Substrate treating appartus and temperature control method using the same

Abstract

An apparatus for processing a substrate is disclosed. The apparatus comprises: a housing that provides a processing space inside; and a plate that supports a substrate within the housing. The plate comprises: a plurality of heating members provided within the plate to heat the substrate; and a temperature measuring member that measures the temperature of the substrate in an area where the plurality of heating members are located. The temperature measuring member is provided in a plurality, and the plurality of temperature measuring members may be provided in at least two different types.

Description

Technology Field

[0001] The present invention relates to a substrate processing apparatus and a temperature control method using the same. More specifically, the invention relates to a substrate processing apparatus and a temperature control method using a plate comprising different types of sensors. Background Technology

[0003] Sensors used for temperature control of heaters in substrate processing devices primarily utilize sensors with fast response times and good precision characteristics. For example, an RTD (PT100) sensor can be used. In such cases, since the RTD sensor is made of platinum, the sensor itself possesses high stability; however, it has the disadvantage that deformation is highly likely to occur when exposed to high temperatures for extended periods, depending on the bonding method.

[0004] Figure 1 is a graph showing the measurement results in a conventional temperature control system using a heater. Referring to Figure 1, it indicates that the temperature accuracy in some channels changes over time in a temperature control system using a heater. In other words, when a temperature sensor is used for a long time, deformation of the temperature sensor occurs, which causes problems with accuracy and makes accurate control difficult. Furthermore, process problems are caused by temperatures exceeding the actual target area due to this. The problem to be solved

[0006] The present invention aims to provide a heating plate with high accuracy in terms of temperature measurement.

[0007] The problems that the present invention aims to solve are not limited to those mentioned above. Other technical problems not mentioned will be clearly understood by those skilled in the art to which the present invention belongs from the description below. means of solving the problem

[0009] An apparatus for processing a substrate according to one example of the present invention is disclosed.

[0010] The above device includes a housing that provides a processing space inside; and a plate that supports a substrate within the housing; wherein the plate includes a plurality of heating members provided within the plate to heat the substrate; and a temperature measuring member that measures the temperature of the substrate in an area where the plurality of heating members are located; wherein the temperature measuring member is provided in a plurality, and the plurality of temperature measuring members may be provided in at least two different types.

[0011] According to one example, the temperature measuring member may include: a first temperature measuring member capable of precisely measuring the temperature of the substrate; and a second temperature measuring member for measuring a temperature that serves as a reference point for measuring the temperature of the substrate.

[0012] According to one example, the durability of the first temperature measuring member may be lower than the durability of the second temperature measuring member.

[0013] According to one example, the precision of the first temperature measuring member may be higher than the precision of the second temperature measuring member.

[0014] According to one example, the number of the first temperature measuring members may be greater than the number of the second temperature measuring members.

[0015] According to one example, the plate may further include a control unit that controls the heating member and the temperature measuring member through a value measured from the temperature measuring member.

[0016] According to one example, the control unit may control offset correction to be performed when the value measured by the first temperature measuring member differs from the reference point by more than a certain range, using the value measured by the second temperature measuring member as a reference point.

[0017] According to one example, the control unit can perform offset correction so that the value measured by the first temperature measuring member is close to the value measured by the second temperature measuring member.

[0018] According to one example, the control unit can periodically or non-periodically compare and correct the value measured by the second temperature measuring member with the value measured by the first temperature measuring member.

[0019] According to one example, the control unit may control the generation of an alarm when it is determined that the offset correction is exceeded.

[0020] According to one example, the first temperature measuring member may be an RTD sensor, and the second temperature measuring member may be a T / C sensor.

[0021] A method for performing temperature control using a substrate processing apparatus according to another example of the present invention is disclosed.

[0022] The above method may include: receiving a temperature value measured through the first temperature measuring member and the second temperature measuring member; monitoring the difference between a first temperature value measured by the first temperature measuring member and a second temperature value measured through the second temperature measuring member; and performing an offset correction by the difference between the first temperature value and the second temperature value.

[0023] According to one example, the step of performing offset correction by the difference between the first temperature value and the second temperature value; can automatically perform correction so that when the first temperature value is measured to be different from the second temperature value by a certain range or more, the first temperature value can be measured similarly to the second temperature value by setting the second temperature value as a reference point.

[0024] According to one example, the method may include a step of generating an alarm when it is determined that the offset correction is outside the possible range.

[0025] According to one example, the offset correction can be performed periodically or non-periodically. Effects of the invention

[0027] According to the present invention, even if a change resulting in reduced accuracy occurs in some sensors, normal control is possible through automatic correction using heterogeneous sensors.

[0028] According to the present invention, the usable time of the bake unit can be increased due to automatic correction.

[0029] The effects of the present invention are not limited to the effects described above. Unmentioned effects will be clearly understood by those skilled in the art from this specification and the accompanying drawings. Brief explanation of the drawing

[0031] Figure 1 is a graph showing the measurement results in a temperature control system using a conventional heater. Figure 2 is a top view of the substrate processing facility. Figure 3 is a drawing of the substrate processing facility of Figure 2 viewed from the AA direction. Figure 4 is a drawing of the substrate processing facility of Figure 2 viewed from the BB direction. Figure 5 is a drawing of the substrate processing facility of Figure 2 viewed from the CC direction. FIG. 6 is a plan view showing a bake unit according to one embodiment of the present invention. FIG. 7 is a drawing showing an example of a substrate processing device according to one embodiment of the present invention. FIG. 8 is a block diagram illustrating a temperature control method according to an embodiment of the present invention. FIG. 9 is a graph showing temperature control being performed according to the present invention. FIG. 10 is a flowchart illustrating a temperature control method according to the present invention. Specific details for implementing the invention

[0032] Embodiments of the present invention are described below with reference to the attached drawings so that those skilled in the art can easily implement them. However, the present invention may be embodied in various different forms and is not limited to the embodiments described herein. Furthermore, in describing preferred embodiments of the present invention in detail, specific descriptions of related known functions or configurations are omitted if it is determined that such detailed descriptions may unnecessarily obscure the essence of the present invention. Additionally, the same reference numerals are used throughout the drawings for parts having similar functions and operations.

[0033] The term 'comprising' a component means that, unless specifically stated otherwise, it does not exclude other components but rather allows for the inclusion of additional components. Specifically, terms such as "comprising" or "having" are intended to indicate the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

[0034] Singular expressions include plural expressions unless the context clearly indicates otherwise. Additionally, the shapes and sizes of elements in drawings may be exaggerated for clearer explanation.

[0035] Terms such as "first," "second," etc., may be used to describe various components, but said components should not be limited by said terms. These terms are used solely for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be named the second component, and similarly, the second component may be named the first component.

[0036] As used throughout this specification, the term “~part” refers to a unit that processes at least one function or operation, and may mean a hardware component such as software, an FPGA, or an ASIC, for example. However, the term “~part” is not limited to software or hardware. The “~part” may be configured to reside in an addressable storage medium or may be configured to run one or more processors.

[0037] As an example, a 'part' may include components such as software components, object-oriented software components, class components, and task components, as well as processes, functions, attributes, procedures, subroutines, segments of program code, drivers, firmware, microcode, circuits, data, databases, data structures, tables, arrays, and variables. The functions provided by the components and the 'part' may be performed separately by multiple components and 'parts', or may be integrated with other additional components.

[0038] Hereinafter, embodiments of the present invention will be described in more detail with reference to the accompanying drawings. Embodiments of the present invention may be modified in various forms, and the scope of the present invention should not be interpreted as being limited to the embodiments below. These embodiments are provided to more fully explain the present invention to those with average knowledge in the art. Accordingly, the shapes of the elements in the drawings are exaggerated to emphasize clearer explanations.

[0039] The equipment of the present embodiment can be used to perform a photolithography process on a substrate such as a semiconductor wafer or a flat panel display panel. Below, the case where a wafer is used as the substrate is described as an example.

[0040] FIGS. 2 to 5 are schematic drawings showing a substrate processing facility according to one embodiment of the present invention.

[0041] Referring to FIGS. 2 to 5, the substrate processing facility (1) includes a load port (100), an index module (200), a first buffer module (300), a coating and developing module (400), a second buffer module (500), a pre- and post-exposure processing module (600), and an interface module (700). The load port (100), the index module (200), the first buffer module (300), the coating and developing module (400), the second buffer module (500), the pre- and post-exposure processing module (600), and the interface module (700) are sequentially arranged in a line in one direction.

[0042] Hereinafter, the direction in which the load port (100), index module (200), first buffer module (300), coating and developing module (400), second buffer module (500), pre- and post-exposure processing module (600), and interface module (700) are arranged is referred to as the first direction (12), the direction perpendicular to the first direction (12) when viewed from above is referred to as the second direction (14), and the direction perpendicular to the first direction (12) and the second direction (14), respectively, is referred to as the third direction (16).

[0043] The substrate (W) is moved while stored inside the cassette (20). At this time, the cassette (20) has a structure that can be sealed from the outside. For example, a Front Open Unified Pod (FOUP) having a door at the front can be used as the cassette (20).

[0044] Below, the load port (100), index module (200), first buffer module (300), coating and developing module (400), second buffer module (500), pre- and post-exposure processing module (600), and interface module (700) will be described in detail.

[0045] The load port (100) has a mounting plate (120) on which a cassette (20) containing substrates (W) is placed. Multiple mounting plates (120) are provided, and the mounting plates (200) are arranged in a line along a second direction (14). In FIG. 2, four mounting plates (120) are provided.

[0046] The index module (200) transports a substrate (W) between a cassette (20) placed on a loading platform (120) of a load port (100) and a first buffer module (300). The index module (200) has a frame (210), an index robot (220), and a guide rail (230). The frame (210) is provided in the shape of a generally hollow rectangular prism and is placed between the load port (100) and the first buffer module (300). The frame (210) of the index module (200) may be provided at a lower height than the frame (310) of the first buffer module (300), which will be described later. The index robot (220) and the guide rail (230) are placed within the frame (210). The index robot (220) has a four-axis drive structure that allows the hand (221), which directly handles the substrate (W), to move and rotate in a first direction (12), a second direction (14), and a third direction (16). The index robot (220) has a hand (221), an arm (222), a support (223), and a base (224). The hand (221) is fixedly installed on the arm (222). The arm (222) is provided with a retractable structure and a rotatable structure. The support (223) is positioned along the third direction (16) in its longitudinal direction. The arm (222) is coupled to the support (223) so that it can move along the support (223). The support (223) is fixedly coupled to the base (224). A guide rail (230) is provided so that its longitudinal direction is positioned along the second direction (14). The base (224) is coupled to the guide rail (230) so that it can move in a straight line along the guide rail (230). Additionally, although not illustrated, the frame (210) is further provided with a door opener for opening and closing the door of the cassette (20).

[0047] The first buffer module (300) has a frame (310), a first buffer (320), a second buffer (330), a cooling chamber (350), and a first buffer robot (360). The frame (310) is provided in the shape of a hollow rectangular prism and is positioned between the index module (200) and the coating and developing module (400). The first buffer (320), the second buffer (330), the cooling chamber (350), and the first buffer robot (360) are located within the frame (310). The cooling chamber (350), the second buffer (330), and the first buffer (320) are sequentially positioned along the third direction (16) from the bottom. The first buffer (320) is positioned at a height corresponding to the coating module (401) of the coating and developing module (400) described later, and the second buffer (330) and the cooling chamber (350) are positioned at a height corresponding to the developing module (402) of the coating and developing module (400) described later. The first buffer robot (360) is positioned at a certain distance from the second buffer (330), the cooling chamber (350), and the first buffer (320) in the second direction (14).

[0048] The first buffer (320) and the second buffer (330) each temporarily store a plurality of substrates (W). The second buffer (330) has a housing (331) and a plurality of supports (332). The supports (332) are arranged within the housing (331) and are provided spaced apart from each other along a third direction (16). A substrate (W) is placed on each support (332). The housing (331) has openings (not shown) in the direction where the index robot (220) is provided, the direction where the first buffer robot (360) is provided, and the direction where the developing robot (482) is provided, so that the index robot (220), the first buffer robot (360), and the developing robot (482) of the developing module (402) described later can bring the substrate (W) into or take out of the supports (332) within the housing (331). The first buffer (320) has a structure generally similar to that of the second buffer (330). However, the housing (321) of the first buffer (320) has an opening in the direction in which the first buffer robot (360) is provided and in the direction in which the application robot (432) located in the application module (401) described later is provided. The number of supports (322) provided in the first buffer (320) and the number of supports (332) provided in the second buffer (330) may be the same or different. According to one example, the number of supports (332) provided in the second buffer (330) may be greater than the number of supports (322) provided in the first buffer (320).

[0049] The first buffer robot (360) transfers a substrate (W) between the first buffer (320) and the second buffer (330). The first buffer robot (360) has a hand (361), an arm (362), and a support (363). The hand (361) is fixedly installed on the arm (362). The arm (362) is provided with an extendable structure so that the hand (361) can move along the second direction (14). The arm (362) is coupled to the support (363) so that it can move linearly along the support (363) in the third direction (16). The support (363) has a length extending from a position corresponding to the second buffer (330) to a position corresponding to the first buffer (320). The support (363) may be provided longer in the upward or downward direction than this. The first buffer robot (360) may be provided so that the hand (361) is driven only in two axes along the second direction (14) and the third direction (16).

[0050] Each cooling chamber (350) cools the substrate (W). The cooling chamber (350) has a housing (351) and a cooling plate (352). The cooling plate (352) has an upper surface on which the substrate (W) is placed and a cooling means (353) for cooling the substrate (W). Various methods, such as cooling by cooling water or cooling using a thermoelectric element, can be used as the cooling means (353). Additionally, the cooling chamber (350) may be provided with a lift pin assembly (not shown) for positioning the substrate (W) on the cooling plate (352). The housing (351) has an opening (not shown) in the direction where the index robot (220) is provided and in the direction where the developing robot (482) is provided, so that the index robot (220) and the developing module (402) described later can bring the substrate (W) into or take out of the cooling plate (352). Additionally, the cooling chamber (350) may be provided with doors (not shown) for opening and closing the aforementioned opening.

[0051] The coating and developing module (400) performs the process of applying a photoresist on a substrate (W) before the exposure process and the process of developing the substrate (W) after the exposure process. The coating and developing module (400) generally has the shape of a rectangular parallelepiped. The coating and developing module (400) has a coating module (401) and a developing module (402). The coating module (401) and the developing module (402) are arranged to be separated by layers from each other. In one example, the coating module (401) is located on top of the developing module (402).

[0052] The coating module (401) includes a process of applying a photosensitive material, such as photoresist, to a substrate (W), and a heat treatment process, such as heating and cooling, to the substrate (W) before and after the resist coating process. The coating module (401) has a resist coating chamber (410), a bake unit (420), and a return chamber (430). The resist coating chamber (410), the bake unit (420), and the return chamber (430) are arranged sequentially along a second direction (14). Thus, the resist coating chamber (410) and the bake unit (420) are positioned spaced apart from each other in the second direction (14) with the return chamber (430) in between. Multiple resist coating chambers (410) are provided, with multiple provided in the first direction (12) and the third direction (16), respectively. An example in which six resist coating chambers (410) are provided is illustrated in the drawing. Bake units (420) are provided in multiple numbers in the first direction (12) and the third direction (16), respectively. An example in which six bake units (420) are provided is shown in the drawing. However, alternatively, bake units (420) may be provided in a larger number.

[0053] The return chamber (430) is positioned parallel to the first buffer (320) of the first buffer module (300) in the first direction (12). A coating robot (432) and a guide rail (433) are positioned within the return chamber (430). The return chamber (430) generally has a rectangular shape. The coating robot (432) transfers the substrate (W) between the bake units (420), the resist coating chambers (400), the first buffer (320) of the first buffer module (300), and the first cooling chamber (520) of the second buffer module (500) described later. The guide rail (433) is positioned so that its length direction is parallel to the first direction (12). The guide rail (433) guides the coating robot (432) to move in a straight line in the first direction (12). The dispensing robot (432) has a hand (434), an arm (435), a support (436), and a base (437). The hand (434) is fixedly installed on the arm (435). The arm (435) is provided with a retractable structure so that the hand (434) can move in a horizontal direction. The support (436) is provided so that its length direction is arranged along a third direction (16). The arm (435) is coupled to the support (436) so that it can move linearly along the support (436) in a third direction (16). The support (436) is fixedly coupled to the base (437), and the base (437) is coupled to the guide rail (433) so that it can move along the guide rail (433).

[0054] All resist coating chambers (410) have the same structure. However, the type of photoresist used in each resist coating chamber (410) may differ from one another. As an example, a chemical amplification resist may be used as the photoresist. The resist coating chamber (410) applies photoresist onto a substrate (W). The resist coating chamber (410) has a housing (411), a support plate (412), and a nozzle (413). The housing (411) has a cup shape with an open top. The support plate (412) is located within the housing (411) and supports the substrate (W). The support plate (412) is provided to be rotatable. The nozzle (413) supplies photoresist onto the substrate (W) placed on the support plate (412). The nozzle (413) has a circular tubular shape and can supply photoresist to the center of the substrate (W). Optionally, the nozzle (413) has a length corresponding to the diameter of the substrate (W), and the discharge port of the nozzle (413) may be provided as a slit. Additionally, the resist coating chamber (410) may additionally be provided with a nozzle (414) that supplies a cleaning solution, such as deionized water, to clean the surface of the substrate (W) on which the photoresist is applied.

[0055] The bake unit (420) heat-treats the substrate (W). For example, the bake units (420) perform a pre-bake process to remove organic matter or moisture from the surface of the substrate (W) by heating the substrate (W) to a predetermined temperature before applying the photoresist, or a soft bake process performed after applying the photoresist to the substrate (W), and perform a cooling process to cool the substrate (W) after each heating process.

[0056] FIG. 6 is a plan view showing a bake unit according to an embodiment of the present invention.

[0057] Referring to FIG. 6, the bake unit (420) may include a process chamber (423), a cooling plate (422), and a substrate processing device (800).

[0058] The process chamber (423) provides a heat treatment space (802) inside. The process chamber (423) may be provided to have a rectangular shape. A cooling plate (422) may cool a substrate that has been heated by a heat treatment unit. The cooling plate (422) may be located in the heat treatment space (802). The cooling plate (422) may be provided in the shape of a circular plate. A cooling means, such as cooling water or a thermoelectric element, is provided inside the cooling plate (422). For example, the cooling plate (422) may cool the heated substrate to room temperature.

[0059] The substrate processing device (800) heat-processes the substrate. The substrate processing device (800) will be described in detail in FIG. 7 below.

[0060] FIG. 7 is a drawing showing a substrate processing device (800) according to one embodiment of the present invention.

[0061] The substrate processing device (800) may include a housing (not shown), a heating plate (810), a temperature measuring member (820), a heating member (830), and a control unit (840).

[0062] A housing (not shown) provides a processing space in which a heat treatment process of a substrate (W) takes place. The housing may include insulating covers. By including insulating covers, the housing minimizes exposure of peripheral devices of the heating plate (810) to high-temperature heat generated from the heating element (830). Although not shown, the housing may include sealing members to prevent external air from entering the processing space.

[0063] A heating plate (810) is located in a heat treatment space (802). The heating plate (810) may be located on one side of a cooling plate (422). The heating plate (810) is provided in the shape of a circular plate. The upper surface of the heating plate (810) is provided as a support area on which a substrate (W) is placed. A plurality of pin holes (not shown) may be formed on the upper surface of the heating plate (810). For example, three pin holes may be provided. Each pin hole is spaced apart along the circumferential direction of the heating plate (810). The pin holes are spaced apart from each other at equal intervals. A lift pin (not shown) is provided in each pin hole. The lift pin can be moved up and down by a driving member (not shown).

[0064] The heating element (830) can heat a substrate (W) placed on a heating plate (810) to a preset temperature. Multiple heating elements (830) may be provided in different areas of the heating plate (810) to heat-treat the substrate area by area. The heating element (830) may be provided in multiple heating zones to heat each area of ​​the substrate. The heating element (830) may be a heater.

[0065] A temperature measuring member (820) is connected to a heating member (830) and can measure the temperature in a plurality of heating zones included in the heating member (830). The temperature measuring member (820) may be a sensor. The temperature measuring member (820) can measure the temperature of a substrate (W) in contact with a plurality of heating zones and transmit the measured temperature information to a control unit (840). Although FIG. 7 shows the temperature measuring member (820) and the control unit (840) connected by a wire, the temperature measuring member (820) can be connected to the control unit (840) by a wire or wirelessly to transmit and receive data.

[0066] The temperature measuring member (820) according to the present invention may be provided in a plurality. According to one example, the temperature measuring member (820) according to the present invention may be provided in a number corresponding to a plurality of heating zones. According to another example, the temperature measuring member (820) according to the present invention may be provided in a number corresponding to a heating member (830).

[0067] The temperature measuring member (820) according to the present invention may be provided in at least two different types. Referring to FIG. 7, the temperature measuring member (820) according to the present invention may include a first temperature measuring member (821) and a second temperature measuring member (822). The types of the first temperature measuring member (821) and the second temperature measuring member (822) may be different.

[0068] The first temperature measuring member (821) can measure the temperature using a sensor capable of precisely measuring the temperature of the substrate. The second temperature measuring member (822) can measure the temperature that serves as a reference point for measuring the temperature of the substrate and can use a sensor of a different type from that of the first temperature measuring member (821).

[0069] That is, in the present invention, by using a first temperature measuring member (821) and a second temperature measuring member (822) of different types among a plurality of temperature measuring members (820), an error can be corrected when a deviation occurs in the temperature of another temperature measuring member using the temperature value measured by one of the temperature measuring members as a reference point.

[0070] In the conventional system, temperature detection was performed by installing only one type of temperature sensor (RTD) within the plate. Consequently, all sensors exhibited identical characteristics regarding deformation caused by heat, leading to a problem where there was no standard sensor to serve as a reference. Therefore, in the past, when temperature-related issues arose, manual calibration or the heater's temperature sensor had to be reworked before use, making it difficult to perform process processing quickly.

[0071] According to the present invention, in a temperature control system, it is possible to automatically correct and predict abnormalities by using a heterogeneous sensor, namely a second temperature measuring member (822), to compare the deviation between the two temperature measuring members and address the problem of the first temperature measuring member (821) failing to properly control the temperature of the object due to performance degradation over time, i.e., change or deformation.

[0072] According to one example, a first temperature measuring member (821) provided to measure and control the temperature in a heating plate (810) may use a high-precision RTD sensor. According to one example, a second temperature measuring member (822), which is a sensor provided for an overtemp interlock, may use a T / C (Thermal Couple) sensor. By using different sensors (821, 822) within a single heating plate (810) to monitor the difference between them for a long time and correcting the monitored results, control-related issues due to temperature sensor deformation after a long time can be resolved.

[0073] According to one example, the durability of the first temperature measuring member (821) may be lower than the durability of the second temperature measuring member (822). According to one example, the precision of the first temperature measuring member (821) may be higher than the precision of the second temperature measuring member (822).

[0074] In the case of the first temperature measuring member (821), which directly performs temperature measurement and control as its main function, it has high precision and can perform precise temperature control based on fine units. In the case of the second temperature measuring member (822), although its precision is lower than that of the first temperature measuring member (821), by using a sensor with higher durability than that of the first temperature measuring member (821), the probability of errors occurring even at high temperatures or high pressures is reduced, thereby providing the effect of being able to use it as a sensor serving as a reference point for temperature measurement.

[0075] According to one example, RTD sensors tend to have good precision but relatively low durability, while T / C sensors tend to have good durability but relatively low precision.

[0076] According to one example, the number of first temperature measuring members (821) may be greater than the number of second temperature measuring members (822). Since there is no need to provide many second temperature measuring members (822) that serve as reference points, they may be provided in fewer numbers than the first temperature measuring members (821). Referring to FIG. 7, an example is disclosed in which one second temperature measuring member (822) is provided, and multiple first temperature measuring members (821) are provided. However, the number of second temperature measuring members (822) may be provided in greater numbers.

[0077] Referring to FIG. 7, the heating plate (810) may further include a control unit (840) that controls the heating member (830) and the temperature measuring member (820) through a value measured from the temperature measuring member (820).

[0078] The control unit (840) can control the first temperature measuring member (821) to perform offset correction when the value measured by the second temperature measuring member (822) differs from the reference point by more than a certain range. According to one example, the certain range may be a range of ±5% to ±20% relative to the reference value. ±5% may be the minimum range value for offset correction. ±20% may be the maximum range value for offset correction. However, this is merely an example and may be set differently depending on the range of the measured value in the actual temperature measuring member.

[0079] According to one example, the control unit (840) can set a range for offset correction based on a reference value. The control unit (840) determines whether the difference value between the first temperature measuring member (821) and the value measured by the second temperature measuring member (822) satisfies the minimum range value for offset correction, and if the minimum range value is satisfied, it can perform offset correction in real time. The control unit (840) determines whether the difference value between the first temperature measuring member (821) and the value measured by the second temperature measuring member (822) does not exceed the maximum range value for offset correction, and if the maximum range value is not exceeded, it can perform offset correction in real time.

[0080] The control unit (840) can perform offset correction so that the value measured by the first temperature measuring member (821) is close to the value measured by the second temperature measuring member (822). Additionally, the control unit (840) can periodically or non-periodically compare and correct the value measured by the second temperature measuring member (822) and the value measured by the first temperature measuring member (821). The control unit (840) can control the generation of an alarm when it is determined that the range for offset correction has been exceeded. That is, the control unit (840) can generate an alarm when the difference value between the value measured by the second temperature measuring member (822) and the first temperature measuring member (821) exceeds the maximum range value for offset correction.

[0081] In the present invention, the difference between the temperature reading values ​​of the RTD sensor (first temperature measuring member, 821) for temperature control in a heater system and a separate sensor (overheating interlock sensor) (second temperature measuring member, 822) is monitored periodically or non-periodically, and automatic correction is performed when a deviation occurs, thereby preventing temperature control problems caused by inaccuracies in the temperature sensor.

[0082] FIG. 8 is a block diagram illustrating a temperature control method according to an embodiment of the present invention.

[0083] Referring to FIG. 8, the heater, i.e., the heating element (830), can be controlled via a PID controller. The control of the heating element (830) can perform an interlock when overtempt is detected, and the measurements from the first temperature measuring element (821) and the second temperature measuring element (822) connected to the heating element (830) are fed back, and the offset can be automatically corrected by compensating the input value by the difference value.

[0084] According to the present invention, even if deformation occurs in the RTD control sensor, offset correction through the T / C sensor is possible, thereby enabling continuous normal temperature control. By using an automatic correction function for sensor deformation in this way, process problems caused by control abnormalities can be prevented. Furthermore, while manual correction was previously performed using a periodic temperature measurement jig, i.e., a SensArray, this invention has the advantage of eliminating the need for such correction. Additionally, the automatic correction increases the usable time of the bake unit. In other words, even if a change in accuracy occurs in some sensors, normal control is possible through automatic correction.

[0085] FIG. 9 is a graph showing temperature control being performed according to the present invention.

[0086] Referring to FIG. 9, if the temperature value measured by the first temperature measuring member (821) is measured differently from the temperature value measured by the second temperature measuring member (822) beyond a certain range, it can be seen that offset correction is performed on the temperature value of the first temperature measuring member (821) through automatic correction.

[0087] FIG. 10 is a flowchart illustrating a temperature control method according to the present invention.

[0088] Referring to FIG. 10, a method for performing temperature control using a substrate processing apparatus according to the present invention is disclosed.

[0089] The control unit (840) can receive temperature values ​​measured through the first temperature measuring member (821) and the second temperature measuring member (822). Afterward, it can monitor the difference between the first temperature value measured by the first temperature measuring member (821) and the second temperature value measured through the second temperature measuring member (822). At this time, the monitoring period may be periodic. Alternatively, the monitoring period may be non-periodic or random. If, as a result of monitoring, there is a difference between the first temperature value and the second temperature value, the control unit (840) can perform offset correction by that difference. At this time, the offset correction method can set the second temperature value as a reference point, and if the first temperature value is measured to be more than a certain range different from the second temperature value, it can automatically perform correction so that the first temperature value is measured to be similar to the second temperature value. "Above a certain range" means that the difference between the first temperature value and the second temperature value corresponds to a range greater than the minimum range for offset correction and less than or equal to the maximum range for offset correction.

[0090] The control unit (840) may generate an alarm if it determines that the offset correction range is exceeded. The case where the offset correction range is exceeded means that the difference between the first temperature value and the second temperature value exceeds the maximum range for offset correction. The above embodiments are provided to aid in understanding the present invention and do not limit the scope of the present invention; it should be understood that various modified embodiments derived therefrom also fall within the scope of the present invention. The drawings provided in the present invention merely illustrate the optimal embodiments of the present invention. The technical scope of protection of the present invention should be determined by the technical concept of the patent claims, and it should be understood that the technical scope of protection of the present invention is not limited to the literal description of the patent claims themselves, but extends substantially to inventions of equivalent technical value. Explanation of the symbols

[0092] 800: Substrate processing unit 810: Plate 820: Temperature measuring component 821: First temperature measuring member 822: Second temperature measuring member 830: Heating element 840: Control unit

Claims

Claim 1 delete Claim 2 delete Claim 3 delete Claim 4 delete Claim 5 delete Claim 6 delete Claim 7 delete Claim 8 delete Claim 9 delete Claim 10 delete Claim 11 delete Claim 12 A method for performing temperature control using a substrate processing apparatus comprising: a housing providing a processing space inside; a plate supporting a substrate within the housing, wherein the plate includes a plurality of heating members provided within the plate to heat the substrate; and a temperature measuring member for measuring the temperature of the substrate in an area where the plurality of heating members are located, wherein the temperature measuring member includes a first temperature measuring member capable of precisely measuring the temperature of the substrate; and a second temperature measuring member for measuring a temperature that serves as a reference point for measuring the temperature of the substrate, the method comprising: receiving a temperature value measured through the first temperature measuring member and the second temperature measuring member; monitoring the difference between a first temperature value measured by the first temperature measuring member and a second temperature value measured through the second temperature measuring member; and performing an offset correction by the difference between the first temperature value and the second temperature value. Claim 13 In claim 12, the step of performing offset correction by the difference between the first temperature value and the second temperature value; is a temperature control method that sets the second temperature value as a reference point and automatically performs correction so that when the first temperature value is measured to be different from the second temperature value by a certain range or more, the first temperature value can be measured similarly to the second temperature value. Claim 14 A temperature control method comprising the step of generating an alarm when it is determined that the offset correction is outside the possible range in claim 13. Claim 15 In paragraph 14, the above offset correction is a temperature control method performed periodically or non-periodically.

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