Dynamic release tape for assembly of individual components

Abstract

The method comprises the step of positioning an individual component assembly on a support fixture of a component transfer system, wherein the individual component assembly comprises a dynamic release tape comprising a flexible support layer and a dynamic release structure disposed on the flexible support layer, and an individual component attached to the dynamic release tape. The method comprises the step of irradiating light onto the dynamic release structure to release the individual component from the dynamic release tape.

Description

Technology Field

[0001] Claim of priority

[0002] This application claims priority to U.S. Patent Application No. 62 / 843,904 filed on May 6, 2019 and U.S. Patent Application No. 62 / 806,154 filed on February 15, 2019, the contents of which are incorporated herein by reference in their entirety.

[0003] This description generally relates to the assembly of individual components onto a substrate.

[0004] In one embodiment, the method comprises the steps of positioning an individual component assembly on a support fixture of a component transfer system, the assembly comprising a dynamic release tape including a flexible support layer and a dynamic release structure disposed on the flexible support layer, and an individual component adhered to the dynamic release tape, and irradiating the dynamic release structure to release the individual component from the dynamic release tape, wherein at least a portion of the flexible support layer is independent when the individual component assembly is positioned on the support fixture.

[0005] The embodiment may have one or more of the following features.

[0006] The step of positioning individual component assemblies on a support fixture includes the step of mounting a wafer ring of the individual component assembly on the frame of the support fixture.

[0007] The method includes the step of bonding individual components to a dynamic release tape. The step of bonding individual components to a dynamic release tape includes the step of bonding individual components to a component adhesive layer of a dynamic release structure. The step of bonding individual components to a dynamic release tape includes the step of transferring individual components from a dicing tape to a dynamic release tape.

[0008] The method includes the step of bonding a wafer to a dynamic release tape. The step of bonding the wafer to the dynamic release tape includes the step of bonding the wafer to a component adhesive layer of a dynamic release structure. The method includes the step of dicing the bonded wafer to form individual components. The step of positioning an individual component assembly on a transparent support plate includes the step of attaching a dynamic release tape containing the individual components to a support plate of a support fixture. The step of positioning an individual component assembly on a support plate includes the step of holding the individual component assembly on the support plate by applying a suction force.

[0009] The step of examining the dynamic release structure includes the step of irradiating the dynamic release structure with light from a light source of the component transfer system.

[0010] In one embodiment, the method comprises the steps of positioning an individual component assembly on a support fixture of a component transfer system, the assembly comprising a dynamic release tape including a flexible support layer and a dynamic release structure disposed on the flexible support layer, and an individual component adhered to the dynamic release tape, the steps of positioning the individual component assembly on a support fixture including the step of positioning the flexible support layer of the dynamic release tape directly on a support plate of the support fixture, and the step of examining the dynamic release structure to release the individual component from the dynamic release tape.

[0011] The embodiment may have one or more of the following features.

[0012] The step of positioning individual component assemblies on a support fixture includes the step of mounting a wafer ring of the individual component assembly on the frame of the support fixture.

[0013] The method includes the step of examining a dynamic release structure through a support plate to release individual components from a dynamic release tape. The method includes the step of orienting a component transfer system so that individual components are positioned between the support plate and a target substrate.

[0014] The step of positioning individual component assemblies on a support plate includes the step of positioning individual component assemblies on a rigid support plate.

[0015] The step of positioning individual component assemblies on support fixtures includes the step of directly attaching a flexible support layer to a support plate.

[0016] The step of positioning individual component assemblies on a support plate includes the step of maintaining individual component assemblies on the support plate by applying suction force.

[0017] The step of positioning individual component assemblies on a support plate includes the step of stretching a dynamic release tape across the support plate.

[0018] The method includes the step of bonding individual components to a dynamic release tape. The step of bonding individual components to a dynamic release tape includes the step of bonding individual components to a component adhesive layer of a dynamic release structure. The step of bonding individual components to a dynamic release tape includes the step of transferring individual components from a dicing tape to a dynamic release tape.

[0019] The method includes the step of bonding a wafer to a dynamic release tape. The step of bonding the wafer to the dynamic release tape includes the step of bonding the wafer to a component adhesive layer of a dynamic release structure. The method includes the step of dicing the bonded wafer to form individual components. The step of positioning an individual component assembly on a transparent support plate includes the step of attaching a dynamic release tape containing the individual components to a support plate of a support fixture. The step of positioning an individual component assembly on a support plate includes the step of holding the individual component assembly on the support plate by applying a suction force.

[0020] The step of examining the dynamic release structure includes the step of irradiating the dynamic release structure with light from a light source of the component transfer system.

[0021] In one embodiment, the individual component transfer system comprises an individual component support fixture comprising a light source, a support frame, and a support plate positioned on the support frame and transparent to light emitted by the light source, and an optical element disposed between the light source and the support frame.

[0022] The embodiment may have one or more of the following features.

[0023] The system includes a suction source configured to apply suction to the air flow channel of the individual component support fixture to maintain the flexible support layer of the individual component assembly against the support plate.

[0024] The system comprises a dynamic release tape including a flexible support layer and a dynamic release structure disposed on the flexible support layer; and an individual component assembly including individual components adhered to the dynamic release tape, wherein the flexible support layer of the dynamic release tape is positioned directly on a support plate and is held in place by a suction force through an air flow channel of an individual component support fixture. The air flow channel is formed through the thickness of the support frame. The air flow channel is formed through the thickness of the support plate.

[0025] The upper surface of the support plate is misaligned from the upper surface of the support frame by an amount sufficient to introduce tensile stress into the dynamic release tape maintained on the individual component support fixture.

[0026] The support plate includes a glass plate.

[0027] The support plate includes a glass plate.

[0028] The support plate is rigid.

[0029] The optical element includes a lens.

[0030] In one embodiment, the individual component transfer system comprises a light source; an individual component support fixture; an individual component assembly disposed on the individual component support fixture, comprising a dynamic release tape including a flexible support layer and a dynamic release structure disposed on the flexible support layer; an individual component assembly including an individual component attached to the dynamic release tape, wherein the dynamic release tape is independent when the individual component assembly is disposed on the individual component support fixture; and an optical element disposed between the light source and the individual component assembly.

[0031] An example may include one or more of the following features.

[0032] The individual component assembly includes a wafer ring placed on an individual component support fixture.

[0033] In one embodiment, the method comprises the steps of: dicing a wafer adhered to a dicing tape to form individual components; transferring individual components from the dicing tape to a dynamic release tape to form an individual component assembly comprising a flexible support layer and a dynamic release structure disposed on the flexible support layer; and positioning the flexible support layer of the individual component assembly directly on a support plate of a component transfer system.

[0034] An example may include one or more of the following features.

[0035] The step of transferring individual components to a dynamic release tape includes the step of bonding individual components to a component adhesive layer of a dynamic release structure.

[0036] The dynamic release structure of the dynamic release tape comprises a plurality of layers. The dynamic release structure comprises an active layer structure and a component adhesive layer, and the step of attaching a wafer to the dynamic release tape includes the step of attaching a wafer to the component adhesive layer.

[0037] The step of positioning a flexible support layer directly on a support plate includes the step of attaching the flexible support layer directly to the support plate.

[0038] The step of positioning a flexible support layer directly on a support plate includes the step of maintaining an individual component assembly on the support plate by applying suction force.

[0039] The step of positioning a flexible support layer directly on a support plate includes the step of stretching a dynamic release tape across the support plate.

[0040] The method includes the step of irradiating light onto a dynamic release structure of an individual assembly through a support plate to release individual components from a dynamic release tape.

[0041] In one embodiment, the method comprises the steps of: dicing a wafer adhered to a dicing tape to form individual components; transferring individual components from the dicing tape to a dynamic release tape to form an individual component assembly comprising a flexible support layer and a dynamic release structure disposed on the flexible support layer; and positioning the individual component assembly in a component transfer system such that at least a portion of the dynamic release tape is independent.

[0042] An example may include one or more of the following features.

[0043] The method includes the step of examining a standalone dynamic release tape to release individual components from the dynamic release tape.

[0044] The dynamic release structure of the dynamic release tape comprises a plurality of layers. The dynamic release structure comprises an active layer structure and a component adhesive layer, and the step of attaching a wafer to the dynamic release tape includes the step of attaching a wafer to the component adhesive layer.

[0045] In one embodiment, the method comprises the steps of: adhering a wafer to a dynamic release tape comprising a freestanding flexible support layer and a dynamic release structure disposed on the flexible support layer; and dicing the adhered wafer to form individual components adhered to the dynamic release tape.

[0046] An example may include one or more of the following features.

[0047] The step of bonding the wafer to the dynamic release tape includes the step of bonding the wafer to the component adhesive layer of the dynamic release structure.

[0048] The dynamic release structure of the dynamic release tape comprises a plurality of layers. The dynamic release structure comprises an active layer structure and a component adhesive layer, and the step of attaching a wafer to the dynamic release tape includes the step of attaching a wafer to the component adhesive layer.

[0049] In one embodiment, the method comprises the steps of: attaching a wafer to a dynamic release tape comprising a flexible support layer and a dynamic release structure disposed on the flexible support layer; dicing the adhesive wafer to form individual components adhered to the dynamic release tape, comprising individual component assemblies; and positioning the flexible support layer of the individual component assembly directly on a support plate of a component transfer system.

[0050] An example may include one or more of the following features.

[0051] The step of positioning the flexible support layer directly on the support plate includes the step of attaching the flexible support layer of the dynamic release tape directly to the support plate.

[0052] The step of positioning a flexible support layer directly on a support plate includes the step of maintaining an individual component assembly on the support plate by applying suction force.

[0053] The step of positioning the flexible support layer on the support plate includes the step of stretching the dynamic release tape across the support plate.

[0054] The method includes the step of irradiating light onto a dynamic release structure of an individual assembly through a support plate to release individual components from a dynamic release tape.

[0055] The dynamic release structure of the dynamic release tape comprises a plurality of layers. The dynamic release structure comprises an active layer structure and a component adhesive layer, and the step of attaching a wafer to the dynamic release tape includes the step of attaching a wafer to the component adhesive layer.

[0056] In one embodiment, the method comprises the steps of: adhering a wafer to a dynamic release tape comprising a flexible support layer and a dynamic release structure disposed on the flexible support layer; dicing the adhesive wafer to form individual components adhered to the dynamic release tape, comprising individual component assemblies; and positioning the individual component assemblies in a component transfer system such that at least a portion of the dynamic release tape is freestanding.

[0057] An example may include one or more of the following features.

[0058] The method includes the step of examining a standalone dynamic release tape to release individual components from the dynamic release tape.

[0059] The dynamic release structure of the dynamic release tape comprises a plurality of layers. The dynamic release structure comprises an active layer structure and a component adhesive layer, and the step of attaching a wafer to the dynamic release tape includes the step of attaching a wafer to the component adhesive layer.

[0060] In one embodiment, the device comprises a flexible support layer; and a dynamic release tape comprising a dynamic release structure disposed on the flexible support layer.

[0061] An example may include one or more of the following features.

[0062] The dynamic release tape is rigid enough to enable laser transfer of individual components from the dynamic release tape.

[0063] The dynamic release tape is sufficiently rigid to maintain a substantially planar configuration during laser transfer of individual components from the dynamic release tape. The flexible support layer comprises a polymer. The dynamic release structure comprises a plurality of layers. The dynamic release structure comprises an absorption and adhesive layer disposed on the flexible support layer and configured to adhere to the flexible support layer and configured to generate gas in response to light irradiation; and an active layer disposed on the absorption and adhesive layer. The active layer comprises a blister-forming layer configured to mechanically respond to the generation of gas by the absorption and adhesive layer. The dynamic release structure comprises an adhesive layer disposed on the flexible support layer and configured to adhere to the flexible support layer; and an active layer structure disposed on the adhesive layer. The active layer structure comprises an absorption and blister-forming layer configured to generate gas in response to light irradiation and mechanically respond to the generation of gas. The active layer structure comprises an absorption layer disposed on the adhesive layer and configured to generate gas in response to light irradiation, and a blister-forming layer configured to mechanically respond to the generation of gas by the absorption layer. One of the layers of the dynamic release structure comprises a component adhesive layer. The adhesive strength of the component adhesive layer is responsive to the application of stimulation.

[0064] The tape can be extended.

[0065] The flexible support layer is ultraviolet permeable.

[0066] The device includes individual components bonded to a dynamic release structure. The individual components include light-emitting diodes (LEDs).

[0067] In one embodiment, the method includes the step of forming a dynamic release structure on a flexible support layer to form a dynamic release tape.

[0068] An example may include one or more of the following features.

[0069] The step of forming a dynamic release structure includes the step of forming a plurality of layers on a flexible support layer. The step of forming a dynamic release structure includes the step of forming an absorbing and adhesive layer on the flexible support layer, configured to adhere to the flexible support layer and configured to generate gas in response to light irradiation; and the step of forming an active layer on the absorbing and adhesive layer. The active layer includes a blister-forming layer configured to mechanically respond to gas generation by the absorbing and adhesive layer. The step of forming a dynamic release structure includes the step of forming an adhesive layer on the flexible support layer, configured to adhere to the flexible support layer; and the step of forming an active layer structure on the adhesive layer. The active layer structure includes an absorbing and blister-forming layer configured to generate gas in response to light irradiation and configured to mechanically respond to gas generation. The step of forming an active layer structure includes the step of forming an absorbing layer on the adhesive layer, configured to generate gas in response to light irradiation, and the step of forming a blister-forming layer configured to mechanically respond to gas generation by the absorbing layer.

[0070] In one embodiment, the dynamic release device includes a flexible support layer; and a dynamic release support structure disposed on the flexible support layer, comprising an adhesive layer disposed on the flexible support layer and configured to adhere to the flexible support layer, and an active layer structure disposed on the adhesive layer.

[0071] The embodiment may have one or more of the following features.

[0072] The active layer structure is configured to generate gas in response to light irradiation and includes an absorption and blister-forming layer configured to mechanically respond to gas generation.

[0073] The active layer structure is disposed on an adhesive layer and includes an absorption layer configured to generate gas in response to light irradiation and a blister-forming layer configured to mechanically respond to gas generation by the absorption layer.

[0074] The dynamic release structure includes a component adhesive layer.

[0075] In one embodiment, the method comprises the step of positioning an individual component assembly, comprising a dynamic release tape including a flexible support layer and a dynamic release structure disposed on the flexible support layer, and an individual component bonded to the dynamic release tape, on a support fixture of a component transfer system. The method comprises the step of examining the dynamic release structure to release the individual component from the dynamic release tape.

[0076] In one embodiment, the individual component transfer system comprises an individual component support fixture comprising a light source, a support frame, and a support plate positioned on the support frame and transparent to light emitted by the light source, and an optical element disposed between the light source and the support frame.

[0077] In one embodiment, the individual component transfer system comprises a light source; an individual component support fixture; and an individual component assembly disposed on the individual component support fixture. The individual component assembly comprises a dynamic release tape comprising a flexible support layer and a dynamic release structure disposed on the flexible support layer, and an individual component adhered to the dynamic release tape. The individual component transfer system comprises an optical element disposed between the light source and the individual component assembly.

[0078] In one embodiment, the method comprises the steps of: dicing a wafer adhered to a dicing tape to form individual components; and transferring individual components from the dicing tape to a dynamic release tape to form an individual component assembly comprising a flexible support layer and a dynamic release structure disposed on the flexible support layer.

[0079] In one embodiment, the method comprises the steps of: adhering a wafer to a dynamic release tape comprising a flexible support layer and a dynamic release structure disposed on the flexible support layer; and dicing the adhered wafer to form individual components adhered to the dynamic release tape.

[0080] In one embodiment, the device includes a dynamic release tape comprising a flexible support layer and a dynamic release structure disposed on the flexible support layer.

[0081] In one embodiment, the method comprises the step of forming a dynamic release structure on a flexible support layer to form a dynamic release tape. In one embodiment, the dynamic release device comprises a support layer; and a dynamic release structure disposed on the support layer, comprising an adhesive layer disposed on the support layer and configured to adhere to the support layer, and an active layer structure disposed on the adhesive layer. Brief explanation of the drawing

[0082] Figures 1a and 1b are diagrams of a laser-assisted transfer process. Figures 2a and 2b are diagrams of a dynamic release tape having a support fixture. Figure 3 is a diagram of a dynamic release tape having a support fixture. Figures 4 and 5 are diagrams of a laser-assisted transfer system for individual components. Figures 6 and 7 are process diagrams. Figures 8a to 8c are diagrams of a multilayer dynamic release tape mounted on a support plate. Figures 9a to 9c are diagrams of a multilayer dynamic release structure. Figure 10 is a diagram of a dynamic release tape having a support fixture. Specific details for implementing the invention

[0083] Here, an approach to laser-assisted transfer of individual components from a thin, flexible dynamic release tape positioned on a support plate of a component transfer system is described. The dynamic release tape comprises a multilayer dynamic release structure disposed on a support layer, such as a backing. Each layer of the dynamic release structure may be designed specifically to target one or more functions of the dynamic release structure, such as adhesion, optical properties, or mechanical properties. Additionally, laser-assisted transfer of individual components from a dynamic release tape disposed on a carrier substrate is described.

[0084] FIGS. 1a and 1b illustrate a laser-assisted transfer process for high-throughput, low-cost contactless assembly of individual components (102) onto a rigid or flexible substrate. The term individual component generally refers to any unit that will be part of, for example, a product or electronic device, such as an electronic, electromechanical, photovoltaic, optoelectronic, or optoelectronic component, a module or system, such as any semiconductor material having a circuit formed in a part made of semiconductor material. In some examples, the individual component may be a light-emitting diode (LED). The individual component may be ultrathin with a maximum thickness of 50 μm or less, 40 μm or less, 30 μm or less, 25 μm or less, 20 μm or less, 10 μm or less, or 5 μm or less. Individual components may be ultra-small, with a maximum length or width dimension of 300 µm per side, 100 µm per side, 50 µm per side, 20 µm per side, or 5 µm per side or less. Individual components may be ultra-thin and ultra-small.

[0085] FIGS. 1a and 1b show a portion of a support fixture (100) of a component transfer system for laser-assisted transfer of individual components (102). The support fixture (100) holds a flexible individual component assembly (108) in place for a laser-assisted transfer process. The support fixture (described in more detail below) may include a rigid support plate (106) mounted on a frame (not shown; described in more detail below). The frame provides stability to the rigid support plate (106). In some examples, the frame may be manipulated, for example, for alignment purposes. The individual component assembly (108) may be attached to the support plate (106) by suction force, tensile stress, or other means, as described in more detail below. Since the positioning of the individual component assembly (108) on the support plate (106) is non-permanent, the individual component assembly (108) can be removed from the support plate (106) after the laser-assisted transfer process is completed, for example, without damaging the support plate (106). Due to the non-permanent attachment of the individual component assembly (108) on the support plate (106), the support plate (106) can be used for multiple transfer processes including multiple individual component assemblies (108).

[0086] An individual component assembly (108) comprises a dynamic release tape (110) mounted on a wafer ring (not shown), and an individual component (102) is attached to the dynamic release tape (110). Although only a single individual component (102) is shown here, multiple individual components (102) may also be attached to the dynamic release tape (110) and transported by a component transport system. The dynamic release tape (e.g., tape (110)) is a tape comprising a flexible support layer (112) and a dynamic release structure (114) disposed on the flexible support layer (112). The tape is a thin, flexible material composed of one or more layers. The flexible support layer (112) contacts the support plate (106) of the support fixture (100), and the individual component (102) is attached to the dynamic release structure (114). The dynamic release structure (114) may be a multilayer structure, such as a structure having two, three, four, or more than four layers, as discussed in more detail below.

[0087] Also referring to FIG. 1b, in a laser-assisted transfer process, radiation (116), such as light, e.g., a laser beam, is irradiated onto the back surface of a support plate (106). Both the support plate (106) and the flexible support layer (112) of the dynamic release tape (110) are permeable to the wavelength of the radiation (116) (e.g., laser energy). An element permeable to a given wavelength is an element through which at least some of the radiation of the given wavelength passes. The radiation (116) passes through the support plate (106) and the flexible support layer (112) of the dynamic release tape (110) and is incident on an area of ​​the dynamic release structure (114), causing ablation of a portion of the thickness of the dynamic release structure (114) in the area where the radiation (116) is incident (referred to as the irradiation area). The ablation creates a confined gas that expands, thereby creating stress in the dynamic release structure (114). At least a portion of the material of the dynamic release structure (114) is deformed by stress to form a blister (118). The blister (118) applies mechanical force to the individual component (102). If the mechanical force applied by the blister (118) is sufficient to overcome the adhesion between the individual component (102) and the dynamic release structure (114), the mechanical force (along with gravity) applied by the blister (118) pushes the individual component away from the support plate (106) (e.g., downward) for transport to the target substrate (130).

[0088] The target substrate (130) may be located very close to the individual component (102), for example, at a distance of about 5 μm to about 300 μm. Using a rigid support plate (106) to support the tape-based individual component assembly (108) helps maintain a consistent separation between the individual component (102) of the individual component assembly (108) and the target substrate (130) by preventing, for example, sagging of the tape (110) or other structural variations. In some examples, the support plate (106) may have a high degree of surface flatness. For example, the support plate (106) may be machined with high precision.

[0089] In some laser-assisted transfer processes, individual components are attached to a rigid, transparent carrier substrate by a dynamic release structure. The carrier substrate with the attached individual components is provided to a component transfer system for laser-assisted transfer of the individual components. By the component transfer system described herein, in which a rigid, transparent support plate is integrated into the component transfer system itself, individual components can be transferred from a tape rather than a rigid carrier substrate, thereby reducing the cost of the end-to-end individual component transfer process (e.g., costs for materials, manufacturing, transportation, etc.). For example, a rigid carrier substrate can be significantly more expensive than a dynamic release tape. Furthermore, since the dynamic release tape is disposable, there is no need to maintain the rigid carrier substrate, and no associated costs are incurred.

[0090] In some examples, the dynamic release tape used in the individual component transfer process is a standalone tape. A standalone tape is a tape that is not attached to a rigid substrate. In some examples, the standalone tape may be positioned on the rigid substrate at one or more stages of the individual component transfer process but may not be attached. For example, the standalone tape may be positioned on the rigid substrate while attaching the individual component to the tape, during introduction into the component transfer system, or during laser-assisted transfer of the individual component.

[0091] In some examples, the dynamic release tape used in the individual component transfer process is not a standalone tape, but instead is attached to a rigid substrate while attaching the individual components to the tape, during introduction into the component transfer system, and during laser-assisted transfer of the individual components.

[0092] Further description of the laser-assisted transfer process can be found in U.S. Patent Publication No. US 2014 / 0238592, the contents of which are incorporated herein by reference in their entirety.

[0093] FIGS. 2A and 2B show a cross-sectional view of an exemplary support fixture (200) comprising a support plate (206) for positioning an individual component assembly (208) for a laser-assisted transfer process. The support plate (206) is a rigid plate that is permeable to the wavelength of radiation used in the laser transfer process, e.g., ultraviolet (UV) light. For example, the support plate (206) may be a glass plate, a quartz plate, or a plate of other material. The support plate (206) is mounted on a frame (220) of the support fixture. In some examples as shown in FIGS. 2A and 2B, the frame (220) has an opening (221) that allows radiation to reach the support plate (206). In some examples, the frame (220) may not have an opening and may be permeable to the wavelength of radiation so that radiation passes through the frame (220).

[0094] The individual component assembly (208) comprises a standalone dynamic release tape (210) mounted on a wafer ring (222), and the individual component (102) is attached to the dynamic release tape (210). For example, the dynamic release tape (210) may be stretched on the wafer ring (222). In the example of FIGS. 2a and 2b, the dynamic release tape (210) comprises a flexible support layer (212), and a multilayer dynamic release structure (214) is disposed on the flexible support layer (212). An exemplary multilayer dynamic release structure (214) comprises a plurality of sublayers (224a, 224b) having adhesive, radiation absorption, and blister-forming functions, and a component adhesive layer (226) attached to the individual component (102). The multilayer dynamic release structure (214) is discussed in more detail below.

[0095] Specifically, referring to FIG. 2b, in order to position an individual component assembly (208) on a support plate (206) of a component transfer system, a wafer ring (222) is in contact with a frame (220), and the back surface of a flexible support layer (212) of a dynamic release tape (210) is in contact with the support plate (206). When positioned in this way, the upper surface (223) of the wafer ring (222) is substantially level (e.g., aligned) with the upper surface (207) of the support plate (206), so that the dynamic release tape (210) is substantially flat over its entire lateral range.

[0096] To hold the dynamic release tape (210) against the support plate (206), suction force is applied through the air flow channel (228) by, for example, the suction force of the component transfer system. For example, the air flow channel (228) may be defined through the thickness of the frame (220) of the component transfer system (as shown), through the thickness of the support plate (206), or both. When suction force is applied, the dynamic release tape (210) is pulled firmly against the support plate (206) so that, for example, the dynamic release structure (214) is substantially flat.

[0097] Referring to FIG. 10, in some examples, the support fixture (150) includes a frame (170) but does not include a support plate (e.g., a support plate (206) as shown in FIG. 2a and FIG. 2b). A wafer ring (222) of an individual component assembly (208) is mounted on the frame (170) of the support fixture (150), otherwise the dynamic release tape (210) is kept independent for the laser-assisted transfer process. If the dynamic release tape (210) has sufficient rigidity, such as being rigid enough to maintain a substantially planar configuration during the laser-assisted transfer process, direct laser-assisted transfer from the independent dynamic release tape (210) can be performed. For example, when an individual component assembly (208) is mounted on a frame (170), the dynamic release tape (210) may be sufficiently rigid so that the maximum deviation of the dynamic release tape (210) in the direction (z) perpendicular to the plane of the tape (210) is smaller than a threshold amount, for example, less than 20 μm, less than 10 μm, or less than 5 μm.

[0098] FIG. 3 shows a cross-sectional view of an exemplary support fixture (300) comprising a support plate (306) for positioning individual component assemblies (208) for a laser-assisted transfer process. The support plate (306) is a rigid plate that is permeable to the wavelength of radiation used in the laser transfer process, e.g., UV light. The support plate (306) is mounted on a frame (320) of the support fixture (300). The frame (320) has an opening (321) that allows radiation to reach the support plate (306). In some examples, the frame (320) may be permeable to the wavelength of radiation so that radiation is transmitted through the frame (320).

[0099] In the example of FIG. 3, when the individual component assembly (208) is positioned on the support fixture (300), the upper surface (223) of the wafer ring (222) is at a lower height than the upper surface (307) of the support plate (306) (e.g., misaligned). For example, when the individual component assembly (208) is positioned on the support plate, the frame (320) of the support fixture (300) may be misaligned by a certain amount from the upper surface of the support plate (306) so that the support plate (306) and the wafer ring (222) remain misaligned. Due to this misalignment, tensile stress is applied to the dynamic release tape (210) to hold the dynamic release tape (210) against the support plate (306), so that, for example, the dynamic release structure (214) is substantially flat. The amount of tensile stress and the force that holds the dynamic release tape (210) against the support plate (306) accordingly can be controlled by changing the height difference between the upper surface (223) of the wafer ring (222) and the upper surface (307) of the support plate (306).

[0100] In some examples, other approaches may be used to position the dynamic release tape (210) on the support plate of the component transfer system by using, for example, an approach including magnetic force, electrostatic force, mechanical fixation, or other approaches.

[0101] FIG. 4 shows an example of a component transfer system (450). The component transfer system (450) includes a support fixture (400) having a support plate (406) mounted on a frame (420). The support fixture (400) is positioned so that an individual component assembly (408) is held on the support plate (406). The individual component assembly (408) includes a dynamic release tape (410) to which an individual component (102) is attached, and the dynamic release tape (410) is mounted on a wafer ring (422) and, for example, extended on the wafer ring (422). For example, the wafer ring (422) is positioned on the frame (420), and the extended dynamic release tape (410) is held against the support plate (406). Radiation from a light source (452), for example, a laser (light such as UV light), may be irradiated onto the individual component assembly (408). Light from the light source (452) is manipulated by an optical element (454), such as a lens, placed between the light source (452) and the support plate (406), and can be focused, for example. The frame (420) is provided with an opening (421) that allows radiation from the light source (452) to reach the support plate (406). A target substrate (430) is held by a substrate holder (432), in which individual components are transported by a laser-assisted transport process.

[0102] In some examples, when the support fixture (400) is configured to hold a separate component assembly to the support plate (406) by applying a suction force, the component transfer system (450) may include a suction source (434) that is fluidly connected (e.g., by a tube (not shown)) to one or more air flow channels (not shown) of the support plate (406) or frame (420).

[0103] FIG. 5 shows an example of a component transfer system (550) equipped with a light source (552) and an optical element (554). The component transfer system (550) includes a support fixture (500) comprising a frame (520). The frame (520) is not equipped with a support plate. An individual component assembly (508) is held on the frame (520) and includes a dynamic release tape (510) mounted on a wafer ring (522) of the individual component assembly (508). In this configuration, the wafer ring (522) of the individual component assembly (508) is positioned on the frame (520), and the dynamic release tape (510) is a standalone tape (meaning a tape not supported by a rigid substrate or support plate) during the laser-assisted transfer process. An individual component (102) is transferred onto a target substrate (530) held by a substrate holder (532).

[0104] In some examples, the component transfer system (450, 550) may be configured for the parallel transfer of multiple individual components, or may be configured to have a single component transfer mode and multiple component transfer modes as described in more detail in WO2018 / 231344 filed April 25, 2018, the full contents of which are incorporated herein by reference.

[0105] Referring to FIG. 6, in some examples, individual components (602) may be transferred to a dynamic release tape (610) after the dicing process. A wafer (630) containing one or more electronic components (e.g., integrated circuits) is attached to a dicing tape (632) (650) and diced to form individual components (602) using, for example, standard wafer processing techniques for wafer dicing (652). For example, the dicing tape (632) may be mounted on a wafer ring. In some examples, the dicing process may include a step of separating individual components (602) by laterally stretching the dicing tape, for example, by extending the dicing tape (632) onto the wafer ring.

[0106] An individual component (602) is transferred onto the dynamic release tape (610) (654), and the dicing tape (632) is removed (656), leaving the individual component (602) attached to the dynamic release tape (610). For example, the individual component (602) may be attached to the component adhesive layer of the dynamic release tape (610) (discussed below). The dynamic release tape (610) with the individual component (602) attached is attached to a transparent rigid support plate (606) of the component transfer system for laser-assisted transfer of the individual component (602) onto the target substrate (658). For example, the flexible support layer of the dynamic release tape (610) is attached to the support plate by, for example, suction force, tensile stress, or other means.

[0107] Referring to FIG. 7, in some examples, individual components (702) may be diced directly onto a dynamic release tape (710). A wafer (730) containing one or more semiconductor dies (e.g., integrated circuits) is adhered to the dynamic release tape (710), for example, the component adhesive layer of the dynamic release tape (710) (750). The adhered wafer (730) is diced to form individual components (702) using, for example, standard wafer processing techniques for wafer dicing (752). For example, the dynamic release tape (710) may be mounted on a wafer ring. In some examples, the dynamic release layer tape (710) is stretchable, and the dicing process may include the step of laterally stretching the dynamic release layer tape (710) to separate individual components (702) by extending the dynamic release tape on the wafer ring, for example.

[0108] A dynamic release layer tape (710) to which individual components (702) are attached is attached (754) to a transparent, rigid support plate (706) of a component transfer system for laser-assisted transfer of individual components (702) onto a target substrate. For example, the flexible support layer of the dynamic release tape (710) is attached to the support plate by, for example, suction force, tensile stress, or in other ways.

[0109] The process of FIG. 7 does not include the step of transferring individual components (702) diced from the dicing tape to the dynamic release layer tape, so the process of FIG. 7 is efficient and effective.

[0110] Referring to FIGS. 8a through 8c, the dynamic release layer tape (800, 820, 840) may be a multilayer tape having a flexible support layer (812) and a multilayer dynamic release structure (814, 834, 854) disposed on the flexible support layer (812). An individual component (802) may be adhered to the dynamic release structure (814, 834, 854) by a component adhesive layer (808) that forms part of each multilayer dynamic release structure (814, 834, 854). The multilayer dynamic release structure (814, 834, 854) may be formed of a varying number of layers having various compositions and functions. As illustrated in FIGS. 8a through 8c, the dynamic release layer tape (800, 820, 840) may be positioned on a rigid support, such as a support plate (806) of a component transfer system that is permeable to radiation used in a laser-assisted transfer process. In some examples, the dynamic release layer tape (800, 820, 840) may be attached to a wafer ring or used in other environments as otherwise used.

[0111] The flexible support layer (812) is a thin, flexible film that is transparent to radiation used in a laser-assisted transfer process, for example, transparent to UV light. For example, the flexible support layer (812) may be a polymer film such as polyvinyl chloride (PVC), polyethylene terephthalate (PET), or poly(methyl methacrylate) (PMMA). The flexible support layer (812) is thin and flexible enough to allow the dynamic release layer tape (800, 820, 840) to be manipulated, for example, rolled, bent, or stretched without destroying the tape. The presence of the flexible support layer (812) allows the dynamic release layer tape (800, 820, 840) to be a freestanding tape having sufficient mechanical integrity to be handled, for example, without being attached to a rigid substrate.

[0112] Specifically, referring to FIG. 8a, in some examples, the dynamic release structure (814) of the dynamic release layer tape (800) may be a three-layer structure having an absorbent and adhesive layer (804) disposed on a flexible support layer (812) and an active layer (805), such as a blister forming layer (shown in FIG. 8a), disposed on the absorbent and adhesive layer (804). A component adhesive layer (808) is disposed on the active layer (805).

[0113] The absorbing and adhesive layer (804) has a dual function (bonding of the active layer (805) to the flexible support layer (812) and absorption of energy resulting from irradiation during the laser-assisted transfer process). For example, the absorbing and adhesive layer (804) absorbs at least 90%, at least 95%, at least 98%, or at least 99% of the energy incident on the absorbing and adhesive layer (804) to prevent the possibility of radiation reaching individual components bonded to the tape (800) and damaging the individual components.

[0114] Gas is generated by the layer being cut by energy absorption by the absorption and adhesion layer (804). An adjacent active layer (805) mechanically responds to the generated gas. For example, as shown in FIG. 8a, the active layer (805) may be a blister-forming layer in which a blister is formed in response to the generation of gas (e.g., as shown in FIG. 1b).

[0115] Referring to FIG. 8b, in some examples, the dynamic release structure (834) of the dynamic release layer tape (820) may be a three-layer structure having an adhesive layer (824) disposed on a flexible support layer (812) and an active layer (826), such as an absorbent and blister-forming layer (as shown in FIG. 8b), disposed on the adhesive layer (824). A component adhesive layer (808) is disposed on the active layer (826).

[0116] The adhesive layer (824) exhibits sufficient adhesion to bond the active layer (826) to the flexible support layer (812). In the example of FIG. 8b, the active layer (826) is an absorption and blister-forming layer. The active layer (826) absorbs energy resulting from irradiation during a laser-assisted transfer process, generating a gas that induces a mechanical response, such as blister formation in the active layer (826). For example, the active layer (826) can absorb at least 90%, at least 95%, at least 98%, or at least 99% of the incident energy.

[0117] Referring to FIG. 8c, in some examples, the dynamic release structure (854) of the dynamic release layer tape (840) may be a four-layer structure having an adhesive layer (844) disposed on a flexible support layer (812) and an active layer structure (846) disposed on the adhesive layer (844). A component adhesive layer (808) is disposed on the active layer structure (846).

[0118] The adhesive layer (844) exhibits sufficient adhesion to bond the active layer structure (846) to the flexible support layer (812). The active layer structure (846) comprises two layers, namely an absorption layer (848) and a blister-forming layer (850). The absorption layer (848) absorbs energy resulting from irradiation during a laser-assisted transport process to generate gas. For example, the absorption layer (848) may absorb at least 90%, at least 95%, at least 98%, or at least 99% of the incident energy. The generation of gas induces a mechanical response, such as blister formation, in the blister-forming layer (850).

[0119] The dynamic release structure (e.g., dynamic release structure (814, 834, 854)) has a number of functions, e.g., adhesion to a flexible support layer, internal adhesion between layers, absorption of incident radiation, and mechanical response (e.g., blister formation). Due to the multilayer characteristics of the dynamic release structure (814, 834, 854), it may be permissible for each layer to be specifically designed to achieve one or more of these functions.

[0120] In the example of FIG. 8a, the absorbing and adhesive layer (804) may be designed to be adhered to the support layer (812) to absorb incident radiation and to generate a sufficient amount of gas to cause blister formation in the active layer (805). In some examples, the absorbing and adhesive layer (804) may be designed to adhere to the active layer (805) with sufficient adhesive force to promote internal adhesion, for example, to avoid at least partially the delamination of blisters that could result in large-diameter blisters potentially affecting individual components in adjacent locations, for example, individual components for transport. In the design of the absorbing and adhesive layer (804), the optical and adhesive properties of the layer may be the focus of the design, while the mechanical properties of the layer, such as strength or elastic modulus, may be a secondary factor in the design. Conversely, the thickness and composition of the active layer (805) may be designed with an emphasis on mechanical properties to achieve the desired blister formation reaction, for example, while the optical and adhesive properties of the layer may be secondary. In some examples, the active layer (805) may be designed to allow the formation of a blister of a target size and to have non-rupturing mechanical properties, and to prevent any gas generated by the absorption and adhesion layer (804) from escaping from the dynamic release structure (814). For example, the target blister size may have a height-to-diameter ratio of about 1 and the base diameter may not be larger than about 3 times the diameter of the irradiation beam (e.g., laser beam). In certain examples, the active layer (805) may be a polymer film having a thickness of about 2 μm to about 5 μm, for example, a film made of PET or polyimide.

[0121] Additionally, in the dynamic release structure (814) of FIG. 8a, the active layer (805) itself does not absorb energy and is therefore not partially ablated. Rather, ablation occurs in the adjacent absorption and adhesion layer (804). Since ablation does not occur in the active layer (805), the thickness of the active layer (805) is not affected by the amount of laser energy transferred to the blister location, which means that the active layer (805) is not thinned by irradiation. Separating the ablation and blister formation into two distinct layers allows for the creation of larger blisters using larger pulse energy.

[0122] In some examples, when an individual component (802) is transferred from a dicing tape (as in FIG. 6) or another source substrate to a dynamic release layer tape, or when a wafer is diced directly from the dynamic release layer tape to form an individual component (802), the component adhesive layer (808) may be designed to have an adhesive strength greater than the force holding the individual component (802) to its source substrate. In some examples, a relatively low adhesive strength between the component adhesive layer (808) and the individual component (802) may contribute to high precision during the laser-assisted transfer process. The component adhesive layer (808) may be designed to have an adhesive strength as low as possible while being sufficient to hold the individual component attached to the dynamic release layer tape prior to the laser-assisted transfer process. In some examples, to satisfy these conflicting criteria of a component adhesive layer (808) having both high and low adhesive strengths, the component adhesive layer (808) may be designed to have an adhesive strength that can be adjusted by the application of a stimulus such as ultraviolet light or heat. The initial strong adhesive strength of the component adhesive layer (808) can facilitate reliable transfer of individual components (802) from the source substrate to the dynamic release layer tape. The initial adhesive strength of the component adhesive layer (808) can also support the wafer during the dicing process to form individual components. Before the laser-assisted transfer process, a stimulus is applied to reduce the adhesive strength between the component adhesive layer (808) and the individual components (802) to a level that can contribute to accurate component placement during transfer.

[0123] Referring to FIGS. 9a through 9c, in some examples, a multilayer dynamic release structure (914, 934, 954) may be applied to a rigid carrier substrate (910), such as a glass carrier substrate. Individual components (902) may be bonded to the rigid carrier substrate (910) by the dynamic release structure (914, 934, 954) to form an individual component assembly (900, 920, 940). The individual components (902) may be transferred directly from the rigid carrier substrate (910) onto a target substrate by a laser-assisted transfer process.

[0124] The dynamic release structure is provided as a standalone tape and can be applied as a tape onto a carrier substrate (910), for example, by roll coating or other tape application methods. In some examples, the dynamic release structure may be spin-coated onto the carrier substrate. Applying the dynamic release structure in the form of a tape onto the carrier substrate has advantages such as cost reduction, labor-intensive processing, and more efficient application compared to spin coating.

[0125] The dynamic release structure (914, 934, 954) provided in the form of a tape for application to a rigid carrier substrate (910) may be a multilayer structure as described above in relation to FIGS. 8a to 8c.

[0126] Specifically, referring to FIG. 9a, in some examples, the dynamic release structure (914) may be a three-layer structure having an absorbing and adhesive layer (904) that is adhered to a rigid carrier substrate (910). An active layer (906), such as a blister forming layer (as shown in FIG. 9a), is disposed on the absorbing and adhesive layer (904). A component adhesive layer (908) is disposed on the active layer (906).

[0127] The absorption and adhesion layer (904) has a dual function (bonding of the active layer (906) to the rigid carrier substrate (910) and absorption of energy resulting from irradiation during the laser-assisted transfer process). By absorbing energy by the absorption and adhesion layer (904), the layer is ablated to generate gas. The generated gas induces a mechanical response in the adjacent active layer (906). For example, as shown in FIG. 9a, the active layer (906) may be a blister-forming layer that forms a blister in response to the gas generation, causing the transfer of individual components (902).

[0128] Referring to FIG. 9b, in some examples, the dynamic release structure (934) may be a three-layer structure having an adhesive layer (924) that adheres to a rigid carrier substrate (910) and an active layer (926), such as an absorption and blister-forming layer (as shown in FIG. 9b), disposed on the adhesive layer (924). A component adhesive layer (908) is disposed on the active layer (926). The adhesive layer (924) exhibits sufficient adhesion to adhere to the carrier substrate (910). In the example of FIG. 9b, the active layer (926) is an absorption and blister-forming layer that absorbs energy from irradiation during a laser-assisted transfer process and generates gas that induces a mechanical response, such as blister formation, in the active layer (926).

[0129] Referring to FIG. 9c, in some examples, the dynamic release structure (954) may be a four-layer structure having an adhesive layer (944) bonded to a rigid carrier substrate (910) and an active layer structure (946) disposed on the adhesive layer (944). A component adhesive layer (908) is disposed on the active layer structure (946). The active layer structure (946) comprises two layers, namely an absorption layer (948) and a blister forming layer (950). The absorption layer (948) absorbs energy from irradiation during a laser-assisted transfer process to generate gas. The generation of gas induces a mechanical response, such as blister formation, in the blister forming layer (950).

[0130] Individual layers of the multilayer dynamic release structure can be designed to achieve desired functions as described above in relation to FIGS. 8a through 8c. For example, the adhesive layers (904, 924, 954) attached to the carrier substrate (910) can be designed to have sufficiently low adhesion to the carrier substrate to allow easy removal after the completion of the laser transfer process, thereby facilitating the maintenance of the carrier substrate.

[0131] Many embodiments have been described. Nevertheless, it will be understood that various modifications may be made without departing from the spirit and scope of the invention. For example, some of the steps described above may be independent of the order and, therefore, may be performed in a different order than described.

[0132] Other implementations are also within the scope of the following claims.

Claims

Claim 1 A method comprising the step of positioning an individual component assembly on a support fixture of a component transfer system, wherein the individual component assembly comprises a dynamic release tape and an individual component adhered to the dynamic release tape, the dynamic release tape comprises a flexible support layer and a dynamic release structure disposed on the flexible support layer, the dynamic release structure comprises a plurality of layers, and the dynamic release structure comprises an adhesive layer disposed on the flexible support layer and configured to adhere to the flexible support layer; and an active layer structure disposed on the adhesive layer; and the step of irradiating the dynamic release structure to release the individual component from the dynamic release tape, wherein, when the individual component assembly is positioned on the support fixture, at least a portion of the flexible support layer is independent. Claim 2 A method according to claim 1, wherein the step of positioning an individual component assembly on a support fixture includes the step of mounting a wafer ring of the individual component assembly on the frame of the support fixture. Claim 3 A method according to claim 1 or 2, comprising the step of adhering individual components to a dynamic release tape. Claim 4 A method according to claim 3, wherein the step of adhering individual components to a dynamic release tape includes the step of adhering individual components to a component adhesive layer of a dynamic release structure. Claim 5 A method according to claim 3, wherein the step of adhering individual components to a dynamic release tape includes the step of transferring individual components from a dicing tape to a dynamic release tape. Claim 6 A method according to claim 1 or 2, comprising the step of adhering a wafer to a dynamic release tape. Claim 7 A method according to claim 6, wherein the step of adhering the wafer to the dynamic release tape includes the step of adhering the wafer to the component adhesive layer of the dynamic release structure. Claim 8 A method according to claim 6, comprising the step of dicing an adhesive wafer to form individual components. Claim 9 A method according to claim 8, wherein the step of positioning an individual component assembly on a support fixture comprises the step of attaching a dynamic release tape containing the individual components to a support plate of the support fixture. Claim 10 A method according to claim 8, wherein the step of positioning an individual component assembly on a support fixture includes the step of maintaining the individual component assembly on a support plate by applying suction force. Claim 11 A method according to claim 1 or 2, wherein the step of investigating the dynamic release structure comprises the step of irradiating the dynamic release structure with light from a light source of a component transfer system. Claim 12 A method comprising the step of positioning an individual component assembly on a support fixture of a component transfer system, wherein the individual component assembly comprises a dynamic release tape and an individual component adhered to the dynamic release tape, the dynamic release tape comprises a flexible support layer and a dynamic release structure disposed on the flexible support layer, the dynamic release structure comprises a plurality of layers, and the dynamic release structure comprises an adhesive layer disposed on the flexible support layer and configured to adhere to the flexible support layer; and an active layer structure disposed on the adhesive layer, and comprising the step of positioning the flexible support layer of the dynamic release tape directly on a support plate of the support fixture; and the step of examining the dynamic release structure to release the individual component from the dynamic release tape. Claim 13 A method according to claim 12, wherein the step of positioning an individual component assembly on a support fixture comprises the step of mounting a wafer ring of the individual component assembly on the frame of the support fixture. Claim 14 A method according to claim 12 or 13, comprising the step of examining a dynamic release structure through a support plate to release individual components from a dynamic release tape. Claim 15 A method according to claim 14, comprising the step of orienting a component transfer system such that individual components are positioned between a support plate and a target substrate. Claim 16 A method according to claim 12 or 13, wherein the step of positioning an individual component assembly on a support plate comprises the step of positioning an individual component assembly on a rigid support plate. Claim 17 A method according to claim 12 or 13, wherein the step of positioning an individual component assembly on a support fixture includes the step of directly attaching a flexible support layer to a support plate. Claim 18 A method according to claim 12 or 13, wherein the step of positioning an individual component assembly on a support plate comprises the step of maintaining the individual component assembly on the support plate by applying a suction force. Claim 19 A method according to claim 12 or 13, wherein the step of positioning an individual component assembly on a support plate comprises the step of stretching a dynamic release tape across the support plate. Claim 20 A method according to claim 12 or 13, comprising the step of adhering individual components to a dynamic release tape. Claim 21 A method according to claim 20, wherein the step of bonding individual components to a dynamic release tape comprises the step of bonding individual components to a component adhesive layer of a dynamic release structure. Claim 22 A method according to claim 20, wherein the step of adhering individual components to a dynamic release tape includes the step of transferring individual components from a dicing tape to a dynamic release tape. Claim 23 A method according to claim 12 or 13, comprising the step of adhering a wafer to a dynamic release tape. Claim 24 A method according to claim 23, wherein the step of bonding the wafer to the dynamic release tape includes the step of bonding the wafer to the component adhesive layer of the dynamic release structure. Claim 25 A method according to claim 23, comprising the step of dicing an adhesive wafer to form individual components. Claim 26 A method according to claim 25, wherein the step of positioning an individual component assembly on a support plate comprises the step of attaching a dynamic release tape containing the individual components to the support plate of a support fixture. Claim 27 A method according to claim 25, wherein the step of positioning an individual component assembly on a support plate includes the step of maintaining the individual component assembly on the support plate by applying a suction force. Claim 28 A method according to claim 12 or 13, wherein the step of investigating the dynamic release structure comprises the step of irradiating the dynamic release structure with light from a light source of a component transfer system. Claim 29 An individual component transfer system comprising: a light source; an individual component support fixture comprising a support frame and a support plate positioned on the support frame and transparent to light emitted by the light source; an optical element disposed between the light source and the support frame, wherein the dynamic release tape comprises a flexible support layer and a dynamic release structure disposed on the flexible support layer, the dynamic release structure comprises a plurality of layers, and the dynamic release structure comprises an adhesive layer disposed on the flexible support layer and configured to adhere to the flexible support layer; and an active layer structure disposed on the adhesive layer. Claim 30 An individual component transfer system according to claim 29, comprising a suction source configured to apply suction force to an air flow channel of an individual component support fixture to maintain a flexible support layer of an individual component assembly against a support plate, wherein the individual component assembly comprises a dynamic release structure; and an individual component adhered to a dynamic release tape. Claim 31 An individual component transfer system according to claim 29, comprising a dynamic release tape; and an individual component assembly comprising individual components adhered to the dynamic release tape, wherein a flexible support layer of the dynamic release tape is positioned directly on a support plate and is held in place by a suction force through an air flow channel of an individual component support fixture. Claim 32 An individual component transfer system according to claim 30, wherein an air flow channel is formed by penetrating the thickness of a support frame. Claim 33 An individual component transfer system according to claim 30, wherein an air flow channel is formed by penetrating the thickness of a support plate. Claim 34 An individual component transfer system according to claim 29 or 30, wherein the upper surface of the support plate is misaligned from the upper surface of the support frame by an amount sufficient to introduce tensile stress into a dynamic release tape maintained on an individual component support fixture. Claim 35 An individual component transfer system according to claim 29 or 30, wherein the support plate comprises a glass plate. Claim 36 An individual component transfer system according to claim 29 or 30, wherein the support plate comprises a quartz plate. Claim 37 An individual component transfer system according to claim 29 or 30, wherein the support plate is rigid. Claim 38 An individual component transfer system according to claim 29 or 30, wherein the optical element comprises a lens. Claim 39 An individual component transfer system comprising: a light source; an individual component support fixture; an individual component assembly disposed on the individual component support fixture, wherein the individual component assembly comprises a flexible support layer and a dynamic release structure disposed on the flexible support layer; an individual component assembly comprising an individual component attached to the dynamic release tape, wherein when the individual component assembly is disposed on the individual component support fixture, the dynamic release tape is independent, the dynamic release structure comprises a plurality of layers, and the dynamic release structure comprises an adhesive layer disposed on the flexible support layer and configured to be adhered to the flexible support layer; and an active layer structure disposed on the adhesive layer; and an optical element disposed between the light source and the individual component assembly. Claim 40 An individual component transfer system according to claim 39, wherein the individual component assembly comprises a wafer ring disposed on an individual component support fixture. Claim 41 A method comprising: dicing a wafer adhered to a dicing tape to form individual components; transferring individual components from the dicing tape to a dynamic release tape to form an individual component assembly, wherein the dynamic release tape comprises a flexible support layer and a dynamic release structure disposed on the flexible support layer, the dynamic release structure comprises a plurality of layers, and the dynamic release structure comprises an adhesive layer disposed on the flexible support layer and configured to adhere to the flexible support layer; and an active layer structure disposed on the adhesive layer; and positioning the flexible support layer of the individual component assembly directly on a support plate of a component transfer system. Claim 42 A method according to claim 41, wherein the step of transferring individual components to a dynamic release tape includes the step of bonding individual components to a component adhesive layer of a dynamic release structure. Claim 43 delete Claim 44 A method according to claim 41, wherein the dynamic release structure comprises a component adhesive layer, and the step of attaching a wafer to a dynamic release tape comprises the step of attaching a wafer to the component adhesive layer. Claim 45 A method according to claim 41 or 42, wherein the step of positioning a flexible support layer directly on a support plate includes the step of directly attaching the flexible support layer to the support plate. Claim 46 A method according to claim 41 or 42, wherein the step of positioning a flexible support layer directly on a support plate comprises the step of maintaining an individual component assembly on the support plate by applying a suction force. Claim 47 A method according to claim 41 or 42, wherein the step of positioning a flexible support layer directly on a support plate comprises the step of stretching a dynamic release tape across the support plate. Claim 48 A method according to claim 41 or 42, comprising the step of irradiating light onto a dynamic release structure of an individual component assembly through a support plate to release an individual component from a dynamic release tape. Claim 49 A method comprising: dicing a wafer adhered to a dicing tape to form individual components; transferring individual components from the dicing tape to a dynamic release tape to form individual component assemblies, wherein the dynamic release tape comprises a flexible support layer and a dynamic release structure disposed on the flexible support layer, the dynamic release structure comprises a plurality of layers, and the dynamic release structure comprises an adhesive layer disposed on the flexible support layer and configured to adhere to the flexible support layer; and an active layer structure disposed on the adhesive layer; and positioning the individual component assembly in a component transfer system such that at least a portion of the dynamic release tape becomes independent. Claim 50 A method according to claim 49, comprising the step of examining a standalone dynamic release tape to release individual components from a dynamic release tape. Claim 51 delete Claim 52 A method according to claim 49, wherein the dynamic release structure comprises a component adhesive layer, and the step of attaching a wafer to a dynamic release tape comprises the step of attaching a wafer to the component adhesive layer. Claim 53 A method comprising the step of adhering a wafer to a dynamic release tape comprising an independent flexible support layer and a dynamic release structure disposed on the flexible support layer, wherein the dynamic release structure comprises a plurality of layers, and the dynamic release structure comprises: an adhesive layer disposed on the flexible support layer and configured to adhere to the flexible support layer; and an active layer structure disposed on the adhesive layer; and the step of dicing the adhesive wafer to form individual components adhered to the dynamic release tape. Claim 54 A method according to claim 53, wherein the step of bonding a wafer to a dynamic release tape comprises the step of bonding the wafer to a component adhesive layer of a dynamic release structure. Claim 55 delete Claim 56 A method according to claim 53, wherein the dynamic release structure comprises a component adhesive layer, and the step of attaching a wafer to a dynamic release tape comprises the step of attaching a wafer to the component adhesive layer. Claim 57 A method comprising the step of adhering a wafer to a dynamic release tape comprising a flexible support layer and a dynamic release structure disposed on the flexible support layer, wherein the dynamic release structure comprises a plurality of layers, and the dynamic release structure comprises an adhesive layer disposed on the flexible support layer and configured to adhere to the flexible support layer; and an active layer structure disposed on the adhesive layer; the step of dicing the adhesive wafer to form individual components adhered to the dynamic release tape, the adhesive wafer comprising an individual component assembly; and the step of positioning the flexible support layer of the individual component assembly directly on a support plate of a component transfer system. Claim 58 A method according to claim 57, wherein the step of directly positioning the flexible support layer on the support plate includes the step of directly attaching the flexible support layer of the dynamic release tape to the support plate. Claim 59 A method according to claim 57 or 58, wherein the step of positioning a flexible support layer directly on a support plate comprises the step of maintaining an individual component assembly on the support plate by applying a suction force. Claim 60 A method according to claim 57 or 58, wherein the step of positioning a flexible support layer on a support plate comprises the step of stretching a dynamic release tape across the support plate. Claim 61 A method according to claim 57 or 58 comprising the step of examining a dynamic release structure of an individual component assembly through a support plate to release an individual component from a dynamic release tape. Claim 62 delete Claim 63 A method according to claim 57, wherein the dynamic release structure comprises a component adhesive layer, and the step of attaching a wafer to a dynamic release tape comprises the step of attaching a wafer to the component adhesive layer. Claim 64 A method comprising the step of adhering a wafer to a dynamic release tape comprising a flexible support layer and a dynamic release structure disposed on the flexible support layer, wherein the dynamic release structure comprises a plurality of layers, and the dynamic release structure comprises an adhesive layer disposed on the flexible support layer and configured to adhere to the flexible support layer; and an active layer structure disposed on the adhesive layer; the step of dicing the adhesive wafer to form individual components adhered to the dynamic release tape, comprising individual component assemblies; and the step of positioning the individual component assembly on a component transfer system such that at least a portion of the dynamic release tape becomes independent. Claim 65 A method according to claim 64, comprising the step of examining a standalone dynamic release tape to release individual components from a dynamic release tape. Claim 66 delete Claim 67 A method according to claim 64, wherein the dynamic release structure comprises a component adhesive layer, and the step of attaching a wafer to a dynamic release tape comprises the step of attaching a wafer to the component adhesive layer. Claim 68 An apparatus comprising a dynamic release tape including a flexible support layer and a dynamic release structure disposed on the flexible support layer, wherein the dynamic release structure comprises a plurality of layers, and the dynamic release structure comprises an adhesive layer disposed on the flexible support layer and configured to adhere to the flexible support layer; and an active layer structure disposed on the adhesive layer. Claim 69 A device according to claim 68, wherein the dynamic release tape is sufficiently rigid to enable laser transfer of individual components from the dynamic release tape. Claim 70 A device according to claim 68 or 69, wherein the dynamic release tape is sufficiently rigid to maintain a planar configuration during laser transfer of individual components from the dynamic release tape. Claim 71 A device according to claim 68, wherein the flexible support layer comprises a polymer. Claim 72 delete Claim 73 The device according to claim 68, wherein the dynamic release structure comprises: an absorbing and adhesive layer disposed on a flexible support layer, configured to adhere to the flexible support layer and configured to generate gas in response to light irradiation; and an active layer structure disposed on the absorbing and adhesive layer. Claim 74 A device according to claim 73, wherein the active layer structure comprises a blister-forming layer configured to mechanically respond to the generation of gas by an absorption and adhesive layer. Claim 75 delete Claim 76 In claim 68, the active layer structure comprises an absorption and blister-forming layer configured to generate gas in response to light irradiation and configured to mechanically respond to gas generation. Claim 77 An apparatus according to claim 68, wherein the active layer structure comprises: an absorption layer disposed on an adhesive layer and configured to generate gas in response to light irradiation; and a blister-forming layer configured to mechanically respond to gas generation by the absorption layer. Claim 78 In claim 68, the device wherein the dynamic release structure comprises a component adhesive layer. Claim 79 A device according to claim 78, wherein the adhesive force of the component adhesive layer is responsive to the application of stimulation. Claim 80 In claim 68 or 69, the dynamic release tape is a device that is extendable. Claim 81 A device according to claim 68 or 69, wherein the flexible support layer is ultraviolet-transmitting. Claim 82 A device comprising individual components bonded to a dynamic release structure, in accordance with claim 68 or 69. Claim 83 A device according to claim 82, wherein individual components comprise light-emitting diodes (LEDs). Claim 84 A method comprising the step of forming a dynamic release structure on a flexible support layer to form a dynamic release tape, wherein the dynamic release tape comprises a flexible support layer and a dynamic release structure disposed on the flexible support layer, the dynamic release structure comprises a plurality of layers, and the dynamic release structure comprises an adhesive layer disposed on the flexible support layer and configured to adhere to the flexible support layer, and an active layer structure disposed on the adhesive layer. Claim 85 A method according to claim 84, wherein the step of forming a dynamic release structure comprises the step of forming a plurality of layers on a flexible support layer. Claim 86 A method according to claim 85, wherein the step of forming a dynamic release structure comprises: forming an absorbing and adhesive layer on a flexible support layer, configured to adhere to the flexible support layer and configured to generate gas in response to light irradiation; and forming an active layer structure on the absorbing and adhesive layer. Claim 87 A method according to claim 86, wherein the active layer structure comprises a blister-forming layer configured to mechanically respond to gas generation by an absorption and adhesive layer. Claim 88 A method according to claim 85, wherein the step of forming a dynamic release structure comprises: forming an adhesive layer on a flexible support layer; and forming an active layer structure on the adhesive layer. Claim 89 A method according to claim 88, wherein the active layer structure is configured to generate gas in response to light irradiation and comprises an absorption and blister-forming layer configured to mechanically respond to gas generation. Claim 90 A method according to claim 88, wherein the step of forming an active layer structure comprises: forming an absorption layer configured to generate gas in response to light irradiation on an adhesive layer; and forming a blister-forming layer on the absorption layer configured to mechanically respond to gas generation by the absorption layer. Claim 91 A dynamic release device comprising: a flexible support layer; and a dynamic release structure disposed on the flexible support layer, wherein the dynamic release structure comprises a plurality of layers, and the dynamic release structure comprises an adhesive layer disposed on the flexible support layer and configured to adhere to the flexible support layer, and an active layer structure disposed on the adhesive layer. Claim 92 A dynamic release device according to claim 91, wherein the active layer structure comprises an absorption and blister-forming layer configured to generate gas in response to light irradiation and configured to mechanically respond to gas generation. Claim 93 A dynamic release device according to claim 91, wherein the active layer structure comprises: an absorption layer disposed on an adhesive layer and configured to generate gas in response to light irradiation; and a blister-forming layer configured to mechanically respond to gas generation by the absorption layer. Claim 94 A dynamic release device according to any one of claims 91 to 93, wherein the dynamic release structure comprises a component adhesive layer. Claim 95 A method comprising the step of positioning an individual component assembly on a support fixture of a component transfer system, wherein the individual component assembly comprises a dynamic release tape and an individual component adhered to the dynamic release tape, the dynamic release tape comprises a flexible support layer and a dynamic release structure disposed on the flexible support layer, the dynamic release structure comprises a plurality of layers, and the dynamic release structure comprises an adhesive layer disposed on the flexible support layer and configured to adhere to the flexible support layer; and an active layer structure disposed on the adhesive layer; and the step of examining the dynamic release structure to release the individual component from the dynamic release tape. Claim 96 An individual component transfer system comprising: a light source; an individual component support fixture; an individual component assembly disposed on the individual component support fixture, wherein the individual component assembly comprises a dynamic release tape and an individual component adhered to the dynamic release tape, the dynamic release tape comprises a flexible support layer and a dynamic release structure disposed on the flexible support layer, the dynamic release structure comprises a plurality of layers, and the dynamic release structure comprises an adhesive layer disposed on the flexible support layer and configured to adhere to the flexible support layer; and an active layer structure disposed on the adhesive layer; and an individual component transfer system comprising an optical element disposed between the light source and the individual component assembly. Claim 97 A method comprising: dicing a wafer adhered to a dicing tape to form individual components; and transferring individual components from the dicing tape to a dynamic release tape to form an assembly of individual components, wherein the dynamic release tape comprises a flexible support layer and a dynamic release structure disposed on the flexible support layer, the dynamic release structure comprises a plurality of layers, and the dynamic release structure comprises an adhesive layer disposed on the flexible support layer and configured to adhere to the flexible support layer; and an active layer structure disposed on the adhesive layer. Claim 98 A method comprising the step of adhering a wafer to a dynamic release tape comprising a flexible support layer and a dynamic release structure disposed on the flexible support layer, wherein the dynamic release structure comprises a plurality of layers, and the dynamic release structure comprises an adhesive layer disposed on the flexible support layer and configured to adhere to the flexible support layer; and an active layer structure disposed on the adhesive layer; and the step of dicing the adhesive wafer to form individual components adhered to the dynamic release tape.

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