Resin composition

Abstract

[Problem] To provide a resin composition, etc., capable of obtaining a cured product having a low dielectric loss tangent, suppressed bending, excellent adhesion, and suppressed non-uniformity on the surface of the insulating layer. (A) a maleimide resin having repeating units represented by the following chemical formula (A-1), (B) an epoxy resin, and (C) an inorganic filler, comprising a resin composition.

Description

Technology Field

[0001] The present invention relates to a resin composition. It also relates to a resin sheet, a circuit board, and a semiconductor device using the said resin composition. Background Technology

[0002] Circuit boards, such as printed circuit boards, are widely used in various electronic devices. As a method for manufacturing circuit boards, a build-up method is known in which an insulating layer and a conductive layer made of metal or the like are alternately laminated on the circuit board. The insulating layer is formed, for example, by a cured product of a resin composition (for example, Patent Document 1). Prior art literature

[0003] Japanese Patent Publication No. JP 2022-161968 The problem to be solved

[0004] Recently, maleimide resin is sometimes included in resin compositions to lower the dielectric loss tangent of the insulating layer.

[0005] When a maleimide resin with three or more functional groups is included in a resin composition, a cured product with a low dielectric loss tangent and suppressed warping is obtained, but when curing the resin composition, the crosslinking density increases excessively, resulting in a cured product with reduced elongation and toughness. As a result, the adhesion to the silicon or conductor layer may be reduced.

[0006] In addition, if a difunctional maleimide resin is included in the resin composition as a maleimide resin, the crosslinking density may not increase excessively, but warping may occur.

[0007] In addition, when a maleimide resin having a flexible framework, such as an aliphatic hydrocarbon framework having 4 or more carbon atoms, is incorporated into a resin composition, a cured product with a low dielectric loss tangent and suppressed warping is obtained, but compatibility with other components is poor. Therefore, when an insulating layer is formed using such a resin composition, the uniformity of the surface of the insulating layer is reduced, and white spots (white areas) may occur on the surface of the insulating layer. If white areas occur, the insulation reliability of the insulating layer may decrease. The white areas occurring on the surface of the insulating layer are sometimes referred to as "non-uniformity."

[0008] The present invention, conceived in consideration of the above-mentioned problem, aims to provide a resin composition capable of obtaining a cured product having a low dielectric loss tangent, suppressed warping, excellent adhesion, and suppressed non-uniformity on the surface of an insulating layer; a resin sheet comprising said resin composition; a cured product of said resin composition; a circuit board comprising a cured product of said resin composition; and a semiconductor device comprising said circuit board. means of solving the problem

[0009] As a result of careful examination by the inventors, it was discovered that if a maleimide resin having a specific repeating unit is included in a resin composition as a maleimide resin, the dielectric loss tangent is low, the occurrence of warping is suppressed, excellent adhesion is achieved, and the occurrence of non-uniformity on the surface of the insulating layer is suppressed, thereby completing the present invention.

[0010] That is, the present invention includes the following contents.

[0011] [1] (A) Maleimide resin having repeating units represented by the following chemical formula (A-1),

[0012] (B) Epoxy resin, and

[0013] (C) A resin composition containing an inorganic filler.

[0014]

[0015] In chemical formula (A-1), X represents, respectively, a divalent group represented by chemical formula (A-2) or a divalent group represented by chemical formula (A-3). * represents a bonding hand.

[0016] In chemical formula (A-2), ring A 1 and case A 2 Each independently represents a divalent group having an directional ring structure that may have substituents, a divalent group containing an alicyclic structure that may have substituents, or a divalent group containing a complex ring structure that may have substituents, and Y 1 and Y 2 represents, respectively, a single bond, an oxygen atom, or an alkylene group that may have a substituent, and n and m represent, respectively, 0 or 1. * indicates a bond loss with the maleimide group in chemical formula (A-1).

[0017] In chemical formula (A-3), Z 1 , Z 2 , and Z 3 Each represents an alkylene group that may have a substituent, independently. * indicates a bond loss with the maleimide group in chemical formula (A-1).

[0018] [2] (A) A resin composition described in [1] having one of the repeating units represented by the following chemical formula (A-4) and the repeating unit represented by the chemical formula (A-5).

[0019]

[0020] [3] (E) A resin composition described in [1] or [2] that further contains a curing agent.

[0021] [4] (E) A resin composition described in [3] comprising any one of an active ester-based curing agent, a phenol-based curing agent, a carbodiimide-based curing agent, and a cyanate ester-based curing agent.

[0022] [5] (F) A resin composition described in any one of [1] to [4], further containing a polymer resin with a weight-average molecular weight greater than 5000.

[0023] [6] A resin composition described in [5], wherein component (F) has a functional group capable of reacting with component (B).

[0024] [7] The content of component (A) when the non-volatile component in the resin composition is 100 mass% is M A Let it be, and the content of component (B) when the non-volatile component in the resin composition is 100 mass% is M B When done as, M A / M B A resin composition described in any one of [1] to [6], having a value of 0.01 or more and 3 or less.

[0025] [8] (C) A resin composition described in any one of [1] to [7], wherein the content of the component is 40 mass% or more when the non-volatile component in the resin composition is 100 mass%.

[0026] [9] The content of component (A) when the non-volatile component in the resin composition is 100 mass% is M A Let it be, and the content of component (C) when the non-volatile component in the resin composition is 100 mass% is M C When done as, M A / M C A resin composition described in any one of [1] to [8], having a value of 0.01 or more and 3 or less.

[0027]

[10] The content of component (A) when the non-volatile component in the resin composition is 100 mass% is M A Let it be, and the content of component (E) when the non-volatile component in the resin composition is 100 mass% is M E When done as, M A / M EA resin composition described in any one of [1] to [9], having a value of 0.01 or more and 3 or less.

[0028]

[11] A resin sheet comprising a support and a resin composition layer provided on the support, comprising a resin composition described in any one of [1] to

[10] .

[0029]

[12] A circuit board comprising an insulating layer formed by a cured resin composition described in any one of [1] to

[10] .

[0030]

[13] A semiconductor device comprising a circuit board as described in

[12] . Effects of the invention

[0031] According to the present invention, a resin composition can be obtained that has a low dielectric loss tangent, suppresses the occurrence of warping, has excellent adhesion, and suppresses the occurrence of non-uniformity on the surface of an insulating layer; a resin sheet comprising said resin composition; a cured product of said resin composition; a circuit board comprising said resin composition; and a semiconductor device comprising said circuit board. Specific details for implementing the invention

[0032] The present invention will be described in detail below by presenting embodiments and examples. However, the present invention is not limited to the embodiments and examples listed below, and may be implemented with arbitrary modifications within the scope of the claims of the present invention and their equivalents without departing from the scope of the claims and equivalents thereof.

[0033] <Resin Composition>

[0034] The resin composition of the present invention comprises (A) a maleimide resin having repeating units represented by the chemical formula (A-1), (B) an epoxy resin, and (C) an inorganic filler. With this composition, a cured product can be obtained in which the dielectric loss tangent is low, the occurrence of warping is suppressed, the adhesion is excellent, and the occurrence of surface non-uniformity of the insulating layer is suppressed.

[0035] In addition to component (A), component (B), and component (C), the resin composition may, if necessary, comprise (D) a maleimide resin not having repeating units represented by chemical formula (A-1), (E) a curing agent, (F) a polymer resin with a weight-average molecular weight greater than 5000, (G) an organic filler, (H) a curing accelerator, (I) other additives, and (J) a solvent. Each component included in the resin composition will be described in detail below.

[0036] In addition, in the present invention, the content of each component in the resin composition is a value when the non-volatile component in the resin composition is set to 100 mass% unless otherwise specified, and the non-volatile component refers to a component other than the solvent described below among the components constituting the resin composition. In addition, in the present invention, the resin component of the resin composition refers to a component among the non-volatile components in the resin composition excluding inorganic fillers.

[0037] <(A) Maleimide resin having repeating units represented by the chemical formula (A-1)>

[0038] The resin composition contains, as component (A), a maleimide resin having repeating units represented by chemical formula (A-1). By including component (A) in the resin composition, the dielectric loss tangent is low, and the occurrence of non-uniformity and warping on the surface of the insulating layer is suppressed, resulting in excellent adhesion. The component (A) may be used as a single type or in combination of two or more types.

[0039]

[0040] In chemical formula (A-1), X represents, respectively, a divalent group represented by chemical formula (A-2) or a divalent group represented by chemical formula (A-3). * represents a bonding hand.

[0041] In chemical formula (A-2), ring A 1 and case A 2Each independently represents a divalent group having an directional ring structure that may have substituents, a divalent group containing an alicyclic structure that may have substituents, or a divalent group containing a complex ring structure that may have substituents, and Y 1 and Y 2 represents, respectively, a single bond, an oxygen atom, or an alkylene group that may have a substituent, and n and m represent, respectively, 0 or 1. * indicates a bond loss with the maleimide group in chemical formula (A-1).

[0042] In chemical formula (A-3), Z 1 , Z 2 , and Z 3 Each represents an alkylene group that may have a substituent, independently. * indicates a bond loss with the maleimide group in chemical formula (A-1).

[0043] In chemical formula (A-2), ring A 1 and case A 2 Each represents, independently, a divalent group having an aromatic ring structure that may have substituents, a divalent group having an alicyclic structure that may have substituents, or a divalent group having a complex ring structure that may have substituents. In the aromatic ring structure, the alicyclic structure, and the complex ring structure, the reduced water is preferably a 3-membered ring or more, more preferably a 4-membered ring or more, even more preferably a 5-membered ring or more, preferably a 20-membered ring or less, more preferably a 15-membered ring or less, even more preferably a 10-membered ring or less, and particularly preferably a 6-membered ring. As for the aromatic ring structure, the alicyclic structure, and the complex ring structure, a single ring structure or a polycyclic structure may be used, but a single ring structure is preferred in the view that the effects of the present invention are significantly obtained.

[0044] Examples of aromatic ring structures for a divalent group having an aromatic ring structure that may have substituents include a benzene ring, a naphthalene ring, an anthracene ring, etc. Among these, a benzene ring is preferred as the aromatic ring structure. Therefore, for a divalent group having an aromatic ring structure that may have substituents, a phenylene group that may have substituents is preferred. Examples of phenylene groups that may have substituents include a 1,2-phenylene group, a 1,3-phenylene group, a 1,4-phenylene group, a 3-methyl-5-ethyl-1,4-phenylene group, etc., and examples include a 1,3-phenylene group, a 1,4-phenylene group, a 3-methyl-5-ethyl-1,4-phenylene group, etc., and a 1,3-phenylene group, a 1,4-phenylene group, or a 3-methyl-5-ethyl-1,4-phenylene group is preferred.

[0045] The divalent group having an aromatic ring structure may have a substituent. Examples of substituents include a halogen atom, an alkyl group, an alkenyl group, a cycloalkyl group, an alkoxy group, a cycloalkyloxy group, an aryl group, an aryloxy group, an arylalkyl group, an aryl alkoxy group, a monovalent heterocyclic group, an alkylidene group, an amino group, a silyl group, a carboxyl group, a sulfonyl group, a cyano group, a nitro group, a hydroxyl group, a mercapto group, an oxo group, etc.

[0046] Halogen atoms used as substituents include, for example, fluorine atoms, chlorine atoms, bromine atoms, and iodine atoms.

[0047] The alkyl group used as a substituent may be either straight-chain or branched. The number of carbon atoms in the alkyl group is preferably 1 to 12, more preferably 1 to 6, and even more preferably 1 to 3.

[0048] The alkenyl group used as a substituent may be either straight-chain or branched. The number of carbon atoms in the alkenyl group is preferably 2 to 12, more preferably 2 to 6, and even more preferably 2 or 3.

[0049] The number of carbon atoms of the cycloalkyl group used as a substituent is preferably 3 to 12, more preferably 3 to 6.

[0050] The alkoxy group used as a substituent may be either straight-chain or branched. The number of carbon atoms of the alkoxy group is preferably 1 to 12, more preferably 1 to 6.

[0051] The number of carbon atoms of the cycloalkyloxy group used as a substituent is preferably 3 to 12, more preferably 3 to 6.

[0052] The aryl group used as a substituent is a group obtained by removing one hydrogen atom from an aromatic ring of an aromatic hydrocarbon. The number of carbon atoms in the aryl group used as a substituent is preferably 6 to 14, more preferably 6 to 10.

[0053] The number of carbon atoms of the aryloxy group used as a substituent is preferably 6 to 14, more preferably 6 to 10. The number of carbon atoms of the arylalkyl group used as a substituent is preferably 7 to 15, more preferably 7 to 11.

[0054] The number of carbon atoms of the aryl alkoxy group used as a substituent is preferably 7 to 15, more preferably 7 to 11.

[0055] A monovalent complex group used as a substituent refers to a group obtained by removing one hydrogen atom from a complex ring of a complex-ring compound. The number of carbon atoms in the monovalent complex group is preferably 3 to 15, more preferably 3 to 9.

[0056] An alkylidene group used as a substituent refers to a group in which two hydrogen atoms are removed from the same carbon atom of an alkane. The number of carbon atoms in the alkylidene group is preferably 1 to 12, more preferably 1 to 6, and even more preferably 1 to 3.

[0057] The substituents described above may additionally have substituents (hereinafter referred to as “secondary substituents”). As secondary substituents, the same as the substituents described above may be used unless otherwise specified.

[0058] Examples of alicyclic structures for a divalent group that may have substituents include cyclohexane rings, cyclopentane rings, cycloheptane rings, and cyclooctane rings. Among these, a cyclohexane ring is preferred as the alicyclic structure. Therefore, for a divalent group that may have alicyclic structures, a cyclohexylene group that may have substituents is preferred. Examples of cyclohexylene groups that may have substituents include 1,2-cyclohexylene groups, 1,3-cyclohexylene groups, 1,4-cyclohexylene groups, and 3-octyl-4-hexyl-1,2-cyclohexylene groups, and 1,3-cyclohexylene groups, 1,4-cyclohexylene groups, and 3-octyl-4-hexyl-1,2-cyclohexylene groups are preferred.

[0059] A divalent group having an alicyclic structure may have a substituent. The substituents that may be had by the divalent group having an alicyclic structure are the same as the substituents that may be had by the divalent group having an aromatic ring structure, except for the alkyl group used as a substituent. The alkyl group used as a substituent of the divalent group having an alicyclic structure may be either straight-chain or branched. The number of carbon atoms in the alkyl group is preferably 3 to 20, more preferably 3 to 12, even more preferably 3 to 10, or 5 to 10.

[0060] The complex ring in a divalent group including a complex ring structure that may have substituents represents a complex ring having a heteroatom selected from a nitrogen atom, an oxygen atom, and a sulfur atom, and if there are multiple heteroatoms, they may be identical or different. In addition, the complex ring may be an aromatic complex ring.

[0061] As heteroatoms, they are selected from nitrogen atoms, oxygen atoms, and sulfur atoms, and nitrogen atoms are preferred. Among the heteroatoms in a divalent group having a heterocyclic structure that may have substituents, the heteroatoms are preferably 1 to 5, more preferably 1 to 3, even more preferably 1 or 2, and particularly preferably 2.

[0062] Examples of complex rings include, for instance, the azolidin ring, oxolane ring, thiolane ring, azol ring, oxol ring, thiol ring, azinan ring, oxan ring, thian ring, pyridine ring, pyrillium ion ring, thiopyrillium ion ring, azephan ring, oxephane ring, thiephane ring, azepine ring, oxepin ring, thiepin ring, imidazole ring, pyrazol ring, oxazol ring, thiazole ring, imidazoline ring, pyrazine ring, piperazine ring, morpholine ring, thiazine ring, indole ring, isoindole ring, benzimidazole ring, purine ring, quinoline ring, isoquinoline ring, quinoxaline ring, cinnoline ring, pteridine ring, etc. Among these, the piperazine ring is preferred as a complex ring. Therefore, a divalent group having a complex ring structure that may have substituents is preferably a divalent group having a piperazine ring structure that may have substituents.

[0063] A divalent group containing a complex ring structure may have substituents. The substituents that a divalent group containing a complex ring structure may have are the same as the substituents that a divalent group having an directional ring structure may have.

[0064] In chemical formula (A-2), Y 1 and Y 2Each represents an alkylene group that may independently have a single bond, an oxygen atom, or a substituent. The alkylene group may be straight-chain, branched, or cyclic; a straight-chain or branched hydrocarbon group is preferred, and a straight-chain group is more preferred. The number of carbon atoms in the alkylene group is preferably 1 to 20, or 5 to 20, more preferably 1 to 6, or 6 to 15, and even more preferably 1 to 3, or 6 to 10. Examples of alkylene groups include methylene, ethylene, propylene, butylene, pentylene, hexylene, octylene, nonylene, and decylene groups, among which methylene, ethylene, and octylene groups are preferred, and methylene or octylene groups are more preferred.

[0065] Y 1 and Y 2 The alkylene group represented by α may have a substituent. The substituent that the alkylene group may have is the same as the substituent that the divalent group having an aromatic ring structure may have.

[0066] In chemical formula (A-2), n represents 0 or 1, and 1 is preferred.

[0067] In chemical formula (A-2), m represents 0 or 1, and 0 is preferred.

[0068] In chemical formula (A-3), Z 1 , Z 2 , and Z 3 Each represents an alkylene group that may have substituents, independently. Z 1 , Z 2 , and Z 3 As an alkylene group that may have the substituent shown here, Y in chemical formula (A-2) 1 It is identical to an alkylene group that has a substituent representing this.

[0069] Specific examples of the divalent group represented by X in chemical formula (A-1) include the groups represented by the following chemical formulas (a1) to (a11), and the group represented by chemical formula (a1) is preferred. However, the divalent group represented by X is not limited to these specific examples. In the chemical formula, "*" indicates a bond loss with the maleimide group in chemical formula (A-1).

[0070]

[0071] As for component (A), it may be a polymer having only repeating units represented by chemical formula (A-1) or a copolymer, but it is preferable to be a copolymer from the viewpoint of significantly obtaining the effects of the present invention. In these cases, X in chemical formula (A-1) may be the same or different. When component (A) is a copolymer, component (A) may be any of random copolymerization, alternating copolymerization, block copolymerization, and graft copolymerization.

[0072] When component (A) is a copolymer, it is preferable that component (A) has, in addition to the repeating unit represented by chemical formula (A-1), one of the repeating unit represented by chemical formula (A-4) and the repeating unit represented by chemical formula (A-5). Among these, it is more preferable to have the repeating unit represented by chemical formula (A-4) from the view of suppressing the occurrence of non-uniformity on the surface of the insulating layer. In chemical formulas (A-4) and (A-5), "*" indicates a bond loss.

[0073]

[0074] (A) In order to significantly obtain the effects of the present invention, it is preferable that the component contains a large amount of repeating units represented by the formula (A-1). The amount of repeating units represented by the formula (A-1) is preferably 30 mass% or more, more preferably 35 mass% or more, even more preferably 40 mass% or more, or 45 mass% or more, with respect to 100 mass% of the total mass of the component (A). The upper limit is preferably 100 mass% or less, more preferably 90 mass% or less, even more preferably 80 mass% or less, 70 mass% or less, or 60 mass% or less.

[0075] (A) Specific examples of component (A) include maleimide resins represented by the following chemical formulas (1) to (11). However, component (A) is not limited to these specific examples. In the chemical formulas, "*" indicates a bond loss.

[0076]

[0077]

[0078]

[0079]

[0080]

[0081]

[0082] (A) As a method for synthesizing the component, for example, it can be synthesized by reacting an amine compound having a maleamic acid structure with maleic anhydride. Additionally, if necessary, it may also be reacted with indene or styrene. As a specific method for synthesizing the component (A), for example, one may refer to Japanese Patent Publication No. JP 2024-012085.

[0083] (A) The weight-average molecular weight of the component is preferably 500 or more, more preferably 700 or more, even more preferably 1000 or more, preferably 50000 or less, more preferably 30000 or less, and even more preferably 20000 or less. The weight-average molecular weight can be measured as a polystyrene equivalent value by gel permeation chromatography (GPC).

[0084] (A) When the non-volatile component in the resin composition is 100 mass%, the content of the component is preferably 1 mass% or more, more preferably 2 mass% or more, even more preferably 3 mass% or more, preferably 25 mass% or less, more preferably 20 mass% or less, and even more preferably 15 mass% or less. When the content of the component (A) is within the above range, the dielectric loss tangent of the cured product of the resin composition can be lowered, and warping after curing can be suppressed.

[0085] (A) The content of component A is preferably 1 mass% or more, more preferably 3 mass% or more, even more preferably 10 mass% or more, preferably 55 mass% or less, more preferably 50 mass% or less, even more preferably 40 mass% or less, 35 mass% or less, or 30 mass% or less when the resin component of the resin composition is 100 mass%. When the content of component A is within the above range, the dielectric loss tangent of the cured product of the resin composition can be lowered, and warping after curing can be suppressed.

[0086] <(B) Epoxy Resin>

[0087] The resin composition contains (B) epoxy resin as component (B). The (B) epoxy resin as component (B) excludes the component (A). By including (B) epoxy resin, a cured product exhibiting good mechanical strength and insulation reliability can be obtained. Component (B) may be used as a single type or in combination of two or more types.

[0088] (B) As epoxy resins, examples include bixylenol-type epoxy resin, bisphenol A-type epoxy resin, bisphenol F-type epoxy resin, bisphenol S-type epoxy resin, bisphenol AF-type epoxy resin, dicyclopentadiene-type epoxy resin, trisphenol-type epoxy resin, naphthol novolak-type epoxy resin, phenol novolak-type epoxy resin, tertiary-butyl-catechol-type epoxy resin, naphthalene-type epoxy resin, naphthol-type epoxy resin, anthracene-type epoxy resin, glycidylamine-type epoxy resin, glycidyl ester-type epoxy resin, glycidylcyclohexane-type epoxy resin, alkyl diglycidyl ether-type epoxy resin, cresol novolak-type epoxy resin, biphenyl-type epoxy resin, linear aliphatic epoxy resin, epoxy resin having a butadiene structure, alicyclic epoxy resin, heterocyclic epoxy resin, spiro-ring containing epoxy resin, cyclohexane-type epoxy resin, cyclohexanedimethanol-type epoxy resin, naphthylene Examples include ether-type epoxy resins, trimethylol-type epoxy resins, tetraphenylethane-type epoxy resins, phenolphthalimidine-type epoxy resins, etc.

[0089] The resin composition preferably comprises, as component (B), an epoxy resin having two or more epoxy groups in one molecule. In order to significantly obtain the desired effect of the present invention, the ratio of the epoxy resin having two or more epoxy groups in one molecule to 100 mass% of the epoxy resin (B) is preferably 50 mass% or more, more preferably 60 mass% or more, and particularly preferably 70 mass% or more.

[0090] (B) Epoxy resins include liquid epoxy resin at a temperature of 20°C (hereinafter referred to as "liquid epoxy resin") and solid epoxy resin at a temperature of 20°C (hereinafter referred to as "solid epoxy resin"). The resin composition may contain only liquid epoxy resin or only solid epoxy resin as component (B), but it is preferable to include a combination of liquid epoxy resin and solid epoxy resin to obtain the effects of the present invention significantly.

[0091] As for the liquid epoxy resin, a liquid epoxy resin having two or more epoxy groups in one molecule is preferred.

[0092] As for the liquid epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol AF type epoxy resin, naphthalene type epoxy resin, glycidyl ester type epoxy resin, glycidylamine type epoxy resin, phenol novolak type epoxy resin, alicyclic epoxy resin having an ester backbone, cyclohexane type epoxy resin, cyclohexanedimethanol type epoxy resin, glycidylamine type epoxy resin, and epoxy resin having a butadiene structure, glycidylcyclohexane type epoxy resin, phenolphthalimidine type epoxy resin, alkyl diglycidyl ether type epoxy resin, epoxy resin having a butadiene structure, and resorcinol type epoxy resin are preferred, and any one of bisphenol A type epoxy resin, bisphenol F type epoxy resin, and naphthalene type epoxy resin is more preferred.

[0093] Specific examples of liquid epoxy resins include “HP4032”, “HP4032D”, and “HP4032SS” (naphthalene-type epoxy resins) manufactured by DIC; “828US”, “jER828EL”, “825”, and “Epicote 828EL” (bisphenol A-type epoxy resins) manufactured by Mitsubishi Chemical Corporation; “jER807” and “1750” (bisphenol F-type epoxy resins) manufactured by Mitsubishi Chemical Corporation; “jER152” (phenol novolak-type epoxy resin) manufactured by Mitsubishi Chemical Corporation; “630” and “630LSD” (glycidylamine-type epoxy resins) manufactured by Mitsubishi Chemical Corporation; and “ZX1059” (a mixture of bisphenol A-type epoxy resin and bisphenol F-type epoxy resin) manufactured by Nittetsu Chemical & Materials. Examples include “EX-721” (glycidyl ester type epoxy resin) manufactured by Nagase Chemtex; “Celoxide 2021P” (alicyclic epoxy resin having an ester backbone) manufactured by Daicel; “PB-3600” (epoxy resin having a butadiene structure) manufactured by Daicel; “ZX1658” and “ZX1658GS” (liquid 1,4-glycidylcyclohexane type epoxy resin) manufactured by Nittetsu Chemical & Materials; “YED216D” (alkyl diglycidyl ether type epoxy resin) manufactured by Mitsubishi Chemical; “YD-8125G” (bisphenol A type epoxy resin) manufactured by Nittetsu Chemical & Materials; and “EX-201” (resorcinol type epoxy resin) manufactured by Nagase Chemtex. These may be used individually or in combination of two or more types.

[0094] As for the solid epoxy resin, a solid epoxy resin having two or more epoxy groups in one molecule is preferred, a solid epoxy resin having three or more epoxy groups in one molecule is more preferred, and an aromatic solid epoxy resin having three or more epoxy groups in one molecule is more preferred.

[0095] As for the solid epoxy resin, bixylenol-type epoxy resin, naphthalene-type epoxy resin, naphthalene-type tetrafunctional epoxy resin, cresol novolak-type epoxy resin, dicyclopentadiene-type epoxy resin, trisphenol-type epoxy resin, naphthol-type epoxy resin, biphenyl-type epoxy resin, naphtylene ether-type epoxy resin, anthracene-type epoxy resin, bisphenol A-type epoxy resin, bisphenol AF-type epoxy resin, and tetraphenylethane-type epoxy resin are preferred, any one of bixylenol-type epoxy resin, naphthol-type epoxy resin, and biphenyl-type epoxy resin is more preferred, and bixylenol-type epoxy resin and biphenyl-type epoxy resin are even more preferred.

[0096] Specific examples of solid-phase epoxy resins include “HP4032H” (naphthalene-type epoxy resin), “HP-4700”, “HP-4710” (naphthalene-type tetrafunctional epoxy resin), “N-690” (cresol novolak-type epoxy resin), “N-695” (cresol novolak-type epoxy resin), “HP-7200”, “HP-7200HH”, “HP-7200H” (dicyclopentadiene-type epoxy resin), “EXA-7311”, “EXA-7311-G3”, “EXA-7311-G4”, “EXA-7311-G4S”, “HP6000”, and “HP6000L” (naphtylene ether-type epoxy resin) manufactured by DIC. "EPPN-502H" (trisphenol-type epoxy resin), "NC7000L" (naphthol novolak-type epoxy resin), "NC3000H", "NC3000", "NC3000L", "NC3100" (biphenyl-type epoxy resin) manufactured by Nippon Kayaku Co., Ltd.; "ESN475V", "ESN4100V" (naphthalene-type epoxy resin), "ESN485" (naphthol novolak-type epoxy resin), "ESN4100-VEK75" (naphthol aral-kil type epoxy resin), "ESN-4100V" (methoxy group-containing naphthol aral-kil type resin) manufactured by Nittetsu Chemical & Materials Co., Ltd.; Examples include “YX4000H”, “YL6121” (biphenyl-type epoxy resin), “YX4000HK” (bixylenol-type epoxy resin), and “YX8800” (anthracene-type epoxy resin) manufactured by Mitsubishi Chemical Corporation; “PG-100” and “CG-500” manufactured by Osaka Gas Chemical Corporation; “YL7760” (bisphenol AF-type epoxy resin), “YL7800” (fluorene-type epoxy resin), “jER1010” (solid-phase bisphenol A-type epoxy resin), and “jER1031S” (tetraphenylethane-type epoxy resin) manufactured by Mitsubishi Chemical Corporation; and “WHR-991S” (phenolphthalimidine-type epoxy resin) manufactured by Nippon Kayaku Corporation. These may be used individually or in combination of two or more types.

[0097] (B) When a combination of liquid epoxy resin and solid epoxy resin is used as a component, the ratio of the two (liquid epoxy resin: solid epoxy resin) is, in mass ratio, preferably 1:0.1 to 1:20, more preferably 1:0.15 to 1:10, and particularly preferably 1:0.2 to 1:5.

[0098] (B) The epoxy equivalent of the component is preferably 50 g / eq. to 5000 g / eq., more preferably 50 g / eq. to 3000 g / eq., even more preferably 80 g / eq. to 2000 g / eq., and even more preferably 110 g / eq. to 1000 g / eq. By being within this range, the cured product of the resin composition can form a cured body with a sufficient crosslinking density. The epoxy equivalent is the mass of an epoxy resin containing 1 equivalent of an epoxy group. This epoxy equivalent can be measured according to JIS K7236.

[0099] (B) The weight-average molecular weight (Mw) of the component is preferably 100 to 5000, more preferably 150 to 3000, and even more preferably 200 to 1500, in order to significantly obtain the desired effect of the present invention. The weight-average molecular weight of the epoxy resin is the weight-average molecular weight in polystyrene equivalent measured by gel permeation chromatography (GPC).

[0100] (B) When the non-volatile component in the resin composition is 100 mass%, the content of the epoxy resin is preferably 1 mass% or more, more preferably 3 mass% or more, even more preferably 5 mass% or more, preferably 25 mass% or less, more preferably 20 mass% or less, even more preferably 15 mass% or less, or 13 mass% or less. (B) When the content of the component is within the above range, the dielectric loss tangent of the cured product of the resin composition can be lowered and warping can be suppressed.

[0101] (B) The content of the epoxy resin is preferably 10 mass% or more, more preferably 15 mass% or more, even more preferably 20 mass% or more, or 25 mass% or more, and preferably 55 mass% or less, more preferably 50 mass% or less, even more preferably 40 mass% or less, or 35 mass% or less, when the resin component of the resin composition is 100 mass%. (B) When the content of the component is within the above range, the dielectric loss tangent of the cured product of the resin composition can be lowered and warping can be suppressed.

[0102] The content of component (A) when the non-volatile component in the resin composition is set to 100 mass% is M A Let it be, and the content of component (B) when the non-volatile component in the resin composition is 100 mass% is M B When done as, M A / M B a, preferably 0.01 or more, more preferably 0.05 or more, even more preferably 0.1 or more, 0.2 or more, 0.3 or more, or 0.4 or more, and preferably 3 or less, more preferably 2 or less, even more preferably 1 or less, 0.8 or less, 0.7 or less, 0.6 or less, or 0.5 or less. M A / M B By adjusting the ratio of component (A) and component (B) so that they fall within this range, the effects of the present invention can be significantly obtained.

[0103] <(C) Inorganic Filler>

[0104] The resin composition contains an inorganic filler (C) as component (C). By including the inorganic filler (C) in the resin composition, it becomes possible to obtain a cured product with a low dielectric loss tangent. The inorganic filler (C) is typically included in the resin composition in a particulate state. The component (C) may be used as a single type or in combination of two or more types.

[0105] (C) Inorganic compounds are used as materials for inorganic fillers. (C) Examples of materials for inorganic fillers include silica, alumina, glass, cordierite, silicon oxide, barium sulfate, barium carbonate, talc, clay, mica powder, zinc oxide, hydrotalcite, boehmite, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, magnesium oxide, boron nitride, aluminum nitride, manganese nitride, aluminum borate, strontium carbonate, strontium titanate, calcium titanate, magnesium titanate, bismuth titanate, titanium oxide, zirconium oxide, barium titanate, barium zirconate titanate, barium zirconate, calcium zirconate, zirconium phosphate, and zirconium tungstate phosphate. Among these, silica is particularly suitable. Examples of silica include amorphous silica, fused silica, crystalline silica, synthetic silica, hollow silica, etc. Additionally, spherical silica is preferred as silica.

[0106] (C) Examples of commercially available inorganic fillers include “SP60-05” and “SP507-05” manufactured by Nittetsu Chemical & Material Co., Ltd.; “YC100C”, “YA050C”, “YA050C-MJE”, “YA010C”, “SC2500SQ”, “SO-C4”, “SO-C2”, “SO-C1”, and “SO-C6” manufactured by Admatex Co., Ltd.; “UFP-30”, “DAW-03”, and “FB-105FD” manufactured by Denka Co., Ltd.; “Silfil (NSS-3N)”, “Silfil (NSS-4N)”, and “Silfil (NSS-5N)” manufactured by Tokuyama Co., Ltd.; and “Cellspheres (MGH-005)” manufactured by Taiheiyo Cement Co., Ltd.

[0107] (C) The average particle diameter of the inorganic filler is preferably 0.01 μm or more, more preferably 0.05 μm or more, even more preferably 0.1 μm or more, 0.2 μm or more, or 0.3 μm or more, and preferably 10 μm or less, more preferably 5 μm or less, even more preferably 3 μm or less.

[0108] (C) The average particle diameter of an inorganic filler can be measured by a laser diffraction scattering method based on the Mie scattering theory. Specifically, the average particle diameter can be measured by creating a volume-based particle diameter distribution of the inorganic filler using a laser diffraction scattering particle diameter distribution measuring device and taking the median diameter as the average particle diameter. For the measurement sample, 100 mg of inorganic filler and 10 g of methyl ethyl ketone can be weighed into a vial and dispersed by ultrasound for 10 minutes. Using a laser diffraction particle diameter distribution measuring device, the wavelength of the light source used is set to blue and red, and the volume-based particle diameter distribution of the inorganic filler is measured using a flow cell method. From the obtained particle diameter distribution, the average particle diameter can be calculated as the median diameter. Examples of laser diffraction particle diameter distribution measuring devices include the "LA-960" manufactured by Horiba Seisakusho Co., Ltd.

[0109] (C) The BET specific surface area of ​​the inorganic filler is preferably 0.1 m² / g or more, more preferably 0.5 m² / g or more, even more preferably 1 m² / g or more, preferably 100 m² / g or less, more preferably 70 m² / g or less, and even more preferably 40 m² / g or less.

[0110] (C) The specific surface area of ​​an inorganic filler can be measured by using a specific surface area measuring device (Macsorb HM-1210 manufactured by Mounttec) to adsorb nitrogen gas onto the surface of a sample according to the BET method, and by calculating the specific surface area using the BET multi-point method.

[0111] (C) It is preferable that the inorganic filler be treated with a surface treatment agent to improve moisture resistance and dispersibility. Examples of surface treatment agents include fluorine-containing silane coupling agents, aminosilane-based coupling agents, epoxysilane-based coupling agents, mercaptosilane-based coupling agents, silane-based coupling agents, alkoxysilanes, organosilazanes, titanate-based coupling agents, etc. The surface treatment agent may be used as a single type or may be used in combination of two or more types.

[0112] As commercially available surface treatment agents, for example, Shin-Etsu Chemical Co., Ltd.'s "KBM403" (3-glycidoxypropyltrimethoxysilane), Shin-Etsu Chemical Co., Ltd.'s "KBM803" (3-mercaptopropyltrimethoxysilane), Shin-Etsu Chemical Co., Ltd.'s "KBE903" (3-aminopropyltriethoxysilane), Shin-Etsu Chemical Co., Ltd.'s "KBM573" (N-phenyl-3-aminopropyltrimethoxysilane), Shin-Etsu Chemical Co., Ltd.'s "SZ-31" (hexamethyldisilazane), Shin-Etsu Chemical Co., Ltd.'s "KBM103" (phenyltrimethoxysilane), Shin-Etsu Chemical Co., Ltd.'s "KBM-4803" (long-chain epoxy-type silane coupling agent), and Shin-Etsu Chemical Co., Ltd.'s "KBM-4803" (long-chain epoxy-type silane coupling agent). Examples include “KBM-7103” (3,3,3-trifluoropropyltrimethoxysilane).

[0113] The degree of surface treatment by the surface treatment agent is preferably within a specific range from the perspective of improving the dispersibility of the inorganic filler. Specifically, 100 mass% of the inorganic filler is preferably surface-treated with 0.2 mass% to 5 mass% of a surface treatment agent, more preferably surface-treated with 0.2 mass% to 3 mass% of a surface treatment agent, and even more preferably surface-treated with 0.3 mass% to 2 mass% of a surface treatment agent.

[0114] The degree of surface treatment by a surface treatment agent can be evaluated by the carbon content per unit surface area of ​​the inorganic filler. From the perspective of improving the dispersibility of the inorganic filler, the carbon content per unit surface area of ​​the inorganic filler is preferably 0.02 mg / m² or more, more preferably 0.1 mg / m² or more, and even more preferably 0.2 mg / m² or more. Meanwhile, from the perspective of preventing an increase in the melt viscosity of the resin composition, it is preferably 1.0 mg / m² or less, more preferably 0.8 mg / m² or less, and even more preferably 0.5 mg / m² or less.

[0115] (C) The carbon content per unit surface area of ​​the inorganic filler can be measured after the inorganic filler is cleaned with a solvent (e.g., methyl ethyl ketone (MEK)) following surface treatment. Specifically, a sufficient amount of MEK is added as a solvent to the inorganic filler surface-treated with a surface treatment agent, and ultrasonically cleaned at 25°C for 5 minutes. After removing the supernatant and drying the solids, the carbon content per unit surface area of ​​the inorganic filler can be measured using a carbon analyzer. As a carbon analyzer, the "EMIA-320V" manufactured by Horiba Seisakusho Co., Ltd. can be used.

[0116] In addition, the degree of surface treatment by a surface treatment agent can be evaluated by the carbon content per unit mass of the inorganic filler. The carbon content per unit mass of the inorganic filler is preferably 0.01 mass% or more, more preferably 0.05 mass% or more, more preferably 0.1 mass% or more, more preferably 1.0 mass% or less, more preferably 0.8 mass% or less, and more preferably 0.5 mass% or less. (C) The carbon content per unit mass of the inorganic filler can be measured using a carbon analyzer, just like the carbon content per unit surface area of ​​the inorganic filler.

[0117] (C) The content of inorganic filler is preferably 40 mass% or more, more preferably 45 mass% or more, even more preferably 50 mass% or more, 55 mass% or more, 60 mass% or more, or 65 mass% or more, when the non-volatile component in the resin composition is 100 mass%, in order to obtain a cured product with a low dielectric loss tangent. The upper limit is preferably 90 mass% or less, more preferably 85 mass% or less, even more preferably 80 mass% or less, or 75 mass% or less.

[0118] The content of component (A) when the non-volatile component in the resin composition is set to 100 mass% is M A Let it be, and the content of component (C) when the non-volatile component in the resin composition is 100 mass% is M C When done as, M A / M C a, preferably 0.01 or more, more preferably 0.02 or more, even more preferably 0.03 or more, 0.04 or more, or 0.05 or more, and preferably 3 or less, more preferably 2 or less, even more preferably 1 or less, 0.8 or less, 0.7 or less, 0.6 or less, 0.5 or less, 0.4 or less, or 0.3 or less. M A / M C By adjusting the ratio of component (A) and component (C) so that they fall within this range, the effects of the present invention can be significantly obtained.

[0119] <(D) Maleimide resin without repeating units represented by chemical formula (A-1)>

[0120] The resin composition may contain, as component (D), a maleimide resin that does not have repeating units represented by chemical formula (A-1) of (D). The maleimide resin that does not have repeating units represented by chemical formula (A-1) of (D) as component (D) excludes those corresponding to components (A) to (C). As component (D), one type may be used alone, or two or more types may be used in combination.

[0121] The maleimide resin that does not have repeating units represented by the chemical formula (A-1) is, for example, a compound having one or more, preferably two or more, maleimide groups and not having repeating units represented by the chemical formula (A-1). (D) The component may be an aliphatic maleimide compound containing an aliphatic amine backbone, or an aromatic maleimide compound containing an aromatic amine backbone.

[0122] (D) As commercially available products of the component, for example, “SLK-2600” and “SLK-6895-T90” manufactured by Shin-Etsu Kagaku Kogyo Co., Ltd., “BMI-1500”, “BMI-1700”, “BMI-3000J”, “BMI-689”, and “BMI-2500” manufactured by Designer Molecules Inc. (maleimide compounds containing a dimer diamine structure); “BMI-6100” manufactured by Designer Molecules Inc. (aromatic maleimide compounds); “MIR-5000-60T” and “MIR-3000-70MT” manufactured by Nippon Kayaku Co., Ltd. (biphenylalactyl maleimide compounds); Examples include “BMI-70” and “BMI-80” manufactured by K.I. Kasei Co., Ltd., and “BMI-2300” and “BMI-TMH” manufactured by Yamato Kasei Kogyo Co., Ltd. In addition, as a (D) component, a maleimide resin (maleimide compound containing a monocyclic skeleton) disclosed in the Korea Invention Association Publication No. 2020-500211 may be used.

[0123] (D) The content of the component is preferably 0.1 mass% or more, more preferably 0.5 mass% or more, even more preferably 1 mass% or more, and preferably 5 mass% or less, more preferably 3 mass% or less, and even more preferably 2 mass% or less, when the non-volatile component in the resin composition is 100 mass%.

[0124] (D) The content of the component is preferably 1 mass% or more, more preferably 2 mass% or more, even more preferably 3 mass% or more when the resin component of the resin composition is 100 mass%, and preferably 10 mass% or less, more preferably 8 mass% or less, and even more preferably 5 mass% or less.

[0125] <(E) Curing Agent>

[0126] The resin composition may contain a curing agent (E) as component (E). The curing agent (E) as component (E) is excluded from those corresponding to components (A) to (D). Component (E) typically has the function of reacting with component (B) to cure the resin composition. Component (E) may be used as a single type, or two or more types may be used in combination in any proportion.

[0127] As component (E), a compound capable of reacting with component (B) to cure the resin composition may be used, examples of which include active ester-based curing agents, phenol-based curing agents, benzoxazine-based curing agents, carbodiimide-based curing agents, acid anhydride-based curing agents, amine-based curing agents, cyanate ester-based curing agents, etc. Among these, as component (E), it is preferable to include any one of active ester-based curing agents, phenol-based curing agents, carbodiimide-based curing agents, and cyanate ester-based curing agents, and it is more preferable to include active ester-based curing agents and phenol-based curing agents.

[0128] Examples of active ester-based curing agents include curing agents having one or more active ester groups per molecule. Among these, as active ester-based curing agents, compounds having two or more highly reactive ester groups per molecule, such as phenol esters, thiophenol esters, N-hydroxyamine esters, and esters of heterocyclic hydroxy compounds, are preferred. The active ester-based curing agent is preferably obtained by a condensation reaction between a carboxylic acid compound and / or a thiocarboxylic acid compound and a hydroxy compound and / or a thiol compound. In particular, from the perspective of improving heat resistance, an active ester-based curing agent obtained from a carboxylic acid compound and a hydroxy compound is preferred, and an active ester-based curing agent obtained from a carboxylic acid compound and a phenol compound and / or a naphthol compound is more preferred.

[0129] Examples of carboxylic acid compounds include benzoic acid, acetic acid, succinic acid, maleic acid, itaconic acid, phthalic acid, isophthalic acid, terephthalic acid, pyromellitic acid, etc.

[0130] Examples of phenol compounds or naphthol compounds include hydroquinone, resorcinol, bisphenol A, bisphenol F, bisphenol S, phenolphthalein, methylated bisphenol A, methylated bisphenol F, methylated bisphenol S, phenol, o-cresol, m-cresol, p-cresol, catechol, α-naphthol, β-naphthol, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, dihydroxybenzophenone, trihydroxybenzophenone, tetrahydroxybenzophenone, phloroglucine, benzenetriol, dicyclopentadiene-type diphenol compounds, phenol novolac, etc. Here, "dicyclopentadiene-type diphenol compound" refers to a diphenol compound obtained by condensing two molecules of phenol with one molecule of dicyclopentadiene.

[0131] Preferred specific examples of active ester-based curing agents include dicyclopentadiene-type active ester-based curing agents, naphthalene-type active ester-based curing agents comprising a naphthalene structure, active ester-based curing agents comprising an acetylated compound of phenol novolac, active ester-based curing agents comprising a benzoylated compound of phenol novolac, active ester-based curing agents that are acetylated compounds of phenol novolac, and active ester-based curing agents comprising a styryl group and a naphthalene structure. As a dicyclopentadiene-type active ester-based curing agent, an active ester-based curing agent comprising a dicyclopentadiene-type diphenol structure is preferred. "Dicyclopentadiene-type diphenol structure" refers to a divalent structural unit consisting of phenylene, dicyclopentylene, and phenylene. Among these, as an active ester-based curing agent, it is preferable to include a dicyclopentadiene-type active ester-based curing agent.

[0132] As commercially available active ester-based curing agents, active ester-based curing agents containing a dicyclopentadiene-type diphenol structure include “EXB9451”, “EXB9460”, “EXB9460S”, “HPC-8000L-65TM”, “HPC-8000-65T”, “EXB-8000H”, “EXB-8000L-65TM” (manufactured by DIC); active ester-based curing agents containing a naphthalene structure include “EXB-9416-70BK”, “EXB-8100L-65T”, “HPC-8150-62T”, “EXB-8100L-65T”, “EXB-8100L-65T”, “EXB-8” (manufactured by DIC); Examples of active ester-based curing agents containing phosphorus include “EXB9401” (manufactured by DIC); active ester-based curing agents containing acetylated phenol novolak include “DC808” (manufactured by Mitsubishi Chemical); active ester-based curing agents containing benzoylated phenol novolak include “YLH1026”, “YLH1030”, “YLH1048” (manufactured by Mitsubishi Chemical), and “EXB-8500-65T” (manufactured by DIC); and active ester-based curing agents containing styryl groups and naphthalene structures include “PC1300-02-65T” and “PC1300-02-65MA” (manufactured by Air Water).

[0133] Examples of phenolic curing agents include curing agents having one or more, preferably two or more, hydroxyl groups bonded to an aromatic ring (benzene ring, naphthalene ring, etc.) within one molecule. Among these, compounds having hydroxyl groups bonded to a benzene ring are preferred. Furthermore, from the perspective of heat resistance and water resistance, phenolic curing agents having a novolak structure are preferred. Additionally, from the perspective of adhesion, nitrogen-containing phenolic curing agents are preferred, and phenolic curing agents containing a triazine backbone are more preferred. In particular, from the perspective of highly satisfying heat resistance, water resistance, and adhesion, phenolic novolak curing agents containing a triazine backbone are preferred.

[0134] Specific examples of phenolic curing agents and naphthol-based curing agents include “MEH-7700”, “MEH-7810”, and “MEH-8000H” manufactured by Meiwa Kasei Co., Ltd.; “NHN”, “CBN”, and “GPH” manufactured by Nippon Kayaku Co., Ltd.; and “SN-170”, “SN-180”, “SN-190”, “SN-475”, “SN-495”, “SN-495V”, “SN-375”, and “SN-395” manufactured by Nittetsu Chemical & Material Co., Ltd. Examples include the “TD-2090”, “TD-2090-60M”, “LA-7052”, “LA-7054”, “LA-1356”, “LA-3018”, “LA-3018-50P”, “EXB-9500”, “HPC-9500”, “KA-1160”, “KA-1163”, and “KA-1165” manufactured by DIC; and the “GDP-6115L”, “GDP-6115H”, and “ELPC75” manufactured by Gunei Kagaku Co.

[0135] Specific examples of carbodiimide-based curing agents include “V-03,” “V-05,” “V-07,” and “V-11S” manufactured by Nisshinbo Chemical Co., Ltd.; and Starvacol (registered trademark) P manufactured by Rankess Co., Ltd.

[0136] Specific examples of benzoxazine-based curing agents include "ODA-BOZ" manufactured by JFE Chemical Co., Ltd., "HFB2006M" manufactured by Showa Kobun Shisha, and "Pd" and "Fa" manufactured by Shikoku Kasei Kogyo Co., Ltd.

[0137] Examples of acid anhydride-based curing agents include curing agents having one or more acid anhydride groups within one molecule. Specific examples of acid anhydride-based curing agents include phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, 4-methylhexahydrophthalic anhydride, methylhexahydrophthalic anhydride, methylnagic anhydride, hydrogenated methylnagic anhydride, trialkyltetrahydrophthalic anhydride, dodecenyl succinic anhydride, 5-(2,5-dioxotetrahydro-3-furanyl)-3-methyl-3-cyclohexene-1,2-dicarboxylic acid anhydride, trimellitic anhydride, pyrromellitic anhydride, benzophenone tetracarboxylic acid dihydride, biphenyltetracarboxylic acid dihydride, naphthalene tetracarboxylic acid dihydride, oxydiphthalic acid dihydride, Examples of polymeric acid anhydrides include 3,3'-4,4'-diphenylsulfonetetracarboxylic acid dihydride, 1,3,3a,4,5,9b-hexahydro-5-(tetrahydro-2,5-dioxo-3-furanyl)-naft[1,2-C]furan-1,3-dione, ethylene glycolbis(anhydrotrimellitate), and styrene-maleic acid resin copolymerized with styrene and maleic acid. Commercially available acid anhydride-based curing agents may be used, for example, "MH-700" manufactured by Shin Nippon Rica.

[0138] As an amine-based curing agent, a curing agent having one or more amino groups within one molecule may be used, such as aliphatic amines, polyetheramines, alicyclic amines, aromatic amines, etc. Among these, aromatic amines are preferred from the perspective of exhibiting the desired effect of the present invention. The amine-based curing agent is preferably a primary amine or a secondary amine, and a primary amine is more preferred. Specific examples of amine-based curing agents include 4,4'-methylenebis(2,6-dimethylaniline), diphenyldiaminosulfone, 4,4'-diaminodiphenylmethane, 4,4'-diaminodiphenylsulfone, 3,3'-diaminodiphenylsulfone, m-phenylenediamine, m-xylylenediamine, diethyltoluenediamine, 4,4'-diaminodiphenyl ether, 3,3'-dimethyl-4,4'-diaminobiphenyl, 2,2'-dimethyl-4,4'-diaminobiphenyl, 3,3'-dihydroxybenzidine, 2,2-bis(3-amino-4-hydroxyphenyl)propane, 3,3-dimethyl-5,5-diethyl-4,4-diphenylmethanediamine, 2,2-bis(4-aminophenyl)propane, Examples include 2,2-bis(4-(4-aminophenoxy)phenyl)propane, 1,3-bis(3-aminophenoxy)benzene, 1,3-bis(4-aminophenoxy)benzene, 1,4-bis(4-aminophenoxy)benzene, 4,4'-bis(4-aminophenoxy)biphenyl, bis(4-(4-aminophenoxy)phenyl)sulfone, bis(4-(3-aminophenoxy)phenyl)sulfone, etc. Commercially available amine-based curing agents may be used, for example, "KAYABOND C-200S", "KAYABOND C-100", "Kayahad AA", "Kayahad AB", "Kayahad AS" manufactured by Nippon Kayaku Co., Ltd., and "Epicure W" manufactured by Mitsubishi Chemical Co., Ltd.

[0139] Examples of cyanate ester-based curing agents include, for instance, difunctional cyanate resins such as bisphenol A dicyanate, polyphenol cyanate, oligo(3-methylene-1,5-phenylene cyanate), 4,4'-methylenebis(2,6-dimethylphenylcyanate), 4,4'-ethylidene diphenyl dicyanate, hexafluorobisphenol A dicyanate, 2,2-bis(4-cyanate)phenylpropane, 1,1-bis(4-cyanatephenylmethane), bis(4-cyanate-3,5-dimethylphenyl)methane, 1,3-bis(4-cyanatephenyl-1-(methylethylidene))benzene, bis(4-cyanatephenyl)thioether, and bis(4-cyanatephenyl)ether; polyfunctional cyanate resins derived from phenol novolak and cresol novolak; and prepolymers in which these cyanate resins are partially triazinated. Specific examples of cyanate ester-based curing agents include “PT30” and “PT60” manufactured by Arxada (both are phenol-novolak type polyfunctional cyanate ester resins); “ULL-950S” (polyfunctional cyanate ester resin); “BA230” and “BA230S75” (prepolymers in which part or all of bisphenol A dicyanate is triazinated to form a trimer); etc.

[0140] When the number of epoxy groups of component (B) is 1, the number of active groups of the curing agent (E) is preferably 0.1 or more, more preferably 0.05 or more, even more preferably 0.1 or more, preferably 10 or less, more preferably 5 or less, and even more preferably 3 or less. Here, "number of epoxy groups of component (B)" is the sum of the values ​​obtained by dividing the mass of the non-volatile component of component (B) present in the resin composition by the epoxy equivalent. Also, "number of active groups of the curing agent (E)" is the sum of the values ​​obtained by dividing the mass of the non-volatile component of the curing agent (E) present in the resin composition by the active group equivalent.

[0141] (E) The content of the component is preferably 1 mass% or more, more preferably 3 mass% or more, even more preferably 5 mass% or more, when the non-volatile component in the resin composition is 100 mass%, in order to obtain a cured product with excellent adhesion and suppressed non-uniformity on the surface of the insulating layer, and preferably 25 mass% or less, more preferably 20 mass% or less, even more preferably 15 mass% or less, or 10 mass% or less.

[0142] (E) The content of the component is preferably 10 mass% or more, more preferably 15 mass% or more, even more preferably 20 mass% or more, and preferably 55 mass% or less, more preferably 50 mass% or less, even more preferably 45 mass% or less, 40 mass% or less, or 35 mass% or less, when the resin component of the resin composition is 100 mass%, in order to obtain a cured product with excellent adhesion and suppressed non-uniformity on the surface of the insulating layer.

[0143] The content of component (A) when the non-volatile component in the resin composition is set to 100 mass% is M A Let it be, and the content of component (E) when the non-volatile component in the resin composition is 100 mass% is M E When done as, M A / M E a, preferably 0.01 or more, more preferably 0.1 or more, even more preferably 0.2 or more, 0.3 or more, or 0.4 or more, and preferably 3 or less, more preferably 2 or less, even more preferably 1.5 or less, 1 or less, 0.9 or less, or 0.8 or less. M A / M E By adjusting the ratio of component (A) and component (E) so that they fall within this range, the effects of the present invention can be significantly obtained.

[0144] <(F) Polymer resin with a weight-average molecular weight greater than 5000>

[0145] The resin composition may contain, as component (F), a polymer resin with a weight-average molecular weight greater than 5000. The polymer resin with a weight-average molecular weight greater than 5000 as component (F) is excluded from the components (A) to (E) described above. The polymer resin with a weight-average molecular weight greater than 5000 may be used as a single type or in combination of two or more types.

[0146] (F) The polymer resin has a large weight-average molecular weight because it is a polymer. (F) The range of the weight-average molecular weight of the component is greater than 5,000, preferably 8,000 or more, more preferably 10,000 or more. The upper limit is 1,000,000 or less, preferably 500,000 or less, more preferably 300,000 or less, even more preferably 200,000 or less, 100,000 or less, 50,000 or less, or 30,000 or less. The weight-average molecular weight can be measured as a polystyrene equivalent value by the GPC method.

[0147] (F) As a polymer resin with a weight-average molecular weight greater than 5000, for example, as a component (F-1), a polymer having a glass transition temperature Tg of 25°C or lower, or being in a liquid state at 25°C or lower may be used. (F-1) A polymer having a glass transition temperature Tg of 25°C or lower, or being in a liquid state at 25°C or lower, does not include those corresponding to components (A) to (E) described above. (F-1) A polymer having a glass transition temperature Tg of 25°C or lower, or being in a liquid state at 25°C or lower, may be used as a single type or in combination of two or more types.

[0148] In the case where component (F-1) is a polymer having a glass transition temperature Tg of 25°C or lower, the glass transition temperature Tg of said component (F-1) is 25°C or lower, preferably 20°C or lower, more preferably 15°C or lower. The lower limit of the glass transition temperature Tg is not particularly limited, but may preferably be -30°C or higher, more preferably -20°C or higher, even more preferably -15°C or higher, or -10°C or higher. In the case where component (F-1) is a polymer that is in a liquid phase at 25°C or lower, said component (F-1) is preferably in a liquid phase at 25°C, in a liquid phase at 20°C, and more preferably in a liquid phase at 15°C. The glass transition temperature Tg can be measured by DSC (differential scanning calorimetry) at a heating rate of 5°C / min.

[0149] Since component (F-1) is a polymer, it typically has a large weight-average molecular weight. The range of the weight-average molecular weight Mw of component (F-1) is greater than 5,000, preferably 8,000 or more, and more preferably 10,000 or more. The upper limit is 1,000,000 or less, preferably 500,000 or less, more preferably 300,000 or less, even more preferably 200,000 or less, 100,000 or less, 50,000 or less, or 30,000 or less. The weight-average molecular weight can be measured as a polystyrene equivalent value by the GPC method.

[0150] The component (F-1) has a low elastic modulus. Therefore, it is desirable that the component (F-1) be a low-elasticity polymer. Specifically, when a tensile test is performed in accordance with the Japanese Industrial Standard (JIS K7161) at a temperature of 25°C and a humidity of 40% RH, the component (F-1) typically exhibits an elastic modulus of 1 GPa or less. The range of the elastic modulus of the component (F-1) is, in detail, typically 1 GPa or less, preferably 0.9 GPa or less, more preferably 0.8 GPa or less, even more preferably 0.7 GPa or less, preferably 0.01 GPa or more, more preferably 0.03 GPa or more, even more preferably 0.05 GPa or more, and particularly preferably 0.1 GPa or more.

[0151] As for the (F-1) component, a resin containing one or more selected from the group consisting of polybutadiene structure, polycarbonate structure, polyalkylene structure, polyalkyleneoxy structure, polysiloxane structure, poly(meth)acrylate structure, polyisoprene structure, polyisobutylene structure, and polystyrene structure is preferred. The term "(meth)acrylate" includes acrylates and methacrylates and combinations thereof. These structures may be included in the main chain or in the side chain. These structures can function as a flexible molecular framework because the restriction on atomic movement due to interatomic bonds included in the structure is small, and the range of possible changes in bond angles and rotations is wide. Therefore, the (F-1) component can be easily obtained as a resin containing these structures. Among these, a resin containing one or more selected from the group consisting of polybutadiene structure, polycarbonate structure, and polyalkylene structure is more preferred.

[0152] A resin containing a polybutadiene structure is sometimes referred to as a "polybutadiene resin." The polybutadiene structure may be partially or entirely hydrogenated. Examples of polybutadiene resins include a resin containing a hydrogenated polybutadiene backbone, a polybutadiene resin containing a hydroxyl group, a polybutadiene resin containing a phenolic hydroxyl group, a polybutadiene resin containing a carboxyl group, a polybutadiene resin containing an acid anhydride group, a polybutadiene resin containing an epoxy group, a polybutadiene resin containing an isocyanate group, a polybutadiene resin containing a urethane group, a polyphenylene ether-polybutadiene resin, etc.

[0153] Specific examples of polybutadiene resins include “Ricon 130MA8”, “Ricon 130MA13”, “Ricon 130MA20”, “Ricon 131MA5”, “Ricon 131MA10”, “Ricon 131MA17”, “Ricon 131MA20”, and “Ricon 184MA6” (polybutadiene containing acid anhydride groups) manufactured by Clay Valley Corporation; “GQ-1000” (polybutadiene with hydroxyl and carboxyl groups introduced), “G-1000”, “G-2000”, and “G-3000” (polybutadiene with hydroxyl groups at both ends), and “GI-1000”, “GI-2000”, and “GI-3000” (polybutadiene with hydrogenated hydroxyl groups at both ends) manufactured by Nippon Soda Corporation; Examples include "FCA-061L" (hydrogenated polybutadiene backbone epoxy resin) manufactured by Nagase Chemtex Co., Ltd.

[0154] In addition, specific examples of polybutadiene resins include polyimide resins having polybutadiene structures, urethane structures, and imide structures within the molecule. The polyimide resin can be manufactured as a linear polyimide resin (polyimide described in Japanese Patent Publication No. JP 2006-37083 and International Publication No. 2008 / 153208) using hydroxyl-terminated polybutadiene, a diisocyanate compound, and a tetrabasic acid anhydride as raw materials. The content of the butadiene structure of the polyimide resin is preferably 60 mass% to 95 mass%, more preferably 75 mass% to 85 mass%. Details of the above polyimide resin may be taken into account from the descriptions in Japanese Patent Publication No. JP 2006-37083 and International Publication No. 2008 / 153208, and the contents thereof are incorporated into this specification.

[0155] A resin containing a polycarbonate structure is sometimes referred to as a "polycarbonate resin." Examples of polycarbonate resins include hydroxyl group-containing carbonate resin, phenolic hydroxyl group-containing carbonate resin, carboxyl group-containing carbonate resin, acid anhydride group-containing carbonate resin, isocyanate group-containing carbonate resin, urethane group-containing carbonate resin, etc.

[0156] Specific examples of polycarbonate resins include “FPC0220” manufactured by Mitsubishi and Kagaku; “T6002” and “T6001” (polycarbonate diol) manufactured by Asahi Kasei; and “C-1090”, “C-2090” and “C-3090” (polycarbonate diol) manufactured by Kuraray.

[0157] In addition, specific examples of polycarbonate resins include polyimide resins having an imide structure, a urethane structure, and a polycarbonate structure within the molecule. The polyimide resin may be manufactured as a linear polyimide resin using hydroxyl-terminated polycarbonates, diisocyanate compounds, and tetrabasic acid anhydrides as raw materials. The content of the carbonate structure of the polyimide resin is preferably 60 mass% to 95 mass%, more preferably 75 mass% to 85 mass%. Details of the polyimide resin may be referenced in the description of International Publication No. 2016 / 129541, the contents of which are incorporated herein.

[0158] A resin containing a polyalkylene structure is sometimes referred to as a "polyalkylene resin." As a polyalkylene resin, a resin containing an alkylene chain in a repeating unit may be used. The number of carbon atoms in said alkylene chain is preferably 2 or more, more preferably 3 or more, even more preferably 5 or more, and even more preferably 7 or more. The upper limit may be, for example, 36 or less, 15 or less, 10 or less, 8 or less, etc. As this polyalkylene resin, a resin containing a carbon skeleton derived from a dimer acid in a repeating unit is preferred.

[0159] A carbon skeleton derived from a dimer acid refers to a skeleton of divalent groups formed by excluding the two terminal carboxyl groups (-COOH) of the dimer acid. Dimer acids are known compounds obtained by dimerizing unsaturated fatty acids (preferably those having 11 to 22 carbon atoms, more preferably those having 18 carbon atoms), and their industrial manufacturing processes are largely standardized in the industry. Dimer acids are readily available when they consist mainly of 36-carbon dimer acids obtained by dimerizing unsaturated fatty acids having 18 carbon atoms, such as oleic acid and linoleic acid, which are particularly inexpensive and readily available. Furthermore, depending on the manufacturing method and the degree of purification, dimer acids may contain arbitrary amounts of monomeric acids, trimeric acids, other polymerized fatty acids, etc. Additionally, although double bonds remain after the polymerization reaction of unsaturated fatty acids, hydrogenated products in which the degree of unsaturation is further reduced by a hydrogenation reaction are also included in the dimer acid.

[0160] A polyalkylene resin containing a carbon skeleton derived from dimer acid generally comprises a divalent hydrocarbon group, wherein the divalent hydrocarbon group comprises a carbon skeleton derived from dimer acid. The divalent hydrocarbon group comprising a carbon skeleton derived from dimer acid typically has a long aliphatic carbon chain with 7 or more carbon atoms, and the alkylene chain is included in the long aliphatic carbon chain. The number of carbon atoms in the divalent hydrocarbon group comprising a carbon skeleton derived from dimer acid may be 36.

[0161] Specific examples of polyalkylene resins containing a carbon skeleton derived from dimer acid include polyimide resins containing a carbon skeleton derived from dimer acid. Examples of such polyimide resins include resins obtained by the imidation reaction of a dimer acid-type diamine and a tetracarboxylic acid anhydride. A dimer acid-type diamine refers to a diamine compound having a structure in which two terminal carboxyl groups (-COOH) of the dimer acid are substituted with aminomethyl groups (-CH2-NH2) or amino groups (-NH2). Examples of dimer acid-type diamines include “PRIAMINE 1073,” “PRIAMINE 1074,” and “PRIAMINE 1075” manufactured by Cloda Japan; and “Versamin 551” and “Versamin 552” manufactured by Cognis Japan. In addition, as the tetracarboxylic acid anhydride, an aliphatic tetracarboxylic acid dihydride may be used, an aromatic tetracarboxylic acid dihydride may be used, or a combination thereof may be used.

[0162] A resin containing a polyalkyleneoxy structure may be referred to as a "polyalkyleneoxy resin." The number of carbon atoms in the alkyleneoxy structure contained in the polyalkyleneoxy resin is preferably 2 to 15, more preferably 3 to 10, and even more preferably 5 to 8. Specific examples of alkyleneoxy resins include "EXA-4850-150," "EXA-4816," and "EXA-4822" manufactured by DIC; "EP-4000," "EP-4003," "EP-4010," and "EP-4011" manufactured by ADEKA; "BEO-60E" and "BPO-20E" manufactured by Shin Nippon Rica; and "YL7175" and "YL7410" manufactured by Mitsubishi Chemical.

[0163] A resin containing a polysiloxane structure is sometimes referred to as a "polysiloxane resin." Examples of polysiloxane resins include "SMP-2006," "SMP-2003PGMEA," and "SMP-5005PGMEA" manufactured by Shin-Etsu Silicon Co., Ltd.; linear polyimides made from amine-terminated polysiloxanes and tetrabasic acid anhydrides (International Publication No. 2010 / 053185, Japanese Patent Publication No. 2002-12667 and Japanese Patent Publication No. 2000-319386, etc.).

[0164] A resin containing a poly(meth)acrylate structure is sometimes referred to as a "poly(meth)acrylate resin." Examples of poly(meth)acrylate resins include Teisan Resin manufactured by Nagase Chemtex; "ME-2000," "W-116.3," "W-197C," "KG-25," and "KG-3000" manufactured by Negami Kogyo; and "ARUFON UH-2000" manufactured by Doagosei.

[0165] Resins containing a polyisoprene structure are sometimes referred to as "polyisoprene resins." Specific examples of polyisoprene resins include "KL-610" and "KL613" manufactured by Kuraray.

[0166] A resin containing a polyisobutylene structure is sometimes referred to as "polyisobutylene resin." Specific examples of polyisobutylene resin include "SIBSTER-073T" (styrene-isobutylene-styrene triblock copolymer) and "SIBSTAR-042D" (styrene-isobutylene diblock copolymer) manufactured by Kaneka.

[0167] A resin containing a polystyrene structure is sometimes referred to as "polystyrene resin." Polystyrene resin may be a copolymer containing any repeating unit different from the styrene unit in combination with the styrene unit, or hydrogenated polystyrene resin. Examples of polystyrene resins include styrene-butadiene-styrene block copolymer (SBS), styrene-isoprene-styrene block copolymer (SIS), styrene-ethylene-butylene-styrene block copolymer (SEBS), styrene-ethylene-propylene-styrene block copolymer (SEPS), styrene-ethylene-ethylene-propylene-styrene block copolymer (SEEPS), styrene-butadiene-butylene-styrene block copolymer (SBBS), styrene-butadiene diblock copolymer, hydrogenated styrene-butadiene block copolymer, hydrogenated styrene-butadiene block copolymer, hydrogenated styrene-isoprene block copolymer, hydrogenated styrene-butadiene random copolymer, styrene-maleic anhydride copolymer, etc.

[0168] Specific examples of polystyrene resins include hydrogenated styrene-based thermoplastic elastomers “S1606”, “H1041”, “Tufftec H1043”, “Tufftec P2000”, and “Tufftec MP10” (manufactured by Asahi Kasei); epoxidized styrene-butadiene thermoplastic elastomers “Epoprend AT501” and “CT310” (manufactured by Daicel); modified styrene-based elastomer having hydroxyl groups “Septon HG252” (manufactured by Kuraray); modified styrene-based elastomer having carboxyl groups “Tufftec N503M”, modified styrene-based elastomer having amino groups “Tufftec N501”, and modified styrene-based elastomer having acid anhydride groups “Tufftec M1913” (manufactured by Asahi Kasei); Examples include the unmodified styrene-based elastomer "Septon S8104" (manufactured by Kuraray); the styrene-ethylene / butylene-styrene block copolymer "FG1924" (manufactured by Kraton) and "EF-40" (manufactured by CRAY VALLEY).

[0169] It is preferable that component (F-1) has a functional group capable of reacting with the epoxy resin (B). This is because having a functional group capable of reacting with the epoxy resin (B) can increase the mechanical strength of the cured product of the resin composition. The functional group capable of reacting with the epoxy resin includes a functional group that appears upon heating. Examples of such functional groups include a hydroxyl group, a carboxyl group, an acid anhydride group, a phenolic hydroxyl group, an epoxy group, an isocyanate group, a urethane group, and a maleimide group (2,5-dihydro-2,5-dioxo-1H-pyrrole-1-yl group). Among these, a hydroxyl group, an acid anhydride group, a phenolic hydroxyl group, an epoxy group, an isocyanate group, a urethane group, and a maleimide group are preferred, and a phenolic hydroxyl group is more preferred.

[0170] (F-1) When the component has a functional group, the functional group equivalent is preferably 100 g / eq. or more, more preferably 200 g / eq. or more, even more preferably 300 g / eq. or more, preferably 200,000 g / eq. or less, more preferably 150,000 g / eq. or less, even more preferably 50,000 g / eq. or less, 10,000 g / eq. or less, or 5,000 g / eq. or less. In addition, the functional group equivalent is the number of grams of resin containing 1 gram equivalent of a functional group. For example, the epoxy group equivalent can be measured according to JIS K7236. The hydroxyl group equivalent can be calculated by dividing the molecular weight of KOH by the hydroxyl group value measured according to JIS K1557-1. In the case of having multiple types of functional groups, the functional group capable of reacting with the epoxy resin having the entire (F-1) component can be calculated from each calculated value, and the functional group equivalent can be calculated.

[0171] It is desirable that component (F-1) have a large number average molecular weight. The specific number average molecular weight (Mn) of component (F-1) is preferably 1,000 or more, more preferably 1,500 or more, even more preferably 3,000 or more, and particularly preferably 5,000 or more. The upper limit is preferably 1,000,000 or less, more preferably 900,000 or less. The number average molecular weight (Mn) is the number average molecular weight in polystyrene equivalent measured using GPC (gel permeation chromatography).

[0172] (F) As a polymer resin with a weight-average molecular weight greater than 5000, (F-2) thermoplastic resin may be used as component (F-2). (F-2) thermoplastic resin does not include components (A) to (E) and component (F-1) described above. (F-2) thermoplastic resin may be used as a single type or in combination of two or more types.

[0173] (F-2) Examples of thermoplastic resins include phenoxy resin, polyvinyl acetal resin, polyolefin resin, polybutadiene resin, polyimide resin, polyamideimide resin, polyetherimide resin, polysulfone resin, polyethersulfone resin, polyphenylene ether resin, polyester resin, polystyrene resin, etc. (F-2) One type of thermoplastic resin may be used alone, or two or more types may be used in combination. (F-2) Phenoxy resin is preferred as the thermoplastic resin.

[0174] Examples of phenoxy resins include phenoxy resins having one or more skeletons selected from the group consisting of bisphenol A skeleton, bisphenol F skeleton, bisphenol S skeleton, bisphenol acetophenone skeleton, novolac skeleton, biphenyl skeleton, fluorene skeleton, dicyclopentadiene skeleton, norbornene skeleton, naphthalene skeleton, anthracene skeleton, adamantane skeleton, terpene skeleton, and trimethylcyclohexane skeleton. The terminals of the phenoxy resin may be any functional group, such as phenolic hydroxyl groups or epoxy groups. Specific examples of phenoxy resins include "1256" and "4250" manufactured by Mitsubishi Chemical Corporation (both phenoxy resins containing a bisphenol A skeleton); and "YX8100" manufactured by Mitsubishi Chemical Corporation (phenoxy resin containing a bisphenol S skeleton). Examples include “YX6954” (bisphenol-acetophenone backbone containing phenoxy resin) manufactured by Mitsubishi Chemical Corporation; “FX280” and “FX293” manufactured by Nittetsu Chemical & Materials Corporation; “YL7500BH30”, “YX6954BH30”, “YX7553”, “YX7553BH30”, “YL7769BH30”, “YL6794”, “YL7213”, “YL7290”, “YL7482” and “YL7891BH30” manufactured by Mitsubishi Chemical Corporation.

[0175] Specific examples of polyimide resins include “PIAD200” manufactured by Arakawa Chemical Co., Ltd., “SLK-6100” manufactured by Shin-Etsu Chemical Co., Ltd., and “Ricacoat SN20” and “Ricacoat PN20” manufactured by Shin-Nippon Rica Co., Ltd. Specific examples of these polyimide resins also include modified polyimide resins such as linear polyimide resin obtained by reacting a difunctional hydroxyl-terminated polybutadiene, a diisocyanate compound, and a tetrabasic acid anhydride (polyimide resin described in Japanese Patent Publication No. 2006-37083), and polyimide resin containing a polysiloxane backbone (polyimide resin described in Japanese Patent Publication No. 2002-12667 and Japanese Patent Publication No. 2000-319386, etc.).

[0176] Examples of polyvinyl acetal resins include polyvinyl formal resin and polyvinyl butyral resin, and polyvinyl butyral resin is preferred. Specific examples of polyvinyl acetal resins include the S-Rec BH series, BX series (e.g., BX-5Z), KS series (e.g., KS-1), BL series, BM series manufactured by Sekisui Kagaku Kogyo Co., Ltd.

[0177] Examples of polyolefin resins include ethylene-based copolymer resins such as low-density polyethylene, ultra-low-density polyethylene, high-density polyethylene, ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, and ethylene-methyl acrylate copolymer; and polyolefin-based polymers such as polypropylene and ethylene-propylene block copolymer.

[0178] Examples of polybutadiene resins include, for instance, a resin containing a hydrogenated polybutadiene backbone, a polybutadiene resin containing a hydroxyl group, a polybutadiene resin containing a phenolic hydroxyl group, a polybutadiene resin containing a carboxyl group, a polybutadiene resin containing an acid anhydride group, a polybutadiene resin containing an epoxy group, a polybutadiene resin containing an isocyanate group, a polybutadiene resin containing a urethane group, and a polyphenylene ether-polybutadiene resin.

[0179] Specific examples of polyamideimide resins include "Viromax HR11NN" and "Viromax HR16NN" manufactured by Toyobo Corporation. Specific examples of polyamideimide resins also include modified polyamideimides such as "KS9100" and "KS9300" (polyamideimide containing a polysiloxane backbone) manufactured by Resonac.

[0180] Specific examples of polyethersulfone resins include "PES5003P" manufactured by Sumitomo Chemicals.

[0181] Specific examples of polysulfone resins include the polysulfones "P1700" and "P3500" manufactured by Solvay Advanced Polymers.

[0182] The polyphenylene ether resin may be a copolymer of polyphenylene ether and polybutadiene. Specific examples of polyetherimide resins include "Ultem" manufactured by GE.

[0183] Examples of polystyrene-based resins include unmodified polystyrene resin, oxazoline group-containing modified polystyrene resin, and styrene block copolymers. Examples of styrene block copolymers include styrene-isoprene-styrene block copolymer (SIS resin), styrene-ethylene-butylene-styrene block copolymer (SEBS resin), styrene-ethylene-propylene-styrene block copolymer (SEPS resin), styrene-butadiene-styrene block copolymer (SBS resin), and styrene-isobutylene-styrene block copolymer (SIBS resin). Specific examples of polystyrene-based resins include "PX3-RP-37", "PX-3-RP-61", and "RP-RX-61" (oxazoline group-containing modified polystyrene resins) manufactured by Nippon Shokubai; "HYBAR 5125" (SIS resin) manufactured by Kuraray; "S1611" (SEBS resin) manufactured by Asahi Kasei; "H1041", "Tufftec H1043", "Tufftec P2000", "Tufftec MP10" (hydrogenated styrene-based polymer resins) manufactured by Asahi Kasei; "Epoprend AT501", "CT310" (epoxylated styrene-butadiene polymer resins) manufactured by Daicel; "Septon HG252" (hydroxyl group modified polystyrene resin) manufactured by Kuraray; "Tufftec N503M" (carboxyl group modified polystyrene resin) manufactured by Asahi Kasei; "Tufftec N501" (amino group modified polystyrene resin) manufactured by Asahi Kasei; Examples include "Toughtec M1913" (modified polystyrene resin containing acid anhydride groups) manufactured by Asahi Kasei; "Septon S8104" (unmodified polystyrene resin) manufactured by Kuraray; "FG1924" (styrene-ethylene / butylene-styrene block copolymer) manufactured by Kraton; and "EF-40" (manufactured by CRAY VALLEY).

[0184] Examples of polyester resins include polyethylene terephthalate resin, polyethylene naphthalate resin, polybutylene terephthalate resin, polybutylene naphthalate resin, polytrimethylene terephthalate resin, polytrimethylene naphthalate resin, polycyclohexanedimethyl terephthalate resin, etc.

[0185] (F) The content of the polymer resin is preferably 1 mass% or more, more preferably 1.5 mass% or more, even more preferably 2 mass% or more, when the non-volatile component of the resin composition is 100 mass%, and preferably 20 mass% or less, more preferably 15 mass% or less, even more preferably 10 mass% or less, 8 mass% or less, or 5 mass% or less.

[0186] (F) The content of the polymer resin is preferably 1 mass% or more, more preferably 3 mass% or more, even more preferably 5 mass% or more, preferably 25 mass% or less, more preferably 23 mass% or less, even more preferably 22 mass% or less, 20 mass% or less, or 10 mass% or less, when the resin component in the resin composition is 100 mass%.

[0187] <(G) Organic Filler>

[0188] The resin composition may contain an organic filler (G) as a component (G). The organic filler (G) as a component (G) is excluded from the components (A) to (F) described above. The organic filler (G) is typically included in the resin composition in a particle state without being incompatible with resin components other than the organic filler (G), and is also included in the cured product while maintaining the particle state without dissolving in a solvent. Furthermore, the organic filler (G) may be used as a single type or in combination of two or more types.

[0189] (G) As an organic filler, particles of an organic material may be used. (G) As an organic material included in the organic filler, a rubber component is preferred. As a rubber component, for example, a silicone-based elastomer such as polydimethylsiloxane; an olefin-based thermoplastic elastomer such as polybutadiene, polyisoprene, polychlorobutadiene, ethylene-vinyl acetate copolymer, styrene-butadiene copolymer, styrene-isoprene copolymer, styrene-isobutylene copolymer, acrylonitrile-butadiene copolymer, isoprene-isobutylene copolymer, isobutylene-butadiene copolymer, ethylene-propylene-diene ternary copolymer, ethylene-propylene-butene ternary copolymer; Examples of thermoplastic elastomers include acrylic thermoplastic elastomers such as poly(meth)acrylate propyl, poly(meth)acrylate butyl, poly(meth)acrylate cyclohexyl, and poly(meth)acrylate octyl. Additionally, silicone-based rubbers such as polyorganosiloxane rubber may be mixed into the rubber component. The rubber component contained in the rubber particles has a glass transition temperature of, for example, 0°C or lower, preferably -10°C or lower, more preferably -20°C or lower, and even more preferably -30°C or lower.

[0190] (G) The organic filler may be a core-shell type rubber particle comprising a core particle containing the rubber component mentioned above and a shell portion formed by graft copolymerizing a monomer component copolymerizable with the rubber component contained in the core particle. Here, the term "core-shell type" does not necessarily refer only to cases where the core particle and the shell portion can be clearly distinguished, but also includes cases where the boundary between the core particle and the shell portion is indistinct, and the core particle does not need to be completely covered by the shell portion.

[0191] (G) Specific examples of organic fillers include, for example, “CHT” manufactured by Samsung SDI; “B602” manufactured by Techno UMG; "Pararoid EXL-2602", "Pararoid EXL-2603", "Pararoid EXL-2655", "Pararoid EXL-2311", "Pararoid-EXL2313", "Pararoid EXL-2315", "Pararoid KM-330", "Pararoid KM-336P", "Pararoid KCZ-201" manufactured by Dow Corporation; "Metablen C-223A", "Metablen E-901", "Metablen S-2001", "Metablen W-450A", "Metablen SRK-200" manufactured by Mitsubishi Rayon Corporation; "Kane-Ace M-511", "Kane-Ace M-600", "Kane-Ace M-400", "Kane-Ace" manufactured by Kaneka Corporation Examples include "M-580", "Kane Ace MR-01", "Starphiloid AC3355", "Starphiloid AC3816", "Starphiloid AC3816N", "Starphiloid AC3832", "Starphiloid AC4030", and "Starphiloid AC3364" manufactured by Aika High School.

[0192] (G) The content of organic filler is preferably 0.1 mass% or more, more preferably 0.5 mass% or more, even more preferably 1 mass% or more, and preferably 15 mass% or less, more preferably 13 mass% or less, even more preferably 10 mass% or less, and 8 mass% or less, when the non-volatile component in the resin composition is 100 mass%.

[0193] (G) The content of organic filler is preferably 0.1 mass% or more, more preferably 1 mass% or more, even more preferably 1.5 mass% or more, preferably 5 mass% or less, more preferably 4.5 mass% or less, even more preferably 4 mass% or less, or 3 mass% or less, when the resin component in the resin composition is 100 mass%.

[0194] <(H) Curing Accelerator>

[0195] The resin composition may include a (H) curing accelerator as a (H) component. The (H) curing accelerator as the (H) component is excluded if it corresponds to components (A) to (G). The (H) curing accelerator can act as a catalyst in the reaction of the (B) epoxy resin to accelerate the curing of the resin composition.

[0196] (H) Examples of curing accelerators include phosphorus-based curing accelerators, urea-based curing accelerators, guanidine-based curing accelerators, imidazole-based curing accelerators, metal-based curing accelerators, amine-based curing accelerators, etc. (H) One type of curing accelerator may be used alone, or two or more types may be used in combination.

[0197] As phosphorus-based curing accelerators, for example, aliphatic phosphonium salts such as tetrabutylphosphonium bromide, tetrabutylphosphonium chloride, tetrabutylphosphonium acetate, tetrabutylphosphonium decanoate, tetrabutylphosphonium laurate, bis(tetrabutylphosphonium)pyromellitate, tetrabutylphosphonium hydrogen hexahydrophthalate, tetrabutylphosphonium 2,6-bis[(2-hydroxy-5-methylphenyl)methyl]-4-methylphenolate, and di-tert-butyldimethylphosphonium tetraphenylborate; Aromatic phosphonium salts such as methyltriphenylphosphonium bromide, ethyltriphenylphosphonium bromide, propyltriphenylphosphonium bromide, butyltriphenylphosphonium bromide, benzyltriphenylphosphonium chloride, tetraphenylphosphonium bromide, p-tolyltriphenylphosphonium tetra-p-tolylborate, tetraphenylphosphonium tetraphenylborate, tetraphenylphosphonium tetrap-tolylborate, triphenylethylphosphonium tetraphenylborate, tris(3-methylphenyl)ethylphosphonium tetraphenylborate, tris(2-methoxyphenyl)ethylphosphonium tetraphenylborate, (4-methylphenyl)triphenylphosphonium thiocyanate, tetraphenylphosphonium thiocyanate, butyltriphenylphosphonium thiocyanate, etc.; aromatic phosphine-borane complexes such as triphenylphosphine-triphenylborane; Aromatic phosphine-quinone addition products such as triphenylphosphine·p-benzoquinone addition products; aliphatic phosphines such as tributylphosphine, tri-tertiary-butylphosphine, trioctylphosphine, di-tertiary-butyl(2-butenyl)phosphine, di-tertiary-butyl(3-methyl-2-butenyl)phosphine, and tricyclohexylphosphine;Dibutylphenylphosphine, di-tertiary-butylphenylphosphine, methyldiphenylphosphine, ethyldiphenylphosphine, butyldiphenylphosphine, diphenylcyclohexylphosphine, triphenylphosphine, tri-o-tolylphosphine, tri-m-tolylphosphine, tri-p-tolylphosphine, tris(4-ethylphenyl)phosphine, tris(4-propylphenyl)phosphine, tris(4-isopropylphenyl)phosphine, tris(4-butylphenyl)phosphine, tris(4-tertiary-butylphenyl)phosphine, tris(2,4-dimethylphenyl)phosphine, tris(2,5-dimethylphenyl)phosphine, tris(2,6-dimethylphenyl)phosphine, tris(3,5-dimethylphenyl)phosphine, tris(2,4,6-trimethylphenyl)phosphine, tris(2,6-dimethyl-4-ethoxyphenyl)phosphine, Examples include aromatic phosphines such as tris(2-methoxyphenyl)phosphine, tris(4-methoxyphenyl)phosphine, tris(4-ethoxyphenyl)phosphine, tris(4-tertiary-butoxyphenyl)phosphine, diphenyl-2-pyridylphosphine, 1,2-bis(diphenylphosphino)ethane, 1,3-bis(diphenylphosphino)propane, 1,4-bis(diphenylphosphino)butane, 1,2-bis(diphenylphosphino)acetylene, and 2,2'-bis(diphenylphosphino)diphenyl ether.

[0198] As urea-based curing accelerators, for example, 1,1-dimethylurea; aliphatic dimethylureas such as 1,1,3-trimethylurea, 3-ethyl-1,1-dimethylurea, 3-cyclohexyl-1,1-dimethylurea, 3-cyclooctyl-1,1-dimethylurea; 3-phenyl-1,1-dimethylurea, 3-(4-chlorophenyl)-1,1-dimethylurea, 3-(3,4-dichlorophenyl)-1,1-dimethylurea, 3-(3-chloro-4-methylphenyl)-1,1-dimethylurea, 3-(2-methylphenyl)-1,1-dimethylurea, 3-(4-methylphenyl)-1,1-dimethylurea, 3-(3,4-dimethylphenyl)-1,1-dimethylurea, 3-(4-isopropylphenyl)-1,1-dimethylurea, 3-(4-methoxyphenyl)-1,1-dimethylurea, 3-(4-nitrophenyl)-1,1-dimethylurea, 3-[4-(4-methoxyphenoxy)phenyl]-1,1-dimethylurea, 3-[4-(4-chlorophenoxy)phenyl]-1,1-dimethylurea, Examples of aromatic dimethylureas include 3-[3-(trifluoromethyl)phenyl]-1,1-dimethylurea, N,N-(1,4-phenylene)bis(N',N'-dimethylurea), N,N-(4-methyl-1,3-phenylene)bis(N',N'-dimethylurea)[toluenebisdimethylurea].

[0199] As guanidine-based curing accelerators, for example, dicyandiamide, 1-methylguanidine, 1-ethylguanidine, 1-cyclohexylguanidine, 1-phenylguanidine, 1-(o-tolyl)guanidine, dimethylguanidine, diphenylguanidine, trimethylguanidine, tetramethylguanidine, pentamethylguanidine, 1,5,7-triazabicyclo[4.4.0]deca-5-en, 7-methyl-1,5,7-triazabicyclo[4.4.0]deca-5-en, 1-methylbiguanide, 1-ethylbiguanide, 1-n-butylbiguanide, 1-n-octadecylbiguanide, 1,1-dimethylbiguanide, 1,1-diethylbiguanide, 1-cyclohexylbiguanide, 1-allylbiguanide, Examples include 1-phenylbiguanide, 1-(o-tolyl)biguanide, etc.

[0200] As imidazole-based curing accelerators, for example, 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazolium trimellitate, 1-Cyanoethyl-2-phenylimidazolium trimellitate, 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-undecylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-ethyl-4'-methylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s-triazine isocyanuric acid adduct, 2-phenylimidazole isocyanuric acid adduct, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, Examples include imidazole compounds such as 2,3-dihydro-1H-pyrrolo[1,2-a]benzimidazole, 1-dodecyl-2-methyl-3-benzylimidazolium chloride, 2-methylimidazoline, and 2-phenylimidazoline, as well as adducts of imidazole compounds and epoxy resins. Examples of commercially available imidazole-based curing accelerators include “1B2PZ”, “2E4MZ”, “2MZA-PW”, “2MZ-OK”, “2MA-OK”, “2MA-OK-PW”, “2PHZ”, “2PHZ-PW”, “Cl1Z”, “Cl1Z-CN”, “Cl1Z-CNS”, and “C11Z-A” manufactured by Shikoku Kasei Kogyo Co., Ltd.; and “P200-H50” manufactured by Mitsubishi Chemical Co., Ltd.

[0201] Examples of metal-based hardening accelerators include organometallic complexes or organometallic salts of metals such as cobalt, copper, zinc, iron, nickel, manganese, and tin. Specific examples of organometallic complexes include organic cobalt complexes such as cobalt(II) acetylacetonate and cobalt(III) acetylacetonate, organic copper complexes such as copper(II) acetylacetonate, organic zinc complexes such as zinc(II) acetylacetonate, organic iron complexes such as iron(III) acetylacetonate, organic nickel complexes such as nickel(II) acetylacetonate, and organic manganese complexes such as manganese(II) acetylacetonate. Examples of organometallic salts include zinc octylate, tin octylate, zinc naphthenate, cobalt naphthenate, tin stearate, and zinc stearate.

[0202] Examples of amine-based curing accelerators include trialkylamines such as triethylamine and tributylamine, 4-dimethylaminopyridine, benzyldimethylamine, 2,4,6-tris(dimethylaminomethyl)phenol, and 1,8-diazabicyclo(5,4,0)-undecene. As amine-based curing accelerators, commercially available products may be used, such as "MY-25" manufactured by Ajinomoto Fine Techno Co., Ltd.

[0203] (H) The content of the curing accelerator is preferably 0.01 mass% or more, more preferably 0.05 mass% or more, even more preferably 0.1 mass% or more, with respect to 100 mass% of the non-volatile component in the resin composition, preferably 5 mass% or less, more preferably 2 mass% or less, and even more preferably 1 mass% or less.

[0204] (H) The content of the curing accelerator is preferably 0.01 mass% or more, more preferably 0.1 mass% or more, even more preferably 0.5 mass% or more, with respect to 100 mass% of the resin component in the resin composition, and preferably 10 mass% or less, more preferably 6 mass% or less, and even more preferably 3 mass% or less.

[0205] <(I) Other Additives>

[0206] In addition to the components described above, the resin composition may additionally include (I) other additives as non-volatile components. Examples of such additives include flame retardants such as phosphazene compounds, organic phosphorus-based flame retardants, organic nitrogen-containing phosphorus compounds, nitrogen compounds, silicone-based flame retardants, metal hydroxides, etc.; radical polymerization initiators such as peroxide-based radical polymerization initiators, azo-based radical polymerization initiators, etc.; organometallic compounds such as organocopper compounds, organozinc compounds, organocobalt compounds, etc.; coloring agents such as phthalocyanine blue, phthalocyanine green, iodine green, diazo yellow, crystal violet, titanium oxide, carbon black, etc.; polymerization inhibitors such as hydroquinone, catechol, pyrogallol, phenothiazine, etc.; leveling agents such as silicone-based leveling agents, acrylic polymer-based leveling agents, etc.; thickeners such as bentonite, montmorillonite, etc.; defoaming agents such as silicone-based defoaming agents, acrylic-based defoaming agents, fluorine-based defoaming agents, vinyl resin-based defoaming agents, etc. Examples of other additives include: UV absorbers such as benzotriazole-based UV absorbers; adhesion enhancers such as urea silanes; adhesion promoters such as triazole-based adhesion promoters, tetrazole-based adhesion promoters, and triazine-based adhesion promoters; antioxidants such as hindered phenol-based antioxidants; fluorescent whitening agents such as stilbene derivatives; surfactants such as fluorine-based surfactants and silicone-based surfactants; dispersants such as phosphate ester-based dispersants, polyoxyalkylene-based dispersants, acetylene-based dispersants, silicone-based dispersants, anionic dispersants, and cationic dispersants; and stabilizers such as borate-based stabilizers, titanate-based stabilizers, aluminate-based stabilizers, zirconate-based stabilizers, isocyanate-based stabilizers, carboxylic acid-based stabilizers, and carboxylic acid anhydride-based stabilizers. (I) Other additives may be used as a single type, or two or more types may be used in combination in any ratio. (I) The content of other additives can be appropriately set by a person skilled in the art.

[0207] <(J) Solvent>

[0208] The resin composition may additionally include a solvent (J) as an optional volatile component in combination with non-volatile components such as components (A) to (I) described above. Typically, an organic solvent is used as the solvent (J). Examples of organic solvents include ketone-based solvents such as acetone, methyl ethyl ketone (MEK), methyl isobutyl ketone, and cyclohexanone; ester-based solvents such as methyl acetate, ethyl acetate, butyl acetate, isobutyl acetate, isoamyl acetate, methyl propionate, ethyl propionate, and γ-butyrolactone; ether-based solvents such as tetrahydropyran, tetrahydrofuran, 1,4-dioxane, diethyl ether, diisopropyl ether, dibutyl ether, diphenyl ether, and anisole; and alcohol-based solvents such as methanol, ethanol, propanol, butanol, and ethylene glycol. Ether ester solvents such as 2-ethoxyethyl acetate, propylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate, ethyl diglycol acetate, γ-butyrolactone, methyl methoxypropionate, etc.; ester alcohol solvents such as methyl lactate, ethyl lactate, 2-methyl hydroxyisobutyrate, etc.; ether alcohol solvents such as 2-methoxypropanol, 2-methoxyethanol, 2-ethoxyethanol, propylene glycol monomethyl ether, diethylene glycol monobutyl ether (butylcarbitol), etc.; amide solvents such as N,N-dimethylformamide, N,N-dimethylacetamide, N-methyl-2-pyrrolidone, etc.; sulfoxide solvents such as dimethyl sulfoxide; nitrile solvents such as acetonitrile, propionitrile, etc.; Examples include aliphatic hydrocarbon solvents such as hexane, cyclopentane, cyclohexane, and methylcyclohexane; aromatic hydrocarbon solvents such as benzene, toluene, xylene, ethylbenzene, and trimethylbenzene. (J) One type of solvent may be used alone, or two or more types may be used in combination.

[0209] (J) The amount of solvent may be, for example, 60 mass% or less, 40 mass% or less, 30 mass% or less, 20 mass% or less, 15 mass% or less, or 10 mass% or less, based on 100 mass% of the total components in the resin composition.

[0210] Method for manufacturing a resin composition

[0211] A resin composition can be prepared, for example, by mixing components that may be included in the resin composition. The aforementioned components may be mixed in part or in whole simultaneously, or in sequence. During the process of mixing each component, the temperature may be appropriately set, and thus heating and / or cooling may be performed temporarily or from beginning to end. Additionally, stirring or shaking may be performed during the process of mixing each component.

[0212] <Physical properties and uses of resin compositions>

[0213] The resin composition of the present invention contains a combination of components (A) to (C), so that the dielectric loss tangent is low and the occurrence of warping is suppressed, so that a cured product with excellent adhesion and suppressed non-uniformity on the surface of the insulating layer can be obtained.

[0214] A cured product obtained by heat-curing a resin composition at 200°C for 90 minutes exhibits the characteristic of suppressing the occurrence of surface non-uniformity. Accordingly, the cured product forms an insulating layer in which the occurrence of non-uniformity is suppressed. The non-uniformity of the insulating layer surface can be measured as follows. Specifically, a resin composition layer of a resin sheet is laminated to be bonded to an inner layer circuit board, and the resin composition layer is heat-cured. After heat-curing, the support is peeled off to obtain an evaluation substrate with the insulating layer surface exposed. The white areas occurring on the surface of the insulating layer of the evaluation substrate are observed using a digital microscope. At that time, the proportion of the white areas (non-uniformity) occurring on the surface of the insulating layer is preferably less than 10%, more preferably 5% or less, relative to the entire surface of the insulating layer. The non-uniformity can be evaluated by the method described in the examples described later.

[0215] A cured product obtained by heat-curing a resin composition at 200°C for 90 minutes exhibits the characteristic of having a low dielectric loss tangent. Accordingly, the cured product forms an insulating layer with a low dielectric loss tangent. The dielectric loss tangent is preferably less than 0.0045, more preferably 0.0040 or less, and even more preferably less than 0.0040 or 0.0038 or less. There is no particular limit on the lower limit, but it can be 0.00001 or more. The dielectric loss tangent can be measured according to the method described in the examples described below.

[0216] A cured product obtained by heat-curing a resin composition at 100°C for 30 minutes and at 200°C for 90 minutes exhibits the characteristic that the occurrence of warping is suppressed. Accordingly, the cured product forms an insulating layer in which the occurrence of warping is suppressed. The size of the warping (amount of warping) is preferably less than 2500 µm, more preferably 2000 µm or less, even more preferably 1900 µm or less, or 1800 µm or less. There is no particular limitation on the lower limit, but it can be 0 µm or more, 0.1 µm or more, etc. The warping can be measured according to the method described in the examples described later.

[0217] A cured product obtained by heat-curing a resin composition at 200°C for 90 minutes exhibits the characteristic of having excellent adhesion to metal foils such as copper foil. Accordingly, the cured product forms an insulating layer with excellent adhesion to the metal foil. Adhesion can be determined by peel strength (peel strength). The peel strength is preferably 0.35 kgf / cm or more, more preferably 0.40 kgf / cm or more, even more preferably 0.41 kgf / cm or more, 0.42 kgf / cm or more, or 0.43 kgf / cm or more. There is no particular upper limit, but it can be 10 kgf / cm or less. Adhesion can be measured by the method described in the examples described later.

[0218] The resin composition of the present invention has a low dielectric loss tangent, suppresses warping, provides excellent adhesion, and suppresses the occurrence of non-uniformity on the surface of the insulating layer, thereby enabling the production of a cured product. Therefore, the resin composition of the present invention can be suitably used as a resin composition for insulating purposes. Specifically, it can be suitably used as a resin composition for forming an insulating layer of a printed circuit board (a resin composition for an insulating layer of a printed circuit board), and it can be more suitably used as a resin composition for forming an interlayer insulating layer of a printed circuit board (a resin composition for an interlayer insulating layer of a printed circuit board). The resin composition of the present invention can also be suitably used even when the printed circuit board is a circuit board with embedded components. The resin composition of the present invention can also be suitably used as a resin composition for forming an insulating layer of a redistribution board of a semiconductor package (a resin composition for an insulating layer of a redistribution board). Furthermore, in the present invention, printed circuit boards and redistribution boards are collectively referred to as "circuit boards," and thus the resin composition of the present invention can be suitably used as an insulating layer of a circuit board.

[0219] In addition, for example, when a semiconductor chip package is manufactured through the following processes (1) to (6), the resin composition of the present invention can be suitably used as a resin composition for a redistribution forming layer (resin composition for forming a redistribution forming layer) as an insulating layer for forming a redistribution layer, and as a resin composition for sealing a semiconductor chip (resin composition for sealing a semiconductor chip). When the semiconductor chip package is manufactured, a redistribution layer may be further formed on the sealing layer.

[0220] (1) A process of laminating a fixed film onto a substrate,

[0221] (2) A process of temporarily fixing a semiconductor chip onto a temporary fixing film,

[0222] (3) A process of forming a sealing layer on a semiconductor chip,

[0223] (4) A process of peeling off the substrate and the fixed film from the semiconductor chip,

[0224] (5) A process of forming a redistribution forming layer as an insulating layer on the surface from which the substrate and temporary fixing film of the semiconductor chip have been peeled off, and

[0225] (6) A process of forming a redistribution layer as a conductor layer on a redistribution forming layer

[0226] [Resin Sheet]

[0227] The resin sheet of the present invention comprises a support and a resin composition layer formed of the resin composition of the present invention, provided on the support. The resin composition layer comprises the resin composition described above, and preferably comprises only the resin composition described above.

[0228] The thickness of the resin composition layer provided by the resin sheet is preferably 100 μm or less, more preferably 75 μm or less, and even more preferably 50 μm or less, from the perspective of thinning. The lower limit of the thickness of the resin composition layer may be, for example, 1 μm or more, 3 μm or more, 5 μm or more, etc.

[0229] Examples of supports include plastic film, metal foil, and release paper, and plastic film and metal foil are preferred.

[0230] When a film of a plastic material is used as a support, examples of plastic materials include polyesters such as polyethylene terephthalate (hereinafter abbreviated as "PET") and polyethylene naphthalate (hereinafter abbreviated as "PEN"), acrylics such as polymethyl methacrylate (PMMA), cyclic polyolefins, triacetylcellulose (TAC), polyether sulfide (PES), polyether ketone, and polyimide. Among these, polyethylene terephthalate and polyethylene naphthalate are preferred, and inexpensive polyethylene terephthalate is particularly preferred.

[0231] When using a metal foil as a support, examples of metal foils include copper foil and aluminum foil, and copper foil is preferred. As for the copper foil, a foil made of copper may be used, or a foil made of an alloy of copper and other metals (e.g., tin, chromium, silver, magnesium, nickel, zirconium, silicon, titanium, etc.) may be used.

[0232] The support may have surface treatments such as mat treatment, corona treatment, or antistatic treatment applied to the surface bonded to the resin composition layer.

[0233] As a support, a support with a release layer attached having a release layer on the surface bonded to the resin composition layer may be used. As a release agent used in the release layer of the support with a release layer attached, for example, one or more release agents selected from the group consisting of alkyd-based release agents, polyolefin-based release agents, urethane-based release agents, and silicone-based release agents may be used. As a support with a release layer attached, commercially available products may be used, for example, PET films having a release layer mainly composed of a silicone-based release agent or an alkyd resin-based release agent, such as “PET501010”, “SK-1”, “AL-5”, “AL-7” manufactured by Lintec; “Lumirror T60” manufactured by Toray; “Purex” manufactured by Teijin; and “Unifil” manufactured by Unitica may be used.

[0234] The thickness of the support is not particularly limited, but is preferably 1 μm or more, more preferably 5 μm or more, even more preferably 10 μm or more, preferably 75 μm or less, more preferably 60 μm or less, and even more preferably 50 μm or less. When using a support with a release layer attached, it is preferable that the total thickness of the support with the release layer attached is within the above range.

[0235] The resin sheet may be provided with any member as needed. For example, the resin sheet may be provided with a protective film that protects the resin composition layer. The protective film is typically provided on the side that is not bonded to the support of the resin composition layer (i.e., the side opposite to the support). The thickness of the protective film is not particularly limited, but is, for example, 1 μm to 40 μm. When a protective film is provided, the adhesion of dust and scratches on the surface of the resin composition layer can be suppressed.

[0236] A resin sheet can be manufactured by a method including, for example, forming a layer of a resin composition on a support. Specifically, a resin sheet may be manufactured by preparing a liquid (varnish-like) resin composition either as is or by mixing a solvent with a resin composition, applying this onto a support, and further drying it as necessary to form a layer of the resin composition. As the solvent, the same solvent as described as a component of the resin composition may be used.

[0237] The application of the resin composition can be performed using an application device such as a die coater. Additionally, drying can be carried out by drying methods such as heating or hot air spraying. Although the drying conditions are not particularly limited, drying is performed so that the solvent content in the resin composition layer is typically 10 mass% or less, preferably 5 mass% or less. Depending on the boiling point of the solvent, for example, when using a resin composition containing 30 mass% to 60 mass% of solvent, a resin composition layer can be formed by drying at 50°C to 150°C for 3 minutes to 10 minutes.

[0238] The manufactured resin sheet can be stored by winding it into a roll shape. If the resin sheet has a protective film, the resin sheet typically becomes usable by peeling off the protective film.

[0239] [Circuit board]

[0240] A circuit board according to one embodiment of the present invention comprises an insulating layer formed by a cured product of the resin composition described above. The insulating layer may comprise only the cured product of the resin composition. The thickness of the insulating layer is not particularly limited and, for example, may be within the same range as the thickness of the resin composition layer provided by the resin sheet. Furthermore, the insulating layer may typically have the same characteristics as the cured product of the resin composition described above.

[0241] Preferably, the circuit board comprises an inner layer substrate and has the insulating layer on the inner layer substrate. Additionally, the circuit board may have a conductive layer. For example, it may have a conductive layer on the insulating layer. Below, an example of a preferred method for manufacturing a circuit board is described.

[0242] A method for manufacturing a circuit board according to a preferred example is,

[0243] A process (I) for forming a resin composition layer on an inner layer substrate, and,

[0244] Process of curing the resin composition layer (II)

[0245] Includes

[0246] "Inner layer substrate" refers to a material that serves as the substrate for a circuit board, such as a glass epoxy substrate, a metal substrate, a polyester substrate, a polyimide substrate, a BT resin substrate, a thermosetting polyphenylene ether substrate, etc. Additionally, the inner layer substrate may have a conductive layer on one or both sides thereof. Furthermore, the conductive layer provided by the inner layer substrate may be patterned. An inner layer substrate having a conductive layer (circuit) formed on one or both sides thereof may be referred to as an "inner layer circuit board." Furthermore, intermediate products on which an insulating layer and / or a conductive layer must be additionally formed when manufacturing a circuit board are also included in the term "inner layer substrate." Additionally, an inner layer substrate containing embedded components may be used.

[0247] The formation of a resin composition layer on an inner layer substrate may be performed by a formation method including, for example, applying a resin composition onto the inner layer substrate and drying it as necessary, but it is preferable to perform it using a resin sheet. A method for forming a resin composition layer using a resin sheet typically involves laminating the resin sheet and the inner layer substrate. The lamination of the resin sheet and the inner layer substrate is performed such that the resin composition layer of the resin sheet and the inner layer substrate are bonded. This lamination may be performed, for example, by heat-pressing the resin sheet onto the inner layer substrate from the support side. As a member for heat-pressing the resin sheet onto the inner layer substrate (hereinafter also referred to as a "heat-pressing member"), examples include a heated metal plate (such as a SUS hard plate) or a metal roll (such as a SUS roll). Furthermore, rather than pressing the heat-pressing member directly onto the resin sheet, it is preferable to press through an elastic material such as heat-resistant rubber so that the resin sheet sufficiently follows the surface irregularities of the inner layer substrate.

[0248] Lamination of the inner layer substrate and the resin sheet may be carried out by a vacuum lamination method. In the vacuum lamination method, the heat pressing temperature is preferably in the range of 60°C to 160°C, more preferably in the range of 80°C to 140°C, the heat pressing pressure is preferably in the range of 0.098 MPa to 1.77 MPa, more preferably in the range of 0.29 MPa to 1.47 MPa, and the heat pressing time is preferably in the range of 20 seconds to 400 seconds, more preferably in the range of 30 seconds to 300 seconds. Lamination is preferably carried out under reduced pressure conditions of 26.7 hPa or less.

[0249] Lamination may be performed using a commercially available vacuum laminator. Examples of commercially available vacuum laminators include the vacuum pressure laminator manufactured by Meigi Seisakusho Co., Ltd., the vacuum applicator manufactured by Nikko Materials Co., Ltd., and the batch vacuum pressure laminator.

[0250] The method for manufacturing a circuit board may include, after lamination, performing a smoothing treatment of the resin sheet by pressing a heat-pressing member from the support side under atmospheric pressure, for example. The pressing conditions for the smoothing treatment may be the same as the conditions for the heat-pressing of the lamination. The smoothing treatment may be performed using a commercially available laminator. Lamination and the smoothing treatment may be performed continuously using the commercially available vacuum laminator described above.

[0251] The method for manufacturing a circuit board according to the present example includes a process (II) of curing a resin composition layer after process (I). By curing the resin composition layer in process (II), an insulating layer comprising a cured resin composition can be formed.

[0252] Curing of the resin composition layer is typically performed by thermal curing. The thermal curing conditions of the resin composition layer may vary depending on the type of resin composition. For example, the curing temperature is preferably 120°C to 240°C, more preferably 150°C to 220°C, and even more preferably 170°C to 210°C. The curing time may preferably be 5 minutes to 120 minutes, more preferably 10 minutes to 100 minutes, and even more preferably 15 minutes to 100 minutes.

[0253] A method for manufacturing a circuit board may include preheating the resin composition layer at a temperature lower than the curing temperature before heat curing the resin composition layer. For example, before heat curing the resin composition layer, the resin composition layer may be preheated at a temperature of typically 50°C to 150°C, preferably 60°C to 140°C, more preferably 70°C to 130°C, for typically 5 minutes or more, preferably 5 minutes to 150 minutes, more preferably 15 minutes to 120 minutes, and even more preferably 15 minutes to 100 minutes. Preheating is typically performed after process (I). In addition, if a smoothing treatment is performed after lamination of the inner layer substrate and the resin sheet, preheating may typically be performed after the smoothing treatment.

[0254] When a resin sheet is used, the method for manufacturing a circuit board may include a process of peeling off a support of the resin sheet after laminating the inner layer substrate and the resin sheet. The peeling of the support may be performed between process (I) and process (II), or after process (II). Additionally, when the method for manufacturing a circuit board includes a process (III) for forming a hole in the insulating layer, a process (IV) for performing a shaping treatment on the insulating layer, and a process (V) for forming a conductor layer as described below, the peeling of the support may be performed between process (II) and process (III), between process (III) and process (IV), or between process (IV) and process (V).

[0255] The method for manufacturing a circuit board may include a process (III) for forming holes, such as via holes or through holes, in an insulating layer after process (II). The method for forming the holes may be selected based on factors such as the composition of the resin composition used to form the insulating layer. For example, holes may be formed by processing methods such as drilling, laser processing, or plasma processing, and among these, laser processing is preferred. For example, holes may be formed by irradiating a laser beam onto an insulating layer after peeling off a support, or holes may be formed by irradiating a laser beam onto an insulating layer through a support. The dimensions and shape of the holes may be appropriately determined according to the design of the circuit board.

[0256] The method for manufacturing a circuit board may include a process (IV) of performing a shaping treatment on an insulating layer. The shaping treatment can be performed to shaping the surface of the insulating layer. Additionally, the shaping treatment can remove smear (resin residue) from the insulating layer. Therefore, this shaping treatment is sometimes referred to as "desmear treatment." For example, if a hole is formed in process (III), smear may be formed within the hole; therefore, it is preferable to perform the shaping treatment of process (IV) after process (III) to remove the smear.

[0257] The procedure and conditions of the harmonization treatment are not particularly limited, and known procedures and conditions commonly used when forming an insulating layer of a circuit board may be adopted. For example, the harmonization treatment may be performed by carrying out swelling treatment with a swelling solution, oxidation treatment with an oxidizing agent, and neutralization treatment with a neutralizing solution on the insulating layer in this order.

[0258] Examples of swelling solutions used for the swelling treatment include alkaline solutions and surfactant solutions, and preferably alkaline solutions. Sodium hydroxide solution and potassium hydroxide solution are more preferred as the alkaline solution. Examples of commercially available swelling solutions include "Swelling Deep Security P" and "Swelling Deep Security SBU" manufactured by Atotech Japan. Swelling treatment using a swelling solution can be performed, for example, by immersing the insulating layer in a swelling solution at 30°C to 90°C for 1 to 20 minutes. From the perspective of suppressing the swelling of the resin of the insulating layer to an appropriate level, it is preferable to immerse the insulating layer in a swelling solution at 40°C to 80°C for 5 to 15 minutes.

[0259] Examples of oxidizing agents used for oxidation treatment include an alkaline permanganate solution in which potassium permanganate or sodium permanganate is dissolved in an aqueous solution of sodium hydroxide. Oxidation treatment using an oxidizing agent such as an alkaline permanganate solution is preferably performed by immersing the insulating layer in an oxidizing agent solution heated to 60°C to 100°C for 10 to 30 minutes. In addition, the concentration of permanganate in the alkaline permanganate solution is preferably 5 mass% to 10 mass%. Examples of commercially available oxidizing agents include alkaline permanganate solutions such as "Concentrate Compact CP" and "Dosing Solution Securigans P" manufactured by Atotech Japan.

[0260] As the neutralizing solution used for neutralization treatment, an acidic aqueous solution is preferred, and as a commercially available product, for example, "Reduction Solution Securegant P" manufactured by Atotech Japan Co., Ltd. Neutralization treatment with the neutralizing solution can be performed by immersing the treated surface, which has undergone oxidation treatment with an oxidizing agent, in a neutralizing solution at 30°C to 80°C for 5 minutes to 30 minutes. From the perspective of workability, a method of immersing the object that has undergone oxidation treatment with an oxidizing agent in a neutralizing solution at 40°C to 70°C for 5 minutes to 20 minutes is preferred.

[0261] The method for manufacturing a circuit board may include a process (V) for forming a conductor layer on an insulating layer. If the method for manufacturing a circuit board includes process (III) or (IV), the process (V) for forming the conductor layer is typically preferably performed after processes (III) and (IV).

[0262] The conductor material used in the conductor layer is not particularly limited. In a suitable embodiment, the conductor layer comprises one or more metals selected from the group consisting of gold, platinum, palladium, silver, copper, aluminum, cobalt, chromium, zinc, nickel, titanium, tungsten, iron, tin, and indium. The conductor layer may be a single metal layer or an alloy layer. As an example of an alloy layer, a layer formed of an alloy of two or more metals selected from the above group (e.g., nickel-chromium alloy, copper-nickel alloy, and copper-titanium alloy) may be used. Among these, from the perspective of the universality of forming the conductor layer, cost, and ease of patterning, a single metal layer of chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver, or copper, or an alloy layer of a nickel-chromium alloy, a copper-nickel alloy, or a copper-titanium alloy is preferred, a single metal layer of chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver, or copper, or an alloy layer of a nickel-chromium alloy is more preferred, and a single metal layer of copper is even more preferred.

[0263] The conductor layer may have a single-layer structure, or it may have a multilayer structure comprising two or more single-metal layers or alloy layers made of different types of metals or alloys. When the conductor layer has a multilayer structure, the layer in contact with the insulating layer is preferably a single-metal layer of chromium, zinc, or titanium, or an alloy layer of a nickel-chromium alloy.

[0264] The thickness of the conductor layer is preferably 3 μm to 35 μm, more preferably 5 μm to 30 μm, depending on the design of the circuit board.

[0265] The conductor layer may be formed by plating. For example, a conductor layer having a desired wiring pattern can be formed by plating on the surface of an insulating layer using conventionally known techniques such as the semi-additive method or the full-additive method. From the perspective of ease of manufacturing, the semi-additive method is preferred. Below, an example of forming a conductor layer by the semi-additive method is shown.

[0266] First, an electroless plating layer (plating seed layer) is formed on the surface of an insulating layer by electroless plating. Next, a mask pattern is formed on the formed electroless plating layer to expose a portion of the electroless plating layer corresponding to a desired wiring pattern. After forming an electrolytic plating layer on the exposed electroless plating layer by electroplating, the mask pattern is removed. Then, the unnecessary electroless plating layer is removed by etching to form a conductor layer having a desired wiring pattern.

[0267] As another example, the conductor layer may be formed using a metal foil. When forming the conductor layer using a metal foil, it is suitable to perform process (V) between process (I) and process (II). For example, after process (I), the support is removed, and a metal foil is laminated onto the surface of the exposed resin composition layer. Lamination of the resin composition layer and the metal foil may be performed by a vacuum lamination method. The lamination conditions may be the same as those described for process (I). Subsequently, process (II) is performed to form an insulating layer. After that, using the metal foil on the insulating layer, a conductor layer having a desired wiring pattern can be formed by known techniques such as the subtractive method or the modified semi-additive method. The metal foil may be manufactured by known methods such as the electrolytic method or the rolling method. Examples of commercially available metal foils include HLP foil manufactured by JX Metal Co., JXUT-III foil, 3EC-III foil manufactured by Mitsui Kinzoku Kogyo Co., TP-III foil, etc.

[0268] When a conductor layer is formed on an insulating layer, the method for manufacturing a circuit board may include performing an annealing treatment after the formation of the conductor layer. By performing the annealing treatment, the adhesion between the insulating layer and the conductor layer can be increased. The annealing treatment can be performed, for example, by heating at 150°C to 210°C for 20 minutes to 180 minutes.

[0269] In a method for manufacturing a circuit board, each of the above-described processes may be performed only once or may be repeated two or more times. For example, the processes (I) to (V) may be repeated to form a circuit board having a multilayer structure, such as a multilayer printed circuit board including a plurality of insulating layers and conductive layers.

[0270] The method for manufacturing a circuit board may include any additional process in combination with the process described above. For example, the method for manufacturing a circuit board may include a process of providing a semiconductor chip to be bonded to a conductor layer. As a specific example, when manufacturing a circuit board for a semiconductor chip package having a semiconductor chip, the method for manufacturing a circuit board may include a process of installing a semiconductor chip. The semiconductor chip may adopt appropriate conditions that allow the terminal electrode of the semiconductor chip to conductively connect to a conductor layer formed on an insulating layer. For example, conditions used in flip-chip mounting may be adopted. Additionally, the semiconductor chip may be bonded using an insulating adhesive or bonded by reflow. Additionally, if necessary, the installed semiconductor chip may be filled with a mold underfill material. Furthermore, the method for manufacturing a circuit board may include, for example, a process of forming a sealing layer, a process of forming a solder resist layer, and a process of dicing and reassembling the manufactured circuit board.

[0271] Examples of circuit boards include printed circuit boards and semiconductor chip packages. Examples of semiconductor chip packages include FC-CSP, MIS-BGA package, ETS-BGA package, Fan-out type WLP (Wafer Level Package), Fan-in type WLP, Fan-out type PLP (Panel Level Package), and Fan-in type PLP. In these semiconductor chip packages, it is preferable to form a redistribution forming layer as an insulating layer using a cured product obtained by curing the resin composition described above. However, the circuit board is not limited to those exemplified herein.

[0272] [Semiconductor Device]

[0273] The above circuit board can be used to manufacture a semiconductor device. The semiconductor device is equipped with the above-described circuit board. Examples of semiconductor devices include various semiconductor devices provided for electrical products (e.g., computers, mobile phones, smartphones, tablet devices, wearable devices, digital cameras, medical devices, televisions, etc.) and vehicles (e.g., motorcycles, automobiles, trains, ships, and aircraft, etc.).

[0274] [Example]

[0275] The present invention will be described in more detail below by presenting examples. However, the present invention is not limited to these examples. In the following description, "parts" and "%" indicating amounts refer to "parts by mass" and "% by mass," respectively, unless otherwise specified. Furthermore, unless otherwise specified, the temperature and pressure conditions are room temperature (23°C) and atmospheric pressure (1 atm).

[0276] <Synthesization Example 1: Synthesis of Intermediate Amine Compound 1>

[0277] 143 g of primin 1075 (manufactured by Kuroda Japan Co., Ltd.) was dissolved in 2457 g of THF to prepare a first solution. Additionally, 130 g of maleic anhydride was dissolved in 197 g of THF to prepare a second solution. At room temperature, the second solution was added dropwise to the first solution over a period of 1 hour. Subsequently, the mixture was stirred for 1 hour, and the precipitated solid was filtered. Next, the filtered solid was washed with THF and dried at room temperature under reduced pressure to obtain intermediate amine compound 1. This intermediate amine compound 1 is represented by the following structural formula (2-1).

[0278]

[0279] <Synthesization Example 2: Synthesis of Intermediate Amine Compound 2>

[0280] In Synthesis Example 1, 143 g of priamine 1075 (manufactured by Kuroda Japan Co., Ltd.) was replaced with 67 g of 4,4'-oxydianiline. Except for the above, intermediate amine compound 2 was obtained in the same manner as in Synthesis Example 1. This intermediate amine compound 2 is represented by the following structural formula (2-2).

[0281]

[0282] <Synthesization Example 3: Synthesis of Intermediate Amine Compound 3>

[0283] In Synthesis Example 1, 143 g of Priamine 1075 (manufactured by Kuroda Japan Co., Ltd.) was replaced with 89 g of 4,4'-Methylenebis(2-ethyl-6-methylaniline). Except for the above details, the intermediate amine compound 3 was obtained in the same manner as in Synthesis Example 1. This intermediate amine compound 3 is represented by the following structural formula (2-3).

[0284]

[0285] <Synthesization Example 4: Synthesis of Intermediate Amine Compound 4>

[0286] In Synthesis Example 1, 143 g of Priamine 1075 (manufactured by Kuroda Japan Co., Ltd.) was replaced with 61 g of Isophoronediamine. Except for the above details, the intermediate amine compound 4 was obtained in the same manner as in Synthesis Example 1. This intermediate amine compound 4 is represented by the following structural formula (2-4).

[0287]

[0288] <Synthesization Example 5: Synthesis of Intermediate Amine Compound 5>

[0289] In Synthesis Example 1, 143 g of Priamine 1075 (manufactured by Kuroda Japan Co., Ltd.) was replaced with 36 g of Ethylenediamine. Except for the above details, the intermediate amine compound 5 was obtained in the same manner as in Synthesis Example 1. This intermediate amine compound 5 is represented by the following structural formula (2-5).

[0290]

[0291] <Synthesization Example 6: Synthesis of Intermediate Amine Compound 6>

[0292] In Synthesis Example 1, 143 g of Priamine 1075 (manufactured by Kuroda Japan Co., Ltd.) was replaced with 47 g of m-phenylenediamine. Except for the above details, the intermediate amine compound 6 was obtained in the same manner as in Synthesis Example 1. This intermediate amine compound 6 is represented by the following structural formula (2-6).

[0293]

[0294] <Synthesization Example 7: Synthesis of Intermediate Amine Compound 7>

[0295] In Synthesis Example 1, 143 g of Priamine 1075 (manufactured by Kuroda Japan Co., Ltd.) was replaced with 47 g of p-phenylenediamine. Except for the above details, the intermediate amine compound 7 was obtained in the same manner as in Synthesis Example 1. This intermediate amine compound 7 is represented by the following structural formula (2-7).

[0296]

[0297] <Synthesization Example 8: Synthesis of Intermediate Amine Compound 8>

[0298] In Synthesis Example 1, 143 g of Priamine 1075 (manufactured by Kuroda Japan Co., Ltd.) was replaced with 55 g of 1,3-bis(aminomethyl)cyclohexane. Except for the above, the intermediate amine compound 8 was obtained in the same manner as in Synthesis Example 1. This intermediate amine compound 8 is represented by the following structural formula (2-8).

[0299]

[0300] <Synthesization Example 9: Synthesis of Intermediate Amine Compound 9>

[0301] In Synthesis Example 1, 143 g of primin 1075 (manufactured by Kuroda Japan Co., Ltd.) was replaced with 70 g of 4,4'-diaminodicyclohexylmethane. Except for the above, the intermediate amine compound 9 was obtained in the same manner as in Synthesis Example 1. This intermediate amine compound 9 is represented by the following structural formula (2-9).

[0302]

[0303] <Synthesization Example 10: Synthesis of Intermediate Amine Compound 10>

[0304] In Synthesis Example 1, 143 g of primamine 1075 (manufactured by Cloda Japan Co., Ltd.) was replaced with 68 g of 1,4-bis(3-aminopropyl)piperazine. Except for the above details, the intermediate amine compound 10 was obtained in the same manner as in Synthesis Example 1. This intermediate amine compound 10 is represented by the following structural formula (2-10).

[0305]

[0306] <Synthesization Example 11: Synthesis of Intermediate Amine Compound 11>

[0307] In Synthesis Example 1, 143 g of priamine 1075 (manufactured by Kuroda Japan Co., Ltd.) was replaced with 56 g of 2,2'-(ethylenedioxy)bis(ethylamine). Except for the above details, the intermediate amine compound 11 was obtained in the same manner as in Synthesis Example 1. This intermediate amine compound 11 is represented by the following structural formula (2-11).

[0308]

[0309] <Synthetic Example 12: Synthesis of Maleimide Resin 1>

[0310] 50.2 g of N,N-dimethylacetamide (DMAC), a reaction solvent, 5.6 g of intermediate amine compound 1, and 28.1 g of radical polymerization resin 1 containing maleic anhydride units were added to a flask equipped with a stirring device, a reflux tube, and a thermometer, and the mixture was stirred at 75°C for 6 hours under a nitrogen atmosphere. Radical polymerization resin 1 contained 80 parts by mass of indene and 20 parts by mass of maleic anhydride. Radical polymerization resin 1 corresponds to the precursor resin.

[0311] After cooling, 308.0g of water and 35.4g of hydrochloric acid were added to the reaction solution, the crystals were washed with water, the precipitated solid was separated by filtration, and 38.9g of amic acid resin was obtained by vacuum drying at 70℃.

[0312] Next, 76.2 g of N,N-dimethylacetamide (DMAC) and 25.4 g of toluene, 34.3 g of amic acid resin, 4.2 g of p-toluenesulfonic acid as an acidic catalyst, and 0.02 g of methoquinone as a polymerization inhibitor were added to a flask equipped with a stirring device, a reflux tube, and a thermometer, and the mixture was stirred for 6 hours at a temperature of 110°C under a nitrogen atmosphere.

[0313] After cooling, the reaction solution was poured into 0.5 L of water, the precipitated solid was separated by filtration, and vacuum dried at 70°C to obtain 127.2 g of maleimide resin. This maleimide resin 1 is a copolymer comprising repeating units represented by chemical formula (1-1) and repeating units represented by chemical formula (1-2), and X comprises a structure derived from intermediate amine compound 1.

[0314]

[0315] <Synthetic Example 13: Synthesis of Maleimide Resin 2>

[0316] In Synthesis Example 12,

[0317] 1) Replace intermediate amine compound 1 with 5.6g, intermediate amine compound 1 with 2.8g, and intermediate amine compound 2 with 2.8g, and

[0318] 2) 28.1 g of radical polymerization resin 1 and 28.1 g of radical polymerization resin 2 were replaced. Radical polymerization resin 2 contained 40 parts by mass of indene, 40 parts by mass of styrene, and 20 parts by mass of maleic anhydride.

[0319] Maleimide resin 2 was synthesized in the same manner as Synthesis Example 12, except for the above details. Maleimide resin 2 is a copolymer comprising a repeating unit represented by chemical formula (1-1), a repeating unit represented by chemical formula (1-2), and a repeating unit represented by chemical formula (1-3), wherein X includes a structure derived from intermediate amine compound 1 and a structure derived from intermediate amine compound 2.

[0320]

[0321] <Synthetic Example 14: Synthesis of Maleimide Resin 3>

[0322] In Synthesis Example 12,

[0323] 1) Replace 5.6g of intermediate amine compound 1 with 5.6g of intermediate amine compound 3, and

[0324] 2) 28.1 g of radical polymerization resin 1 and 28.1 g of radical polymerization resin 3 were replaced. Radical polymerization resin 3 contained 80 parts by mass of styrene and 20 parts by mass of maleic anhydride.

[0325] Maleimide resin 3 was synthesized in the same manner as Synthesis Example 12, except for the above details. Maleimide resin 3 is a copolymer comprising repeating units represented by chemical formula (1-1) and repeating units represented by chemical formula (1-3), and X comprises a structure derived from intermediate amine compound 3.

[0326]

[0327] <Synthetic Example 15: Synthesis of Maleimide Resin 4>

[0328] In Synthesis Example 12,

[0329] Intermediate amine compound 1 was replaced with 5.6g, intermediate amine compound 1 with 2.8g, and intermediate amine compound 4 with 2.8g.

[0330] Maleimide resin 4 was synthesized in the same manner as Synthesis Example 12, except for the above details. Maleimide resin 4 is a copolymer comprising repeating units represented by chemical formula (1-1) and repeating units represented by chemical formula (1-2), and X includes a structure derived from intermediate amine compound 1 and a structure derived from intermediate amine compound 4.

[0331]

[0332] <Synthetic Example 16: Synthesis of Maleimide Resin 5>

[0333] In Synthesis Example 12,

[0334] Intermediate amine compound 1 was changed to 5.6g, intermediate amine compound 1 to 2.8g, and intermediate amine compound 5 to 2.8g.

[0335] Maleimide resin 5 was synthesized in the same manner as Synthesis Example 12, except for the above details. Maleimide resin 5 is a copolymer comprising repeating units represented by chemical formula (1-1) and repeating units represented by chemical formula (1-2), and X includes a structure derived from intermediate amine compound 1 and a structure derived from intermediate amine compound 5.

[0336]

[0337] <Synthetic Example 17: Synthesis of Maleimide Resin 6>

[0338] In Synthesis Example 12,

[0339] Intermediate amine compound 1 was changed to 5.6g, intermediate amine compound 1 to 2.8g, and intermediate amine compound 6 to 2.8g.

[0340] Maleimide resin 6 was synthesized in the same manner as Synthesis Example 12, except for the above details. Maleimide resin 6 is a copolymer comprising repeating units represented by chemical formula (1-1) and repeating units represented by chemical formula (1-2), and X comprises a structure derived from intermediate amine compound 1 and a structure derived from intermediate amine compound 6.

[0341]

[0342] <Synthetic Example 18: Synthesis of Maleimide Resin 7>

[0343] In Synthesis Example 12,

[0344] Intermediate amine compound 1 was replaced with 5.6g, intermediate amine compound 1 with 2.8g, and intermediate amine compound 7 with 2.8g.

[0345] Maleimide resin 7 was synthesized in the same manner as Synthesis Example 12, except for the above details. Maleimide resin 7 is a copolymer comprising repeating units represented by chemical formula (1-1) and repeating units represented by chemical formula (1-2), and X includes a structure derived from intermediate amine compound 1 and a structure derived from intermediate amine compound 7.

[0346]

[0347] <Synthetic Example 19: Synthesis of Maleimide Resin 8>

[0348] In Synthesis Example 12,

[0349] Intermediate amine compound 1 was changed to 5.6g, intermediate amine compound 1 to 2.8g, and intermediate amine compound 8 to 2.8g.

[0350] Maleimide resin 8 was synthesized in the same manner as Synthesis Example 12, except for the above details. Maleimide resin 8 is a copolymer comprising repeating units represented by chemical formula (1-1) and repeating units represented by chemical formula (1-2), and X comprises a structure derived from intermediate amine compound 1 and a structure derived from intermediate amine compound 8.

[0351]

[0352] <Synthetic Example 20: Synthesis of Maleimide Resin 9>

[0353] In Synthesis Example 12,

[0354] Intermediate amine compound 1 was replaced with 5.6g, intermediate amine compound 1 with 2.8g, and intermediate amine compound 9 with 2.8g.

[0355] Maleimide resin 9 was synthesized in the same manner as Synthesis Example 12, except for the above details. Maleimide resin 9 is a copolymer comprising repeating units represented by chemical formula (1-1) and repeating units represented by chemical formula (1-2), and X comprises a structure derived from intermediate amine compound 1 and a structure derived from intermediate amine compound 9.

[0356]

[0357] <Synthetic Example 21: Synthesis of Maleimide Resin 10>

[0358] In Synthesis Example 12,

[0359] Intermediate amine compound 1 was replaced with 5.6g, intermediate amine compound 1 with 2.8g, and intermediate amine compound 10 with 2.8g.

[0360] Maleimide resin 10 was synthesized in the same manner as Synthesis Example 12, except for the above details. Maleimide resin (10) is a copolymer comprising repeating units represented by chemical formula (1-1) and repeating units represented by chemical formula (1-2), and X includes a structure derived from intermediate amine compound 1 and a structure derived from intermediate amine compound 10.

[0361]

[0362] <Synthetic Example 22: Synthesis of Maleimide Resin 11>

[0363] In Synthesis Example 12,

[0364] Intermediate amine compound 1 was replaced with 5.6g, intermediate amine compound 1 with 2.8g, and intermediate amine compound 11 with 2.8g.

[0365] Maleimide resin 11 was synthesized in the same manner as Synthesis Example 12, except for the above details. Maleimide resin (11) is a copolymer comprising repeating units represented by chemical formula (1-1) and repeating units represented by chemical formula (1-2), and X includes a structure derived from intermediate amine compound 1 and a structure derived from intermediate amine compound 11.

[0366]

[0367] <Synthetic Example 23: Synthesis of Maleimide A>

[0368] A MEK solution (62 mass% of non-volatile components) of a maleimide compound synthesized by the method described in Synthesis Example 1 of the Invention Association Public Disclosure No. 2020-500211 was prepared. This maleimide compound had a structure represented by the following chemical formula (1) (where t" in the chemical formula is 1.47 (mainly 1, 2, or 3)), and a weight-average molecular weight of 2000.

[0369]

[0370] <Synthesization Example 24: Synthesis of Polymer A>

[0371] In a reaction vessel, 69g of difunctional hydroxyl-terminated polybutadiene ("G-3000" manufactured by Nippon Soda, number average molecular weight = 3000, hydroxyl group equivalent = 1800g / eq.), 40g of PGMEA (propylene glycol monomethyl ether acetate manufactured by Showa Denko, 0.005g of dibutyltin laurate were added and mixed to dissolve uniformly. After homogenization, the temperature was raised to 60°C, and while stirring further, 8g of isophorone diisocyanate ("IPDI" manufactured by Evonik Deg Japan, isocyanate group equivalent = 113g / eq.) was added and the reaction was carried out for about 3 hours.

[0372] Next, 23 g of cresol novolak resin (DIC "KA-1160", hydroxyl equivalent = 117 g / eq.) and 60 g of PGMEA were added to the reactants, and the reaction was carried out for approximately 10 hours under reflux at 150°C while stirring. 2250 cm² was measured by FT-IR. -1 Confirmation of the disappearance of the NCO peak was performed. Confirmation of the disappearance of the NCO peak was considered the endpoint of the reaction, and the reaction mixture was cooled to room temperature. Then, the reaction mixture was filtered through a 100-mesh filter cloth, and a polymer having a butadiene structure and phenolic hydroxyl groups (phenolic hydroxyl group-containing butadiene resin: non-volatile component 50 mass%) was obtained. The weight-average molecular weight of polymer A was 27,000, the hydroxyl equivalent was 467 g / eq., and the glass transition temperature was -7°C.

[0373] <Synthesization Example 25: Synthesis of Polymer B>

[0374] 368.41 g of ethyl diglycol acetate and 368.41 g of "Sorbetso 150" (registered trademark) manufactured by ExxonMobil (aromatic solvent) were added as solvents to a flask equipped with a stirring device, a thermometer, and a condenser. Additionally, 100.1 g (0.4 mol) of diphenylmethane diisocyanate and 400 g (0.2 mol) of polycarbonate diol ("C-2015N" manufactured by Curare, number average molecular weight: approx. 2000, hydroxyl equivalent: 1000 g / eq., non-volatile component: 100 mass%) were added to the above flask, and the reaction was carried out at 70°C for 4 hours. Accordingly, a first reaction solution was obtained.

[0375] Next, 195.9 g (0.2 mol) of nonylphenol novolak resin (hydroxyl equivalent: 229.4 g / eq, average 4.27 functionalities, average calculated molecular weight: 979.5 g / mol) and 41.0 g (0.1 mol) of ethylene glycol bis anhydrotrimellitate were added to the above flask, the temperature was raised to 150°C over 2 hours, and the reaction was carried out for 12 hours. Accordingly, a second reaction solution was obtained. 2250 cm² by FT-IR -1 Confirmation of the disappearance of the NCO peak was performed. Confirmation of the disappearance of the NCO peak was considered the endpoint of the reaction, and the second reaction solution was cooled to room temperature. Then, the second reaction solution was filtered through a 100-mesh filter cloth. Accordingly, a dispersion solution (50 mass% of non-volatile component) containing polymer B (phenolic hydroxyl group-containing polycarbonate resin) as a non-volatile component was obtained as the filtrate. The weight-average molecular weight of polymer B was 20,000, the hydroxyl group equivalent was 339 g / eq., and the glass transition temperature was 5°C.

[0376] <Synthesization Example 26: Synthesis of Polymer C>

[0377] In a 1L separable flask equipped with a stirring rod and an oil bath, 200g of cyclohexanone was added while introducing nitrogen gas, 149.4g of dimerdiamine ("PRIAMINE 1075" manufactured by Cloda Japan Co., Ltd.) as a diamine, and 4.7g of m-aminophenol as a monoamine compound were added while stirring, and subsequently, 67.3g of 1,2,4,5-cyclohexanetetracarboxylic acid dianhydride was added as a tetracarboxylic acid, and the mixture was stirred at room temperature for 30 minutes. The temperature was raised to 100℃ and stirred for 3 hours, after which the oil bath was removed and the mixture was returned to room temperature to obtain a varnish-like polyimide precursor. Subsequently, while removing distilled water from the system using a Dean Stark trap, heating was performed at 170°C for 10 hours and imidized to obtain polymer C (non-volatile component 50 mass%) having a carbon skeleton derived from dimer acid. The weight-average molecular weight of the obtained polymer C was 10,000, the hydroxyl equivalent was 3,900 g / eq., and the glass transition temperature was -1°C.

[0378] <Examples 1 to 19, Comparative Examples 1 to 2>

[0379] Each component was weighed in parts by mass as listed in the table below, and 15 parts of MEK and 15 parts of cyclohexanone were additionally mixed and uniformly dispersed using a high-speed rotary mixer to obtain a resin composition (resin varnish).

[0380]

[0381]

[0382] * In the table, the content of components (A) to (H) represents the content when the non-volatile component included in the resin composition is set to 100 mass%.

[0383] The details of each component listed in the table are as follows.

[0384] (A) Ingredient

[0385] · Maleimide resin 1: Maleimide resin 1 synthesized in Synthesis Example 12

[0386] · Maleimide resin 2: Maleimide resin 2 synthesized in Synthesis Example 13

[0387] · Maleimide resin 3: Maleimide resin 3 synthesized in Synthesis Example 14

[0388] · Maleimide resin 4: Maleimide resin 4 synthesized in Synthesis Example 15

[0389] · Maleimide resin 5: Maleimide resin 5 synthesized in Synthesis Example 16

[0390] · Maleimide resin 6: Maleimide resin 6 synthesized in Synthesis Example 17

[0391] · Maleimide resin 7: Maleimide resin 7 synthesized in Synthesis Example 18

[0392] · Maleimide resin 8: Maleimide resin 8 synthesized in Synthesis Example 19

[0393] · Maleimide resin 9: Maleimide resin 9 synthesized in Synthesis Example 20

[0394] · Maleimide resin 10: Maleimide resin 10 synthesized in Synthesis Example 21

[0395] · Maleimide resin 11: Maleimide resin 11 synthesized in Synthesis Example 22

[0396] (B) Component

[0397] ·ESN-4100V: Methoxy group-containing naphthol-aralkyl type resin (Manufactured by Nittetsu Chemical & Material, epoxy equivalent 363 g / eq.)

[0398] · ZX-1059: Bisphenol-type epoxy resin (Manufactured by Nittetsu Chemical & Materials, 1:1 mixture of Bisphenol A and Bisphenol F, epoxy equivalent 165 g / eq.)

[0399] · NC3000L: Biphenyl-type epoxy resin (manufactured by Nippon Kasei Co., Ltd., epoxy equivalent weight approx. 271 g / eq.)

[0400] ·HP4032SS: Naphthalene-type epoxy resin (Manufactured by DIC, epoxy equivalent approx. 144 g / eq.)

[0401] · YX4000HK: Vixylenol-type epoxy resin (Manufactured by Mitsubishi Chemical, epoxy equivalent 194 g / eq.)

[0402] (C) Component

[0403] ·SO-C2: Spherical silica surface-treated with an aminosilane-based coupling agent ("KBM573" manufactured by Shin-Etsu Chemical Co., Ltd.) (average particle diameter 0.5㎛, manufactured by Admatex)

[0404] (D) Component

[0405] ·MIR-3000-70T: Aromatic maleimide resin (manufactured by Nippon Kayaku Co., Ltd., MEK / toluene mixed solution with a non-volatile component ratio of 70%)

[0406] · Maleimide A: Maleimide A synthesized in Synthesis Example 23

[0407] (E) Component

[0408] ·HPC-8000-65T: Active ester compound (manufactured by DIC, active group equivalent approx. 223 g / eq., toluene solution of 65 mass% non-volatile component)

[0409] · LA-3018-50P: Triazine-backed phenolic curing agent (manufactured by DIC, hydroxyl equivalent approx. 151 g / eq., 1-methoxy-2-propanol solution with 50% solids)

[0410] · V-03: Carbodiimide resin (manufactured by Nisshinbo Chemical, 50% solids toluene solution)

[0411] ·BA230S75: Bisphenol A dicyanate prepolymer (manufactured by Arxada, cyanate equivalent approx. 235 g / eq., MEK solution with 75% solids)

[0412] · PT30: Phenol-novolak type polyfunctional cyanate ester resin (manufactured by Arxada, cyanate equivalent approx. 124 g / eq., MEK solution with 80% solids)

[0413] (F) Component

[0414] · Polymer A: Polymer A synthesized in Synthesis Example 24

[0415] · Polymer B: Polymer B synthesized in Synthesis Example 25

[0416] · Polymer C: Polymer C synthesized in Synthesis Example 26

[0417] ·YX7553BH30: Special high molecular weight epoxy resin (manufactured by Mitsubishi Chemical, 30% solid content MEK, cyclohexanone solution)

[0418] (G) Component

[0419] ·EXL2655: Organic filler (manufactured by DOW)

[0420] (H) component

[0421] ·2P4MZ: 2-phenyl-4-methylimidazole (manufactured by Shikoku Kasei High School Co., Ltd.)

[0422] ·Co(acac) 3: Cobalt(III) acetylacetonate (manufactured by Tokyo Kasei Co.)

[0423] Production of Resin Sheets

[0424] As a support, a polyethylene terephthalate film (Toray’s “Lumirr R80”, thickness 38 μm, softening point 130°C) was prepared by performing a release treatment with an alkyd resin-based release agent (Lintec “AL-5”).

[0425] A resin composition obtained in Examples 1 to 19 and Comparative Examples 1 to 2 was uniformly applied to the above support using a die coater such that the thickness of the resin composition layer after drying was 50 μm, and a resin composition layer was formed on the support by drying at 70°C to 100°C for 3 minutes. Subsequently, a rough surface of a polypropylene film ("Alpan MA-411" manufactured by Oji F-Tex, thickness 15 μm) was bonded as a protective film to the side of the resin composition layer that was not bonded to the support. Accordingly, a resin sheet having a support, a resin composition layer, and a protective film in this order was obtained.

[0426] <Test Example 1: Measurement of Genetic Loss Tangent>

[0427] The protective film was peeled off from the resin sheet, and the resin composition layer was heat-cured by heating at 200°C for 90 minutes. Afterward, the support was peeled off to obtain a cured product. The obtained cured product was cut into pieces with a width of 2 mm and a length of 80 mm to obtain an evaluation test specimen.

[0428] For the test specimens, the dielectric loss tangent was measured using a measuring device (Agilent Technologies “HP8362B”) by the cavity resonance perturbation method at a measurement frequency of 5.8 GHz and a measurement temperature of 23°C. Measurements were performed on three test specimens, and the average value was calculated. Based on this average value, the dielectric loss tangent was evaluated according to the following criteria.

[0429] ○: Hereditary loss tangent less than 0.0040

[0430] △: Hereditary loss tangent 0.0040 or greater and less than 0.0045

[0431] ×: Hereditary loss tangent is 0.0045 or greater

[0432] <Test Example 2: Evaluation of Non-uniformity of Cured Product (Observation Test of Cured Product Non-uniformity)>

[0433] Using a batch-type vacuum pressure laminator (manufactured by Nikko Materials, 2-stage build-up laminator "CVP700"), a resin composition layer of the resin sheet was laminated onto one side of the inner layer substrate so that it came into contact with the inner layer substrate. Lamination was performed by reducing the pressure for 30 seconds to adjust the atmospheric pressure to 13 hPa or less, and then pressing at 120°C and a pressure of 0.74 MPa for 30 seconds. Subsequently, a heat press was performed at 100°C and a pressure of 0.5 MPa for 60 seconds. After that, the resin composition layer was cured under curing conditions of 200°C and 90 minutes, and the support was peeled off to form an insulating layer, thereby producing an evaluation substrate.

[0434] An arbitrary location on the obtained evaluation substrate was observed using a digital microscope (Keyence “VHX-7000”) (the observed area was a square with sides of 200 μm). Within the observed area, the white portion of the insulating layer was made non-uniform, and an evaluation was performed based on the proportion of the total area.

[0435] ○: White part is 5% or less of the total

[0436] △: White area is greater than 5% of the total and less than 10%

[0437] ×: White part is 10% or more of the total

[0438] <Test Example 3: Measurement of Bending>

[0439] A resin sheet with the protective film peeled off was laminated across the entire surface of one side of a 12-inch silicon wafer (thickness 775 μm) using a batch-type vacuum pressure laminator (2-stage build-up laminator "CVP700" manufactured by Nikko Materials Co., Ltd.). This lamination was performed so that the resin composition layer and the silicon wafer were bonded. The support of the resin sheet was peeled off to expose the resin composition layer. On the surface of this exposed resin composition layer, a resin sheet with the protective film peeled off was additionally laminated in the same manner, and the support was peeled off to form two layers of resin composition (total thickness 100 μm) on one side of the 12-inch silicon wafer. In addition, the lamination was performed by depressurizing for 30 seconds to reduce the atmospheric pressure to 13 hPa or less, and then compressing for 30 seconds at 100°C and a pressure of 0.74 MPa.

[0440] The resin composition layer was cured by heating in an oven at 100°C for 30 minutes and then further heating at 200°C for 90 minutes to obtain a sample laminate having a layer configuration of "silicon wafer / cured layer of resin composition layer." The amount of warping of the obtained sample laminate was measured using a shadow moiré measuring device ("ThermoireAXP" manufactured by Arcorometrics). The measurement was performed in accordance with JEITA EDX-7311-24 of the Electronic Information Technology Industry Association standard. Specifically, a virtual plane obtained using the least squares method for the entire data of the evaluation substrate surface (the side opposite to the silicon wafer of the cured layer) of the measurement area was used as the reference plane, and the amount of warping was calculated as the difference between the minimum and maximum values ​​of the vertical height from this reference plane to the evaluation substrate surface. The measured value of the obtained amount of warping was evaluated according to the following criteria. A smaller amount of warping indicates that warping can be effectively suppressed.

[0441] ○: Bending amount 0㎛ or more and 2000㎛ or less

[0442] △: Bending amount greater than 2000㎛ and less than 2500㎛

[0443] ×: Bending amount is 2500㎛ or more

[0444] <Test Example 4: Measurement of Adhesion with Copper Foil>

[0445] (1) Treatment of the copper foil

[0446] The polished surface of "3EC-III" (electric field copper foil, 35㎛) manufactured by Mitsui Kinzoku Kosansha was etched to a depth of 1㎛ using a micro-etching agent ("CZ8101" manufactured by Maxar) to perform a polishing treatment on the copper surface, followed by an anti-corrosion treatment (CL83 00). In addition, it was heat-treated in an oven at 130℃ for 30 minutes. This copper foil is called CZ copper foil.

[0447] (2) Preparation of inner layer substrate

[0448] A copper surface enamel treatment was performed by etching both sides of a glass-fiber epoxy resin double-sided copper laminate (copper foil thickness 18 μm, substrate thickness 0.4 mm, manufactured by Panasonic “R1515A”) with a micro-etching agent (manufactured by Maxar “CZ8101”) to a thickness of 1 μm.

[0449] (3) Formation of copper foil lamination and insulation layer

[0450] Using a batch-type vacuum pressure laminator (manufactured by Nikko Materials, 2-stage build-up laminator "CVP700"), a resin composition layer of the resin sheet was laminated onto both sides of the inner layer substrate so that it came into contact with the inner layer substrate. Lamination was performed by reducing the pressure for 30 seconds to adjust the atmospheric pressure to 13 hPa or less, and then pressing at 120°C and a pressure of 0.74 MPa for 30 seconds. Subsequently, a heat press was performed at 100°C and a pressure of 0.5 MPa for 60 seconds. A treated surface of CZ copper foil was laminated onto the resin composition layer under the same conditions as above. Then, the resin composition layer was cured under a curing condition of 200°C and 90 minutes to form an insulating layer, thereby producing an evaluation substrate.

[0451] (4) Measurement of adhesion with copper foil

[0452] The fabricated evaluation substrate was cut into small pieces measuring 150×30 mm. A cutter was used to make an incision of 10 mm in width and 100 mm in length into the copper foil portion of the small piece. One end of the copper foil was peeled off and held with a clamp. The peel strength was determined by measuring the load (kgf / cm²) when the foil was pulled vertically 35 mm at a speed of 50 mm / min at room temperature. A tensile testing machine (TSE "AC-50C-SL") was used for the measurement. The measurement was performed in accordance with the Japanese Industrial Standard (JIS C6481), and the copper foil adhesion was evaluated based on the following criteria.

[0453] ○: Peel strength of 0.40 kgf / cm or higher

[0454] △: Peel strength of 0.35 kgf / cm or more, and less than 0.40 kgf / cm

[0455] ×: Peel strength less than 0.35 kgf / cm

[0456]

[0457]

Claims

Claim 1 (A) a maleimide resin having repeating units represented by the following chemical formula (A-1), (B) an epoxy resin, and (C) a resin composition comprising an inorganic filler. In chemical formula (A-1), X represents, respectively, a divalent group represented by chemical formula (A-2) or a divalent group represented by chemical formula (A-3). * indicates a bonding hand. In chemical formula (A-2), ring A 1 and case A 2 Each independently represents a divalent group having an directional ring structure that may have substituents, a divalent group containing an alicyclic structure that may have substituents, or a divalent group containing a complex ring structure that may have substituents, and Y 1 and Y 2 represents, respectively, a single bond, an oxygen atom, or an alkylene group that may have a substituent, and n and m represent, respectively, 0 or 1. * indicates the loss of bonding with the maleimide group in formula (A-1). In formula (A-3), Z 1 , Z 2 , and Z 3 Each represents an alkylene group that may have a substituent, independently. * indicates a bond loss with the maleimide group in chemical formula (A-1). Claim 2 A resin composition according to claim 1, wherein component (A) further comprises either a repeating unit represented by the following chemical formula (A-4) and a repeating unit represented by the chemical formula (A-5). Claim 3 In claim 1, (E) a resin composition further containing a curing agent. Claim 4 A resin composition according to paragraph 3, wherein component (E) comprises any one of an active ester-based curing agent, a phenol-based curing agent, a carbodiimide-based curing agent, and a cyanate ester-based curing agent. Claim 5 A resin composition according to claim 1, further comprising (F) a polymer resin with a weight-average molecular weight greater than 5000. Claim 6 A resin composition according to claim 5, wherein component (F) has a functional group capable of reacting with component (B). Claim 7 In claim 1, the content of component (A) when the non-volatile component in the resin composition is 100 mass% is M A Let it be, and the content of component (B) when the non-volatile component in the resin composition is 100 mass% is M B When done as, M A / M B A resin composition having a value of 0.01 or more and 3 or less. Claim 8 A resin composition according to claim 1, wherein the content of component (C) is 40 mass% or more when the non-volatile component in the resin composition is 100 mass%. Claim 9 In claim 1, the content of component (A) when the non-volatile component in the resin composition is 100 mass% is M A Let it be, and the content of component (C) when the non-volatile component in the resin composition is 100 mass% is M C When done as, M A / M C A resin composition having a value of 0.01 or more and 3 or less. Claim 10 In paragraph 3, the content of component (A) when the non-volatile component in the resin composition is 100 mass% is M A Let it be, and the content of component (E) when the non-volatile component in the resin composition is 100 mass% is M E When done as, M A / M E A resin composition having a value of 0.01 or more and 3 or less. Claim 11 A resin sheet comprising a support and a resin composition layer provided on the support, the resin composition layer comprising the resin composition described in any one of claims 1 to 10. Claim 12 A circuit board comprising an insulating layer formed by a cured product of a resin composition described in any one of claims 1 to 10. Claim 13 A semiconductor device comprising a circuit board as described in paragraph 12.

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