A method of manufacturing a semiconductor package having a connection pin and corresponding semiconductor package

Abstract

A method of manufacturing a semiconductor package having a connection pin for creating a connection between the semiconductor package and an external circuit, comprising the steps of, providing said semiconductor package having a bond pad for receiving a rivet; mounting said rivet onto the bond pad of the semiconductor package, wherein the rivet is arranged to receive, in a rivet cavity of said rivet, said connection pin for creating said connection; molding the semiconductor package, having said mounted rivet, with a molding compound, wherein, during said molding, an opening of said rivet is covered by a cover, said opening leading to said rivet cavity; removing the cover and providing said connection pin in the rivet cavity via the rivet opening of said rivet. [Fig. 1]