be 0.5 to 3 mm and the thickness may be 0.2 to 1 mm.
[0033] Referring to FIG. 2, the step of curing the UV resin and bonding it to glass for encapsulation can be performed under vacuum. By applying a vacuum process to remove bubbles within the PDMS, pores can be removed, thereby removing solvent, moisture, and oxygen from the interior.
[0034] The step of curing the above UV resin to bond it with glass and encapsulate it can be cured within 1 minute at a wavelength of 300 to 400 nm.
[0035] FIG. 3 is a schematic diagram showing the module structure of a perovskite solar cell with a PDMS material and UV resin cured encapsulated by a thin film encapsulation method for a perovskite module according to an embodiment of the present invention.
[0036] Figure 4 is a diagram showing the results of comparing perovskite decomposition depending on whether a vacuum process is performed. Referring to Figure 4, it can be seen that if the step of pressing in the vacuum state is not included, the perovskite changes due to the solvent, moisture, and oxygen remaining inside.
[0037] The method for manufacturing a thin film encapsulation for a perovskite module according to the present invention utilizes Polydimethylsiloxane (PDMS) material and UV-resin glass curing encapsulation technology to improve stability against the exposed surface caused by the laser etching process of the perovskite solar cell module, thereby providing moisture and heat barrier properties of the perovskite solar cell module and increasing light stability. The PDMS can significantly improve stability against the external environment without affecting the perovskite solar cell module.
[0038] When a laser etching process is performed for perovskite module fabrication, the perovskite is exposed to the atmosphere during the P3 stage (the cell separation stage). This can also cause perovskite degradation due to the external environment. Consequently, A-site defects occur, and structural stability is reduced. Additionally, light-induced electron-hole pairs react with the surrounding environment (oxygen and moisture) to generate reactive oxygen species, which further disrupt the chemical bonds of A-site cations, thereby accelerating degradation. To prevent this, PDMS material is spin-coated thinly to prevent A-site defects through passivation of the perovskite surface. As a final step, glass-to-glass bonding is performed using a UV-resin curing method. Therefore, particles such as moisture and oxygen are completely blocked from entering the perovskite solar cell module, thereby increasing stability against the external environment.
[0039] In addition, the present invention provides a method for manufacturing a thin film encapsulation for a perovskite module according to another embodiment of the present invention, comprising the steps of: preparing a perovskite solar cell module; forming an organic encapsulation layer on the perovskite solar cell module through a Chemical Vapor Deposition (CVD) process; forming an inorganic encapsulation layer on the organic encapsulation layer through an Atomic Layer Deposition (ALD) process; applying a UV resin to the edge of the perovskite solar cell module on which the organic and inorganic encapsulation layers are formed; and curing the UV resin to bond with glass and encapsulate.
[0040] According to one embodiment of the present invention, the organic encapsulation layer may comprise Parylene, and the inorganic encapsulation layer may comprise aluminum oxide (Al2O3).
[0041] The thickness of the organic encapsulation layer may be 1 to 10 μm, preferably 3 to 7 μm, but is not limited thereto.
[0042] The thickness of the above inorganic encapsulation layer may be 30 to 50 nm, preferably 30 to 40 nm, but is not limited thereto.
[0043] FIG. 5 is a diagram showing a method for forming an organic encapsulation layer through a Chemical Vapor Deposition (CVD) process according to an embodiment of the present invention.
[0044] Referring to FIG. 5, the step of forming an organic encapsulation layer on the perovskite solar cell module through a Chemical Vapor Deposition (CVD) process may include: heating Parylene powder on the perovskite solar cell module to 130 to 170 °C to vaporize it and form a Parylene dimer gas; passing the Parylene dimer gas through a furnace heated to 650 to 750 °C to convert it into a Parylene monomer gas; and depositing the converted Parylene monomer gas onto the surface of the perovskite solar cell module in a deposition chamber to form a Parylene film.
[0045] When laser scribing is performed for perovskite modularization, the perovskite layer is exposed to the atmosphere during the P3 step (the step of separating the cell) as shown in Fig. 6(a), which can also cause perovskite decomposition due to the external environment. The perovskite structure absorbs light to generate electron-hole pairs (excitons). The generated holes mainly react with organic cations at the A-site to weaken chemical bonds. As a result, methylammonium decomposes into methylamine and protons as shown in [Equation 1]. The generated methylamine is highly volatile and rapidly detaches from the surface. This leads to defects in the A-site as shown in [Equation 2], and the stability of the structure is reduced. Additionally, light-induced electron-hole pairs react with the surrounding environment (oxygen and moisture) to generate reactive oxygen species, and as shown in [Equation 3], these reactive oxygen species further destroy the chemical bonds of the A-site cations, accelerating decomposition. As shown in Fig. 6(b), A-site defects can be prevented through passivation of the perovskite surface by forming a perylene thin film.
[0046]
[0047] Figure 7 is a diagram showing a method of forming an inorganic encapsulation layer on the organic encapsulation layer through an atomic layer deposition (ALD) process.
[0048] Referring to FIG. 7, the step of forming an inorganic encapsulation layer on the organic encapsulation layer through an atomic layer deposition (ALD) process may include: (a) injecting TMA (Al(CH3)3) into a chamber to react with -OH groups on the surface to form aluminum methyl (-O-Al(CH3)2) groups and releasing methane (CH4) as a byproduct; (b) removing residual TMA and byproducts using an inert gas N2; (c) injecting water (H2O) to react with aluminum methyl groups to form aluminum oxide (Al-O), regenerate -OH groups on the surface, and release methane (CH4) as a byproduct; (d) performing a purge to remove residual H2O and byproducts; and repeating steps (a) through (d) to form an aluminum oxide thin film of a desired thickness.
[0049] According to one embodiment of the present invention, the step of forming an aluminum oxide thin film of a desired thickness by repeating steps (a) to (d) can be repeated 250 to 350 times, preferably 280 to 320 times, but is not limited thereto.
[0050] Figure 8 is a diagram illustrating a method of encapsulating by curing UV resin. Referring to Figure 8, UV resin is applied evenly to the outside of a perovskite module using a dispenser, and then the inside is sealed by filling it with nitrogen gas. Afterward, the applied resin is cured using a UV wavelength curing device to complete the encapsulation technique.
[0051] In the step of applying UV resin to the edge of the perovskite solar cell module having the above organic and inorganic encapsulation layers formed thereon, the width of the applied UV resin may be 0.5 to 3 mm and the thickness may be 0.2 to 1 mm.
[0052] In addition, the present invention provides a perovskite solar cell module comprising a thin film encapsulation of a perovskite solar cell module characterized by being manufactured by the above-described manufacturing method.
[0053] When the above perovskite solar cell module is exposed to light and measured using the maximum power point tracking method, the performance of the solar cell is characterized by maintaining 95% or more of the initial efficiency after 1000 hours.
[0055] Hereinafter, the present invention will be described in detail with reference to examples to specifically explain the invention. However, the embodiments according to the present invention may be modified in various different forms, and the scope of the present invention is not to be interpreted as being limited to the embodiments described below. The embodiments of this specification are provided to more completely explain the present invention to those with average knowledge in the art.
[0057] Example 1. Preparation of Perovskite Solar Cell Module Encapsulation Thin Film Using PDMS and UV Resin Glass Curing Encapsulation Technology
[0058] Masking was performed on the sides of the perovskite solar cell module. Subsequently, as shown in Fig. 1, a uniform PDMS film of a consistent thickness was formed through a spin coating process (5,000 rpm, ramping time 4 sec, 30 sec). After the coating was completed, the side markings were removed. After the PDMS film was formed on the perovskite solar cell module, the process shown in Fig. 2 was carried out. Resin was applied to the external marking area of the module using a dispenser device to a width of 1 mm and a thickness of 0.5 mm. After application, the module was bonded to glass and compressed under vacuum inside a vacuum chamber. Finally, the final encapsulation was completed by curing within 1 minute using a UV curing machine with a wavelength of 365 nm. The module structure of the PDMS and UV resin-cured encapsulated perovskite solar cell is shown in Fig. 3.
[0060] Example 2. Perylene, Al 2 O 3 Fabrication of Perovskite Solar Cell Module Encapsulation Thin Films Using UV Resin Glass Curing Encapsulation Technology
[0061] A uniform perylene film with a thickness of 5 μm was formed on a perovskite solar cell module through a CVD process as shown in Fig. 5. First, when Parylene powder is heated to 150°C and vaporized, a dimer gas is formed. Second, the generated dimer gas is converted into a monomer gas by passing through a furnace heated to 690°C. Finally, the converted monomer gas is deposited on the surface of the perovskite solar cell module in a deposition chamber to form a Parylene film.
[0062] An Al2O3 thin film was formed on the formed perylene film through an ALD process as shown in Fig. 7. First, TMA (Al(CH3)3) was injected. At this time, it reacts with the -OH groups on the surface to form aluminum methyl (-O-Al(CH3)2) groups and releases methane (CH4) as a byproduct. Second, residual TMA and byproducts are removed using the inert gas N2. Third, water (H2O) is injected so that the water reacts with the aluminum methyl groups to form aluminum oxide (Al-O), regenerates the -OH groups on the surface, and releases methane (CH4) as a byproduct. In the next step, purging is performed again to remove residual H2O and byproducts to prepare for the next cycle. The above process was repeated 300 times until a thickness of 33 nm was reached to form an Al2O3 thin film.
[0063] The final steps were carried out in the order of Fig. 8. UV-resin was applied evenly to the outside of the perovskite module using a dispenser to a width of 1 mm and a thickness of 0.5 mm, and then N2 gas was filled inside to bond with glass and seal it. Afterward, the applied resin was cured using a UV wavelength curing device to complete the final encapsulation.
[0065] Experimental Example 3. Moisture and Heat Test
[0066] Perovskite solar cell modules with PDMS films were placed in a moisture and heat test chamber to compare perovskite decomposition with and without the addition of a vacuum process.
[0067] Referring to Fig. 4, it can be seen that if the step of pressing in the vacuum state is not included, the perovskite is altered by the solvent, moisture, and oxygen remaining inside.
[0069] Experimental Example 4. 85℃ and RH 85% Chamber Test
[0070] A perovskite solar cell module with introduced perylene and Al2O3 was tested for 1,000 hours in a chamber environment of 85°C and RH 85%.
[0071] Referring to Fig. 9, it can be seen that the perovskite solar cell module is encapsulated to block the external environment (moisture, oxygen), and maintains 97.18% of the initial efficiency (2.82% decrease) even after 1000 hours in a chamber environment of 85°C and RH 85%.
[0073] Experimental Example 5. Photostability Test
[0074] Photostability tests were performed on perovskite solar cell modules with PDMS film and perovskite solar cell modules with perylene and Al2O3 by measuring the Maximum Power Point (MPPT) after exposure for 1000 hours.
[0075] Referring to Fig. 10, it can be seen that the perovskite solar cell module with a PDMS film maintained 97.52% of its initial efficiency (2.8% decrease), and the perovskite solar cell module with perylene and Al2O3 maintained 98.62% of its initial efficiency (1.39% decrease). It can be seen that the efficiency does not drop significantly even when continuously exposed to light for 1,000 hours due to the effect of passivation of the etching surface of the laser module.
[0077] Specific embodiments of the present invention have been examined so far. Those skilled in the art will understand that the present invention may be embodied in modified forms without departing from the essential characteristics of the invention. Therefore, the disclosed embodiments should be considered in an illustrative rather than a restrictive sense. The scope of the present invention is defined by the claims, not by the foregoing description, and all variations within the scope of equivalents should be interpreted as being included in the present invention.
Claims
Claim 1 A method for manufacturing a thin film encapsulation for a perovskite solar cell module, comprising the steps of: preparing a perovskite solar cell module; forming a polydimethylsiloxane (PDMS) encapsulation layer on the perovskite solar cell module; applying a UV resin to the edge of the perovskite solar cell module on which the polydimethylsiloxane encapsulation layer is formed; and curing the UV resin to bond it with glass for encapsulation. Claim 2 A method for manufacturing a thin film encapsulation for a perovskite solar cell module according to claim 1, wherein the step of forming a polydimethylsiloxane (PDMS) encapsulation layer on the perovskite solar cell module comprises: a step of performing a masking treatment on the edge of the perovskite solar cell module; and a step of forming a polymer thin film on the masked perovskite solar cell module through a spin coating process, and the step of applying a UV resin to the edge of the perovskite solar cell module on which the polydimethylsiloxane encapsulation layer is formed comprises: a step of removing the masking from the edge of the perovskite solar cell module; and a step of applying the resin using a dispenser device to the portion where the masking has been removed. Claim 3 A method for manufacturing a thin film encapsulation for a perovskite solar cell module, wherein, in claim 1, the step of curing the UV resin and bonding it to glass for encapsulation is performed in a vacuum state. Claim 4 A method for manufacturing a thin film encapsulation for a perovskite solar cell module, comprising the steps of: preparing a perovskite solar cell module; forming an organic encapsulation layer on the perovskite solar cell module through a chemical vapor deposition (CVD) process; forming an inorganic encapsulation layer on the organic encapsulation layer through an atomic layer deposition (ALD) process; applying a UV resin to the edge of the perovskite solar cell module on which the organic and inorganic encapsulation layers are formed; and curing the UV resin to bond with glass for encapsulation. Claim 5 A method for manufacturing a thin film encapsulation for a perovskite solar cell module, characterized in that, in claim 4, the organic encapsulation layer comprises Parylene and the inorganic encapsulation layer comprises aluminum oxide (Al2O3). Claim 6 A method for manufacturing a thin film encapsulation for a perovskite solar cell module according to claim 4, wherein the step of forming an organic encapsulation layer on the perovskite solar cell module through a Chemical Vapor Deposition (CVD) process comprises: a step of heating and vaporizing Parylene powder on the perovskite solar cell module to 130 to 170 ℃ to form a Parylene dimer gas; a step of passing the Parylene dimer gas through a furnace heated to 650 to 750 ℃ to convert it into a Parylene monomer gas; and a step of depositing the converted Parylene monomer gas on the surface of the perovskite solar cell module within a deposition chamber to form a Parylene film. Claim 7 In claim 4, the step of forming an inorganic encapsulation layer on the organic encapsulation layer through an atomic layer deposition (ALD) process comprises: (a) injecting TMA (Al(CH3)3) into a chamber to react with -OH groups on the surface to form aluminum methyl (-O-Al(CH3)2) groups and releasing methane (CH4) as a byproduct; (b) removing residual TMA and byproducts using an inert gas N2; (c) injecting water (H2O) to react with aluminum methyl groups to form aluminum oxide (Al-O), regenerate -OH groups on the surface, and release methane (CH4) as a byproduct; (d) performing a purge to remove residual H2O and byproducts; and (e) repeating steps (a) through (d) to form an aluminum oxide thin film of a desired thickness, characterized in that the method for manufacturing a thin film encapsulation for a perovskite solar cell module comprises