Glass substrate, supporting glass substrate, multilayer, manufacturing method of multilayer, and manufacturing method of semiconductor packaging

TW202629527APending Publication Date: 2026-07-16NIPPON ELECTRIC GLASS CO LTD
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Patent Information

Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
NIPPON ELECTRIC GLASS CO LTD
Filing Date
2025-08-20
Publication Date
2026-07-16

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Abstract

This invention provides a glass substrate with a high Young's modulus to prevent breakage of the glass substrate due to warping. The glass substrate of this invention, as a glass composition, contains, in molar percent: 51-70% SiO2, 5.1-30% MgO, 1-20% CaO, and 0.1-20% rare earth oxides + ZrO2; its Young's modulus exceeds 95 GPa.
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