Apparatus for bonding chip and method for bonding chip using the same

Abstract

A chip bonding device according to an embodiment of the present invention comprises a body, a substrate transfer unit installed on the body for transferring a substrate, a bond head transfer unit disposed on the upper surface of the body, an alignment unit installed on the body for confirming the position of the substrate and the position of the chip, and a bond head installed on the bond head transfer unit for moving and adsorbing a chip at the bottom, wherein the bond head has a chip bonding part that adsorbs a chip at the bottom, and the chip bonding part comprises a chip bonding part body in which an installation groove is formed, a pushing module in which one end is inserted and disposed in the installation groove, and an attachment module having a deformable member that is deformed by the pushing module, wherein the deformable member may be provided with a deformable part that is deformed by being pressed by the pushing module and adsorbs a chip on its bottom surface.

Description

Technology Field

[0001] The present invention relates to a chip bonding device and a chip bonding method. Background Technology

[0003] Generally, to bond a chip and a substrate, a process of aligning the chip onto the substrate and applying pressure is required. Furthermore, in a bonding process that does not use other media for bonding the chip and the substrate, the parallelism between the chip and the substrate must be controlled to be within 100 nm to suppress bubble formation. However, in die bonding equipment that operates at high speeds and is subjected to frequent bonding loads, managing parallelism is practically difficult.

[0004] Accordingly, a method is used to bond the chip to the substrate after deforming the chip's shape by applying a load to the center of the chip; however, in this case, the deformed shape of the chip is inconsistent, leading to the problem of the chip breaking upon contact with the substrate. Furthermore, since the chip is deformed as a load is applied directly to it, there is an increased risk of chip breakage.

[0005] Accordingly, there is a need to develop a device that can prevent chip damage while preventing the formation of air bubbles between the chip and the substrate. The problem to be solved

[0007] One of the technical problems that the technical concept of the present invention aims to solve is to provide a chip bonding device and a chip bonding method capable of preventing chip damage.

[0008] In addition, one of the technical problems that the technical concept of the present invention aims to solve is to provide a chip bonding device and a chip bonding method capable of preventing the formation of bubbles between a chip and a substrate. means of solving the problem

[0010] A chip bonding device according to an exemplary embodiment comprises a body, a substrate transfer unit installed on the body for transferring a substrate, a bond head transfer unit disposed on the upper surface of the body, an alignment unit installed on the body for confirming the position of the substrate and the position of the chip, and a bond head installed on the bond head transfer unit for moving and adsorbing a chip at the bottom, wherein the bond head has a chip bonding part that adsorbs a chip at the bottom, and the chip bonding part comprises a chip bonding part body in which an installation groove is formed, a pushing module in which one end is inserted and disposed in the installation groove, and an attachment module having a deformable member that is deformed by the pushing module, wherein the deformable member may be provided with a deformable part that is deformed by being pressed by the pushing module and adsorbs a chip on its bottom surface.

[0011] A chip bonding method according to an exemplary embodiment can determine whether a chip is in contact with a deformation part provided in a deformation member, control the deformation amount of the chip while detecting the deformation amount of the deformation part through a displacement sensor, determine whether the chip is in contact with the substrate, and sequentially bond the chip to the substrate while controlling the driving of the actuator of the pushing module and the Z-axis driving part of the bond head so that the load applied to the chip is the same. Effects of the invention

[0013] A chip bonding device capable of preventing damage to a chip and a chip bonding method using the same can be provided.

[0014] In addition, a chip bonding device capable of preventing the formation of bubbles between the chip and the substrate and a chip bonding method using the same can be provided.

[0015] The various and beneficial advantages and effects of the present invention are not limited to those described above and will be more easily understood in the process of explaining specific embodiments of the present invention. Brief explanation of the drawing

[0017] FIG. 1 is a schematic diagram showing a die bonding facility including a chip bonding device according to an exemplary embodiment. FIG. 2 is an explanatory diagram for explaining the operation of a chip separation module provided in a die bonding facility according to an exemplary embodiment. FIG. 3 is a schematic perspective view showing a chip bonding device according to an exemplary embodiment. FIG. 4 is a schematic diagram showing the bond head of a chip bonding device according to an exemplary embodiment. Figure 5 is a schematic cross-sectional view showing the chip bonding portion of Figure 4. FIGS. 6 to 12 are explanatory diagrams for explaining the operation of a bond head. Specific details for implementing the invention

[0018] Preferred embodiments of the present invention will be described below with reference to the attached drawings.

[0020] FIG. 1 is a schematic diagram showing a die bonding facility including a chip bonding device according to an exemplary embodiment.

[0022] Referring to FIG. 1, the die bonding facility (10) may be configured to include a chip and substrate supply module (20), a chip separation module (30), a chip transfer module (40), and a chip bonding device (100).

[0024] The chip and substrate supply module (20) may include an Equipment Front End Module (EFEM) or a Load Port Module (LPM), and performs the function of drawing a substrate from the substrate storage unit (21) and supplying it to the chip bonding device (100), and supplying a chip from the chip storage unit (22) to the chip separation module (30). As an example, the substrate storage unit (21) may be a 300mm Front Opening Unified Pod (FOUP) or a Front Opening Shipping Box (FOSB). Additionally, the chip storage unit (22) may be a 400mm Front Opening Unified Pod (FOUP) or a MAC that stores chips attached to a ring frame.

[0026] The chip separation module (30) is a device that expands the film (31, see FIG. 2) of a ring frame so that the chip can be easily detached from it, and includes an ejector (33, see FIG. 2) that physically pushes the chip (102) up so that it can be detached from the film. Here, referring to FIG. 2, the operation of the chip separation module (30) is briefly examined. First, the film (31) to which the chip (102) is attached is expanded by the expander (32) to make it easy for the chip (102) to detach from the film (31). Afterward, the ejector (33) is positioned aligned below the chip and pushes the film (31) and the chip (102) upward. At this time, the adhesion area between the chip and the film is reduced, making it easy for the chip (102) to be separated from the film. Afterward, the pickup device (42) of the chip transfer module (40, see FIG. 1) separates the chip (102) pushed up by the ejector (33) from the film (31) and transfers it to the chip bonding device (100, see FIG. 1). At this time, the pickup device (42) may transfer the chip (102) to the chip bonding device (100) in the same state as it was separated from the film (31), or it may transfer it upside down.

[0028] Referring again to FIG. 1, the chip transfer module (40) performs the role of transferring the chip (102, see FIG. 2) separated from the film (31) in the chip separation module (30) to the chip bonding device (100). To this end, the chip transfer module (40) may be equipped with a pickup device (42) as shown in FIG. 2. Meanwhile, the chip transfer module (40) may be positioned on one side of the chip separation module (30) and the chip bonding device (100). Additionally, the chip transfer module (40) may perform the role of discharging the film (31, see FIG. 2) from which the chip (102, see FIG. 2) has been removed to the outside of the die bonding equipment (10).

[0030] A chip bonding device (100) is positioned adjacent to a chip transfer module (40) and bonds a chip (102, see FIG. 2) and a substrate (104).

[0032] FIG. 3 is a schematic perspective view showing a chip bonding device according to an exemplary embodiment.

[0034] Referring to FIG. 3, a chip bonding device (100) according to an exemplary embodiment may be configured to include, as an example, a body (110), a substrate transfer unit (120), a bond head transfer unit (130), an alignment unit (140), and a bond head (150).

[0036] As an example, a bond head transfer unit (130) is disposed on the upper surface of the body (110). Additionally, the body (110) may have a frame shape in which a substrate transfer unit (120) is disposed in the space formed by the body (110). As an example, the body (110) may be provided with an upper frame (112) on which the bond head transfer unit (130) is installed and a column frame (114) disposed between the substrate transfer unit (120). However, it is not limited thereto, and the shape of the body (110) may be varied. Furthermore, the body (110) may be further provided with a lower frame (116) to which the column frame (114) extends upward.

[0038] The substrate transfer unit (120) performs the role of transferring the substrate (104) supplied by the chip and substrate supply module (20, see FIG. 1) described above to a position where it is bonded with a chip (not shown). As an example, the substrate transfer unit (120) may be placed between the pillar frames (114) of the body (110). Meanwhile, the substrate transfer unit (120) moves the substrate (104) in the X-axis direction of FIG. 3. As an example, when the bonding of the chip and the substrate (104) is completed, the substrate transfer unit (120) transfers the substrate (104) with the chips stacked thereon to the chip and substrate supply module (20, see FIG. 1), and the chip and substrate supply module (20) can discharge it to the outside of the die bonding facility (10) using an LPM (Load Port Module).

[0040] A bond head transfer unit (130) is installed on the upper frame (112) of the body (110) and moves the bond head (150) along the upper frame (112) in the Y-axis direction of FIG. 3. As an example, the bond head transfer unit (130) may be provided with a first moving frame (132) that moves along the rail (112a) of the upper frame (112). The bond head (150) may be installed on the first moving frame (132) of the bond head transfer unit (130) and may be moved in conjunction with the first moving frame (132). Meanwhile, the bond head transfer unit (130) may be provided with a driving source (not shown) that generates a driving force for the movement of the first moving frame (132).

[0042] The alignment unit (140) performs the role of verifying the position to align the chip and the substrate. As an example, the alignment unit (140) may include a first alignment unit (142) for verifying the position of the substrate and a second alignment unit (144) for verifying the position of the chip. Meanwhile, the first alignment unit (142) may be installed on a second movable frame (142a) which is movably installed on the upper frame (112) of the body (110). Furthermore, the first alignment detection member (142b) of the first alignment unit (140) is installed on the second movable frame (142a) and can move together with the second movable frame (142a) to detect the position of the substrate placed below. Meanwhile, in this embodiment, the second moving frame (142a) is described as having a separate configuration from the first moving frame (132), but is not limited thereto, and the second moving frame (142a) and the first moving frame (132) can be formed integrally and moved in conjunction with each other.

[0043] The second alignment unit (144) may be installed on a lower frame (116) positioned at the bottom of the body (110) so as to be placed along the movement path of the bond head (150). As an example, the second alignment unit (144) may have a number of second alignment sensing members (144a) equal to the number of bond heads (150), and a fixing member (144b) on which the second alignment sensing members (144a) are installed. As an example, FIG. 3 illustrates a case in which one bond head (150) and a second alignment sensing member (144a) are provided, but is not limited thereto, and multiple bond heads (150) and second alignment sensing members (144a) may be provided.

[0045] The bond head (150) is installed on the first movable frame (132) and moves together with the first movable frame (132). As an example, multiple bond heads (150) may be installed on the first movable frame (132). More details regarding the bond head (150) will be described later.

[0047] FIG. 4 is a schematic diagram showing the bond head of a chip bonding device according to an exemplary embodiment.

[0049] Referring to FIG. 4, a bond head (150) according to an exemplary embodiment may be configured to include, as an example, a theta-axis drive unit (152), a Z-axis drive unit (154), a tilt adjustment unit (156), and a chip bonding unit (160).

[0050] The bond head (150) is positioned on the upper surface of the substrate by the bond head transfer unit (130, see FIG. 3) while the chip is in an adsorption state on the chip bonding unit (160). Subsequently, the bond head (150) transfers the chip in the Z-axis direction (see FIG. 3) by means of the Z-axis drive unit (154) provided in the bond head (150). While the chip reaches the bonding position with the substrate, the bond head (150) corrects the position error by adjusting the theta axis through the theta axis drive unit (152). Meanwhile, theta refers to the rotational component on the X,Y plane. Subsequently, the parallelism between the chip and the substrate is adjusted through the tilt adjustment unit (156). Meanwhile, the tilt adjustment unit (156) may be composed of an air gyro, and the parallelism between the chip and the substrate can be automatically adjusted by a control unit (not shown).

[0052] The chip bonding portion (160) is positioned at the bottom of the bond head (150), and the chip is adsorbed to the bottom surface. Further details regarding the chip bonding portion (160) will be described later.

[0054] Figure 5 is a schematic cross-sectional view showing the chip bonding portion of Figure 4.

[0056] Referring to FIG. 5, a chip bonding unit (160) according to an exemplary embodiment may be configured to include, as an example, a chip bonding unit body (162), a pushing module (170), and an attachment module (180).

[0058] The chip bonding body (162) may be provided with a chip adsorption channel (162a) for supplying suction force to adsorb the chip (102) to the attachment module (180). Additionally, the chip bonding body (162) may be provided with a fixing vacuum channel (162b) for fixing the attachment module (180). The attachment module (180) can be fixedly installed on the chip bonding body (162) by the suction force provided by the fixing vacuum channel (162b). Meanwhile, the chip bonding body (162) may be provided with an installation groove (162c) in which a pushing module (170) is installed, and a part of the pushing module (170) can be inserted into the installation groove (162c). Meanwhile, in this embodiment, the case in which the attachment module (180) is fixedly installed on the chip bonding body (162) by a vacuum suction method is described as an example, but it is not limited thereto, and the chip bonding body (162) and the attachment module (180) can be mutually coupled by magnetic force using a magnet. Furthermore, the chip bonding body (162) and the attachment module (180) can be fixed by screw fastening.

[0060] The pushing module (170) may be configured, for example, to include an actuator (172), a contact detection sensor (174) positioned below the actuator (172), and a push member (176) positioned below the contact detection sensor (174). Meanwhile, the actuator (172) may be equipped with a displacement sensor (178) for detecting the displacement of the push member (176). The actuator (172) performs the function of raising and lowering the push member (176) so that the push member (176) presses against the deformation member (184) of the attachment module (180) to be described later. In addition, the contact detection sensor (174) can detect whether the deformation member (184) and the chip (102) are in contact by detecting the load applied to the push member (176). Additionally, the contact detection sensor (174) can detect whether the chip (102) and the substrate (104) are in contact by detecting the load applied to the push member (176). Furthermore, the contact detection sensor (174) can also detect whether the chip (102) and the substrate (104) are in contact with a constant load.

[0061] Meanwhile, the displacement sensor (178) performs the role of detecting the displacement of the push member (176) when the deformation of the deformation member (184) occurs and when the chip (102) and the substrate (104) are joined. In other words, through the signal regarding the displacement of the push member (176) detected by the displacement sensor (178), the control unit (not shown) controls the amount of deformation of the deformation member (184) to cause the deformation of the deformation member (184) to occur, and furthermore, causes the chip (102) and the substrate (104) to be joined.

[0062] For example, the lower portion of the push member (176) may have a hemispherical shape. However, it is not limited thereto, and the lower portion of the push member (176) may have a triangular cross-section or a '+' cross-section. That is, the shape of the lower portion of the push member (176) can be changed to any shape that first contacts the push member (176) at the central portion of the deformation member (184) to be described later, and then sequentially contacts it at the edges.

[0064] The attachment module (180) may have an attachment module body (182) having an opening (182a) into which a push member (176) is inserted and disposed, and a deformation member (184) installed in the attachment module body (182) and having a deformation part (184a) that is deformed by the push member (176). Meanwhile, the attachment module body (182) may have an extension channel (182b) connected to the chip adsorption channel (162a) of the chip bonding part body (162). Accordingly, a chip can be bonded to the attachment module (180). Meanwhile, the deformation member (184) has a cylindrical shape with an open top end, and the deformation part (184a) of the deformation member (184) may be made of an elastic material so that it can be deformed by the push member (176). As an example, the deformation member (184) may be made of aluminum or stainless steel.

[0066] The operation of the bond head will be explained in more detail below with reference to the drawings.

[0068] FIGS. 6 to 12 are explanatory diagrams for explaining the operation of a bond head.

[0070] Subsequently, as illustrated in FIG. 6, the push member (176) is lowered by the actuator (172) so that the push member (176) comes into contact with the deformation portion (184a) of the deformation member (184) provided in the attachment module (180). At this time, the contact detection sensor (174) detects the contact between the deformation portion (184a) of the deformation member (184) and the push member (176).

[0072] Subsequently, as illustrated in FIG. 7, the push member (176) is continuously lowered by the actuator (172), and accordingly, the deformation portion (184a) of the deformation member (184) is deformed to be convex toward the lower side. Accordingly, the chip (102) attached to the bottom surface of the deformation member (184) is also deformed together with the deformation portion (184a). At this time, the deformation of the deformation portion (184a) by the actuator (172) is achieved by controlling the amount of deformation through information regarding the displacement of the push member (176) detected by the displacement sensor (178).

[0074] Subsequently, first, a bond head (150, see FIG. 4) is positioned on the upper part of the substrate by a bond head transfer unit (130, see FIG. 3). Then, the bond head (150) transfers the chip in the Z-axis direction (see FIG. 3) by means of a Z-axis drive unit (154, see FIG. 4) provided in the bond head (150). While the chip reaches the bonding position with the substrate, the bond head (150) corrects the position error by adjusting the theta axis through a theta-axis drive unit (152, see FIG. 4).

[0076] Afterwards, as shown in FIG. 8, the chip (102) and the substrate (104) come into contact. At this time, the contact detection sensor (174) detects the contact between the chip (102) and the substrate (104).

[0078] Subsequently, as illustrated in FIG. 9, the bond head (150) transports the chip downward in the Z-axis direction (see FIG. 3) by means of a Z-axis drive unit (154, see FIG. 4) provided in the bond head (150). At this time, the push member (176) is raised by the actuator (172) so that the load applied to the contact detection sensor (174) maintains the same load.

[0080] At this time, as illustrated in FIG. 10, the upward movement of the push member (176) by the actuator (172) can be achieved through information regarding the displacement of the push member (176) detected by the displacement sensor (178) and information regarding the downward displacement of the bond head (150) in the Z-axis direction. Also, the upward movement of the push member (176) and the downward movement of the bond head (150) can be achieved so that the contact area between the chip (102) and the substrate (104) is increased.

[0082] Subsequently, as illustrated in FIG. 11, the bond head (150) is transported in the Z-axis direction (see FIG. 3) by the Z-axis drive unit (154, see FIG. 4) provided in the bond head (150), and at the same time, the push member (176) is raised by the actuator (172). Accordingly, the chip (102) is sequentially bonded to the substrate (104) from the center of the chip (102) until the edge of the chip (102) is bonded to the substrate (104). In this way, by sequentially bonding the chip (102) to the substrate (104) from the center of the chip (102) until the edge of the chip (102) is bonded to the substrate (104), bubbles can be prevented from forming between the chip (102) and the substrate (104).

[0084] Afterwards, as shown in FIG. 12, the bond head (150) is moved upward in the Z-axis direction by the Z-axis drive unit (154, see FIG. 4) provided in the bond head (150), and the bonding process between the chip (102) and the substrate (104) is completed.

[0086] As described above, by deforming the deformation portion (184a) of the deformation member (184) to form a bond between the chip (102) and the substrate (104), it is possible to prevent excessive load from being concentrated on the chip (102). Accordingly, damage to the chip (102) can be prevented.

[0087] Furthermore, by controlling the load applied to the deformation part (184a) through information on the displacement of the push member (176) detected by the displacement sensor (178), the bonding between the chip (102) and the substrate (104) can be performed, thereby further reducing damage to the chip (102).

[0088] Furthermore, by ensuring that the substrate (104) and the chip (102) come into contact sequentially from the center of the chip (102) to the edge, it is possible to prevent bubbles from forming between the chip (102) and the substrate (104).

[0090] Although embodiments of the present invention have been described in detail above, the scope of the present invention is not limited thereto, and it will be obvious to those skilled in the art that various modifications and variations are possible within the scope of the technical concept of the present invention as described in the claims. Explanation of the symbols

[0091] 10: Die Bonding Equipment 20: Substrate supply module 30: Module for chip separation 40: Chip transfer module 100 : Chip bonding device 110 : Body 120: Substrate transfer unit 130: Bond head transfer unit 140 : Alignment unit 150 : Bond head 160 : Chip bonding section 162 : Chip bonding body 170 : Pushing Module 180: Attachment Module

Claims

Claim 1 A chip bonding device comprising: a body; a substrate transfer unit installed on the body for transferring a substrate; a bond head transfer unit disposed on the upper surface of the body; an alignment unit installed on the body for confirming the position of the substrate and the position of the chip; and a bond head installed on the bond head transfer unit, which moves and adsorbs a chip at the bottom; wherein the bond head has a chip bonding part that adsorbs a chip at the bottom; the chip bonding part includes a chip bonding part body in which an installation groove is formed; a pushing module in which one end is inserted and disposed in the installation groove; and an attachment module having a deformable member that is deformed by the pushing module; wherein the deformable member has a deformable part that is deformed by being pressed by the pushing module and adsorbs a chip on its bottom surface; and the attachment module includes an attachment module body having an opening into which one end of the pushing module is inserted and disposed, and the deformable member having the deformable part that is inserted and disposed inside the attachment module body and is deformed by the pushing module. Claim 2 In claim 1, the pushing module comprises an actuator inserted and disposed in the installation groove; a contact sensing sensor disposed below the actuator; and a pushing member disposed below the contact sensing sensor; wherein the pushing member moves up and down to contact and separate from the deformation member, forming a chip bonding device. Claim 3 In paragraph 2, the chip bonding device further comprises a displacement sensor installed in the actuator to detect the displacement of the push member, wherein the pushing module is a pushing module. Claim 4 In paragraph 2, the contact sensing sensor is a chip bonding device that detects contact between the push member and the deformation member and a load applied to the push member. Claim 5 In paragraph 2, the lower portion of the push member is a chip bonding device having a hemispherical shape. Claim 6 delete Claim 7 In claim 1, the chip bonding device is made of an elastic material such that the deformation member can be deformed by the pushing module. Claim 8 In claim 7, the above-mentioned deformation member is a chip bonding device made of aluminum or stainless steel. Claim 9 A chip bonding device according to claim 1, wherein the chip bonding body is provided with a chip adsorption channel that supplies suction force to adsorb the chip to the attachment module. Claim 10 A chip bonding device according to claim 9, wherein the attachment module comprises an attachment module body having an opening into which one end of the pushing module is inserted, and the attachment module body comprises an extension channel connected to the chip adsorption channel. Claim 11 A chip bonding device according to claim 1, wherein the chip bonding body is provided with a fixing vacuum channel for the fixed installation of the attachment module. Claim 12 A chip bonding device according to claim 1, wherein the bond head comprises a theta-axis drive unit disposed at the upper end, a Z-axis drive unit disposed below the theta-axis drive unit for lifting drive, a tilt adjustment unit disposed below the Z-axis drive unit, and a chip bonding unit disposed below the tilt adjustment unit. Claim 13 In Clause 12, the above tilt adjustment unit is a chip bonding device composed of an air gyro. Claim 14 In claim 1, the thickness of the deformation portion is thicker than the thickness of the chip in the chip bonding device. Claim 15 A chip bonding method comprising determining whether a chip is in contact with a deformation part provided in a deformation member, controlling the deformation amount of the chip while detecting the deformation amount of the deformation part through a displacement sensor, determining whether the chip is in contact with a substrate to be bonded to the chip, and sequentially bonding the chip to the substrate while controlling the driving of the actuator of the pushing module and the Z-axis driving part of the bond head so that the load applied to the chip is the same. Claim 16 A chip bonding method according to claim 15, wherein when sequentially bonding the above-mentioned chips to the above-mentioned substrate, the displacement of the push member of the pushing module is detected through the displacement sensor to control the amount of deformation of the chips while performing bonding. Claim 17 A chip bonding method according to claim 16, wherein the push member is driven to be sequentially bonded to the substrate from the center of the chip to the edge of the chip while gradually rising by the actuator as the bond head descends. Claim 18 A chip bonding method according to claim 15, wherein the chip bonding portion of the bond head is lowered toward the substrate side by the Z-axis driving unit before determining whether the chip and the substrate are in contact. Claim 19 A chip bonding method according to claim 15, wherein the chip is deformed in conjunction with the deformation of the deformation part of the deformation member. Claim 20 A chip bonding method according to claim 19, wherein the deformation portion of the deformation member is made of an elastic material, the pushing module is provided with a pushing member that presses the deformation member, and the lower portion of the pushing member has a hemispherical shape.

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