Photosensitive resin composition, transfer film, method for producing a resin pattern, and method for producing a conductive pattern

Abstract

This invention provides a photosensitive resin composition capable of forming resin patterns with improved shape defects and excellent resolution. The aforementioned photosensitive resin composition comprises: an alkali-soluble resin containing crosslinking groups having double bonds; a polyfunctional (meth)acrylate; and a polymerization inhibitor. The total double bond content in the solid component of the photosensitive resin composition is 2.00 mmol / g or more relative to the total solid component content, the proportion of acrylonitrile-based double bonds in the total double bonds in the solid component of the photosensitive resin composition is 10% to 50%, and the molar ratio of the polymerization inhibitor content to the acrylonitrile-based double bond content is 0.001 to 0.015.