Electronic component handling equipment and electronic component testing equipment

Abstract

(Problem) To provide an electronic component handling device that can improve responsiveness and prevent damage to the heater. (Solution) A handler (3) handling the DUT (300) is equipped with a pusher (6) that electrically connects the DUT (300) and the socket (2) by pressing the DUT (300) toward the socket (2). The pusher (6) is equipped with a temperature control device (7) that adjusts the temperature of the DUT (300). The temperature control device (7) includes a heater unit (71) which is a heating source. The heater unit (71) includes a planar heater (72), a first heat transfer material (73) disposed on the first surface (721a) of the planar heater (72), and a second heat transfer material (74) disposed on the second surface (721b) of the planar heater (72).

Description

Technology Field

[0001] The present invention relates to an electronic component handling device and an electronic component testing device used for testing electronic components under test (hereinafter simply referred to as "DUT" (Device Under Test)), such as semiconductor integrated circuit elements. Background Technology

[0002] An electronic component test device is equipped with a handler that transports the DUT (see, for example, Patent Document 1). This handler holds the DUT by adsorbing it with a contact arm and presses it against the socket of a test head. A pusher for pressing the DUT against the socket is installed at the lower part of the contact arm of this handler, and a heater for controlling the temperature of the DUT is installed inside the pusher. Prior art literature

[0003] International Publication No. 2009 / 057203 The problem to be solved

[0004] In the aforementioned electronic component testing device, a ceramic heater in which a heating element is embedded in a ceramic is generally used as the heater. However, since ceramic heaters have a large mass, they have a large heat capacity and a slow rate of heating. Consequently, there is a problem in that responsiveness may deteriorate in temperature control using this ceramic heater.

[0005] In addition, there is a problem with such ceramic heaters where the heater may be damaged if the heating element heats up rapidly, causing the ceramic to undergo localized thermal expansion and distortion.

[0006] The problem that the present invention aims to solve is to provide an electronic component handling device and an electronic component testing device that can improve responsiveness and prevent damage to the heater. means of solving the problem

[0007] [1] The electronic component handling device according to the present invention is an electronic component handling device that handles a DUT or a carrier containing the DUT, and has a pressing device that electrically connects the DUT and the socket by pressing the DUT or the carrier toward the socket, and the pressing device has a temperature control device that adjusts the temperature of the DUT, and the temperature control device includes a heater unit that is a heating source, and the heater unit includes a planar heater, a first heating material disposed on a first surface that is one side of the planar heater, and a second heating material disposed on a second surface that is the other side of the planar heater.

[0008] [2] In the above invention, the first and second heat transfer materials may preferentially diffuse heat from the planar heater in a first direction parallel to the main surface of the planar heater.

[0009] [3] In the above invention, the first and second heat transfer materials may be graphite sheets.

[0010] [4] In the above invention, the heater unit may be a sheet-shaped laminate having a thickness of 400 μm or less.

[0011] [5] In the above invention, the surface heater may include a first resin layer, a second resin layer laminated to the first resin layer, and a metal wiring layer sandwiched between the first and second resin layers.

[0012] [6] In the above invention, the surface heater may be a polyimide heater.

[0013] [7] In the above invention, the temperature control device may further include a cooler unit that is in contact with the heater unit and is a cooling source, and the cooler unit may include a passage for circulating refrigerant.

[0014] [8] In the above invention, the pressure device further comprises a pressure mechanism that pressurizes the cooler unit toward the heater unit, and the cooler unit may pressurize the heater unit by being pressurized by the pressure mechanism.

[0015] [9] In the above invention, the pressure device may further have a contact plate that contacts the DUT or the carrier, and the cooler unit may press the heater unit by being pressurized by the pressure mechanism, and the heater unit may come into contact with the contact plate by being pressurized by the cooler unit.

[0016]

[10] In the above invention, the cooler unit has a nozzle member having a nozzle for spraying refrigerant, and a cold plate that is positioned opposite to the nozzle and spaced apart from the nozzle, through which the refrigerant is sprayed from the nozzle member. The flow path includes an air gap formed between the nozzle member and the cold plate, and the refrigerant sprayed from the nozzle may flow through the air gap after reaching the cold plate.

[0017]

[11] In the above invention, the cold plate has a first opposing surface facing the nozzle member, the nozzle member has a second opposing surface facing the cold plate, and the air gap is formed between the first opposing surface and the second opposing surface, and the first and second opposing surfaces may both be flat.

[0018]

[12] In the above invention, the nozzle is positioned approximately at the center of the second opposing surface, and the second opposing surface includes a plurality of grooves extending outward in the radial direction from the nozzle to the nozzle member, and the plurality of grooves may be formed at approximately equal intervals.

[0019]

[13] In the above invention, the width of the groove may be widened as it approaches the center of the second opposing surface.

[0020]

[14] In the above invention, the second opposing surface is formed on the outside of the groove and includes a step that is annularly connected, and the height of the second opposing surface on the outside of the step may be higher than the height of the second opposing surface on the inside of the step.

[0021]

[15] In the above invention, the thickness of the air gap may be 1 mm or less.

[0022]

[16] In the above invention, the pressing device may further have a contact plate that contacts the DUT or the carrier, the heater unit may be in contact with the contact plate, the cold plate may be in contact with the heater unit, and the heater unit may be pressed toward the contact plate.

[0023]

[17] An electronic component handling device in which the sum of the thickness of the cold plate, the thickness of the heater unit, and the thickness of the contact plate is 2 mm or less in the above invention.

[0024]

[18] The electronic component testing device according to the present invention is an electronic component testing device for testing a DUT, and is an electronic component testing device equipped with the electronic component handling device described above and a tester having a socket. Effects of the invention

[0025] In the electronic component handling device and electronic component testing device according to the present invention, the heater unit of the temperature control device has a planar heater. Since this planar heater has a small thickness, the thermal capacity of the planar heater is smaller compared to the thermal capacity of the ceramic heater described above. For this reason, the heating rate of the heater unit using the planar heater can be improved, thereby enabling an improvement in responsiveness.

[0026] In addition, since first and second heat transfer materials are installed on the first and second surfaces of the planar heater, heat can be dissipated from the planar heater by the first and second heat transfer materials even when the planar heater is heated rapidly. This allows for the prevention of damage to the planar heater. Brief explanation of the drawing

[0027] FIG. 1 is a block diagram showing an example of the configuration of an electronic component test device in an embodiment of the present invention. FIG. 2 is a cross-sectional view showing the state of the pusher before adsorbing and maintaining the DUT in an embodiment of the present invention. FIG. 3 is a cross-sectional view showing the state after adsorbing and maintaining the DUT of the pusher in an embodiment of the present invention. FIG. 4(a) is an enlarged cross-sectional view of section IVa of FIG. 2, and FIG. 4(b) is an enlarged cross-sectional view of section IVb of FIG. 3. FIG. 5 is a perspective view of a retainer in an embodiment of the present invention viewed from below. FIG. 6 is an enlarged cross-sectional view of a contact plate and a temperature control device in an embodiment of the present invention. Figure 7 is an enlarged cross-sectional view of part VII of Figure 6. FIG. 8 is a plan view showing an example of the configuration of a heater unit of an embodiment of the present invention. FIG. 9 is a perspective view seen from below showing a nozzle member in an embodiment of the present invention. Specific details for implementing the invention

[0028] Embodiments of the present invention will be described below based on the drawings.

[0029] FIG. 1 is a block diagram showing an example of the configuration of an electronic component test device in the present embodiment. FIG. 2 is a cross-sectional view showing the state before the pusher in the present embodiment adsorbs and holds the DUT, and FIG. 3 is a cross-sectional view showing the state after the pusher in the present embodiment adsorbs and holds the DUT. FIG. 4(a) is an enlarged cross-sectional view of section IVa of FIG. 2, and FIG. 4(b) is an enlarged cross-sectional view of section IVb of FIG. 3. FIG. 5 is a perspective view of the retainer in the present embodiment viewed from below.

[0030] The electronic component test device (100) in the present embodiment shown in FIG. 1 is a device for testing the electrical characteristics of a DUT (300). Specific examples of the DUT (300) to be tested may include a System on a chip (SoC), a logic device, or a memory device. As shown in FIG. 2, the DUT (300) in the present embodiment is equipped with a substrate (301), an IC chip (302), a temperature detection circuit (303), a mold resin (304), and a plurality of terminals (305).

[0031] In this DUT (300), an IC chip (302) and a temperature detection circuit (303) are mounted on the upper surface of a substrate (301), and the IC chip (302) and the temperature detection circuit (303) are covered by a mold resin (304). Additionally, a terminal (305) electrically connected to the IC chip (302) and the temperature detection circuit (303) is installed on the lower surface of the substrate (301), and these terminals (305) are electrically connected by contacting a socket (2) to be described later. Furthermore, in this embodiment, the temperature detection circuit (303) is described as a separate electronic component from the IC chip (302), but it is not limited thereto, and the temperature detection circuit (303) may be included in the IC chip (302).

[0032] As shown in FIG. 1, the electronic component testing device (100) is equipped with a tester (1) for testing a DUT (300), a socket (2) for electrically connecting the DUT (300) and the tester (1), and a handler (3) for transporting the DUT (300) and pressing it against the socket (2).

[0033] The tester (1) is equipped with a main frame (11) and a test head (12). The main frame (11) is connected to the test head (12) via a cable (13). The main frame (11) transmits a test signal to the DUT (300) via the test head (12) to test the DUT (300) and evaluates the DUT (300) according to the test results. The test head (12) is connected to the main frame (11) via a cable (13) and transmits the test signal transmitted from the main frame (11) to the DUT (300) during the test of the DUT (300).

[0034] As shown in FIG. 3, the test head (12) is electrically connected to the DUT (300) through a socket (2). The socket (2) is equipped with a socket body (21) and a contactor (22). The socket body (21) is fixed to the upper surface of the test head (12). The contactor (22) is positioned on the socket body (21). Although not specifically illustrated, the contactor (22) is electrically connected to a load board, etc., positioned on the upper surface of the test head (12), and is also electrically connected to the DUT (300) by contacting the terminal (305) of the DUT (300). In this embodiment, a pogo pin is used as the contactor (22), but something other than a pogo pin may be used as the contactor (22). For example, a cantilever-type probe needle, an anisotropic rubber sheet, or a membrane-type contactor with bumps formed on an insulating film may be used.

[0035] As shown in FIG. 1, the DUT (300) is pressed into the socket (2) by the handler (3). The handler (3) is equipped with a constant temperature bath (4), a contact arm (5), a pusher (6), and a refrigerant supply unit (9). In addition, the handler (3) in this embodiment corresponds to an example of an "electronic component handling device" in the present invention, and the pusher (6) in this embodiment corresponds to an example of a "pressure device" in the present invention.

[0036] The constant temperature bath (4) can adjust the internal atmosphere temperature to a desired temperature and can apply a high or low temperature to the DUT (300). The constant temperature bath (4) is not specifically limited, but, for example, can adjust the temperature in the range of -55℃ to +155℃. This constant temperature bath (4) accommodates a contact arm (5) and a pusher (6). In addition, the constant temperature bath (4) accommodates a socket (2) through an opening formed at the bottom of the constant temperature bath (4). In addition, the handler (3) does not need to be equipped with the constant temperature bath (4).

[0037] The contact arm (5) is supported on a rail (not shown) provided by the handler (3). The contact arm (5) is equipped with a horizontal movement actuator (not shown) and is capable of moving back and forth and side to side along the rail. Additionally, the contact arm (5) is equipped with an up-and-down movement actuator (not shown) and is capable of moving in the up-and-down direction.

[0038] A pusher (6) is positioned at the bottom of this contact arm (5). As shown in FIG. 2, this pusher (6) is equipped with a pusher body (61), a contact plate (62), a retainer (63), an adsorption pad (68), a vertical guide (69), a temperature control device (7), and a pressure mechanism (8).

[0039] As shown in FIG. 2, the pusher body (61) in this embodiment has a plurality (two in this example) of first suction holes (611), a first refrigerant supply hole (612), and a plurality (two in this example) of first refrigerant recovery holes (613). The first suction hole (611) is a through hole that opens at the bottom surface of the pusher body (61), and the opening is connected to the second suction hole (67) (described later) of the retainer (63). This first suction hole (611) is connected to a vacuum pump (not shown), and the interior of the first suction hole (611) is subjected to negative pressure by this vacuum pump.

[0040] The first refrigerant supply hole (612) is a through hole that opens from the lower surface of the pusher body (61), and the supply-side tubular part (772) (described later) of the refrigerant guide (77) (described later) is inserted into this first refrigerant supply hole (612). Refrigerant is supplied to this first refrigerant supply hole (612) from a refrigerant supply source (200) installed outside the handler (3). Additionally, the first refrigerant recovery hole (613) is a through hole that opens from the lower surface of the pusher body (61), and the recovery-side tubular part (773) (described later) of the refrigerant guide (77) (described later) is inserted into this first refrigerant recovery hole (613). Refrigerant that has been used in the temperature control device (7) is recovered into this first refrigerant recovery hole (613). In addition, the aforementioned first suction port (611), first refrigerant supply port (612), and first refrigerant recovery port (613) may be installed in a part other than the pusher body (61).

[0041] As shown in FIG. 2, the contact plate (62) is a plate having a convex shape that is folded and bent so as to protrude downward. As shown in FIG. 3, the contact plate (62) is a member that comes into direct contact with the DUT (300) while the pusher (6) is holding the DUT (300). In addition, the temperature control device (7) heats or cools the DUT (300) through this contact plate (62).

[0042] As a material constituting this contact plate (62), a metal having an insulating film formed on its surface can be used. Specifically, for example, aluminum having an anodic oxide film on its surface can be used. In order to transfer heat from the temperature control device (7) to the DUT (300), it is preferable that the contact plate (62) be composed of a metal material having high thermal conductivity. In addition, by using a metal having an insulating film formed on its surface, electronic noise generated from the pusher (6) can be shielded from the DUT (300), and the pusher (6) can be electrically insulated from the DUT (300). Also, to prevent electrostatic discharge (ESD), the contact plate (62) may be electrically connected to ground, although not specifically shown.

[0043] This contact plate (62) has a contact portion (621) and a side portion (622). The contact portion (621) is extended along a direction approximately parallel to the DUT (300). This contact portion (621) has a contact surface (621a) that contacts the DUT (300). In this embodiment, the contact surface (621a) is the lower surface of the contact portion (621), and as shown in FIG. 3, it contacts and presses against the DUT (300) when the pusher (6) holds the DUT (300). Additionally, the above-mentioned temperature control device (7) applies heat to the DUT (300) through this contact surface (621a). As shown in FIG. 4(a), the thickness (T1) of this contact portion (621) is not particularly limited but can be 500 μm to 550 μm (500 μm ≤ T1 ≤ 550 μm).

[0044] As shown in FIG. 2, the width (W) of this contact surface (621a) C ) is the width (W) of the DUT (300) as in the following (1) equation. D Along with being smaller than ) and as in equation (2), the width of the retainer (W RIt is smaller than ). In this way, by making the width of the contact surface (621a) of the contact plate (62) smaller, the rate of temperature change of the contact part (621) can be improved during temperature control of the DUT (300) by the temperature control device (7) which can reduce the thermal capacity of the contact part (621). That is, the responsiveness of temperature control by the pusher (6) can be improved.

[0045] W D >W C … (1)

[0046] W R >W C … (2)

[0047] However, in the above equation (1), W D is the width of DUT (300), and W C is the width of the contact surface (621a) of the contact plate (62), and in the above equation (2), W R This is the width of the retainer (63).

[0048] The side (622) of the contact plate (62) is connected to the outer edge of the contact portion (621) and extends along a direction approximately perpendicular to the contact portion (621). This side (622) has a catch surface (622a) and a side surface (622b). In this embodiment, the catch surface (622a) is the lower surface of the side (622). This catch surface (622a) is an inclined surface having an annular shape that surrounds the contact surface (621a), and is inclined so that the width of the contact plate (62) widens as it moves away from the contact surface (621a). As shown in FIGS. 2 and FIGS. 4(a), this catch surface (622a) is a surface that contacts the retainer (63). Additionally, the side (622b) is a side connected to the top of the catch surface (622a) and extends along a direction approximately perpendicular to the contact portion (621). This side (622b) is always spaced apart from the retainer (63).

[0049] The retainer (63) is a member that holds the contact plate (62). As shown in FIG. 2, this retainer (63) is positioned on the lower surface of the pusher body (61). As shown in FIG. 2 and FIG. 5, the retainer (63) in this embodiment has an annular shape and surrounds the contact plate (62). Also, as shown in FIG. 2, the retainer (63) is spaced apart from the temperature control device (7), and a space (S) is formed between the retainer (63) and the temperature control device (7). Because heat generated from the temperature control device (7) is difficult to transfer to the retainer (63) due to this space (S), the temperature control of the DUT (300) can be performed efficiently.

[0050] As shown in FIG. 5, this retainer (63) is equipped with a frame-shaped part (64), a retaining part (65), and a plurality of second suction holes (67). The frame-shaped part (64) has an annular shape. As shown in FIG. 2, this frame-shaped part (64) is fixed to the lower surface of the pusher body (61). Additionally, although not specifically limited, the frame-shaped part (64) can be fixed to the pusher body (61) by means of a fastener such as a bolt.

[0051] As shown in FIGS. 2 and 5, a retaining part (65) is formed on the lower surface of the mold-shaped part (64) to contact and hold the contact plate (62). In this embodiment, the retaining part (65) is provided with a plurality (four in this example) of claw parts (66a to 66d) (hereinafter collectively referred to as claw parts (66)).

[0052] The claw portion (66) protrudes downward from the lower surface of the mold-shaped portion (64). This claw portion (66) is arranged to surround all four sides of the contact plate (62). In this embodiment, a pair of claw portions (66a, 66b) are arranged to face each other, and a pair of claw portions (66c, 66d) are arranged to face each other.

[0053] In addition, these claws (66a to 66d) are spaced apart from each other and surround the contact plate (62) along the annular catch surface (622a) of the contact plate (62). By holding the contact plate (62) with the claws (66) arranged spaced apart in this way, the contact area between the holding part (65) and the contact plate (62) can be reduced, and it becomes difficult for heat to escape from the contact plate (62) to the holding part (65). Therefore, the temperature control of the DUT (300) can be performed efficiently.

[0054] Additionally, as shown in FIG. 5, the claw portion (66) has a protrusion (661) and an opening (662). The protrusion (661) of this embodiment is positioned at the bottom of the claw portion (66) as shown in FIG. 4(a) and protrudes toward the contact plate (62). The protrusion (661) in this embodiment has a retaining surface (661a). This retaining surface (661a) is an inclined surface that is approximately parallel to the catch surface (622a) of the contact plate (62) and faces the catch surface (622a) of the contact plate (62). This retaining surface (661a) holds the contact plate (62) by supporting the catch surface (622a) from below when the contact plate (62) is not in contact with the DUT (300). At this time, the locking surface (622a) of the contact plate (62) is not fixed to the retaining surface (661a) of the retainer (63) by means of adhesive or screw, and the contact plate (62) is retained to the retainer (63) so as to be detachable.

[0055] As shown in FIG. 5, the claw portions (66a, 66b) have an opening (662). This opening (662) penetrates the claw portions (66a, 66b) in a horizontal direction. Through this opening (662), heat is difficult to escape from the contact plate (62) to the claw portions (66a, 66b), and the retainer (63) can also be made lighter.

[0056] The second suction hole (67) penetrates the frame shape part (64) and the claw part (66c, 66d). The upper end of this second suction hole (67) is connected to the first suction hole (611) of the pusher body (61). Since this second suction hole (67) is connected to a vacuum pump (not shown) through the first suction hole (611), the interior of the second suction hole (67) becomes negative pressure.

[0057] As shown in FIGS. 3 and 4(b), an adsorption pad (68) is placed at the bottom of the second suction hole (67). By contacting the DUT (300), the adsorption pad (68) forms a space enclosed by the adsorption pad (68) and the DUT (300). Since this space is connected to the second suction hole (67), the DUT (300) can be adsorbed and maintained on the bottom surface (66e) of the claw (66c, 66d).

[0058] As shown in FIG. 4(b), when the adsorption pad (68) adsorbs the DUT (300), the contact surface (621a) of the contact plate (62) is in contact with the DUT (300). At this time, since the catch surface (622a) of the contact plate (62) is not fixed to the retaining surface (661a) of the retainer (63), the contact plate (62) is pushed upward by the DUT (300), and the contact plate (62) moves away from the retainer (63). By moving the contact plate (62) away from the retainer (63) in this way, heat can be prevented from escaping to the retainer (63) during temperature control of the DUT (300) by the temperature control device (7). That is, the thermal capacity of the component interposed between the temperature control device (7) and the DUT (300) can be reduced, thereby improving the responsiveness of the temperature control.

[0059] As shown in FIGS. 2 and 3, a temperature control device (7) is disposed on the inside of this contact plate (62). This temperature control device (7) adjusts the temperature of the DUT (300) through the contact plate (62).

[0060] FIG. 6 is an enlarged cross-sectional view of the contact plate and temperature control device in the present embodiment, and FIG. 7 is an enlarged cross-sectional view of part VII of FIG. 6. FIG. 8 is a plan view showing an example of the configuration of the heater unit in the present embodiment. As shown in FIG. 6, the temperature control device (7) is equipped with a heater unit (71) which is a heating source and a cooler unit (75) which is a cooling source.

[0061] The heater unit (71) is disposed on the contact portion (621) of the contact plate (62). The heater unit (71) is a sheet-shaped laminate formed by laminating a planar heater (72), a first heat transfer material (73), and a second heat transfer material (74). The thickness (T2) of the heater unit (71) is not particularly limited, but is 400 μm or less (T2 ≤ 400 μm).

[0062] As shown in FIGS. 6 to 8, the planar heater (72) has a planar shape (sheet shape). Since the thickness of such a planar heater (72) is thin, the heat capacity of the planar heater (72) is smaller compared to the heat capacity of a ceramic heater, etc. Because of this, the heating speed of the temperature control device (7) can be increased, thereby improving responsiveness.

[0063] As shown in FIG. 6, the thickness (T3) of such a planar heater (72) is not particularly limited, but can be 100 μm to 150 μm (100 μm ≤ T3 ≤ 150 μm). In addition, as the planar heater (72), a resin film heater such as a polyimide heater or a polyester heater can be used. In particular, it is preferable to use a polyimide heater as the planar heater (72). Polyimide heaters have excellent heat resistance among heaters using resin. Also, since polyimide heaters are cheaper compared to ceramic heaters, etc., cost reduction can be achieved.

[0064] As shown in FIG. 8, the planar heater (72) has a heater section (72a) and an outlet section (72b). The heater section (72a) is the part that heats the contact plate (62). Meanwhile, the outlet section (72b) has a strip-like shape extending from the heater section (72a) and is the part used for connecting to a power source to supply power to the planar heater (72).

[0065] As shown in FIGS. 6 and 8, this planar heater (72) has a resin layer (721), metal wiring (724), and terminals (725) (see FIG. 8). The resin layer (721) is a planar layer. As shown in FIG. 7, the resin layer (721) includes a first resin layer (722) and a second resin layer (723) laminated on the first resin layer (722). The first resin layer (722) and the second resin layer (723) are not particularly limited but are resin films and are attached to each other through an adhesive, etc., which is not shown. Additionally, the first and second resin layers (722, 723) may be attached to each other without using an adhesive. The first and second resin layers (722, 723) are composed of resin materials such as polyimide or polyester, for example. In particular, it is desirable to use polyimide as a resin material from the perspective of heat resistance.

[0066] A metal wire (724) is sandwiched between the first and second resin layers (722, 723). This metal wire (724) is made of a metal, such as stainless steel. As shown in FIG. 8, the metal wire (724) is serrated in the heater section (72a) and connected to a terminal (725) in the output section (72b). This terminal (725) is electrically connected to the aforementioned power source.

[0067] As shown in FIGS. 6 to 8, a first heat transfer material (73) is disposed on the first surface (upper surface) (721a) of the planar heater (72). Additionally, a second heat transfer material (74) is disposed on the second surface (lower surface) (721b) of the planar heater (72). These first and second heat transfer materials (73, 74) are heat-conducting materials that dissipate heat generated from the planar heater (72) from the planar heater (72). The thickness (T4, T5) of these first and second heat transfer materials (73, 74) is not particularly limited, but can be 50 μm to 100 μm (50 μm ≤ T4, T5 ≤ 100 μm).

[0068] In such a planar heater, since the metal wiring generates heat, a local temperature rise occurs in the vicinity of the metal wiring, and consequently, the temperature of the resin layer in the vicinity of the metal wiring becomes too high in the vicinity of the metal wiring, which can cause the resin layer to burn out. Meanwhile, in the heater unit (71) of the present embodiment, heat is diffused to a part other than the vicinity of the metal wiring (724) by means of the first and second heat transfer materials (73, 74), thereby suppressing the local temperature rise in the vicinity of the metal wiring (724) and preventing the occurrence of burnout of the resin layer (721).

[0069] For example, a Thermal Interface Material (TIM) can be used as the first and second thermal materials (73, 74). For example, a metal foil composed of aluminum or copper, a graphite sheet, a silicone rubber sheet containing a thermally conductive filler, a sheet containing carbon nanotubes (CNT), and a gel containing a thermally conductive filler can be used as the TIM.

[0070] It is preferable that the first and second heat transfer materials (73, 74) preferentially diffuse heat from the planar heater (72) into a first direction (in this example, a horizontal direction) parallel to the first and second circumferential surfaces (721a, 721b) of the planar heater (72). Furthermore, a heat transfer material that preferentially diffuses heat into the first direction refers to a heat transfer material in which, when pressed under a predetermined pressure, the thermal conductivity in the first direction is greater than the thermal conductivity in the direction perpendicular to the first direction. As such a material, the aforementioned graphite sheet or a sheet manufactured by binding CNTs that are continuous along the first direction can be used.

[0071] As shown in FIG. 7, in the planar heater (72), the metal wiring (724) generates heat, so heat tends to concentrate in the first part (73a) located near the metal wiring (724) of the first heating material (73). On the other hand, heat tends to concentrate relatively in the second part (73b) located far from the metal wiring (724) of the first heating material (73). Therefore, by using the first heating material (73) that preferentially diffuses heat in the first direction as in the present embodiment, heat can be preferentially transferred from the first part (73a) toward the second part (73b), thereby suppressing the excessive heating of the first part (73a). Because of this, the localized high temperature of the part near the metal wiring (724) of the planar heater (72) can be effectively suppressed. In addition, for the same reason, the area near the metal wiring (724) of the planar heater (72) can be effectively suppressed from becoming locally high temperature with respect to the second heating material (74).

[0072] As shown in FIGS. 2 and 6, a cooler unit (75) is placed on a heater unit (71). This cooler unit (75) cools the heater unit (71) that is heating up to adjust the temperature of the heater unit (71) to a desired temperature. In addition, the DUT (300) can be cooled through the heater unit (71) and the contact plate (62) by this cooler unit (75).

[0073] As shown in FIGS. 2 and 6, this cooler unit (75) is equipped with a cold plate (76), a refrigerant guide (77), a nozzle member (78), and a flow path (79). The cold plate (76) is a cylindrical plate with a bottom. This cold plate (76) is placed on a heater unit (71) and is a member that cools by contacting the heater unit (71). As for the material constituting this cold plate (76), a metal having an insulating film formed on its surface, similar to the contact plate (62) described above, may be used.

[0074] The thickness (T6) of the cold plate (76) is, for example, 300 μm to 400 μm (300 μm ≤ T6 ≤ 400 μm). In addition, the sum (T7) of the thickness (T6) of the cold plate (76), the thickness (T2) of the heater unit (71), and the thickness (T1) of the contact plate is 2 mm or less (T6 + T2 + T1 ≤ 2 mm). In this way, the responsiveness of the temperature control can be improved by shortening the distance between the cold plate (76) and the DUT (300).

[0075] In addition, this cold plate (76) has a first opposing surface (76a) facing the nozzle member (78). This first opposing surface (76a) is flat.

[0076] A refrigerant guide (77) is positioned to fit into the upper opening of the cold plate (76), and the refrigerant guide (77) seals the internal space of the cold plate (76). As shown in FIG. 2, this refrigerant guide (77) is a component for guiding the refrigerant supplied from the first refrigerant supply port (612) of the pusher body (61) into the interior of the cooler unit (75), and for guiding the refrigerant used for cooling to the first refrigerant recovery port (613) of the pusher body (61).

[0077] As shown in FIGS. 2 and 6, this refrigerant guide (77) has a pressure section (771), a supply-side tubular section (772), and a plurality of recovery-side tubular sections (773). The pressure section (771) is the main body of the refrigerant guide (77) and presses the nozzle member (78) downward.

[0078] As shown in FIGS. 2 and 6, a supply-side tubular portion (772) is positioned approximately at the center of the upper surface of the pressure portion (771). As shown in FIG. 2, the supply-side tubular portion (772) is a tubular member extending upward from the upper surface of the pressure portion (771) and is inserted into the first refrigerant supply hole (612) of the pusher body (61). Inside the supply-side tubular portion (772), a second refrigerant supply hole (772a) is formed, which constitutes part of the flow path (79), and this second refrigerant supply hole (772a) extends to the lower surface of the pressure portion (771).

[0079] A plurality of recovery-side cylindrical parts (773) are arranged on the upper surface of the pressure-side part (771). As shown in FIG. 2, the recovery-side cylindrical part (773) is a cylindrical member extending upward from the upper surface of the pressure-side part (771) and is inserted into the first refrigerant recovery hole (613) of the pusher body (61). Inside the recovery-side cylindrical part (773), a second refrigerant recovery hole (773a) is formed, which constitutes part of the flow path (79), and this second refrigerant recovery hole (773a) extends to the lower surface of the pressure-side part (771).

[0080] As shown in FIGS. 2 and 6, the nozzle member (78) is interposed between the cold plate (76) and the refrigerant guide (77). This nozzle member (78) is a member that sprays refrigerant onto the cold plate (76). As shown in FIG. 6, this nozzle member (78) has a through hole (781), a nozzle (782), and a projection (785). The through hole (781) is connected to the second refrigerant supply hole (772a) of the refrigerant guide (77). The through hole (781) forms part of the flow path (79). The nozzle (782) is formed approximately at the center of the lower surface (second opposing surface (78a)) of the through hole (781). This nozzle (782) is spaced apart from the cold plate (76) and sprays the refrigerant supplied from the second refrigerant supply hole (772a) of the refrigerant guide (77) toward the cold plate (76).

[0081] Additionally, the nozzle member (78) has a second opposing surface (78a) that is spaced apart from the first opposing surface (76a) and faces the first opposing surface (76a) of the cold plate (76). Because of this, an air gap (791) is formed between the first opposing surface (76a) and the second opposing surface (78a). This air gap (791) also forms part of the flow path (79), and the refrigerant sprayed from the nozzle (782) flows through the air gap (791) after reaching the first opposing surface (76a) of the cold plate (76). By flowing the refrigerant through the air gap (791) on the cold plate (76), the refrigerant can be accelerated on the first opposing surface (76a), thereby improving the cooling speed. Because of this, the responsiveness in temperature control can be improved.

[0082] The refrigerant circulating through the air gap (791) is recovered into the second refrigerant recovery hole (773a) through the gap between the side of the nozzle member (78) and the cold plate (76) and the gap between the upper surface of the nozzle member (78) and the refrigerant guide (77).

[0083] FIG. 9 is a perspective view from below showing a nozzle member (78) in the present embodiment. The second opposing surface (78a) is flat. This second opposing surface (78a) includes a plurality (four in this example) of grooves (783) and steps (784). The plurality of grooves (783) extend outward in the radial direction from the nozzle opening (782) to the nozzle member (78). By forming such grooves (783), the refrigerant sprayed from the nozzle opening (782) can be guided into the grooves (783) and flow outward in the radial direction.

[0084] In addition, the width of the groove (783) widens as it approaches the center of the second opposing surface (78a). Because of this, the refrigerant can be circulated at high speed even at the leading edge of the groove (783).

[0085] In addition, multiple grooves (783) are arranged at approximately equal intervals along the circumferential direction of the nozzle (782) with the nozzle (782) as the center. This allows the refrigerant to flow evenly outward in the radial direction through the air gap (791).

[0086] A step (784) is formed on the outer side of this groove (783). This step (784) has an annular shape. The second opposing surface (78a) is partitioned by this step (784) and includes an outer opposing surface (78b) located on the outer side of the step (784) and an inner opposing surface (78c) located on the inner side of the step (784). As shown in FIG. 6, the height (H1) of the outer opposing surface (78b) is higher than the height (H2) of the inner opposing surface (78c). That is, the thickness of the air gap (791) becomes smaller on the outer opposing surface (78b) and larger on the inner opposing surface (78c). By forming such a step (784), the refrigerant can be accelerated on the outer periphery of the second opposing surface (78a).

[0087] In addition, the thickness (T8) of the air gap (791) can be appropriately set according to the pressure of the supplied refrigerant, for example, it can be 1 mm or less (T8 ≤ 1 mm). If the thickness (T8) of the air gap (791) is 1 mm or less, the refrigerant flowing through the air gap (791) can be accelerated, so the cooling speed can be improved. Because of this, the responsiveness in temperature control can be improved.

[0088] As shown in FIGS. 6 and 9, a plurality of protrusions (785) are arranged on the second opposing surface (78a). These protrusions (785) are spacers interposed between the first opposing surface (76a) and the second opposing surface (78a), and separate the first and second opposing surfaces (76a, 78a). The tip of the protrusion (785) contacts the first opposing surface (76a) of the cold plate (76) and defines the aforementioned air gap (791).

[0089] As shown in FIG. 2, the pressurizing mechanism (8) is interposed between the pusher body (61) and the refrigerant guide (77) of the temperature control device (7). This pressurizing mechanism (8) pressurizes the cooler unit (75) toward the heater unit (71) by pressing the refrigerant guide (77) downward. In this embodiment, the pressurizing mechanism (8) is a spring such as a coil spring. In addition, the pressurizing mechanism (8) may be another elastic body such as rubber. In addition, the pressurizing mechanism (8) may form part of the gimbal structure.

[0090] The cold plate (76) of the cooler unit (75), which is pressurized by the pressurizing mechanism (8), always presses the heater unit (71) toward the contact plate (62). In this way, by pressing the heater unit (71) toward the contact plate (62) with the cold plate (76), the first and second heat transfer materials (73, 74) are in close contact with the surface heater (72), thereby promoting heat dissipation to the first and second heat transfer materials (73, 74) of the surface heater (72).

[0091] As shown in FIG. 2, the vertical guide (69) is positioned on the outside of the retainer (63). This vertical guide (69) is fixed to the lower surface of the pusher body (61) and extends downward from the lower surface of the pusher body (61). Additionally, although not specifically limited, the vertical guide (69) can be fixed to the pusher body (61) by means of a fastener such as a bolt. As shown in FIG. 3, this vertical guide (69) can perform positioning of the DUT (300) relative to the pusher (6) in the vertical and horizontal directions by coming into contact with the DUT (300) when the pusher (6) adsorbs and holds the DUT (300).

[0092] Returning to Fig. 1, the refrigerant supply unit (9) supplies refrigerant to the pusher (6). This refrigerant supply unit (9) is equipped with a connection unit (91), a valve (92), and a valve control unit (93). The connection unit (91) is connected to a refrigerant supply source (200) installed outside the electronic component testing device (100). The refrigerant supplied by this refrigerant supply source (200) may be compressed dry air or liquid nitrogen, etc. When the refrigerant supply source (200) supplies compressed dry air, the refrigerant supply source (200) may be equipped, for example, with a compressor that sucks in and compresses outside air and a dryer that dries the compressed air. Alternatively, the refrigerant supply source (200) may be an existing factory piping system capable of supplying compressed dry air. When the refrigerant supply source (200) supplies liquid nitrogen, the refrigerant supply source (200) may be, for example, a pressure vessel storing liquid nitrogen at high pressure or a factory pipe for supplying liquid nitrogen.

[0093] A valve (92) is installed downstream of the connection part (91). This valve (92) regulates the flow rate of the refrigerant supplied from the refrigerant supply source (200). The refrigerant passing through this valve (92) is supplied to the first refrigerant supply port (612) of the pusher body (61) as shown in FIG. 2.

[0094] As shown in FIG. 1, the valve control unit (93) controls the opening and closing of the valve (92). In this embodiment, the valve control unit (93) receives a detection value from the temperature detection circuit (303) (see FIG. 2) of the DUT (300). The valve control unit (93) performs PID control according to the received detection value so that the temperature of the DUT (300) becomes a desired value. In addition, the control method of the valve control unit (93) is not limited to PID control and may use other control methods.

[0095] In the electronic component testing device (100) of the above embodiment, the heater unit (71) of the temperature control device (7) has a planar heater (72). Since the planar heater (72) has a thin thickness, the heat capacity of the planar heater (72) is smaller compared to the heat capacity of the ceramic heater. Because of this, the heating speed of the heater unit (71) can be increased, thereby improving responsiveness.

[0096] In addition, in the electronic component testing device (100) of the present embodiment, first and second heat transfer materials (73, 74) are installed on the first and second circumferential surfaces (721a, 721b) of the planar heater (72). Because of this, even if the planar heater (72) is heated rapidly, the planar heater (72) can be suppressed from becoming locally high temperature by the first and second heat transfer materials (73, 74), and heat can be allowed to escape from the planar heater (72). Because of this, damage to the planar heater (72) can be prevented.

[0097] In addition, in the electronic component testing device (100) of this embodiment, since a ceramic heater that tends to be heavy is not used, the weight of the pusher (6) can be reduced.

[0098] Furthermore, the embodiments described above are provided to facilitate understanding of the present invention and are not intended to limit the invention. Accordingly, each element disclosed in the above embodiments is intended to include all design modifications or equivalents that fall within the technical scope of the present invention.

[0099] For example, in the above embodiment, the pusher (6) adsorbs and holds the DUT (300), but is not limited thereto. The pusher (6) may adsorb and hold a carrier containing the DUT. Such a carrier is not particularly limited, but, for example, carriers described in Japanese Patent Publication No. 2019-197012 and Japanese Patent Publication No. 2013-79860 may be used.

[0100] Additionally, the pusher (6) may press a plurality of DUTs (300) mounted on a test tray that is equipped with a plurality of DUTs (300). In this case, the handler (3) is equipped with a plurality of pushers (6), and the plurality of pushers (6) each press a plurality of DUTs (300) mounted on the test tray. In this case, all pushers (6) may have the same configuration as the present embodiment described above. Explanation of the symbols

[0101] 100: Electronic component testing device 1: Tester 11: Mainframe 12: Testhead 13: Cable 2: Socket 21: Socket body 22: Contactor 3: Handler 4: Constant temperature bath 5: Contact arm 6: Pusher 61: Pusher body 611: First suction hole 612: 1st Refrigerant Supply Point 613: 1st Refrigerant Recovery Point 62: Contact plate 621: Contact part 621a: Contact surface 622: Side 622a: Catching surface 622b: Side 63: Retainer 64: Mold shape part 65: Maintenance part 66(66a~66d): Claws 66e: Bottom surface 661: Protrusion 661a: Retention surface 662: Opening 67: Second suction hole 68: Suction pad 69: Vertical guide 7: Temperature controller 71: Heater unit 72: Surface heater 72a: Heater section 72b: Outlet section 721: Resin layer 721a, 721b: First and second main surfaces 722, 723: 1st and 2nd resin layers 724: Metal wiring 725: Terminal 73: First heating element 73a, 73b: First and second parts 74: Second heat transfer material 75: Cooler unit 76: Cold plate 76a: First opposing surface 77: Refrigerant guide 771: Pressing part 772: Supply side tubular part 772a: Second refrigerant supply port 773: Recovery side tubular part 773a: Second refrigerant recovery port 78: Nozzle member 78a: Second opposing surface 78b: Outer opposing surface 78c: Inner opposing surface 781: Through hole 782: Nozzle 783: Groove 784: Step 785: Protrusion 79: Distribution Route 791: Air Gap 8: Pressurizing mechanism 9: Refrigerant supply unit 91: Connection part 92: Valve 93: Valve control unit 200: Refrigerant supply source 300: DUT 301: Board 302: IC chip 303: Temperature detection circuit 304: Mold resin 305: Terminal

Claims

Claim 1 A temperature control device for adjusting the temperature of a DUT, wherein the temperature control device comprises a heater unit which is a heating source, and the heater unit comprises a planar heater, a first heat transfer material disposed on a first surface which is one surface of the planar heater, and a second heat transfer material disposed on a second surface which is the other surface of the planar heater, and the temperature control device further comprises a cooler unit which is a cooling source and is in contact with the heater unit, and the cooler unit comprises a flow path for circulating a refrigerant, and the cooler unit comprises a nozzle member having a nozzle for spraying a refrigerant, and a cold plate which is disposed opposite to the nozzle and spaced apart from the nozzle and through which the refrigerant is sprayed from the nozzle member, and the flow path comprises an air gap formed between the nozzle member and the cold plate, and the refrigerant sprayed from the nozzle circulates within the air gap after reaching the cold plate. Claim 2 In claim 1, the first and second heat transfer materials are a temperature control device that preferentially diffuses heat from the planar heater in a first direction parallel to the main surface of the planar heater. Claim 3 A temperature control device according to claim 2, wherein the first and second heat transfer materials are graphite sheets. Claim 4 The temperature control device according to claim 1, wherein the heater unit is a sheet-shaped laminate having a thickness of 400 μm or less. Claim 5 A temperature control device according to claim 1, wherein the planar heater comprises a first resin layer, a second resin layer laminated to the first resin layer, and a metal wiring layer sandwiched between the first and second resin layers. Claim 6 In claim 5, the temperature control device wherein the planar heater is a polyimide heater. Claim 7 delete Claim 8 delete Claim 9 A temperature control device according to claim 1, wherein the cold plate has a first opposing surface facing the nozzle member, the nozzle member has a second opposing surface facing the cold plate, the air gap is formed between the first opposing surface and the second opposing surface, and both the first and second opposing surfaces are flat. Claim 10 A temperature control device according to claim 9, wherein the nozzle is positioned at the center of the second opposing surface, and the second opposing surface includes a plurality of grooves extending outwardly in the radial direction from the nozzle nozzle to the nozzle member, and the plurality of grooves are formed at equal intervals. Claim 11 A temperature control device according to claim 10, wherein the width of the groove widens as it approaches the center of the second opposing surface. Claim 12 A temperature control device according to claim 10, wherein the second opposing surface is formed on the outer side of the groove and includes a step that is annularly connected, and the height of the second opposing surface on the outer side of the step is higher than the height of the second opposing surface on the inner side of the step. Claim 13 A temperature control device according to claim 1, wherein the thickness of the air gap is 1 mm or less. Claim 14 An electronic component handling device for handling a DUT or a carrier containing said DUT, comprising a pressing device that electrically connects said DUT and a socket by pressing said DUT or said carrier toward a socket, wherein the pressing device comprises a temperature control device as described in claim 1 and a pressing mechanism that presses said cooler unit toward a heater unit, and wherein the cooler unit presses said heater unit by being pressurized by said pressing mechanism. Claim 15 An electronic component handling device according to claim 14, wherein the pressing device further comprises a contact plate in contact with the DUT or the carrier, the cooler unit pressurizes the heater unit by being pressurized by the pressing mechanism, and the heater unit contacts the contact plate by being pressurized by the cooler unit. Claim 16 An electronic component handling device for handling a DUT or a carrier containing said DUT, comprising a pressing device that electrically connects said DUT and a socket by pressing said DUT or said carrier toward a socket, wherein the pressing device comprises a temperature control device as described in claim 1 and a contact plate that contacts said DUT or said carrier, wherein the heater unit contacts said contact plate and the cold plate contacts said heater unit and the heater unit presses said heater unit toward said contact plate. Claim 17 An electronic component handling device according to claim 16, wherein the sum of the thickness of the cold plate, the thickness of the heater unit, and the thickness of the contact plate is 2 mm or less. Claim 18 An electronic component testing device for testing a DUT, comprising an electronic component handling device according to any one of claims 14 to 17 and a tester having a socket.

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